Retainers, top rings, and substrate processing equipment

Abstract

This suppresses wear on the outer edge of the retainer and improves the uniformity of the substrate's polishing profile. [Solution] The retainer 314 is positioned to surround the substrate in a top ring that presses the substrate toward the polishing pad. The retainer 314 includes a first member 314a having a sliding surface with respect to the polishing pad, a second member 314b having a sliding surface with respect to the polishing pad located outside the sliding surface of the first member 314a and having higher wear resistance to sliding with the polishing pad than the wear resistance of the first member 314a, and a coupling mechanism 320 that connects the first member 314a and the second member 314b.

Description

Technical Field

[0001] This application relates to a retainer, a top ring, and a substrate processing apparatus.

Background Art

[0002] There is a CMP (Chemical Mechanical Polishing) apparatus, which is a type of substrate processing apparatus used in semiconductor processing steps. CMP apparatuses can be broadly classified into "face-up type (the substrate's polished surface faces upward)" and "face-down type (the substrate's polished surface faces downward)" depending on the direction in which the polished surface of the substrate faces.

[0003] A face-down chemical mechanical polishing apparatus includes a top ring that holds a substrate and a polishing table to which a polishing pad is attached, and is configured to polish the substrate by pressing the substrate against the polishing pad while rotating the top ring and the polishing table. Here, when polishing the substrate, the substrate may come off the top ring and fly out to the outside of the top ring.

[0004] On the other hand, for example, Patent Document 1 discloses a polishing apparatus in which a retainer is disposed around the substrate to prevent the substrate from flying out when the top ring is rotating. This polishing apparatus can prevent the substrate from flying out by disposing the retainer and can improve the polishing profile of the substrate by pressing the polishing pad with the retainer.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, conventional techniques do not take into account the fact that the polishing profile of the substrate becomes uneven due to wear on the outer edge of the retainer.

[0007] In other words, when polishing a substrate, the retainer slides against the polishing pad, causing wear on the retainer's sliding surface. Here, stronger pressure is applied to the outer edge of the retainer's sliding surface than to other parts, so as the polishing process continues, the outer edge of the retainer's sliding surface wears down more significantly than other parts. When polishing a substrate using such a retainer, the protrusion of the polishing pad between the substrate and the retainer becomes larger, causing the outer edge of the substrate to come into strong contact with the polishing pad. As a result, the polishing rate of the outer edge of the substrate becomes higher than that of other parts of the substrate, and consequently, the polished profile of the substrate becomes uneven.

[0008] Therefore, one of the objectives of this invention is to suppress wear on the outer peripheral edge of the retainer and improve the uniformity of the substrate polishing profile. [Means for solving the problem]

[0009] According to one embodiment, a retainer is disposed in a top ring that presses a substrate toward a polishing pad, the retainer comprising: a first member having a sliding surface with respect to the polishing pad; a second member having a sliding surface with respect to the polishing pad, disposed outside the sliding surface of the first member, and having abrasion resistance to sliding with the polishing pad that is higher than the abrasion resistance of the first member; and a coupling mechanism that connects the first member and the second member. It will be disclosed. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a plan view showing the overall configuration of a CMP apparatus as an example of a substrate processing apparatus according to one embodiment of the present invention. [Figure 2] Figure 2 is a schematic perspective view of the polishing apparatus. [Figure 3] Figure 3 is a schematic cross-sectional view of the top ring. [Figure 4] Figure 4 is a schematic cross-sectional view of the retainer. [Figure 5] Figure 5 is a diagram illustrating the connection between the first member and the second member. [Figure 6] Figure 6 is a diagram illustrating the connection between the first member and the second member. [Figure 7] Figure 7 is a diagram illustrating the connection between the first member and the second member. [Figure 8] Figure 8 is a diagram illustrating the connection between the first member and the second member. [Figure 9] Figure 9 is a diagram illustrating the connection between the first member and the second member. [Figure 10] Figure 10 is a diagram illustrating the connection between the first member and the second member. [Figure 11] Figure 11 is a diagram illustrating the connection between the first member and the second member. [Figure 12] Figure 12 is a diagram illustrating the connection between the first member and the second member. [Modes for carrying out the invention]

[0011] Hereinafter, a retainer, a top ring, and a substrate processing apparatus according to one embodiment of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant descriptions are omitted.

