Multilayer electronic components

Abstract

In a three-terminal multilayer ceramic capacitor (MLCC), a dummy pattern is placed in the margin area of ​​the internal ground electrode to mitigate the step difference and improve the density of the outer casing. [Solution] The stacked electronic component includes a body containing a dielectric layer and first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer, first and second faces facing in a first direction, third and fourth faces 3 and 4 facing in the Y direction perpendicular to the first direction, and fifth and sixth faces 5 and 6 facing in the Z direction perpendicular to the first and second directions, a first external electrode 130 disposed on the third face and connected to the first internal electrode, a second external electrode 140 disposed on the fourth face and connected to the first internal electrode, a third external electrode 150 disposed on the fifth face and connected to the second internal electrode, and a fourth external electrode 160 disposed on the sixth face and connected to the second internal electrode, and the body further includes a dummy pattern 123 disposed between the second internal electrode and the fifth face and between the second internal electrode and the sixth face.

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of stacked electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products, such as video equipment like liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones and mobile phones, on-board chargers (OBCs) in electric vehicles, and DC-DC converters, and plays the role of charging or discharging electricity.

[0003] In addition to two-terminal MLCCs with two external electrodes, three-terminal or four-terminal MLCCs have been developed with modified internal and external electrode structures to improve frequency characteristics.

[0004] Three-terminal MLCCs have a structure in which signal internal electrodes and ground internal electrodes are stacked alternately. Because the ground internal electrode pattern must be drawn in a different direction from the signal internal electrode pattern, the area on the dielectric layer where the internal electrode pattern is not formed during the stacking and crimping process of the laminate may be larger than that of a two-terminal MLCC, and the resulting step difference may be more pronounced than in a two-terminal MLCC.

[0005] On the other hand, steps that occur during the lamination and crimping processes to form the MLCC body can lead to stress imbalances in the body, potentially reducing the mechanical strength of the MLCC. This can also cause internal electrodes to warp and decrease the density of the dielectric layer, thus reducing the reliability of the MLCC.

[0006] Therefore, there is a need for structural improvements to MLCCs that can mitigate the step caused by the unformed regions of the internal electrodes in 3-terminal MLCCs. [Overview of the project] [Problems that the invention aims to solve]

[0007] One of the several objectives of this invention is to mitigate the step difference that occurs in 3-terminal MLCCs.

[0008] One of the several objectives of the present invention is to minimize the negative effects that occur when forming a dummy pattern in the margin of the ground internal electrode to mitigate the step difference that occurs in a 3-terminal MLCC.

[0009] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0010] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer, and comprises a body including first and second faces facing a first direction, third and fourth faces facing a second direction perpendicular to the first direction, and fifth and sixth faces facing a third direction perpendicular to the first and second directions; a first external electrode disposed on the third face and connected to the first internal electrode; a second external electrode disposed on the fourth face and connected to the first internal electrode; a third external electrode disposed on the fifth face and connected to the second internal electrode; and a fourth external electrode disposed on the sixth face and connected to the second internal electrode, wherein the body may further include dummy patterns disposed between the second internal electrode and the fifth face, and between the second internal electrode and the sixth face. [Effects of the Invention]

[0011] One of the several effects of the present invention is that, in a 3-terminal MLCC, the step difference is mitigated by placing a dummy pattern in the margin area of ​​the internal ground electrode, thereby improving the density of the outer casing of the main body.

[0012] One of the several effects of the present invention is that it prevents or minimizes the reliability degradation problem that can occur when a dummy pattern is formed in the margin portion of the ground internal electrode to mitigate the step difference that occurs in a 3-terminal MLCC.

