Multilayer electronic components

Abstract

To provide a stacked electronic component with excellent heat generation characteristics and reliability. [Solution] The stacked electronic component includes a dielectric layer 111 and internal electrodes 121 and 122 arranged alternately in a first direction X, and includes a body 110 including first and second surfaces facing the first direction, third and fourth surfaces facing the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing the third direction Z, and external electrodes arranged on the third and fourth surfaces. The internal electrodes include first and second conductor parts EP1 and EP2 arranged spaced apart in a third direction with a separation part SP in between, and the body includes a first margin part 114 which is the region between the fifth surface and the internal electrodes and a second margin part 115 which is the region between the sixth surface and the internal electrodes, and when the widths of the body, first margin part, separation part and second margin part in the third direction are W, MW1, CW, and MW2, respectively, then 0.08

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] Multilayer ceramic capacitors offer the advantages of being small yet guaranteeing high capacitance and being easy to mount, making them suitable for use as components in various electronic devices. As computers, mobile devices, and other electronic equipment become smaller and more powerful, the demand for smaller and higher-capacitance multilayer ceramic capacitors is increasing.

[0004] Furthermore, with the miniaturization and increased capacitance of multilayer ceramic capacitors, the mounting density of multilayer ceramic capacitors is also increasing.

[0005] Multilayer ceramic capacitors can experience temperature increases depending on the applied voltage and operating environment. This temperature rise can affect their electrical characteristics and potentially lead to reduced reliability; therefore, it is necessary to control the heat generation characteristics of multilayer ceramic capacitors. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] JP 2004-193352 A [Overview of the Initiative]

Problems to be Solved by the Invention

[0007] One of the various objects of the present invention is to provide a multilayer electronic component having excellent heat generation characteristics.

[0008] One of the various objects of the present invention is to provide a multilayer electronic component having excellent reliability.

[0009] However, the object of the present invention is not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Means for Solving the Problems

[0010] The multilayer electronic component according to an embodiment of the present invention includes a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and facing each other in a third direction, a main body, and external electrodes disposed on the third surface and the fourth surface. The internal electrodes include a first conductor portion and a second conductor portion spaced apart in the third direction with a separation portion therebetween. The main body includes a first margin portion which is a region between the fifth surface and the internal electrodes, and a second margin portion which is a region between the sixth surface and the internal electrodes. When the widths of the main body, the first margin portion, the separation portion, and the second margin portion in the third direction are W, MW1, CW, and MW2, respectively, 0.08 < MW1 / W < 0.20, 0.08 < MW2 / W < 0.20, and 0.08 < CW / W < 0.3 can be satisfied.

Advantages of the Invention

[0011] As one of the various advantages of the present invention, by including the first and second conductor portions in which the internal electrodes are spaced apart in the third direction with a separation portion therebetween, the heat generation characteristics of the multilayer electronic component can be improved.

[0012] However, the diverse and meaningful advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood during the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0013] [Figure 1] It schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 2] It schematically shows a cross-sectional view taken along the line I-I' of FIG. 1. [Figure 3] It schematically shows a cross-sectional view taken along the line II-II' of FIG. 1. [Figure 4] It schematically shows a cross-sectional view taken along the line III-III' of FIG. 1. [Figure 5] It schematically shows a cross-sectional view taken along the line IV-IV' of FIG. 1. [Figure 6] It shows the disassembled body of FIG. 1. [Figure 7] It is a cross-sectional view corresponding to FIG. 2 of a conventional stacked electronic component. [Figure 8] It is a graph comparing the capacitance and DF of the conventional example and the inventive example.

Embodiments for Carrying Out the Invention

[0014] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be deformed into several other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape and size of elements in the drawings may be enlarged, reduced (or emphasized or simplified) for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0015] Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the description have been omitted, and the size and thickness of each component shown are arbitrarily indicated for the convenience of explanation; therefore, the present invention is not necessarily limited by the illustrations. Also, components with the same function within the scope of the same concept are described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a certain component, unless otherwise stated to the contrary, it does not mean that other components are excluded, but rather that other components may be further included.

