Multilayer electronic components and manufacturers of multilayer electronic components

Abstract

This invention provides a multilayer electronic component that can achieve various capacities and has improved mechanical strength, as well as a method for manufacturing a multilayer electronic component that does not require a separate capacity evaluation process in the intermediate stages of the manufacturing process. [Solution] The stacked electronic component 100 includes a body 110 which includes a dielectric layer 111 and two or more internal electrodes 121, 122, 123, 124, 125-1, 126-1 which are alternately arranged with respect to the dielectric layer in a first direction x and have different lengths in a second direction y perpendicular to the first direction, and external electrodes 130, 140 which are arranged on the body and connected to one or more of the internal electrodes, and the internal electrodes include a pair of main electrodes 121, 122, 123, 124 which are connected to the external electrodes and arranged across the dielectric layer and an auxiliary electrode pair 125-1, 126-1 which are spaced apart from the external electrodes in a second direction and arranged across the dielectric layer, and the internal electrodes have a continuous shape in the second direction.

Description

[Technical Field]

[0001] The present invention relates to a stacked electronic component and a method for manufacturing a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of stacked electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products, such as video equipment like liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones and mobile phones, on-board chargers (OBCs) in electric vehicles, and DC-DC converters, and plays the role of charging or discharging electricity.

[0003] Achieving various capacities in MLCCs of the same size may require design changes to specifications such as dielectric sheets and internal electrodes, and such design changes can prolong the time it takes to complete an MLCC. In particular, for MLCCs that require precise tolerances and narrow variations in electrical characteristics, an additional process of evaluating the capacitance may be carried out in the intermediate stages before the entire product is manufactured, which can lead to more time being spent to complete the final MLCC product.

[0004] Therefore, there is a need for improvements to a method that can achieve various capacities within essentially the same size and improve the production efficiency of MLCCs without the need to evaluate capacity during the intermediate stages of MLCC manufacturing, as well as structural improvements that can ensure the mechanical strength of MLCCs. [Overview of the project] [Problems that the invention aims to solve]

[0005] One of the several objectives of the present invention is to provide a stacked electronic component that can achieve various capacities.

[0006] One of the several objectives of the present invention is to provide a stacked electronic component with improved mechanical strength.

[0007] One of the several objectives of the present invention is to provide a method for manufacturing stacked electronic components that does not require a separate capacity evaluation process in an intermediate stage of the manufacturing process.

[0008] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0009] A stacked electronic component according to one embodiment includes a dielectric layer, a body including two or more internal electrodes arranged alternately with the dielectric layer in a first direction and having different lengths in a second direction perpendicular to the first direction, and an external electrode arranged on the body and connected to one or more of the internal electrodes, wherein the internal electrodes include a pair of main electrodes connected to the external electrodes and arranged with the dielectric layer in between, and a pair of auxiliary electrodes arranged spaced apart from the external electrodes in the second direction and with the dielectric layer in between, and the internal electrodes can have a continuous shape in the second direction.

[0010] A method for manufacturing a stacked electronic component according to one embodiment includes the steps of forming a body that includes a dielectric layer and two or more internal electrodes that are alternately arranged in a first direction with respect to the dielectric layer and have different lengths in a second direction perpendicular to the first direction; and forming an external electrode that is placed on the body and connected to one or more of the internal electrodes, wherein the internal electrode includes a pair of main electrodes that are connected to the external electrode and are arranged with the dielectric layer in between, and a pair of auxiliary electrodes that are spaced apart from the external electrode in the second direction and are arranged with the dielectric layer in between, wherein the internal electrode has a continuous shape in the second direction, and the pair of main electrodes and the pair of auxiliary electrodes can be formed by polishing the surfaces of a stacked body formed by stacking a dielectric sheet and an internal electrode sheet that face each other in the second direction. [Effects of the Invention]

[0011] One of the several effects of the present invention is to provide a stacked electronic component that can achieve various capacities.

[0012] One of the several effects of the present invention is to provide a stacked electronic component with improved mechanical strength.

[0013] One of the several effects of the present invention is to provide a method for manufacturing stacked electronic components that does not require a separate capacity evaluation process in an intermediate stage of the manufacturing process.