[0013] However, the diverse yet beneficial advantages and effects of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Brief explanation of the drawing]

[0014] [Figure 1] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 2] This diagram schematically shows a perspective view of the main body according to one embodiment. [Figure 3] This is a schematic cross-sectional view along the line I-I' in Figure 1. [Figure 4] This is a schematic cross-sectional view along the line II-II' in Figure 1. [Figure 5] These are cross-sectional views in the first and second directions of a multilayer electronic component according to one embodiment, after polishing in the first direction up to the line A-A' in Figure 3. [Figure 6] These are cross-sectional views in the first and second directions of a multilayer electronic component according to one embodiment, after polishing in the first direction up to the line B-B' in Figure 3. [Figure 7] Figure 6 is an enlarged view of region P. [Modes for carrying out the invention]

[0015] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape, size, etc. of the elements in the drawings can be exaggerated for a clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0016] And, in order to clearly explain the present invention in the drawings, parts not related to the explanation are omitted, and the sizes and thicknesses of each configuration shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited to what is shown in the drawings. For components having the same function within the scope of the same concept, the same reference numerals are used for explanation. Further, throughout the specification, when a certain part refers to a certain component as "including", this does not exclude other components unless otherwise stated to the contrary, and means that other components may be further included.

[0017] In the drawings, the x direction is the direction in which the first internal electrode and the second internal electrode are alternately arranged across the dielectric layer or the first direction. Among the y direction and the z direction which are perpendicular to the x direction, the y direction can be defined as the second direction and the z direction as the third direction.

[0018] FIG. 1 schematically shows a perspective view of a multilayer electronic component according to an embodiment of the present invention, FIG. 2 schematically shows a perspective view of a main body according to an example, FIG. 3 schematically shows a cross-sectional view taken along the line I-I' of FIG. 1, FIG. 4 schematically shows a cross-sectional view taken along the line II-II' of FIG. 1, FIG. 5 is a view showing the planar structure of the first internal electrode in the cross-sections in the first direction and the second direction of a multilayer electronic component according to an example polished in the first direction up to the line A-A' of FIG. 3, FIG. 6 is a view showing the planar structure of the second internal electrode in the cross-sections in the first direction and the second direction of a multilayer electronic component according to an example polished in the first direction up to the line B-B' of FIG. 3, and FIG. 7 is an enlarged view of the P region of FIG. 6.

[0019] In the following, with reference to Figures 1 to 7, a multilayer electronic component 100 according to one embodiment of the present invention and various embodiments thereof will be described in detail. While a multilayer ceramic capacitor will be described as an example of a multilayer electronic component, this disclosure is not limited to this and can be applied to various multilayer electronic components, such as inductors, piezoelectric elements, varistors, or thermistors.

[0020] A stacked electronic component 100 according to one embodiment of the present invention includes a dielectric layer 111 and first internal electrodes 121 and second internal electrodes 122 arranged alternately with the dielectric layer 111, and comprises a body including first and second faces 1 and 2 facing in a first direction, third and fourth faces 3 and 4 facing in a second direction perpendicular to the first direction, and fifth and sixth faces 5 and 6 facing in a third direction perpendicular to the first and second directions, and a first external electrode disposed on the third face 3 and connected to the first internal electrode 121. The main body 110 includes an electrode 130, a second external electrode 140 positioned on the fourth surface 4 and connected to the first internal electrode 121, a third external electrode 150 positioned on the fifth surface 5 and connected to the second internal electrode 122, and a fourth external electrode 160 positioned on the sixth surface 6 and connected to the second internal electrode 122. The main body 110 may further include dummy patterns 123 positioned between the second internal electrode 122 and the fifth surface 5, and between the second internal electrode 122 and the sixth surface 6.

[0021] The main body 110 may include a dielectric layer 111 and internal electrodes 121 and 122. The dielectric layer 111 and the internal electrodes 121 and 122 can be arranged alternately within the main body 110, and the direction in which the internal electrodes 121 and 122 and the main body 110 are arranged alternately can be defined as the stacking direction or the first direction.

[0022] There are no particular restrictions on the specific shape of the main body 110, but as shown in Figure 1, the main body 110 can be a hexahedron or a similar shape. Furthermore, although the shape of the main body 110 may not be a hexahedron with perfectly straight corners due to shrinkage during the firing process and a separate polishing process, it can be substantially a hexahedron.