[0016] In drawings, the X direction can be defined as the first direction, the lamination direction, or the thickness (T) direction; the Y direction as the second direction or the length (L) direction; and the Z direction as the third direction or the width (W) direction.

[0017] Multilayer electronic components Figure 1 shows a schematic perspective view of a stacked electronic component according to one embodiment of the present invention; Figure 2 shows a schematic cross-sectional view along the line I-I' in Figure 1; Figure 3 shows a schematic cross-sectional view along the line II-II' in Figure 1; Figure 4 shows a schematic cross-sectional view along the line III-III' in Figure 1; Figure 5 shows a schematic cross-sectional view along the line IV-IV' in Figure 1; and Figure 6 shows the main body of Figure 1 disassembled.

[0018] The following describes in detail a multilayer electronic component 100 according to one embodiment of the present invention with reference to Figures 1 to 6. While a multilayer ceramic capacitor (MLCC) will be described as an example of a multilayer electronic component, the present invention is not limited to this and can be applied to various multilayer electronic components using ceramic materials, such as inductors, piezoelectric elements, varistors, or thermistors.

[0019] A multilayer electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer in a first direction, and includes a first surface 1 and a second surface 2 facing each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface, the second surface, the third surface, and the fourth surface and facing each other in a third direction. The internal electrodes include a first conductor portion EP1 and a second conductor portion EP2 spaced apart in the third direction with a separation portion SP therebetween. The main body includes a first margin portion 114 which is a region between the fifth surface and the internal electrodes, and a second margin portion 115 which is a region between the sixth surface and the internal electrodes. When the widths in the third direction of the main body, the first margin portion, the separation portion, and the second margin portion are W, MW1, CW, and MW2 respectively, 0.08 < MW1 / W < 0.20, 0.08 < MW2 / W < 0.20, and 0.08 < CW / W < 0.3 can be satisfied.

[0020] With the miniaturization and high capacitance of multilayer ceramic capacitors, the mounting density of multilayer ceramic capacitors is also increasing.

[0021] The temperature of a multilayer ceramic capacitor may rise depending on the applied voltage, the use environment, etc. The temperature rise of a multilayer ceramic capacitor affects its electrical characteristics and may further lead to a decrease in reliability. Therefore, it is necessary to control the heat generation characteristics of the multilayer ceramic capacitor.

[0022] Conventionally, to control the heat generation characteristics of a multilayer ceramic capacitor, methods have been used to either lower the voltage applied to the capacitor or to lower the ESR (equivalent series resistance). In contrast, according to one embodiment of the present invention, the internal electrodes 121 and 122 include a first conductor section EP1 and a second conductor section EP2, which are spaced apart in a third direction with a separation section SP in between. This allows the current flowing through each conductor section EP1 and EP2 to be reduced, thereby reducing the heat generated in each conductor section EP1 and EP2 and improving the heat generation characteristics. Furthermore, the heat generated in each conductor section EP1 and EP2 is released through the separation section SP and margin sections 114 and 115, which suppresses the temperature rise of the multilayer ceramic capacitor.

[0023] The following describes the various components included in the stacked electronic component 100 according to one embodiment of the present invention.

[0024] The main body 110 may have dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0025] There are no particular restrictions on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be hexahedral or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 is not a perfectly straight hexahedron, but can be substantially hexahedral.

[0026] The main body 110 may have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and connected to the third surface 3 and the fourth surface 4 and facing each other in a third direction. The first surface 1 may be a mounting surface that is positioned to face the substrate when mounted on the substrate.

[0027] As margin regions where internal electrodes 121 and 122 are not placed overlap the dielectric layer 111, steps are created due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third, fourth, and fifth surfaces and / or the corners connecting the second surface with the third, fourth, and fifth surfaces may have a shape that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, due to the contraction behavior during the sintering process of the main body, the corners connecting the first surface 1 with the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6 and / or the corners connecting the second surface 2 with the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6 may have a shape that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, in order to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded by performing a separate process to round the corners connecting the first face with the third, fourth, fifth, and sixth faces, and / or the corners connecting the second face with the third, fourth, fifth, and sixth faces.

