Cleaning attachment

Abstract

This provides a cleaning attachment that can prevent mist or vapor of liquids other than the cleaning solution from adhering to it. [Solution] The cleaning attachment 70 is attachable to and detachable from the substrate processing apparatus 1. The substrate processing apparatus 1 includes a spin chuck 10 that rotates the substrate while holding it horizontally, a chamber 4 that houses the spin chuck 10, a liquid nozzle 41 that discharges liquid from the chamber 4, and a liquid passage that guides the liquid to be supplied to the liquid nozzle 41 into the chamber 4. The cleaning attachment 70 includes a cleaning liquid nozzle 71 arranged around the spin chuck 10, a cleaning liquid passage 72 that guides the cleaning liquid to be discharged from the cleaning liquid nozzle 71 to the cleaning liquid nozzle 71, and a connector 75 that is attachable to and detachable from the liquid supply source corresponding to the liquid nozzle 41 or the liquid passage, and guides the liquid as cleaning liquid from the liquid supply source to the cleaning liquid passage 72.

Description

Technical Field

[0001] The present invention relates to a cleaning attachment for cleaning a substrate processing apparatus. The substrates include, for example, semiconductor wafers, substrates for FPD (Flat Panel Display) such as liquid crystal display devices and organic EL (electroluminescence) display devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, substrates for solar cells, and the like.

Background Art

[0002] Patent Document 1 discloses a first cleaning liquid nozzle that discharges a cleaning liquid toward the outer peripheral portion based on spin. Patent Document 2 discloses a nozzle that discharges a cleaning liquid toward the outer peripheral surface of a spin chuck.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] In Patent Document 1 and Patent Document 2, since the nozzles are close to the spin chuck even when the nozzles are not in use, mists and vapors of liquids other than the cleaning liquid adhere to the nozzles.

[0005] At least one embodiment of the present invention provides a cleaning attachment that can prevent mists and vapors of liquids other than the cleaning liquid from adhering.

Means for Solving the Problems

[0006] One embodiment of the present invention provides a cleaning attachment for cleaning a substrate processing apparatus, wherein the substrate processing apparatus includes a spin chuck for rotating a substrate while holding it horizontally, a chamber housing the spin chuck, a liquid nozzle for discharging liquid from within the chamber, and a liquid channel for guiding the liquid to be supplied to the liquid nozzle into the chamber, and the cleaning attachment is attachable to and detachable from the substrate processing apparatus and includes a cleaning liquid nozzle arranged around the spin chuck, a cleaning liquid channel for guiding the cleaning liquid to be discharged from the cleaning liquid nozzle to the cleaning liquid nozzle, and a connector attachable to and detachable from a liquid supply source corresponding to the liquid nozzle or liquid channel, for guiding the liquid as the cleaning liquid from the liquid supply source to the cleaning liquid channel.

[0007] In the above embodiment, at least one of the following features may be added to the cleaning attachment.

[0008] The cleaning attachment further includes a nozzle holder that connects the cleaning fluid nozzle to the connector, thereby maintaining a constant angle and position of the cleaning fluid nozzle relative to the connector, wherein the nozzle holder is deformable, and at least one of the angle and position of the cleaning fluid nozzle relative to the connector changes with deformation of the nozzle holder.

[0009] The cleaning solution nozzle is movable relative to the nozzle holder.

[0010] The liquid nozzle includes a bottom nozzle that discharges the liquid toward the lower surface of the substrate held by the spin chuck, and the connector is attachable to and detachable from the bottom nozzle.

[0011] The cleaning attachment is rotatable around a straight line perpendicular to the lower nozzle while the connector remains attached to the lower nozzle.

[0012] The connector is detachable from the bottom nozzle and spin chuck, and when the spin chuck rotates, the cleaning attachment rotates around the vertical line relative to the bottom nozzle, while the connector remains attached to the bottom nozzle and spin chuck.

[0013] The outer circumferential surface of the spin chuck includes a rotating portion that rotates when the spin chuck rotates and a non-rotating portion that does not rotate when the spin chuck rotates, and the cleaning liquid nozzle is positioned so that the cleaning liquid is discharged toward the non-rotating portion.

[0014] The cleaning attachment further includes a camera positioned around the spin chuck.

[0015] The cleaning attachment further includes a nozzle holder that maintains a constant angle and position of the cleaning fluid nozzle and camera relative to the connector by connecting the cleaning fluid nozzle and camera to the connector.

[0016] The liquid nozzle includes a top nozzle that discharges the liquid toward the upper surface of the substrate held by the spin chuck, and the connector is attachable to and detachable from the top nozzle.

[0017] The substrate processing apparatus further includes an actuator for moving the upper nozzle, and when the actuator moves the upper nozzle while the connector is attached to the upper nozzle, the cleaning attachment also moves. [Brief explanation of the drawing]

[0018] [Figure 1A] This is a schematic plan view showing the layout of the substrate processing apparatus according to the first embodiment. [Figure 1B] This is a schematic side view of a substrate processing device. [Figure 2] This is a schematic diagram showing the inside of the processing unit viewed horizontally. [Figure 3] It is a schematic partial cross-sectional view of the disassembled spin chuck and the bottom nozzle seen horizontally. [Figure 4] It is a block diagram showing the electrical configuration of the substrate processing apparatus. [Figure 5] It is a schematic view of the cleaning attachment attached to the nozzle base of the bottom nozzle seen horizontally. [Figure 6] It is a schematic view of the cleaning attachment attached to the nozzle base of the bottom nozzle seen vertically from above. [Figure 7] It is a schematic view of the cleaning attachment in which the nozzle holder is deformed into a shape different from the shape shown in FIG. 5 seen horizontally. [Figure 8] It is a schematic view showing a cross-section along line VIII-VIII shown in FIG. 7. [Figure 9] It is a schematic view for explaining the procedure of cleaning the spin chuck by the cleaning attachment. [Figure 10] It is a schematic view of the cleaning attachment according to the second embodiment seen horizontally. [Figure 11] It is a schematic view of the cleaning attachment according to the third embodiment seen horizontally.

Embodiments for Carrying Out the Invention

[0019] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0020]

[0021] FIG. 1A is a schematic plan view showing the layout of the substrate processing apparatus 1 according to the first embodiment. FIG. 1B is a schematic side view of the substrate processing apparatus 1.

[0022] As shown in Figure 1A, the substrate processing apparatus 1 is a single-wafer type apparatus that processes disc-shaped substrates W, such as semiconductor wafers, one at a time. The substrate processing apparatus 1 comprises a load port LP that holds a carrier CA that accommodates multiple substrates W, such as a Front-Opening Unified Pod (FOUP); a plurality of processing units 2 that process the substrates W transported from the carrier CA on the load port LP with a processing fluid such as a processing liquid or processing gas; a transport system TS that transports the substrates W between the carrier CA on the load port LP and the plurality of processing units 2; an outer wall 1a that forms a sealed space housing the plurality of processing units 2 and the transport system TS; and a control device 3 that controls the substrate processing apparatus 1.

[0023] Multiple processing units 2 form multiple towers TW. Figure 1A shows an example where four towers TW are formed. As shown in Figure 1B, the multiple processing units 2 contained in one tower TW are stacked vertically. As shown in Figure 1A, the multiple towers TW form two rows that extend in the depth direction (left-right direction in Figure 1A) of the substrate processing apparatus 1 in a plan view. In a plan view, the two rows face each other via a transport path TP.

[0024] The transport system TS includes an indexer robot IR that loads and unloads substrates W to and from a carrier CA on a load port LP, and a center robot CR that loads and unloads substrates W to and from multiple processing units 2. The center robot CR is located on the transport path TP. The indexer robot IR is located between the load port LP and the center robot CR in a plan view. The indexer robot IR passes the substrates W to the center robot CR and receives the substrates W from the center robot CR. The center robot CR does the same.

[0025] The indexer robot IR includes one or more hands Hi that horizontally support the substrate W. The hands Hi are movable in both the horizontal and vertical directions. The hands Hi are rotatable around a vertical line. The hands Hi can load and unload the substrate W to and from the carrier CA on any load port LP, and can transfer the substrate W to and from the center robot CR.

[0026] The center robot CR includes one or more hands Hc that horizontally support the substrate W. The hands Hc are movable in both the horizontal and vertical directions. The hands Hc are rotatable around a vertical line. The hands Hc can transfer the substrate W to and from the indexer robot IR, and can load and unload the substrate W to and from any of the processing units 2.

[0027] The control device 3 controls the electrical and electronic equipment installed in the substrate processing device 1. The control device 3 includes at least one computer that can communicate with each other. The computer includes a CPU (Central Processing Unit) 3a that processes information such as program execution, and a memory 3b that stores information such as programs to be executed by the CPU 3a. The CPU is also called a processor. The control device 3 controls the substrate processing device 1 to transport and process the substrate W, which will be described later. In other words, the control device 3 is programmed to transport and process the substrate W, which will be described later.

[0028] Next, we will describe the processing unit 2.

[0029] Figure 2 is a schematic horizontal view of the inside of the processing unit 2. Figure 3 is a schematic partial horizontal cross-sectional view of the disassembled spin chuck 10 and lower nozzle 41.

[0030] As shown in Figure 2, the processing unit 2 includes a chamber 4 for housing the substrate W, and a spin chuck 10 that holds one substrate W horizontally within the chamber 4 and rotates it around a vertical axis of rotation A1 passing through the center of the substrate W.

[0031] Chamber 4 includes a box-shaped partition wall 5 with a passage 5b through which the substrate W passes, and a door 6 that opens and closes the passage 5b. The FFU 7 (Fan Filter Unit 7) is positioned above an air outlet 5a located at the top of the partition wall 5. The FFU 7 constantly supplies clean air (air filtered by the filter) into Chamber 4 from the air outlet 5a. The gas inside Chamber 4 is discharged from Chamber 4 through an exhaust duct 8 connected to the bottom of the processing cup 21. This constantly creates a downflow of clean air inside Chamber 4. The flow rate of the exhaust discharged into the exhaust duct 8 is changed according to the opening degree of the exhaust valve 9 located inside the exhaust duct 8.

[0032] The partition wall 5 of the chamber 4 includes a plate-shaped maintenance cover 5c that opens and closes the internal space of the chamber 4. The inner surface of the maintenance cover 5c is in contact with the atmosphere inside the chamber 4. The outer surface of the maintenance cover 5c is in contact with the atmosphere outside the substrate processing apparatus 1. The maintenance cover 5c is part of the outer wall 1a of the substrate processing apparatus 1. When the maintenance cover 5c is moved, the inside of the chamber 4 is connected to the outside of the substrate processing apparatus 1 through the space in which the maintenance cover 5c was located. The maintenance cover 5c may be attachable to and detachable from the substrate processing apparatus 1, or rotatable or slidable relative to the substrate processing apparatus 1, as long as it can open and close the internal space of the chamber 4.

[0033] The spin chuck 10 includes a horizontally held disc-shaped spin base 12, a plurality of chuck pins 11 that horizontally hold the substrate W above the spin base 12, a spin shaft 13 that extends downward from the center of the spin base 12 along the rotation axis A1, and a spin motor 14 that rotates the spin base 12 and the plurality of chuck pins 11 around the rotation axis A1 by rotating the spin shaft 13. Although the spin chuck 10 includes three or more chuck pins 11, Figure 2 is depicted as having only two chuck pins 11.

