Semiconductor testing equipment

Abstract

The aim is to provide highly customizable, compact semiconductor testing equipment. [Solution] The tester 1 comprises a performance board unit 20 on which a device to be tested for semiconductor circuitry is mounted, a plurality of substrate units 30 electrically connected to the device to be tested via the performance board unit 20, and a main unit 10 having a housing section 12 that houses the plurality of substrate units 30. The performance board unit 20 is detachably mounted on the main unit 10 with the opening of the housing section 12 closed.

Description

Technical Field

[0001] The present invention relates to a semiconductor test apparatus.

Background Art

[0002] Patent Document 1 below discloses a wafer test system for electrically inspecting a plurality of semiconductor chips (dies) formed on a semiconductor wafer. This wafer test system includes a prober that contacts probes to the electrodes of the semiconductor chips formed on the wafer, and a tester that has terminals electrically connected to the probes, operates the semiconductor chips via the terminals, and detects the output signals thereof to inspect the electrical characteristics of the semiconductor chips.

[0003] This tester (semiconductor test apparatus) includes a tester main body, a test head, and a cable connecting the tester main body and the test head. The test head includes a probe card (device under measurement) and a performance board (signal transmission unit) electrically connected to the terminals of the probe card. The tester main body includes a board unit that exchanges signals with the test head via the cable, and a power unit that supplies power to the board unit.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The above-mentioned tester has a configuration in which the tester body and test head are connected via a cable. However, in recent years, there has been a demand for compact testers that integrate the tester body and test head (performance board) into a single unit. Because such testers house each of the above units in a single enclosure, it is difficult to replace the performance board or swap out the board unit according to the specifications of the semiconductor chip, and there was room for improvement in terms of customizability.

[0006] This invention has been made in view of the above-mentioned problems, and aims to provide a compact semiconductor testing apparatus with high customizability. [Means for solving the problem]

[0007] A semiconductor testing apparatus according to one aspect of the present invention comprises a signal transmission unit on which a device to be tested for semiconductor circuitry is mounted, a plurality of substrate units electrically connected to the device to be tested via the signal transmission unit, and a main unit having a housing section that houses the plurality of substrate units, wherein the signal transmission unit is detachably mounted on the main unit with the opening of the housing section closed. [Effects of the Invention]

[0008] According to one aspect of the present invention described above, a highly customizable and compact semiconductor testing apparatus can be provided. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic diagram of an inspection system comprising a tester according to the first embodiment. [Figure 2] This is a perspective view of the tester according to the first embodiment. [Figure 3] This is an exploded perspective view of the tester according to the first embodiment. [Figure 4] This is an exploded perspective view of the performance board unit according to the first embodiment. [Figure 5]This is a plan view of the underbase unit with the cover member removed according to the first embodiment. [Figure 6] Figure 5 shows the view VI from the arrow. [Figure 7] This is an enlarged view of region A shown in Figure 5. [Figure 8] This is a perspective view of the tester according to the second embodiment. [Figure 9] This is an exploded perspective view of the tester according to the second embodiment. [Figure 10] This is a plan view of the underbase unit according to the second embodiment. [Figure 11] This is a magnified view of region B shown in Figure 10. [Modes for carrying out the invention]

[0010] Embodiments of the present invention will be described below with reference to the drawings. However, it should be noted that at least some of the drawings are schematic, and the ratios of the thicknesses of each part may differ from those of reality. Furthermore, it is also true that there are parts where the dimensional relationships and ratios differ between drawings. Moreover, the embodiments shown below are illustrative examples of devices and methods for realizing the technical idea of ​​this invention, and the embodiments of this invention do not limit the materials, shapes, structures, arrangements, etc. of the components to those described below.

[0011] (First Embodiment) Figure 1 is a schematic diagram of an inspection system 100 equipped with a tester 1 according to the first embodiment. The inspection system 100 shown in Figure 1 comprises a tester 1 (semiconductor testing device) and a prober 2. This inspection system 100 inspects the electrical characteristics of each semiconductor circuit before separating the multiple semiconductor circuits formed on the wafer W into individual chips.

