Multilayer structure and method for manufacturing the same, as well as protective sheet and electronic device using the same

A multilayer structure with specific metal oxide and inorganic phosphorus compound layers, laminated with thermoplastic resin, addresses the challenge of insufficient water vapor barrier and peel strength in conventional protective sheets, ensuring high performance and flexibility for flexible electronic devices.

JP2026113612APending Publication Date: 2026-07-07KURARAY CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
KURARAY CO LTD
Filing Date
2026-04-02
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

Conventional multilayer structures for protective sheets in electronic devices fail to provide sufficient water vapor barrier properties and peel strength from encapsulants, compromising flexibility and thickness, which is critical for high-performance flexible electronic devices.

Method used

A multilayer structure comprising a substrate with two layers containing a reaction product of a metal oxide and an inorganic phosphorus compound, laminated with thermoplastic resin layers via adhesive layers, maintaining a total thickness of 15-120 μm and thermal shrinkage rate within specific limits to enhance water vapor barrier properties and peel strength.

Benefits of technology

The multilayer structure achieves excellent water vapor barrier properties and peel strength while maintaining flexibility, suitable for use in flexible electronic devices.

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Abstract

To provide a multilayer structure with excellent water vapor barrier properties, peel strength from sealing materials, and flexibility, as well as a method for manufacturing the same, and a protective sheet and electronic device using the same. [Solution] A laminate comprising a base material (X) and at least two layers (Y) arranged on both sides of the base material (X), and layers (Z) mainly composed of a thermoplastic resin laminated on both sides of the laminate via adhesive layers (I), wherein layers (Y) contain a reaction product (D) of a metal oxide (A) containing aluminum atoms and an inorganic phosphorus compound (BI), the thickness of the base material (X) is 5 μm or more and 100 μm or less, the thickness of each layer (Z) is 5 μm or more and 100 μm or less, the total thickness of all layers is 15 μm or more and 120 μm or less, each layer (Y) may be different, each adhesive layer (I) may be different, each layer (Z) may be different, and the moisture permeability is 1.0 × 10 -2 g / m 2 • A multilayer structure that is less than or equal to day.
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