Resin composition, film, polarizing sheet, and sunglasses

Abstract

A resin composition capable of providing a film that can effectively suppress the formation of grease and gel during film manufacturing, as well as a film, a polarizing sheet, and sunglasses. [Solution] A polyamide resin (A) containing alicyclic diamine units and aliphatic dicarboxylic acid units, and P(=O)(OR 1 ) 3-n (OR 2 ) n The structure represented by (where R 1 represents a hydrogen atom or a metal atom, and R 2 A resin composition comprising a phosphate compound (B) having (where represents a substituent other than a metal atom, and n is an integer of 1 or 2), wherein the content of the phosphate compound (B) is 0.001 to 2.5% by mass of the resin composition.

Description

[Technical Field]

[0001] This invention relates to resin compositions, films, polarizing sheets, and sunglasses. In particular, it relates to resin compositions mainly composed of polyamide resin, etc. [Background technology]

[0002] Polyamide resins are used in a wide range of applications, including electrical and electronic equipment, automobiles, machinery, and building materials, due to their excellent mechanical properties such as rigidity and strength, as well as heat resistance (Patent Documents 1-3). [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2015-129271 [Patent Document 2] Japanese Patent Publication No. 2013-001906 [Patent Document 3] Japanese Patent Publication No. 2012-131977 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] As mentioned above, polyamide resins are used in a wide range of fields, but when forming polyamide resins into films, glue can form or the polyamide resin can gel during the film manufacturing process. The present invention aims to solve these problems and to provide a resin composition capable of providing a film that can effectively suppress the formation of glue and gel during film manufacturing, as well as a film, a polarizing sheet, and sunglasses. [Means for solving the problem]

[0005] Under the above problems, as a result of the study by the present inventors, it has been found that the above problems can be solved by blending a predetermined phosphate compound in a predetermined polyamide resin at a ratio of 0.001 to 2.5% by mass in the resin composition. Specifically, the above problems have been solved by the following means. <1>A resin composition containing a polyamide resin (A) containing an alicyclic diamine unit and an aliphatic dicarboxylic acid unit, P(=O)(O-R 1 ) 3-n (O-R 2 ) n represented by the structure (where R 1 represents a hydrogen atom or a metal atom, R 2 represents a substituent other than a metal atom, and n is an integer of 1 or 2.) and a phosphate compound (B), where the content of the phosphate compound (B) is 0.001 to 2.5% by mass in the resin composition. <2>The resin composition according to <1>, wherein the aliphatic dicarboxylic acid unit contains an aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms. <3>The resin composition according to <1> or <2>, wherein the aliphatic dicarboxylic acid unit contains a sebacic acid unit and / or a dodecanedioic acid unit. <4>The resin composition according to any one of <1> to <3>, wherein the alicyclic diamine constituting the alicyclic diamine unit contains two substituted or unsubstituted cyclohexane rings. <5>The resin composition according to any one of <1> to <4>, wherein the alicyclic diamine unit contains a unit represented by the formula (PA-1).

Chemical formula

Chemical formula

[0006] This invention provides a resin composition capable of effectively suppressing the formation of grease and gel during film manufacturing, as well as films, polarizing sheets, and sunglasses. [Brief explanation of the drawing]

[0007] [Figure 1] This is a schematic diagram illustrating an example of the layer structure of the heat-bent molded product according to this embodiment. [Modes for carrying out the invention]

[0008] The following describes in detail embodiments for carrying out the present invention (hereinafter simply referred to as "this embodiment"). Note that the following embodiment is illustrative for explaining the present invention, and the present invention is not limited to this embodiment. In this specification, "~" is used to mean that the numerical values ​​before and after it are included as the lower and upper limits. Furthermore, the upper and lower limits of the numerical values ​​in this specification are given as examples of this embodiment, regardless of the combination of upper and lower limits. In this specification, all physical properties and characteristic values ​​shall be those at 23°C unless otherwise specified. In this specification, when groups (atomic groups) are not specified as substituted or unsubstituted, the notation includes both groups (atomic groups) with and without substituents. For example, "alkyl group" includes not only unsubstituted alkyl groups but also substituted alkyl groups. In this specification, when notation is not specified as substituted or unsubstituted, unsubstituted is preferred. Examples of substituents in this specification are preferably halogen atoms, cyano groups, nitro groups, hydroxyl groups, alkyl groups, alkoxy groups, aryl groups, aryloxy groups, heterocyclic groups, heterocyclic oxy groups, alkenyl groups, alkylsulfanyl groups, arylsulfanyl groups, acyl groups, or amino groups; more preferably halogen atoms, alkyl groups, alkoxy groups, aryl groups, aryloxy groups, alkenyl groups, or acyl groups; even more preferably alkyl groups, aryl groups, aryloxy groups, or alkenyl groups; and even more preferably alkyl groups. The formula weight of these substituents is preferably 15 or more, and preferably 200 or less. For example, the formula weight of a methyl group (-CH3) is 15. These substituents may have further substituents, but it is preferable that they have no substituents.

[0009] In this specification, "film" refers to a molded product that is thin in thickness relative to its length and width, and is generally flat, and includes sheets. Furthermore, "film" in this specification may be single-layer or multi-layer, but single-layer is preferred. If the measurement methods, etc., described in the standards shown in this specification differ from year to year, unless otherwise specified, the standards as of January 1, 2024 shall apply. If the measurement methods, etc., described in the standards shown in this specification have been discontinued as of January 1, 2024, the standards in effect at the time of discontinuation shall apply. Figure 1 may not accurately reflect reality due to its scale and other factors.

[0010] <Resin composition> The resin composition of this embodiment comprises a polyamide resin (A) containing alicyclic diamine units and aliphatic dicarboxylic acid units, and P(=O)(OR 1 ) 3-n (OR 2 ) n The structure represented by (where R 1 represents a hydrogen atom or a metal atom, R 2The resin composition is characterized by comprising a phosphate compound (B) having (where represents a substituent other than a metal atom, and n is an integer of 1 or 2), wherein the content of the phosphate compound (B) is 0.001 to 2.5% by mass in the resin composition. By adopting this configuration, a resin composition is obtained that can provide a film that effectively suppresses the formation of grease and gel during film manufacturing. Die grease is a deposit that forms when polyamide resin accumulates in the die slip area during extrusion molding, and is presumed to be mainly caused by decomposition products of the polyamide resin. By incorporating a stabilizer such as a phosphate compound (B), the decomposition of the polyamide resin (A) can be effectively suppressed. On the other hand, gel formation occurs when the polyamide resin decomposes and recombines to form a polymer due to the thermal history during compounding. In other words, since polyamide resin (A) is inherently a resin that readily reacts with active sites on metal surfaces, it reacts with active sites present on the metal surface inside the molding machine, and it is thought that this reaction promotes decomposition and recombination, resulting in gel formation. In this embodiment, it is presumed that the phosphate compound (B) having a predetermined structure interacts with the metal active sites, effectively suppressing the reaction of polyamide resin (A) with active sites on the metal surface, and thus suppressing the gelation of polyamide resin (A). Furthermore, the resin composition of this embodiment can be made to have excellent transparency and can be preferably used in optical components. The details of this embodiment will be described below.