[0012] A probe card 3 (device under test) is mounted on the tester 1. The probe card 3 includes a plurality of probes (inspection needles). The prober 2 brings the plurality of probes provided on the probe card 3 into contact with the pads of the plurality of semiconductor circuits formed on the wafer W. The prober 2 includes a tester moving device 2A, a stage device 2B, and a wafer transfer device 2C.

[0013] The tester moving device 2A includes a moving mechanism (not shown) and moves the tester 1 between a standby position 1A and an inspection position 1B. The stage device 2B supports the wafer W and aligns the tester 1 located at the inspection position 1B with the wafer W. The stage device 2B is movable in a planar direction along the horizontal plane and in a vertical direction perpendicular to the horizontal plane, and is further rotatable in a θ direction around a vertical axis. The wafer transfer device 2C transfers the wafer W onto the stage device 2B.

[0014] When performing an inspection, the stage device 2B moves the wafer W and brings the pads of the plurality of semiconductor circuits formed on the wafer W into contact with the tip portions of the plurality of probes provided on the tester 1 located at the inspection position 1B. In this state, the tester 1 inspects each semiconductor circuit by simultaneously inputting test signals to each semiconductor circuit via the plurality of probes and receiving output signals from each semiconductor circuit.

[0015] FIG. 2 is a perspective view of the tester 1 according to the first embodiment. FIG. 3 is an exploded perspective view of the tester 1 according to the first embodiment. As shown in FIG. 2, the tester 1 includes a main body unit 10 and a performance board unit 20 (signal transmission unit). The tester 1 is integrally formed in a rectangular box shape. The main body unit 10 houses a plurality of substrate units 30 (see FIG. 3) and a power supply unit (not shown) that supplies power to the plurality of substrate units 30.

[0016] In the following description, an XYZ orthogonal coordinate system may be set, and the positional relationship of each member may be described while referring to this XYZ orthogonal coordinate system. The X-axis direction is the first linear direction along the horizontal plane, the Y-axis direction is the second linear direction orthogonal to the first linear direction in the horizontal plane, and the Z-axis direction is the vertical direction. In this embodiment, for the sake of convenience of explanation, it will be described as if the main body unit 10 side is arranged on the lower side (-Z side) and the performance board unit 20 side is arranged on the upper side (+Z side), but this positional relationship can be changed depending on the orientation and posture of the tester 1.

[0017] As shown in FIG. 2, the performance board unit 20 includes a unit cover 21 in which an opening 22 is formed. The opening 22 is formed at the center of the upper surface of the unit cover 21. The opening 22 is formed in a circular shape in a plan view as viewed from the Z-axis direction. A device mounting portion 23 to which the probe card 3 (see FIG. 1) can be mounted is exposed from the opening 22. The performance board unit 20 is detachably mounted on the upper part of the main body unit 10.

[0018] As shown in FIG. 3, the main body unit 10 includes a rectangular box-shaped housing 11 that is open upward. Inside the housing 11, a housing portion 12 that is open upward and houses a plurality of substrate units 30 is formed. The plurality of substrate units 30 are housed in the housing portion 12 with a gap in the X-axis direction. The plurality of substrate units 30 generate test signals to be input to a plurality of semiconductor circuits formed on the wafer W, and receive and inspect output signals from each semiconductor circuit. The plurality of substrate units 30 can be increased or decreased in number or replaced according to the specifications of the semiconductor circuits formed on the wafer W.

[0019] On the upper part of each unit of the plurality of substrate units 30, a plurality (two or three) of first connectors 31 are provided. The plurality of first connectors 31 are connected to the lower surface of the performance board unit 20. A substrate retainer 13 that protrudes horizontally toward the housing portion 12 and restricts the upward removal of the plurality of substrate units 30 is detachably attached to the upper end opening edge of the housing 11.

[0020] Furthermore, the upper opening edge of the housing 11 is provided with positioning pins 14 for positioning the performance board unit 20, a clamping device 15 for clamping the performance board unit 20, and a locking bracket 16 for locking the performance board unit 20. The positioning pins 14 are located at positions corresponding to three of the four corners of the housing 11 when viewed from above. This prevents the performance board unit 20 from being attached to the main unit 10 in an incorrect orientation.

