Semiconductor testing equipment and inspection systems

Abstract

In semiconductor testing equipment where multiple circuit board units are housed inside a casing, this prevents circuit board units from being inserted into the wrong slot. [Solution] The tester 2 comprises a card guide 20 that extends vertically in each slot 13 and has a groove 21 into which the side end 11e of the substrate unit 11 is inserted, and a guide block 30 that is located above the card guide 20 and extends along the arrangement direction of the substrate unit 11 so as to overlap the plurality of card guides 20 when viewed from above, the guide block 30 has recesses 31 that are provided for each card guide 20 and expose the grooves 21 of the card guide 20 when viewed from above, and a substrate unit temporary mounting surface 34 that is located between adjacent recesses 31 when viewed from above and into which the substrate unit 11 can be temporarily placed.

Description

Technical Field

[0001] The present invention relates to a semiconductor test apparatus and an inspection system.

Background Art

[0002] For example, Patent Document 1 discloses a wafer test system including a test head and a probe. The wafer test system disclosed in Patent Document 1 includes a test head and a test head support / damping device.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An inspection system such as the wafer system disclosed in Patent Document 1 includes a semiconductor test apparatus that inspects a semiconductor integrated circuit like the test head of Patent Document 1. The semiconductor test apparatus includes a housing and a plurality of substrate units housed inside the housing. When assembling the semiconductor test apparatus, the substrate units are inserted into each of a plurality of slots provided inside the housing. There are many types of substrate units, and the slots into which they are to be inserted in advance are determined. However, since a large number of slots are arranged in proximity, there is a possibility that the substrate units may be inserted into the wrong slots.

[0005] The present invention has been made in view of the above-described problems, and an object thereof is to suppress the insertion of substrate units into wrong slots in a semiconductor test apparatus in which a plurality of substrate units are housed inside a housing.

Means for Solving the Problems

[0006] The present invention employs the following configuration as a means to solve the above problems.

[0007] A semiconductor testing apparatus according to one aspect of the present invention comprises a housing provided with a plurality of slots into which substrate units are inserted; a plurality of substrate units inserted from above into the slots and installed inside the housing, arranged horizontally facing each other; a guide member provided extending vertically into each of the slots and having a groove into which the side end of the substrate unit is inserted; and a block member located above the guide member and extending along the arrangement direction of the substrate units so as to overlap the plurality of guide members when viewed from above, wherein the block member is provided with recesses that expose the grooves of the guide members when viewed from above and are provided for each guide member, and a substrate unit temporary placement surface located between adjacent recesses when viewed from above, into which the substrate units can be temporarily placed.

[0008] An inspection system according to one aspect of the present invention comprises the above-described semiconductor testing apparatus and a test object transport device that moves a test object on which a semiconductor integrated circuit is provided and connects it to the semiconductor testing apparatus. [Effects of the Invention]

[0009] According to the present invention, in a semiconductor testing apparatus in which multiple substrate units are housed inside a casing, it is possible to prevent substrate units from being inserted into the wrong slots. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic diagram showing the general configuration of an inspection system in one embodiment of the present invention. [Figure 2] This is a perspective view of the tester in one embodiment of the present invention. [Figure 3] This is an exploded perspective view of a tester in one embodiment of the present invention. [Figure 4] This is a front view of a substrate unit in one embodiment of the present invention, viewed from the horizontal direction. [Figure 5] This is a schematic plan view of the main enclosure of one embodiment of the present invention, seen from above. [Figure 6] This is a schematic front view of the card guide in one embodiment of the present invention, viewed from the Y direction. [Figure 7] This is an enlarged view of section A in Figure 6. [Figure 8] This is a schematic perspective view of inserting a substrate unit into a slot in one embodiment of the present invention. [Figure 9] This is a schematic partial plan view of a guide block included in a modified version of the tester of this embodiment. [Modes for carrying out the invention]

[0011] Hereinafter, an embodiment of the semiconductor testing apparatus and inspection system according to the present invention will be described with reference to the drawings.

