Semiconductor testing equipment

Abstract

The aim is to provide a compact semiconductor testing apparatus that allows for easy attachment and detachment of multiple power supply units. [Solution] The tester 1 comprises a performance board unit 20 on which a probe card is mounted, a plurality of circuit board units electrically connected to the probe card via the performance board unit 20, a plurality of power supply units 50 that supply power to the plurality of circuit board units, and a main unit 10 on which the performance board unit 20 is mounted and which also has a first housing section 12 that houses the plurality of circuit board units, and a second housing section 17 that houses the plurality of power supply units 50. The plurality of power supply units 50 are detachably mounted in the second housing section 17, and the main unit 10 is provided with a busbar 60 that is electrically connected to the plurality of power supply units 50 in the direction in which the plurality of power supply units 50 are attached to and detached from the second housing section 17 (Y-axis direction).

Description

Technical Field

[0001] The present invention relates to a semiconductor test apparatus.

Background Art

[0002] Patent Document 1 below discloses a wafer test system for electrically inspecting a plurality of semiconductor chips (dies) formed on a semiconductor wafer. This wafer test system includes a prober that contacts probes to electrodes of semiconductor chips formed on the wafer, and a tester that has terminals electrically connected to the probes, operates the semiconductor chips via the terminals, detects their output signals, and inspects the electrical characteristics of the semiconductor chips.

[0003] This tester (semiconductor test apparatus) includes a tester main body, a test head, and a cable connecting the tester main body and the test head. The test head includes a probe card (device under measurement) and a performance board (signal transmission unit) electrically connected to the terminals of the probe card. The tester main body includes a board unit that exchanges signals with the test head via the cable, and a power supply unit that supplies power to the board unit.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The above-mentioned tester has a configuration in which the tester body and test head are connected via a cable, but in recent years there has been a demand for compact testers that integrate the tester body and test head (performance board) into a single unit. Such testers house the circuit board unit and power supply unit in a single enclosure, and if the number of circuit board units is increased, decreased, or replaced depending on the specifications of the semiconductor chip, the capacity of the power supply unit also needs to be increased or decreased according to the power supply amount to each circuit board unit.

[0006] Therefore, the inventors of the present invention considered a configuration in which multiple power supply units can be attached to and detached from the tester body (main unit). However, when connecting power supply units to the tester body with cables, cable connection work is required for each power supply unit. In addition, since the cable becomes thicker depending on the amount of power supplied to the circuit board unit, space is required to route and bundle the cables, which compresses the internal space of the tester body and leads to the problem of the tester body becoming larger.

[0007] This invention has been made in view of the above-mentioned problems, and aims to provide a semiconductor testing apparatus that is compact and allows for easy attachment and detachment of multiple power supply units. [Means for solving the problem]

[0008] A semiconductor testing apparatus according to one aspect of the present invention comprises a signal transmission unit on which a device to be tested for semiconductor circuitry is mounted, a plurality of substrate units electrically connected to the device to be tested via the signal transmission unit, a plurality of power supply units for supplying power to the plurality of substrate units, and a main unit on which the signal transmission unit is mounted and which also has a first housing section for housing the plurality of substrate units and a second housing section for housing the plurality of power supply units, wherein the plurality of power supply units are detachably mounted in the second housing section, and the main unit is provided with busbars electrically connected to the plurality of power supply units in the direction of attachment and detachment of the plurality of power supply units to the second housing section. [Effects of the Invention]

[0009] According to one aspect of the present invention described above, a semiconductor testing apparatus can be provided that allows for easy attachment and detachment of multiple power supply units and is compact. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic diagram of an inspection system equipped with a tester according to one embodiment. [Figure 2] This is a perspective view of a tester according to one embodiment. [Figure 3] This is an exploded perspective view of a tester according to one embodiment. [Figure 4] This is a perspective view of a tester according to one embodiment, with the side cover removed. [Figure 5] This is a schematic diagram of a tester according to one embodiment, viewed from the direction of attachment and detachment of the power supply unit. [Figure 6] This is a perspective view showing the connection state between a busbar and a power supply unit according to one embodiment. [Figure 7] This is a perspective view of a power supply unit according to one embodiment. [Figure 8] This is the VIII view shown by the arrow in Figure 5. [Modes for carrying out the invention]