[0021] There are a total of four clamping devices 15, two on each of the two sides extending in the X-axis direction from the upper opening edge of the housing 11. Three of the four clamping devices 15 extend and retract their clamping pins in the X-axis direction toward the positioning pin 14. The remaining clamping device 15 extends and retracts its clamping pins in the X-axis direction toward the corner of the housing 11 where the positioning pin 14 is not located. The clamping devices 15 are electrically driven and can switch between a clamped state and an unclamped state toward the performance board unit 20. The lock bracket 16 has an elongated hole extending in the Z-axis direction and is provided in pairs, sandwiching the housing portion 12 in the Y-axis direction.

[0022] Figure 4 is an exploded perspective view of the performance board unit 20 according to the first embodiment. As shown in Figure 4, the performance board unit 20 includes a performance board 24 on which a device mounting section 23 is provided. The performance board 24 is interposed between the probe card 3 (see Figure 1) and the multiple substrate units 30 (see Figure 3) and transmits the signals necessary for testing.

[0023] A device mounting section 23 is provided on the upper surface of the performance board 24. A lock plunger 26, which can be fitted into a lock bracket 16 (see Figure 3), is provided on the lower surface of the performance board 24. The lock plunger 26 is provided in a pair corresponding to the lock bracket 16. The lock plunger 26 is electrically driven and can switch between a fitted state and an unfitted state with respect to the lock bracket 16. The performance board 24 is attached to the underbase unit 40 via a frame unit 25.

[0024] The underbase unit 40 forms the lower surface of the performance board unit 20. The underbase unit 40 is provided with a plurality of second connectors 41. The plurality of second connectors 41 are provided in a number and arrangement corresponding to the plurality of first connectors 31 shown in Figure 3. The plurality of second connectors 41 are connected to the plurality of first connectors 31 in the Z-axis direction.

[0025] The first connector 31 and the second connector 41 are, for example, ZIF (Zero Insertion Force) connectors. The second connector 41 is provided with a lock lever 41a (see Figure 6, described later). By operating the lock lever 41a, the second connector 41 can be switched between a fixed state, where it is fixed to the first connector 31, and an unlocked state, where it is released from the first connector 31. Note that the first connector 31 and the second connector 41 do not have to be ZIF connectors, as long as they can be switched between the fixed state and the unlocked state by moving the lock lever 41a.

[0026] Returning to Figure 4, the underbase unit 40 is formed in the shape of a rectangular plate in plan view. Engaging pieces 42 are attached to the four corners of the underbase unit 40. The engaging pieces 42 have a positioning hole 42a into which the positioning pin 14 can be inserted in the Z-axis direction, and a clamping hole 42b into which the clamping pin of the clamping device 15 can be inserted in the X-axis direction, corresponding to the configuration of the main unit 10.

[0027] Mounting pieces 43 for mounting the lock plunger 26 are attached to the center of two sides of the underbase unit 40 that extend in the X-axis direction. A unit attachment / detachment mechanism 50 is provided on the upper surface of the underbase unit 40. The unit attachment / detachment mechanism 50 comprises a motor unit 51 and a lock lever interlocking mechanism 52. The lock lever interlocking mechanism 52 is covered by a cover member 53.

[0028] Figure 5 is a plan view of the underbase unit 40 with the cover member 53 removed according to the first embodiment. Figure 6 is a view taken along arrow VI in Figure 5. Figure 7 is an enlarged view of area A shown in Figure 5. As shown in Figure 5, the underbase unit 40 has multiple (three) mounting holes 40a. Multiple second connectors 41 are attached to the multiple mounting holes 40a. The multiple mounting holes 40a are spaced apart in the Y-axis direction and extend parallel to the X-axis direction. The multiple second connectors 41 are attached to each mounting hole 40a, forming a row in the X-axis direction.

[0029] The motor unit 51 is positioned on the upper surface of the underbase unit 40, on the -X side of the multiple mounting holes 40a. The motor unit 51 includes a ball screw 51a extending in the Y-axis direction and a nut 51b that moves in the Y-axis direction along the ball screw 51a as the ball screw 51a rotates.

[0030] The lock lever interlocking mechanism 52 includes a plurality (3) of engaging members 54 that are movable in the X-axis direction (first linear direction) in a plan view, a movable member 55 that is movable in the Y-axis direction (second linear direction) which is perpendicular to the X-axis direction in a plan view, and a motion conversion mechanism 56 that converts the movement of the movable member 55 in the Y-axis direction into the movement of the engaging member 54 in the X-axis direction.

