Method for forming scribe lines and apparatus for forming scribe lines

Abstract

This process quickly forms scribe lines that separate small pieces of a predetermined shape from the substrate. [Solution] The scribe line formation method comprises the steps of: forming a second scribe line SL2 on a substrate W by moving a scribe blade 55 in contact with the substrate W along a second processing line that is in contact with a first processing line for forming a first scribe line SL1 of a predetermined shape; changing the movement path of the scribe blade 55 at the contact point P between the first processing line and the second processing line while keeping the scribe blade 55 in contact with the substrate W; and forming a first scribe line SL1 on the substrate W by moving the scribe blade 55 from the contact point P through the first processing line and back to the contact point P.

Description

Technical Field

[0001] The present invention relates to a scribe line forming method for forming a scribe line on a substrate, and a scribe line forming apparatus for forming a scribe line on a substrate.

Background Art

[0002] As a method for dividing a brittle substrate such as a glass substrate into small pieces having a predetermined shape such as a circle or an ellipse, a scribe line is formed on the substrate along a processing line corresponding to the shape of the small piece, and the small piece is divided from the substrate along the scribe line. A method is known. In this case, in addition to a scribe line (referred to as a contour scribe line) for dividing a small piece, another scribe line (referred to as an auxiliary scribe line) for assisting the division of the small piece is formed so as to be in contact with this scribe line (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above conventional scribe line forming method, a contour scribe line for dividing a small piece and an auxiliary scribe line for assisting the division are formed individually. Specifically, after forming the contour scribe line on the substrate, the scribe blade (for example, a scribing wheel) for forming the scribe line is once separated from the substrate, and after bringing the scribe blade into contact with the substrate again, the auxiliary scribe line is formed.

[0005] Thus, in the method of forming contour scribe lines and auxiliary scribe lines separately, it is necessary to lift the scribe blade away from the substrate and then bring it back into contact, which makes it time-consuming to form both scribe lines.

[0006] The objective of the present invention is to quickly form scribe lines that separate small pieces of a predetermined shape from a substrate. [Means for solving the problem]

[0007] Several embodiments for solving the problem are described below. These embodiments can be combined as needed. The present invention provides a method for forming a scribe line, comprising the following steps. (a) A step of forming a second scribe line on a substrate by moving a scribe blade in contact with the substrate along a second processing line that is in contact with a first processing line for forming a first scribe line of a predetermined shape. (b) A step of changing the movement path of the scribe blade while keeping the scribe blade in contact with the substrate at the point of contact between the first processing line and the second processing line. (c) A step of forming a first scribe line on the substrate by moving the scribe blade from the contact point, through the first processing line, and back to the contact point.

[0008] In the above-described scribe line formation method, when the scribe blade reaches the contact point between the first scribe line and the second scribe line, the movement path of the scribe blade is changed while the scribe blade remains in contact with the substrate. Furthermore, the first scribe line is formed by moving the scribe blade back to the contact point along the first processing line from the contact point. In other words, the first and second scribe lines are formed continuously by moving the scribe blade in a "single-stroke" manner along the first processing line of the first scribe line and the second processing line of the second scribe line. As a result, in the above-described scribe line formation method, it is unnecessary to temporarily remove the scribe blade from the substrate and then re-contact it in order to form the other scribe line after forming one scribe line. Consequently, the formation time for the first and second scribe lines is shortened compared to conventional methods.

[0009] In the above-described method for forming a scribe line, the contact point of the first processing line may have a curved shape. This allows the scribe blade to move with a certain degree of curvature when changing its movement path. As a result, the scribe blade can change its path smoothly.

[0010] In the above-described method for forming a scribe line, the corners of the first processed line may have a curved shape. This allows the scribe blade to move with a certain degree of curvature when moving it along the corners of the first processed line, enabling smooth movement of the scribe blade along the first processed line. As a result, the occurrence of chipping of the substrate can be suppressed, and a higher quality first scribe line can be formed.

[0011] The above-described method for forming a scribe line may further include a step in which, when the scribe blade reaches the contact point after forming the first or second scribe line, the load applied by the scribe blade to the substrate is made smaller than the load applied when forming the scribe line. When the scribe blade reaches the contact point after forming the first or second scribe line, a scribe line has already been formed at that contact point. In this case, by making the load applied by the scribe blade to the substrate smaller than the load applied when forming the scribe line, the occurrence of chipping of the substrate at the contact point between the first and second scribe lines can be suppressed, thereby enabling the formation of a higher-quality first scribe line.

