Package, light-emitting device, light-emitting module

Abstract

To provide a package that facilitates inspection of whether the joining member has risen to a predetermined height on the side of the frame when joining it to a wiring board. [Solution] The package has a base having an upper surface and a lower surface opposite to the upper surface, and a frame joined to the base, surrounding the lower surface of the base when viewed from below, and having an upper surface, a lower surface opposite to the upper surface, an outer surface, and an inner surface, wherein the frame has one or more grooves that are recessed from the outer surface toward the inner surface, the one or more grooves are provided from the upper surface to the lower surface of the frame, the one or more grooves are provided with respect to a predetermined first height and a second height higher than the first height with respect to the lower surface of the frame, the width at the second height is wider than the width at the first height, and one or more electrode patterns are arranged on the lower surface of the frame that are connected to the lower ends of the one or more grooves when viewed from below.

Description

Technical Field

[0001] The present disclosure relates to a package, a light-emitting device, and a light-emitting module.

Background Art

[0002] Packages capable of mounting light-emitting elements are known. For example, a package having a base portion having a first surface on which a semiconductor laser element is disposed and a frame portion surrounding the semiconductor laser element disposed on the first surface can be mentioned. In this package, a metal film is provided on the lower surface of the frame portion. When this package is joined to a substrate, the metal film on the lower surface of the frame portion and the metal film of the substrate are joined by soldering. At this time, the solder sandwiched between the lower surface of the frame portion and the substrate may climb up the side surface of the frame portion. The higher the amount of solder, the higher the height to which the solder climbs tends to be. Therefore, by confirming that the solder has climbed up to a predetermined height on the side surface of the frame portion, it can be confirmed that the amount of solder is sufficient, that is, the joining strength between the frame portion and the substrate is sufficient.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present disclosure is to provide a package capable of facilitating inspection of whether a joining member has climbed up to a predetermined height on the side surface of a frame portion when joining to a wiring substrate. Another object is to provide a light-emitting device having this package and a light-emitting module having this light-emitting device.

Means for Solving the Problems

[0005] A package according to one embodiment of the present disclosure includes a base having an upper surface and a lower surface opposite to the upper surface, and a frame joined to the base, surrounding the lower surface of the base when viewed from below, and having an upper surface, a lower surface opposite to the upper surface, an inner surface, and an outer surface, wherein the frame has one or more grooves that are recessed from the outer surface toward the inner surface, the one or more grooves are provided from the upper surface toward the lower surface of the frame, the one or more grooves are wider at the second height than at the first height with respect to a predetermined first height and a second height higher than the first height with respect to the lower surface of the frame, and one or more electrode patterns are arranged on the lower surface of the frame that are connected to the lower ends of the one or more grooves when viewed from below.

[0006] A light-emitting device according to one embodiment of the present disclosure comprises a package according to one embodiment of the present disclosure and one or more light-emitting elements mounted on the upper surface of the base and surrounded by the frame in a top view, wherein the one or more light-emitting elements are electrically connected to the one or more electrode patterns.

[0007] A light-emitting module according to one embodiment of the present disclosure is a light-emitting module having a wiring board and one or more light-emitting devices according to one embodiment of the present disclosure mounted on the wiring board, wherein the wiring board has a mounting area on which the light-emitting devices are mounted, electrode portions are arranged in the mounting area, the one or more electrode patterns are joined to the electrode portions via a conductive bonding member, and a part of the bonding member enters into grooves formed by the one or more groove portions. [Effects of the Invention]

[0008] According to one embodiment of this disclosure, a package can be provided that facilitates inspection of the amount of bonding material when bonding to a wiring board. Furthermore, a light-emitting device having this package and a light-emitting module having this light-emitting device can be provided. [Brief explanation of the drawing]

[0009] [Figure 1]This is a perspective view illustrating a package according to the first embodiment. [Figure 2] This is a top view illustrating a package according to the first embodiment. [Figure 3] This is a bottom view illustrating a package according to the first embodiment. [Figure 4] Figure 2 shows a cross-sectional view of the package along the IV-IV section. [Figure 5] This is a side view showing a magnified view of the groove and its vicinity. [Figure 6] This is a partial perspective view illustrating a package according to the first embodiment. [Figure 7] This is a diagram illustrating the implementation of the package. [Figure 8] This diagram schematically shows the joint member as it climbs up the groove. [Figure 9] This is a partial perspective view illustrating a package according to Modification 1 of the First Embodiment. [Figure 10] This is a partial perspective view illustrating a package according to a modified example 2 of the first embodiment. [Figure 11] This is a perspective view illustrating a light-emitting device according to the second embodiment. [Figure 12] This is a top view of the light-emitting device shown in Figure 11, with the lens component and cover removed. [Figure 13] This is a cross-sectional view of the light-emitting device along the VIII-VIII section in Figure 11. [Figure 14] This is a perspective view illustrating a light-emitting module according to the third embodiment. [Figure 15] This is a top view illustrating a wiring board that constitutes a light-emitting module according to the third embodiment. [Modes for carrying out the invention]

[0010] Hereinafter, embodiments for implementing the invention will be described with reference to the drawings. In the following description, terms indicating specific directions and positions (for example, "upper", "lower", and other terms including those terms) are used as necessary. However, the use of those terms is for facilitating the understanding of the invention with reference to the drawings, and the technical scope of the present invention is not excessively limited by the meanings of those terms. For example, when the "upper surface" is described, the invention does not necessarily have to be used so as to always face upward. Also, parts denoted by the same reference numerals appearing in a plurality of drawings indicate the same or equivalent parts or members.

[0011] In the present disclosure, with regard to polygons such as triangles and quadrilaterals, shapes obtained by performing processing such as rounding, chamfering, corner rounding, and rounding at the corners of the polygon are also included in what is called a polygon. Also, not limited to the corners (ends of the sides), shapes obtained by performing processing on the middle part of the sides are also similarly called polygons. That is, shapes obtained by performing partial processing while leaving the polygon as a base are included in the interpretation of the "polygon" described in the present disclosure.

[0012] Moreover, not only for polygons, but also for words representing specific shapes such as trapezoids, circles, and concavities and convexities, the same applies. Also, the same applies when dealing with each side forming the shape. That is, even if a side has been processed at a corner or in the middle part, the processed part is also included in the interpretation of the "side". When distinguishing a "polygon" or a "side" without partial processing from the processed shape, "strict" is added, for example, it is described as "strict quadrilateral" and the like.

[0013] Furthermore, the following embodiments exemplify packages and the like for embodying the technical idea of the present invention, and do not limit the present invention as follows. Also, dimensions, materials, shapes, relative arrangements, etc. of the components described below are not intended to limit the scope of the present invention only to those, but are intended to be exemplified, unless otherwise specified. Also, the content described in one embodiment is applicable to other embodiments and modifications. Also, the sizes and positional relationships of the members shown in the drawings may be exaggerated for clarity of explanation. Furthermore, in order to avoid excessive complexity of the drawings, schematic diagrams omitting the illustration of some elements or end views showing only the cut surface as a cross-sectional view may be used.

