Substrate structure and its structural package

Abstract

In existing technologies, the most common manufacturing process uses substrates of a single size, but this method does not effectively reduce manufacturing costs. [Solution] The present invention provides a substrate structure comprising a support plate defining a planar direction and a plurality of substrates arranged adjacent to each other along that direction. Each substrate has opposing first and second surfaces, with the second surface positioned on the support plate by a temporary adhesive layer, and a functional material provided in the gap between adjacent substrates. The area of ​​the support plate is greater than or equal to the sum of the areas of all substrates. Along the vertical direction, the height difference between the first or second surfaces of two adjacent substrates is controlled to be 50 micrometers or less. Such a structure can ensure accuracy and stability in subsequent manufacturing processes.

Description

[Technical Field]

[0001] This invention relates to a substrate structure, which can be applied to structural packages, and more particularly to a substrate structure for a semiconductor package and a structural package thereof. [Background technology]

[0002] As electronic products become smaller, more powerful, and more integrated, the demands on substrate structures are increasing. However, conventional substrate manufacturing processes face several challenges. For example, achieving cost reduction requires a considerable manufacturing scale, which necessitates the production of large substrates. However, producing large substrates is difficult, and there are technical bottlenecks, particularly in ensuring surface flatness. Secondly, in subsequent manufacturing processes (e.g., packaging), differences in thermal expansion coefficients between materials can easily lead to warping and deformation of the substrate structure, affecting the yield rate. In existing technologies, manufacturing processes using substrates of a single dimension are the most common, but this method does not effectively reduce manufacturing costs. [Overview of the Initiative] [Problems that the invention aims to solve]

[0003] The object of the present invention is to provide a substrate structure and exemplary embodiments of one or more substrate structures, all of which illustrate that the substrate structures of the present invention are large, bonded composite substrates that can effectively reduce manufacturing costs.

[0004] The object of the present invention is to provide a substrate structure and exemplary embodiments of one or more substrate structures, all of which illustrate that the substrate structures of the present invention are large, bonded composite substrates that can accommodate subsequent applications and maintain surface flatness.

[0005] The object of the present invention is to provide structural packages and exemplary embodiments of one or more structural packages, all of which illustrate that the substrate structures of the present invention are large, bonded composite substrates that can be applied to the structural package by cutting or reducing their size. [Means for solving the problem]

[0006] To achieve the above objectives, the present invention provides a substrate structure comprising a support plate, a plurality of substrates, a temporary adhesive layer, and a functional material. The support plate defines a planar direction, and the plurality of substrates are installed adjacent to the support plate along the planar direction. Each substrate has opposing first and second surfaces. The temporary adhesive layer is placed between the second surface of a substrate and the support plate, and the functional material fills the gaps between adjacent substrates. The planar area of ​​the support plate of the present invention is more than twice the planar area of ​​a substrate, so that a plurality of substrates can be mounted on it. Furthermore, the first surfaces of adjacent substrates define a height difference along a direction perpendicular to the planar direction, and / or the second surfaces of adjacent substrates define a height difference along a direction perpendicular to the planar direction, and this height difference is 50 micrometers (μm) or less, so that the flatness of at least one surface of the substrate is maintained.

[0007] In one embodiment, the support plate and / or the substrate thereof includes Si, Silica (i.e., fused silica, SiO2), glass, quartz, silicon carbide, ceramic, glass ceramic, sapphire (Al2O3), compound semiconductor material, or polyimide, or a combination of one or more of the above materials.

[0008] In one embodiment, the support plate has a thermal expansion coefficient of 15 ppm / K or less within a temperature range of 25°C to 400°C.

[0009] In one embodiment, the planar area of ​​the support plate in the planar direction is 16,000 mm². 2 That's all.

[0010] In one embodiment, the planar area is 17,000 mm². 2 That's all.

[0011] In one embodiment, the planar area is 90,000 mm². 2 That's all.

[0012] In one embodiment, the planar area is 170,000 mm². 2 That's all.

[0013] In one embodiment, the planar area is 250,000 mm². 2 That's all.

[0014] In one embodiment, a height difference is defined between the first surface of two adjacent substrates and / or the second surface of two adjacent substrates, and this height difference is 10 μm or less.

[0015] In one embodiment, the maximum thickness of the temporary adhesive layer is greater than the difference in height between the second surfaces of two adjacent substrates.

[0016] In one embodiment, the maximum thickness of the temporary adhesive layer is greater than the flatness of the second surface of the adjacent substrate.

[0017] In one embodiment, each substrate defines a flatness of 10 μm or less on its first or second surface.

[0018] In one example, the flatness is 3 μm or less.

[0019] In one embodiment, the planar area of ​​the support plate is more than twice the planar area of ​​the substrate.

[0020] In one embodiment, the support plate is defined as having a thickness of 1 mm or less.

[0021] In one embodiment, the substrate has a thermal expansion coefficient of 15 ppm / K or less within a temperature range of 25°C to 400°C.

[0022] In one embodiment, the substrate structure further defines the difference in thermal expansion coefficients between the substrate and the support plate; the difference in thermal expansion coefficients is 12 ppm / K or less within a temperature range of 25°C to 400°C.

[0023] In one embodiment, the substrate structure further defines a difference in the coefficient of thermal expansion between the substrate and the support plate; the difference in the coefficient of thermal expansion is 8 ppm / K or less within a temperature range of 25°C to 400°C.

[0024] In one embodiment, the difference in the coefficient of thermal expansion is 5 ppm / K or less.

[0025] In one embodiment, each substrate is a multilayer substrate and includes a glass material, a glass-ceramic material, a ceramic material, and a polyimide material obtained by bonding a glass material / a glass-ceramic material / a ceramic material. A difference in the coefficient of thermal expansion is defined between the polyimide material and the glass material / a glass-ceramic material / a ceramic material, and this difference in the coefficient of thermal expansion is 5 ppm / K or less within a temperature range of 25°C to 400°C.

[0026] In one embodiment, each substrate defines a thermal conductivity of 1.0 W / m * K or more.

[0027] In one embodiment, the thermal conductivity is 2.0 W / m * K or more.

[0028] In one embodiment, each substrate defines a modulus of elasticity of 50 GPa or more.

[0029] In one embodiment, the modulus of elasticity is 80 GPa or more.

[0030] In one embodiment, the temporary adhesive layer defines a separation temperature of 200°C or more.

[0031] In one embodiment, the temporary adhesive layer defines a separation band that absorbs a predetermined optical wavelength band.

[0032] In one embodiment, the modulus of elasticity of the functional material is smaller than that of the adjacent substrate.

[0033] In one embodiment, the substrate structure further includes a first electrical layer structure provided on the first surface of each substrate.

[0034] In one embodiment, the first electrical layer structure is extended to the functional material of any one of the adjacent substrates.

[0035] In one embodiment, each substrate includes one or more conductive holes.

[0036] In one embodiment, the substrate structure further includes one or more holes, which are arranged on each substrate and connect at least one surface of the first and second surfaces of each substrate.

[0037] In one embodiment, one or more holes form one or more through-holes by connecting the first and second surfaces of each substrate.

[0038] In one embodiment, the functional material is provided in at least one or more holes in each substrate.

[0039] In one embodiment, the substrate structure further includes a plurality of internal holes, which are arranged in each functional material, each located within the corresponding holes.

[0040] In one embodiment, one or more holes were already formed when each substrate was placed on the support plate or before.

[0041] In one embodiment, the substrate structure further includes a second electrical layer structure, which is provided between the second surface of each substrate and the temporary adhesive layer.

[0042] In one embodiment, the second electrical layer structure is extended to a functional material located between two adjacent substrates.

[0043] In one embodiment, the second electrical layer structure is an unpatterned electrical layer structure.

[0044] In one embodiment, the height difference between the first surfaces of two adjacent substrates is 1 / 10 or less of the thickness of the two adjacent substrates.

[0045] In one embodiment, the first surfaces of these substrates jointly define a polished surface, and the polished surface is simultaneously constructed by polishing or buffing.

[0046] In one embodiment, the second surfaces of these substrates jointly define a polished surface, and the polished surface is simultaneously constructed by polishing or buffing.

[0047] In one embodiment, the substrate structure further includes a first electrical layer structure and a second electrical layer structure. The first electrical layer structure is provided on the first surface of each substrate and on the functional material of any one adjacent substrate, and the second electrical layer structure is provided between the second surface of each substrate and the temporary adhesive layer. Each substrate includes one or more conductive holes that electrically connect the first electrical layer structure and the second electrical layer structure.