[0023] The main body 110 can have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1 and the second surface 2 and are connected to the third surface 3 and the fourth surface 4 and face each other in a third direction. The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated so that they are difficult to confirm without using a scanning electron microscope (SEM).

[0024] The main component of the dielectric composition forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, the dielectric layer 111 can contain a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 includes, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5), and can include one or more of them.

[0025] The main body 110 can include a capacitance forming portion Ac that is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 that are disposed to face each other with the dielectric layer 111 interposed therebetween, and a capacitance is formed.

[0026] Furthermore, the capacitance-forming portion Ac is the part that contributes to the capacitance formation of the capacitor, and can be formed by repeatedly stacking a plurality of first internal electrodes 121 and second internal electrodes 122 with a dielectric layer 111 in between.

[0027] Referring to Figure 2, cover portions 112 and 113 can be arranged on one and the other surface of the capacitance forming portion Ac in the first direction. The cover portions 112 and 113 can be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and can basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0028] The cover portions 112 and 113 do not contain internal electrodes and can be made of the same material as the dielectric layer 111. That is, the cover portions 112 and 113 can be made of ceramic material, for example, the same ceramic material as the dielectric layer 11.

[0029] The average thickness tc of the cover portions 112 and 113 is not particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the stacked electronic component, the average thickness tc of the cover portions 112 and 113 may be 15 μm or less.

[0030] The average thickness tc of the cover portions 112 and 113 can represent the size in the first direction, and can be the average value of the sizes of the cover portions 112 and 113 in the first direction measured at five equally spaced points on the upper or lower part of the volume forming portion Ac.

[0031] The internal electrodes 121 and 122 may be included in the main body 110 together with the dielectric layer 111.

[0032] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122.

[0033] The first internal electrode 121 is connected to the third surface 3 and the fourth surface 4, and can be connected to the first external electrode 130 and the second external electrode 140, which will be described later, via the third surface 3 and the fourth surface 4. On the other hand, the first internal electrode 121 may be positioned at a distance from the fifth surface 5 and the sixth surface 6.

[0034] Referring to Figure 5, the first internal electrode 121 may include a first main portion 121a which overlaps with the second internal electrode 122 in a first direction, and first lead portions 121b and 121c which extend from the first main portion 121a in a second direction.

[0035] The first lead portions 121b and 121c may include a first-first lead portion 121b whose end is in direct contact with the first external electrode 130, and a first-second lead portion 121c whose end is in direct contact with the second external electrode 140.

[0036] The shape of the first internal electrode 121 is not particularly limited, but it can have a shape in which the width in the third direction is substantially the same along the second direction.

[0037] The second internal electrode 122 is connected to the fifth surface 5 and the sixth surface 6, and can be connected to the third external electrode 150 and the fourth external electrode 160, which will be described later, via the fifth surface 5 and the sixth surface 6. On the other hand, the second internal electrode 122 may be positioned at a distance from the third surface 3 and the fourth surface 4.

[0038] Referring to Figure 6, the second internal electrode 122 may include a second main portion 122a, which is a region overlapping with the first internal electrode 121 in a first direction, and second lead portions 122b and 122c, which are arranged extending from the second main portion 122a in a third direction.

[0039] The second lead portions 122b and 122c may include a second-first lead portion 122b whose end is in direct contact with the fifth surface 5, and a second-second lead portion 122c whose end is in direct contact with the sixth surface 6.

[0040] The shape of the second internal electrode 122 is not particularly limited, but the second internal electrode 122 may have a shape in which the length of the second lead portions 122b and 122c in the second direction is shorter than the length of the second main portion 122a in the second direction, and the width of the second lead portions 122b and 122c in the third direction is shorter than the width of the second main portion 122b in the third direction.

[0041] The first internal electrode 121 and the second internal electrode 122 can be electrically isolated by the dielectric layer 111 placed between them, and can be electrically isolated from the external electrodes that are not connected via a space separated from the surface of the main body 110.