[0031] As shown in Figure 6, the engaging member 54 has a comb-like shape and is equipped with multiple engaging grooves 54a that engage with multiple lock levers 41a. The multiple engaging grooves 54a are open downwards. As shown in Figure 5, the engaging member 54 is positioned on the -Y side of the mounting hole 40a, extends linearly in the X-axis direction where the second connectors 41 are arranged in a row, and engages with the lock lever 41a of each second connector 41. The engaging member 54 is connected to the linear guide 60.

[0032] The linear guide 60 comprises a rail 61 extending in the X-axis direction and a plurality of slide blocks 62 that move along the rail 61. The engaging member 54 is attached to the plurality of slide blocks 62 and is movable in the X-axis direction. By moving in the X-axis direction, the engaging member 54 moves the lock lever 41a between a fixed position that fixes the plurality of second connectors 41 and the plurality of first connectors 31 (see Figure 6(b)) and a release position that releases the fixation between the plurality of second connectors 41 and the plurality of first connectors 31 (see Figure 6(a)).

[0033] As shown in Figure 5, the movable member 55 is attached to the nut 51b of the motor unit 51 and is movable in the Y-axis direction. The movable member 55 is formed in the shape of a long plate in the Y-axis direction when viewed from above. The motion conversion mechanism 56 is provided on the movable member 55 and includes an elongated hole 57 that extends in an oblique direction intersecting the X-axis and Y-axis directions when viewed from above, and a cam follower 58 provided on the engaging member 54 that is movable along the inner wall of the elongated hole 57.

[0034] Three elongated holes 57 are formed, corresponding to the three engaging members 54. In a plan view, the three elongated holes 57 extend parallel to each other in an oblique direction, inclined towards the -Y side as they move toward the +X side. A cam follower 58 is attached to the -X end of each engaging member 54. The cam follower 58 has a wheel portion that is rotatable about an axis extending in the Z-axis direction.

[0035] As shown in Figure 7, the cam follower 58 is attached to the -X side end of the engaging member 54 via a mounting piece 54c. The mounting piece 54c has an inverted L shape and is fixed to the Y-axis oriented surface of the engaging member 54 with a bolt 54b or the like. The outer diameter of the cam follower 58 is slightly smaller than the width of the elongated hole 57, allowing it to roll along the first inner wall surface 57ba or the second inner wall surface 57ab of the elongated hole 57.

[0036] For example, when the movable member 55 moves to the -Y side, the cam follower 58 rolls along the first inner wall surface 57ba and moves to one end 58a on the -X side of the elongated hole 57. When the cam follower 58 moves to one end 58a of the elongated hole 57, the engaging member 54 moves to the -X side together with the cam follower 58, so that the lock lever 41a moves to the unlocked position, as shown in Figure 6(a).

[0037] Furthermore, when the movable member 55 moves to the +Y side, the cam follower 58 rolls along the second inner wall surface 57ab opposite the first inner wall surface 57ba and moves to the other end 58b of the elongated hole 57 on the +X side. When the cam follower 58 moves to the other end 58b of the elongated hole 57, the engaging member 54 moves to the +X side together with the cam follower 58, so that the lock lever 41a moves to the fixed position as shown in Figure 6(b).

[0038] Next, we will explain the customization process for Tester 1 with the above configuration (the process of attaching and detaching the performance board unit 20).

[0039] To remove the performance board unit 20 from the main unit 10, first, the connector connection between the performance board unit 20 and the circuit board unit 30 is released. Specifically, the motor unit 51 shown in Figure 5 is driven to move the movable member 55 to the -Y side. When the movable member 55 moves to the -Y side, the cam follower 58 moves to the -X side along the elongated hole 57. When the cam follower 58 moves to the -X side, the engaging member 54 moves to the -X side together with the cam follower 58, and as shown in Figure 6(a), the lock lever 41a that engages with the engaging member 54 moves (rotates) to the release position. This releases the fixing between the first connector 31 and the second connector 41.

