Light-emitting device

Abstract

The objective is to provide a light-emitting device that improves heat dissipation and allows for the placement of light-emitting elements in the intended positions. [Solution] The light-emitting device has a semiconductor laminate 31, a first electrode 32 and a second electrode 33 between the lower surface of the semiconductor laminate and the upper surfaces of the first conductive member 10 and the second conductive member 20, a first joining member for joining the first conductive member and the first electrode, and a second joining member for joining the second conductive member and the second electrode, and has a first recess 15 that is recessed from the first planar portion 14 of the first conductive member toward the lower surface of the first conductive member, the first recess has a first portion 151 which includes a portion that overlaps with the outer circumference of the first electrode and a second portion 152 which does not overlap with the outer circumference of the first electrode, the second portion is separated from the first corners 30c1 and 30c2 of the light-emitting element that overlap with the first conductive member, and a part of the first joining member is located between the second portion of the first planar portion and the first corner of the light-emitting element and is arranged in the first exposed regions 14c1 and 14c2 from the light-emitting element.

Description

[Technical Field]

[0001] This disclosure relates to a light-emitting device. [Background technology]

[0002] Patent Document 1 discloses an electronic device having a configuration in which electronic components are mounted via a conductive bonding layer, the device comprising a support member having a mounting surface that is bonded to the conductive bonding layer, and a sealing surface provided on the outside of the mounting surface so as to surround the mounting surface and having a rough surface formed by a plurality of laser irradiation marks. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Patent No. 6776800 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] This disclosure aims to provide a light-emitting device that improves heat dissipation and allows the light-emitting element to be positioned at an intended location. [Means for solving the problem]

[0005] A light-emitting device according to one embodiment of the present disclosure comprises a light-emitting element having a rectangular shape in top view, having a first conductive member, a second conductive member spaced apart from the first conductive member, a semiconductor laminate, a first electrode disposed between the lower surface of the semiconductor laminate and the upper surface of the first conductive member, and a second electrode disposed between the lower surface of the semiconductor laminate and the upper surface of the second conductive member, and comprising a first joining member that joins the first conductive member and the first electrode, and a second joining member that joins the second conductive member and the second electrode, wherein the upper surface of the first conductive member has a first planar portion and a small portion around the first electrode in top view The first bonding member is positioned in part and has a first recess that is recessed from the first planar portion of the first conductive member toward the lower surface side of the first conductive member, the first recess having a first portion that overlaps with the outer circumference of the first electrode in a top view and a second portion that does not overlap with the outer circumference of the first electrode, the second portion being separated from the first corner of the light-emitting element that overlaps with the first conductive member in a top view, and the part of the first bonding member is positioned in the first planar portion between the second portion and the first corner of the light-emitting element in a top view, and is positioned in a first exposed region that is exposed from the light-emitting element. [Effects of the Invention]

[0006] According to one embodiment of the present disclosure, heat dissipation can be improved and the light-emitting element can be positioned in the intended location. [Brief explanation of the drawing]

[0007] [Figure 1] This is a schematic top view showing a light-emitting device according to an embodiment. [Figure 2] This is a schematic top view showing the portion of the light-emitting device according to the embodiment, excluding the light-transmitting member. [Figure 3A] This is a schematic top view showing the first conductive member, the second conductive member, and the protective element included in the light-emitting device according to the embodiment. [Figure 3B] This is a schematic top view showing the first conductive member, the second conductive member, and the protective element included in the light-emitting device according to the embodiment. [Figure 4]Figure 1 is a schematic cross-sectional view showing the light-emitting device in the IV-IV line. [Figure 5] This is a schematic partial top view showing a portion of the first conductive member in region V of Figure 3B. [Figure 6] This is a schematic partial cross-sectional view showing a portion of the first conductive member along the VI-VI line in Figure 3A. [Figure 7] This is a schematic partial cross-sectional view showing a portion of the light-emitting device along line VII-VII in Figure 1. [Modes for carrying out the invention]

[0008] The light-emitting device according to the embodiments of this disclosure will be described in detail below with reference to the drawings. However, the embodiments shown below are illustrative of light-emitting devices that embody the technical concept of the embodiments and are not limited thereto. Furthermore, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of this disclosure to those described therein, unless otherwise specified, but are merely illustrative examples. Note that the size, positional relationships, etc. of the members shown in each drawing may be exaggerated for clarity of explanation. Also, in the following description, the same name and reference numerals indicate the same or similar members, and detailed explanations will be omitted as appropriate. In some cases, end view diagrams showing only the cross-section may be used as cross-sectional views.

[0009] In the diagrams shown below, directions are sometimes indicated by the X, Y, and Z axes. The X, Y, and Z axes are mutually orthogonal. In the X-axis direction, the direction the arrow is pointing is denoted as the +X side, and the opposite direction is denoted as the -X side. In the Y-axis direction, the direction the arrow is pointing is denoted as the +Y side, and the opposite direction is denoted as the -Y side. In the Z-axis direction, the direction the arrow is pointing is denoted as upward or the +Z side, and the opposite direction is denoted as downward or the -Z side.

[0010] Furthermore, in the terminology of the embodiments, "top view" refers to viewing the object from the +Z side. However, these do not restrict the orientation of the light-emitting device when it is in use, and the orientation of the light-emitting device is arbitrary. Also, in the embodiments, the +Z side surface (i.e., the surface of the object when viewed from the +Z side) is referred to as the "top surface," and the -Z side surface (i.e., the surface of the object when viewed from the -Z side) is referred to as the "bottom surface." In the embodiments shown below, "parallel" includes the case where two lines, surfaces, etc., have an inclination within a range of ±5°.

[0011] Furthermore, in this disclosure, unless otherwise specified, polygons such as rectangles shall be referred to as polygons, including shapes with chamfered or other processing applied to their corners. Similarly, shapes with processing applied not only to the corners (i.e., the ends of the sides) but also to the middle parts of the sides shall also be referred to as polygons. In other words, shapes that retain a polygonal base but have undergone partial processing shall be included in the interpretation of "polygon" as described in this disclosure. In addition, in this disclosure, "inside" refers to the side closer to the center of the light-emitting device when viewed from above, and "outside" refers to the side further away from the center of the light-emitting device when viewed from above.

[0012] Furthermore, "covering" is not limited to direct contact, but also includes indirectly covering, for example, through other components. Similarly, "arranging" is not limited to direct contact, but also includes indirectly arranging, for example, through other components.

