Laminates and packaging bags

Abstract

To provide a laminate and a packaging bag that can improve the heat resistance of the packaging bag. [Solution] The laminate 20 comprises a base layer 21 and a heat-resistant sealing layer 22. The melting point of the heat-resistant sealing layer 22 is between 135°C and 280°C.

Description

[Technical Field]

[0001] This disclosure relates to laminates and packaging bags. [Background technology]

[0002] Packaging bags made of a film-like packaging material containing plastic are used as bags to contain the contents. Such packaging bags are constructed by heat-sealing the inner surfaces of the packaging materials together to form a seal, as described in Patent Document 1, for example. In this case, the storage area for the contents is formed in the space surrounded by the packaging material and the seal. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 10-35694 [Overview of the project] [Problems that the invention aims to solve]

[0004] Incidentally, in some cases, such packaging bags require improved heat resistance in order to process the contents at high temperatures.

[0005] This disclosure has been made with these points in mind, and aims to provide a laminate and a packaging bag that can improve the heat resistance of the packaging bag. [Means for solving the problem]

[0006] Embodiments of this disclosure relate to the following [1] to [6].

[0007] [1] It comprises a base layer and a heat-resistant sealing layer, A laminate in which the melting point of the heat-resistant sealing layer is 135°C or higher and 280°C or lower.

[0008] [2] The heat-resistant seal layer is the laminate according to [1], which contains polyamide, polymethylpentene, or polybutylene terephthalate.

[0009] [3] The heat-resistant seal layer is the laminate according to [1], which contains an unstretched nylon film.

[0010] [4] The laminate according to any one of [1] to [3], further comprising a functional layer provided between the base material layer and the heat-resistant seal layer.

[0011] [5] The laminate according to any one of [1] to [4], further comprising an adhesive layer provided between the base material layer and the heat-resistant seal layer.

[0012] [6] A packaging bag comprising the laminate according to any one of [1] to [5], where the heat-resistant seal layers are joined to each other. [Advantages of the Invention]

[0013] According to the present disclosure, the heat resistance of the packaging bag can be improved. [Brief Description of the Drawings] <00\00107>

[0014] [Figure 1] FIG. 1 is a front view showing an example of a packaging bag according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a cross-sectional view showing an example of a laminate according to an embodiment of the present disclosure. [Figure 3] FIG. 3 is a cross-sectional view showing an example of a laminate according to an embodiment of the present disclosure. [Figure 4] FIG. 4 is a cross-sectional view showing an example of a laminate according to an embodiment of the present disclosure. <000}0119>FIGS. 5(a)-(b) are front views showing a method of using a packaging bag according to an embodiment of the present disclosure. [Modes for carrying out the invention]

[0015] An embodiment will be described below with reference to the drawings. Figures 1 to 5 are diagrams illustrating one embodiment. The following figures are schematic representations. Therefore, the size and shape of each part are exaggerated as appropriate to facilitate understanding. Furthermore, it can be modified as appropriate without departing from the technical concept. In the following figures, the same parts are denoted by the same reference numerals, and some detailed explanations may be omitted. In addition, the numerical values ​​such as dimensions and material names of each component described in this specification are examples of embodiments and are not limited to them; they can be selected and used as appropriate. In this specification, terms that specify shapes and geometric conditions, such as parallel, orthogonal, and perpendicular, will be interpreted to include not only their strict meaning but also substantially the same state.

[0016] (Packaging bag composition) First, an overview of the packaging bag 10 according to one embodiment of this disclosure will be described with reference to Figure 1.

[0017] The packaging bag 10 shown in Figure 1 is a bag formed by partially joining the inner surfaces 202 (heat-resistant sealing layer 22, see Figures 2 to 4) of a film-like laminate 20, which will be described later. The packaging bag 10 comprises a first surface 11 and a second surface 12, both composed of the laminate 20.

[0018] As shown in Figure 1, the packaging bag 10 comprises a first end 13, a second end 14 facing the first end 13 in a first direction D1, and a pair of side ends 15 extending from the first end 13 to the second end 14 along the first direction D1. The first direction D1 is the transport direction of the laminate 20 when manufacturing the packaging bag 10 from the film-like laminate 20, and is the so-called MD (Machine Direction). In the example shown in Figure 1, the first end 13 and the second end 14 extend in a second direction D2 perpendicular to the first direction D1, and the packaging bag 10 has a rectangular outer shape. Although not shown, the first end 13 and the second end 14 may also extend in a direction inclined with respect to the second direction D2.