[0011] Embodiments of the present invention will be described below with reference to the drawings. However, it should be noted that at least some of the drawings are schematic, and the ratios of the thicknesses of each part may differ from those of reality. Furthermore, it is also true that there are parts where the dimensional relationships and ratios differ between drawings. Moreover, the embodiments shown below are illustrative examples of devices and methods for realizing the technical idea of ​​this invention, and the embodiments of this invention do not limit the materials, shapes, structures, arrangements, etc. of the components to those described below.

[0012] Figure 1 is a schematic diagram of an inspection system 100 equipped with a tester 1 according to one embodiment. The inspection system 100 shown in Figure 1 comprises a tester 1 (semiconductor testing device) and a prober 2. This inspection system 100 inspects the electrical characteristics of each semiconductor circuit before separating the multiple semiconductor circuits formed on the wafer W into individual chips.

[0013] A probe card 3 (device to be measured) is attached to the tester 1. The probe card 3 is equipped with multiple probes (test needles). The prober 2 brings the multiple probes provided on the probe card 3 into contact with the pads of multiple semiconductor circuits formed on the wafer W. The prober 2 is equipped with a tester moving device 2A, a stage device 2B, and a wafer transport device 2C.

[0014] The tester moving device 2A, equipped with a moving mechanism (not shown), moves the tester 1 between the standby position 1A and the inspection position 1B. The stage device 2B supports the wafer W and aligns the tester 1, located at the inspection position 1B, with the wafer W. The stage device 2B is movable in a planar direction along the horizontal plane, in a vertical direction perpendicular to the horizontal plane, and is also rotatable in the θ direction around the vertical axis. The wafer transport device 2C transports the wafer W onto the stage device 2B.

[0015] When performing the inspection, the stage device 2B moves the wafer W and brings the tips of multiple probes provided on the tester 1 located at the inspection position 1B into contact with the pads of multiple semiconductor circuits formed on the wafer W. In this state, the tester 1 simultaneously inputs a test signal to each semiconductor circuit via the multiple probes and receives output signals from each semiconductor circuit to inspect each semiconductor circuit.

[0016] Figure 2 is a perspective view of the tester 1 according to one embodiment. Figure 3 is an exploded perspective view of the tester 1 according to one embodiment. Figure 4 is a perspective view of the tester 1 according to one embodiment with the side cover 11a removed. As shown in FIG. 2, the tester 1 includes a main body unit 10 and a performance board unit 20 (signal transmission unit). The tester 1 is entirely formed in a rectangular box shape. The main body unit 10 houses a plurality of substrate units 30 (see FIG. 3) and a plurality of power supply units 50 (see FIG. 4) that supply power to the plurality of substrate units 30.

[0017] In the following description, an XYZ orthogonal coordinate system may be set, and the positional relationship of each member may be described while referring to this XYZ orthogonal coordinate system. The X-axis direction is the first linear direction along the horizontal plane, the Y-axis direction is the second linear direction orthogonal to the first linear direction in the horizontal plane, and the Z-axis direction is the vertical direction. In the present embodiment, for convenience of explanation, it is described as if the main body unit 10 side is arranged on the lower side (-Z side) and the performance board unit 20 side is arranged on the upper side (+Z side), but this positional relationship can be changed depending on the orientation and posture of the tester 1.

[0018] As shown in FIG. 2, the performance board unit 20 includes a unit cover 21 in which an opening 22 is formed. The opening 22 is formed at the center of the upper surface of the unit cover 21. The opening 22 is formed in a circular shape in a plan view seen from the Z-axis direction. From the opening 22, a device mounting portion 23 to which a probe card 3 (see FIG. 1) can be mounted is exposed. The performance board unit 20 is detachably mounted on the upper part of the main body unit 10.

