Substrate processing equipment

Abstract

The present invention provides a substrate processing apparatus capable of suppressing the intrusion and adhesion of foreign matter. [Solution] This substrate processing apparatus 100 includes a mounting table 30 on which a substrate 200 is placed, a heating unit 40 for heating the substrate 200 placed on the mounting table 30, a lifting unit 50 for raising and lowering the substrate 200 on the mounting table 30, and a moving mechanism 60 for moving the lifting unit 50 up and down. The lifting unit 50 does not penetrate the heating unit 40 but bypasses the outside of the heating unit 40 and extends from the moving mechanism 60 side toward the substrate 200 side.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus, and more particularly to a substrate processing apparatus including a lifting unit for lifting a substrate.

Background Art

[0002] Conventionally, a substrate processing apparatus including a lifting unit for lifting a substrate has been known (see, for example, Patent Document 1).

[0003] The substrate processing apparatus disclosed in Patent Document 1 includes a substrate mounting table for mounting a substrate and a substrate lifting mechanism for lifting the substrate. The substrate lifting mechanism includes a plurality of lift pins (lifting unit) for lifting the substrate, a support plate for supporting the lift pins, a lift rod for lifting the support plate, and a drive mechanism. Further, the substrate processing apparatus includes a processing container for housing the lift pins and the support plate. The lift rod penetrates the bottom plate of the processing container. Further, the lift pins penetrate the substrate mounting table from below the substrate mounting table and protrude from the upper surface of the substrate mounting table. Then, when the drive mechanism raises and lowers the lift rod, the lift pins supported by the support plate are raised and lowered. Thereby, the substrate located on the upper surface side of the substrate mounting table is raised and lowered.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In Patent Document 1, in order to heat the substrate placed on the substrate mounting table, there is a temperature control mechanism (heating unit). Therefore, in the configuration in which the lift pins penetrate the substrate mounting table as in Patent Document 1, the lift pins also penetrate the heating unit. Therefore, the heating unit has a hole through which the lift pins penetrate. Therefore, there is a problem that foreign substances such as particles enter from the hole of the heating unit and adhere to the side wall of the hole.

[0006] This invention was made to solve the above-mentioned problems, and one of its objectives is to provide a substrate processing apparatus that can suppress the intrusion and adhesion of foreign matter. [Means for solving the problem]

[0007] To achieve the above objective, a substrate processing apparatus according to one aspect of this invention comprises a mounting table on which a substrate is placed, a heating unit for heating the substrate placed on the mounting table, a lifting unit for raising and lowering the substrate on the mounting table, and a moving mechanism for moving the lifting unit up and down, wherein the lifting unit does not penetrate the heating unit but bypasses the outside of the heating unit and extends from the moving mechanism side toward the substrate side.

[0008] In a substrate processing apparatus according to one aspect of this invention, as described above, the lifting and lowering section extends from the moving mechanism side toward the substrate side, bypassing the outside of the heating section without penetrating it. As a result, since the lifting and lowering section does not penetrate the heating section, there is no hole in the heating section through which the lifting and lowering section passes. Therefore, it is possible to suppress foreign matter from entering the hole in the heating section and adhering to the side wall of the hole. In addition, since the lifting and lowering section does not penetrate the heating section, the lifting and lowering section is less affected by the temperature rise and fall of the heating section. As a result, the lifting and lowering section is less likely to be damaged. Because the lifting and lowering section is less affected by the temperature rise and fall of the heating section, the range of materials for the lifting and lowering section is also increased. Furthermore, when the lifting and lowering section penetrates the heating section, contact may occur between the wall of the hole in the heating section and the lifting and lowering section due to assembly errors of the lifting and lowering section and the heating section, or deformation of the lifting and lowering section due to the heat of the heating section. In a substrate processing apparatus according to one aspect, since the lifting and lowering section does not penetrate the heating section, there is no contact with the side wall of the hole, and it is less likely to be damaged.