[0014] <First Embodiment> As a first embodiment of the package according to the present disclosure, the package 100 will be described. FIG. 1 is a perspective view exemplifying the package according to the first embodiment. FIG. 2 is a top view exemplifying the package according to the first embodiment. FIG. 3 is a bottom view exemplifying the package according to the first embodiment. FIG. 4 is a cross-sectional view of the package taken along the IV-IV cross-sectional line in FIG. 2. FIG. 5 is a side view showing an enlarged view of the groove portion and its vicinity. FIG. 6 is a partial perspective view exemplifying the package according to the first embodiment.

[0015] The package 100 has a base portion 110 and a frame portion 120. The package 100 can be used, for example, as a package for mounting a light-emitting element. Hereinafter, each component of the package 100 will be described.

[0016] (Base portion 110) The base 110 comprises an upper surface 110a and a lower surface 110b opposite to the upper surface 110a. The upper surface 110a and the lower surface 110b are, for example, flat. The upper surface 110a and the lower surface 110b are, for example, parallel. Here, parallelism allows for a difference of ±5 degrees. The same applies to the following description. The base 110 has a rectangular shape when viewed from above. This rectangle may be a rectangle with a long side and a short side. However, the shape of the base 110 when viewed from above does not have to be rectangular. Unless otherwise stated to exclude squares, a rectangle may include a square.

[0017] A metal film may be provided on the upper surface 110a of the base 110. A metal film may also be provided on the lower surface 110b of the base 110.

[0018] The base 110 can be formed using, for example, a metal as the main material. Examples of metals that can be used include copper and copper alloys. However, the base 110 may also be formed from a main material other than metal, such as ceramics.

[0019] (Frame section 120) The frame portion 120 comprises an upper surface 120a, a lower surface 120b opposite to the upper surface 120a, one or more inner surfaces 120c, and one or more outer surfaces 120d. The frame portion 120 is, for example, rectangular in shape when viewed from above. One or more inner surfaces 120c of the frame portion 120 are connected to the upper surface 120a and extend downward from the upper surface 120a. One or more outer surfaces 120d of the frame portion 120 are connected to the upper surface 120a and the lower surface 120b and extend downward from the upper surface 120a.

[0020] The frame portion 120 is provided with one or more grooves 130 that are recessed from the outer surface 120d toward the inner surface 120c. The one or more grooves 130 are provided from the upper surface 120a toward the lower surface 120b of the frame portion 120.

[0021] In the illustrated example, the frame portion 120 is rectangular in shape when viewed from above and has a plurality of groove portions 130. The plurality of groove portions 130 may include first groove portions 130A provided at each of the four corners of the frame portion 120. This allows the effects of the groove portions 130, described later, to be obtained at the four corners. The plurality of groove portions 130 may include second groove portions 130B provided between two first groove portions 130A provided at two adjacent corners of the frame portion 120.

[0022] As shown in Figure 5, the second groove 130B has a width W2 at the second height H2 that is wider than the width W1 at the first height H1, with respect to a predetermined first height H1 and a second height H2 that is higher than the first height H1, with respect to the lower surface 120b of the frame 120. Here, in the second groove 130B, the width at a certain height is the length of the straight line drawn parallel to the lower surface 120b, connecting the connection between the L-side surface and the outer surface 120d, and the connection between the R-side surface and the outer surface 120d, at that height. The L-side and R-side refer to the areas enclosed by dashed lines, indicated by L or R in Figure 6. The left boundary between the outer surface 120d and the second side surface 130S2 may be called the L-side, and the right boundary may be called the R-side.

[0023] Furthermore, in the illustrated example, the second groove 130B has a width W3 at the third height H3 that is wider than the width W2 at the second height H2, with respect to a predetermined second height H2 and a third height H3 that is higher than the second height H2, with respect to the lower surface 120b of the frame 120. The third height H3 is the height of the upper surface 120a with respect to the lower surface 120b of the frame 120.

[0024] The width of the second groove 130B from the lower surface 120b of the frame 120 to the first height H1 may be the same as the width W1. The width of the second groove 130B from the first height H1 to the second height H2 may be the same as the width W2. The width of the second groove 130B from the second height H2 to the third height H3 may be the same as the width W3.

[0025] The second groove 130B has a first side surface 130S1 and a second side surface 130S2 connected to the first side surface 130S1. The first side surface 130S1 of the second groove 130B may be a plane. The first side surface 130S1 of the second groove 130B may be parallel or perpendicular to the inner side surface 120c or outer side surface 120d of the frame 120. Here, parallelism and perpendicularity allow for a difference of ±5 degrees. The same applies to the following description. The second side surface 130S2 of the second groove 130B may include the side surfaces 131c, 132c, and 133c described later.

[0026] A first stepped portion 131 may be provided in the second groove portion 130B. The first stepped portion 131 may have an upper surface 131a and a side surface 131c that connects to the upper surface 131a and extends downward. The side surface 131c connects to the outer surface 120d of the frame portion 120, the first side surface 130S1 of the second groove portion 130B, and the lower surface 120b of the frame portion 120. The first height H1 is the height at the point where the upper surface 131a of the first stepped portion 131 and the side surface 131c of the first stepped portion 131 intersect. In the illustrated example, the upper surface 131a is a flat surface and the side surface 131c is a curved surface. The upper surface 131a is, for example, parallel to the lower surface 120b of the frame portion 120.

[0027] A second stepped portion 132 may be provided in the second groove portion 130B. The second stepped portion 132 may comprise an upper surface 132a and a side surface 132c that connects to the upper surface 132a and extends downward. The side surface 132c connects to the outer surface 120d of the frame portion 120 and the first side surface 130S1 of the second groove portion 130B. The second height H2 is the height at the point where the upper surface 132a of the second stepped portion 132 and the side surface 132c of the second stepped portion 132 intersect. In the illustrated example, the upper surface 132a and the side surface 132c are planar. The upper surface 132a is, for example, parallel to the lower surface 120b of the frame portion 120. The side surface 132c is, for example, perpendicular to the outer surface 120d that connects to the side surface 132c. Side surface 132c is, for example, perpendicular to the first side surface 130S1 of the second groove 130B. Two side surfaces 132c that face each other across the first side surface 130S1 of the second groove 130B in a side view are, for example, parallel to each other.

[0028] In the illustrated example, the second groove 130B further includes a side surface 133c that connects to the upper surface 120a of the frame 120 and extends downward. The side surface 133c connects to the outer surface 120d of the frame 120, the first side surface 130S1 of the second groove 130B, and the upper surface 132a of the second stepped portion 132. In the illustrated example, the side surface 133c is planar. The side surface 133c is perpendicular to, for example, the outer surface 120d that connects to the side surface 133c. The side surface 133c is perpendicular to, for example, the first side surface 130S1 of the second groove 130B. In a side view, the two side surfaces 133c that face each other across the first side surface 130S1 of the second groove 130B are, for example, parallel to each other.