[0014] However, the diverse yet beneficial advantages and effects of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Brief explanation of the drawing]

[0015] [Figure 1] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment. [Figure 2] This shows schematic cross-sectional views of a stacked electronic component according to a conventional embodiment in the first and second directions. [Figure 3] This shows schematic cross-sectional views of a stacked electronic component according to a conventional embodiment in the first and second directions. [Figure 4] Schematically shows a cross-sectional view of a stacked electronic component in a first direction and a third direction according to an embodiment. [Figure 5] Schematically shows a cross-sectional view of a stacked electronic component in a first direction and a second direction according to an embodiment. [Figure 6] Schematically shows a cross-sectional view of a stacked electronic component in a first direction and a second direction according to an embodiment. [Figure 7] It is an enlarged view of the P region in FIG. 6. [Figure 8] Schematically shows a part of a manufacturing method of a stacked electronic component according to an embodiment.

Mode for Carrying Out the Invention

[0016] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape and size of elements in the drawings can be exaggerated for a clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0017] And, in order to clearly explain the present invention in the drawings, parts not related to the explanation are omitted, and the sizes and thicknesses of each configuration shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited to what is shown in the drawings. Note that components having the same function within the scope of the same concept are described using the same reference numerals. Further, throughout the specification, when a certain part says that a certain component "includes", this means that, unless otherwise stated to the contrary, it does not exclude other components, and may further include other components.

[0018] In the drawing, the x-direction can be defined as the direction in which the first internal electrode and the second internal electrode are alternately arranged with the dielectric layer in between, or the first direction, and the y-direction and z-direction, which are perpendicular to the x-direction, with the y-direction being the second direction and the z-direction being the third direction.

[0019] Multilayer electronic components Figure 1 schematically shows a perspective view of a stacked electronic component according to one embodiment, Figure 2 schematically shows cross-sectional views in the first and second directions of a stacked electronic component according to a conventional embodiment, Figure 3 schematically shows cross-sectional views in the first and second directions of a stacked electronic component according to a conventional embodiment, Figure 4 schematically shows cross-sectional views in the first and third directions of a stacked electronic component according to one embodiment, and Figure 5 schematically shows cross-sectional views in the first and second directions of a stacked electronic component according to one embodiment.

[0020] In the following, with reference to Figures 1 to 5, a multilayer electronic component 100 according to one embodiment and various embodiments thereof will be described in detail.

[0021] A stacked electronic component 100 according to one embodiment includes a dielectric layer 111, a body 110 including two or more internal electrodes 121, 122, 123, 124, 125-1, 126-1 which are alternately arranged with the dielectric layer 111 in a first direction and have different lengths in a second direction perpendicular to the first direction, and external electrodes 130, 140 which are arranged on the body 110 and connected to one or more of the internal electrodes 121, 122, 123, 124, 125-1, 126-1, and internal electrodes 121, 122 ,123,124,125-1,126-1 include main electrode pairs 121,122,123,124 which are connected to the external electrodes 130,140 and arranged with the dielectric layer 111 in between, and auxiliary electrode pairs 125-1,126-1 which are spaced apart from the external electrodes 130,140 in a second direction and arranged with the dielectric layer 111 in between, and the internal electrodes 121,122,123,124,125-1,126-1 may have a continuous shape in a second direction.

[0022] Referring to FIG. 5, the main body 110 includes a dielectric layer 111, and internal electrodes 121, 122, 123, 124, 125-1, 126-1 that are alternately arranged with the dielectric layer 111 in the first direction.

[0023] There is no particular limitation on the specific shape of the main body 110. However, as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 does not have a hexahedron shape with perfect straight lines, but can have a substantially hexahedron shape.

[0024] Referring to FIG. 1, the main body 110 can include a first surface 1 and a second surface 2 facing each other in the first direction, a third surface 3 and a fourth surface 4 facing each other in a second direction perpendicular to the first direction, and a fifth surface 5 and a sixth surface 6 facing each other in a third direction perpendicular to the first direction and the second direction.

[0025] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated to such an extent that it is difficult to confirm without using a scanning electron microscope (SEM). The number of stacked dielectric layers does not need to be particularly limited and can be determined in consideration of the size of the ceramic electronic component. For example, the main body can be formed by stacking 300 or more dielectric layers.

[0026] The main component of the dielectric composition forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, the dielectric layer 111 can contain a perovskite-type compound represented by ABO3 as the main component. The perovskite-type compound represented by ABO3 is, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-yZr y )O3(0 < y < 1), CaZrO3, and (Ca 1-x Sr x )(Zr 1-y Ti y )O3(0 < x ≤ 0.5, 0 < y ≤ 0.5) can include one or more of them.

