vehicle-mounted machines

Abstract

The aim is to provide in-vehicle equipment that achieves high-performance boiling cooling while simultaneously reducing the overall weight of the device. [Solution] The device comprises a substrate 2 on which electronic components 3 are mounted, a heat conductive member 8 that contacts the electronic components 3 mounted on the substrate 2, and a housing 6 that houses the substrate 2, the heat conductive member 8, and the coolant liquid 50 in its internal space. The heat conductive member 8 is positioned so that at least a portion of it is immersed in the coolant liquid 50. The heat conductive member 8 has a transport section that transports the coolant liquid 50 from the portion immersed in the coolant liquid 50 to the portion not immersed in the coolant liquid 50 by capillary action.

Description

Technical Field

[0001] The present invention relates to in-vehicle devices.

Background Art

[0002] Generally, vehicles such as automobiles are equipped with a plurality of electronic control units (ECUs) to control various objects including engines, power steering, brakes, airbags, and the like. The electronic control device mounted on a vehicle (hereinafter referred to as an "in-vehicle device") is composed of a substrate on which electronic components are mounted and a housing that houses this substrate.

[0003] In recent years, the demand for advanced driver assistance systems (hereinafter referred to as ADAS) and autonomous driving (hereinafter referred to as AD) systems has increased, and the development of autonomous driving technology for automobiles has accelerated. Along with the higher functionality of electronic control devices, the amount of heat generated by the mounted electronic components has been increasing. Therefore, conventionally, as a method for cooling the electronic components (heat-generating components) mounted on the substrate, a boiling cooling method has been proposed in which a refrigerant liquid is boiled by the heat of the electronic components to cool the electronic components.

[0004] As this type of conventional in-vehicle device, for example, there is one as described in Patent Document 1. Patent Document 1 describes a boiling cooling device having a heat-receiving part to which a cooling object is attached and a heat-radiating part, and in which a refrigerant liquid in contact with the heat-receiving part boils and evaporates to transport heat to the heat-radiating part.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, in the technology described in Patent Document 1, in order to cool the heat-generating component, the entire heat-generating component was immersed in the refrigerant liquid within a container filled with the refrigerant liquid. Therefore, in order to immerse the entire heat-generating component in the refrigerant liquid, it was necessary to fill the entire internal space of the housing with the refrigerant liquid, which increased the amount of refrigerant liquid and thus increased the overall weight of the device.

[0007] The objective of this project is to provide an in-vehicle device that achieves high-performance boiling cooling while reducing the overall weight of the device, taking into consideration the problems mentioned above. [Means for solving the problem]

[0008] To solve the above problems and achieve the objective, an in-vehicle device reflecting one aspect of the present invention comprises a substrate on which electronic components are mounted, a heat conductive member that contacts the electronic components mounted on the substrate, and a housing that houses the substrate, the heat conductive member, and a refrigerant liquid in an internal space. The heat conductive member is arranged so that at least a portion of it is immersed in the refrigerant liquid. The heat conductive member has a transport section that transports the refrigerant liquid from the portion immersed in the refrigerant liquid to the portion that is not immersed in the refrigerant liquid by capillary action. [Effects of the Invention]

[0009] According to the above configuration of the in-vehicle equipment, it is possible to achieve high-performance boiling cooling while reducing the overall weight of the equipment. Furthermore, issues, configurations, and effects other than those mentioned above will be clarified by the following description of the embodiments. [Brief explanation of the drawing]

[0010] [Figure 1] This is an exploded perspective view showing an in-vehicle device according to the first embodiment. [Figure 2] This is a perspective view showing an in-vehicle device according to the first embodiment. [Figure 3] This figure shows an example of the implementation of in-vehicle equipment according to the first embodiment. [Figure 4] This is a cross-sectional view showing an in-vehicle device according to the first embodiment. [Figure 5] This is a cross-sectional view showing the in-vehicle equipment according to the first embodiment in a tilted state. [Figure 6] This is a cross-sectional view showing the in-vehicle equipment according to the first embodiment in a horizontally laid position. [Figure 7] This is a cross-sectional view showing the in-vehicle equipment according to the first embodiment laid flat, with the equipment inverted vertically from the state shown in Figure 6. [Figure 8] This is a perspective view showing another example of a heat conduction member for an in-vehicle device according to the first embodiment. [Figure 9] This figure shows an example of the implementation of in-vehicle equipment according to the second embodiment. [Modes for carrying out the invention]

