Wiring board module

Abstract

To provide a wiring board module that can suppress constraints on the placement of electronic components and surface wiring constraints on external substrates. [Solution] The wiring board module includes a first wiring board having a first surface on which processor components are mounted, a second wiring board having a second surface on which memory components are mounted, the second surface being parallel to the first surface and positioned away from the first wiring board, a connecting member mounted on the first and second wiring boards between the first and second wiring boards and facing a first edge of the outer shape of the processor component package in a projection view in a first direction perpendicular to the first surface, and electrically connecting the first and second wiring boards, and a plurality of support members positioned between the first and second wiring boards and supporting the first and second wiring boards, wherein the plurality of support members are positioned away from each other and each is positioned away from the connecting member.

Description

Technical Field

[0001] The present invention relates to a wiring board module.

Background Art

[0002] Patent Document 1 discloses a wiring board module in which a plurality of wiring boards are laminated and mounted using a raised board in order to suppress an increase in mounting area.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the wiring board module of Patent Document 1, in the vicinity of the mounting area of the raised board joined to the external board, there is a possibility of causing restrictions on the arrangement of electronic components and restrictions on the surface wiring of the external board.

[0005] An object of the present invention is to provide a wiring board module capable of suppressing restrictions on the arrangement of electronic components and restrictions on the surface wiring of an external board.

Means for Solving the Problems

[0006] A wiring board module as one aspect of the present invention comprises: a first wiring board having a first surface on which processor components are mounted; a second wiring board having a second surface on which memory components are mounted, wherein the second surface is parallel to the first surface and is positioned away from the first wiring board; a connecting member mounted on the first and second wiring boards between the first and second wiring boards and facing a first edge of the package outline of the processor components in a projection view in a first direction perpendicular to the first surface, thereby electrically connecting the first and second wiring boards; and a plurality of support members positioned between the first and second wiring boards and holding the first and second wiring boards, wherein the plurality of support members are positioned away from each other and each is positioned away from the connecting member. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a wiring board module that can suppress constraints on the placement of electronic components and surface wiring constraints on external substrates. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic diagram of a wiring board module according to the first embodiment. [Figure 2] This is an explanatory diagram of a wiring board module according to the first embodiment. [Figure 3] This is a schematic diagram of the wiring board module according to the first embodiment. [Figure 4] This is an exploded perspective view schematically showing the wiring board module of the second embodiment. [Figure 5] This is an exploded perspective view schematically showing the wiring board module of the third embodiment. [Figure 6] This is a schematic diagram of a wiring board module according to the fourth embodiment. [Figure 7] This is a schematic diagram of a wiring board module according to the fifth embodiment. [Figure 8] This is a schematic diagram of a wiring board module according to the sixth embodiment. [Figure 9]This is a schematic diagram of a wiring board module according to the seventh embodiment. [Figure 10] This is a perspective view showing the configuration of a conventional wiring board module. [Modes for carrying out the invention]

[0009] The embodiments of the present invention will be described in detail below with reference to the drawings. In each figure, the same reference numeral is used for identical components, and redundant explanations are omitted. [First Embodiment] Figure 1 is a schematic diagram of the wiring board module 100 of this embodiment. Figures 1(a) and 1(b) are exploded perspective views of the wiring board module 100. Figure 1(c) is a front view of the wiring board module 100. In Figure 1(c), the intermediate substrate 21 is shown as transparent for convenience.

[0010] The wiring board module 100 has a main board 10 formed by alternately stacking multiple insulating layers and conductive layers, and various mounted components mounted on the main board 10. The intermediate board module 20 is one of the mounted components mounted on the main board 10. The intermediate board module 20 includes an intermediate board 21. A RAM (Random Access Memory) 22, a passive electronic component 23, and an intermediate connecting member 24 are mounted on the intermediate board 21. In this embodiment, the RAM 22 and the passive electronic component 23 are mounted on the surface of the intermediate board 21, and the intermediate connecting member 24 is mounted on the back surface of the intermediate board 21. The intermediate board 21 is a printed circuit board formed by alternately stacking multiple insulating layers and conductive layers. In this embodiment, two RAMs 22 are mounted on the intermediate board 21. DRAM (Dynamic RAM) and SRAM (Static RAM) are envisioned as memory, but the present invention is not limited to these, and other memory may be used. The passive electronic component 23 is a general-purpose electronic component, specifically a chip resistor or ceramic capacitor. The intermediate connecting member 24 has a double-sided substrate layer structure, and through-holes are formed at regular intervals on a substrate made of insulating material, allowing conductivity between both sides. After sealing the inside of the through-holes with a sealing material such as resin (filling with sealing material), a cap plating is applied to the land surfaces (pad surfaces) on both sides, forming mounting lands directly above the through-holes.

[0011] The main board 10 has an intermediate board module 20, as well as a video processing IC 30 and a spacer (support member) 40 mounted on it. The video processing IC 30 is an IC package that incorporates a video processing processor and includes a memory area, timer function, and input / output ports in addition to the CPU core. The spacer 40 has a double-sided board layer structure, and mounting lands that can be mounted on the main board 10 are formed on one side. The main board 10 has mounting lands for mounting the intermediate board module 20, the video processing IC 30, and the spacer 40. These mounting lands include conductive pads formed in any shape on the insulating layer of the surface, and mounting lands corresponding to the electrode shape of the mounted components by the etching shape of the solder resist that protects the surface wiring etc. from the outside.

[0012] The intermediate board module 20 is mounted on the main board 10 such that the intermediate connection member mounting land 11 and the mounting land of the intermediate connection member 24 face each other. The video processing IC 30 is mounted on the main board 10 such that the video processing IC mounting land 12 and the electrodes of the video processing IC 30 face each other. The spacer 40 is mounted on the main board 10 such that the spacer mounting land 13 and the mounting land of the spacer 40 face each other.

