Semiconductor testing apparatus, signal transmission unit attachment / detachment system, and signal transmission unit attachment / detachment method

Abstract

The objective is to provide a semiconductor testing apparatus, a signal transmission unit attachment / detachment system, and a signal transmission unit attachment / detachment method that facilitate the attachment and detachment of heavy signal transmission units. [Solution] The tester 1 comprises a performance board unit 20 on which probe cards for testing semiconductor circuits are attached, and a main unit 10 on which the performance board unit 20 is detachably attached. The performance board unit 20 is equipped with casters 70 on the main unit 10 side, and the main unit 10 is equipped with a caster rail 90 that supports the casters 70, and a lifting unit 94 that raises and lowers the caster rail 90 in the direction of attachment and detachment of the performance board unit 20.

Description

Technical Field

[0001] The present invention relates to a semiconductor test apparatus, a signal transmission unit attachment / detachment system, and a signal transmission unit attachment / detachment method.

Background Art

[0002] Patent Document 1 below discloses a wafer test system that electrically inspects a plurality of semiconductor chips (dies) formed on a semiconductor wafer. This wafer test system includes a prober that contacts probes to the electrodes of semiconductor chips formed on the wafer, and a tester that has terminals electrically connected to the probes, operates the semiconductor chips via the terminals, and detects the output signals thereof to inspect the electrical characteristics of the semiconductor chips.

[0003] This tester (semiconductor test apparatus) includes a tester main body, a test head, and a cable that connects the tester main body and the test head. The test head includes a probe card (device under measurement) and a performance board electrically connected to the terminals of the probe card. The tester main body includes a board unit that exchanges signals with the test head via the cable, and a power supply unit that supplies power to the board unit.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The above-mentioned tester has a configuration in which the tester body and test head are connected via a cable. However, in recent years, there has been a demand for compact testers that integrate the tester body and test head (performance board) into a single unit. Because such testers house each of the above units in a single enclosure, it is difficult to replace the performance board or swap out the board unit according to the specifications of the semiconductor chip, and there was room for improvement in terms of customizability.

[0006] Therefore, the inventors of this application developed a performance board unit (signal transmission unit) that integrates the performance board into a single unit, and devised a configuration that allows it to be attached to and detached from the tester body (main unit). However, because this performance board unit includes the performance board and numerous other components, it can weigh, for example, around 80 kg, which presents a problem as it is not easy to attach and detach by hand.

[0007] This invention has been made in view of the above-mentioned problems, and aims to provide a semiconductor testing apparatus, a signal transmission unit attachment / detachment system, and a signal transmission unit attachment / detachment method that facilitate the attachment and detachment of heavy signal transmission units. [Means for solving the problem]

[0008] A semiconductor testing apparatus according to one aspect of the present invention comprises a signal transmission unit on which a device to be tested for semiconductor circuit testing is attached, and a main unit on which the signal transmission unit is detachably attached, wherein the signal transmission unit is provided with casters on the main unit side, and the main unit comprises a caster rail that supports the casters, and a lifting unit that raises and lowers the caster rail in the direction of attachment and detachment of the signal transmission unit.

[0009] Furthermore, a signal transmission unit attachment / detachment system according to one aspect of the present invention comprises the semiconductor testing apparatus described above, and a jig equipped with a connecting rail that can be connected to the caster rail in a raised state by the lifting unit.

[0010] Furthermore, a method for attaching and detaching a signal transmission unit according to one aspect of the present invention is a method for attaching and detaching a signal transmission unit of a semiconductor testing apparatus comprising a signal transmission unit to which a device under test for testing a semiconductor circuit is attached, and a main unit to which the signal transmission unit is detachably attached, wherein a caster is provided on the main unit side of the signal transmission unit, and the main unit is provided with a caster rail to support the caster and a lifting unit to raise and lower the caster rail in the direction of attaching and detaching the signal transmission unit, and after raising the caster rail with the lifting unit, the signal transmission unit is slid along the caster rail. [Effects of the Invention]

[0011] According to one aspect of the present invention described above, it is possible to provide a semiconductor testing apparatus, a signal transmission unit attachment / detachment system, and a signal transmission unit attachment / detachment method that facilitate the attachment and detachment of heavy signal transmission units. [Brief explanation of the drawing]

[0012] [Figure 1] This is a schematic diagram of an inspection system equipped with a tester according to one embodiment. [Figure 2] This is a perspective view of a tester according to one embodiment. [Figure 3] This is an exploded perspective view of a tester according to one embodiment. [Figure 4] This is an exploded perspective view of a performance board unit according to one embodiment. [Figure 5] This is a plan view of the underbase unit with the cover member removed according to one embodiment. [Figure 6] Figure 5 shows the view VI from the arrow. [Figure 7] This is a bottom view of a performance board unit according to one embodiment. [Figure 8] This is a perspective view of the tester 1 with a portion of the unit cover removed according to one embodiment. [Figure 9] This is a plan view of the main unit according to one embodiment. [Figure 10] It is a perspective view showing an elevating unit provided in a main body unit according to an embodiment. [Figure 11] It is a flowchart of a method for attaching and detaching a performance board unit according to an embodiment. [Figure 12] It is a schematic diagram showing an initial state of a tester according to an embodiment. [Figure 13] It is an explanatory diagram for explaining step S2 shown in FIG. 11. [Figure 14] It is an explanatory diagram for explaining step S3 shown in FIG. 11. [Figure 15] It is a perspective view of region A shown in FIG. 14. [Figure 16] It is a perspective view of an attachment / detachment system of a performance board unit including a tester and a jig according to an embodiment. [Figure 17] It is an explanatory diagram for explaining step S5 shown in FIG. 11. [Figure 18] It is an explanatory diagram for explaining steps S7 and S8 shown in FIG. 11.