[0029] The distance L1 from the inner surface 120c of the frame portion 120 to the first surface 130S1 of the second groove portion 130B is constant from the upper surface 120a of the frame portion 120 to the lower surface 120b of the frame portion 120. Also, in a cross-sectional view passing through the second groove portion 130B and perpendicular to the outer surface 120d and the lower surface 120b, the distance L2 from the outer surface 120d of the frame portion 120 to the first surface 130S1 of the second groove portion 130B is constant from the upper surface 120a of the frame portion 120 to the lower surface 120b of the frame portion 120. In other words, in the direction perpendicular to the outer surface 120d where the upper surface 131a of the first stepped portion 131 and the upper surface 132a of the second stepped portion 132 are connected, the length of the upper surface 131a and the length of the upper surface 132a are equal to the distance L2.

[0030] The first groove 130A is a structure in which, for example, the L portion of the second groove 130B shown in Figure 6 is moved parallel to the R portion of the second groove 130B shown in Figure 6 along the outer surface 120d until the width W1 shown in Figure 5 becomes zero, and either the L portion or the R portion is bent 90 degrees relative to the other such that the boundary between the L portion and the R portion is convex.

[0031] Therefore, the first groove 130A, like the second groove 130B, has a first stepped portion 131 and a second stepped portion 132. The upper surface 131a of the first stepped portion 131 in the first groove 130A is at the same height as the upper surface 131a of the first stepped portion 131 in the second groove 130B, and is the first height H1. The upper surface 132a of the second stepped portion 132 in the first groove 130A is at the same height as the upper surface 132a of the second stepped portion 132 in the second groove 130B, and is the second height H2.

[0032] Similar to the second groove 130B, the first groove 130A has a wider width at the second height H2 than at the first height H1. Furthermore, in the illustrated example, the first groove 130A has a wider width at the third height H3 than at the second height H2. Here, in the first groove 130A, the width at a certain height is the length of the straight line drawn parallel to the bottom surface 120b, connecting the connection point between the L-side surface and the outer surface 120d, and the connection point between the R-side surface and the outer surface 120d, at that height.

[0033] In the first groove 130A, the lengths of the upper surfaces 131a and 132a are equal to the distance L2 in the direction perpendicular to the outer surface 120d where the upper surface 131a of the first stepped portion 131 and the upper surface 132a of the second stepped portion 132 are connected.

[0034] The height from the bottom surface 120b of the frame portion 120 to the top surface 120a of the frame portion 120 is, for example, 1.7 mm or more and 2.1 mm or less. The length of the width W1 is, for example, 0.26 mm or more and 0.66 mm or less. The length of the width W2 is, for example, 0.5 mm or more and 1 mm or less. The length of the width W3 is, for example, 0.7 mm or more and 1.2 mm or less. The height of height H1 is, for example, 0.15 mm or more and 0.55 mm or less. The height of height H2 is, for example, 0.5 mm or more and 0.9 mm or less. The height of height H3 is, for example, 1.7 mm or more and 2.1 mm or less. The length of distance L1 is, for example, 0.6 mm or more and 1.1 mm or less. The length of distance L2 is, for example, 0.05 mm or more and 0.35 mm or less. The distance between two opposing outer surfaces 120d of the frame portion 120 is between 1.2 and 3.7 times the length of the width W1 of the groove portion 130.

[0035] The width W1 of the first groove 130A is narrower than the width W1 of the second groove 130B. The width W2 of the first groove 130A is narrower than the width W2 of the second groove 130B. The width W3 of the first groove 130A is narrower than the width W3 of the second groove 130B.

[0036] In the illustrated example, a metal film 141 is provided on the first side surface 130S1 and / or the second side surface 130S2 of the first groove 130A and the second groove 130B. For example, a multilayer structure such as Ni / Au or Ti / Pt / Au can be used for the metal film 141.

[0037] In the illustrated example, metal films 142 and 143, which are electrically insulated from each other, are provided on the upper surface 120a of the frame portion 120. Metal film 142 may be provided in a frame shape along the outer edge of the upper surface 120a when viewed from above. Metal film 143 may be provided in a frame shape inside metal film 142 and spaced apart from metal film 142 when viewed from above. When viewed from above, metal films 142 and 143 may be arranged to surround the upper surface 110a of the base portion 110. Metal films 142 and 143 may be formed from the same metallic material as metal film 141. Note that metal films 142 and 143 are optional.

[0038] In the illustrated example, one or more electrode patterns 144 are arranged on the lower surface 120b of the frame portion 120. Specifically, three electrode patterns 144 are arranged along one of the opposing outer surfaces 120d of the frame portion 120, and three electrode patterns 144 are arranged along the other outer surface 120d. The number of grooves 130 is at least equal to the number of electrode patterns 144. In the illustrated example, multiple electrode patterns 144 are provided, and the number of grooves 130 and the number of electrode patterns 144 are equal, at six each. This allows for the placement of grooves 130 for each electrode pattern 144, and the effects of the grooves 130, described later, can be obtained for all electrode patterns 144.

[0039] In the illustrated example, in a bottom view, three electrode patterns 144 along one of the opposing outer surfaces 120d of the frame portion 120 and three electrode patterns 144 along the other outer surface 120d face each other across the bottom surface 110b of the base portion 110. In a bottom view, each electrode pattern 144 is spaced apart from the bottom surface 110b of the base portion 110. In a bottom view, each electrode pattern 144 is in contact with the outer edge of the bottom surface 120b of the frame portion 120. Each electrode pattern 144 is connected to the lower end of the groove portion 130. Each electrode pattern 144 is connected to the metal film 141 provided in the first groove portion 130A or the metal film 141 provided in the second groove portion 130B. This makes it easier for the conductive bonding member to spread from the electrode patterns 144 to the metal film 141 when the package 100 is bonded to the wiring board via the conductive bonding member.

[0040] As shown in Figure 3, in a bottom view, the outer edges of the first groove 130A and the second groove 130B are part of the outer edge of the electrode pattern 144. In a bottom view, along the contour of the frame 120, the length of the outer edge of the first groove 130A is shorter than the length of the outer edge of the electrode pattern 144 connected to the first groove 130A. In a bottom view, along the contour of the frame 120, the length of the outer edge of the second groove 130B is shorter than the length of the outer edge of the electrode pattern 144 connected to the second groove 130B. As a result, even with a small amount of joining material extending from the electrode pattern 144 to the metal film 141, a sufficient crawl-up height for inspection can be obtained.

