Movable devices, optical deflectors, projection devices, head-up displays, laser headlamps, head-mounted displays, object recognition devices, and mobile bodies

Abstract

This mechanism suppresses situations where the oscillation of the movable part is hindered by vibrations generated during the oscillation of the movable part around its first axis. [Solution] A movable device 13 comprising a movable part 101, first drive units 110a, 110b that drive the movable part to swing around a first axis, a first support unit 120 that supports the first drive unit, second drive units 130a, 130b that drive the first support unit to swing around a second axis substantially perpendicular to the first axis, and a second support unit 140 that supports the second drive unit, wherein the movable device 13 has a vibration reduction unit 300 that reduces vibration of a specific vibration mode that causes the first support unit to vibrate around the second axis among the vibration modes that occur when the first drive unit is driven.

Description

Technical Field

[0001] The present invention relates to a movable device, an optical deflector, a projection device, a head-up display, a laser headlamp, a head-mounted display, an object recognition device, and a moving body.

Background Art

[0002] Conventionally, there is known a movable device including a movable part, a first drive part that drives the movable part to swing around a first axis, a first support part that supports the first drive part, a second drive part that drives the first support part to swing around a second axis substantially orthogonal to the first axis, and a second support part that supports the second drive part.

[0003] For example, in Patent Document 1, there is disclosed a two-dimensional optical deflector (movable device) including a mirror part (movable part) that reflects light, a pair of torsion bars that support the mirror part, a pair of first actuator parts (first drive parts) that are connected to each torsion bar and rotate the mirror part around the axis (first axis) of the torsion bar, a movable frame (first support part) that supports the first actuator parts, and a third actuator part (second drive part) that drives the movable frame to swing around a second axis substantially orthogonal to the first axis. In this optical deflector, a second actuator part is provided which is connected to the movable frame on the side opposite to the first actuator parts. This second actuator part is not connected to the torsion bar and is configured to be bendable in the same direction as the first actuator parts. The second actuator part is driven so as to reduce an extra operation included in the swinging of the mirror part around the first axis by the first actuator parts. Thereby, the driving force of the first actuator parts is efficiently transmitted to the mirror part to improve the driving sensitivity of the mirror part.

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in conventional movable devices, vibrations generated during the oscillation of the movable part around its first axis sometimes hindered the normal oscillation of the movable part. [Means for solving the problem]

[0005] To solve the above-mentioned problems, the present invention provides a movable device comprising: a movable part; a first drive unit that drives the movable part to swing around a first axis; a first support unit that supports the first drive unit; a second drive unit that drives the first support unit to swing around a second axis substantially perpendicular to the first axis; and a second support unit that supports the second drive unit, characterized in that it has a vibration reduction unit that reduces vibration of a specific vibration mode among the vibration modes that occur when the first drive unit is driven, which causes the first support unit to vibrate around the second axis. [Effects of the Invention]

[0006] According to the present invention, vibrations generated when the movable part oscillates around the first axis prevent the movable part from functioning normally. This can prevent situations where oscillations are inhibited. [Brief explanation of the drawing]

[0007] [Figure 1] (a) is a plan view of the movable device according to Embodiment 1. (b) is a rear view of the movable device. (c) is a cross-sectional view of the part indicated by the symbol CC in Figure (a). (d) is a cross-sectional view of the part indicated by the symbol DD in Figure (a). (e) is a cross-sectional view of the part indicated by the symbol EE in Figure (a). [Figure 2] (a) to (c) are schematic diagrams illustrating the oscillation in the second drive unit of the movable device. [Figure 3] (a) is an explanatory diagram showing an example of the waveform of the first drive signal applied to piezoelectric drive unit group A. (b) is an explanatory diagram showing an example of the waveform of the second drive signal applied to piezoelectric drive unit group B. (c) is an explanatory diagram showing the waveforms of the first drive signal and the second drive signal superimposed. [Figure 4] (a) and (b) are diagrams showing the movement of the movable device when the first drive unit is driven with a 20kHz drive signal, visualized using a laser Doppler device. [Figure 5] A graph with the oscillation amplitude around the first axis on the horizontal axis and the jitter value on the vertical axis. [Figure 6] (a) is a plan view of the movable device according to Embodiment 2. (b) is a rear view of the same movable device. (c) is a cross-sectional view of the part indicated by the symbol CC in Figure (a). (d) is a cross-sectional view of the part indicated by the symbol DD in Figure (a). (e) is a cross-sectional view of the part indicated by the symbol EE in Figure (a). [Figure 7] (a) is a plan view of the movable device according to Embodiment 3. (b) is a rear view of the same movable device. (c) is a cross-sectional view of the part indicated by the symbol CC in Figure (a). (d) is a cross-sectional view of the part indicated by the symbol DD in Figure (a). (e) is a cross-sectional view of the part indicated by the symbol EE in Figure (a). [Figure 8] (a) is a plan view of the movable device according to Embodiment 4. (b) is a rear view of the same movable device. (c) is a cross-sectional view of the part indicated by the symbol CC in Figure (a). (d) is a cross-sectional view of the part indicated by the symbol DD in Figure (a). (e) is a cross-sectional view of the part indicated by the symbol EE in Figure (a). [Figure 9] (a) is a plan view of the movable device according to Embodiment 5. (b) is a rear view of the same movable device. (c) is a cross-sectional view of the part indicated by the symbol CC in Figure (a). (d) is a cross-sectional view of the part indicated by the symbol DD in Figure (a). (e) is a cross-sectional view of the part indicated by the symbol EE in Figure (a). [Figure 10] (a) is a plan view of the movable device according to Embodiment 6. (b) is a rear view of the same movable device. (c) is a cross-sectional view of the part indicated by the symbol CC in Figure (a). (d) is a cross-sectional view of the part indicated by the symbol DD in Figure (a). (e) is a cross-sectional view of the part indicated by the symbol EE in Figure (a). [Figure 11] (a) is a plan view of the movable device according to Embodiment 7. (b) is a rear view of the same movable device. (c) is a cross-sectional view of the part indicated by the symbol CC in Figure (a). (d) is a cross-sectional view of the part indicated by the symbol DD in Figure (a). (e) is a cross-sectional view of the part indicated by the symbol EE in Figure (a). [Figure 12] (a) is a plan view of the movable device according to Embodiment 8. (b) is a rear view of the same movable device. (c) is a cross-sectional view of the part indicated by the symbol CC in Figure (a). (d) is a cross-sectional view of the part indicated by the symbol DD in Figure (a). (e) is a cross-sectional view of the part indicated by the symbol EE in Figure (a). [Figure 13](a) is a plan view of the movable device according to Embodiment 9. (b) is a rear view of the movable device. (c) is a cross-sectional view taken along the line C-C in Fig. (a). (d) is a cross-sectional view taken along the line D-D in Fig. (a). (e) is a cross-sectional view taken along the line E-E in Fig. (a). [Figure 14] (a) is a plan view of the movable device according to Embodiment 10. (b) is a rear view of the movable device. (c) is a cross-sectional view taken along the line C-C in Fig. (a). (d) is a cross-sectional view taken along the line D-D in Fig. (a). (e) is a cross-sectional view taken along the line E-E in Fig. (a). [Figure 15] It is a schematic diagram of an example of an optical scanning system. [Figure 16] It is a hardware configuration diagram of an example of an optical scanning system. [Figure 17] It is a functional block diagram of an example of a control device. [Figure 18] It is a flowchart of an example of a process related to an optical scanning system. [Figure 19] It is a schematic diagram of an example of an automobile equipped with a head-up display device. [Figure 20] It is a schematic diagram of an example of a head-up display device. [Figure 21] It is a schematic diagram of an example of an image forming apparatus equipped with an optical writing device. [Figure 22] It is a schematic diagram of an example of an optical writing device. [Figure 23] It is a schematic diagram of an example of an automobile equipped with a lidar device. [Figure 24] It is a schematic diagram of an example of an automobile equipped with a lidar device. [Figure 25] It is a schematic diagram of an example of a lidar device. [Figure 26] It is a schematic diagram of an example of a laser headlamp. [Figure 27] It is a perspective view of the appearance of an example of a head-mounted display. [Figure 28] It is a diagram partially illustrating the configuration of a head-mounted display. [Figure 29] It is a schematic configuration diagram showing an example of a position detection device for the pupil or the cornea. [Figure 30] It is a schematic configuration diagram showing an example of a pupil or corneal position detection device.

Embodiments for Carrying out the Invention

[0008] Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. In each drawing, the same reference numerals are given to the same constituent parts, and duplicate explanations may be omitted.

[0009] In the following description of the embodiments, rotation, oscillation, and movement are assumed to be synonymous. In each figure, the X-axis direction, Y-axis direction, and Z-axis direction that are orthogonal to each other may be shown. The Z-axis direction is along the stacking direction of each layer in the piezoelectric drive unit or the like. The case of viewing from the Z-axis direction may be described as "plan view". Also, in each figure, parallel oblique lines may be attached to a portion that is not a cross section.

[0010] The X-axis direction includes the direction indicated by the arrow and the opposite direction thereof. Among the X-axis directions, the direction in which the arrow points may be denoted as the +X direction, and the opposite direction of the +X direction may be denoted as the -X direction. The Y-axis direction includes the direction indicated by the arrow and the opposite direction thereof. Among the Y-axis directions, the direction in which the arrow points may be denoted as the +Y direction, and the opposite direction of the +Y direction may be denoted as the -Y direction. The Z-axis direction includes the direction indicated by the arrow and the opposite direction thereof. Among the Z-axis directions, the direction in which the arrow points may be denoted as the +Z direction, and the opposite direction of the +Z direction may be denoted as the -Z direction. These directions do not limit the orientation of the movable device 13, and the orientation of the movable device 13 is arbitrary. The movable device may be called an "optical deflector".

[0011] 〔Embodiment 1〕 Hereinafter, an embodiment of a movable device according to the present invention (hereinafter, this embodiment is referred to as "Embodiment 1") will be described. FIG. 1 is an explanatory diagram showing the configuration of the movable device 13 according to Embodiment 1. For details, Figure 1(a) is a plan view of the movable device 13 according to this embodiment 1, Figure 1(b) is a rear view of the movable device 13 according to this embodiment 1, Figure 1(c) is a cross-sectional view of the part indicated by CC in Figure 1(a), Figure 1(d) is a cross-sectional view of the part indicated by DD in Figure 1(a), and Figure 1(e) is a cross-sectional view of the part indicated by EE in Figure 1(a).

[0012] As shown in Figure 1, the movable device 13 comprises a mirror section 101 as a movable part, first drive sections 110a and 110b, a first support frame 120 as a first support section, second drive sections 130a and 130b, a second support frame 140 as a second support section, and an electrode connection section 150.

[0013] The mirror section 101 has a reflective surface 14 that reflects incident light. The mirror section 101 is an example of a movable part. The first drive units 110a and 110b are each connected to the mirror section 101 and cause the mirror section 101 to swing around a first axis parallel to the X-axis. The first support frame 120 supports the mirror section 101 and the first drive units 110a and 110b.

[0014] The second drive units 130a and 130b are connected to the first support frame 120 and cause the mirror unit 101 and the first support frame 120 to swing around a second axis parallel to the Y-axis. The second support frame 140 supports the second drive units 130a and 130b. The electrode connection unit 150 is electrically connected to the first drive units 110a and 110b, the second drive units 130a and 130b, and the control device described later.

[0015] The movable device 13 is formed by, for example, manufacturing a single SOI (Silicon On Insulator) substrate by etching or the like, and then forming a reflective surface 14, first piezoelectric drive units 112a, 112b, second piezoelectric drive units 131a-131d and 132a-132d, electrode connection units 150, etc., on the manufactured substrate, thereby integrally forming each component. The formation of each component may be performed after the SOI substrate is manufactured or during the SOI substrate is manufactured.

[0016] The SOI substrate 361 on which the movable device 13 is fabricated includes a silicon support layer 361a made of single-crystal silicon (Si), a silicon oxide layer 361b formed on the silicon support layer 361a (on the +Z direction side), and a silicon active layer 361c made of single-crystal silicon formed on the silicon oxide layer 361b. The silicon oxide layer 361b can also be called a BOX (Buried Oxide) layer.

[0017] A component composed solely of the silicon active layer 361c possesses the function of an elastic part with elastic properties.

[0018] The SOI substrate 361 does not necessarily have to be planar and may have curvature or other properties. The components used to form the movable device 13 can be integrally molded by etching or the like, and may be partially elastic substrates, and are not limited to SOI substrates.

[0019] The mirror portion 101 includes, for example, a circular mirror portion base 102 and a reflective surface 14 formed on the +Z side surface of the mirror portion base. The mirror portion base 102 includes, for example, a silicon active layer 361c. The reflective surface 14 includes, for example, a thin metal film containing aluminum, gold, silver, etc.

[0020] A movable thickened portion 103 for reinforcing the mirror portion is formed on the -Z side surface of the mirror base 102. The movable thickened portion 103 includes, for example, a silicon support layer 361a and a silicon oxide layer 361b, and can suppress distortion of the reflective surface 14 caused by movement.

