Display panels and display devices

Abstract

Embodiments of the present invention provide a display panel and a display device. [Solution] The display panel includes a via hole penetrating the display panel, a cut-out area located at the periphery of the via hole, the cut-out area comprising a base substrate and a sealing layer located on one side of the base substrate, and at least one circumferential uneven structure, the uneven structure being located between the sealing layer and the base substrate of the cut-out area, the at least one circumferential uneven structure being arranged sequentially around the via hole, the minimum distance from the first uneven structure to the outer edge of the via hole being 0 to 30 microns, at least one of the uneven structures having a surface away from the base substrate and a side surface connected to the surface, at least one of the surface and the side surface being uneven, and the first uneven structure being the uneven structure with the smallest distance from the center of the via hole.

Description

Technical Field

[0003] , , ,

[0004]

[0001] The present disclosure relates to the field of semiconductor technology, and more particularly, to display panels and display devices.

Background Art

[0002] After the concept of a full-screen emerged, in order to increase the screen occupancy rate, various异形 screens with different designs, from a forehead screen to a water-drop screen and the current mainstream perforated screen, have competitively emerged. Using a screen with small perforations can improve both the user experience and the immersion feeling.

Summary of the Invention

[0003] Embodiments of the present invention provide a display panel, the display panel comprising: a via hole penetrating through the display panel; a cut residue region located at a peripheral portion of the via hole, the cut residue region comprising a base substrate and a sealing layer located on one side of the base substrate; and at least one turn of uneven structure; the uneven structure is located between the sealing layer and the base substrate of the cut residue region, at least one turn of the uneven structure is sequentially provided around the via hole, the minimum distance from the first uneven structure to the outer edge of the via hole is 0 micron to 30 microns, at least one of the uneven structures has a surface departing from the base substrate and a side surface connecting to the surface, and at least one of the surface and the side surface is uneven, and the first uneven structure is the uneven structure with the smallest distance from the center of the via hole.

[0004] In a possible embodiment, the side surface is uneven, and the uneven structure has a cross-sectional shape in a T shape passing through the center of the via hole in a direction perpendicular to the base substrate. In a possible embodiment, the side surface is uneven, and the uneven structure has a cross-sectional shape consisting of a stepped shape passing through the center of the via hole in a direction perpendicular to the base substrate. In a possible embodiment, the surface is uneven, and the uneven structure has a cross-sectional shape consisting of a concave shape passing through the center of the via hole in a direction perpendicular to the base substrate.

[0005] In a possible embodiment, the uneven structure has at least one repeating structure in a direction perpendicular to the base substrate, and the at least one repeating structure is provided by sequentially stacking them. In a possible embodiment, the uneven structure has a plurality of repeating structures, with a flat layer provided between two adjacent repeating structures.

[0006] In possible embodiments, the different repeating structures have the same cross-sectional shape in a direction perpendicular to the base substrate, passing through the center of the via holes.

[0007] In a possible embodiment, the display panel further includes a display area located on the side of the cut-out area away from the via hole, the display area including a barrier layer, a buffer layer, an active layer, a first gate insulating layer, a first gate metal layer, a second gate insulating layer, a second gate metal layer, an interlayer medium layer, a first source / drain layer, a first planar layer, a second source / drain layer, a second planar layer, and a pixel limiting layer, sequentially located on the base substrate side. The uneven structure comprises one or a combination of the barrier layer, the buffer layer, the first gate insulating layer, the second gate insulating layer, the interlayer medium layer, the first flat layer, the second flat layer, and the pixel limiting layer.

[0008] In a possible embodiment, the surface of the uneven structure away from the via hole further has a plurality of circumferential first crack prevention dams, the first crack prevention dams are located between the base substrate and the sealing layer, and the plurality of circumferential first crack prevention dams are sequentially provided around the uneven structure. In a possible embodiment, a first crack-preventing metal layer is further provided between each of the first crack-preventing dams and the base substrate, and a second crack-preventing metal layer is further provided between the first crack-preventing metal layer and the first crack-preventing dam.

[0009] In a possible embodiment, the first crack-preventing metal layer is provided in the same layer as the first gate metal layer, and the second crack-preventing metal layer is provided in the same layer as the second gate metal layer.

[0010] In a possible embodiment, a third crack-preventing metal layer is further provided between at least one of the uneven structures and the base substrate, and a fourth crack-preventing metal layer is further provided between the third crack-preventing metal layer and the uneven structure. The third crack-preventing metal layer is provided in the same layer as the first crack-preventing metal layer, and the fourth crack-preventing metal layer is provided in the same layer as the second crack-preventing metal layer.

[0011] In a possible embodiment, the distance between two adjacent circles of the uneven structure is greater than the distance between two adjacent circles of the first crack prevention dam.

[0012] In a possible embodiment, the spacing between two adjacent perimeters of the uneven structure is twice the spacing between two adjacent perimeters of the first crack prevention dam.

[0013] In a possible embodiment, there is a groove between two adjacent circumferential groove structures, the groove extending from the sealing layer to the buffer layer and exposing a portion of the buffer layer.

[0014] In a possible embodiment, on the side of the first crack prevention dam away from the dimple structure, there are further multiple circumferential stop dams that sequentially surround the first crack prevention dam, wherein the height of each circumferential stop dam increases sequentially in the direction perpendicular to the base substrate in the direction from the stop dam to the via hole.

[0015] In a possible embodiment, there are further a plurality of circumferences of second crack prevention dams that sequentially surround the top dam on the side of the stop dam away from the first crack prevention dam, and the second crack prevention dams have the same configuration as that of the first crack prevention dam.

[0016] In a possible embodiment, the display panel includes three concavo-convex structures, five of the first crack prevention dams, two of the stop dams, and four of the second crack prevention dams.