[0019] As shown in FIG. 3, the main body unit 10 includes a rectangular box-shaped housing 11 that is open at the top. Inside the housing 11, a first accommodation portion 12 that is open at the top and houses a plurality of substrate units 30 is formed. The plurality of substrate units 30 are accommodated in the first accommodation portion 12 with a gap in the X-axis direction. The plurality of substrate units 30 generate test signals to be input to a plurality of semiconductor circuits formed on the wafer W, and receive and inspect output signals from each semiconductor circuit. The plurality of substrate units 30 can be increased or decreased in number or replaced according to the specifications of the semiconductor circuits formed on the wafer W.

[0020] On the upper part of each unit of the plurality of substrate units 30, a plurality (two or three) of first connectors 31 are provided. The plurality of first connectors 31 are connected to the lower surface of the performance board unit 20. On the upper end opening edge of the housing 11, a substrate retainer 13 that protrudes horizontally toward the first accommodating portion 12 and restricts the upward removal of the plurality of substrate units 30 is detachably attached.

[0021] Also, on the upper end opening edge of the housing 11, a positioning pin 14 for positioning the performance board unit 20, a clamping device 15 for clamping the performance board unit 20, and a lock bracket 16 for locking the performance board unit 20 are provided. The positioning pin 14 is provided at positions corresponding to three of the four corners of the housing 11 in a plan view. Thereby, it is possible to prevent the performance board unit 20 from being mounted on the main body unit 10 in a non-normal orientation.

[0022] Four clamping devices 15 are provided, two on each of the two sides extending in the X-axis direction of the upper end opening edge of the housing 11. Three of the four clamping devices 15 cause the clamping pins to protrude and retract in the X-axis direction toward the positioning pin 14. The remaining one of the clamping devices 15 causes the clamping pin to protrude and retract in the X-axis direction toward the corner of the housing 11 where the positioning pin 14 is not arranged. The clamping device 15 is driven electrically and can switch between a clamped state and a non-clamped state with the performance board unit 20. The lock bracket 16 has a long hole extending in the Z-axis direction and is provided in a pair sandwiching the first accommodating portion 12 in the Y-axis direction.

[0023] The performance board unit 20 includes a performance board (not shown) on which the device mounting section 23 is mounted. The performance board is interposed between the probe card 3 (see Figure 1) and the multiple board units 30 (see Figure 3) and transmits the signals necessary for testing. The performance board unit 20 also includes multiple second connectors (not shown) connected to multiple first connectors 31, and a lock plunger (not shown) that can switch between a mated state and an unmated state with respect to the lock bracket 16.

[0024] Multiple ventilation holes are formed in the side cover 11a of the housing 11. As shown in Figure 4, the side cover 11a is detachable from the housing 11 and covers the fan unit 40 provided inside the housing 11. The fan unit 40 provides air cooling for multiple circuit board units 30 (see Figure 3) housed in the first housing section 12. Below the fan unit 40 (first housing section 12), the housing 11 has a second housing section 17 that houses multiple power supply units 50. The second housing section 17 opens toward the -Y side.

[0025] Multiple power supply units 50 are arranged in a row in the X-axis direction in the second housing section 17. The multiple power supply units 50 are detachably mounted to the second housing section 17 in the Y-axis direction. In the following description, the Y-axis direction may be referred to as the direction in which the power supply units 50 are attached or detached. Also, the +Y side may be referred to as the far side in the direction in which the power supply units 50 are attached or detached, and the -Y side may be referred to as the near side in the direction in which the power supply units 50 are attached or detached. The multiple power supply units 50 are detachably fixed to the main unit 10 by bolts 51 and 52.

[0026] Figure 5 is a schematic diagram of a tester 1 according to one embodiment, viewed from the direction of attachment and detachment of the power supply unit 50. Note that in Figure 5, only the components related to attachment and detachment of the power supply unit 50 are shown for improved visibility. As shown in Figure 5, the main unit 10 is provided with a frame portion 11A and a cage portion 11B located inside the frame portion 11A. The frame portion 11A has a roughly rectangular parallelepiped shape.