[0021] As shown in Figure 1, the first drive units 110a and 110b include torsion bars 111a and 111b and first piezoelectric drive units 112a and 112b as drive members.

[0022] Each of the torsion bars 111a and 111b has one end connected to the mirror portion 101 and is an example of an elastic support member that extends in the first axial direction and elastically supports the mirror portion 101.

[0023] Each of the first piezoelectric drive units 112a and 112b has one end connected to the torsion bar 111a and 111b, respectively, and causes the mirror portion 101, supported by the torsion bar 111a and 111b, to swing around the first axis. The first axis is an example of a predetermined swing axis. The other ends of each of the first piezoelectric drive units 112a and 112b are connected to the inner circumference of the first support frame 120, respectively.

[0024] The torsion bars 111a and 111b are formed from a silicon active layer 361c. The first piezoelectric drive units 112a and 112b are composed of a piezoelectric body 200 in which a lower electrode 201, a piezoelectric part 202, and an upper electrode 203 are stacked in this order on the +Z side surface of the silicon active layer 361c, which is the elastic part. The upper electrode 203 and the lower electrode 201 include, for example, gold (Au) or platinum (Pt). The piezoelectric part 202 includes, for example, PZT (lead zirconate titanate), which is a piezoelectric material.

[0025] The first support frame 120 is composed of a silicon support layer 361a, a silicon oxide layer 361b, and a silicon active layer 361c, and is a rectangular enclosure-shaped support formed to surround the mirror portion 101.

[0026] The second drive units 130a and 130b include a plurality of second piezoelectric drive units 131a to 131d, 132a to 132d as drive members connected in a folded manner. One end of the second drive units 130a and 130b is connected to the outer circumference of the first support frame 120, and the other end is connected to the inner circumference of the second support frame 140.

[0027] The connection points between the second drive unit 130a and the first support frame 120, and between the second drive unit 130b and the first support frame 120, are point-symmetric with respect to the center of the reflective surface 14. Furthermore, the connection points between the second drive unit 130a and the second support frame 140, and between the second drive unit 130b and the second support frame 140, are point-symmetric with respect to the center of the reflective surface 14.

[0028] As shown in Figure 1(c), the second piezoelectric drive units 131a-131d and 132a-132d are composed of a piezoelectric body 200 in which a lower electrode 201, a piezoelectric unit 202, and an upper electrode 203 are stacked in this order on the +Z side surface of the silicon active layer 361c, which is an elastic part. The upper electrode 203 and the lower electrode 201 include, for example, gold (Au) or platinum (Pt). The piezoelectric unit 202 includes, for example, PZT (lead zirconate titanate), which is a piezoelectric material.

[0029] The second support frame 140 includes a silicon support layer 361a, a silicon oxide layer 361b, and a silicon active layer 361c. The second support frame 140 is a rectangular enclosure-shaped support formed to surround the mirror portion 101, the first drive units 110a and 110b, the first support frame 120, and the second drive units 130a and 130b.

[0030] The electrode connection section 150 is formed on the +Z side surface of the second support frame 140 and is electrically connected to the upper electrodes 203 and lower electrodes 201 of the first piezoelectric drive units 112a and 112b, the upper electrodes 203 and lower electrodes 201 of the second piezoelectric drive units 131a to 131d and 132a to 132d, and a control device described later, via electrode wiring made of aluminum (Al). A signal voltage is applied to the lower electrode 201, and the upper electrode 203 is connected to ground (GND).

[0031] The upper electrode 203 or the lower electrode 201 may be directly connected to the electrode connection part 150, or they may be indirectly connected by connecting the electrodes to each other.

[0032] In this embodiment 1, the case in which the piezoelectric element 200 is formed only on one surface (the +Z side) of the silicon active layer 361c, which is the elastic part, was described as an example. However, it may also be provided on other surfaces of the elastic part (for example, the -Z side), or on both one and the other surface of the elastic part.

[0033] Furthermore, the shape of each component is not limited to that of this embodiment, as long as the mirror portion 101 can be driven around the first axis or the second axis. For example, the torsion bars 111a, 111b and the first piezoelectric drive units 112a, 112b may have a curved shape.

[0034] Furthermore, an insulating layer made of a silicon oxide film may be formed on at least one of the following surfaces: the +Z side surface of the upper electrode 203 of the first drive units 110a, 110b; the +Z side surface of the first support frame; the +Z side surface of the upper electrode 203 of the second drive units 130a, 130b; and the +Z side surface of the second support frame.

[0035] In this case, electrode wiring is provided on the insulating layer, and the insulating layer is partially removed or not formed only at the connection spots where the lower electrode 201 or the lower electrode 201 is connected to the electrode wiring, creating openings. This increases the design flexibility of the first drive units 110a, 110b, the second drive units 130a, 130b, and the electrode wiring, and suppresses short circuits caused by contact between electrodes. In addition, the silicon oxide film also functions as an anti-reflective material.

[0036] Next, the control of the movable device 13 by the control device in this embodiment will be described. The control device has the function of a control unit that applies drive voltage to the first drive units 110a, 110b and the second drive units 130a, 130b of the movable device 13.

[0037] The piezoelectric elements 202 of the first drive units 110a and 110b, and the piezoelectric elements 202 of the second drive units 130a and 130b, undergo deformation (e.g., expansion and contraction) corresponding to the potential of the applied voltage when a positive or negative voltage is applied in the polarization direction, exhibiting a so-called inverse piezoelectric effect. Utilizing this inverse piezoelectric effect, the first drive units 110a and 110b cause the mirror unit 101 to oscillate, and the second drive units 130a and 130b cause the first support frame 120 to oscillate.

[0038] In this case, the angle formed between the XY plane and the reflective surface 14 of the mirror portion 101 when the reflective surface 14 is tilted in the +Z or -Z direction with respect to the XY plane is called the deflection angle. The +Z direction is defined as the positive deflection angle, and the -Z direction as the negative deflection angle.

[0039] In the first drive units 110a and 110b, when a drive voltage, which is a drive signal, is applied to the piezoelectric parts 202 of the first piezoelectric drive units 112a and 112b via the upper electrode 203 and the lower electrode 201, each piezoelectric part 202 deforms. Due to the action of this deformation of the piezoelectric parts 202, the first piezoelectric drive units 112a and 112b bend. As a result, a driving force around the first axis acts on the mirror part 101 via the two torsion bars 111a and 111b, causing the mirror part 101 to swing around the first axis. The drive voltage applied to the first drive units 110a and 110b is controlled by the control device.

[0040] The control device applies a predetermined sinusoidal drive voltage in parallel to the first piezoelectric drive units 112a and 112b of the first drive units 110a and 110b, thereby moving the mirror unit 101 around the first axis at a period of the predetermined sinusoidal drive voltage. For example, if the frequency of the drive voltage is set to approximately 20 kHz, which is about the same as the resonant frequency of the torsion bars 111a and 111b, the mirror unit 101 can be made to resonate and vibrate at approximately 20 kHz by utilizing the mechanical resonance caused by the twisting of the torsion bars 111a and 111b.

[0041] The movable device 13 according to this embodiment 1 shows a cantilevered configuration in which the first piezoelectric drive units 112a and 112b extend from the torsion bars 111a and 111b toward the +Y direction. The movable device 13 is not limited to this. The movable device 13 only needs to be able to swing the mirror unit 101 by the piezoelectric unit 202 to which a drive voltage is applied. The movable device 13 may be, for example, a double-supported (double-sided) type as described later.

[0042] There are no particular restrictions on the drive signals applied to each of the paired first piezoelectric drive units 112a and 112b. Therefore, the drive signal may be a waveform signal with a constant amplitude, or a periodic waveform in which the amplitude and DC component are modulated in intensity over time.

[0043] Meanwhile, in the second drive units 130a and 130b, when a drive voltage, which is a drive signal, is applied to the piezoelectric parts 202 of the second piezoelectric drive units 131a-131d and 132a-132d via the upper electrode 203 and lower electrode 201, each piezoelectric part 202 deforms. Due to the action of this deformation of the piezoelectric parts 202, the second piezoelectric drive units 131a-131d and 132a-132d undergo bending deformation. As a result, rotational torque around the second axis is applied to the first support frame 120 and the first drive units 110a, 110b and mirror unit 101 inside it, causing the mirror unit 101 to oscillate around the second axis. The drive voltage applied to the second drive units 130a and 130b is controlled by the control device.

[0044] More specifically, the oscillation around the first axis (main scan) is driven by resonant vibration (resonant drive) as described above, so its oscillation waveform (scan waveform) is a sine wave. In contrast, the oscillation around the second axis (sub-scan) is required to have a constant-velocity sawtooth scan waveform so that the scan lines from the main scan are equally spaced. In this case, the oscillation around the second axis (sub-scan) needs to be driven non-resonantly in order to perform a constant-velocity sawtooth scan, making it more difficult to obtain a larger amplitude than in the case of resonant drive. Therefore, in this embodiment, a meander structure is adopted in which multiple second piezoelectric drive units 131a~131d, 132a~132d (drive beams) are connected in a folded manner.

[0045] The second piezoelectric drive units 131a~131d, 132a~132d of this meander structure include the second piezoelectric drive units 131b, 131d, 132a, 132c, which are the piezoelectric drive unit group A of channel A to which the first drive signal for sub-scanning is applied, and the second piezoelectric drive units 131a, 131c, 132b, 132d, which are the piezoelectric drive unit group B of channel B to which the second drive signal for sub-scanning is applied.

[0046] Specifically, the piezoelectric drive unit group A consists of the even-numbered second piezoelectric drive units 131b and 131d of the second piezoelectric drive units 131a to 131d of the second drive unit 130a, counting from the second piezoelectric drive unit 131a closest to the mirror unit 101, and the odd-numbered second piezoelectric drive units 132a and 132c of the second piezoelectric drive units 132a to 132d of the second drive unit 130b, counting from the second piezoelectric drive unit 132a closest to the mirror unit 101, to which the first drive signal is applied. On the other hand, among the second piezoelectric drive units 131a to 131d of the second drive unit 130a, the odd-numbered second piezoelectric drive units 131a and 131c, counting from the second piezoelectric drive unit 131a closest to the mirror unit 101, and among the second piezoelectric drive units 132a to 132d of the second drive unit 130b, the even-numbered second piezoelectric drive units 132b and 132d, counting from the second piezoelectric drive unit 132a closest to the mirror unit 101, constitute piezoelectric drive unit group B, to which the second drive signal is applied.

[0047] Figures 2(a) to 2(c) are schematic diagrams illustrating the oscillation in the second drive units 130a and 130b of the movable device 13. In Figures 2(a) to (c), the dotted lines represent the mirror section 101, etc.

[0048] When no drive voltage is applied to any of the second piezoelectric drive units 131a-131d and 132a-132d in the second drive units 130a and 130b, the deflection angle of the mirror unit 101 by the second drive units 130a and 130b is zero, as shown in Figure 2(a).

[0049] When the first drive signal is applied to the second piezoelectric drive units 131b, 131d, 132a, and 132c of piezoelectric drive unit group A, as shown in Figure 2(b), the second piezoelectric drive units 131b, 131d, 132a, and 132c of piezoelectric drive unit group A bend and deform in the same direction, causing the mirror unit 101 to tilt in the negative direction around the second axis.

[0050] When a second drive signal is applied to the second piezoelectric drive units 131a, 131c, 132b, and 132d of piezoelectric drive unit group B, as shown in Figure 2(c), the second piezoelectric drive units 131a, 131c, 132b, and 132d of piezoelectric drive unit group B bend and deform in the same direction, causing the mirror unit 101 to tilt in the positive direction around the second axis.

[0051] As shown in Figures 2(b) and (c), by applying a first drive signal and a second drive signal to the second piezoelectric drive units 131a to 131d and 132a to 132d of piezoelectric drive unit group A and piezoelectric drive unit group B, respectively, and causing bending deformation, the amount of movement due to bending deformation accumulates, making it possible to increase the swing angle of the mirror unit 101 around the second axis.

[0052] Figure 3(a) is an explanatory diagram showing an example of the waveform of the first drive signal applied to piezoelectric drive unit group A. Figure 3(b) is an explanatory diagram showing an example of the waveform of the second drive signal applied to piezoelectric drive unit group B. Figure 3(c) is an explanatory diagram showing the waveforms of the first drive signal and the second drive signal superimposed.

[0053] As shown in Figure 3(a), the first drive signal applied to the piezoelectric drive unit group A is, for example, a drive voltage with a sawtooth waveform and a frequency of, for example, several tens of Hz (e.g., 60 Hz). The waveform of the first drive signal is set with a predetermined ratio such that, for example, TrA:TfA = 9:1, where TrA is the time width of the rise period as the voltage value increases from the minimum to the next maximum value, and TfA is the time width of the fall period as the voltage value decreases from the maximum to the next minimum value. In this case, the ratio of TrA to one period is called the symmetry of the first drive signal.

[0054] As shown in Figure 3(b), the second drive signal applied to the piezoelectric drive unit group B is, for example, a drive voltage with a sawtooth waveform and a frequency of, for example, several tens of Hz (e.g., 60 Hz). The waveform of the second drive signal is set with a predetermined ratio such that, for example, TfB:TrB = 9:1, where TrB is the time width of the rise period as the voltage value increases from the minimum to the next maximum value, and TfB is the time width of the fall period as the voltage value decreases from the maximum to the next minimum value. In this case, the ratio of TfB to one period is called the symmetry of the second drive signal.