[0013] In this embodiment, an image processing IC and RAM are implemented, but other processor components that incorporate an image processing processor or the like, and other memory components that can record tasks performed by said processor components may also be implemented.

[0014] Furthermore, in this embodiment, the back surface of the intermediate board 21 on which the RAM 22 is mounted faces the surface of the main board 10 on which the video processing IC 30 is mounted, but the present invention is not limited to this. The surface of the intermediate board 21 on which the RAM 22 is mounted may face the surface of the main board 10 on which the video processing IC is mounted. In this case, the height of the wiring board module 100 can be reduced.

[0015] The image processing IC 30 is disposed between the main board 10 and the intermediate board module 20. The image processing IC 30 has a rectangular package outer shape, and is mounted on the main board 10 such that in a projection view in a direction perpendicular to the surface on which the image processing IC 30 is mounted, one side (the first side) thereof faces one side of the intermediate connecting member 24 on the longitudinal side of the board outer shape. The spacer 40 is mounted on the main board 10 so as to be close to both ends of the package outer shape side (the second side) of the image processing IC 30 corresponding to the opposite side of the side facing the intermediate connecting member 24. The intermediate board 21 has a rectangular board outer shape, and the intermediate connecting member 24 is pre-mounted in proximity to one side thereof. By mounting the intermediate board module 20 on the main board 10 in this state, the image processing IC 30 is mounted so as to be surrounded by the intermediate connecting member 24 and the two spacers 40, and each component is mounted so as to cover the package outer shape of the image processing IC 30 with the board outer shape of the intermediate board 21. In the present embodiment, in a projection view in a direction perpendicular to the surface on which the image processing IC 30 is mounted, the sum of the projected areas of the intermediate connecting member 24 and the two spacers 40 is 50% or less of the projected area of the image processing IC 30. However, it is more preferable that the sum of the projected areas is 40% or less of the projected area of the image processing IC 30, and still more preferable that it is 30% or less.

[0016] The intermediate board module 20 is supported by three components, namely, the intermediate connecting member 24 and the two spacers 40. The image processing IC 30 has functions such as video correction, codec, and format conversion, and performs a large amount of calculations in a short time. The RAM 22 temporarily stores the calculation data performed by the image processing IC 30. In the intermediate board module 20, the wiring pattern formed inside the intermediate board 21 electrically connects each electrode of the RAM 22 and the intermediate connecting member 24. In the wiring board module 100, the image processing IC 30 and the RAM 22 are electrically connected via the wiring patterns of the main board 10, the intermediate connecting member 24, and the intermediate board 21. Since a large amount of calculation data is transmitted at high speed between the image processing IC 30 and the RAM 22, the scale of the number of wirings electrically connecting the image processing IC 30 and the RAM 22 is large. Therefore, by arranging them close to each other, the wiring area of the main board 10 can be kept compact.

[0017] Also, by arranging the intermediate substrate 21 above the video processing IC 30 and electrically connecting the video processing IC 30 and the RAM 22 via the intermediate connection member 24, the component mounting area of the main substrate 10 can be kept compact. Although the package outer shape of the RAM 22 has a larger mounting area than other electronic components such as transistors and regulator ICs, in this embodiment, the effect of reducing the mounting area of the main substrate 10 is high by adopting a three-dimensional mounting configuration. In addition, in the wiring connection between the video processing IC 30 and the RAM 22, although some of the wirings have portions passing through passive components such as resistance elements, the other wirings are configured by directly connecting the video processing IC 30 and the RAM 22. Therefore, by making the RAM 22 have a three-dimensional mounting configuration, the influence on other circuit connections can be limited to a minor range.

[0018] Figure 10 is a perspective view showing the configuration of a conventional wiring board module 900. The wiring board module 900 has a main board 90. An image processing IC 91 and a RAM 92 are mounted on the surface of the main board 90. In order for the image processing IC 91 and RAM 92 to perform stable and high-speed calculation processing, it is desirable to connect them compactly by placing bypass capacitors (bypass cons) at a short distance from their power supply electrodes. To suppress noise generated by the operation of electronic equipment from flowing into the power line, a bypass capacitor is mounted near the image processing IC 91 to lower the AC impedance to the power line and ground, thereby suppressing noise generation. Therefore, on the back surface of the main board 90, bypass capacitors for each power supply are mounted at a position directly below the power supply electrodes. The passive electronic component 93 of the image processing IC includes a bypass capacitor that is electrically connected to the power supply electrode of the image processing IC 91. The passive electronic component 94 of the RAM includes a bypass capacitor that is electrically connected to the power supply electrode of the RAM 92. To ensure stable operation during high-speed calculations, the main board 90 connects power supply wiring to the back surface via vias and through-holes from the mounting lands where the power supply electrodes are mounted, creating a short path to the bypass capacitor electrodes. As a result, the placement of the bypass capacitors is constrained by the area occupied by the package outlines of the video processing IC 91 and RAM 92, which in turn restricts the placement of other electronic components and other circuit wiring.

[0019] Figure 2 is an explanatory diagram of the wiring board module 100. Figures 2(a) and 2(b) are perspective views of the wiring board module 100. Figure 2(c) is a front view of the wiring board module 100. In Figure 2(c), the intermediate board 21 is shown transparently for convenience. Figure 2(d) is a partially enlarged view of the wiring board module 100, particularly the video processing IC 30 and the intermediate board 21.

[0020] On the back side of the main board 10, opposite to the surface on which the video processing IC 30 and intermediate connection member 24 are mounted, the video processing IC passive electronic component 14 and RAM passive electronic component 15 are mounted, as in the conventional design. The connection electrodes of the intermediate connection member 24 to the main board 10 are mounted in a narrow pitch, and bypass capacitors are mounted for the power supply electrodes among the many electrodes arranged in this narrow pitch. Therefore, the mounting area occupied by the RAM passive electronic component 15 can be contained within a smaller area than the mounting area occupied by the conventional RAM passive electronic component 94. As a result, the main board 10 and the electronic device on which the main board 10 is mounted can be miniaturized.