[0041] Viewed from below, the length of the electrode pattern 144 connected to the first groove 130A on the contour line of the frame portion 120 is 1.35 mm or more and 1.65 mm or less. Viewed from below, the length of the electrode pattern 144 connected to the second groove 130B on the contour line of the frame portion 120 is 2.3 mm or more and 2.5 mm or less. Viewed from below, the length of the first groove 130A is 0.1 mm or more and 0.4 mm or less. Viewed from below, the length of the second groove 130B is 0.6 mm or more and 1 mm or less. Viewed from below, the length of the electrode pattern 144 connected to the first groove 130A on the contour line of the frame portion 120 is 3 times or more and 10 times or less the length of the first groove 130A. Viewed from below, the length of the electrode pattern 144 connected to the second groove 130B on the contour line of the frame portion 120 is between 2.5 and 4 times the length of the second groove 130B.

[0042] If the outer shape of the frame portion 120 is a rectangle having a long side and a short side, the first groove portion 130A is provided on the outer surface 120d of the frame portion 120 at the location connecting the side constituting the long side and the side constituting the short side. The second groove portion 130B is not provided on the outer surface 120d of the frame portion 120 at the location connecting the side constituting the long side and the side constituting the short side, but is provided on the perpendicular bisector of the long side or short side when viewed from below. If the outer shape of the electrode pattern 144 is a rectangle having a long side and a short side, the first groove portion 130A is provided on the electrode pattern 144 at the location connecting the side constituting the long side and the side constituting the short side. The second groove portion 130B is not provided on the electrode pattern 144 at the location connecting the side constituting the long side and the side constituting the short side, but is provided on the perpendicular bisector of the long side.

[0043] The frame portion 120 may further have a third stepped portion 140 having an upper surface 140a that is connected to one or more inner surfaces 120c of the frame portion 120 and extends inward from the inner surfaces 120c. The upper surface 140a is located above the upper surface 110a of the base portion 110 and below the upper surface 120a of the frame portion 120. The third stepped portion 140 further has an inner surface that is connected to the upper surface 140a and extends downward. The upper surface 140a may be, for example, parallel to the upper surface 110a of the base portion 110. The inner surface of the third stepped portion 140 is connected to the upper surface 110a of the base portion 110. In the illustrated example, the third stepped portion 140 is provided along two opposing inner surfaces 120c in a top view. The third stepped portion 140 may be provided along only one of the inner surfaces 120c. The frame portion 120 does not necessarily have to have the third stepped portion 140.

[0044] One or more metal films 145 may be provided on the upper surface 140a of the third stepped portion 140. In the illustrated example, metal films 145 are provided on one upper surface 140a and the other upper surface 140a of the third stepped portion 140, respectively. The metal films 145 may be formed from the same metallic material as the metal film 141.

[0045] The third stepped portion 140 may further have a lower surface 140b connected to the inner surface of the third stepped portion 140. The lower surface 140b may be a plane parallel to the upper surface 140a. The lower surface 140b is located above the lower surface 120b of the frame portion 120. In the illustrated example, the frame portion 120 further has a side surface that connects to the lower surface 140b and extends downward. The side surface connects to the lower surface 120b of the frame portion 120.

[0046] The frame portion 120 can be formed using a different material as its main material, for example, than the base portion 110. Examples of main materials for forming the frame portion 120 include ceramics. For example, aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide can be used as ceramics.

[0047] (Package 100) The frame portion 120 is joined to the base portion 110. In the illustrated example, the lower surface 140b of the third stepped portion 140 of the frame portion 120 is joined to the upper surface 110a of the base portion 110. The base portion 110 and the frame portion 120 form a concave shape that is recessed from the upper surface 120a of the frame portion 120 toward the upper surface 110a of the base portion 110. The concave shape is formed inside the outer shape of the frame portion 120 when viewed from above. When viewed from above, the upper surface 110a of the base portion 110 is surrounded by a frame formed by one or more inner surfaces 120c of the frame portion 120 and / or the inner surface of the third stepped portion 140. The outer shape of this frame is a rectangle with long and short sides. When viewed from below, the frame portion 120 surrounds the lower surface 110b of the base portion 110. In the illustrated example, the base portion 110 and the frame portion 120 are formed separately and then joined together. However, the base portion 110 and the frame portion 120 may be formed as a single unit.

[0048] Figure 7 illustrates the mounting of the package. As shown in Figure 7, the package 100 can be mounted, for example, on a wiring board 150 on which an electrode portion 154 is arranged. The electrode pattern 144 of the package 100 is bonded to the electrode portion 154 of the wiring board 150 via a bonding member such as Au-Sn. When bonding, the bonding member is placed on the electrode portion 154, and the package 100 is positioned so that the electrode pattern 144 is on the electrode portion 154 via the bonding member. After that, the bonding member is heated and melted, and then hardened. If necessary, the package 100 may be pressed towards the wiring board 150 before the bonding member hardens.

[0049] During joining, the molten joining material spreads across the entire electrode pattern 144 of the package 100. Some of the joining material flows out from the lower surface 120b of the frame portion 120, enters the groove portion 130, and climbs up the groove portion 130. The joining material that climbs up the groove portion 130 comes into contact with the first side surface 130S1 of the groove portion 130. The height of the joining material that climbs up the groove portion 130 changes depending on the amount of joining material that flows out. To ensure sufficient bonding strength between the package 100 and the wiring board 150, it is preferable that an appropriate amount of joining material climbs up the groove portion 130. By inspecting the height to which the joining material climbs up the groove portion 130, it is possible to determine whether sufficient bonding strength has been obtained.

[0050] Figure 8 schematically shows the appearance of the joint member as it climbs up the groove. Figure 8 schematically shows the side view and top view for cases with a small amount of joint member, a large amount, and an intermediate amount. In Figure 8, the joint member J is indicated by a dot pattern.

[0051] As shown in Figure 8, the height to which the connecting member J rises can be directly inspected in a side view. On the other hand, the height to which the connecting member J rises cannot be directly inspected in a top view. However, as shown in Figure 5, since the groove 130 is wider at the second height than at the first height, it is possible to inspect whether the connecting member J has risen to a predetermined height or higher by observing the width of the connecting member J in a top view. The inspection may be performed visually or by image recognition using a camera.

[0052] For example, if sufficient joint strength can be obtained by having the joining member J rise to a position higher than the first height H1 shown in Figure 5, then in Figure 8, the intermediate and large amounts of joining member J satisfy this criterion. This can be determined by viewing the groove 130 from above, without viewing it from the side. Similarly, if sufficient joint strength can be obtained by having the joining member J rise to a position higher than the second height H2 shown in Figure 5, then in Figure 8, the large amount of joining member J satisfies this criterion. This can be determined by viewing the groove 130 from above, without viewing it from the side.