[0048] In one embodiment, the substrate structure further includes a power supply plate electrically connected to the second electrical layer structure, and the power supply plate includes conductive holes electrically connected to the second electrical layer structure.

[0049] In one embodiment, the power supply plate is positioned connected to the side edge of the support plate.

[0050] In one embodiment, the conductive holes are manufactured by sintering.

[0051] In one embodiment, one of the substrates is provided with a power supply area, and the power supply area is electrically connected to the second electrical layer structure.

[0052] In one embodiment, either substrate includes conductive holes in the power supply area that are electrically connected to the second electrical layer structure.

[0053] In one embodiment, one or more substrates define a bending strength of 150 MPa (Megapascal) or more.

[0054] In one embodiment, one or more substrates are defined as having a dielectric loss Df of 0.006 or less at a test frequency of 10 GHz (Gigahertz).

[0055] In one embodiment, the substrate structure further defines multiple cut units, and each cut unit does not contain any gaps.

[0056] In one embodiment, the substrate structure further includes one or more markings, and one or more markings are arranged on a support plate.

[0057] In one embodiment, one or more markings are positioned vertically, with one substrate located within the projection range of the support plate.

[0058] In one embodiment, one or more substrates are light-transmitting.

[0059] In one embodiment, the substrate structure further includes one or more corresponding markings, and one or more corresponding markings are arranged on these substrates.

[0060] In one embodiment, each substrate has one or more corners or side edges defined, and any one of the substrates has one or more corners or side edges with chamfers defined.

[0061] In one embodiment, the functional material covers one or more corners or side edges of one or more substrates.

[0062] The structural package includes a portion of the substrate structure described above. The portion of the substrate structure removes the temporary adhesive layer, separates the support plate, defines multiple cut units, and does not include any gaps within each cut unit. The portion of the structural package includes one or more cut units, the size of which each cut unit is greater than or equal to the size of any one of the substrates in the substrate structure described above.

[0063] In one embodiment, the size of each cutting unit approaches the size of one of the substrates.

[0064] In one embodiment, each substrate has one or more corners or side edges defined, and any one of the substrates has one or more corners or side edges with chamfers defined.

[0065] In one embodiment, the functional material covers one or more corners or side edges of one or more substrates.

[0066] The assembly package includes a part of a substrate structure combination. The substrate structure combination includes the two substrate structures, which are joined together, and the conductive holes are electrically connected to the first electrical layer structure of at least two of the substrate structures. The substrate structure combination has the temporary adhesive layer removed, the support plate separated, and further defines several cut units in part, with each cut unit not containing any gaps. The assembly package includes one or more cut units, the size of which each cut unit is greater than or equal to the size of any one of the substrates in the substrate structure.

[0067] In one embodiment, the size of each cutting unit approaches the size of one of the substrates.

[0068] In one embodiment, each substrate has one or more corners or side edges defined, and any one of the substrates has one or more corners or side edges with chamfers defined.

[0069] In one embodiment, the functional material covers one or more corners or side edges of one or more substrates.

[0070] In one embodiment, the structural package further includes an adhesive layer, through which two substrate structures are joined.

[0071] The assembly package includes a substrate and defines corresponding first and second surfaces, a plurality of corners or side edges, one or more chamfers, and a plurality of conductive holes. It also includes a functional material, which is provided on at least the first and second surfaces of the substrate and at least a portion of the plurality of corners or side edges. The plurality of conductive holes connect at least one surface of the first and second surfaces of each substrate.

[0072] In one embodiment, one or more chamfers define one or more corners or side edges.

[0073] In one embodiment, the functional material covers one or more corners or side edges of each substrate.

[0074] In one embodiment, the functional material covers at least one of the first and second surfaces of each substrate.

[0075] In one embodiment, one or more conductive holes communicate with at least one external surface of the functional material.

[0076] In one embodiment, the functional material includes one or more sub-functional materials.

[0077] In one embodiment, one or more conductive holes connect at least one of the first and second surfaces of each substrate.

[0078] In one embodiment, the structural package further includes a plurality of holes, which are placed on a substrate, and a plurality of conductive holes are formed by placing a conductive material in these holes.

[0079] In one embodiment, a functional material is placed in these holes.

[0080] In one embodiment, the structural package further includes a plurality of internal pores, in which each functional material is placed, each located within the corresponding pore. By placing conductive material in these internal pores, a plurality of conductive pores are formed.

[0081] The assembly package includes two substrates that are positioned opposite each other and joined together. Each substrate defines a first surface and a second surface corresponding to each other, a plurality of corners or side edges, one or more chamfers, and a plurality of conductive holes. One or more functional materials are disposed on at least the first and second surfaces and at least a portion of the plurality of corners or side edges of the substrates. At least a portion of these conductive holes on one substrate are electrically connected to at least a portion of these conductive holes on the other substrate. These conductive holes also communicate with at least one surface of the first and second surfaces of each substrate.

[0082] In one embodiment, the structural package further includes an adhesive layer that connects the first surface of one substrate to the second surface of another substrate.

[0083] In one embodiment, one or more chamfers define one or more corners or side edges.

[0084] In one embodiment, the functional material covers one or more corners or side edges of each substrate.

[0085] In one embodiment, the functional material covers at least one of the first and second surfaces of each substrate.

[0086] In one embodiment, one or more conductive holes communicate with at least one external surface of the functional material.

[0087] In one embodiment, the functional material includes one or more sub-functional materials.

[0088] In one embodiment, one or more conductive holes in each substrate connect at least one of the first and second surfaces of each substrate.

[0089] In one embodiment, the structural package further includes a plurality of holes, which are placed on a substrate, and a plurality of conductive holes are formed by placing a conductive material in these holes.

[0090] In one embodiment, a functional material is placed in these holes.

[0091] In one embodiment, the structural package further includes a plurality of internal pores, in which each functional material is placed, each located within the corresponding pore. By placing conductive material in these internal pores, a plurality of conductive pores are formed.

[0092] The foregoing is for illustrative purposes only and does not limit the present invention. In addition to the explanatory embodiments, examples, and features described above, other embodiments, examples, and features of the present invention can be clearly understood by referring to the drawings and the following detailed description. [Brief explanation of the drawing]