[0021] Furthermore, the image processing IC 30 is equipped with numerous electrodes (electrode sections) 31 and is electrically connected to other ICs in order to operate and control the wiring board module 100. For this reason, the electrodes 31 have pre-configured port assignments for each of the multiple circuit blocks, such as ports for connecting to electronic components of the imaging circuit system and ports for connecting to circuit components of the wireless communication system.

[0022] In this embodiment, as shown in Figure 2(d), the RAM communication electrodes (first electrode portion) 311 included in the electrode 31 are formed in several rows at a position adjacent to one side of the package outline of the video processing IC 30. By arranging the intermediate connecting member 24 in this manner, the wiring length of the wiring pattern connecting the video processing IC 30 and the RAM 22 on the main board 10 can be made more compact. Depending on the processor unit to which it is applied, the RAM communication electrodes 311 may not necessarily have ports concentrated on one side of the package outline. In that case, by aligning the intermediate connecting member 24 with the side where the RAM communication electrodes 311 have a high degree of integration, the wiring pattern connecting the video processing IC 30 and the RAM 22 on the main board 10 can be made more compact.

[0023] Furthermore, in this embodiment, the intermediate substrate module 20 is supported by an intermediate connecting member 24 and two spacers 40. Unlike a configuration in which the video processing IC 30 is surrounded by a frame-shaped riser substrate or the like, a certain amount of gap is formed between the three members. Other electronic components can be placed in this gap, and signal wiring patterns can also be formed on the surface conductor layer of the main substrate 10. For example, among the wiring connecting the video processing IC 30 and other ICs, there are wirings that form high-speed transmission lines and are configured to control the characteristic impedance in the wiring path within the main substrate 10. In such impedance control lines (Z control lines), a conductor layer adjacent to the wiring layer in the stacking direction may be set as a reference layer. Measures such as forming a ground plane or ground mesh line for the reference layer, or removing the conductor layer of an adjacent layer and setting the next adjacent conductor layer as the reference layer, may be taken. Such measures are appropriately optimized according to the purpose of Z control, depending on the substrate material and layer configuration of the main substrate 10. Such Z-control lines create wiring constraints mainly on adjacent layers within the projection range of the wiring area. For example, when a Z-control line is routed to an inner conductor layer of the main substrate 10, wiring constraints are created on the conductor layers on both sides adjacent to that routing. Therefore, routing the Z-control line on the surface conductor layer limits the conductor layer subject to wiring constraints to only the conductor layer one layer inward, thereby increasing the wiring density of the main substrate 10 and reducing the size of the substrate. In particular, in the case of an image processing IC 30 applied to electronic devices such as imaging devices, the substrate wiring may consist of multiple high-speed transmission lines such as imaging signals, wireless communication signals, and USB (Universal Serial Bus) standard wiring. Therefore, configuring the substrate to allow surface routing around the image processing IC 30 enables miniaturization of the substrate and reduction of the number of layers in the layer configuration. Furthermore, since the electrodes and mounting lands of the intermediate connection member 24 are formed at a narrow pitch near the electrode portion of the image processing IC 30, space can be secured to place other electronic components in the gap formed between the intermediate connection member 24 and the spacer 40. Therefore, the wiring board module 100 can arrange components with a high component mounting density.

[0024] Figure 3 is a schematic diagram of the wiring board module 100. Figure 3(a) is a schematic diagram showing a side view of the video processing IC 30 mounting section on the wiring board module 100. In this embodiment, the spacer 40 forms a mounting land 41 and is soldered to the main board 10 to hold the intermediate board module 20. No fixing or holding such as soldering is performed between the spacer 40 and the intermediate board 21; it is supported only by contact.

[0025] Here, the clearance setting in the board thickness direction between the intermediate board module 20 and the main board 10 is set appropriately, taking into consideration the component height and variations of the video processing IC 30, as well as variations in "mounting lift" of the soldered joints during component mounting. The board layer configuration of the intermediate connecting member 24 is determined to satisfy this clearance. Then, in order to stably solder the main board 10 and the intermediate connecting member 24, a certain amount of gap is left so that the intermediate board module 20 and the video processing IC 30 do not come into contact when the intermediate board module 20 is mounted. Other electronic components placed in the certain amount of gap formed between the intermediate connecting member 24 and the spacer 40 are selected so that their component height is equal to or less than that of the video processing IC 30. If an electronic component with a component height exceeding that of the video processing IC 30 is mounted, it is mounted in a position that does not project onto the outer shape of the intermediate board module 20 to avoid contact with the intermediate board module 20. By configuring it in this way, the height setting of the intermediate board module 20 can be kept to the bare minimum, and the size of the wiring board module 100 and the electronic device on which the wiring board module 100 is mounted can be suppressed.

[0026] If the spacer 40 and the intermediate substrate 21 are soldered together, the intermediate substrate module 20 will be fixedly held in multiple areas, including the area where the spacer 40 is placed and the area where the intermediate connecting member 24 is placed. In this case, if the intermediate substrate 21 or the main substrate 10 warps or deforms due to, for example, changes in ambient temperature, stress will concentrate at each solder joint according to the amount of deformation. If the stress concentration becomes excessive, the solder joint may break, potentially causing malfunction of the wiring board module 100. To improve the reliability of such solder joints, the wiring board module 100 limits the fixed holding area to only the area of ​​the intermediate connecting member 24, thereby reducing stress concentration at the solder joint when each substrate deforms. In this embodiment, the spacer 40 is mounted on the main substrate 10, but the present invention is not limited to this, and for example, the spacer 40 may be mounted on the intermediate substrate 21 and configured to be in contact with and supported by the main substrate 10. In this case, the number of component mounting pads around the video processing IC 30, where signal electrodes are concentrated and wiring density tends to be relatively high, can be reduced, thereby increasing the wiring flexibility of the main board 10.