[0053] For example, multiple packages 100 may be mounted in a relatively narrow area of ​​a wiring board 150. In this case, it is difficult to view the grooves 130 provided on the opposing outer surfaces 120d of adjacent packages 100 from the side. On the other hand, even in such cases, it is possible to view the packages 100 from above, and as explained with reference to Figure 8, by recognizing the width of the joining member from above, it is possible to determine whether the degree of the joining member's rise is appropriate.

[0054] In other words, in conventional packages where a groove of a fixed width is provided regardless of the height from the bottom surface of the frame, it was difficult to determine from a top view whether the joining member had climbed up to a predetermined height or higher. In contrast, the groove 130 of package 100 has a wider width at the second height than at the first height, which makes it possible to easily inspect whether the joining member has climbed up to a predetermined height.

[0055] Furthermore, the ability to determine the height to which the joint member rises from a top view shortens the decision-making time when using image recognition with a camera. In other words, if the height to which the joint member rises can only be determined from a side view, even if there is sufficient space on the side, it is necessary to move the camera to the position where the groove is provided and take pictures repeatedly. In contrast, if the height to which the joint member rises can be determined from a top view, multiple grooves 130 can be photographed at once from above the package 100 as long as they are within the camera's field of view, thus shortening the decision-making time. This makes it possible to easily inspect whether the joint member has risen to a predetermined height.

[0056] In the first embodiment, an example was shown in which one groove 130 has two sets of first stepped portions 131 and second stepped portions 132 on the left and right sides. However, even if one groove 130 has only one set of first stepped portions 131 and second stepped portions 132 on one side, the degree to which the joining member rises can be determined by looking at it from above. This makes it possible to easily inspect whether the joining member has risen to a predetermined height. Furthermore, as long as one groove 130 has at least one stepped portion, the degree to which the joining member rises can be determined by looking at it from above.

[0057] <Variations of the first embodiment> Figure 9 is a partial perspective view illustrating a package according to Modification 1 of the First Embodiment. In the example of Figure 9, in the second groove 130B, all of the side surfaces 131c constituting the first step portion 131, the side surfaces 132c constituting the second step portion 132, and the side surface 133c are curved. The first side surface 130S1 of the second groove 130B is flat, as in the case of Figure 6. Also, in the first groove 130A, all surfaces constituting the step portion are curved except for the top surface, and there is no distinction between the first side surface 130S1 and the second side surface 130S2.

[0058] In the case of Figure 9, the first groove 130A and the second groove 130B have a wider width at the second height than at the first height, thus achieving the same effect as in the first embodiment.

[0059] Figure 10 is a partial perspective view illustrating a package according to a modification 2 of the first embodiment. In the example of Figure 10, the first groove 130A and the second groove 130B have inclined portions 135 that gradually widen as they move upward.

[0060] In the case of Figure 10, the width of the first groove 130A and the second groove 130B increases as the height from the lower surface 120b of the frame 120 increases, thus achieving the same effect as in the first embodiment. Furthermore, since the width changes continuously with respect to the height from the lower surface 120b of the frame 120, the degree to which the joining member rises can be determined in more detail from a top view.

[0061] <Second Embodiment> A second embodiment shows a light-emitting device having the package according to the disclosure. Figure 11 is a perspective view illustrating a light-emitting device according to the second embodiment. Figure 12 is a top view of the light-emitting device shown in Figure 11 with the lens member and lid removed. Figure 13 is a cross-sectional view of the light-emitting device along the cross-sectional line VIII-VIII in Figure 11.

[0062] As illustrated in Figures 11 to 13, the light-emitting device 200 includes a package 100, a submount 210, one or more light-emitting elements 220, one or more reflective members 230, wiring 250, a cover 260, and a lens member 280. Note that the light-emitting device 200 does not necessarily have to include all of these components. The individual components of the light-emitting device 200 will be described below.

[0063] (Submount 210) The submount 210 is, for example, configured in the shape of a rectangular parallelepiped and has a bottom surface, a top surface, and one or more sides. The submount 210 has the smallest width in the vertical direction. Note that the shape is not limited to a rectangular parallelepiped. The submount 210 is formed using, for example, aluminum nitride or silicon carbide, but other materials may be used. A metal film may or may not be provided on the top and / or bottom surface of the submount 210.

[0064] (Light-emitting element 220) The light-emitting device 200 can be equipped with one or more light-emitting elements 220. In the illustrated example of the light-emitting device 200, five light-emitting elements 220 are equipped. The light-emitting elements 220 are, for example, semiconductor laser elements. The light-emitting elements 220 are not limited to semiconductor laser elements, but may also be, for example, light-emitting diodes (LEDs) or organic light-emitting diodes (OLEDs). In the illustrated example of the light-emitting device 200, semiconductor laser elements are used as light-emitting elements 220.

[0065] The light-emitting element 220 has, for example, a rectangular shape when viewed from above. The side connected to one of the two shorter sides of the rectangle becomes the light-emitting end face from which light is emitted. The top and bottom surfaces of the light-emitting element 220 have a larger area than the light-emitting end face. A metal film may or may not be provided on the top surface of the light-emitting element 220.

[0066] Here, we will explain the case where the light-emitting element 220 is a semiconductor laser element. The light (laser light) emitted from the light-emitting element 220 has a broadened shape and forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the exit end face. Here, FFP refers to the shape and light intensity distribution of the emitted light at a position away from the exit end face.

[0067] Based on the elliptical light emitted from the light-emitting element 220, the direction passing through the major axis of the ellipse is defined as the fast axis direction of the FFP, and the direction passing through the minor axis of the ellipse is defined as the slow axis direction of the FFP. The fast axis direction of the FFP in the light-emitting element 220 may coincide with the stacking direction in which the multiple semiconductor layers, including the active layer of the light-emitting element 220, are stacked.

[0068] Furthermore, based on the light intensity distribution of the FFP of the light-emitting element 220, 1 / e of the peak intensity value 2 Light with the above intensity will be called the main portion of light. Also, in this light intensity distribution, 1 / e 2 The angle corresponding to the intensity of the FFP is called the spreading angle. The spreading angle of the FFP in the fast axis direction is greater than the spreading angle of the FFP in the slow axis direction.

[0069] Furthermore, the light passing through the center of the elliptical shape of the FFP, in other words, the light with peak intensity in the light intensity distribution of the FFP, will be referred to as light traveling along the optical axis, or light passing through the optical axis. The optical path of the light traveling through the center of the elliptical shape of the FFP will also be referred to as the optical axis of that light.

[0070] As the light-emitting element 220, a light-emitting element that emits blue light can be used. "Light-emitting element that emits blue light" refers to a light-emitting element whose emitted light peak wavelength is in the range of 405 nm to 494 nm. Furthermore, it is preferable to use a light-emitting element 220 whose emitted light peak wavelength is in the range of 430 nm to 480 nm. Examples of such light-emitting elements 220 include semiconductor laser elements containing nitride semiconductors. For example, GaN, InGaN, or AlGaN can be used as nitride semiconductors.