[0012] <Polishing equipment> Figure 1 is a plan view showing the overall configuration of a CMP apparatus as an example of a substrate processing apparatus according to one embodiment of the present invention. As shown in Figure 1, the CMP apparatus 1000 comprises a substantially rectangular housing 1. The interior of the housing 1 is divided by partition walls 1a and 1b into a load / unload apparatus 2, a polishing apparatus 3, and a cleaning apparatus 4. The load / unload apparatus 2, the polishing apparatus 3, and the cleaning apparatus 4 are each assembled independently and exhausted independently. The cleaning apparatus 4 also includes a power supply member that supplies power to the polishing apparatus and a control device 5 that controls the processing operation.

[0013] <Load / Unload device> The load / unload device 2 includes two or more (four in this embodiment) front load members 20 on which wafer cassettes for stocking a large number of objects to be processed (e.g., disc-shaped wafers (substrates)) are mounted. These front load members 20 are positioned adjacent to the housing 1 and are arranged along the width direction (perpendicular to the longitudinal direction) of the polishing device. The front load members 20 can be equipped with open cassettes, SMIF (Standard Manufacturing Interface) pods, or FOUP (Front Opening Unified Pods). Here, SMIF and FOUP are sealed containers that house wafer cassettes inside and are covered with partitions, thereby maintaining an environment independent of the external space.

[0014] Furthermore, a travel mechanism 21 is installed in the load / unload device 2 along the arrangement of the front load members 20. On the travel mechanism 21, a wafer cassette is movable along the arrangement direction. Two transfer robots (loader, transfer mechanism) 22 are installed. The transfer robot 22 can access the wafer cassette mounted on the front load member 20 by moving on the traveling mechanism 21. Each transfer robot 22 has two hands, one on the upper side and one on the lower side. The upper hand is used when returning the processed wafer to the wafer cassette. The lower hand is used when taking out the wafer before processing from the wafer cassette. Thus, the upper and lower hands can be used properly. Further, the lower hand of the transfer robot 22 is configured to be able to invert the wafer.

[0015] <Polishing device> The polishing device 3 is an area where wafer polishing (planarization) is performed. The polishing device 3 includes a first polishing device 3A, a second polishing device 3B, a third polishing device 3C, and a fourth polishing device 3D. The first polishing device 3A, the second polishing device 3B, the third polishing device 3C, and the fourth polishing device 3D are arranged along the longitudinal direction of the polishing device as shown in FIG. 1.

[0016] As shown in FIG. 1, the first polishing device 3A includes a polishing table 30A to which a polishing pad (abrasive) 10 having a polishing surface is attached, a top ring 31A for holding the wafer and pressing it against the polishing pad 10 on the polishing table 30A for polishing, a polishing liquid supply nozzle 32A for supplying a polishing liquid or a dressing liquid (e.g., pure water) to the polishing pad 10, a dresser 33A for dressing the polishing surface of the polishing pad 10, and an atomizer 34A for spraying a mixed fluid of a liquid (e.g., pure water) and a gas (e.g., nitrogen gas) or a liquid (e.g., pure water) to remove slurry, polishing products on the polishing surface, and polishing pad residues by dressing.

[0017] Similarly, the second polishing device 3B includes a polishing table 30B, a top ring 31B, a polishing fluid supply nozzle 32B, a dresser 33B, and an atomizer 34B. The third polishing device 3C includes a polishing table 30C, a top ring 31C, a polishing fluid supply nozzle 32C, a dresser 33C, and an atomizer 34C. The fourth polishing device 3D includes a polishing table 30D, a top ring 31D, a polishing fluid supply nozzle 32D, a dresser 33D, and an atomizer 34D.

[0018] Since the first polishing device 3A, the second polishing device 3B, the third polishing device 3C, and the fourth polishing device 3D have the same configuration, only the first polishing device 3A will be described below.

[0019] Figure 2 is a schematic perspective view of the first polishing apparatus 3A. The top ring 31A is supported by a rotating shaft 36. A polishing pad 10 is attached to the upper surface of the polishing table 30A. The upper surface of the polishing pad 10 forms a polishing surface for polishing the substrate W. The top ring 31A and the polishing table 30A are configured to rotate around their axes as indicated by the arrows. The substrate W is held by vacuum suction on the lower surface of the top ring 31A. During polishing, polishing fluid is supplied to the polishing surface of the polishing pad 10 from the polishing fluid supply nozzle 32A, and the substrate W to be polished is pressed against the polishing surface of the polishing pad 10 by the top ring 31A and polished.