[0011] <Polyamide resin (A) containing alicyclic diamine units and aliphatic dicarboxylic acid units> The resin composition of this embodiment includes a polyamide resin (A) (which may be referred to as "polyamide resin (A)" herein) containing alicyclic diamine units and aliphatic dicarboxylic acid units. The alicyclic structure of polyamide resin (A) can improve the transparency of the polyamide resin itself, and thus improve the transparency of the resulting film. Furthermore, since polyamide resin (A) has excellent compatibility with phosphate compound (B), the resulting resin composition does not impair transparency.

[0012] In this embodiment, the alicyclic diamine constituting the alicyclic diamine unit is preferably a diamine containing a five-membered ring and / or a six-membered ring. The five-membered ring and / or six-membered ring may or may not have substituents. Furthermore, it is preferable that the alicyclic diamine consists only of aliphatic hydrocarbon groups containing an alicyclic structure, except for the terminal amino group. The alicyclic diamine unit contains, more preferably, two or more substituted or unsubstituted cyclohexane rings, and even more preferably, two substituted or unsubstituted cyclohexane rings. The alicyclic diamine unit preferably does not contain carbon-carbon double bonds or carbon-carbon triple bonds. The molecular weight of the alicyclic diamine constituting the alicyclic diamine unit is preferably 195 or more, more preferably 200 or more, preferably 500 or less, more preferably 400 or less, and even more preferably 300 or less.

[0013] In this embodiment, it is more preferable that the alicyclic diamine unit includes at least one unit represented by formula (PA-0). [ka] (In formula (PA-0), R is an independent substituent, and n is an independent integer between 0 and 5. L is a single bond or a divalent linking group. * indicates a bond site with another unit or terminal group.) In formula (PA-0), each R is independently a substituent, preferably an aliphatic group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, even more preferably a linear or branched alkyl group having 1 to 6 carbon atoms, even more preferably a methyl group, an ethyl group, or a propyl group, and even more preferably a methyl group. In formula (PA-0), n is an integer between 0 and 5, preferably an integer of 1 or more, preferably an integer of 4 or less, more preferably an integer of 3 or less, even more preferably an integer of 2 or less, and even more preferably an integer of 1 or less. In formula (PA-0), L is a single bond or a divalent linking group, more preferably a single bond or a divalent aliphatic hydrocarbon group, more preferably a single bond or a divalent alkylene group, even more preferably a single bond or an alkylene group having 1 to 3 carbon atoms, even more preferably a single bond, a methylene group, an ethylene group, or an isopropylene group, and even more preferably a methylene group. * indicates a bonding site with another unit or terminal group. That is, it is usually bonded to -C(=O)- to form an amide bond with NH in formula (PA-0), or bonded to a hydrogen atom to form a terminal amino group with NH in formula (PA-0), or bonded to a terminal group.

[0014] In this embodiment, it is more preferable that the alicyclic diamine unit includes a unit represented by formula (PA-1). [ka] (In formula (PA-1), R 1 Each of these is an alkyl group having 1 to 5 carbon atoms, and each of these is an integer from 0 to 3. * indicates a bonding site with another unit or terminal group.

[0015] In formula (PA-1), R 1This is an alkyl group having 1 to 5 carbon atoms, preferably a linear or branched alkyl group having 1 to 5 carbon atoms, more preferably a methyl group, an ethyl group, or a propyl group, and even more preferably a methyl group. In formula (PA-1), n1 is an integer between 0 and 3, preferably an integer greater than or equal to 1, preferably an integer less than or equal to 2, and more preferably 1.

[0016] Specific examples of alicyclic diamines include 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, 1,3-diaminocyclohexane, 1,4-diaminocyclohexane, bis(4-aminocyclohexyl)methane, bis(4-amino-3-methylcyclohexyl)methane, 2,2-bis(4-aminocyclohexyl)propane, 2,2-bis(4-amino-3-methylcyclohexyl)propane, bis(aminomethyl)decalin, and bis(aminomethyl)tricyclodecane.

[0017] The polyamide resin (A) contains alicyclic diamine units in a proportion of preferably 75 mol% or more, more preferably 80 mol% or more, even more preferably 85 mol% or more, even more preferably 90 mol% or more, even more preferably 95 mol% or more, particularly even more preferably 99 mol% or more, and 100 mol% or less of the total diamine units constituting the polyamide resin (A). The alicyclic diamine units may be one type or a combination of two or more types.

[0018] Examples of diamines other than alicyclic diamines that can be used as raw material diamines for polyamide resin (A) include aliphatic diamines such as tetramethylenediamine, pentamethylenediamine, 2-methylpentanediamine, hexamethylenediamine, heptamethylenediamine, octamethylenediamine, nonamethylenediamine, decamethylenediamine, dodecamethylenediamine, 2,2,4-trimethylhexamethylenediamine, and 2,4,4-trimethylhexamethylenediamine, as well as aromatic ring diamines such as xylylenediamine, bis(4-aminophenyl) ether, paraphenylenediamine, and bis(aminomethyl)naphthalene. One or more of these can be used in combination.

[0019] On the other hand, in this embodiment, the aliphatic dicarboxylic acid constituting the aliphatic dicarboxylic acid unit is preferably a linear or branched aliphatic dicarboxylic acid having 7 to 20 carbon atoms, more preferably a linear aliphatic dicarboxylic acid having 7 to 20 carbon atoms, and even more preferably an α,ω-linear aliphatic dicarboxylic acid having 7 to 20 carbon atoms. The number of carbon atoms in the aliphatic dicarboxylic acid is preferably 8 or more, more preferably 9 or more, even more preferably 10 or more, preferably 18 or less, more preferably 16 or less, even more preferably 14 or less, even more preferably 13 or less, and even more preferably 12 or less. The aliphatic dicarboxylic acid is HOOC-(CH2) n It is preferable to represent it as -COOH, where n is an integer between 5 and 18. The aliphatic dicarboxylic acid units that can be used in this embodiment preferably include aliphatic dicarboxylic acid units having 7 to 20 carbon atoms, more preferably include at least one of sebacic acid units, undecanediic acid units, and dodecanediic acid units, and even more preferably include sebacic acid units and / or dodecanediic acid units.

[0020] The polyamide resin (A) contains aliphatic dicarboxylic acid units in a proportion of preferably 75 mol% or more, more preferably 80 mol% or more, even more preferably 85 mol% or more, even more preferably 90 mol% or more, even more preferably 95 mol% or more, particularly even more preferably 99 mol% or more, and 100 mol% or less of the total dicarboxylic acid units constituting the polyamide resin (A). The aliphatic dicarboxylic acid units may be one type or a combination of two or more types.

[0021] Examples of dicarboxylic acids other than aliphatic dicarboxylic acids include phthalate compounds such as isophthalic acid, terephthalic acid, and orthophthalic acid, as well as isomers of naphthalenedicarboxylic acids such as 1,2-naphthalenedicarboxylic acid, 1,3-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,5-naphthalenedicarboxylic acid, 1,6-naphthalenedicarboxylic acid, 1,7-naphthalenedicarboxylic acid, 1,8-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, and 2,7-naphthalenedicarboxylic acid, and can be used individually or in combination of two or more.

