Induction heating conditioner

Abstract

The circuit board is cooled without significantly reducing the heating area of ​​the top plate. [Solution] The invention comprises a substrate on which a heating coil is mounted, and a cooling mechanism for cooling the substrate, wherein the cooling mechanism includes a first flow path which is the gap between a top plate installed above the substrate and the substrate, a blower fan installed below the substrate, and an air guide duct which guides the air blown out from the blower fan into the first flow path.

Description

Technical Field

[0001] The present invention relates to an induction heating cooker.

Background Art

[0002] As an induction heating cooker, there is one in which a substrate (printed circuit board) on which a heating coil is mounted is spread under a top plate, and substantially the entire surface of the top plate is used as a heating region.

[0003] In this type of induction heating cooker, since the heat resistance of the substrate is low, for example, the heat of a cooking utensil such as a pan is transmitted through the top plate, and there is a problem that the substrate is damaged.

[0004] In order to solve this problem, in the induction heating cooker described in Patent Document 1, air is sent from a blower fan installed side by side in the horizontal direction of the substrate (that is, in the same plane as the substrate) into a gap formed between the substrate and the top plate, thereby cooling the substrate.

[0005] However, in the induction heating cooker described in Patent Document 1, an installation space for the blower fan is required beside the substrate, and there is a problem that the heating region is reduced by the amount of this installation space.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] Therefore, the main object of the present invention is to cool the substrate without reducing the heating region of the top plate as much as possible.

Means for Solving the Problems

[0008] The induction heating cooker according to the present invention comprises a substrate on which a heating coil is mounted, and a cooling mechanism for cooling the substrate, wherein the cooling mechanism comprises a first flow path which is the gap between a top plate installed above the substrate and the substrate, a blower fan installed below the substrate, and an air guide duct which guides the air blown out from the blower fan into the first flow path.

[0009] According to the present invention, a blower fan is installed below the substrate, and the air blown out from the blower fan is guided to the first flow path by an air guide duct, resulting in a configuration where the air guide ducts are lined up to the side of the substrate (coplanar with the substrate). This allows for a reduction in installation space compared to a configuration where the blower fan is lined up to the side of the substrate, as in the induction heating cooker described in Patent Document 1. As a result, the substrate can be cooled without significantly reducing the heating area of ​​the top plate.

[0010] Many of the circuit components incorporated into the device are installed in the space below the circuit board. Some of these circuit components generate heat during operation. As a result, the circuit board can be damaged by the heat from these components. In addition, heating coils generate magnetic flux during operation. To prevent this magnetic flux from adversely affecting the circuit components, a magnetic flux shielding plate is installed between the circuit board and the circuit components to block the magnetic flux.

[0011] Therefore, the cooling mechanism may further include a second flow path which is the gap between a magnetic flux shielding plate installed below the substrate and the substrate, and the air guide duct may further guide the air sent out from the blower fan into the second flow path.

[0012] This configuration suppresses damage to the circuit board caused by heat from circuit components. Furthermore, since the second flow path is formed using a magnetic flux shielding plate, cooling performance can be improved without increasing the number of components.

[0013] Comparing the heat generated by cooking appliances to the heat generated by circuit components, the former generates more heat than the latter.

[0014] Therefore, the gap constituting the first channel may be configured to be wider than the gap constituting the second channel.

[0015] As mentioned above, the circuit board can also be damaged by the heat generated by the circuit components.

[0016] Therefore, the cooling mechanism may further cool circuit components installed below the substrate, and may further include a third flow path formed along at least a portion of the circuit components, wherein the air guide duct further guides the air sent out from the blower fan into the third flow path.

[0017] With this configuration, the circuit components can be cooled directly, making it even more difficult for heat from the circuit components to transfer to the circuit board. Furthermore, damage to the circuit components themselves can be suppressed.

[0018] Specific examples of the aforementioned circuit components include inverter circuit components and resonant circuit components.

[0019] A specific embodiment of the blower fan is a sirocco fan having a rotating shaft that extends in a direction perpendicular to the surface of the substrate. With such a configuration, the overall thickness of the cooking appliance can be reduced.

[0020] Depending on the installation location of the aforementioned air duct, an unheated area may be formed in the center of the top plate, making it inconvenient to use.

[0021] Therefore, the air guide duct may be configured to wrap around from below the substrate, passing outside the outer edge of the substrate and then over the substrate. More specifically, the enclosure may be shaped like a box that opens upward, with the opening closed by the top plate, and further comprising an enclosure that houses the substrate and the cooling mechanism inside, and the air guide duct may be configured to pass between the outer edge of the substrate and the inner circumferential surface of the enclosure.