[0012] In the above-described method for forming a scribe line, after the step of forming the first scribe line, the movement path of the scribe blade may be further changed to a second processing line while the scribe blade remains in contact with the substrate at the contact point. This allows for the continuous formation of multiple first scribe lines.

[0013] A scribe line forming apparatus according to another view of the present invention comprises a scribe blade and a control unit. The scribe blade forms a scribe line on a substrate. The control unit controls the scribe blade.

[0014] In the above-described scribe line forming apparatus, the control unit moves the scribe blade, which is in contact with the substrate, along a second processing line that is in contact with a first processing line for forming a first scribe line of a predetermined shape on the substrate, thereby forming a second scribe line on the substrate. At the point of contact between the first processing line and the second processing line, while keeping the scribe blade in contact with the substrate, the control unit changes the movement path of the scribe blade, moving the scribe blade from the point of contact through the first processing line back to the point of contact, thereby forming a first scribe line on the substrate.

[0015] In the above-described scribe line forming apparatus, when the scribe blade reaches the contact point between the first scribe line and the second scribe line, the movement path of the scribe blade is changed while the scribe blade remains in contact with the substrate. Furthermore, the first scribe line is formed by moving the scribe blade back to the contact point along the first processing line from the contact point. In other words, the first and second scribe lines are formed continuously by moving the scribe blade in a "single stroke" manner along the first processing line of the first scribe line and the second processing line of the second scribe line. As a result, in the above-described scribe line forming apparatus, it is unnecessary to temporarily remove the scribe blade from the substrate and then re-contact it in order to form the other scribe line after forming one scribe line. Consequently, the formation time for the first and second scribe lines is shortened compared to conventional methods. [Effects of the Invention]

[0016] When forming a first scribe line having a predetermined shape and a second scribe line in contact with the first scribe line, it is unnecessary to temporarily remove the scribe blade from the substrate and then re-contact it in order to form the other scribe line after forming one. As a result, the formation time for the first and second scribe lines can be shortened. [Brief explanation of the drawing]

[0017] [Figure 1] A diagram showing the configuration of a scribe line forming apparatus. [Figure 2] A diagram showing the control configuration of a scribe line forming apparatus. [Figure 3] A diagram showing an example of a scribe line formed on a substrate. [Figure 4] A diagram showing an example of scribe line formation for dividing elliptical pieces. [Figure 5] A diagram showing an example of scribe line formation for dividing a trapezoidal piece. [Figure 6] A flowchart illustrating the method for forming scribe lines. [Figure 7] A diagram showing another example of the third scribe line.

Embodiments for Carrying Out the Invention

[0018] 1. First Embodiment (1) Scribe Line Forming Apparatus Hereinafter, the scribe line forming apparatus 100 will be described. The scribe line forming apparatus 100 is a system for forming a scribe line for dividing a small piece of a predetermined shape from a substrate W. Specifically, the scribe line forming apparatus 100 forms a scribe line corresponding to the shape of the processing line on the substrate W by moving a scribe blade along a processing line of a predetermined shape on the substrate W. The substrate W is, for example, a planar thin plate made of a brittle material such as a glass substrate, a ceramic substrate, a sapphire substrate, or a silicon substrate. The thickness of the substrate W is, for example, 0.5 mm to 5 mm.

[0019] The configuration of the scribe line forming apparatus 100 will be described with reference to FIGS. 1 and 2. FIG. 1 is a diagram showing the configuration of the scribe line forming apparatus 100. FIG. X is a diagram showing the control configuration of the scribe line forming apparatus 100. The scribe line forming apparatus 100 includes a table 1, a moving stage 2, a bridge 3, a scribe head 5, and a control device 7. The table 1 is a member for placing the substrate W. The table 1 is placed on the moving stage 2. The moving stage 2 is slidably placed on rails 21a and 21b extending in a horizontal one direction (Y direction in the example of FIG. 1). The moving stage 2 is driven by a ball screw 25 rotated by a first motor 23 and can move in one direction along the rails 21a and 21b. The table 1 can move in the above one direction (Y direction) with respect to the scribe head 5 following the movement of the moving stage 2. It is only necessary that the table 1 and the bridge 3 can move relative to each other, and the bridge 3 may be fixed to the moving stage 2 and move in the above one direction (Y direction) with respect to the table.