[0017] In a possible embodiment, the display panel further includes a semi-concavo-convex structure, and the semi-concavo-convex structure is disposed between the concavo-convex structure and the via hole.

[0018] In a possible embodiment, in different positions of the first concavo-convex structure, in a direction perpendicular to the base substrate, the maximum width of a cross-section passing through the center of the via hole varies at different positions of the first concavo-convex structure.

[0019] In a possible embodiment, the semi-concavo-convex structure has a minimum distance of zero from the outer edge of the via hole.

[0020] In a possible embodiment, in a direction perpendicular to the base substrate, the cross-sectional shape of the semi-concavo-convex structure passing through the center of the via hole is half of the cross-sectional shape of the via hole passing through the center in a direction perpendicular to the base substrate.

[0021] In a possible embodiment, the minimum distance between the first concavo-convex structure and the outer edge of the via hole and the minimum distance k1 between two adjacent concavo-convex structures satisfy the following relationship: 0 < k3 ≤ k1 "Equation 1".

[0022] In a possible embodiment, the concavo-convex structure includes one repeating structure in a direction perpendicular to the base substrate, the repeating structure is in the same layer as the first source / drain, or the repeating structure is in the same layer as the second source / drain.

[0023] In a possible embodiment, the concavo-convex structure includes two repeating structures in a direction perpendicular to the base substrate, and the two repeating structures are a first repeating structure and a second repeating structure located on a side of the first repeating structure away from the base substrate. The first repeating structure is in the same layer as the first source-drain, and the second repeating structure is in the same layer as the second source-drain.

[0024] In a possible embodiment, the concavo-convex structure includes a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer that are sequentially stacked in a direction perpendicular to the base substrate, and a line width of the aluminum metal layer is smaller than a line width of the second titanium metal layer.

[0025] In a possible embodiment, each of the concavo-convex structures is an integral structure.

[0026] In a possible embodiment, each of the concavo-convex structures includes a plurality of solid parts and a plurality of excavation parts, the solid parts and the excavation parts are alternately arranged, and all the solid parts in the same concavo-convex structure have the same circular center.

[0027] In a possible embodiment, each of the sealing layers in the cut residue region includes a first inorganic sealing layer and a second inorganic sealing layer located on a side of the first inorganic sealing layer away from the base substrate.

[0028] Embodiments of the present invention further provide a display device including the display panel provided by the embodiments of the present invention.

Brief Description of the Drawings

[0029] [Figure 1] It is a top view schematic diagram of a display panel provided by an embodiment of the present invention. [Figure 2] It is a schematic cross-sectional view of FIG. 1 along broken line EF. [Figure 3]Figure 2 is a schematic diagram showing the enlarged structure in the remaining cut area. [Figure 4a] Figure 1 is a schematic diagram of a structure provided by an embodiment of the present invention in which the distance between two adjacent uneven structures is greater than the distance between two adjacent first crack prevention dams. [Figure 4b] Figure 2 is a schematic diagram of a structure provided by an embodiment of the present invention in which the distance between two adjacent uneven structures is greater than the distance between two adjacent first crack prevention dams. [Figure 4c] This is a schematic diagram of the cross-section of the first uneven structure T11 on both sides of the center of the via hole K provided by an embodiment of the present invention. [Figure 5a] This is a schematic diagram of a cross-sectional structure of another display panel provided by an embodiment of the present invention. [Figure 5b] This is a schematic diagram of a cross-sectional structure of another display panel provided by an embodiment of the present invention. [Figure 6] The uneven structure provided by the embodiment of the present invention is a schematic diagram of a stepped shape. [Figure 7] Figure 6 is a schematic diagram showing the enlarged structure in the remaining cut area. [Figure 8] This is a schematic diagram showing a structure in which the uneven structure provided by an embodiment of the present invention is in the form of a recess. [Figure 9] The diagram shows a schematic representation of a stepped and recessed structure, which is provided by an embodiment of the present invention. [Figure 10] This is a schematic diagram of a structure that includes two repeating structures, which is provided by an embodiment of the present invention. [Figure 11] Figure 10 is a schematic diagram showing the enlarged structure in the remaining cut area. [Figure 12] This is a cross-sectional view of a display panel display area provided by an embodiment of the present invention. [Figure 13] This is a schematic top view of the uneven structure provided by an embodiment of the present invention. [Figure 14] This is a schematic top view of another uneven structure provided by an embodiment of the present invention. [Modes for carrying out the invention]

[0030] To further clarify the purpose, technical solutions, and advantages of the embodiments disclosed herein, the technical solutions of the embodiments disclosed herein will be described clearly and completely below, together with the accompanying drawings of the embodiments disclosed herein. Obviously, the embodiments described herein are some, but not all, embodiments of the disclosure. All other embodiments that can be obtained by those skilled in the art without requiring creative work based on the embodiments described herein are within the scope of the disclosure.

[0031] Unless otherwise defined, technical or scientific terms used in this invention shall have the ordinary meanings understood by an ordinary person skilled in the art to which this invention pertains. Terms such as “first,” “second,” etc., used in this invention do not indicate any order, number, or importance, but are used solely to distinguish different components. Words such as “includes” or “constitutes” are intended to mean that the element or object preceding the word covers the element or object and its equivalents that appear after the word, without excluding other elements or objects. Similar words such as “connected” or “linked” may include electrical connections, whether direct or indirect, as well as physical or mechanical connections. Terms such as “up,” “down,” “left,” and “right” are used solely to indicate relative positional relationships, and if the absolute position of the object being described changes, this relative positional relationship may change accordingly.

[0032] In order to make the following description of embodiments of the present invention clear and concise, the present invention omits detailed descriptions of known functions and known components.

[0033] Referring to Figures 1, 2, and 3, Figure 2 is a schematic cross-sectional view along the dashed line EF in Figure 1, and Figure 3 is an enlarged schematic view of the remaining cut area S1 in Figure 2. Embodiments of the present invention provide a display panel. The display panel includes via holes K, a remaining cut area S1, and an uneven structure T around at least one circumference.

