Coil components

Abstract

This invention provides a coil component with improved adhesion between the main body and the external electrodes. [Solution] The coil component of the present invention comprises a body including magnetic particles and an insulating film disposed on the surface of the magnetic particles, a coil disposed inside the body, and an external electrode disposed on the first surface of the body, wherein the magnetic particles include first magnetic particles that directly contact the external electrode and second magnetic particles that do not directly contact the external electrode, and at least a portion of the insulating film contacts the second magnetic particles and the external electrode, respectively.

Description

Technical Field

[0001] The present invention relates to a coil component.

Background Art

[0002] An inductor, which is one type of coil component, is a typical passive electronic component used in electronic devices together with a resistor and a capacitor.

[0003] In the case of a coil component having a bottom electrode structure, copper (Cu) plating is formed on the bottom surface of the main body by an electrochemical method. If powder is exposed on the bottom surface of the main body, the adhesion strength with the seed layer may be weakened by the insulating coating layer on the powder. As a result, problems such as poor plating of the external electrode may occur.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide a coil component with improved adhesion between a main body and an external electrode.

Means for Solving the Problems

[0005] A coil component according to one aspect of the present invention made to achieve the above object includes a main body including magnetic particles and an insulating film disposed on the surface of the magnetic particles, a coil disposed in the main body, and an external electrode disposed on a first surface of the main body. The magnetic particles include first magnetic particles that directly contact the external electrode and second magnetic particles that do not directly contact the external electrode, and at least a part of the insulating film contacts the second magnetic particles and the external electrode, respectively.

[0006] To achieve the above objective, another embodiment of the present invention provides a coil component comprising: a body including magnetic particles and an insulating film disposed on the surface of the magnetic particles; a coil disposed within the body; and an external electrode disposed on a first surface of the body, wherein the magnetic particles include first magnetic particles that are in direct contact with the external electrode and second magnetic particles that are not in direct contact with the external electrode. The region on the first surface in which the first magnetic particles are distributed is narrower than the region on the first surface in which the external electrodes are placed. [Effects of the Invention]

[0007] According to the present invention, the adhesion force between the body of the coil component and the external electrode can be improved, and the voltage withstand characteristics of the coil component can be improved. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic perspective view showing a coil component according to one embodiment of the present invention. [Figure 2] This figure shows a cross-section along the line I-I' in Figure 1. [Figure 3] This figure shows a cross-section along the line II-II' in Figure 1. [Figure 4] This is a magnified view of A in Figure 3. [Figure 5] This is a magnified view of B in Figure 3. [Figure 6] This is a view of the coil component from below (Figure 1). [Modes for carrying out the invention]

[0009] The terms used herein are used solely to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as “includes” or “having” are intended to specify the existence of features, figures, stages, operations, components, parts, or combinations thereof described in the specification, and should be understood not to preemptively exclude the possibility of the existence or addition of one or more other features, figures, stages, operations, components, parts, or combinations thereof. Throughout the specification, “above” means located above or below the part in question, and does not necessarily mean located above the direction of gravity.

[0010] Furthermore, the term "connection" shall not refer only to cases where each component is in direct physical contact with another component, but shall also encompass cases where other components are interposed between the components, and each component is in contact with the other components.

[0011] The dimensions and thicknesses of each component shown in the drawings are arbitrary for illustrative purposes, and therefore the present invention is not necessarily limited to those shown.

[0012] In drawings, the X direction is defined as the first direction or thickness direction, the Y direction as the second direction or length direction, and the Z direction as the third direction or width direction.

[0013] Hereinafter, specific examples of embodiments for implementing the coil component of the present invention will be described in detail with reference to the drawings.

[0014] When explaining with reference to the drawings, the same or corresponding components will be assigned the same reference numerals, and redundant explanations will be omitted.

[0015] Electronic devices utilize various types of electronic components, and various types of coil components are appropriately used between these components for purposes such as noise reduction.

[0016] That is, in an electronic device, coil components are used for power inductors, high-frequency inductors, general beads, GHz beads, common mode filters, and the like.

[0017] FIG. 1 is a perspective view schematically showing a coil component according to an embodiment of the present invention, FIG. 2 is a view showing a cross section taken along line I-I' of FIG. 1, FIG. 3 is a view showing a cross section taken along line II-II' of FIG. 1, FIG. 4 is an enlarged view showing A in FIG. 3, FIG. 5 is an enlarged view showing B in FIG. 3, and FIG. 6 is a view of the coil component of FIG. 1 as seen from below.