[0042] The materials used to form the internal electrodes 121 and 122 are not particularly limited, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of the following: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0043] Referring to Figure 1, external electrodes 130, 140, 150, and 160 may be placed on the main body 110.

[0044] Referring to Figures 3 and 4, the external electrodes 130, 140, 150, and 160 may include a first external electrode 130 positioned on the third surface 3 of the main body 110 and connected to the first internal electrode 121, a second external electrode 140 positioned on the fourth surface 4 and connected to the first internal electrode 121, a third external electrode 150 positioned on the fifth surface 5 and connected to the second internal electrode 122, and a fourth external electrode 160 positioned on the sixth surface 6 and connected to the second internal electrode 122.

[0045] On the other hand, the external electrodes 130, 140, 150, and 160 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined by considering electrical properties, structural stability, etc., and may also have a multilayer structure.

[0046] For example, the external electrodes 130, 140, 150, and 160 may include electrode layers 131, 141, 151, and 161 disposed on the main body 110, and plating layers 132, 142, 152, and 162 formed on the electrode layers 131, 141, 151, and 161.

[0047] As a more specific example for electrode layers 131, 141, 151, and 161, the electrode layers may be fired electrodes containing a conductive metal and glass, or resin-based electrodes containing a conductive metal and resin.

[0048] Furthermore, the electrode layers 131, 141, 151, and 161 may be formed in a manner in which a fired electrode and a resin-based electrode are sequentially formed on the main body. In addition, the electrode layers may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0049] The conductive metal contained in the electrode layers 131, 141, 151, and 161 can be a material with excellent electrical conductivity, but is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof, and preferably copper (Cu) to improve adhesion to the main body.

[0050] The plating layers 132, 142, 152, and 162 play a role in improving mounting characteristics. The types of plating layers 132, 142, 152, and 162 are not particularly limited and may be plating layers containing one or more of Ni, Sn, Pd, and their alloys, and may be formed in multiple layers.

[0051] As a more specific example for the plating layers 132, 142, 152, and 162, the plating layer may be a Ni plating layer or an Sn plating layer, and may be a configuration in which a Ni plating layer and an Sn plating layer are sequentially formed on the electrode layers 131, 141, 151, and 161, or may be a configuration in which an Sn plating layer, a Ni plating layer, and an Sn plating layer are sequentially formed. Furthermore, the plating layer may include multiple Ni plating layers and / or multiple Sn plating layers.

[0052] On the other hand, steps that occur during the lamination and crimping processes to form the MLCC body can lead to stress imbalances in the body, potentially reducing the mechanical strength of the MLCC. This can also cause internal electrodes to warp and decrease the density of the dielectric layer, thus reducing the reliability of the MLCC.

[0053] Furthermore, such step differences may be even more pronounced in the case of a 3-terminal MLCC due to structural and morphological differences between the signal internal electrode and the ground internal electrode.

[0054] Specifically, in the case of a 3-terminal MLCC, the lead-out portions of the signal internal electrode and the ground internal electrode are formed in different directions from each other. Therefore, the region where the signal internal electrode and the ground internal electrode overlap in the first direction may not be sufficient compared to the internal electrode structure of a 2-terminal MLCC, which may result in an increase in the region on the dielectric layer where no internal electrodes are formed compared to a 2-terminal MLCC structure.

[0055] Therefore, in one embodiment of the present invention, by arranging dummy patterns 123a, 123b, 123c, and 123d in the regions between the second internal electrode 122 and the fifth surface 5 of the main body 110, and between the second internal electrode and the sixth surface 6, the step difference that occurs in the 3-terminal MLCC structure can be efficiently mitigated.