MODE FOR CARRYING OUT THE INVENTION

[0013] Hereinafter, embodiments of the present invention will be described based on the drawings. However, it should be noted that at least a part of the drawings is schematic, and the ratio of the thickness of each part is different from the actual one. Also, of course, there are parts where the dimensional relationships and ratios are different between the drawings. Further, the embodiments shown below are examples of devices and methods for embodying the technical idea of this invention, and the embodiments of this invention do not specify the materials, shapes, structures, arrangements, etc. of the components as follows.

[0014] FIG. 1 is a schematic diagram of an inspection system 100 including a tester 1 according to an embodiment. The inspection system 100 shown in Figure 1 comprises a tester 1 (semiconductor testing device) and a prober 2. This inspection system 100 inspects the electrical characteristics of each semiconductor circuit before separating the multiple semiconductor circuits formed on the wafer W into individual chips.

[0015] A probe card 3 (device to be measured) is attached to the tester 1. The probe card 3 is equipped with multiple probes (test needles). The prober 2 brings the multiple probes provided on the probe card 3 into contact with the pads of multiple semiconductor circuits formed on the wafer W. The prober 2 is equipped with a tester moving device 2A, a stage device 2B, and a wafer transport device 2C.

[0016] The tester moving device 2A, equipped with a moving mechanism (not shown), moves the tester 1 between the standby position 1A and the inspection position 1B. The stage device 2B supports the wafer W and aligns the tester 1, located at the inspection position 1B, with the wafer W. The stage device 2B is movable in a planar direction along the horizontal plane, in a vertical direction perpendicular to the horizontal plane, and is also rotatable in the θ direction around the vertical axis. The wafer transport device 2C transports the wafer W onto the stage device 2B.

[0017] When performing the inspection, the stage device 2B moves the wafer W and brings the tips of multiple probes provided on the tester 1 located at the inspection position 1B into contact with the pads of multiple semiconductor circuits formed on the wafer W. In this state, the tester 1 simultaneously inputs a test signal to each semiconductor circuit via the multiple probes and receives output signals from each semiconductor circuit to inspect each semiconductor circuit.

[0018] Figure 2 is a perspective view of the tester 1 according to one embodiment. Figure 3 is an exploded perspective view of the tester 1 according to one embodiment. As shown in Figure 2, the tester 1 comprises a main unit 10 and a performance board unit 20 (signal transmission unit). The tester 1 is formed in the shape of a rectangular box. The main unit 10 houses a plurality of circuit board units 30 (see Figure 3) and a power supply unit (not shown) that supplies power to the plurality of circuit board units 30.

[0019] In the following explanation, an XYZ Cartesian coordinate system will be established, and the positional relationships of each component will be described with reference to this XYZ Cartesian coordinate system. The X-axis direction is the first linear direction along the horizontal plane, the Y-axis direction is the second linear direction perpendicular to the first linear direction in the horizontal plane, and the Z-axis direction is the vertical direction. In this embodiment, for the sake of explanation, the main unit 10 is assumed to be positioned on the lower side (-Z side) and the performance board unit 20 is assumed to be positioned on the upper side (+Z side), but this positional relationship may change depending on the orientation and posture of the tester 1.

[0020] As shown in Figure 2, the performance board unit 20 includes a unit cover 21 with an opening 22. The unit cover 21 includes a center cover 21a with an opening 22, and a first side cover 21b and a second side cover 21c that are separable from the center cover 21a.

[0021] The center cover 21a covers the portion of the performance board unit 20 excluding the side end in the Y-axis direction. The first side cover 21b covers the portion of the performance board unit 20's side end in the Y-axis direction excluding the -X end. The second side cover 21c covers the portion of the performance board unit 20's side end in the Y-axis direction that is not covered by the first side cover 21b (the -X end).

[0022] The opening 22 is formed in the center of the upper surface of the center cover 21a. In a plan view from the Z-axis direction, the opening 22 is circular. A device mounting section 23 into which a probe card 3 (see Figure 1) can be attached is exposed through the opening 22. The performance board unit 20 is detachably mounted on the top of the main unit 10. The direction of attachment and detachment of the performance board unit 20 is the Z-axis direction.

[0023] As shown in Figure 3, the main unit 10 includes a rectangular box-shaped housing 11 with an open top. Inside the housing 11, there is a housing section 12 that is open at the top and accommodates multiple substrate units 30. The multiple substrate units 30 are housed in the housing section 12 with gaps in the X-axis direction. The multiple substrate units 30 generate test signals to be input to multiple semiconductor circuits formed on the wafer W, and also receive and inspect output signals from each semiconductor circuit. The number of multiple substrate units 30 can be increased, decreased, or replaced depending on the specifications of the semiconductor circuits formed on the wafer W.

[0024] Multiple (two or three) first connectors 31 are provided on the top of each of the multiple board units 30. The multiple first connectors 31 are connected to the bottom surface of the performance board unit 20. A board retainer 13 is detachably attached to the upper opening edge of the housing 11, protruding horizontally toward the housing 12 and preventing the multiple board units 30 from coming out upward.

