Semiconductor testing equipment and inspection systems

Abstract

In semiconductor testing equipment that includes multiple units connected using connectors, this invention enables more reliable connection between the connectors. [Solution] The underbase unit 20 comprises an underbase plate 30, a floating plate 31 to which the underbase unit connector portion abuts and which is movable relative to the underbase plate 30 in the direction in which the substrate connector portion is attached to the underbase unit connector portion, and a coil spring 32 which is elastically deformable and interposed between the underbase plate 30 and the floating plate 31 in the attachment direction.

Description

Technical Field

[0001] The present invention relates to a semiconductor test apparatus and an inspection system.

Background Art

[0002] For example, Patent Document 1 discloses a wafer test system including a test head and probes. The wafer test system disclosed in Patent Document 1 includes a test head and a test head support / reduction device.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An inspection system such as the wafer system disclosed in Patent Document 1 includes a semiconductor test apparatus that inspects a semiconductor integrated circuit like the test head of Patent Document 1. The semiconductor test apparatus includes a plurality of units such as a performance board unit and a substrate unit. These units include connector portions that can be connected to each other and are electrically connected by connecting the connector portions to each other. However, the fitting between the connector portions may be insufficient due to dimensional errors or the like.

[0005] The present invention has been made in view of the above problems, and an object thereof is to make it possible to more reliably connect connector portions in a semiconductor test apparatus including a plurality of units connected using connector portions.

Means for Solving the Problems

[0006] A semiconductor testing apparatus according to one aspect of the present invention comprises a first unit having a first connector portion and a second unit having a second connector portion connectable to the first connector portion, wherein the first unit comprises a base portion, a movable portion to which the first connector portion abuts and which is movable relative to the base portion in the direction in which the second connector portion is attached to the first connector portion, and an elastically deformable portion which is elastically deformable and interposed between the base portion and the movable portion in the attachment direction.

[0007] An inspection system according to one aspect of the present invention comprises the above-described semiconductor testing apparatus and a test object transport device for moving a test object on which a semiconductor integrated circuit is provided and connecting it to the semiconductor testing apparatus. [Effects of the Invention]

[0008] According to one aspect of the present invention, in a semiconductor testing apparatus comprising multiple units connected using connectors, the connectors can be connected to each other more reliably. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic diagram showing the general configuration of an inspection system in one embodiment of the present invention. [Figure 2] This is a perspective view of the tester in one embodiment of the present invention. [Figure 3] This is an exploded perspective view of a tester in one embodiment of the present invention. [Figure 4] This is a schematic exploded perspective view of the main body of one embodiment of the present invention. [Figure 5] This is a schematic perspective view of a substrate unit in one embodiment of the present invention. [Figure 6] This is a schematic exploded perspective view of the performance board unit in one embodiment of the present invention. [Figure 7] This is a schematic exploded perspective view of the underbase unit in one embodiment of the present invention. [Figure 8]This is a schematic, partially enlarged perspective view of the underbase unit in one embodiment of the present invention, viewed from a diagonal downward angle. [Figure 9] This is a cross-sectional view along line AA in Figure 8. [Figure 10] Figure 8 is a cross-sectional view along line BB. [Figure 11] This is a schematic enlarged cross-sectional view including the stud bolts of an underbase unit in one embodiment of the present invention. [Figure 12] This is a schematic enlarged cross-sectional view including the stud bolts of an underbase unit in one embodiment of the present invention. [Figure 13] This is a schematic enlarged cross-sectional view including the stud bolts of an underbase unit in one embodiment of the present invention. [Figure 14] This is a schematic enlarged cross-sectional view including a fixing pin for a connector in one embodiment of the present invention. [Figure 15] This is a schematic enlarged cross-sectional view including a fixing pin for a connector in one embodiment of the present invention. [Figure 16] This is a schematic enlarged cross-sectional view including a fixing pin for a connector in one embodiment of the present invention. [Modes for carrying out the invention]

[0010] Hereinafter, an embodiment of the semiconductor testing apparatus and inspection system according to the present invention will be described with reference to the drawings.