[0040] Once the first connector 31 and the second connector 41 are released, an electrical signal is sent to the clamping device 15 (see Figure 3) and the locking plunger 26 (see Figure 4) to release the clamp and lock between the main unit 10 and the performance board unit 20. Next, as shown in Figure 3, the performance board unit 20 can be removed from the main unit 10 by pulling it upward. By removing the performance board unit 20, the housing section 12 of the main unit 10 is opened, and the substrate unit 30 can be easily replaced according to the specifications of the semiconductor circuit formed on the wafer W. The performance board unit 20 can also be replaced.

[0041] When replacing the performance board unit 20, or when reattaching the same performance board unit 20 to the main unit 10, the installation can be easily performed by following the reverse procedure described above. After attaching the performance board unit 20 to the main unit 10, when connecting the performance board unit 20 and the circuit board unit 30 with a connector, the motor unit 51 shown in Figure 5 is driven to move the movable member 55 to the +Y side. When the movable member 55 moves to the +Y side, the cam follower 58 moves to the +X side along the elongated hole 57. When the cam follower 58 moves to the +X side, the engaging member 54 moves to the +X side together with the cam follower 58, and as shown in Figure 6(b), the lock lever 41a that engages with the engaging member 54 moves (rotates) to a fixed position. This allows the first connector 31 and the second connector 41 to be fixed.

[0042] As described above, the tester 1 according to this embodiment comprises a performance board unit 20 on which a probe card 3 for testing semiconductor circuits is mounted, a plurality of substrate units 30 electrically connected to the probe card 3 via the performance board unit 20, and a main unit 10 having a housing section 12 that houses the plurality of substrate units 30. The performance board unit 20 is detachably mounted on the main unit 10 with the opening of the housing section 12 closed. With this configuration, by removing the performance board unit 20 from the main unit 10, the housing section 12 is opened, and the substrate units 30 can be replaced or the performance board unit 20 can be replaced according to the specifications of the semiconductor circuit formed on the wafer W. Therefore, a compact tester 1 with high customizability can be provided.

[0043] Furthermore, in this embodiment, the system includes a plurality of first connectors 31 provided on a plurality of substrate units 30, a plurality of second connectors 41 provided on the performance board unit 20 and connected to the plurality of first connectors 31, a plurality of lock levers 41a provided on the plurality of second connectors 41 that are movable between a fixed position for fixing the plurality of second connectors 41 and the plurality of first connectors 31 and a release position for releasing the fixing of the plurality of second connectors 41 and the plurality of first connectors 31, and a lock lever interlocking mechanism 52 provided on the performance board unit 20 that moves the plurality of lock levers 41a between the fixed position and the release position. With this configuration, connector connection and disconnection when attaching and detaching the performance board unit 20 to the main unit unit 10 can be performed in a short time.

[0044] Furthermore, in this embodiment, the lock lever interlocking mechanism 52 includes a plurality of engaging members 54 that are movable in the X-axis direction (first linear direction) in a plan view and engage with a plurality of lock levers 41a, a movable member 55 that is movable in the Y-axis direction (second linear direction) perpendicular to the X-axis direction in a plan view, and a motion conversion mechanism 56 that converts the movement of the movable member 55 in the Y-axis direction into the movement of the engaging member 54 in the X-axis direction. With this configuration, by interlocking the linear movements in the X-axis direction and the Y-axis direction, the lock levers 41a of the plurality of second connectors 41 that are densely provided on the performance board unit 20 can be moved in a space-saving manner.

[0045] Furthermore, in this embodiment, the motion conversion mechanism 56 includes an elongated hole 57 provided in the movable member 55 that extends diagonally in a direction intersecting the X-axis and Y-axis directions in a plan view, and a cam follower 58 provided in the engaging member 54 that is movable along the inner wall of the elongated hole 57. With this configuration, the movement of the movable member 55 in the Y-axis direction can be converted into the movement of the engaging member 54 in the X-axis direction with a simple structure.

[0046] (Second Embodiment) Next, a second embodiment of the present invention will be described. In the following description, components identical or equivalent to those in the above-described embodiment will be denoted by the same reference numerals, and their descriptions will be simplified or omitted.