[0019] In the packaging bag 10, the first surface 11 and the second surface 12 are bonded together at a sealing portion that joins the inner surfaces 202 of the film-like laminate 20. The sealing portion has a first end sealing portion 131 located at the first end 13, a second end sealing portion 141 located at the second end 14, and a pair of side end sealing portions 151 located at the side ends 15. The width of the first end sealing portion 131 and the second end sealing portion 141 along the first direction D1 may be, for example, 5 mm or more and 20 mm or less. The width of the side end sealing portion 151 along the second direction D2 may also be, for example, 5 mm or more and 20 mm or less.

[0020] The method for forming the seal portion is not particularly limited, as long as the inner surfaces 202 (heat-resistant seal layers 22, described later) of the laminate 20 are joined together to seal the packaging bag 10. For example, the seal portion may be formed by melting a part of the laminate 20 by heating, etc., and welding the inner surfaces 202 of the laminate 20 together. In this case, the heat sealing method can be a known method such as heat sealing, bar sealing, rotary roll sealing, belt sealing, impulse sealing, high-frequency sealing, ultrasonic sealing, etc. The sealing temperature during heat sealing may be 120°C to 300°C. The sealing pressure during heat sealing may be 0.1 MPa to 3.0 MPa. Furthermore, the heat sealing time may be 1 second to 10 seconds. As described later, the melting point of the heat-resistant seal layer 22 of the laminate 20 is 135°C to 280°C. In this case, the sealing temperature may be lower than the melting point of the heat-resistant seal layer 22. Thus, even when the sealing temperature falls below the melting point of the heat-resistant sealing layer 22, a seal can be formed by adjusting the sealing pressure.

[0021] The packaging bag 10 shown in Figure 1 can be suitably used, for example, in the manufacturing process of semiconductor components to enclose them during the heat treatment of the semiconductor components. In this embodiment, as will be described later, the melting point of the heat-resistant sealing layer 22 of the laminate 20 constituting the packaging bag 10 is high. Therefore, even if heat treatment is performed with the components enclosed inside, damage to the packaging bag 10 can be suppressed. The packaging bag 10 (laminated 20) may be transparent so that the semiconductor components enclosed inside the packaging bag 10 can be seen from the outside.

[0022] (Structure of the laminate) Next, the laminate 20 used in the packaging bag 10 described above will be explained. As shown in Figures 2 to 4, the laminate 20 constituting the packaging bag 10 according to this disclosure comprises a base layer 21 and a heat-resistant sealing layer 22. The base layer 21 and the heat-resistant sealing layer 22 are arranged in order from the outer surface 201 side to the inner surface 202 side. Furthermore, as shown in Figures 3 and 4, the laminate 20 may further comprise functional layers 23a and 23b provided between the base layer 21 and the heat-resistant sealing layer 22. Furthermore, as shown in Figures 2 to 4, the laminate 20 may further comprise adhesive layers 24a and 24b provided between the base layer 21 and the heat-resistant sealing layer 22. The laminate 20 may further comprise other layers such as a printing layer.

[0023] Specifically, as shown in Figure 2, the laminate 20 comprises a base layer 21, a first adhesive layer 24a, and a heat-resistant sealing layer 22, arranged sequentially from the outer surface 201 to the inner surface 202. In this case, the base layer 21 constitutes the outer surface 201 of the laminate 20, and the heat-resistant sealing layer 22 constitutes the inner surface 202 of the laminate 20. The outer surface 201 is the surface facing away from the contents in the packaging bag 10, and the inner surface 202 is the surface facing the contents. The thickness of the laminate 20 as shown in Figure 2 may be, for example, 30 μm or more and 100 μm or less.

[0024] Furthermore, as shown in Figure 3, the laminate 20 comprises a base layer 21 arranged sequentially from the outer surface 201 to the inner surface 202, a first adhesive layer 24a, a functional layer 23a, a second adhesive layer 24b, and a heat-resistant sealing layer 22. In this case as well, the base layer 21 constitutes the outer surface 201 of the laminate 20, and the heat-resistant sealing layer 22 constitutes the inner surface 202 of the laminate 20. The thickness of the laminate 20 as shown in Figure 3 may be, for example, 50 μm or more and 200 μm or less.