[0022] The polyamide resin (A) used in this embodiment may further contain aminocarboxylic acid units. Including aminocarboxylic acid units tends to further improve the hue of molded products such as films. There are no specific requirements for the type of aminocarboxylic acid that constitutes the aminocarboxylic acid unit; known aminocarboxylic acids can be used. In this embodiment, it is preferable that the aminocarboxylic acid is composed only of aliphatic hydrocarbon groups, except for the terminal amino group and carboxylic acid group. The molecular weight of the aminocarboxylic acid constituting the aminocarboxylic acid unit is preferably 180 or more, more preferably 190 or more, preferably 400 or less, more preferably 300 or less, and even more preferably 250 or less.

[0023] In this embodiment, the aminocarboxylic acid constituting the aminocarboxylic acid unit is preferably represented by formula (PA-2). [ka] (In equation (PA-2), n is an integer between 5 and 20.) In formula (PA-2), n is an integer between 5 and 20, preferably 6 or greater, more preferably 7 or greater, even more preferably 8 or greater, even more preferably 9 or greater, even more preferably 10 or greater, and also preferably 18 or less, more preferably 16 or less, even more preferably 14 or less, even more preferably 13 or less, and even more preferably 12 or less.

[0024] It should be noted that while polyamide resin (A) mainly contains diamine units and dicarboxylic acid units, it does not completely exclude other monomer units, and it goes without saying that it may also contain lactam units such as ε-caprolactam and laurolactam, and aliphatic aminocarboxylic acid units such as aminocaproic acid and aminoundecanoic acid. In particular, it is preferable that the polyamide resin (A) used in this embodiment contains aminocarboxylic acid units. In this embodiment, it is preferable that the total mass of diamine units, dicarboxylic acid units, and optionally aminocarboxylic acid units among the monomer units constituting the polyamide resin (A) accounts for 90% by mass or more of the total monomer units, more preferably 95% by mass or more, even more preferably 97% by mass or more, and even more preferably 99% by mass or more. In polyamide resin (A), the molar ratio of diamine units to dicarboxylic acid units is preferably 40:60 to 60:40, and more preferably 45:55 to 55:45. Furthermore, in this embodiment, when the polyamide resin (A) contains aminocarboxylic acid units, the proportion of aminocarboxylic acid units among the total monomer units constituting the polyamide resin (A) is preferably 1 mol% or more, more preferably 5 mol% or more, even more preferably 10 mol% or more, preferably 50 mol% or less, more preferably 40 mol% or less, even more preferably 30 mol% or less, and even more preferably 20 mol% or less.

[0025] The polyamide resin (A) is preferably amorphous or microcrystalline. Being amorphous or microcrystalline improves the transparency of the resulting film. An amorphous or microcrystalline resin is a resin that does not have a clear melting point, and specifically, its enthalpy of fusion ΔHm is less than 5 J / g, preferably 3 J / g or less, and more preferably 1 J / g or less. The enthalpy of fusion ΔHm is measured in accordance with JIS K7121 and K7122 during the heating process. Specifically, the polyamide resin is heated from room temperature to 250°C at a heating rate of 10°C / min in a nitrogen stream using a differential scanning calorimeter (DSC), then immediately cooled to below room temperature, and then heated again from room temperature to 250°C at a heating rate of 10°C / min.

[0026] It is also preferable to use polyamide resin (A) manufactured using biomass raw materials (biomass polyamide resin). By using biomass polyamide resin, the environmental impact can be reduced. Polyamide resin (A) may also use monomer raw materials that have been certified under Mass Balance Certification (ISCC PLUS). Mass balance certification means that the extent to which renewable raw materials and bio-raw materials are used in each factory or production facility, and how much of the product is produced or shipped, is quantified and guaranteed along with quality. Furthermore, the polyamide resin (A) may be recycled products (including recovered products, material recycled products, chemical recycled products, etc.), unsuitable products, or scraps generated during the molding of the polyamide resin (A) or the resin composition of this embodiment.

[0027] The weight-average molecular weight of the polyamide resin (A) used in this embodiment is preferably 5000 or more, more preferably 8000 or more, even more preferably 10000 or more, preferably 100000 or less, more preferably 80000 or less, even more preferably 50000 or less, and even more preferably 20000 or less. Setting it above the lower limit tends to further improve the impact resistance of the resulting film. Setting it below the upper limit tends to further improve the fluidity of the resin composition. The weight-average molecular weight is the acrylic equivalent value measured by GPC (gel permeation chromatography). The solvent used for the measurement was hexafluoroisopropanol.

[0028] In the resin composition of this embodiment, the content of polyamide resin (A) is preferably 80% by mass or more, more preferably 85% by mass or more, even more preferably 90% by mass or more, even more preferably 95% by mass or more, even more preferably 97% by mass or more, and even more preferably 99% by mass or more, based on 100% by mass of the resin composition. Setting the content of polyamide resin (A) above the lower limit tends to result in a higher glass transition temperature. Furthermore, in the resin composition of this embodiment, the content of polyamide resin (A) is preferably 99.9% by mass or less, based on 100% by mass of the resin composition. Note that in the resin composition of this embodiment, the total of polyamide resin (A) and the phosphate compound (B) described later does not exceed 100% by mass. Setting the content of polyamide resin (A) below the upper limit tends to result in a higher transparency of the resulting film. Furthermore, in the resin composition of this embodiment, all components other than the phosphate compound (B) may be polyamide resin (A). The resin composition of this embodiment may contain only one type of polyamide resin (A), or it may contain two or more types. When it contains two or more types, it is preferable that the total amount is within the above range.

[0029] The resin composition of this embodiment may or may not contain polyamide resins other than polyamide resin (A). Examples of polyamide resins other than polyamide resin (A) include aliphatic polyamide resins other than polyamide resin (A) and aromatic polyamide resins. Examples of aliphatic polyamide resins include polyamide 4, polyamide 46, polyamide 6, polyamide 66, polyamide 666, polyamide 610, polyamide 11, polyamide 116, polyamide 12, and polyamide 612. Examples of aromatic polyamide resins include polyhexamethylene terephthalamide (polyamide 6T), polyhexamethylene isophthalamide (polyamide 6I), polyamide 66 / 6T, polyamide 9T, polyamide 9MT, polyamide 10T, polyamide 6I / 6T, and xylylenediamine-based polyamide resins (MXD6, etc.).

[0030] Aliphatic polyamide resins and aromatic polyamide resins other than polyamide resin (A) are manufactured using recycled resins or biomass raw materials, and it is also preferable to use polyamide resins (biomass thermoplastic resins). Furthermore, it is preferable that the resin composition of this embodiment substantially contains no polyamide resins other than polyamide resin (A). Specifically, the content of polyamide resins other than polyamide resin (A) in the resin composition of this embodiment is preferably less than 10% by mass, more preferably less than 5% by mass, even more preferably less than 3% by mass, even more preferably less than 1% by mass, and still more preferably less than 0.1% by mass, based on 100% by mass of the resin composition.