[0009] In the substrate processing apparatus according to the first aspect described above, preferably, the lifting and lowering section includes a pin portion that contacts the substrate and a connecting portion that connects the pin portion to the moving mechanism, and the pin portion is detachable from the connecting portion. However, the pin portion may be damaged if the substrate is brought in with the pin portion raised and collides with the pin portion, or due to assembly errors. In this case, the pin portion needs to be replaced. In the configuration described in Patent Document 1 above, where the lift pin (pin portion) penetrates the substrate mounting table, the lift pin extends to the bottom of the substrate mounting table and is fixed to the support plate, so the bottom plate of the processing container needs to be removed in order to replace the pin portion. In addition, the temperature control mechanism (heating section) is also detached when the bottom plate is removed. Therefore, after replacing the lift pin, the heating section and bottom plate need to be reassembled. However, as described above, since the pin portion is detachable from the connecting portion, even if the pin portion is damaged, only the pin portion can be removed from the connecting portion and replaced, so there is no need to remove and reassemble the bottom plate and heating section. Therefore, the pin portion can be easily replaced.

[0010] In this case, preferably, the pin portion is fastened to the connector. With this configuration, the pin portion can be easily removed from the connector simply by releasing the fastening of the pin portion. Conversely, the pin portion can be easily attached to the connector simply by fastening the pin portion. In this way, the pin portion can be easily replaced.

[0011] In the above-described substrate processing apparatus in which the pin portion is detachable, preferably, the mounting table has an annular shape, the outer circumference of the annular mounting table is larger than the outer circumference of the substrate, and the inner circumference of the annular mounting table is smaller than the outer circumference of the substrate, the mounting table contacts and supports the entire outer circumference of the substrate, the pin portion is located between the heating unit and the mounting table, when the pin portion rises, the tip of the pin portion is located closer to the substrate than the mounting table, and when the pin portion descends, the mounting table is located closer to the substrate than the tip of the pin portion. With this configuration, after the tip of the pin portion lifts the substrate from the robot hand, a gap is created between the tip of the pin portion and the mounting table, so that the robot hand can easily retreat through the gap between the tip of the pin portion and the mounting table. Also, as the pin portion on which the substrate is placed descends, the pin portion is located below the mounting table, so that the substrate can be positioned on the mounting table. Furthermore, the mounting base has an annular shape, and the outer circumference of the annular mounting base is larger than the outer circumference of the substrate, while the inner circumference of the annular mounting base is smaller than the outer circumference of the substrate. Therefore, it is possible to prevent foreign matter from entering the back side of the substrate and the gap between the mounting base and the heating element through the gap between the substrate, the pin portion and the mounting base.

[0012] In a substrate processing apparatus in which the above-mentioned pin portion is detachable, preferably, the pin portion is made of ceramics. With this configuration, since ceramics have high heat resistance, the pin portion can be used even when the pin portion becomes hot due to the heating section.

[0013] In the above-mentioned substrate processing apparatus in which the pin portion is detachable, preferably, the mounting base is detachable, and by removing the mounting base, the connection point between the pin portion and the connector portion is exposed. With this configuration, when replacing the pin portion, the connection point between the pin portion and the connector portion is exposed by removing the mounting base, so the pin portion can be easily replaced. Furthermore, when the substrate processing apparatus is in operation, the mounting base is attached, and the connection point between the pin portion and the connector portion is not exposed. This makes it possible to suppress foreign matter from adhering to the pin portion and the connector portion.

[0014] In the substrate processing apparatus according to the first aspect described above, preferably, the lifting section extends from the moving mechanism side toward the substrate side, bypassing the outside of the heating section, then bends at a position closer to the substrate than the heating section, extends toward the center of the heating section, then bends again and extends toward the substrate side. With this configuration, since the lifting section extends toward the center of the heating section, then bends again and extends toward the substrate side, the tip of the pin section can be positioned below the substrate, bypassing the heating section.

[0015] In the substrate processing apparatus according to the first aspect described above, preferably, a side wall portion is further provided that is located vertically below the mounting table, and the side wall portion surrounds the heating portion and the lifting portion. With this configuration, the adhesion of foreign matter to the sides of the heating portion and the lifting portion below the mounting table can be suppressed by the side wall portion. [Effects of the Invention]

[0016] According to the present invention, as described above, it is possible to suppress the intrusion and adhesion of foreign matter. [Brief explanation of the drawing]