[0034] The via hole K penetrates the display panel, and the area where the via hole K is located is specifically used to hold a camera. Specifically, the shape of the via hole K may be a circle, an ellipse, or a rectangle.

[0035] The remaining cut area S1 is located around the via hole K and includes the base substrate 11 and the sealing layer 9 located on one side of the base substrate 11. When the via hole K is specifically cut, the display panel usually requires a cut area (not shown) around the via hole K due to cutting accuracy limitations, and after cutting, the portion of the cut area that is not removed can be used as the remaining cut area that ultimately remains on the display panel.

[0036] The aforementioned uneven structure T is located between the sealing layer 9 and the base substrate 11 in the remaining cut region S1, and at least one circumferential uneven structure T is sequentially distributed around the via hole K, with the minimum distance from the first uneven structure T11 to the outer edge of the via hole K (i.e., the distance from the first uneven structure T11 at the position closest to the first uneven structure T11 on the outer edge of the via hole K, see, for example, k3 in Figure 4b) being 0 μm to 30 μm. At least one of the concave structures T has a surface T1 away from the substrate 11 and a side surface T2 connected to the surface T1. At least one of the surface T1 and side surface T2 is uneven, and the first concave structure T11 is the uneven structure T with the smallest distance from the center of the via hole K. Specifically, if the cutting position is exactly where the uneven structure T is located, the remaining half of the uneven structure T after cutting will also become the first uneven structure T11, and at this time, the distance between the first uneven structure T11 and the outer edge of the via hole K closest to it will be 0 microns.

[0037] In this embodiment, the remaining cut area S1 is provided with an uneven structure T that extends around the via hole K for at least one full circle. Since at least one of the surface T1 away from the substrate 11 and the side surface T2 of the uneven structure T is uneven, the contact area with the sealing layer 9 is increased by the uneven structure T, and the adhesive strength of the sealing layer is increased. This improves the stress imbalance in the sealing layer in the cut area in the conventional punched screen manufacturing process. The thermal effect of laser cutting amplifies the stress, making the sealing layer more prone to peeling and more likely to cause sealing defects, thus improving the problem of reduced product production yield.

[0038] Specifically, as shown in Figures 1 and 2, the display panel further includes a display area AA located on the side of the remaining cut area S1 away from the via hole. Between the via hole K and the display area AA, the remaining cut area S1, the first crack prevention area S2, the stopper area S3, the second crack prevention area S4, and the loop area S5 can be provided in sequence. Here, in the first crack prevention area S2, multiple first crack prevention dams CD1 are sequentially provided around the via hole K. The first crack prevention dams CD1 prevent cracks generated during dicing from extending to the display area and prevent overflow of the organic sealing material used when forming the organic sealing layer 92 into the remaining cut area S1. In the stopper area S3, multiple stop dams ID are sequentially provided around the first crack prevention dams CD1. The multiple stop dams ID prevent overflow of the organic sealing material used when forming the organic sealing layer 92 into the remaining cut area S1. In the second crack prevention region S4, multiple second crack prevention dams CD2 (Crack Dam2) are sequentially provided around the stop dam ID (IJP Dam). The purpose of these multiple second crack prevention dams CD2 (Crack Dam2) is to prevent cracks generated during dicing from extending to the display region and to prevent overflow of the organic sealing material used when forming the organic sealing layer 92 into the remaining cut region S1. Multiple signal lines D (for example, data lines) that avoid via holes K can be provided in the loop region S5, and these are used to drive the pixel circuits of the display region and write data signals. Specifically, the display area AA includes a first inorganic layer 12 (specifically, a barrier layer and a buffer layer sequentially arranged above the substrate 11) arranged sequentially on one side of the base substrate 11, a second inorganic layer 13 (specifically, a first gate insulating layer GI1 and a second gate insulating layer GI2 sequentially arranged above the first inorganic layer 12), a third inorganic layer 14 (specifically, an interlayer medium layer ILD arranged above the second inorganic layer 13), a flat layer 3, a pixel limiting layer 4, a spacer 5, a first inorganic sealing layer 91, an organic sealing layer 92, and a second inorganic sealing layer 93.The remaining cut area S1, the first crack prevention area S2, the stopper area S3, the second crack prevention area S4, and the loop area S5 can be provided with a portion of the film layers of the first inorganic layer 12, the second inorganic layer 13, the third inorganic layer 14, the flat layer 3, the pixel limiting layer 4, the spacer 5, the first inorganic sealing layer 91, the organic sealing layer 93, and the second inorganic sealing layer 93. Specifically, a light-emitting layer (not shown in the figure) can be provided between the sealing layer 9 and the pixel limiting layer 4, and the light-emitting layer can cover the remaining cut area S1, the first crack prevention area S2, the stopper area S3, the second crack prevention area S4, and the loop area S5, and can be cut at the positions of the uneven structure T, the first crack prevention dam CD1, and the second crack prevention dam CD2.