[0031] <Phosphate compound (B)> The resin composition of this embodiment is P(=O)(OR 1 ) 3-n(OR 2 ) n The structure represented by (where R 1 represents a hydrogen atom or a metal atom, R 2 The present invention provides a phosphate compound (B) (which may be referred to as "phosphate compound (B)" herein) having a substituent other than a metal atom, where n is an integer of 1 or 2. By using such a phosphate compound (B) in combination with the polyamide resin (A) described above, a resin composition is obtained that can provide a film that can effectively suppress the formation of grease and gel during film production.

[0032] In this embodiment, the phosphate compound (B) is P(=O)(OR 1 ) 3-n (OR 2 ) n It has a structure represented by the following: R 1 R represents a hydrogen atom or a metal atom, with a metal atom being more preferred. 1 Because the atom is either a hydrogen atom or a metal atom, the phosphate compound (B) tends to interact with active sites on the metal surface inside the molding machine, more effectively suppressing the formation of grease and gel. As the metal atom, zinc and sodium are preferred, with zinc being more preferred. R 2 R represents a substituent other than a metal atom, preferably an aliphatic group, more preferably an aliphatic group having 10 to 30 carbon atoms, and more preferably a linear or branched alkyl group having 10 to 30 carbon atoms. 2 Preferably, at least one of the members is a linear or branched alkyl group having 10 to 30 carbon atoms. In other words, phosphate compound (B) preferably contains phosphate compound (B1) having an aliphatic group, and phosphate compound (B) is P(=O)(OR 1 ) 3-n (OR 2 ) n In the structure represented by R 2It is more preferable that the compound (B2) contains at least one of which is a linear or branched alkyl group having 10 to 30 carbon atoms. R 2 Because it has an aliphatic group, the phosphate compound (B) is more likely to appear on the film surface during film manufacturing, and it is more likely to interact with the metal active sites on the surface of the molding machine, thus tending to more effectively suppress the formation of glue and gel. R 1 or R 2 When there are two of them, they may be the same or different. n is an integer of 1 or 2, preferably 2.

[0033] The number of carbon atoms in a linear or branched alkyl group having 10 to 30 carbon atoms is preferably 13 or more, more preferably 15 or more, preferably 25 or less, more preferably 20 or less, even more preferably 18 or less, and most preferably 18. A linear or branched alkyl group having 10 to 30 carbon atoms is preferred, although it is preferably a linear alkyl group.

[0034] In this embodiment, it is preferable that the phosphate compound (B) includes at least one of the compounds represented by formula (P1), formula (P2), and formula (P3). [ka] (In formulas (P1) to (P3), R x Each of these independently represents a linear or branched alkyl group having 10 to 30 carbon atoms, where n represents 1 or 2.

[0035] R x The number of carbon atoms is preferably 13 or more, more preferably 15 or more, preferably 25 or less, more preferably 20 or less, even more preferably 18 or less, and most preferably 18. Rx The alkyl group can be linear or branched, but a linear alkyl group is preferred.

[0036] In this embodiment, it is more preferable that the phosphate compound (B) comprises at least one of the compound represented by formula (P1-1) and the compound represented by formula (P2-1). In this embodiment, a mixture of the compound represented by formula (P1-1) and the compound represented by formula (P2-1) is even more preferable. Formula (P1-1) Formula (P2-1) [ka]

[0037] Furthermore, in this embodiment, it is preferable that the phosphate compound (B) includes at least one compound represented by formula (P3). Formula (P3) [ka] (In formula (P3), R represents a linear or branched alkyl group having 10 to 18 carbon atoms. nx represents 1 or 2.) The number of carbon atoms in R is preferably 13 or more, more preferably 15 or more, preferably 25 or less, more preferably 20 or less, even more preferably 18 or less, and most preferably 18. R is a linear or branched alkyl group, but a linear alkyl group is preferred.

[0038] nx is 1 or 2, and preferably a mixture of 1 and 2.

[0039] The content of phosphate compound (B) in the resin composition of this embodiment is 0.001 to 2.5% by mass of the resin composition. The content of phosphate compound (B) in the resin composition is preferably 0.005% by mass or more, more preferably 0.01% by mass or more, even more preferably 0.05% by mass or more, and even more preferably 0.08% by mass or more. By setting the content of phosphate compound (B) above the lower limit, the generation of glue and gel during molding tends to be effectively suppressed. Furthermore, the content of phosphate compound (B) in the resin composition is preferably 2.0% by mass or less, more preferably 1.5% by mass or less, even more preferably 1.1% by mass or less, and even more preferably 0.6% by mass or less. By setting the content of phosphate compound (B) below the upper limit, the transparency of the resulting film tends to improve. The resin composition of this embodiment may contain only one phosphate compound (B), or it may contain two or more. When it contains two or more, it is preferable that the total amount is within the above range.

[0040] Furthermore, it is preferable that the resin composition of this embodiment substantially contains no phosphate compounds other than phosphate compound (B). Specifically, the content of phosphate compounds other than phosphate compound in the resin composition of this embodiment is preferably less than 10 parts by mass, more preferably less than 5 parts by mass, even more preferably less than 3 parts by mass, even more preferably less than 1 part by mass, and even more preferably less than 0.1 parts by mass, per 100 parts by mass of phosphate compound (B).

[0041] <Release agent> The resin composition of this embodiment may contain a release agent. Including a release agent provides superior release properties and effectively suppresses roll contamination during film manufacturing. Examples of release agents include at least one compound selected from the group consisting of aliphatic carboxylic acids, esters of aliphatic carboxylic acids and alcohols, aliphatic hydrocarbon compounds with a number average molecular weight of 200 to 15000, and polysiloxane-based silicone oils, with esters of aliphatic carboxylic acids and alcohols being preferred. Specific examples of esters of aliphatic carboxylic acids and alcohols include beeswax (a mixture mainly composed of myricyl palmitate), stearyl stearate, behenyl behenate, stearyl behenate, glycerin monopalmitate, glycerin monostearate, glycerin distearate, glycerin tristearate, pentaerythritol monopalmitate, pentaerythritol monostearate, pentaerythritol distearate, pentaerythritol tristearate, and pentaerythritol tetrastearate. In addition, as release agents, the release agents described in paragraph 0032 of Japanese Patent Publication No. 2017-226848 and paragraph 0056 of Japanese Patent Publication No. 2018-199745 can be used, and this information is incorporated herein.

[0042] If the resin composition of this embodiment contains a release agent, the content of the release agent in the resin composition is preferably 0.001 parts by mass or more, more preferably 0.01 parts by mass or more, and preferably 2 parts by mass or less, more preferably 1 part by mass or less, and even more preferably 0.5 parts by mass or less, per 100 parts by mass of polyamide resin (A). One type of release agent may be used, or two or more types may be used. If two or more types are used, it is preferable that the total amount be within the above range.

[0043] <Polyetheramide elastomer> The resin composition of this embodiment may also contain a polyetheramide elastomer. By using a polyetheramide elastomer in combination with a release agent, it is possible to effectively suppress dirt on the rolls during film manufacturing and the formation of a sharkskin-like texture on the film surface. Furthermore, haze can also be reduced. A polyetheramide elastomer is an elastomer containing a polyether structure and a polyamide structure. The polyetheramide elastomer in this embodiment is substantially free of ester structures. Substantially free of ester structures means that it is not a so-called polyester etheramide elastomer, and more specifically, the ester structure content is usually less than 1% by mass of the polyetheramide elastomer, preferably less than 0.5% by mass, more preferably less than 0.1% by mass, and even more preferably less than 0.01% by mass. The polyetheramide elastomer used in this embodiment preferably comprises a polyalkylene glycol block and a polyamide block.