[0028] On the other hand, in order to suppress the step difference caused by the internal electrodes 121 and 122, if the internal electrodes after lamination are cut so that they are exposed on the fifth surface 5 and sixth surface 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, the portions connecting the first surface and the fifth and sixth surfaces, and the portions connecting the second surface and the fifth and sixth surfaces, may not have a contracted form.

[0029] The multiple dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM). There is no particular limit to the number of dielectric layers stacked, and it can be determined considering the size of the multilayer electronic component. For example, the main body can be formed by stacking 400 or more dielectric layers.

[0030] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate-based (BaTiO3) powder can be used as the ceramic powder. More specifically, as the ceramic powder, barium titanate-based (BaTiO3) powder, normal dielectric powder of a CaZrO3 substrate, etc. can be used. More specifically, as the barium titanate-based (BaTiO3) powder, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1) may be one or more of them, and the normal dielectric powder of the CaZrO3 substrate may be (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0031] Therefore, the dielectric layer 111 is BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), and (Ca 1-x Sr x )(Zr 1-y Ti y)One or more of O3 (0 < x < 1, 0 < y < 1) can be included.

[0032] The main body 110 includes a capacitance forming portion Ac in which a capacitance is formed, including a first internal electrode 121 and a second internal electrode 122 that are disposed inside the main body 110 and are disposed to face each other with a dielectric layer 111 interposed therebetween, and cover portions 112 and 113 formed on the upper and lower portions of the capacitance forming portion Ac in the first direction.

[0033] In addition, the capacitance forming portion Ac can be formed by repeatedly laminating a plurality of first internal electrodes 121 and second internal electrodes 122 with a dielectric layer 111 interposed therebetween as a portion that contributes to the formation of the capacitance of the capacitor.

[0034] The cover portions 112 and 113 can include an upper cover portion 112 disposed on the upper portion of the capacitance forming portion Ac in the first direction and a lower cover portion 113 disposed on the lower portion of the capacitance forming portion Ac in the first direction.

[0035] The upper cover portion 112 and the lower cover portion 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, and can basically play a role of preventing damage to the internal electrodes due to physical or chemical stress.

[0036] The upper cover portion 112 and the lower cover portion 113 do not include internal electrodes and can include the same material as the dielectric layer 111.

[0037] That is, the upper cover portion 112 and the lower cover portion 113 can include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0038] On the other hand, the thickness of the cover portions 112 and 113 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thickness tc of the cover portions 112 and 113 may be 15 μm or less.

[0039] The average thickness tc of the cover portions 112 and 113 can represent the size in the first direction, and may be the average value of the sizes of the cover portions 112 and 113 in the first direction measured at five equally spaced points on the upper or lower part of the volume forming portion Ac.

[0040] Furthermore, margin portions 114 and 115 can be arranged on the side surface of the volume-forming portion Ac.

[0041] The margin portions 114 and 115 may include a first margin portion 114 located on the fifth surface 5 of the main body 110 and a second margin portion 115 located on the sixth surface 6. That is, the margin portions 114 and 115 can be located on both end surfaces in the width direction of the ceramic main body 110.

[0042] As shown in Figure 5, the margin portions 114 and 115 can refer to the regions between the interface between both ends of the first internal electrode 121 and the second internal electrode 122 and the body 110 in a cross-section obtained by cutting the body 110 in the width-thickness (WT) direction.

[0043] The margins 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0044] The margin portions 114 and 115 may be formed by applying conductive paste to the ceramic green sheet, except where the margin portions are formed, to form internal electrodes.

