Substrate cleaning apparatus, substrate processing apparatus, method, program, and storage medium

Abstract

Measure the amount of abrasive particles remaining on the cleaning material. [Solution] The substrate cleaning apparatus is a cleaning member for cleaning a polished substrate, comprising: a cleaning member that moves between a cleaning position for cleaning the substrate and a retracted position for cleaning the cleaning member; and a measuring unit that, at the retracted position, irradiates the cleaning member with light and measures the amount of abrasive particles remaining on the cleaning member by receiving scattered or reflected light from the cleaning member.

Description

Technical Field

[0001] The present invention relates to a substrate cleaning device, a substrate processing device, a method, a program, and a storage medium.

Background Art

[0002] In a substrate cleaning device for cleaning a substrate such as a polished wafer, cleaning members such as a roll cleaning member and a pencil cleaning member are used. Such a cleaning member is cleaned by a self-cleaning unit that cleans itself.

[0003] Conventionally, in order to confirm whether the cleaning member is being cleaned, a technique for measuring the degree of cleanliness of the cleaning member by measuring the adsorption force of the cleaning member is known (see Patent Document 1).

[0004] However, no technique has been proposed for measuring the remaining amount of abrasive grains (slurry components used during wafer polishing) remaining on the cleaning member.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] An object of the present invention is to measure the remaining amount of abrasive grains remaining on a cleaning member for cleaning a polished substrate.

Means for Solving the Problems

[0007] [1] A substrate cleaning device according to one aspect of the present invention A cleaning member for cleaning a polished substrate, the cleaning member moving between a cleaning position for cleaning the substrate and a retracted position for cleaning the cleaning member In the aforementioned retracted position, a measuring unit measures the amount of abrasive particles remaining on the cleaning member by irradiating the cleaning member with light and receiving scattered or reflected light from the cleaning member. It is equipped with.

[0008] [2] A substrate cleaning apparatus according to one aspect of the present invention is described in [1] above, The measuring unit measures the amount of abrasive particles remaining by irradiating the cleaning member with excitation light and receiving Raman scattered light from the cleaning member.

[0009] [3] A substrate cleaning apparatus according to one aspect of the present invention, in which, The system further includes a determination unit that determines whether or not to replace the cleaning member based on the measurement results from the measurement unit.

[0010] [4] A substrate cleaning apparatus according to one aspect of the present invention, in any of the above [1] to [3], The cleaning member has a plurality of nodules on its surface, The system further includes a display control unit that displays the measurement results from the measurement unit in a map-like manner on the display unit, corresponding to the plurality of nodules.

[0011] [5] A substrate processing apparatus according to one aspect of the present invention comprises any of the substrate cleaning apparatuses described in [1] to [4] above.

[0012] [6] A method according to one aspect of the present invention is A method for measuring the amount of residual abrasive particles remaining on a cleaning member used to clean a polished substrate, Moving the cleaning member from the cleaning position where the substrate is cleaned to the retracted position where the cleaning member is cleaned, In the aforementioned retracted position, the amount of abrasive particles remaining on the cleaning member is measured by irradiating the cleaning member with light and receiving scattered or reflected light from the cleaning member. Includes.

[0013] [7] A program according to one aspect of the present invention is: A program for causing a computer to execute a method for measuring the amount of abrasive grains remaining on a cleaning member that cleans a polished substrate, the method comprising: Moving the cleaning member from a cleaning position for cleaning the substrate to a retracted position for cleaning the cleaning member; At the retracted position, irradiating the cleaning member with light and receiving scattered light or reflected light from the cleaning member to measure the amount of abrasive grains remaining on the cleaning member; Including.

[0014] [8] A storage medium according to one aspect of the present invention is a computer-readable storage medium storing the program of [7] above.

Effect of the Invention

[0015] According to the present invention, the amount of abrasive grains remaining on a cleaning member that cleans a polished substrate can be measured.