[0012] Figure 1 is a schematic diagram showing the general configuration of the inspection system 1 of this embodiment. The inspection system 1 of this embodiment uses a wafer W on which semiconductor circuits are provided as the test object and performs inspection of the electrical characteristics of the semiconductor integrated circuit. As shown in Figure 1, the inspection system 1 comprises a tester 2 (semiconductor test equipment) and a prober 3 (test object transport equipment). This inspection system 1 inspects the electrical characteristics of each semiconductor circuit before separating the multiple semiconductor circuits formed on the wafer W into individual chips.

[0013] A probe card 4 is attached to the tester 2. The probe card 4 has multiple probes. The prober 3 brings the multiple probes on the probe card 4 into contact with the pads of multiple semiconductor circuits formed on the wafer W. The prober 3 includes a tester moving device 3a, a stage device 3b, and a wafer transport device 3c.

[0014] The tester moving device 3a includes a moving mechanism (not shown) and moves the tester 2 between the standby position 1A and the inspection position 1B. The stage device 3b supports the wafer W and aligns the tester 2 located at the inspection position 1B with the wafer W. The stage device 3b is movable in a planar direction along the horizontal plane and in a vertical direction perpendicular to the horizontal plane, and is further rotatable in the θ direction around the vertical axis. The wafer transfer device 3c transfers the wafer W onto the stage device 3b.

[0015] When performing an inspection, the stage device 3b moves the wafer W and brings the pads of the plurality of semiconductor circuits formed on the wafer W into contact with the tip portions of the plurality of probes of the probe card 4 provided on the tester 2 located at the inspection position 1B. In this state, the tester 2 inputs test signals to each semiconductor circuit simultaneously via the plurality of probes and receives the output signals from each semiconductor circuit, thereby inspecting each semiconductor circuit.

[0016] FIG. 2 is a perspective view of the tester 2. FIG. 3 is an exploded perspective view of the tester 2. As shown in these figures, the tester 2 includes a main body portion 2a and a performance board unit 2b. In FIGS. 2 and 3, the tester 2 disposed at the standby position 1A is illustrated. At the standby position 1A, the tester 2 is in a posture with the side where the probe card 4 is mounted facing upward. In the following description, the description will be made based on the direction in the state where the tester 2 is disposed at the standby position 1A. In the present embodiment, a plurality of substrate units 11 described later are arranged horizontally in a state of facing each other, and in the following description, the arrangement direction of the plurality of substrate units 11 is defined as the X direction. The horizontal direction orthogonal to the X direction is defined as the Y direction.

[0017] The main body part 2a is a unit that performs signal processing and the like for the test of the wafer W, and detachably supports the performance board unit 2b. The main body part 2a includes a main body housing 10 (housing) and a plurality of substrate units 11. Further, the main body part 2a further includes a control processing unit and the like not shown in the figure. The control processing unit inputs a control signal to each substrate unit 11, for example. Further, the control processing unit may process the signals input from each substrate unit 11. Also, a battery may be housed inside the main body housing 10, and the control processing unit may include a power supply unit for supplying the power of the battery to each substrate unit 11 and the like.

[0018] The main body housing 10 is a housing that houses the substrate unit 11. In the present embodiment, the main body housing 10 is formed in a box shape that opens upward. Inside the main body housing 10, a plurality of slots 13 (see FIG. 5) into which the substrate unit 11 can be inserted are provided. The substrate unit 11 is housed inside the main body housing 10 by being inserted into these slots 13 one by one. Also, a plurality of positioning pins 10a for the performance board unit are provided on the upper surface of the main body housing 10. These positioning pins 10a for the performance board unit perform horizontal positioning of the performance board unit 2b when the performance board unit 2b is mounted on the main body part 2a from above.

[0019] The substrate unit 11 is a substrate on which electronic components for performing various signal processes are mounted, and is replaceable according to the type of test to be performed on the wafer W and the like. FIG. 4 is a front view of the substrate unit 11 seen from the horizontal direction. As shown in this figure, the substrate unit 11 includes a substrate main body 11a, an upper plate 11b, an upper connector part 11c, and a lower connector part 11d.