[0011] The embodiments of the in-vehicle equipment will be described below with reference to Figures 1 to 9. The embodiments of the present invention will be described below with reference to the drawings. The following description and drawings are illustrative for explaining the present invention, and have been omitted and simplified as appropriate for clarity of explanation. The present invention can be implemented in various other forms. Unless otherwise specified, each component may be singular or plural. In each figure, common components are denoted by the same reference numeral.

[0012] The positions, sizes, shapes, and ranges of the components shown in the drawings may not represent their actual positions, sizes, shapes, and ranges in order to facilitate understanding of the invention. Therefore, the present invention is not necessarily limited to the positions, sizes, shapes, and ranges disclosed in the drawings.

[0013] 1. Example of the first embodiment First, the configuration of the in-vehicle equipment according to the embodiment example (hereinafter referred to as "this example") will be described with reference to Figures 1 to 7. Figure 1 is an exploded perspective view showing the in-vehicle equipment, and Figure 2 is a perspective view showing the in-vehicle equipment.

[0014] The device shown in FIG. 1 is an example of in-vehicle equipment mounted on an automobile, and is an electronic control device having an electronic circuit for controlling the automobile. Note that the in-vehicle equipment is not limited to the electronic control device, and various other in-vehicle equipment can be applied as long as it has heat-generating components.

[0015] As shown in FIGS. 1 and 2, the in-vehicle device 1 includes a substrate 2, an electronic component indicating a heat-generating component mounted on the substrate 2, a cover 5 and a case 6 constituting the housing, a substrate-side connector 7, a heat conduction member 8, a radiation fin 10, and a case-side connector 12. The substrate 2 may be a single-layer substrate or a multilayer substrate. A plurality of electronic components are mounted on one surface of the substrate 2.

[0016] As the electronic components, for example, arithmetic devices such as a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), a SoC (System on a Chip), and a SiP (System in a Package) are applicable. Also, as the electronic components, for example, storage devices such as DDR SDRAM, power supply ICs, coils, capacitors, etc. are applicable. Here, at least one electronic component exceeding a predetermined heat generation amount among the plurality of electronic components is defined as the heat-generating component 3. In this example, the heat-generating component 3 is arranged at the central part of the substrate 2.

[0017] Also, a substrate-side connector 7 is attached to the edge of the substrate 2. And, on the substrate 2, wiring patterns for connecting the plurality of electronic components to each other or an electronic component and the substrate-side connector 7 are formed.

[0018] Furthermore, a heat conduction member 8 is attached to the substrate 2 via the heat-generating component 3. The heat conduction member 8 is arranged to face the surface of the substrate 2 on which the electronic components are mounted. The heat conduction member 8 may be directly joined to the heat-generating component 3, or may be attached to the substrate 2 with the heat-generating component 3 interposed therebetween. And, heat from the heat-generating component 3 is transmitted to the heat conduction member 8. Note that the detailed configuration of the heat conduction member 8 will be described later.

[0019] The substrate 2, electronic components, heat conductive member 8, and substrate-side connector 7, having the above-described configuration, are housed in the internal space of the cover 5 and case 6 that constitute the housing. The case 6 is formed in a flat, hollow, substantially rectangular parallelepiped shape with one side open. The case 6 has a housing section 6a that houses the substrate 2, electronic components, heat conductive member 8, and substrate-side connector 7. One side of the housing section 6a is open.

[0020] The cover 5 is formed in a flat plate shape. The cover 5 is attached to the case 6 so as to close the opening formed in the case 6. The cover 5 and case 6 together form a hollow, flat, roughly rectangular parallelepiped housing.