[0093] [Figure 1] This is a plan view showing one embodiment of the substrate structure of the present invention. [Figure 1A] This is a side view of Figure 1. [Figure 1AX] This is another embodiment of the substrate structure of the present invention, and is a side view showing the height difference between adjacent substrates. [Figure 1B] This is another embodiment of the substrate structure of the present invention, and is a side view of the temporary adhesive layer in sections. [Figure 1C] This is another embodiment of the substrate structure of the present invention, and is a side view of one aspect of the substrate structure. [Figure 1D] This is another embodiment of the substrate structure of the present invention, and is a side view of one aspect of a support plate. [Figure 1E] This is another embodiment of the substrate structure of the present invention, and is a side view of one aspect of a functional material. [Figure 1FA] This is another embodiment of the substrate structure of the present invention, and is a side view of one aspect of a functional material structure. [Figure 1FB] This is another embodiment of the substrate structure of the present invention, and a side view of another aspect of the functional material structure. [Figure 1G] This is another embodiment of the substrate structure of the present invention, and a side view of yet another aspect of the functional material structure. [Figure 1GA]This is another embodiment of the substrate structure of the present invention, and a side view of yet another aspect of the functional material structure. [Figure 1GB] This is another embodiment of the substrate structure of the present invention, and a side view of yet another aspect of the functional material structure. [Figure 1GM] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments of a functional material structure. [Figure 1GN] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments of a functional material structure. [Figure 1H] This is another embodiment of the substrate structure of the present invention, and is a side view of a plurality of arrangement combinations of a substrate and functional material. [Figure 1HA] This is another embodiment of the substrate structure of the present invention, and is a side view of a plurality of arrangement combinations of a substrate and functional material. [Figure 1HB] This is another embodiment of the substrate structure of the present invention, and is a side view of a plurality of arrangement combinations of a substrate and functional material. [Figure 1HC] This is another embodiment of the substrate structure of the present invention, and is a side view of a plurality of arrangement combinations of a substrate and functional material. [Figure 1HD] This is another embodiment of the substrate structure of the present invention, and is a side view of a plurality of arrangement combinations of a substrate and functional material. [Figure 1IA] This is another embodiment of the substrate structure of the present invention, and is a side view including multiple embodiments of the electrical layer. [Figure 1IB] This is another embodiment of the substrate structure of the present invention, and is a side view including multiple embodiments of the electrical layer. [Figure 1IC] This is another embodiment of the substrate structure of the present invention, and is a side view including multiple embodiments of the electrical layer. [Figure 1IP] This is another embodiment of the substrate structure of the present invention, and is a side view including multiple embodiments of the electrical layer. [Figure 1: IQ] This is another embodiment of the substrate structure of the present invention, and is a side view including multiple embodiments of the electrical layer. [Figure 1IR] This is another embodiment of the substrate structure of the present invention, and is a side view including multiple embodiments of the electrical layer. [Figure 1JA]This is another embodiment of the substrate structure of the present invention, and is a side view including multiple embodiments of the electrical layer. [Figure 1JB] This is another embodiment of the substrate structure of the present invention, and is a side view including multiple embodiments of the electrical layer. [Figure 1K] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of chamfering. [Figure 1KA] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of chamfering. [Figure 1KB] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of chamfering. [Figure 1L] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of chamfering. [Figure 1MA] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of chamfering. [Figure 1MB] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of chamfering. [Figure 1MC] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of chamfering. [Figure 1MM] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of chamfering. [Figure 1MN] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of chamfering. [Figure 1MP] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of chamfering. [Figure 1MQ] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of chamfering. [Figure 1MR] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of chamfering. [Figure 1NA] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of chamfering. [Figure 1NB]This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of chamfering. [Figure 1NC] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of chamfering. [Figure 10] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of the electrical layer. [Figure 1OM] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of the electrical layer. [Figure 1ON] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of the electrical layer. [Figure 1OP] This is another embodiment of the substrate structure of the present invention, and is a side view of multiple embodiments of the electrical layer. [Figure 1OQ] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several steps in forming an electrical layer or through-holes. [Figure 1OX] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several steps in forming an electrical layer or through-holes. [Figure 1OY] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several steps in forming an electrical layer or through-holes. [Figure 1P] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments for forming an electrical layer. [Figure 1PX] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments for forming an electrical layer. [Figure 1Q] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments for forming the electrical layer and the power supply plate. [Figure 1QX] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments for forming the electrical layer and the power supply plate. [Figure 1QY] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments for forming the electrical layer and the power supply plate. [Figure 1R]This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments for forming the electrical layer and the power supply plate. [Figure 1S] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments for forming the electrical layer and the power supply plate. [Figure 1T] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments for forming the electrical layer and the power supply plate. [Figure 1U] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments of which form the electrical layer and the power supply area. [Figure 1UM] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments of which form the electrical layer and the power supply area. [Figure 1UX] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments of which form the electrical layer and the power supply area. [Figure 1UY] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments of which form the electrical layer and the power supply area. [Figure 1V] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments of which form the electrical layer and the power supply area. [Figure 1W] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments of which form the electrical layer and the power supply area. [Figure 1WA] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments of which form the electrical layer and the power supply area. [Figure 1WB] This is another embodiment of the substrate structure of the present invention, and is a side view of one of several embodiments of which form the electrical layer and the power supply area. [Figure 1X] This is another embodiment of the substrate structure of the present invention, and is a side view showing an example of one of several embodiments for forming a multilayer electrical layer. [Figure 1XA] This is another embodiment of the substrate structure of the present invention, and is a side view showing an example of one of several embodiments for forming a multilayer electrical layer. [Figure 1XB] This is another embodiment of the substrate structure of the present invention, and is a side view showing an example of one of several embodiments for forming a multilayer electrical layer. [Figure 2] This is a side view of one embodiment of the substrate structure of the present invention, in which the support plate has been removed. [Figure 2A] This figure shows an example of the cutting unit of the present invention. [Figure 2AX] This figure shows an example of another cutting unit of the present invention. [Figure 2W] Figure 2 is a side view showing the cut unit attached to and defined on the support plate. [Figure 2X] The substrate structure of the present invention is shown as a side view of another embodiment in which the support plate has been removed. [Figure 2XW] Figure 2X is a side view showing the cut unit attached to and defined on the support plate. [Figure 3] This is a side view of a multilayer embodiment of the substrate structure of the present invention. [Figure 3A] Figure 3 is a side view of another embodiment. [Figure 3B] This is a side view of yet another embodiment shown in Figure 3. [Figure 3X] This is a side view of one of the processes that forms Figure 3. [Figure 3Y] This is a side view of another process that forms Figure 3. [Figure 4] Figure 3 shows a side view of one embodiment in which the support plate has been removed. [Figure 4A] Figure 4 is a side view showing the cutting unit positioned on the electrical board. [Figure 4AX] This is a side view showing another cutting unit from Figure 4 placed on the electrical board. [Figure 5] This is a side view of one embodiment of the substrate structure of the present invention, in which the support plate has been removed. [Figure 5A] Figure 5 is a side view showing the cutting unit positioned on the electrical board. [Figure 5AX] This is a side view showing another cutting unit from Figure 5 placed on the electrical board. [Figure 6] Figure 2 shows the plan view, with the markings corresponding to the layout. [Modes for carrying out the invention]

[0094] The following describes a better embodiment of the substrate structure of the present invention with reference to the drawings, and the same elements are denoted by the same reference numerals.

[0095] The advantages and features of the present invention and the structures that realize the present invention will be clearly described in the following embodiments with reference to the drawings. However, the present invention can be embodied in several different forms and should not be construed as being limited to the following embodiments. On the contrary, the embodiments disclosed below are provided to clarify and complete this specification and to fully convey the scope of the claims of the present invention to those skilled in the art, and the present invention is limited only to the claims. For this reason, the embodiments do not describe in detail conventional components, operations and techniques to avoid obscuring the technical features of the present invention. Throughout the specification, elements that are the same or approximate are denoted by the same or approximate reference numerals. Throughout the specification, when one element is connected to another element, it is stated that the element is "mechanically connected directly or indirectly" to the other element, or "electrically connected" to the other element, and further permits the insertion of one or more intermediate elements between them. Furthermore, it should be understood that in this specification, the terms "include" or "contain" specify the above features, integers, steps, operations, elements and / or assemblies, and do not preclude the presence or addition of one or more other features, integers, steps, operations, elements and / or assemblies, or combinations thereof. The terms "and / or" indicate the possibility of an intersection or union. Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as those commonly understood by those skilled in the art. It should be further understood that terms or terms (e.g., those defined in claims or common dictionaries) should be interpreted as having the same meaning in the description of the technology relating to them, and not as ideal or overly formal meanings unless explicitly defined herein.

[0096] Please refer to Figures 1 and 1A. A substrate structure 1 of a first embodiment of the present invention is shown. The substrate structure 1 comprises a support plate 10, a plurality of substrates 20, a temporary adhesive layer 30, and a functional material 40. The support plate 10 defines a planar direction (composed of a horizontal axis X and a vertical axis Y, and perpendicular to the vertical direction Z), and the support plate 10 further defines one or more side edges E10 by its contour. These substrates 20 are provided adjacent to the support plate 10 along the planar direction and are, for example, joined. Each substrate 20 defines a first surface S1 and a second surface S2 corresponding to each other, with the second surface S2 facing the direction of the support plate 10. Each substrate 20 further defines one or more corners, side edges E20 by its contour. The temporary adhesive layer 30 is positioned connected at least between the second surface S2 of each substrate 20 and the support plate 10. The temporary adhesive layer 30 is provided continuously or intermittently along the support plate 10. For example, in Figure 1, the temporary adhesive layer 30 is provided continuously along the support plate 10, or, as in Figure 1A, the temporary adhesive layer 30 is provided intermittently along the support plate 10 and along the second surface S2 corresponding to each substrate 20. The functional material 40 is provided in the gap G (as a filler) between at least two adjacent substrates 20, or further provided on the outer periphery of one or more substrates 20. The planar sizes of the support plate 10 and the substrates 20 in this invention can both be changed according to the requirements of the manufacturing process, and the planar sizes of two adjacent substrates 20 may also differ. In short, the support plate 10 has a planar area greater than or equal to the sum of the planar areas of all the substrates 20. Alternatively, the planar area A10 of the support plate 10 is at least twice the planar area A20 of the smallest substrate 20. Here, the support plate 10 can support at least several (two or more) substrates 20 (minimum substrates) on it. The vertical direction Z, perpendicular to the planar direction, defines a height difference h between the first surfaces S1 of two adjacent substrates 20, and this height difference h is 50 μm or less. Furthermore, this height difference h is 10 μm or less, and further, this height difference h is 5 μm or less. Figure 1 shows only the height difference h of the first surface S1. Similarly, the same applies to the second surfaces S2 of two adjacent substrates 20; please refer to Figure 1AX. A height difference h is defined between the second surfaces S2 of two adjacent substrates 20, and this height difference h is 50 μm or less. Furthermore, this height difference h is 10 μm or less, and further, this height difference h is 5 μm or less.Furthermore, the height difference h between the first surface S1 and / or second surface S2 of two adjacent substrates 20 may be interpreted as being less than or equal to 1 / 10 of the thickness of the two adjacent substrates. In principle, by making the height difference h as close to zero as possible, the flatness of the virtual plane jointly defined by the first surface S1 or second surface S2 of the two adjacent substrates 20 is improved, and the risk to product quality and yield due to excessive height differences is reduced when subsequent wiring and patterning manufacturing processes are carried out on these substrates. In order to reduce this height difference, the first surface S1 or second surface S2 of these substrates 20 is further planarized by a polishing or buffing process, for example, a polished surface is jointly defined by simultaneously polishing or buffing the first surface S1 of these substrates 20. A polished surface is jointly defined by simultaneously polishing or buffing the second surface S2 of these substrates 20, meaning that the first surface S1 or second surface S2 may refer to a surface of the substrate 20 that has not been polished or buffed, or a surface that has undergone surface treatment. To simplify the drawings, the height difference h is omitted from Figure 1 and subsequent drawings. In one embodiment, area utilization is maximized by bringing one or more side edges E20 of the substrate 20 closer to (aligning as closely as possible with) one or more side edges E10 of the support plate 10. In some embodiments, each substrate 20 is defined as having a flatness of 10 μm or less on the first surface S1 or second surface S2, and this flatness can be further defined as 3 μm or less. Flatness is the degree of deviation of the entire surface of the member from an ideal plane, and the measurement range includes the entire surface and is used to evaluate the flatness of the entire surface.