[0013] [Embodiment] Referring to FIGS. 1 to 7, an example of the configuration of the light-emitting device 1 according to the embodiment will be described. FIG. 1 is a top view schematically showing the light-emitting device 1 according to the embodiment. FIG. 2 is a top view schematically showing a portion of the light-emitting device 1 excluding the light-transmissive member 70. FIGS. 3A and 3B are top views schematically showing the first conductive member 10, the second conductive member 20, and the protection element 90 included in the light-emitting device 1 according to the embodiment. FIG. 4 is a cross-sectional view schematically showing the light-emitting device 1 taken along line IV-IV in FIG. 1. FIG. 5 is a partial top view showing a part of the first conductive member 10 in region V in FIG. 3B. FIG. 6 is a partial cross-sectional view schematically showing a part of the first conductive member 10 taken along line VI-VI in FIG. 3A. FIG. 7 is a partial cross-sectional view schematically showing a part of the light-emitting device taken along line VII-VII in FIG. 1. In FIGS. 3A and 5, the outer perimeters of the semiconductor laminate 31, the first electrode 32, and the second electrode 33 of the light-emitting element 30 included in the light-emitting device 1 are each indicated by a dashed line. In the examples shown in FIGS. 3A and 5, in a top view, the outer perimeter of the semiconductor laminate 31 overlaps with the outer perimeter of the light-emitting element 30.

[0014] As shown in FIGS. 1 to 4, the light-emitting device 1 includes a first conductive member 10, a second conductive member 20, a light-emitting element 30, a first joining member 40, and a second joining member 50. In the examples shown in FIGS. 1 and 4, the light-emitting device 1 further includes a covering member 60, a light-transmissive member 70, a light guide member 80, and a protection element 90.

[0015] As shown in FIGS. 2 to 4, the first conductive member 10 and the second conductive member 20 are spaced apart in the X-axis direction. The light-emitting element 30 is disposed so as to straddle the first conductive member 10 and the second conductive member 20. The light-emitting element 30 has a semiconductor laminate 31, a first electrode 32 disposed between the lower surface 31b of the semiconductor laminate 31 and the upper surface 11 of the first conductive member 10 in the Z-axis direction, and a second electrode 33 disposed between the lower surface 31b of the semiconductor laminate 31 and the upper surface 21 of the second conductive member 20 in the Z-axis direction. As shown in FIGS. 2 and 3A, the light-emitting element 30 has a rectangular shape in a top view. The first electrode 32 and the second electrode 33 also have a rectangular shape in a top view.

[0016] As shown in Figures 3A and 3B, the upper surface 11 of the first conductive member 10 has a first flat portion 14 and a first recess 15. The first recess 15 is recessed from the first flat portion 14 toward the lower surface 12 of the first conductive member 10 (see Figure 4). The first recess 15 is also located in at least a portion of the periphery of the first electrode 32 when viewed from above. In the example shown in Figure 3A, the first recess 15 is located in the -X side portion 32b of the first electrode 32, a portion of the +Y side portion 32c of the first electrode 32, and a portion of the -Y side portion 32d of the first electrode 32. That is, the first recess 15 is not located in the +X side portion 32a of the first electrode 32 (the portion of the outer circumference of the first electrode 32 toward the second conductive member 20), another portion of the +Y side portion 32c of the first electrode 32, or another portion of the -Y side portion 32d of the first electrode 32.

[0017] As shown in Figure 4, the first joining member 40 joins the first conductive member 10 and the first electrode 32. The second joining member 50 joins the second conductive member 20 and the second electrode 33. As shown in Figure 7, the first joining member 40 has a portion located outside the light-emitting element 30. The second joining member 50 also has a portion located outside the light-emitting element 30, similar to the first joining member 40.

[0018] As shown in Figure 3A, the first recess 15 has a first portion 151 and a second portion 152. The first portion 151 includes a portion that overlaps with the outer circumference of the first electrode 32 in a top view. On the other hand, the second portion 152 does not overlap with the outer circumference of the first electrode 32 in a top view and is separated from the first corners 30c1 and 30c2 of the light-emitting element 30 that overlap with the first conductive member 10 in a top view. A part of the first joining member 40 is located in the first planar portion 14, between the second portion 152 and the first corners 30c1 and 30c2 of the light-emitting element 30 in a top view, and is positioned in the first exposed regions 14c1 and 14c2 that are exposed from the light-emitting element 30. The first corners 30c1 and 30c2 of the light-emitting element 30 refer to the intersection points of the sides that form the outer shape of the light-emitting element 30 in the region that overlaps with the first conductive member 10 of the light-emitting element 30 when viewed from above.

[0019] When molten materials are used as the first joining member 40 and the second joining member 50, the light-emitting element 30 is placed on the first conductive member 10 and the second conductive member 20 via the first joining member 40 and the second joining member 50, and the first joining member 40 and the second joining member 50 are heated and melted, and then cooled. As a result, the light-emitting element 30 is joined to the first conductive member 10 and the second conductive member 20 via the first joining member 40 and the second joining member 50.

[0020] According to the light-emitting device 1, since the first recess 15 has a first portion 151, the possibility that the first bonding member 40, which melts when the light-emitting element 30 is bonded, will wet and spread from the region of the first planar portion 14 that overlaps with the first electrode 32 in a top view into the first recess 15 can be reduced. As a result, the wetting and spreading of the first bonding member 40 can be reduced, and as a result, the possibility that the light-emitting element 30 may shift from its intended position due to the wetting and spreading of the first bonding member 40 can be reduced. Furthermore, according to the light-emitting device 1, since a part of the first bonding member 40 is arranged in the first exposed regions 14c1 and 14c2, the contact area between the first conductive member 10 and the first bonding member 40 can be increased. As a result, the heat generated in the light-emitting element 30 can be efficiently dissipated to the first conductive member 10 side via the first bonding member 40. As a result, the heat dissipation performance of the light-emitting device 1 can be improved.

[0021] The following describes each component that makes up the light-emitting device 1.

[0022] <First conductive member 10, second conductive member 20> The first conductive member 10 and the second conductive member 20 are conductive members for supplying power to the light-emitting element 30. In the examples shown in Figures 1 to 4, the first conductive member 10 and the second conductive member 20 are plate-shaped members patterned into a predetermined shape. In the examples shown in Figures 1 to 4, the light-emitting device 1 comprises two conductive members, the first conductive member 10 and the second conductive member 20. However, the number of conductive members provided in the light-emitting device 1 may be three or more. Also, in the examples shown in Figures 3A, 3B, and 4, the first conductive member 10 is positioned on the -X side, and the second conductive member 20 is positioned on the +X side. However, the positional relationship between the first conductive member 10 and the second conductive member 20 in the X-axis direction may be reversed.