[0011] Figure 1 is a schematic diagram showing the general configuration of the inspection system 1 of this embodiment. The inspection system 1 of this embodiment uses a wafer W on which semiconductor circuits are provided as the test object and performs inspection of the electrical characteristics of the semiconductor integrated circuit. As shown in Figure 1, the inspection system 1 comprises a tester 2 (semiconductor test equipment) and a prober 3 (test object transport equipment). This inspection system 1 inspects the electrical characteristics of each semiconductor circuit before separating the multiple semiconductor circuits formed on the wafer W into individual chips.

[0012] The tester 2 is equipped with a probe card 4. The probe card 4 has a plurality of probes. The prober 3 contacts the plurality of probes provided on the probe card 4 with the pads of the plurality of semiconductor circuits formed on the wafer W. The prober 3 includes a tester moving device 3a, a stage device 3b, and a wafer transfer device 3c.

[0013] The tester moving device 3a has a moving mechanism (not shown) and moves the tester 2 between a standby position 1A and an inspection position 1B. The stage device 3b supports the wafer W and aligns the tester 2 located at the inspection position 1B with the wafer W. The stage device 3b is movable in a planar direction along the horizontal plane and in a vertical direction perpendicular to the horizontal plane, and is further rotatable in a θ direction around a vertical axis. The wafer transfer device 3c transfers the wafer W onto the stage device 3b.

[0014] When performing an inspection, the stage device 3b moves the wafer W and contacts the pads of the plurality of semiconductor circuits formed on the wafer W with the tip portions of the plurality of probes of the probe card 4 provided on the tester 2 located at the inspection position 1B. In this state, the tester 2 inspects each semiconductor circuit by simultaneously inputting test signals to each semiconductor circuit via the plurality of probes and receiving output signals from each semiconductor circuit.

[0015] FIG. 2 is a perspective view of the tester 2. Also, FIG. 3 is an exploded perspective view of the tester 2. As shown in these figures, the tester 2 includes a main body portion 2a and a performance board unit 2b. In FIGS. 2 and 3, the tester 2 arranged at the standby position 1A is illustrated. At the standby position 1A, the tester 2 is in a posture with the side where the probe card 4 is mounted facing upward. In the following description, the explanation will be made based on the direction in the state where the tester 2 is arranged at the standby position 1A.

[0016] The main unit 2a is a unit that performs signal processing for testing the wafer W and detachably supports the performance board unit 2b. Figure 4 is a schematic exploded perspective view of the main unit 2a. As shown in Figure 4, the main unit 2a comprises a main housing 10, a plurality of substrate units 11 (second units), and a control processing unit 12.

[0017] The main housing 10 is a housing that accommodates the circuit board unit 11 and the control processing unit 12. In this embodiment, the main housing 10 is formed in the shape of a box that opens upwards. Multiple slots into which the circuit board unit 11 can be inserted are provided inside the main housing 10. The circuit board unit 11 is housed inside the main housing 10 by being inserted one by one into these slots. In addition, multiple positioning pins 10a for the performance board unit are provided on the upper surface of the main housing 10. These positioning pins 10a for the performance board unit are used to position the performance board unit 2b horizontally when the performance board unit 2b is mounted on the main body 2a from above.

[0018] The substrate unit 11 is a substrate on which electronic components that perform various signal processing are mounted, and it is replaceable depending on the type of test to be performed on the wafer W. Figure 5 is a schematic perspective view of the substrate unit 11. As shown in this figure, the substrate unit 11 comprises a substrate body 11a, an upper plate 11b, and a substrate connector section 11c (second connector section).

[0019] The substrate body 11a is an electronic circuit board and is housed in the main body housing 10 with its front and back surfaces facing horizontally. As shown in Figure 4, the multiple substrate units 11 are arranged so that the front and back surfaces of each substrate body 11a face each other. In this embodiment, the main body housing 10 is formed in a rectangular shape when viewed from above. Each substrate body 11a is positioned along the long side of the main body housing 10 when viewed from above.

[0020] The upper plate 11b is a strip-shaped plate member connected to the upper end of each circuit board body 11a. The upper plate 11b extends along the long side of the main body housing 10 in a plan view. A circuit board connector portion 11c is fixed to each upper plate 11b. The upper plate 11b may be formed from a single strip-shaped plate member, or it may be formed by stacking multiple plate members.

[0021] Furthermore, the upper plate 11b is provided with insertion holes 11d into which the connector fixing pins 35 of the performance board unit 2b, described later, can be inserted from above (see Figure 10). Two insertion holes 11d are provided for each fixing point of the board connector section 11c. These two insertion holes 11d are positioned so as to sandwich the fixing points of the board connector section 11c between them. In other words, the upper plate 11b is provided with twice the number of insertion holes 11d as the number of fixing points of the board connector section 11c.