[0034] The spin chuck 10 is not limited to a mechanical chuck that contacts multiple chuck pins 11 with the end face of the substrate W, but may also be a vacuum chuck that holds the substrate W horizontally by adhering the back surface (bottom surface) of the substrate W, which is a non-device forming surface, to the upper surface 12u of the spin base 12. If the spin chuck 10 is a mechanical chuck, the multiple chuck pins 11 correspond to a substrate holder. If the spin chuck 10 is a vacuum chuck, the spin base 12 corresponds to a substrate holder.

[0035] The spin chuck 10 further includes a lower housing 15 positioned below the spin base 12. The lower housing 15 surrounds the spin motor 14. The lower housing 15 houses the spin motor 14. The chuck pin 11, spin base 12, and spin shaft 13 are rotatable relative to the lower housing 15. Even when the spin motor 14 rotates the chuck pin 11, etc., the lower housing 15 does not rotate.

[0036] As shown in Figure 3, the spin base 12 includes a horizontal circular top surface 12u (see Figure 6) and a cylindrical outer surface 12o extending downward from the outer circumference of the top surface 12u of the spin base 12. The lower housing 15 includes a cylindrical outer surface 15o extending downward from the outer surface 12o of the spin base 12. The outer surface 12o of the spin base 12 is a part of the surface of the spin base 12 that is visible when the spin base 12 is viewed horizontally. The same applies to the outer surface 15o of the lower housing 15. The outer surface 12o of the spin base 12 is rotatable relative to the outer surface 15o of the lower housing 15. The outer surface 12o of the spin base 12 and the outer surface 15o of the lower housing 15 correspond to the outer surface of the spin chuck 10.

[0037] The outer diameter of the spin base 12 (the diameter of the outer surface 12o of the spin base 12; the same applies hereinafter) may be constant or may vary. The same applies to the outer surface 15o of the lower housing 15 (the diameter of the outer surface 15o of the lower housing 15; the same applies hereinafter). The outer diameter of the spin base 12 (the maximum value if it is not constant) may be equal to or different from the outer diameter of the lower housing 15 (the maximum value if it is not constant). Figure 3 shows an example where the outer diameter of the spin base 12 is constant and the outer diameter of the lower housing 15 varies. In this example, the outer diameter of the lower housing 15 increases from a value smaller than the outer diameter of the spin base 12 to a value larger than the outer diameter of the spin base 12 as it moves downward from the spin base 12.

[0038] As shown in Figure 2, the processing unit 2 includes a cylindrical processing cup 21 that receives processing liquid splashed from the substrate W. The processing cup 21 includes a plurality of guards 24 that receive processing liquid discharged outward from the substrate W held in the spin chuck 10, a plurality of cups 23 that receive processing liquid guided downward by the plurality of guards 24, and a cylindrical outer wall 22 that surrounds the plurality of guards 24 and the plurality of cups 23. Figure 2 shows an example in which four guards 24 and three cups 23 are provided, and the outermost cup 23 is integrated with the third guard 24 from the top.

[0039] The guard 24 includes a cylindrical portion 25 surrounding the spin chuck 10 and an annular ceiling portion 26 extending diagonally upward toward the rotation axis A1 from the upper end of the cylindrical portion 25. Multiple ceiling portions 26 are stacked vertically, and multiple cylindrical portions 25 are arranged concentrically. The annular upper end of the ceiling portion 26 corresponds to the upper end 24u of the guard 24 surrounding the substrate W and spin base 12 in a plan view. Multiple cups 23 are each located below the multiple cylindrical portions 25. The cups 23 form annular grooves that receive the processing liquid guided downward by the guard 24.

[0040] The processing unit 2 includes a guard lifting actuator 27 that individually raises and lowers multiple guards 24. The guard lifting actuator 27 holds the guards 24 stationary at any position within the range from the upper position to the lower position. Figure 2 shows a state where two guards 24 are positioned in the upper position and the remaining two guards 24 are positioned in the lower position. The upper position is a position where the upper end 24u of the guard 24 is positioned above the holding position where the substrate W held by the spin chuck 10 is placed. The lower position is a position where the upper end 24u of the guard 24 is positioned below the holding position.

[0041] An actuator is a device that converts driving energy, represented by electricity, fluid, magnetic, thermal, or chemical energy, into mechanical work, i.e., the motion of a tangible object. Actuators include electric motors (rotary motors), linear motors, air cylinders, and other devices. When the motion of the actuator differs from the motion of the object, a motion converter may be provided to convert the actuator's motion into linear motion or rotation. For example, if the actuator is an electric motor and the object is to move in a linear motion, a motion converter such as a ball screw and ball nut may be used to convert the rotation of the electric motor into linear motion.

[0042] The processing unit 2 includes a plurality of nozzles that discharge processing fluids, such as processing liquid and processing gas, toward the substrate W held in the spin chuck 10. The plurality of nozzles include a chemical solution nozzle 31 that discharges the chemical solution toward the upper surface of the substrate W, and a rinsing liquid nozzle 32 that discharges the rinsing liquid toward the upper surface of the substrate W. Figure 2 shows an example where the chemical solution is DHF (Diluted HF) and the rinsing liquid is pure water (DIW).

[0043] The chemical nozzle 31 is connected to a chemical pipe 31p that guides the chemical solution. When the chemical valve 31v attached to the chemical pipe 31p is opened, the discharge port of the chemical nozzle 31 continuously discharges the chemical solution downwards. The chemical solution may be a liquid containing at least one of sulfuric acid, nitric acid, hydrochloric acid, hydrofluoric acid, phosphoric acid, acetic acid, ammonia water, hydrogen peroxide, organic acids (e.g., citric acid, oxalic acid, etc.), organic alkalis (e.g., TMAH: tetramethylammonium hydroxide, etc.), surfactants, and corrosion inhibitors, or it may be any other liquid.

[0044] Although not shown in the diagram, the chemical solution valve 31v includes a valve body provided with an annular valve seat through which the chemical solution passes, a valve element movable relative to the valve seat, and an actuator that moves the valve element between a closed position where the valve element is in contact with the valve seat and an open position where the valve element is away from the valve seat. The same applies to other valves. The actuator may be a pneumatic actuator or an electric actuator, or any other type of actuator. The control device 3 opens and closes the chemical solution valve 31v, etc., by controlling the actuator.

[0045] The rinse liquid nozzle 32 is connected to the rinse liquid piping 32p that guides the rinse liquid. When the rinse liquid valve 32v attached to the rinse liquid piping 32p is opened, the outlet of the rinse liquid nozzle 32 continuously discharges the rinse liquid downwards. The rinse liquid may be any of the following: pure water (deionized water: DIW), carbonated water, electrolyzed ionized water, hydrogen water, ozonated water, hydrochloric acid water at a dilution concentration (e.g., about 1 to 100 ppm), or ammonia water at a dilution concentration (e.g., about 1 to 100 ppm), or any other liquid.

[0046] The chemical solution nozzle 31 may be a scan nozzle that can move horizontally while discharging the chemical solution toward the substrate W, or it may be a fixed nozzle that cannot move horizontally while discharging the chemical solution toward the substrate W. The same applies to the other nozzles. Figure 2 shows an example where the chemical solution nozzle 31 and the rinse solution nozzle 32 are scan nozzles.

[0047] The chemical nozzle 31 is connected to a nozzle actuator 31a that moves the chemical nozzle 31 in at least one of the vertical and horizontal directions. The rinse nozzle 32 is connected to a nozzle actuator 32a that moves the rinse nozzle 32 in at least one of the vertical and horizontal directions.

[0048] The nozzle actuator 31a moves the chemical nozzle 31 horizontally between a processing position in which the chemical dispensed from the chemical nozzle 31 is supplied to the upper surface of the substrate W, and a standby position in which the chemical nozzle 31 is positioned around the processing cup 21 in a plan view. The nozzle actuator 31a may also include a vertical actuator for moving the chemical nozzle 31 vertically and a horizontal actuator for moving the chemical nozzle 31 and the vertical actuator horizontally. The contents of this paragraph also apply to the nozzle actuator 32a.

[0049] The multiple nozzles further include a bottom nozzle 41 that discharges the processing liquid toward the underside of the substrate W held by the spin chuck 10. The bottom nozzle 41 protrudes upward from the center of the upper surface 12u of the spin base 12. The bottom nozzle 41 does not rotate even when the substrate W and the spin chuck 10 rotate. The bottom nozzle 41 is a fixed nozzle that does not move in any direction.

[0050] As shown in Figure 3, the bottom nozzle 41 includes an outlet 41o that discharges the processing liquid toward the center of the lower surface of the substrate W held by the spin chuck 10, and an internal flow path that guides the processing liquid to the outlet 41o. The outlet 41o of the bottom nozzle 41 is positioned above the upper surface 12u of the spin base 12. When the substrate W is held by the spin chuck 10, the outlet 41o of the bottom nozzle 41 faces the lower surface of the substrate W in an upward and downward direction. The internal flow path of the bottom nozzle 41 extends downward from the outlet 41o of the bottom nozzle 41 along the rotation axis A1, which corresponds to the rotation center of the spin chuck 10.

[0051] As shown in Figure 3, the lower nozzle 41 includes a horizontal disc portion 41x positioned above the upper surface 12u of the spin base 12, and a cylindrical portion 41y extending downward from the disc portion 41x. The outer circumference of the disc portion 41x protrudes outward from the cylindrical portion 41y by a certain distance along its entire circumference. The horizontal upper and lower surfaces of the disc portion 41x are positioned above the upper surface 12u of the spin base 12. The inner surface of the spin base 12 surrounds the cylindrical portion 41y, horizontally separated from its outer surface. The discharge port 41o of the lower nozzle 41 opens on the upper surface of the disc portion 41x. The internal flow path of the lower nozzle 41 extends downward from the upper surface of the disc portion 41x through the disc portion 41x and the cylindrical portion 41y.

[0052] As shown in Figure 2, the lower nozzle 41 is connected to the rinse fluid piping 41p that guides the rinse fluid. The rinse fluid valve 41v and the flow rate adjustment valve 41f are attached to the rinse fluid piping 41p. When the rinse fluid valve 41v is opened, the rinse fluid is continuously discharged upward from the discharge port 41o of the lower nozzle 41 at a flow rate corresponding to the opening of the flow rate adjustment valve 41f. When the control device 3 changes the opening of the flow rate adjustment valve 41f, the flow rate of the rinse fluid discharged from the lower nozzle 41 is also changed. The processing liquid discharged from the lower nozzle 41 may be a rinse fluid other than pure water, or a liquid other than a rinse fluid, such as a chemical solution.

[0053] The outer circumferential surface of the lower nozzle 41 and the inner circumferential surface of the spin base 12 form a cylindrical gas flow path 43 that extends vertically. The gas flow path 43 includes a central opening 42 that opens in the center of the upper surface 12u of the spin base 12. The gas flow path 43 is connected to an inert gas pipe 43p that guides an inert gas. When an inert gas valve 43v attached to the inert gas pipe 43p is opened, the inert gas is continuously discharged upward from the central opening 42 of the spin base 12.