[0022] According to such a configuration, since the air duct is installed at the outer edge portion of the top plate, a non-heating region is not formed near the center of the top plate, and the usability is improved.

[0023] When the induction cooker is installed in the kitchen, if the air duct is configured to pass outside the outer edge on the front side (the side of the cook) of the substrate, a non-heating region is formed at the place closest to the cook on the top plate, and the usability deteriorates.

[0024] Therefore, in the state where the induction cooker is installed, the air duct may be configured to pass outside the outer edge on the back side or the side surface side of the substrate.

[0025] Further, the air duct may have an air duct in a cylindrical shape extending along the outer edge of the substrate, and include an air inlet for introducing the air sent out from the air blower fan and an air outlet formed intermittently or continuously along the extending direction thereof, and the cross-sectional area of the air duct or the opening area of the air outlet is configured to become smaller as it is farther from the air inlet.

[0026] According to such a configuration, it becomes difficult for the pressure of the air flowing in the air duct in the extending direction to decrease even when it is farther from the air inlet. As a result, the air sent out from the air blower fan can flow through the entire substrate at substantially the same flow rate. As a result, the entire substrate can be cooled substantially evenly.

[0027] An operation region may be provided in a part of the top plate, and an operating device may be provided in the operation region. In this case, when the air that has become high temperature after passing through the first flow path hits the operating device, the operating device is damaged.

[0028] Therefore, the system further comprises an operating device installed below an operating area set on a part of the top plate, the circuit board being installed to avoid the operating area, and the cooling mechanism further comprises an exhaust duct that exhausts the air that has passed through the first flow path to the outside, the exhaust duct having one end connected to the first flow path and the other end passing below the operating device and connected to the outside.

[0029] With this configuration, the air that has become hot after flowing through the first channel will not directly hit the operating device.

[0030] Furthermore, the device may have a casing that opens upward, the opening being covered by the top plate, and further comprises a housing that contains the substrate and the cooling mechanism, with the intake port for the blower fan and the exhaust port for the air that has passed through the first flow path being formed on different surfaces of the housing.

[0031] This configuration makes it possible to suppress the circulation of the same air used in the cooling mechanism. [Effects of the Invention]

[0032] The induction heating cooker according to the present invention allows for cooling of the substrate without significantly reducing the heating area of ​​the top plate. [Brief explanation of the drawing]

[0033] [Figure 1] This is a schematic exploded perspective view showing the induction cooker of the first embodiment. [Figure 2] This is a schematic perspective view of the induction cooker according to the first embodiment. [Figure 3] This is a schematic perspective view of the induction cooker according to the first embodiment. [Figure 4] A schematic plan view showing the induction cooker of the first embodiment. [Figure 5] This is a schematic cross-sectional view AA showing an induction cooker according to the first embodiment. [Figure 6]This is a schematic cross-sectional view BB showing the induction cooker of the first embodiment. [Modes for carrying out the invention]

[0034] Hereinafter, embodiments of the induction heating cooker according to the present invention will be described with reference to the drawings.

[0035] <First Embodiment> As shown in Figures 1 to 3, the induction heating cooker 100 according to this embodiment comprises a housing 10 with an open top, a top plate 20 that closes the opening of the housing 10, a circuit board 30 installed below the top plate 20, a magnetic flux shielding plate 40 installed below the circuit board 30, and circuit components 50 (see Figure 6) installed below the magnetic flux shielding plate 40. In other words, the circuit board 30, the magnetic flux shielding plate 40, and the circuit components 50 are all housed inside the housing 10. In this embodiment, when installed in a kitchen, the side of the housing 10 facing the cook is called the front S1, the side facing the opposite side is called the back S2, and the side facing downwards is called the bottom S3.

[0036] Furthermore, this embodiment includes a first support tray T1 and a second support tray T2 installed inside the housing 10. The first support tray T1 houses the circuit board 30 and the magnetic flux shielding plate 40 and supports them inside the housing 10, while the second support tray T2 houses the circuit components 50 and supports them inside the housing 10.

[0037] The top plate 20 constitutes the uppermost surface of the cooker 100 and is, for example, rectangular in shape. However, it is not limited to a rectangular shape and may be circular in shape, for example. In this embodiment, a part of it is set as an operating area, and an operating device C is installed below this operating area. This operating device C is, for example, equipped with a touch panel display.

[0038] The substrate 30 is a so-called PCB (printed circuit board) and is laid out across the entire area below the top plate 20. In this embodiment, it is laid out across the entire area, avoiding the operating area. The area where this substrate 30 is laid out becomes the heating area. The substrate 30 is installed with a gap G1 between it and the top plate 20 (see Figure 4).

