Circulation duct structure for semiconductor processing systems

Abstract

This provides an improved arrangement of circulation duct structures for semiconductor processing systems. [Solution] In a semiconductor processing system, a duct assembly comprising an upper duct section 330, a vertical duct section 340, and a lower duct section 350 is connected to an equipment front-end module (EFEM) and processes nitrogen (N2) gas passing through the EFEM. The duct assembly has a filter section 380 for replacing a chemical filter for processing N2 gas without removing the duct assembly from the EFEM. An advantage of at least one embodiment of the present invention is reduced maintenance time.

Description

Technical Field

[0001] The present disclosure generally relates to fabricating semiconductor devices. More specifically, the present disclosure relates to an equipment front-end module for a semiconductor processing system employed to manufacture semiconductor devices.

Background Art

[0002] Semiconductor processing systems, such as those having a cluster-type platform, generally include an equipment front-end module (EFEM). These systems conventionally also include circulation ducts. The circulation ducts serve to maintain air quality management within the cleanroom, adjust the temperature, maintain a uniform level of oxygen, maintain a uniform humidity within the EFEM, and ensure appropriate ventilation as required by the EFEM.

[0003] In conventional systems, these circulation ducts are disposed on both sides of the EFEM. Such an arrangement results in an increase in the EFEM footprint. Further, chemical filters are disposed within the EFEM, whereby the circulation ducts on both sides of the EFEM prevent direct access to the chemical filters. Thus, when the chemical filters need to be replaced, the circulation duct structure has to be loosened, the ducts removed to access the filters, and removed. Similarly, removal of the circulation ducts is also required to enter the mini-environment within the EFEM. Both of these processes increase the exchange and maintenance downtime.

[0004] Figure 1 shows the prior art system 10 described above. The prior art system 10 includes an EFEM 20, a first circulation duct 30, a second circulation duct 40, a first extension section 50, and a second extension section 60. Inside the EFEM 20 is a minienvironment through which nitrogen (N2) gas circulates. The first circulation duct 30 may provide a path for the N2 gas to be discharged from the minienvironment of the EFEM 20. The second circulation duct 40 may also provide a path for the N2 gas to be discharged from the minienvironment of the EFEM 20.

[0005] The first extension section 50 may include additional components for the operation of the EFEM 20, such as a cooling stage, a filter, or an aligner. The second extension section 60 may also include additional components for the operation of the EFEM 20, such as a cooling stage, a filter, or an aligner. The configuration of the first circulation duct 30 and the second circulation duct 40 may be such that it may be necessary to remove the first circulation duct 30 and the second circulation duct 40 in order to replace the chemical filter. [Overview of the project] [Problems that the invention aims to solve]

[0006] Therefore, in this field, there is a need for improved arrangement of circulation duct structures for semiconductor processing systems. This disclosure provides a solution to this need. [Means for solving the problem]

[0007] A semiconductor processing system is disclosed according to at least one embodiment of the present invention. The semiconductor processing system comprises one or more load ports configured to hold wafers; an instrument front-end module having a wafer transport robot for transporting wafers between one or more load ports and a load lock chamber; a chemical filter configured to filter gases flowing through the instrument front-end module; and at least one circulation duct structure connected to the instrument front-end module, wherein the at least one circulation duct structure is mounted in close proximity to one or more load ports, and the chemical filter is not obstructed by the at least one circulation duct structure.

[0008] A duct assembly is disclosed according to at least one embodiment of the present invention. The duct assembly comprises an equipment front-end module (EFEM) having a wafer transport robot for transporting wafers between one or more load ports and a load lock chamber, wherein the EFEM comprises a filter section configured to hold a chemical filter, a mini-environment door, an upper duct section coupled to the filter section, a vertical duct section connected to the upper duct section and located in close proximity to one or more load ports, and a lower duct section connected to the vertical duct section, the lower duct section being located in close proximity to the mini-environment door.

[0009] This summary of the invention is provided to introduce a selection of concepts in a simplified form. These concepts are described in more detail in the detailed description of the examples of the present disclosure below. This summary is not intended to identify any major or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0010] These and other configurations, aspects, and advantages of the present invention disclosed herein are described below with reference to drawings of certain embodiments, which are intended to illustrate the invention and not to limit it. [Brief explanation of the drawing]

[0011] [Figure 1] This is an overview view of a prior art substrate processing system. [Figure 2] This is an overhead view of the substrate processing system according to the embodiment described in this disclosure. [Figure 3] This is a perspective view of the EFEM of the substrate processing system according to the embodiments described in this disclosure. [Figure 4] This is a perspective view of a portion of the circulating duct structure within a semiconductor duct assembly according to an embodiment described in this disclosure.