[0020] The substrate body 11a is an electronic circuit board and is housed in the main body housing 10 with its front and back surfaces facing horizontally. As shown in Figure 3, the multiple substrate units 11 are arranged in the X direction so that the front and back surfaces of each substrate body 11a face each other. This X direction is horizontal when the tester 2 is in the standby position 1A. In other words, each substrate unit 11 has a substrate body 11a that is inserted into the main body housing 10 in a position where its front and back surfaces face the X direction which is aligned horizontally. The side ends of such substrate bodies 11a form the side ends 11e of the substrate unit 11.

[0021] The upper plate 11b is a strip-shaped plate member connected to the upper end of each substrate body 11a. The upper plate 11b extends along the Y direction in a plan view. An upper connector portion 11c is fixed to each upper plate 11b. The upper plate 11b may be formed from a single strip-shaped plate member, or it may be formed by stacking multiple plate members.

[0022] The upper connector section 11c is provided for each board body 11a. For example, one to three upper connector sections 11c are provided for each board body 11a. Each upper connector section 11c is fixed to the upper plate 11b and is electrically connected to the board body 11a. Such upper connector sections 11c can be connected to the lower connector section for the performance board unit, which will be described later, provided on the performance board unit 2b. The board unit 11 is electrically connected to the performance board unit 2b by the connection of the upper connector section 11c to the lower connector section for the performance board unit.

[0023] The lower connector section 11d is provided at the lower edge of each circuit board body 11a. Multiple bottom connector sections 12 (see Figure 5) are provided at the bottom of the main body housing 10. Each lower connector section 11d is connected to a bottom connector section 12. For example, the circuit board unit 11 is electrically connected to the control processing unit by being connected to the bottom connector section 12. The number of lower connector sections 11d can be changed according to the circuit board unit 11.

[0024] Each circuit board unit 11 is housed inside the main housing 10 by inserting the circuit board body 11a into a slot 13 provided in the main housing 10. Each circuit board unit 11 is inserted into the main housing 10 from top to bottom, as shown by the arrows in Figure 4. Multiple types of circuit board units 11 exist, for example, depending on differences in function. In other words, different types of circuit board units 11 are housed in the main housing 10. These circuit board units 11 are installed in predetermined positions inside the main housing 10 according to their type.

[0025] Figure 5 is a schematic plan view of the main housing 10 as seen from above. As shown in Figure 5, the main housing 10 is provided with slots 13 into which the circuit board units 11 can be inserted. A slot 13 is provided for each circuit board unit 11 and is arranged in the X direction. The bottom connector portion 12 described above is provided in one of the slots 13.

[0026] Furthermore, each slot 13 is provided to extend in the Y direction (slot extension direction), as shown in Figure 5. Card guides 20 (guide members) are provided at each of the Y-direction ends of such slots 13. Figure 6 is a schematic front view of the card guide 20 as seen from the Y direction. Figure 7 is an enlarged view of part A in Figure 6. As shown in Figures 6 and 7, a guide block 30 (block member) is provided above the card guide 20. In other words, the tester 2 of this embodiment comprises a plurality of card guides 20 and guide blocks 30.

[0027] As described above, the card guides 20 are located at both ends in the Y direction of each slot 13. In other words, there are two card guides 20 for each slot 13. Figure 6 shows the card guide 20 located at one end of the slot 13, out of the two card guides 20 provided for one card guide 20. Note that the card guide 20 located at the other end of the slot 13 has the same structure as the card guide 20 located at one end, so a detailed explanation is omitted.

[0028] As shown in Figure 6, each card guide 20 is provided extending vertically into each slot 13. Each card guide 20 is provided with a groove 21 into which the side end 11e of the circuit board unit 11 is inserted. The groove 21 is formed as a recess extending from the inside to the outside of the main housing 10 along the Y direction. The upper end of the groove 21 is open upward. This upper end of the groove 21 is the entrance end 21a, which is the entrance to the groove 21 when the circuit board unit 11 is inserted into the slot 13. Furthermore, the width dimension (dimension in the X direction) of the groove 21 decreases continuously downward from the entrance end 21a, and becomes a constant width dimension after the lower connector portion 11d of the circuit board unit 11 inserted into the groove 21 is positioned to be mated with the bottom connector portion 12.