[0018] Referring to FIGS. 1 to 6, the coil component 1000 according to this embodiment includes a main body 100, a support member 200, a coil 300, external electrodes (400, 500), and an insulating layer 600, and further includes a coil insulating film IF.

[0019] The main body 100 forms the appearance of the coil component 1000 according to this embodiment, and the coil 300 and the support member 200 are arranged inside.

[0020] The main body 100 is generally formed in a hexahedron shape.

[0021] The main body 100 includes a first surface 101 and a second surface 102 that face each other in a first direction (X direction), a third surface 103 and a fourth surface 104 that face each other in a second direction (Y direction), and a fifth surface 105 and a sixth surface 106 that face each other in a third direction (Z direction) based on the directions shown in FIGS. 1 to 3. Each of the third to sixth surfaces (103, 104, 105, 106) of the main body 100 corresponds to a side surface of the main body 100 that connects the first surface 101 and the second surface 102 of the main body 100. Hereinafter, the first surface 101 of the main body 100 means the lower surface of the main body, but is not necessarily limited thereto.

[0022] The main body 100 is formed such that the coil component 1000 according to the present embodiment, on which external electrodes (400, 500) and an insulating layer 600, which will be described later exemplarily, are formed, has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, but is not limited thereto. On the other hand, since the above numerical values are only design values that do not reflect process errors and the like, it should be regarded as belonging to the scope of the present invention up to the range recognized as process errors.

[0023] The main body 100 includes a core 110 that penetrates a support member 200 and a coil 300, which will be described later. The core 110 is formed by filling through-holes, through which a magnetic composite sheet penetrates the central portions of the coil 300 and the support member 200, but is not limited thereto.

[0024] The main body 100 includes magnetic particles (11, 12) and insulating films (11F, 12F) disposed on the surfaces of the magnetic particles.

[0025] The magnetic particles (11, 12) include any one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the magnetic particles (11, 12) are at least one or more of pure iron powder, Fe—Si-based alloy powder, Fe—Si—Al-based alloy powder, Fe—Ni-based alloy powder, Fe—Ni—Mo-based alloy powder, Fe—Ni—Mo—Cu-based alloy powder, Fe—Co-based alloy powder, Fe—Ni—Co-based alloy powder, Fe—Cr-based alloy powder, Fe—Cr—Si-based alloy powder, Fe—Si—Cu—Nb-based alloy powder, Fe—Ni—Cr-based alloy powder, and Fe—Cr—Al-based alloy powder.

[0026] The magnetic particles (11, 12) are amorphous or crystalline. For example, the magnetic particles (11, 12) are Fe—Si—B—Cr-based amorphous alloy powder, but are not necessarily limited thereto. The magnetic particles (11, 12) each have an average diameter of about 0.1 μm to 30 μm, but are not limited thereto.

[0027] The magnetic particles (11, 12) include two or more types of magnetic particles. Here, "different types of magnetic particles" means that the magnetic particles dispersed in the resin are distinguished from each other by one of the following: average diameter, compositional crystallinity, and shape. For example, as shown in Figure 4, the magnetic particles (11, 12) include a large number of magnetic particles with different diameters.

[0028] An insulating film (11F, 12F) is formed on the surface of the magnetic particles (11, 12). The insulating film (11F, 12F) may contain, for example, epoxy, polyimide, or liquid crystal polymer, either alone or in combination, or it may contain silica (SiO2) or alumina (Al2O3), or it may be an oxide containing the metal of the magnetic particles.

[0029] The main body 100 contains resin. Magnetic particles (11, 12) are dispersed in the resin of the main body 100. The resin is configured to be distinct from insulating films (11F, 12F) formed on the surface of the magnetic particles. The main body according to this embodiment is formed by laminating one or more magnetic composite sheets containing resin and magnetic particles (11, 12) dispersed in the resin.

[0030] The resin may include, but is not limited to, epoxy, polyimide, or liquid crystal polymer, either alone or in combination.

[0031] Referring to Figure 4, the magnetic particles (11, 12) include a first magnetic particle 11 that is in direct contact with the external electrode described later, and a second magnetic particle 12 that is not in direct contact with the external electrode.

[0032] The first magnetic particle 11 extends to the first surface 101 of the main body 100. Here, a portion of the first magnetic particle 11 protrudes beyond the first surface 101. The insulating film 11F is not placed on the protruding portion of the first magnetic particle 11. That is, since the insulating film 11F is not placed on a portion of the surface of the first magnetic particle 11, the first magnetic particle 11 is in direct contact with the external electrodes 400 and 500.