[0023] Each of the first conductive member 10 and the second conductive member 20 may have a substrate and a plating layer disposed on the surface of the substrate. Examples of materials constituting the substrate include copper (Cu), aluminum (Al), silver (Ag), gold (Au), zinc (Zn), chromium (Cr), tungsten (W), cobalt (Co), nickel (Ni), rhodium (Rh), ruthenium (Ru), and alloys thereof. The substrate may also contain trace elements such as nonmetals like silicon (Si) and phosphorus (P). The substrate may have a single-layer structure or a laminated structure composed of these metals or alloys.

[0024] The plating layer is preferably composed of a material with a higher reflectivity than the substrate. Examples of materials that make up the plating layer include Ni, Ag, Au, platinum (Pt), palladium (Pd), Al, W, molybdenum (Mo), Ru, and Rh. The plating layer may be a single-layer structure or a multilayer structure composed of these metals. Examples of multilayer plating layers include Ni / Pd / Au (i.e., a plating layer laminated in the order of Ni, Pd, and Au from the substrate side), Ni / Pt / Au (i.e., a plating layer laminated in the order of Ni, Pt, and Au from the substrate side), and Ni / Au / Ag (i.e., a plating layer laminated in the order of Ni, Au, and Ag from the substrate side).

[0025] As shown in Figures 3A, 3B, and 4, the first conductive member 10 has an upper surface 11, a lower surface 12 located opposite the upper surface 11 in the Z-axis direction, and a plurality of side surfaces located between the upper surface 11 and the lower surface 12 in the Z-axis direction. The upper surface 11 of the first conductive member 10 has a first flat portion 14 and a first recess 15. The entire first flat portion 14 is a flat surface parallel to the X-axis and Y-axis directions. However, it is not limited to this, and the entire first flat portion 14 may be a rough surface. Alternatively, a part of the first flat portion 14 may be a flat surface, and the other part of the first flat portion 14 may be a rough surface. If the first flat portion 14 includes a rough surface, the surface roughness of the first flat portion 14 is less than the maximum distance (depth) of the first recess 15 in the Z-axis direction.

[0026] (First plane part 14) In the examples shown in Figures 3A and 3B, the first planar portion 14 includes a first region 141 and a second region 142. The first region 141 is the region of the first planar portion 14 that is located inside the second region 142 when viewed from above.

[0027] In the examples shown in Figures 3A and 3B, the first region 141 includes an inner region 141a, a first outer region 141b, a second outer region 141c, and a third outer region 141d. However, the configuration of the first region 141 is not limited to the examples shown in Figures 3A and 3B. For example, the first region 141 may include an inner region 141a, a first outer region 141b, and a second outer region 141c, but may not include a third outer region 141d. Also, the first region 141 may include other outer regions that are continuous with the inner region 141a.

[0028] The inner region 141a is located closer to the second conductive member 20 than the first outer region 141b, the second outer region 141c, and the third outer region 141d. The outer circumference of the inner region 141a coincides with the outer circumference of the first electrode 32 when viewed from above. In the examples shown in Figures 3A and 3B, the inner region 141a has a rectangular shape when viewed from above. That is, as shown in Figure 3B, the outer perimeter of the inner region 141a in a top view is defined by the first side 141a1, the second side 141a2, the third side 141a3, the fourth side 141a4, the fifth side 141a5, a virtual first extension line 141a6 from the second side 141a2 toward the +Y side, a virtual second extension line 141a7 from the third side 141a3 toward the -Y side, a virtual third extension line 141a8 between the second side 141a2 and the third side 141a3 in the Y-axis direction, a virtual fourth extension line 141a9 from the fourth side 141a4 toward the -X side, and a virtual fifth extension line 141a10 from the fifth side 141a5 toward the -X side. Furthermore, the intersection point of the first extension line 141a6 and the fourth extension line 141a9 will be referred to as "intersection point 141r1" below. The intersection of the second extension line 141a7 and the fifth extension line 141a10 will hereafter be referred to as "intersection 141r2".

[0029] As shown in Figure 3B, the inner region 141a has multiple sides. Of the multiple sides of the inner region 141a, the side located on the second conductive member 20 side is the first side 141a1. Of the multiple sides of the inner region 141a, the sides located on the opposite side of the first side 141a1 in the X-axis direction are the second side 141a2 and the third side 141a3. Also, of the multiple sides of the inner region 141a, the side located between the first side 141a1 and the second side 141a2 is the fourth side 141a4. Of the multiple sides of the inner region 141a, the side located between the first side 141a1 and the third side 141a3 is the fifth side 141a5.

[0030] In the example shown in Figure 3B, the first side 141a1 of the inner region 141a overlaps with the portion 13a of the outer circumference of the first conductive member 10 on the second conductive member 20 side (the +X side end of the first conductive member 10, hereinafter sometimes referred to as "portion 13a of the first conductive member 10") when viewed from above. Also, the first side 141a1 of the inner region 141a overlaps with the portion 32a of the outer circumference of the first electrode 32 on the second conductive member 20 side (hereinafter sometimes referred to as "portion 32a of the first electrode 32") when viewed from above. Therefore, portion 32a of the first electrode 32 and the inner region 141a overlap with portion 13a of the first conductive member 10 when viewed from above. However, this is not limited to this case; portion 32a of the first electrode 32 and the inner region 141a do not necessarily have to overlap with portion 13a of the first conductive member 10 when viewed from above. For example, portion 32a and inner region 141a of the first electrode 32 may be located -X side of portion 13a of the first conductive member 10 in a top view. In this case, the region between portion 32a (or inner region 141a) of the first electrode 32 and portion 13a of the first conductive member 10 may be composed of a first planar portion 14 and / or a first recess 15. If the region between portion 32a (or inner region 141a) of the first electrode 32 and portion 13a of the first conductive member 10 is composed of a first recess 15, the first recess 15 may be arranged in a ring shape surrounding the first electrode 32.

[0031] Furthermore, in the example shown in Figure 4, the inner end portion 40a of the first bonding member 40 overlaps with portion 32a of the first electrode 32 in the Z-axis direction. That is, the inner end portion 40a of the first bonding member 40 overlaps with portion 13a of the first conductive member 10. As a result, the surface tension at the inner end portion 40a of the first bonding member 40 reduces the possibility that the first bonding member 40 will flow onto the side surface of the first conductive member 10 facing the second conductive member 20 during bonding of the light-emitting element 30. Consequently, the possibility of the light-emitting element 30 shifting from its intended position in the X-axis direction can be reduced.