[0029] Such card guides 20 are fixed to the main body housing 10. For example, the main body housing 10 has a frame (not shown), and the card guides 20 are fixed to this frame. Alternatively, each card guide 20 may be divided and formed into multiple parts arranged in the vertical direction.

[0030] Guide blocks 30 are provided above the card guides 20 located at one end of slot 13 and above the card guides 20 located at the other end of slot 13. In other words, the same number of card guides 20 are provided as the number of slots 13 and are arranged in the X direction. One guide block 30 is provided above these card guides 20. Similarly, the same number of card guides 20 are provided as the number of slots 13 and are arranged in the X direction. One guide block 30 is also provided above these card guides 20.

[0031] Furthermore, if necessary, the guide block 30 above the card guide 20 located at one end of the slot 13 will be referred to as the first guide block 30a, and the guide block 30 above the card guide 20 located at the other end of the slot 13 will be referred to as the second guide block 30b. In other words, the tester 2 is provided with a first guide block 30a, which is a guide block 30 located at one end of the slot 13 in the Y direction when viewed from above, and a second guide block 30b, which is a guide block 30 located at the other end of the slot 13 in the Y direction when viewed from above.

[0032] As shown in Figure 5, each guide block 30 is a rod-shaped member extending along the X direction. In this embodiment, the guide block 30 is formed to have a rectangular cross-section. Each guide block 30 is positioned to overlap with a plurality of card guides 20 when viewed from above. Specifically, the first guide block 30a is positioned to overlap with a card guide 20 located at one end of the slot 13. The second guide block 30b is positioned to overlap with a card guide 20 located at the other end of the slot 13.

[0033] Each guide block 30 has a recess 31 provided so as to expose the groove 21 of the card guide 20 when viewed from above. The recess 31 is formed to be recessed in the Y direction, extending from the inside to the outside of the main housing 10, similar to the groove 21 of the card guide 20. The recess 31 is also formed to penetrate the guide block 30 in the vertical direction. The upper end of such a recess 31 is an entrance end 31a that serves as the entrance to the recess 31 when the circuit board unit 11 is inserted into the slot 13.

[0034] As shown in Figure 7, each recess 31 is provided with an upper portion 32 that forms the upper part of the recess 31 and a lower portion 33 that forms the lower part of the recess 31. The upper portion 32 is provided with an entrance end 31a and is formed so as to continuously decrease in width (dimension in the X direction) toward the bottom. The lower portion 33 is connected to the lower end of the upper portion 32 and is also connected to the entrance end 21a of the groove 21.

[0035] The width dimension d1 (dimension in the X direction) of the entrance end 31a of the recess 31 is greater than the width dimension d2 of the entrance end 21a of the groove 21. Furthermore, it is preferable that the width dimension d3 at the lower end of the lower portion 33 is less than or equal to the width dimension d2 of the entrance end 21a of the groove 21. By ensuring that the width dimension d3 at the lower end of the lower portion 33 is less than or equal to the width dimension d2 of the entrance end 21a of the groove 21, it is possible to prevent the substrate unit 11 from getting caught on the card guide 20 when the substrate unit 11 is inserted.

[0036] Between the recesses 31 of the guide block 30, there is a temporary substrate unit mounting surface 34 on which the substrate unit 11 can be temporarily placed during insertion. In other words, the guide block 30 has a temporary substrate unit mounting surface 34 located between the recesses 31. This temporary substrate unit mounting surface 34 is formed by the upper surface of the guide block 30.

[0037] As shown in Figure 5, the distance da between the temporary substrate unit mounting surface 34 of the first guide block 30a and the temporary substrate unit mounting surface 34 of the second guide block 30b is smaller than the length dimension db (see Figure 4) of the substrate unit 11 in the Y direction. Therefore, both ends of the substrate unit 11 can be placed on the temporary substrate unit mounting surface 34 of the guide block 30 from above before inserting the substrate unit 11 into the slot 13.