[0039] In this embodiment, the substrate 30 is installed in multiple sections, specifically divided into three sections. The substrate 30 may also be in one piece. Each substrate 30 is housed in a separate first support tray T1.

[0040] A heating coil (not shown) is mounted on this substrate 30. Specifically, multiple heating coils are embedded in an aligned manner. This heating coil is made by stacking multiple thin plate-shaped coils with gaps between them. Note that each heating coil may be aligned so that they do not overlap with each other, or they may be aligned so that some overlaps occur.

[0041] The magnetic flux shielding plate 40 is, for example, a ferrite core, and is used to shield the magnetic flux generated by the heating coil. Therefore, it is installed facing the substrate 30. In this embodiment, it is laid out on the bottom surface of the first support tray T1, and the substrate 30 is installed above it with a gap G2 (see Figure 4).

[0042] The circuit components 50 are components incorporated into the circuit necessary to operate the cooker 100, and specifically include, for example, inverter circuit components and resonant circuit components. The inverter circuit components and resonant circuit components exemplified here are equipped with heat sinks because they generate heat during operation. In this embodiment, they are mounted on a substrate (not shown) laid out on the bottom surface of the second support tray T2.

[0043] However, the induction cooker 100 according to this embodiment further includes a cooling mechanism 60 for cooling the substrate 30.

[0044] The cooling mechanism 60 includes a first flow path L1 which is the gap G1 between the top plate 20 and the substrate 30, a second flow path L2 which is the gap between the substrate 30 and the magnetic flux shielding plate 40, a blower fan 70 installed below the magnetic flux shielding plate 40, and an air guide duct 80 which guides the air blown out from the blower fan 70 to the first flow path L1 and the second flow path L2. In this embodiment, a cooling mechanism 60 is provided for each substrate 30.

[0045] Comparing the gap G1 constituting the first flow path L1 with the gap G2 constituting the second flow path L2, the former is wider than the latter. In other words, the cross-sectional area of ​​the first flow path L1, when cut in a direction perpendicular to the flow direction, is wider than that of the second flow path L2.

[0046] The blower fan 70 is, for example, a sirocco fan and is equipped with a blade body 71 having a rotation axis X that extends in a direction perpendicular to the surface of the substrate 30. The blower fan 70 is configured to draw in air from an intake port 11 formed on the rear surface S2 of the housing 10 and send it out to the air guide duct 80.

[0047] As shown in Figures 1, 5, and 6, the air guide duct 80 has a cylindrical first air guide passage 81 that extends along the outer edge of the substrate 30. In this embodiment, the first air guide passage 81 is installed alongside the substrate 30 (i.e., on the same plane as the substrate 30). More specifically, it is installed so as to be interposed between the substrate 30 and the rear surface S2 of the housing 10. On the surface facing the top plate 20, outlets 81a are formed intermittently or continuously along its extension direction. The first air guide passage 81 also has an inlet 81b for introducing air sent from the blower fan 70, and guides the air introduced from the inlet 81b towards the first flow path L1 and the second flow path L2 via the outlets 81a. In other words, the air guide duct 80 guides the air sent from the blower fan 70 so that it flows from below the substrate 30, through the side, and upward.

[0048] Here, as shown in Figures 1 and 4, the first air duct 81 is configured such that the cross-sectional area of ​​the opening when cut in a direction perpendicular to the extension direction decreases as it moves away from the inlet 81b. As a result, the pressure of the air flowing through the first air duct 81 becomes substantially uniform in the extension direction. Consequently, the flow rate of the air discharged from the outlet 81a becomes substantially uniform in the extension direction.

[0049] Furthermore, the cooling mechanism 60 of this embodiment is configured to further cool the circuit components 50. Specifically, as shown in Figure 6, it further includes a third flow path L3 formed along at least a portion of the circuit components 50, and the air guide duct 80 is configured to further guide the air sent out from the blower fan 70 into the third flow path L3.

[0050] Specifically, the third flow path L3 is formed by a tunnel duct 90 that covers the heat sink of the inverter circuit component. In this embodiment, the tunnel duct 90 is installed on the bottom surface of the second support tray T2. The air passing through the third flow path L3 is configured to pass between adjacent fins that constitute the heat sink.

[0051] Furthermore, the air guide duct 80 has a second air guide passage 82 that guides the air sent out from the blower fan 70 to the third flow path L3, separate from the first air guide passage 81. Therefore, in this embodiment, the air sent out from the blower fan 70 is divided into the first air guide passage 81 and the second air guide passage 82.