[0054] The inert gas discharged from the central opening 42 of the spin base 12 is nitrogen gas. The inert gas may be a gas other than nitrogen gas, such as helium gas or argon gas. When the substrate W is held in the spin chuck 10, the central opening 42 of the spin base 12 discharges nitrogen gas, and the nitrogen gas flows radially in all directions between the lower surface of the substrate W and the upper surface 12u of the spin base 12. As a result, the space between the substrate W and the spin base 12 is filled with nitrogen gas.

[0055] The processing unit 2 includes a blocking member 51 positioned above the spin chuck 10. Figure 2 shows an example where the blocking member 51 is a disc-shaped blocking plate. The blocking member 51 includes a disc portion 52 positioned horizontally above the spin chuck 10. The blocking member 51 is horizontally supported by a cylindrical support shaft 53 extending upward from the center of the disc portion 52. The center line of the disc portion 52 is positioned on the rotation axis A1 of the substrate W. The lower surface of the disc portion 52 corresponds to the lower surface 51L of the blocking member 51. The lower surface 51L of the blocking member 51 is parallel to the upper surface of the substrate W and has an outer diameter greater than or equal to the diameter of the substrate W.

[0056] The shut-off member 51 is connected to a vertical actuator 54v that moves the shut-off member 51 vertically in parallel. The shut-off member 51 is further connected to a rotary actuator 54r that rotates the shut-off member 51 around its centerline (the centerline of the disc portion 52). The vertical actuator 54v is connected to the shut-off member 51 via the rotary actuator 54r.

[0057] The vertical actuator 54v positions the shut-off member 51 at any position within the range from the upper position (the position shown in Figure 2) to the lower position. The lower position is a proximity position in which the lower surface 51L of the shut-off member 51 is close to the upper surface of the substrate W to a height that prevents a scan nozzle, such as a chemical nozzle 31, from entering the space between the substrate W and the shut-off member 51. The upper position is a standby position in which the shut-off member 51 is retracted to a height that allows a scan nozzle to enter the space between the shut-off member 51 and the substrate W.

[0058] The multiple nozzles include a central nozzle 55 that discharges a processing fluid, such as a processing liquid or processing gas, downward through a central opening 56 that opens in the center of the lower surface 51L of the shut-off member 51. The central nozzle 55 extends vertically along the centerline of the shut-off member 51. The discharge port of the central nozzle 55 is located above the central opening 56 of the shut-off member 51.

[0059] The inner circumferential surface of the blocking member 51 surrounds the outer circumferential surface of the central nozzle 55 with a gap between them. The central nozzle 55 is held by the blocking member 51. When the blocking member 51 moves up or down, the central nozzle 55 also moves up or down. Even if the blocking member 51 rotates, the central nozzle 55 does not rotate. The central nozzle 55 is a fixed nozzle.

[0060] The central nozzle 55 is connected to a rinse fluid pipe 55p that guides the rinse fluid. When the rinse fluid valve 55v attached to the rinse fluid pipe 55p is opened, a rinse fluid such as pure water is continuously discharged downward from the outlet of the central nozzle 55. The liquid discharged from the central nozzle 55 may be a rinse fluid other than pure water, or a liquid other than a rinse fluid such as IPA (isopropyl alcohol).

[0061] The inner circumferential surface of the shut-off member 51 and the outer circumferential surface of the central nozzle 55 form a cylindrical gas flow path 57 that extends vertically. The gas flow path 57 includes a central opening 56 that opens in the middle of the lower surface 51L of the shut-off member 51. The gas flow path 57 is connected to an inert gas pipe 57p that guides an inert gas. When the inert gas valve 57v attached to the inert gas pipe 57p is opened, the inert gas is continuously discharged downward from the central opening 56 of the shut-off member 51. The inert gas discharged from the central opening 56 of the shut-off member 51 is nitrogen gas. The inert gas may be a gas other than nitrogen gas, such as helium gas or argon gas.

[0062] When processing the substrate W with the substrate processing apparatus 1, the control device 3 causes the transport system TS (see Figure 1A) to transport the substrate W into the chamber 4 through the passage 5b of the chamber 4, and places the substrate W horizontally on the spin chuck 10. Then, the control device 3 holds and rotates the substrate W on the spin chuck 10. While rotating the substrate W on the spin chuck 10, the control device 3 discharges the chemical solution from the chemical solution nozzle 31 toward the top surface of the substrate W. As a result, the entire top surface of the substrate W is covered with a liquid film of the chemical solution. After stopping the discharge of the chemical solution from the chemical solution nozzle 31, the control device 3 discharges the rinse solution from the rinse solution nozzle 32 toward the top surface of the substrate W while rotating the substrate W on the spin chuck 10. As a result, the chemical solution on the substrate W is replaced by the rinse solution, and the entire top surface of the substrate W is covered with a liquid film of the rinse solution.

[0063] The control device 3 stops the discharge of rinse liquid from the rinse liquid nozzle 32 and then accelerates the substrate W in the rotational direction on the spin chuck 10. This removes the liquid from the substrate W and dries the substrate W. If necessary, the control device 3 may replace the rinse liquid on the substrate W, such as pure water, with IPA discharged from the central nozzle 55 before drying the substrate W. After the substrate W is dry, the control device 3 stops the rotation of the spin chuck 10 and releases the substrate W. Then, the control device 3 causes the transport system TS to support the substrate W on the spin chuck 10 and transports the substrate W out of the chamber 4 through the passage opening 5b of the chamber 4.

[0064] Next, the spin base 12 and the lower nozzle 41 will be described.

[0065] As shown in Figure 3, the lower nozzle 41 includes a nozzle head 41h on which the discharge port 41o of the lower nozzle 41 is provided, and a nozzle base 41b that guides the processing liquid to be discharged from the discharge port 41o of the lower nozzle 41 to the nozzle head 41h. The nozzle head 41h is positioned above the nozzle base 41b. The nozzle head 41h is attachable to and detachable from the nozzle base 41b. In other words, the lower nozzle 41 is divided into a nozzle head 41h and a nozzle base 41b. If we consider the nozzle head 41h as the lower nozzle 41, then the nozzle base 41b forms a liquid passage that guides the liquid to be supplied to the lower nozzle 41.

[0066] The division position of the lower nozzle 41, that is, the position where the nozzle head 41h and nozzle base 41b are combined, may be within the space inside the spin base 12, or it may be below the spin base 12. Figure 3 shows an example of the latter. As mentioned above, the lower nozzle 41 includes a disc portion 41x and a cylindrical portion 41y. In the example shown in Figure 3, the nozzle head 41h includes the disc portion 41x and a part of the cylindrical portion 41y, and the nozzle base 41b includes the remaining part of the cylindrical portion 41y. Therefore, in this example, the lower nozzle 41 is divided at a position below the disc portion 41x.

[0067] The spin chuck 10 forms a cylindrical central space 12s that extends downward from the center of the upper surface 12u of the spin base 12 along the rotation center of the spin chuck 10. The space inside the spin base 12 is part of the central space 12s. The nozzle base 41b is located within the central space 12s. Part of the nozzle head 41h is also located within the central space 12s. The remaining part of the nozzle head 41h (disc portion 41x) is located above the central space 12s.

[0068] The spin base 12 includes a base body 12b fixed to the spin shaft 13 and a base cover 12c that can be attached to and removed from the base body 12b. The base cover 12c is fixed to the spin shaft 13, either via or without the base body 12b. When the spin motor 14 (see Figure 2) rotates the spin shaft 13, the base body 12b and the base cover 12c rotate.

[0069] The base body 12b includes a horizontal top surface. The base cover 12c also includes a horizontal top surface. The chuck pin 11 protrudes upward from the top surface of the base body 12b. The top surface of the base body 12b forms part of the top surface 12u of the spin base 12. The top surface of the base cover 12c forms the remaining part of the top surface 12u of the spin base 12. The base body 12b forms a recess 12r that is recessed downward from the top surface of the base body 12b. The base cover 12c is located within the recess 12r.

[0070] Figure 3 shows an example in which the base cover 12c is cylindrical, surrounding the centerline of the spin base 12, and constitutes the inner surface of the spin base 12. In this example, the base cover 12c includes a cylindrical portion 12y that extends vertically around the centerline of the spin base 12, and a horizontal annular portion 12x that protrudes outward from the cylindrical portion 12y by a certain distance around the entire circumference of the cylindrical portion 12y.

[0071] The upper surface of the annular portion 12x corresponds to the upper surface of the base cover 12c. The inner circumferential surface of the cylindrical portion 12y corresponds to the inner circumferential surface of the base cover 12c. The inner circumferential surface of the cylindrical portion 12y corresponds to at least a part of the inner circumferential surface of the spin base 12. The inner circumferential surface of the cylindrical portion 12y surrounds the entire circumference of the lower nozzle 41 while being horizontally separated from the outer circumferential surface of the lower nozzle 41. The base cover 12c and the lower nozzle 41 form a part of the gas flow path 43.

[0072] Next, we will explain how to open and close the chuck pin 11.

[0073] The chuck pin 11 is held by the spin base 12. The chuck pin 11 is movable relative to the spin base 12 between an open position and a closed position. The open position is when the chuck pin 11 is horizontally away from the end face of the substrate W. The closed position is when the chuck pin 11 is horizontally pressed against the end face of the substrate W.

[0074] The spin chuck 10 includes a driven magnet 62 that is movable within the spin base 12 between an upper position and a lower position, and a drive magnet 63 that is movable within the lower housing 15 between an upper position and a lower position. The upper position of the driven magnet 62 is the position in which the chuck pin 11 is positioned in the open position. The lower position of the driven magnet 62 is the position in which the chuck pin 11 is positioned in the closed position. The upper position of the drive magnet 63 is the position in which the driven magnet 62 is positioned in the upper position. The lower position of the drive magnet 63 is the position in which the driven magnet 62 is positioned in the lower position.

[0075] The spin chuck 10 includes a cam 61 that converts the movement of the driven magnet 62 into the movement of the chuck pin 11 between an open position and a closed position, a spring (not shown) that generates a force to return the driven magnet 62 to the lower position when it moves away from the lower position, and an opening / closing actuator 64 that moves the drive magnet 63 between an upper position and a lower position. When the control device 3 moves the drive magnet 63 from the lower position to the upper position using the opening / closing actuator 64, the chuck pin 11 moves from the closed position to the open position. When the control device 3 moves the drive magnet 63 from the upper position to the lower position using the opening / closing actuator 64, the chuck pin 11 moves from the open position to the closed position.

[0076] The spin chuck 10 includes a light-emitting element 66e that emits light toward the spin base 12, a reflector 65 that reflects the light from the light-emitting element 66e within the spin base 12, and a light-receiving element 66r that receives the light from the light-emitting element 66e reflected by the reflector 65. The light-emitting element 66e and the light-receiving element 66r are located within the lower housing 15. The reflector 65 is located within the spin base 12. The reflector 65 moves together with the driven magnet 62 between an upper position and a lower position.

[0077] Light from the light-emitting element 66e enters the spin base 12 via the transmissive portion 67b of the spin base 12 and the transmissive portion 67h of the lower housing 15, and is reflected by the reflector 65. The light from the light-emitting element 66e reflected by the reflector 65 enters the lower housing 15 via the transmissive portion 67b of the spin base 12 and the transmissive portion 67h of the lower housing 15, and is received by the photodetector 66r. When the position of the reflector 65 changes, the amount of light entering the photodetector 66r also changes. The control device 3 detects whether the chuck pin 11 is in the closed position by detecting the amount of light entering the photodetector 66r.