[0021] Furthermore, an O-ring 11 is positioned on the outer edge of the opening of case 6. The O-ring 11 is interposed between case 6 and cover 5. As a result, the internal space between case 6 and cover 5 is sealed liquid-tight by the O-ring 11. The internal space formed by case 6 and cover 5 is then filled with refrigerant liquid 50 (see Figure 4).

[0022] Furthermore, a case-side connector 12 is located on the side wall 6b of case 6. The terminals on the case-side connector 12 that connect to the board-side connector 7 are provided on the housing portion 6a side of case 6. Therefore, the board-side connector 7 and the case-side connector 12 are electrically connected within the internal space enclosed by case 6 and cover 5 (see Figure 4). As a result, leakage of the refrigerant liquid 50 from the connection point between the board-side connector 7 and the case-side connector 12 can be prevented, and the refrigerant liquid 50 can be reliably sealed inside the housing.

[0023] The cover 5 and case 6 having the above-described configuration are preferably made of a metal material with excellent thermal conductivity, such as aluminum or copper.

[0024] Furthermore, a plurality of heat dissipation fins 10 are provided on the other side of the case 6 opposite to the side where the opening is formed. The heat dissipation fins 10 are formed, for example, by bending a flat plate-shaped member into a roughly V-shape. However, the heat dissipation fins 10 are not limited to a configuration in which a flat plate-shaped member is bent; flat plate-shaped members protruding from the other side of the case 6 may be arranged in a row, and various other shapes can be applied.

[0025] The heat dissipation fins 10 are formed from a metal material with excellent thermal conductivity, such as aluminum or copper. Air flowing through the heat dissipation fins 10 promotes heat exchange, thereby enabling the cooling of the entire in-vehicle equipment 1.

[0026] In this example, the heat dissipation fins 10 are described in an example where they are provided on the case 6, but the invention is not limited to this, and the heat dissipation fins 10 may also be provided on the cover 5. Furthermore, the present invention can achieve its objectives even without providing the heat dissipation fins 10.

[0027] Figure 3 shows an example of the implementation of the in-vehicle device 1 having the configuration described above. As shown in Figure 3, the in-vehicle device 1 is positioned with the other side of the case 6, where the heat dissipation fins 10 are provided, facing parallel to the vertical direction. In other words, the in-vehicle device 1 is positioned vertically, with the housing consisting of the case 6 and cover 5 in a vertical orientation.

[0028] Furthermore, the automobile is equipped with multiple in-vehicle devices 1. These multiple in-vehicle devices 1 are arranged vertically, with the covers 5 and heat dissipation fins 10 of adjacent in-vehicle devices 1 facing each other. By circulating air between the multiple in-vehicle devices 1, the devices 1 can be cooled.

[0029] Furthermore, the case-side connector 12 of the in-vehicle device 1 is connected to a vehicle-side device (not shown). The case-side connectors 12 of multiple in-vehicle devices 1 can each be disconnected from the vehicle-side device. This allows only the faulty in-vehicle device 1 to be replaced if any of the multiple in-vehicle devices 1 fail. In addition, the number of in-vehicle devices 1 installed can be increased or decreased according to the performance requirements of the vehicle, thus increasing the flexibility of the configuration of the in-vehicle devices 1.

[0030] Next, the configuration of the heat conduction member 8 will be described with reference to Figures 4 to 7. Figure 4 is a cross-sectional view showing the in-vehicle device 1.

[0031] As shown in Figure 4, the heat conductive member 8 is formed in a substantially flat, approximately circular shape. Furthermore, when viewed from a direction perpendicular to the surface of the substrate 2, the heat conductive member 8 is formed to be larger than the outer diameter of the heat-generating component 3. Therefore, when viewed from a direction perpendicular to the surface of the substrate 2, the heat conductive member 8 covers the entire heat-generating component 3.