[0045] Furthermore, in order to suppress the step caused by the internal electrodes 121 and 122, after cutting the laminated internal electrodes so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, a single dielectric layer or two or more dielectric layers can be laminated in the third direction (width direction) on both sides of the capacitance forming portion Ac to form margin portions 114 and 115.

[0046] On the one hand, the widths of the margin portions 114 and 115 do not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average width of the margin portions 114 and 115 may be 15 μm or less.

[0047] The average width of the margin portions 114 and 115 can mean the average size MW1 in the third direction of the region where the internal electrode is separated from the fifth surface and the average size MW2 in the third direction of the region where the internal electrode is separated from the sixth surface, and can be the value obtained by averaging the sizes in the third direction of the margin portions 114 and 115 measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0048] Therefore, in one embodiment, the average sizes MW1 and MW2 in the third direction of the regions where the internal electrodes 121 and 122 are separated from the fifth surface and the sixth surface can be 15 μm or less respectively. <000,0211>

[0049] The internal electrodes 121 and 122 include a first conductor portion EP1 and a second conductor portion EP2 which are separated and arranged in the third direction with a separation portion SP therebetween. The main body includes a first margin portion 114 which is the region between the fifth surface and the internal electrode, and a second margin 115 which is the region between the sixth surface and the internal electrode. When the widths in the third direction of the main body, the first margin portion, the separation portion, and the second margin portion are W, MW1, CW, and MW2 respectively, 0.08 < MW1 / W < 0.20, 0.08 < MW2 / W < 0.20, and 0.08 < CW / W < 0.3 can be satisfied.

[0050] By including the first conductor portion EP1 and the second conductor portion EP2 which are separated and arranged in the third direction with the separation portion SP therebetween, the internal electrodes 121 and 122 can reduce the current values flowing through each of the conductor portions EP1 and EP2, and thereby reduce the heat generation generated in each of the conductor portions EP1 and EP2 to improve the heat generation characteristics.

[0051] Further, as 0.08 < MW1 / W < 0.20, 0.08 < MW2 / W < 0.20, and 0.08 < CW / W < 0.3 are satisfied, the heat generated in each conductor part EP1 and EP2 is released through the separation part SP and the margin parts 114 and 115, and the temperature rise of the multilayer ceramic capacitor can be suppressed.

[0052] When MW1 / W and / or MW2 / W is 0.08 or less, it becomes difficult to protect the internal electrode from external impacts or the like, and there is a risk of a decrease in reliability. When it is 0.20 or more, there is a risk of a decrease in the capacitance per unit volume of the multilayer electronic component. Therefore, it is preferable to satisfy 0.08 < MW1 / W < 0.20 and 0.08 < MW2 / W < 0.20, and more preferably, it can satisfy 0.10 ≤ MW1 / W ≤ 0.15 and 0.10 ≤ MW2 / W ≤ 0.15.

[0053] When CW / W is 0.08 or less, since the first conductor part EP and the second conductor part EP2 are arranged very close to each other, there is a risk that the effect of separating the current and flowing through the first conductor part EP1 and the second conductor part EP2 cannot be ensured. On the other hand, when CW / W is 0.30 or more, the capacitance per unit volume of the multilayer electronic component may decrease, or a margin part cannot be ensured, and there is a risk of a decrease in reliability. Therefore, it is preferable to satisfy 0.08 < CW / W < 0.3, and more preferably, it can satisfy 0.10 ≤ CW / W ≤ 0.20.

[0054] In one embodiment, the above W, MW1, CW, and MW2 can satisfy 0.10 ≤ MW1 / W ≤ 0.15, 0.10 ≤ MW2 / W ≤ 0.15, and 0.10 ≤ CW / W ≤ 0.20.

[0055] In one embodiment, W, MW! CW, and MW2 can satisfy (MW1 + CW + MW2) / W ≤ 0.40.

[0056] When (MW1 + CW + MW2) / W exceeds 0.40, there is a risk of a decrease in the capacitance per unit volume of the multilayer electronic component.

[0057] In one embodiment, MW1, MW2, and CW can satisfy MW1 < CW and MW2 < CW.

