Imaging device

Abstract

To improve cooling efficiency while suppressing reflections of images on the casing. [Solution] The imaging device comprises a housing having an air intake port and an exhaust port, an image sensor disposed within the housing, an image processing unit that performs image processing based on electrical signals from the image sensor and generates more heat than the image sensor, and a cooling fan that draws in air from the air intake port and exhausts air from the exhaust port. The image sensor is positioned closer to the air intake port than the image processing unit, and the cooling fan is positioned closer to the exhaust port than the image sensor and the image processing unit, drawing in air from the air intake port and exhausting air from the exhaust port.

Description

Technical Field

[0001] The present invention relates to an imaging device.

Background Art

[0002] An omnidirectional imaging device has a plurality of imaging optical systems including a wide-angle lens and an imaging sensor that captures an image formed by this wide-angle lens. The omnidirectional imaging device synthesizes the images captured by each imaging optical system to obtain an image within a solid angle of 4π steradians (see, for example, Patent Document 1 below).

[0003] However, in the omnidirectional imaging device of Patent Document 1, a configuration for dissipating heat from heat sources such as an imaging sensor is not considered.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

[0005] The imaging device disclosed in the present application includes a housing having an air inlet and an air outlet, an imaging element disposed within the housing, an image processing unit that executes image processing based on an electrical signal from the imaging element and generates more heat than the imaging element, and a cooling fan that takes in air from the air inlet and exhausts air from the air outlet. The imaging element is disposed at a position closer to the air inlet than the image processing unit, and the cooling fan is disposed at a position closer to the air outlet than the imaging element and the image processing unit, and takes in air from the air inlet and exhausts air from the air outlet. The imaging device disclosed in this application comprises a housing having an air intake port and an exhaust port; an image sensor disposed within the housing and capturing an image of a subject from a first surface of the housing; an image processing unit that performs image processing based on electrical signals from the image sensor and generates more heat than the image sensor; and a cooling fan that draws in air from the air intake port and exhausts air from the exhaust port, wherein the air intake port is located on the first surface, and the cooling fan is located closer to the exhaust port than the image sensor and the image processing unit, drawing in air from the air intake port and exhausting air from the exhaust port. The imaging device disclosed in this application comprises a housing having an air intake port and an exhaust port; a first image sensor disposed within the housing; a second image sensor disposed within the housing further from the air intake port than the first image sensor; an image processing unit disposed between the first image sensor and the second image sensor within the housing, which performs image processing based on electrical signals from the first image sensor and the second image sensor and generates more heat than the first image sensor and the second image sensor; and a cooling fan disposed between either the first image sensor or the second image sensor and the image processing unit, which draws in air from the air intake port and exhausts air from the exhaust port, wherein the cooling fan is positioned within the housing closer to the exhaust port than the first image sensor, the second image sensor and the image processing unit, and draws in air from the air intake port and exhausts air from the exhaust port.

[0006] The imaging device disclosed in this application is an imaging device having a flow path formed through which air flows from an intake port to an exhaust port, and comprises a first image sensor, a second image sensor, an image processing unit for processing the output signals of the first image sensor and the second image sensor, a first heat transfer member for conducting heat generated by the first image sensor, a second heat transfer member for conducting heat generated by the second image sensor, and a third heat transfer member for conducting heat generated by the image processing unit, wherein at least a portion of the first heat transfer member and the second heat transfer member is in contact with the air in the flow path at a location different from the section from where the third heat transfer member is in contact with the air in the flow path to the exhaust port.

[0007] The imaging device disclosed in this application is an imaging device having a flow path formed through which air flows from an intake port to an exhaust port, and comprises a first image sensor, a second image sensor, an image processing unit for processing the output signals of the first image sensor and the second image sensor, a first heat transfer member for conducting heat generated by the first image sensor, a second heat transfer member for conducting heat generated by the second image sensor, and a third heat transfer member for conducting heat generated by the image processing unit, wherein the flow path branches into at least a first flow path and a second flow path different from the first flow path from the intake port to the exhaust port, at least one of the first heat transfer member and the second heat transfer member is in contact with the air in the flow path from the point where the flow path branches to the exhaust port including the first flow path, and the third heat transfer member is in contact with the air in the flow path from the point where the flow path branches to the exhaust port including the second flow path.