[0033] In the case of coil components with a bottom electrode structure, copper (Cu) plating is formed on the bottom surface of the main body by an electrochemical method. If powder is exposed on the bottom surface of the main body, the insulating coating layer on the powder may weaken the adhesion between it and the seed layer. This may lead to problems such as poor plating of the external electrodes.

[0034] In this embodiment, the coil component 1000 has a portion of the insulating film 11F removed from the surface of the first magnetic particle 11 exposed on the first surface 101 of the main body, and the plating layer of the external electrodes (400, 500) is formed directly on the surface of the first magnetic particle 11. That is, the first magnetic particle 11 acts as a seed during the plating of the external electrodes (400, 500). Since roughness is formed on the surface of the first magnetic particle 11 from which the insulating film 11F has been removed, the external electrodes are stably formed on the first surface 101 of the main body.

[0035] The first magnetic particles 11 extending to the first surface 101 of the main body have a circular or elliptical cross-section. This is in contrast to the first magnetic powder 11 extending to the third surface 103 and the fourth surface 104 of the main body, which have a cross-sectional surface, as will be described later. The first surface 101 of the main body is the lower surface of the coil component 1000 according to this embodiment, and no dicing process is performed on the lower surface. Therefore, when observed in a cross-sectional sample, the first magnetic particles 11 extending to the first surface 101 of the main body maintain a curved outline and have a perfectly circular or elliptical cross-section. Furthermore, as shown in Figure 4, while the first magnetic particles 11 extending to the first surface 101 maintain a circular or elliptical shape, at least a portion of them protrudes from the first surface 101.

[0036] Only a portion of the insulating film 11F of the first magnetic particle 11 is removed. Referring to Figure 4, the insulating film 11F remains on the surface of the first magnetic particle 11 that is not exposed to the first surface 101.

[0037] Figure 6 is a view of the coil component from Figure 1, seen from below. For the sake of clarity, the insulating layer 600 is omitted from the diagram in Figure 6.

[0038] Referring to Figure 6, the region R11 where the first magnetic particle 11 is distributed on the first surface 101 is narrower than the region where the external electrodes (400, 500) are placed on the first surface 101. Specifically, referring to Figure 6, the region R11 has a shorter length in the Y direction (second direction) and a shorter length in the Z direction (third direction) than the region where the external electrodes (400, 500) are placed on the first surface 101.

[0039] If the insulating film of magnetic particles is removed from the entire region where the external electrodes (400, 500) are located, the dielectric strength of the coil component may decrease. Therefore, the dielectric strength can be improved by removing the insulating film 11F from only a portion of the magnetic particles 11 in the region where the external electrodes (400, 500) are located.

[0040] At least a portion of the first magnetic particles 11 extends to the third surface 103 and the fourth surface 104 of the main body 100 and contacts the first and second external electrodes (400, 500). The first magnetic particles 11 extending to the third surface 103 and the fourth surface 104 of the main body 100 have cut surfaces. The third surface 103 and the fourth surface 104 of the main body 100 are the dicing surfaces of the coil component. Generally, in the case of thin-film coil components, a coil bar is manufactured in which multiple coils and multiple main bodies are connected to each other on a large-area substrate, and dicing is performed in the second direction (Y direction) and third direction (Z direction) of each component to individualize the main bodies of the multiple components. Therefore, the magnetic particles 11 extending to the third and fourth surfaces (103, 104) of the main body 100 of the coil component according to this embodiment have cut surfaces. Since the insulating film 11F is also removed during the dicing process, no insulating film is placed on the cut surfaces of the magnetic particles 11. Furthermore, the cut surface is coplane with the third surface 103 and the fourth surface 104 of the main body, and the magnetic particles 11 do not protrude from the third surface 103 and the fourth surface 104.

[0041] At least a portion of the second magnetic particles 12 extends to the first surface 101 of the main body 100. Here, a portion of the second magnetic particles 12 protrudes beyond the first surface 101. However, unlike the first magnetic particles 11 described above, the insulating film 12F is not removed from the second magnetic particles 12 that extend to the first surface 101. Therefore, the second magnetic particles 12 have the following arrangement relationship with the external electrodes (400, 500) or the insulating layer 600.