[0058] Since the heat generated inside the main body is difficult to be released through the separation part SP rather than the margin parts 114 and 115, a wider width CW of the separation part can be ensured to further suppress the temperature rise of the multilayer ceramic capacitor.

[0059] When the widths of the first conductor part EP1 and the second conductor part EP2 in the third direction are A1 and A2 respectively, A1 + A2 can satisfy 0.60 or more.

[0060] When A1 + A2 is less than 0.60, the capacitance per unit volume of the multilayer electronic component may decrease.

[0061] At this time, A1 and A2 can be substantially the same. Since A1 and A2 are substantially the same, the heat generated in the first conductor part EP1 and the second conductor part EP2 is similar and may be more advantageous for the heat generation characteristics.

[0062] However, it is not necessary to be limited thereto, and A1 and A2 may be different from each other.

[0063] In one embodiment, the internal electrodes 121 and 122 can include a first internal electrode 121 drawn out to the third surface and a second internal electrode 122 drawn out to the fourth surface.

[0064] The first internal electrode 121 and the second internal electrode 122 are alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be exposed to the third surface and the fourth surfaces 3 and 4 of the main body 110 respectively.

[0065] The first internal electrode 121 is separated from the fourth surface 4 and exposed via the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed via the fourth surface 4. The first external electrode 131 is positioned on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 is positioned on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0066] In other words, the first internal electrode 121 is not connected to the second external electrode 132, but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131, but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance from the third surface 3. Furthermore, the first internal electrode 121 and the second internal electrode 122 may be arranged at a distance from the fifth and sixth surfaces of the main body 110.

[0067] The conductive metals contained in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, W, Ti, and alloys thereof, but the present invention is not limited thereto.

[0068] The internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing metal powder, a binder, an organic solvent, etc., to a predetermined thickness using a screen printing method or gravure printing method.

[0069] In one embodiment, the first internal electrode 121 includes a first-first conductor portion 121-1 and a second-first conductor portion 121-2 arranged at a distance from each other in a third direction with a first separation portion SP1 in between, and the second internal electrode 122 includes a first-second conductor portion 122-1 and a second-second conductor portion 122-2 arranged at a distance from each other in a third direction with a second separation portion SP2 in between.

[0070] The first-first conductor section 121-1 and the second-first conductor section 121-2 can be connected to the first external electrode 131 on the third surface, and the first-second conductor section 122-1 and the second-second conductor section 122-2 can be connected to the second external electrode 132 on the fourth surface.

[0071] As shown in Figure 3, in the cross-sections in the first and second directions, which have been polished so that the first conductor portion EP1 is visible, the first-first conductor portion 121-1 and the first-second conductor portion 122-1 can be arranged alternately in the first direction with the dielectric layer 111 in between.

[0072] As shown in Figure 5, in the first and second cross-sections polished to reveal the second conductor portion EP2, the second-first conductor portion 121-2 and the second-second conductor portion 122-2 can be arranged alternately in the first direction with the dielectric layer 111 in between.

[0073] In one embodiment, the first separation portion SP1 and the second separation portion SP2 may be arranged to overlap in the first direction. This allows heat generated inside the main body 110 to be easily discharged to the outside of the main body 110.

[0074] When the first separation portion SP1 and the second separation portion SP2 are arranged to overlap in the first direction, the first conductor portion EP1 and the second conductor portion EP2 may not be observed in the cross-sections in the first and second directions that have been polished so that the separation portion SP is visible, as shown in Figure 4.

[0075] However, the first separation section SP1 and the second separation section SP2 do not necessarily have to be arranged so as to overlap in the first direction; they may be arranged so as not to overlap in the first direction.

[0076] The average thickness te of the internal electrodes does not need to be particularly limited. In this case, the thickness of the internal electrodes 121 and 122 can represent the size of the first conductor portion EP1 and / or the second conductor portion EP2 in the first direction.