[0056] On the other hand, when dummy patterns 123a, 123b, 123c, and 123d are placed in the regions between the second internal electrode 122 and the fifth surface 5, and between the second internal electrode and the sixth surface 6 of the main body 110, the regions where the dummy patterns 123a, 123b, 123c, and 123d are placed are highly likely to experience structural defects, such as reduced firing efficiency and frequent occurrence of pores. This is because, in the case of a dielectric layer 111 in contact with internal electrodes 121 and 122, the shrinkage of the internal electrodes 121 and 122 during firing provides shrinkage stress to the dielectric layer 111, thereby ensuring the density of the dielectric layer 111. However, in the case of a dielectric layer 111 in contact with dummy patterns 123a, 123b, 123c, and 123d, it may be difficult to ensure the density after firing.

[0057] Therefore, in one embodiment, by ensuring that the dummy patterns 123a, 123b, 123c, and 123d placed between the second internal electrode 122 and the fifth surface 5, and between the second internal electrode and the sixth surface 6 of the main body 110, contain one or more of Mg, V, Al, Li, Na, K, Mn, Al, Ba, Si, and Y, the density of the region of the dielectric layer 111 where the internal electrodes 121 and 122 are not formed can be improved.

[0058] Referring to Figure 6, the dummy patterns 123a, 123b, 123c, and 123d may, but are not limited to, have a substantially rectangular shape in the cross-section of the stacked electronic component 100 in the second and third directions. On the other hand, the corners of the dummy patterns 123a, 123b, 123c, and 123d may be rounded in the cross-section of the stacked electronic component 100 in the second and third directions, which can further improve the effect of mitigating the step difference.

[0059] Referring to Figure 6, the dummy patterns 123a, 123b, 123c, and 123d can be placed between the second internal electrode 122 and the fifth surface 5, and between the second internal electrode 122 and the sixth surface 6. The regions between the second internal electrode 122 and the fifth surface 5, and between the second internal electrode 122 and the sixth surface 6, can correspond to the widthwise margin of the second internal electrode 122, and can correspond to the region that does not overlap with the first internal electrode 121 in the first direction.

[0060] In one embodiment, the dummy patterns 123a, 123b, 123c, and 123d may be arranged at a distance from the second internal electrode 122. This prevents one or more of the Mg, V, Al, Li, Na, K, Mn, Al, Ba, Si, and Y contained in the dummy patterns 123a, 123b, 123c, and 123d from diffusing into the capacitance forming portion Ac, thereby ensuring the reliability of the stacked electronic component 100.

[0061] In one embodiment, the dummy patterns 123a, 123b, 123c, and 123d may be arranged at a distance from the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6. If the dummy patterns 123a, 123b, 123c, and 123d are in contact with at least a portion of the surface of the main body 110, at least a portion of the dummy patterns 123a, 123b, 123c, and 123d will be exposed to the outside of the main body 110, which may result in them being connected to a portion of the external electrodes 130, 140, 150, and 160, or a decrease in moisture resistance reliability. Therefore, as in one embodiment, by arranging the dummy patterns 123a, 123b, 123c, and 123d so as to be separated from the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6, it is possible to prevent the external electrodes 130, 140, 150, and 160 from connecting with the dummy patterns 123a, 123b, 123c, and 123d, thereby preventing the problem of reduced moisture resistance reliability.

[0062] In one embodiment, the dummy patterns 123a, 123b, 123c, and 123d may be arranged so as to be offset from the first internal electrode 121 in a first direction. Being offset in a first direction means that they do not overlap in a first direction. That is, the dummy patterns 123a, 123b, 123c, and 123d do not have to overlap the first internal electrode 121 in a first direction. This improves the area of ​​the region where the first internal electrode 121 and the second internal electrode 122 overlap in a first direction, thereby improving the capacity per unit volume of the stacked electronic component 100.

[0063] If dummy patterns 123a, 123b, 123c, and 123d contain Mg, the form in which Mg exists is not particularly limited. For example, Mg can exist in the form of an oxide containing Mg, or in the form of a carbonate containing Mg, or in the form of a mixture thereof. That is, in one embodiment, dummy patterns 123a, 123b, 123c, and 123d may contain one or more of the oxides containing Mg and carbonates containing Mg. In this case, the ratio (at%) of magnesium (Mg) content to oxygen (O) content in dummy patterns 123a, 123b, 123c, and 123d can satisfy the condition of being greater than 0 at% and less than or equal to 10 at%.