[0017] [Figure 1] This is a side view (cross-sectional view) of a substrate processing apparatus (with the lifting section raised) according to one embodiment of the present invention. [Figure 2] This is a side view (cross-sectional view) of a substrate processing apparatus (with the lifting section in the lowered position) according to one embodiment of the present invention. [Figure 3] This is a top view of a substrate processing apparatus according to one embodiment of the present invention (with the mounting table attached). [Figure 4] This is a top view of a substrate processing apparatus according to one embodiment of the present invention (with the mounting table removed). [Figure 5] This figure shows a lifting mechanism according to one embodiment of the present invention. [Figure 6] This is a magnified section of Figure 5. [Figure 7] This is a side view (cross-sectional view) of a substrate processing device with a modified appearance. [Modes for carrying out the invention]

[0018] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0019] [Embodiment] The substrate processing apparatus 100 according to this embodiment will be described. In the present specification, as shown in FIG. 1, the vertical direction is defined as the Z direction. Further, the upward direction is defined as the Z1 direction, and the downward direction is defined as the Z2 direction.

[0020] As shown in FIGS. 1 and 2, the substrate processing apparatus 100 is, for example, a sputtering apparatus that forms a film on a substrate 200. The substrate 200 is, for example, a semiconductor substrate. The substrate processing apparatus 100 includes a processing container 10, a sputter particle emission unit 20, a mounting table 30, a side wall portion 31, a heating unit 40, a lifting unit 50, a moving mechanism 60, and a control unit 70.

[0021] As shown in FIGS. 1 and 2, the processing container 10 houses the substrate 200. The substrate 200 has a perfect circular shape when viewed from the Z direction (see FIG. 3). The inside of the processing container 10 can be maintained in a vacuum state. The processing container 10 has, for example, a cylindrical shape (a perfect circular shape when viewed from the Z direction, see FIG. 3). The processing container 10 has a gas introduction portion 11. A rare gas such as argon gas or nitrogen gas for sputtering enters the inside of the processing container 10 from the gas introduction portion 11. Further, the processing container 10 has an exhaust portion 12. The exhaust portion 12 is, for example, a pump that exhausts gas from the inside of the processing container 10. Thereby, the inside of the processing container 10 becomes a vacuum. Further, the processing container 10 has a substrate loading / unloading port 13. The substrate loading / unloading port 13 is an opening. Further, the processing container 10 has a gate valve 14. The gate valve 14 opens and closes the substrate loading / unloading port 13. In a state where the gate valve 14 moves upward and the substrate loading / unloading port 13 is open, a robot hand 210 holding the substrate 200 enters the processing container 10, and the substrate 200 is placed on the lifting unit 50.

[0022] The sputtered particle emission unit 20 includes a target 21 and an electrode 22. The target 21 is placed inside the processing container 10 and generates sputtered particles for forming a thin film on the substrate 200. In other words, the target 21 is a component that becomes the material for the thin film formed on the substrate 200.

[0023] Electrode 22 is connected to a power supply (not shown) and applies a voltage to target 21. Specifically, when electrode 22 applies a DC high voltage, AC voltage, pulse voltage, or high-frequency voltage to target 21, a plasma discharge phenomenon occurs inside the processing container 10. Electrode 22 is insulated from the processing container 10.

[0024] The mounting base 30 supports the substrate 200. The mounting base 30 is flat and has an annular shape. Specifically, the mounting base 30 has an annular shape (perfectly circular shape, see Figure 3) when viewed from the Z direction. In this embodiment, the mounting base 30 is detachable. Specifically, the mounting base 30 is detachable from the side wall portion 31. For example, the mounting base 30 is fixed to the side wall portion 31 by fastening members such as screws. By removing the mounting base 30, as shown in Figure 4, the connection point between the pin portion 51 and the connecting portion 52 of the lifting portion 50 (the connection point between the base portion 51a of the pin portion 51 and the third portion 52c of the connecting portion 52 (see Figure 5)) is exposed. The mounting base 30 is made of, for example, ceramics. Note that the upper surface portion 10a of the processing container 10 is omitted in Figures 3 and 4.

[0025] In this embodiment, as shown in Figures 1 and 2, the side wall portion 31 is located below the mounting base 30 and extends vertically, surrounding the heating portion 40 and the lifting portion 50. For example, the side wall portion 31 is arranged along the outer circumference of the annular mounting base 30 and has a cylindrical shape (a perfect circle when viewed from the Z direction, see Figure 3). For example, the Z1 direction side of the side wall portion 31 is located inside the processing container 10, and the Z2 direction side of the side wall portion 31 is located outside the processing container 10.

[0026] The bottom portion 32 covers the side wall portion 31 in the Z2 direction. The bottom portion 32 has, for example, a disc shape (a perfect circle when viewed from the Z direction).