[0022] A board connector section 11c is provided for each board body 11a. For example, one to three board connector sections 11c are provided for each board body 11a. Each board connector section 11c is fixed to the upper plate 11b and electrically connected to the board body 11a. Such board connector sections 11c can be connected to the underbase unit connector section 34, which will be described later, provided on the performance board unit 2b. In this embodiment, the board connector section 11c is a male connector and the underbase unit connector section 34 is a female connector. However, the board connector section 11c may be a female connector and the underbase unit connector section 34 may be a male connector. The board unit 11 is electrically connected to the performance board unit 2b by the connection of the board connector section 11c to the underbase unit connector section 34.

[0023] Each circuit board unit 11 is housed inside the main enclosure 10 by inserting the circuit board body 11a into a slot provided in the main enclosure 10. Each circuit board unit 11 is also connected to the control processing unit 12 via wiring for electrical connection. In other words, each circuit board unit 11 is electrically connected to the control processing unit 12 inside the main enclosure 10.

[0024] The control processing unit 12 is connected to each board unit 11. The control processing unit 12 inputs control signals to each board unit 11 based on a pre-stored test program or the like. The control processing unit 12 may also process the signals input from each board unit 11. The main body housing 10 may house a battery. The control processing unit 12 may also be equipped with a power supply unit to supply power from the battery to each board unit 11, etc.

[0025] The performance board unit 2b is detachable from the main body 2a and is fixed to the main body 2a by a locking mechanism (not shown). The performance board unit 2b is electrically connected to the wafer W via the probe card 4, which is connected from above. Figure 6 is a schematic exploded perspective view of the performance board unit 2b. As shown in this figure, the performance board unit 2b comprises an underbase unit 20 (first unit), a frame unit 21, an upper base unit 22, and a cover unit 23.

[0026] The underbase unit 20 is located below the upper base unit 22 and includes an underbase unit connector section 34, etc. The underbase unit 20 is electrically connected to the main body 2a by the connection of the circuit board connector section 11c to the underbase unit connector section 34. The underbase unit 20 will be described in more detail later.

[0027] The frame unit 21 is a frame-shaped member located between the underbase unit 20 and the upper base unit 22, forming a space between the underbase unit 20 and the upper base unit 22. A flexible circuit board (not shown) is housed in the space between the underbase unit 20 and the upper base unit 22, for example, to connect the underbase unit connector portion 34 and the upper base unit connector portion 22b, which will be described later.

[0028] The upper base unit 22 comprises an upper base plate 22a and a plurality of upper base unit connector portions 22b. The upper base plate 22a is a plate member with its front and back surfaces oriented vertically, and the plurality of upper base unit connector portions 22b are fixed to it. The upper base unit 22 is fixed to the frame unit 21 and supported by the frame unit 21. The upper base unit connector portions 22b are connector portions that are electrically connected to the probe card 4, and each can be connected to the probe card 4.

[0029] The cover unit 23 is a cover member that covers the performance board unit 2b, the underbase unit 20, and the frame unit 21. As shown in Figure 3, the upper base unit 22 is exposed while the cover unit 23 covers the performance board unit 2b, the underbase unit 20, and the frame unit 21.

[0030] The underbase unit 20 will be described in more detail. Figure 7 is a schematic exploded perspective view of the underbase unit 20. Figure 8 is a schematic enlarged partial perspective view of the underbase unit 20 viewed from diagonally below. As shown in these figures, the underbase unit 20 comprises an underbase plate 30 (base part), a floating plate 31 (movable part), a coil spring 32 (elastically deformable part), a stud bolt 33, an underbase unit connector part 34 (first connector part), and a connector fixing pin 35 (positioning pin).

[0031] The underbase plate 30 is a plate member that directly or indirectly supports the floating plate 31, coil spring 32, stud bolt 33, underbase unit connector portion 34, and connector fixing pin 35. The underbase plate 30 is positioned so that its front and back surfaces face up and down. The underbase plate 30 is formed to be rectangular in plan view, and positioning holes 30a for inserting the positioning pins 10a for the performance board unit are provided in three of its four corners. By inserting the positioning pins 10a for the performance board unit into the positioning holes 30a of the underbase plate 30, the performance board unit 2b is positioned horizontally relative to the main body portion 2a.