[0064] The method for forming the dummy patterns 123a, 123b, 123c, and 123d is not particularly limited. For example, during the process of laminating the first internal electrode 121 and the second internal electrode 122, a paste containing Mg powder, Mg-containing oxide powder, and Mg-containing carbonate powder can be applied to the dielectric layer 111 where the paste for the second internal electrode 122 is not placed, and then fired to form the dummy patterns.

[0065] On the other hand, the components contained in the dummy patterns 123a, 123b, 123c, and 123d and the components contained in the dielectric layer 111 can interdiffuse. As a result, the dummy patterns 123a, 123b, 123c, and 123d can contain some of the barium (Ba), titanium (Ti), and other additive elements contained in the dielectric layer 111. In this case, the ratio (at%) of magnesium (Mg) content to all elements excluding oxygen (O) contained in the dummy patterns 123a, 123b, 123c, and 123d can satisfy 0.1 at% to 10 at%. This improves the effect of mitigating steps and prevents problems of reduced reliability and dielectric properties due to the presence of excessive magnesium (Mg).

[0066] If the ratio (at%) of magnesium (Mg) content to all elements excluding oxygen (O) in dummy patterns 123a, 123b, 123c, and 123d is less than 0.1 at%, it may become difficult to sufficiently ensure the effect of reducing the step height by applying shrinkage stress to the surrounding dielectric layer.

[0067] If the ratio (at%) of magnesium (Mg) content to all elements excluding oxygen (O) in dummy patterns 123a, 123b, 123c, and 123d exceeds 10 at%, the excessive presence of magnesium (Mg) in dummy patterns 123a, 123b, 123c, and 123d increases the likelihood of excessive magnesium (Mg) diffusion into the surrounding dielectric layer. As the p-type conversion of the dielectric layer progresses, this can lead to problems with degradation of high-temperature reliability.

[0068] The method for analyzing the composition of dummy patterns 123a, 123b, 123c, and 123d is not particularly limited. For example, by polishing the multilayer electronic component 100 in a first direction to simultaneously expose the second internal electrode 122 and dummy patterns 123a, 123b, 123c, and 123d, the four corner regions of the cross-section can be analyzed via STEM-EDS (Scanning Transmission Electron Microscope-Energy Dispersive X-ray Spectroscopy) to determine the presence, distribution, and content of specific elements.

[0069] If the dummy patterns 123a, 123b, 123c, and 123d are arranged adjacent to or connected to the second internal electrode 122, some of the magnesium (Mg) contained in the dummy patterns 123a, 123b, 123c, and 123d may diffuse into the second internal electrode 122, which may cause a decrease in the electrical conductivity of the second internal electrode 122.

[0070] Therefore, the dummy patterns 123a, 123b, 123c, and 123d according to one embodiment can be arranged separately from the second internal electrode 122, which may result in the second internal electrode 122 being substantially free of magnesium (Mg). In this case, the statement that the second internal electrode 122 is substantially free of magnesium (Mg) means that, when the second internal electrode 122 is analyzed by a compositional analysis method such as STEM-EDS (Scanning Transmission Electron Microscope-Energy Dispersive X-ray Spectroscopy), the magnesium (Mg) content in the second internal electrode 122 is less than 0.05 at% of all elements excluding oxygen.

[0071] In the following, with reference to Figure 7, the positional relationships between the second internal electrode 122, the dummy patterns 123a, 123b, 123c, 123d, and the surface of the main body 110 will be described in detail. Figure 7 describes the relationship between the first dummy pattern 123a, the second internal electrode 122, the third surface 3, and the fifth surface 5, but this description can also be applied similarly to the relationships between the second to fourth dummy patterns 123b, 123c, 123d and the second internal electrode 122 and the third to sixth surfaces 3, 4, 5, 6.