[0044] Polyalkylene glycol blocks are -(alkylene group-O) n2 - is preferred to represent the above -(alkylene group-O) n2 The alkylene group in - is preferably a linear or branched alkylene group having 1 to 10 carbon atoms. The number of carbon atoms constituting the alkylene group is preferably 2 or more, more preferably 3 or more, preferably 8 or less, more preferably 6 or less, even more preferably 5 or less, and even more preferably 5 or less. Specific examples of the above -(alkylene group-O)- include -(CH2O)-, -(CH2CH2O)-, -(CH2CH2CH2O)-, -(CH(CH3)CH2O)-, -(CH2CH2CH2CH2O)-, and -(C(CH3)2CH2O)-, and combinations of two or more of these may also be used. The above-(alkylene group-O) n2 In -, n2 is preferably between 1 and 200, and more preferably between 3 and 100. The polyalkylene glycol block preferably includes a polypropylene glycol (PPG) block and / or a polytetramethylene ether glycol (PTMG) block.

[0045] The proportion of polyalkylene glycol in the polyetheramide elastomer is preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 15 mol% or more, and even more preferably 20 mol% or more, based on 100 mol% of the total constituent units of the polyetheramide elastomer. Depending on the application, it may be 30 mol% or more, 40 mol% or more, 50 mol% or more, 60 mol% or more, or 65 mol% or more. Setting it above the lower limit tends to further improve the impact strength of the resin composition. Furthermore, the proportion of polyalkylene glycol in the polyetheramide elastomer used in this embodiment is preferably 90 mol% or less, more preferably 85 mol% or less, even more preferably 80 mol% or less, and even more preferably 75 mol% or less, based on 100 mol% of the total constituent units of the polyetheramide elastomer. Setting it below the upper limit tends to improve compatibility with the polyamide resin (A). The polyetheramide elastomer may contain only one type of polyalkylene glycol, or it may contain two or more types. When it contains two or more types, it is preferable that the total amount is within the above range.

[0046] The polyamide block is preferably represented as an aliphatic polyamide block, -(NH(CH2) n3 C(=O)) n4 It is preferable that the aliphatic polyamide block is represented by -. Here, n3 is preferably 3 or more, more preferably 5 or more, even more preferably 7 or more, even more preferably 9 or more, even more preferably 10 or more, and also preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, even more preferably 14 or less, and even more preferably 12 or less. Furthermore, when n5 is the number of carbon atoms in an aliphatic dicarboxylic acid with 7 to 20 carbon atoms that constitutes the polyamide resin (A) (for example, sebacic acid has n5=10), it is preferable that the difference (absolute value) between n5 and n3 is small. More specifically, it is preferable that |n5-n3| is 3 or less, and more preferably 2 or less. n4 is preferably between 1 and 300, and more preferably between 5 and 100.

[0047] The proportion of polyamide in the polyetheramide elastomer is preferably 10 mol% or more, more preferably 15 mol% or more, even more preferably 20 mol% or more, and even more preferably 25 mol% or more, based on 100 mol% of the total constituent units of the polyetheramide elastomer. Setting it above the lower limit tends to further improve the compatibility with the polyamide resin (A). Furthermore, the proportion of polyamide in the polyetheramide elastomer used in this embodiment is preferably 95 mol% or less, more preferably 90 mol% or less, even more preferably 85 mol% or less, and even more preferably 80 mol% or less, based on 100 mol% of the total constituent units of the polyetheramide elastomer. Depending on the application, it may also be 70 mol% or less, 60 mol% or less, 50 mol% or less, 40 mol% or less, or 35 mol% or less. Setting it below the upper limit tends to more effectively suppress the decrease in the glass transition temperature of the resin composition. The polyetheramide elastomer may contain only one type of polyamide or two or more types. When it contains two or more types, it is preferable that the total amount is within the above range.

[0048] The weight-average molecular weight of the polyetheramide elastomer is preferably 3000 or more, more preferably 5000 or more, preferably 100000 or less, and more preferably 80000 or less. Setting it above the lower limit tends to improve the toughness of the resin composition. Setting it below the upper limit tends to further improve compatibility with the polyamide resin (A). The weight-average molecular weight is an acrylic equivalent value measured by GPC (gel permeation chromatography).

[0049] The polyetheramide elastomer preferably has a total of 90% by mass or more of the polyalkylene glycol block and the polyamide block, more preferably 95% by mass or more, even more preferably 97% by mass or more, and preferably 100% by mass or less of the polyetheramide elastomer.

[0050] When the resin composition of this embodiment contains a polyetheramide elastomer, the polyetheramide elastomer content is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, even more preferably 1.0% by mass or more, and even more preferably 1.5% by mass or more, based on 100% by mass of the resin composition. From the viewpoint of more effectively suppressing dirt on the rolls and the film surface becoming rough, it is even more preferably 2.0% by mass or more, and even more preferably 3.0% by mass or more. Furthermore, the polyetheramide elastomer content in the resin composition of this embodiment is preferably 20.0% by mass or less, more preferably 15.0% by mass or less, even more preferably 10.0% by mass or less, even more preferably 8.0% by mass or less, even more preferably 7.0% by mass or less, and even more preferably 5.0% by mass or less, based on 100% by mass of the resin composition. From the viewpoint of further improving transparency, it is even more preferably 4.5% by mass or less. The resin composition of this embodiment may contain only one type of polyetheramide elastomer, or it may contain two or more types. When it contains two or more types, it is preferable that the total amount is within the above range.

[0051] <Polyalkylene glycol> The resin composition of this embodiment may also contain polyalkylene glycol having ethylene glycol units and / or propylene glycol units in a total proportion of 50 mol% or more of the total units, and a number average molecular weight of 100 to 3500. By including such polyalkylene glycol, excellent transparency can be achieved, and roll fouling during film manufacturing can be effectively suppressed.

[0052] The polyalkylene glycol contains ethylene glycol units and / or propylene glycol units totaling 50 mol% or more of the total units, preferably 60 mol% or more, more preferably 70 mol% or more, even more preferably 80 mol% or more, even more preferably 90 mol% or more, even more preferably 95 mol% or more, and particularly most preferably 99 mol% or more. Alternatively, all units other than the terminal groups may consist of ethylene glycol units and / or propylene glycol units. By setting the value above the lower limit, polyalkylene glycol tends to bleed out more easily onto the resin surface (e.g., the surface of a molded body such as a film) during molding, and the retention of the resin composition is suppressed by improved slipperiness with the inner wall of the molding machine, thereby further suppressing roll fouling. On the other hand, by setting the total amount of ethylene glycol units and / or propylene glycol units to 50 mol% or more of the total units, the polyamide resin (A) becomes more appropriately compatible, effectively suppressing excessive bleeding out of polyalkylene glycol onto the resin surface during molding, and effectively suppressing roll fouling caused by the polyalkylene glycol itself.