[0032] As shown in Figure 5, in a top view, the sum of the length L1 overlapping the first portion 151 on the second side 141a2 of the inner region 141a and the length L2 overlapping the first portion 151 on the third side 141a3 is preferably 0.4 to 0.7 times the length L3 of the -X side portion 32b of the first electrode 32 (i.e., the portion of the outer circumference of the first electrode 32 opposite to the second conductive member 20). If the sum of length L1 and length L2 is 0.4 times or more of length L3, the area in which the possibility of the first bonding member 40 wetting and spreading from the first planar portion 14 to the first recess 15 can be reduced during bonding of the light-emitting element 30 increases. This reduces the possibility that the light-emitting element 30 may shift from its intended position due to the wetting and spreading of the first bonding member 40. On the other hand, if the sum of length L1 and length L2 is 0.7 times or less of length L3, the first exposed regions 14c1, 14c2 and the second exposed region 14d increase. That is, the combined length of lengths L4, L5, and L6 shown in Figure 5 increases. This makes it possible to increase the number of first bonding members 40 that are placed in the first exposed regions 14c1, 14c2, and the second exposed region 14d. As a result, the contact area between the first conductive member 10 and the first bonding member 40 increases, improving the heat dissipation of the light-emitting device 1. If the first region 141 does not include the third outer region 141d, it is preferable that the sum of length L1 and length L2 is 0.5 times or more and 0.8 times or less of length L3. This reduces the possibility of the light-emitting element 30 shifting from the intended position and improves the heat dissipation of the light-emitting device 1. In Figure 5, the first exposed regions 14c1, 14c2 and the second exposed region 14d are shown with a dense dot pattern, while the first recessed area 15 is shown with a sparse dot pattern.

[0033] In the examples shown in Figures 3A and 3B, the outer circumference of the inner region 141a coincides with the outer circumference of the first electrode 32 in a top view, and the inner region 141a is the same size as the first electrode 32. However, the inner region 141a may be smaller than the first electrode 32 in a top view. In this case, for example, in a top view, a part of the first electrode 32 (the +X side portion 32a) overlaps with the inner region 141a, and another part of the first electrode 32 (the -X side portion 32b) overlaps with the first recess 15.

[0034] The first outer region 141b, the second outer region 141c, and the third outer region 141d are each continuous with the outer perimeter of the inner region 141a and extend outward from the inner region 141a.

[0035] As shown in Figure 3B, the first outer region 141b can be tangent to the intersection point 141r1.

[0036] As shown in Figure 3A, the first outer region 141b includes the first exposed region 14c1. In Figure 3A, the first exposed region 14c1 is shown with a dense dot pattern. In the example shown in Figure 3A, the first exposed region 14c1 has a portion extending in the X-axis direction at the +Y-side end of the first outer region 141b, and a portion extending in the Y-axis direction at the -X-side end of the first outer region 141b. A portion of the first joining member 40 is positioned in the portion of the first exposed region 14c1 that extends in the X-axis direction and / or the portion that extends in the Y-axis direction. By positioning a portion of the first joining member 40 in the portion of the first exposed region 14c1 that extends in the X-axis direction and the portion that extends in the Y-axis direction, the heat dissipation of the light-emitting device 1 can be further improved. Furthermore, because the first bonding member 40 is positioned in the first exposed region 14c1, it can be inferred that the first bonding member 40 is present over a wide area of ​​the first electrode 32 (specifically, it extends to the outer circumference of the first electrode 32). The position of the first bonding member 40 in the first exposed region 14c1 can be confirmed, for example, by visual inspection from above. Therefore, the quality of the bonding of the light-emitting element 30 can be determined by simple means such as visual inspection.

[0037] The first exposed region 14c1 overlaps with the first corner 30c1 of the light-emitting element 30 in a top view. In a top view, the overlap of the first exposed region 14c1 with the first corner 30c1 of the light-emitting element 30 causes the first bonding member 40 to wet and spread over the first exposed region 14c1, and is positioned outside the outer circumference of the first electrode 32.

[0038] As shown in Figure 5, in a top view, the width W1 of the first exposed area 14c1 is preferably 0.5 times or more and 0.75 times or less the distance W2 between the outer circumference of the light-emitting element 30 and the outer circumference of the first electrode 32. If the width W1 of the first exposed area 14c1 is 0.5 times or more the distance W2 between the outer circumference of the light-emitting element 30 and the outer circumference of the first electrode 32, it becomes easier to visually confirm that the first bonding member 40 has spread wetting outward from the outer circumference of the light-emitting element 30 in a top view. On the other hand, if the width W1 of the first exposed area 14c1 is 0.75 times or less the distance W2 between the outer circumference of the light-emitting element 30 and the outer circumference of the first electrode 32, the possibility of the first bonding member 40 excessively wetting into the first outer area 141b during bonding of the light-emitting element 30 can be reduced. This reduces the possibility of tilting of the light-emitting element 30 with respect to the Z-axis direction. Note that "width W1 of the first exposed area 14c1" means the minimum width of the first exposed area 14c1. Furthermore, "the distance W2 between the outer circumference of the light-emitting element 30 and the outer circumference of the first electrode 32" refers to the minimum distance between the outer circumference of the light-emitting element 30 and the outer circumference of the first electrode 32.

[0039] As shown in Figure 3B, the second outer region 141c can be in contact with the intersection 141r2. Also, as shown in Figure 3A, the second outer region 141c overlaps with the first corner 30c2 of the light-emitting element 30 in a top view. Furthermore, the second outer region 141c can include the first exposed region 14c2. In Figure 3A, the first exposed region 14c2 is shown with a dense dot pattern. The other configurations of the second outer region 141c are the same as those of the first outer region 141b. Therefore, a description of the other configurations of the second outer region 141c is omitted.

[0040] The third outer region 141d is separated from the first outer region 141b and the second outer region 141c, and is located between the first outer region 141b and the second outer region 141c in the Y-axis direction. The third outer region 141d extends to the -X side from the second side 141a2 of the inner region 141a.

[0041] The third outer region 141d is located outside the outer circumference of the light-emitting element 30 in a top view and may include a second exposed region 14d that is exposed from the light-emitting element 30. By arranging the first bonding member 40 in the second exposed region 14d, the heat dissipation of the light-emitting device 1 can be improved. In Figure 3A, the second exposed region 14d is shown as a dense dot pattern.

[0042] In the examples shown in Figures 3A and 3B, the area of ​​the second exposure region 14d is smaller than the areas of the first exposure regions 14c1 and 14c2, respectively. However, the area of ​​the second exposure region 14d may be greater than or equal to the areas of the first exposure regions 14c1 and 14c2, respectively.

[0043] The second region 142 is a region of the first planar portion 14 that is located outside the first region 141. In the example shown in Figure 3A, the second region 142 has a portion 142a located on the +Y side of the first region 141 and extending in the X-axis direction, a portion 142b located on the -X side of the first region 141 and extending in the Y-axis direction, and a portion 142c located on the -Y side of the first region 141 and extending in the X-axis direction. Portion 142a is continuous with the +Y side end of portion 142b. Portion 142c is continuous with the -Y side end of portion 142b.