[0027] As shown in FIG. 5, the main body 110 according to an embodiment can include two or more internal electrodes 121, 122, 123, 124, 125-1, 126-1 that are alternately arranged in the dielectric layer 111 in the first direction and have different lengths in the second direction.

[0028] Referring to FIG. 2, the internal electrodes 121, 122 included in the multilayer electronic component 10 according to the conventional embodiment have substantially the same length in the second direction. In this case, in order to realize various capacitances of the multilayer electronic component 10, one or more specifications of the dielectric layer 111 and the internal electrodes 121, 122 have to be changed by a separate design, and thus, it may take a considerable amount of time to complete the multilayer electronic component 10. In particular, in a multilayer electronic product that requires precise tolerance and narrow variation of electrical characteristics, since the process of evaluating the capacitance may be further performed in the intermediate process before the entire product is made, it may take even more time to complete the multilayer electronic component 10.

[0029] Referring to Figure 3, the stacked electronic component 10' according to the conventional embodiment includes two or more internal electrodes 121, 122, 123, 124, 125, and 126 with different lengths Le1, Le2, and Le3 in the second direction. This makes it possible to realize stacked electronic components 10' with various capacities without any separate design changes to the dielectric layer 111 or the internal electrodes 121, 122, 123, 124, 125, and 126. However, as in the stacked electronic component 10' according to the conventional embodiment, if two or more internal electrodes 121, 122, 123, 124, 125, and 126 with different lengths Le1, Le2, and Le3 in the second direction are all connected to the external electrodes 130 and 140, the asymmetry of the shapes of the internal electrodes 121, 122, 123, 124, 125, and 126 prevents the effective distribution of stress generated during the firing process of the main body 110, which may reduce the mechanical strength of the stacked electronic component 10'.

[0030] Therefore, in the stacked electronic component 100 according to one embodiment of the present invention, the internal electrodes 121, 122, 123, 124, 125-1, and 126-1 include two or more internal electrodes with different lengths in the second direction, connected to the external electrodes 130 and 140 described later, and a main electrode pair 121, 122, 123, and 124 arranged across the dielectric layer 111, and an auxiliary electrode pair 125-1 and 126-1 arranged at a distance from the external electrodes 130 and 140, and also arranged across the dielectric layer 111. This makes it possible to achieve various capacities in stacked electronic components of substantially the same size without further processes, and prevents the problem of reduced mechanical strength of the stacked electronic component due to the formation of internal electrodes with different lengths.

[0031] Referring to Figure 5, the main electrode pairs 121, 122, 123, and 124 can be connected to the external electrodes 130 and 140, which will be described later, to form the capacitance of the stacked electronic component 100. The main electrode pairs 121, 122, 123, and 124 may include first internal electrodes 121 and 123 connected to the first external electrode 130, which will be described later, and second internal electrodes 122 and 124 connected to the second external electrode 140. The main electrode pairs 121, 122, 123, and 124 may include multiple electrode pairs in which first internal electrodes 121 and 123 and second internal electrodes 122 and 124 are arranged with a dielectric layer 111 in between, and the lengths of the first internal electrodes 121 and 123 in the second direction included in each electrode pair may be different, and the lengths of the second internal electrodes 122 and 124 in the second direction included in each electrode pair may be different.

[0032] Referring to Figure 5, the auxiliary electrode pair 125-1 and 126-1 are positioned at a distance from the external electrodes 130 and 140, which will be described later, and can play a role in improving the mechanical strength of the stacked electronic component 100. The auxiliary electrode pair 125-1 and 126-1 may include a first auxiliary electrode 125-1 positioned closer to the first external electrode 130 than to the second external electrode 140, and a second auxiliary electrode 126-1 positioned closer to the second external electrode 140 than to the first external electrode 130.

[0033] The internal electrodes 121, 122, 123, 124, 125-1, and 126-1 according to one embodiment may have a continuous shape in the second direction. In this case, "continuous shape" can mean that the internal electrodes 121, 122, 123, 124, 125-1, and 126-1 are formed as a single unit that is not separated in the second direction, and does not mean that they do not contain voids or minute discontinuities that may be formed during the formation of the internal electrodes.