Brief Description of the Drawings

[0016] [Figure 1] It is a diagram showing an example of the schematic configuration of a substrate processing apparatus. [Figure 2] It is a diagram showing an example of the schematic configuration of a substrate cleaning apparatus using a roll cleaning member. [Figure 3] It is a diagram showing an example of the schematic configuration of a substrate cleaning apparatus using a pencil cleaning member. [Figure 4] It is a diagram showing an example of the functional configuration of a substrate cleaning apparatus. [Figure 5] It is a diagram showing an example of the hardware configuration of a substrate cleaning apparatus. [Figure 6] It is a diagram for explaining a method of measuring abrasive grains remaining on a cleaning member. [Figure 7] It is a diagram for explaining a measurement location measured by a measurement unit. [Figure 8] It is a diagram for explaining measurement of the nozzle surface of a cleaning member. <{ [Figure 9] [[ID=@49]]It is a diagram for explaining an example of a method of measuring a cleaning member by a measurement unit. [Figure 10] This diagram illustrates another example of a method for measuring cleaning members using a measuring unit. [Figure 11] This figure shows an example of a spectrum measured by the measurement unit. [Figure 12] This figure shows an example of measurement results displayed in a map-like format on the display unit. [Figure 13] This figure shows an example of the operation of the substrate cleaning apparatus according to this embodiment. [Modes for carrying out the invention]

[0017] The following descriptions of each embodiment will be made with reference to the drawings. However, unnecessarily detailed explanations may be omitted. For example, detailed explanations of already well-known matters and redundant explanations of substantially identical configurations may be omitted. This is to avoid the following explanation becoming unnecessarily verbose and to facilitate understanding for those skilled in the art.

[0018] (Configuration of substrate processing apparatus) As shown in Figure 1, the substrate processing apparatus 1 of this embodiment has a substantially rectangular housing 310 and a load port 312 on which a substrate cassette for stocking a large number of substrates W is mounted. The load port 312 is located adjacent to the housing 310. The load port 312 can be equipped with an open cassette, an SMIF (Standard Mechanical Interface) pod, or a FOUP (Front Opening Unified Pod). The SMIF pod and FOUP are sealed containers that house a substrate cassette inside and are covered with a partition wall, thereby maintaining an environment independent of the external space. Examples of substrates W include semiconductor wafers.

[0019] The housing 310 contains a plurality of polishing units 314a to 314d (four in the embodiment shown in Figure 1), a first cleaning unit 316 and a second cleaning unit 318 for cleaning the substrate W after polishing, and a drying unit 320 for drying the substrate W after cleaning. The polishing units 314a to 314d are arranged along the longitudinal direction of the substrate processing apparatus 1, and the cleaning units 316, 318 and the drying unit 320 are also arranged along the longitudinal direction of the substrate processing apparatus 1. According to the substrate processing apparatus 1 of this embodiment, various substrates W can be polished in the manufacturing process of semiconductor wafers with a diameter of 300 mm or 450 mm, flat panels, image sensors such as CMOS (Complementary Metal Oxide Semiconductor) and CCD (Charge Coupled Device), and magnetic films in MRAM (Magnetoresistive Random Access Memory). Alternatively, the substrate processing apparatus 1 may be configured to include only cleaning units 316, 318 and a drying unit 320, without providing a polishing unit for polishing the substrate W within the housing 310.

[0020] A first transport robot 322 is positioned in the area surrounded by the load port 312, the polishing unit 314a located on the load port 312 side, and the drying unit 320. A transport unit 324 is also positioned parallel to the polishing units 314a to 314d, the washing units 316 and 318, and the drying unit 320. The first transport robot 322 receives the substrate W before polishing from the load port 312 and passes it to the transport unit 324, and removes the dried substrate W from the drying unit 320 and returns it to the load port 312.

[0021] A second transport robot 326 is positioned between the first cleaning unit 316 and the second cleaning unit 318 to transfer the substrate W between the two units, and a third transport robot 328 is positioned between the second cleaning unit 318 and the drying unit 320 to transfer the substrate W between the two units. Furthermore, an overall control unit 350 that controls the movement of each component of the substrate processing apparatus is positioned inside the housing 310. In this embodiment, the overall control unit 350 is positioned inside the housing 310 for explanation, but the invention is not limited to this configuration. The overall control unit 350 may be positioned outside the housing 310, or it may be located in a remote location.

[0022] As the first cleaning unit 316, a roll cleaning device may be used that, in the presence of a cleaning solution, brings a roll cleaning member 100 (see Figure 2) that extends linearly over almost the entire length of the diameter of the substrate W into contact with the substrate W and scrubs the surface of the substrate W while rotating it around a central axis parallel to the substrate W. Alternatively, as the second cleaning unit 318, a pencil cleaning device may be used that, in the presence of a cleaning solution, brings the contact surface of a vertically extending cylindrical pencil cleaning member 150 (see Figure 3) into contact with the substrate W and scrubs the surface of the substrate W by moving the pencil cleaning member 150 in one direction while rotating it. Furthermore, as the drying unit 320, a spin drying unit may be used that dries the substrate W by spraying IPA vapor from a moving spray nozzle toward the substrate W which is rotated while being held horizontally, and further dries the substrate W by centrifugal force by rotating the substrate W at high speed.