[0097] In some embodiments, the support plate 10 has the following characteristics. For example, the support plate 10 includes Si, Silica (i.e., fused silica (SiO2, silicon dioxide)), glass, quartz, ceramic, glass ceramic, sapphire (Al2O3), compound semiconductor material, or polyimide, or includes a combination of one or more of the above materials. The support plate 10 can be a single-layer substrate, a composite substrate, or a multi-layer substrate. The support plate 10 is further a glass substrate or a glass ceramic substrate. In some embodiments, the support plate 10 defines a coefficient of thermal expansion of 15 ppm / K or less within a temperature range of 25 °C to 400 °C. In some embodiments, taking the rectangular support plate 10 as an example, the planar area A10 in the planar direction is 90,000 mm 2 or more, for example 300 * 300 mm; the planar area A10 of the support plate 10 in the planar direction is 170,000 mm 2 or more, for example 370 * 470 mm, and further 250,000 mm 2 or more, for example 500 * 500 mm. In some embodiments, the support plate 10 defines a thickness of 1 mm or less, and the thickness can be further defined as 0.7 mm or less.

[0098] In some embodiments, one or more substrates 20 have the following properties. For example, the substrate 20 includes Si, Silica (SiO2, silicon dioxide) (i.e., fused silica), glass, silicon carbide, ceramic, glass ceramic, compound semiconductor material, or polyimide, or a combination of one or more of the above materials. In some embodiments, one or more substrates 20 can be single-layer substrates, composite substrates, or multilayer substrates. In some embodiments, one or more substrates 20 include an organic material, or further include an organic material. Each substrate 20 defines a thermal conductivity of 1.0 W / m*K or higher. The thermal conductivity can be further defined as 2.0 W / m*K or higher. In some embodiments, the risk of warping is further reduced by defining an elastic modulus of 50 GPa (Gigapascal) or higher for each substrate 20. The elastic modulus can be further defined as 80 GPa (Gigapascal) or higher. In some embodiments, each substrate 20 defines a thermal expansion coefficient of 15 ppm / K or less within a temperature range of 25°C to 400°C. The thermal expansion coefficient can be further defined as 12 ppm / K or less. See Figure 1C. As an example, a multilayer substrate is formed by bonding a polyimide material 22' to one or more substrates 20A2 as a base material 21' (e.g., glass material, glass ceramic material, ceramic material), and a difference in thermal expansion coefficient is defined between the polyimide material 22' and the glass material / glass ceramic material / ceramic material, and this difference in thermal expansion coefficient is 5 ppm / K or less within a temperature range of 25°C to 400°C. A difference in thermal expansion coefficient is defined between any one substrate 20 and the support plate 10, or further, between each substrate 20 and the support plate 10, and this difference in thermal expansion coefficient is 12 ppm / K or less within a temperature range of 25°C to 400°C. Alternatively, it can be further reduced to 8 ppm / K or 5 ppm / K or less within the same temperature range to further reduce the risk of warping. Furthermore, in some embodiments, one or more substrates 20 define a bending strength of 150 MPa (Megapascal) or more.In some embodiments, one or more substrates 20 are defined to have a dielectric loss Df (Dissipation Factor, Loss Tangent) of 0.006 or less at a test frequency of 10 GHz (Gigahertz). As shown in Figure 1D, in the base of Figure 1C, the support plate 10A3 may also be the substrate 11 (e.g., glass material, glass ceramic material, ceramic material), and a multilayer substrate to which a polyimide material 12 is further bonded defines a difference in thermal expansion coefficients between the polyimide material 12 and the glass material / glass ceramic material / ceramic material, and this difference in thermal expansion coefficients is 5 ppm / K or less in the temperature range of 25°C to 400°C.

[0099] In some embodiments, the temporary adhesive layer 30 defines a maximum thickness greater than the height difference h of the second surface S2 of two adjacent substrates 20. In some embodiments, the maximum thickness of the temporary adhesive layer 30 is greater than the flatness of the second surface S2 of the adjacent substrates 20. In some embodiments, the temporary adhesive layer 30 has the following characteristics: For example, the temporary adhesive layer 30 has the function of separating one or more substrates 20 from the support plate 10, for example, mechanical separation or chemical separation. The temporary adhesive layer 30 can define a separation temperature of 200°C or higher, or it can absorb a predetermined light wavelength band, for example, ultraviolet (UV), green light, etc., and define a separation wavelength band. In some embodiments, as shown in Figure 1L, the temporary adhesive layer 30 includes an adhesive layer 31 and a separation layer 32, and the separation layer 32 defines the above separation conditions.

[0100] In some embodiments, the functional material 40 can, in principle, be placed between two adjacent substrates 20, or on either surface of these substrates 20, and in particular on the outward-facing surfaces (including the side surfaces) of these substrates 20. Since the functional material 40 can be the same or different depending on the location, the resulting effects may also differ; for example, a functional material placed between two adjacent substrates 20 can be defined as insulation or bonding, a functional material placed on the outside of the substrates 20 can be defined as insulation or protection, and a functional material placed on either surface of these substrates 20 can be defined as protection or planarization. These effects are illustrative and not limiting. The functional material 40 includes organic and / or inorganic materials. For example, organic materials include epoxy resin (epoxy) or polyimide; inorganic materials include, but are not limited to, silica (SiO2, silicon dioxide), glass, and ceramics; for example, the functional material 40 includes glass frit, glass powder, glass paste, or a combination of one or more of the above materials. The functional material 40 is placed on these substrates 20, and a portion of the first and second surfaces are exposed in the form of a build-up layer (e.g., Ajinomoto Build-Up Film (ABF)), including, but not limited to, this. Furthermore, the relevant properties of the functional material 40 can be improved by adding inorganic materials, such as reducing CTE, improving strength, and increasing hygroscopicity. The elastic modulus of the functional material 40 is smaller than the elastic modulus of the adjacent substrates 20, or smaller than the elastic modulus of each substrate 20, further reducing the risk of warping.

