Multilayer electronic components

Abstract

To improve the heat dissipation characteristics of multilayer electronic components. [Solution] The stacked electronic component includes a dielectric layer 111 and internal electrode layers and floating electrode layers arranged alternately in a first direction with the dielectric layer in between, and a body 110 including a first and second surface facing the first direction, a third and fourth surface facing the second direction perpendicular to the first direction, and a fifth surface 5 and a sixth surface 6 facing the third direction perpendicular to the first and second directions. The internal electrode layer includes a first electrode pattern connected to a first external electrode, a second electrode pattern connected to a second external electrode and spaced apart from the first electrode pattern in a second direction, and a first heat dissipation pattern 13 positioned between the first electrode pattern and the second electrode pattern. The floating electrode layer includes a floating electrode pattern 21 spaced apart from the third to sixth surfaces and second heat dissipation patterns 22 and 23 spaced apart from the floating electrode pattern in a third direction.

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