[0032] Furthermore, the heat conductive member 8 is formed from a porous material or a structure having a fine groove structure. The heat conductive member 8 is composed of, for example, a sintered body of resin or metal fibers or particles. Because the heat conductive member 8 has fine pores or grooves, a capillary action occurs within the heat conductive member 8, causing the liquid to move spontaneously. In other words, the heat conductive member 8 has a transport section that transports the refrigerant liquid 50 from the area immersed in the refrigerant liquid 50 to the area not immersed in the refrigerant liquid 50 by capillary action.

[0033] As described above, in general, the surfaces of the case 6 and cover 5 of the in-vehicle equipment 1 are positioned parallel to the vertical direction, and therefore the substrate 2 housed in the case 6 and cover 5 is also positioned so that its surface is approximately parallel to the vertical direction. As a result, the refrigerant liquid 50 filled in the case 6 and cover 5 accumulates on the lower side in the direction of gravity within the internal space of the case 6 and cover 5. At this time, the heat-generating component 3 mounted on the substrate 2 is located above the liquid surface of the refrigerant liquid 50 in the vertical direction (direction of gravity). Therefore, the heat-generating component 3 is not in contact with the refrigerant liquid 50.

[0034] In contrast, the lower end of the heat conduction member 8 in the direction of gravity is located below the liquid surface of the refrigerant liquid 50. That is, a portion of the heat conduction member 8 that contacts the heat-generating component 3 is impregnated with the refrigerant liquid 50. The heat conduction member 8 then draws the refrigerant liquid 50 up from the part impregnated with the refrigerant liquid 50 against the direction of gravity to the part that contacts the heat-generating component 3, due to capillary action. This allows the heat-generating component 3 to be cooled by the refrigerant liquid 50. In this way, the heat-generating component 3 can be cooled without filling the refrigerant liquid 50 to the point where it contacts the heat-generating component 3, thus reducing the amount of refrigerant liquid 50 that needs to be filled. As a result, while achieving high-performance boiling cooling, the overall weight of the in-vehicle equipment 1 can be reduced by reducing the amount of refrigerant liquid 50 that needs to be filled.

[0035] Furthermore, the heat generated by the heat-generating component 3 is transferred to the heat-conducting member 8. Then, through the heat conduction of the heat-conducting member 8 itself, the heat is transferred to the point on the heat-conducting member 8 that comes into contact with the coolant liquid 50. As a result, the heat generated by the heat-generating component 3 can be transferred to the coolant liquid 50 by the heat-conducting member 8. The heat-generating component 3 can be cooled even if all or part of it is not immersed in the coolant liquid 50.

[0036] Furthermore, the refrigerant liquid 50 boils due to the heat from the heat-generating component 3 transmitted through the heat-conducting member 8, generating bubbles. The generated bubbles then draw the refrigerant liquid 50 upwards, in the opposite direction to gravity. This allows the refrigerant liquid 50 to be supplied to parts of the heat-conducting member 8 that are not immersed in it. In this way, the refrigerant liquid 50 can be transported not only by the capillary action of the heat-conducting member 8 but also by the boiling of the refrigerant liquid 50. As a result, the heat-generating component 3 can be cooled even if all or part of it is not immersed in the refrigerant liquid 50. Consequently, while achieving high-performance boiling cooling, the amount of refrigerant liquid 50 to be sealed can be reduced, thereby reducing the overall weight of the in-vehicle equipment 1.

[0037] Furthermore, the refrigerant liquid 50 that boils in the heat conductive member 8 condenses on the inner walls of the cover 5 and case 6. As the refrigerant liquid 50 condenses, heat is transferred to the cover 5 and case 6. The heat transferred to the cover 5 and case 6 is then dissipated by the heat dissipation fins 10 provided on the case 6. This cools the entire in-vehicle equipment 1.