[0052] Furthermore, the cooling mechanism 60 of this embodiment further includes a first exhaust duct 91 that exhausts the air that has become hot after passing through the first flow path L1 and the second flow path L2 to the outside of the housing 10, and a second exhaust duct 92 that exhausts the air that has become hot after passing through the third flow path L3 to the outside of the housing 10. In this embodiment, these exhaust ducts 91 and 92 are connected to an exhaust port 12 formed on the bottom surface S3 of the housing 10. Therefore, the air that has passed through each flow path L1, L2, and L3 is exhausted downwards from the housing 10. In this embodiment, the entire exhaust port 12 is formed on the bottom surface S3 of the housing 10, but part or all of the exhaust port 12 may be formed on the front surface S1 of the housing 10. Incidentally, the intake port 11 is formed on the back surface S2 of the housing 10. In other words, this exhaust port 12 is formed on a surface of the housing 10 that faces a different direction from the intake port 11. This prevents the air exhausted from the exhaust port 12 from being drawn in and circulated through the intake port 11.

[0053] The first exhaust duct 91 has one end connected to the first support tray T1 and the other end connected to the exhaust port 12. More specifically, an opening is formed in the bottom surface of the first support tray T1 for discharging air that has flowed through the first flow path L1 and the second flow path L2, and one end of the first exhaust duct 91 is connected to this opening.

[0054] An operating device C is installed on the front side of the central circuit board 30. Therefore, the first exhaust duct 91, which is connected to the opening of the first support tray T1 that supports the central circuit board 30, passes below the operating device C and is connected to the exhaust port 12.

[0055] With the above configuration, in this embodiment, a portion of the air blown out from the blower fan 70 is sent to the rear side below the substrate 30, then sent upward along the outer edge of the substrate 30, flows from the rear side to the front side through the first flow path L1 and the second flow path L2, and is finally exhausted to the outside from the lower front side.

[0056] Next, the operation of the cooling mechanism 60 in this embodiment will be described.

[0057] The air blown out from the blower fan 70 is divided into a first air duct 81 and a second air duct 82. The air flow rate of the air introduced into the first air duct 81 is set to be greater than that of the air introduced into the second air duct 82, so that air flows preferentially to the first air duct L1 and the second air duct L2 over the third air duct L3. The air introduced into the second air duct 82 passes through the third air duct L3, cools the circuit components 50, and is then exhausted to the outside through the second exhaust duct 92.

[0058] Meanwhile, the air introduced into the first air duct 81 proceeds in the direction of extension of the first air duct 81 and is discharged from each outlet 81a. The air discharged from the outlets 81a then passes through the first flow path L1 and the second flow path L2, respectively, cooling the substrate 30, and is then exhausted to the outside through the first exhaust duct 91. Here, the flow rate of the air passing through the first flow path L1 is set to be greater than the flow rate of the air passing through the second flow path L2.

[0059] In this embodiment, a blower fan 70 is installed below the substrate 30, and the air blown out from the blower fan 70 is guided to the first flow path L1 by an air guide duct 80, resulting in a configuration where the air guide duct 80 is lined up next to the substrate 30. This reduces the installation space compared to when the blower fan 70 is lined up next to the substrate 30. As a result, the substrate 30 can be cooled without significantly reducing the heating area of ​​the top plate 20. Furthermore, since the intake port 11 and exhaust port 12 are formed on surfaces facing different directions on the housing 10, specifically the bottom and back surfaces, the circulation of the same air to the cooling mechanism 60 can be suppressed. In addition, as a configuration in which the cooling mechanism 60 cools the circuit components 50, a configuration is adopted in which a heat sink constituting part of the circuit components 50 is cooled, so that chips and other components connected to the heat sink can be cooled efficiently.

[0060] <Other Embodiments> The present invention is not limited to the embodiments described above. In the embodiments described above, the air guide duct was configured to guide the air sent out from the fan not only to the first passage but also to the second and third passages, but the invention is not limited to this. For example, it may be configured to guide the air only to the first passage, or to the first and second passages only, or to the first and third passages only.

[0061] In the above embodiment, the heating coil was embedded in the substrate for mounting, but the configuration is not limited to this. For example, it may be mounted on the surface of the substrate or stacked on top of it.

[0062] In the above embodiment, the air passing through the first, second, and third channels is configured to pass from the back to the front of the cooker, but the invention is not limited to this configuration. For example, the air may be configured to pass from one side to the other of the cooker, or from the front to the back of the cooker.

[0063] In the above embodiment, the cross-sectional area of ​​the first air guide is configured to decrease as it moves away from the inlet, but the embodiment is not limited to this. For example, the cross-sectional area may remain the same even as it moves away from the inlet.