[0071] The emission peak of the light emitted from the light-emitting element 220 is not limited to this. For example, the light emitted from the light-emitting element 220 may be blue light, as well as visible light including green light and red light having wavelengths outside the aforementioned wavelength range, ultraviolet light, and infrared light.

[0072] (Reflective member 230) The reflective member 230 comprises a bottom surface, a plurality of side surfaces, and a light-reflecting surface inclined with respect to the bottom surface. The plurality of side surfaces include two side surfaces that face each other across the light-reflecting surface. Preferably, the light-reflecting surface has a light reflectance of 90% or more with respect to the peak wavelength of the irradiated light. The light-reflecting surface is, for example, a flat surface. The inclination angle of the light-reflecting surface with respect to the bottom surface is in the range of 10 degrees to 80 degrees, for example, 45 degrees.

[0073] The reflective member 230 can use glass or metal as the main material that forms its outer shape. The main material is preferably a heat-resistant material, such as glass like quartz or BK7 (borosilicate glass), metals like aluminum, or Si. The light-reflecting surface can be formed using, for example, metals like Ag or Al, or dielectric multilayer films such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0074] (Wiring 250) The wiring 250 is composed of a conductor having a linear shape with joints at both ends. In other words, the wiring 250 has joints at both ends of the linear portion for joining with other components. The wiring 250 is used for electrical connection between two components. As the wiring 250, for example, a metal wire can be used. Examples of metals include gold, aluminum, silver, copper, and tungsten.

[0075] (Lid part 260) The lid 260 has an upper surface, a lower surface, and one or more sides connected to the upper and lower surfaces. The one or more sides connect the outer edge of the upper surface to the outer edge of the lower surface. The lid 260 is, for example, a rectangular parallelepiped. In this case, both the upper and lower surfaces of the lid 260 are rectangular, and the lid 260 has four rectangular sides.

[0076] However, the lid 260 is not limited to a rectangular parallelepiped. That is, the lid 260 is not limited to a rectangle when viewed from above, and can be any shape such as a circle, ellipse, or polygon.

[0077] The lid portion 260 has a light-transmitting region that transmits light of a predetermined wavelength. The light-transmitting region constitutes at least a part of the upper and lower surfaces of the lid portion 260. The light-transmitting region of the lid portion 260 can be formed using, for example, sapphire as the main material. Sapphire is a material with relatively high transmittance and relatively high strength. In addition to sapphire, other translucent materials such as quartz, silicon carbide, or glass may be used as the main material for the light-transmitting region of the lid portion 260. The parts of the lid portion 260 other than the light-transmitting region may be formed integrally with the light-transmitting region using the same material.

[0078] (Lens component 280) The lens member 280 has an upper surface, a lower surface, and side surfaces. The lens member 280 imparts optical effects such as focusing, diffusing, and collimating to incident light, and light with these optical effects is emitted from the lens member 280.

[0079] The lens member 280 has one or more lens surfaces. The one or more lens surfaces are provided on the upper side of the lens member 280. Alternatively, they may be provided on the lower side of the lens member 280. The lens member 280 has an upper surface and a lower surface, both of which are flat. The one or more lens surfaces are connected to the upper surface. The one or more lens surfaces are surrounded by the upper surface when viewed from above. When viewed from above, the lens member 280 has a rectangular outline. The lower surface of the lens member 280 is rectangular.

[0080] In the lens member 280, the portion that overlaps with one or more lens surfaces when viewed from above is designated as the lens portion, and the portion that does not overlap is designated as the non-lens portion. In the lens member 280, the portion that overlaps with the top surface when viewed from above is included in the non-lens portion. The lens portion can also be distinguished as a lens-shaped portion when the lens surface side is divided by a hypothetical plane including the top surface, and a flat plate-shaped portion when the lens surface side is divided. The bottom surface of the lens member 280 is composed of the bottom surface of the lens portion and the bottom surface of the non-lens portion.

[0081] In a lens member 280 having multiple lens surfaces, the multiple lens surfaces are formed in a continuous line in one direction. That is, the multiple lens surfaces are connected to each other and arranged in the same direction. The lens member 280 is formed such that the vertices of each lens surface lie on a hypothetical straight line. This hypothetical straight line is in the same direction as the longitudinal direction of the lens member 280.

[0082] Here, the direction in which multiple lens surfaces are aligned when viewed from above is called the connection direction. When viewed from above, the length of the multiple lens surfaces in the connection direction is greater than the length in the direction perpendicular to this direction. In the illustrated lens member 280, the connection direction is the same direction as the longitudinal direction of the lens member 280.

[0083] The lens member 280 is light-transmitting. Both the lens portion and the non-lens portion of the lens member 280 are light-transmitting. The lens member 280 can be formed using, for example, glass such as BK7.

[0084] (Light-emitting device 200) In the light-emitting device 200, one or more light-emitting elements 220 are mounted on the upper surface 110a of the base 110 and surrounded by the frame 120 when viewed from above. A submount 210 and a reflective member 230 are arranged on the base 110, and the light-emitting elements 220 are positioned on the submount 210. For example, a metal film formed on the lower surface of the light-emitting element 220 and a metal film formed on the upper surface of the submount 210 are joined via Au paste, Au-Sn, etc. The light-emitting element 220 may be positioned such that its emission end face faces the light-reflecting surface side of the reflective member 230.

[0085] In the illustrated light-emitting device 200, multiple light-emitting elements 220 are arranged in a line along the longitudinal direction of the base 110. Light is emitted from the light-emitting surface of each light-emitting element 220 in the same direction. Here, the same direction includes an angular difference of ±10 degrees. In the illustrated light-emitting device 200, each of the multiple light-emitting elements 220 emits light from its emission end face toward the light-reflecting surface of the reflecting member 230.

[0086] Each light-emitting element 220 is electrically connected to the package 100 by a plurality of wires 250. Among the plurality of wires 250, there are wires 250 whose one end of the junction is connected to the package 100. Among the plurality of wires 250, there are wires 250 whose one end of the junction is connected to the light-emitting element 220. In the illustrated example, each light-emitting element 220 is electrically connected in series by a plurality of wires 250.

[0087] The light-emitting element 220, located at one end of the base portion 110 in the longitudinal direction, is electrically connected via wiring 250 to a metal film 145 provided on one upper surface 140a of the third stepped portion 140. For example, one end of wiring 250 is joined to the metal film provided on the upper surface of the light-emitting element 220, and the other end of wiring 250 is joined to the metal film 145 provided on one upper surface 140a of the third stepped portion 140. The metal film 145 provided on one upper surface 140a of the third stepped portion 140 can be electrically connected, for example, to an electrode pattern 144 arranged along one of the opposing outer surfaces of the frame portion 120 via vias.