[0042] At least a portion of the second magnetic particles 12 have an insulating film 12F that contacts the external electrodes (400, 500). Referring to Figure 4, at least a portion of the insulating film 12F is in contact with the second magnetic particles 12 and the external electrodes 400, respectively. As described above, in the region where the external electrodes (400, 500) are located, the remaining magnetic particles 12, excluding some of the magnetic particles 11, do not remove the insulating film 12F, thus improving the dielectric strength. Therefore, the second magnetic particles 12 have an insulating layer, which will be described later. The particles are positioned outside the main body 100 with respect to the second direction (Y direction) relative to 600. Referring to Figure 4, some of the second magnetic particles 12 are located outside the main body 100 beyond the interface between the insulating layer 600 and the external electrode 400. Also, referring to Figure 6, the second magnetic particles 12 are distributed in the remaining area of ​​the first surface 101 of the main body 100, excluding region R11. Therefore, at least a portion of the second magnetic particles 12 are distributed within the region where the external electrodes (400, 500) are located on the first surface 101.

[0043] At least a portion of the second magnetic particle 12 is in contact with the insulating layer 600 via the insulating film 12F. That is, at least a portion of the insulating film 12F is positioned between the second magnetic particle 12 and the insulating layer 600.

[0044] The support member 200 is embedded within the main body 100. The support member 200 is configured to support the coil 300, which will be described later.

[0045] The support member 200 is formed from an insulating material including a thermosetting insulating resin such as epoxy resin, a thermoplastic insulating resin such as polyimide, or a photosensitive insulating resin, or from an insulating material in which such an insulating resin is impregnated with a reinforcing material such as glass fiber or inorganic filler. For example, the support member 200 is formed from insulating materials such as prepreg, ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine) resin, or PID (Photo Imageable Dielectric).

[0046] As inorganic fillers, at least one selected from the group consisting of silica (SiO2), alumina (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, mud, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) can be used.

[0047] When the support member 200 is formed of an insulating material including reinforcing material, the support member 200 provides superior rigidity. When the support member 200 is formed of an insulating material that does not contain glass fibers, it is advantageous for reducing the thickness of the coil component 1000 according to this embodiment. Also, the volume occupied by the coil 300 and / or magnetic particles (11, 12) can be increased relative to the main body 100 of the same size, thereby improving the component characteristics. When the support member 200 is formed of an insulating material including a photosensitive insulating resin, the number of steps required to form the coil 300 is reduced, which is advantageous for reducing production costs, and fine vias can be formed.

[0048] The coil 300 is placed inside the main body 100 and exhibits the characteristics of a coil component. For example, when the coil component 1000 of this embodiment is used as a power inductor, the coil 300 can stabilize the power supply of electronic equipment by storing the electric field in a magnetic field and maintaining the output voltage.

[0049] The coil 300 includes coil patterns (310, 320) and vias 330. Specifically, with reference to the directions shown in Figures 1 to 3, the first coil pattern 310 is positioned on the upper surface of the support member 200 facing the second surface 102 of the main body 100, and the second coil pattern 320 is positioned on the lower surface of the support member 200 facing the upper surface of the support member 200. The vias 330 penetrate the support member 200 and connect the first coil pattern 310 and the second coil pattern 320. In this way, the coil 300 functions as a single coil between the first external electrode 400 and the second external electrode 500.

[0050] Each of the first coil pattern 310 and the second coil pattern 320 is a planar helical shape that forms at least one turn around the core 110 of the main body 100. For example, with reference to the directions shown in Figures 1 and 2, the first coil pattern 310 forms multiple turns around the core on the upper surface of the support member 200. The second coil pattern 320 forms multiple turns around the core on the lower surface of the support member 200.

[0051] One end of the first coil pattern 310 extends to the third surface 103 of the main body and is connected to the first external electrode 400, which will be described later, and the other end is connected to the via 330. One end of the second coil pattern 320 extends to the fourth surface 104 of the main body and is connected to the second external electrode 500, which will be described later, and the other end is connected to the via 330.

[0052] At least one of the coil patterns (310, 320) and via 330 includes at least one conductive layer.

[0053] For example, when the first coil pattern 310 and via 330 are formed by plating, each of the first coil pattern 310 and via 330 includes a seed layer formed by electroless plating or vapor deposition such as sputtering, and an electroplated layer. Here, the electroplated layer is either a single-layer structure or a multilayer structure. A multilayer electroplated layer is formed in a conformal film structure in which one electroplated layer covers the other, or in a shape in which the other electroplated layer is laminated on only one surface of the other electroplated layer. The seed layers of the first coil pattern 310 and via 330 are formed integrally without boundaries between them, but are not limited to this. The electroplated layers of the first coil pattern 310 and via 330 are formed integrally without boundaries between them, but are not limited to this.

