module

Abstract

This invention provides a module that can achieve a uniform, high-brightness surface light source without applying a separate optical system, and that can manufacture a diffusion layer that can be directly molded onto the surface light source. [Solution] The module 100 includes a circuit board 110, a light-emitting element 120 located on the circuit board 110, and a diffusion layer 130 located on the light-emitting element 120. The diffusion layer 130 includes a base resin containing a siloxane compound and a (meth)acrylic diffusion agent, with the content of the (meth)acrylic diffusion agent being 1.0 to 10.0% by weight.

Description

[Technical Field]

[0001] This invention relates to a module. [Background technology]

[0002] Compared to conventional light sources such as fluorescent and incandescent lamps, light-emitting elements consume less power, have a longer lifespan, faster response times, superior stability, and are environmentally friendly. For these reasons, light-emitting elements are used in various display devices, lighting equipment, and vehicle light sources.

[0003] Top-view type light-emitting elements have a beam angle of 120 degrees and suffer from a hot spot problem where light is concentrated around the top surface. To solve this problem, other optical components such as an air gap or inner lens are applied to the light-emitting element to realize a surface light source. Here, the inner lens may be an inner lens that has been etched to scatter direct / indirect light, or an inner lens to which an optic has been applied.

[0004] However, even with such an optical system applied, dark areas remain, making it difficult to achieve brightness levels high enough to meet North American regulations. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Korean Published Patent Publication No. 2021-0143482 [Overview of the project] [Problems that the invention aims to solve]

[0006] The problem that this invention aims to solve is to provide a module that can achieve a uniform, high-brightness surface light source without applying a separate optical system, and that can manufacture a diffusion layer that can be directly molded onto the surface light source. [Means for solving the problem]

[0007] To solve the above-mentioned problems, 1) the present invention provides a module manufactured by a composition for manufacturing a diffusion layer, comprising a circuit board, a light-emitting element located on the circuit board, and a diffusion layer located on the light-emitting element, wherein the diffusion layer comprises a base resin containing a siloxane compound and a (meth)acrylic diffusion agent, and the content of the (meth)acrylic diffusion agent is 1.0 to 10.0% by weight.

[0008] 2) The present invention can provide a module in which, in 1) above, the diffusion layer is a single layer covering the light-emitting element.

[0009] 3) In the present invention, the light-emitting element can provide a module in which light is emitted from the top surface and has a beam angle of 120° or more.

[0010] 4) In any one of the above 1) to 3), the present invention can provide a module in which the light-emitting element emits light from the side and has a beam angle of 140° or more.

[0011] 5) In any one of the above 1) to 4), the present invention can provide a module in which the siloxane compound comprises a substituent represented by the following chemical formula 1. [ka] In the aforementioned chemical formula 1, R 11 ~R 13 These are, independently, hydrogen, C1~C 20 alkyl groups or C2-C 20 It is an alkenyl group, R 11 ~R 13 At least one of them is C2~C 20 It is the alkenyl group.

[0012] 6) In any one of the above 1) to 5), the base resin can provide a module containing one or more selected from the siloxane compounds represented by the following Chemical Formula 1-1, the siloxane compounds represented by the following Chemical Formula 1-2, and the siloxane compounds represented by the following Chemical Formula 1-3.

Chemical Formula

Chemical Formula

[0013] 7) The present invention can provide a module in which, in 6) above, the siloxane compound represented by chemical formula 1-1 is a siloxane compound represented by the following chemical formula 1-1-1. [ka] In the aforementioned chemical formula 1-1-1, n 1-1-1 The range is 100 to 500.

[0014] 8) The present invention can provide a module in which, in 6) above, the siloxane compound represented by chemical formula 1-2 is a siloxane compound represented by the following chemical formula 1-2-1. [ka] In the aforementioned chemical formula 1-2-1, n 1-21-1 and n 1-22-1 Each of these ranges independently from 100 to 500.

[0015] 9) The present invention relates to a module in which, in 6) above, the siloxane compound represented by chemical formula 1-3 is a siloxane compound represented by the following chemical formula 1-3-1. [ka]

[0016] 10) In the present invention, the base resin can be provided as a module comprising 70.0 to 90.0% by weight of a siloxane compound represented by chemical formula 1-1, 1.0 to 20.0% by weight of a siloxane compound represented by chemical formula 1-2, and 5.0 to 25.0% by weight of a siloxane compound represented by chemical formula 1-3.