[0034] On the other hand, auxiliary electrode pairs 125-1 and 126-1 can be formed by firing an internal electrode paste that is longer in the second direction than the internal electrode paste used to form the main electrode pairs 121, 122, 123, and 124. As a result, the area in which the main electrode pairs 121, 122, 123, and 124 overlap in the first direction according to one embodiment may be smaller than the area in which the auxiliary electrode pairs 125-1 and 126-1 overlap in the first direction.

[0035] The materials used to form the internal electrodes 121, 122, 123, 124, 125-1, and 126-1 are not particularly limited, and any material with excellent electrical conductivity can be used. For example, a conductive paste for internal electrodes containing one or more of the following materials can be printed onto a dielectric sheet to form the electrodes.

[0036] While screen printing or gravure printing can be used as printing methods for conductive paste for internal electrodes, the present invention is not limited to these methods.

[0037] Referring to Figure 5, cover portions 112 and 113 may be placed above and below the outermost internal electrodes 121, 122, 123, 124, 125-1, and 126-1 in the first direction.

[0038] The cover portions 112 and 113 can be formed by laminating a single dielectric layer or two or more dielectric layers on the upper and lower parts in the first direction of the internal electrodes 121, 122, 123, 124, 125-1, and 126-1, which are located on the outermost part in the first direction, and can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0039] The cover portions 112 and 113 do not contain internal electrodes and can contain the same material as the dielectric layer 111. That is, the cover portions 112 and 113 can contain ceramic materials, for example, barium titanate (BaTiO3) based ceramic materials.

[0040] On the other hand, the average thickness of the cover portions 112 and 113 is not particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the stacked electronic component, the average thickness tc of the cover portions 112 and 113 may be 15 μm or less.

[0041] The average thickness of the cover portions 112 and 113 can represent the size in the first direction, and can be the average value of the sizes of the cover portions 112 and 113 in the first direction measured at five equally spaced points in the second direction.

[0042] Referring to Figure 4, margin portions 114 and 115 may be arranged on both sides of the internal electrodes 121, 122, 123, 124, 125-1, and 126-1 in the third direction.

[0043] The margin portions 114 and 115 may include a margin portion 114 located on the fifth surface 5 of the main body 110 and a margin portion 115 located on the sixth surface 6. That is, the margin portions 114 and 115 may be regions that are in contact with both end surfaces of the main body 110 in the third direction (width direction).

[0044] As shown in Figure 3, the margin portions 114 and 115 can refer to the regions between the interface between both ends of the internal electrodes 121, 122, 123, 124, 125-1, and 126-1 and the body 110 in cross-sections obtained by cutting the body 110 in the first and third directions.

[0045] The margins 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0046] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheet, except for the areas where the margin portions are formed, to form internal electrodes.

[0047] Furthermore, in order to suppress steps caused by the internal electrodes 121, 122, 123, 124, 125-1, and 126-1, the laminated internal electrodes 121, 122, 123, 124, 125-1, and 126-1 may be cut so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body 110, and then a single dielectric layer or two or more dielectric layers may be laminated in a third direction on both sides of the main body 110 to form margin portions 114 and 115.

[0048] On the other hand, the width of the margin portions 114 and 115 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width of the margin portions 114 and 115 may be 15 μm or less.

[0049] The average width of the margin sections 114 and 115 can represent the average size of the margin sections 114 and 115 in the third direction, and can be the average value of the size of the margin sections 114 and 115 in the third direction measured at five equally spaced points in the first direction.

[0050] Referring to Figure 1, external electrodes 130 and 140 are positioned on the main body 110.

[0051] Specifically, when the direction perpendicular to the first direction is defined as the second direction, the external electrodes 130 and 140 can be arranged on one surface 3 and the other surface 4 of the main body 110 that face the second direction.

[0052] In this case, the external electrode 130 may include a first external electrode 130 which is arranged on one surface 3 of the main body 110 facing the second direction and connected to one or more of the internal electrodes 121, 122, 123, 124, 125-1, and 126-1, and a second external electrode 140 which is arranged on the other surface 3 of the main body 110 facing the second direction and connected to one or more of the internal electrodes 121, 122, 123, 124, 125-1, and 126-1.