[0027] The heating unit 40 heats the substrate 200 placed on the mounting base 30. Specifically, the heating unit 40 is located inside the mounting base 30. The heating unit 40 is also spaced apart from the mounting base 30 in the Z direction. The heating unit 40 includes a heater 41 and a reflector 42. The heater 41 has, for example, a ring shape. The reflector 42 reflects the heat generated by the heater 41 towards the substrate 200.

[0028] The lifting section 50 raises and lowers the substrate 200 on the mounting table 30. In this embodiment, the lifting section 50 does not penetrate the heating section 40 but bypasses the outside of the heating section 40 and extends from the moving mechanism 60 side toward the substrate 200 side. Specifically, as shown in Figure 5, the lifting section 50 includes a pin section 51 that contacts the substrate 200 and a connecting section 52 that connects the pin section 51 to the moving mechanism 60 shown in Figures 1 and 2. The connecting section 52 includes a first section 52a, a second section 52b, and a third section 52c. The first section 52a extends in the Z direction and one end is connected to the moving mechanism 60. The second section 52b extends in a horizontal direction perpendicular to the Z direction and one end is connected to the first section 52a. The third section 52c extends in the Z direction and one end is connected to the second section 52b. The first part 52a, the second part 52b, and the third part 52c have, for example, a rod shape. The first part 52a, the second part 52b, and the third part 52c are fixed to each other by fastening members 53. The first part 52a also penetrates the bottom surface 32 (see Figures 1 and 2).

[0029] The pin portion 51 also includes a base portion 51a and a tip portion 51b. The base portion 51a extends along a horizontal direction perpendicular to the Z direction. One end of the base portion 51a is connected to the third portion 52c, and the other end of the base portion 51a is connected to the tip portion 51b. For example, as shown in Figure 6, the base end of the tip portion 51b is a male thread 511b, and the end of the base portion 51a has a female thread 511a. The tip portion 51b and the base portion 51a are fixed together by screwing the male thread 511b of the tip portion 51b into the female thread 511a of the base portion 51a.

[0030] Furthermore, in this embodiment, the pin portion 51 is detachable from the connecting portion 52. Specifically, the fastening member 53 fastens one end of the base portion 51a of the pin portion 51 to the other end of the third portion 52c of the connecting portion 52. By releasing the fastening member 53, the pin portion 51 is detached from the connecting portion 52.

[0031] Furthermore, in this embodiment, as shown in Figure 3, the outer circumference of the ring-shaped mounting base 30 is larger than the outer circumference of the substrate 200, and the inner circumference of the ring-shaped mounting base 30 is smaller than the outer circumference of the substrate 200, so the mounting base 30 contacts and supports the entire outer circumference of the substrate 200 (see Figure 2). Note that Figure 3 shows a state in which the center of the mounting base 30 and the center of the substrate 200 coincide. Then, as shown in Figure 1, the lifting section 50 bypasses the outside of the heating section 40 and extends from the moving mechanism 60 side toward the substrate 200 side, then bends in the Z direction between the heating section 40 and the substrate 200, extends toward the center of the heating section 40, then bends again and extends toward the substrate 200 side. Specifically, the first section 52a, the second section 52b, and the third section 52c of the connecting section 52 bypass the outside of the heating section 40 and extend from the moving mechanism 60 side toward the substrate 200 side.

[0032] The lifting section 50 has multiple sets of a second section 52b, a third section 52c, and a pin section 51. For example, the lifting section 50 includes three such sets. As shown in Figure 4, these three sets are located at equal angular intervals when viewed from the Z direction. On the other hand, there is one first section 52a that is common to all sets.

[0033] Furthermore, in this embodiment, as shown in Figure 1, the pin portion 51 is located between the heating unit 40 and the mounting table 30. When the pin portion 51 rises, the tip 512b of the pin portion 51 is located closer to the substrate 200 than to the mounting table 30. Specifically, when the substrate 200 is loaded, the robot hand 210 transports the substrate 200 onto the center of the mounting table 30, after which the pin portion 51 rises and lifts the substrate 200 from the robot hand 210. After that, the robot hand 210, which has moved away from the substrate 200, moves back, and as shown in Figure 2, the pin portion 51 descends and the substrate 200 is placed on the mounting table 30. Also, when the substrate 200 is unloaded, the pin portion 51 rises and lifts the substrate 200, and the robot hand 210 moves below the substrate 200 which is being lifted by the pin portion 51. Subsequently, the pin section 51 descends, the circuit board 200 is placed on the robot hand 210, and the circuit board 200 is then unloaded by the robot hand 210.