[0039] Specifically, as shown in Figures 1 and 2, multiple first crack prevention dams CD1 are provided around the base substrate 11 and the sealing layer 9 on the side of the uneven structure T away from the via holes K, and multiple first crack prevention dams CD1 are provided around the perimeter of the uneven structure T. A first crack prevention metal layer 81 is provided between each first crack prevention dam CD1 and the base substrate 11, and a second crack prevention metal layer 82 is provided between the first crack prevention metal layer 81 and the first crack prevention dam CD1. In this embodiment of the present invention, multiple first crack prevention dams CD1 are provided around the side of the remaining cut area S1 away from the via holes K to prevent cracks generated during cutting from extending to the display area, a first crack prevention metal layer 81 is further provided between the first crack prevention dam CD1 and the base substrate 11, and a second crack prevention metal layer 82 is provided between the first crack prevention metal layer 81 and the first crack prevention dam CD1. Because the first crack-preventing metal layer 81 and the second crack-preventing metal layer 82 have excellent ductility, crack propagation can be effectively prevented. Specifically, the display panel has a first gate metal layer and a second gate metal layer located on the side of the first gate metal layer away from the base substrate 11. The first crack-preventing metal layer 81 is the same layer as the first gate metal layer, and the second crack-preventing metal layer 82 is the same layer and made of the same material as the second gate metal layer. Specifically, the material of the first crack-preventing metal layer 81 and the second crack-preventing metal layer 82 may be molybdenum, which has excellent ductility, is less likely to break during dicing, and can effectively prevent crack propagation. Specifically, the projection patterns of the first crack-preventing metal layer 81 and the second crack-preventing metal layer 82 on the base substrate 11 can match the projection pattern of the first crack-preventing dam CD1 on the base substrate 11, and are specifically ring-shaped. Specifically, the projection patterns of the first crack-preventing metal layer 81 and the second crack-preventing metal layer 82 onto the base substrate 11 may coincide with the projection pattern of the first crack-preventing dam CD1 onto the base substrate 11, and may specifically be ring-shaped. Specifically, the configuration of the first crack-preventing dam CD1 may be similar to the uneven structure T consisting of a film layer included in a signal line (e.g., a data line), as shown in Figure 2 and Figure 4a.

[0040] Specifically, as shown in Figure 5b, a third crack-preventing metal layer 83 is further provided between at least one uneven structure T and the base substrate 11, and a fourth crack-preventing metal layer 84 is further provided between the third crack-preventing metal layer 83 and the uneven structure T. The third crack-preventing metal layer 83 is the same layer as the first crack-preventing metal layer 81, and the fourth crack-preventing metal layer 84 is the same layer as the second crack-preventing metal layer 82. The third crack-preventing metal layer 83 and the fourth crack-preventing metal layer 84 have excellent ductility and can further prevent the propagation of cracks.

[0041] Specifically, this shows the equally spaced distribution between multiple uneven structures T in the remaining cut region S1. In this embodiment of the present invention, the minimum distance from the first uneven structure T11 in the remaining cut region S1 to the outer edge of the via hole is 0 μm to 30 μm. For example, the minimum distance from the first uneven structure T11 to the outer edge of the via hole is 15 μm to 28 μm. Specifically, for example, the minimum distance from the first uneven structure T11 to the outer edge of the via hole is 18 μm, and the distance between two adjacent convex structures in a region that is not the remaining cut region (for example, two adjacent first crack prevention dams CD1 in Figure 2) is usually smaller than the minimum distance from the uneven structure T to the outer edge of the via hole. For example, the distance between two adjacent first crack prevention dams CD1 (for example, the distance between the right side of the first crack prevention dam CD1 and the left side of the second first crack prevention dam CD1 in the first crack prevention region S2 of Figure 4a) is 14 μm, and the distance between two adjacent uneven structures T (for example, the distance between the right side of the first uneven structure T and the left side of the second uneven structure T in the remaining cut region S1 of Figure 4a) is 28 μm. In an embodiment of the present invention, the minimum distance from the first uneven structure T11 to the outer edge of the via hole is set to 0 μm to 30 μm, that is, the cutting position is set to a region where uneven structures T with large spacing exist, and uneven structures T different from the convex structures in the non-cut remaining region are provided in the remaining cut region S1 (corresponding to the cut region before cutting). Specifically, the distance between two adjacent uneven structures T in the remaining cut region S1 is larger than that of the convex structures in the non-cut remaining region, and the cut region can be filled with fewer uneven structures T.

[0042] Specifically, as shown in Figure 4a, the spacing k1 between two adjacent uneven structures T is greater than the spacing k2 between two adjacent first crack prevention dams CD1. Specifically, the spacing k1 between two adjacent uneven structures T is twice the spacing k2 between two adjacent first crack prevention dams CD1. In this embodiment of the present invention, by making the spacing k1 between two adjacent uneven structures T greater than the spacing k2 between two adjacent first crack prevention dams CD1, when the pixel limiting layer 3 is applied to the display panel, the uneven structures T in the remaining cut area S1 become denser, which makes it easier for air bubbles to form in the remaining cut area S1 and prevents the patterning of the pixel limiting layer 4 from being unfavorable.

[0043] Specifically, as shown in Figure 4a, there is a groove X extending from the sealing layer 9 to the buffer layer (specifically, a film layer within the first inorganic layer 12) between two adjacent uneven structures T, with a portion of the buffer layer exposed.

[0044] Specifically, as shown in Figure 4a, the display panel includes three uneven structures, five first crack prevention dams, two stop dams, and four second crack prevention dams. Of course, in actual implementation, the number of first crack prevention dams CD1, stop dams ID, and second crack prevention dams CD2 may be different, and adjustments to the number of these components or modifications of the components themselves are included in the design concept of this invention, and the present invention is not limited thereto.

[0045] Specifically, as shown in Figure 4a, the display panel further includes a semi-recessed structure T11 located between the recessed structure T and the via hole K. That is, when the via hole K is specifically cut, the cutting position is at the position of the recessed structure T, and the semi-recessed structure T11 that remains on the display panel after cutting is formed. Specifically, the distance between the semi-recessed structure T11 and the via hole K is zero. Specifically, the cross-sectional shape of the semi-recessed structure T11 passing through the center of the via hole K in a direction perpendicular to the base substrate 11 is half the cross-sectional shape of the recessed structure T11 passing through the center of the via hole K in a direction perpendicular to the base substrate 11.