[0101] As shown in Figure 1E, the distinction from Figure 1AX is that the functional material 40A4 of substrate structure 1E covers the surfaces of these substrates 20 facing outwards, for example, the first surface S1 and the side surface, and the functional material 40A4 is formed from the same material. As shown in Figure 1FA, the distinction from Figure 1E is that the functional material 40A41 of substrate structure 1FA includes multiple materials, for example, the first functional material 41 is placed between two adjacent substrates 20 and extends to the side surfaces of these substrates 20. The second functional material 42 is placed on the first surface S1 of these substrates 20 and extends to the surface of the first functional material 41 adjacent to the first surface S1. As shown in Figure 1FB, the distinction from Figure 1FA is that the functional material 40A42 of substrate structure 1FB includes multiple materials, for example, the first functional material 41 is placed between two adjacent substrates 20 and extends to the side surfaces of these substrates 20. The third functional material 43 is placed on the first surface S1 of these substrates 20; the second functional material 42 is placed on the outward-facing surface of these third functional materials 43 and extends to the surface of the first functional material 41 adjacent to the first surface S1. In this embodiment, part or all of the third functional material 43 may, and is not limited thereto, extend to the surface of the first functional material 41 adjacent to the first surface S1. As shown in Figure 1IA, the functional material 40A43 of the substrate structure 1IA comprises multiple materials, and the distinction from Figure 1FB is that the substrate structure 1IA includes a second electrical layer structure 60, which defines one or more power supply areas 61 for achieving electrical connections with the outside, and these substrates 20 have multiple through-holes 70v', and the functional material 40A43 (the third functional material 43' may be an example, but is not limited thereto) fills these through-holes 70v'. As shown in Figure 1IB, the functional material 40A44 of the substrate structure 1IB includes multiple materials, and the distinction from Figure 1IA is that the functional material 40A44 filling these through holes 70v' (for example, a third functional material 43') further opens an inner hole 70vb. Here, the inner hole 70vb can be, but is not limited to, coaxial with the through hole 70v'. Here, it is preferable, but is not limited to, that the hole wall of the inner hole 70vb is defined by the functional material 40A44. In this embodiment, the inner hole 70vb does not penetrate the second functional material 42.As shown in Figure 1IC, the functional material 40A45 of substrate structure 1IC contains multiple materials, and the distinction from Figure 1IB is that multiple conductive holes 70 are formed by filling these internal holes 70vb with conductive material. Refer to Figure 1JA, the distinction from Figure 1IB is that multiple internal holes 71vi of substrate structure 1JA penetrate the second functional material 42. These internal holes 71vi are formed by opening them with functional material 40A44 (a third functional material 43' can be used as an example, but is not limited to this) which is filled into these through holes 70v'. Refer to Figure 1JB, the distinction from Figure 1IC is that multiple conductive holes 71 are formed by filling these internal holes 71vi of substrate structure 1JB with conductive material. It should be understood that although the substrate structure contains few components, various arrangement combinations are possible. It should be noted that these through holes 70v', internal holes 71vi, can only communicate with holes on any surface (e.g., the first surface S1 of substrate 20), as shown in Figure 1OM. Here, they may be called holes. The substrate structures 1IP, 1IQ, and 1IR in Figures 1IA and 1IC, and the substrate structures 1IA, 1IB, and 1IC in Figures 1IA and 1IC, are further covered by a third functional material 43A' which completely covers these substrates 20.

[0102] As shown in Figure 1G, the functional material 40A4A of substrate structure 1G covers all surfaces of these substrates 20, including a first surface S1, a second surface S2, and opposing surfaces on both sides, and the functional material 40A4A1 can be formed from the same material. As shown in Figure 1GA, the functional material 40A4A1 of substrate structure 1GA includes multiple materials, for example, a first functional material 41 is placed between two adjacent substrates 20 and extends to the side surfaces of these substrates 20. A second functional material 42 is placed on the first surface S1 and second surface S2 of these substrates 20, and each is extended to the two opposing surfaces of the first functional material 41 adjacent to the first surface S1 and second surface S2. As shown in Figure 1GB, the functional material 40A4A2 of substrate structure 1GB includes multiple materials, for example, a first functional material 41 is placed between two adjacent substrates 20 and extends to the side surfaces of these substrates 20. A third functional material 43 is placed on the first surface S1 and second surface S2 of these substrates 20. The two second functional materials 42 are placed on the first surface S1 and the second surface S2 of the substrate 20, respectively. The second functional materials 42 are placed on the outward-facing surfaces of the third functional materials 43 and are extended to two opposing surfaces of the first functional material 41 adjacent to the first surface S1 and the second surface S2.

[0103] Functional materials have a number of further embodiments and are not limited thereto. For example, in Figure 1GM, the functional material 40A4A1' of substrate structure 1GM comprises multiple materials, for example, a first functional material 41A' covers all surfaces of these substrates 20 and includes a first surface S1, a second surface S2, and opposing surfaces on both sides. The second functional material corresponds to the first surface S1 and the second surface S2 of these substrates 20 and is arranged on two opposing surfaces of the first functional material 41A'. For example, in Figure 1GN, the functional material 40A4A2' of substrate structure 1GN comprises multiple materials, for example, a third functional material 43A' covers all surfaces of these substrates 20 and includes a first surface S1, a second surface S2, and opposing surfaces on both sides. The first functional material 41 is positioned between two adjacent substrates 20. In this embodiment, the first functional material 41 is located between two third functional materials 43A', and the second functional material corresponds to the first surface S1 and second surface S2 of these substrates 20 and is positioned on two opposing surfaces of the third functional material 43A'.

[0104] Furthermore, these substrates 20 can be designed with a chamfered structure at one or more corners or side edges. Taking substrate structures 1K, 1KA, and 1KB in Figures 1K, 1KA, and 1KB as examples, the chamfers r20 are located on the side of substrate 20A4' facing the support plate 10, both side edges of substrate 20A41', and the outward-facing side edge of substrate 20A42', respectively, but the arrangement of the chamfered structures on the substrate is not limited to these. It should be understood that the implementation of the chamfered structure of the present invention can be applied to substrates (including blank substrates and non-blank substrates) in all embodiments of the present invention.

[0105] Simultaneously, refer to Figures 1H to 1HB and 1HC to 1HD. The difference from Figures 1G to 1GB is that the substrate 20X has a chamfer r20, and here we take the example of having chamfers on all four side edges, but it is not limited to this. This improves the adhesive strength and mechanical properties between the functional material and the substrate.

[0106] Simultaneously, refer to Figures 1MA to 1MC, 1NA, 1NB to 1NC, and 1MM to 1MN. The difference from Figures 1MA to 1MC, 1K, 1KA to 1KB, and 1JA to 1JB is that the substrate 20X has a chamfer r20, and here we take the example of having chamfers on four side edges, but it is not limited to this. This improves the adhesive strength and mechanical properties between the functional material and the substrate.

[0107] In some embodiments, these substrates 20 and functional materials 40 are jointly formed into a composite substrate. For example, the elastic modulus or CTE of this composite substrate approaches that of the support plate 10, thereby reducing the risk of warping.

[0108] As shown in Figures 1O and 1OP, the substrate structures 1O and 1OP further include first electrical layer structures 50 and 50C, which are provided on at least the first surface S1 of each substrate 20. The difference between the first electrical layer structures 50 and 50C in Figures 1O and 1OP is that in Figure 1O, the first electrical layer structure 50 is provided only on the substrate 20, while in Figure 1OP, the first electrical layer structure 50C can be further extended to the functional material 40 of the adjacent substrate 20. In some embodiments, the first electrical layer structure 50C can be further extended to the functional material 40 on the outer periphery of the substrate 20. In some embodiments, the first electrical layer structures 50 and 50C are either an unpatterned conductive layer (i.e., a complete conductive layer covering the entire surface) or a patterned wiring layer. In some embodiments, the substrate 20 is either an undefined or defined substrate, where defined or not defined means the presence or absence of at least through holes, conductive holes, or conductive layers, and if all three conditions are not met, it is considered undefined. For example, the first electrical layer structure 50 may be an electrical layer structure inherent in the substrate 20 itself (i.e., the substrate 20 is a predefined substrate), and the substrate 20 is placed on the support plate 10. Alternatively, the substrate 20 (i.e., the substrate 20 is an undefined substrate) may be placed on the support plate 10 first, and then the first electrical layer structure 50C may be placed on top of it, in which case the first electrical layer structure 50C is not an electrical layer structure inherent in the substrate 20 itself. If the first electrical layer structures 50 and 50C are unpatterned conductive layers, they can be single-layer electrical layers. If the first electrical layer structures 50 and 50C are patterned wiring layers, they can be multi-layer electrical redistribution structures (RDLs).As shown in Figures 1OQ and 1OX, in substrate structure 1OX, each substrate 20 includes one or more through holes 70v, the through holes 70v connecting at least one of the first surface S1 and second surface S2 of the substrate 20, or further connecting the two aforementioned surfaces, and the through holes 70v can be provided in each substrate 20 beforehand or formed by drilling after the substrate 20 is placed on the support plate 10; in substrate structure 1OQ, each substrate 20 includes one or more conductive holes 70, the conductive holes 70 are electrically connected to at least the first electrical layer structure 50C, the conductive holes 70 can be provided in each substrate 20 beforehand or formed by drilling after each substrate 20 is placed on the support plate 10 and then placing conductive material in them; or, each substrate 20 is provided with through holes 70v beforehand and then formed by placing conductive material in them after being placed on the support plate 10. As shown in Figure 1OY, the distinction between substrate structure 1OY and substrate structure 1OQ is that substrate structure 1OY lacks the first electrical layer structure 50C. As shown in Figures 1OM and 1ON, in substrate structure 1OM, the through-holes 70v or conductive holes 70 mainly connect only the first surface S1 or the second surface S2, and this embodiment takes the first surface S1 as an example. In substrate structure 1ON, the through-holes 70v or conductive holes 70 connect the first surface S1 or the second surface S2 simultaneously. Such a double-sided connecting structure can achieve double-sided communication when the through-holes 70v are first drilled through, or by polishing the surface of substrate structure 1OM that does not connect to the through-holes 70v or conductive holes 70.