[0038] Figure 5 is a cross-sectional view showing the in-vehicle device 1 in a tilted state, rotated approximately 45 degrees from the state shown in Figure 4. As shown in Figure 5, the liquid level of the refrigerant liquid 50 contained in the housing changes depending on the rotation of the installation position of the in-vehicle device 1 and the driving conditions of the vehicle, such as when driving on an incline or accelerating. However, with the in-vehicle device 1 in this example, as shown in Figure 5, even when the liquid level changes and the heat-generating component 3 is not immersed in the refrigerant liquid 50, a portion of the heat-conducting member 8 is immersed in the refrigerant liquid 50. Therefore, as shown in Figure 5, even if the liquid level of the refrigerant liquid 50 changes, the heat-conducting member 8 and the refrigerant liquid 50 can reliably cool the heat-generating component 3.

[0039] In this example, a circular heat conduction member 8 is described, but it is not limited to this. The shape of the heat conduction member 8 can be any shape, such as a polygon such as a square or hexagon, or an ellipse, as long as a part of it is immersed in the coolant liquid 50. Alternatively, the heat conduction member 8 can be formed in a circular shape, and the heat-generating component 3 can be placed at the radial center of the heat conduction member 8. As a result, as shown in Figures 4 and 5, the distance from the outer edge to the center of the heat conduction member 8 does not change even when the in-vehicle equipment 1 rotates. The heat conduction member 8 can then transport the coolant liquid 50 to the center through capillary action. Therefore, in order to efficiently reduce the amount of coolant liquid 50, it is preferable to form the heat conduction member 8 in a circular shape and place the heat-generating component 3 at the center of the heat conduction member 8.

[0040] Figures 6 and 7 are cross-sectional views showing the in-vehicle device 1 with the cover 5 and case 6 positioned vertically, i.e., the in-vehicle device 1 lying flat. Figure 7 is a cross-sectional view showing the inverted orientation of the in-vehicle device 1 as shown in Figure 6.

[0041] In the arrangement example shown in Figure 6, the case 6 is positioned below the cover 5 in the vertical direction (direction of gravity), and the substrate 2 and heat-generating component 3 are positioned below the heat-conducting member 8 in the vertical direction (direction of gravity). As shown in Figure 6, the amount of coolant liquid 50 is set so that the liquid level of the coolant liquid 50 is in contact with the surface of the heat-conducting member 8 that faces the substrate 2, that is, the vertical lower surface of the heat-conducting member 8. As a result, even when the in-vehicle equipment 1 is placed on a flat surface, the heat-conducting member 8 can be immersed in the coolant liquid 50, and the heat-generating component 3 can be cooled by the heat-conducting member 8 and the coolant liquid 50.

[0042] Furthermore, by positioning the substrate 2 on the case 6 side, the lower surface of the heat conductive member 8 can be positioned below the vertical midpoint in the internal space of the case 6 and cover 5. This allows the refrigerant liquid 50 to be immersed in a portion of the heat conductive member 8 even if the amount of refrigerant liquid 50 is less than half the amount of the internal space of the case 6 and cover 5.

[0043] Furthermore, in the state shown in Figure 7, the substrate 2 and the heat-generating component 3 are not immersed in the coolant liquid 50. However, the side of the heat-conducting member 8 opposite to the side facing the substrate 2 and the heat-generating component 3 is immersed in the coolant liquid 50. As a result, heat from the heat-generating component 3 is transferred to the heat-conducting member 8, and the coolant liquid 50 can be boiled at the point where the heat-conducting member 8 is immersed in the coolant liquid 50. Consequently, even when the in-vehicle equipment 1 is positioned as shown in Figure 7, the heat-generating component 3 can be reliably cooled.

[0044] Furthermore, an insulating, inert refrigerant is used as the refrigerant liquid 50 because the substrate 2 is immersed in it. However, by coating the substrate 2, it is also possible to use a non-insulating refrigerant as the refrigerant liquid 50.

[0045] Furthermore, by making the internal space enclosed by the cover 5 and the case 6 airtight, the internal space may be evacuated before the refrigerant liquid 50 is sealed inside. This allows the refrigerant liquid 50 to boil at a temperature lower than its boiling point under atmospheric pressure. Thus, in order to seal the refrigerant liquid 50 under vacuum, it is preferable to provide the cover 5 and the case 6 with piping for vacuuming and piping for sealing the refrigerant liquid 50.