[0077] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average thickness of the internal electrodes 121 and 122 may be 0.4 μm or less.

[0078] Here, the average thickness te of the internal electrodes can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the thickness of one internal electrode 121, 122 can be measured at multiple points, for example, 30 points equally spaced in the second direction, and the average value can be measured. The 30 equally spaced points can be specified in the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 internal electrodes 121, 122 and measuring the average value, the average thickness of the internal electrodes 121, 122 can be further generalized.

[0079] External electrodes 131 and 132 can be arranged on the third surface 3 and fourth surface 4 of the main body 110.

[0080] The external electrodes 131 and 132 may include a first external electrode 131 and a second external electrode 132, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110, respectively, and connected to a first internal electrode 121 and a second internal electrode 122, respectively.

[0081] Referring to Figure 1, the external electrodes 131 and 132 can be positioned to cover both end faces of the side margin portions 114 and 115 in the second direction.

[0082] In this embodiment, a structure in which the stacked electronic component 100 has two external electrodes 131 and 132 is described, but the number and shape of the external electrodes 131 and 132 can be changed depending on the form of the internal electrodes 121 and 122 and other purposes.

[0083] On the other hand, the external electrodes 131 and 132 can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. Furthermore, they can have a multilayer structure.

[0084] For example, the external electrodes 131 and 132 may include electrode layers 131a and 132a placed on the main body 110, and plating layers 131b and 132b formed on the electrode layers 131a and 132a.

[0085] To give a more specific example for the electrode layers 131a and 132a, the electrode layers 131a and 132a may be firing electrodes containing a conductive metal and glass, or resin-based electrodes containing a conductive metal and resin.

[0086] Furthermore, the electrode layers 131a and 132a may be formed in a manner in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Alternatively, the electrode layers 131a and 132a may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto the fired electrode.

[0087] The conductive metal contained in the electrode layers 131a and 132a can be any material with excellent electrical conductivity, and is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0088] The plating layers 131b and 132b play a role in improving mounting characteristics. The types of plating layers 131b and 132b are not particularly limited and can be plating layers containing one or more of Ni, Sn, Pd, and their alloys, and can be formed in multiple layers.

[0089] To give a more specific example for the plating layers 131b and 132b, the plating layers 131b and 132b may be Ni plating layers or Sn plating layers, and may be in a form in which Ni plating layers and Sn plating layers are formed sequentially on the electrode layers 131a and 132a, or may be in a form in which Sn plating layers, Ni plating layers and Sn plating layers are formed sequentially. Furthermore, the plating layers 131b and 132b may include multiple Ni plating layers and / or multiple Sn plating layers.

[0090] The size of the stacked electronic component 100 does not need to be particularly limited.

[0091] For example, the multilayer electronic component 100 may have a size of 0603 (length × width, 0.6 mm × 0.3 mm) or less. Considering manufacturing tolerances, the size of the external electrodes, etc., the length of the multilayer electronic component 100 may be 0.66 mm or less and the width may be 0.33 mm or less. Here, the length of the multilayer electronic component 100 may mean the maximum size of the multilayer electronic component 100 in the second direction, and the width of the multilayer electronic component 100 may mean the maximum size of the multilayer electronic component 100 in the third direction.

[0092] The following describes an example of a method for manufacturing a stacked electronic component 100 according to one embodiment of the present invention. However, the method for manufacturing the stacked electronic component 100 of the present invention is not limited thereto.

[0093] First, a ceramic slurry containing ceramic powder, an organic solvent, and a binder is applied to a carrier film 300 to form a ceramic green sheet.

[0094] Subsequently, an internal electrode pattern can be formed on the ceramic green sheet by printing a conductive paste for internal electrodes containing metal powder, a binder, an organic solvent, etc., to a predetermined thickness using a screen printing method or gravure printing method. At this time, the conductive paste for internal electrodes can be printed in a manner that excludes the region where the separation portion SP is located, so that after sintering, the internal electrodes include a first conductor portion EP1 and a second conductor portion EP2 that are separated in a third direction with the separation portion SP in between.