[0012] It should be understood that the elements in the figures are illustrated for simplification and clarity and are not necessarily drawn to actual size. For example, the relative sizes of some elements in the figures may be exaggerated relative to others to help improve understanding of the illustrated embodiments of this disclosure. [Modes for carrying out the invention]

[0013] Here, similar reference numerals refer to drawings that identify similar structural features or embodiments of the present disclosure. For illustrative and illustrative purposes only, and not for limiting purposes, partial diagrams of load lock devices connecting a process module to an equipment front-end module (EFEM) of a semiconductor processing system according to the present disclosure are shown in Figures 2–4. The systems and methods of the present disclosure may be semiconductor processing systems employed to fabricate semiconductor devices, such as semiconductor processing systems employed to deposit material layers using chemical vapor deposition (CVD) and atomic layer deposition (ALD) techniques during the fabrication of logic devices and memory devices, but the present disclosure is not generally limited to any semiconductor processing operation or the fabrication of any particular semiconductor device.

[0014] As used herein, the term “substrate” may refer to any substrate material, including any substrate material on which devices, circuits, or films may be modified or formed. “Substrate” can be continuous or discontinuous, rigid or flexible, solid or porous, or a combination thereof. A substrate can be in any form, such as powder, plate, or workpiece. A substrate in plate form may include wafers of various shapes and sizes. Wafers may be 200 mm in diameter, 300 mm in diameter, or 450 mm in diameter. A substrate may be formed from one or more semiconductor materials, including, as non-limiting examples, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, and silicon carbide.

[0015] Referring to Figure 2, an overview of the semiconductor processing system 100 is shown. The semiconductor processing system 100 may include at least one process module 110, a back-end transport module 120, and a load lock device 130. The semiconductor processing system 100 may also include an equipment front-end module (EFEM) 140, a processor, and an exhaust source. In the illustrated embodiment, the semiconductor processing system 100 may include a clustered platform having five process modules 110 configured to deposit material layers on a substrate by, for example, atomic layer deposition (ALD), plasma-enhanced atomic layer deposition (PEALD), chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), epitaxial deposition, or physical vapor deposition (PVD). This is for illustrative and illustrative purposes only and is not limiting. In consideration of this disclosure, as will be understood by those skilled in the art, semiconductor processing systems configured for other material layer deposition operations, and semiconductor processing systems configured for processing operations other than material layer deposition (e.g., etching, rapid thermal processes), can also benefit from this disclosure.

[0016] At least one process module 110 may be coupled to a backend transport module 120 by at least one process module gate valve 150. The process module 110 further includes at least one process chamber. In some embodiments, the process module 110 may include two or more process chambers, such as a dual-chamber module or a quad-chamber module. The process chamber(s) may be configured to flow a material layer precursor or reactant across the substrate during the deposition of a material layer onto the substrate. A reactant source may be fluidly coupled to the process chamber of the process module and provide the reactant to the process chamber for deposition of a material layer onto the substrate.

[0017] The process module gate valve 150 may be configured to transport the substrate between the backend transport module 120 and the process module 110 before and after the deposition of the material layer on the substrate. In certain examples, the material layer may be deposited using ALD or CVD deposition techniques. In some examples, the material layer may be deposited using plasma-enhanced ALD (PEALD) or plasma-enhanced CVD (PECVD) techniques.

[0018] The backend transport module 120 is coupled to the load lock device 130 and includes a backend chamber body and a backend substrate transport robot. The backend transport module 120 is further coupled to the load lock device 130 via a backend gate valve 160. The backend gate valve 160 may be configured to allow the transport of one or more substrates between the load lock device and the backend transport module.

[0019] As shown in Figure 1, the load lock device includes a load lock device back-end surface. The back-end gate valve 160 is coupled to the load lock device 130 at the load lock device back-end surface, and the back-end gate valve 160 is further coupled to the back-end transport module 120 at the back-end transport module surface. Thus, the load lock device 130 is coupled to the back-end transport module 120 using the back-end gate valve 160, and the back-end gate valve 160 is configured to provide selective communication between the back-end transport module 120 and the load lock chamber of the load lock device 130.