[0044] (First recess 15) As explained with reference to Figures 3A and 3B, the first recess 15 is positioned in at least a portion of the periphery of the first electrode 32 in a top view. Since the first region 141 and the second region 142 of the first planar portion 14 are separated by the first recess 15, the possibility of the first bonding member 40 positioned in the first region 141 wetting and spreading into the second region 142 during bonding of the light-emitting element 30 can be reduced. As a result, the first bonding member 40 remains within the first region 141, thereby reducing the wetting and spreading of the first bonding member 40. Consequently, the possibility of the light-emitting element 30 shifting from its intended position due to the wetting and spreading of the first bonding member 40 can be reduced. Furthermore, by the first bonding member 40 remaining within the first region 141, the possibility of a decrease in the thickness of the first bonding member 40 due to the wetting and spreading of the first bonding member 40 can be reduced. This reduces the possibility of the light-emitting element 30 tilting in the Z-axis direction. In Figure 3A, the first recess 15 is shown as a sparse dot pattern.

[0045] The first recess 15 has, in a top view, a first portion 151 which includes a portion that overlaps with the outer circumference of the first electrode 32, and a second portion 152 which does not overlap with the outer circumference of the first electrode 32 and is separated from the first corners 30c1 and 30c2 of the light-emitting element 30. In a top view, the first portion 151 includes a portion that overlaps with the outer circumference of the first electrode 32, while the second portion 152 does not overlap with the outer circumference of the first electrode 32, so that a region extending outward from the outer circumference of the first electrode 32 (in the example shown in Figures 3A and 3B, the first outer region 141b and the second outer region 141c) can be provided on the first planar portion 14. Furthermore, by separating the second portion 152 from the first corners 30c1 and 30c2 of the light-emitting element 30, first exposed regions 14c1 and 14c2 that are exposed from the light-emitting element 30 can be provided in the region extending outward from the outer circumference of the first electrode 32 (in the example shown in Figures 3A and 3B, the first outer region 141b and the second outer region 141c).

[0046] As shown in Figure 4, in a cross-sectional view, the maximum depth of the first recess 15 (in the example shown in Figure 4, the depth D1 of the first portion 151) is preferably 0.25 times or more and 0.75 times or less the thickness T1 of the first conductive member 10. If the maximum depth of the first recess 15 is 0.25 times or more the thickness T1 of the first conductive member 10, the strength of the first conductive member 10 can be ensured. On the other hand, if the maximum depth of the first recess 15 is 0.75 times or less the thickness T1 of the first conductive member 10, the possibility of the first joining member 40 wetting and spreading from the first flat portion 14 to the first recess 15 during the joining of the light-emitting element 30 can be reduced.

[0047] As shown in Figure 6, in a cross-sectional view, it is preferable that the depth D1 of the first portion 151 is deeper than the depth D2 of the second portion 152. This reduces the possibility that the first joining member 40 will spread to the second portion 152 when the light-emitting element 30 is joined. The depth D2 of the second portion 152 is, for example, 0.5 to 0.9 times the depth D1 of the first portion 151.

[0048] In the example shown in Figure 5, the width W3 of the first part 151 in the Y-axis direction is greater than the width W4 of the second part 152 in the Y-axis direction. This increases the contact area between the first conductive member 10 and the covering member 60, which will be described later, compared to the case where the width W3 of the first part 151 in the Y-axis direction is the same as the width W4 of the second part 152 in the Y-axis direction. As a result, the adhesion between the first conductive member 10 and the covering member 60 can be improved. Note that "width W3 of the first part 151 in the Y-axis direction" means the minimum width of the first part 151 in the Y-axis direction. Also, "width W4 of the second part 152 in the Y-axis direction" means the minimum width of the second part 152 in the Y-axis direction.

[0049] As shown in Figure 3A, the first recess 15 may further have a third portion 153. In the example shown in Figure 3A, the third portion 153 is separated from the portion 30c3 located between the two first corners 30c1 and 30c2 on the outer circumference of the light-emitting element 30. By separating the third portion 153 from the portion 30c3 on the outer circumference of the light-emitting element 30, an additional region (second exposed region 14d) extending outward from the outer circumference of the light-emitting element 30 can be provided on the first planar portion 14. A portion of the first joining member 40 may be placed in the second exposed region 14d. This can improve the heat dissipation of the light-emitting device 1.

[0050] (Protruding part 16, through part 17) In the example shown in Figures 3A and 3B, the first conductive member 10 further includes a protrusion 16 and a through-hole 17. The protrusion 16 is a portion for connecting the first conductive member 10, before it is separated into individual pieces, to other conductive members. The protrusion 16 projects outward from the outer circumference of the second region 142 of the first planar portion 14.

[0051] The through-hole 17 is located on the +X side of the first recess 15 in a top view and overlaps with the outer circumference of the first electrode 32. The through-hole 17 penetrates the first conductive member 10 in the Z-axis direction, and a part of the side surface defining the through-hole 17 is open. That is, as shown in Figure 3A, the +X side (second conductive member 20 side) of the through-hole 17 is open in a top view. The presence of the through-hole 17 in the first conductive member 10 reduces the possibility that the first bonding member 40, which melted during the bonding of the light-emitting element 30, will spread from the first region 141 of the first planar portion 14 to the through-hole 17 in a top view.

[0052] The second conductive member 20 is separated from the first conductive member 10. As shown in Figure 4, the second conductive member 20 may have an upper surface 21, a lower surface 22, and a plurality of side surfaces located between the upper surface 21 and the lower surface 22 in the Z-axis direction. The upper surface 21 of the second conductive member 20 has a second planar portion 24 and a second recess 25. The second recess 25 is positioned in at least a portion of the periphery of the second electrode 33 in a top view. The second recess 25 also has a fourth portion 251 that overlaps with the outer circumference of the second electrode 33 in a top view, and a fifth portion 252 that does not overlap with the outer circumference of the second electrode 33. The fifth portion 252 is separated from the second corners 30d1 and 30d2 of the light-emitting element 30 that overlap with the second conductive member 20 in a top view. A portion of the second connecting member 50 is located in the second planar portion 24, in a top view, between the fifth portion 252 and the second corners 30d1, 30d2 of the light-emitting element 30, and is positioned in the third exposed regions 24c1, 24c2 that are exposed from the light-emitting element 30. The other configurations of the second conductive member 20 are the same as those of the first conductive member 10. Therefore, a description of the other configurations of the second conductive member 20 is omitted. In Figures 3A and 5, the third exposed regions 24c1, 24c2 are shown with a dense dot pattern. In Figure 3A, the second recess 25 is shown with a sparse dot pattern.