[0027] When mounting the intermediate board module 20 to the main board 10, stable component mounting can be achieved and mounting defects can be reduced by performing solder reflow while maintaining the surface of the opposing intermediate board 21 nearly parallel to the surface of the main board 10. However, due to slight warping that occurs during the manufacturing of each board and variations in the thickness dimensions of each board, it is difficult to maintain a relative parallel state between the two boards during solder reflow. If solder reflow is performed with the two boards tilted relative to each other, solder bridging defects may occur at solder joints near areas where the boards are close together, as solder may be pushed out from the mounting pads. In addition, open defects may occur at solder joints near areas where the boards are separated. Therefore, by configuring the board thickness of the intermediate connecting member 24 and the spacer 40 to be equal and mounting the intermediate board module 20 nearly parallel to the main board 10, the occurrence of such mounting defects can be reduced. One specific method for achieving this state is to construct the intermediate connecting member 24 and the spacer 40 by panelizing them on the same worksheet. Since each individual substrate piece within the same worksheet is manufactured using essentially the same process and timing, the substrate thickness can be manufactured to be relatively uniform. Therefore, by cutting (separating) the intermediate connecting member 24 and the spacer 40 from the same worksheet, the substrate thickness of both members that support both ends of the intermediate substrate 21 can be made relatively uniform.

[0028] When taking individual pieces of the intermediate connecting member 24 and spacer 40 from a worksheet, several formation methods are possible. Among these, when the substrate outline of the individual pieces is very small and a certain level of processing accuracy is required for the external dimensions, dicing is a viable option. Dicing is a processing method commonly used, for example, when cutting out individual chip pieces from a semiconductor wafer. A proposed process involves fixing the substrate with UV tape, performing dicing using a blade, and then removing the individual pieces after a cleaning process. When adopting such a processing method, the substrate outline can be formed into a rectangular shape, and the outline can be formed by dicing in two orthogonal directions. By forming the substrate outlines of the intermediate connecting member 24 and spacer 40 using such a highly accurate processing method, the outlines of each substrate can be processed in close proximity to the mounting lands. Therefore, the external area of ​​each substrate can be made smaller, and the mounting density of mounted components near the video processing IC 30 can be increased.

[0029] As mentioned above, the intermediate connecting member 24 electrically connects the intermediate board 21 and the main board 10. There is a concern that soldering defects such as solder bridging and open circuits may occur at the solder joints between the two boards due to the effects of thermal warping deformation of the boards during reflow soldering. In the wiring board module 100, the external dimensions of the intermediate board 21 are smaller than those of the main board 10. The intermediate board 21 is processed into a roughly rectangular external shape, but the main board 10 often has a complex external shape, such as having some notches or through holes, depending on its relationship with other components of the electronic device it is mounted on. Therefore, the main board 10 tends to deform more due to thermal warping during reflow soldering than the intermediate board 21. Consequently, solder joint defects are more likely to occur at the solder joint between the intermediate connecting member 24 and the main board 10 than at the solder joint between the intermediate connecting member 24 and the intermediate board 21. Therefore, by applying a solder precoat to the mounting lands 242B of the intermediate connecting member 24 on the main board 10 before mounting the intermediate board module 20 to the main board 10, the occurrence of solder joint defects can be reduced. In the solder precoat process, for example, before forming individual pieces of the intermediate connecting member 24, a certain amount of solder is printed onto the mounting lands 242B in advance, and then the solder is melted and fixed in a reflow oven to perform a solder coating on the mounting lands 242B. After that, the components of the intermediate board module 20 are mounted, and when mounting the main board 10, solder printing is again performed on the mounting lands on the main board 10 side, and then the intermediate board module 20 with the precoat applied to the mounting lands 242B is mounted. By implementing this mounting process, the mounting height of the intermediate connecting member 24 on the main board 10 can be raised by a certain amount. By raising the height with solder, the adjustment range for the proximity and separation of boards due to thermal warping of the main board 10 can be expanded, and the occurrence of solder joint defects can be reduced.

[0030] Furthermore, by applying pre-coating to the mounting lands 242A of the intermediate connecting member 24 for mounting on the intermediate substrate 21, the risk of solder joint defects during mounting of the intermediate substrate module 20 can be reduced. However, as mentioned above, the intermediate substrate 21 has a small substrate outline, and if the design consideration is such that the residual copper ratio of each conductor layer constituting the intermediate substrate 21 is not uneven on the front and back sides, the thermal warping of the intermediate substrate 21 during reflow mounting can be kept relatively small. Also, applying pre-coating to both sides of the intermediate connecting member 24 instead of just one side increases the manufacturing process of the intermediate connecting member 24, leading to increased man-hours and manufacturing costs. Therefore, it is desirable to form the intermediate connecting member 24 so that the mounting height Hb between the intermediate connecting member 24 and the main substrate 10 is higher than the mounting height (solder joint height) Ha between the intermediate connecting member 24 and the intermediate substrate 21. Such a configuration helps to balance mounting quality and manufacturing man-hours, and it is desirable to address this with solder pre-coating on only one side.

[0031] Furthermore, as mentioned above, the intermediate connecting member 24 is configured to allow conductivity on both sides by forming through-holes 241 at regular intervals in a base material made of insulating material. The inside of the through-holes 241 is sealed with resin or the like, and then a cap plating is applied to the land surfaces on both sides to form mounting lands 242A and 242B directly above the through-hole lands. Through this processing method, the intermediate connecting member 24 can have a large number of through-holes 241 and mounting lands 242A and 242B formed at a narrow pitch. The mounting land pitch is sufficiently smaller than the mounting land pitch of the RAM 22 electrodes, which are general-purpose components, and the electrode connection parts can be concentrated, so that the component connection area can be formed at high density.