[0078] The spin chuck 10 forms a flow path including an internal gap 68 between the lower surface of the spin base 12 and the upper surface of the lower housing 15. The internal gap 68 is horizontal and annular, and opens on the outer circumferential surface of the spin chuck 10. The permeable portion 67b of the spin base 12 and the permeable portion 67h of the lower housing 15 form part of the internal gap 68. The internal gap 68 is connected to an inert gas pipe 68p, which is opened and closed by an inert gas valve 68v. A gas such as an inert gas supplied from the inert gas pipe 68p to the internal gap 68 flows radially outward through the internal gap 68 and is discharged outside the spin chuck 10 from the downstream end of the internal gap 68, which opens on the outer circumferential surface of the spin chuck 10. The downstream end of the internal gap 68 corresponds to the outlet of the internal gap 68. The downstream end of the internal gap 68 corresponds to the boundary between the spin base 12 and the lower housing 15 on the outer circumferential surface of the spin chuck 10.

[0079] Next, the electrical configuration of the substrate processing device 1 will be described.

[0080] Figure 4 is a block diagram showing the electrical configuration of the substrate processing apparatus 1. The substrate processing apparatus 1 includes a control device 3 that controls the controlled objects 3g, such as electrical and electronic equipment installed in the substrate processing apparatus 1. The devices installed in the substrate processing apparatus 1, such as the processing unit 2 and actuators, are included in the controlled objects 3g.

[0081] The control device 3 includes at least one computer capable of communicating with each other. The computer includes a CPU 3a that executes various instructions. The computer further includes a main memory 3c that stores information to be sent and received with the CPU 3a, a storage 3d that stores information to be sent and received with the main memory 3c, such as a program PG, and a communication interface 3f to which other devices such as a host computer HC are connected. The computer may also include a reader 3e that reads information from removable media RM. The computer may be connected to external storage ES via the communication interface 3f.

[0082] The control device 3 is connected to an input device 3h and a display device 3i. The input device 3h is operated when an operator, such as a user or maintenance personnel, inputs information into the board processing device 1. The information is displayed on the screen of the display device 3i. The input device 3h may be a keyboard, a pointing device, or a touch panel, or it may be a device other than these. A touch panel display that serves as both the input device 3h and the display device 3i may be provided in the board processing device 1.

[0083] The CPU 3a executes the program PG stored in the storage 3d. The program PG in the storage 3d may be pre-installed on the control unit 3, sent to the storage 3d from an external device such as an external storage ES via the communication interface 3f, or sent to the storage 3d from a removable media RM via the reader 3e.

[0084] Main memory 3c is the primary memory. Storage 3d, removable media RM, and external storage ES are auxiliary storage devices. Main memory 3c is volatile memory that retains data only when power is supplied. Storage 3d, removable media RM, and external storage ES are non-volatile memory that retains data even when power is not supplied.

[0085] Storage 3d refers to magnetic storage devices such as hard disk drives or semiconductor memory such as SSDs (Solid State Drives). Removable media RM refers to optical discs such as compact discs or semiconductor memory such as memory cards. External storage ES refers to magnetic storage devices such as hard disk drives or semiconductor memory such as SSDs or USB (Universal Serial Bus) flash drives (so-called USB memory).

[0086] The external storage ES may be connected to the communication interface 3f via a USB cable or via a LAN (Local Area Network). In the latter case, the external storage ES may be a NAS (Network Attached Storage). If the control device 3 does not have a reader 3e, the removable media RM may be connected to the communication interface 3f via an external reader 3e.

[0087] Main memory 3c, storage 3d, removable media RM, and external storage ES are examples of memory 3b that store at least one of the information sent to and received from the CPU 3a. Storage 3d, removable media RM, and external storage ES are examples of computer-readable recording media on which the program PG is recorded. Storage 3d, removable media RM, and external storage ES are non-transitory tangible media.

[0088] Storage 3d stores multiple recipe RCs. Recipe RCs are information that defines the processing content, processing conditions, and processing procedure for substrate W. Multiple recipe RCs differ from each other in at least one of the processing content, processing conditions, and processing procedure for substrate W. Control device 3 controls the substrate processing device 1 so that substrate W is processed according to the recipe RC specified by the host computer HC.

[0089] Next, we will explain the cleaning attachment 70.

[0090] Figure 5 is a schematic diagram of the cleaning attachment 70 mounted on the nozzle base 41b of the lower nozzle 41, viewed horizontally. Figure 6 is a schematic diagram of the cleaning attachment 70 mounted on the nozzle base 41b of the lower nozzle 41, viewed vertically from above. Figure 7 is a schematic diagram of the cleaning attachment 70, viewed horizontally, in which the nozzle holder 81 has been deformed into a shape different from that shown in Figure 5. Figure 8 is a schematic diagram showing a cross-section along the line VIII-VIII shown in Figure 7.

[0091] In the following, unless otherwise specified, the cleaning attachment 70 in use will be described. The use state is when the cleaning attachment 70 is attached to the substrate processing apparatus 1 and is in a state where the substrate processing apparatus 1 can be cleaned. Directions such as the vertical, horizontal, and perpendicular directions are defined based on the cleaning attachment 70 in use.

[0092] As shown in Figure 5, the cleaning attachment 70 is detachable from the substrate processing apparatus 1. When the cleaning attachment 70 is attached to the substrate processing apparatus 1, it cleans the object to be cleaned by discharging cleaning fluid towards the object to be cleaned in the chamber 4. The cleaning fluid may be a rinsing solution such as pure water, or a liquid other than a rinsing solution.

[0093] Figures 5 to 8 show an example where the cleaning target is the outer surface of the spin chuck 10. The cleaning attachment 70 may discharge the cleaning fluid towards a cleaning target other than the outer surface of the spin chuck 10, in addition to or instead of the outer surface of the spin chuck 10. For example, the cleaning target may be at least one of the outer surface of the spin chuck 10, the inner surface of the guard 24, and the inner surface of the cup 23.

[0094] As shown in Figure 5, the cleaning attachment 70 includes a cleaning fluid nozzle 71, a cleaning fluid passage 72, and a connector 75. The cleaning attachment 70 may further include at least one of a cleaning fluid pipe 73, a nozzle holder 81, and a cleaning fluid valve 74. Figure 5 shows an example in which the cleaning attachment 70 includes a cleaning fluid pipe 73, a nozzle holder 81, and a cleaning fluid valve 74.

[0095] The cleaning fluid nozzle 71 discharges cleaning fluid towards the object to be cleaned in the chamber 4. The cleaning fluid passage 72 guides the cleaning fluid to the cleaning fluid nozzle 71. The connector 75 is attachable to and detachable from the liquid supply source of the substrate processing apparatus 1 and guides the liquid corresponding to the cleaning fluid from the liquid supply source to the cleaning fluid passage 72. Figure 5 shows an example where the liquid supply source is the bottom nozzle 41.

[0096] The cleaning fluid piping 73 forms a cleaning fluid passage 72. The cleaning fluid passage 72 includes the inner surface of the cleaning fluid piping 73 and the space surrounded by that inner surface. The nozzle holder 81 maintains a constant angle and position of the cleaning fluid nozzle 71 relative to the connector 75 by connecting the cleaning fluid nozzle 71 to the connector 75. The nozzle holder 81 may also hold the cleaning fluid piping 73 in addition to the cleaning fluid nozzle 71. The cleaning fluid valve 74 changes the flow rate of the cleaning fluid supplied to the cleaning fluid nozzle 71.

[0097] The cleaning solution nozzle 71 may be a mist nozzle that discharges the cleaning solution in a mist form, a shower nozzle that discharges the cleaning solution in a shower form, a straight nozzle that forms a straight column of cleaning solution, or any other type of nozzle. Figures 7 and 8 show an example in which the cleaning solution nozzle 71 is a mist nozzle that diffuses the mist of the cleaning solution in a conical shape.

[0098] The mist nozzle may be an external or internal two-fluid nozzle that generates mist by colliding liquid and gas, or it may be a spray nozzle that generates mist by discharging compressed liquid from an orifice or by utilizing the Venturi effect.

[0099] A mist nozzle diffuses the cleaning solution mist into a cone-shaped space extending from its outlet by discharging the cleaning solution mist from its nozzle outlet. The way the cleaning solution mist spreads is not limited to this. The mist nozzle may also discharge the cleaning solution mist from its outlet so that the cleaning solution mist is dispersed into a flat space extending in a fan shape from its outlet. The mist nozzle may also discharge the cleaning solution mist from its outlet so that the cleaning solution mist is dispersed into a columnar space extending in a straight line from its outlet.

[0100] As shown in Figure 5, the cleaning fluid nozzle 71 is arranged around the spin chuck 10. The cleaning fluid nozzle 71 includes a discharge port 71o that discharges the cleaning fluid supplied through the cleaning fluid passage 72 toward the object to be cleaned. The discharge port 71o is located below the upper surface 12u of the spin base 12. The discharge port 71o faces directly toward the object to be cleaned.

[0101] Figure 5 shows an example where the discharge port 71o of the cleaning fluid nozzle 71 directly faces the outer circumferential surface of the spin chuck 10. In this example, the discharge port 71o may directly face only one of the outer circumferential surface 12o of the spin base 12 and the lower housing 15, or it may directly face both the outer circumferential surface 12o of the spin base 12 and the lower housing 15. As long as the discharge port 71o directly faces the object to be cleaned, the cleaning fluid nozzle 71 may be positioned between the outer circumferential surface of the spin chuck 10 and the inner circumferential surface of the innermost guard 24, or it may be positioned outside the innermost guard 24.

[0102] The cleaning liquid nozzle 71 discharges the cleaning liquid from the discharge port 71o in the direction of cleaning liquid discharge. As long as the cleaning liquid discharged from the discharge port 71o directly hits the object to be cleaned, the discharge port 71o may discharge the cleaning liquid in any of the following directions: vertically upward, vertically downward, diagonally upward, diagonally downward, and horizontal, or it may discharge the cleaning liquid in two or more of these directions simultaneously. In other words, the direction of cleaning liquid discharge may be any of the vertically upward, vertically downward, diagonally upward, diagonally downward, and horizontal, or it may be two or more of these directions.

[0103] As shown in Figure 5, the cleaning fluid nozzle 71 is held in a nozzle holder 81. The cleaning fluid nozzle 71 may be fixed to the nozzle holder 81 or it may be movable relative to the nozzle holder 81. The nozzle holder 81 may be a deformable variable holder or a fixed holder that does not deform. Figures 5 to 8 show an example in which the cleaning fluid nozzle 71 is movable relative to the nozzle holder 81 and the nozzle holder 81 is deformable.

[0104] Changing the position of the cleaning fluid nozzle 71 relative to the nozzle holder 81 changes the angle of the cleaning fluid nozzle 71 relative to the object to be cleaned. This changes the direction of cleaning fluid discharge. In addition, the liquid impact point where the cleaning fluid discharged from the cleaning fluid nozzle 71 directly strikes the object to be cleaned also changes. Therefore, by changing the position of the cleaning fluid nozzle 71 relative to the nozzle holder 81, both the cleaning fluid discharge direction and the liquid impact point can be changed.