[0020] <Conveying mechanism> Next, the transport mechanism for transporting wafers will be described. As shown in Figure 1, the first linear transporter 6 is positioned adjacent to the first polishing apparatus 3A and the second polishing apparatus 3B. The first linear transporter 6 transports wafers between four transport positions (in order from the load / unloading apparatus side, these are designated as the first transport position TP1, the second transport position TP2, the third transport position TP3, and the fourth transport position TP4) along the direction in which the polishing apparatuses 3A and 3B are arranged. This is a mechanism for transporting C.

[0021] Furthermore, a second linear transporter 7 is positioned adjacent to the third polishing apparatus 3C and the fourth polishing apparatus 3D. The second linear transporter 7 is a mechanism for transporting wafers between three transport positions (referred to as the fifth transport position TP5, the sixth transport position TP6, and the seventh transport position TP7, in order from the load / unloading apparatus side) along the direction in which the polishing apparatuses 3C and 3D are arranged.

[0022] The wafer is transported to polishing machines 3A and 3B by the first linear transporter 6. The top ring 31A of the first polishing machine 3A moves between the polishing position and the second transport position TP2 by the swinging motion of the top ring head. Therefore, the transfer of the wafer to the top ring 31A takes place at the second transport position TP2. Similarly, the top ring 31B of the second polishing machine 3B moves between the polishing position and the third transport position TP3, and the transfer of the wafer to the top ring 31B takes place at the third transport position TP3. The top ring 31C of the third polishing machine 3C moves between the polishing position and the sixth transport position TP6, and the transfer of the wafer to the top ring 31C takes place at the sixth transport position TP6. The top ring 31D of the fourth polishing machine 3D moves between the polishing position and the seventh transport position TP7, and the transfer of the wafer to the top ring 31D takes place at the seventh transport position TP7.

[0023] A lifter 11 is positioned at the first transport position TP1 to receive wafers from the transport robot 22. The wafers are transferred from the transport robot 22 to the first linear transporter 6 via the lifter 11. A shutter (not shown) is provided in the partition wall 1a between the lifter 11 and the transport robot 22, and the shutter opens when the wafers are being transported to allow the wafers to be transferred from the transport robot 22 to the lifter 11. A swing transporter 12 is positioned between the first linear transporter 6, the second linear transporter 7, and the cleaning device 4. The swing transporter 12 has a hand that can move between the fourth transport position TP4 and the fifth transport position TP5. The transfer of wafers from the first linear transporter 6 to the second linear transporter 7 is performed by the swing transporter 12. The wafers are then transported by the second linear transporter 7 to the third polishing device 3C and / or the fourth polishing device 3D. Furthermore, the wafers polished in the polishing device 3 are transported to the cleaning device 4 via the swing transporter 12.

[0024] The first linear transporter 6 and the second linear transporter 7 each have multiple transport stages (not shown), as described in Japanese Patent Publication No. 2010-50436. This allows for the use of separate transport stages, for example, for transporting unpolished wafers to each transport position and for transporting polished wafers from each transport position. This enables the wafers to be quickly transported to the transport position to start polishing, and the polished wafers to be quickly sent to the cleaning device.

[0025] <Top Ring> Figure 3 is a schematic cross-sectional view of the top ring. The top ring 31A comprises a rotating shaft 36, a top ring body 312 fixed to the rotating shaft 36, and a retainer 314 attached to the top ring body 312. The retainer 314 is an annular member positioned in the top ring 31A to surround the substrate W, and is a member for preventing the substrate W from flying out of the top ring 31A during the polishing process. The retainer 314 is positioned to surround the substrate W when viewed from a direction perpendicular to the polishing surface, which is the surface of the substrate W to be polished. Here, perpendicular does not have to be strictly perpendicular, but may be approximately perpendicular.