[0025] Furthermore, as shown in Figure 4, the laminate 20 comprises a base layer 21, a functional layer 23b, a first adhesive layer 24a, and a heat-resistant sealing layer 22, arranged sequentially from the outer surface 201 to the inner surface 202. In this case as well, the base layer 21 constitutes the outer surface 201 of the laminate 20, and the heat-resistant sealing layer 22 constitutes the inner surface 202 of the laminate 20. The thickness of the laminate 20 as shown in Figure 4 may be, for example, 50 μm or more and 200 μm or less.

[0026] The following describes each layer that makes up the laminate.

[0027] <Base material layer> The base layer 21 is a layer that supports, for example, the heat-resistant sealing layer 22 and increases the overall strength of the laminate 20. As materials constituting the base layer 21, for example, films or sheets of polyamide resins such as nylon, polyimide resins, or polyester resins such as polyethylene terephthalate or polybutylene terephthalate can be used. Alternatively, as materials constituting the base layer 21, for example, paper, liquid crystal polymer (LCP), or others can be used.

[0028] Furthermore, the resin film or sheet mentioned above may be an unstretched film, or a stretched film that has been stretched in one or two axes.

[0029] The melting point of the base layer 21 may be higher than the melting point of the heat-resistant sealing layer 22.

[0030] The thickness of such a substrate layer 21 may be, for example, 5 μm or more and 50 μm or less.

[0031] <Heat-resistant sealing layer> The heat-resistant sealing layer 22 is a layer used to bond the laminates 20 together, and is the innermost layer when it is formed into a packaging bag 10.

[0032] The material used to constitute the heat-resistant seal layer 22 is a heat-resistant material. The heat-resistant seal layer 22 may contain polyamide such as nylon, polymethylpentene (PMP), or polybutylene terephthalate (PBT). In this case, the heat-resistant seal layer 22 may also contain an unstretched nylon film. Thus, in this embodiment, instead of polypropylene (PP) or polyethylene (PE), which are common sealing materials, a highly heat-resistant polyamide, polymethylpentene (PMP), or polybutylene terephthalate (PBT) may be used as the material constituting the heat-resistant seal layer 22. This makes it possible to obtain a packaging bag 10 that is difficult to tear in high-temperature environments.

[0033] In this embodiment, the melting point of the heat-resistant sealing layer 22 is 135°C to 280°C. In this case, heat sealing becomes possible at a sealing temperature not significantly different from that of polypropylene and polyethylene (for example, around 150°C), and even when stored in a high-temperature environment (around 200°C), adhesion between the heat-resistant sealing layers 22 can be suppressed.

[0034] The water vapor permeability of the heat-resistant sealing layer 22 is, for example, 0.01 g / (m³). 2 ·24h) or more 200g / (m 2 It may be less than 24 hours. Some semiconductor components have performance degradation due to water vapor. For this reason, the water vapor permeability of the heat-resistant seal layer 22 should be 200 g / (m²). 2 By keeping the water vapor permeability below 24 hours, it is possible to suppress the ingress of water vapor into the packaging bag 10 during the heat treatment of semiconductor components, thereby suppressing the degradation of the performance of the semiconductor components. The water vapor permeability is a value measured in accordance with JIS K7129-2:2019, under conditions of 40°C and a relative humidity difference of 90%RH. When measuring, the heat-resistant seal layer 22 is installed in the measuring device so that the inner surface 202 side of the laminate 20 becomes the water vapor supply side. The water vapor permeability measuring device may be a PERMATRAN-w 3 / 33 manufactured by MOCON, Inc., USA.