[0008] The imaging device disclosed in this application is an imaging device having a flow path formed through which air flows from an intake port to an exhaust port, and comprises a first image sensor, a second image sensor, an image processing unit for processing the output signals of the first image sensor and the second image sensor, a first heat transfer member for conducting heat generated by the first image sensor, a second heat transfer member for conducting heat generated by the second image sensor, and a third heat transfer member for conducting heat generated by the image processing unit, wherein at least one of the first heat transfer member and the second heat transfer member is in contact with the air in the flow path from the first intake port to the exhaust port including the first flow path, and the third heat transfer member is in contact with the air in the flow path from the second intake port to the exhaust port including the second flow path which is different from the first flow path.

[0009] The imaging device disclosed in this application comprises a housing having an air intake port and an exhaust port, a first image sensor disposed within the housing, a second image sensor disposed within the housing, and an image processing unit disposed within the housing for processing the output signals of the first and second image sensors. The heat generated by the first image sensor, the second image sensor, and the image processing unit is dissipated by being transferred to the air flowing through a channel from the air intake port to the exhaust port, and the heat generated by the first and second image sensors is transferred to the air in a section of the channel different from the section through which the air from which the heat generated by the image processing unit is transferred flows. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a perspective view of the imaging device according to Example 1. [Figure 2] Figure 2 is a bottom view of the imaging device according to Example 1. [Figure 3] Figure 3 is a side cross-sectional view of the imaging device according to Example 1. [Figure 4A] Figure 4A is a side cross-sectional view showing an example of airflow inside the imaging device according to Embodiment 1. [Figure 4B] Figure 4B is a side cross-sectional view showing another example of airflow within the imaging device according to Example 1. [Figure 5] Figure 5 is a side cross-sectional view of the imaging device according to Example 2. [Figure 6] Figure 6 is an explanatory diagram showing the airflow inside the imaging device according to Example 2. [Modes for carrying out the invention] [Examples]

[0011] <Appearance of the imaging device> Figure 1 is a perspective view of the imaging device according to Embodiment 1, and Figure 2 is a bottom view of the imaging device according to Embodiment 1. In Figure 1, (A) is a front perspective view and (B) is a rear perspective view. The imaging device 100 has a housing 101. A wide-angle lens 102A and an air intake port 103 are provided on the front panel 101A of the housing 101.

[0012] A wide-angle lens 102B is provided on the rear panel 101B of the housing 101. An exhaust port 200 is provided on the bottom panel 101C of the housing 101. Slits are formed in the intake port 103 and the exhaust port 200, and air passes through the gap between the slits. Reference numeral 101D denotes the top panel.

[0013] The wide-angle lens 102A is mounted on the housing 101 so as to be exposed from the housing 101. The wide-angle lens 102A receives light from outside the housing 101 and emits it to the image sensor. The wide-angle lens 102B is mounted on the housing 101 so as to be exposed from the housing 101 in the opposite direction to the direction in which the wide-angle lens 102A is exposed. The wide-angle lens 102B receives light from outside the housing 101 and emits it to the image sensor.

[0014] At least one of the wide-angle lenses 102A and 102B has a field of view of 180 degrees or more. The imaging device 100 arranges two image sensors facing opposite directions and places the wide-angle lenses 102A and 102B in front of each image sensor to image the subject with a solid angle of 4π steradians.

[0015] By combining the image data obtained from the two image sensors, a full-sphere image (an image within a solid angle of 4π steradians) is generated. Note that if the wide-angle lenses 102A and 102B do not require a solid angle of 4π steradians to be used to capture the subject, both lenses may have a field of view of less than 180 degrees.