[0064] In the above embodiment, the first air duct was installed between the substrate and the rear of the housing, but it is not limited to this. For example, it may be installed between the substrate and the side of the housing.

[0065] In the above embodiment, the intake port and exhaust port were formed on surfaces of the housing facing different directions, but the invention is not limited to this. For example, they may be formed on surfaces of the housing facing the same direction. In this case, it is preferable to take some measures to prevent the air exhausted from the exhaust port from being directly drawn in through the intake port.

[0066] In the above embodiment, the cross-sectional area of ​​the first air guide is configured to decrease as it moves away from the inlet, so that the air blown out from the fan can reach the entire substrate. However, the embodiment is not limited to this configuration. For example, the opening area of ​​the outlet of the air guide may be configured to decrease as it moves away from the inlet. Specifically, this opening area represents the opening area per unit length in the extending direction of the first air guide.

[0067] In the above embodiment, the air guide duct was configured to wrap around from outside the outer edge on the back side of the substrate, but it is not limited to this. For example, it may be configured to wrap around from outside the outer edge on the side or front side of the substrate.

[0068] Furthermore, various combinations or modifications of parts of the embodiments are permitted, as long as they do not contradict the spirit of the present invention. [Explanation of Symbols]

[0069] 100 induction cooker 10 cabinets 11 Air intake 12 Exhaust vents 20 Top Plate 30 circuit boards 40 Magnetic flux shielding plate 50 circuit components 60 Cooling mechanism L1 First channel L2 Second channel L3 Third channel 70 Blower fan 80 Air duct 81 1st air guide path 81a Inlet 81b outlet 82 2nd air guide path

Claims

1. A circuit board with a heating coil mounted on it, The system comprises a cooling mechanism for cooling the aforementioned substrate, The cooling mechanism, The first channel is the gap between the top plate installed above the substrate and the substrate, A blower fan is installed below the aforementioned substrate, An induction heating cooker characterized by comprising an air guide duct that guides the air blown out from the blower fan to the first flow path.

2. The cooling mechanism further comprises a second flow path which is the gap between a magnetic flux shielding plate installed below the substrate and the substrate. The induction heating cooker according to claim 1, wherein the air guide duct is configured to further guide the air sent out from the blower fan into the second flow path.

3. The induction cooker according to claim 2, wherein the gap constituting the first flow path is wider than the gap constituting the second flow path.

4. The cooling mechanism further cools circuit components installed below the substrate, and further comprises a third channel formed along at least a portion of the circuit components. The induction heating cooker according to claim 1, wherein the air guide duct is configured to further guide the air sent out from the blower fan into the third flow path.

5. The induction heating cooker according to claim 4, wherein the circuit component is an inverter circuit component or a resonant circuit component.

6. The induction heating cooker according to claim 1, wherein the blower fan is a sirocco fan having a rotation axis extending in a direction perpendicular to the surface of the substrate.

7. The induction heating cooker according to claim 1, wherein the air guide duct is configured to wrap around from below the substrate, passing outside the outer edge of the substrate, to above the substrate.

8. The enclosure has an upward-facing opening, the opening is closed by the top plate, and the enclosure further comprises a housing that contains the circuit board and the cooling mechanism inside. The induction heating cooker according to claim 7, wherein the air guide duct is configured to pass between the outer edge of the substrate and the inner circumferential surface of the housing.

9. The induction heating cooker according to claim 7, wherein, when the induction heating cooker is installed, the air guide duct is configured to pass outside the outer edge of the back or side of the substrate.

10. The air guide duct is cylindrical in shape and extends along the outer edge of the substrate, and includes an air guide path having an inlet for introducing air sent out from the blower fan and outlets formed intermittently or continuously along its extension direction. The induction heating cooker according to claim 1, wherein the cross-sectional area of ​​the air guide or the opening area of ​​the outlet decreases as it moves away from the inlet.

11. The above-mentioned top plate further comprises an operating device installed below the operating area set on a part of the top plate, The substrate is installed so as to avoid the operating area. The cooling mechanism further includes an exhaust duct for exhausting the air that has passed through the first passage to the outside. The induction heating cooker according to claim 1, wherein one end of the exhaust duct is connected to the first flow path and the other end passes below the operating device and is connected to the outside.

12. The enclosure has an upward-facing opening, the opening is closed by the top plate, and the enclosure further comprises a housing that contains the circuit board and the cooling mechanism inside. The induction heating cooker according to claim 1, wherein the intake port of the blower fan and the exhaust port of the air that has passed through the first flow path are formed on surfaces of the housing facing in different directions.

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