[0035] The oxygen permeability of the heat-resistant sealing layer 22 is, for example, 0.01 cc / (m³).2 ·day·atm) or more than 200 cc / (m 2 ·day·atm), or less. Some semiconductor components deteriorate in performance due to oxygen (air). Therefore, when the oxygen permeability of the heat-resistant seal layer 22 is 200 cc / (m 2 ·day·atm) or less, it is possible to suppress the entry of oxygen (air) into the packaging bag 10 during the heat treatment of the semiconductor component, and it is possible to suppress the deterioration of the performance of the semiconductor component. The oxygen permeability is a value measured under the conditions of a temperature of 23°C and a relative humidity difference of 90% RH in accordance with JIS K7126-2:2006 "Appendix A (Provisions): Test Method for Oxygen Gas Permeability by Electrolytic Sensor Method". When measuring, the heat-resistant seal layer 22 is installed in the measuring device so that the inner surface 202 side of the laminate 20 becomes the oxygen supply side. The oxygen permeability measuring device may be "OX-TRAN 2 / 20" manufactured by MOCON, USA.

[0036] As described above, such a heat-resistant seal layer 22 may include an unstretched nylon film. In this case, as an example, the melting point of the unstretched nylon film may be 215°C. Also, as an example, the water vapor permeability of the unstretched nylon film is 60 g / (m 2 ·24h) or more and less than 80 g / (m 2 ·24h). Further, as an example, the oxygen permeability of the unstretched nylon film is 30 cc / (m 2 ·day·atm) or more and 110 cc / (m 2 ·day·atm) or less.

[0037] <Adhesive layer> Adhesive layers such as the first adhesive layer 24a and the second adhesive layer 24b are layers provided when bonding any two layers, and are provided, for example, between the base material layer 21 and the heat-resistant seal layer 22.

[0038] The material of the adhesive layer can be appropriately selected depending on the resin that makes up the layer to be bonded. For example, anchor coating agents such as isocyanate-based (urethane-based), polyethyleneimine-based, polybutadiene-based, and organotitanium-based materials, or anchor coating agents and laminating adhesives such as polyurethane-based, polyacrylic-based, polyester-based, epoxy-based, polyvinyl acetate-based, cellulose-based, and other laminating adhesives can be used as desired.

[0039] Suitable adhesive layers include, for example, polyethylene, polypropylene, linear low-density polyethylene, ethylene-vinyl alcohol, ethylene-methacrylic acid copolymer, ethylene-acrylic acid copolymer, ionomer, maleic anhydride-modified polyolefin resin, and the like.

[0040] The melting point of the adhesive layer may be higher than the melting point of the heat-resistant sealing layer 22. In this embodiment, the thickness of the adhesive layer may be 3 μm or more and 60 μm or less.

[0041] <Functional Layer> Functional layers 23a and 23b are layers that impart various functions to the laminate 20. Functional layers 23a and 23b may be, for example, barrier layers. The barrier layer is a layer that suppresses the permeation of oxygen gas and water vapor, etc. The melting point of the barrier layer may be higher than the melting point of the heat-resistant sealing layer 22. As the barrier layer, for example, a material having gas barrier properties against oxygen gas, nitrogen gas or water vapor, or light-shielding properties against sunlight, etc. may be used. Specifically, as the barrier layer (functional layer 23a), for example, aluminum foil, tin, lead, copper, iron, nickel, or alloys thereof may be used. Also, as the barrier layer (functional layer 23b), a thin metal vapor-deposited layer such as aluminum may be used. When aluminum foil is used as the barrier layer, the thickness of the barrier layer may be 5 μm or more and 15 μm or less. By using aluminum foil as the barrier layer, the fabrication of the laminate 20 can be made easier.

[0042] When an aluminum metal vapor-deposited layer is used as the barrier layer, the thickness of the barrier layer may typically be between 50 Å and 500 Å, and in particular, between 100 Å and 300 Å. Furthermore, the surface of the support layer (e.g., substrate layer 21) supporting the above-mentioned aluminum vapor-deposited thin film may be pre-coated with, for example, a vapor deposition primer, to improve the adhesion of the vapor-deposited film, and other necessary pre-treatments may be applied as desired.

[0043] Furthermore, the barrier layer (functional layer 23b) may be a transparent vapor-deposited layer that can be formed by conventionally known methods. In this case, the barrier layer may be a transparent vapor-deposited layer made of an inorganic oxide vapor-deposited layer. In this way, by having a transparent vapor-deposited layer as the barrier layer, it is possible to provide or improve gas barrier properties that prevent the permeation of oxygen gas and water vapor, etc., while maintaining the permeability of the contents.