[0020] It should be noted that there is an error in the original text where "図2は、スクライブライン形成装置100の制御構成を示す図である。" mentions "図X", which should be "図2". The translation has been corrected accordingly.Bridge 3 is supported by columns 31a and 31b that straddle the mobile platform 2 and table 1, and is placed on table 1. Bridge 3 extends in another horizontal direction (the X direction in the example of Figure 1). A guide 33 is attached to Bridge 3. A scribe head is mounted on the guide 33 so as to be movable along the extension direction of the guide 33. Driven by a second motor 35, the scribe head 5 moves along the guide 33 in the other direction (the X direction).

[0021] In the scribe line forming apparatus 100, the table 1 moves in one direction (Y direction) relative to the scribe head 5, and the scribe head 5 moves along the other direction (X direction), thereby allowing the scribe head 5 to move two-dimensionally with respect to the substrate W placed on the table 1.

[0022] A holder unit 53 is attached to the scribe head 5 via a holder joint 51. The holder unit 53 has a scribe blade 55. The scribe blade 55 is a scribe wheel that forms a scribe line on the substrate W. The scribe blade 55 is supported in the holder unit 53 so as to be rotatable around an axis in the height direction (Z direction). The scribe head 5 may also be equipped with a rotation mechanism for rotating the holder unit 53 and the scribe blade 55. The scribe head 5 is provided with a lifting mechanism (not shown) for raising and lowering the scribe head 5 in the height direction (Z direction) and an air cylinder 57 that provides a driving force to press the scribe blade 55 against the substrate W.

[0023] In addition, the scribe head 5 may be equipped with various sensors (for example, acceleration sensors) to detect vibrations transmitted to the scribe blade 55. Furthermore, the scribe line forming apparatus 100 may be equipped with sensors (for example, encoders that measure the rotational speed of the first motor 23 and the second motor 35) to acquire information regarding the position of the scribe blade 55 (scribe head).

[0024] The control device 7 is a computer system composed of arithmetic circuits such as a CPU, memory devices (e.g., RAM, ROM, SSD, hard disk, etc.), and various interfaces (e.g., network interface). As shown in Figure 2, the control device 7 has a storage unit 71 and a control unit 73.

[0025] The memory unit 71 is a storage area of ​​the memory device of the computer system that constitutes the control device 7. The memory unit 71 stores a control program for controlling the scribe line forming apparatus 100, various parameters related to the control of the scribe line forming apparatus 100, data related to the shapes of the first scribe line and the second scribe line (for example, CAD drawings of the first scribe line and the second scribe line), and so on.

[0026] The control unit 73 is composed of the arithmetic circuits of the computer system that constitutes the control device 7, a part of the memory area of ​​the memory device, and various interfaces, and performs various information processing related to the control of the scribe line forming apparatus 100. The control unit 73 performs various information processing related to the control of the scribe line forming apparatus 100 by executing the control program stored in the memory unit 71.

[0027] The control unit 73 controls the horizontal movement of the table 1 in one direction (Y direction) by controlling the first motor 23 connected to the control device 7. The control unit 73 controls the horizontal movement of the scribe head 5 in another direction (X direction) by controlling the second motor 35 connected to the control device 7. The control unit 73 controls the position of the scribe blade 55 in the Z direction by controlling the lifting mechanism connected to the control device 7. The control unit 73 controls the load (pressing force) that the scribe blade 55 applies to the substrate W by controlling the air cylinder 57 connected to the control device 7.

[0028] (2) Scribeline The following describes scribe lines. Scrib lines are formed on a substrate W to separate small pieces of a predetermined shape from the substrate W. In this embodiment, a scribe line forming apparatus 100 is used to form scribe lines on the substrate W as shown in Figure 3. Figure 3 is a diagram showing an example of scribe lines formed on the substrate W.

[0029] In this embodiment, a first scribe line SL1 and a second scribe line SL2 are formed on the substrate W. The first scribe line SL1 is a scribe line for separating small pieces from the substrate W. Therefore, the first scribe line SL1 forms a closed region having a shape corresponding to the shape of the small piece. That is, the region closed by the first scribe line SL1 is separated from the substrate W as a small piece. In the example shown in Figure 3, the first scribe line SL1 has a circular shape, so a circular small piece is separated from the substrate W. Also, in Figure 3, multiple (four) first scribe lines SL1 are formed.

[0030] The second scribe line SL2 is a straight scribe line that extends in the first direction D1 so as to be in contact with the first scribe line SL1 and contact point P. The second scribe line SL2 is a scribe line that assists in the separation of small pieces from the substrate W according to the first scribe line SL1.