[0054] Each of the coil patterns (310, 320) and vias 330 is formed from a conductive material such as, but is not limited to, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), molybdenum (Mo), or alloys thereof.

[0055] The external electrodes (400, 500) are arranged on the first surface 101 of the main body 100. Since the first surface 101 of the main body 100 is the bottom surface, the coil component according to this embodiment is a coil component having a bottom surface electrode structure.

[0056] The external electrodes (400, 500) include a first external electrode 400 positioned on the first surface 101 and the third surface 103 of the main body 100, and a second external electrode 500 positioned on the first surface 101 and the fourth surface 104.

[0057] The first external electrode 400 is positioned on the third surface 103 of the main body 100 and connected to one end of the first coil pattern 310. The second external electrode 500 is positioned on the fourth surface 104 of the main body 100 and connected to one end of the second coil pattern 320. The first external electrode 400 and the second external electrode 500 are positioned on the first surface 101 of the main body 100, separated from each other by an insulating layer 600.

[0058] Referring to Figure 4, the external electrode 400 is positioned inside the main body with reference to the second direction (Y direction) relative to the first magnetic particle 11. As described above, in this embodiment, the coil component has the insulating film 11F removed only from a portion of the magnetic particles 11 in the region where the external electrodes (400, 500) are positioned. The first magnetic particles 11 from which the insulating film 11F has been removed are positioned outside the main body beyond the boundary between the external electrode 400 and the insulating layer 600.

[0059] The external electrodes (400, 500) include a first layer (410, 510) and a second layer (420, 520) placed on the first layer. That is, the external electrodes are formed with a multi-layer structure. For example, the first external electrode 400 consists of a first layer 410 containing copper (Cu), a second layer 420 containing nickel (Ni) placed on the first layer, and a third layer 430 containing tin (Sn) placed on the second layer. Here, the first to third layers are each formed by plating, but are not limited to this.

[0060] The first layer (410, 510) of the external electrode contains copper (Cu). The first layer (410, 510) of the external electrode is in direct contact with the first magnetic particles 11. When the first layer (410, 510) is plated, the first magnetic particles 11 act as seeds. The insulating film 11F is partially removed from the first magnetic particles 11, and the first magnetic particles 11 are in direct contact with the first layer (410, 510) of the external electrode, so the first layer (410, 510) is stably formed on the first surface 101 of the main body.

[0061] However, the present invention is not necessarily limited thereto. For example, the first layer (410, 510) of the external electrode may be a conductive resin layer. The conductive resin layer contains a resin and a metal component dispersed within the resin. The resin includes epoxy as a thermosetting resin. In the case of a metal component, it contains a silver (Ag) or copper (Cu) component. For example, the conductive resin layer in this embodiment is an Ag epoxy layer or a Cu epoxy layer.

[0062] The first and second external electrodes (400, 500) are formed from conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but are not limited to these.

[0063] The external electrodes (400, 500) are formed by vapor deposition methods such as sputtering and / or plating methods, but are not limited to these.

[0064] The insulating layer 600 is positioned on the first surface 101 of the main body 100 and covers the sides of the external electrodes (400, 500).

[0065] The insulating layer 600 is placed on the surface of the main body 100 so that the main body 100 is not exposed to the outside of the coil component. Specifically, the insulating layer 600 is placed on the first surface 101, the second surface 102, the fifth surface 105, and the sixth surface 106 of the main body 100 in areas where external electrodes are not formed. The insulating layer 600 functions as a plating resist when the external electrodes (400, 500) are formed by plating, but is not limited to this.

[0066] The insulating layer 600 is placed on the surface of the main body 100 where external electrodes (400, 500) are not formed, and serves to electrically protect the coil components, reduce leakage current, and prevent plating bleeding during the formation of external electrodes.

[0067] The insulating layer 600 is made of thermoplastic resins such as polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber, and acrylic; thermosetting resins such as phenol, epoxy, urethane, melamine, and alkyd; photosensitive resins; parylene; SiO2 x , or SiN x Includes.