[0055] Furthermore, as shown in Figure 3(c), for example, the period TA of the waveform of the first drive signal and the period TB of the waveform of the second drive signal are set to be the same.

[0056] In this embodiment 1, the sawtooth waveforms of the first and second drive signals are generated by superimposing sine waves. Furthermore, although sawtooth waveform drive voltages are used as the first and second drive signals in this embodiment, the waveforms may be changed according to the device characteristics of the movable device 13, such as drive voltages with rounded peaks in the sawtooth waveform, or drive voltages with curved straight regions in the sawtooth waveform.

[0057] In this embodiment 1, the movable device 13 has a large difference between the oscillation frequency (approximately 20 kHz) that causes the mirror section 101 to oscillate around the first axis and the oscillation frequency (approximately 60 Hz) that causes the mirror section 101 to oscillate around the second axis, so their movements are unlikely to interfere with each other. However, even in this case, experiments have confirmed that if the drive voltage of the first drive units 110a and 110b is increased to increase the oscillation amplitude around the first axis, abnormal vibrations of the first support frame 120 propagate to the second drive units 130a and 130b, exciting a primary resonance mode (several hundred Hz) in the oscillation around the second axis, and causing abnormal vibrations in the oscillation around the second axis.

[0058] Figures 4(a) and (b) show the movement of the movable device 13 when the first drive units 110a and 110b are driven with a 20kHz drive signal, visualized using a laser Doppler device. When the mirror section 101 was oscillated around the first axis at an oscillation frequency of 20 kHz, no abnormal vibration occurred in the oscillation around the second axis when the oscillation amplitude around the first axis was 16.9 degrees, as shown in Figure 4(a). On the other hand, when the oscillation amplitude around the first axis was 18.9 degrees, the first support frame 120 was seen to be rotating around the second axis, as shown in Figure 4(b). Consequently, the mirror section 101 also vibrated around the second axis.

[0059] Figure 5 is a graph with the oscillation amplitude (main scan amplitude) around the first axis on the horizontal axis and the jitter value on the vertical axis. The jitter value represents the fluctuation in the timing of the mirror vibration, which is detected by the PD (Photo Detector) from the scanning light from the mirror. When the drive voltage of the first drive units 110a and 110b is increased to increase the oscillation amplitude around the first axis, abnormal vibrations around the second axis that occur can be quantitatively determined by measuring the jitter value of the scanning light. As shown in Figure 5, it can be seen that as the oscillation amplitude increases, the jitter value increases sharply from around 18 degrees of oscillation amplitude.

[0060] In general, abnormal vibrations manifest in various ways, each with its own unique cause. Most of these are caused by the coupling of unwanted modes (vibration modes) and can be addressed through mode engineering (adjustment of each mode frequency) during the design phase. For example, among the natural modes of the movable device 13 in this embodiment, there are vibration modes corresponding to the resonance frequency, which is the oscillation frequency (20 kHz) around the first axis, as well as vibration modes corresponding to the primary resonance frequency around the second axis. In particular, when a meander structure is employed in the second drive unit that generates oscillation around the second axis, there are a great many modes in which the meander structure deforms. If any of these modes are near the oscillation frequency around the first axis, abnormal vibrations are likely to occur during oscillation around the second axis.

[0061] Normally, abnormal vibrations in the oscillation around the second axis can be avoided by designing all vibration modes corresponding to the second drive unit that generates oscillation around the second axis to be several kHz away from the oscillation frequency (resonance frequency) around the first axis. However, regarding the abnormal vibrations caused by the primary resonance mentioned above, the frequency of the primary resonance is originally in the range of several hundred Hz to several kHz, making it difficult to avoid the occurrence of abnormal vibrations by changing the frequency in the design.

[0062] Therefore, in this embodiment, a dynamic damper 300 is provided as a vibration reduction unit to reduce the vibration of the primary resonance mode, which is a specific vibration mode that causes the first support frame 120 to oscillate around the second axis, among the vibration modes that occur when the first drive units 110a and 110b that generate oscillation around the first axis are driven.

[0063] By providing such vibration reduction components, even when the drive voltage of the first drive units 110a and 110b is increased to increase the oscillation amplitude around the first axis, for example, the vibration of the primary resonance mode can be reduced, and abnormal vibrations of the first support frame 120 around the second axis can be suppressed. As a result, it is possible to avoid a situation in which the normal oscillation of the mirror unit 101 around the first axis is hindered.

[0064] In particular, in this embodiment 1, a dynamic damper 300 is provided as a vibration reduction unit, attached to the first support frame 120. As shown in Figure 1, the dynamic damper 300 comprises a beam section 302 and a mass section 303 as mass sections, and a torsion bar spring 301 as a pivot shaft section that rotatably supports the beam section 302 and the mass section 303 around a pivot axis (rotation center axis 310) parallel to the second axis. In this dynamic damper 300, the torsion bar spring 301 is formed on the first support frame 120, centered on the rotation center axis 310 of the dynamic damper which is parallel to the second axis. Near the longitudinal center of the torsion bar spring 301, a long beam section 302 is formed with its longitudinal direction perpendicular to the second axis, and a mass section 303, which acts as a weight, is formed at its tip.

[0065] The resonant frequency of the dynamic damper 300 is determined approximately by the rotational stiffness of the torsion bar spring 301 and beam section 302 around the rotational center axis 310, and the moment of inertia of the mass section 303. The resonant frequency of the dynamic damper in this embodiment 1 is designed to substantially coincide with the frequency of the primary resonance mode described above. By doing so, the vibration of the dynamic damper can absorb the vibration energy of the primary resonance around the second axis, thereby suppressing the resonance amplitude.

[0066] According to this embodiment 1, the dynamic damper 300 can suppress vibrations of the primary resonance mode (rotational rigid body mode) around the second axis that occur when the oscillation amplitude of the mirror section 101 around the first axis by the first drive units 110a and 110b is increased. As a result, even if the oscillation amplitude of the mirror section 101 around the first axis is increased, it is possible to avoid hindering the normal oscillation of the mirror section 101 around the second axis, making it possible to oscillate the mirror section 101 significantly around the first axis.

[0067] Furthermore, in this embodiment 1, the mirror section 101 is a cantilever support structure in which the mirror section 101 is supported via torsion bars 111a and 111b on the tip sides of each first drive unit 110a and 110b, whose base ends are fixed to the first support frame 120. In such a cantilever support configuration, as shown in Figures 1(a) and (b), there is empty space in the internal space of the first support frame 120 in the area opposite to the first piezoelectric drive units 112a and 112b relative to the torsion bars 111a and 111b. In this embodiment 1, the dynamic damper 300 is placed in this empty space in the internal space of the first support frame 120, so that the dynamic damper 300 can be provided without increasing the size of the movable device 13.

[0068] While various configurations are possible for the dynamic damper 300, in order to suppress abnormal vibrations of the primary resonance mode around the second axis due to large amplitude around the first axis, it is necessary to form a vibration system that vibrates at a frequency that substantially coincides with the primary resonance mode around the second axis in the same rotational direction as the first support frame 120. The moment of inertia of the dynamic damper 300 is preferably about 5% to 20% of the total size of the first support frame 120, including the mirror section 101 and the first drive sections 110a and 110b.

[0069] [Embodiment 2] Next, another embodiment of the movable device according to the present invention (hereinafter referred to as "Embodiment 2") will be described. In this second embodiment, the configuration of the dynamic damper differs from that of the first embodiment described above. Note that the same explanations as in the first embodiment will be omitted in the description of this second embodiment.

[0070] Figure 6 is an explanatory diagram showing the configuration of the movable device 13 according to this second embodiment. For details, Figure 6(a) is a plan view of the movable device 13 according to this second embodiment, Figure 6(b) is a rear view of the movable device 13 according to this second embodiment, Figure 6(c) is a cross-sectional view of the part indicated by CC in Figure 6(a), Figure 6(d) is a cross-sectional view of the part indicated by DD in Figure 6(a), and Figure 6(e) is a cross-sectional view of the part indicated by EE in Figure 6(a).

[0071] In this second embodiment, two dynamic dampers 300A and 300B are attached to the first support frame 120. The second dynamic damper 300B of the two dynamic dampers 300A and 300B has the same basic configuration as the dynamic damper 300 of the first embodiment described above, but the longitudinal length of the beam portion 302 is shorter than that of the dynamic damper 300 of the first embodiment. The first dynamic damper 300A of the two dynamic dampers 300A and 300B is configured to be symmetrical with respect to the second dynamic damper 300B across the second axis.

[0072] In this second embodiment, the vibration modes around the second axis generated by the two dynamic dampers 300A and 300B include a mode in which the two dynamic dampers 300A and 300B vibrate in phase and a mode in which they vibrate in opposite phase. Of these, using the mode in which they vibrate in opposite phase makes it possible to efficiently dampen the vibration amplitude of the primary resonance mode around the second axis.

[0073] [Embodiment 3] Next, another embodiment of the movable device according to the present invention (hereinafter referred to as "Embodiment 3") will be described. In this third embodiment, the configuration of the dynamic damper differs from that of the embodiments described above. Note that descriptions similar to those given in the embodiments described above will be omitted in this description of this third embodiment.

[0074] As described above, by adding a dynamic damper, the vibration amplitude (peak) of the primary resonance mode around the second axis is attenuated, making it possible to increase the amplitude around the first axis. However, if the size of the first support frame 120 increases due to the addition of a dynamic damper, problems may arise, such as the frequency of the primary resonance mode around the second axis (primary resonance frequency) decreasing, which worsens the resistance to external vibrations. Therefore, it is preferable to have a compact structure that does not increase the size of the first support frame 120.

[0075] In particular, when the frequency of the primary resonance mode of the second axis is low, in a structure in which a long beam section 302 extends from the torsion bar spring 301, as in the dynamic damper 300 described above, it may be necessary to widen the width of the long beam section 302 (axial length of the second axis). In this case, if the longitudinal length of the torsion bar spring 301 supporting the beam section 302 (axial length of the second axis) is also increased to match the width of the beam section 302, the size of the first support frame 120 will become larger.

[0076] Figure 7 is an explanatory diagram showing the configuration of the movable device 13 according to this third embodiment. For details, Figure 7(a) is a plan view of the movable device 13 according to this third embodiment, Figure 7(b) is a rear view of the movable device 13 according to this third embodiment, Figure 7(c) is a cross-sectional view of the part indicated by CC in Figure 7(a), Figure 7(d) is a cross-sectional view of the part indicated by DD in Figure 7(a), and Figure 7(e) is a cross-sectional view of the part indicated by EE in Figure 7(a).

[0077] In this third embodiment, similar to the second embodiment described above, it is equipped with two dynamic dampers 300A and 300B configured symmetrically across the second axis. However, in the dynamic dampers 300A and 300B of this third embodiment, the beam portion 302 and the torsion bar spring 301 are connected by a connecting portion 304 with a width narrower than the width of the beam portion 302 (the axial length of the second axis). In other words, a slit is provided between the beam portion 302 and the torsion bar spring 301. This makes it possible to make the length of the torsion bar spring 301, which is positioned inside the first support frame 120, shorter than the width of the beam portion 302. As a result, it is possible to suppress an increase in the size of the first support frame 120.

[0078] [Embodiment 4] Next, another embodiment of the movable device according to the present invention (hereinafter referred to as "Embodiment 4") will be described. In this fourth embodiment, the configuration of the dynamic damper differs from that of the embodiments described above. Note that descriptions similar to those given in the embodiments described above will be omitted in this description of this fourth embodiment.

[0079] Figure 8 is an explanatory diagram showing the configuration of the movable device 13 according to this embodiment 4. For details, Figure 8(a) is a plan view of the movable device 13 according to this embodiment 4, Figure 8(b) is a rear view of the movable device 13 according to this embodiment 4, Figure 8(c) is a cross-sectional view of the part indicated by CC in Figure 8(a), Figure 8(d) is a cross-sectional view of the part indicated by DD in Figure 8(a), and Figure 8(e) is a cross-sectional view of the part indicated by EE in Figure 8(a).

[0080] In this embodiment 4, as in the embodiment 2 described above, there are two dynamic dampers 300A and 300B configured to be symmetrical with respect to the second shaft. However, in this embodiment 4, the other end of the torsion bar spring 301, which is attached to the inner wall of the first support frame 120 on the opposite side of the first drive units 110a and 110b, extends between each of the first drive units 110a and 110b and the inner wall of the first support frame 120 in the axial direction of the first shaft.

[0081] A gap is formed between the first drive units 110a and 110b and the inner wall of the first support frame 120, allowing the first drive units 110a and 110b to be displaced. Since this gap is empty space, by extending the torsion bar spring 301 into this gap, a longer torsion bar spring 301 can be obtained without increasing the size of the first support frame 120.