[0044] As the transparent vapor-deposited layer, for example, a vapor-deposited layer of an oxide such as silicon (Si), aluminum (Al), magnesium (Mg), calcium (Ca), potassium (K), tin (Sn), sodium (Na), boron (B), titanium (Ti), lead (Pb), zirconium (Zr), or yttrium (Y) may be used. In particular, for packaging bags, a vapor-deposited layer of aluminum oxide or silicon oxide is preferred.

[0045] Inorganic oxides are written as, for example, SiO X AlO X MO X(However, in the formula, M represents an inorganic element, and the range of X varies depending on the inorganic element.) The range of X may be as follows: silicon (Si) 0-2, aluminum (Al) 0-1.5, magnesium (Mg) 0-1, calcium (Ca) 0-1, potassium (K) 0-0.5, tin (Sn) 0-2, sodium (Na) 0-0.5, boron (B) 0-1.5, titanium (Ti) 0-2, lead (Pb) 0-2, zirconium (Zr) 0-2, and yttrium (Y) 0-1.5. In the above, when X=0, it is a complete inorganic element (pure substance), is not transparent, and the upper limit of the range of X is the value when it is completely oxidized. Silicon (Si) and aluminum (Al) are preferably used as packaging materials, and the range of the value of X may be 1.0 to 2.0 for silicon (Si) and 0.5 to 1.5 for aluminum (Al).

[0046] The thickness of the transparent vapor-deposited layer varies depending on the type of inorganic oxide used, but can be arbitrarily selected within the range of 50 Å to 2000 Å, preferably 100 Å to 1000 Å. For example, in the case of a vapor-deposited layer of aluminum oxide or silicon oxide, the thickness may be 50 Å to 500 Å, and more preferably 100 Å to 300 Å.

[0047] The vapor-deposited layer can be formed on a support layer (e.g., a substrate layer 21). Methods for forming the vapor-deposited layer include, for example, physical vapor deposition (PVD) methods such as vacuum deposition, sputtering, and ion plating, or chemical vapor deposition (CVD) methods such as plasma chemical vapor deposition, thermochemical vapor deposition, and photochemical vapor deposition. Specifically, for example, the vapor-deposited layer can be formed on a molding roller using a roller-type vapor deposition layer forming apparatus. In this case, the material constituting the support layer may be, for example, polyester such as polyethylene terephthalate or polybutylene terephthalate, or plastic such as polyamide such as nylon. It is preferable that the plastic film constituting the support layer is stretched in one or two axes.

[0048] Furthermore, a gas barrier coating may be formed on the vapor-deposited layer as needed. The gas barrier coating is a film that functions as a layer to suppress the permeation of oxygen gas and water vapor, etc. The gas barrier coating is generally given by formula R 1 n M(OR 2 ) m (However, in the formula, R 1 , R 2 The gas barrier composition is obtained by polycondensing a polyvinyl alcohol resin and / or an ethylene-vinyl alcohol copolymer in the presence of a sol-gel catalyst, acid, water, and an organic solvent. The gas barrier coating film is preferably transparent.

[0049] The above general formula R 1 n M(OR 2 ) mAs the alkoxide represented by , at least one of the following can be used: a partially hydrolyzed alkoxide or a condensate of the hydrolyzed alkoxide. Furthermore, as the partially hydrolyzed alkoxide, it is not necessary for all alkoxy groups to be hydrolyzed; it may be a product in which one or more alkoxy groups are hydrolyzed, or a mixture thereof. As the condensate of the hydrolyzed alkoxide, dimers or more of the partially hydrolyzed alkoxide, specifically 2 to 6-mers, can be used.

[0050] The above general formula R 1 n M(OR 2 ) m In the alkoxide represented by , the metal atom represented by M can be silicon, zirconium, titanium, aluminum, or others. Preferred metals include, for example, silicon and titanium. Furthermore, in this disclosure, the alkoxide can be used alone or by mixing alkoxides of two or more different metal atoms in the same solution.

[0051] Furthermore, the above general formula R 1 n M(OR 2 ) m In the alkoxide represented by R, 1 Specific examples of organic groups represented by the above general formula R include, for example, methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, sec-butyl group, t-butyl group, n-hexyl group, n-octyl group, and other alkyl groups. 1 n M(OR 2 ) m In the alkoxide represented by R, 2 Specific examples of organic groups represented by include, for example, methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, sec-butyl group, and others. Note that these alkyl groups may be the same or different within the same molecule.