[0032] Furthermore, the underbase plate 30 is provided with multiple through-openings 30b through which the underbase unit connector portion 34 passes in the vertical direction. For example, as shown in Figure 7, the underbase plate 30 is provided with multiple through-openings 30b, each formed in a rectangular shape. In this embodiment, the underbase plate 30 is provided with three through-openings 30b. Multiple underbase unit connector portions 34 arranged in one direction pass through each through-opening 30b. The number of through-openings 30b provided in the underbase plate 30 can be changed. Also, the number of underbase unit connector portions 34 passing through one through-opening 30b may differ, for example, depending on the through-opening 30b.

[0033] Figure 9 is a cross-sectional view taken along line AA in Figure 8. As shown in Figure 9, the underbase plate 30 is provided with bolt holes 30c into which stud bolts 33 are screwed. Multiple bolt holes 30c are provided on each side of the through-opening 30b, with the through-opening 30b in between. Multiple bolt holes 30c located on the same side of the through-opening 30b are arranged along the arrangement direction of multiple underbase unit connector portions 34 that pass through one through-opening 30b.

[0034] The floating plate 31 is a frame-shaped member against which multiple underbase unit connector portions 34 abut from below. The floating plate 31 is connected to the underbase plate 30 via a coil spring 32 and is a movable portion that can move vertically relative to the underbase plate 30. In this embodiment, the board connector portion 11c is attached to the underbase unit connector portion 34 from below upward. In other words, the floating plate 31 is movable relative to the underbase plate 30 in the direction in which the board connector portion 11c is attached to the underbase unit connector portion 34.

[0035] In this embodiment, two floating plates 31 are provided for one through-opening 30b of the underbase plate 30. In other words, in this embodiment, the underbase unit 20 comprises six floating plates 31. However, in Figures 7 and 8, for the sake of explanation, only one of the six floating plates 31 is shown, and the others are omitted.

[0036] The floating plate 31 is formed in a frame shape having a central opening 31a. The central opening 31a is positioned to overlap the through opening 30b of the underbase plate 30 when viewed from above, and is an opening through which the underbase unit connector portion 34 passes in the vertical direction. In this embodiment, the floating plate 31 is formed to a size that allows multiple underbase unit connector portions 34 to pass through the central opening 31a.

[0037] Furthermore, the floating plate 31 is provided with multiple bolt openings 31b (openings) on each side of the central opening 31a, with the shaft portion 33a of the stud bolt 33 (described later) passing through them, with the central opening 31a in between. For example, six stud bolts 33 are provided for the floating plate 31 shown in Figures 7 and 8. Therefore, in this embodiment, six bolt openings 31b are provided for the floating plate 31 shown in Figures 7 and 8.

[0038] Furthermore, as shown in Figure 9, for example, the floating plate 31 is provided with spring contact surfaces 31c around each bolt opening 31b, against which the coil spring 32 abuts from above. In this embodiment, these spring contact surfaces 31c are located below the upper surface of the floating plate 31. The floating plate 31 is provided with recesses 31d corresponding to each bolt opening 31b. The bottom surface of these recesses 31d is the spring contact surface 31c. Also, the portion of the lower surface of the floating plate 31 located behind the spring contact surface 31c is the contact surface of the head 33b of the stud bolt 33, which will be described later.

[0039] Figure 10 is a cross-sectional view taken along line BB in Figure 8. For example, as shown in Figure 10, the floating plate 31 has multiple pin insertion holes 31e on each side of the central opening 31a, with the central opening 31a in between, into which connector fixing pins 35 are inserted. As an example, eight connector fixing pins 35 can be inserted into the floating plate 31 shown in Figures 7 and 8. Therefore, in this embodiment, eight pin insertion holes 31e are provided for the floating plate 31 shown in Figures 7 and 8. In addition, the surface of the lower surface of the floating plate 31 surrounding the pin insertion holes 31e is the contact surface for the protruding portion 34a of the underbase unit connector portion 34, which will be described later.