[0047] Figure 8 is a perspective view of the tester 1 according to the second embodiment. Figure 9 is an exploded perspective view of the tester 1 according to the second embodiment. As shown in Figure 8, the tester 1 of the second embodiment is formed as a rectangle extending in the Y-axis direction in a plan view. As shown in Figure 9, the number of substrate units 30 that can be housed in the main unit 10 of this tester 1 is less than the number that can be housed in the main unit 10 of the first embodiment shown in Figure 3. The tester 1 of the second embodiment is used, for example, in a handler that cuts semiconductor circuits from a wafer W into chips, packages them, and then places them on a test socket (device to be measured) (not shown) for inspection.

[0048] As shown in Figure 8, the performance board unit 20 is provided with a rectangular device mounting section 23 in plan view, to which a test socket (not shown) can be attached. Also, as shown in Figure 9, the main unit 10 is provided with a rectangular box-shaped housing 11 that is open at the top. Inside the housing 11, there is a housing section 12 that is open at the top and accommodates multiple board units 30.

[0049] The upper opening edge of the housing 11 is not provided with the clamping device 15 shown in Figure 3 above; instead, a clamp pin insertion piece 17 is provided. There are a total of four clamp pin insertion pieces 17, two on each of the two sides extending in the X-axis direction of the upper opening edge of the housing 11. A clamp hole 17a is formed in the clamp pin insertion piece 17, penetrating in the X-axis direction.

[0050] Figure 10 is a plan view of the underbase unit 40 according to the second embodiment. Figure 11 is an enlarged view of area B shown in Figure 10. As shown in Figure 10, the underbase unit 40 has multiple mounting holes 40a into which multiple second connectors 41 are attached. The multiple (3) mounting holes 40a are spaced apart in the Y-axis direction and extend parallel to the X-axis direction. The multiple second connectors 41 are attached to each mounting hole 40a, forming a row in the X-axis direction.

[0051] The underbase unit 40 has multiple insertion holes 40b into which multiple clamp pin insertion pieces 17 are inserted in the Z-axis direction. The number and arrangement of the multiple insertion holes 40b correspond to the number of clamp pin insertion pieces 17 shown in Figure 9. Optical sensors 45 for checking the clamping state are provided near one of the two insertion holes 40b located on the -Y side, and near one of the two insertion holes 40b located on the +Y side.

[0052] The unit attachment / detachment mechanism 50 includes a manually operable lever unit 59 and a lock lever interlocking mechanism 52. The lever unit 59 is accessible, for example, by removing a portion of the unit cover 21 of the performance board unit 20. The lever unit 59 is located on the upper surface of the underbase unit 40, on the -X side of the multiple mounting holes 40a.

[0053] The lever unit 59 includes a movable plate 59a that can be moved in the Y-axis direction by operating a lever around an axis extending in the X-axis direction. A linear guide 60 is attached to the lower surface of the movable plate 59a, allowing it to move in the Y-axis direction. The movable plate 59a is connected to a movable member 55 of the lock lever interlocking mechanism 52. With this configuration, the movable member 55 can be moved in the Y-axis direction by operating the lever of the lever unit 59. In the second embodiment as well, a motor unit 51 may be provided instead of the lever unit 59 to make it electrically operated.

[0054] The moving member 55 is connected to a first clamp member 70A and a second clamp member 70B via a motion conversion mechanism 56. The first clamp member 70A is positioned on the -Y side of the underbase unit 40. A pair of first clamp pins 71A, with their tips facing the +X side, are attached to the first clamp member 70A. The first clamp pins 71A are positioned in a location corresponding to the insertion hole 40b. The first clamp member 70A is connected to a linear guide 60 and is movable in the X-axis direction.

[0055] The second clamping member 70B is positioned on the +Y side of the underbase unit 40. A pair of second clamping pins 71B, with their tips facing the -X side, are attached to the second clamping member 70B. The second clamping pins 71B are positioned corresponding to the insertion holes 40b. The second clamping member 70B is connected to the linear guide 60 and is movable in the X-axis direction.

[0056] The motion conversion mechanism 56 includes a first elongated hole 57A provided on the moving member 55 and extending parallel to the aforementioned elongated hole 57, and a first cam follower 58A provided on the first clamping member 70A and movable along the inner wall of the first elongated hole 57A. In other words, the first clamping member 70A moves in the X-axis direction together with the aforementioned engaging member 54. The first elongated hole 57A is formed at the -Y side end of the moving member 55.