[0026] Figure 4 is a schematic cross-sectional view of the retainer. Figure 4 shows the area enclosed by the dashed line in Figure 3. This expands the scope. Figures 4(a) to 4(h) show various patterns of the retainer. As shown in Figure 4, the retainer 314 includes a first member 314a having a sliding surface with respect to the polishing pad 10. More specifically, the first member 314a has a sliding surface that slides against the polishing pad 10 when the polishing surface is pressed toward the polishing pad 10. In one example, the first member 314a is formed in an annular shape. The retainer 314 also includes a second member 314b having a sliding surface with respect to the polishing pad 10, which is located outside the sliding surface of the first member 314a. More specifically, the second member 314b has a sliding surface that slides against the polishing pad 10 when the polishing surface is pressed toward the polishing pad 10. In one example, the second member 314b is formed in an annular shape. The second member 314b is made of a material that has higher wear resistance to sliding against the polishing pad 10 than the wear resistance of the first member 314a. In other words, if the first member 314a has a first level of wear resistance against the polishing pad 10, the second member 314b is made of a material that has a second level of wear resistance against the polishing pad 10 that is greater than the first level of wear resistance. As a result, the second member 314b experiences less wear than the first member 314a when sliding against the polishing pad 10. For example, if the first member 314a has a first level of hardness, a first level of Young's modulus, or a first level of sliding properties, the second member 314b is made of a material that has a second level of hardness, a second level of Young's modulus, or a second level of sliding properties that is greater than the first level of hardness, a first level of Young's modulus, or a first level of sliding properties.

[0027] As shown in Figure 4(a), the first member 314a may have a base portion 314a-1 positioned inside the second member 314b, and a flange portion 314a-2 extending from the base portion 314a-1 to the upper part of the second member 314b. As shown in Figure 4(b), the second member 314b may have a sliding surface positioned outside the sliding surface of the first member 314a, spaced apart from the first member 314a. As shown in Figure 4(c), the upper part of the second member 314b may protrude outward. As shown in Figure 4(d), the first member 314a may be positioned outside the upper part of the second member 314b.

[0028] Furthermore, as shown in Figures 4(e) and 4(f), the second member 314b may be positioned only at the outer corners of the sliding surface of the first member 314a with respect to the polishing pad 10. As shown in Figure 4(g), the first member 314a has a plurality of (two in this embodiment) sliding surfaces arranged at intervals, and the second member 314b may have a sliding surface positioned outside the sliding surface of the first member 314a, spaced apart from the sliding surface of the first member 314a. Also, as shown in Figure 4(h), the second member 314b may have a plurality of (two in this embodiment) sliding surfaces positioned outside the sliding surface of the first member 314a, spaced apart from the sliding surface of the first member 314a, and the sliding surfaces of the plurality of second members 314b may be spaced apart from each other.

[0029] What is common to the various patterns in Figures 4(a) to 4(h) is that the sliding surface of the retainer 314 with the polishing pad 10 has a first member 314a positioned on the inside and a second member 314b positioned on the outside (outermost periphery). According to this embodiment, wear of the outer peripheral edge of the retainer 314 can be suppressed and the uniformity of the polishing profile of the substrate can be improved. That is, since the second member 314b, which has higher wear resistance to the polishing pad 10 than the wear resistance of the first member 314a, is positioned at the outer peripheral edge of the retainer 314, even if the polishing process of the substrate W is continued, the outer peripheral edge of the sliding surface of the retainer 314 is less likely to wear down significantly compared to other parts. Therefore, when polishing a substrate using such a retainer 314, it is possible to suppress the excessive protrusion of the polishing pad between the substrate W and the retainer 314, so that the outer peripheral part of the substrate W is less likely to come into strong contact with the polishing pad 10. Therefore, the polishing rate of the outer periphery of the substrate W becomes equivalent to that of other parts of the substrate W, and as a result, the uniformity of the substrate's polishing profile can be improved.

[0030] Next, the coupling mechanism for joining the first member 314a and the second member 314b will be described. Figure 5 is a diagram illustrating the connection between the first member 314a and the second member 314b.

[0031] As shown in Figure 5, the second member 314b has a base portion 314b-1 positioned outside the first member 314a, and a flange portion 314b-2 that extends from the base portion 314b-1 to the upper part of the first member 314a. Multiple flange portions 314b-2 (eight in this embodiment) are formed along the circumferential direction of the retainer 314, spaced apart from one another.

[0032] The coupling mechanism 320 includes an alignment hole 322 that penetrates the flange portion 314b-2 and reaches the interior of the first member 314a, and an alignment pin 324 that protrudes downward from the top ring body 312 of the top ring 31A and is inserted into the alignment hole 322. The coupling mechanism 320 also includes a screw hole 326 that penetrates the top ring body 312 and reaches the interior of the first member 314a, and a screw member 328 that is inserted into the screw hole 326 and fixes the first member 314a to the top ring body 312.

[0033] By providing a screw hole 326 in the first member 314a and a flange portion 314b-2 (step) for hooking in the second member 314b, the first member 314a can be fixed to the top ring body 312 with a screw member 328 (bolt), and at the same time, the second member 314b can also be fixed. The positional relationship between the first member 314a and the second member 314b can be adjusted using the alignment pin 324 provided on the top ring body 312. Alternatively, the second member 314b may be provided with a screw hole and the first member 314a may be provided with a flange portion (step) for hooking.

