Carrier tape

A laminated carrier tape with lower and convex partition walls addresses the delamination issue in conventional tapes, ensuring reliable transport and storage of electronic components.

JP2026113727APending Publication Date: 2026-07-07MURATA MFG CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
MURATA MFG CO LTD
Filing Date
2026-04-17
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

Conventional carrier tapes with thin partition walls are prone to interlayer peeling and generation of foreign matters during molding, which can adversely affect electronic components.

Method used

A laminated carrier tape with partition walls having a lower top height than the surface and a convex shape to reduce delamination, formed by press molding from laminated paper.

Benefits of technology

The carrier tape effectively prevents delamination and foreign matter generation, allowing efficient storage and transport of a large number of electronic components without compromising integrity.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a carrier tape that is less prone to delamination between layers in the partition walls between the storage sections that house the components. [Solution] A carrier tape 1 is formed in a strip shape from laminated material with layers in the lamination direction, and has a surface 1a and a back surface 1b opposite to each other in the height direction corresponding to the lamination direction, and on the side of surface 1a, a plurality of storage sections 10 for accommodating parts M are arranged along the length direction separated by a partition wall 20, wherein in the height direction, the height position 21h of the top 21 of the partition wall 20 is lower than the height position 1ah of surface 1a.
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Description

Technical Field

[0001] The present invention relates to a carrier tape suitable for use in transporting and storing a large number of components such as chip-shaped electronic components.

Background Art

[0002] Conventionally, when transporting minute electronic components such as semiconductor chips and capacitor chips, there are cases where a large number of electronic components are accommodated in a long strip-shaped carrier tape, and the carrier tape is wound around a reel and transported together with the reel. This type of carrier tape has accommodation portions formed by recesses for accommodating electronic components one by one on the surface side, arranged along the length direction, and a cover tape is attached to the surface to enclose the electronic components in the accommodation portions. Patent Document 1 discloses a carrier tape having a paper base material, and a large number of accommodation portions are formed on the surface of the base material by a molding die.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The above accommodation portions are separated by partition wall portions. If the thickness of the partition wall portions forming the interval between the accommodation portions is reduced to reduce the pitch of the accommodation portions, it is advantageous for efficiently accommodating a large number of electronic components. However, when the thickness of the partition wall portions is made as thin as about 0.3 mm, in the case of a layered paper-made carrier tape, interlayer peeling is likely to occur in the partition wall portions when press-molded with a molding die. When this interlayer peeling occurs, fine chips and paper powder are generated as foreign matters from the peeled portion, and there is a risk that these foreign matters may adversely affect the electronic components.

[0005] Therefore, the present invention aims to provide a carrier tape that is less prone to delamination in the partition walls between housing sections that contain components. [Means for solving the problem]

[0006] The carrier tape according to the present invention is formed in a strip shape from a laminated material that forms layers in the lamination direction, and has a front surface and a back surface that are opposite to each other in the height direction corresponding to the lamination direction, and on the front surface side, a plurality of storage sections for accommodating parts are arranged along the length direction separated by a partition wall, wherein in the height direction, the height position of the top of the partition wall is lower than the height position of the front surface. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a carrier tape that is less prone to delamination in the partition walls between the storage sections that house the components. [Brief explanation of the drawing]

[0008] [Figure 1] This is a plan view showing a part of the carrier tape according to the embodiment. [Figure 2] This is a cross-sectional view taken along line II-II in Figure 1. [Figure 3] This is a cross-sectional view taken along line III-III in Figure 1. [Figure 4] This is an enlarged view of section IV in Figure 2. [Figure 5] This is a cross-sectional view showing another form of the partition wall according to the embodiment, and corresponds to Figure 4. [Modes for carrying out the invention]

[0009] The embodiments will now be described with reference to the drawings. Figure 1 is a plan view of the carrier tape 1 according to the embodiment. Figure 2 is a cross-sectional view taken along line II-II of Figure 1. Figure 3 is a cross-sectional view taken along line III-III of Figure 1. Figure 4 is an enlarged view of section IV of Figure 2.

[0010] The carrier tape 1 according to this embodiment is formed in a strip shape from paper, which is a laminated material with layers in the thickness direction. The paper forming the carrier tape 1 is so-called laminated paper, which is formed by laminating and bonding multiple sheets of paper in the lamination direction. In Figures 1 to 4, the length direction of the carrier tape 1 is indicated by L, the width direction perpendicular to the length direction L is indicated by W, and the height direction perpendicular to the length direction L and the width direction W is indicated by T. The lamination direction corresponds to the height direction of the carrier tape 1. In the following description, the length direction, width direction, and height direction refer to the directions indicated by L, W, and T above. Note that the height direction T is the same as the thickness direction of the carrier tape 1. In the following, the height direction may be referred to as the thickness direction.