[0052] When preparing the above gas barrier composition, for example, a silane coupling agent may be added. As the silane coupling agent, known organic reactive group-containing organoalkoxysilanes can be used. In this embodiment, organoalkoxysilanes having epoxy groups are particularly preferred, and specifically, for example, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, etc. can be used. One or more of the above silane coupling agents may be used.

[0053] As described above, when the barrier layer (functional layer 23b) is a transparent vapor-deposited layer, the transparent vapor-deposited layer can be formed on the substrate layer 21 (e.g., polyethylene terephthalate film). In this case, for example, the melting point of the polyethylene terephthalate film on which the transparent vapor-deposited layer is formed may be 264°C. Also, for example, the water vapor permeability of the polyethylene terephthalate film on which the transparent vapor-deposited layer is formed may be 0.05 g / (m³). 2 ·24h) or more 1.9g / (m 2 It may be less than 24h. Furthermore, as an example, the oxygen permeability of a polyethylene terephthalate film on which a transparent vapor deposition layer is formed is 0.1 cc / (m²). 2 ·day · atm) or more 1.8cc / (m 2 It is also acceptable if it is less than or equal to (day·atm).

[0054] <Other layers> The laminate 20 according to this embodiment may further include other layers, such as an intermediate layer or a printed layer, in addition to the layers described above.

[0055] The intermediate layer is a layer that improves the puncture resistance of the packaging bag 10 and increases its strength. The material constituting this intermediate layer may be, for example, polyamide such as nylon, polyester such as polyethylene terephthalate or polybutylene terephthalate, or plastic such as linear low-density polyethylene (LLDPE). It is preferable that the plastic film constituting the intermediate layer is stretched in one or two axes. The intermediate layer may consist of a single layer or multiple layers. By providing an intermediate layer in the laminate 20 in this way, the puncture resistance of the packaging bag 10 can be improved. The melting point of the intermediate layer may be higher than the melting point of the heat-resistant sealing layer 22. The thickness of the intermediate layer may be, for example, 12 μm or more and 50 μm or less.

[0056] The printed layer is a layer that forms any desired printed pattern, such as letters, numbers, pictures, figures, symbols, and designs, for decorative purposes, to indicate contents, expiration dates, manufacturer, seller, etc., and to add aesthetic appeal. The printed layer can be provided in a predetermined position as needed. The printed layer may be provided over the entire surface of the substrate layer 21, etc., or on a part thereof. The printed layer can be formed using conventionally known pigments and dyes, and the method of formation is not particularly limited. The thickness of the printed layer may be, for example, 0.5 μm or more and 5 μm or less.

[0057] Such laminates 20 can be manufactured by, for example, wet lamination, dry lamination, solvent-free dry lamination, extrusion lamination, T-die co-extrusion molding, co-extrusion lamination, inflation, or any other method. Furthermore, if necessary, pretreatment such as corona treatment or ozone treatment can be applied to the film when performing the lamination described above.

[0058] Next, the operation of the packaging bag 10 according to this embodiment, which has the above configuration, will be described. Here, the method of using the packaging bag 10 shown in Figure 1 will be described.

[0059] First, as shown in Figure 5(a), a packaging bag 10 with an open first end 13 is prepared. In this case, for example, a strip-shaped laminate 20 is continuously unwound from a roll-shaped laminate 20, and this is superimposed on another strip-shaped laminate 20. Next, the positions corresponding to the vicinity of the pair of side ends 15 of the packaging bag 10 are heat-sealed to form a pair of side end seal portions 151. Subsequently, the two laminates 20 heat-sealed at the pair of side end seal portions 151 are cut into the shape of the packaging bag 10 to form individual pieces. Next, the positions corresponding to the vicinity of the second end 14 are heat-sealed to form a second end seal portion 141. In this way, a packaging bag 10 with an open first end 13 is obtained.

[0060] Next, the contents, such as a semiconductor component P, are placed inside the packaging bag 10, which has an opening at the first end 13. At this time, the semiconductor component P is placed inside the packaging bag 10 through the opening at the first end 13.