[0053] <light-emitting element 30> The light-emitting element 30 is a semiconductor device that emits light on its own when a voltage is applied to it. An example of the light-emitting element 30 is an LED (Light Emitting Diode) chip. The light-emitting element 30 has a rectangular shape when viewed from above.

[0054] In the example shown in Figure 4, the light-emitting element 30 has a semiconductor laminate 31, a first electrode 32, and a second electrode 33, as well as an element substrate 34. The element substrate 34 is placed on the semiconductor laminate 31. The element substrate 34 is translucent. Here, in this specification, "translucent" means having a transmittance of at least 60%, preferably 80%, or more for light emitted by, for example, the light-emitting element 30. Examples of materials constituting the element substrate 34 include sapphire, spinel, glass, aluminum nitride, and silicon carbide. However, the light-emitting element 30 does not necessarily have an element substrate 34.

[0055] As shown in Figure 4, the semiconductor laminate 31 may have an upper surface 31a, a lower surface 31b, and a plurality of sides located between the upper surface 31a and the lower surface 31b in the Z-axis direction.

[0056] The semiconductor laminate 31 comprises a first semiconductor layer, an emissive layer, and a second semiconductor layer. The first semiconductor layer, the emissive layer, and the second semiconductor layer are stacked in the Z-axis direction. The first semiconductor layer and the second semiconductor layer have different conductivity types. For example, if the first semiconductor layer is an n-type semiconductor layer, the second semiconductor layer is a p-type semiconductor layer. If the first semiconductor layer is a p-type semiconductor layer, the second semiconductor layer is an n-type semiconductor layer. One of the first and second semiconductor layers is electrically connected to the first electrode 32. The other of the first and second semiconductor layers is electrically connected to the second electrode 33. The emissive layer may have a single quantum well (SQW) structure or a multi-quantum well (MQW) structure including multiple well layers.

[0057] Each of the first semiconductor layer, the light-emitting layer, and the second semiconductor layer is, for example, a semiconductor layer made of a nitride semiconductor. Nitride semiconductors are made of In x Al y Ga 1-x-yThe semiconductor comprises all compositions in which the composition ratios x and y are varied within their respective ranges in the chemical formula N (0 ≤ x, 0 ≤ y, x + y ≤ 1). The emission peak wavelength of the light-emitting layer can be appropriately selected depending on the purpose. The light-emitting layer is configured to emit, for example, visible light or ultraviolet light.

[0058] When a structure including a first semiconductor layer, an emissive layer, and a second semiconductor layer is considered as a single laminate, the semiconductor laminate 31 may comprise multiple laminates. In this case, for example, the multiple laminates may be stacked sequentially in the Z-axis direction. The multiple emissive layers comprising each of the multiple laminates may include well layers with different emission peak wavelengths, or they may include well layers with the same emission peak wavelength.

[0059] The combination of emission peak wavelengths of multiple laminates can be selected as appropriate. For example, if the semiconductor laminate 31 comprises two laminates, possible combinations of light emitted by the light-emitting layers of each laminate include blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, ultraviolet light and blue light, blue light and green light, blue light and red light, or green light and red light. For example, if the semiconductor laminate 31 comprises three laminates, possible combinations of light emitted by the light-emitting layers of each laminate include blue light, green light, and red light.

[0060] As shown in Figure 4, the first electrode 32 and the second electrode 33 are separated in the X-axis direction. The first electrode 32 is positioned in the Z-axis direction between the lower surface 31b of the semiconductor laminate 31 and the first planar portion 14 (first region 141) on the upper surface 11 of the first conductive member 10. The second electrode 33 is positioned in the Z-axis direction between the lower surface 31b of the semiconductor laminate 31 and the second planar portion 24 on the upper surface 21 of the second conductive member 20.

[0061] Examples of materials constituting the first electrode 32 and the second electrode 33 include metals such as Au, Ag, Cu, Al, Ni, Rh, Ti, Pt, Pd, Mo, Cr, and W, and alloys containing these metals. The first electrode 32 and the second electrode 33 may each have a single-layer structure composed of these metals or alloys, or a laminated structure in which multiple layers composed of these metals or alloys are stacked.

[0062] In the X-axis direction, the distance W2 between the outer circumference of the light-emitting element 30 and the outer circumference of the first electrode 32 is preferably 0.01 times or more and 0.1 times or less the width of the light-emitting element 30. If the distance W2 between the outer circumference of the light-emitting element 30 and the outer circumference of the first electrode 32 in the X-axis direction is 0.01 times or more the width of the light-emitting element 30, the possibility of the first bonding member 40 crawling up onto the side surface of the semiconductor laminate 31 of the light-emitting element 30 when the first bonding member 40 wets and spreads during bonding of the light-emitting element 30 can be reduced. This reduces the possibility of a short circuit in the light-emitting element 30. On the other hand, if the distance W2 between the outer circumference of the light-emitting element 30 and the outer circumference of the first electrode 32 in the X-axis direction is 0.1 times or less the width of the light-emitting element 30, the first bonding member 40 can reach the first exposed region 14c1 when the first bonding member 40 wets and spreads during bonding of the light-emitting element 30.

[0063] <First joining member 40, second joining member 50> As shown in Figure 4, the first joining member 40 is positioned in the Z-axis direction between the first planar portion 14 (first region 141) on the upper surface 11 of the first conductive member 10 and the lower surface of the first electrode 32. The second joining member 50 is positioned in the Z-axis direction between the second planar portion 24 on the upper surface 21 of the second conductive member 20 and the lower surface of the second electrode 33.

[0064] As examples of materials constituting the first joining member 40 and the second joining member 50, molten materials can be used. Examples of molten materials include alloys such as Au-Sn, Sn-Ag-Cu, Sn-Cu, Sn-Sb, Sn-Bi, Sn-In, Sn-Pb, and Ni-Sn.

[0065] <Covering member 60> The covering member 60 is light-reflecting. The covering member 60 covers the first conductive member 10, the second conductive member 20, the light-emitting element 30, the first joining member 40, and the second joining member 50 such that the lower surface 12 of the first conductive member 10 and the lower surface 22 of the second conductive member 20 are exposed. By exposing the lower surface 12 of the first conductive member 10 and the lower surface 22 of the second conductive member 20 from the covering member 60, the heat generated in the light-emitting element 30 can be more easily dissipated to the outside from the lower surfaces of the first conductive member 10 and the second conductive member 20. In addition, the covering member 60 covers the first recess 15 on the upper surface 11 of the first conductive member 10. As a result, the contact area between the first conductive member 10 and the covering member 60 is increased compared to the case where the first conductive member 10 does not have the first recess 15, thereby improving the adhesion between the first conductive member 10 and the covering member 60. Furthermore, by arranging the covering member 60 within the first recess 15, the volume of the covering member 60 in the light-emitting device 1 can be increased compared to the case where the first conductive member 10 does not have the first recess 15, thereby improving the light extraction efficiency of the light-emitting device 1.