[0053] In this embodiment, a structure is described in which the ceramic electronic component 100 has two external electrodes 130 and 140. However, the number and shape of the external electrodes can be changed depending on the form of the internal electrodes 121, 122, 123, 124, 125-1, and 126-1, or for other purposes.

[0054] On the other hand, the external electrodes 130 and 140 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined by considering electrical properties, structural stability, etc., and may also have a multilayer structure.

[0055] For example, the external electrodes 130 and 140 may include electrode layers 131 and 141 placed on the main body 110, and plating layers 132, 133, 142, and 143 formed on the electrode layers 131 and 141.

[0056] As a more specific example for electrode layers 131 and 141, the electrode layer may be a fired electrode containing a conductive metal and glass, or a resin-based electrode containing a conductive metal and resin.

[0057] Furthermore, the electrode layer may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body 110. Alternatively, the electrode layer may be formed by transferring a sheet containing a conductive metal onto the main body 110, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0058] While any material with excellent electrical conductivity can be used as the conductive metal in the electrode layer, it is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0059] The plating layers 132, 133, 142, and 143 may be plating layers containing one or more of nickel (Ni), tin (Sn), palladium (Pd), and alloys thereof, and may be formed in multiple layers.

[0060] As a more specific example for the plating layers 132, 133, 142, and 143, the plating layer may be a Ni plating layer or an Sn plating layer, and may be in a form in which a Ni plating layer and an Sn plating layer are sequentially formed on the electrode layer, or may be in a form in which an Sn plating layer, a Ni plating layer, and an Sn plating layer are sequentially formed. Furthermore, the plating layer may include multiple Ni plating layers and / or multiple Sn plating layers.

[0061] Figure 6 schematically shows cross-sectional views of the modified stacked electronic component in the first and second directions, and Figure 7 is an enlarged view of region P in Figure 6.

[0062] In the following, a modified example of the stacked electronic component 100' will be described in detail with reference to Figures 6 and 7, but the same content as that of the stacked electronic component 100 in one embodiment will be omitted.

[0063] Referring to Figure 6, the internal electrodes 121, 122, 123-1, 124-1, 125-1, and 126-1 of the modified stacked electronic component 100' include two or more pairs of auxiliary electrode pairs 123-1, 124-1, 125-1, and 126-1, and the distances between the two or more pairs of auxiliary electrode pairs 123-1, 124-1, 125-1, and 126-1 and the adjacent external electrodes 130 and 140 may be different.

[0064] In Figure 6, the modified example shows two or more pairs of auxiliary electrode pairs 123-1, 124-1, 125-1, and 126-1 including the first auxiliary electrode pair 123-1, 124-1 and the second auxiliary electrode pair 125-1, 126-1. However, the auxiliary electrode pairs 123-1, 124-1, 125-1, and 126-1 of the present invention can include two or more pairs of auxiliary electrode pairs.

[0065] The first auxiliary electrode pair 123-1, 124-1 and the second auxiliary electrode pair 125-1, 126-1 may have different distances in the second direction from the more adjacent external electrodes 130, 140. This allows for more efficient realization of various capacitances of the multilayer electronic component 100' and further enhances the effect of improving the mechanical strength of the multilayer electronic component 100'.

[0066] Referring to Figure 7, when d1 is the distance in the second direction between the first auxiliary electrode 123-1 of the first auxiliary electrode pair and the first electrode layer 131 of the first external electrode, and d2 is the distance in the second direction between the second auxiliary electrode 2-1 of the second auxiliary electrode pair and the first electrode layer 131 of the first external electrode, the absolute value of the difference between d1 and d2 (|d1-d2|) may be 1 μm or more. This further improves the effect of realizing various capacitances of the stacked electronic component 100'. On the other hand, there is no particular upper limit to the absolute value of the difference between d1 and d2 (|d1-d2|), but in order to realize various capacitances in substantially the same size, the absolute value of the difference between d1 and d2 (|d1-d2|) may be 5 μm or less.

[0067] Referring to Figure 6, the main electrode pairs 121 and 122 may be arranged repeatedly in the first direction. This allows the internal electrodes 121, 122, 123-1, 124-1, 125-1, and 126-1 to contain two or more pairs of main electrode pairs 121 and 122. Similarly, the auxiliary electrode pairs 123-1, 124-1, 125-1, and 126-1 can be arranged repeatedly in the first direction, allowing the internal electrodes 121, 122, 123-1, 124-1, 125-1, and 126-1 to contain two or more pairs of auxiliary electrode pairs 123-1, 124-1, 125-1, and 126-1. In this case, each of the auxiliary electrode pairs 123-1, 124-1, 125-1, and 126-1 may be arranged alternately with the main electrode pairs 121 and 122, with the dielectric layer 111 in between.