[0031] By having the second scribe line SL2 contact the first scribe line SL1 at contact point P, the second scribe line SL2 and the first scribe line SL1 can be formed continuously (i.e., without moving the scribe blade 55 away from the substrate W and then making it contact the substrate W again). Specifically, after forming the second scribe line SL2 by moving the scribe blade 55 along the second processing line for forming the second scribe line SL2, at contact point P, while keeping the scribe blade 55 in contact with the substrate W, the movement path of the scribe blade 55 is changed from the second processing line to the first processing line for forming the first scribe line SL1, thereby forming the first scribe line SL1. This allows the scribe blade 55 to move in a "single stroke" manner, thereby continuously forming the two scribe lines.

[0032] Furthermore, as shown in Figure 3, the second scribe line SL2 is in contact with the adjacent first scribe line SL1 at its end. This allows multiple first scribe lines SL1 to be formed continuously without separating the scribe blade 55 from the substrate W.

[0033] As shown in Figure 3, the contact point P of the first machining line of the first scribe line SL1 has a curved shape. Since the first scribe line SL1 (first machining line) and the second scribe line SL2 (second machining line) are in contact at contact point P, the first machining line of the first scribe line SL1 extends in the same direction as the second machining line of the second scribe line SL2 at contact point P. Therefore, when changing the movement path of the scribe blade 55 between the second machining line and the first machining line, the path change from the second machining line to the first machining line and the path change from the first machining line to the second machining line can be performed smoothly.

[0034] Furthermore, as described above, the scribe blade 55 is configured to rotate around an axis in the Z direction relative to the scribe head 5. Therefore, when changing the direction of travel of the scribe blade 55, if the direction of travel of the scribe blade 55 is changed with a small curvature, it may cause chipping in the substrate W, degrade the quality of the scribe line, or damage the scribe blade 55. Accordingly, when changing the direction of travel of the scribe blade 55, by moving the scribe blade 55 along a curved path, the scribe blade 55 can be moved with a certain degree of curvature. As a result, the path of the scribe blade 55 can be changed smoothly, which can suppress chipping in the substrate W, degrade the quality of the scribe line, and damage to the scribe blade 55.

[0035] As shown in Figure 3, multiple third scribe lines SL3 can be further formed on the substrate W. The third scribe lines SL3 are formed between adjacent first scribe lines SL1, extend in a second direction D2 which is perpendicular in the horizontal plane to the first direction D1 which is the extension direction of the second scribe line SL2, and intersect the second scribe line SL2. The third scribe lines SL3 are scribe lines that assist in individually separating small pieces from the substrate W.

[0036] In the example shown in Figure 3, a circular first scribe line SL1 was formed to separate a small circular piece, but this is not the only option. By forming a closed first scribe line SL1 of any shape, small pieces of any shape can be separated from the substrate W.

[0037] For example, as shown in Figure 4, by forming an elliptical first scribe line SL1, an elliptical piece can be separated from the substrate W. Figure 4 shows an example of scribe line formation for separating an elliptical piece.

[0038] Furthermore, as shown in Figure 5, for example, by forming a first scribe line SL1 in the shape of a polygon such as a trapezoid, small polygonal pieces such as trapezoids can be separated from the substrate W. Figure 5 shows an example of scribe line formation for separating small trapezoidal pieces. As shown in Figure 5, when forming a first scribe line SL1 with corners, such as a trapezoid, it is preferable that the corner portion of the first processing line for forming the first scribe line SL1 be curved.

[0039] When moving the scribe blade 55 along a first machining line that has corners, if the corners are not curved, the scribe blade 55 will move with a small curvature. As a result, as explained above, this may cause chipping in the substrate W, degrading the quality of the scribe line, or damage to the scribe blade 55. Therefore, by making the corners of the first machining line curved, the scribe blade 55 can move with a certain degree of curvature at the corners, allowing the scribe blade 55 to move smoothly along the first machining line. As a result, the occurrence of chipping in the substrate W and damage to the scribe blade 55 can be suppressed, and a higher quality first scribe line SL1 can be formed.

[0040] (3) Method for forming scribe lines The following describes how to form scribe lines as shown in Figures 3 to 5 using the scribe line forming apparatus 100, with reference to Figure 6. Figure 6 is a flowchart showing the method for forming scribe lines.