[0038] Furthermore, each guide block 30 is fixed to the main body housing 10 by bolts 40, as shown in Figure 6. Alternatively, each guide block 30 may be divided into multiple parts 35 arranged in the X direction.

[0039] Returning to Figures 2 and 3, the performance board unit 2b is detachable from the main body 2a and is fixed to the main body 2a by a locking mechanism (not shown). The performance board unit 2b is connected to the probe card 4 from above and can be electrically connected to the wafer W via the probe card 4.

[0040] Such a performance board unit 2b includes multiple lower connectors for the performance board unit (not shown) that are connected to the upper connector 11c of the board unit 11. Furthermore, as shown in Figures 2 and 3, the performance board unit 2b includes multiple upper connectors 2b1 for the performance board unit that are connected to the probe card 4.

[0041] When assembling such a tester 2, the circuit board unit 11 is inserted into each slot 13 of the main body housing 10. Figure 8 is a schematic perspective view of inserting the circuit board unit 11 into the slot 13. As shown in this figure, the operator can place both ends of the circuit board unit 11 against the temporary mounting surface 34 of the guide block 30 from above, and temporarily place the circuit board unit 11 on the guide block 30. Therefore, with the circuit board unit 11 temporarily placed, the slot 13 into which the circuit board unit 11 should be inserted can be visually confirmed.

[0042] Next, the side end 11e of the circuit board unit 11 is aligned with the recess 31 of the guide block 30, and the circuit board unit 11 is inserted from top to bottom. The side end 11e of the circuit board unit 11 is inserted into the groove 21 of the card guide 20, and guided by the card guide 20, it is inserted to the bottom of the slot 13. Once all the circuit board units 11 have been inserted into the slots 13, the performance board unit 2b is fixed to the main body 2a, and the assembly of the tester 2 is completed.

[0043] The tester 2 of this embodiment, as described above, comprises a main body housing 10, a plurality of circuit board units 11, a card guide 20, and a guide block 30. The main body housing 10 has a plurality of slots 13 into which the circuit board units 11 are inserted. The circuit board units 11 are inserted into the slots 13 from above and installed inside the main body housing 10. The plurality of circuit board units 11 are arranged horizontally facing each other. The card guide 20 is provided extending vertically into each slot 13. The card guide 20 also has a groove 21 into which the side end 11e of the circuit board unit 11 is inserted. The guide block 30 is located above the card guide 20 and is provided extending along the arrangement direction (X direction) of the circuit board units 11 so as to overlap the plurality of card guides 20 when viewed from above.

[0044] The guide block 30 is also provided with a recess 31 and a temporary substrate unit mounting surface 34. The recess 31 exposes the groove 21 of the card guide 20 when viewed from above. A recess 31 is provided for each card guide 20. The temporary substrate unit mounting surface 34 is located between adjacent recesses 31 when viewed from above, allowing the substrate unit 11 to be temporarily placed there.

[0045] According to the tester 2 of this embodiment, when assembling, the worker can temporarily place the circuit board unit 11 on the guide block 30 by placing both ends of the circuit board unit 11 against the temporary mounting surface 34 of the guide block 30 from above before inserting the circuit board unit 11 into the slot 13. This allows the worker to visually confirm which slot 13 the circuit board unit 11 should be inserted into while it is temporarily placed. It is also possible to adjust the orientation of the circuit board unit 11 while it is temporarily placed. Therefore, compared to inserting the circuit board unit 11 directly into the slot 13 without temporarily placing it, the possibility of inserting the circuit board unit 11 into the wrong slot 13 can be reduced. Thus, according to the tester 2 of this embodiment, it is possible to suppress the insertion of a circuit board unit 11 into the wrong slot 13 in a tester 2 in which multiple circuit board units 11 are housed inside the main body housing 10.

[0046] Furthermore, in the tester 2 of this embodiment, the card guide 20 is provided at each end of the slot extension direction (Y direction), which is the horizontal direction perpendicular to the arrangement direction of the slots 13. In addition, a first guide block 30a and a second guide block 30b are provided as guide blocks 30. The first guide block 30a is a guide block 30 located at one end of the slot 13 in the Y direction when viewed from above. The second guide block 30b is a guide block 30 located at the other end of the slot 13 in the Y direction when viewed from above. Furthermore, the distance da between the temporary mounting surface 34 of the substrate unit of the first guide block 30a and the temporary mounting surface 34 of the substrate unit of the second guide block 30b is smaller than the length dimension db of the substrate unit 11 in the Y direction.