[0082] [Embodiment 5] Next, another embodiment of the movable device according to the present invention (hereinafter referred to as "Embodiment 5") will be described. In this embodiment 5, the configuration of the dynamic damper differs from that of the embodiments described above. Note that descriptions similar to those given in the embodiments described above will be omitted in the description of this embodiment 5.

[0083] The effect of a dynamic damper in suppressing abnormal vibrations around the second axis is influenced not only by its function of canceling out abnormal vibrations due to its resonant frequency, but also by the damping function of the dynamic damper itself. The damping function of the dynamic damper is obtained to some extent by the materials and structure of the dynamic damper itself, but there are cases where the damping function of the dynamic damper is insufficient.

[0084] Figure 9 is an explanatory diagram showing the configuration of the movable device 13 according to this embodiment 5. For details, Figure 9(a) is a plan view of the movable device 13 according to this embodiment 5, Figure 9(b) is a rear view of the movable device 13 according to this embodiment 5, Figure 9(c) is a cross-sectional view of the part indicated by CC in Figure 9(a), Figure 9(d) is a cross-sectional view of the part indicated by DD in Figure 9(a), and Figure 9(e) is a cross-sectional view of the part indicated by EE in Figure 9(a).

[0085] In this embodiment 5, as in the embodiment 2 described above, there are two dynamic dampers 300A and 300B configured symmetrically across the second axis. However, in this embodiment 5, a damper gel material 305 is provided between the first support frame 120 and the dynamic dampers 300A and 300B to supplement the damping function of the dynamic dampers 300A and 300B. In particular, as in this embodiment 5, it is effective to provide the damper gel material 305 near the tip of the beam portion 302, which is the vibrating part of each dynamic damper 300A and 300B.

[0086] [Embodiment 6] Next, another embodiment of the movable device according to the present invention (hereinafter referred to as "Embodiment 6") will be described. In this embodiment 6, the configuration of the dynamic damper differs from that of the embodiments described above. Note that descriptions similar to those given in the embodiments described above will be omitted in the description of this embodiment 6.

[0087] If damper gel material 305 is added later as a damper material, as in Embodiment 5 described above, in order to compensate for the insufficient damping function provided by the dynamic damper, a process of applying the damper gel material 305 is required in the post-manufacturing process of the MEMS structure, which may lead to increased costs and reduced yield.

[0088] Figure 10 is an explanatory diagram showing the configuration of the movable device 13 according to this embodiment 6. For details, Figure 10(a) is a plan view of the movable device 13 according to this embodiment 6, Figure 10(b) is a rear view of the movable device 13 according to this embodiment 6, Figure 10(c) is a cross-sectional view of the part indicated by the symbol CC in Figure 10(a), Figure 10(d) is a cross-sectional view of the part indicated by the symbol DD in Figure 10(a), and Figure 10(e) is a cross-sectional view of the part indicated by the symbol EE in Figure 10(a).

[0089] In this embodiment 6, as in the embodiment 2 described above, there are two dynamic dampers 300A and 300B configured to be symmetrical with respect to the second axis. However, in this embodiment 6, the dynamic dampers 300A and 300B use the first support frame 120 and the constituent membrane (damping membrane) 306 that make up the dynamic damper 300 as damping material to supplement the damping function of the dynamic dampers 300A and 300B.

[0090] According to this, by leaving the silicon oxide layer 361b of the SOI substrate 361 as a damping film 306 during the MEMS manufacturing process, the damping function of the dynamic dampers 300A and 300B can be supplemented. However, the silicon oxide layer 361b used as the damping film 306 has low elasticity. Therefore, if it is provided in a part with a large vibration amplitude (near the tip of the beam portion 302), as in the damper gel material 305 of Embodiment 5 described above, the damping film 306 will easily break. Or, it may even suppress the vibration itself. For this reason, as in Embodiment 5, it is preferable to provide the damping film 306 near the base end of the beam portion 302 and near the torsion bar spring 301, where the vibration amplitude is small.

[0091] [Embodiment 7] Next, another embodiment of the movable device according to the present invention (hereinafter referred to as "Embodiment 7") will be described. In this embodiment 7, the structure of the second drive unit differs from that of the embodiments described above. Note that descriptions similar to those given in the embodiments described above will be omitted in the description of this embodiment 7.

[0092] Figure 11 is an explanatory diagram showing the configuration of the movable device 13 according to this embodiment 7. For details, Figure 11(a) is a plan view of the movable device 13 according to this embodiment 7, Figure 11(b) is a rear view of the movable device 13 according to this embodiment 7, Figure 11(c) is a cross-sectional view of the part indicated by symbol CC in Figure 11(a), Figure 11(d) is a cross-sectional view of the part indicated by symbol DD in Figure 11(a), and Figure 11(e) is a cross-sectional view of the part indicated by symbol EE in Figure 11(a).

[0093] In the movable device 13 of this embodiment 7, the structure of the second drive units 230a and 230b is not a meander structure as in the above-described embodiment. Specifically, it is a cantilever support structure in which the first support frame 120 is supported on the tip side of the second drive units 230a and 230b, which are drive beams, one of each, with their base ends fixed to the second support frame 140. With such a cantilever support structure, it is thought that abnormal vibrations are less likely to occur because the structure is simple. However, with a cantilever support structure, the drive sensitivity is small and it is difficult to increase the oscillation amplitude around the second axis. Therefore, if the rigidity of the second drive units 230a and 230b is reduced in order to increase the drive sensitivity, abnormal vibrations around the second axis are more likely to occur when driving around the first axis, similar to the meander structure. Therefore, the problem of abnormal vibration occurring around the second axis when the first axis is driven is not limited to cases where the second drive unit employs a meander structure. It can also occur even if the second drive unit does not have a meander structure, as long as the vibration of the first support frame 120 during drive around the first axis is transmitted to the structure on the second drive unit side, and includes a vibration mode (rotational rigid body mode) that generates vibration around the second axis.

[0094] According to this embodiment 7, similar to embodiment 1 described above, the dynamic damper 300 can suppress vibrations of the primary resonance mode (rotational rigid body mode) around the second axis that occur when the oscillation amplitude of the mirror portion 101 around the first axis by the first drive units 110a and 110b is increased. As a result, in this embodiment 7 as well, even if the oscillation amplitude of the mirror portion 101 around the first axis is increased, it is possible to avoid hindering the normal oscillation of the mirror portion 101 around the second axis, making it possible to oscillate the mirror portion 101 significantly around the first axis.

[0095] It goes without saying that the configuration of the dynamic damper 300 in this embodiment 7 can be the configuration of the dynamic damper in the other embodiments described above.

[0096] [Embodiment 8] Next, another embodiment of the movable device according to the present invention (hereinafter referred to as "Embodiment 8") will be described. In this embodiment 8, the structure of the first drive unit differs from that of the embodiments described above. Note that descriptions similar to those given in the embodiments described above will be omitted in the description of this embodiment 8.

[0097] Figure 12 is an explanatory diagram showing the configuration of the movable device 13 according to this embodiment 8. For details, Figure 12(a) is a plan view of the movable device 13 according to this embodiment 8, Figure 12(b) is a rear view of the movable device 13 according to this embodiment 8, Figure 12(c) is a cross-sectional view of the part indicated by CC in Figure 12(a), Figure 12(d) is a cross-sectional view of the part indicated by DD in Figure 12(a), and Figure 12(e) is a cross-sectional view of the part indicated by EE in Figure 12(a).

[0098] In the movable device 13 of this embodiment 8, the structure of the first drive units 110a and 110b is not a cantilever support structure as in the above-described embodiment, but a double-support structure. Specifically, in the case of a cantilever support structure, as described above, one torsion bar 111a and 111b are provided on the tip side of each of the one first drive units 110a and 110b, whose base end is fixed to the first support frame 120, and these torsion bars 111a and 111b support both sides of the mirror unit 101. In contrast, in the case of a double-support structure, two first drive units 210a and 210b, whose base end is fixed to the lower edge of the first support frame 120 in Figure 12(a), and two first drive units 210c and 210d, whose base end is fixed to the upper edge of the first support frame 120 in Figure 12(a), support one torsion bar 111a and 111b from two directions, top and bottom (±y direction) in the figure.

[0099] In this embodiment 8, the first piezoelectric drive units 212a to 212d of the first drive units 210a to 210d are configured, as in the embodiments described above, as shown in Figure 12(d), with the lower electrode 201, piezoelectric unit 202, and upper electrode 203 formed in that order on the +Z side surface of the silicon active layer 361c of the SOI substrate 361. The upper electrode 203 and lower electrode 201 are made of, for example, gold (Au) or platinum (Pt). The piezoelectric unit 202 is made of, for example, PZT (lead zirconate titanate), which is a piezoelectric material. The torsion bars 111a and 111b are also made of the silicon active layer 361c, with the axial direction of the first axis as the longitudinal direction, as in the embodiments described above.

[0100] Two first drive units 210a and 210b, whose base ends are fixed to the lower edge of the first support frame 120 in Figure 12(a), and two first drive units 210c and 210d, whose base ends are fixed to the upper edge of the first support frame 120 in Figure 12(a), are each subjected to a drive signal with a sinusoidal waveform that has the same drive frequency but a phase difference of 180°. Since the first piezoelectric drive units 212a to 212d have a unimorph structure, they deform in only one direction when a drive voltage is applied. However, the oscillation around the first axis is performed by resonant drive, and reciprocating rotation (oscillation) is achieved by the elastic action of the torsion bars 111a and 111b and the inertial force of the mirror unit 101.

[0101] In the first drive units 110a and 110b of the cantilever support structure, as in the embodiment described above, there is empty space in the internal space of the first support frame 120 in the region opposite to the first piezoelectric drive units 112a and 112b relative to the torsion bars 111a and 111b. Therefore, by placing a dynamic damper in that empty space, it is possible to provide a dynamic damper in the internal space of the first support frame 120.

[0102] However, in the first drive units 210a to 210d of the double-support structure as in this embodiment 8, other first piezoelectric drive units 212c and 212d are arranged in the area opposite to the torsion bars 111a and 111b in the internal space of the first support frame 120, leaving no empty space. Therefore, it is difficult to install a dynamic damper in the internal space of the first support frame 120.

[0103] Therefore, in this embodiment 8, the dynamic damper 300 is positioned outside the first support frame 120. More specifically, the dynamic damper 300 is provided in the space between the first support frame 120 and the second drive unit 130a. The dynamic damper 300 supports each end of the torsion bar spring 301 with the first support frame 120 and the second drive unit 130a, and a beam portion 302 is formed to extend from near the longitudinal center of the torsion bar spring 301 in a direction perpendicular to the second axis along the second piezoelectric drive unit 131a, with a mass portion 303, which acts as a weight, formed at its tip.

[0104] Even if the first drive units 210a to 210d have a double-support structure, as in this embodiment 8, the same problem can occur if the vibration of the first support frame 120 during drive around the first axis is transmitted to the structure on the second drive unit side, and includes a vibration mode (rotational rigid body mode) that causes vibration around the second axis. Furthermore, even if the dynamic damper 300 is placed outside the first support frame 120, it is possible to suppress the vibration of the primary resonance mode (rotational rigid body mode) around the second axis that occurs when the oscillation amplitude of the mirror unit 101 around the first axis by the first drive units 210a to 210d is increased, just as if it were placed inside the first support frame 120. As a result, even in this embodiment 8, even if the oscillation amplitude of the mirror unit 101 around the first axis is increased, it is possible to avoid hindering the normal oscillation of the mirror unit 101 around the second axis, making it possible to oscillate the mirror unit 101 significantly around the first axis.

[0105] It goes without saying that the configuration of the dynamic damper 300 in this embodiment 8 can be the same as the configuration of the dynamic damper in the other embodiments described above.

[0106] [Embodiment 9] Next, another embodiment of the movable device according to the present invention (hereinafter referred to as "Embodiment 9") will be described. In this embodiment 9, the structure of the second drive unit differs from that of the embodiments described above. Note that descriptions similar to those given in the embodiments described above will be omitted in the description of this embodiment 9.

[0107] Figure 13 is an explanatory diagram showing the configuration of the movable device 13 according to this embodiment 9. For details, Figure 13(a) is a plan view of the movable device 13 according to this embodiment 9, Figure 13(b) is a rear view of the movable device 13 according to this embodiment 9, Figure 13(c) is a cross-sectional view of the part indicated by symbol CC in Figure 13(a), Figure 13(d) is a cross-sectional view of the part indicated by symbol DD in Figure 13(a), and Figure 13(e) is a cross-sectional view of the part indicated by symbol EE in Figure 13(a).

[0108] In the movable device 13 of this embodiment 9, the second drive unit is made into a stacked structure by stacking (joining) two SOI substrates, thereby increasing the oscillation amplitude around the second axis. Specifically, the movable device 13 of this embodiment 9 includes first drive units 110a and 110b having a cantilever support structure, similar to the embodiments described above, but also includes second drive units 130a and 130b formed on the first SOI substrate 361 on which the first drive units 110a and 110b are formed, and second drive units 130c and 130d formed on a second SOI substrate 362 separate from the first SOI substrate 361, as a second drive unit that drives the first support frame 120 to oscillate around the second axis.