[0105] If the nozzle holder 81 is deformable, the angle and position of the cleaning fluid nozzle 71 relative to the object to be cleaned will change when the operator changes the shape of the nozzle holder 81. Depending on how the nozzle holder 81 is deformed, it is also possible to move the cleaning fluid nozzle 71 relative to the object to be cleaned without changing the angle of the cleaning fluid nozzle 71 relative to the object to be cleaned. In other words, the cleaning fluid nozzle 71 can be moved in a parallel direction, either vertically or horizontally, relative to the object to be cleaned. Depending on how the nozzle holder 81 is deformed, it is also possible to change the direction of cleaning fluid discharge without moving the liquid impact position in the vertical direction.

[0106] Figures 5 to 7 show an example where the nozzle holder 81 is a multi-joint arm. A multi-joint arm includes multiple arms and one or more joints connecting them. In the example shown in Figures 5 to 7, the multi-joint arm includes arms 82, 84, and 86. The base end of arm 82 is attached to the connector 75, and the tip of arm 82 is attached to joint 83. The base end of arm 84 is attached to joint 83, and the tip of arm 84 is attached to joint 85. The base end of arm 86 is attached to joint 85, and the tip of arm 86 is attached to joint 87.

[0107] Each of the joints 83, 85, and 87 may be flexible only around a horizontal straight line, or it may be flexible around multiple straight lines, including a horizontal straight line. In other words, each of the joints 83, 85, and 87 may include an axis and bearing, or it may include a ball joint.

[0108] The angle of joint 83 may be kept constant by the frictional force generated within joint 83, or by a stopper. The angle of joint 83 may be changed manually or automatically. In the latter case, an actuator may be provided to change the angle of joint 83. In this case, a button to operate the actuator may be provided on the cleaning attachment 70, or on a mobile terminal connected to the actuator by wire or wireless. The mobile terminal is an electronic device operated by a person, such as an operator. The button may be a physical button and a software button, or both. The contents of this paragraph also apply to joints 85 and 87.

[0109] The connector 75 is inserted into the central space 12s (see Figure 3) of the spin chuck 10 and attached to the nozzle base 41b with the nozzle head 41h of the lower nozzle 41 detached from the nozzle base 41b of the lower nozzle 41. Once the connector 75 is attached to the nozzle base 41b, at least a portion of the connector 75 is positioned in the space where the nozzle head 41h was located. This allows the cleaning attachment 70 to be attached to the lower nozzle 41. By removing the connector 75 from the nozzle base 41b and attaching the nozzle head 41h to the nozzle base 41b, the lower nozzle 41 returns to its original shape.

[0110] As shown in Figure 5, the connector 75 includes an internal channel 75i that guides cleaning fluid from the liquid supply source of the substrate processing apparatus 1 to the cleaning fluid channel 72. Figure 5 shows an example in which the internal channel 75i guides cleaning fluid from the nozzle base 41b of the lower nozzle 41 to the cleaning fluid channel 72. The internal channel 75i opens at two locations on the surface of the connector 75. The internal channel 75i is connected to the cleaning fluid channel 72 directly or indirectly. In the example shown in Figure 5, the internal channel 75i is connected to the cleaning fluid piping 73 via a cleaning fluid valve 74.

[0111] When the connector 75 is attached to the nozzle base 41b of the lower nozzle 41, the internal flow path 75i of the connector 75 is connected to the flow path in the nozzle base 41b. As a result, the liquid in the nozzle base 41b is supplied to the internal flow path 75i and flows through the internal flow path 75i toward the cleaning fluid passage 72. The connector 75 may be rotatable around the vertical centerline of the nozzle base 41b with respect to the nozzle base 41b, while the internal flow path 75i of the connector 75 is connected to the flow path in the nozzle base 41b.

[0112] When the connector 75 is attached to the nozzle base 41b of the lower nozzle 41, the cleaning attachment 70 may or may not be in contact with the spin chuck 10. However, if the chuck pin 11 and spin base 12 are rotated by the spin motor 14 while cleaning fluid is being discharged from the cleaning fluid nozzle 71, then no part of the cleaning attachment 70 is in contact with the chuck pin 11 and spin base 12 when the connector 75 is attached to the nozzle base 41b. In this case, the cleaning attachment 70 may or may not be in contact with the lower housing 15.

[0113] The cleaning fluid valve 74 may be an on / off valve that maintains its opening only to zero or the maximum value, or a flow control valve that maintains its opening to any value within the range from the minimum to the maximum value, or it may be two valves, namely an on / off valve and a flow control valve. If the cleaning fluid valve 74 is a flow control valve, it may be a flow control valve that maintains its opening to any value within the range from zero, which corresponds to the minimum value, to the maximum value. Figure 5 shows an example where the cleaning fluid valve 74 is such a flow control valve.

[0114] As shown in Figure 5, the cleaning fluid valve 74 includes a valve body 74b provided with an annular valve seat through which the cleaning fluid passes, and a valve element 74e that is movable relative to the valve seat. Figure 5 shows an example where the cleaning fluid valve 74 is a needle valve and the valve element 74e is needle-shaped. The cleaning fluid valve 74 may be a valve other than a needle valve. When the opening of the cleaning fluid valve 74 is maintained at any value within the range from zero (corresponding to the minimum value) to the maximum value, the valve element 74e is movable relative to the valve seat between a closed position and an open position. The closed position is the position where the cleaning fluid does not flow from upstream to downstream of the valve seat. The open position is the position where the cleaning fluid flows from upstream to downstream of the valve seat.

[0115] The opening degree of the cleaning fluid valve 74 may be changed manually or automatically. In the latter case, i.e., if the cleaning fluid valve 74 is equipped with an actuator that moves the valve body 74e relative to the valve seat, the button that operates the actuator is as described above. Figure 5 shows an example in which the opening degree of the cleaning fluid valve 74 is changed manually. In this example, the cleaning fluid valve 74 includes a handle 74h that is operated by an operator. When the operator moves the handle 74h, the valve body 74e moves relative to the valve seat by an amount corresponding to the amount the handle 74h is moved. This increases or decreases the opening degree of the cleaning fluid valve 74 by an amount corresponding to the amount the valve body 74e moves.

[0116] The cleaning attachment 70 may or may not be equipped with a camera 91 (see Figure 8) for photographing the object to be photographed inside the chamber 4.

[0117] If the cleaning attachment 70 includes a camera 91, the cleaning attachment 70 includes a camera holder that maintains a constant position of the camera 91 relative to the connector 75. Figure 8 shows an example where the nozzle holder 81 also serves as the camera holder. In this example, the cleaning fluid nozzle 71 and the camera 91 are held in the nozzle holder 81 via a bracket 92 and are aligned in the rotational direction of the spin chuck 10. The cleaning attachment 70 may also include a camera holder separate from the nozzle holder 81.

[0118] Camera 91 generates an image (at least one of a still image and a video) of the shooting area 94, which includes the object to be photographed, by photographing the area. The image of the shooting area 94 may be transmitted to a mobile terminal 93 connected to camera 91 by wire or wireless connection. In this case, the operator can check the status of the object to be photographed, such as the spin chuck 10, while outside the chamber 4 by visually checking the display of the mobile terminal 93.

[0119] The operator may determine the status of the subject by visually inspecting the image of the subject generated by the camera 91. Alternatively, the operator may determine the status of the subject based on information transmitted by the mobile terminal 93. In other words, the mobile terminal 93 may determine the status of the subject based on the image of the subject generated by the camera 91 and communicate the result of the determination to the operator using information such as messages or images.

[0120] The camera 91 includes a lens 91L that directly faces the imaging area 94. The camera 91 images the imaging area 94 through the lens 91L. The cleaning fluid nozzle 71 discharges cleaning fluid toward the liquid impact position 95 on the outer surface of the spin chuck 10. The camera 91 is positioned so that the liquid impact position 95 is included in the imaging area 94.

[0121] In the example shown in Figure 8, when the operator moves the bracket 92 relative to the nozzle holder 81, the angle and position of the cleaning fluid nozzle 71 and camera 91 relative to the nozzle holder 81 change. If the nozzle holder 81 is deformable, when the operator changes the shape of the nozzle holder 81, the cleaning fluid nozzle 71 and camera 91 move with or without changing their angles. This allows the imaging area 94 to be moved horizontally or vertically relative to the spin chuck 10 while following the liquid impact position 95.

[0122] Next, the procedure for cleaning the spin chuck 10 using the cleaning attachment 70 will be described.

[0123] Figure 9 is a schematic diagram illustrating the procedure. When cleaning the spin chuck 10 with the cleaning attachment 70, the operator switches the substrate processing device 1 (specifically, the input device 3h (see Figure 4)) to the cleaning standby state. The cleaning standby state is a state in which the substrate W is not in the chamber 4, the spin chuck 10 is stationary, none of the nozzles are discharging processing liquid, all scan nozzles are in the standby position, and the shut-off member 51 is in the upper position.

[0124] Next, the operator reaches into the chamber 4 and detaches the nozzle head 41h of the lower nozzle 41 from the nozzle base 41b of the lower nozzle 41. Then, the operator places the cleaning attachment 70 into the chamber 4. After that, the operator attaches the connector 75 to the nozzle base 41b of the lower nozzle 41. The operator may move their hand into and out of the chamber 4 through the passage 5b which is opened and closed by the door 6, or after moving the maintenance cover 5c, they may move their hand into and out of the chamber 4 through the space where the maintenance cover 5c was located. This is also true for the following operations and for embodiments other than the first embodiment.

[0125] The cleaning fluid nozzle 71 is positioned in the discharge position simultaneously with, before, or after the connector 75 is attached to the nozzle base 41b. The discharge position is where the discharge port 71o of the cleaning fluid nozzle 71 directly faces the object to be cleaned, such as the outer surface of the spin chuck 10. When the cleaning fluid nozzle 71 is positioned in the discharge position, all guards 24 may be in the upper position as shown in Figure 9, or at least one guard 24 may be in the lower position. The cleaning standby state may be the state in which the guards 24 are positioned in this manner.

[0126] The operator attaches the connector 75 to the nozzle base 41b of the lower nozzle 41, aligns the discharge port 71o of the cleaning fluid nozzle 71 directly with the outer surface of the spin chuck 10, and then, with the cleaning fluid valve 74 of the cleaning attachment 70 closed, operates the substrate processing apparatus 1 to open the rinse fluid valve 41v for the lower nozzle 41. This supplies pure water, an example of a cleaning fluid, to the internal flow path 75i of the connector 75 via the nozzle base 41b of the lower nozzle 41. However, because the cleaning fluid valve 74 is closed, the cleaning fluid is blocked upstream of the cleaning fluid valve 74.

[0127] The operator opens the rinse fluid valve 41v for the lower nozzle 41, and then opens the cleaning fluid valve 74 by operating the handle 74h of the cleaning fluid valve 74. This allows the cleaning fluid supplied from the lower nozzle 41 to the connector 75 to be supplied to the cleaning fluid nozzle 71 via the cleaning fluid passage 72, causing the cleaning fluid nozzle 71 to begin discharging the cleaning fluid. The cleaning fluid discharged from the cleaning fluid nozzle 71 directly strikes the outer surface of the spin chuck 10, which is an example of the object to be cleaned, and then flows downward along the outer surface of the spin chuck 10. The cleaning fluid then flows down into the innermost cup 23 and is discharged from the cup 23 through the drain port of the cup 23.

[0128] When the cleaning solution nozzle 71 is discharging cleaning solution, the operator may perform at least one of the following: flow rate adjustment, discharge angle adjustment, height adjustment, and rotation adjustment.