[0023] Furthermore, instead of a roll cleaning device, a pencil cleaning device similar to the second cleaning unit 318 may be used as the first cleaning unit 316, or a two-fluid jet cleaning device that cleans the surface of the substrate W using a two-fluid jet may be used. Also, instead of a pencil cleaning device, a roll cleaning device similar to the first cleaning unit 316 may be used as the second cleaning unit 318, or a two-fluid jet cleaning device that cleans the surface of the substrate W using a two-fluid jet may be used.

[0024] The cleaning solution in this embodiment includes a rinsing solution such as distilled water (DIW) and a chemical solution such as ammonia hydrogen peroxide solution (SC1), hydrochloric acid hydrogen peroxide solution (SC2), sulfuric acid hydrogen peroxide solution (SPM), or hydrofluoric acid. Unless otherwise specified in this embodiment, the cleaning solution refers to the rinsing solution, the chemical solution, or both the rinsing solution and the chemical solution.

[0025] As shown in Figures 2 and 3, the substrate cleaning apparatus includes a rotation holding mechanism that holds and rotates the substrate W, a drive unit 170 that rotates the cleaning member 10, and a substrate cleaning liquid supply unit 520 that supplies cleaning liquid to the substrate W.

[0026] In the embodiment shown in Figure 2, the rotating and holding part 510 performs both the functions of a rotating part and a holding part, and in this case as well, the substrate cleaning device is equipped with both a rotating part and a holding part. On the other hand, in the embodiment shown in Figure 3, the substrate W is held by the holding part 516, and the substrate W is rotated by the rotation of the holding part 516 by the rotating part 517.

[0027] In the embodiment shown in Figure 2, the rotation holding unit 510, which serves as a rotation holding mechanism, has a spindle 511 and a bolster 512 provided at the tip of the spindle 511. In the embodiment shown in Figure 3, a rotating shaft 553 for rotating the pencil cleaning member 150 is provided at the tip of the oscillating arm 551, and a drive unit 170 is provided for rotating this rotating shaft.

[0028] The cleaning member 10 is, for example, a roll cleaning member 100 as shown in Figure 2 or a pencil cleaning member 150 as shown in Figure 3. Hereafter, the term cleaning member 10 will be used as a concept that includes both the roll cleaning member 100 and the pencil cleaning member 150. The cleaning member 10 is typically used for post-cleaning of CMP.

[0029] The roll cleaning member 100 shown in Figure 2 is rotatable around a rotation axis. The roll cleaning member 100 may have a roll body portion 110 that is removable or fixed to the roll mounting portion 105, and a plurality of nodules 115 (see Figure 7) may be provided on the surface of the roll body portion 110.

[0030] The roll cleaning member 100 may be made of a PVA (polyvinyl alcohol) sponge material or polyvinyl acetal obtained by reacting PVA, such as PVFM (polyvinylformal), PVAc (polyvinylacetate), etc. This PVA sponge material can be prepared from a homopolymer of polyvinyl acetate, etc. As the material for the roll cleaning member 100, nylon, polyurethane, or a combination of polyurethane and PVA, or other moldable materials such as other copolymers that do not scratch the substrate surface and provide suitable material removal for the process can be used.

[0031] The pencil cleaning member 150 may be made of a PVA sponge material or PVFM (polyvinylformal) obtained by reacting PVA. As the material for the pencil cleaning member 150, nylon, polyurethane, or a combination of polyurethane and PVA may be used.

[0032] As the substrate W is cleaned, contaminants (such as abrasive particles contained in the slurry) adhering to the substrate W, such as semiconductor substrates or glass substrates, are transferred to the cleaning member 10. If the cleaning of the substrate W is repeated in this state, scratches will occur, and the cleaning performance will clearly deteriorate. For this reason, the cleaning member 10 may be cleaned periodically (for example, after cleaning one lot of substrate W). Specifically, the cleaning member 10 may be moved from the cleaning position where the substrate W is cleaned to a retracted position where the cleaning member 10 itself is cleaned (self-cleaning), and the cleaning member 10 may be cleaned (self-cleaning) by rotating it into contact with the cleaning member of the self-cleaning section (see Figure 6) provided in the cleaning tank.