[0066] As shown in Figure 4, the covering member 60 covers the side surface of the light-emitting element 30. This allows light emitted from the side surface of the light-emitting element 30 to be reflected to the upper surface of the light-emitting element 30, thereby improving the light extraction efficiency of the light-emitting device 1. In addition, a portion of the covering member 60 is positioned between the first electrode 32 and the second electrode 33, and between the first conductive member 10 and the second conductive member 20 in a cross-sectional view. This reduces the absorption of light emitted downward from the light-emitting element 30 by the first conductive member 10, the second conductive member 20, the first bonding member 40, and the second bonding member 50. As a result, the light extraction efficiency of the light-emitting device 1 can be improved.

[0067] The covering member 60 can have insulating properties. As shown in Figure 4, the covering member 60 is placed between the first electrode 32 and the second electrode 33, and between the first conductive member 10 and the second conductive member 20. Therefore, the possibility of short circuits occurring between the first electrode 32 and the second electrode 33, and between the first conductive member 10 and the second conductive member 20 can be reduced.

[0068] Examples of materials constituting the coating member 60 include thermosetting resins. Examples of thermosetting resins include epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, polyester resins (e.g., unsaturated polyester resins), and urethane resins. The coating member 60 may also further contain light-reflecting particles. Examples of light-reflecting particles include inorganic particles such as titanium oxide, silicon oxide, aluminum oxide, zirconium oxide, magnesium oxide, potassium titanate, barium titanate, zinc oxide, silicon nitride, aluminum nitride, boron nitride, calcium carbonate, calcium hydroxide, and calcium silicate.

[0069] <Translucent member 70> The light-transmitting member 70 is placed on the light-emitting element 30 and is a light-transmitting member that transmits light emitted from the light-emitting element 30 and emits it to the outside. The light-transmitting member 70 is covered by the covering member 60 so that the upper surface of the light-transmitting member 70 is exposed. Of the light emitted from the light-emitting element 30, the light that passes through the side of the light-transmitting member 70 is reflected by the covering member 60 to the upper surface of the light-transmitting member 70.

[0070] In the example shown in Figure 4, the translucent member 70 has a laminated structure in which a translucent layer 71 and a wavelength conversion layer 72 are stacked. The wavelength conversion layer 72 is positioned on the -Z side of the translucent layer 71.

[0071] Examples of materials constituting the light-transmitting layer 71 include inorganic materials such as glass, ceramics, and sapphire, and organic materials such as resins or hybrid resins containing one or more of the following: silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, acrylic resin, phenolic resin, and fluororesin.

[0072] The wavelength conversion layer 72 includes, for example, a base material composed of a thermoplastic resin or a thermosetting resin, and a wavelength conversion material contained in the base material. The wavelength conversion material is configured to be able to convert at least a part of the light from the light emitting element 30. Thereby, the chromaticity adjustment of the light emitting device 1 becomes easy. The wavelength conversion material contained in the wavelength conversion layer 72 may be of one type or a plurality of types. As the wavelength conversion material, a phosphor can be used.

[0073] As the phosphor, yttrium aluminum garnet-based phosphors (for example, Y3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (for example, Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet-based phosphors (for example, Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (for example, Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (for example, Sr4Al 14 O 25 :Eu), chlorosilicate-based phosphors (for example, Ca8MgSi4O 16 Cl2:Eu), β-sialon-based phosphors (for example, (Si,Al)3(O,N)4:Eu), α-sialon phosphors (for example, Ca(Si,Al) 12 (O,N) 16 :Eu), SLA-based phosphors (for example, SrLiAl3N4:Eu), CASN-based phosphors (for example, CaAlSiN3:Eu) or SCASN-based phosphors (for example, (Sr,Ca)AlSiN3:Eu) and other nitride-based phosphors, KSF-based phosphors (for example, K2SiF6:Mn), KSAF-based phosphors (for example, K2(Si,Al)F6:Mn) or MGF-based phosphors (for example, 3.5MgO·0.5MgF2·GeO2:Mn) and other fluoride-based phosphors, phosphors having a perovskite structure (for example, CsPb(F,Cl,Br,I)3), or quantum dot phosphors (for example, CdSe, InP, AgInS2 or AgInSe2) etc. can be used.

[0074] However, the light-transmitting member 70 is not limited to having a laminated structure in which a light-transmitting layer 71 and a wavelength conversion layer 72 are laminated. The light-transmitting member 70 may be a single-layer structure having, for example, a base material made of the same material as the light-transmitting layer 71 and a wavelength conversion material contained in the base material. Furthermore, the light-emitting device 1 is not limited to having a light-transmitting member 70, and may not have a light-transmitting member 70.

[0075] <Light guide member 80> The light guide member 80 is a member for joining the light-emitting element 30 and the light-transmitting member 70. The light guide member 80 is positioned between the upper surface of the light-emitting element 30 and the lower surface of the light-transmitting member 70. As shown in Figure 4, the light guide member 80 can further cover the side surface of the semiconductor laminate 31. This allows the light guide member 80 to guide the light emitted from the side surface of the light-emitting element 30 to the light-transmitting member 70. As a result, the light extraction efficiency of the light-emitting device 1 can be improved. However, the light guide member 80 does not necessarily have to cover the side surface of the semiconductor laminate 31.

[0076] In the example shown in Figure 4, the light guide member 80 has a triangular cross-sectional shape in which the width in the X-axis direction increases as it extends upward. That is, the outer surface of the light guide member 80 is a straight line in cross-sectional view. However, the outer surface of the light guide member 80 may be a curve in cross-sectional view.

[0077] For example, a resin material can be used as the light guide member 80. As the resin material, a resin or hybrid resin containing one or more of the following can be used: silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, acrylic resin, fluororesin, etc.

[0078] <Protective element 90> The protection element 90 is connected in parallel with the light-emitting element 30. This reduces the voltage load applied between the first electrode 32 and the second electrode 33 of the light-emitting element 30 when an excessive voltage load is applied to the light-emitting element 30, thereby bypassing the current. The protection element 90 is, for example, a Zener diode. However, the protection element 90 is not limited to a Zener diode and may be other protection elements such as a varistor.

[0079] In the examples shown in Figures 3A and 3B, the protective element 90 is positioned on the upper surface 21 of the second conductive member 20. The protective element 90 is electrically connected to the first conductive member 10, for example, via a bonding wire 91. However, the protective element 90 may be positioned on the upper surface 11 of the first conductive member 10 and electrically connected to the second conductive member 20, for example, via a bonding wire 91. Alternatively, the protective element 90 may be positioned across the upper surface 11 of the first conductive member 10 and the upper surface 21 of the second conductive member 20.