[0046] Specifically, as shown in FIG. 4a, when the cutting position is at the position of the concavo-convex structure T, the remaining half of the concavo-convex structure T after cutting becomes the first concavo-convex structure T11. Specifically, when the cutting position is in the region between two adjacent concavo-convex structures T, the minimum distance k3 between the first concavo-convex structure T11 and the outer K edge of the via hole and the minimum distance k1 between two adjacent concavo-convex structures T satisfy the relationship of 0 < k3 ≤ k1, as shown in FIG. 4b.

[0047] Specifically, depending on the position of the first concavo-convex structure T11, the maximum width of the cross-section perpendicular to the base substrate 11 and passing through the center of the via hole K is different. For example, taking the example shown in FIG. 4c, FIG. 4c is a schematic cross-sectional view of the first concavo-convex structure T11 passing through both sides of the center of the via hole K. This cross-section may be a cross-section parallel to the EF direction in FIG. 1 and passing through the center of the via K, and the width K5 on the left side of the first concavo-convex structure T11 in FIG. 4c is larger than the width K6 on the right side of the first concavo-convex structure T11 in FIG. 4c. That is, when the dicing process is performed, due to the error of the dicing process, the remaining parts are different depending on the position of the first concavo-convex structure T11, and the first concavo-convex structure T11 may become an asymmetric structure with respect to the center of the via hole K.

[0048] Specifically, as shown in FIGS. 1 and 2, on the side away from the concavo-convex structure of the first crack prevention dam CD1, a plurality of circumferences of stop dams ID that sequentially surround the first crack prevention dam CD1 are provided. Pointing in the direction of the via hole K from the stop dam ID (as shown by the arrow AB in FIG. 2), the height in the direction perpendicular to the base substrate 11 of each circumference of the stop dam ID increases sequentially, and the effect of the stopper action increasing sequentially can be obtained. Specifically, the stop dam ID is provided by laminating the flat layer 3, the pixel limiting layer 4, and the spacer 5 in this order. That is, when forming the flat layer 3, the pixel limiting layer 4, and the spacer 5, by multiplexing the flat layer 3, the pixel limiting layer 4, and the spacer 5 to form the stop dam ID, the complexity of the manufacturing process of the display panel can be reduced. Of course, in a specific implementation, the stop dam ID may be composed of other film layers, and the number of film layers constituting the stop dam ID may be different, and the embodiments of the present invention are not limited thereto.

[0049] Specifically, as shown in Figures 1 and 2, on the side away from the first crack prevention dam CD1, multiple second crack prevention dams CD2 are provided around the crack prevention dam ID in sequence. The configuration of the second crack prevention dam CD2 and the first crack prevention dam CD1 is specifically the same, which reduces the complexity of the process. Specifically, the configuration of the second crack prevention dam CD2 and the first crack prevention dam CD1 may be specifically the same. Specifically, the second crack prevention dam CD2 can be constructed by sequentially laminating a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer. The third inorganic layer 14 has a gap in the corresponding region between two adjacent second crack prevention dams CD2, that is, the third inorganic layer 14 can be excavated in the region between two adjacent second crack prevention dams CD2. The second inorganic layer 13 has grooves in the corresponding regions between two adjacent second crack prevention dams CD2, meaning that a portion of the second inorganic layer 13 in the region between two adjacent second crack prevention dams CD2 can be excavated.

[0050] Specifically, as shown in Figures 1 and 2, the sealing layer 9 of the cut-out remaining region S1 is composed of a first inorganic sealing layer 91 and a second inorganic sealing layer 93 located on the side of the first inorganic sealing layer 91 away from the base substrate, and an organic sealing layer 92 is not required to be provided in the cut-out remaining region S1.

[0051] Specifically, as shown in Figure 3, the side surface T2 of the uneven structure T is uneven, and the cross-sectional shape of the uneven structure T passing through the center of the via hole in a direction perpendicular to the base substrate 11 is T-shaped. Specifically, the uneven structure T has an I-shaped cross-sectional shape passing through the center of the via hole in a direction perpendicular to the base substrate 11. Specifically, the display panel increases the number of signal lines. The uneven structure T is in the same layer and made of the same material as the signal lines (specifically, data lines SD), and the cross-sectional shape of the signal lines may be the same as the cross-sectional shape of the uneven structure T in order to form the uneven structure T at the same time as the signal lines. Specifically, the uneven structure T is formed by sequentially stacking a first titanium metal layer 71, an aluminum metal layer 72, and a second titanium metal layer 73 in a direction perpendicular to and away from the base substrate 11, and the line width of the aluminum metal layer 72 is smaller than the line width of the second titanium metal layer 73. Specifically, the line width of the aluminum metal layer 72 can be understood as the width of the uneven structure T in the direction perpendicular to the base substrate 11 and toward the via hole K, as shown by arrows AB in Figure 2. Specifically, as shown in Figure 3, the cross-sectional shape of the aluminum metal layer 72 in the uneven structure T that is perpendicular to the base substrate 11 and passes through the center of the via hole K is trapezoidal, and the surface of the trapezoidal shape that is away from the base substrate 11 (the upper end surface of the trapezoid) is in contact with the second titanium metal layer 73, and the line width of the aluminum metal layer 72 is smaller than the line width of the second titanium metal layer 73. It can be understood that the area of ​​the aluminum metal layer 72 that is away from the base substrate 11 is smaller than the area of ​​the second titanium metal layer 73 that is facing the base substrate 11. In the embodiment of the present invention, the uneven structure T has a T-shaped cross-sectional shape that passes through the center of the via hole in a direction perpendicular to the base substrate 11, and is designed to resemble a metal button. In the process of introducing a metal button into the remaining cut area S1 and peeling off the film (the process of removing the protective film under the base substrate 11), the deposition of the first inorganic package 91 and the second inorganic package 93 is completed at the position of the metal button, and by attaching them to the surface of the uneven structure T, an inward-recessed structure is formed.As a result, when the first inorganic package 91 and the second inorganic package 93 are scratched by the second titanium metal layer (i.e., Top Ti) of the metal button, the first inorganic encapsulation layer 91 and the second inorganic encapsulation 93 become less likely to peel off from the inorganic film layer on the base substrate 11 during the film peeling process, thus improving the problem of peeling of the encapsulation layer.