[0095] After this, a laminate can be obtained by stacking ceramic green sheets with printed internal electrode patterns in the first direction. At this time, ceramic green sheets without printed internal electrode patterns can be stacked on the upper and lower parts of the laminate to form cover portions 112 and 113 after sintering.

[0096] After this, the laminate can be cut to obtain a unit laminate having a predetermined chip size.

[0097] Subsequently, the above-mentioned unit laminate can be sintered to obtain the main body. The sintering temperature may be, for example, 1000°C to 1400°C, but the present invention is not limited thereto.

[0098] Next, external electrodes 131 and 132 are formed. For example, if the base electrode layers 131a and 132a include a fired electrode layer, the main body 110 can be dipped in a conductive paste for external electrodes containing metal powder, glass frit, binder, and organic solvent, and then the conductive paste for external electrodes can be fired at a temperature of 500°C to 900°C to form a fired electrode layer.

[0099] For example, if the base electrode layers 131a and 132a include a resin electrode layer, the main body can be dipped in a conductive resin composition containing metal powder, resin, binder, and organic solvent, and then cured at a temperature of 250°C to 550°C to form the resin electrode layer.

[0100] Furthermore, electroplating and / or electroless plating may be performed to form plating layers 131b and 132b on the underlying electrode layers 131a and 132a.

[0101] (Example of experiment) Using the manufacturing method described above, we prepared sample chips of size 3216 (length: approximately 3.2 mm, width: approximately 1.6 mm, thickness: approximately 1.6 mm).

[0102] Sample chips for each test number were manufactured to satisfy the CW / W, MW1 / W, MW2 / W, and (A1+A2) / W requirements listed in Table 1 below.

[0103] Test numbers 1 and 2 have a CW / W of 0, and the internal electrodes 121' and 122' are formed from a single conductive portion, as shown in Figure 7.

[0104] In Table 1 below, the heat generation characteristics and high-temperature reliability of the sample chips for each test number are evaluated and described.

[0105] For the heat generation characteristics, the sample chip was mounted on a PCB substrate, the voltage was increased and applied under the conditions of an initial temperature of 105°C and a frequency of 400 KHz, and the voltage value when the temperature of the sample chip reached 125°C was measured. When the voltage value when the temperature of the above sample chip reached 125°C was 850 V or more, it was represented by ◎, when it was less than 850 V and 800 V or more, it was represented by ○, when it was less than 800 V and 750 V or more, it was represented by △, and when it was less than 750 V, it was represented by ×.

[0106] For high-temperature reliability, when 24 hours of voltage was applied to 320 sample chips mounted on a PCB substrate under the conditions of a temperature of 125°C and a voltage of 100 V, it was determined as defective when the initial insulation resistance (IR) value decreased by 3 orders or less, and when the number of sample chips determined as defective was 3 or more out of the total number of sample chips, it was represented by ×, when it was 1 or 2, it was represented by △, and when the number of defective was 0, it was represented by ◎.

[0107]

Table 1

[0108] As can be confirmed from Table 1 above, it can be confirmed that Test Numbers 5 and 6, which satisfy all of 0.08 < MW1 / W < 0.20, 0.08 < MW2 / W < 0.20, and 0.08 < CW / W < 0.3, have excellent heat generation characteristics.

[0109] On the other hand, in the case of Test Numbers 1 to 4, CW / W is 0.08 or less and the heat generation characteristics deteriorate, and in the case of Test Numbers 7 and 8, CW / W is 0.3 or more, and it can be confirmed that all of the heat generation characteristics and high-temperature reliability have deteriorated.

[0110] Figure 8 is a graph comparing the capacitances and DFs of 50 sample chips each of Test Number 2 (conventional example) and Test Number 5 (invention example) after measuring them.

[0111] In Figure 8, the capacitance and DF (Dissipation Factor) were measured using an LCR meter under 1 kHz conditions. Referring to Figure 8, it can be confirmed that the capacitance and DF of the inventive example can be achieved in much the same way as those of the conventional example.

