Resin microparticles, methods for producing the same, and applications thereof.
The two-stage polymerization process for resin fine particles reduces metallic and ionic content, addressing high dielectric loss tangents and ion migration issues, ensuring excellent dielectric properties for semiconductor applications.
JP2026113724APending Publication Date: 2026-07-07SEKISUI PLASTICS CO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- SEKISUI PLASTICS CO LTD
- Filing Date
- 2026-04-16
- Publication Date
- 2026-07-07
AI Technical Summary
Technical Problem
Existing resin microparticles used in semiconductor applications have high dielectric loss tangents and contain significant metallic and ionic components, which affect their performance and ion migration, particularly in miniaturized components.
Method used
Resin fine particles with reduced metallic and eluted ion content, achieved through a two-stage polymerization process using specific monomers and surfactants, resulting in a dielectric loss tangent of 0.0050 or less and total ion content of 100 ppm or less.
Benefits of technology
The resin fine particles exhibit excellent dielectric properties and prevent ion migration, suitable for use in miniaturized semiconductor components.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 2026113724000001
Abstract
Resin microparticles with reduced metallic and eluted ion components and excellent dielectric properties. The present invention provides particles and a method for producing such resin microparticles. [Solution] The resin fine particles according to the embodiment of the present invention are measured by inductively coupled plasma emission spectrometry. The total content of component A is 100 ppm or less and is measured by ion chromatography. The total amount of eluted ion component B is 100 ppm or less, and the dielectric loss tangent at a frequency of 10 GHz is The value is 0.0050 or less. Component A consists of Al, Ba, Ca, Cr, Cu, Fe, K, and Mg These are Mn, Na, P, S, Si, Sr, and Zn. Ionic component B is fluoride ions. ions, chloride ions, nitrite ions, bromide ions, nitrate ions, phosphate ions, and sulfur It is an acid ion.
Need to check novelty before this filing date? Find Prior Art