[0027] The cage portion 11B is attached to the inside of the upper end of the frame portion 11A. The cage portion 11B has a roughly U-shaped cage that is open upwards. The first housing portion 12 described above is formed on the inside of the cage portion 11B. The fan unit 40 described above (see Figure 4) is attached to the surface of the cage portion 11B that faces outwards in the Y-axis direction. The second housing portion 17 is formed on the inside of the frame portion 11A and on the underside of the cage portion 11B.

[0028] The main unit 10 includes a busbar 60 that is electrically connected to the multiple power supply units 50 in the direction in which the multiple power supply units 50 are attached and detached (Y-axis direction). The busbar 60 is made of a conductive metal material and is electrically connected to a backplane substrate (not shown) provided at the bottom of the cage portion 11B. The backplane substrate is electrically connected to the multiple substrate units 30 housed in the first housing portion 12. This allows power to be supplied from the multiple power supply units 50 to the multiple substrate units 30. The busbar 60 includes a first busbar 60A connected to the anode side of the multiple power supply units 50 and a second busbar 60B connected to the cathode side of the multiple power supply units 50.

[0029] Figure 6 is a perspective view showing the connection between the busbar 60 and the power supply unit 50 according to one embodiment. Figure 7 is a perspective view of the power supply unit 50 according to one embodiment. Figure 8 is a view VIII of the arrow shown in Figure 5. As shown in Figure 6, the first busbar 60A includes a first power supply side connection part 61A and a first board side connection part 62A. The second busbar 60B includes a second power supply side connection part 61B and a second board side connection part 62B.

[0030] The first power supply side connection part 61A has a rod shape that extends linearly in the X-axis direction. The first power supply side connection part 61A is attached to the lower end of the -Y-side surface of the cage part 11B shown in Figure 5. The first power supply side connection part 61A is mechanically and electrically connected to the busbar connection terminal 70 of the power supply unit 50 via a bolt 51 in the Y-axis direction. The first power supply side connection part 61A is electrically insulated from the cage part 11B.

[0031] The first substrate-side connection portion 62A is connected to the first power supply-side connection portion 61A and has a branch shape extending along the XY plane. The first substrate-side connection portion 62A is attached to the bottom of the cage portion 11B shown in Figure 5. Specifically, the first substrate-side connection portion 62A is mechanically and electrically connected to a backplane substrate (not shown) provided at the bottom of the cage portion 11B via bolts (not shown). The first substrate-side connection portion 62A is electrically insulated from the cage portion 11B.

[0032] The second power supply side connection part 61B has a rod shape that extends linearly in the X-axis direction. The second power supply side connection part 61B is attached to the upper side of the first power supply side connection part 61A at the lower end of the -Y side surface of the cage part 11B shown in Figure 5, and extends parallel to the first power supply side connection part 61A. The second power supply side connection part 61B is mechanically and electrically connected to the busbar connection terminal 70 of the power supply unit 50 via a bolt 51 in the Y-axis direction. The second power supply side connection part 61B is electrically insulated from the cage part 11B.

[0033] The second substrate-side connection portion 62B is connected to the second power supply-side connection portion 61B and has a branch shape that extends along the XY plane, with a gap between it and the first substrate-side connection portion 62A. The second substrate-side connection portion 62B is attached to the bottom of the cage portion 11B shown in Figure 5. Specifically, the second substrate-side connection portion 62B is mechanically and electrically connected to a backplane substrate (not shown) provided at the bottom of the cage portion 11B via bolts (not shown). The second substrate-side connection portion 62B is electrically insulated from the cage portion 11B.

[0034] As shown in Figure 7, the power supply unit 50 has a roughly rectangular parallelepiped shape extending in the Y-axis direction. Power terminals 53 are provided on the face of the power supply unit 50 facing the -Y side. Busbar connection terminals 70 are mechanically and electrically connected to the power supply terminals 53 via bolts 54. The power supply unit 50 includes a first power supply terminal 53A on the anode side and a second power supply terminal 53B on the cathode side as power supply terminals 53. The power supply unit 50 also includes a first busbar connection terminal 70A connected to the first power supply terminal 53A and a second busbar connection terminal 70B connected to the second power supply terminal 53B as busbar connection terminals 70.