[0068] The arrangement order of the main electrode pair 121, 122 and the auxiliary electrode pair 123-1, 124-1, 125-1, 126-1 in the first direction may vary. Specifically, the main electrode pair 121, 122 and the auxiliary electrode pair 123-1, 124-1, 125-1, 126-1 may be arranged in the first direction in a specific order.

[0069] In one embodiment, when the arrangement of the main electrode pair 121, 122 is A1, the arrangement of auxiliary electrode pairs 123-1, 124-1, 125-1, 126-1 with the smallest separation distance from adjacent external electrodes is A2, and the arrangement of auxiliary electrode pairs 125-1, 126-1 with the largest separation distance from adjacent external electrodes is A3, the internal electrodes 121, 122, 123-1, 124-1, 125-1, 126-1 can be arranged in a repeating sequence of A1, A2, A1, and A3 along a first direction, or A1, A1, A2, and A3 can be arranged in a repeating sequence. This allows the pattern in which the arrangement of auxiliary electrode pairs 123-1, 124-1, 125-1, and 126-1 is placed between the arrangement of main electrode pairs 121 and 122 to be repeated in the first direction, further enhancing the effect of improving the mechanical strength of the stacked electronic component 100'.

[0070] Manufacturing method for multilayer electronic components Figure 8 schematically shows a part of the manufacturing method of a stacked electronic component according to one embodiment.

[0071] In the following section, with reference to Figure 8, a method for manufacturing a stacked electronic component according to one embodiment will be described in detail.

[0072] A method for manufacturing a stacked electronic component according to one embodiment may include the step of forming a body 110 which includes a dielectric layer 111 and two or more internal electrodes 121, 122, 123, 123-1, 124, 124-1, 125, 125-1, 126, 126-1 which are alternately arranged with the dielectric layer 111 in a first direction and have different lengths in a second direction perpendicular to the first direction.

[0073] In the step of forming the main body 110, conductive pastes 21, 22, 23, 24, 25, and 26 for internal electrodes, containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, can be printed onto a dielectric sheet 11 formed using a dielectric slurry containing a barium titanate-based dielectric material and a plasticizer, and this can be repeatedly laminated.

[0074] The conductive pastes 21, 22, 23, 24, 25, and 26 for the internal electrodes can be printed onto the dielectric sheet 11 by screen printing or gravure printing, but the present invention is not limited thereto.

[0075] Multiple dielectric sheets 11 and multiple conductive pastes 21, 22, 23, 24, 25, 26 for internal electrodes can form a laminate through a lamination and compression process, and in this process they can be cut to a size corresponding to a laminated electronic component.

[0076] In a method for manufacturing a stacked electronic component according to one embodiment, the main electrode pair and the auxiliary electrode pair can be formed by polishing the surfaces of a stacked body, which is formed by stacking a dielectric sheet 11 and internal electrode pastes 21, 22, 23, 24, 25, and 26, that face each other in the second direction.

[0077] Referring to Figure 8, depending on the capacitance of the stacked electronic component, the surface of the stack can be determined to be one of B1, B2, and B3, which can be adjusted by polishing the surface to which the conductive pastes 21, 22, 23, 24, 25, and 26 for the internal electrodes are exposed.

[0078] Specifically, when the surface of the laminate is determined to be B1, the conductive pastes 21 and 22 for internal electrodes are exposed on the surface of the laminate, but the conductive pastes 23, 24, 25, and 26 for internal electrodes are not exposed on the surface of the laminate. In this case, the conductive pastes 21 and 22 for internal electrodes can later form the main electrode pairs 121 and 122, and the conductive pastes 23, 24, 25, and 26 for internal electrodes can later form the auxiliary electrode pairs 123-1, 124-1, 125-1, and 126-1, which corresponds to the case where the internal electrodes 121, 122, 123-1, 124-1, 125-1, and 126-1 of the modified laminated electronic component 100' are formed.