[0034] Furthermore, in this embodiment, the pin portion 51 (root portion 51a, tip portion 51b) is made of ceramics. The connecting portion 52 (first portion 52a, second portion 52b, and third portion 52c) is made of stainless steel. Ceramics can withstand high temperatures of 1000°C or higher and exhibit little thermal deformation (low coefficient of thermal expansion). Stainless steel has excellent strength and rigidity.

[0035] The moving mechanism 60 moves the lifting section 50 up and down. The moving mechanism 60 is, for example, a motor, and the motor's driving force moves the lifting section 50 up and down. The moving mechanism 60 is also connected to the first part 52a of the connecting section 52, and by raising and lowering the first part 52a, the multiple pin sections 51 also rise and fall.

[0036] The control unit 70 includes a CPU (Central Processing Unit) and memory. The control unit 70 controls the gate valve 14, sputter particle discharge unit 20, heating unit 40, moving mechanism 60, and robot hand 210, etc., by executing a predetermined program.

[0037] (Replacement of the pin) The replacement of the pin portion 51 will now be explained. Note that when the pin portion 51 is replaced, the circuit board 200 is not placed inside the processing container 10.

[0038] The worker removes the sputter particle discharge unit 20 together with the top surface 10a of the processing container 10. The top surface 10a of the processing container 10 is fastened, for example, to the side wall 10b of the processing container 10, and by releasing the fastening, the worker removes the sputter particle discharge unit 20 together with the top surface 10a. As a result, the mounting base 30 is exposed, as shown in Figure 3.

[0039] Next, as shown in Figure 4, the worker removes the mounting base 30. This exposes the pin portion 51. The worker then uses a screwdriver or similar tool to release the screws on the fastening member 53. This detaches the pin portion 51 from the third portion 52c of the connecting portion 52. The worker then screws the new replacement pin portion 51 onto the third portion 52c of the connecting portion 52. This attaches the new pin portion 51 to the connecting portion 52. The worker then installs the mounting base 30, the upper surface portion 10a of the processing container 10, and the sputter particle discharge portion 20. This completes the replacement of the pin portion 51. Note that when replacing the pin portion 51, the screwed connection between the base portion 51a and the tip portion 51b may be released, and only the tip portion 51b may be replaced.

[0040] (Effects of this embodiment) In this embodiment, the following effects can be obtained.

[0041] In this embodiment, as described above, the lifting section 50 does not penetrate the heating section 40 but bypasses the outside of the heating section 40, extending from the moving mechanism 60 side toward the substrate 200 side. As a result, since the lifting section 50 does not penetrate the heating section 40, there is no hole in the heating section 40 through which the lifting section 50 passes. Therefore, it is possible to suppress foreign matter from entering the hole in the heating section 40 and adhering to the side wall of the hole. In addition, since the lifting section 50 does not penetrate the heating section 40, the lifting section 50 is less affected by the temperature rise and fall of the heating section 40. As a result, the lifting section 50 is less likely to be damaged. Because the lifting section 50 is less affected by the temperature rise and fall of the heating section 40, the range of materials for the lifting section 50 is also increased. Furthermore, if the lifting section 50 penetrates the heating section 40, the lifting section 50 may come into contact with the wall of the hole in the heating section 40 due to assembly errors between the lifting section 50 and the heating section 40, or deformation of the lifting section 50 due to the heat of the heating section 40. In the substrate processing apparatus 100 of this embodiment, the lifting section 50 does not penetrate the heating section 40, so there is no contact with the side wall of the hole, and it is less likely to be damaged.