[0011] The carrier tape 1 has a surface 1a and a surface 1b that are opposite to each other in the height direction. Both surface 1a and surface 1b are flat surfaces and are parallel to each other. The distance between surface 1a and surface 1b is the maximum distance in the height direction of the carrier tape 1, that is, the distance between surface 1a and surface 1b is the thickness of the carrier tape 1.

[0012] Multiple storage compartments 10 are formed on the surface 1a side of the carrier tape 1. The multiple storage compartments 10 are positioned at equal pitches along the length direction, with the storage compartments 10 offset towards one end in the width direction of the carrier tape 1. On the other end, opposite to the end in the width direction where the multiple storage compartments 10 are located, multiple feed holes 30 are formed at equal pitches along the length direction. The feed holes 30 are circular through holes that penetrate from the surface 1a to the back surface 1b.

[0013] Each of the multiple housing sections 10 houses one of the components M shown in Figure 4. The components M are, for example, chip-shaped electronic components having a rectangular parallelepiped shape, such as semiconductor chips or multilayer ceramic capacitors, but are not limited to these.

[0014] Between adjacent storage compartments 10 in the longitudinal direction, partition walls 20 are formed to separate the storage compartments 10. Multiple storage compartments 10 are arranged in a single row along the longitudinal direction, separated by partition walls 20.

[0015] The housing section 10 is a recess that opens to the surface 1a side of the carrier tape 1. The housing section 10 has a rectangular internal space corresponding to the component M to be housed. As shown in Figures 3 and 4, the housing section 10 is formed by being surrounded by a bottom section 11, a pair of side walls 12 on both sides in the width direction, and a pair of partition walls 20 on both sides in the length direction. The pair of side walls 12 face each other in the width direction, and the pair of partition walls 20 face each other in the length direction.

[0016] The pair of side walls 12 forming the storage section 10 are flat surfaces along the length and height directions, rising almost vertically from the edges on both sides of the bottom section 11 in the width direction and continuing directly to the surface 1a. That is, as shown in Figure 1, when the carrier tape 1 is viewed from above, there is a surface 1a on both sides of the recess 1a in the width direction, and there is no portion separating the storage section 10 from the surface 1a.

[0017] As shown in Figure 3, the partition wall 20 has a rectangular shape when viewed from the front in the length direction. The partition wall 20 has a top portion 21 that extends straight in the width direction. The top portion 21 is the end of the partition wall 20 on the surface 1a side. In the height direction, the height position 21h of this top portion 21 is lower than the height position 1ah of the surface 1a. That is, the top portion 21 of the partition wall 20 is not in the same plane as the surface 1a, but is recessed on the side of the bottom portion 11 that is closer to the surface 1a. The height position 21h of this top portion 21 refers to the highest point of the top portion 21 that is closest to the surface 1a in the height direction.

[0018] As shown in Figure 4, the amount of recess H1, that is, the height distance H1 from the top 21 to the surface 1a, is preferably 5% to 30% of the depth H2 of the housing section 10. The depth H2 of the housing section 10 is the height dimension from the bottom 11 to the surface 1a, and is the height of the side wall 12.

[0019] In an embodiment, the thickness G, which is the dimension in the length direction of the partition wall portion 20, is not limited. For example, it is 0.2 mm or more and 0.45 mm or less. When the thickness G of the partition wall portion 20 is this small, the pitch of the plurality of accommodating portions 10 becomes small, and the number of accommodating portions 10 can be increased, so that a large number of components M can be efficiently accommodated, which is preferable.

[0020] As shown in FIG. 4, the top portion 21 is formed in an R shape convex toward the surface 1a in the cross-sectional shape along the length direction and the height direction. That is, the side cross-sectional shape of the upper surface 21a of the partition wall portion including the top portion 21 is a semi-arc shape. The radius r of the R on this upper surface is, for example, 0.1 mm or more and 1.5 mm or less.

[0021] Note that the cross-sectional shape of the top portion 21 of the partition wall portion 20 does not have to be an R shape. For example, as shown in FIG. 5, the top portion 21 of the partition wall portion 20 has a rectangular cross-sectional shape along the length direction and the height direction, and the upper surface 21a of the top portion 21 may be formed as a flat surface along the length direction and the width direction.

[0022] The carrier tape 1 of the embodiment is formed by pressing a molding die against the surface 1a of a material made of a strip-shaped laminated paper and performing press molding, so that the accommodating portion 10 and the partition wall portion 20 are formed simultaneously. At the time of this press molding, the partition wall portion 20 is formed by being compressed in the height direction and the thickness direction from the state of the material. Therefore, the degree of compression of the partition wall portion 20 is higher than that of other portions, and the density is higher than that of other portions other than the partition wall portion 20. Also, because of the high density, the hardness of the partition wall portion 20 is higher than that of other portions.