[0032] Figure 3(b) is a schematic diagram showing the details of the mounting lands on the intermediate connecting member 24 and the intermediate substrate 21. When manufacturing the intermediate substrate module 20, a solder paste (not shown) is printed and transferred in advance between these mounting lands, and then reflow mounting is performed to join the opposing lands. There are two main types of mounting land structures: SMD (Solder Mask Defined) and NSMD (Non Solder Mask Defined). In SMD, the contour shape of the mounting land is formed by a solder mask, i.e., solder resist. In NSMD, the contour shape of the mounting land is formed by etching the conductor pad, and the interface of the solder resist is set at a certain distance from the conductor pad. In Figure 3(b), the mounting land 242A of the intermediate connecting member 24 is formed with an SMD type land design, and the mounting land (joining terminal portion) 212 of the intermediate substrate 21 is formed with an NSMD type land design. In the mounting land 242A, the periphery of the conductor pad is covered with solder resist 242C, and the outline shape of the mounting land 242B is formed by the contour shape of the solder resist 242C. In the mounting land 212, solder resist 213 is set in an area a certain distance away from the mounting land 212, and the outline shape of the conductor pad is determined by its own etching process. As mentioned above, considering the occurrence of mounting defects such as solder bridges and open faults at the solder joints, it is desirable to apply solder precoating to the mounting land 242B on the main substrate 10 side, which is relatively unfavorable to thermal warping. At this time, although it is relatively favorable to thermal warping, measures other than solder precoating to the mounting land 242A on the intermediate substrate 21 side should also be considered. One such measure is to apply an NSMD structure mounting land to the mounting land 242A. Due to its structure, NSMD does not have a solder resist layer around the conductor pad. During reflow soldering, if the substrates come into close proximity due to thermal warping, the molten solder is pressed against each other, causing it to bulge around the outer edge of the conductor pad. In the case of SMD components, the solder resist layer forming the outer shape of the mounting land can further press against the bulging solder, potentially causing solder to leak outside the land and form floating conductors such as solder balls.Therefore, by using an NSMD structure, the solder resist recedes around the conductor pad, creating space for the pressed molten solder to accumulate around the conductor pad. For this reason, the NSMD structure can be effectively used as one of the countermeasures against mounting defects such as solder bridges and solder balls during reflow soldering. [Second Embodiment] In this embodiment, only the configurations that differ from the first embodiment will be described, and the common configurations will not be described.

[0033] Figure 4 is an exploded perspective view schematically showing the wiring board module 200 of this embodiment. Similar to the wiring board module 100, the wiring board module 200 has a configuration in which an intermediate board module 20 is three-dimensionally mounted on top of the video processing IC 30. RAM 22 and passive electronic components 23 are mounted on one side of the intermediate board 21, and an intermediate connecting member 24 is mounted on the other side. The main board 10B includes a video processing IC mounting land 12 on which the video processing IC 30 is mounted, and intermediate connecting member mounting land 11 and two passive electronic component mounting lands 16 formed around the video processing IC mounting land 12. General-purpose passive electronic components 50 are mounted on the passive electronic component mounting land 16. Passive electronic components 50 are, for example, ceramic capacitors, chip resistors, inductors, etc., components whose height is approximately the same as that of the intermediate connecting member 24.

[0034] In this embodiment, by using a general-purpose passive electronic component 50 as a substrate support member instead of a spacer 40, the work of cutting the spacer 40 from the worksheet and tray loading work during the manufacturing of the intermediate substrate module 20 can be reduced. Furthermore, by using a general-purpose passive electronic component 50, it is easy to apply to automated machines such as chip mounters, thereby improving manufacturing efficiency.

[0035] Similar to the first embodiment, in order to improve the solder joint reliability of the intermediate connecting member 24, the passive electronic component 50 is soldered to the main board 10B to hold the intermediate board module 20, and there is no fixed holding between the passive electronic component 50 and the intermediate board 21, only contact support is provided. Alternatively, the passive electronic component 50 may be mounted on the intermediate board 21 and configured to be supported by contact with the main board 10B. [Third Embodiment] In this embodiment, only the configurations that differ from the first embodiment will be described, and the common configurations will not be described.

[0036] Figure 5 is an exploded perspective view schematically showing the wiring board module 300 of this embodiment. Similar to the wiring board module 100, the wiring board module 300 has a configuration in which an intermediate board module 20 is three-dimensionally mounted on top of the video processing IC 30. RAM 22 and passive electronic components 23 are mounted on one side of the intermediate board 21, and an intermediate connection member 24 is mounted on the other side. The main board 10B includes a video processing IC mounting land 12 on which the video processing IC 30 is mounted, and intermediate connection member mounting land 11 and two metal spacer mounting lands 17 formed around the video processing IC mounting land 12. General-purpose metal spacers 60 are mounted on the metal spacer mounting lands 17. The metal spacers 60 are, for example, onboard spacers, onboard tap spacers, onboard chip rings, etc., components whose height is approximately the same as that of the intermediate connection member 24. By using general-purpose metal spacers 60 as board support members, manufacturing efficiency can be improved.

[0037] Similar to the first embodiment, in order to improve the solder joint reliability of the intermediate connecting member 24, the metal spacer 60 is soldered to the main substrate 10C to hold the intermediate substrate module 20, and there is no fixed holding between the metal spacer 60 and the intermediate substrate 21, only contact support is provided. Alternatively, the metal spacer 60 may be mounted on the intermediate substrate 21 and configured to provide contact support with the main substrate 10C. Furthermore, the metal spacer 60 can be replaced with other metal parts within the scope of providing contact support for the intermediate substrate module 20, for example, a metal ring or a metal washer can be used. [Fourth Embodiment] In this embodiment, only the configurations that differ from the first embodiment will be described, and the common configurations will not be described.