[0053] Polyalkylene glycol may contain other monomer units in addition to ethylene glycol units and propylene glycol units. The other monomer units are preferably alkylene glycol units other than ethylene glycol units and propylene glycol units. Other examples of alkylene glycol units include methylene glycol, butylene glycol, pentylene glycol, hexylene glycol, trimethylene glycol, tetramethylene glycol, pentamethylene glycol, neopentyl glycol, 3-methyltetramethylene glycol, and hexamethylene glycol.

[0054] The polyalkylene glycol may be modified with arbitrary substituents at its terminal ends. Furthermore, the modification of the ends may be limited to one end of the polyalkylene glycol or it may be limited to both ends. Examples of optional substituents include carboxyl groups, hydroxyl groups, alkyl ethers, aryl ethers, aralkyl ethers, fatty acid esters, and aryl esters.

[0055] The number-average molecular weight of polyalkylene glycol is 100 to 3500, with a lower limit of preferably 300 or more, more preferably 500 or more, even more preferably 800 or more, and even more preferably 1000 or more. The upper limit is preferably 3000 or less, more preferably 2000 or less, and even more preferably 1500 or less. Setting the number-average molecular weight above the lower limit tends to effectively suppress the volatilization of polyalkylene glycol. Setting the number-average molecular weight below the upper limit tends to more effectively suppress the decrease in transparency. This is presumed to be because polyalkylene glycol does not easily become completely miscible with polyamide resin (A), forming a sea-island structure. When the number-average molecular weight of polyalkylene glycol is large, the island portion expands, increasing the refractive index difference and reducing transparency. The number-average molecular weight is measured according to JIS K1577.

[0056] Specific examples of polyalkylene glycols include polyethylene glycol, polypropylene glycol, or copolymers containing ethylene glycol units and / or propylene glycol units with other alkylene glycol units. Polyethylene glycol or polypropylene glycol is preferred, and polypropylene glycol is more preferred from the viewpoint of ease of manufacture.

[0057] Polyalkylene glycol is not particularly limited and may be manufactured by known methods, or a commercially available product may be used. Examples of commercially available products include D-1000 (manufactured by NOF Corporation) and D-2000 (manufactured by NOF Corporation).

[0058] When the resin composition of this embodiment contains polyalkylene glycol, the polyalkylene glycol content is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, even more preferably 0.2% by mass or more, and may be 0.4% by mass or more depending on the application, etc. Also, it is preferably 5% by mass or less, more preferably 3% by mass or less, even more preferably 2% by mass or less, even more preferably 1% by mass or less, even more preferably 0.5% by mass or less, and may be 0.3 parts by mass or less depending on the application, etc. Setting it above the lower limit tends to effectively suppress roll fouling during molding. Furthermore, setting it below the upper limit tends to more effectively suppress the decrease in the glass transition temperature and toughness of the resin composition. In this embodiment, the total amount of polyamide resin (A) and polyalkylene glycol does not exceed 100% by mass. The resin composition of this embodiment may contain only one type of polyalkylene glycol, or it may contain two or more types. When it contains two or more types, it is preferable that the total amount is within the above range. Furthermore, it is preferable that the resin composition of this embodiment substantially does not contain polyalkylene glycols other than the above-mentioned polyalkylene glycol (for example, those with a number average molecular weight of less than 100 or greater than 3500). Specifically, the content of polyalkylene glycols other than the above-mentioned polyalkylene glycol in the resin composition of this embodiment is preferably less than 10 parts by mass, more preferably less than 5 parts by mass, even more preferably less than 3 parts by mass, even more preferably less than 1 part by mass, and even more preferably less than 0.1 parts by mass, per 100 parts by mass of the above-mentioned polyalkylene glycol.

[0059] <Other ingredients> The resin composition of this embodiment may or may not contain other components in addition to those mentioned above. Other components include cyclic ether compounds (preferably epoxy compounds), ultraviolet absorbers, antioxidants, heat stabilizers, flame retardants, flame retardant enhancers, colorants, antistatic agents, fluorescent whitening agents, antifogging agents, flow modifiers, plasticizers, dispersants, antibacterial agents, antiblocking agents, impact modifiers, sliding modifiers, hue modifiers, acid trapping agents, and the like. Furthermore, the resin composition of this embodiment may contain, without departing from the spirit of the present invention, the additives described in paragraphs 0047 to 0103 of International Publication No. 2021 / 241471, the additives described in paragraphs 0041 to 0056 of Japanese Patent Application Publication No. 2023-61203, and the additives described in paragraphs 0017 to 0021 of International Publication No. 2024 / 029515, and these contents are incorporated herein.

[0060] If the resin composition of this embodiment contains other components, their total content is preferably 0.001 to 3% by mass of the resin composition, more preferably less than 2% by mass, even more preferably less than 1% by mass, even more preferably less than 0.5% by mass, even more preferably less than 0.1% by mass, and may be less than 0.01% by mass. The other ingredients may consist of only one type or two or more types. If two or more other ingredients are included, it is preferable that the total amount falls within the above range.

[0061] <Physical properties of resin compositions> The resin composition of this embodiment preferably exhibits excellent transparency. Specifically, the resin composition of this embodiment preferably has a total light transmittance of 80% or more, more preferably 85% or more, and even more preferably 90% or more when molded into a 300 μm thick film. The upper limit of the total light transmittance is preferably 100%, but the required performance can be met even if it is 99% or less. Furthermore, the resin composition of this embodiment preferably has a haze of 3.0% or less when molded into a 300 μm thick film, more preferably 2.0% or less, even more preferably 1.5% or less, even more preferably 1.0% or less, even more preferably 0.7% or less, even more preferably 0.5% or less, even more preferably 0.4% or less, and even more preferably 0.3% or less, 0.28% or less, or 0.25% or less. The lower limit of the haze is preferably 0%, but the required performance can be met even if it is 0.001% or higher. Total light transmittance and haze are measured according to the examples described below.

[0062] <Method for producing resin compositions> Any method can be used to manufacture the resin composition of this embodiment. For example, it can be obtained by mixing a polyamide resin (A) and a phosphate compound (B) and melt-kneading them. More specifically, a method can be used in which the polyamide resin (A), the phosphate compound (B), and other components as needed are mixed using a mixing means such as a V-type blender to prepare a single blended product, which is then melt-kneaded in a vented extruder to form pellets.

[0063] <film> The film of this embodiment is formed from the resin composition of this embodiment. The thickness of the film in this embodiment is preferably 10 μm or more, more preferably 50 μm or more, even more preferably 100 μm or more, preferably 1000 μm or less, more preferably 800 μm or less, even more preferably 700 μm or less, even more preferably 600 μm or less, and even more preferably 500 μm or less.