[0034] Figures 6 to 8 illustrate the connection between the first member and the second member. As shown in Figures 6 to 8, the first member 314a has a base portion 314a-1 positioned inside the second member 314b, and a flange portion 314a-2 that extends from the base portion 314a-1 to the upper part of the second member 314b.

[0035] The coupling mechanism 330 includes an annular groove 332 formed at the contact point between the base portion 314a-1 and the second member 314b, and a rod-shaped fitting member 334 positioned in the groove 332. Figure 6 shows the state in which the fitting member 334 is being inserted into the groove 332, and Figure 7 shows the state in which the fitting member 334 has been fully inserted into the groove 332.

[0036] Furthermore, the coupling mechanism 330 includes a pin hole 336 that penetrates the flange portion 314a-2 and reaches the interior of the second member 314b, and a rotation-preventing pin 338 inserted into the pin hole 336. As shown in Figures 7 and 8, the coupling mechanism 330 further includes an insertion opening 339 that communicates with the groove 332 from the outside of the second member 314b. The fitting member 334 is inserted into the groove 332 via the insertion opening 339 and positioned in the groove 332.

[0037] In this embodiment, a rod-shaped fitting member 334 is inserted into a groove 332 formed between the base portion 314a-1 and the second member 314b. The fitting member 334 is elastic and is inserted through an insertion opening 339 provided in the second member 314b. The first member 314a and the second member 314b are constrained vertically by the fitting member 334 and also constrained rotationally by the rotation-retaining pin 338. The fitting member 334 may be made of a resin such as polyvinyl chloride or of spring steel metal. The rotation-retaining pin 338 may also be made of a resin or a metal such as stainless steel. The insertion opening 339 may be filled with a sealant such as silicone rubber to prevent polishing slurry from entering the interior. According to this embodiment, the first member 314a can absorb the upward and lateral forces that the second member 314b receives during polishing.

[0038] Figure 9 is a diagram illustrating the connection between the first member and the second member. Thus, the first member 314a has a base portion 314a-1 positioned inside the second member 314b, and a flange portion 314a-2 that extends from the base portion 314a-1 to the upper part of the second member 314b.

[0039] The coupling mechanism 340 includes a first flow path 341 formed in an annular shape at the contact portion between the flange portion 314a-2 and the second member 314b, and a plurality of first holes 342 communicating with the first flow path 341 from the upper surface of the flange portion 314a-2. The coupling mechanism 340 also includes a first fixing member 343 that fills the first flow path 341 and the plurality of first holes 342. More specifically, the plurality of first holes 342 include a first injection hole 342-1 communicating with the first flow path 341 from the upper surface of the flange portion 314a-2, and a first air vent hole 342-2 communicating with the first flow path 341 from the upper surface of the flange portion 314a-2. The first fixing member 343 is formed by being introduced into the first flow path 341 via the first injection hole 342-1, filling the first flow path 341, the first injection hole 342-1, and the first air vent hole 342-2, and curing, and is made of, for example, epoxy resin.

[0040] Furthermore, the coupling mechanism 340 includes a second flow path 345 formed in an annular shape at the contact portion between the base portion 314a-1 and the second member 314b, and a plurality of second holes 346 communicating with the second flow path 345 from the inner surface of the base portion 314a-1. The coupling mechanism 340 also includes a second fixing member 347 that fills the second flow path 345 and the plurality of second holes 346. More specifically, the plurality of second holes 346 include a second injection hole 346-1 communicating with the second flow path 345 from the inner surface of the base portion 314a-1, and a second air vent hole 346-2 communicating with the second flow path 345 from the inner surface of the base portion 314a-1. The second fixing member 347 is formed by flowing into the second flow path 345 through the second injection hole 346-1, filling the second flow path 345, the second injection hole 346-1, and the second air vent hole 346-2, and curing, and is made of, for example, epoxy resin.

[0041] As in this embodiment, the first member 314a and the second member 314b can be joined by pouring resin or the like into the channels provided in the first member 314a and the second member 314b and allowing it to harden inside. For example, a two-component epoxy resin can be used as the resin to be poured. In this embodiment, since the first air vent hole 342-2 is formed at the location furthest from the first injection hole 342-1 and in the middle of the first channel 341, air and excess epoxy resin can be removed, preventing voids from remaining inside the first channel 341. Also, in this embodiment, since the second air vent hole 346-2 is formed at the location furthest from the second injection hole 346-1 and in the middle of the second channel 345, air and excess epoxy resin can be removed, preventing voids from remaining inside the second channel 345.