[0052] Specifically, as shown in Figure 2 or Figure 4a, the remaining cut region S1 may include only the first inorganic layer 12 and remove the second inorganic layer 13 and the third inorganic layer 14, so as not to cause particle generation during cutting and thus disadvantage to the patterning of the pixel limiting layer 4 when the remaining cut region S1 has multiple inorganic layers. Of course, as shown in Figure 5a, the remaining cut region S1 is composed of the first inorganic layer 12, the second inorganic layer 13, and the third inorganic layer 14, and a sealing ring of the same height as the remaining cut region S1 is formed in the first crack prevention region S2, improving the uniformity of the sealing layer 9.

[0053] Specifically, as shown in Figures 6 and 7, Figure 7 is an enlarged schematic diagram of the remaining cut area S1 in Figure 6, where the side surface T2 of the uneven structure T is uneven, and the cross-sectional shape passing through the center of the via hole in a direction perpendicular to the base substrate 11 of the uneven structure T is stepped. Specifically, the uneven structure T is composed of a second inorganic layer 13 and a third inorganic layer 14, and the line width of the second inorganic layer 13 is greater than the line width of the third inorganic layer 14. The uneven structure T shown in Figure 7 has a two-step cross-section and consists of two inorganic layers, but embodiments of the present invention are not limited thereto, and specifically may include single-step and multi-step (which may consist of more inorganic layers).

[0054] Specifically, as shown in Figure 8, the surface T1 of the uneven structure T is uneven, and the cross-sectional shape of the uneven structure T is recessed when passing through the center of the via hole in a direction perpendicular to the base substrate 11, and the uneven structure T may specifically be composed of a flat layer 3.

[0055] Specifically, the cross-sectional shape of the uneven structure T passing through the center of the via hole in a direction perpendicular to the base substrate 11 may include only recessed shapes as shown in Figure 8, or only I-shaped shapes as shown in Figure 2, or it may be composed of a second inorganic layer 13 and a third inorganic layer 14 as shown in Figure 6, or it may include both stepped shapes and recessed shapes as shown in Figure 9. The stepped shape structure may be composed of a second inorganic layer 13 and a third inorganic layer 14, the recessed shape structure may be composed of a flat layer 3, or it may include both I-shaped and recessed shapes, or it may include both I-shaped and stepped shapes. When the uneven structure T includes multiple shape structures, the multiple shape structures are stacked sequentially in a direction perpendicular to the base substrate 11.

[0056] In a specific embodiment, with reference to Figures 10 and 11, Figure 11 is an enlarged schematic diagram of the remaining cut area S1 in Figure 10, where the uneven structure T includes at least one repeating structure Q in a direction perpendicular to the base substrate 11, and at least one repeating structure Q has the same cross-sectional shape passing through the via hole center in a direction perpendicular to the base substrate 11. Specifically, as shown in Figure 11, the uneven structure T has a plurality of repeating structures Q, with a flat layer 3 provided between two adjacent repeating structures Q. Specifically, each repeating structure Q shown in Figure 11 is I-shaped in order to increase the contact area with the sealing layer 9. Specifically, the repeating structures Q may be laminated in the order of a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer.

[0057] Specifically, as shown in Figure 12, the display area AA consists of a barrier layer, a buffer layer (the barrier layer and buffer layer are designated as the first inorganic layer 12), an active layer 111, a first gate insulating layer 131, a first gate metal layer 112, a second gate insulating layer 132 (the first gate insulating layer 131 and the second gate insulating layer 132 are designated as the second inorganic layer 13), and a second gate metal layer 11, all arranged sequentially on one side of the base substrate 11. 5. Includes an interlayer medium layer ILD (the interlayer medium layer ILD is referred to as the third inorganic layer 14), a first source / drain layer 113, a passivation layer 31, a first flat layer 32, a second source / drain layer 114, a second flat layer 33 (the passivation layer 31, the first flat layer 32, and the second flat layer 33 are referred to as the flat layer 3), a pixel electrode 116, a pixel limiting layer 4, a pacer 5, a light-emitting layer 117, a cathode 118, a first inorganic encapsulation layer 91, an organic encapsulation layer 92, and a second inorganic encapsulation layer 93.

[0058] Specifically, as shown in Figures 2, 4a, and 4b, the first crack prevention dam CD1 may be provided in the same layer and made of the same material as the uneven structure T. Specifically, both the first crack prevention dam CD1 and the uneven structure T may be provided in the same layer and made of the same material as the first source / drain layer 113 or the second source / drain layer 114, and both may include a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer that are sequentially laminated. Similarly, the second crack prevention dam CD2 may be provided in the same layer and made of the same material as the uneven structure T. Specifically, both the second crack prevention dam CD2 and the uneven structure T may be provided in the same layer and made of the same material as the first source / drain layer 113 or the second source / drain layer 114, and both may include a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer that are sequentially laminated. In this invention, "same layer setting" refers to a structure formed by creating two (or more) types of structures using the same film deposition process and then patterning them using the same patterning process, and the materials may be the same or different. For example, the materials used to form the precursors of multiple structures provided in the same layer may be the same, while the materials used to form the final structures may be the same or different. In this invention, "integrated structure" refers to a structure connected to two (or more) types of structures formed using the same film deposition process and patterned using the same patterning process, and the materials used may be the same or different.