[0068] The coil insulating film IF is placed between the coil 300 and the main body 100, and between the support member 200 and the main body 100. The coil insulating film IF is formed along the surface of the support member 200 on which the coil patterns (310, 320) are formed, but is not limited to this. The coil insulating film IF is for insulating the coil 300 and the main body 100, and includes, but is not limited to, a known insulating material such as parylene. As another example, the coil insulating film IF may include an insulating material such as epoxy resin instead of parylene. The coil insulating film IF is formed by vapor deposition, but is not limited to this. As another example, the coil insulating film IF can also be formed by laminating and curing insulating films for forming the coil insulating film IF on both sides of the support member 200 on which the coil 300 is formed, or by applying and curing insulating paste for forming the coil insulating film IF on both sides of the support member 200 on which the coil 300 is formed. On the other hand, for the reasons stated above, the coil insulating film IF is an optional component in this embodiment. In other words, if the main body 100 has sufficient electrical resistance at the designed operating current and voltage of the coil component 1000 according to this embodiment, the coil insulating film IF can be omitted in this embodiment.

[0069] Although embodiments of the present invention have been described in detail above with reference to the drawings, the present invention is not limited to the embodiments described above, and can be modified and implemented in various ways without departing from the technical spirit of the present invention. [Explanation of symbols]

[0070] 11, 12 First and second magnetic particles 11F, 12F insulating film 110 cores 100 Main Unit 101, 102, 103, 104, 105, 106 1st to 6th sides 110 cores 200 Support Member 300 coils 310, 320 coil patterns 330 Beer 400, 500 external electrode 410, 510 1st layer 420, 520 2nd layer 430 3rd layer 600 Insulating layer 1000 coil components IF coil insulating film R11 Region where the first magnetic particle is distributed on the first surface

Claims

1. A body including magnetic particles and an insulating film disposed on the surface of the magnetic particles, A coil arranged inside the main body, The main body comprises an external electrode positioned on the first surface of the main body, The magnetic particles include a first magnetic particle that is in direct contact with the external electrode and a second magnetic particle that is not in direct contact with the external electrode. A coil component characterized in that at least a portion of the insulating film is in contact with the second magnetic particle and the external electrode, respectively.

2. The first magnetic particle extends to the first surface of the main body, The coil component according to claim 1, characterized in that the insulating film is not disposed on at least a portion of the surface of the first magnetic particle.

3. The coil component according to claim 1, characterized in that at least a portion of the first magnetic particle protrudes from the first surface of the main body.

4. The coil component according to claim 1, characterized in that the main body has a first surface and a second surface facing the first direction, and a third surface and a fourth surface that connect the first surface and the second surface and face the second direction.

5. The coil component according to claim 4, characterized in that the external electrode is positioned inside the main body with reference to the second direction relative to the first magnetic particle.

6. The coil component according to claim 4, further comprising an insulating layer disposed on the first surface of the main body and covering the side surface of the external electrode.

7. The coil component according to claim 6, characterized in that the second magnetic particle is arranged outside the main body with reference to the second direction relative to the insulating layer.

8. The coil component according to claim 6, characterized in that at least a portion of the insulating film is disposed between the second magnetic particle and the insulating layer.

9. The coil component according to claim 4, characterized in that the external electrodes include a first external electrode disposed on the third and first surfaces of the main body, and a second external electrode disposed on the fourth and first surfaces of the main body.

10. At least a portion of the first magnetic particle extends to the third and fourth surfaces of the main body, The coil component according to claim 9, characterized in that the first magnetic particles extending to the third and fourth surfaces of the main body have a cross-section.

11. The external electrode includes a first layer and a second layer disposed on the first layer. The coil component according to claim 1, characterized in that the first layer comprises at least one of copper (Cu) and silver (Ag).

12. The coil component according to claim 11, characterized in that the first layer further comprises resin.

13. A body including magnetic particles and an insulating film disposed on the surface of the magnetic particles, A coil arranged inside the main body, The main body comprises an external electrode positioned on the first surface of the main body, The magnetic particles include a first magnetic particle that is in direct contact with the external electrode and a second magnetic particle that is not in direct contact with the external electrode. A coil component characterized in that the region in which the first magnetic particles are distributed on the first surface is narrower than the region in which the external electrodes are arranged on the first surface.

14. The coil component according to claim 13, characterized in that at least a portion of the second magnetic particles are distributed within the region on which the external electrode is positioned on the first surface.

15. The coil component according to claim 13, characterized in that at least a portion of the second magnetic particle protrudes from the first surface of the main body.

16. The first magnetic particle extends to the first surface of the main body, The coil component according to claim 13, characterized in that the insulating film is not disposed on at least a portion of the surface of the first magnetic particle.

17. The external electrode includes a first layer and a second layer disposed on the first layer. The coil component according to claim 13, characterized in that the first layer comprises at least one of copper (Cu) and silver (Ag).

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