[0057] When the engaging member 54 moves to the +X side, the first clamping member 70A also moves to the +X side, the second connector 41 becomes fixed, and the first clamping pin 71A is inserted into the clamping pin insertion piece 17, resulting in a clamped state. When the engaging member 54 moves to the -X side, the first clamping member 70A also moves to the -X side, the second connector 41 becomes unfixed, and the first clamping pin 71A is removed from the clamping pin insertion piece 17, resulting in an unclamped state.

[0058] The motion conversion mechanism 56 includes a second elongated hole 57B provided on the moving member 55 and oriented symmetrically to the first elongated hole 57A with respect to the axis of symmetry L extending in the X-axis direction in a plan view, and a second cam follower 58B provided on the second clamping member 70B and movable along the inner wall of the second elongated hole 57B. In other words, the second clamping member 70B moves in the opposite direction to the engagement member 54 and the first clamping member 70A described above. The second elongated hole 57B is formed at the +Y side end of the moving member 55. Note that the second elongated hole 57B does not need to be positioned at an equidistant distance from the first elongated hole 57A with respect to the axis of symmetry L, as long as it is oriented symmetrically to the first elongated hole 57A.

[0059] As shown in Figure 11, the second cam follower 58B is attached to the -X end of the second clamp member 70B via a mounting piece 70a. The outer diameter of the second cam follower 58B is slightly smaller than the width of the second slot 57B, allowing it to roll along the first inner wall surface 57ba or the second inner wall surface 57ab of the second slot 57B.

[0060] For example, when the movable member 55 moves to the +Y side, the second cam follower 58B rolls along the first inner wall surface 57ba and moves to one end 58a on the +X side of the second elongated hole 57B. When the second cam follower 58B moves to one end 58a of the second elongated hole 57B, the second clamp member 70B moves to the +X side together with the second cam follower 58B, so that the second clamp pin 71B is removed from the clamp pin insertion piece 17 and moves to the non-clamped position 71a, which is the non-clamped state.

[0061] Furthermore, when the movable member 55 moves to the -Y side, the second cam follower 58B rolls along the second inner wall surface 57ab opposite the first inner wall surface 57ba and moves to the other end 58b of the second elongated hole 57B on the -X side. When the second cam follower 58B moves to the other end 58b of the second elongated hole 57B, the second clamp member 70B moves to the -X side together with the second cam follower 58B, so that the second clamp pin 71B moves to the clamp position 71b where it is inserted into the clamp pin insertion piece 17 and becomes clamped.

[0062] As described above, the second embodiment includes a first clamp member 70A and a second clamp member 70B provided on the performance board unit 20, which, when moved in the X-axis direction in a plan view, switch the performance board unit 20 from a clamped state in which it cannot be attached to the main unit 10 to an unclamped state in which it can be attached to the main unit 10. The motion conversion mechanism 56 includes a first elongated hole 57A provided on the moving member 55 and extending parallel to the elongated hole 57, a first cam follower 58A provided on the first clamp member 70A and movable along the inner wall of the first elongated hole 57A, a second elongated hole 57B provided on the moving member 55 and oriented symmetrically with respect to the first elongated hole 57A with respect to the axis of symmetry L extending in the X-axis direction in a plan view, and a second cam follower 58B provided on the second clamp member 70B and movable along the inner wall of the second elongated hole 57B. With this configuration, the switching between the fixed and unlocked states of the second connector 41 can be linked to the switching between the clamped and unclamped states of the first clamp member 70A and the second clamp member 70B. Furthermore, since the first clamp member 70A and the second clamp member 70B move in opposite directions in the X-axis direction, it is possible to prevent the clamps from coming loose due to the sliding of the performance board unit 20 in the X-axis direction.

[0063] While preferred embodiments of the present invention have been described and explained above, it should be understood that these are illustrative and should not be considered limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the invention. Therefore, the present invention should not be considered limited by the foregoing description, but rather limited by the claims.

[0064] For example, in the above embodiment, three engaging members 54 were provided, but if the second connectors 41 are provided in a single row, there may be only one engaging member 54.