[0041] First, in order to form the second scribe line SL2, the scribe blade 55 is directed in the first direction D1, which is the extension direction of the second scribe line SL2 (step S1). Specifically, the control unit 73 of the control device 7 controls the lifting mechanism to bring the scribe blade 55 into contact with the substrate W. The control unit 73 also controls the air cylinder 57 to control the load that the scribe blade 55 applies to the substrate W. Furthermore, the control unit 73 controls the first motor 23 and / or the second motor 35 to move the table 1 and / or the scribe head 5 relative to the substrate W, thereby moving the scribe blade 55 in the first direction D1.

[0042] By moving the scribe blade 55 in the first direction D1 while it is in contact with the substrate W, if the scribe blade 55 is not facing the first direction D1, it rotates around the axis in the Z direction to face the first direction D1. Here, "the scribe blade 55 facing the first direction D1" means that the extension direction of the blade portion of the scribe blade 55 becomes parallel to the first direction D1.

[0043] Furthermore, it is preferable to perform the operation of orienting the scribe blade 55 in the first direction D1 on a portion of the substrate W that is not used as a product due to the division of small pieces. The operation of orienting the scribe blade 55 in the first direction D1 is performed with the scribe blade 55 in contact with the substrate W, and by performing this operation on a portion of the substrate W that is not used, it is possible to prevent scratches or other damage from being formed on the portion of the substrate W that is used as a product.

[0044] Furthermore, if the scribe head 5 has a rotation mechanism for rotating the scribe blade 55, the scribe blade 55 can be directed in the first direction D1 by rotating it.

[0045] After orienting the scribe blade 55 in the first direction D1, the control unit 73 controls the first motor 23 and / or the second motor 35 to move the scribe head 5 horizontally relative to the substrate W, positioning the scribe blade 55 (scribe head 5) at the starting position for forming the second scribe line SL2 (starting position for the second processing line). Subsequently, the control unit 73 controls the lifting mechanism to move the scribe blade 55 in the Z direction to bring it into contact with the substrate W. The control unit 73 also controls the air cylinder 57 to control the load (pressing force) that the scribe blade 55 applies to the substrate W.

[0046] The control unit 73 controls the first motor 23 and / or the second motor 35 while the scribe blade 55 is in contact with the substrate W under a predetermined load, to move the scribe blade 55 along the second processing line of the second scribe line SL2, thereby forming the second scribe line SL2 (step S2). Specifically, the control unit 73 controls the first motor 23 and / or the second motor 35 to move the scribe blade 55 relative to the substrate W from the starting position in the first direction D1, which is the extension direction of the second scribe line SL2, thereby forming the second scribe line SL2.

[0047] While the second scribe line SL2 is moving, the control unit 73 determines whether the scribe blade 55 has reached the contact point P between the second scribe line SL2 (second processing line) and the first scribe line SL1 (first processing line) (step S3). This determination can be made for each first scribe line SL1, for example, based on data relating to the shapes of the first and second scribe lines. In addition, the above determination can be made based on, for example, the amount of movement of the scribe blade 55 (scribe head 5) from the starting position, the position of the scribe blade 55, etc.

[0048] If the control unit 73 determines that the scribe blade 55 has not reached the contact P (No in step S3), it continues to form the second scribe line SL2.

[0049] On the other hand, if the control unit 73 determines that the scribe blade 55 has reached contact P (Yes in step S3), the control unit 73 changes the movement path of the scribe blade 55 from the second processing line to the first processing line while keeping the scribe blade 55 in contact with the substrate W (step S4). Subsequently, the control unit 73 controls the first motor 23 and / or the second motor 35 to move the scribe blade 55 from contact P along the first processing line, thereby forming the first scribe line SL1 (step S5).

[0050] As described above, the first scribe line SL1 is a scribe line for separating small pieces from the substrate W and forms a closed region. Therefore, the first processing line (first scribe line SL1), which starts from contact P, returns to that contact P and ends there.

[0051] Therefore, while the scribe blade 55 is moving along the first machining line, the control unit 73 determines whether the scribe blade 55 has returned to the endpoint of the first machining line, that is, to the contact point P between the first machining line (first scribe line SL1) and the second machining line (second scribe line SL2) (step S6). If it is determined that the scribe blade 55 has not reached the contact point P (No in step S6), the control unit 73 continues to form the first scribe line SL1.

[0052] On the other hand, if the control unit determines that the scribe blade 55 has reached the contact point P (Yes in step S6), the control unit 73 controls the air cylinder 57 to reduce the load that the scribe blade 55 applies to the substrate W to a level lower than the load used when forming the first scribe line SL1 (and the second scribe line SL2) (step S7). At this time, the scribe blade 55 is still in contact with the substrate W.