[0040] The coil spring 32 is an elastically deformable part whose upper end abuts the underbase plate 30 from below and whose lower end abuts the floating plate 31 from above. In other words, the coil spring 32 is interposed between the underbase plate 30 and the floating plate 31 so as to be sandwiched between the underbase plate 30 and the floating plate 31 from above and below. The coil spring 32 is formed in a cylindrical shape through which the shaft portion 33a of the stud bolt 33 is inserted. The coil spring 32 is elastically deformable so as to be compressed in the vertical direction, and can bias the floating plate 31 from above downwards by its restoring force. As an example, six stud bolts 33 are provided for the floating plate 31 shown in Figures 7 and 8. Therefore, in this embodiment, six coil springs 32 are provided for the floating plate 31 shown in Figures 7 and 8.

[0041] The stud bolt 33 has a shaft portion 33a and a head portion 33b. For example, as shown in Figure 9, the shaft portion 33a has a tip portion 33c that is screwed into the underbase plate 30 and a body portion 33d that has a larger diameter than the tip portion 33c. The tip portion 33c is inserted from below into the bolt hole 30c of the underbase plate 30. The body portion 33d is located between the tip portion 33c and the head portion 33b and is the portion that is inserted into the cylindrical coil spring 32. The diameter of the body portion 33d is smaller than that of the head portion 33b.

[0042] The head portion 33b is connected to the shaft portion 33a and can contact the lower surface of the floating plate 31 from below. The head portion 33b can restrict the movement of the floating plate 31 from top to bottom. The mounting direction of the board connector portion 11c to the underbase unit connector portion 34 is from bottom to top, as described above. In other words, the head portion 33b can restrict the movement of the floating plate 31 from top to bottom, which is the opposite direction to this mounting direction.

[0043] Furthermore, the head portion 33b is positioned such that when the floating plate 31 contacts it from above, a gap (referred to as the bolt position upper gap Sa) is formed between the floating plate 31 and the underbase plate 30. In other words, the head portion 33b is positioned such that the floating plate 31 can move from below to above (along the direction in which the circuit board connector portion 11c is attached to the underbase unit connector portion 34) between the head portion 33b and the underbase plate 30.

[0044] As an example, six stud bolts 33 are provided for the floating plate 31 shown in Figures 7 and 8. However, the number of stud bolts 33 provided for a single floating plate 31 can be changed.

[0045] The underbase unit connector section 34 is a connector section to which the board connector section 11c of the board unit 11 is attached. Each underbase unit connector section 34 is electrically connected to the upper base unit connector section 22b of the upper base unit 22. When the board connector section 11c is inserted into the underbase unit connector section 34, the board connector section 11c and the upper base unit connector section 22b are electrically connected.

[0046] The underbase unit connector portion 34 is provided with a protruding portion 34a on its lower side. The protruding portion 34a is located below the floating plate 31 and contacts the lower surface of the floating plate 31 from below. The protruding portion 34a is also provided with a through-hole 34b through which a connector fixing pin 35 is inserted. The protruding portion 34a is provided so as to protrude outward from the main body of the underbase unit connector portion 34 in a horizontal direction perpendicular to the arrangement direction of the multiple underbase unit connector portions 34 that pass through the same through-opening 30b.

[0047] Two connector fixing pins 35 are provided for each underbase unit connector section 34. One connector fixing pin 35 is provided for each protruding section 34a of the underbase unit connector section 34. The connector fixing pins 35 are inserted through the through holes 34b of each protruding section. The connector fixing pins 35 are also inserted through the pin insertion holes 31e of the floating plate 31. In other words, the through holes 34b and pin insertion holes 31e are arranged to overlap in a plan view, and the connector fixing pins 35 are inserted into both the overlapping through holes 34b and pin insertion holes 31e. The floating plate 31 and underbase unit connector section 34, through which the connector fixing pins 35 are inserted, are movable in the vertical direction.

[0048] Furthermore, as shown in Figure 10, the connector fixing pin 35 is provided with a flange portion 35a. The flange portion 35a is a portion that protrudes radially outward from the connector fixing pin 35. The flange portion 35a is located below the protruding portion 34a of the underbase unit connector portion 34, and the protruding portion 34a of the underbase unit connector portion 34 abuts against the flange portion 35a from above.