[0033] (Functional Configuration) Figure 4 shows an example of the functional configuration of the substrate cleaning apparatus 20 (first cleaning unit 316 and / or second cleaning unit 318 in Figure 1) according to this embodiment. As shown in Figure 4, the substrate cleaning apparatus 20 has a control unit 21, a measuring unit 22, a communication unit 23, an input unit 24, an output unit (display unit) 25, and a storage unit 26. In the figure, each functional unit that performs a function can be said to be a means for performing that function.

[0034] The control unit 21 includes a drive control unit 21a, a determination unit 21b, a display control unit 21c, and a notification unit 21d.

[0035] The drive control unit 21a controls a motor for moving the cleaning member 10 between a cleaning position for cleaning the substrate W and a retracted position for cleaning the cleaning member 10 itself (self-cleaning), and a motor for moving the cleaning member 10 when cleaning the substrate W or during self-cleaning.

[0036] The determination unit 21b determines whether or not to replace the cleaning member 10 based on the measurement results from the measurement unit 22. Specifically, the determination unit 21b determines that the self-cleaning of the cleaning member 10 is complete if the amount of residual abrasive particles measured by the measurement unit 22 is less than a threshold, and determines that self-cleaning is necessary again if the amount of residual abrasive particles is greater than or equal to the threshold. Furthermore, the determination unit 21b determines that the cleaning member 10 needs to be replaced if the amount of residual abrasive particles is greater than or equal to the threshold even after performing self-cleaning a predetermined number of times.

[0037] The display control unit 21c displays the measurement results from the measurement unit 22 on the display unit 25. The display control unit 21c may also display the measurement results from the measurement unit 22 on the display unit 25 in a map-like manner, corresponding to multiple nodules 115.

[0038] Figure 12 shows an example of measurement results displayed in a map-like manner on the display unit 25. In Figure 12, each cell corresponds to each nodule 115 distributed in the axial and circumferential directions of the cleaning member 10. The numerical value in each cell indicates the amount of abrasive particles remaining as measured by the measurement unit 22. This remaining amount may be a normalized value, for example, with a certain reference value set to 100. By displaying the remaining amount in a map-like manner in this way, it becomes possible to visually identify parts of the cleaning member 10 that have not been sufficiently cleaned (parts where a lot of abrasive particles remain). Based on these results, the cleaning member 10 can be efficiently self-cleaned by focusing on re-cleaning the parts where a lot of abrasive particles remain.

[0039] The notification unit 21d provides notification according to the determination result by the determination unit 21b. Specifically, if the determination unit 21b determines that the cleaning member 10 needs to be replaced, the notification unit 21d outputs a display or sound prompting the replacement of the cleaning member via the output unit 25 of the substrate cleaning device 20. Alternatively, the notification unit 21d may also provide the above notification to a terminal device via the network using the communication unit 23.

[0040] The measuring unit 22 measures the amount of abrasive particles remaining on the cleaning member 10 by irradiating the cleaning member 10 with light when the cleaning member 10 is in a retracted position, and receiving the scattered or reflected light from the cleaning member 10.

[0041] Figure 6 illustrates the measurement of residual abrasive particles by the measuring unit 22. As shown in Figure 6, in the retracted position, the cleaning member 10 rotates in the self-cleaning section within the cleaning tank to clean itself (self-cleaning), and the cleaning member 10 rotates into contact with the cleaning member. This washes out abrasive particles adhering to the surface of the cleaning member 10 and the nodule 115 (not shown in Figure 6).

[0042] The measurement unit 22 is, for example, a Raman spectrometer, which irradiates the cleaning member 10 with a laser (for example, with a wavelength of around 532 nm) as excitation light from the light source unit. Fibers, mirrors, etc., are used in the optical path inside the measurement unit 22. The Raman scattered light from the cleaning member 10 is then spectrally analyzed at the light receiving unit to obtain a Raman spectrum. By using a Raman spectrometer, the abrasive particle residue state on the surface of the cleaning member can be monitored non-destructively and while the member remains wet.