[0072] Referring to Figure 7, in one embodiment, the length in the second direction separating the dummy pattern 123a from the second internal electrode 122 can be L1, the length in the second direction separating the dummy pattern 123a from the third surface 3 can be L2, and the length in the second direction from one end of the second lead portion 122b in the second direction to the third surface 3 can be LM. In this case, L1 / LM can satisfy the condition of 0.03 or more and 0.97 or less, and L2 / LM can satisfy the condition of 0.03 or more and 0.97 or less. This prevents the dummy pattern 123a from being connected to the second internal electrode 122, prevents the dummy pattern 123 from being exposed to the fifth surface 5, and also ensures a sufficient step-leveling effect for the dummy pattern 123a.

[0073] Referring to Figure 7, in one embodiment, the width in the third direction separating the dummy pattern 123a and the second internal electrode 122 can be defined as W1, the width in the third direction separating the dummy pattern 123a and the fifth surface 5 can be defined as W2, and the width in the third direction from one end of the second main portion 122a in the third direction to the fifth surface 5 can be defined as WM. In this case, W1 / WM can satisfy the condition of 0.03 to 0.97, and W2 / WM can satisfy the condition of 0.03 to 0.97. This prevents the dummy pattern 123a and the second internal electrode 122 from being connected, prevents the dummy pattern 123 from being exposed to the fifth surface 5, and ensures a sufficient step-leveling effect for the dummy pattern 123a.

[0074] Referring to Figure 7, in one embodiment, the average length of the dummy pattern 123a in the second direction can be LA, and in this case, LA / LM can satisfy the condition of 0.03 to 0.97. This prevents the dummy pattern 123a from being connected to the second internal electrode 122, prevents the dummy pattern 123 from being exposed to the third surface 3 and the fifth surface 5, and not only ensures a sufficient step-leveling effect of the dummy pattern 123a, but also ensures a sufficient capacity per unit volume of the stacked electronic component 100.

[0075] Referring to Figure 7, in one embodiment, the average width of the dummy pattern 123a in the third direction can be set to WA, and in this case, WA / WM can satisfy the condition of 0.03 or more and 0.97 or less. This prevents the dummy pattern 123a from being connected to the second internal electrode 122, prevents the dummy pattern 123 from being exposed to the third surface 3 and the fifth surface 5, and not only ensures a sufficient step-leveling effect of the dummy pattern 123a, but also ensures a sufficient capacity per unit volume of the stacked electronic component 100.

[0076] The method for measuring L1, L2, W2, W1, LM, WM, LA, and WA is not particularly limited. For example, the measurements can be taken via an optical microscope or a scanning electron microscope in a cross-section of the multilayer electronic component 100 after polishing in a first direction until the second internal electrode 122 and dummy pattern 123a are exposed. L1, L2, W2, W1, LM, and WM may represent the minimum length or width between each end, and LA and WA may represent the maximum length or width.

[0077] Although embodiments of the present invention have been described in detail above, the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided herein. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0078] Furthermore, the expression “one embodiment” as used in this disclosure does not mean that each embodiment is the same as another, but is provided to highlight and illustrate the unique and distinct features of each embodiment. However, the embodiments presented above do not preclude their realization in combination with the features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment unless there is a contradictory or contrary description of that matter in the other embodiment.