[0079] When the surface of the laminate is determined to be B2, the conductive pastes 21, 22, 23, and 24 for the internal electrodes are exposed on the surface of the laminate, but the conductive pastes 25 and 26 for the internal electrodes are not exposed on the surface of the laminate. In this case, the conductive pastes 21, 22, 23, and 24 for the internal electrodes can later form the main electrode pairs 121, 122, 123, and 124, and the conductive pastes 25 and 26 for the internal electrodes can later form the auxiliary electrode pairs 125-1 and 126-1, which corresponds to the case of forming the internal electrodes 121, 122, 123, 124, 125-1, and 126-1 of a laminated electronic component 100 according to one embodiment.

[0080] When the surface of the laminate is determined to be B3, all of the conductive pastes 21, 22, 23, 24, 25, and 26 for the internal electrodes are exposed on the surface of the laminate, and each of the conductive pastes 21, 22, 23, 24, 25, and 26 for the internal electrodes can form the main electrode pairs 121, 122, 123, 124, 125, and 126, and this is the case when forming the laminated electronic component 10' according to the conventional embodiment.

[0081] Thus, in one embodiment, by forming the main electrode pair and the auxiliary electrode pair by polishing the surfaces facing each other in the second direction of a laminate in which the dielectric sheet 11 and the internal electrode pastes 21, 22, 23, 24, 25, and 26 are stacked, various capacities can be achieved in a laminated electronic component of substantially the same size, and the mechanical strength of the laminated electronic component can be improved by adjusting the number of auxiliary electrode pairs.

[0082] After the stage of forming the laminate, a process of forming a cover portion may be carried out as needed, and thereafter the main body 110 can be formed by firing at a temperature of 900°C to 1200°C.

[0083] After the step of forming the main body 110, external electrodes 130 and 140 can be formed on the main body 110.

[0084] The method for forming the external electrodes 130 and 140 is not particularly limited. For example, the electrode layer that may be included in the external electrodes 130 and 140 may be formed by dipping in a paste containing a conductive metal and glass, or by transferring a sheet containing a conductive metal. Alternatively, it can be formed using a paste containing a conductive metal and resin, or by using atomic layer deposition (ALD), molecular layer deposition (MLD), chemical vapor deposition (CVD), sputtering, or the like.

[0085] Furthermore, if a plating layer is placed on the electrode layer, the plating layer may be formed using methods such as electrolytic plating or electroless plating.

[0086] Although embodiments of the present invention have been described in detail above, the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided herein. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0087] Furthermore, the expression “one embodiment” as used in this disclosure does not mean that each embodiment is the same as another, but is provided to highlight and illustrate the unique and distinct features of each embodiment. However, the embodiments presented above do not preclude their realization in combination with the features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment unless there is a contradictory or contrary description of that matter in the other embodiment.

[0088] The terms used in this disclosure are used solely to illustrate one embodiment and are not intended to limit the disclosure. Where otherwise clearly the context indicates otherwise, singular expressions include plural expressions. [Explanation of symbols]

[0089] 100, 100': Multilayer electronic components 110: Main unit 111: Dielectric layer 112, 113: Cover section 114, 115: Margin section 121, 122, 123, 124, 125, 126: Main electrode pair 123-1, 124-1, 125-1, 126-1: Auxiliary electrode pairs 130, 140: External electrode 131, 141: Electrode layer 132, 133, 142, 143: Plating layer

Claims

1. A body comprising a dielectric layer, and two or more internal electrodes arranged alternately with the dielectric layer in a first direction, with different lengths in a second direction perpendicular to the first direction, The body includes an external electrode disposed on the main body and connected to one or more of the internal electrodes, The internal electrodes include a pair of main electrodes connected to the external electrodes and positioned with the dielectric layer in between, and a pair of auxiliary electrodes positioned at a distance from the external electrodes and positioned with the dielectric layer in between. The internal electrodes have a continuous shape in the second direction, and the component is a stacked electronic component.

2. The internal electrode includes two or more pairs of the auxiliary electrode pairs, The stacked electronic component according to claim 1, wherein the two or more pairs of auxiliary electrodes have different distances in the second direction from adjacent external electrodes.

3. The stacked electronic component according to claim 2, wherein the absolute value of the difference between the distance between the two or more pairs of auxiliary electrodes and an adjacent external electrode in the second direction is 1 μm or more.

4. The stacked electronic component according to claim 1, wherein the area in which the main electrode pair overlaps in the first direction is smaller than the area in which the auxiliary electrode pair overlaps in the first direction.