[0047] According to the tester 2 of this embodiment, when temporarily placing the substrate unit 11 on the temporary substrate unit mounting surface 34, each of the ends of the substrate unit 11 can be placed on the guide block 30. In other words, when temporarily placing the substrate unit 11 on the temporary substrate unit mounting surface 34, the substrate unit 11 can be temporarily placed so as to straddle the first guide block 30a and the second guide block 30b. Therefore, according to the tester 2 of this embodiment, the substrate unit 11 can be stabilized compared to the case where only one of the two ends of the substrate unit 11 is placed on the guide block 30.

[0048] Furthermore, in the tester 2 of this embodiment, the guide block 30 may be divided into a plurality of parts 35 arranged in the X direction. Dividing the guide block 30 makes it easier to handle during assembly and manufacturing compared to a guide block 30 that is not divided.

[0049] Furthermore, in the tester 2 of this embodiment, the width dimension d1 of the entrance end 31a of the recess 31 is larger than the width dimension d2 of the entrance end 21a of the groove 21. With the tester 2 of this embodiment, the substrate unit 11 can be inserted into the groove 21 of the card guide 20 via the recess 31, which has a large width dimension d1 of the entrance end 31a. Therefore, compared to the case where the guide block 30 is not provided, it is possible to easily insert the substrate unit 11 into the groove 21 of the card guide 20.

[0050] Furthermore, in the tester 2 of this embodiment, the recess 31 is provided with an upper portion 32 and a lower portion 33. The upper portion 32 has an entrance end 31a and its width decreases continuously toward the bottom. The lower portion 33 is connected to the lower end of the upper portion 32 and is also connected to the entrance end 21a of the groove portion 21. With the tester 2 of this embodiment, the X-direction positioning of the substrate unit 11 moving from top to bottom can be performed, and the substrate unit 11 can be easily inserted into the groove portion 21 of the card guide 20.

[0051] Furthermore, in the tester 2 of this embodiment, the width dimension d3 at the lower end of the lower portion 33 is less than or equal to the width dimension d2 of the entrance end 21a of the groove portion 21. With the tester 2 of this embodiment, when viewed from above, the upper end surface of the card guide 20 is prevented from being exposed in the recess 31, and the substrate unit 11 can be easily inserted into the groove portion 21 of the card guide 20.

[0052] Furthermore, the inspection system 1 of this embodiment includes a tester 2 and a prober 3. The prober 3 moves the wafer W on which the semiconductor integrated circuit is provided and connects it to the tester 2. With this inspection system 1 of this embodiment, because it includes a tester 2, it is possible to prevent the substrate unit 11 from being inserted into the wrong slot 13.

[0053] While preferred embodiments of the present invention have been described and explained above, it should be understood that these are illustrative and should not be considered limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the invention. Therefore, the present invention should not be considered limited by the foregoing description, but rather limited by the claims.

[0054] For example, as shown in Figure 9, the guide block 30 may be divided into multiple recesses 31, and each divided region 50 may be sequentially colored with two colors. That is, for example, if the region 50 is colored with black and white, the black region 50 (black region 51) and the white region 50 (white region 52) are arranged in order in the extending direction of the guide block 30. This makes it easier to distinguish adjacent recesses 31, and further suppresses the insertion of the substrate unit 11 into the wrong slot 13. It is preferable that the regions 50 included in the same slot 13 of the first guide block 30a and the second guide block 30b are colored the same. This ensures that both ends of the substrate unit 11 are inserted into the recesses 31 of the regions 50 that are colored the same, further suppressing the insertion of the substrate unit 11 into the wrong slot 13.