[0053] When the scribe blade 55 reaches the contact point P again after passing through the first processing line from the contact point P, the second scribe line SL2 has already been formed at that contact point P. In this case, by making the load that the scribe blade 55 applies to the substrate W smaller than the load applied when forming the first scribe line SL1 (and the second scribe line SL2), the occurrence of chipping or other damage to the substrate W at the contact point P between the first scribe line SL1 and the second scribe line SL2 can be suppressed. As a result, a first scribe line SL1 of higher quality can be formed.

[0054] If the scribe blade 55 reaches the contact point P after passing through the first processing line and then needs to form the next first scribe line SL1 (No in step S8), the control unit 73 changes the movement path of the scribe blade 55 from the first processing line to the second processing line while keeping the scribe blade 55 in contact with the substrate W. The control unit also increases the load applied by the scribe blade 55 to the substrate W to the load used when forming the scribe line and starts forming the next first scribe line SL2, which is also in contact with the first scribe line SL1 (i.e., returns to step S2). Subsequently, by repeatedly executing steps S2 to S8, multiple first scribe lines SL1 and (one) second scribe line SL2 can be continuously formed without separating the scribe blade 55 from the substrate W.

[0055] On the other hand, if there are no further first scribe lines SL1 and / or second scribe lines SL2 to be formed (Yes in step S8), a third scribe line SL3 is further formed to assist in individually separating the small pieces from the substrate W. Specifically, the third scribe line SL3 is formed as follows.

[0056] First, the scribe blade 55 is directed in the second direction D2, which is the extension direction of the third scribe line SL3 (step S9). Specifically, the control unit 73 of the control device 7 controls the lifting mechanism to bring the scribe blade 55 into contact with the substrate W, controls the air cylinder 57 to control the load that the scribe blade 55 places on the substrate W, and controls the first motor 23 and / or the second motor 35 to move the table 1 and / or the scribe head 5 relative to the substrate W, thereby moving the scribe blade 55 in the second direction D2 and directing the scribe blade 55 in the second direction D2.

[0057] After orienting the scribe blade 55 in the second direction D2, the control unit 73 controls the first motor 23 and / or the second motor 35 to move the scribe head 5 horizontally relative to the substrate W, positioning the scribe blade 55 at the starting position for forming the third scribe line SL3 (the starting position for the third machining line to form the third scribe line SL3). Subsequently, the control unit 73 controls the lifting mechanism to move the scribe blade 55 in the Z direction to bring it into contact with the substrate W, and controls the air cylinder 57 to control the load that the scribe blade 55 applies to the substrate W.

[0058] Furthermore, the control unit 73 controls the first motor 23 and / or the second motor 35 to move the scribe blade 55 along the third processing line while the scribe blade 55 is in contact with the substrate W under a predetermined load, thereby forming the third scribe line SL3 (step S10). Specifically, the control unit 73 controls the first motor 23 and / or the second motor 35 to move the scribe blade 55 relative to the substrate W from the starting position in the second direction D2, which is the extension direction of the third scribe line SL3, thereby forming the third scribe line SL3.

[0059] In the method for forming scribe lines according to this embodiment, a second scribe line SL2 is first formed in contact with the first scribe line SL1. When the scribe blade 55 reaches the contact point P between the first scribe line SL1 and the second scribe line SL2, the movement path of the scribe blade 55 is changed from a second processing line for forming the second scribe line SL2 to a first processing line for forming the first scribe line SL1, while the scribe blade 55 remains in contact with the substrate W. Then, the first scribe line SL1 is formed by moving the scribe blade 55 back to the same contact point P along the first processing line. In other words, the second scribe line SL2 and the first scribe line SL1 can be formed continuously by moving the scribe blade 55 in a "single stroke" manner along the second processing line of the second scribe line SL2 and the first processing line of the first scribe line SL1. In other words, after forming the second scribe line SL2, it becomes unnecessary to temporarily remove the scribe blade 55 from the substrate W and then re-contact it in order to form the first scribe line SL1. As a result, the formation time for the first scribe line SL1 and the second scribe line SL2 can be shortened compared to conventional methods.

[0060] 2. Other Embodiments Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible without departing from the spirit of the invention. In particular, the multiple embodiments and modifications described herein can be arbitrarily combined as needed. (A) The processing content and processing order of each step in the flowchart shown in Figure 6 can be modified as appropriate without departing from the spirit of the invention.