[0079] The terms used in this disclosure are used solely to illustrate one embodiment and are not intended to limit the disclosure. Where otherwise clearly indicated by context, singular expressions include plural expressions. [Explanation of Symbols]

[0080] 100: Stacked Electronic Components 110: Main unit 111: Dielectric layer 112, 113: Cover section 121, 122: First internal electrode and second internal electrode 121a, 122a: First main section and second main section 121b, 121c: 1st lead section and 1st lead section 122b, 122c: 2-1 lead section and 2-2 lead section 123a, 123b, 123c, 123d: Dummy patterns 130, 140, 150, 160: External electrode 131, 141, 151, 161: Electrode layer 132, 142, 152, 162: Plating layer

Claims

1. A body comprising a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer, the body comprising first and second surfaces facing a first direction, third and fourth surfaces facing a second direction perpendicular to the first direction, and fifth and sixth surfaces facing a third direction perpendicular to the first and second directions, A first external electrode is arranged on the third surface and connected to the first internal electrode, A second external electrode is positioned on the fourth surface and connected to the first internal electrode, A third external electrode is positioned on the fifth surface and connected to the second internal electrode, The system includes a fourth external electrode, which is positioned on the sixth surface and connected to the second internal electrode, The main body further includes a dummy pattern disposed between the second internal electrode and the fifth surface, and between the second internal electrode and the sixth surface, in a stacked electronic component.

2. The stacked electronic component according to claim 1, wherein the dummy pattern includes one or more of Mg, V, Al, Li, Na, K, Mn, Ba, Si, and Y.

3. The stacked electronic component according to claim 1, wherein the first internal electrode is connected to the third and fourth surfaces and separated from the fifth and sixth surfaces, and the second internal electrode is connected to the fifth and sixth surfaces and separated from the third and fourth surfaces.

4. The first internal electrode includes a first main portion that overlaps with the second internal electrode in a first direction, and a first lead portion that extends from the first main portion in a second direction. The stacked electronic component according to claim 1, wherein the second internal electrode includes a second main portion that overlaps with the first internal electrode in a first direction, and a second lead portion that extends from the second main portion in a third direction.

5. The stacked electronic component according to claim 1, wherein the dummy pattern is arranged at a distance from the second internal electrode.

6. The stacked electronic component according to claim 1, wherein the dummy pattern is arranged at a distance from the third, fourth, fifth, and sixth surfaces.

7. The stacked electronic component according to claim 1, wherein the dummy pattern is arranged to be offset from the first internal electrode in a first direction.

8. The stacked electronic component according to claim 1, wherein the dummy pattern comprises one or more of an oxide containing Mg and a carbonate containing Mg.

9. The multilayer electronic component according to claim 8, wherein the ratio (at%) of the magnesium (Mg) content to the oxygen (O) content in the dummy pattern is greater than 0 at% and less than or equal to 10 at%.

10. The multilayer electronic component according to claim 8, wherein the ratio (at%) of magnesium (Mg) content to all elements excluding oxygen (O) contained in the dummy pattern is 0.1 at% or more and 10 at% or less.

11. The length in the second direction from which the dummy pattern and the second internal electrode are separated is L1. The length in the second direction from which the dummy pattern and the third surface are separated is L2. When LM is the length in the second direction from one end of the second lead portion in the second direction to the third surface, L1 / LM satisfies the condition of being between 0.03 and 0.

97. The stacked electronic component according to claim 4, wherein L2 / LM satisfies 0.03 or more and 0.97 or less.

12. The width in the third direction where the dummy pattern and the second internal electrode are separated is W1. The width in the third direction where the dummy pattern and the fifth surface are separated is W2. When WM is the width in the third direction from one end of the second main part in the third direction to the fifth surface, W1 / WM satisfies the condition of being between 0.03 and 0.

97. The stacked electronic component according to claim 4, wherein W2 / WM satisfies 0.03 or more and 0.97 or less.

13. Let LA be the average length in the second direction of the dummy pattern. When LM is the length in the second direction from one end of the second lead portion in the second direction to the third surface, The stacked electronic component according to claim 4, wherein LA / LM satisfies 0.03 or more and 0.97 or less.

14. The average width of the dummy pattern in the third direction is WA, When WM is the width in the third direction from one end of the second main part in the third direction to the fifth surface, The stacked electronic component according to claim 4, wherein WA / WM satisfies 0.03 or more and 0.97 or less.

15. The stacked electronic component according to any one of claims 1 to 14, wherein the dummy pattern has a rounded shape.

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