[0016] <Side cross-section of imaging device 100> FIG. 3 is a side cross-sectional view of the imaging device 100 according to Example 1. The imaging device 100 includes a cooling fan 300, imaging elements 301A and 301B, heat transfer pads 302A and 302B, heat dissipation sheets 303A and 303B, heat sinks 304A and 304B, a circuit board 305, a circuit group 306, a heat transfer pad 307, a heat dissipation plate 308, a rechargeable battery 309, and a battery case 310 within a housing 101. The imaging elements 301A and 301B and the circuit group 306 are heat sources. X is the optical axis common to the wide-angle lenses 102A and 102B. The direction from the back plate portion 101B to the front plate portion 101A is defined as +X, and the direction from the front plate portion 101A to the back plate portion 101B is defined as -X.

[0017] The cooling fan 300 is, for example, a blower fan that cools the interior of the housing 101. The blower fan has a structure that sucks air from both sides orthogonal to its rotation axis 300c and exhausts the air from one side in the rotation direction. The cooling fan 300 includes a fan 300a and a housing case 300b.

[0018] The fan 300a is housed in the housing case 300b. The rotation axis 300c of the fan 300a housed in the housing case 300b is parallel to the optical axis X. The housing case 300b houses the fan 300a. The housing case 300b has openings 300cA and 300cB in a plane in a direction orthogonal to the optical axis X, and has an opening 300cC on a side surface facing the exhaust port 200.

[0019] The opening 300cC is connected to the exhaust port 200 and allows the air inside the cooling fan 300 to pass through the exhaust port 200. The cooling fan 300 is connected to the circuit group 306 via the circuit board 305 by a flexible wiring board not shown. The cooling fan 300 rotates the fan 300a by driving and controlling the circuit group 306, sucks the air inside the housing 101 through the openings 300cA and 300cB, and discharges it outside the housing 101 through the opening 300cC via the exhaust port 200.

[0020] The imaging element 301A is disposed near the intake port 103. The imaging element 301A is disposed closer to the intake port 103 than the imaging element 301B and the circuit group 306. The imaging element 301A is disposed inside the imaging device 100 rather than the wide-angle lens 102A, receives the light condensed by the wide-angle lens 102A, and converts it into an electrical signal. The imaging element 301A is connected to the circuit group 306 via the circuit board 305 by a flexible wiring board (not shown).

[0021] The imaging element 301A is fixed to the heat dissipation sheet 303A via the heat transfer pad 302A. A heat sink 304A is provided around the heat dissipation sheet 303A. Therefore, the heat generated from the imaging element 301A is transmitted to the air in the internal space of the housing 101 via the heat transfer pad 302A, the heat dissipation sheet 303A, and the heat sink 304A. The heat transfer pad 302A, the heat dissipation sheet 303A, and the heat sink 304A that conduct the heat generated from the imaging element 301A are referred to as the first heat transfer member.

[0022] The imaging element 301B is disposed at a position inside the housing 101 that is farther from the intake port 103 than the imaging element 301A and is separated from the imaging element 301A by a predetermined distance. The imaging element 301B is disposed inside the imaging device 100 rather than the wide-angle lens 102B, receives the light condensed by the wide-angle lens 102B, and converts it into an electrical signal. The imaging element 301B is connected to the circuit group 306 via the circuit board 305 by a flexible wiring board (not shown).

[0023] The imaging element 301B is fixed to the heat dissipation sheet 303B via the heat transfer pad 302B. A heat sink 304B is provided around the heat dissipation sheet 303B. Therefore, the heat generated from the imaging element 301B is transmitted to the air in the internal space of the housing 101 via the heat transfer pad 302B, the heat dissipation sheet 303B, and the heat sink 304B. The heat transfer pad 302B, the heat dissipation sheet 303B, and the heat sink 304B that conduct the heat generated from the imaging element 301B are referred to as the second heat transfer member.

[0024] The image sensors 301A and 301B may be, for example, XY addressing solid-state image sensors (e.g., CMOS (Complementary Metal-Oxide Semiconductor) sensors) or sequential scanning solid-state image sensors (e.g., CCD (Charge Coupled Device)).