[0038] Figure 6 is a schematic diagram of the wiring board module 400 of this embodiment. Figure 6(a) is an exploded perspective view of the wiring board module 400. Figure 6(b) is a front view of the wiring board module 400. In Figure 6(b), the intermediate substrate 21B is shown as transparent for convenience.

[0039] The wiring board module 400, like the wiring board module 100, has a configuration in which an intermediate board module 20B is three-dimensionally mounted on top of the video processing IC 30. RAM 22 and passive electronic components 23 are mounted on one side of the intermediate board 21B, and an intermediate connecting member 24 is mounted on the other side. The intermediate connecting member 24 is mounted approximately in the center of the intermediate board 21B and at a position corresponding to the midpoint between the two RAMs 22. The main board 10D includes a video processing IC mounting land 12 on which the video processing IC 30 is mounted, an intermediate connecting member mounting land 11 formed around the video processing IC mounting land 12, and two spacer mounting lands 13. In addition, two more spacer mounting lands 13 are formed at positions that are equal in distance from the intermediate connecting member mounting land 11, straddling the mounting area of ​​the intermediate connecting member mounting land 11. Furthermore, in order to further shorten the module external dimensions of the intermediate board module 20B in the X direction, the RAMs 22 are arranged along the Y direction. By positioning the intermediate connecting member 24 in the center of the intermediate board 21B, the wiring lengths from the two RAMs 22 become equal. Furthermore, in order to stably mount the intermediate board module 20B onto the main board 10D, in this embodiment, spacer mounting lands 13 are formed so as to contact the four corner areas of the intermediate board module 20B, and spacers 40 are mounted thereon.

[0040] According to the configuration of this embodiment, the main board 10D and the intermediate board module 20B can be miniaturized in the X direction. Furthermore, if the intermediate board module 20B can be stably mounted and held on the main board 10D using only the intermediate connecting member 24, it is possible to eliminate all spacers 40 in consideration of the component mounting process and the quality of electronic equipment assembly. When spacers 40 are installed, in order to improve the reliability of the solder joint of the intermediate connecting member 24B, the spacers 40 are soldered to the main board 10D to hold the intermediate board module 20B, and no fixed holding is performed between the spacers 40 and the intermediate board 21B, but only contact support is provided. Alternatively, the spacers 40 may be mounted on the intermediate board 21B and configured to be supported by contact with the main board 10D. [Fifth Embodiment] In this embodiment, only the configurations that differ from the first embodiment will be described, and the common configurations will not be described.

[0041] Figure 7 is a schematic diagram of the wiring board module 500 of this embodiment. Figure 7(a) is an exploded perspective view of the wiring board module 500. Figure 7(b) is a front view of the wiring board module 500. In Figure 7(b), the intermediate substrate 21C is shown as transparent for convenience.

[0042] The wiring board module 500, like the wiring board module 100, has a configuration in which an intermediate board module 20C is three-dimensionally mounted on top of the video processing IC 30. A RAM 22 and a passive electronic component 23 are mounted on one side of the intermediate board 21C, and an intermediate connecting member 24 is mounted on the other side. In this embodiment, the intermediate board 21C has two RAMs 22 separated by a certain distance from each other, and a notch 211 is formed between the components. The main board 10E includes a video processing IC mounting land 12 on which the video processing IC 30 is mounted, and an intermediate connecting member mounting land 11 and two spacer mounting lands 13 formed around the video processing IC mounting land 12. When the intermediate board module 20C is mounted on the main board 10E, a part of the package outline of the video processing IC 30 is exposed to the outside through the notch 211. With this configuration, for example, a so-called TIM (Thermal Interface Material) can be incorporated into the exposed part of the video processing IC 30. The TIM material is attached to the surface of the video processing IC 30 package, and the other end is in contact with metal parts inside the electronic device, allowing the heat generated by the video processing IC 30 during operation to be transferred to various parts of the electronic device. The TIM material is selected appropriately according to the application, and for example, a heat dissipation sheet made by processing an elastic material into a sheet shape, or a gap filler in which a paste-like material is injected can be used.

[0043] To improve the reliability of the solder joint of the intermediate connecting member 24, the spacer 40 is soldered to the main board 10E to hold the intermediate board module 20C, and there is no fixed holding between the spacer 40 and the intermediate board 21C, only contact support is provided. Alternatively, the spacer 40 may be mounted on the intermediate board 21C and configured to be supported by contact with the main board 10E. [Sixth Embodiment] In this embodiment, only the configurations that differ from the first embodiment will be described, and the common configurations will not be described.

[0044] Figure 8 is a schematic diagram of the wiring board module 600 of this embodiment. Figure 8(a) is an exploded perspective view of the wiring board module 600. Figure 8(b) is a front view of the wiring board module 600.

[0045] Unlike the wiring board module 100, the wiring board module 600 has a configuration in which an intermediate board module 20D is three-dimensionally mounted on the back surface of the main board 10F on which the video processing IC 30 is mounted. Electronic components 18 are mounted on the back surface of the main board 10F in the area corresponding to the area on which the video processing IC 30 is mounted. The electronic components 18 include bypass capacitors for each power supply, which are positioned directly below the power supply electrodes of the video processing IC 30. Power supply wiring is connected to the back surface of the board via vias and through-holes from the mounting lands on which the power supply electrodes of the video processing IC 30 are mounted, and these bypass capacitor electrodes are connected via a short path, thereby achieving stable operation during high-speed calculations. The thickness of the intermediate connecting member 24B is set considering contact with the tallest component among the electronic components 18. The thickness of the spacer 40B that supports the intermediate board module 20D is set to be equal to that of the intermediate connecting member 24B.

[0046] With this configuration, for example, TIM material can be attached to the package surface of the video processing IC 30 or the RAM 22. By attaching one end of the TIM material to the package surface of the video processing IC 30 or RAM 22 and bringing the other end into contact with metal components inside the electronic device, heat from the video processing IC 30 or RAM 22 can be transferred to various parts of the device. In this embodiment, TIM material can be attached to the package surface of the video processing IC 30 from direction P, and TIM material can be attached to the package surface of the RAM 22 from direction Q, which is opposite to direction P. Therefore, a path can be configured to transfer heat from inside the package to metal components from two directions.