[0042] Figures 10 and 11 illustrate the connection between the first member and the second member. As shown in Figures 10 and 11, the connection mechanism 350 comprises a first thread 352 formed on the outer circumferential surface of the first member 314a and a second thread 354 formed on the inner circumference of the second member 314b. The second thread 354 is formed on the outer circumferential surface of the first member 314a so as to screw into the first thread 352.

[0043] Furthermore, the coupling mechanism 350 includes a pin hole 356 formed at the contact portion between the first member 314a and the second member 314b, which are coupled by screwing together the first thread 352 and the second thread 354, and a rotation-preventing pin 358 inserted into the pin hole 356.

[0044] According to this embodiment, as shown in Figure 11, the second member 314b can be joined to the first member 314a by screwing it in. After joining, a top surface hole is machined to form a pin hole 356, and a rotation-preventing pin 358, such as an Enzart or ring component, is inserted into the pin hole. By press-fitting into hole 356, permanent rotation prevention after joining can be achieved.

[0045] Figure 12 is a diagram illustrating the joining of the first member and the second member. As shown in Figure 12, the joining mechanism 360 comprises a tapered outer surface 362 of the first member 314a and an inner surface 364 of the second member 314b that is tapered to join with the outer surface 362 of the first member 314a. The first member 314a and the second member 314b are joined by rotational friction by rotating at least one of the first member 314a and the second member 314b so that the outer surface 362 of the first member 314a and the inner surface 364 of the second member 314b rub against each other.

[0046] More specifically, a disc-shaped first member 314a is attached to jig 1, and a rectangular plate-shaped second member 314b with a circular hole in the center is attached to jig 2. Jigs 1 and 2 are configured such that one side rotates and the other is fixed, or that they rotate in opposite directions. In this embodiment, jig 1 rotates and jig 2 is fixed. By bringing the first member 314a and the second member 314b into contact with each other and rotating jig 1, frictional heat is generated between the outer circumferential surface 362 of the first member 314a and the inner circumferential surface 364 of the second member 314b, allowing for thermal diffusion bonding. At this time, the dimensions of the tapered portions of each member are set to interfere with each other as a melting allowance. In addition, the processed surface of the high-melting-point member may be deliberately made rough to contribute to improving the bonding strength from the low-melting-point side. After thermal diffusion bonding of the two, the retainer 314 in the final product shape is obtained by processing it into an arbitrary ring shape.

[0047] Although several embodiments of the present invention have been described above, the embodiments described above are for the purpose of facilitating understanding of the present invention and do not limit it. The present invention can be modified and improved without departing from its spirit, and of course, equivalents thereof are included in the present invention. Furthermore, any combination or omission of the components described in the claims and specification is possible to the extent that at least some of the above-mentioned problems can be solved or at least some of the effects can be achieved.

[0048] As one embodiment, the present application discloses a retainer disposed in a top ring that presses a substrate toward a polishing pad, the retainer comprising: a first member having a sliding surface with respect to the polishing pad; a second member having a sliding surface with respect to the polishing pad, disposed outside the sliding surface of the first member, and having abrasion resistance to sliding with the polishing pad that is higher than the abrasion resistance of the first member; and a coupling mechanism that connects the first member and the second member.

[0049] Furthermore, the present application discloses a retainer in which, as one embodiment, the retainer is arranged to surround the substrate in a top ring that holds the substrate and presses it toward a polishing pad, the first member is formed in an annular shape, and the second member is also formed in an annular shape.

[0050] Furthermore, the present application discloses a retainer in which, as one embodiment, the retainer is arranged to surround the substrate when viewed from a direction perpendicular to the polishing surface which is the surface of the substrate to be polished, the first member has a sliding surface that slides with the polishing pad when the polishing surface is pressed toward the polishing pad, and the second member has a sliding surface that slides with the polishing pad when the polishing surface is pressed toward the polishing pad.

[0051] Furthermore, the present application discloses a retainer in which, as one embodiment, the first member has a base portion disposed inside the second member and a flange portion extending from the base portion to the upper part of the second member.