[0109] As shown in Figure 1P, the substrate structure 1P further includes a second electrical layer structure 60, which is provided at least between the second surface S2 of each substrate 20 and the temporary adhesive layer 30; the second electrical layer structure 60, like the first electrical layer structure 50, can extend to the space between the functional material 40 and the temporary adhesive layer 30 of adjacent substrates 20, and can further extend to the outer periphery of the substrate 20, while still being located between the functional material 40 and the temporary adhesive layer 30. When the second electrical layer structure 60 is placed on the functional material 40 located in the gap G between at least two adjacent substrates 20, it defines a height difference h' between the second surface S2 of the two adjacent substrates 20 and the functional material 40 located in the gap G between the two adjacent substrates 20, with the height difference being 5 μm or less; see Figure 1P. It should be noted that the second electrical layer structure 60 is not limited to a patterned one. Similarly, the second electrical layer structure 60 may be an unpatterned conductive layer or a patterned wiring layer; or a single wiring layer or a multilayer rewiring structure. Furthermore, the second electrical layer structure 60 may be an electrical layer structure pre-provided in the substrate 20 and connected to the temporary adhesive layer 30. In the substrate structure 1P shown in Figure 1P, each substrate 20 includes one or more conductive holes 70, and the conductive holes 70 are electrically connected to at least the second electrical layer structure 60. In particular, the conductive holes 70 provide the possibility of electrical connection between the first surface S1 and the second surface S2 of the substrate 20, and the conductive holes 70 usually extend along the vertical direction Z. In some embodiments, the conductive holes 70 may include a barrier layer (not shown), a buffer layer (not shown), a nucleating layer (not shown), and / or a filler material, which are formed, for example, by a plating means. Conductive material may be included in the conductive holes, or further insulating material may be included. In the substrate structure 1PX shown in Figure 1PX, each substrate 20 includes one or more through holes 70v that do not contain conductive material, and the through holes 70v connect the first surface S1 and the second surface S2 of the substrate 20. The through-holes 70v are either pre-formed in each substrate 20 or formed by drilling after the substrate 20 is placed on the support plate 10.

[0110] The conductive holes 70 may be pre-formed in the substrate 20, as shown in Figure 1P, and are bonded to the support plate 10 by a temporary adhesive layer 30. The conductive holes 70 are formed by a subsequent manufacturing process after being bonded to the support plate 10 by the temporary adhesive layer 30, for example, a plating process. In the substrate structures 1Q and 1R shown in Figures 1Q and 1R, the second electrical layer structure 60 includes a power supply area 61, which is usually provided on the side edge of the second electrical layer structure 60, but is not limited to this. One of the functions of the power supply area 61 is to supply power to the second electrical layer structure 60 via an electrical connection using a plurality of conductive hole forming means. In some embodiments, the power supply area 61 is not covered by the functional material 40, but the substrate structures 1Q and 1R further include one or more power supply plates 80, which are independent substrates located outside the substrate 20, adjacent to the corresponding substrate 20, and electrically connected to the second electrical layer structure 60 (and its power supply area 61). The distinction between Figure 1Q and Figure 1R is that the second electrical layer structure 60 in Figure 1Q can accommodate multiple substrates 20 simultaneously, while the second electrical layer structure 60 in Figure 1R can accommodate each substrate 20 individually. The number of power supply plates 80 corresponds to the number of independent second electrical layer structures 60, and each can accommodate a substrate 20. More specifically, the power supply plate 80 has one or more conductive holes 81 electrically connected to the power supply area 61 of the second electrical layer structure 60, and the conductive holes 81 are formed by conductive hole forming means such as chemical plating, electroplating, or sintering. See Figures 1QX and 1QY. Before the electroplating process, the through-hole 70v in Figure 1QX has not yet been filled with conductive material. As shown in Figure 1QX, in the electroplating process, the power supply area 61 and the portion corresponding to the second electrical layer structure 60 in which the through-hole 70v is exposed can each be two electrodes that are charged and discharged in the electroplating process. These are gradually formed in the through-hole 70v in Figure 1QY, as shown in the conductive material 70' in Figure 1QX, and finally the conductive holes 70 in Figure 1P are formed, and these conductive holes 70 are electrically connected to at least the second electrical layer structure 60. The substrate structure 1S shown in Figure 1S has multiple conductive holes 70 in one or more substrates 20. The substrate structure further includes one or more first electrical layer structures, and these conductive holes 70 are electrically connected to the first electrical layer structure 50 and the second electrical layer structure 60.In substrate structure 1S, a single first electrical layer structure 50C is electrically connected to a second electrical layer structure 60 through these conductive holes 70 of the substrates 20. In substrate structure 1T shown in Figure 1T, multiple first electrical layer structures 50 correspond to multiple substrates 20 and are electrically connected to a second electrical layer structure 60 through these conductive holes 70 of the substrates 20, and each first electrical layer structure 50 and the corresponding substrate 20 are formed as independent units (unless electrically connected by other wiring).

[0111] As shown in Figures 1U to 1V, the substrate structures 1U to 1V are similar to the above embodiment, but the distinguishing feature is that the power supply area 61E is directly exposed by the second electrical layer structure 60, thus achieving the same effect as a power supply plate. As shown in Figures 1UX to 1UY, in the embodiment of the power supply area 61E, the substrate structures 1UX to 1UY are gradually formed in the through-hole 70v in Figure 1UX, as shown by the conductive material 70' in Figure 1UY, and finally the conductive hole 70 in Figure 1U is formed.

[0112] As shown in Figures 1W to 1WB, the substrate structures 1W, 1WA, and 1WB are similar to the embodiments described above, and the distinguishing feature is that the power supply area 61F is electrically connected to predetermined conductive holes 71 in the substrate, thus achieving the same effect as the power supply board 80. Here, the portion of the substrate 20 with predetermined conductive holes 71 belongs to a part of the substrate 20 and is not an independent substrate. The function of these predetermined conductive holes 71 and the conductive holes 81 of the power supply board 80 are the same, and they are formed by conductive hole forming means such as chemical plating, electroplating, or sintering, and further formed in the conductive holes 70 by the electroplating process. In other words, in the substrate structure of the present invention, some of the conductive holes 70 in the substrate 20 are used for power supply.

[0113] As shown in Figures 1X to 1XA, the substrate 20 of substrate structures 1X to 1XA comprises a first electrical layer structure 50, a second electrical layer structure 60, and one or more conductive holes 70. Some of the conductive holes 70 can be electrically connected to the first electrical layer structure 50 and the second electrical layer structure 60. In the substrate structure 1XB of Figure 1XB, the substrate 20 comprises the first electrical layer structure 50 and one or more conductive holes 70, and the second electrical layer structure 60 is placed on the temporary adhesive layer 30 (and its support plate 10) before being connected to it.