[0049] The flange portion 35a is positioned such that when the protruding portion 34a of the underbase unit connector portion 34 contacts it from above, a gap (referred to as the pin position upper gap Sb) is formed between the floating plate 31 and the underbase plate 30. In other words, the flange portion 35a is positioned such that the floating plate 31 and the underbase unit connector portion 34 can move from bottom to top (along the direction in which the board connector portion 11c is attached to the underbase unit connector portion 34) between the flange portion 35a and the underbase plate 30. For example, the pin position upper gap Sb has the same vertical dimension as the bolt position upper gap Sa. However, the pin position upper gap Sb may have a smaller vertical dimension than the bolt position upper gap Sa.

[0050] Furthermore, the upper end of the connector fixing pin 35 is inserted from below into the screw hole 30d of the underbase plate 30 and screwed into the underbase plate 30. The lower end of the connector fixing pin 35 is inserted from above into the insertion hole 11d provided in the circuit board unit 11.

[0051] Next, the operation of the inspection system 1 of this embodiment when the performance board unit 2b is attached to the main body 2a will be described with reference to Figures 11 to 16.

[0052] Figures 11 to 13 are schematic enlarged cross-sectional views of the underbase unit 20, including the stud bolts 33. Figure 11 shows the floating plate 31 in its lowest position between the head 33b and the underbase plate 30. This position of the floating plate 31 shown in Figure 11 is referred to as the lowest position. Figure 12 shows the floating plate 31 in an intermediate position between the head 33b and the underbase plate 30. This position of the floating plate 31 shown in Figure 12 is referred to as the intermediate position. Figure 13 shows the floating plate 31 in its highest position between the head 33b and the underbase plate 30. This position of the floating plate 31 shown in Figure 11 is referred to as the uppermost position.

[0053] Figures 14 to 16 are schematic enlarged cross-sectional views of the underbase unit 20, including the connector fixing pins 35. Figure 14 shows the floating plate 31 in its lowest position between the flange portion 35a and the underbase plate 30. The position of the floating plate 31 shown in Figure 14 corresponds to the lowest position shown in Figure 11. Figure 15 shows the floating plate 31 in an intermediate position between the flange portion 35a and the underbase plate 30. The position of the floating plate 31 shown in Figure 15 corresponds to the intermediate position shown in Figure 12. Figure 16 shows the floating plate 31 in its highest position between the flange portion 35a and the underbase plate 30. The position of the floating plate 31 shown in Figure 16 corresponds to the uppermost position shown in Figure 13.

[0054] When the circuit board connector 11c is not attached to the underbase unit connector 34, the floating plate 31 is positioned at its lowest position, as shown in Figures 11 and 14, due to factors such as the biasing force of the coil spring 32, the weight of the floating plate 31, and the weight of the underbase unit connector 34. At this time, the dimensions of the gap Sa above the bolt position shown in Figure 11 and the dimensions of the gap Sb above the pin position shown in Figure 14 are at their maximum.

[0055] Next, the performance board unit 2b is attached to the main body 2a. For example, with the main body 2a in place, the performance board unit 2b is lowered from above onto the top surface of the main body 2a, and the performance board unit 2b is fixed to the main body 2a with a locking mechanism (not shown).

[0056] Here, the underbase unit connector section 34 is attached to the board connector section 11c from above. In other words, relatively speaking, the board connector section 11c is attached to the underbase unit connector section 34 from below upward.

[0057] For example, the mounting position of the board connector portion 11c relative to the board body 11a may be lower than the design value, or the mounting position of the board unit 11 relative to the main body housing 10 may be lower than the design value. In such cases, the floating plate 31 is connected to the board connector portion 11c while remaining in its lowest position, for example.

[0058] On the other hand, if the mounting position of the board connector portion 11c to the main board body 11a and the mounting position of the board unit 11 to the main body housing 10 are within the design range, the floating plate 31 will be in an intermediate position, for example, as shown in Figures 12 and 15. This is because the underbase unit connector portion 34 is lifted by the board connector portion 11c, and the coil spring 32 is elastically deformed so as to be compressed.

[0059] Furthermore, if the mounting position of the board connector portion 11c relative to the board body 11a, or the mounting position of the board unit 11 relative to the main body housing 10, is higher than the design range, the floating plate 31 will be in the uppermost position, for example, as shown in Figures 13 and 16. This is because the underbase unit connector portion 34 is further raised relative to the board connector portion 11c, and the coil spring 32 is compressed more.