[0052] Furthermore, in one embodiment, the present application provides that the second member is arranged on the outside of the first member. The disclosed retainer includes a base portion and a flange portion that extends from the base portion to the upper part of the first member, and the coupling mechanism includes an alignment hole that penetrates the flange portion and reaches the interior of the first member, an alignment pin that protrudes downward from the top ring body of the top ring and is inserted into the alignment hole, a screw hole that penetrates the top ring body and reaches the interior of the first member, and a screw member that is inserted into the screw hole and fixes the first member to the top ring body.

[0053] Furthermore, in one embodiment, the present application discloses a retainer in which the first member has a base portion disposed inside the second member and a flange portion extending from the base portion to the upper part of the second member, and the coupling mechanism includes an annular groove formed at the contact portion between the base portion and the second member, a rod-shaped fitting member disposed in the groove, a pin hole that penetrates the flange portion and reaches the interior of the second member, and a rotation-preventing pin inserted into the pin hole.

[0054] Furthermore, the present application discloses a retainer in which, as one embodiment, the coupling mechanism further includes an insertion opening communicating with the groove from the outside of the second member, and the fitting member is inserted into the groove via the insertion opening and positioned in the groove.

[0055] Furthermore, the present application discloses a retainer in one embodiment in which the first member has a base portion disposed inside the second member and a flange portion extending from the base portion to the upper part of the second member, and the coupling mechanism includes a first flow path formed in an annular shape at the contact portion between the flange portion and the second member, a plurality of first holes communicating with the first flow path from the upper surface of the flange portion, a first fixing member filling the first flow path and the plurality of first holes, a second flow path formed in an annular shape at the contact portion between the base portion and the second member, a plurality of second holes communicating with the second flow path from the inner surface of the base portion, and a second fixing member filling the second flow path and the plurality of second holes.

[0056] Furthermore, the present application discloses a retainer in which, as one embodiment, the plurality of first holes include a first injection hole communicating with the first flow path from the upper surface of the flange portion and a first air vent hole communicating with the first flow path from the upper surface of the flange portion, and the first fixing member is flowed into the first flow path through the first injection hole and filled and hardened in the first flow path, the first injection hole and the first air vent hole; and the plurality of second holes include a second injection hole communicating with the second flow path from the inner surface of the base portion and a second air vent hole communicating with the second flow path from the inner surface of the base portion, and the second fixing member is flowed into the second flow path through the second injection hole and filled and hardened in the second flow path, the second injection hole and the second air vent hole.

[0057] Furthermore, in one embodiment, the present application discloses a retainer in which the coupling mechanism includes a first thread formed on the outer circumferential surface of the first member, a second thread formed on the inner circumference of the second member so as to screw into the first thread, a pin hole formed at the contact portion between the first member and the second member, which are coupled by screwing the first thread and the second thread together, and a rotation-preventing pin inserted into the pin hole.

[0058] Furthermore, the present application discloses a retainer in which, as one embodiment, the coupling mechanism includes a tapered outer surface of the first member and an inner surface of the second member tapered to join with the outer surface of the first member, and the first member and the second member are rotationally friction-joined by rotating at least one of the first member and the second member to rub against the outer surface of the first member and the inner surface of the second member.

[0059] Furthermore, in one embodiment, the present invention relates to a top that holds the substrate and presses toward the polishing pad. A top ring is disclosed, comprising a rotating shaft, a top ring body fixed to the rotating shaft, and a retainer as described above attached to the top ring body.

[0060] Furthermore, the present application discloses, as one embodiment, a substrate processing apparatus having the top ring described above and a polishing table configured to hold a polishing pad. [Explanation of Symbols]

[0061] 3 Polishing equipment 10 polishing pads 30A Polishing Table 31A Top Ring 312 Top ring body 314 Retainer 314a First member 314a-1 Base section 314a-2 Flange section 314b Second member 314b-1 Base section 314b-2 Flange section 320 Coupling mechanism 322 Alignment holes 324 Alignment pins 326 threaded holes 328 Screw component 330 Coupling mechanism 332 Groove 334 Fitting member 336 pin holes 338 Rotation stop pin 339 Insertion port 340 Coupling mechanism 341 First channel 342 First hole 342-1 First injection port 342-2 First air vent 343 First fixing member 345 Second channel 346 Second hole 346-1 Second injection port 346-2 Second air vent 347 Second fixing member 350 Coupling mechanism 352 First thread 354 Second thread 356 pin holes 358 Rotation stopper pin 360 Coupling Mechanism 362 Outer surface 364 Inner surface 1000 CMP equipment W board

Claims

1. A retainer is positioned to surround the substrate in a top ring that presses the substrate toward a polishing pad, A first member having a sliding surface with respect to the polishing pad, A second member having a sliding surface with respect to the polishing pad, which is positioned outside the sliding surface of the first member, and having a wear resistance to sliding with the polishing pad that is higher than the wear resistance of the first member, A coupling mechanism for connecting the first member and the second member, including, Retainer.