[0023] In this embodiment, the carrier tape 1 contains one component M in each of the multiple storage compartments 10, and a cover tape (not shown) is attached to the surface 1a to seal the multiple storage compartments 10. As a result, the components M are sealed in the storage compartments 10 without falling out. The carrier tape 1, with one component M in each of the multiple storage compartments 10, is wound onto a reel (not shown) for transport and storage. Then, at the supplier of the components M, the carrier tape 1 is unwound from the reel, the cover tape is peeled off, and the components M are picked up from the storage compartments 10 for use. When unwinding the carrier tape 1 from the reel, the teeth of a rotating transport sprocket are sequentially engaged with the feed holes 30. As a result, the carrier tape 1 is unwound from the reel, and multiple components M are transported in the unwinding direction.

[0024] The carrier tape 1 described above is an embodiment of the carrier tape 1, and the following effects are achieved with this carrier tape 1.

[0025] The carrier tape 1 according to this embodiment is formed in a strip shape from a laminated material that forms layers in the lamination direction, and has a surface 1a and a back surface 1b that are opposite each other in the height direction corresponding to the lamination direction. On the surface 1a side, a plurality of storage sections 10 for accommodating parts M are arranged along the length direction separated by a partition wall 20, and in the height direction, the height position of the top 21 of the partition wall 20 is lower than the height position of the surface 1a.

[0026] As a result, the height of the partition wall 20 is smaller than the height, or thickness, of the carrier tape 1, thus reducing the degree of delamination compared to the case where the height is the same as the thickness of the carrier tape 1. In other words, delamination is less likely to occur in the partition wall 20.

[0027] In the carrier tape 1 according to the embodiment, the height distance H1 from the top 21 to the surface 1a is preferably 5% or more and 30% or less of the depth H2 of the storage section 10.

[0028] This ensures that the height of the partition wall 20 is sufficient to prevent the parts M housed in the housing 10 from protruding beyond the partition wall 20, while also providing the effect of suppressing delamination due to the low height.

[0029] In the carrier tape 1 according to the embodiment, the thickness of the partition wall portion 20 is preferably 0.2 mm or more and 0.45 mm or less.

[0030] As a result, the pitch between the multiple storage compartments 10 becomes smaller, increasing the number of storage compartments 10, and enabling efficient storage of a large number of parts M.

[0031] In the carrier tape 1 according to the embodiment, it is preferable that the top portion 21 has a cross-sectional shape along the length direction and height direction that is convex R-shaped on the surface 1a side.

[0032] For example, if the side cross-sectional shape of the top portion 21 is rectangular and has corners, these corners are prone to peeling, which can easily cause delamination and burrs. However, by forming the top portion 21 in an R-shape, such problems are less likely to occur. In other words, by forming the top portion 21 in an R-shape, the occurrence of delamination and burrs at the top portion 21 can be suppressed.

[0033] In the carrier tape 1 according to the embodiment, it is preferable that the density of the partition wall portion 20 is higher than that of other parts other than the partition wall portion 20.

[0034] As a result, the layers of the partition wall 20 become denser, which further suppresses the occurrence of delamination between layers.

[0035] The present invention is not limited to the configuration of the above embodiments, and can be modified and applied as appropriate without altering the essence of the invention. [Explanation of Symbols]

[0036] 1 Carrier Tape 1a Surface of the carrier tape 1ah Height position of the surface of the carrier tape 1b Back side of the carrier tape 10 Storage Unit 20 Partition wall section 21 Top 21h Height position of the top of the partition wall G Thickness of the partition wall H1: Height distance from the top to the surface. H2 Depth of the storage compartment M parts L (Length direction) T (height direction) W (width direction)

Claims

1. A carrier tape formed in a strip shape from laminated material arranged in layers in the lamination direction, having a front and back surface opposite to each other in the height direction corresponding to the lamination direction, and having a plurality of storage compartments for accommodating components arranged along the length direction separated by partition walls on the front surface side, A carrier tape in which both the front surface and the back surface are flat surfaces and parallel to each other.

2. The carrier tape according to claim 1, wherein the distance in the height direction from the top to the surface is 5% or more and 30% or less of the depth of the housing portion.

3. The carrier tape according to claim 1 or 2, wherein the thickness of the partition wall portion is 0.2 mm or more and 0.45 mm or less.

4. The carrier tape according to claim 1 or 2, wherein the top portion has a cross-sectional shape along the length direction and the height direction that is convex R-shaped towards the surface side.

5. The carrier tape according to claim 1 or 2, wherein the density of the partition wall portion is higher than that of other portions other than the partition wall portion.