[0088] A metal film formed on the upper surface of the submount 210 on which the light-emitting element 220, located at the other longitudinal end of the base 110, is mounted, is electrically connected via wiring 250 to a metal film 145 provided on the other upper surface 140a of the third stepped portion 140. For example, one end of wiring 250 is joined to the metal film on the upper surface of the submount 210, and the other end of wiring 250 is joined to the metal film 145 provided on the other upper surface 140a of the third stepped portion 140. The metal film 145 provided on the other upper surface 140a of the third stepped portion 140 can be electrically connected via vias to, for example, an electrode pattern 144 arranged along the other opposing outer surface of the frame portion 120. As a result, the light-emitting element 220 is electrically connected to the electrode pattern 144.

[0089] In the light-emitting device 200, a reflective member 230 is provided to reflect light emitted from the light-emitting element 220. Light emitted from one or more light-emitting elements 220 is reflected by the light-reflecting surface of one or more reflective members 230. One reflective member 230 may reflect light emitted from multiple light-emitting elements 220, or the light-emitting elements 220 and reflective members 230 may be arranged in a one-to-one ratio.

[0090] The lid portion 260 is joined to the upper surface 120a of the frame portion 120 of the package 100. More specifically, the lid portion 260 is supported on the upper surface 120a of the frame portion 120 and is positioned above the light-emitting element 220 surrounded by the frame portion 120. The outer periphery of the lower surface of the lid portion 260 is joined to, for example, the upper surface 120a of the frame portion 120. For example, a metal film provided on the outer periphery of the lower surface of the lid portion 260 and a metal film 142 provided on the upper surface 120a of the frame portion 120 are joined and fixed via Au-Sn or the like.

[0091] The lid portion 260, by joining with the upper surface 120a of the frame portion 120, seals the space in which the light-emitting element 220 is arranged together with the base portion 110 and the frame portion 120. This space may be formed in an hermetically sealed state. For example, when an end-face emitting laser is used as the light-emitting element 220, it is preferable to arrange it in an hermetically sealed space because organic matter and the like tend to accumulate on the emission end surface. Also, when a light-emitting element 220 that emits light with a wavelength shorter than green is used, it is preferable to arrange it in an hermetically sealed space because organic matter and the like tend to accumulate on the emission end surface. Therefore, when an end-face emitting laser that emits light with a wavelength shorter than green is used as the light-emitting element 220, it is particularly preferable to arrange it in an hermetically sealed space.

[0092] The lid portion 260 has a light-transmitting region that transmits light reflected upward from the light-reflecting surface of the reflective member 230 and emits it to the lens member 280. In other words, light reflected from the light-reflecting surface of the reflective member 230 toward the lid portion 260 passes through the light-transmitting region of the lid portion 260. The entire lid portion 260 may be a light-transmitting region. Preferably, the light-transmitting region of the lid portion 260 transmits 70% or more of the light reflected from the light-reflecting surface of the reflective member 230 toward the lid portion 260.

[0093] The lens member 280 is positioned on the lid 260. The lens member 280 is joined to the lid 260. One lens surface of the lens member 280 corresponds to the light emitted from one light-emitting element 220. The light emitted from each light-emitting element 220 is reflected upward by the light-reflecting surface of the reflecting member 230, and is sequentially transmitted through the lid 260 and the lens member 280 before being emitted to the outside of the light-emitting device 200.

[0094] <Third Embodiment> The third embodiment shows a light-emitting module having the light-emitting device according to the present disclosure. Figure 14 is a perspective view illustrating a light-emitting module according to the third embodiment. Figure 15 is a top view illustrating a wiring board constituting the light-emitting module according to the third embodiment. Note that in Figure 14, the bonding member 370 is shown as a dot pattern.

[0095] As shown in Figure 14, the light-emitting module 300 includes a wiring board 310 and one or more light-emitting devices 200 mounted on the wiring board 310. In the illustrated example, four light-emitting devices 200 are mounted on the wiring board 310. Each light-emitting device 200 is connected, for example, in series. Each light-emitting device 200 may also be connected in parallel.

[0096] As shown in Figure 15, the wiring board 310 is, for example, rectangular in top view. This rectangle has a long side and a short side. The wiring board 310 includes mounting areas 310R on which the light-emitting devices 200 are mounted. In the illustrated example, the wiring board 310 includes four mounting areas 310R on which the light-emitting devices 200 are mounted.

[0097] Each mounting region 310R may contain an electrode portion 320 and a metal portion 330. In the illustrated example, in a top view, three electrode portions 320 are arranged on each side of the metal portion 330, facing each other with the metal portion 330 in between. The electrode portions 320 and the metal portion 330 are electrically insulated from each other. The electrode portions 320 and the metal portion 330 can be made of elemental metals such as Cu, Ag, Al, Ni, Rh, Au, Ti, Pt, Pd, Mo, Cr, W, or alloys containing these metals.

[0098] The electrode pattern 144 of the light-emitting device 200 is joined to the electrode portion 320 via a conductive bonding member 370. A portion of the bonding member 370 is fitted into a groove 130 of the light-emitting device 200. This increases the bonding strength between the light-emitting device 200 and the wiring board 310. The metal portion 330 is joined to the lower surface 110b of the base portion 110 of the light-emitting device 200 via a conductive bonding member. This allows heat generated in the light-emitting device 200 to be dissipated through the metal portion 330.

[0099] In the light-emitting module 300, four light-emitting devices 200 are mounted in a relatively narrow area of ​​the wiring board 310, but a portion of the joining member 370 is embedded in the groove 130 of the light-emitting device 200. Therefore, as explained with reference to Figure 8, by observing the width of the joining member 370 in a top view, it is possible to determine whether the height of the joining member 370 is appropriate. Furthermore, if it is within the camera's field of view, multiple grooves 130 can be photographed at once from above the light-emitting device 200, thus shortening the decision-making time.

[0100] The light-emitting module 300 can be used, for example, in automotive headlights. However, the light-emitting module 300 can be used as a light source for lighting, projectors, head-mounted displays, and other displays such as backlights.

[0101] When the light-emitting module 300 is used in automotive applications, the wiring board 310 on which the package 100 is mounted is subjected to a wide range of temperatures from low to high, resulting in thermal shock to the bonding member 370. In the light-emitting module 300, a portion of the bonding member 370 fits into the groove 130, thereby increasing the bonding strength between the package 100 and the wiring board 310. This makes it possible to realize a light-emitting module 300 with high reliability in bonding between the package 100 and the wiring board 310.

[0102] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims.