[0114] The substrate structure of the present invention is configured as a large substrate by bonding a size-limited substrate 20 to a support plate 10, and then subsequent manufacturing processes are carried out. As shown in Figures 2W and 2, a means for separating from the support plate 10 is provided in accordance with the separation characteristics of the temporary adhesive layer 30, and by providing light of a predetermined wavelength or heating, for example, the multiple substrates 20 that have been bonded to the support plate 10 are separated from each other, and the multiple substrates 20 are formed into an integral structure by the functional material 40. The first electrical layer structure 50' and the second electrical layer structure 60' can each be a rewiring structure (not limited to this) as shown in Figure 2, the first electrical layer structure 50' can complete the relevant processes before removing the support plate 10, and the second electrical layer structure 60' is completed after removing the support plate 10. The first electrical layer structure 50' and the second electrical layer structure 60' have maximum line widths P50 and P60, respectively, and the maximum line width P50 of the first electrical layer structure 50' is smaller than the maximum line width P60 of the second electrical layer structure 60'. In this embodiment, a wiring process (not limited to) can be performed simultaneously on multiple substrates 20, and since a double-sided wiring laminated substrate structure 2 is ultimately formed, costs can be effectively reduced. At this time, the substrate structure 2 can be separated from the support plate 10 by removing the temporary adhesive layer 30, and further multiple cut units 2A can be defined; each cut unit 2A does not contain any gaps G. It should be noted that the size of each cut unit is greater than or equal to the size of any one substrate. See also Figure 2A. The double-sided wiring laminated substrate structure can be further cut according to demand to manufacture cut units 2A, which can be used in industries such as advanced packaging. For example, an assembly package 100 comprises an electrical board 90 and a portion of a substrate structure 2 placed on the electrical board 90. Since the portion of the substrate structure 2 includes one or more cut units 2A, the assembly package 100 includes the cut units 2A. Here, since the size of the substrate 20 in the substrate structure 2 is much larger than the size of the cut units 2A after the cutting process, the substrate 20 in the figure can be divided into three cut units 2A.

[0115] Please refer to Figures 2, 2A, 2AX, 2XW, and 2X. Figures 2, 2XW, and 2X (but not limited to these) form the basis of this explanation. In this embodiment, the substrate structure 2X defines multiple cut units 2AX, and each cut unit 2AX does not contain any gaps G. Here, we take the example of the substrate structure 2AX including a first electrical layer structure 50' and a second electrical layer structure 60' as rewiring structures, but we are not limited to this. Here, the substrate structure 2XW includes a temporary adhesive layer 30 and a support plate 10. The main difference between the substrate structure 2X and the substrate structure 2 is the size of the substrate 20 in the substrate structure 2X, which approaches the size of the cut unit 2AX after the cutting process (i.e., the size is almost the same). Therefore, the cutting process only separates multiple substrates 20, and does not divide a single substrate 20 into multiple parts, which usually occurs when the size of the substrate 20 itself is sufficiently small. Since the size of the substrate 20 of substrate structure 2 is larger than the size of the cut unit 2A after the cutting process, the single substrate 20 can be divided into multiple substrates during the cutting process. In this embodiment, the cutting process only separates the multiple substrates 20 from each other, and the functional material 40 can be retained. For example, by covering one side edge of each substrate 20, the effect of protecting the side edges can be achieved. It should be noted that the substrate 20 may have conductive holes 70, a first electrical layer structure 50', and a second electrical layer structure 60' as in this embodiment, or it may be a blank substrate.

[0116] Figures 3 to 5A show different embodiments of the substrate structure 2 (Figures 3, 3X, and 3Y), and different types of cut units of a portion of the substrate structure that fit the structural package (Figures 4, 4A, 4AX, 5, 5A, and 5AX). As shown in Figure 3, two substrate structures, using substrate structure 1C as an example, are joined together by facing the first surfaces S1 of these substrates 20 of each substrate structure 1C and, if necessary / unnecessary, via an adhesive layer 30X (here, the case with an adhesive layer is given as an example) to form substrate structure 3 (shown in Figure 3X). In substrate structure 3, openings 70xv (shown in Figure 3Y) are formed through these substrates 20 and the adhesive layer 30X of the two substrate structures 1C, and after the conductive material is placed, a plurality of conductive holes 70x are formed that electrically connect the first electrical layer structure 50 of at least two substrate structures 1C. As shown in Figure 3, these conductive holes 70x can further connect the second surfaces S2 of the two substrate structures 1C. For example, if a second electrical layer structure 60 is present, these conductive holes 70x can further electrically connect the second electrical layer structures 60 of the two substrate structures 1C. The adhesive layer 30X includes an inorganic material and / or an organic material, such as silica (ie.e., fused silica, SiO2), glass, ceramic, or polyimide, or a combination of one or more of the above materials. The adhesive layer 30X includes glass frit, glass powder, glass paste, or a combination of one or more of the above materials. The thermal conductivity of the adhesive layer 30X is greater than the thermal conductivity of the substrates 20 of the two substrate structures 1C. Furthermore, the thermal conductivity of the adhesive layer 30X is more than twice that of the substrate 20. The adhesive layer 30X is non-conductive, or a conductive layer having non-conductivity, and includes a non-conductive thermal conductive material and / or thermal conductive particles. The thermal conductive layer contains a thermal conductive material including carbon nanotubes and / or graphene, or multiple silicon carbide (SiC) and / or silicon (Si) thermal conductive particles. Alternatively, as shown in Figure 3A, the adhesive layer structure 30XA is conductive, or a thermal conductive layer having conductivity, and is a thermal conductive material and / or thermal conductive particles containing conductivity.The thermal conductive layer can be insulated from the opening 70xv, and the method of insulation is that the thermal conductive layer does not come into contact with the opening 70xv. The thermal conductive layer is a metal layer or contains multiple metal particles. It should be understood that in both Figure 3 and Figure 3A, the adhesive layer is shown as the thermal conductive layer. Taking Figure 3B as an example, the adhesive layer may be a composite structure, which may be referred to here as the adhesive layer structure 30XB, and includes an adhesive layer 30XB1 and two thermal conductive layers 30XB2 between the adhesive layer 30XB1 and the upper and lower substrates 20. When the thermal conductive layer 30XB2 is conductive, it is insulated from the opening 70xv, and the method of insulation is that the thermal conductive layer does not come into contact with the opening 70xv.

[0117] As shown in Figure 4, the substrate structure 3 can further remove the support plates 10 from each substrate structure 1C and perform a cutting process to manufacture multiple cut units 4A. Here, the order of processes such as removing the support plates 10 and manufacturing the cut units 4A does not matter. As shown in Figure 4A, the structural package 400 includes an electrical board 90 and a part of the substrate structure 4 (i.e., one or more cut units 4A) placed on the electrical board 90. As shown in Figure 4AX, the structural package 400' includes an electrical board 90 and a part of the substrate structure 4 placed on the electrical board 90. Here, one or more side edges E20 of the substrate 20 of the cut unit 4AX approach (align as closely as possible) one or more side edges E10 of the support plate 10. It should be understood that the electrical layer of the substrate structure 1C is a single-layer electrical layer, and may be changed to the first electrical layer structure 50' and second electrical layer structure 60' (electrical rewiring structure) of the substrate structure 2. It should be understood that embodiments of the functional material of the present invention can also be applied, and the functional material can cover the side edges of each substrate 20.

[0118] The substrate structure of the present invention can be further applied as follows. Please refer to Figure 5. Substrate structure 5 (or referred to as substrate structure combination) includes two substrate structures 2 joined via an adhesive layer 30X, the first electrical layer structure 50' and second electrical layer structure 60' (electrical rewiring structure) of one substrate structure 2 and the first electrical layer structure 50y and second electrical layer structure 60y (electrical rewiring structure) of the other substrate structure 2, respectively, having maximum line widths P50, P60, P50y, and P60y, and the maximum line widths can be arranged in ascending order from smallest to largest. In this embodiment, the substrate structure 5 has already had the support plates 10 of each substrate structure removed. It should be understood that the conductive holes 70y can be electrically connected to at least two first electrical layer structures 50', 50y in the substrate structure, or to two corresponding second surfaces S2, or to two corresponding second electrical layer structures 60', 60y, as in each of the embodiments described above. The substrate structure 5 is further manufactured by a cutting process to produce multiple cut units 5A. Next, referring to Figure 5A, the structural package 500 includes an electrical board 90 and a portion of the substrate structure 5 (i.e., one or more cut units 5A) placed on the electrical board 90. Similarly, as shown in Figure 5AX, the substrate structure 5 can be divided into multiple cut units 5AX depending on the size of the substrate 20, and one or more side edges E20 of the substrate 20 of the cut unit 5AX approach (align as closely as possible) one or more side edges E10 of the support plate 10. That is, the structural package 500' includes an electrical board 90 and a portion of the substrate structure 5 (i.e., one or more cut units 5AX) placed on the electrical board 90.