5. The stacked electronic component according to claim 1, wherein the internal electrodes include two or more pairs of main electrode pairs and two or more pairs of auxiliary electrode pairs, and the auxiliary electrode pairs are arranged alternately with the main electrode pairs with the dielectric layer in between.

6. The internal electrode includes two or more pairs of main electrode pairs and two or more pairs of auxiliary electrode pairs with different separation distances from the external electrode. When the arrangement of the main electrode pair is A1, the arrangement of the auxiliary electrode pair that has the smallest separation distance from adjacent external electrodes is A2, and the arrangement of the auxiliary electrode pair that has the largest separation distance from adjacent external electrodes is A3, The stacked electronic component according to any one of claims 1 to 5, wherein the internal electrodes are arranged in a repeating sequence of A1, A2, A1, and A3 along the first direction.

7. The internal electrode includes two or more pairs of main electrode pairs and two or more pairs of auxiliary electrode pairs with different separation distances from the external electrode. When the arrangement of the main electrode pair is A1, the arrangement of the auxiliary electrode pair that has the smallest separation distance from adjacent external electrodes is A2, and the arrangement of the auxiliary electrode pair that has the largest separation distance from adjacent external electrodes is A3, The stacked electronic component according to any one of claims 1 to 5, wherein the internal electrodes are arranged in a repeating sequence of A1, A1, A2, and A3 along the first direction.

8. The steps include forming a body that includes a dielectric layer and two or more internal electrodes that are alternately arranged with the dielectric layer in a first direction and have different lengths in a second direction perpendicular to the first direction, The step includes forming an external electrode that is placed on the main body and connected to one or more of the internal electrodes, The internal electrodes include a pair of main electrodes connected to the external electrodes and positioned with the dielectric layer in between, and a pair of auxiliary electrodes positioned at a distance from the external electrodes and positioned with the dielectric layer in between. A method for manufacturing a laminated electronic component, wherein the main electrode pair and the auxiliary electrode pair are formed by polishing the surfaces of a laminate, which is formed by laminating a dielectric sheet and an internal electrode paste, that face each other in a second direction.

9. The method for manufacturing a stacked electronic component according to claim 8, wherein the internal electrode has a shape that is continuous in the second direction.

10. The internal electrode includes two or more pairs of the auxiliary electrode pairs, The method for manufacturing a stacked electronic component according to claim 8, wherein the two or more pairs of auxiliary electrodes are separated from adjacent external electrodes by different distances in the second direction.

11. The method for manufacturing a stacked electronic component according to claim 10, wherein the absolute value of the difference in the distance between the two or more pairs of auxiliary electrodes and adjacent external electrodes in the second direction is 1 μm or more.

12. The method for manufacturing a stacked electronic component according to claim 8, wherein the area in which the main electrode pair overlaps in the first direction is smaller than the area in which the auxiliary electrode pair overlaps in the first direction.

13. The method for manufacturing a stacked electronic component according to claim 8, wherein the internal electrodes include two or more pairs of main electrode pairs and two or more pairs of auxiliary electrode pairs, and the auxiliary electrode pairs are arranged alternately with the main electrode pairs with the dielectric layer in between.

14. The internal electrode includes two or more pairs of main electrode pairs and two or more pairs of auxiliary electrode pairs with different separation distances from the external electrode. When the arrangement of the main electrode pair is A1, the arrangement of the auxiliary electrode pair that has the smallest separation distance from adjacent external electrodes is A2, and the arrangement of the auxiliary electrode pair that has the largest separation distance from adjacent external electrodes is A3, The method for manufacturing a stacked electronic component according to any one of claims 8 to 13, wherein the internal electrodes are arranged in a repeating sequence of A1, A2, A1, and A3 along the first direction.

15. The internal electrode includes two or more pairs of main electrode pairs and two or more pairs of auxiliary electrode pairs with different separation distances from the external electrode. When the arrangement of the main electrode pair is A1, the arrangement of the auxiliary electrode pair that has the smallest separation distance from adjacent external electrodes is A2, and the arrangement of the auxiliary electrode pair that has the largest separation distance from adjacent external electrodes is A3, The method for manufacturing a stacked electronic component according to any one of claims 8 to 13, wherein the internal electrodes are arranged in a repeating sequence of A1, A1, A2, and A3 along the first direction.

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