[0109] The movable device 13 of this embodiment 9 can be, for example, one in which a first SOI substrate 361 and a second SOI substrate 362 are joined together with a silicon oxide layer 363 in between to form a laminated structure. A piezoelectric part 202 is formed on the surface of each SOI substrate 361, 362, sandwiched between a lower electrode 201 and an upper electrode 203.

[0110] The first SOI substrate 361 is composed of a silicon support layer 361a, a silicon oxide layer 361b, and a silicon active layer 361c, while the second SOI substrate 362 is composed of a silicon support layer 362a, a silicon oxide layer 362b, and a silicon active layer 362c. Each SOI substrate 361 and 362 is formed by etching or the like, and each component is integrally formed on the formed substrate by creating a reflective surface 14, first piezoelectric drive parts 112a, 112b, second piezoelectric drive parts 131a~131d, 132a~132d, 133a~133d, 134a~134d, electrode connection parts 150, etc. The first SOI substrate 361 and the second SOI substrate 362 may be bonded rather than joined. In the case of bonding, the silicon oxide layer 363 acts as an adhesive. In the inter-substrate connection section 160, electrical wiring is provided between the first SOI substrate 361 and the second SOI substrate 362 by a silicon through-electrode 162 in order to apply voltage to the piezoelectric section 202.

[0111] In this embodiment 9, in addition to the second drive units 130a and 130b formed on the first SOI substrate 361, second drive units 130c and 130d formed on the second SOI substrate 362 are provided, and by driving with these second drive units 130a to 130d, the first support frame 120 can be swung around the second axis with a large amplitude.

[0112] In this embodiment 9, the first support frame 120 is composed of two SOI substrates 361 and 362 that are connected to each other. On the other hand, the torsion bars 111a, 111b and the mirror portion 101 supported by the first support frame 120 are composed solely of the first SOI substrate 361. Furthermore, the first support frame 120 is supported by second drive units 130a and 130b formed on the first SOI substrate 361 and second drive units 130c and 130d formed on the second SOI substrate 362.

[0113] Here, the dynamic damper 350 of this embodiment 9 is formed by a second SOI substrate 362. As shown in Figure 13(b), the dynamic damper 350 comprises a beam portion 352 and a mass portion 353 as mass portions, and a torsion bar spring 351 as a pivot shaft portion that rotatably supports the beam portion 302 and the mass portion 353 around a pivot axis (rotation center axis 360) parallel to the second axis.

[0114] The torsion bar spring 351 of the dynamic damper 350 is connected at both ends to the upper and lower edges of the first support frame 120 in Figure 13(b). The beam portion 352 of the dynamic damper 350 is connected to the longitudinal center of the torsion bar spring 351 and is positioned on the side of the torsion bar spring 351 where the mirror portion 101 is provided. In this embodiment 9, the beam portion 352 is shaped to avoid contact with the mirror portion 101 when the mirror portion 101 swings around its first axis, thus avoiding contact with the movable area of ​​the mirror portion 101. Specifically, the beam portion 352 is an enclosure shape (frame shape) that surrounds the movable area of ​​the mirror portion 101, and in plan view it is a roughly rectangular hollow shape (frame shape). The mass portion 353 is formed at the point (edge) of the beam portion 352 furthest from the torsion bar spring 351.

[0115] According to this embodiment 9, it is possible to provide a dynamic damper 350 with a large moment of inertia without increasing the size of the first support frame 120, and the vibration energy of the primary resonance around the second axis can be sufficiently absorbed by the vibration of the dynamic damper 350. Furthermore, since the primary resonance around the second axis is contributed to by the moment of inertia around the second axis, providing the dynamic damper 350 at a position outside the plane of the first SOI substrate 361 in the substrate thickness direction (Z direction) is less likely to cause performance degradation.

[0116] [Embodiment 10] Next, another embodiment of the movable device according to the present invention (hereinafter referred to as "Embodiment 10") will be described. In the above-described embodiment, abnormal vibrations around the second axis that occur when the mirror portion 101 is driven to oscillate around the first axis were suppressed by a dynamic damper. However, in this embodiment 10, abnormal vibrations around the first axis that occur when the mirror portion 101 is driven to oscillate around the first axis are suppressed by a dynamic damper. Since the rigidity of the second drive unit around the first axis is greater than the rigidity of the second axis and the frequency is higher than the primary resonance, abnormal vibrations around the first axis are unlikely to occur. However, depending on the design, significant abnormal vibrations around the first axis may occur. This embodiment 10 suppresses such abnormal vibrations around the first axis. Note that in the description of this embodiment 10, the same explanations as in the above-described embodiment will be omitted.

[0117] Figure 14 is an explanatory diagram showing the configuration of the movable device 13 according to this embodiment 10. For details, Figure 14(a) is a plan view of the movable device 13 according to this embodiment 10, Figure 14(b) is a rear view of the movable device 13 according to this embodiment 10, Figure 14(c) is a cross-sectional view of the part indicated by CC in Figure 14(a), Figure 14(d) is a cross-sectional view of the part indicated by DD in Figure 14(a), and Figure 14(e) is a cross-sectional view of the part indicated by EE in Figure 14(a).

[0118] In this embodiment 10, as shown in Figure 14, the dynamic damper 370 comprises beam sections 372a, 372b and mass sections 373a, 373b as mass sections, and a torsion bar spring 371 as a pivot axis that rotatably supports the beam sections 372a, 372b and mass sections 373a, 373b around a pivot axis (rotation center axis 380) parallel to the first axis. In this dynamic damper 370, the torsion bar spring 371, which is centered on the rotation center axis 380 of the dynamic damper parallel to the first axis, is formed in the first support frame 120. Near the longitudinal center of the torsion bar spring 371, two bifurcated beam sections 372a, 372b extending in a direction perpendicular to the first axis are connected, and mass sections 373a, 373b, which act as weights, are formed at the ends of each beam section 372a, 372b.

[0119] The resonant frequency of the dynamic damper 370 is determined approximately by the rotational stiffness of the torsion bar spring 371 and beam sections 372a and 372b around the rotational center axis 380, and the moment of inertia of the mass section 373 and beam sections 372a and 372b. The resonant frequency of the dynamic damper 370 in this embodiment 10 is designed to substantially coincide with the frequency of abnormal vibrations around the first axis that occur when the mirror section 101 is driven to oscillate around the first axis. In this way, the vibration of the dynamic damper 370 absorbs the vibration energy of the abnormal vibrations around the first axis that occur when the first axis is driven, thereby suppressing the abnormal vibrations around the first axis.

[0120] Furthermore, in this embodiment 10, since the mirror section 101 is cantilevered by the first drive units 110a and 110b, as described above, there is empty space in the internal space of the first support frame 120 in the region opposite to the first piezoelectric drive units 112a and 112b relative to the torsion bars 111a and 111b. In this embodiment 10, the dynamic damper 370 is placed in this empty space in the internal space of the first support frame 120, so the dynamic damper 370 can be provided without increasing the size of the movable device 13.

[0121] In the embodiments described above, the detailed shape of each component is not limited to the shape of the embodiment. Furthermore, the materials, manufacturing processes, electrical connections, and control methods are not limited to the examples of the embodiments. For example, in the embodiments described above, the movable part is an example of an optical deflector in which the mirror part 101 is used, but the movable part may have a diffraction grating, a photodiode, a light-receiving element, a heater (e.g., a heater using SiN), a light source (e.g., a surface-emitting laser), etc. instead of the mirror part.

[0122] [Optical scanning system] Next, we will describe the optical scanning system 10 to which the movable device 13 is applied. Figure 15 is a schematic diagram of an example of an optical scanning system. The optical scanning system 10 is a system that optically scans the surface to be scanned 15 by deflecting light emitted from the light source device 12 using the reflective surface 14 of the movable device 13, according to the control of the control device.

[0123] The optical scanning system 10 includes a movable device 13. The movable device 13 has a control device, a light source device 12, and a reflective surface 14.

[0124] The control device is an electronic circuit unit equipped with, for example, a CPU (Central Processing Unit) and an FPGA (Field-Programmable Gate Array). The movable device 13 is a MEMS device having, for example, a reflective surface 14, the reflective surface 14 of which is movable.

[0125] The light source device 12 is, for example, a laser device that emits a laser. The scanning surface 15 is, for example, a screen.

[0126] The control device generates control commands for the light source device 12 and the movable device 13 based on the acquired optical scanning information. Based on the control commands, the control device outputs drive signals to the light source device 12 and the movable device 13. The light source device 12 emits light from the light source based on the input drive signals. The movable device 13 can pivot the reflective surface 14 around the Y axis based on the input drive signals. The movable device 13 can pivot the reflective surface 14 around the X axis based on the input drive signals. The movable device 13 may also pivot the reflective surface 14 around axes extending in other directions.

[0127] The optical scanning system 10 can perform optical scanning by oscillating the reflective surface 14, thereby projecting the light reflected by the reflective surface 14 onto the surface to be scanned 15. The optical scanning system 10 can project any image onto the surface to be scanned 15.

[0128] [Hardware configuration of optical scanning system 10] Next, we will describe the hardware configuration of an example of the optical scanning system 10. Figure 16 is a hardware configuration diagram of an example of an optical scanning system 10. The control device, the light source device 12, and the movable device 13 are electrically connected to each other. The control device includes a CPU 20, RAM 21 (Random Access Memory), ROM 22 (Read Only Memory), FPGA 23, an external I / F 24, a light source device driver 25, and a movable device driver 26.

[0129] The CPU 20 is an arithmetic unit that reads programs and data from storage devices such as ROM 22 onto RAM 21, executes processing, and realizes the overall control and functions of the control device. RAM 21 is a volatile storage device that temporarily holds programs and data. ROM 22 is a non-volatile storage device that can retain programs and data even when the power is turned off. ROM 22 stores processing programs and data that the CPU 20 executes to control each function of the optical scanning system 10.

[0130] FPGA23 is a circuit that outputs control signals suitable for the light source driver 25 and the movable device driver 26 according to the processing of the CPU 20. External I / F24 is an interface to external devices or networks, for example. External devices include, for example, higher-level devices such as PCs (Personal Computers), and storage devices such as USB memory, SD cards, CDs, DVDs, HDDs, and SSDs. Networks include, for example, automotive CAN (Controller Area Network), LAN (Local Area Network), and the internet. External I / F24 only needs to be configured to enable connection or communication with external devices, and an external I / F24 may be provided for each external device.

[0131] The light source driver 25 is an electrical circuit that outputs a drive signal, such as a drive voltage, to the light source device 12 according to the input control signal. The movable device driver 26 is an electrical circuit that outputs a drive signal, such as a drive voltage, to the movable device 13 according to the input control signal.

[0132] In the control unit, the CPU 20 acquires optical scanning information from external devices or networks via the external I / F 24. The CPU 20 can acquire optical scanning information as long as it is configured to do so. This could involve storing the optical scanning information in the ROM 22 or FPGA 23 within the control unit, or by adding a new storage device such as an SSD within the control unit and storing the optical scanning information in that device.

[0133] Optical scanning information refers to information indicating how to perform optical scanning on the surface to be scanned 15. For example, when displaying an image by optical scanning, the optical scanning information may be image data. Also, for example, when performing optical writing by optical scanning, the optical scanning information is writing data indicating the writing order and writing locations. For example, when performing object recognition by optical scanning, the optical scanning information is irradiation data indicating the timing and irradiation range of the light used for object recognition.

[0134] The control device can realize the functional configuration described later through the instructions and hardware configuration of the CPU 20.

[0135] [Control device function configuration] Next, the functional configuration of the control device of the optical scanning system 10 will be described. Figure 17 is a functional block diagram of an example of a control device. The control device includes a control unit 30 and a drive signal output unit 31. The control unit 30 is implemented by, for example, a CPU 20, an FPGA 23, etc. The control unit 30 acquires optical scanning information from an external device, converts the optical scanning information into a control signal, and outputs it to the drive signal output unit 31. For example, the control unit 30 acquires image data as optical scanning information from an external device, generates a control signal from the image data through predetermined processing, and outputs it to the drive signal output unit 31. The drive signal output unit 31 is implemented by, for example, a light source device driver 25, a movable device driver 26, etc. The drive signal output unit 31 outputs a drive signal to the light source device 12 or the movable device 13 based on the input control signal.

[0136] The drive signal is a signal for controlling the drive of the light source device 12 or the movable device 13. For example, the drive signal output to the light source device 12 is a drive voltage that controls the irradiation timing and irradiation intensity of the light source. The drive signal output to the movable device 13 is a drive voltage that controls the timing and range of movement of the reflective surface 14. The drive signal output to the movable device 13 may be the drive signal according to the first embodiment described above, or the drive signal according to the second embodiment.

[0137] [Light scanning process] Next, we will describe the process by which the optical scanning system 10 optically scans the surface to be scanned 15. Figure 18 is a flowchart of an example of processing related to an optical scanning system.

[0138] In step S11, the control unit 30 acquires optical scanning information from an external device or the like. In step S12, the control unit 30 generates a control signal from the acquired optical scanning information and outputs the control signal to the drive signal output unit 31. In step S13, the drive signal output unit 31 outputs a drive signal to the drive units 110a to 1110d of the light source device 12 and the movable device 13 based on the input control signal. In step S14, the light source device 12 irradiates light based on the input drive signal. The drive units 110a to 110d of the movable device 13 also oscillate the reflective surface 14 based on the input drive signal. According to the optical scanning system 10, the light is deflected in any direction and optical scanning is performed by driving the light source device 12 and the movable device 13.