[0129] Flow rate adjustment involves the operator increasing or decreasing the flow rate of cleaning fluid discharged from the cleaning fluid nozzle 71 by operating the handle 74h of the cleaning fluid valve 74. Discharge angle adjustment involves the operator changing the angle of the cleaning fluid nozzle 71 relative to the connector 75. Height adjustment involves the operator changing the vertical position of the cleaning fluid nozzle 71 relative to the connector 75. Rotation adjustment involves the operator rotating the cleaning attachment 70 relative to the nozzle base 41b of the lower nozzle 41.

[0130] After the outer surface of the spin chuck 10 is cleaned by the cleaning fluid discharged from the cleaning fluid nozzle 71, the operator closes the cleaning fluid valve 74 by operating the handle 74h of the cleaning fluid valve 74. This stops the cleaning fluid nozzle 71 from discharging the cleaning fluid. Subsequently, the operator closes the rinse fluid valve 41v for the bottom nozzle 41 by operating the substrate processing apparatus 1. Then, the operator disconnects the connector 75 from the nozzle base 41b of the bottom nozzle 41 and moves the cleaning attachment 70 outside the chamber 4. After that, the operator attaches the nozzle head 41h of the bottom nozzle 41 to the nozzle base 41b of the bottom nozzle 41. If the maintenance cover 5c has been moved, the operator returns the maintenance cover 5c to its original position.

[0131] When cleaning the outer surface of the spin chuck 10 with cleaning fluid discharged from the cleaning fluid nozzle 71, the operator may discharge the cleaning fluid from the cleaning fluid nozzle 71 toward the downstream end of the internal gap 68, as shown in an enlarged view in Figure 9. In other words, the operator may adjust at least one of the angle and position of the cleaning fluid nozzle 71 so that the cleaning fluid hits the vicinity of the boundary between the spin base 12 and the lower housing 15.

[0132] When the substrate W held in the spin chuck 10 is treated with a processing solution, foreign matter such as crystals precipitated from the processing solution may adhere to the vicinity of the boundary between the spin base 12 and the lower housing 15 on the outer surface of the spin chuck 10. If the amount of foreign matter adhering to this boundary increases, the flow of gas within the internal gap 68 may change, and the amount of gas in the internal gap 68 passing through the permeable portion 67b of the spin base 12 (see Figure 3) may decrease. Similarly, the amount of gas in the internal gap 68 passing through the permeable portion 67h of the lower housing 15 (see Figure 3) may decrease.

[0133] When such gas decreases, foreign matter such as dust becomes more difficult to remove from the transparent portion 67h of the lower housing 15. The same applies to the transparent portion 67b of the spin base 12. Light emitted by the light-emitting element 66e and light reflected by the reflector 65 pass through the transparent portion 67b of the spin base 12 and the transparent portion 67h of the lower housing 15. When foreign matter such as dust increases, the detection accuracy of the position of the chuck pin 11 decreases. By cleaning the area near the boundary between the spin base 12 and the lower housing 15 on the outer surface of the spin chuck 10 with a cleaning solution, this decrease in detection accuracy can be prevented or mitigated.

[0134] If the cleaning attachment 70 includes a camera 91 (see Figure 8), the operator may perform at least one of the following: pre-cleaning photography, cleaning photography, and post-cleaning photography.

[0135] Pre-cleaning photography involves photographing the outer surface of the spin chuck 10 with the camera 91 to confirm the areas to be cleaned by the cleaning fluid discharged from the cleaning fluid nozzle 71 before the cleaning fluid is discharged from the nozzle 71. In-cleaning photography involves photographing the outer surface of the spin chuck 10 with the camera 91 while the cleaning fluid is being discharged from the cleaning fluid nozzle 71 toward the outer surface of the spin chuck 10. Post-cleaning photography involves stopping the discharge of cleaning fluid from the cleaning fluid nozzle 71 and then photographing the areas to which the cleaning fluid was supplied with the cleaning fluid using the camera 91.

[0136] Next, the effects of this embodiment will be described.

[0137] In this embodiment, the connector 75 of the cleaning attachment 70 is detachable from the liquid nozzle or liquid passage. The lower nozzle 41 is an example of a liquid nozzle. The cleaning liquid nozzle 71 discharges cleaning liquid supplied from the liquid supply source of the substrate processing apparatus 1 via the connector 75 and the cleaning liquid passage 72 toward the object to be cleaned, such as the outer surface of the spin chuck 10. This allows the object to be cleaned with the cleaning liquid.

[0138] Since the cleaning attachment 70 can be attached to and detached from the substrate processing apparatus 1, the cleaning attachment 70 can be placed outside the chamber 4 when not in use. Therefore, it is possible to prevent mist or vapor of liquids other than the cleaning solution from adhering to the cleaning attachment 70.

[0139] Furthermore, since the liquid supplied from the liquid supply source of the substrate processing apparatus 1 is used as the cleaning fluid, there is no need to provide a dedicated liquid supply source, and the piping and valves of the substrate processing apparatus 1 can be used as part of the cleaning attachment 70. In addition, whether the connector 75 is connected to the liquid nozzle or the liquid passage, the distance from the connector 75 to the cleaning fluid nozzle 71 can be shortened compared to when the liquid nozzle and liquid passage are located outside the chamber 4. This makes it possible to miniaturize the cleaning attachment 70.

[0140] In this embodiment, the nozzle holder 81 connects the cleaning fluid nozzle 71 to the connector 75, maintaining a constant angle and position of the cleaning fluid nozzle 71 relative to the connector 75. Therefore, by positioning the cleaning fluid nozzle 71 appropriately, the cleaning fluid discharged from the nozzle 71 can be continuously directed to the desired location. This ensures reliable cleaning of the target object, such as the outer surface of the spin chuck 10.

[0141] The nozzle holder 81 is deformable. When the nozzle holder 81 is deformed, at least one of the angle and position of the cleaning fluid nozzle 71 relative to the connector 75 changes. When the angle of the cleaning fluid nozzle 71 relative to the connector 75 changes, the position to which the cleaning fluid discharged from the cleaning fluid nozzle 71 strikes changes. The same is true when the position of the cleaning fluid nozzle 71 relative to the connector 75 changes. Therefore, by changing at least one of the angle and position of the cleaning fluid nozzle 71 relative to the connector 75, the position to be cleaned by the cleaning fluid discharged from the cleaning fluid nozzle 71 can be changed.

[0142] In this embodiment, in addition to the nozzle holder 81 being deformable, the cleaning fluid nozzle 71 is movable relative to the nozzle holder 81. When the cleaning fluid nozzle 71 moves relative to the nozzle holder 81, at least one of the angle and position of the cleaning fluid nozzle 71 relative to the connector 75 changes. Moving the cleaning fluid nozzle 71 relative to the nozzle holder 81 allows for finer adjustment of the angle and position of the cleaning fluid nozzle 71 compared to when the nozzle holder 81 is deformed. Combining the deformation of the nozzle holder 81 with the movement of the cleaning fluid nozzle 71 relative to the nozzle holder 81 increases the degree of freedom in adjusting the angle and position.

[0143] In this embodiment, a connector 75 is detachable from a bottom nozzle 41, which is an example of a liquid nozzle. The bottom nozzle 41 discharges liquid toward the bottom surface of the substrate W held by the spin chuck 10. The bottom nozzle 41 is positioned near the spin chuck 10. The cleaning liquid nozzle 71 is positioned around the spin chuck 10. Therefore, by supplying cleaning liquid from the bottom nozzle 41, the distance from the connector 75 to the cleaning liquid nozzle 71 can be shortened, and the cleaning attachment 70 can be miniaturized.

[0144] In this embodiment, the cleaning attachment 70 is rotatable around a straight line perpendicular to the lower nozzle 41 (the vertical center line of the nozzle base 41b) while the connector 75 remains attached to the lower nozzle 41. When the cleaning attachment 70 is rotated relative to the lower nozzle 41, the position where the cleaning liquid discharged from the cleaning liquid nozzle 71 collides with the nozzle moves in the direction of rotation of the cleaning attachment 70. This allows the cleaning liquid to directly impact a wider area.

[0145] In this embodiment, the camera 91 is provided on the cleaning attachment 70. When the cleaning attachment 70 is attached to the substrate processing apparatus 1, not only the cleaning liquid nozzle 71 but also the camera 91 is positioned around the spin chuck 10. The camera 91 photographs objects to be photographed inside the chamber 4, such as the object to be cleaned, while the cleaning attachment 70 is attached to the substrate processing apparatus 1. Therefore, the location to be cleaned, i.e., the contaminated location, can be determined based on the image from the camera 91. If the camera 91 takes pictures during or after cleaning, it can be determined whether or not the area has been cleaned based on the image from the camera 91.

[0146] In this embodiment, the nozzle holder 81 connects not only the cleaning fluid nozzle 71 but also the camera 91 to the connector 75. Therefore, the cleaning attachment 70 can be made smaller compared to the case where the cleaning fluid nozzle 71 and the camera 91 are held in separate holders. Since the cleaning fluid nozzle 71 and the camera 91 are held in the same holder (nozzle holder 81), the camera 91 is positioned close to the cleaning fluid nozzle 71. The camera 91 photographs the same location near the location to be cleaned by the cleaning fluid. Therefore, the condition of the object to be photographed before, after, and during cleaning can be more accurately understood based on the images from the camera 91.

[0147] Next, a second embodiment will be described.

[0148] In Figure 10, components equivalent to those shown in Figures 1A to 9 are given the same reference numerals as in Figure 1A, etc., and their descriptions are omitted.

[0149] The main difference between the second embodiment and the first embodiment is that the cleaning attachment 70 rotates together with the spin base 12. Unless otherwise specified, the cleaning attachment 70 in use will be described below.

[0150] Figure 10 is a schematic diagram of the cleaning attachment 70 according to the second embodiment, viewed horizontally. The cleaning attachment 70 according to the second embodiment includes a connector 75 according to the second embodiment in place of the connector 75 according to the first embodiment. Except for the connector 75, the cleaning attachment 70 according to the second embodiment has the same configuration as the cleaning attachment 70 according to the first embodiment.

[0151] As shown in Figure 10, the connector 75 according to the second embodiment includes a horizontal disc portion 75p positioned above the lower nozzle 41 and a cylindrical portion 75c surrounding the lower nozzle 41. The cylindrical portion 75c extends downward from the disc portion 75p. No part of the connector 75 is in contact with the lower nozzle 41.

[0152] The lower surface of the disc portion 75p of the connector 75 corresponds to a non-contact surface that does not come into contact with the lower nozzle 41. The lower surface of the disc portion 75p is positioned above the discharge port 41o of the lower nozzle 41. The lower surface of the disc portion 75p is parallel to the upper surface of the lower nozzle 41. The lower surface of the disc portion 75p faces the upper surface of the lower nozzle 41 directly in the vertical direction.

[0153] The connector 75 includes an internal channel 75i that guides cleaning fluid from the liquid supply source of the substrate processing apparatus 1 to the cleaning fluid channel 72. Figure 10 shows an example in which the internal channel 75i guides cleaning fluid from the discharge port 41o of the lower nozzle 41 to the cleaning fluid channel 72. The internal channel 75i opens at two locations on the surface of the connector 75, namely, a location on the lower surface of the disc portion 75p and a location on the upper surface of the disc portion 75p. The internal channel 75i is connected directly or indirectly to the cleaning fluid channel 72.