[0059] Specifically, each uneven structure T has two repeating structures Q in a direction perpendicular to the base substrate 11, and the two repeating structures Q may be a first repeating structure Q1 and a second repeating structure Q2 located on the side of the first repeating structure Q away from the substrate 11. The first repeating structure Q1 may be in the same layer as the first source / drain layer, and the first repeating structure Q1 is formed together with the first source / drain layer when the first source / drain layer is manufactured. The second repeating structure Q2 may be in the same layer as the second source / drain layer 113, and the second repeating structure Q2 may be formed simultaneously with the second source / drain layer when the second source / drain layer is manufactured. Specifically, the uneven structure T includes only one repeating structure Q (uneven structure T shown in Figure 5a) in a direction perpendicular to the base substrate 11. This one repeating structure Q may be in the same layer as the first source / drain layer, or it may be in the same layer as the second source / drain layer.

[0060] Specifically, the uneven surface structure T can be composed of one or two of the following: a barrier layer, a buffer layer, a first gate insulating layer, a second gate insulating layer, an interlayer medium layer, a first flat layer, a second flat layer, and a pixel limiting layer. The first crack prevention dam CD1 consists of one or more of the following: a barrier layer, a buffer layer, a first gate insulating layer, a second gate insulating layer, an interlayer medium layer, a first flat layer, a second flat layer, and a pixel limiting layer. The configuration of the first crack prevention dam CD1 may be the same as the configuration of the uneven surface structure T, thereby reducing the complexity of the display panel manufacturing process. The configuration of the first crack prevention dam CD1 and the configuration of the uneven surface structure T may be different.

[0061] Specifically, as shown in Figure 13, each uneven structure T has an integrated structure in which its projection onto the base substrate 11 is a perfect annular shape.

[0062] Specifically, as shown in Figure 14, each uneven structure T includes a plurality of solid parts T11 and a plurality of excavated parts T12. The solid parts T11 and excavated parts T12 are arranged alternately. All solid parts T11 in the same uneven structure T have the same center. In the embodiment of the present invention, the adhesion strength between the sealing layer 9 and the uneven structure T is increased by designing the uneven structure T to be divided. The greater the number of divisions in the uneven structure T, the greater the adhesion strength between the sealing layer 9 and the uneven structure T can be. However, the specific number of divisions is determined by the process level, as shown by the dashed line in Figure 13. The extension lines of the solid parts T11 in the uneven structure T intersect the center of the ring.

[0063] Embodiments of the present invention provide a display device including a display panel similar to those in embodiments of the present invention.

[0064] In this embodiment, the remaining cut region S1 is provided with at least one circular uneven structure T distributed around the via hole K and a surface T1 that is separated from the base substrate 11 of the uneven structure T. At least one of the side surfaces T3 is formed in an uneven shape. The uneven structure T increases the contact area with the sealing layer 9, thereby increasing the adhesive strength of the sealing layer. This improves the problem in punched screen manufacturing where the stress on the sealing layer in the cut region is unbalanced, the stress is amplified by the thermal effect of laser cutting, the sealing layer becomes prone to peeling, and sealing defects occur, thus reducing the production yield of the product.

[0065] The display panels provided by embodiments of the present invention may be organic electroluminescent display panels (OLEDs) or quantum dot light-emitting display panels (QLEDs). Other essential components of the display panel should be understood by those skilled in the art and will not be described repeatedly here, nor should they be considered limitations of the present invention. Since the principle of solving the problems of this display panel is the same as the principle of solving the problems of the display substrates described above, embodiments of the display panel according to embodiments of the present invention can refer to embodiments of the display substrates described above, and the redundancies will be omitted. Embodiments of the present invention provide a display device including a display panel similar to that of one embodiment of the present invention. Products and components with display functions, such as mobile phones, tablet PCs, TVs, monitors, notebook computers, digital photo frames, navigation systems, smartwatches, fitness bands, and personal digital assistants, can be used. Other essential components of the display device should be understood by those skilled in the art and are omitted here, and should not be considered limitations of the present invention. Since the principle of solving the problems of this display device is the same as the principle of solving the problems of the display panel described above, embodiments of this display device may refer to embodiments of the display panel described above, and redundant points will be omitted.

[0066] Preferred embodiments of the present invention have been described above, but those skilled in the art, once they recognize the basic creative concept, can make additional changes and modifications to these embodiments. Accordingly, the appended claims are intended to be construed as including all changes and modifications that fall within the scope of the preferred embodiments and the present invention.

[0067] It goes without saying that those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments. Thus, if these changes and modifications to the embodiments of the present invention fall within the scope of the claims of the present invention and related art, the present invention is intended to include such changes and modifications.

Claims

1. It is a display panel, A via hole that penetrates the aforementioned display panel, A cut-out area located at the periphery of the via hole and comprising a base substrate and a sealing layer located on one side of the base substrate, Including at least one circular uneven structure, The uneven structure is located between the sealing layer and the base substrate in the remaining cut area, and at least one of the uneven structures is provided sequentially around the via hole, the minimum distance from the first uneven structure to the outer edge of the via hole is 0 to 30 microns, at least one of the uneven structures has a surface away from the base substrate and a side surface connected to the surface, at least one of the surface and the side surface is uneven, and the first uneven structure is the uneven structure that is the smallest distance from the center of the via hole, display panel.

2. The display panel according to claim 1, wherein the side surface is uneven, and the uneven structure has a cross-sectional shape consisting of a T shape passing through the center of the via hole in a direction perpendicular to the base substrate.

3. The display panel according to claim 1, wherein the side surface is uneven, and the uneven structure has a cross-sectional shape consisting of a stepped shape passing through the center of the via hole in a direction perpendicular to the base substrate.

4. The display panel according to claim 1 or claim 3, wherein the surface is uneven, and the uneven structure has a cross-sectional shape consisting of a concave shape passing through the center of the via hole in a direction perpendicular to the base substrate.