[0042] In this embodiment, as described above, the lifting section 50 includes a pin section 51 that contacts the substrate 200 and a connecting section 52 that connects the pin section 51 to the moving mechanism 60, and the pin section 51 is detachable from the connecting section 52. However, the pin section 51 may be damaged if the substrate 200 is brought in while the pin section 51 is raised and collides with the pin section 51, or due to errors during assembly. In the configuration described in Patent Document 1 above, where the lift pin (pin section 51) penetrates the substrate mounting table, the lift pin extends to the bottom of the substrate mounting table and is fixed to the support plate, so the bottom plate of the processing container must be removed in order to replace the pin section. In addition, the temperature control mechanism (heating section 40) is also detached when the bottom plate is removed. For this reason, the temperature control mechanism and the bottom plate (bottom surface section 32) must be reassembled after the lift pin is replaced. Therefore, as described above, since the pin portion 51 is detachable from the connection portion 52, even if the pin portion 51 is damaged, only the pin portion 51 can be removed from the connection portion 52 and replaced, eliminating the need to remove and reassemble the bottom portion 32 and the heating portion 40. For this reason, the pin portion 51 can be easily replaced.

[0043] In this embodiment, as described above, the pin portion 51 is fastened to the connecting portion 52. This allows the pin portion 51 to be easily removed from the connecting portion 52 simply by releasing the fastening of the pin portion 51. Conversely, the pin portion 51 can be easily attached to the connecting portion 52 simply by fastening the pin portion 51. In this way, the pin portion 51 can be easily replaced.

[0044] In this embodiment, as described above, the mounting base 30 has an annular shape, the outer circumference of the annular mounting base 30 is larger than the outer circumference of the substrate 200, and the inner circumference of the annular mounting base 30 is smaller than the outer circumference of the substrate 200, so that the mounting base 30 contacts and supports the entire outer circumference of the substrate 200. The pin portion 51 is located between the heating portion 40 and the mounting base 30, and when the pin portion 51 is raised, the tip 512b of the pin portion 51 is located closer to the substrate 200 than the mounting base 30, and when the pin portion 51 is lowered, the mounting base 30 is located closer to the substrate 200 than the tip 512b of the pin portion 51. As a result, after the tip of the pin portion 51 lifts the substrate 200 from the robot hand 210, a gap is created between the tip 512b of the pin portion 51 and the mounting base 30, so that the robot hand 210 can easily move out of the gap between the tip 512b of the pin portion 51 and the mounting base 30. Furthermore, as the pin portion 51 on which the substrate 200 is placed descends, the pin portion 51 is positioned below the mounting base 30, allowing the substrate 200 to be positioned on the mounting base 30. In addition, the mounting base 30 has an annular shape, and the outer circumference of the annular mounting base 30 is larger than the outer circumference of the substrate 200, while the inner circumference of the annular mounting base 30 is smaller than the outer circumference of the substrate 200. Therefore, it is possible to prevent foreign matter from entering the back side of the substrate 200 and the gap between the mounting base 30 and the heating unit 40 through the gap between the substrate 200, the pin portion 51, and the mounting base 30.

[0045] In this embodiment, as described above, the pin portion 51 is made of ceramics. Because ceramics have high heat resistance, the pin portion 51 can be used even when it becomes hot due to the heating section 40.

[0046] In this embodiment, as described above, the mounting base 30 is detachable, and by removing the mounting base 30, the connection point between the pin portion 51 and the connecting portion 52 is exposed. This allows the pin portion 51 to be easily replaced by removing the mounting base 30, which exposes the connection point between the pin portion 51 and the connecting portion 52. Furthermore, when the substrate processing apparatus 100 is in operation, the mounting base 30 is attached, and the connection point between the pin portion 51 and the connecting portion 52 is not exposed. This prevents foreign matter from adhering to the pin portion 51 and the connecting portion 52.

[0047] In this embodiment, as described above, the lifting section 50 bypasses the outside of the heating section 40, extends from the moving mechanism 60 side toward the substrate 200 side, then bends at a position closer to the substrate 200 than the heating section 40, extends toward the center of the heating section 40, then bends again and extends toward the substrate 200 side. As a result, the lifting section 50 extends toward the center of the heating section 40, then bends, and extends toward the substrate 200 side, so that the tip of the pin section 51 can be positioned below the substrate 200, bypassing the heating section 40.

[0048] In this embodiment, as described above, the substrate processing apparatus 100 further includes a side wall portion 31 that is located vertically below the mounting table 30. The side wall portion 31 surrounds the heating section 40 and the lifting section 50. As a result, the side wall portion 31 can suppress the adhesion of foreign matter to the sides of the heating section 40 and the lifting section 50 below the mounting table 30.

[0049] [Differentiation] It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims rather than by the description of the embodiments above, and further includes all modifications (exceptions) within the meaning and scope equivalent to the claims.