[0080] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims.

[0081] The aspects of this disclosure are, for example, as follows: <Item 1> First conductive member and, A second conductive member separated from the first conductive member, A light-emitting element having a rectangular shape when viewed from above, comprising a semiconductor laminate, a first electrode disposed between the lower surface of the semiconductor laminate and the upper surface of the first conductive member, and a second electrode disposed between the lower surface of the semiconductor laminate and the upper surface of the second conductive member, A first joining member that joins the first conductive member and the first electrode, A second joining member that joins the second conductive member and the second electrode, Equipped with, The upper surface of the first conductive member has a first planar portion and a first recess that is located in at least a portion of the periphery of the first electrode in a top view and is recessed from the first planar portion of the first conductive member toward the lower surface of the first conductive member. The first recess, in a top view, has a first portion that includes a portion that overlaps with the outer circumference of the first electrode, and a second portion that does not overlap with the outer circumference of the first electrode. The second portion is spaced apart from the first corner of the light-emitting element that overlaps with the first conductive member in a top view, A portion of the first joining member is located in the first planar portion, in a top view, between the second portion and the first corner of the light-emitting element, and is positioned in the first exposed region exposed from the light-emitting element. Light-emitting device. <Item 2> In a cross-sectional view, the depth of the first portion is greater than the depth of the second portion. The light-emitting device described in item 1 above. <Item 3> The portion of the outer circumference of the first conductive member that is on the side of the second conductive member overlaps with the portion of the outer circumference of the first electrode that is on the side of the second conductive member when viewed from above. The light-emitting device described in item 1 or item 2 above. <Item 4> The first conductive member, the second conductive member, the light-emitting element, the first bonding member, and the second bonding member are further comprising a light-reflective covering member that covers them such that the lower surface of the first conductive member and the lower surface of the second conductive member are exposed. A light-emitting device according to any one of the above items <1> to <3>. <Item 5> The light-emitting element has two of the first corners, The first recess has a third portion that is separated from the portion of the outer circumference of the light-emitting element that is located between the two first corners, A portion of the first joining member is positioned in the first planar portion, in a top view, between the third portion and the light-emitting element, and is placed in a second exposed region that is exposed from the light-emitting element. A light-emitting device according to any one of the above items <1> to <4>. <Item 6> The upper surface of the second conductive member has a second planar portion and a second recess that is located in at least a portion of the periphery of the second electrode in a top view and is recessed from the second planar portion of the second conductive member toward the lower surface of the second conductive member, The second recess, in a top view, has a fourth portion that includes a portion that overlaps with the outer circumference of the second electrode, and a fifth portion that does not overlap with the outer circumference of the second electrode. The fifth portion is spaced apart from the second corner of the light-emitting element that overlaps with the second conductive member in a top view, A portion of the second joining member is located in the second planar portion, in a top view, between the fifth portion and the second corner of the light-emitting element, and is positioned in the third exposed region exposed from the light-emitting element. A light-emitting device according to any one of the above items <1> to <5>. [Explanation of Symbols]

[0082] 1. Light-emitting device 10 First conductive member 14 1st plane part 14c1,14c2 1st exposure area 14d 2nd exposure area 15. First recess 151 Part 1 152 Part 2 153 Part 3 20 Second conductive member 24 Second plane part 24c1,24c2 3rd exposure area 25 Second recess 251 Part 4 252 Part 5 30 light-emitting elements 30c1,30c2 1st corner 30d1,30d2 2nd corner 31 Semiconductor Stack 32 1st electrode 33 Second electrode 40 First Joining Member 50 Second Joining Member 60 Covering member 70 Translucent material 80 Light guide member 90 protective elements

Claims

1. First conductive member and A second conductive member separated from the first conductive member, A light-emitting element having a rectangular shape when viewed from above, comprising a semiconductor laminate, a first electrode disposed between the lower surface of the semiconductor laminate and the upper surface of the first conductive member, and a second electrode disposed between the lower surface of the semiconductor laminate and the upper surface of the second conductive member, A first joining member that joins the first conductive member and the first electrode, A second joining member that joins the second conductive member and the second electrode, Equipped with, The upper surface of the first conductive member has a first planar portion and a first recess that is located in at least a portion of the periphery of the first electrode in a top view and is recessed from the first planar portion of the first conductive member toward the lower surface of the first conductive member. The first recess, in a top view, has a first portion that includes a portion that overlaps with the outer circumference of the first electrode, and a second portion that does not overlap with the outer circumference of the first electrode. The second portion is spaced apart from the first corner of the light-emitting element that overlaps with the first conductive member in a top view, A portion of the first joining member is located in the first planar portion, in a top view, between the second portion and the first corner of the light-emitting element, and is positioned in the first exposed region exposed from the light-emitting element. Light-emitting device.

2. In a cross-sectional view, the depth of the first portion is greater than the depth of the second portion. The light-emitting device according to claim 1.

3. The portion of the outer circumference of the first conductive member that is on the side of the second conductive member overlaps with the portion of the outer circumference of the first electrode that is on the side of the second conductive member when viewed from above. The light-emitting device according to claim 1 or claim 2.

4. The device further comprises a light-reflective covering member covering the first conductive member, the second conductive member, the light-emitting element, the first bonding member, and the second bonding member, such that the lower surfaces of the first conductive member and the lower surfaces of the second conductive member are exposed. The light-emitting device according to claim 1 or claim 2.

5. The light-emitting element has two of the first corners, The first recess has a third portion that is separated from the portion of the outer circumference of the light-emitting element that is located between the two first corners, A portion of the first joining member is positioned in the first planar portion, in a top view, between the third portion and the light-emitting element, and is placed in a second exposed region that is exposed from the light-emitting element. The light-emitting device according to claim 1 or 2.

6. The upper surface of the second conductive member has a second planar portion and a second recess that is located in at least a portion of the periphery of the second electrode in a top view and is recessed from the second planar portion of the second conductive member toward the lower surface of the second conductive member. The second recess, in a top view, has a fourth portion that includes a portion that overlaps with the outer circumference of the second electrode, and a fifth portion that does not overlap with the outer circumference of the second electrode. The fifth portion is spaced apart from the second corner of the light-emitting element that overlaps with the second conductive member in a top view, A portion of the second joining member is located in the second planar portion, in a top view, between the fifth portion and the second corner of the light-emitting element, and is positioned in the third exposed region exposed from the light-emitting element. The light-emitting device according to claim 1 or claim 2.

Images