[0017] 11) The present invention can provide a module in which, in 1) above, the base resin comprises a siloxane compound represented by the following chemical formula 2. [ka] In the aforementioned chemical formula 2, R 21 ~R 29 Each of these is independently of hydrogen or C1~C 20 It is an alkyl group, n 2-1 and n 2-2 Each of these values ​​is independent and ranges from 1 to 100.

[0018] 12) The present invention can provide a module in which, in 8) above, the siloxane compound represented by chemical formula 2 is a siloxane compound represented by the following chemical formula 2-1. [ka] In the aforementioned chemical formula 2-1, n2-1-1 and n 2-2-1 Each of these values ​​is independent and ranges from 1 to 100.

[0019] 13) The present invention can provide a module in which, in 11) or 12) above, the base resin contains 1.0 to 26.0% by weight of the siloxane compound represented by chemical formula 2.

[0020] 14) The present invention can provide a module in any one of the above 1) to 13) in which the (meth)acrylic diffusing agent comprises one or more selected from polyalkyl (meth)acrylate; polyalkyl (meth)acrylate-co-polystyrene; a mixture of polyalkyl (meth)acrylate and polycarbonate; a mixture of polyalkyl (meth)acrylate and silica; and a mixture of polyalkyl (meth)acrylate and polyoxymethylene.

[0021] 15) In any one of the above 1) to 14), the present invention can provide a module in which the (meth)acrylic diffusing agent has an average particle size of 0.5 to 5.0 μm. [Effects of the Invention]

[0022] The module according to the present invention can achieve a uniform, high-brightness surface light source without the application of a separate optical system, as the diffusion layer can be directly molded into the surface light source. [Brief explanation of the drawing]

[0023] [Figure 1] This diagram illustrates a module according to one embodiment of the present invention. [Modes for carrying out the invention]

[0024] The present invention will be described in more detail below to facilitate understanding.

[0025] The terms and words used in this specification and in the claims should not be interpreted in a manner limited to their ordinary or dictionary meanings, but rather should be interpreted in a manner consistent with the technical idea of ​​the present invention, in accordance with the principle that inventors may define the concepts of terms as appropriate to best describe their invention.

[0026] In this invention, alkyl groups refer to linear or cyclic alkyl groups, and the number of carbon atoms is not particularly limited, but C1 to C 20 Alkyl alkyl groups, preferably C1-C 15 Alkyl alkyl groups, more preferably C1-C 10 The alkyl group may be an alkyl group, most preferably a C1-C5 alkyl group. The alkyl group may be further substituted with other substituents. Specific examples of the alkyl group include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, sec-butyl group, 1-methyl-butyl group, 1-ethyl-butyl group, n-pentyl group, isopentyl group, neopentyl group, tert-pentyl group, n-hexyl group, 1-methylpentyl group, 2-methylpentyl group, 4-methyl-2-pentyl group, 3,3-dimethylbutyl group, 2-ethylbutyl group, n-hexyl group Examples include, but are not limited to, butyl group, 1-methylhexyl group, cyclopentylmethyl group, cyclohexylmethyl group, n-octyl group, tert-octyl group, 1-methylheptyl group, 2-ethylhexyl group, 2-propylpentyl group, n-nonyl group, 2,2-dimethylheptyl group, 1-ethyl-propyl group, 1,1-dimethyl-propyl group, isohexyl group, 2-methylpentyl group, 4-methylhexyl group, and 5-methylhexyl group.

[0027] In this invention, the alkenyl group means a linear or cyclic alkenyl group, and the number of carbon atoms is not particularly limited, but C2 to C 20 Alkenyl groups, preferably C2-C 15 alkenyl group, more preferably C2~C 10The alkenyl group may be, most preferably, a C2-C5 alkenyl group. The alkenyl group may be further substituted with other substituents. The alkenyl group may be, but is not limited to, vinyl, 1-propenyl, isopropenyl, 1-butenyl, 2-butenyl, 3-butenyl, 1-pentenyl, 2-pentenyl, 3-pentenyl, 3-methyl-1-butenyl, 1,3-butadienyl, allyl, 1-phenylvinyl-1-yl, 2-phenylvinyl-1-yl, 2,2-diphenylvinyl-1-yl, 2-phenyl-2-(naphthyl-1-yl)vinyl-1-yl, 2,2-bis(diphenyl-1-yl)vinyl-1-yl, stilbenyl group, styrenyl group, etc.