[0139] The optical scanning system 10 may also include separate control devices for controlling the drive units 110a to 110d of the movable device 13 and for controlling the light source device 12.

[0140] The optical scanning system 10 can suppress the decrease in the resonant frequency that occurs when the size of the movable mirror portion 101 is increased. The optical scanning system 10 can perform optical scanning with high precision.

[0141] [Head-Up Display Device] Next, we will describe the head-up display device 500. Figure 19 is a schematic diagram of an example of an automobile 400 equipped with a head-up display device 500. The automobile 400 is equipped with a head-up display device 500. The head-up display device 500 is an image projection device that projects images by optical scanning. The automobile 400 is an example of a mobile device.

[0142] As shown in Figure 19, the head-up display device 500 is installed, for example, near the windshield (windshield 401, etc.) of a car 400. Projected light L emitted from the head-up display device 500 is reflected by the windshield 401 and directed towards the user, the observer (driver 402). As a result, the driver 402 can see the image projected by the head-up display device 500 as a virtual image. Alternatively, a combiner may be installed on the inner wall surface of the windshield, and the virtual image may be seen by the user by the projected light reflected by the combiner.

[0143] Figure 20 is a schematic diagram of an example of a head-up display device 500. The head-up display device 500 is equipped with laser light sources 501R, 501G, and 501B. Laser light source 501R emits red laser light. Laser light source 501G emits green laser light. Laser light source 501B emits blue laser light.

[0144] The head-up display device 500 includes an incident optical system. The incident optical system includes collimator lenses 502, 503, and 504, two dichroic mirrors 505 and 506, and a light intensity adjustment unit 507. The collimator lenses 502 to 504 are provided for laser light sources 501R, 501G, and 501B. Laser light emitted from the laser light sources 501R, 501G, and 501B passes through the incident optical system and enters the movable device 13. The laser light that enters the movable device 13 is reflected by the reflective surface 14. The laser light is deflected by the movable device 13.

[0145] The head-up display device 500 includes a projection optical system. The projection optical system includes a free-form surface mirror 509, an intermediate screen 510, and a projection mirror 511. The laser light deflected by the movable device 13 is projected onto the windshield 401 via the projection optical system. The head-up display device 500 may also project the laser light onto a screen. The head-up display device 500 may also include a unitized light source unit 530 having an optical housing. The optical housing may house, for example, laser light sources 501R, 501G, 501B, collimator lenses 502, 503, 504, and dichroic mirrors 505, 506.

[0146] The head-up display device 500 can project the intermediate image displayed on the intermediate screen 510 onto the windshield 401. According to the head-up display device 500, the intermediate image projected onto the windshield 401 can be viewed by the driver 402 as a virtual image.

[0147] The laser light of each color emitted from the laser light sources 501R, 501G, and 501B is made into approximately parallel light by collimator lenses 502, 503, and 504, respectively, and then combined by two dichroic mirrors 505 and 506. The dichroic mirrors 505 and 506 may each be examples of the combining section. After the combined laser light is adjusted in intensity by the light intensity adjustment section 507, it is scanned in two dimensions by the movable device 13. The projected light L scanned in two dimensions by the movable device 13 is reflected by the free-form mirror 509 to correct distortion, and then focused onto the intermediate screen 510. The intermediate screen 510 displays an intermediate image. The intermediate screen 510 is composed of a microlens array in which microlenses are arranged in two dimensions. The intermediate screen 510 magnifies the incident projected light L in units of microlenses.

[0148] The movable device 13 oscillates (reciprocates) the reflective surface 14 in two axial directions. The movable device 13 scans the projected light L incident on the reflective surface 14 in two dimensions. The drive control of the movable device 13 is synchronized with the light emission timing of the laser light sources 501R, 501G, and 501B.

[0149] The image projection device can project an image by performing a light scan using a movable device 13 having a reflective surface 14. The image projection device may be, for example, a projector placed on a desk or the like that projects an image onto a display screen. The image projection device may also be a head-mounted display device that is mounted on a wearable member attached to the observer's head or the like, and projects an image onto a reflective-transmitting screen on the wearable member, or projects an image onto the eyeballs as a screen.

[0150] The image projection device is not limited to those mounted on a vehicle or mounting member. For example, the image projection device may be mounted on a moving object such as an aircraft, ship, or mobile robot. Alternatively, the image projection device may be mounted on a non-moving object such as a work robot that operates a drive target such as a manipulator without moving from its location.

[0151] An image projection device equipped with a movable device 13 can suppress the decrease in resonant frequency that occurs when the movable part is enlarged, and can perform optical scanning with high precision. According to the image projection device equipped with a movable device 13, the resolution of the light trajectory near the center O of the field of view can be improved.

[0152] [Optical writing device 600] Next, we will describe the optical writing device 600 equipped with the movable device 13. Figure 21 is a schematic diagram of an example of an image forming apparatus equipped with an optical writing device 600. The image forming apparatus may be a laser printer 650. The laser printer 650 has a printer function using laser light. The laser printer 650 includes an optical writing device 600. The optical writing device 600 optically scans the photoreceptor drum, which is the scanning surface 15, with one or more laser beams. The optical writing device 600 performs optical writing on the photoreceptor drum by optical scanning. The optical writing device 600 includes a movable device 13.

[0153] Figure 22 is a schematic diagram of an example of an optical writing device. In the optical writing device 600, the laser light emitted from the light source device 12, such as a laser element, passes through the imaging optical system 601, such as a collimator lens, and is then deflected in one axis direction or two axis directions by the movable device 13.

[0154] The optical writing device 600 includes a scanning optical system 602. The scanning optical system has a first lens 602a, a second lens 602b, and a reflective mirror section 602c. The laser light deflected by the movable device 13 passes through the scanning optical system 602 and is irradiated onto the surface to be scanned 15 (for example, a photosensitive drum or photosensitive paper). As a result, the optical writing device 600 performs optical writing on the surface to be scanned 15. The scanning optical system 602 forms a spot-shaped image of the light beam on the surface to be scanned 15. As described above, the control device applies drive signals to the drive units 110a to 110d of the movable device 13 to oscillate the reflective surface 14.

[0155] Thus, the optical writing device 600 can be applied to an image forming apparatus that has a printer function using laser light. The image forming apparatus equipped with the optical writing device 600 may also be a laser labeling apparatus. The optical writing device 600 may be mounted on an image forming apparatus such as a laser labeling apparatus that has a scanning optical system capable of optical scanning in two axes, and prints by deflecting laser light onto a thermal media, optical scanning, and heating.

[0156] The movable device 13 having a reflective surface 14 consumes less power to drive compared to a rotating polyhedron mirror using a polygon mirror or the like. The optical writing device 600 equipped with the movable device 13 allows for power saving. The wind noise generated by the movable device 13 during vibration is less than that of a rotating polyhedron mirror. Therefore, the optical writing device 600 equipped with the movable device 13 allows for improved quietness. The installation space required for the movable device 13 is significantly less than that required for a rotating polyhedron mirror. The heat generated by the movable device 13 is significantly less than that generated by a rotating polyhedron mirror. The image forming apparatus equipped with the optical writing device 600 allows for easy miniaturization of the entire apparatus.

[0157] Thus, by applying the movable device 13 of the embodiment to the optical writing device 600, the decrease in resonant frequency that occurs when increasing the size of the movable part can be suppressed, and an optical writing device capable of high-precision optical scanning can be provided. With the optical writing device 600 equipped with the movable device 13, the resolution of the light trajectory near the center O of the field of view can be improved.

[0158] [Laser radar equipment] Next, we will explain the laser radar system 700. Figures 23 and 24 are schematic diagrams of an example of a vehicle equipped with a 700 laser radar system. Figure 25 is a schematic diagram of an example of a laser radar system 700. The laser radar device 700 is a distance measuring device that measures the distance to an object in the target direction. A distance measuring device is an example of an object recognition device. The laser radar device 700 has a movable device 13. The laser radar device 700 is mounted on, for example, an automobile 701, and measures the distance to an object 702 by optically scanning the target direction and receiving reflected light from the object 702 present in the target direction. The automobile 701 is an example of a mobile device.

[0159] As shown in Figure 25, the laser radar device 700 includes an incident optical system. The incident optical system has a collimator lens 703 and a plane mirror 704. The collimator lens 703 is an optical system that converts divergent light into approximately parallel light. The laser light emitted from the light source device 12 passes through the incident optical system and is scanned in one or two axes by the movable device 13.

[0160] The laser radar device 700 includes a light projection optical system having a light projection lens 705. Light reflected from the reflective surface 14 of the movable device 13 passes through the light projection lens 705 and is projected onto the target object 702 in front. The control device drives and controls the light source device 12 and the movable device 13. The reflected light reflected from the target object 702 is detected by the photodetector 709. The reflected light is received by the image sensor 707 via the incident light detection and reception optical system, such as the condensing lens 706. The image sensor 707 outputs the detection signal to the signal processing device 708. The signal processing device 708 performs predetermined processing on the input detection signal, such as binarization and noise processing, and outputs the result to the distance measuring circuit 710.

[0161] The distance measuring circuit 710 recognizes the presence or absence of the object 702 based on the time difference between the timing when the light source device 12 emits laser light and the timing when the photodetector 709 receives the laser light, or the phase difference of each pixel of the image sensor 707 that receives the light, and calculates distance information to the object 702.

[0162] The movable device 13 having a reflective surface 14 is less prone to damage and smaller than a polyhedron, thus enabling the provision of a highly durable, compact radar device. Such a laser radar device can be mounted on vehicles, aircraft, ships, robots, etc., and can optically scan a predetermined range to measure the presence or absence of obstacles and the distance to those obstacles.

[0163] The distance measuring device measures the distance to the object 702 by performing an optical scan by controlling a movable device 13 having a reflective surface 14 with a control device, and receiving the reflected light with a photodetector. The object recognition device is not limited to the distance measuring device. The object recognition device only needs to be able to detect the object 702 by having a movable device 13, performing an optical scan, and receiving the reflected light with a photodetector.

[0164] The object recognition device may be, for example, a biometric authentication device that recognizes an object by calculating object information such as shape from distance information obtained by optical scanning of a hand or face, and then recording and referencing this information. The object recognition device may also be a security sensor that recognizes intruders by optical scanning within a target area. The object recognition device may also be a 3D scanner that calculates and recognizes object information such as shape from distance information obtained by optical scanning and outputs it as 3D data.

[0165] By incorporating the movable device 13, such a distance measuring device can suppress the decrease in resonant frequency that occurs when increasing the size of the movable part, and can perform optical scanning with high precision. With a distance measuring device equipped with the movable device 13, the resolution of the light trajectory near the center O of the field of view can be improved.

[0166] [Laser headlamp] Next, a laser headlamp 50 equipped with a movable device 13 will be described. Figure 26 is a schematic diagram of an example of a laser headlamp 50. The laser headlamp 50 may also be an automobile headlight. The laser headlamp 50 includes a light source device 12b, a movable device 13, a mirror 51, and a transparent plate 52. The movable device 13 may include a control device which is a control unit.

[0167] The light source device 12b is a light source that emits blue laser light. The light emitted from the light source device 12b enters the movable device 13 and is reflected by the reflective surface 14. The drive units 110a to 110d of the movable device 13 oscillate the reflective surface 14 based on signals from the control device. The movable device 13 oscillates the reflective surface 14 to scan the laser light in two dimensions in the X and Y directions.

[0168] The scanning light from the movable device 13 is reflected by the mirror 51 and incident on the transparent plate 52. The transparent plate 52 is coated on either its front or back surface with a yellow phosphor. The blue laser light reflected by the mirror 51 changes to white light within the range legally defined for headlights as it passes through the yellow phosphor coating on the transparent plate 52. As a result, the area in front of the vehicle equipped with the laser headlamp 50 is illuminated with white light.

[0169] The scanning light from the movable device 13 undergoes a predetermined scattering as it passes through the phosphor in the transparent plate 52. This reduces glare on the illuminated object in front of the vehicle.

[0170] In the laser headlamp 50, the colors of the light source device 12b and the phosphor are not limited to blue and yellow, respectively. The laser headlamp 50 may also include a light source device 12b that emits near-ultraviolet light. In the laser headlamp 50, the transparent plate 52 may be covered with a uniform mixture of blue, green, and red phosphors, which are the three primary colors of light. With this configuration, the light passing through the transparent plate 52 can be converted to white light, and the area in front of the vehicle can be illuminated with white light.

[0171] By incorporating a movable device 13, such a laser headlamp 50 can suppress the decrease in resonant frequency that occurs when increasing the size of the movable part, and can perform optical scanning with high precision. With a laser headlamp 50 equipped with a movable device 13, the resolution of the light trajectory near the center O of the field of view can be improved.