[0046] 1-2. Modified Examples of Heat Conducting Materials Next, a modified example of the heat conductive member will be described with reference to Figure 8. Figure 8 is a perspective view showing a modified example of the heat conductive member.

[0047] In the example described above, the entire heat conduction member 8 is formed from a porous material or a structure having a fine groove structure, but it is not limited to this. As shown in Figure 8, a transport section may be provided in at least a part of the heat conduction member 28 to transport the coolant liquid 50 by capillary action. The heat conduction member 28 has a contact portion 20 that does not have a cavity and a plurality of grooves 21 formed on one surface of the contact portion 20.

[0048] On one side of the contact portion 20 where multiple grooves 21 are formed, the other side opposite to it contacts the heat-generating component 3. In this way, by making the contact portion 20 of the heat-conducting member 28 with the heat-generating component 3 a solid contact portion filled with material, heat from the heat-generating component 3 can be efficiently conducted.

[0049] Multiple fine grooves 21 extend in a predetermined direction on one surface of the contact portion 20. When the heat conductive member 28 is placed on the substrate 2, a portion of the multiple grooves 21 comes into contact with the refrigerant liquid 50. Multiple openings 22 are formed on the surface of the grooves 21 opposite to the contact portion 20. The multiple grooves 21 are formed to a size that allows the refrigerant liquid 50 to be drawn up by capillary action. The width of the grooves 21 is set to a size that allows capillary action to occur, for example, to about 200 microns. In other words, the grooves 21 are transport sections that transport the refrigerant liquid 50 by capillary action.

[0050] By drawing the refrigerant liquid 50 into multiple grooves 21, the refrigerant liquid 50 boils within the grooves 21. The gas from the boiling refrigerant liquid 50 within the grooves 21 is discharged through openings 22 formed in the grooves 21. Note that the openings 22 are formed only on predetermined surfaces of the grooves 21. Therefore, the gas from the boiling refrigerant liquid 50 within the grooves 21 can be discharged in a predetermined direction.

[0051] Furthermore, both a liquid phase region and a gaseous phase region of the refrigerant liquid 50 coexist within the groove 21. The refrigerant liquid 50 moves within the groove 21 due to the flow associated with the generation and discharge of gas. As a result, the heat conductive member 28 can provide the effect of forced-flow boiling with a high heat transfer coefficient. Moreover, within the groove 21, a region where the liquid phase is thinned is created between the liquid phase and the gas phase. In this region where the liquid phase is thinned, a high heat transfer coefficient can be obtained, thereby promoting the electric heating performance of the heat conductive member 28.

[0052] In the heat conduction member 28 shown in Figure 8, multiple grooves 21 are used as transport sections, but the invention is not limited to this, and a part of the contact section 20 may be formed of a porous material as the transport section. Furthermore, although an example has been described in which multiple grooves 21 that generate capillary action or porous material are formed on the surface of the contact section 20 opposite to the surface that contacts the heat-generating component 3, the invention is not limited to this. The multiple grooves 21 or porous material can be placed anywhere that comes into contact with the coolant liquid 50, such as the side surface of the contact section 20.

[0053] 2. Second Embodiment Example Next, we will describe an example of the implementation of in-vehicle equipment according to the second embodiment. Figure 9 shows an example of the implementation of in-vehicle equipment according to the second embodiment.

[0054] In the example shown in Figure 9, the water-cooling jacket 102 is in contact with one side of the cover 5 or case 6 of the in-vehicle equipment 101. The in-vehicle equipment 101 is the same as the in-vehicle equipment 1 described above. The water-cooling jacket 102 has an equipment-side connector 103. The equipment-side connector 103 is connected to a vehicle-side connector 104 provided on the vehicle-side electrical circuit board 107. The vehicle-side connector 104 is connected to piping 106 to a radiator or the like (not shown). Coolant is supplied to the equipment-side connector 103 via the vehicle-side connector 104. The supplied coolant passes through piping (not shown) provided inside the water-cooling jacket 102.