[0025] Furthermore, the upper opening edge of the housing 11 is provided with positioning pins 14 for positioning the performance board unit 20, a clamping device 15 for clamping the performance board unit 20, and a locking bracket 16 for locking the performance board unit 20. The positioning pins 14 are located at positions corresponding to three of the four corners of the housing 11 when viewed from above. This prevents the performance board unit 20 from being attached to the main unit 10 in an incorrect orientation.

[0026] There are a total of four clamping devices 15, two on each of the two sides extending in the X-axis direction from the upper opening edge of the housing 11. Three of the four clamping devices 15 extend and retract their clamping pins in the X-axis direction toward the positioning pin 14. The remaining clamping device 15 extends and retracts its clamping pins in the X-axis direction toward the corner of the housing 11 where the positioning pin 14 is not located. The clamping devices 15 are electrically driven and can switch between a clamped state and an unclamped state toward the performance board unit 20. The lock bracket 16 has an elongated hole extending in the Z-axis direction and is provided in pairs, sandwiching the housing portion 12 in the Y-axis direction.

[0027] Figure 4 is an exploded perspective view of a performance board unit 20 according to one embodiment. As shown in Figure 4, the performance board unit 20 includes a performance board 24 on which a device mounting section 23 is provided. The performance board 24 is interposed between the probe card 3 (see Figure 1) and the multiple substrate units 30 (see Figure 3) and transmits the signals necessary for testing.

[0028] A device mounting section 23 is provided on the upper surface of the performance board 24. A lock plunger 26, which can be fitted into a lock bracket 16 (see Figure 3), is provided on the lower surface of the performance board 24. The lock plunger 26 is provided in a pair corresponding to the lock bracket 16. The lock plunger 26 can be switched between an engaged state and an unengaged state with respect to the lock bracket 16. The performance board 24 is attached to the underbase unit 40 via a frame unit 25.

[0029] The underbase unit 40 forms the lower surface of the performance board unit 20. The underbase unit 40 is provided with a plurality of second connectors 41. The plurality of second connectors 41 are provided in a number and arrangement corresponding to the plurality of first connectors 31 shown in Figure 3. The plurality of second connectors 41 are connected to the plurality of first connectors 31 in the Z-axis direction.

[0030] The first connector 31 and the second connector 41 are, for example, ZIF (Zero Insertion Force) connectors. The second connector 41 is provided with a lock lever 41a (see Figure 6, described later). By operating the lock lever 41a, the second connector 41 can be switched between a fixed state, where it is fixed to the first connector 31, and an unlocked state, where it is released from the first connector 31. Note that the first connector 31 and the second connector 41 do not have to be ZIF connectors, as long as they can be switched between the fixed state and the unlocked state by moving the lock lever 41a.

[0031] Returning to Figure 4, the underbase unit 40 is formed in the shape of a rectangular plate in plan view. Engaging pieces 42 are attached to the four corners of the underbase unit 40. The engaging pieces 42 have a positioning hole 42a into which the positioning pin 14 can be inserted in the Z-axis direction, and a clamping hole 42b into which the clamping pin of the clamping device 15 can be inserted in the X-axis direction, corresponding to the configuration of the main unit 10.

[0032] Mounting pieces 43 for mounting the lock plunger 26 are attached to the center of two sides of the underbase unit 40 that extend in the X-axis direction. A unit attachment / detachment mechanism 50 is provided on the upper surface of the underbase unit 40. The unit attachment / detachment mechanism 50 comprises a motor unit 51 and a lock lever interlocking mechanism 52. The lock lever interlocking mechanism 52 is covered by a cover member 53.

[0033] Figure 5 is a plan view of the underbase unit 40 with the cover member 53 removed according to one embodiment. Figure 6 is a view VI as shown by the arrow in Figure 5. As shown in Figure 5, the underbase unit 40 has multiple (three) mounting holes 40a. Multiple second connectors 41 are attached to the multiple mounting holes 40a. The multiple mounting holes 40a are spaced apart in the Y-axis direction and extend parallel to the X-axis direction. The multiple second connectors 41 are attached to each mounting hole 40a, forming a row in the X-axis direction.

[0034] The motor unit 51 is positioned on the upper surface of the underbase unit 40, on the -X side of the multiple mounting holes 40a. The motor unit 51 includes a ball screw 51a extending in the Y-axis direction and a nut 51b that moves in the Y-axis direction along the ball screw 51a as the ball screw 51a rotates.

[0035] The lock lever interlocking mechanism 52 includes a plurality (3) of engaging members 54 that are movable in the X-axis direction (first linear direction) in a plan view, a movable member 55 that is movable in the Y-axis direction (second linear direction) which is perpendicular to the X-axis direction in a plan view, and a motion conversion mechanism 56 that converts the movement of the movable member 55 in the Y-axis direction into the movement of the engaging member 54 in the X-axis direction.

[0036] As shown in Figure 6, the engaging member 54 has a comb-like shape and is equipped with multiple engaging grooves 54a that engage with multiple lock levers 41a. The multiple engaging grooves 54a are open downwards. As shown in Figure 5, the engaging member 54 is positioned on the -Y side of the mounting hole 40a, extends linearly in the X-axis direction where the second connectors 41 are arranged in a row, and engages with the lock lever 41a of each second connector 41. The engaging member 54 is connected to the linear guide 60.