[0025] Multiple light-receiving elements (pixels) are arranged in a matrix on the light-receiving surface of image sensors 301A and 301B. Multiple types of color filters, each transmitting light of a different color component, are arranged in a predetermined color arrangement (for example, a Bayer arrangement) for each pixel of image sensors 301A and 301B. Therefore, each pixel of image sensors 301A and 301B outputs analog electrical signals corresponding to each color component to the circuit group 306 through color separation by the color filters. In this embodiment, image sensors 301A and 301B with a smaller heat generation than the heat generation of the circuit group 306 are used. However, the heat generation of image sensors 301A and 301B may differ.

[0026] Each of the image sensors 301A and 301B has an AFE (Analog Front End). The AFE is an analog front-end circuit that performs signal processing on the analog electrical signals from the image sensors 301A and 301B. The AFE sequentially performs gain adjustment of the electrical signals, analog signal processing (correlated double sampling, black level correction, etc.), A / D conversion processing, and digital signal processing (defective pixel correction, etc.) to generate RAW image data, which is then output to the circuit group 306.

[0027] The circuit board 305 is positioned between the rechargeable battery 309 and the cooling fan 300 so that its surface is perpendicular to the optical axis X. A group of circuits 306 is mounted on the circuit board 305. The group of circuits 306 includes, for example, a processor, memory, and LSIs such as an ASIC (Application Specific Integrated Circuit) or an FPGA (Field-Programmable Gate Array).

[0028] The processor provides overall control over the imaging device 100. The processor executes programs. The memory stores the programs executed by the processor, pre-prepared data, and data obtained from the execution processes of the processor and LSI.

[0029] The LSI performs specific processing, such as image processing and compression / decompression, using electrical signals from the image sensors 301A and 301B. This specific processing may also be achieved by a processor executing a program stored in memory. The LSI that performs image processing and the processor that executes the image processing program are referred to as the image processing unit. The image processing unit generates a full-sphere image (an image within a solid angle of 4π steradians) by combining the image data obtained from each of the two image sensors 301A and 301B. Because the circuit group 306 performs various processing in this way, the amount of heat generated by the circuit group 306 is greater than that of the image sensors 301A and 301B.

[0030] The circuit group 306 is fixed to the heat sink 308 via a heat transfer pad 307. The heat sink 308 is roughly C-shaped, with one end connected to the heat transfer pad 307 and the other end fixed to the battery case 310. Therefore, the heat generated from the circuit group 306 is transferred to the air in the internal space of the housing 101 via the heat transfer pad 307 and the heat sink 308. The heat transfer pad 307 and the heat sink 308 that conduct the heat generated from the circuit group 306 are referred to as the third heat transfer member.

[0031] The rechargeable battery 309 is located between the image sensor 301A and the circuit group 306. The rechargeable battery 309 supplies power to the image sensors 301A, 301B, the circuit group 306, and the cooling fan 300 via the circuit board 305 using a flexible wiring board (not shown).

[0032] The battery case 310 has a box portion 310a and a lid portion 310b. The box portion 310a houses the rechargeable battery 309. The lid portion 310b seals the opening of the box portion 310a in which the rechargeable battery 309 is housed. A wall plate 320 is provided on one end edge of the lid portion 310b. The wall plate 320 extends in the X direction. One end edge of the wall plate 320 abuts against one end edge of the lid portion 310b. The other end edge of the wall plate 320 does not abut the cooling fan 300, creating a gap between it and the cooling fan 300. The wall plate 320 may be a substantially L-shaped plate member integrally formed with the lid portion 310b.

[0033] In the imaging device 100, the wide-angle lens 102A, image sensor 301A, rechargeable battery 309, circuit group 306, cooling fan 300, image sensor 301B, and wide-angle lens 102B are arranged on the X-axis in the direction of -X. The imaging device 100, in which the combination of wide-angle lens 102A and image sensor 301A and the combination of wide-angle lens 102B and image sensor 301B are arranged back-to-back in opposite directions, captures the subject with a solid angle of 4π steradians.

[0034] Therefore, if a new mechanism such as a cooling fan 300 is added inside the imaging device 100, the housing 101 needs to be expanded to accommodate the new mechanism. For example, if the housing 101 is lengthened in a direction perpendicular to the optical axis X (for example, towards the bottom plate portion 101C) without changing the thickness of the housing 101 in the optical axis X direction, the image of the expanded portion of the housing 101 will be reflected.