[0154] The cleaning attachment 70 includes a ring-shaped packing 76 that seals the gap between the upper surface of the lower nozzle 41 and the lower surface of the disc portion 75p around the discharge port 41o of the lower nozzle 41. Figure 10 shows an example where the packing 76 is an O-ring.

[0155] The packing 76 protrudes downward from an annular groove that is recessed upward from the lower surface of the disc portion 75p. The processing liquid discharged from the outlet 41o of the lower nozzle 41 passes inside the packing 76 and enters the internal flow path 75i of the connector 75. As the cleaning attachment 70 rotates with the spin base 12 in the rotational direction of the spin chuck 10, the packing 76 rotates with the connector 75 while sealing the gap between the lower nozzle 41 and the connector 75.

[0156] The connector 75 is attached to the base body 12b of the spin base 12 in place of the base cover 12c (see Figure 3) of the spin base 12. Figure 10 shows an example where the cylindrical portion 75c of the connector 75 is inserted into the recess 12r of the base body 12b and protrudes upward from the top surface of the base body 12b. The connector 75 is attachable to and detachable from the base body 12b. The connector 75 rotates with the base body 12b. When the connector 75 is attached to the base body 12b, the cleaning attachment 70 is not in contact with the lower housing 15 and is not in contact with any other components in the chamber 4 besides the spin chuck 10.

[0157] When the spin motor 14 rotates the base body 12b with the connector 75 attached to the base body 12b of the spin base 12, the cleaning attachment 70 also rotates without or with minimal relative rotation between the connector 75 and the base body 12b. The connector 75 may be held to the base body 12b by the frictional force acting between the cylindrical portion 75c of the connector 75 and the recess 12r of the base body 12b. In this case, an O-ring may be interposed between the outer circumferential surface of the cylindrical portion 75c and the inner circumferential surface of the recess 12r.

[0158] If the connector 75 is removable from the spin base 12, the connector 75 may be held in place by a force other than friction. For example, the connector 75 may be fixed to the spin base 12 or the spin shaft 13 by bolts. The connector 75 may also be fixed to the spin base 12 by attaching the male threads on the connector 75 to the female threads on the base body 12b or the spin shaft 13.

[0159] When cleaning the spin chuck 10 with the cleaning attachment 70, the cleaning attachment 70 is attached to the substrate processing apparatus 1 in the same manner as in the first embodiment, except that the connector 75 of the cleaning attachment 70 is attached to the base body 12b of the spin base 12 instead of the nozzle base 41b of the lower nozzle 41. After that, the operator performs the following tasks.

[0160] Specifically, with the connector 75 of the cleaning attachment 70 attached to the base body 12b of the spin base 12 and the cleaning fluid nozzle 71 positioned in the discharge position, the operator opens the rinse fluid valve 41v (see Figure 2) for the bottom nozzle 41 by operating the substrate processing apparatus 1. Subsequently, the operator opens the cleaning fluid valve 74 by operating the handle 74h of the cleaning fluid valve 74. As a result, the cleaning fluid supplied from the bottom nozzle 41 to the connector 75 is supplied to the cleaning fluid nozzle 71 via the cleaning fluid passage 72, and the cleaning fluid nozzle 71 begins to discharge the cleaning fluid.

[0161] After the cleaning solution nozzle 71 begins discharging the cleaning solution, the operator may operate the substrate processing apparatus 1 to cause the spin motor 14 to rotate the spin base 12 at the cleaning speed (for example, a speed in the range of 10 to 100 rpm). In this way, the cleaning attachment 70 rotates 360 degrees or more at the cleaning speed together with the spin base 12.

[0162] The operator may rotate the cleaning attachment 70 while discharging cleaning fluid from the cleaning fluid nozzle 71, or rotate the cleaning attachment 70 while stopping the discharge of cleaning fluid from the cleaning fluid nozzle 71. In the latter case, the operator may alternately perform attachment rotation, which moves the cleaning attachment 70 in the rotational direction of the spin chuck 10, and discharge, which discharges cleaning fluid from the cleaning fluid nozzle 71, one or more times.

[0163] The cleaning fluid discharged from the cleaning fluid nozzle 71 directly strikes the outer surface of the spin chuck 10, and then flows downward along the outer surface of the spin chuck 10. As the cleaning attachment 70 rotates together with the spin base 12, the position where the cleaning fluid discharged from the cleaning fluid nozzle 71 directly strikes the spin chuck 10 moves in the direction of the spin chuck 10's rotation. This allows a wider area within the outer surface of the spin chuck 10 to be cleaned with the cleaning fluid.

[0164] When the cleaning fluid nozzle 71 is discharging cleaning fluid, or when it is not, the operator may temporarily stop the rotation of the spin motor 14 and perform at least one of the aforementioned flow rate adjustment, discharge angle adjustment, and height adjustment.

[0165] If the cleaning attachment 70 includes a camera 91 (see Figure 8), the operator may perform at least one of the following: pre-cleaning photography, in-cleaning photography, and post-cleaning photography.

[0166] When the cleaning solution nozzle 71 is discharging cleaning solution, the operator may open the inert gas valve 43v (see Figure 2) by operating the substrate processing apparatus 1 to supply gas to the gas flow path 43. In this case, through holes 75h (see Figure 10) opened on the inner and outer surfaces of the connector 75 may be provided in the connector 75 to discharge the gas inside the connector 75.

[0167] After the outer surface of the spin chuck 10 is cleaned by the cleaning fluid discharged from the cleaning fluid nozzle 71, the operator closes the cleaning fluid valve 74 and the rinse fluid valve 41v. Then, the operator disconnects the connector 75 from the base body 12b of the spin base 12 and moves the cleaning attachment 70 outside the chamber 4. Next, the operator attaches the base cover 12c of the spin base 12 to the base body 12b of the spin base 12. If the maintenance cover 5c was moved, the operator returns the maintenance cover 5c to its original position.

[0168] In the second embodiment, in addition to the effects of the first embodiment, the following effects can be achieved.

[0169] In this embodiment, the connector 75 is attachable to and detachable from both the bottom nozzle 41 and the spin chuck 10. When the spin chuck 10 rotates with the connector 75 attached to both the bottom nozzle 41 and the spin chuck 10, the cleaning attachment 70 rotates in this state. Therefore, the spin chuck 10 (more precisely, the spin motor 14) can be used as part of the cleaning attachment 70 to semi-automatically clean the object to be cleaned. The force that rotates the cleaning attachment 70 is transmitted from the spin chuck 10 to the connector 75. Even when the cleaning attachment 70 rotates, the connector 75 remains attached to the bottom nozzle 41. Therefore, cleaning fluid can be discharged from the cleaning fluid nozzle 71 before, after, and during the rotation of the cleaning fluid nozzle 71.

[0170] In this embodiment, when the spin chuck 10 rotates, the outer circumferential surface 12o of the spin base 12, which corresponds to the rotating portion of the outer circumferential surface of the spin chuck 10, rotates relative to the outer circumferential surface 15o of the lower housing 15, which corresponds to the non-rotating portion of the outer circumferential surface of the spin chuck 10. When the connector 75 is attached to the lower nozzle 41 and the spin chuck 10, the cleaning fluid nozzle 71 is positioned so that it discharges cleaning fluid at least toward the outer circumferential surface 15o of the lower housing 15. When the spin chuck 10 rotates, the point of impact of the cleaning fluid moves within the outer circumferential surface 15o of the lower housing 15 in the direction of rotation of the spin chuck 10. Therefore, a wider area within the outer circumferential surface 15o of the lower housing 15 can be cleaned with the cleaning fluid. The entire circumference of the lower housing 15 can also be cleaned with the cleaning fluid.

[0171] Next, a third embodiment will be described.

[0172] In Figure 11 below, configurations equivalent to those shown in Figures 1A to 10 above are given the same reference numerals as in Figure 1A, etc., and their descriptions are omitted.

[0173] The main difference between the third embodiment and the first embodiment is that the cleaning attachment 70 is attached to the top nozzle that discharges the processing liquid toward the top surface of the substrate W, rather than to the bottom nozzle 41. Unless otherwise specified, the cleaning attachment 70 in use will be described below.

[0174] Figure 11 is a schematic diagram of the cleaning attachment 70 according to the third embodiment, viewed horizontally. The cleaning attachment 70 according to the third embodiment includes a connector 75 according to the third embodiment in place of the connector 75 according to the first embodiment. Except for the connector 75, the cleaning attachment 70 according to the third embodiment has the same configuration as the cleaning attachment 70 according to the first embodiment.

[0175] The connector 75 according to the third embodiment is attached to a rinse nozzle 32, which is an example of a top nozzle. The connector 75 is attachable to and detachable from the rinse nozzle 32. The connector 75 is located below the rinse nozzle 32. If the cleaning attachment 70 includes a cleaning valve 74, the cleaning valve 74 is located below the connector 75. The cleaning attachment 70 is held by the rinse nozzle 32. When the nozzle actuator 32a moves the rinse nozzle 32, the cleaning attachment 70 also moves horizontally or vertically.

[0176] The connector 75 includes an internal channel 75i that guides cleaning fluid from a rinse fluid nozzle 32, which is an example of a liquid supply source for the substrate processing apparatus 1, to a cleaning fluid passage 72. The internal channel 75i opens at two locations on the surface of the connector 75. The internal channel 75i is connected directly or indirectly to the cleaning fluid passage 72. The rinse fluid nozzle 32 is inserted into the internal channel 75i and protrudes upward from the internal channel 75i. The cleaning attachment 70 may include a sealing ring that seals the gap between the inner surface of the internal channel 75i and the outer surface of the rinse fluid nozzle 32.

[0177] When cleaning the spin chuck 10 with the cleaning attachment 70, the operator moves the rinse liquid nozzle 32 to the nozzle actuator 32a to a position above the center of the spin chuck 10 (the position shown in Figure 11) by operating the substrate processing apparatus 1. Then, the operator attaches the cleaning attachment 70 to the substrate processing apparatus 1 in the same manner as in the first embodiment, except that the connector 75 is attached to the rinse liquid nozzle 32 instead of the nozzle base 41b of the lower nozzle 41 (see Figure 3). After that, the operator performs the following operations.

[0178] Specifically, with the connector 75 attached to the rinse liquid nozzle 32 and the cleaning liquid nozzle 71 positioned in the discharge position, the operator opens the rinse liquid valve 32v for the rinse liquid nozzle 32 by operating the substrate processing apparatus 1. Subsequently, the operator opens the cleaning liquid valve 74 by operating the handle 74h of the cleaning liquid valve 74. As a result, the cleaning liquid supplied from the rinse liquid nozzle 32 to the connector 75 is supplied to the cleaning liquid nozzle 71 via the cleaning liquid passage 72, and the cleaning liquid nozzle 71 begins to discharge the cleaning liquid.

[0179] When the cleaning fluid nozzle 71 is discharging cleaning fluid, or when it is not, the operator may rotate the spin base 12 with the spin motor 14, or keep the spin base 12 stationary. At this time, the operator may move the rinse fluid nozzle 32 and the cleaning attachment 70 up and down with the nozzle actuator 32a. At this time, the operator may perform at least one of the aforementioned flow rate adjustment, discharge angle adjustment, and height adjustment. If the cleaning attachment 70 includes a camera 91 (see Figure 8), the operator may perform at least one of the aforementioned pre-cleaning, in-cleaning, and post-cleaning photography.