[0028] In the present invention, alkyl (meth)acrylate may be expressed as encompassing alkyl acrylate and alkyl methacrylate. Alkyl (meth)acrylate is C1-C 10 It may be an alkyl (meth)acrylate, or one or more selected from methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, heptyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and decyl (meth)acrylate, of which methyl methacrylate is preferred.

[0029] In this invention, particle size and particle size distribution can be measured using a laser scattering particle size analyzer (manufacturer: HORIBA, model name: LA-950, supplier: Trendtop scientific corp., Taipei, Taiwan). The average particle size may represent the average value of the particle sizes of 10 samples being measured.

[0030] In this invention, the refractive index can be measured using a spectrophotometer (manufacturer: Shimadzu, model name: UV-2600). The refractive index (n) can be calculated by measuring the transmittance (T) of light at a specific wavelength and using Brewster's law (n=).

[0031] In this invention, the transmittance of the module can be derived by the following formula.

[0032] I / I0 = exp{(-3Lxr 3 )(n d / n s -1)4λ 4}

[0033] I: Output Intensity I0: Input Intensity x: module thickness L: Concentration of the diffusing agent r: Particle radius of the diffusing agent n d :Refractive index of the diffusing agent n s :Refractive index of the base resin λ: Wavelength of the light-emitting element

[0034] In this invention, the output intensity (i) can be measured using a vehicle light distribution device (manufacturer: Impress Sensor & Systems, model name: LMK 598). The unit of output intensity is candela (cd), and it can be measured by sensing the intensity of the light emitted through the module using an optical sensor.

[0035] In this invention, the input intensity (I0) can be measured using a power meter (manufacturer: Thorlabs, model name: PM100D). The input intensity unit is candela (cd), and the amount of light from a light-emitting element (LED) entering the optical sensor can be measured.

[0036] In this invention, the module thickness (x) can be measured with a micrometer or a digital thickness gauge.

[0037] In this invention, the concentration (L) of the diffusing agent can be measured using a laser scattering particle size analyzer. The concentration of the diffusing agent is calculated using the following formula based on the degree of scattering according to the Mie theory, and is automatically calculated by the laser scattering particle size analyzer.

[0038] C = α·L - ln(T)

[0039] C: particle concentration α: Absorption coefficient (particle intrinsic property) L: Length of the path the light takes through the sample. T: Transparency

[0040] In the present invention, the particle radius (r) of the diffusing agent can be measured with a laser scattering particle size analyzer, and the average particle size may represent the average value of the particle sizes of 10 samples being measured.

[0041] In this invention, the wavelength (λ) can be measured using a spectral analyzer (manufacturer: Horiba, model name: LabSpec). The wavelength band of the light-emitting element entering the optical sensor can be measured.

[0042] In this invention, the beam angle indicates the range over which the light source emits light and can be measured with a goniotphotometer (manufacturer: Withlight, model name: OPI-305). Beam intensity distribution curve data can be obtained via the sensor of the goniotphotometer, and the beam angle can be calculated as the angle between two points where the intensity at the center of the beam decreases to 50% of its maximum value.

[0043] 1. Module A module according to one embodiment of the present invention includes a circuit board, a light-emitting element located on the circuit board, and a diffusion layer located on the light-emitting element, wherein the diffusion layer is manufactured using a diffusion layer manufacturing composition comprising a base resin containing a siloxane compound and a (meth)acrylic diffusion agent, the content of which of the (meth)acrylic diffusion agent is 1.0 to 10.0% by weight.

[0044] Figure 1 is a diagram illustrating a module according to one embodiment of the present invention.

[0045] Referring to Figure 1, module 100 consists of a circuit board 110, a light-emitting element 120, and a diffusion layer 130. The thickness of the diffusion layer 130 is indicated by t.

[0046] The following describes in detail a module according to one embodiment of the present invention.