[0035] Therefore, it is preferable to arrange the cooling fan 300, the circuit group 306 and the circuit board 305, as well as the rechargeable battery 309, on the optical axis X and between the image sensors 301A and 301B. By arranging them in this way, reflections of the image on the housing 101 can be suppressed.

[0036] Furthermore, in order to improve cooling efficiency, the cooling fan 300 needs to be placed near the heat sources. However, within the housing 101, there are three heat sources to be cooled: the image sensors 301A and 301B and the circuit group 306. Since the cooling fan 300 is a double-sided intake type that draws in air from openings 300cA and 300cB, if two heat sources are placed near each of the openings 300cA and 300cB, the question arises as to where to place the remaining heat source within the housing 101.

[0037] The air flowing inside the enclosure 101 is drawn in by the cooling fan 300 through the intake port 103 and exhausted through the exhaust port 200. For example, suppose that image sensors 301A and 301B are placed near the openings 300cA and 300cB of the cooling fan 300, respectively, and that the circuit group 306, which generates the most heat, is placed upstream of the intake port 103.

[0038] In this case, when the cooling fan 300 draws in air, the air heated by the circuit group 306 comes into contact with the image sensors 301A and 301B, preventing cooling. Therefore, it is necessary to position the image sensors 301A, 301B and the circuit group 306 so that air heated by a heat output greater than their own heat output does not come into contact with them.

[0039] Therefore, the image sensor 301A is positioned closer to the air intake 103 than the circuit group 306. The circuit group 306 is positioned closer to the opening 300cA of the cooling fan 300 than at least one of the image sensors 301A and 301B. As a result, the image sensor 301B is positioned near the opening 300cB.

[0040] In this way, the circuit group 306 is positioned closer to the cooling fan 300 than one of the two image sensors 301A and 301B, which is image sensor 301A. This allows the image sensor 301A to be cooled by the air drawn in from the intake port 103, thereby improving the cooling efficiency of the image sensor 301A.

[0041] Furthermore, the air drawn in by the cooling fan 300 is heated by the image sensor 301A, and this air heated by the image sensor 301A comes into contact with the image sensor 301B and the circuit group 306. However, the image sensor 301B generates the same amount of heat as the image sensor 301A, and the circuit group 306 generates more heat than the image sensor 301A.

[0042] Therefore, even if air heated by the image sensor 301A is applied to the circuit group 306 and the image sensor 301B, the circuit group 306 and the image sensor 301B will not be heated and can be sufficiently cooled. Furthermore, by arranging them in this manner on the X-axis, the thickness of the housing 101 in the Y-axis and Z-axis directions, where the wide-angle lenses 102A and 102B are not located, can be reduced, thereby suppressing reflections of the image on the housing 101.

[0043] Note that the arrangement of the image sensors 301A, 301B, the cooling fan 300, and the circuit group 306 is not limited to the arrangement described above. The circuit group 306 should be positioned closer to the cooling fan 300 than at least one of the two image sensors 301A and 301B.

[0044] Figure 4A is a side cross-sectional view showing an example of airflow inside the imaging device 100 according to Embodiment 1. In Figure 4A, the thick black arrows indicate the airflow and the flow paths formed inside the housing 101. When the cooling fan 300 is driven, the fan 300a rotates, drawing air from outside the housing 101 into the housing 101 through the intake port 103.

[0045] The air drawn in through the intake port 103 passes through the gap between the housing 101 and the heat sink 304A, and the gap between the heat dissipation sheet 303A and the battery case 310. Heat from the image sensor 301A is transferred to the heat dissipation sheet 303A and the heat sink 304A, thereby cooling the image sensor 301A.

[0046] The air drawn in from the intake port 103 branches and passes through (1) the gap (flow path) formed by the housing 101 and the heat sink 304A. The air drawn in from the intake port 103 also passes through (2) the gap (flow path) formed by the wide-angle lens 102A and the heat sink 304A, and through the gap (flow path) between the heat dissipation sheet 303A and the battery case 310. Heat from the image sensor 301A is transferred to the heat dissipation sheet 303A and the heat sink 304A. As the air drawn in from the intake port 103 flows through these gaps (flow paths), the image sensor 301A is cooled by contact with the heat dissipation sheet 303A and the heat sink 304A.