[0060] As described above, the tester 2 of this embodiment comprises an underbase unit 20 and a substrate unit 11. The underbase unit 20 has an underbase unit connector portion 34. The substrate unit 11 has a substrate connector portion 11c that can be connected to the underbase unit connector portion 34. The underbase unit 20 also comprises an underbase plate 30, a floating plate 31, and a coil spring 32. The underbase unit connector portion 34 is in contact with the floating plate 31. The floating plate 31 is also movable relative to the underbase plate 30 in the direction in which the substrate connector portion 11c is attached to the underbase unit connector portion 34. The coil spring 32 is elastically deformable and is interposed between the underbase plate 30 and the floating plate 31 in the attachment direction.

[0061] According to the tester 2 of this embodiment, the floating plate 31 can move vertically (in the mounting direction) relative to the substrate unit 11. In other words, as described above, the floating plate 31 can move to different positions such as the lowest position, an intermediate position, and the highest position. Therefore, according to the tester 2 of this embodiment, for example, if the position of the substrate connector portion 11c is located below the design target value due to dimensional errors, the floating plate 31 can be moved to the lowest position, thereby more reliably fitting the substrate connector portion 11c and the underbase unit connector portion 34. Also, according to the tester 2 of this embodiment, for example, if the position of the substrate connector portion 11c is located above the design target value due to dimensional errors, the floating plate 31 can be moved to the highest position, thereby more reliably fitting the substrate connector portion 11c and the underbase unit connector portion 34. Also, for example, if the position of the substrate connector portion 11c is at the design target value, the floating plate 31 can be moved to the intermediate position, thereby more reliably fitting the substrate connector portion 11c and the underbase unit connector portion 34. Therefore, according to the tester 2 of this embodiment, in a tester 2 equipped with multiple units connected using connectors, it becomes possible to more reliably connect the connectors (in this embodiment, the board connector 11c and the underbase unit connector 34) to each other.

[0062] Furthermore, in this embodiment, the tester 2 includes a stud bolt 33 whose shaft portion 33a is fixed to the underbase plate 30 in the underbase unit 20. For example, the floating plate 31 is provided with a bolt opening 31b through which the shaft portion 33a passes. Also, for example, the coil spring 32 is formed in a cylindrical shape through which the shaft portion 33a is inserted and is interposed between the underbase plate 30 and the floating plate 31.

[0063] According to the tester 2 of this embodiment, since the shaft portion 33a of the stud bolt 33 passes through the coil spring 32, the coil spring 32 is prevented from coming out of the stud bolt 33, and the positioning of the coil spring 32 can be reliably performed.

[0064] Furthermore, in the tester 2 of this embodiment, the stud bolt 33 has a head 33b connected to the shaft portion 33a. The head 33b can restrict the movement of the floating plate 31 in the direction opposite to the mounting direction. The head 33b is positioned between the head 33b and the underbase plate 30 so that the floating plate 31 can move along the mounting direction.

[0065] According to the tester 2 of this embodiment, the vertical movement distance of the floating plate 31 can be defined by the position of the head 33b. Therefore, the vertical movement distance of the floating plate 31 can be easily adjusted by changing the amount the stud bolt 33 is tightened into the underbase plate 30, for example, to adjust the position of the head 33b.

[0066] Furthermore, in the tester 2 of this embodiment, the underbase unit 20 is equipped with connector fixing pins 35 that can be inserted into the circuit board unit 11. Also, the coil spring 32 is positioned differently from the connector fixing pins 35 when viewed from the mounting direction.

[0067] According to the tester 2 of this embodiment, there is no need to install a coil spring 32 around the connector fixing pin 35. Therefore, according to the tester 2 of this embodiment, it is possible to install the coil spring 32 regardless of the shape of the connector fixing pin 35.

[0068] Furthermore, in the tester 2 of this embodiment, multiple coil springs 32 are provided for a single floating plate 31. With this tester 2 of this embodiment, the load on the floating plate 31 can be distributed and received by multiple coil springs 32, thereby reducing the load on the coil springs 32.

[0069] Furthermore, in the tester 2 of this embodiment, multiple underbase unit connector portions 34 are in contact with one floating plate 31. According to the tester 2 of this embodiment, one floating plate 31 is provided for multiple underbase unit connector portions 34. For example, it is also possible to install one floating plate 31 for each underbase unit connector portion 34. However, by providing one floating plate 31 for multiple underbase unit connector portions 34 as in this embodiment, it is possible to simplify the structure of the underbase unit 20.