[0172] [Head-mounted display] Next, we will describe the head-mounted display 60. Figure 27 is a perspective view of an example of a head-mounted display. Figure 28 is a diagram illustrating a partial configuration of a head-mounted display. The head-mounted display 60 is a head-mounted display that can be worn on a human head. The head-mounted display 60 can be shaped like, for example, eyeglasses. Hereinafter, the head-mounted display may be abbreviated as HMD. The HMD 60 is equipped with a movable device 13.

[0173] The HMD60 comprises a front 60a and temples 60b, each provided in a roughly symmetrical arrangement on the left and right sides. The front 60a has, for example, a light guide plate 61. The temples 60b can house optical systems, control devices, and the like.

[0174] Figure 28 shows the left eye portion of the HMD60. The right eye portion of the HMD60 has the same configuration as the left eye portion. The HMD60 includes a light source unit 530, a light intensity adjustment unit 507, a movable device 13, a light guide plate 61, and a half mirror 62. The movable device 13 may include a control device as a control unit.

[0175] As described above, the light source unit 530 is unitized by an optical housing. The optical housing houses the laser light sources 501R, 501G, and 501B, the collimator lenses 502, 503, and 504, and the dichroic mirrors 505 and 506. In the light source unit 530, the three colors of laser light emitted from the laser light sources 501R, 501G, and 501B are combined by the dichroic mirrors 505 and 506. The light source unit 530 emits the combined parallel light.

[0176] Light emitted from the light source unit 530 is adjusted in intensity by the light intensity adjustment unit 507 before being incident on the movable device 13. The movable device 13 oscillates the reflective surface 14 based on a drive signal input from the control device. The movable device 13 performs a two-dimensional scan of the light incident from the light source unit 530. The control device drives and controls the drive units 110a to 110d of the movable device 13 in synchronization with the light emission timing of the laser light sources 501R, 501G, and 501B. The HMD 60 forms a color image using the scanning light.

[0177] The scanning light from the movable device 13 is incident on the light guide plate 61. The light guide plate 61 guides the scanning light to the half mirror 62 while reflecting it off its inner wall surface. The light guide plate 61 is made of a resin or the like that is transparent to the wavelength of the scanning light.

[0178] The half-mirror 62 reflects light from the light guide plate 61 to the back side of the HMD 60 and emits it towards the eyes of the wearer 63. The half-mirror 62 has, for example, a free-form surface shape. The image formed by the scanning light is projected onto the wearer's retina by reflection from the half-mirror 62. Alternatively, the HMD 60 projects onto the wearer's retina by reflection from the half-mirror 62 and the lens effect of the crystalline lens in the eyeball. In the HMD 60, spatial distortion in the image is corrected by reflection from the half-mirror 62. The wearer 63 can observe the image formed by light scanned in the XY direction.

[0179] By equipping the HMD60 with a half-mirror 62, the wearer 63 can observe an image in which the image from light from the outside and the image from scanning light are superimposed. The HMD60 may also be equipped with a mirror instead of the half-mirror 62. With this configuration of the HMD60, by eliminating light from the outside, the wearer 63 can observe only the image from scanning light.

[0180] In this way, by applying the movable device 13 of the embodiment to a head-mounted display, the decrease in resonant frequency that occurs when increasing the size of the movable part can be suppressed, and a head-mounted display capable of high-precision optical scanning can be provided.

[0181] By incorporating the movable device 13, such an HMD60 can suppress the decrease in resonant frequency that occurs when increasing the size of the movable part, and can perform optical scanning with high precision. With the HMD60 equipped with the movable device 13, the resolution of the light trajectory near the center O of the field of view can be improved.

[0182] [Eyeball tilt position detection device (pupil or corneal position detection device 80)] Next, we will describe an eyeball tilt position detection device equipped with a movable device 13. The eyeball tilt position detection device is a pupil or corneal position detection device 80 that detects the position of the pupil or cornea. Figure 29 is a schematic diagram showing an example of the pupil or corneal position detection device 80.

[0183] In this embodiment, the "tilt position of the eyeball" refers to the position of the pupil or cornea of ​​the eyeball, or the direction of the user's gaze. Hereafter, the "tilt position of the eyeball" will be described as the position of the pupil or cornea, and the "eyeball tilt position detection device" will be described as the "pupil or cornea position detection device." Furthermore, the pupil or cornea position detection device described below is synonymous with a gaze direction tracking device (eye tracking device) that detects or tracks the user's gaze direction continuously or at time intervals.

[0184] The pupil or corneal position detection device 80 shown in Figure 29 comprises a light source 82, a first light deflection unit 83, a movable device 13, a second light deflection unit 85, and a light receiving unit 86.

[0185] The light source 82 includes, for example, laser light sources 82r, 82g, and 82b that emit red, green, and blue laser light, and an infrared laser light source 82ir that emits infrared laser light. The laser light sources 82r, 82g, and 82b may be any one or any combination of two. The laser light sources 82r, 82g, and 82b emit light for drawing an image using the movable device 13.

[0186] The infrared laser light source 82ir emits light for detecting the position of the pupil or cornea. The light used to detect the position of the pupil or cornea is not limited to infrared light; visible light may also be used. From the viewpoint of improving the visibility of the drawn image, invisible light is preferred for detecting the position of the pupil or cornea.

[0187] The first light deflection unit 83 is, for example, a dichroic mirror, which deflects the light emitted from the light source 82 toward the reflective surface 14 of the movable device 13 while combining the light. The pupil or corneal position detection device 80 may include a plurality of first light deflection units 83-1, 83-2, 83-3, 83-4, 83-5 depending on the number of laser light sources 82r, 82g, 82b and infrared laser light sources 82ir. The first light deflection unit 83 includes a plurality of first light deflection units 83-1, 83-2, 83-3, 83-4, 83-5. The plurality of first light deflection units 83-1, 83-2, 83-3, 83-4, 83-5 deflect their respective lights while combining them.

[0188] The movable device 13 is equipped with a reflective surface 14 and scans the light deflected by the first light deflection unit 83 toward the second light deflection unit 85 in a two-dimensional direction. At this time, the movable device 13 scans the light deflected by the first light deflection unit 83 by, for example, raster scanning and forms an image. The movable device 13 can scan the light deflected by the first light deflection unit 83 by spiral scanning.

[0189] The second light deflection unit 85 is, for example, a holographic optical element, which deflects the light L1 scanned by the movable device 13 toward the user's eyeball 87. At least a portion of the light L2 deflected by the second light deflection unit 85 is incident on the user's eyeball 87 as display image light. The second light deflection unit 85 may also be equipped with multiple light deflection members. For example, multiple types of light deflection members that reflect specific light from the light emitted from the light source 82 may be used, so that the reflective surface differs for each type of light emitted from the light source 82. A specific example is a configuration in which light deflection members that reflect light emitted from laser light sources 82r, 82g, and 82b are stacked in order from closest to the eyeball 87, and a light deflection member that reflects light emitted from an infrared laser light source 82ir is stacked.

[0190] The light-receiving unit 86 receives light L3 reflected by the user's eyeball 87 from the light L2 deflected by the second light deflection unit 85, and outputs a detection signal SD corresponding to the received light. The light-receiving unit 86 is, for example, an image sensor capable of detecting infrared light. Multiple light-receiving units 86 may be provided at positions capable of receiving light L3 reflected by the user's eyeball 87. The light intensity of the light received by the light-receiving unit 86 changes depending on the position of the eyeball (pupil, cornea, etc.), i.e., the direction of line of sight. Therefore, the pupil or corneal position detection device 80 in this embodiment detects or estimates the pupil or corneal position based on the intensity of the light received by the light-receiving unit 86. The light-receiving unit 86 may also be configured to image the eyeball 87 illuminated by the light L2 deflected by the second light deflection unit 85. In this case, the pupil or corneal position detection device 80 detects or estimates the tilt position of the eyeball based on the position of the pupil or cornea included in the captured image (detection signal SD) and the position where the light L2 deflected by the second light deflection unit 85 is reflected in the eyeball 87.

[0191] As described above, the pupil or corneal position detection device 80 according to this embodiment can detect the position of the pupil or cornea while forming an image with the movable device 13. Furthermore, since the movable device 13 is configured to scan light more efficiently, it is possible to achieve image formation and detection of the pupil or corneal position with lower power consumption. Moreover, the movable device 13 can achieve the above effects without changing the area required for mounting on the pupil or corneal position detection device 80 compared to the configuration of the conventional technology. As a result, the pupil or corneal position detection device 80 can be configured without becoming larger.

[0192] Furthermore, the pupil or corneal position detection device 80 can also be mounted on a head-mounted display as, for example, an eye-tracking device to detect or track the user's gaze direction. In this case, for example, by reducing the resolution of the image displayed in other areas compared to the image displayed in the area near the user's gaze direction (foveal rendering), image processing can be sped up compared to displaying a high-resolution image across the entire area.

[0193] Figure 30 is a schematic diagram showing an example of a pupil or corneal position detection device 80. As shown in Figure 30, the pupil or corneal position detection device 80 comprises a light source 82, first light deflection units 83-1 to 83-4, lens 92, lens 93, scanning mirror 94, deflection mirror 95, second light deflection unit 85, light receiving unit 86, and control unit 96.

[0194] Lens 92 is an optical system that converts light emitted from the light source 82 into substantially parallel light. Lens 93 is an optical system that shapes the light converted into substantially parallel light by lens 92 into a desired laser beam state. In this embodiment, a configuration having lens 92 and lens 93 is shown, but lenses 92 and 93 are not necessarily required.

[0195] Light formed by lenses 92 and 93 is incident on the scanning mirror 94 (movable device 13). The scanning mirror 94 scans the incident light and forms image light. The formed image light is incident on the deflection mirror 95 and reflected in the direction toward the second light deflection unit 85. The deflection mirror 95 corresponds to the first light deflection unit 83-5 described in Figure 29, but it is preferable that it has a configuration that allows it to scan light and is equipped with the movable device 13. By making the deflection mirror 95 capable of light scanning, an image can be projected over a wider area.

[0196] In the above description, a configuration in which the deflection mirror 95 is positioned between the scanning mirror 94 and the second light deflection unit 85 is given as an example, but the pupil or corneal position detection device 80 is not limited to this. In the pupil or corneal position detection device 80, the scanning mirror 94 may be positioned between the deflection mirror 95 and the second light deflection unit 85, and the light reflected by the deflection mirror 95 may be scanned in two axial directions by the scanning mirror 94 and incident on the second light deflection unit 85.

[0197] The control unit 96 detects the position of the user's pupil or cornea based on the detection signal SD output by the light receiving unit 86 and acquires information indicating the direction of gaze. The control unit 96 also controls the emission and light intensity of the light source 82 by providing a formation drive signal SL1 to the light source 82 to form an image to be projected onto the retina 32, and drives the scanning mirror 94 by providing a scanning drive signal SS to the scanning mirror 94. Furthermore, if the deflection mirror 95 is configured to be optically scannable, the control unit 96 drives the deflection mirror 95 by providing a deflection drive signal ST to control the projection position of the image according to the acquired gaze information.

[0198] Although examples of embodiments of the present invention have been described above, the present invention is not limited to these specific embodiments, and various modifications and changes are possible within the scope of the gist of the present invention as described in the claims.

[0199] In the embodiments described above, a configuration in which a reflective surface is provided on the movable part is illustrated, but the invention is not limited to this. The movable part may also be equipped with other optical elements such as a diffraction grating, a photodiode, a heater (for example, a heater using SiN), or a light source (for example, a surface-emitting laser), or it may be equipped with both a reflective surface and other optical elements.

[0200] [Processing circuit] Each of the functions of the embodiments described above can be realized by one or more processing circuits. Hereinafter, "processing circuit" as used herein includes processors programmed to execute each function by software, such as processors implemented by electronic circuits, as well as devices such as ASICs (Application Specific Integrated Circuits), DSPs (digital signal processors), FPGAs (field programmable gate arrays), and conventional circuit modules designed to execute each of the functions described above.

[0201] The above is just one example; each of the following embodiments produces its own unique effects. [First aspect] The first embodiment is a movable device 13 comprising a movable part (e.g., a mirror part 101), first drive units 110a to 110d, 210a to 210d that drive the movable part to swing around a first axis, a first support part (e.g., a first support frame 120) that supports the first drive unit, second drive units 130a to 130d, 230a, 230b that drive the first support part to swing around a second axis substantially perpendicular to the first axis, and a second support part (e.g., a second support frame 140) that supports the second drive unit, characterized in that it has vibration reduction units (e.g., dynamic dampers 300, 300A, 300B, 350) that reduce vibrations of a specific vibration mode (e.g., a primary resonance mode around the second axis) that causes the first support part to vibrate around the second axis among the vibration modes that occur when the first drive unit is driven. In a movable device in which a movable part is oscillated around a first axis by a first drive unit, and a first support unit that supports the first drive unit is oscillated around a second axis by a second drive unit, the oscillation frequencies around the first axis and the oscillation frequencies around the second axis are separated to suppress interference between them. However, it has been found that if the driving force of the first drive unit is increased and the oscillation amplitude around the first axis is increased, vibrations generated in the first support unit are propagated to the second drive unit, which can cause abnormal vibrations around the second axis. More specifically, when the movable part oscillates around the first axis due to the drive of the first drive unit, vibrations may occur in the first support unit that supports the first drive unit. Among the vibration modes of the first support unit that occur at this time, there may be a specific vibration mode that causes the first support unit to vibrate around the second axis (for example, the resonance mode of the second drive unit). In this case, if the vibration of the specific vibration mode becomes large, abnormal vibration will occur around the second axis, hindering the normal oscillation of the movable part around the first axis. In this embodiment, by providing a vibration reduction unit, the vibration of a specific vibration mode that causes the first support unit to vibrate around the second axis, among the vibration modes that occur when the first drive unit is driven, is reduced. As a result, even if the vibration of the specific vibration mode increases, for example by increasing the driving force of the first drive unit and increasing the oscillation amplitude around the first axis, the vibration of that specific vibration mode is reduced by the vibration reduction unit. As a result, it is possible to suppress the propagation of the vibration of the specific vibration mode to the second drive unit and the occurrence of abnormal vibration around the second axis, and to suppress the situation in which the oscillation of the movable part around the second axis is hindered.