[0103] In addition to the embodiments described above, the following further notes are disclosed. (Note 1) A base having an upper surface and a lower surface opposite to the upper surface, It has a frame portion that is joined to the base, surrounds the lower surface of the base when viewed from below, and has an upper surface, a lower surface opposite to the upper surface, an inner surface, and an outer surface, The frame portion is provided with one or more grooves that are recessed from the outer surface toward the inner surface, The one or more grooves are provided extending from the upper surface to the lower surface of the frame portion. The one or more grooves have a width at the second height that is greater than the width at the first height, with respect to a predetermined first height and a second height that is greater than the width at the first height, with respect to the lower surface of the frame portion. A package in which one or more electrode patterns are arranged on the lower surface of the frame portion, connected to the lower ends of the one or more groove portions when viewed from below. (Note 2) The package according to Appendix 1, wherein one or more grooves are provided with a metal film connected to one or more electrode patterns. (Note 3) The one or more electrode patterns are a plurality of electrode patterns, The plurality of electrode patterns are arranged on the lower surface of the frame portion. The package according to Appendix 1 or 2, wherein the number of the one or more grooves is at least equal to or greater than the number of the multiple electrode patterns. (Note 4) The one or more grooves are provided with a first stepped portion. The first stepped portion comprises an upper surface and a side surface that is connected to the upper surface and extends downward, The package according to any one of the appendices 1 to 3, wherein the first height is the height at the point where the upper surface of the first stepped portion and the side surface of the first stepped portion intersect. (Note 5) The one or more grooves have a first side surface and a second side surface connected to the first side surface. The package according to any one of appendices 1 to 4, wherein the distance from the inner surface to the first surface is constant from the upper surface to the lower surface of the frame. (Note 6) The one or more grooves are provided with a second stepped portion. The second stepped portion comprises an upper surface and a side surface that connects to the upper surface and extends downward, The package as described in Appendix 4 or 5, wherein the second height is the height at the point where the upper surface of the second stepped portion and the side surface of the second stepped portion intersect. (Note 7) The package according to any one of the appendices 1 to 3, wherein the one or more grooves have an inclined portion in which the width of the one or more grooves gradually widens as it goes upward. (Note 8) The aforementioned frame portion is rectangular in shape when viewed from above. The one or more grooves are a plurality of grooves, The package according to any one of appendices 1 to 7, wherein the plurality of grooves include at least one first groove provided at each of the four corners of the frame. (Note 9) The package as described in Appendix 8, wherein the plurality of grooves include a second groove provided between two first grooves provided at two adjacent corners of the frame. (Note 10) The package according to any one of the appendices 1 to 9, wherein the base portion is mainly made of metal and the frame portion is mainly made of ceramic. (Note 11) The package described in any one of the appendices 1 to 10, The base has one or more light-emitting elements mounted on the upper surface and surrounded by the frame when viewed from above, A light-emitting device wherein the one or more light-emitting elements are electrically connected to the one or more electrode patterns. (Note 12) A light-emitting module comprising a wiring board and one or more light-emitting devices described in Appendix 11 mounted on the wiring board, The wiring board includes a mounting area on which the light-emitting device is mounted, The aforementioned mounting area is where the electrode portion is arranged. A light-emitting module in which the one or more electrode patterns are joined to the electrode portion via a conductive bonding member, and a part of the bonding member fits into grooves formed by the one or more grooves. (Note 13) A metal part is placed in the aforementioned mounting area. The light-emitting module as described in Appendix 12, wherein the metal part is joined to the lower surface of the base via the joining member. [Explanation of Symbols]

[0104] 100 packages 110 Base 110a,120a,131a,132a,140a Top surface 110b,120b,140b Bottom surface 120 Frame section 120c inner surface 120d outer surface 130 groove section 130A First groove 130B Second groove section 131 First step section 132 Second step section 131c,132c,133c side 135 Slope 141, 142, 143, 145 Metal film 144 electrode patterns 150 Wiring boards 154 Electrode section 200 Light-emitting devices 210 Submount 220 light-emitting elements 230 Reflective material 250 Wiring 260 Lid 280 Lens components 300 Light-Emitting Modules 310 Wiring board 310R Implementation Area 320 Electrode section 330 Metal parts 370 Joining member

Claims

1. A base having an upper surface and a lower surface opposite to the upper surface, It has a frame portion that is joined to the base, surrounds the lower surface of the base when viewed from below, and has an upper surface, a lower surface opposite to the upper surface, an inner surface, and an outer surface, The frame portion is provided with one or more grooves that are recessed from the outer surface toward the inner surface, The one or more grooves are provided extending from the upper surface to the lower surface of the frame portion. The one or more grooves have a predetermined first height and a second height higher than the first height, with respect to the lower surface of the frame, and the width at the second height is wider than the width at the first height. A package in which one or more electrode patterns are arranged on the lower surface of the frame portion, connected to the lower ends of the one or more groove portions when viewed from below.

2. The package according to claim 1, wherein one or more grooves are provided with metal films connected to one or more electrode patterns.

3. The one or more electrode patterns are a plurality of electrode patterns, The plurality of electrode patterns are arranged on the lower surface of the frame portion. The package according to claim 1, wherein the number of the one or more grooves is at least equal to or greater than the number of the multiple electrode patterns.

4. The one or more grooves are provided with a first stepped portion. The first stepped portion comprises an upper surface and a side surface that connects to the upper surface and extends downward, The package according to claim 1, wherein the first height is the height at the point where the upper surface of the first stepped portion and the side surface of the first stepped portion intersect.

5. The one or more grooves have a first side surface and a second side surface connected to the first side surface. The package according to claim 1, wherein the distance from the inner surface to the first surface is constant from the upper surface to the lower surface of the frame portion.

6. The one or more grooves are provided with a second stepped portion. The second stepped portion comprises an upper surface and a side surface that connects to the upper surface and extends downward, The package according to claim 4, wherein the second height is the height at the point where the upper surface of the second stepped portion and the side surface of the second stepped portion intersect.

7. The package according to claim 1, wherein the one or more grooves have inclined portions that gradually widen as the width of the one or more grooves increases upward.

8. The aforementioned frame portion is rectangular in shape when viewed from above. The one or more grooves are multiple grooves, The package according to claim 1, wherein the plurality of grooves include at least a first groove provided at each of the four corners of the frame.

9. The package according to claim 8, wherein the plurality of grooves include a second groove provided between two first grooves provided at two adjacent corners of the frame.

10. The package according to claim 1, wherein the base portion is mainly made of metal and the frame portion is mainly made of ceramic.

11. A package according to any one of claims 1 to 10, The base has one or more light-emitting elements mounted on the upper surface and surrounded by the frame when viewed from above, A light-emitting device wherein the one or more light-emitting elements are electrically connected to the one or more electrode patterns.

12. A light-emitting module comprising a wiring board and one or more light-emitting devices according to claim 11 mounted on the wiring board, The wiring board includes a mounting area on which the light-emitting device is mounted, The aforementioned mounting area is where the electrode portion is located. A light-emitting module in which the one or more electrode patterns are joined to the electrode portion via a conductive bonding member, and a part of the bonding member fits into grooves formed by the one or more grooves.

13. A metal part is placed in the aforementioned mounting area. The light-emitting module according to claim 12, wherein the metal part is joined to the lower surface of the base via the joining member.

Images