[0047] The air that passes through the gap between the housing 101 and the heat sink 304A branches off and passes through the gap (flow path) between the circuit board 305 and the heat sink 308. The air that passes through the gap (flow path) between the circuit board 305 and the heat sink 308 is guided to the cooling fan side 300 by the wall plate 320. (4) Also, the air that passes through the gap between the housing 101 and the heat sink 304A passes through the gap formed between the heat sink 308 and the housing 101, and (5) passes through the gap (flow path) between the heat sink 308 and the cooling fan 300. Heat from the circuit group 306 is transferred to the circuit board 305 and the heat sink 308, and the circuit group 306 is cooled by this air.

[0048] Furthermore, the air that passes between the heat dissipation sheet 303A and the battery case 310 flows through a channel formed by the inner wall surface of the top plate portion 101D, the battery case 310, and the wall plate 320. This air then branches, with one branch passing through the gap between the wall plate 320 and the storage case 300b, and the other passing through the gap (channel) between the heat dissipation plate 308 and the cooling fan 300.

[0049] This air also cools the circuit group 306. In addition, the other branched air passes through the gap between the cooling fan 300, the heat sink 304B, and the heat dissipation sheet 303B. Heat from the image sensor 301B is transferred to the heat dissipation sheet 303B and the heat sink 304B, and this cools the image sensor 301B.

[0050] The air heated near the openings 300aC and 300bC of the cooling fan 300 is drawn into the housing case 300b through the openings 300bC and 300cC, and then discharged outside the housing 101 through the exhaust port 200 from opening 300cC. This improves the cooling efficiency of the circuit group 306 and the image sensor 301B. By improving the cooling efficiency in this way, the impact of noise on image data caused by heat generation can be reduced.

[0051] Figure 4B is a side cross-sectional view showing another example of the airflow within the imaging device 100 according to Embodiment 1. The imaging device 100 in Figure 4B has the addition of a wall plate 330 and an air intake port 340 compared to the imaging device 100 in Figure 4A. Components identical to those in Figure 4A are denoted by the same reference numerals, and their descriptions are omitted.

[0052] The wall panel 330 is provided to seal the space between the inner wall surface of the top panel 101D and the housing case 300b for the cooling fan 300. Specifically, for example, the wall panel 330, together with the housing case 300b for the cooling fan 300, divides the internal space of the housing 101 into a space on the +X side of the wall panel 330 and a space on the -X side of the wall panel 330. As a result, air from the space on the +X side of the wall panel 330 does not flow out into the space on the -X side of the wall panel 330.

[0053] For example, air that has passed through the heat dissipation sheet 303A and the heat sink 304A, and through the space between the inner wall surface of the top plate portion 101D and the battery case 310 and the wall plate 320, is drawn in by the wall plate 330 through the gap between the wall plate 320 and the housing case 300b of the cooling fan 300. This incoming air is drawn into the cooling fan 300 through the opening 300aC of the cooling fan 300. This allows the image sensor 301A to be cooled.

[0054] Furthermore, the air intake port 340 is provided on the top plate portion 101D of the imaging device 100, connecting the outside of the imaging device 100 with the space on the -X direction side from the wall plate 330 inside the imaging device 100, and allows air from the air intake port 340 to pass into the imaging device 100. The air flowing in from the air intake port 340 passes through the heat dissipation sheet 303B and the heat sink 304B. Heat from the image sensor 301B is transferred to the heat dissipation sheet 303B and the heat sink 304B, thereby cooling the image sensor 301B.

[0055] Thus, in Figures 4A and 4B, at least a portion of the first heat transfer member and the second heat transfer member come into contact with the air in the airflow path from the intake port to the exhaust port at a location different from the section from where the third heat transfer member comes into contact with the air in the airflow path from the intake port to the exhaust port.