[0180] After the outer surface of the spin chuck 10 is cleaned by the cleaning fluid discharged from the cleaning fluid nozzle 71, the operator closes the cleaning fluid valve 74 and the rinsing fluid valve 32v. Then, the operator disconnects the connector 75 from the rinsing fluid nozzle 32 and moves the cleaning attachment 70 outside the chamber 4. Next, the operator moves the rinsing fluid nozzle 32 to the nozzle actuator 32a to the standby position by operating the substrate processing apparatus 1. If the maintenance cover 5c has been moved, the operator returns the maintenance cover 5c to its original position.

[0181] In the third embodiment, the cleaning attachment 70 may be attached to an upper nozzle other than the rinse liquid nozzle 32.

[0182] For example, the cleaning attachment 70 may be attached to a scan nozzle other than the rinse liquid nozzle 32, or it may be attached to a fixed nozzle. The cleaning attachment 70 may also be attached to the central nozzle 55 (see Figure 2), which moves up and down together with the blocking member 51. In other words, the cleaning liquid supplied from the central nozzle 55 to the connector 75 may be supplied to the cleaning liquid nozzle 71 via the cleaning liquid passage 72.

[0183] When the cleaning attachment 70 is attached to the central nozzle 55, the spin chuck 10 can be cleaned using the cleaning attachment 70 in the same manner as described above, except that the nozzle actuator 32a is replaced by the vertical actuator 54v (see Figure 2) and the rinse fluid valve 32v is replaced by the rinse fluid valve 55v (see Figure 2).

[0184] The cleaning attachment 70 may be directly attached to the central nozzle 55, or it may be attached to the central nozzle 55 via a component other than the central nozzle 55, such as a blocking member 51. This is also true when attaching the cleaning attachment 70 to an upper nozzle other than the central nozzle 55. If it is necessary to stabilize the angle and position of the cleaning attachment 70, the connector 75 and the upper nozzle may be connected directly or indirectly by the connector holder of the cleaning attachment 70.

[0185] In the third embodiment, in addition to the effects of the first embodiment, the following effects can be achieved.

[0186] In this embodiment, a connector 75 is attached to and detached from an upper nozzle, which is an example of a liquid nozzle. The upper nozzle discharges liquid toward the upper surface of the substrate W held by the spin chuck 10. Depending on the structure of the spin chuck 10, there may be no lower nozzle 41. Even in such cases, cleaning liquid can be supplied to the cleaning attachment 70 from the liquid supply source of the substrate processing apparatus 1.

[0187] In this embodiment, with the connector 75 attached to the top nozzle, when an actuator such as the nozzle actuator 32a or the vertical actuator 54v moves the top nozzle horizontally or vertically, the cleaning attachment 70 also moves horizontally or vertically. Therefore, the actuator that moves the top nozzle can be used as part of the cleaning attachment 70 to move the cleaning liquid nozzle 71 to a desired position.

[0188] Next, other embodiments will be described.

[0189] The cleaning fluid passage 72 may be formed by the nozzle holder 81 instead of the cleaning fluid piping 73. In this case, the cleaning fluid piping 73 is unnecessary.

[0190] The cleaning fluid valve 74 may be omitted from the cleaning attachment 70. In this case, the operator can open and close valves such as the rinsing fluid valve 41v by operating the substrate processing device 1. If it is necessary to change the flow rate of the cleaning fluid discharged from the cleaning fluid nozzle 71, the operator can change the opening degree of flow rate adjustment valves such as the flow rate adjustment valve 41f by operating the substrate processing device 1.

[0191] The cleaning fluid nozzle 71 may have a plurality of discharge ports 71o spaced apart in at least one of the horizontal and vertical directions. In addition to or instead of this, the cleaning attachment 70 may have a plurality of cleaning fluid nozzles 71 spaced apart in at least one of the horizontal and vertical directions. In this case, the cleaning attachment 70 may have a plurality of nozzle holders 81, each connecting one or more cleaning fluid nozzles 71 to a connector 75.

[0192] The connector 75 of the cleaning attachment 70 may be attachable to and detachable from nozzles that discharge liquid within the chamber 4, excluding the top nozzle and bottom nozzle 41. The connector 75 of the cleaning attachment 70 may also be attachable to and detachable from piping such as the rinse liquid piping 32p, rather than from nozzles.

[0193] This disclosure includes the imaging attachment described in the following paragraph. That is, if the cleaning attachment 70 includes a camera 91, the cleaning attachment 70 does not have to include a cleaning fluid nozzle 71 and a cleaning fluid passage 72. The connector 75 does not have to have an internal passage 75i that guides the cleaning fluid toward the cleaning fluid nozzle 71.

[0194] A photographic attachment for photographing the substrate processing apparatus 1, The substrate processing apparatus 1 is A spin chuck 10 rotates the substrate W while holding it horizontally, The chamber 4 housing the spin chuck 10, A liquid nozzle that discharges liquid within the chamber 4, The system includes a liquid passage that guides the liquid to be supplied to the liquid nozzle into the chamber 4, The aforementioned imaging attachment is detachable from the substrate processing apparatus 1. A camera 91 is positioned around the spin chuck 10, A connector 75 that can be attached to and detached from the mounting member inside the chamber 4, A shooting attachment comprising: a camera holder that maintains a constant angle and position of the camera 91 relative to the connector 75 by connecting the camera 91 to the connector 75.

[0195] The mounting member includes at least one of the following: the spin chuck 10, the liquid nozzle, the cylindrical guard 24 surrounding the spin chuck 10, and the blocking member 51 positioned above the spin chuck 10. The object of the camera 91 to be photographed may be at least one of the outer circumferential surface of the spin chuck 10, the inner circumferential surface of the guard 24, and the inner surface of the cup 23.

[0196] You may combine two or more of the above-mentioned configurations. You may also combine two or more of the above-mentioned processes.

[0197] Although embodiments of the present invention have been described in detail, these are merely specific examples used to clarify the technical content of the present invention, and the present invention should not be construed as being limited to these specific examples. The spirit and scope of the present invention are limited only by the appended claims. [Explanation of Symbols]

[0198] 1: Substrate processing device, 10: Spin chuck, 11: Chuck pin, 12: Spin base, 12b: Base body, 12c: Base cover, 12o: Outer surface, 12r: Recess, 12s: Central space, 12u: Top surface, 12x: Annular part, 12y: Cylindrical part, 13: Spin axis, 14: Spin motor, 15: Lower housing, 15o: Outer surface, 32: Rinse liquid nozzle, 32a: Nozzle actuator, 32p: Rinse liquid dispenser Pipe, 32v: Rinse liquid valve, 41: Bottom nozzle, 41b: Nozzle base, 41f: Flow rate adjustment valve, 41h: Nozzle head, 41o: Discharge port, 41p: Rinse liquid piping, 41v: Rinse liquid valve, 41x: Disc section, 41y: Cylindrical section, 51: Shut-off member, 51L: Bottom, 52: Disc section, 53: Support shaft, 54r: Rotary actuator, 54v: Vertical actuator, 55: Center nozzle, 55p: Rinse liquid piping, 55 v: Rinse fluid valve, 61: Cam, 62: Driven magnet, 63: Driven magnet, 64: Opening / closing actuator, 65: Reflector, 66e: Light-emitting element, 66r: Light-receiving element, 67b: Transmitting part, 67h: Transmitting part, 68: Internal gap, 68p: Inert gas piping, 68v: Inert gas valve, 70: Cleaning attachment, 71: Cleaning fluid nozzle, 71o: Discharge port, 72: Cleaning fluid passage, 73: Cleaning fluid piping, 74: Cleaning fluid valve, 74b : Valve body, 74e: Valve element, 74h: Handle, 75: Connector, 75c: Cylindrical part, 75h: Through hole, 75i: Internal flow path, 75p: Disc part, 76: Packing, 81: Nozzle holder, 82: Arm, 83: Joint, 84: Arm, 85: Joint, 86: Arm, 87: Joint, 91: Camera, 91L: Lens, 92: Bracket, 93: Mobile terminal, 94: Shooting area, 95: Liquid impact position, A1: Rotation axis, W: Substrate

Claims

1. A cleaning attachment for cleaning a substrate processing device, The substrate processing apparatus is A spin chuck that rotates the circuit board while holding it horizontally, A chamber housing the aforementioned spin chuck, A liquid nozzle for discharging liquid within the chamber, The system includes a liquid passage that guides the liquid to be supplied to the liquid nozzle into the chamber, The cleaning attachment is removable from the substrate processing apparatus. A cleaning fluid nozzle is arranged around the spin chuck, A cleaning fluid passage that guides the cleaning fluid to be discharged from the cleaning fluid nozzle to the cleaning fluid nozzle, A cleaning attachment comprising a connector that is attachable to and detachable from a liquid supply source corresponding to the liquid nozzle or liquid channel, and which guides the liquid, as a cleaning solution, from the liquid supply source to the cleaning liquid channel.

2. The cleaning attachment further includes a nozzle holder that maintains a constant angle and position of the cleaning liquid nozzle relative to the connector by connecting the cleaning liquid nozzle to the connector. The nozzle holder is deformable, The cleaning attachment according to claim 1, wherein at least one of the angle and position of the cleaning fluid nozzle relative to the connector changes with deformation of the nozzle holder.

3. The cleaning attachment according to claim 2, wherein the cleaning solution nozzle is movable relative to the nozzle holder.

4. The liquid nozzle includes a bottom nozzle that discharges the liquid toward the bottom surface of the substrate held in the spin chuck, The cleaning attachment according to any one of claims 1 to 3, wherein the connector is attachable to and detachable from the lower nozzle.

5. The cleaning attachment according to claim 4, wherein the cleaning attachment is rotatable around a straight line perpendicular to the lower nozzle while the connector remains attached to the lower nozzle.

6. The connector is attachable to and detachable from the lower nozzle and spin chuck. The cleaning attachment according to claim 5, wherein when the spin chuck rotates, the cleaning attachment rotates around the vertical line with respect to the lower nozzle, while the connector remains attached to the lower nozzle and the spin chuck.

7. The outer circumferential surface of the spin chuck includes a rotating portion that rotates when the spin chuck rotates and a non-rotating portion that does not rotate when the spin chuck rotates. The cleaning attachment according to claim 6, wherein the cleaning liquid nozzle is positioned to discharge the cleaning liquid toward the non-rotating part.

8. The cleaning attachment according to any one of claims 1 to 3, further comprising a camera positioned around the spin chuck.

9. The cleaning attachment according to claim 8, further comprising a nozzle holder that maintains a constant angle and position of the cleaning solution nozzle and camera relative to the connector by connecting the cleaning solution nozzle and camera to the connector.

10. The liquid nozzle includes an upper nozzle that discharges the liquid toward the upper surface of the substrate held by the spin chuck, The cleaning attachment according to any one of claims 1 to 3, wherein the connector is attachable to and detachable from the upper nozzle.

11. The substrate processing apparatus further includes an actuator for moving the upper nozzle, The cleaning attachment according to claim 10, wherein, with the connector attached to the upper nozzle, when the actuator moves the upper nozzle, the cleaning attachment also moves.

Images