5. The display panel according to claim 1, wherein the uneven structure has at least one repeating structure in a direction perpendicular to the base substrate, and the at least one repeating structure is provided by sequentially stacking them.

6. The display panel according to claim 5, wherein the uneven structure has a plurality of repeating structures, and a flat layer is provided between two adjacent repeating structures.

7. The display panel according to claim 6, wherein the different repeating structures have the same cross-sectional shape in a direction perpendicular to the base substrate and passing through the center of the via hole.

8. The display panel according to any one of claims 1 to 5, further comprising a display area located on the side of the remaining cut area away from the via hole, wherein the display area comprises a barrier layer, a buffer layer, an active layer, a first gate insulating layer, a first gate metal layer, a second gate insulating layer, a second gate metal layer, an interlayer medium layer, a first source / drain layer, a first flat layer, a second source / drain layer, a second flat layer, and a pixel limiting layer, sequentially located on the side of the base substrate.

9. The display panel according to claim 8, wherein the uneven structure comprises one or a combination of the barrier layer, the buffer layer, the first gate insulating layer, the second gate insulating layer, the interlayer medium layer, the first flat layer, the second flat layer, and the pixel limiting layer.

10. The display panel according to claim 8, further comprising a plurality of circumferential first crack prevention dams on the side of the uneven structure away from the via hole, wherein the first crack prevention dams are located between the base substrate and the sealing layer, and the plurality of circumferential first crack prevention dams are sequentially provided around the uneven structure.

11. The display panel according to claim 10, wherein a first crack-preventing metal layer is further provided between at least one of the first crack-preventing dams and the base substrate, and a second crack-preventing metal layer is further provided between the first crack-preventing metal layer and the first crack-preventing dam.

12. The display panel according to claim 11, wherein the first crack-preventing metal layer is provided in the same layer as the first gate metal layer, and the second crack-preventing metal layer is provided in the same layer as the second gate metal layer.

13. A third crack-preventing metal layer is further provided between at least one of the uneven structures and the base substrate, and a fourth crack-preventing metal layer is further provided between the third crack-preventing metal layer and the uneven structure. The display panel according to claim 12, wherein the third crack-preventing metal layer is provided in the same layer as the first crack-preventing metal layer, and the fourth crack-preventing metal layer is provided in the same layer as the second crack-preventing metal layer.

14. The display panel according to claim 10, wherein the spacing between two adjacent undulation structures is greater than the spacing between two adjacent first crack prevention dams.

15. The display panel according to claim 14, wherein the spacing between two adjacent undulation structures is twice the spacing between two adjacent first crack prevention dams.

16. A display panel according to any one of claims 1 to 5, having grooves between two adjacent circumferential groove structures, wherein the grooves extend from the sealing layer to the buffer layer, exposing a portion of the buffer layer.

17. The display panel according to claim 10, wherein on the side of the first crack prevention dam away from the uneven structure, a plurality of stop dams are provided around the first crack prevention dam in sequence, and in the direction from the stop dam to the via hole, the height of the stop dams around each perimeter increases sequentially in the direction perpendicular to the base substrate.

18. The display panel according to claim 17, further comprising a plurality of second crack prevention dams surrounding the stop dam in sequence on the side of the stop dam away from the first crack prevention dam, wherein the second crack prevention dams have the same configuration as the first crack prevention dam.

19. The display panel according to claim 18, wherein the display panel includes three of the uneven structures, five of the first crack prevention dams, two of the stop dams, and four of the second crack prevention dams.

20. The display panel according to claim 18, further comprising a semi-recessed structure, the semi-recessed structure being positioned between the recessed structure and the via hole.

21. The display panel according to claim 20, wherein the maximum width of the cross section passing through the center of the via hole in a direction perpendicular to the base substrate varies at different positions of the first uneven structure.

22. The display panel according to claim 20, wherein the semi-recessed structure has a minimum distance of zero from the outer edge of the via hole.

23. The display panel according to claim 20, wherein the semi-recessed structure has a cross-sectional shape that passes through the center of the via hole in a direction perpendicular to the base substrate, and the cross-sectional shape that passes through the center of the via hole in a direction perpendicular to the base substrate is half the cross-sectional shape that passes through the center of the via hole in a direction perpendicular to the base substrate.

24. The display panel according to claim 16, wherein the minimum distance k3 between the first uneven structure and the outer edge of the via hole, and the minimum distance k1 between two adjacent uneven structures satisfy formula 2. 0<k3≦k1 “Formula 2”.

25. The aforementioned uneven structure includes one repeating structure in a direction perpendicular to the base substrate, The display panel according to claim 8, wherein the repeating structure is in the same layer as the first source drain, or the repeating structure is in the same layer as the second source drain.

26. The aforementioned uneven structure includes two repeating structures in a direction perpendicular to the base substrate, and each of the two repeating structures is a first repeating structure and a second repeating structure located on the side of the first repeating structure that is away from the base substrate. The display panel according to claim 8, wherein the first repeating structure is in the same layer as the first source and drain, and the second repeating structure is in the same layer as the second source and drain.

27. The display panel according to claim 25 or claim 26, wherein the uneven structure includes a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer sequentially stacked in a direction perpendicular to the base substrate, and the line width of the aluminum metal layer is smaller than the line width of the second titanium metal layer.

28. The display panel according to claim 1, wherein each of the aforementioned uneven structures is an integral structure.

29. The display panel according to claim 1, wherein each of the aforementioned uneven structures includes a plurality of physical parts and a plurality of excavated parts, the physical parts and the excavated parts are arranged alternately, and all of the physical parts in the same uneven structure have the same circular center.

30. The display panel according to claim 1, wherein each of the sealing layers in the remaining cut area includes a first inorganic sealing layer and a second inorganic sealing layer located on the side of the first inorganic sealing layer that is away from the base substrate.

31. A display device comprising a display panel according to any one of claims 1 to 30.

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