[0056] In Figures 4A and 4B, the airflow path from the intake port 103 to the exhaust port 200 is not limited to Figures 1 and 2, as long as the airflow cools the image sensor 301A → image sensor 301B and the circuit group 306 in that order. For example, in terms of the airflow path, the circuit group 306 should be as close to the cooling fan 300 as possible.

[0057] Furthermore, in Figures 4A and 4B, the rechargeable battery 309, the circuit board 305 and the circuit group 306, and the cooling fan 300 are arranged between the image sensors 301A and 301B. However, as long as they are between the image sensors 301A and 301B, the rechargeable battery 309, the circuit board 305 and the circuit group 306, and the cooling fan 300 may be arranged so that their longitudinal directions extend along the optical axis X. [Examples]

[0058] Example 2 will now be described. Example 1 described an example in which a blower fan was used as the cooling fan. Example 2 will describe an example in which a sirocco fan was used as the cooling fan. In Example 2, the focus will be on the features of Example 2, so the same reference numerals will be used for parts that are the same as in Example 1, and their explanations will be omitted.

[0059] <Side cross-section of imaging device 100> Figure 5 is a side cross-sectional view of the imaging device 100 according to Embodiment 2. The imaging device 100 has a cooling fan 500 and a support member 501 inside the housing 101, replacing the cooling fan 300 of Embodiment 1. Inside the housing 101, the image sensor 301A, cooling fan 300, circuit group 306 and circuit board 305, rechargeable battery 309, and image sensor 301B are arranged in the -X direction in that order.

[0060] The cooling fan 500 is, for example, a sirocco fan, which cools the inside of the housing 101. The sirocco fan has a structure that draws in air from one surface perpendicular to its rotation axis 500c and exhausts air from one side in the direction of rotation. The cooling fan 500 has a fan 500a and a housing case 500b.

[0061] The fan 500a is housed in the housing case 500b. The fan 500a is positioned inside the housing case 500b such that its axis of rotation 500c is parallel to the optical axis X. The housing case 500b houses the fan 500a. The housing case 500b has an opening 500cB on one plane substantially perpendicular to the optical axis X, and an opening 500cC on the side facing the exhaust port 200. The opening 500cB faces the heat sink 308, and the opening 500cC allows air inside the cooling fan 500 to pass through to the exhaust port 200. The other plane substantially perpendicular to the optical axis X faces the support member 501.

[0062] The cooling fan 500 is connected to the circuit group 306 via the circuit board 305 using a flexible wiring board (not shown). The cooling fan 500 rotates fan 500a under the drive control of the circuit group 306, drawing air from inside the housing 101 through the opening 500cB and expelling it outside the housing 101 through the exhaust port 200 via the opening 500cC.

[0063] The support member 501 is roughly L-shaped and fixes and supports the heat sink 308. The support member 501 is also fixed to the bottom plate portion 101C of the housing 101 near the exhaust port 200 and shields against air leakage from the intake port 103 to the exhaust port 200. As a result, the support member 501, together with the heat sink sheet 303A and the inner wall surface of the housing 101, forms part of the airflow path for air drawn in from the intake port 103 and guides the air to the image sensor 301B.

[0064] Figure 6 is an explanatory diagram showing the airflow inside the imaging device 100 according to Embodiment 2. In Figure 6, the thick black arrows indicate the airflow and the flow paths formed inside the housing 101. When the cooling fan 500 is driven, the fan 500a rotates, drawing air from outside the housing 101 into the housing 101 through the intake port 103.

[0065] Air drawn in from the intake port 103 passes through the gap (flow path) formed by the heat sink 304A and the wide-angle lens 102A, and then through the gap between the heat dissipation sheet 303A and the support member 501. Heat from the image sensor 301A is transferred to the heat dissipation sheet 303A and the heat sink 304A, thereby cooling the image sensor 301A.

[0066] The air guided by the support member 501 and the inner wall surface of the top plate portion 101D comes into contact with the heat sink 304B and passes through the gap between the heat dissipation sheet 303B and the battery case 310, the gap between the heat sink 304B and the battery case 310, and the gap between the battery case 310 and the inner wall surface of the bottom plate portion 101C of the housing 101. Since heat from the image sensor 301B is transferred to the heat dissipation sheet 303B and the heat sink 304B, the image sensor 301B is cooled as a result. After this, the air cools the heat sink 308, the circuit board 305, and the circuit group 306.