[0070] Furthermore, the inspection system 1 of this embodiment includes a tester 2 and a handler 3. The handler 3 moves the wafer W on which the semiconductor integrated circuit is provided and connects it to the tester 2.

[0071] According to the inspection system 1 of this embodiment, since it is equipped with a tester 2, it is possible to more reliably connect the connector parts (in this embodiment, the board connector part 11c and the underbase unit connector part 34) to each other.

[0072] While preferred embodiments of the present invention have been described and explained above, it should be understood that these are illustrative and should not be considered limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the invention. Therefore, the present invention should not be considered limited by the foregoing description, but rather limited by the claims.

[0073] For example, the above embodiment described an example in which the present invention is applied to an inspection system equipped with a prober 3 as a test object transport device. However, the present invention is not limited thereto. For example, the present invention can also be applied to an inspection system equipped with a handler as a test object transport device. When the present invention is applied to an inspection system equipped with a handler, the tester 2 is moved relative to the handler, and the tester 2 and the wafer are connected via a probe card.

[0074] Note that the test object is not limited to wafers. For example, the test object may be a packaged device. In such cases, tester 2 is connected to the device via a test socket.

[0075] Furthermore, in the above embodiment, a configuration in which the elastic deformation part is a coil spring 32 was described. However, the present invention is not limited thereto. For example, it is also possible to have a configuration in which the elastic deformation part is a spring of a different type than a coil spring, or a configuration in which the elastic deformation part is made of rubber.

[0076] Furthermore, in the above embodiment, a configuration was described in which the first unit is the underbase unit 20 and the second unit is the substrate unit 11. However, the present invention is not limited thereto. In other words, when the tester 2 has multiple units, it is possible to arbitrarily set which unit is the first unit and which unit is the second unit. [Explanation of symbols]

[0077] 1. Inspection System 2. Tester (semiconductor testing equipment) 2a Main body 2b Performance Board Unit 3. Probe (Test object transport device) 10 Main Unit 11. Circuit board unit (second unit) 11a Main board 11b Upper plate 11c PCB connector section (second connector section) 11d Insertion hole 20 Underbase Unit (Unit 1) 30 Underbase plate (base part) 30a Positioning hole 30b Through opening 30c bolt holes 30d screw hole 31. Floating plate (movable part) 31a center opening 31b Bolt opening (opening) 31c Spring contact surface 31e Pin insertion hole 32. Coil spring (elastic deformation part) 33 Stud bolts 33a Shaft 33b head 34 Underbase unit connector section (first connector section) 34a Protrusion 34b Projection through hole 35 Connector fixing pins (positioning pins) 35a Flange section W wafer (test subject)

Claims

1. A first unit having a first connector portion, A second unit having a second connector portion that can be connected to the first connector portion, Equipped with, The first unit is, The base part, The first connector portion is in contact with a movable portion which is movable relative to the base portion in the direction in which the second connector portion is attached to the first connector portion, An elastically deformable elastic deformable part interposed between the base part and the movable part in the mounting direction, Equipped with, Semiconductor testing equipment.

2. The first unit comprises a stud bolt whose shaft portion is fixed to the base portion, The movable part is provided with an opening through which the shaft passes, The elastically deformable portion is formed in a cylindrical shape through which the shaft portion is inserted and is interposed between the base portion and the movable portion. The semiconductor testing apparatus according to claim 1.

3. The stud bolt has a head connected to the shaft portion, The head is capable of restricting the movement of the movable part in the direction opposite to the mounting direction, and the head is positioned between the head and the base so that the movable part can move along the mounting direction. The semiconductor testing apparatus according to claim 2.

4. The first unit is equipped with a positioning pin that can be inserted into the second unit, The elastically deformable portion is positioned at a different location from the positioning pin when viewed from the mounting direction. A semiconductor testing apparatus according to any one of claims 1 to 3.

5. Multiple elastically deformable parts are provided for each of the movable parts. A semiconductor testing apparatus according to any one of claims 1 to 3.

6. Multiple first connector portions are in contact with one of the movable portions. A semiconductor testing apparatus according to any one of claims 1 to 3.

7. A semiconductor testing apparatus according to any one of claims 1 to 3, A test object transport device that moves a test object equipped with a semiconductor integrated circuit and connects it to the semiconductor test apparatus, Equipped with, Inspection system.

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