[0064] The film of this embodiment preferably has excellent transparency. Specifically, the film of this embodiment preferably has a total light transmittance of 80% or more, more preferably 85% or more, and even more preferably 90% or more. The upper limit of the total light transmittance of the film is preferably 100%, but the required performance can be met even if it is 99% or less. Furthermore, the haze of the film of this embodiment is preferably 3.0% or less, more preferably 2.0% or less, even more preferably 1.5% or less, even more preferably 1.0% or less, even more preferably 0.7% or less, even more preferably 0.5% or less, even more preferably 0.4% or less, and even more preferably 0.3% or less, 0.28% or less, and 0.25% or less. The lower limit of the haze of the film is preferably 0%, but the required performance can be met even if it is 0.001% or more. Total light transmittance and haze are measured according to the examples described below.

[0065] <Wound body> The film of this embodiment can be in the form of a winding body wound around a core material.

[0066] <Polarizing sheet> A film formed from the resin composition of this embodiment, or the film of this embodiment, is preferably used as a protective film for a polarizing sheet (a film that protects the polarizing film). In this embodiment, the polarizing sheet preferably comprises the film of this embodiment and a polarizing film, and is a sheet laminated in the order of polarizing film, protective film, and polarizing film. That is, the film of this embodiment is preferably used as at least one of the protective films of the polarizing sheet. The protective film is usually bonded to the polarizing film via an adhesive. In this embodiment, one of the protective films of the polarizing sheet may be the film of this embodiment or another protective film. When one of the protective films of the polarizing sheet is the film of this embodiment, the other protective film of the polarizing sheet may be a known protective film for polarizing sheets, or it may be the film of this embodiment. The polarizing film may be a known one, and an example is one in which iodine or a dichroic organic dye is adsorbed or impregnated onto a polyvinyl alcohol (PVA) film. The adhesive used to bond the film and other protective films to the polarizing film in this embodiment can be a known adhesive, such as an acrylic adhesive, urethane adhesive, epoxy adhesive, silicone adhesive, or polyvinyl alcohol adhesive. Among these, a urethane adhesive is preferred. The thickness of the adhesive is typically 1 μm or more, and typically 30 μm or less. Furthermore, the polarizing sheet of this embodiment may have a masking film or the like provided on the outside of the film of this embodiment or other protective films.

[0067] Furthermore, the polarizing sheet of this embodiment is preferably used in heat-bent molded products that have undergone heat bending. When the film of this embodiment is used in a polarizing sheet or a heat-bent molded product, the film of this embodiment may be provided on either side of the polarizing film, or on both sides. The first embodiment is that, after heat bending, the film of this embodiment is positioned on the convex side of the polarizing film, for example, on the side of the protective film 4 in Figure 1. The second embodiment is one in which the film of this embodiment is positioned such that, after heat bending, it is located on the concave side of the polarizing film, for example, on the side of the protective film 3 in Figure 1. A third embodiment is one in which, for example, both protective films 3 and 4 in Figure 1 are the films of this embodiment, such that the films of this embodiment are located on both sides of the polarizing film. In Figure 1, the lens 1, polarizing film 2, and protective films 3 and 4 are shown to be bent, but it goes without saying that polarizing sheets that are not bent are also included in this embodiment. The film and other protective films used in the polarizing sheet of this embodiment may or may not be stretched. In the first embodiment, it is preferable that they are stretched. In the second embodiment, it is preferable that they are not stretched. In the third embodiment, it is preferable that the protective film positioned on the side of protective film 4 in Figure 1 is stretched, and it is preferable that the protective film positioned on the side of protective film 3 in Figure 1 is not stretched.

[0068] In this embodiment, the polarizing sheet is preferably used as a polarizing sheet for liquid crystal display devices, a polarizing lens (sunglasses, ski goggles, prescription eyeglass lenses, camera viewfinder lenses), a cover for various instruments, automobile glass, train glass, polarizing sheets for in-vehicle display panels and electronic device housings, an in-vehicle rearview mirror, a silver mirror for helmets, and is particularly preferably used as sunglasses. [Examples]

[0069] The present invention will be described in more detail below with reference to examples. The materials, amounts used, proportions, processing content, and processing procedures shown in the following examples can be modified as appropriate, as long as they do not depart from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. If the measuring instruments used in the examples are difficult to obtain due to discontinuation or other reasons, measurements can be taken using other instruments with equivalent performance.

[0070] 1. Raw materials A1:XE4805, manufactured by EMS, a polyamide resin synthesized from bis(4-amino-3-methylcyclohexyl)methane and dodecanediic acid, amorphous polyamide resin, weight-average molecular weight 10600. A2:XE3805, manufactured by EMS, a polyamide resin synthesized from bis(4-amino-3-methylcyclohexyl)methane and dodecanediic acid, amorphous polyamide resin, weight-average molecular weight 13300 A3:XE4205, manufactured by EMS, a polyamide resin synthesized from bis(4-amino-3-methylcyclohexyl)methane and sebaciic acid, amorphous polyamide resin, weight-average molecular weight 15800 A4:G850, manufactured by Arkema, is a polyamide resin synthesized from bis(4-amino-3-methylcyclohexyl)methane, sebacic acid, and aminoundecanoic acid (aminoundecanoic acid is present in an amount of 17 mol% relative to 100 mol% of the raw material monomers). It is an amorphous polyamide resin with a weight-average molecular weight of 19600.

[0071] B1: JP-518Zn, manufactured by Johoku Chemical Co., Ltd., a mixture of the compounds shown below, with a molar ratio of left:right = 2:1, phosphate compounds. [ka] B2: AX-71, manufactured by ADEKA, phosphate compound [ka] B3: ADEKA STAB (AS) 2112, manufactured by ADEKA, tris(2,4-di-tert-butylphenyl) phosphite compound B4: Adeka Stab AO-60, manufactured by ADEKA, tetrakis[3-(3',5'-di-tert-butyl-4-hydroxyphenyl)propionic acid]pentaerythritol B5: ADEKA stub AO-412S, manufactured by ADEKA Corporation. [ka] B6: Irganox 1098, manufactured by BASF. [ka] B7:PX-200, manufactured by Daihachi Chemical Industry Co., Ltd., phosphate compound [ka] B8:EB-P, manufactured by Kao Corporation, mold release agent [ka]

[0072] 2. Examples 1-6, Comparative Examples 1-4 <Manufacturing of resin pellets> Each component was blended in a tumbler to achieve the composition shown in Tables 1 and 2 below (contents are shown in parts by mass in Tables 1 and 2). The mixture was then fed into a twin-screw extruder (manufactured by Japan Steel Works, TEX30α) from the base, and melt-kneaded at a cylinder temperature of 280°C to produce pellets for the examples and comparative examples.

[0073] <Film Manufacturing> The pellets obtained above were extruded in a molten state using a T-die melt extruder consisting of a twin-screw extruder with a vent, a screw diameter of 28 mm, and a screw L / D ratio of 40 (Shibaura Machine Co., Ltd., "TEM-26DS"), at a discharge rate of 15 kg / h and a screw rotation speed of 250 rpm. After being compressed between the first and second rolls, the pellets were cooled and solidified to produce a 300 μm thick film. The cylinder temperature and die temperature were 280°C, and the first and second roll temperatures were 120°C. Details of the first and second rolls used are as follows. • First roll: Manufactured by Shibaura Machinery Co., Ltd., UM roll Dimensions: Outer diameter 180mm x Roll width 400mm • Second roll: Manufactured by Shibaura Machine Co., Ltd., rigid metal roll (surface: chrome treated) Dimensions: Outer diameter 180mm x Roll width 400mm

[0074] <Cause of eye discharge> The die slip portion after consuming 15 kg of polyamide for film production was visually observed and evaluated as follows. This evaluation was performed with the die temperature set to 320°C. The evaluation was conducted by five experts and decided by majority vote. A: No eye discharge was observed, or some eye discharge was present but at an acceptable level. B: Eye discharge occurred, making it unusable.