[0020] The load lock device 130 is further coupled to the EFEM 140 via a load lock gate valve 170. In certain exemplary embodiments, the load lock gate valve 170 is analogous to a back-end gate valve 160. In this respect, the load lock gate valve 170 may be configured to allow the transport of one or more substrates between the load lock device 130 and the EFEM 140.

[0021] The EFEM140 further includes a front-end substrate transport robot, which is configured to move within the EFEM140 for transporting substrates between one or more load ports 180 and a load locking device 130. The one or more load ports 180 are connected to the EFEM140 and are also configured to house one or more front-opening unified pods (EOUPs) that accommodate the substrates before and after the deposition of material layers onto the substrates. In the example shown in Figure 2, the system 100 includes three load ports 180. However, other examples may include fewer or additional load ports.

[0022] The semiconductor processing system 100 may also include a circulating duct system 190 connected to the EFEM 140. The circulating duct system 190 is shown as having a trapezoidal shape, but may have any other shape (e.g., rounded, elliptical) that does not significantly increase the footprint of the semiconductor processing system 100.

[0023] The processor is coupled to the semiconductor processing system 100, for example, through (or via) a wired or wireless link. The processor is operably connected to a user interface and is configured to communicate with a memory. The memory includes a machine-readable non-transitory medium having a plurality of program modules that contain instructions recorded thereon and that, when read by the processor, cause the processor to execute certain operations.

[0024] FIG. 3 shows an equipment front-end module system (EFEM) 300 according to at least one embodiment of the present invention. The EFEM 300 may include a main body 310, a plurality of load ports 320, an upper duct section 330, a vertical duct section 340, a lower duct section 350, and a cooling station 360. The plurality of load ports 320 are configured to receive a plurality of FOUPs that hold a plurality of substrates that move into the main body 310 and into a plurality of processing chambers.

[0025] The upper duct section 330 and the lower duct section 350 may be coupled to the main body 310. The vertical duct section 340 may be located adjacent to the plurality of load ports 320. The upper duct section 330, the vertical duct section 340, and the lower duct section 350 may be arranged to partially surround the cooling station 360. This arrangement around the cooling station 360 can result in space savings and allow for a smaller overall footprint of the EFEM 300.

[0026] The EFEM 300 may also include an optical curtain. The optical curtain may be arranged adjacent to the vertical duct section 340. The optical curtain has a function of indicating an alarm situation when the optical axis of the optical curtain is blocked.

[0027] Figure 4 is a rear view of a duct assembly according to at least one embodiment of the present invention. The duct assembly may comprise an upper duct section 330, a vertical duct section 340, and a lower duct section 350. The duct assembly is illustrated to surround a cooling station 360, similar to Figure 3.

[0028] The lower duct section 350 may be configured to connect to a mini-environment section 370. The mini-environment section 370 may have a door that allows access to the mini-environment of the EFEM 300. The mini-environment section 370 may be accessible without removing the lower duct section 350. An example of a mini-environment is described in U.S. Patent No. 11,639,811 B2 by Lindeboom et al., titled “Apparatus Including a Clean Mini Environment,” which is incorporated herein by reference.

[0029] Prior art systems, including the system shown in Figure 1, had the drawback of requiring the removal of either the first duct section 30 or the second duct section 40 to access the mini-environment of the EFEM 10. Embodiments of the present invention enable access without removing the duct sections, allowing for faster maintenance and reduced downtime of the semiconductor processing system.

[0030] The upper duct section 330 may be connected to the filter section 380 and the side panel 390. The filter section 380 has a door that allows access to the chemical filter. The chemical filter removes contaminants (such as organic, acidic, and alkaline contaminants) from the N2 gas circulating through the body 310 of the EFEM 300. The chemical filter can be replaced without removing the upper duct section 330 or separating the upper duct section 330 from the filter section 380. Removal of the existing chemical filter is performed by opening the door on the filter section 380 and removing the side panel 390.

[0031] Prior art approaches would have required the removal of ducts to access the chemical filters. By avoiding duct removal, faster maintenance times and reduced downtime for the semiconductor processing system can be achieved. Furthermore, the chemical filters may be replaced quickly and safely.