[0202] [Second aspect] The second embodiment is a movable device 13 comprising a movable part (e.g., a mirror part 101), first drive units 110a to 110d, 210a to 210d that drive the movable part to swing around a first axis, a first support part (e.g., a first support frame 120) that supports the first drive unit, second drive units 130a to 130d, 230a, 230b that drive the first support part to swing around a second axis substantially perpendicular to the first axis, and a second support part (e.g., a second support frame 140) that supports the second drive unit, characterized in that it has a vibration reduction unit (e.g., a dynamic damper 370) that reduces vibrations of a specific vibration mode that causes the first support part to vibrate around the first axis (e.g., abnormal vibration around the first axis) among the vibration modes that occur when the first drive unit is driven. In a movable device in which a movable part is oscillated around a first axis by a first drive unit, and a first support unit that supports the first drive unit is oscillated around a second axis by a second drive unit, the oscillation frequencies around the first axis and the oscillation frequencies around the second axis are separated to suppress interference between them. However, it has been found that if the driving force of the first drive unit is increased and the oscillation amplitude around the first axis is increased, abnormal vibrations around the first axis can occur due to vibrations generated in the first support unit. More specifically, when the movable part oscillates around the first axis due to the drive of the first drive unit, vibrations may occur in the first support unit that supports the first drive unit. Among the vibration modes of the first support unit that occur at this time, there may be a specific vibration mode that causes the movable part to vibrate around the first axis. In this case, if the vibration of the specific vibration mode becomes large, abnormal vibrations will occur around the first axis, and the oscillation of the movable part around the first axis will be hindered. In this embodiment, by providing a vibration reduction unit, the vibration of a specific vibration mode that causes the movable part to vibrate around the first axis, among the vibration modes that occur when the first drive unit is driven, is reduced. As a result, even if the vibration of the specific vibration mode increases, for example by increasing the driving force of the first drive unit and increasing the oscillation amplitude around the first axis, the vibration of that specific vibration mode is reduced by the vibration reduction unit. As a result, it is possible to suppress the occurrence of abnormal vibration around the first axis due to the vibration of the specific vibration mode, and to prevent the oscillation of the movable part around the first axis from being hindered.

[0203] [Third aspect] The third aspect is characterized in that, in the first or second aspect, the vibration reduction unit includes dynamic dampers 300, 300A, 300B, 350, and 370 attached to the first support unit. According to this method, it is possible to generate vibrations to reduce abnormal vibrations and suppress them without installing actuators. This allows for, for example, a reduction in the number of wires.

[0204] [Fourth aspect] The fourth aspect is characterized in that, in the first aspect, the vibration reduction unit includes dynamic dampers 300, 300A, 300B, and 350, which are attached to the first support unit and support the mass unit so that it can rotate around a pivot axis (e.g., a rotation center axis 310, 360) parallel to the second axis. According to this, a dynamic damper with a simple configuration can suppress abnormal vibrations around the second axis, thereby preventing situations where the oscillation of the movable part around the second axis is inhibited.

[0205] [Fifth aspect] The fifth aspect is characterized in that, in the second aspect, the vibration reduction unit includes a dynamic damper 370 comprising a mass unit (for example, a beam unit 372 and a mass unit 373) and a pivot shaft unit (for example, a torsion bar spring 371) attached to the first support unit and supporting the mass unit so as to be rotatable about a pivot axis parallel to the first axis. According to this, a dynamic damper with a simple configuration can suppress abnormal vibrations around the first axis, thereby preventing situations where the oscillation of the movable part around the first axis is inhibited.

[0206] [Sixth aspect] The sixth aspect is characterized in that, in the fourth or fifth aspect, the pivot shaft portion and the mass portion are connected to each other by a connecting portion 304 whose axial length of the pivot shaft is shorter than that of the mass portion. According to this, it becomes possible to make the length of the pivot axis of the dynamic damper, which is positioned inside the first support, shorter than the width of the mass part (the axial length of the pivot axis). As a result, it becomes easier to suppress an increase in the size of the first support.

[0207] [Seventh aspect] The seventh aspect is characterized in that, in any of the fourth to sixth aspects, the thickness of the pivot shaft portion is thinner than that of the mass portion. According to this, the thickness of the pivot shaft portion, which functions as the spring part of the dynamic damper, can be made thinner, and the resonant frequency of the dynamic damper can be easily lowered.

[0208] [8th aspect] The eighth aspect is characterized in that, in any of the third to seventh aspects, the dynamic damper is provided with two of the dynamic dampers, and the two dynamic dampers are configured to operate in vibration modes that are out of phase with respect to each other. According to this, it is possible to efficiently dampen abnormal vibrations.

[0209] [Ninth aspect] The ninth embodiment is characterized in that, in any of the third to eighth embodiments, a damper material (for example, a damper gel material 305, a damping film 306) is provided between the first support portion and the dynamic damper. According to this, the insufficient damping function of the dynamic damper can be compensated for by the damping material, thereby improving the effect of suppressing abnormal vibrations.

[0210] [Tenth aspect] The tenth embodiment is characterized in that, in the ninth embodiment, the damper material is a constituent film (for example, a damping film 306) that constitutes the first support portion and the dynamic damper. According to this method, by leaving the constituent film as a damping material during the manufacturing process, it is possible to provide damping material at a lower cost than when damping material is added later.

[0211] [Aspect 11] The eleventh embodiment is one in which, in any of the first to tenth embodiments, at least a portion of the vibration reduction unit is arranged between the first support unit and the first drive unit. A gap is formed between the first support and the first drive unit, allowing the first drive unit to be displaced. Since this gap is empty space, in this embodiment, where at least a portion of the vibration reduction unit is placed in this gap, the device can be easily miniaturized.

[0212] [Twelfth aspect] The twelfth embodiment is an optical deflector that deflects light by reflecting light with a reflective part (e.g., a reflective surface 14) provided on a movable part (e.g., a mirror part 101) of a movable device 13, characterized in that the movable device is one of the movable devices of the first to eleventh embodiments. According to this, it is possible to provide an optical deflector in which the oscillation of the reflecting part is suppressed by vibrations generated when the reflecting part oscillates around its first axis.

[0213] [The 13th aspect] The 13th aspect is a projection device characterized by having an optical deflector as described in the 12th aspect. This makes it possible to provide a projection device in which the oscillation of the reflective part is suppressed by vibrations generated when the reflective part oscillates around its first axis.

[0214] [Aspect 14] The 14th embodiment is a head-up display characterized by having an optical deflector according to the 12th embodiment. According to this, it is possible to provide a head-up display in which the oscillation of the reflective part is suppressed by vibrations generated when the reflective part oscillates around its first axis.

[0215] [Aspect 15] The 15th embodiment is a laser headlamp characterized by having an optical deflector according to the 12th embodiment. This makes it possible to provide a laser headlamp in which the oscillation of the reflecting part is suppressed by vibrations generated when the reflecting part oscillates around its first axis.

[0216] [Phase 16] The sixteenth embodiment is a head-mounted display characterized by having an optical deflector according to the twelfth embodiment. According to this, it is possible to provide a head-mounted display in which the oscillation of the reflective part is suppressed by vibrations generated when the reflective part oscillates around its first axis.

[0217] [Pattern 17] The 17th aspect is an object recognition device characterized by having an optical deflector as described in the 12th aspect. This makes it possible to provide an object recognition device in which the oscillation of the reflective part is suppressed by vibrations generated when the reflective part oscillates around its first axis.

[0218] [Pattern 18] The 18th embodiment is a mobile body characterized by having at least one of the head-up display of the 14th embodiment, the laser headlamp of the 15th embodiment, and the object recognition device of the 17th embodiment. This makes it possible to provide a mobile body in which the oscillation of the reflecting part is suppressed by vibrations generated when the reflecting part oscillates around its first axis. [Explanation of Symbols]

[0219] 10: Optical scanning system 13: Movable device 14: Reflective surface 30: Control Unit 50: Laser headlamp 60: Head-mounted display 80: Position detection device 101: Mirror section 110a~110d, 210a~210d: First drive unit 111a, 111b: Torsion bar 112a, 112b, 212a~212d: First piezoelectric drive unit 120: First support slot 130a~130d, 230a, 230b: Second drive unit 131a~131d, 132a~132d, 133a~133d, 134a~134d: Second piezoelectric drive unit 140: Second support slot 150: Electrode connection part 160: Inter-board connection section 200: Piezoelectric material 201: Lower electrode 202: Piezoelectric part 203: Upper electrode 300, 300A, 300B, 350, 370: Dynamic damper 301, 351, 371: Torsion bar springs 302,352,372:Beam part 303,353,373: Mass Department 304 :Connection part 305: Damper gel material 306: Damping film 310, 360, 380: Rotational center axis 361,362: SOI substrate 361a, 362a: Silicon support layer 361b, 362b: Silicon oxide layer 361c, 362c: Silicon active layer 363: Silicon oxide layer 400: Automobile 500: Head-up display device 600: Optical writing device 700: Laser radar equipment [Prior art documents] [Patent Documents]

[0220] [Patent Document 1] Patent No. 7501281

Claims

1. Movable parts and A first drive unit drives the movable part to swing around the first axis, A first support portion that supports the first drive portion, A second drive unit drives the first support unit to swing around a second axis that is substantially perpendicular to the first axis, A movable device comprising a second support portion that supports the second drive portion, A movable device characterized by having a vibration reduction unit that reduces vibrations of a specific vibration mode among the vibration modes that occur when the first drive unit is driven, which causes the first support unit to vibrate around the second shaft.

2. Movable parts and A first drive unit drives the movable part to swing around the first axis, A first support portion that supports the first drive portion, A second drive unit drives the first support unit to swing around a second axis that is substantially perpendicular to the first axis, A movable device comprising a second support portion that supports the second drive portion, A movable device characterized by having a vibration reduction unit that reduces vibrations of a specific vibration mode among the vibration modes that occur when the first drive unit is driven, which causes the first support unit to vibrate around the first shaft.

3. In the movable device according to claim 1 or 2, The movable device is characterized in that the vibration reduction section includes a dynamic damper attached to the first support section.

4. In the movable device according to claim 1, The vibration reduction unit is characterized by including a dynamic damper comprising a mass unit and a pivot shaft unit attached to the first support unit and supporting the mass unit so as to be rotatable about a pivot axis parallel to the second axis.

5. In the movable device according to claim 2, The vibration reduction unit is characterized by including a dynamic damper comprising a mass unit and a pivot shaft unit attached to the first support unit and supporting the mass unit so as to be rotatable about a pivot axis parallel to the first axis.

6. In the movable device according to claim 4 or 5, A movable device characterized in that the pivot shaft portion and the mass portion are connected to each other by a connecting portion whose axial length is shorter than that of the mass portion.

7. In the movable device according to claim 4 or 5, A movable device characterized in that the thickness of the pivot shaft portion is thinner than that of the mass portion.

8. In the movable device according to claim 4 or 5, The system is equipped with two of the aforementioned dynamic dampers, The movable device is characterized in that the two dynamic dampers are configured to operate in vibration modes that are out of phase with respect to each other.

9. In the movable device according to claim 4 or 5, A movable device characterized in that a damping material is provided between the first support portion and the dynamic damper.

10. In the movable device according to claim 9, The movable device is characterized in that the damping material is a constituent membrane that makes up the first support portion and the dynamic damper.

11. In the movable device according to claim 1, 2, 4, or 5, At least a portion of the vibration reduction unit is a movable device disposed between the first support unit and the first drive unit.

12. An optical deflector that deflects light by reflecting it with a reflective part provided on the movable part of a movable device, An optical deflector characterized in that the movable device is the movable device described in claim 1, 2, 4, or 5.

13. A projection device characterized by having the light deflector described in claim 12.

14. A head-up display characterized by having the optical deflector described in claim 12.

15. A laser headlamp characterized by having the optical deflector described in claim 12.

16. A head-mounted display characterized by having the optical deflector described in claim 12.

17. An object recognition device characterized by having the optical deflector described in claim 12.

18. A mobile body having at least one of the following devices: a head-up display, a laser headlamp, and an object recognition device, The mobile body is characterized in that at least one of the devices has the optical deflector described in claim 12.

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