[0043] Figure 11 shows an example of a Raman spectrum measured by the measurement unit 22. From top to bottom in Figure 11, the Raman spectra of PVA without abrasive grains (cleaning member 10), PVA with abrasive grains (cleaning member 10), and abrasive grains (CeO2) are shown. In the Raman spectrum of PVA with abrasive grains (cleaning member 10), the wavenumber is 475 cm⁻¹. -1 There is a Raman shift peak for abrasive grains (CeO2) in the vicinity. Therefore, by detecting the Raman shift peak of abrasive grains from the Raman spectrum of the cleaning member 10, it is possible to detect the presence or absence of abrasive grains and measure the amount of residual abrasive grains (the measurement of residual amount will be described later). As an example, the case where the abrasive grain is ceria (CeO2) has been described, but the residual amount can be measured similarly even with other abrasive grains such as silica (SiO2). In other words, by detecting the Raman shift peak of the abrasive grain to be measured, it is possible to measure the presence or absence of abrasive grains and the amount of residual grains.

[0044] The measurement of the cleaning member 10 by the measuring unit 22 may be performed multiple times while changing its position on the surface of the nodule 115.

[0045] Alternatively, as shown in Figure 9, the measurement unit 22 may be moved in the X direction (axis direction of the cleaning member 10) and the Y direction (optical axis direction of the objective lens of the measurement unit 22), while rotating the cleaning member 10 and measuring each nodule 115. Specifically, when the control unit 21 issues a measurement instruction to the measurement unit 22, the control unit 21 moves the measurement unit 22 in the Y direction (object side of the objective lens) so that the measurement unit 22 approaches the cleaning member 10. Then, while moving the measurement unit 22 in the X direction, measurements are performed sequentially in units of nodules 115 from one end of the cleaning member 10 (for example, the left end in Figure 9). Once the measurement is completed up to the other end (for example, the right end in Figure 9), the control unit 21 rotates the cleaning member 10 by a predetermined angle (for example, by the length of one row of nodules 115), moves the measurement unit 22 in the X direction to return it to the one end, and starts measuring again. This operation is repeated, and once a series of measurements are completed, the control unit 21 moves the measuring unit 22 in the Y-axis direction so that it moves away from the cleaning member 10.

[0046] As shown in Figure 10, the measuring unit 22 may be provided with multiple objective lenses corresponding to multiple nodules 115 of the cleaning member 10 (for example, a predetermined number in the axial direction of the cleaning member 10). In this case, control of moving the measuring unit 22 in the axial direction of the cleaning member 10 (the X direction in Figure 9) becomes unnecessary, and the measurement time of the cleaning member 10 can be shortened.

[0047] Here, we will explain how to measure the amount of residual abrasive grains. As an indicator of the amount of residual grains, the average intensity of the peaks of the Raman shift of the abrasive grains measured by the measurement unit 22 may be used. In this case, the average value of the measurement results (peak intensity) of multiple nodules 115 may be used, or the average value of the measurement results (peak intensity) of nodules 115 located at specific measurement points (for example, three points at the left end, center, and right end in the axial direction of the cleaning member 10) may be used (if multiple measurements are taken with a single nodule 115, the average value of those measurements may be used). Alternatively, the peak count may be used instead of the peak intensity.

[0048] As an example, the measurement unit 22 was described as a Raman spectrometer, but an infrared spectrometer such as an FTIR may also be used as the measurement unit 22. Alternatively, the measurement unit 22 may be an optical measuring device that irradiates light with a wavelength corresponding to the absorption peak of the abrasive grain and detects the amount of reflected and / or scattered light received.

[0049] Returning to Figure 4, the communication unit 23 is a communication interface between the substrate cleaning device 20 and other devices. The communication unit 23 also sends and receives information to and from servers and terminal devices via the network.

[0050] The input unit 24 is an element for users of the substrate cleaning device 20 (including users and maintenance personnel of the substrate cleaning device 20) to input information, and is, for example, a keyboard, mouse, touch panel, microphone, gesture input device, etc. Note that the input unit 24 may be provided in other parts of the substrate processing apparatus 1, including the substrate cleaning device 20.

[0051] The output unit (display unit) 25 is an interface that outputs various information (images and sound) from the substrate cleaning device 20 to the user, and is, for example, a video display device (display unit) such as a liquid crystal display or a speaker. When the output unit 25 is configured as a display unit, a GUI for accepting user operations is displayed on this display unit. Note that the output unit 25 may be provided in other parts of the substrate processing device 1, including the substrate cleaning device 20.