[0050] In the above embodiment, an example was shown where the substrate processing apparatus 100 is a sputtering apparatus, but the present invention is not limited thereto. For example, the substrate processing apparatus may be a substrate processing apparatus other than a sputtering apparatus (for example, an apparatus that forms a thin film on a substrate by coating).

[0051] In the above embodiment, the lifting section 50 includes a pin section 51 and a connecting section 52, and the pin section 51 is shown to be detachable from the connecting section 52. However, the present invention is not limited to this. For example, the pin section and the connecting section may be integrated, and the pin section may not be detachable from the connecting section.

[0052] In the above embodiment, an example was shown in which the male thread 511b of the tip portion 51b of the pin portion 51 is screwed into the female thread 511a of the base portion 51a, but the present invention is not limited thereto. For example, a hole may be formed in the connecting portion, and the pin portion may be inserted into the hole in the connecting portion.

[0053] In the above embodiment, an example was shown in which the pin portion 51 is made of ceramics, but the present invention is not limited thereto. For example, the pin portion may be formed from a material other than ceramics that has high heat resistance.

[0054] In the above embodiment, an example was shown in which the connecting portion 52 is made of stainless steel, but the present invention is not limited thereto. For example, the connecting portion may be made of a material other than stainless steel, such as ceramics.

[0055] In the above embodiment, the lifting section 50 is shown to bypass the outside of the heating section 40, extend from the moving mechanism 60 side toward the substrate 200 side, then bend at a position closer to the substrate 200 than the heating section 40, extend toward the center of the heating section 40, then bend again and extend toward the substrate 200 side. However, the present invention is not limited to this. For example, as shown in the modified lifting section 250 in Figure 7, the lifting section 250 may bypass the outside of the heating section 40 and extend linearly from the moving mechanism 60 side toward the substrate 200 side without bending.

[0056] In the above embodiment, an example was shown in which the mounting base 30 is removed when the pin portion 51 is replaced, but the present invention is not limited thereto. For example, when the pin portion 51 is replaced, the mounting base 30 and the side wall portion 31 may be removed together.

[0057] In the above embodiment, an example was shown in which the mounting base 30 is ring-shaped (a shape having a relatively large opening in the center), but the present invention is not limited thereto. As long as there is a hole in the mounting base through which the tip portion 51b of the pin portion 51 passes, the mounting base may have a shape other than a ring shape (for example, a shape in which only a hole through which the tip portion 51b passes is present in a disc).

[0058] In the above embodiment, an example was shown in which the three sets of the second part 52b, the third part 52c, and the pin part 51 of the lifting section 50 are located at equal angular intervals when viewed from the Z direction, but the present invention is not limited to this. For example, the above sets do not need to be located at equal angular intervals as long as they do not interfere with the robot hand 210 that transports the substrate 200.

[0059] In the above embodiment, an example was shown in which there are three sets of the second part 52b, the third part 52c, and the pin part 51 of the lifting section 50, but the present invention is not limited to this. There may be three or more sets of these sets, depending on the size and shape of the substrate 200.

[0060] In the above embodiment, the substrate 200, processing container 10, mounting table 30, heating unit 40, side wall portion 31, and bottom surface portion 32 are shown as being perfectly circular when viewed from the Z direction, but the present invention is not limited to this. These components do not have to be perfectly circular. These components are appropriately designed to match the final product form of the substrate 200 to be processed.

[0061] In the above embodiment, when the substrate 200 is loaded, the robot hand 210 transports the substrate 200 onto the center of the mounting table 30, after which the pin portion 51 rises and lifts the substrate 200 from the robot hand 210 (i.e., the robot hand 210 does not move up or down). However, the present invention is not limited to this. For example, the pin portion 51 may be raised in advance before the substrate 200 is loaded by the robot hand 210, and the robot hand 210 holding the substrate 200 may move above the pre-raised pin portion 51, and then the robot hand 210 may descend below the tip of the pin portion 51, thereby placing the substrate 200 on the tip of the pin portion 51 from the robot hand 210, and the robot hand 210, no longer holding the substrate 200, may move away by passing between the mounting table 30 and the substrate 200. After that, the pin portion 51 on which the substrate 200 is placed will descend. Furthermore, in the above embodiment, when the substrate 200 is unloaded, the pin portion 51 rises, lifting the substrate 200, the robot hand 210 moves below the substrate 200 which is being lifted by the pin portion 51, then the pin portion 51 lowers, the substrate 200 is placed on the robot hand 210, and the substrate 200 is unloaded by the robot hand 210 (i.e., the robot hand 210 does not move up or down), but the present invention is not limited to this. For example, the pin portion 51 rises, lifting the substrate 200, the robot hand 210 moves between the substrate 200 which is being lifted by the pin portion 51 and the mounting table 30, then the robot hand 210 rises above the tip of the pin portion 51 so that the substrate 200 is placed on the robot hand 210 from the tip of the pin portion 51, and the substrate 200 is unloaded by the robot hand 210, which is holding the substrate 200, moving away from above the pin portion 51.