[0035] The busbar connection terminal 70 extends from the power terminal 53 above the top surface of the power supply unit 50 and has a curved shape toward the rear side (+Y side) in the direction of attachment / detachment of the power supply unit 50. Specifically, the busbar connection terminal 70 comprises an electrode-side fixing portion 71, a curved portion 72, and a busbar-side fixing portion 73. The electrode-side fixing portion 71 is formed in a plate shape along the XY plane and is fixed to the power terminal 53 in the Z-axis direction via a bolt 54.

[0036] The curved portion 72 is a part that is bent at a right angle to the +Z side from the +X side edge of the electrode-side fixing portion 71, and is formed in a plate shape along the YZ plane. The curved portion 72 comprises a first portion that extends linearly vertically upward from the +X side edge of the electrode-side fixing portion 71, a second portion that extends at a 45-degree angle with respect to the horizontal plane (XY plane) from the end of the first portion toward the back side (+Y side) in the attachment / detachment direction, and a third portion that extends linearly horizontally from the end of the second portion toward the back side (+Y side) in the attachment / detachment direction.

[0037] The busbar-side fixing portion 73 is a portion bent at a right angle to the -X side from the end of the third portion of the curved portion 72, and is formed in a plate shape along the XZ plane. A through hole 73a is formed in the busbar-side fixing portion 73, penetrating in the Y-axis direction. A bolt 51, shown in Figure 6, is inserted into the through hole 73a. The bolt 51 mechanically and electrically connects the busbar connection terminal 70 and the busbar 60 in the Y-axis direction.

[0038] As shown in Figure 7, the power supply unit 50 is mounted on a slide plate 80. The slide plate 80 is fixed to the bottom surface of the power supply unit 50 via countersunk screws or the like. The slide plate 80 is formed in a plate shape that is longer on both sides in the Y-axis direction than the power supply unit 50. A fixing hole 81 is formed at the -Y end of the slide plate 80, which penetrates in the Z-axis direction. A bolt 52, as shown in Figure 5, is inserted into the fixing hole 81. The bolt 52 mechanically fixes the slide plate 80 and the main unit 10 in the Z-axis direction.

[0039] As shown in Figure 8, a positioning recess 82 is provided at the +Y side end of the slide plate 80. The positioning recess 82 is a notch formed in a semicircular or roughly U-shape when viewed from the Z-axis direction in a plan view. A fixing piece 90 is provided at the rear side (+Y side) of the second housing section 17. The fixing piece 90 has a crank-shaped form, and the +Y side end of the slide plate 80 forms a gap 91 into which it can be inserted in the Y-axis direction.

[0040] The second housing section 17 is provided with a positioning projection 92 that engages with a positioning recess 82. The positioning projection 92 is provided in a columnar shape within the gap 91 of the fixing piece 90 and engages with the positioning recess 82 of the slide plate 80 inserted into the gap 91. The positioning projection 92 is composed of, for example, a bolt that penetrates the gap 91 of the fixing piece 90 in the Z-axis direction and is fixed to the bottom surface of the second housing section 17, and a cylindrical spacer disposed within the gap 91 through which the bolt passes.

[0041] To install the power supply unit 50 with the above configuration onto the main unit 10, first, remove the side cover 11a from the main unit 10 as shown in Figure 4. Next, insert the power supply unit 50 into the empty space of the second housing 17 in the Y-axis direction. When the power supply unit 50 is inserted in the Y-axis direction, as shown in Figure 8, the +Y side end of the slide plate 80 on which the power supply unit 50 is mounted is inserted into the gap 91 of the fixing piece 90, and the positioning recess 82 engages with the positioning protrusion 92. In this state, as shown in Figures 5 and 6, align the busbar 60 and the busbar connection terminal 70 and fix them in the Y-axis direction with the bolt 51. Then, fix the -Y side end of the slide plate 80 to the bottom surface of the second housing 17 in the Z-axis direction with the bolt 52. Finally, attach the removed side cover 11a to the main unit 10. As a result, the power supply unit 50 can be attached to the main unit 10. To remove the power supply unit 50 from the main unit 10, follow the reverse procedure described above.