[0061] (B) In the above embodiment, the third scribe line SL3 was a scribe line extending in a second direction D2 perpendicular to the second scribe line SL2. However, it is not limited to this, and as shown in Figure 7, the third scribe line SL3 may be a scribe line parallel to the second scribe line SL2 (extending in a first direction D1) and located near the first scribe line SL1 on the opposite side in the second direction D2 from the contact point P where the second scribe line SL2 contacts the first scribe line SL1. Figure 7 shows another example of the third scribe line SL3.

[0062] Such a third scribe line SL3 may be formed so as not to contact the first scribe line SL1, as shown in Figure 7, or it may be formed to contact it, as shown in Figure 7. When the third scribe line SL3 is formed to contact the first scribe line SL1, the load applied when bringing the scribe blade 55 into contact with the substrate W at the contact point with the first scribe line SL1 during the formation of the third scribe line SL3 may be smaller than the load applied during the formation of the third scribe line SL3.

[0063] (C) In the above embodiment, the second scribe line SL2 was a straight scribe line, but is not limited to this. The second scribe line SL2 is in contact with the first scribe line SL1 at least at one point, and any shape can be formed as long as the scribe blade 55 is moved along the first and second processing lines in a "single stroke" manner to continuously form the first scribe line SL1 and the second scribe line SL2.

[0064] (D) In ​​the above embodiment, the first scribe line SL1 was formed after the second scribe line SL2 was formed. However, conversely, the second scribe line SL2 may be formed after the first scribe line SL1. In this case as well, the first scribe line SL1 is formed by moving the scribe blade 55 from the contact point P through the first processing line and back to the contact point P. Then, with the scribe blade 55 in contact with the substrate W, the movement path of the scribe blade 55 is changed from the first processing line to the second processing line, and the second scribe line SL2 is formed by moving the scribe blade 55 along the second processing line. In this way, the first scribe line SL1 and the second scribe line SL2 can be formed continuously.

[0065] 3. Features of the Embodiment The above embodiment can also be described as follows. (1) The method for forming a scribe line comprises the following steps. The following (a) to (c) do not limit the order in which each step is performed. (a) A step (for example, steps S1 to S3) of forming a second scribe line (for example, second scribe line SL2) on a substrate (for example, substrate W) by moving a scribe blade (for example, scribe blade 55) in contact with the substrate along a second processing line that is in contact with a first processing line for forming a first scribe line (for example, first scribe line SL1) of a predetermined shape. (b) A step (for example, step S4) in which the scribe blade changes its movement path while keeping the scribe blade in contact with the substrate at the point of contact between the first processing line and the second processing line. (c) A step of forming a first scribe line on the substrate by moving the scribe blade from the contact point through the first processing line and back to the contact point (for example, steps S5 to S7).

[0066] In the above-described scribe line formation method, when the scribe blade reaches the contact point between the first scribe line and the second scribe line, the movement path of the scribe blade is changed while the scribe blade remains in contact with the substrate. Furthermore, the first scribe line is formed by moving the scribe blade back to the contact point along the first processing line from the contact point. In other words, the first and second scribe lines are formed continuously by moving the scribe blade in a "single-stroke" manner along the first processing line of the first scribe line and the second processing line of the second scribe line. As a result, in the above-described scribe line formation method, it is unnecessary to temporarily remove the scribe blade from the substrate and then re-contact it in order to form the other scribe line after forming one scribe line. Consequently, the formation time for the first and second scribe lines is shortened compared to conventional methods.

[0067] (2) In the scribe line forming method described in (1) above, the contact point of the first processing line may have a curved shape. This allows the scribe blade to move with a certain degree of curvature when changing the movement path of the scribe blade. As a result, the path of the scribe blade can be changed smoothly.

[0068] (3) In the method for forming a scribe line described in (2) above, the corners of the first processed line may have a curved shape. This allows the scribe blade to move with a certain degree of curvature when moving it along the corners of the first processed line, so that the scribe blade can move smoothly along the first processed line. As a result, the occurrence of chipping of the substrate can be suppressed, and a first scribe line of higher quality can be formed.