[0037] The linear guide 60 comprises a rail 61 extending in the X-axis direction and a plurality of slide blocks 62 that move along the rail 61. The engaging member 54 is attached to the plurality of slide blocks 62 and is movable in the X-axis direction. By moving in the X-axis direction, the engaging member 54 moves the lock lever 41a between a fixed position that fixes the plurality of second connectors 41 and the plurality of first connectors 31 (see Figure 6(b)) and a release position that releases the fixation between the plurality of second connectors 41 and the plurality of first connectors 31 (see Figure 6(a)).

[0038] As shown in Figure 5, the movable member 55 is attached to the nut 51b of the motor unit 51 and is movable in the Y-axis direction. The movable member 55 is formed in the shape of a long plate in the Y-axis direction when viewed from above. The motion conversion mechanism 56 is provided on the movable member 55 and includes an elongated hole 57 that extends in an oblique direction intersecting the X-axis and Y-axis directions when viewed from above, and a cam follower 58 provided on the engaging member 54 that is movable along the inner wall of the elongated hole 57.

[0039] Three elongated holes 57 are formed, corresponding to three engaging members 54. In a plan view, the three elongated holes 57 extend parallel to each other in an oblique direction, inclining towards the -Y side as they move toward the +X side. A cam follower 58 is attached to the -X end of each engaging member 54. The cam follower 58 has a wheel portion that is rotatable about an axis extending in the Z-axis direction. The outer diameter of the cam follower 58 is slightly smaller than the width of the elongated holes 57, allowing it to roll along the inner wall surface of the elongated holes 57.

[0040] For example, when the movable member 55 moves to the -Y side, the cam follower 58 rolls along the inner wall surface of the elongated hole 57 and moves to one end of the elongated hole 57 on the -X side. When the cam follower 58 moves to one end of the elongated hole 57, the engaging member 54 moves to the -X side together with the cam follower 58, so that the lock lever 41a moves to the unlocked position, as shown in Figure 6(a).

[0041] Furthermore, when the movable member 55 moves to the +Y side, the cam follower 58 rolls along the inner wall surface of the elongated hole 57 and moves to the other end of the elongated hole 57 on the +X side. When the cam follower 58 moves to the other end of the elongated hole 57, the engaging member 54 moves to the +X side together with the cam follower 58, so that the lock lever 41a moves to the fixed position as shown in Figure 6(b).

[0042] Figure 7 is a bottom view of a performance board unit 20 according to one embodiment. As shown in Figure 7, casters 70 are provided on the bottom side (main unit 10 side) of the performance board unit 20. The casters 70 are positioned to correspond to the four corners of the underside of the underbase unit 40. The casters 70 are, for example, ball casters, but may also be wheels or rollers.

[0043] An operating part 71 is provided at the -Y side end of the performance board unit 20 for disengaging the lock plunger 26 from the lock bracket 16. The operating part 71 is, for example, a pullable knob and is connected to the lock plunger 26 via a wire (not shown). Pulling the operating part 71 retracts the spring pin of the lock plunger 26, thereby disengaging the lock plunger 26 from the lock bracket 16. The operating part 71 is normally inoperable by an interlocking part 80, which will be described later.

[0044] Figure 8 is a perspective view of the tester 1 with a portion of the unit cover 21 removed according to one embodiment. As shown in Figure 8, the performance board unit 20 includes a connector portion 72 located at the -X end of the side end facing the -Y side. The connector portion 72 can be exposed to the outside by removing the second side cover 21c.

[0045] The connector section 72 is connected to the main unit 10 from a direction other than the attachment / detachment direction of the performance board unit 20 (Z-axis direction) (Y-axis direction). The main unit 10 is equipped with a cable (not shown) that passes through the housing 11, and an external connector (not shown) provided at the end of the cable is connected to the connector section 72 in the Y-axis direction. The motor unit 51 shown in Figures 4 and 5 receives power from the main unit 10 via the connector section 72 to operate the lock lever interlocking mechanism 52.

[0046] Figure 9 is a plan view of the main unit 10 according to one embodiment. Figure 10 is a perspective view showing the lifting unit 94 provided in the main unit 10 according to one embodiment. As shown in Figure 9, the main unit 10 is equipped with caster rails 90. There are a total of two caster rails 90, one on each of the two sides extending in the X-axis direction from the upper opening edge of the housing 11. The caster rails 90 support the casters 70 (see Figure 7) of the performance board unit 20 from below.

[0047] The caster rails 90 are provided in pairs at the upper opening edge of the housing 11, sandwiching the housing 12 in the Y-axis direction. The pair of caster rails 90 extend parallel to the X-axis direction. In a plan view, the pair of caster rails 90 are positioned closer to the housing 12 than the positioning pins 14, clamping device 15, and lock bracket 16 described above. A rail housing groove 11a for housing the caster rails 90 is formed at the upper opening edge of the housing 11. When the caster rails 90 are housed in the rail housing groove 11a, they are flush with the upper surface of the main unit 10.