[0075] <Gel formation> The obtained pellets were heated in a vacuum dryer (Yamato Scientific Co., Ltd., DP23) under nitrogen at 280°C for 1.5 hours. Then, 5 g was dissolved in 50 mL of hexafluoroisopropanol and filtered by suction using a membrane filter with a filtration diameter of 10 μm. The mass of the insoluble material recovered on the filter was measured, and the gelation rate was calculated using the following formula and evaluated as follows. Gelling rate = Mass of insoluble matter / Mass of dissolved matter × 100 A: Gelation rate is less than 1% by mass B: Gelation rate of 1% by mass or more

[0076] <Roller stains> The surfaces of the first and second rolls, after consuming 350 kg of polyamide to manufacture the film, were visually inspected and evaluated as follows. The evaluation was conducted by five experts, and the decision was made by majority vote. A: No roll stains were observed, or some roll stains were observed but were at a usable level. B: Roller soiling occurred, making it unusable.

[0077] <Measurement of haze and total light transmittance> Using a haze meter, the haze (%) and total light transmittance (%) of the 300 μm thick film obtained above were measured under the conditions of a D65 light source and a 10° field of view. A haze meter, model "HM-150" manufactured by Murakami Color Technology Research Institute, was used.

[0078] [Table 1]

[0079] [Table 2]

[0080] As is clear from the results in Tables 1 and 2, the present invention yielded a film in which eye discharge and gel were effectively suppressed. In contrast, when the phosphate compound was not included (Comparative Examples 1, 4-7), or when the phosphate compound was included but outside the range of content specified in the present invention (Comparative Examples 2, 3), or when a phosphate compound other than the phosphate compound (B) specified in the present invention was used (Comparative Example 8), haze was high and the total light transmittance decreased (Comparative Example 3), or eye discharge and gel were generated (Comparative Examples 1-8). [Explanation of Symbols]

[0081] 1 lens 2 Polarizing film 3. Protective film 4. Protective film

Claims

1. A polyamide resin (A) containing alicyclic diamine units and aliphatic dicarboxylic acid units, P(=O)(O-R) １ ) ３-ｎ (O-R ２ ) ｎ The structure represented by (where R １ represents a hydrogen atom or a metal atom, R ２ A resin composition comprising a phosphate compound (B) having (where represents a substituent other than a metal atom, and n is an integer of 1 or 2), The content of the phosphate compound (B) is 0.001 to 2.5% by mass in the resin composition. The phosphate compound (B) is a phosphate compound (B2) in which at least one of R １ ), ３-ｎ (O-R ２ ), ｎ in the structure represented by is a linear or branched alkyl group having 10 to 30 carbon atoms, and the resin composition contains the phosphate compound (B2).​​

2. A polyamide resin (A) containing alicyclic diamine units and aliphatic dicarboxylic acid units, P(=O)(O-R) １ ) ３-ｎ (O-R ２ ) ｎ The structure represented by (where R １ represents a hydrogen atom or a metal atom, R ２ A resin composition comprising a phosphate compound (B) having (where represents a substituent other than a metal atom, and n is an integer of 1 or 2), The content of the phosphate compound (B) is 0.001 to 2.5% by mass in the resin composition. A resin composition for use as a protective film for polarizing sheets.

3. The resin composition according to claim 1 or 2, wherein the aliphatic dicarboxylic acid unit comprises an aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms.

4. The resin composition according to claim 1 or 2, wherein the aliphatic dicarboxylic acid unit comprises a sebaciate unit and / or a dodecanediate unit.

5. The resin composition according to claim 1 or 2, wherein the alicyclic diamine constituting the alicyclic diamine unit comprises two substituted or unsubstituted cyclohexane rings.

6. The resin composition according to claim 1 or 2, wherein the alicyclic diamine unit includes a unit represented by formula (PA-1). 【Chemistry 1】 (In formula (PA-1), R １ Each of these is an alkyl group having 1 to 5 carbon atoms, and each of these is an integer from 0 to 3. * indicates a bonding site with another unit or terminal group.

7. The resin composition according to claim 1 or 2, wherein the phosphate compound (B) comprises a phosphate compound (B1) having an aliphatic group.

8. The resin composition according to claim 1 or 2, wherein the phosphate compound (B) comprises at least one of the compound represented by formula (P1), the compound represented by formula (P2), and the compound represented by formula (P3). 【Chemistry 2】 (In formulas (P1) to (P3), R ｘ Each of these independently represents a linear or branched alkyl group having 10 to 30 carbon atoms, where n represents 1 or 2.

9. The resin composition according to claim 1 or 2, wherein the content of the polyamide resin (A) in the resin composition is 80 to 99.9% by mass (however, the total of the polyamide resin (A) and the phosphate compound (B) does not exceed 100% by mass).

10. Furthermore, the resin composition according to claim 1 or 2, comprising a mold release agent.

11. The resin composition according to claim 1 or 2, wherein the polyamide resin (A) is an amorphous or microcrystalline resin.

12. The resin composition according to claim 1 or 2, wherein the haze when the resin composition is formed into a film with a thickness of 300 μm is 3.0% or less.

13. The resin composition according to claim 1 or 2, wherein the total light transmittance when the resin composition is formed into a film with a thickness of 300 μm is 80% or more.

14. The aliphatic dicarboxylic acid unit comprises a sebaciate unit and / or a dodecanediate unit, The alicyclic diamine unit includes a unit represented by formula (PA-1), The phosphate compound comprises at least one of the compound represented by formula (P1), the compound represented by formula (P2), and the compound represented by formula (P3). The content of the polyamide resin (A) in the resin composition is 80 to 99.9% by mass (however, the total of the polyamide resin (A) and the phosphate compound (B) does not exceed 100% by mass). The polyamide resin (A) is an amorphous or microcrystalline resin. The haze when the resin composition is formed into a film with a thickness of 300 μm is 3.0% or less. The total light transmittance when the resin composition is formed into a film with a thickness of 300 μm is 80% or more. The resin composition according to claim 1, for use as a protective film for polarizing sheets. 【Transformation 3】 (In formula (PA-1), R １ Each of these is an alkyl group having 1 to 5 carbon atoms, and each of these is an integer from 0 to 3. * indicates a bonding site with another unit or terminal group. 【Chemistry 4】 (In formulas (P1) to (P3), R ｘ Each of these independently represents a linear or branched alkyl group having 10 to 30 carbon atoms, where n represents 1 or 2.

15. Furthermore, the resin composition according to claim 14, further comprising a mold release agent.

16. A film formed from the resin composition according to claim 1, 2, 14, or 15.

17. A polarizing sheet comprising the film according to claim 16 and a polarizing film.

18. Sunglasses comprising the polarizing sheet described in claim 17.

Images