[0067] The air that has cooled the circuit board 305 and the circuit group 306 is drawn into the housing case 500b through the opening 500cB and discharged outside the housing 101 through the exhaust port 200 at the opening 500cC. As described above, there are no other image sensors 301A (heat dissipation sheet 303A) and 301B (heat dissipation sheet 303B) in the way that the air that has cooled the heat sink 308, the circuit board 305, and the circuit group 306 flows to the exhaust port 200. This configuration improves the cooling efficiency of the circuit group 306 and the image sensor 301B. By improving the cooling efficiency in this way, the impact of noise on image data caused by heat generation can be reduced.

[0068] Furthermore, regarding the airflow path from the intake port 103 to the exhaust port 200, the arrangement and number of the intake port 103 and exhaust port 200 are not limited to those shown in Figures 1 and 2, as long as the airflow cools the image sensor 301A → image sensor 301B → circuit group 306 in that order.

[0069] Furthermore, although the rechargeable battery 309, circuit board 305 and circuit group 306, and cooling fan 500 are arranged between the image sensors 301A and 301B, the rechargeable battery 309, circuit board 305 and circuit group 306, and cooling fan 500 may be arranged so that their longitudinal directions extend along the optical axis X, as long as they are between the image sensors 301A and 301B.

[0070] Furthermore, although the above-described embodiment described a configuration in which the imaging device 100 has built-in cooling fans 300 and 500, the cooling fans 300 and 500 do not necessarily have to be built-in. For example, an intake-type external fan, as described in Examples 1 and 2, may be attached near the exhaust port. In this case, when the attached external fan draws in air, air is drawn in from the intake port, and the heat source can be cooled in the same way as in Examples 1 and 2.

[0071] It should be noted that the present invention is not limited to the above, and may be combined in any way. Furthermore, other embodiments that can be conceivable within the scope of the technical idea of ​​the present invention are also included in the scope of the present invention. [Explanation of Symbols]

[0072] 100 Imaging device, 101 Housing, 102A, 102B Wide-angle lens, 103 Intake port, 200 Exhaust port, 300, 500 Cooling fan, 301A, 301B Image sensor, 306 Circuit group

Claims

1. A housing having an air intake and an exhaust port, An imaging sensor arranged inside the housing, An image processing unit that performs image processing based on electrical signals from the image sensor and generates more heat than the image sensor, It comprises a cooling fan that draws in air from the intake port and exhausts air from the exhaust port, The image sensor is positioned closer to the air intake than the image processing unit. The cooling fan is positioned closer to the exhaust port than the image sensor and the image processing unit, and draws in air from the intake port and exhausts air from the exhaust port. Imaging device.

2. The imaging apparatus according to claim 1, The image sensor captures the subject from the first surface of the housing, The air intake port is located on the first surface, Imaging device.

3. The imaging apparatus according to claim 2, The exhaust port is located on a second surface of the housing that is different from the first surface. Imaging device.

4. An imaging device according to any one of claims 1 to 3, The intake port and the exhaust port have slits that allow air to pass through. Imaging device.

5. An imaging device according to any one of claims 1 to 4, The cooling fan is positioned opposite the image processing unit and draws in air from the image processing unit and exhausts it from the exhaust port. Imaging device.

6. A housing having an air intake and an exhaust port, An image sensor disposed within the housing and capturing an image of a subject from the first surface of the housing, An image processing unit that performs image processing based on electrical signals from the image sensor and generates more heat than the image sensor, It comprises a cooling fan that draws in air from the intake port and exhausts air from the exhaust port, The air intake port is located on the first surface, The cooling fan is positioned closer to the exhaust port than the image sensor and the image processing unit, and draws in air from the intake port and exhausts air from the exhaust port. Imaging device.

7. The imaging device according to claim 6, The exhaust port is located on a second surface of the housing that is different from the first surface. Imaging device.

Images