[0048] As shown in Figure 10, the caster rail 90 is supported by the upper ends of a plurality of support columns 91 extending in the Z-axis direction. The plurality of support columns 91 are spaced apart in the X-axis direction. In addition, the bottom of the rail housing groove 11a shown in Figure 9 has a plurality of through holes (not shown) through which the plurality of support columns 91 can pass in the Z-axis direction. The lower ends of the plurality of support columns 91 are attached to a mounting plate 92 extending in the X-axis direction, as shown in Figure 10. Engagement plates 93, which engage with the lifting unit 94, are attached to the lower surfaces of both ends of the mounting plate 92 in the X-axis direction.

[0049] Each caster rail 90 is made movable up and down in the Z-axis direction by two lifting units 94. In other words, the main unit 10 is provided with four lifting units 94. Each lifting unit 94 comprises a motor unit 95, an extendable section 96, and a guide section 97. The motor unit 95 is connected to the extendable section 96. The extendable section 96 includes an extendable rod 96a (see Figures 12 and 13 described later) that extends and retracts in the Z-axis direction by the rotation of the motor unit 95.

[0050] The telescopic section 96 is equipped with a mechanism (such as a ball screw) that converts the rotation of the motor section 95 into movement of the telescopic rod 96a in the Z-axis direction. The upper end of the telescopic rod 96a is engaged with the engagement plate 93. The guide section 97 includes a guide rod 97a fixed to the engagement plate 93 and a guide cylinder 97b fixed to the telescopic section 96 and slidably engaged with the guide rod 97a in the Z-axis direction. The guide section 97 restricts the tilt of the telescopic rod 96a and improves the accuracy of the Z-axis movement of the lifting unit 94.

[0051] Next, we will explain how to attach and detach the performance board unit 20 from the tester 1 with the above configuration (signal transmission unit attachment / detachment method).

[0052] Figure 11 is a flowchart illustrating a method for attaching and detaching a performance board unit 20 according to one embodiment. As shown in Figure 11, this method includes the steps of: S1 disconnecting the first connector 31 and the second connector 41; S2 raising the performance board unit 20; S3 preparing the jig 201; S4 removing the target cover and disconnecting the external connector; S5 releasing the interlock; S6 disengaging the lock plunger 26; S7 moving the performance board unit 20 to the jig 201; and S8 fixing the performance board unit 20 to the jig 201. This allows the performance board unit 20 to be removed from the main unit 10. The method will be explained in detail below with reference to Figures 12 to 18. Note that when attaching the performance board unit 20 to the main unit 10, follow the reverse procedure described above.

[0053] Figure 12 is a schematic diagram showing the initial state of the tester 1 according to one embodiment. In Figure 12, for improved visibility, only the components related to the attachment and detachment of the performance board unit 20 are shown. The same applies to Figures 13, 14, and 18, which will be described later. As shown in Figure 12, in the initial state, the performance board unit 20 is attached to the main unit 10 with the casters 70 resting on the caster rails 90. The caster rails 90 are lowered to a position where they are housed in the rail housing grooves 11a shown in Figure 9.

[0054] The positioning pin 14 of the main unit 10 is inserted in the Z-axis direction into the positioning hole 42a of the engaging piece 42 of the performance board unit 20. The clamp pin of the clamping device 15 of the main unit 10 is inserted in the X-axis direction into the clamping hole 42b of the engaging piece 42. The lock plunger 26 of the performance board unit 20 engages with the lower end of the elongated hole in the lock bracket 16 of the main unit 10.

[0055] In step S1, the motor unit 51 shown in Figure 5 is driven from this state to move the movable member 55 to the -Y side. When the movable member 55 moves to the -Y side, the cam follower 58 moves to the -X side along the elongated hole 57. When the cam follower 58 moves to the -X side, the engaging member 54 moves to the -X side together with the cam follower 58, and as shown in Figure 6(a), the lock lever 41a that engages with the engaging member 54 moves (rotates) to the unlocked position. As a result, the lock between the first connector 31 and the second connector 41 is released.

[0056] Figure 13 is an explanatory diagram illustrating step S2 shown in Figure 11. After disconnecting the first connector 31 and the second connector 41, the clamping device 15 is driven as shown in Figure 13 to pull out the clamping pin from the clamping hole 42b of the engaging piece 42. Next, the lifting unit 94 is driven to raise the caster rail 90.

[0057] As the caster rail 90 rises, the performance board unit 20 rises along with the caster rail 90, and the positioning pin 14 is pulled out of the positioning hole 42a of the engaging piece 42. At this time, the lock plunger 26 rises along the elongated hole of the lock bracket 16, but because it is engaged with the upper end of the elongated hole, the movement of the performance board unit 20 in the X-axis direction along the caster rail 90 is restricted.

[0058] Figure 14 is an explanatory diagram illustrating step S3 shown in Figure 11. Figure 15 is a perspective view of area A shown in Figure 14. Figure 16 is a perspective view of a detachable system 200 (signal transmission unit detachable system) for a performance board unit 20, including a tester 1 and a jig 201, according to one embodiment. Once the performance board unit 20 is raised, the jig 201 is placed to the side of the tester 1, as shown in Figure 14, and the connecting rail 203 of the jig 201 is connected to the caster rail 90, which is raised by the lifting unit 94.

[0059] As shown in Figure 16, the jig 201 comprises a jig body 202, a pair of connecting rails 203 provided on the upper surface of the jig body 202, and a stopper 205a provided on the upper surface of the jig body 202 to restrict the fall of the performance board unit 20. The jig body 202 is, for example, a trolley with a rectangular shape in plan view, and the pair of connecting rails 203 and the stopper 205a are attached to its upper surface.