[0055] As described above, the refrigerant liquid 50 contained within the casing of the in-vehicle equipment 101 boils in the heat conductive member 8. The boiled refrigerant liquid 50 condenses in the cover 5 and case 6. The heat condensed in the cover 5 and case 6 is cooled by the coolant passing through the water-cooling jacket 102.

[0056] Furthermore, the vehicle-side electrical circuit board 107 has a vehicle-side electrical connector 105 that is electrically connected to the case-side connector 12 provided on the in-vehicle device 101. Through the connection between this case-side connector 12 and the vehicle-side electrical connector 105, the in-vehicle device 101 and the vehicle-side electrical circuit board 107 perform signal transmission and reception and power exchange. As a result, the in-vehicle device 101 can be mounted in a manner that allows it to be detached from the vehicle.

[0057] The other components are the same as those of the in-vehicle device 1 according to the first embodiment described above, so their description will be omitted. In this implementation example of the in-vehicle device 101 according to the second embodiment, the same functions and effects as those of the in-vehicle device 1 according to the first embodiment described above can be obtained.

[0058] It should be noted that the invention is not limited to the embodiments described above and shown in the drawings, and various modifications are possible without departing from the gist of the invention as described in the claims. Furthermore, it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. In addition, it is possible to add, delete, or replace parts of the configuration of other embodiments.

[0059] In addition, while porous materials and multiple grooves 21 were used as transport sections formed in the heat-conducting members 8 and 28, the design is not limited to these. As long as the transport section can transport the refrigerant liquid 50 by capillary action, various shapes such as multiple fins or protrusions can be applied.

[0060] In this specification, although terms such as "parallel" and "orthogonal" are used, these do not mean only strictly "parallel" and "orthogonal," but may also refer to states that are "approximately parallel" or "approximately orthogonal," which include "parallel" and "orthogonal" and are within a range in which they can perform their functions. [Explanation of Symbols]

[0061] 1, 101…In-vehicle equipment, 2…Circuit board, 3…Heat-generating component, 5…Cover (housing), 6…Case (housing), 6a…Housing section, 6b…Side wall, 7…Circuit board side connector, 8, 28…Heat conductive material, 10…Heat dissipation fin, 11…O-ring, 12…Case side connector, 20…Contact part, 21…Groove, 22…Opening, 50…Refrigerant liquid, 102…Water cooling jacket, 103…Equipment side connector, 104…Vehicle body side connector, 105…Vehicle body side electrical connector, 106…Piping, 107…Vehicle body side electrical circuit board

Claims

1. A circuit board on which electronic components are mounted, A heat conductive member that contacts the electronic component mounted on the substrate, The system comprises a housing that contains the substrate, the heat conductive member, and the refrigerant liquid in its internal space, The heat conductive member is positioned such that at least a portion of it is immersed in the coolant liquid. The heat conducting member has a transport section that transports the refrigerant liquid by capillary action from the portion immersed in the refrigerant liquid to the portion not immersed in the refrigerant liquid. In-vehicle equipment.

2. The transport section is composed of a porous body formed on at least a portion of the heat conductive member. The in-vehicle device according to claim 1.

3. The transport section is composed of a plurality of grooves formed in at least a portion of the heat conductive member. The in-vehicle device according to claim 1.

4. The groove has an opening through which the gas from the boiling refrigerant liquid is discharged. The in-vehicle device according to claim 3.

5. The heat conductive member has a contact portion that contacts the electronic component, The contact portion is formed to be solid and filled with contents. The in-vehicle device according to claim 1.

6. The size of the heat conductive member is formed to be larger than the outer diameter of the electronic component. When viewed from a direction perpendicular to the surface of the substrate, the heat conductive member covers the entire electronic component. The in-vehicle device according to claim 1.

7. The heat conductive member is formed in a circular shape, The electronic component is positioned at the radial center of the heat conductive member. The in-vehicle device according to claim 6.

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