[0052] The storage unit 26 is, for example, a data storage device such as internal memory or external memory (SD memory card, etc.). The storage unit 26 stores various data handled by the control unit 21 and various information downloaded by the communication unit 23 from a server via the network. The storage unit 26 does not necessarily have to be located inside the circuit board cleaning device 20; part or all of the storage unit 26 may be located in another device that is connected to the circuit board cleaning device 20 via the network in a manner that enables communication.

[0053] (Hardware configuration) Next, the hardware configuration of the substrate cleaning apparatus 20 according to this embodiment will be described. Figure 5 is a block diagram showing an example of the hardware configuration of the substrate cleaning apparatus 20 according to this embodiment.

[0054] In the substrate cleaning apparatus 20, the CPU 201 is a processing unit that controls the operation of the entire substrate cleaning apparatus 20. The ROM 202 is a non-volatile memory that stores control programs executed by the CPU 201 and various data. The RAM 203 is a volatile memory used for the load area and work area of ​​programs executed by the CPU 201. The storage device 204 is a storage means for storing various information, and may be built into the main body of the substrate cleaning apparatus 20 or may have a removable storage medium. The input device 205 is a device for the user of the substrate cleaning apparatus 20 to input information, such as a keyboard, mouse, touch panel, or microphone. The display 206 is a display device that displays various information (user interface, etc.). The measuring device 207 is a device for measuring the amount of abrasive particles remaining on the cleaning member 10. Specifically, the measuring device 207 includes a light source unit and a light receiving unit, and measures the amount of abrasive particles remaining by irradiating the cleaning member with light of a specific wavelength band from the light source unit and receiving the reflected or scattered light from the cleaning member with the light receiving unit. Motor 208 includes a motor for moving the cleaning member 10 between a cleaning position for cleaning the substrate W and a retracted position for cleaning the cleaning member 10 itself (self-cleaning), and a motor for moving the cleaning member 10 during cleaning the substrate W or during self-cleaning. Communication I / F (interface) 209 is an interface for connecting to other devices and networks (not shown). Bus 210 is a bus line that connects each of the above components to each other.

[0055] Furthermore, at least one of the above configurations may be provided in the substrate processing apparatus 1.

[0056] (An example of operation) Next, an example of the operation of the substrate cleaning apparatus 20 (substrate processing apparatus 1) according to this embodiment will be described. Figure 13 is a flowchart showing an example of the operation of the cleaning member 10 of the substrate cleaning apparatus 20 during self-cleaning.

[0057] First, the control unit 21 moves the cleaning member 10 from the cleaning position where the substrate W is cleaned to a retracted position where the cleaning member 10 itself is cleaned (self-cleaning), and resets the self-cleaning count n to 0 (step S10).

[0058] Next, the control unit 21 performs self-cleaning of the cleaning member 10 (step S20).

[0059] When the self-cleaning of the cleaning member 10 is completed, the control unit 21 increments the self-cleaning count n of the cleaning member 10 to n+1 (step S30).

[0060] Then, the control unit 21 measures the amount of abrasive particles remaining on the cleaning member 10 using the measuring unit 22 (step S40).

[0061] The control unit 21 determines whether the amount of abrasive particles remaining, as measured by the measurement unit 22, is less than a threshold (step S50).

[0062] If the determination is affirmed, it is determined that the self-cleaning of the cleaning member 10 is complete (step S60).

[0063] On the other hand, if the amount of abrasive particles remaining as measured by the measuring unit 22 is greater than or equal to a threshold (i.e., the determination in step S50 is rejected), it is further determined whether the number of self-cleaning cycles n of the cleaning member 10 is greater than or equal to a threshold (a predetermined number of cycles) (step S70).

[0064] If the determination is affirmed, the control unit 21 determines that the cleaning member 10 needs to be replaced, and the notification unit 21d notifies the user of the substrate cleaning device 20 to replace the cleaning member 10 (step S80).

[0065] On the other hand, if the number of self-cleaning cycles n of the cleaning member 10 is less than a threshold (a predetermined number of cycles) (i.e., the determination in step S70 is rejected), the control unit 21 returns to step S20 and performs self-cleaning of the cleaning member 10 again.

[0066] According to the above configuration, the amount of abrasive particles remaining on the cleaning member can be measured. This makes it possible to understand the accumulation state of abrasive particles on the surface of the cleaning member during the cleaning process, and to suitably determine when self-cleaning or brush replacement is necessary.