[0065] Furthermore, without departing from the spirit of the present invention, the components in the above-described embodiments may be replaced with well-known components as appropriate, and the above-described embodiments and modifications may be combined as appropriate. [Explanation of Symbols]

[0066] 1. Tester (semiconductor testing equipment) 1A Standby position 1B Examination location 2 Prova 2A Tester Relocation Device 2B Stage Equipment 2C wafer transport equipment 3. Probe card (device under test) 10 Main Unit 11 cabinets 12 Storage Unit 13. Circuit board holder 14 Positioning pins 15. Clamping device 16 Lock Bracket 17. Clamp pin insertion piece 17a Clamp hole 20 Performance board units (signal transmission units) 21 Unit Cover 22 Opening 23 Device mounting area 24 Performance Board 25 Frame Unit 26 Rock plunger 30 circuit board units 31 First Connector 40 Underbass Unit 40a Mounting hole 40b Insertion hole 41. Second connector 41a Lock lever 42 Engaging piece 42a Positioning hole 42b Clamp hole 43 Mounting piece 45 Optical Sensors 50 Unit Detachable Mechanism 51 Motor Unit 51a Ball screw 51b Nut 52 Lock lever interlocking mechanism 53 Cover component 54 Engaging member 54a Engagement groove 54b Bolt 54c Mounting piece 55 Movable member 56 Motion conversion mechanism 57 long hole 57A 1st long hole 57ab Second inner wall surface 57B 2nd long hole 57ba First inner wall surface 58 Cam Follower 58a One end 58A First cam follower 58b Other end 58B Second Cam Follower 59 Lever Unit 59a Mobile Plate 60 Linear Guide 61 rails 62 Slide Blocks 70a Mounting piece 70A First clamp member 70B Second clamping member 71a Non-clamped position 71A First clamping pin 71b Clamp position 71B Second clamping pin 100 Inspection Systems Area A B area L axis of symmetry W wafer

Claims

1. A signal transmission unit to which the device under test for semiconductor circuit testing is attached, A plurality of substrate units electrically connected to the device under measurement via the signal transmission unit, The unit comprises a main body unit having a housing section that accommodates the plurality of substrate units, The signal transmission unit is detachably attached to the main unit with the opening of the housing closed. Semiconductor testing equipment.

2. Multiple first connectors provided on the multiple substrate units, The signal transmission unit is provided with a plurality of second connectors connected to the plurality of first connectors, Multiple locking levers are provided on the plurality of second connectors and are movable between a fixing position for fixing the plurality of second connectors and the plurality of first connectors and a release position for releasing the fixing between the plurality of second connectors and the plurality of first connectors. The signal transmission unit is provided with a lock lever interlocking mechanism that moves the plurality of lock levers between the fixed position and the unlocked position, The semiconductor testing apparatus according to claim 1.

3. The aforementioned lock lever interlocking mechanism is One or more engaging members are provided to be movable in a first linear direction in a plan view and to engage with the plurality of lock levers, A movable member is provided so as to be movable in a second linear direction perpendicular to the first linear direction in a plan view, The system includes a motion conversion mechanism that converts the movement of the moving member in the second linear direction into the movement of the engaging member in the first linear direction. The semiconductor testing apparatus according to claim 2.

4. The motion conversion mechanism is The moving member is provided with an elongated hole that extends in an oblique direction intersecting the first linear direction and the second linear direction in a plan view, The engaging member is provided with a cam follower that is movable along the inner wall of the elongated hole, The semiconductor testing apparatus according to claim 3.

5. The signal transmission unit is provided with a first clamping member and a second clamping member that move in the first linear direction in a plan view, thereby switching the signal transmission unit between a clamped state in which it cannot be attached to the main unit and an unclamped state in which it can be attached to the main unit. The motion conversion mechanism is The movable member is provided with a first elongated hole that extends parallel to the elongated hole, A first cam follower is provided on the first clamp member and is movable along the inner wall of the first elongated hole, A second elongated hole is provided on the moving member and is oriented symmetrically to the first elongated hole with respect to the axis of symmetry extending in the first linear direction in a plan view, The second clamp member is provided with a second cam follower that is movable along the inner wall of the second elongated hole, The semiconductor testing apparatus according to claim 4.

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