[0061] Next, as shown in Figure 5(b), the first end seal portion 131 is formed by heat sealing the vicinity of the first end 13 of the packaging bag 10, thereby closing the first end 13 of the packaging bag 10. At this time, the inside of the packaging bag 10 may be degassed. In this way, the semiconductor component P is sealed inside the packaging bag 10.

[0062] Next, the semiconductor component P sealed inside the packaging bag 10 is subjected to a heat treatment. In this case, for example, the packaging bag 10 containing the semiconductor component P is placed inside a heat treatment apparatus (not shown), and the semiconductor component P sealed inside the packaging bag 10 is pressurized with a gas (oxygen gas or nitrogen gas) at around 200°C. At this time, the pressure inside the heat treatment apparatus may be about 1 MPa. In this state, the packaging bag 10 is stored inside the heat treatment apparatus for about 1 hour.

[0063] Afterward, the packaging bag 10 is removed from the heat treatment device, and then the semiconductor component P is removed from the packaging bag 10. In this way, the semiconductor component P is heat-treated. The used packaging bag 10 may be discarded after the heat treatment.

[0064] As described above, according to this embodiment, the laminate 20 comprises a base layer 21 and a heat-resistant sealing layer 22. Furthermore, the melting point of the heat-resistant sealing layer 22 is between 135°C and 280°C. This improves the heat resistance of the packaging bag 10 made from the laminate 20. That is, even when the packaging bag 10 is stored in a high-temperature environment of around 200°C, it is possible to suppress the adhesion of the heat-resistant sealing layers 22 to each other while suppressing damage (breakage) of the packaging bag 10. In addition, because the melting point of the heat-resistant sealing layer 22 is between 135°C and 280°C, heat sealing becomes possible at a sealing temperature (for example, around 150°C) that is not significantly different from that of polypropylene and polyethylene.

[0065] Furthermore, according to this embodiment, the heat-resistant sealing layer 22 contains polyamide, polymethylpentene, or polybutylene terephthalate. This further improves the heat resistance of the packaging bag 10 and enhances its gas barrier properties. Polyamides such as nylon are materials with high heat resistance and have therefore not been conventionally used in sealing layers. In contrast, in this embodiment, by setting the melting point of the heat-resistant sealing layer 22 to 135°C or higher and 280°C or lower, good heat sealing performance can be obtained even when a material with high heat resistance is used for the heat-resistant sealing layer 22.

[0066] Furthermore, according to this embodiment, the heat-resistant sealing layer 22 includes an unstretched nylon film. This further improves the heat resistance of the packaging bag 10 and enhances the gas barrier properties and heat sealability of the heat-resistant sealing layer 22.

[0067] Furthermore, according to this embodiment, the laminate 20 further comprises functional layers 23a and 23b provided between the base layer 21 and the heat-resistant sealing layer 22. This further enhances the heat resistance and gas barrier properties of the packaging bag 10.

[0068] In the embodiment described above, the packaging bag 10 is described as a four-sided sealed bag (flat pouch) sealed by a first end seal portion 131, a second end seal portion 141, and a side end seal portion 151, but it is not limited to this. For example, the packaging bag 10 may be a stand-up pouch, a gusseted pouch, or a pillow bag.

[0069] The multiple components disclosed in the above embodiments and variations can be combined as needed. Alternatively, some components may be removed from all the components shown in the above embodiments and variations. [Explanation of Symbols]

[0070] 10 packaging bags 20 Laminate 21 Base material layer 22 Heat-resistant sealing layer 23a Functional layer 23b Functional layer 24a Adhesive layer 24b Adhesive layer

Claims

1. It comprises a base layer and a heat-resistant sealing layer, A laminate in which the melting point of the heat-resistant sealing layer is 135°C or higher and 280°C or lower.

2. The laminate according to claim 1, wherein the heat-resistant sealing layer comprises polyamide, polymethylpentene, or polybutylene terephthalate.

3. The laminate according to claim 1, wherein the heat-resistant sealing layer includes an unstretched nylon film.

4. The laminate according to claim 1, further comprising a functional layer provided between the base material layer and the heat-resistant sealing layer.

5. The laminate according to claim 1, further comprising an adhesive layer provided between the base material layer and the heat-resistant sealing layer.

6. A laminate comprising the one described in any one of claims 1 to 5, A packaging bag in which the heat-resistant sealing layers are joined together.

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