[0060] The stopper 205a is, for example, an L-shaped plate member, positioned between a pair of connecting rails 203, and capable of contacting the performance board unit 20 in the X-axis direction. Together with the fixing pin 205b (see Figure 18), which will be described later, the stopper 205a forms a fixing mechanism 205 that secures the performance board unit 20 after it has moved from the caster rail 90 onto the connecting rail 203.

[0061] As shown in Figure 15, the connecting rail 203 is equipped with a connecting groove 203c that allows the end of the caster rail 90 to be connected in the X-axis direction. The connecting rail 203 has a greater width in the Y-axis direction than the caster rail 90, and the caster rail 90 is connected to the connecting rail 203 by being inserted into the connecting groove 203c.

[0062] The caster rail 90 includes a track 90a on which the casters 70 roll, and a pair of restrictive walls 90b erected on both sides of the track 90a to prevent the casters 70 from derailing. The connecting rail 203 includes a track 203a that is continuous with the track 90a, and a pair of restrictive walls 203b that are continuous with the pair of restrictive walls 90b. This allows the performance board unit 20 to be safely transferred from the caster rail 90 to the connecting rail 203 while preventing the casters 70 from derailing.

[0063] After connecting the connecting rail 203 of the jig 201 to the caster rail 90, remove the target cover of the performance board unit 20 (the first side cover 21b and the second side cover 21c on the -Y side) as shown in Figure 8. Then, pull out the external connector (not shown) from the connector section 72 (step S4).

[0064] Figure 17 is an explanatory diagram illustrating step S5 shown in Figure 11. After disconnecting an external connector (not shown) from the connector section 72, operate the interlock section 80 as shown in Figure 17. The interlock section 80 is a safety device that allows operation of the operation section 71 after the connection at the connector section 72 has been released. This prevents the performance board unit 20 from sliding while the external connector is connected.

[0065] As shown in Figure 17(a), the interlock section 80 comprises a first plate 81 and a second plate 82 that is slidable in the X-axis direction relative to the first plate 81. The first plate 81 has a first opening 81a that exposes the connector section 72. The second plate 82 has a second opening 82a that communicates with the first opening 81a in the Y-axis direction. A slide piece 83 is attached to the upper part of the second plate 82. The slide piece 83 is engaged with a rail member (not shown) that has a dovetail-shaped slide groove extending in the X-axis direction, so as to be movable in the X-axis direction.

[0066] The second plate 82 is movable between a communication position in which the second opening 82a communicates with the first opening 81a, as shown in Figure 17(a), and a non-communication position in which the second opening 82a does not communicate with the first opening 81a, as shown in Figure 17(b). The second plate 82 is provided with a cover portion 82c that covers the operating section 71 when in the communication position shown in Figure 17(a) and exposes the operating section 71 when in the non-communication position shown in Figure 17(b).

[0067] Furthermore, a plunger 84 is provided on the second plate 82. The first plate 81 has a first plunger hole 81b and a second plunger hole 81c. The first plunger hole 81b engages with the plunger 84 when the second plate 82 is in the communication position shown in Figure 17(a). The second plunger hole 81c engages with the plunger 84 when the second plate 82 is in the non-communication position shown in Figure 17(b).

[0068] In step S5, after pulling out an external connector (not shown) from the connector section 72, the plunger 84 is pulled to disengage from the first plunger hole 81b. Then, the second plate 82 is moved from the communication position shown in Figure 17(a) to the non-communication position shown in Figure 17(b). When the second plate 82 moves to the non-communication position, the plunger 84 engages with the second plunger hole 81c by the built-in spring. Also, when the second plate 82 moves to the non-communication position, the cover section 82c shifts in front of the operating section 71, exposing the two operating sections 71.

[0069] In step S6, pulling these two operating parts 71 retracts the spring pins of the two lock plungers 26 shown in Figure 7. This releases the engagement between the lock plungers 26 and the lock bracket 16.

[0070] Figure 18 is an explanatory diagram illustrating steps S7 and S8 shown in Figure 11. After disengaging the lock plunger 26 from the lock bracket 16, the performance board unit 20 is slid along the caster rail 90 in the X-axis direction, as shown in Figure 18. Then, the performance board unit 20 is transferred from the caster rail 90 onto the connecting rail 203 of the jig 201.

[0071] Once the performance board unit 20 is slid to a position where it is in contact with or close to the stopper 205a, the fixing pin 205b is inserted into the positioning hole 42a of the engaging piece 42. This fixes the performance board unit 20, which has been transferred from the caster rail 90 to the connecting rail 203. The fixing pins 205b may be inserted one by one by an operator, or they may be inserted mechanically by pulling a lever (not shown), or electrically by pressing a button (not shown).

[0072] In this way, by removing the performance board unit 20, the housing section 12 (see Figure 3) of the main unit 10 is opened, and the substrate unit 30 can be easily replaced according to the specifications of the semiconductor circuit formed on the wafer W. Furthermore, the removed performance board unit 20 can be replaced. Although the performance board unit 20 is heavy, as described above, it can be easily attached and detached because it can be slid along by the casters 70 and caster rails 90.