[0062] In the above embodiment, when the substrate 200 is loaded, the robot hand 210 transports the substrate 200 onto the center of the mounting table 30, after which the pin portion 51 rises and the pin portion 51 directly supports the substrate 200 (the pin portion 51 contacts the substrate 200). However, the present invention is not limited to this. For example, the substrate 200 may be placed on a tray, and the robot hand 210 transports the tray on which the substrate 200 is placed onto the center of the mounting table 30, after which the pin portion 51 rises and the pin portion 51 supports the tray on which the substrate 200 is placed. After that, the pin portion 51 may descend so that the mounting table 30 supports the tray on which the substrate 200 is placed. Furthermore, in the above embodiment, when the substrate 200 is unloaded, the pin portion 51 rises, lifting the substrate 200 (the pin portion 51 comes into contact with the substrate 200), the robot hand 210 moves below the substrate 200 which is being lifted by the pin portion 51, then the pin portion 51 lowers, the substrate 200 is placed on the robot hand 210, and the substrate 200 is unloaded by the robot hand 210. However, the present invention is not limited to this. For example, the pin portion 51 rises, lifting the tray on which the substrate 200 is placed, the robot hand 210 moves below the tray which is being lifted by the pin portion 51, then the pin portion 51 lowers, the tray on which the substrate 200 is placed on the robot hand 210, and the tray on which the substrate 200 is placed is unloaded by the robot hand 210. [Explanation of symbols]

[0063] 30 Mounting platform 31 Side wall section 40 Heating section 50 Lifting section 51 Pin section 52 Connection part 60 Moving mechanism 100 Substrate Processing Equipment 200 circuit boards 250 Lifting section

Claims

1. A mounting platform on which the circuit board is placed, A heating unit for heating the substrate placed on the mounting base, A lifting mechanism for raising and lowering the substrate on the mounting platform, The lifting section is provided with a moving mechanism that moves it up and down, A substrate processing apparatus wherein the lifting and lowering section extends from the moving mechanism side toward the substrate side, bypassing the outside of the heating section without penetrating it.

2. The lifting and lowering section includes a pin portion that contacts the substrate and a connecting portion that connects the pin portion and the moving mechanism. The substrate processing apparatus according to claim 1, wherein the pin portion is detachable from the connection portion.

3. The substrate processing apparatus according to claim 2, wherein the pin portion is fastened to the connection portion.

4. The aforementioned mounting platform has an annular shape, The outer circumference of the ring-shaped support stand described above is larger than the outer circumference of the substrate, and the inner circumference of the ring-shaped support stand described above is smaller than the outer circumference of the substrate, and the support stand contacts and supports the entire outer circumference of the substrate. The substrate processing apparatus according to claim 2, wherein the pin portion is located between the heating portion and the base described above, when the pin portion is raised, the tip of the pin portion is located closer to the substrate than the base described above, and when the pin portion is lowered, the base described above is located closer to the substrate than the tip of the pin portion.

5. The substrate processing apparatus according to claim 2, wherein the pin portion is made of ceramics.

6. The aforementioned mounting base is detachable. The substrate processing apparatus according to claim 2, wherein the connection point between the pin portion and the connection portion is exposed by removing the mounting base.

7. The substrate processing apparatus according to claim 1, wherein the lifting portion bypasses the outside of the heating portion, extends from the moving mechanism side toward the substrate side, then bends in the vertical direction between the heating portion and the substrate, extends toward the center of the heating portion, then bends again and extends toward the substrate side.

8. The mounting platform further comprises a side wall portion that exists vertically below the aforementioned mounting platform, The substrate processing apparatus according to claim 1, wherein the side wall surrounds the heating section and the lifting section.

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