[0069] (4) Any of the scribe line forming methods described in (1) to (3) above may further include a step (for example, step S7) in which, when the scribe blade reaches the contact point after the first scribe line or the second scribe line has been formed, the load applied by the scribe blade to the substrate is made smaller than the load applied when forming the scribe line. When the scribe blade reaches the contact point after the first scribe line or the second scribe line has been formed, the scribe line has already been formed at that contact point. In this case, by making the load applied by the scribe blade to the substrate smaller than the load applied when forming the scribe line, the occurrence of chipping of the substrate at the contact point between the first scribe line and the second scribe line can be suppressed, thereby enabling the formation of a first scribe line of higher quality.

[0070] (5) In any of the scribe line forming methods described in (1) to (4) above, after the step of forming the first scribe line, the movement path of the scribe blade may be further changed to a second processing line while the scribe blade remains in contact with the substrate at the contact point. This makes it possible to form multiple first scribe lines in a continuous manner.

[0071] (6) A scribe line forming apparatus (for example, a scribe line forming apparatus 100) comprises a scribe blade and a control unit (for example, a control unit 73). The scribe blade forms a scribe line on the substrate. The control unit controls the scribe blade.

[0072] In the above-described scribe line forming apparatus, the control unit moves the scribe blade, which is in contact with the substrate, along a second processing line that is in contact with a first processing line for forming a first scribe line of a predetermined shape on the substrate, thereby forming a second scribe line on the substrate. At the point of contact between the first processing line and the second processing line, while keeping the scribe blade in contact with the substrate, the control unit changes the movement path of the scribe blade, moving the scribe blade from the point of contact through the first processing line back to the point of contact, thereby forming a first scribe line on the substrate.

[0073] In the above-described scribe line forming apparatus, when the scribe blade reaches the contact point between the first scribe line and the second scribe line, the movement path of the scribe blade is changed while the scribe blade remains in contact with the substrate. Furthermore, the first scribe line is formed by moving the scribe blade back to the contact point along the first processing line from the contact point. In other words, the first and second scribe lines are formed continuously by moving the scribe blade in a "single stroke" manner along the first processing line of the first scribe line and the second processing line of the second scribe line. As a result, in the above-described scribe line forming apparatus, it is unnecessary to temporarily remove the scribe blade from the substrate and then re-contact it in order to form the other scribe line after forming one scribe line. Consequently, the formation time for the first and second scribe lines is shortened compared to conventional methods. [Industrial applicability]

[0074] This invention can be widely applied when forming scribe lines on a substrate. [Explanation of symbols]

[0075] 100: Scribe line forming apparatus 1: Table 2: Mobile stand 21a, 21b: Rail 23: First motor 25: Ball screw 3: Bridge 31a, 31b: Post 33: Guide 35: Second motor 5: Scribehead 51: Holder joint 53: Holder Unit 55: Scribe Blade 57: Air Cylinder 7: Control device 71: Storage section 73: Control Unit W: Circuit board SL1: First scribe line SL2: Second Scribe Line SL3: Third Scribe Line P: Contact

Claims

1. The steps include: moving a scribe blade in contact with the substrate along a second processing line that is in contact with a first processing line for forming a predetermined shape of first scribe line on the substrate, thereby forming a second scribe line on the substrate; The steps include changing the movement path of the scribe blade while keeping it in contact with the substrate at the point of contact between the first processing line and the second processing line, The steps include: moving the scribe blade from the contact point through the first processing line and back to the contact point to form a first scribe line on the substrate; A method for forming a scribe line, comprising the following features.

2. The method for forming a scribe line according to claim 1, wherein the portion of the first processed line at the point of contact has a curved shape.

3. The method for forming a scribe line according to claim 2, wherein the corner portion of the first processed line has a curved shape.

4. The method for forming a scribe line according to claim 1, further comprising the step of making the load applied by the scribe blade to the substrate less than the load applied when forming the scribe line when the scribe blade reaches the contact point after forming the first scribe line or the second scribe line.

5. The method for forming a scribe line according to claim 1, wherein, after the step of forming the first scribe line, the movement path of the scribe blade is further changed to a second processing line while the scribe blade remains in contact with the substrate at the contact point.

6. A scribe blade that forms a scribe line on a substrate, A control unit for controlling the scribe blade, Equipped with, The control unit, A scribe blade in contact with the substrate is moved along a second processing line that is in contact with a first processing line for forming a first scribe line of a predetermined shape on the substrate, thereby forming a second scribe line on the substrate. At the point of contact between the first processing line and the second processing line, while keeping the scribe blade in contact with the substrate, the movement path of the scribe blade is changed. The scribe blade is moved from the contact point through the first processing line and back to the contact point to form the first scribe line on the substrate. Scribe line forming apparatus.

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