[0112] Although embodiments of the present invention have been described in detail above, the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0113] Furthermore, the expression "one embodiment" as used in this disclosure does not mean that each embodiment is identical to the others, but is provided to highlight and describe the unique and distinct features of each embodiment. However, the present embodiments are not excluded from being realized in combination with features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description in the other embodiment that contradicts or is inconsistent with that matter.

[0114] The terms used in this disclosure are used solely to describe one embodiment and are not intended to limit the disclosure. Where otherwise, singular expressions include plural expressions unless the context clearly indicates otherwise. [Explanation of Symbols]

[0115] 100 Stacked Electronic Components 110 Main Unit 111 Dielectric layer 112, 113 Cover section 114, 115 Margin section 121, 122 Internal electrode EP1, EP2 Conductor section SP separation part 131, 132 External electrode 131a, 132a electrode layer 131b, 132b Plating layer

Claims

1. A body comprising a dielectric layer and internal electrodes arranged alternately with the dielectric layer in a first direction, including a first and second surface facing the first direction, a third and fourth surface connected to the first and second surfaces and facing the second direction, and a fifth and sixth surface connected to the first, second, third and fourth surfaces and facing the third direction, Includes external electrodes arranged on the third and fourth surfaces, The internal electrode includes a first conductor portion and a second conductor portion arranged at a distance from each other in a third direction, with a separation portion in between. The main body includes a first margin portion which is the region between the fifth surface and the internal electrode, and a second margin portion which is the region between the sixth surface and the internal electrode. When the widths of the main body, the first margin portion, the separation portion, and the second margin portion in the third direction are W, MW1, CW, and MW2, respectively, A multilayer electronic component satisfying 0.08 < MW1 / W < 0.20, 0.08 < MW2 / W < 0.20, and 0.08 < CW / W < 0.

3.

2. The aforementioned W, MW1 and MW2 are, A stacked electronic component according to claim 1, satisfying 0.10 ≤ MW1 / W ≤ 0.15 and 0.10 ≤ MW2 / W ≤ 0.

15.

3. The aforementioned W and CW are, A stacked electronic component according to claim 1, satisfying 0.10 ≤ CW / W ≤ 0.

20.

4. The aforementioned W, MW1, CW, and MW2 are, A stacked electronic component according to claim 1, satisfying 0.10 ≤ MW1 / W ≤ 0.15, 0.10 ≤ MW2 / W ≤ 0.15, and 0.10 ≤ CW / W ≤ 0.

20.

5. The aforementioned W, MW1, CW, and MW2 are, The stacked electronic component according to claim 1, wherein (MW1 + CW + MW2) / W satisfies 0.40 or less.

6. The aforementioned MW1, MW2, and CW are, A stacked electronic component according to claim 1, satisfying MW1 < CW and MW2 < CW.

7. When the widths of the first conductor portion and the second conductor portion in the third direction are A1 and A2, respectively, The stacked electronic component according to claim 1, wherein A1 + A2 satisfies 0.60 or more.

8. The stacked electronic component according to claim 7, wherein A1 and A2 are different from each other.

9. The stacked electronic component according to claim 7, wherein A1 and A2 are substantially the same.

10. The internal electrode includes a first internal electrode drawn out to the third surface and a second internal electrode drawn out to the fourth surface. The first internal electrode includes a first-1 conductor portion and a second-1 conductor portion arranged to be separated in a third direction with a first separation portion in between. The stacked electronic component according to any one of claims 1 to 9, wherein the second internal electrode includes a first-to-second conductor portion and a second-to-second conductor portion arranged at a distance from each other in a third direction with a second separation portion in between.

11. The stacked electronic component according to claim 10, wherein the first separation portion and the second separation portion are arranged to overlap in the first direction.

12. The stacked electronic component according to claim 10, wherein the first separation portion and the second separation portion are arranged so as not to overlap in the first direction.

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