[0119] Figure 6 discloses a substrate structure 6 of another embodiment of the present invention, which differs from the substrate structure 1 of Figure 1 in that the substrate structure 6 includes one or more markings MK. These markings MK are placed on the support plate 10 and may be optical markings, physical markings, mechanical markings or other forms of markings, and are used for positioning, alignment, or identification. The position of these markings MK is precisely designed and can be placed in the non-bonding area NTA of the support plate 10, so that these substrates 20 serve as a reference for alignment when bonding them to the support plate 10 along the vertical direction Z. These markings MK can be placed in the bonding area TA of the support plate 10, and at least one marking MK' is placed so that any of the substrates 20 are on the support plate 10 along the vertical direction Z, and any of the substrates 20 are within the projection range of the support plate. Furthermore, the substrate 20 itself is light-transmitting, meaning that light can be transmitted through the substrate 20. Such properties are relatively important in some applications, such as display devices, optical elements, or photosensitive elements. It should be noted that in the embodiments in which the markings exist, the substrate 20 is not necessarily required to have light transmission properties. In some embodiments, the substrate structure 6 further has one or more corresponding markings MC, which are placed on these substrates 20. Similarly, these corresponding markings MC may be optical markings, physical markings, mechanical markings, or other forms of markings. The corresponding markings MC and the markings MK on the support plate can form corresponding pair relationships and are used to accurately align the substrate 20 and the support plate 10, thereby determining whether the substrate 20 is accurately positioned or if fine adjustments are needed. In this embodiment, the light-transmitting substrate 20 can further improve bonding accuracy, manufacturing efficiency, and product quality.

[0120] The substrate structure of the present invention provides a large substrate that can be divided in a later process into "relatively small high-performance substrates" for various advanced packaging applications. As is well known, some high-performance substrates have size limitations, preventing conductive wiring processes from being carried out on larger substrates and thus limiting manufacturing cost reductions. The present invention involves bonding a substrate to a support plate to create a relatively large bonded substrate. Furthermore, after the conductive wiring manufacturing process is carried out on this bonded substrate, it can be divided in a later process into the required size for high-performance substrates used in advanced packaging, thus combining the benefits of high-performance substrates with cost reduction.

[0121] As described above, various embodiments of the present invention are described in the specification for illustrative purposes and various modifications are possible without departing from the scope and spirit of the invention. Therefore, it should be understood that these various embodiments do not limit the true scope and spirit of the invention.

[0122] The above are illustrative and not limiting. All equivalent modifications or changes made without departing from the spirit and scope of the present invention should be included in the claims. [Explanation of Symbols]

[0123] 1, 1A, 1A1, 1A2, 1A3, 1A4, 1A41, 1A42, 1A43, 1A44, 1A44-1, 1A45, 1A45-1, 1A4A, 1A4A1, 1A4A1', 1A4 A2, 1A4A2'2X, 1A4', 1A41', 1A42'2X, 1A4'X, 1A41'X, 1A42'2XX, 1A43X, 1A44X, 1A45X, 1A44-1X, 1A 45-1X, 1A4AX, 1A4A1X, 1A4A2X, 1B, 1C, 1C1, 1C2, 1C2'2X, 1C2'', 1C2X, 1C2Y, 1D, 1D', 1D1, 1D1', 1D1 ", 1D2, 1D3, 1D4, 1E, 1E1, 1E1', 1E1", 1E2, 1F, 1F1, 1F2, 1G, 1G1, 1G2, 2, 2'2X, 3, 3'3X, 3"3Y, 4, 5, 6 Board structure 2A, 2AX, 4A, 4AX, 5A, 5AX Cut Unit 10, 10', 10”, 10A3 support plate 11, 21' base material 12, 22' Polyimide material 20, 20A2, 20A4', 20A41', 20A42'2X, 20X board 30 Temporary adhesive layer 30X, 30XB1 adhesive layer 30XA, 30XB adhesive layer structure 30XB2 Thermal Conductive Layer 31 Adhesive layer 32 Separation layer 40, 40A4, 40A41, 40A42, 40A43, 40A44, 40A45, 40A4A, 40A4A1, 40A4A1', 40A4A2, 40A4A2' Functional materials 41, 41A' 1st functional material 42 Second functional material 43, 43', 43A' Third functional material 50, 50', 50C, 50y First Electrical Layer Structure 60, 60', 60y Second Electrical Layer Structure Power supply area 61, 61E, 61F 70, 70x, 70y, 71, 81 conductive hole 70' conductive material 70v, 70v' through hole 70xv open hole 70vb, 71vi inner hole 80 Power supply board 90 Electrical board 100, 400, 400', 500, 500' structural packages A10, A20 plane area E10, E20 side edge G Gap h, h' difference in height MC Corresponding markings MK, MK' marking NTA Non-Connected Area P50, P60, P50y, P60y Maximum line width r20 chamfer S1 1st surface S2 2nd surface TA junction area X horizontal axis Y (vertical axis) Z vertical direction

Claims

1. A support plate that defines the planar direction, A plurality of substrates are installed adjacent to the support plate along the aforementioned planar direction, each having a first surface and a second surface facing each other, A temporary adhesive layer is provided, which is connected and positioned between the second surface of each substrate and the support plate. A functional material provided in the gap between two adjacent substrates, The planar area of ​​the support plate is greater than or equal to the sum of the planar areas of the substrates. A substrate structure characterized in that, along a direction perpendicular to the planar direction, a height difference is defined between the first surface of two adjacent substrates and / or the second surface of two adjacent substrates, and the height difference is 50 μm or less.

2. The support plate and / or the plurality of substrates are Si, Silica (i.e., fused silica, SiO ２ ), glass, quartz, silicon carbide, ceramic, glass ceramic, sapphire (Al ２ O ３ The substrate structure according to claim 1, characterized by comprising a compound semiconductor material, or polyimide, or a combination of one or more of the above materials.

3. The substrate structure according to claim 1, characterized in that the support plate has a thermal expansion coefficient of 15 ppm / K or less in a temperature range of 25°C to 400°C.

4. The support plate has a planar area of ​​16,000 mm² in the planar direction. ２ The substrate structure according to claim 1, characterized in that it is as described above.

5. The substrate structure according to claim 1, characterized in that a height difference is defined between the first surface of two adjacent substrates and / or the second surface of two adjacent substrates, and the height difference is 10 μm or less.

6. The substrate structure according to claim 1, characterized in that the substrate has a thermal expansion coefficient of 15 ppm / K or less in a temperature range of 25°C to 400°C.

7. Each of the above substrates is a multilayer substrate comprising a glass material, a glass ceramic material, a ceramic material, and a polyimide material formed by bonding the glass material / glass ceramic material / ceramic material, wherein a difference in thermal expansion coefficients is defined between the polyimide material and the glass material / glass ceramic material / ceramic material, and the difference in thermal expansion coefficients is 5 ppm / K or less within a temperature range of 25°C to 400°C, characterized in that the substrate structure according to claim 1.

8. The substrate structure according to claim 1, characterized in that each of the substrates defines a thermal conductivity coefficient of 1.0 W / m*K or greater.

9. The substrate structure according to claim 1, characterized in that each of the aforementioned substrates has an elastic modulus of 50 GPa or more.

10. The substrate structure according to claim 1, characterized in that each of the substrates includes one or more conductive holes.

11. The substrate structure according to claim 1, characterized in that the difference in height between the first surfaces of two adjacent substrates is 1 / 10 or less of the thickness of the two adjacent substrates.

12. The substrate structure according to claim 1, characterized in that one or more of the substrates define a bending strength of 150 MPa (Megapascal) or more.

13. The substrate structure according to claim 1, characterized in that one or more of the substrates have a dielectric loss Df of 0.006 or less at a test frequency of 10 GHz (Gigahertz).

14. The substrate structure according to claim 1, further characterized in that a plurality of cut units are defined, and each of the cut units does not contain the gap.

15. The substrate structure according to claim 1, further comprising one or more markings, wherein one or more of the markings are arranged on the support plate.

16. The substrate structure according to claim 1, characterized in that each of the substrates defines one or more corners or side edges, and any one of the substrates defines a chamfer on one or more of the corners or side edges.

17. A structural package (assembly package) comprising a part of a combination of substrate structures, the combination of substrate structures comprising two of the substrate structures described in claim 1, the two substrate structures being joined to each other, the conductive holes being electrically connected to the first electrical layer structure of at least two of the substrate structures, the combination of substrate structures having a temporary adhesive layer removed, separating the support plate and defining a further number of cut units in part, each of which does not contain the gap; comprising one or more of the cut units, the size of each cut unit being greater than or equal to the size of any one of the substrates in the substrate structure.

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