[0047] To improve the solder joint reliability of the intermediate connecting member 24B, the spacer 40B is soldered to the main board 10F to hold the intermediate board module 20D, and there is no fixed holding between the spacer 40B and the intermediate board 21; it is only supported by contact. Alternatively, the spacer 40B may be mounted on the intermediate board 21 and configured to be supported by contact with the main board 10F. [Seventh Embodiment] In this embodiment, only the configurations that differ from the first embodiment will be described, and the common configurations will not be described.

[0048] Figure 9 is a schematic diagram of the wiring board module 700 of this embodiment. Figure 9(a) is an exploded perspective view of the wiring board module 700. Figure 9(b) is a front view of the wiring board module 700.

[0049] Unlike the wiring board module 100, the wiring board module 700 has spacer mounting lands 13 that straddle the mounting area of ​​the intermediate connection member mounting lands 11 and are formed at positions equidistant from the intermediate connection member mounting lands 11. On the main board 10G, an electronic component mounting lands 19 is formed in the area enclosed by the intermediate connection member mounting lands 11 and the two spacer mounting lands 13, where other electronic components can be mounted. After the electronic component 18B is mounted on the electronic component mounting lands 19, the intermediate board module 20E is mounted and reflow mounted.

[0050] The substrate thickness of the intermediate connecting member 24C is set considering contact with the tallest component among the electronic components 18B. The substrate thickness of the spacer 40B that supports the intermediate substrate module 20E is set to be equal to that of the intermediate connecting member 24B.

[0051] By configuring it in this way, for example, a heat dissipation structure can be formed by attaching TIM material to the package surface of the video processing IC 30 and the package surface of the RAM 22 from the same direction. By attaching one end of the TIM material to the package surface of the video processing IC 30 or RAM 22 and bringing the other end into contact with metal parts inside the electronic device, heat from the video processing IC 30 or RAM 22 can be transferred to various parts inside the device.

[0052] To improve the solder joint reliability of the intermediate connecting member 24C, the spacer 40C is soldered to the main board 10G to hold the intermediate board module 20E, and there is no fixed holding between the spacer 40C and the intermediate board 21; it is only supported by contact. Alternatively, the spacer 40C may be mounted on the intermediate board 21 and configured to be supported by contact with the main board 10G.

[0053] This embodiment includes the following configuration. (Composition 1) A first wiring board having a first surface on which processor components are mounted, A second wiring board having a second surface on which memory components are mounted, wherein the second surface is parallel to the first surface and is positioned away from the first wiring board, A connecting member is mounted on the first and second wiring boards between the first and second wiring boards, and in a projection view in a first direction perpendicular to the first surface, so as to face the first side of the package outline of the processor component, and electrically connects the first and second wiring boards. It comprises a plurality of support members that are arranged between the first and second wiring boards and support the first and second wiring boards, A wiring board module characterized in that the plurality of support members are arranged apart from each other, and each is arranged apart from the connecting member. (Configuration 2) The wiring board module according to configuration 1, characterized in that the first surface faces the second wiring board. (Composition 3) The wiring board module according to configuration 2, characterized in that the back surface of the second surface faces the first surface. (Composition 4) The wiring board module according to claim 2 or 3, characterized in that at least a portion of the wiring connecting the processor component and other electronic components mounted on the first wiring board is formed on the surface layer of the first wiring board, avoiding the mounting portion of the connecting member. (Composition 5) The wiring board module according to claim 1, characterized in that the back surface of the first surface faces the second wiring board. (Composition 6) A wiring board module according to any one of configurations 1 to 5, characterized in that at least a portion of the memory component overlaps with the processor component in a projection view in the first direction. (Composition 7) The wiring board module according to any one of configurations 1 to 6, characterized in that the second wiring board does not overlap with the processor component in a projection view in the first direction. (Composition 8) The memory component comprises a first memory component and a second memory component, which are arranged along a direction parallel to the direction in which the processor component and the connecting member face each other. The wiring board module according to any one of configurations 1 to 7, characterized in that the connecting member is arranged such that it is at equal distances from the first and second memory components in a projection view in the first direction. (Composition 9) The wiring board module according to any one of configurations 1 to 8, characterized in that the second wiring board has at least one of a notch shape and a through hole formed therein for exposing the processor components in a projected view in the first direction. (Composition 10) A wiring board module according to any one of configurations 1 to 9, characterized in that an electronic component having a component height less than or equal to the component height of the processor component is mounted on the first surface near an edge different from the first edge of the package outer shape. (Composition 11) The aforementioned processor component is at least one of an image processing processor and a video processing processor. The wiring board module according to any one of configurations 1 to 10, characterized in that the memory component is capable of temporarily recording tasks performed by the processor component. (Composition 12) The processor component comprises a plurality of electrode portions electrically connected to the first wiring board, A wiring board module according to any one of configurations 1 to 11, characterized in that the first electrode portion of the electrode portion that is electrically connected to the memory component is located on the side of the first edge and along the first edge. (Composition 13) A wiring board module according to any one of configurations 1 to 12, characterized in that the plurality of support members are arranged in close proximity to both ends of the second side, which is the opposite side of the first side, in a projection view in the first direction. (Composition 14) The wiring board module according to any one of configurations 1 to 13, characterized in that the support member is joined to one of the first and second wiring boards and abuts against the other of the first and second wiring boards. (Composition 15) A wiring board module according to any one of configurations 1 to 14, characterized in that the connecting member and the support member are separated from the same worksheet. (Composition 16) A wiring board module according to any one of configurations 1 to 15, characterized in that the shape of the connecting member and the support member is rectangular in a projection view in the first direction. (Composition 17) The connecting member is joined to the first and second wiring boards by solder. A wiring board module according to any one of configurations 1 to 16, characterized in that the solder joint height between the first wiring board and the connecting member is higher than the solder joint height between the second wiring board and the connecting member. (Composition 18) The wiring board module according to any one of configurations 1 to 17, characterized in that the joint terminal portion used for soldering the second wiring board to the connecting member is formed with an NSMD type land design. (Composition 19) The connecting member is provided with through-holes for electrically connecting the first and second wiring boards. A wiring board module according to any one of configurations 1 to 18, characterized in that in the through-hole, the inside of the through-hole is filled with a sealing material and a mounting land is formed by applying a cap plating to the surface of the pad portion. (Composition 20) The wiring board module according to any one of configurations 1 to 19, characterized in that the support member is a passive electronic component. (Composition 21) A wiring board module according to any one of configurations 1 to 20, characterized in that the support member is one of a metal spacer, a metal ring, and a metal washer. (Composition 22) A wiring board module according to any one of configurations 1 to 21, characterized in that, in a projection view in the first direction, the sum of the projected areas of the connecting member and the plurality of support members is 50% or less of the projected area of ​​the processor component.