2. The retainer is positioned to surround the substrate in a top ring that holds the substrate and presses it toward the polishing pad. The first member is formed in an annular shape, The second member is formed in an annular shape, The retainer according to claim 1.

3. The retainer is positioned to surround the substrate when viewed from a direction perpendicular to the polishing surface, which is the surface of the substrate to be polished. The first member has a sliding surface that slides against the polishing pad when the polishing surface is pressed toward the polishing pad, The second member has a sliding surface that slides against the polishing pad when the polishing surface is pressed toward the polishing pad. The retainer according to claim 2.

4. The first member has a base portion disposed inside the second member and a flange portion that extends from the base portion to the upper part of the second member. The retainer according to claim 3.

5. The second member has a base portion disposed on the outside of the first member and a flange portion that extends from the base portion to the upper part of the first member. The coupling mechanism is An alignment hole that penetrates the flange portion and reaches the interior of the first member, An alignment pin protrudes downward from the top ring body of the top ring and is inserted into the alignment hole, A screw hole that penetrates the top ring body and reaches the interior of the first member, A screw member inserted into the screw hole and used to fix the first member to the top ring body, including, The retainer according to claim 1.

6. The first member has a base portion disposed inside the second member and a flange portion that extends from the base portion to the upper part of the second member. The coupling mechanism is An annular groove is formed at the contact portion between the base portion and the second member, A rod-shaped fitting member arranged in the groove, A pin hole that penetrates the flange portion and reaches the interior of the second member, A rotation-preventing pin inserted into the aforementioned pin hole, including, The retainer according to claim 1.

7. The coupling mechanism is The second member further includes an insertion opening that communicates with the groove from the outside, The fitting member is inserted into the groove via the insertion opening and positioned in the groove. The retainer according to claim 6.

8. The first member has a base portion disposed inside the second member and a flange portion that extends from the base portion to the upper part of the second member. The coupling mechanism is A first flow channel is formed in an annular shape at the contact portion between the flange portion and the second member, A plurality of first holes communicating with the first flow path from the upper surface of the flange portion, The first flow path and the first fixing member filled in the plurality of first holes, A second flow channel is formed in an annular shape at the contact portion between the base portion and the second member, Multiple second holes communicating with the second flow path are located on the inner surface of the base portion, The second flow path and the second fixing member filled in the plurality of second holes, including, The retainer according to claim 1.

9. The plurality of first holes include a first injection hole communicating with the first flow path from the upper surface of the flange portion, and a first air vent hole communicating with the first flow path from the upper surface of the flange portion. The first fixing member is formed by being introduced into the first flow path through the first injection hole, filling the first flow path, the first injection hole, and the first air vent hole, and then hardening. The plurality of second holes include a second injection hole communicating with the second flow path from the inner surface of the base portion, and a second air vent hole communicating with the second flow path from the inner surface of the base portion. The second fixing member is formed by flowing into the second flow channel through the second injection hole, filling the second flow channel, the second injection hole, and the second air vent hole, and then hardening. The retainer according to claim 8.

10. The coupling mechanism is The first screw thread formed on the outer circumferential surface of the first member, A second thread is formed on the inner circumference of the second member so as to engage with the first thread, A pin hole is formed in the contact portion between the first member and the second member, which are joined by screwing the first thread and the second thread together, A rotation-preventing pin inserted into the aforementioned pin hole, including, The retainer according to claim 1.

11. The coupling mechanism is The tapered outer surface of the first member and The inner circumferential surface of the second member, which is tapered to join to the outer circumferential surface of the first member, Includes, The first member and the second member are joined by rotational friction by rotating at least one of the first member and the second member to rub against the outer circumferential surface of the first member and the inner circumferential surface of the second member. The retainer according to claim 1.

12. A top ring that holds the substrate and presses it toward the polishing pad, Rotating shaft and The top ring body is fixed to the aforementioned rotating shaft, A retainer according to any one of claims 1 to 11 attached to the top ring body, including, Top ring.

13. The top ring according to claim 12, A polishing table configured to hold a polishing pad, Circuit board processing equipment.

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