[0073] As described above, the tester 1 according to this embodiment comprises a performance board unit 20 on which probe cards 3 for testing semiconductor circuits are attached, and a main unit 10 on which the performance board unit 20 is detachably attached. The performance board unit 20 is equipped with casters 70 on the main unit 10 side, and the main unit 10 is equipped with a caster rail 90 that supports the casters 70, and a lifting unit 94 that raises and lowers the caster rail 90 in the direction of attachment and detachment of the performance board unit 20. With this configuration, a tester 1 is obtained in which the heavy performance board unit 20 can be easily attached and detached.

[0074] Furthermore, in this embodiment, the main unit 10 is equipped with a lock bracket 16 having an elongated hole extending in the attachment / detachment direction, and the performance board unit 20 is equipped with a lock plunger 26 that engages with the elongated hole of the lock bracket 16 so as to be movable in the attachment / detachment direction, and restricts the movement of the performance board unit 20 along the caster rail 90. With this configuration, even if the caster rail 90 rises and the positioning pin 14 is pulled out from the positioning hole 42a of the engaging piece 42, the lock plunger 26 is engaged with the upper end of the elongated hole of the lock bracket 16, so that the movement of the performance board unit 20 along the caster rail 90 can be restricted. This prevents the heavy performance board unit 20 from moving unintentionally due to vibrations or its own weight when the caster rail 90 rises.

[0075] Furthermore, in this embodiment, the performance board unit 20 includes a connector section 72 connected to the main unit 10 in a direction other than the attachment / detachment direction, an operating section 71 for releasing the engagement of the lock plunger 26 with the lock bracket 16, and an interlock section 80 that enables operation of the operating section 71 when the connection of the connector section 72 is released. With this configuration, it is possible to prevent the performance board unit 20 from being removed while an external connector is still connected to the connector section 72.

[0076] Furthermore, in this embodiment, the main unit 10 comprises a plurality of circuit board units 30 each having a plurality of first connectors 31, and the performance board unit 20 comprises a plurality of second connectors 41 connected to the plurality of first connectors 31 in the attachment / detachment direction, a plurality of lock levers 41a provided on the plurality of second connectors 41 that are movable between a fixed position for fixing the plurality of second connectors 41 and the plurality of first connectors 31 and a release position for releasing the fixing of the plurality of second connectors 41 and the plurality of first connectors 31, a lock lever interlocking mechanism 52 that moves the plurality of lock levers 41a between the fixed position and the release position, and a motor unit 51 that receives power from the main unit 10 via the connector section 72 to operate the lock lever interlocking mechanism 52. With this configuration, connector connection and disconnection when attaching and detaching the performance board unit 20 to the main unit 10 can be performed in a short time.

[0077] Furthermore, the attachment / detachment system 200 for the performance board unit 20 of this embodiment includes a tester 1 and a jig 201 equipped with a connecting rail 203 that can be connected to the caster rail 90 when it is raised by the lifting unit 94. With this configuration, the circuit board unit 30 can be easily replaced or the performance board unit 20 replaced by moving the performance board unit 20 from the caster rail 90 onto the connecting rail 203 of the jig 201.

[0078] Furthermore, in this embodiment, the jig 201 includes a fixing mechanism 205 for fixing the performance board unit 20 after it has been transferred from the caster rail 90 to the connecting rail 203. With this configuration, the performance board unit 20 can be safely transported on the jig 201.

[0079] Furthermore, the method for attaching and detaching the performance board unit 20 of this embodiment is a method for attaching and detaching the performance board unit 20 of a tester 1, which comprises a performance board unit 20 on which a probe card 3 for testing semiconductor circuits is attached, and a main unit 10 on which the performance board unit 20 is detachably attached. The method involves providing casters 70 on the main unit 10 side of the performance board unit 20, and providing caster rails 90 that support the casters 70 and a lifting unit 94 that raises and lowers the caster rails 90 in the direction of attaching and detaching the performance board unit 20. After raising the caster rails 90 with the lifting unit 94, the performance board unit 20 is slid along the caster rails 90. With this configuration, the heavy performance board unit 20 can be easily attached and detached.

[0080] Furthermore, in this embodiment, in the above attachment / detachment method, a jig 201 equipped with a connecting rail 203 that can be connected to the caster rail 90 is placed adjacent to the tester 1, the caster rail 90, which is raised by the lifting unit 94, is connected to the connecting rail 203, and at least a part of the performance board unit 20 is transferred from the caster rail 90 to the connecting rail 203. With this configuration, by transferring the performance board unit 20 from the caster rail 90 to the connecting rail 203 of the jig 201, it becomes easier to replace the circuit board unit 30 or the performance board unit 20. Note that if only the circuit board unit 30 is to be replaced, it is not necessary to transfer the performance board unit 20 completely to the jig 201.

[0081] While preferred embodiments of the present invention have been described and explained above, it should be understood that these are illustrative and should not be considered limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the invention. Therefore, the present invention should not be considered limited by the foregoing description, but rather limited by the claims.

[0082] For example, in the above embodiment, a jig 201 is placed to the side of the tester 1, and the performance board unit 20 is moved from the caster rail 90 onto the connecting rail 203 of the jig 201, but the configuration is not limited to this. The performance board unit 20 may be slid onto a member other than the jig 201 (for example, the top surface of a workbench). Also, if the performance board unit 20 can slide within the range of the caster rail 90, at least a part of the housing section 12 of the main unit 10 can be opened, so it is not necessary to move the performance board unit 20 onto the jig 201 or any other member other than the jig 201.