[0054] Although preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of its gist. [Explanation of symbols]

[0055] 10, 10B, 10C, 10D, 10E, 10F, 10G Main board (first wiring board) 21, 21B, 21C Intermediate board (second wiring board) 22 RAM (Memory Components) 24, 24B, 24C Intermediate connecting members 30. Video Processing ICs (Processor Components) 40, 40B, 40C Spacers (support members) 50 Passive electronic components (support members) 60 Metal spacers (support members) 100, 200, 300, 400, 500, 600, 700 Wiring board modules

Claims

1. A first wiring board having a first surface on which processor components are mounted, A second wiring board having a second surface on which memory components are mounted, wherein the second surface is parallel to the first surface and is positioned away from the first wiring board, A connecting member is mounted on the first and second wiring boards between the first and second wiring boards, and in a projection view in a first direction perpendicular to the first surface, so as to face the first edge of the package outline of the processor component, and electrically connects the first and second wiring boards. It comprises a plurality of support members arranged between the first and second wiring boards and supporting the first and second wiring boards, A wiring board module characterized in that the plurality of support members are arranged apart from each other, and each is arranged apart from the connecting member.

2. The wiring board module according to claim 1, characterized in that the first surface faces the second wiring board.

3. The wiring board module according to claim 2, characterized in that the back surface of the second surface faces the first surface.

4. The wiring board module according to claim 2, characterized in that at least a portion of the wiring connecting the processor component and other electronic components mounted on the first wiring board is formed on the surface layer of the first wiring board, avoiding the mounting portion of the connecting member.

5. The wiring board module according to claim 1, characterized in that the back surface of the first surface faces the second wiring board.

6. The wiring board module according to any one of claims 1 to 5, characterized in that at least a portion of the memory component overlaps with the processor component in a projection view in the first direction.

7. The wiring board module according to any one of claims 1 to 5, characterized in that the second wiring board does not overlap with the processor component in a projection view in the first direction.

8. The memory component comprises a first memory component and a second memory component, which are arranged along a direction parallel to the direction in which the processor component and the connecting member face each other. The wiring board module according to any one of claims 1 to 5, characterized in that the connecting member is arranged such that the distance from each of the first and second memory components is equal in a projection view in the first direction.

9. The wiring board module according to any one of claims 1 to 5, characterized in that the second wiring board has at least one of a notch shape and a through hole formed therein for exposing the processor components in a projection view in the first direction.

10. The wiring board module according to any one of claims 1 to 5, characterized in that an electronic component having a component height less than or equal to the component height of the processor component is mounted on the first surface near a side different from the first side of the package outer shape.

11. The aforementioned processor component is at least one of an image processing processor and a video processing processor. The wiring board module according to any one of claims 1 to 5, characterized in that the memory component is capable of temporarily recording tasks performed by the processor component.

12. The processor component comprises a plurality of electrode portions electrically connected to the first wiring board, The wiring board module according to any one of claims 1 to 5, characterized in that the first electrode portion of the electrode portion that is electrically connected to the memory component is arranged on the side of the first edge and along the first edge.

13. The wiring board module according to any one of claims 1 to 5, characterized in that the support member is positioned close to both ends of the second side which is opposite the first side in a projection view in the first direction.

14. The wiring board module according to any one of claims 1 to 5, characterized in that the support member is joined to one of the first and second wiring boards and abuts against the other of the first and second wiring boards.

15. The wiring board module according to any one of claims 1 to 5, characterized in that the connecting member and the support member are separated from the same worksheet.

16. The wiring board module according to any one of claims 1 to 5, characterized in that the shape of the connecting member and the support member is rectangular in a projection view in the first direction.

17. The connecting member is joined to the first and second wiring boards by solder. The wiring board module according to any one of claims 1 to 5, characterized in that the solder joint height between the first wiring board and the connecting member is higher than the solder joint height between the second wiring board and the connecting member.

18. The wiring board module according to any one of claims 1 to 3, characterized in that the joint terminal portion used for soldering the second wiring board to the connecting member is formed with an NSMD type land design.

19. The connecting member is provided with through-holes for electrically connecting the first and second wiring boards. The wiring board module according to any one of claims 1 to 5, characterized in that the through-hole is filled with a sealing material and a mounting land is formed by applying a capping plate to the surface of the pad portion.

20. The wiring board module according to any one of claims 1 to 5, characterized in that the support member is a passive electronic component.

21. The wiring board module according to any one of claims 1 to 5, characterized in that the support member is one of a metal spacer, a metal ring, and a metal washer.

22. The wiring board module according to any one of claims 1 to 5, characterized in that, in a projection view in the first direction, the sum of the projected areas of the connecting member and the plurality of support members is 50% or less of the projected area of ​​the processor component.

Images