[0042] As described above, in this embodiment, the power supply unit 50 and the busbar 60 are electrically connected in the attachment / detachment direction (Y-axis direction), eliminating the need for cable connection work and simplifying the connection process. Furthermore, since the busbar 60 only needs to have a width and thickness corresponding to the amount of power supplied to each board unit 30, it can be placed in a space-saving manner within the main unit 10. This prevents the overall height of the second housing section 17 from increasing, and makes the main unit 10 more compact.

[0043] As described above, the tester 1 according to this embodiment comprises a performance board unit 20 on which a probe card 3 for testing semiconductor circuits is mounted, a plurality of substrate units 30 electrically connected to the probe card 3 via the performance board unit 20, a plurality of power supply units 50 that supply power to the plurality of substrate units 30, and a main unit 10 on which the performance board unit 20 is mounted and which also has a first housing section 12 that houses the plurality of substrate units 30 and a second housing section 17 that houses the plurality of power supply units 50. The plurality of power supply units 50 are detachably mounted in the second housing section 17, and the main unit 10 is provided with busbars 60 that are electrically connected to the plurality of power supply units 50 in the direction of attachment and detachment of the plurality of power supply units 50 to the second housing section 17 (Y-axis direction). With this configuration, an easy attachment and detachment of the plurality of power supply units is possible and a compact tester 1 can be obtained.

[0044] Furthermore, in this embodiment, each of the power supply units 50 is equipped with a busbar connection terminal 70 that is fixed to the busbar 60 via bolts 51 in the attachment / detachment direction. With this configuration, the attachment / detachment direction of the power supply unit 50 coincides with the connection direction of the busbar connection terminal 70 to the busbar 60, making the fixing work with bolts 51 easier.

[0045] Furthermore, in this embodiment, the busbar connection terminal 70 is provided on the front side (-Y side) in the attachment / detachment direction of each of the multiple power supply units 50. With this configuration, the bolt 51 can be fixed in the open space on the front side (-Y side) of the second housing 17, making the work easier than fixing the bolt 51 in the closed space on the back side (+Y side) of the second housing 17.

[0046] Furthermore, in this embodiment, the busbar connection terminal 70 has a shape that extends upward from the power terminal 53 provided on the front side (-Y side) of each of the multiple power supply units 50, and curves toward the rear side (+Y side) of the connection direction. With this configuration, the busbar connection terminal 70 can be easily brought into contact with the busbar 60 in the connection direction (Y axis direction), and since the busbar connection terminal 70 extends upward from the power supply unit 50 and does not extend to the left or right, multiple power supply units 50 can be arranged at high density in the X axis direction as shown in Figure 5.

[0047] Furthermore, in this embodiment, each of the multiple power supply units 50 is mounted on a slide plate 80 that can slide in the attachment / detachment direction in the second housing section 17. This configuration makes it easy to insert the power supply units 50 into the second housing section 17.

[0048] Furthermore, in this embodiment, a positioning recess 82 is provided on the rear side (+Y side) of the slide plate 80 in the attachment / detachment direction, and a positioning projection 92 is provided on the rear side (+Y side) of the second housing section 17 in the attachment / detachment direction, with which the positioning recess 82 engages. With this configuration, the power supply unit 50 can be positioned relative to the second housing section 17 at the same time as the power supply unit 50 is inserted, making it easier to fix the busbar connection terminal 70 to the busbar 60.

[0049] Furthermore, in this embodiment, a fixing hole 81 is provided on the front side (-Y side) of the slide plate 80 in the attachment / detachment direction, which can be fixed to the main unit 10 via a bolt 52. With this configuration, the connection state of the power supply unit 50 can be maintained, so that even if the tester 1 is used upside down, as shown in Figure 1, the connection state of the power supply unit 50 can be maintained and power can be stably supplied to each board unit 30.