[0083] For example, in the above embodiment, a probe card 3 was used as an example of the device under test, but the configuration is not limited to this. For example, if the tester 1 is used as a handler that cuts semiconductor circuits from a wafer W into chips, packages them, and then places them on a test socket for inspection, the test socket may be the device under test.

[0084] Furthermore, without departing from the spirit of the present invention, the components in the above-described embodiments may be replaced with well-known components as appropriate, and the above-described embodiments and modifications may be combined as appropriate. [Explanation of Symbols]

[0085] 1. Tester (semiconductor testing equipment) 1A Standby position 1B Examination location 2 Prova 2A Tester Relocation Device 2B Stage Equipment 2C wafer transport equipment 3 Probe Card 10 Main Unit 11 cabinets 11a Rail housing groove 12 Storage Unit 14 Positioning pins 15. Clamping device 16 Lock Bracket 20 Performance board units (signal transmission units) 21 Unit Cover 21a Center Cover 21b First side cover 21c Second side cover 22 Opening 23 Device mounting area 24 Performance Board 25 Frame Unit 26 Rock plunger 30 circuit board units 31 First Connector 40 Underbass Unit 40a Mounting hole 41. Second connector 41a Lock lever 42 Engaging piece 42a Positioning hole 42b Clamp hole 43 Mounting piece 50 Unit Detachable Mechanism 51 Motor Unit 51b Nut 52 Lock lever interlocking mechanism 53 Cover component 54 Engaging member 54a Engagement groove 55 Movable member 56 Motion conversion mechanism 57 long hole 58 Cam Follower 60 Linear Guide 61 rails 62 Slide Blocks 70 casters 71 Operation section 72 Connector section 80 Interlock section 81 Plate 1 81a First opening 81b First plunger hole 81c Second plunger hole 82 Second Plate 82a 2nd opening 82c Cover section 83 slide pieces 84 Plungers 90 Caster Rail 90a Rolling road 90b Barrier 91 Pillar 92 Mounting plate 93 Engaging plate 94 Lifting Unit 95 Motor section 96 Telescopic part 96a Telescopic rod 97 Guide Section 97a Guide Rod 97b Guide tube 100 Inspection Systems 200 Detachable System 201 Jig 202 Jig body 203 Connecting rails 203a Rolling road 203b Barrier wall 203c connection groove 205 Fixing mechanism 205a Stopper 205b Fixing pin Area A W wafer

Claims

1. A signal transmission unit to which the device under test for semiconductor circuit testing is attached, The unit comprises a main unit to which the signal transmission unit is detachably attached, The signal transmission unit is equipped with casters on the main unit side. The main unit is, A caster rail that supports the aforementioned caster, The system includes a lifting unit that raises and lowers the caster rail in the direction of attachment and detachment of the signal transmission unit. Semiconductor testing equipment.

2. The main unit comprises a lock bracket having an elongated hole extending in the attachment / detachment direction, The signal transmission unit includes a lock plunger that engages with the elongated hole in the lock bracket so as to be movable in the attachment / detachment direction, and restricts the movement of the signal transmission unit along the caster rail. The semiconductor testing apparatus according to claim 1.

3. The signal transmission unit is The main unit and the connector portion connected in a direction other than the attachment / detachment direction, An operating unit for releasing the engagement of the lock plunger with the lock bracket, The system includes an interlock unit that enables operation of the operating unit when the connection of the connector unit is disconnected. The semiconductor testing apparatus according to claim 2.

4. The main unit comprises a plurality of circuit board units, each having a plurality of first connectors. The signal transmission unit is The plurality of first connectors and the plurality of second connectors connected in the attachment / detachment direction, Multiple locking levers are provided on the plurality of second connectors and are movable between a fixing position for fixing the plurality of second connectors and the plurality of first connectors and a release position for releasing the fixing between the plurality of second connectors and the plurality of first connectors. A lock lever interlocking mechanism that moves the plurality of lock levers between the fixed position and the unlocked position, The system includes a motor unit that receives power from the main unit via the connector and operates the lock lever interlocking mechanism. The semiconductor testing apparatus according to claim 3.

5. A semiconductor testing apparatus as described in any one of claims 1 to 4, The jig includes a connecting rail that can be connected to the caster rail when it is raised by the lifting unit, Signal transmission unit attachment / detachment system.

6. The jig includes a fixing mechanism for fixing the signal transmission unit that has moved from the caster rail to the connecting rail. The signal transmission unit attachment / detachment system according to claim 5.

7. A method for attaching and detaching a signal transmission unit in a semiconductor testing apparatus, comprising a signal transmission unit to which a device under test for testing semiconductor circuits is attached, and a main unit to which the signal transmission unit is detachably attached, Casters are provided on the main unit side of the signal transmission unit. The main unit is provided with a caster rail that supports the caster and a lifting unit that raises and lowers the caster rail in the direction of attachment and detachment of the signal transmission unit. After the lifting unit raises the caster rail, the signal transmission unit is slid along the caster rail. How to attach and detach the signal transmission unit.

8. A jig equipped with a connecting rail that can be connected to the caster rail is placed adjacent to the semiconductor testing apparatus. The caster rail, which has been raised by the lifting unit, is connected to the connecting rail, and at least a part of the signal transmission unit is moved from the caster rail to the connecting rail. The method for attaching and detaching a signal transmission unit according to claim 7.

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