[0067] In the above embodiment, an example was described in which the cleaning member 10 measured by the measuring unit 22 is a roll cleaning member. However, the cleaning member 10 measured by the measuring unit 22 may be a pencil cleaning member as shown in Figure 3. In this case, the measuring unit 22 may be provided below the pencil-shaped cleaning member 10 in the retracted position, and measurement light (excitation light) may be irradiated from below the cleaning member 10 after the self-cleaning of the cleaning member 10 is completed.

[0068] Any part or all of the functional components described herein may be implemented by program. The programs referred to herein may be distributed by non-temporarily recording them on a computer-readable recording medium, by distributing them via communication lines such as the Internet (including wireless communication), or by distributing them installed on any terminal.

[0069] Based on the above description, those skilled in the art may be able to conceive of additional effects and various modifications of the present invention, but the embodiments of the present invention are not limited to the individual embodiments described above. Various additions, modifications, and partial deletions are possible without departing from the conceptual idea and spirit of the present invention derived from the claims and their equivalents.

[0070] For example, what is described herein as a single device (or component, hereinafter the same) (including what is depicted as a single device in the drawings) may be implemented by multiple devices. Conversely, what is described herein as multiple devices (including what is depicted as multiple devices in the drawings) may be implemented by a single device. Alternatively, some or all of the means or functions included in one device (e.g., a server) may be included in another device (e.g., a terminal device).

[0071] Furthermore, not all matters described herein are mandatory requirements. In particular, matters described herein but not included in the claims can be considered optional additional matters.

[0072] It should also be noted that the applicant is only aware of the prior art inventions described in the "Prior Art Documents" section of this specification, and the present invention is not necessarily intended to solve the problems described in those prior art inventions. The problems that the present invention aims to solve should be determined by considering this specification as a whole. For example, if this specification describes that a certain effect is achieved by a particular configuration, it can also be said that the problem that is the inverse of that predetermined effect is solved. However, this does not necessarily mean that such a particular configuration is an essential requirement. [Explanation of symbols]

[0073] 1. Substrate processing apparatus 10, 100, 150 Cleaning components 20. Substrate cleaning equipment 21 Control Unit 21a Drive control unit 21b Judgment section 21c Display Control Unit 21d News Department 22 Measuring part 23 Communications Department 24 Input section 25 Display section 26 Memory section

Claims

1. A cleaning member for cleaning a polished substrate, comprising a cleaning member that moves between a cleaning position for cleaning the substrate and a retracted position for cleaning the cleaning member itself, In the aforementioned retracted position, a measuring unit measures the amount of abrasive particles remaining on the cleaning member by irradiating the cleaning member with light and receiving scattered or reflected light from the cleaning member. A substrate cleaning device equipped with the following features.

2. The measuring unit measures the amount of abrasive particles remaining by irradiating the cleaning member with excitation light and receiving Raman scattered light from the cleaning member. The substrate cleaning apparatus according to claim 1.

3. The system further includes a determination unit that determines whether or not to replace the cleaning member based on the measurement results from the measurement unit. The substrate cleaning apparatus according to claim 1.

4. The cleaning member has a plurality of nodules on its surface, The system further includes a display control unit that displays the measurement results from the measurement unit in a map-like manner on the display unit, corresponding to the plurality of nodules. The substrate cleaning apparatus according to claim 1.

5. A substrate processing apparatus comprising a substrate cleaning apparatus according to any one of claims 1 to 4.

6. A method for measuring the amount of residual abrasive particles remaining on a cleaning member used to clean a polished substrate, Moving the cleaning member from the cleaning position where the substrate is cleaned to the retracted position where the cleaning member is cleaned, In the aforementioned retracted position, the amount of abrasive particles remaining on the cleaning member is measured by irradiating the cleaning member with light and receiving scattered or reflected light from the cleaning member. Methods that include...

7. A program for causing a computer to perform a method for measuring the amount of abrasive particles remaining on a cleaning member used to clean a polished substrate, wherein the method is: Moving the cleaning member from the cleaning position where the substrate is cleaned to the retracted position where the cleaning member is cleaned, In the aforementioned retracted position, the amount of abrasive particles remaining on the cleaning member is measured by irradiating the cleaning member with light and receiving scattered or reflected light from the cleaning member. A program that includes this.

8. A computer-readable storage medium storing the program described in claim 7.

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