[0055] Furthermore, in the above embodiment, for example, the temporary mounting surface 34 of the guide block 30 for the substrate unit may be processed to increase the frictional force. This can prevent the substrate unit 11 temporarily placed on the temporary mounting surface 34 from sliding. To increase the frictional force, for example, the temporary mounting surface 34 of the substrate unit may be made rougher than the other surfaces of the guide block 30. Alternatively, to increase the frictional force, for example, a coating material that increases frictional force may be applied to the temporary mounting surface 34 of the substrate unit.

[0056] Furthermore, the shape of the tester 2 is not limited to the shape shown in the above embodiment. For example, the shape of the tester 2 may be smaller than the shape shown.

[0057] For example, the above embodiment described an example in which the present invention is applied to an inspection system equipped with a prober 3 as a test object transport device. However, the present invention is not limited thereto. For example, the present invention can also be applied to an inspection system equipped with a handler as a test object transport device. When the present invention is applied to an inspection system equipped with a handler, the tester 2 is moved relative to the handler, and the tester 2 and the wafer are connected via a probe card.

[0058] Note that the test object is not limited to wafers. For example, the test object may be a packaged device. In such cases, tester 2 is connected to the device via a test socket. [Explanation of symbols]

[0059] 1. Inspection System 2. Tester (semiconductor testing equipment) 2a Main body 3. Probe (Test object transport device) 10. Main unit (casing) 10a pin 11 Circuit board unit 11a Main board 11b Upper plate 11c Upper connector section 11d Lower connector section 11e Side edge 12 Bottom connector section 13 slots 20 Card Guide 21 Groove 21a Inlet end 30 Guide Blocks 30a First guide block 30b Second guide block 31 Recess 31a Inlet end 32 Upper part 33 Lower part 34 Temporary mounting surface for circuit board unit 35 parts 40 volts 50 areas 51 Black Area 52 White area W wafer (test subject)

Claims

1. A housing with multiple slots inside into which circuit board units are inserted, A plurality of the aforementioned circuit board units are inserted into the aforementioned slots from above and installed inside the housing, and are arranged horizontally facing each other, A guide member is provided in each of the aforementioned slots, extending in the vertical direction, and having a groove into which the side end of the substrate unit is inserted. A block member is provided located above the guide member and extending along the arrangement direction of the substrate unit so as to overlap the plurality of guide members when viewed from above, Equipped with, The aforementioned block member is When viewed from above, the groove portion of the guide member is exposed, and recesses are provided for each guide member, A temporary mounting surface for the substrate unit, located between adjacent recesses when viewed from above, on which the substrate unit can be temporarily placed, It is provided. Semiconductor testing equipment.

2. The guide members are provided at each end of the slot in the slot extension direction, which is a horizontal direction perpendicular to the arrangement direction. The block members include a first block member located at one end of the slot in the slot extension direction when viewed from above, and a second block member located at the other end of the slot in the slot extension direction when viewed from above. The distance between the temporary mounting surface of the substrate unit of the first block member and the temporary mounting surface of the substrate unit of the second block member is smaller than the length dimension of the substrate unit in the slot extension direction. The semiconductor testing apparatus according to claim 1.

3. The block member is divided and formed into a plurality of parts arranged in the arrangement direction. The semiconductor testing apparatus according to claim 1 or 2.

4. The dimension of the entrance end of the recess in the direction of arrangement is greater than the dimension of the entrance end of the groove in the direction of arrangement. The semiconductor testing apparatus according to claim 1 or 2.

5. The aforementioned recess is An upper portion is provided which has an entrance end and whose width dimension continuously decreases downwards, A lower portion connected to the lower end of the upper portion and connected to the entrance end of the groove, It is provided. The semiconductor testing apparatus according to claim 4.

6. The width dimension at the lower end of the lower portion is less than or equal to the width dimension at the entrance end of the groove. The semiconductor testing apparatus according to claim 5.

7. The block member is color-coded according to the number of recesses. The semiconductor testing apparatus according to claim 1 or 2.

8. A semiconductor testing apparatus according to claim 1 or 2, A test object transport device that moves a test object equipped with a semiconductor integrated circuit and connects it to the semiconductor test apparatus, Equipped with, Inspection system.

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