[0050] While preferred embodiments of the present invention have been described and explained above, it should be understood that these are illustrative and should not be considered limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the invention. Therefore, the present invention should not be considered limited by the foregoing description, but rather limited by the claims.

[0051] For example, in the above embodiment, a probe card 3 was used as an example of the device under test, but the configuration is not limited to this. For example, the semiconductor testing apparatus may be used as a handler that cuts semiconductor circuits from a wafer W into chips, packages them, and then places them on a test socket for inspection. In this case, the test socket may be the device under test.

[0052] Furthermore, without departing from the spirit of the present invention, the components in the above-described embodiments may be replaced with well-known components as appropriate, and the above-described embodiments and modifications may be combined as appropriate. [Explanation of Symbols]

[0053] 1. Tester (semiconductor testing equipment) 1A Standby position 1B Examination location 2 Prova 2A Tester Relocation Device 2B Stage Equipment 2C wafer transport equipment 3. Probe card (device under test) 10 Main Unit 11 cabinets 11a Side cover 11A Frame 11B Kagobe 12. First Detention Unit 14 Positioning pins 15. Clamping device 16 Lock Bracket 17. Second Detention Unit 20 Performance board units (signal transmission units) 21 Unit Cover 22 Opening 23 Device mounting area 30 circuit board units 31 First Connector 40 Fan Units 50 Power Supply Units 51 volts 52 volts 53 Power terminal 53A 1st power supply terminal 53B 2nd power supply terminal 54 volts 60 Bus Bar 60A First Busbar 60B Second Bus Bar 61A First power supply side connection 61B Second power supply side connection 62A First board side connection section 62B Second board side connection section 70 Busbar connectors 70A First busbar connection terminal 70B Second busbar connection terminal 71 Electrode side fixing part 72 music section 73 Busbar-side fixing part 73a Through hole 80 sliding plates 81 Fixed hole 82 Positioning recess 90 Fixed piece 91 gap 92 Positioning protrusion 100 Inspection Systems W wafer

Claims

1. A signal transmission unit to which the device under test for semiconductor circuit testing is attached, A plurality of substrate units electrically connected to the device under measurement via the signal transmission unit, Multiple power supply units that supply power to the aforementioned multiple circuit board units, The system comprises a main unit on which the signal transmission unit is mounted and which has a first housing section for housing the plurality of circuit board units, and a second housing section for housing the plurality of power supply units, The aforementioned plurality of power supply units are detachably mounted in the second housing, The main unit is equipped with busbars that are electrically connected to the plurality of power units in the direction in which the plurality of power units are attached to and detached from the second housing. Semiconductor testing equipment.

2. The plurality of power supply units are equipped with busbar connection terminals that are fixed to the busbar via bolts in the attachment / detachment direction. The semiconductor testing apparatus according to claim 1.

3. The busbar connection terminal is provided on the front side in the direction of attachment / detachment in each of the multiple power supply units. The semiconductor testing apparatus according to claim 2.

4. The busbar connection terminal has a shape that extends upward from the power terminal provided on the front side facing the front in the attachment / detachment direction of each of the plurality of power supply units, and curves toward the rear side in the attachment / detachment direction. The semiconductor testing apparatus according to claim 3.

5. Each of the aforementioned multiple power supply units is mounted on a sliding plate that can slide in the attachment / detachment direction in the second housing section. A semiconductor testing apparatus according to any one of claims 1 to 4.

6. A positioning recess is provided on the inner side of the slide plate in the direction of attachment and detachment. A positioning projection is provided on the inner side of the second housing in the direction of attachment and detachment, with which the positioning recess engages. The semiconductor testing apparatus according to claim 5.

7. On the front side of the slide plate in the direction of attachment and detachment, a fixing hole is provided, which allows the slide plate to be fixed to the main unit via a bolt. The semiconductor testing apparatus according to claim 5.

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