[0032] While this disclosure has been provided in the context of certain embodiments and examples, those skilled in the art will understand that this disclosure extends beyond the embodiments specifically described to other alternative embodiments and / or uses and obvious modifications of these embodiments and their equivalents. In addition, while several variations of the embodiments of this disclosure are shown and described in detail, other modifications within the scope of this disclosure will be readily apparent to those skilled in the art based on this disclosure. It is also intended that various combinations or partial combinations of certain features and aspects of the embodiments may be made and still be included within the scope of this disclosure. Naturally, the various features and aspects of the disclosed embodiments can be combined or substituted for each other to form changing modes of the embodiments of this disclosure. Therefore, it is not intended that the scope of this disclosure should be limited by the specific embodiments described above.

[0033] Where headings are provided herein, they are for convenience only and do not necessarily affect the scope or meaning of the apparatus and methods disclosed herein. [Explanation of symbols]

[0034] 10 Systems 20 EFEM 30 First circulation duct 40 Second circulation duct 50 First Extension Section 60 Second Extension Section 100 Semiconductor Processing Systems 110 Process Modules 120 Backend Transport Modules 130 Load lock device 140 EFEM 150 Process Module Gate Valves 160 Backend Gate Valve 170 Load Lock Gate Valve 180 Load Ports 190 Circulation Duct System 300 EFEM 310 Main Unit 320 Load Ports 330 Upper duct section 340 Vertical duct section 350 Lower duct section 360 Cooling Station 370 Mini-Environment Section 380 Filter Section 390 Side Panel

Claims

1. A semiconductor processing system, One or more load ports configured to hold wafers, A device front-end module having a wafer transport robot for transporting wafers between one or more load ports and a load lock chamber, A chemical filter configured to filter gas flowing through the front-end module of the aforementioned equipment, At least one circulation duct structure connected to the equipment front-end module, Includes, The at least one circulation duct structure is mounted in a position close to one or more load ports. A semiconductor processing system in which the chemical substance filter is not obstructed by the at least one circulation duct structure.

2. The semiconductor processing system according to claim 1, wherein the at least one circulation duct structure comprises an upper duct section, a vertical duct section, and a lower duct section.

3. The semiconductor processing system according to claim 2, wherein the upper duct section is coupled to a filter section of the equipment front-end module, and the filter section has a door for accessing the chemical filter without removing the upper duct section from the equipment front-end module.

4. The semiconductor processing system according to claim 2, wherein the equipment front-end module includes a mini-environment door, and the mini-environment door is not obstructed by the at least one circulation duct.

5. The semiconductor processing system according to claim 1, wherein the one or more load ports include a plurality of load ports.

6. The semiconductor processing system according to claim 2, wherein the vertical duct section is located in close proximity to one or more load ports.

7. A plurality of first gate valves configured to connect the equipment front-end module to the load lock chamber, A backend wafer handling chamber configured to receive at least one wafer from the load lock chamber, A process module configured to process wafers, A second set of gate valves configured to connect the load lock chamber to the backend wafer handling chamber, A third plurality of gate valves configured to connect the backend wafer handling chamber to the at least one process module, The semiconductor processing system according to claim 1, further comprising:

8. The semiconductor processing system according to claim 7, wherein the at least one process module comprises at least one of a single-chamber configuration, a dual-chamber configuration, or a quad-chamber configuration.

9. The semiconductor processing system according to claim 7, wherein the at least one process module is configured to process a wafer according to at least one of the following processes: atomic layer deposition (ALD), plasma-enhanced atomic layer deposition (PEALD), chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), epitaxial deposition, or physical vapor deposition (PVD).

10. An equipment front-end module (EFEM) having a wafer transport robot for transporting wafers between one or more load ports and a load lock chamber, A filter section configured to hold a chemical filter, EFEM equipped with a mini environment door, An upper duct section coupled to the filter section, A vertical duct section connected to the upper duct section and located in close proximity to one or more load ports, A lower duct section connected to the vertical duct section, wherein the lower duct section is located in close proximity to the mini-environment door, Equipped with, A duct assembly in which the chemical filter can be replaced without separating the upper duct section from the filter section.

11. The duct assembly according to claim 10, wherein the vertical duct section is located in close proximity to one or more load ports.

12. The duct assembly according to claim 10, further comprising a plurality of first gate valves configured to connect the EFEM to the load lock chamber.

13. The duct assembly according to claim 10, wherein one or more load ports are configured to receive a front-end unified pod (FOUP).

14. The duct assembly according to claim 10, wherein the one or more load ports include a plurality of load ports.

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