[0047] 1) Circuit board The circuit board may include a printed circuit board (PCB). The printed circuit board may include one or more selected from metal core printed circuit boards, flexible printed circuit boards, ceramic printed circuit boards, and rigid printed circuit boards.

[0048] The circuit board may include a wiring layer, and the wiring layer may be electrically connected to the light-emitting element.

[0049] The circuit board may be provided with a connector, which can supply power to the light-emitting element. The connector may be located on the upper or lower surface of the circuit board.

[0050] 2) Light-emitting element Multiple light-emitting elements can be positioned on the circuit board. The light-emitting elements can be electrically connected in series, parallel, or series-parallel by the wiring layer.

[0051] The light-emitting element is a light-emitting diode chip capable of emitting light in at least one of the following colors: blue, red, green, ultraviolet, or infrared.

[0052] The light-emitting element can emit light from its upper surface and have a beam angle of 120° or more.

[0053] The light-emitting element can emit light from its side and have a beam angle of 140° or more.

[0054] The light-emitting element may also be a five-sided light-emitting element.

[0055] 3) Diffusion layer The diffusion layer is produced by a diffusion layer manufacturing composition comprising a base resin containing a siloxane compound and a (meth)acrylic diffusion agent, wherein the content of the (meth)acrylic diffusion agent is 1.0 to 10.0% by weight.

[0056] The diffusion layer can be manufactured by thermal curing the diffusion layer manufacturing composition, specifically by thermal curing the diffusion layer manufacturing composition two or more times.

[0057] The aforementioned diffusion layer manufacturing composition can be primary heat-cured at 35 to 65°C, preferably 40 to 60°C, and more preferably 45 to 55°C. When the above conditions are met, the diffusion agent can be uniformly distributed within the base resin, and the basic curing reaction can be carried out. Furthermore, the viscosity does not change abruptly during the heat-curing process, resulting in no bubbles being generated and the surface roughness being appropriately maintained.

[0058] The primary heat-cured diffusion layer production composition can be secondary heat-cured at 120-180°C, preferably 130-170°C, and more preferably 140-160°C. Meeting the above conditions prevents thermal decomposition and yellowing, resulting in improved optical performance and durability.

[0059] A light-emitting element can be in-mold into the diffusion layer. The diffusion layer makes it possible to achieve a uniform, high-brightness surface light source without applying another optical system.

[0060] The thickness of the diffusion layer may be 3 to 30 mm, preferably 3.5 to 25 mm, and more preferably 4.0 to 10.0 mm. When the above conditions are met, the light path is properly maintained, so diffusion is sufficiently achieved and the occurrence of hot spots where the light source is locally concentrated can be minimized. In addition, light can be emitted well from the diffusion layer, and the occurrence of dark areas due to a decrease in brightness can be minimized.

[0061] The aforementioned diffusion layer manufacturing composition comprises a base resin containing a siloxane compound and a (meth)acrylic diffusion agent, wherein the content of the (meth)acrylic diffusion agent is 3.0 to 7.0% by weight.

[0062] (1) Base resin The base resin contains a siloxane compound.

[0063] Conventionally, epoxy resins or UV resins used as base resins are prone to significant thermal discoloration due to their properties. However, because the aforementioned base resin contains a siloxane compound, it exhibits significantly less thermal discoloration compared to conventional base resins. As a result, modules manufactured using this diffusion agent composition are highly reliable and exhibit relatively superior color stability.

[0064] The siloxane compound may contain substituents represented by the following chemical formula 1.

[0065] [ka]

[0066] In the aforementioned chemical formula 1, R 11 ~R 13 These are, independently, hydrogen, C1~C 20 alkyl groups or C2-C 20 It is an alkenyl group, R 11 ~R 13 At least one of them is C2~C 20 It is the alkenyl group.

[0067] In the above Chemical Formula 1, R 11 ~R 13 are each independently, preferably, hydrogen, a C1-C 15 alkyl group or a C2-C 15 alkenyl group, and at least one of R 11 ~R 13 is a C2-C 15 alkenyl group; more preferably, hydrogen, a C1-C 10 alkyl group or a C2-C 10 alkenyl group, and at least one of R 11 ~R 13 is a C2-C 10 alkenyl group; most preferably, hydrogen, a C1-C5 alkyl group or a C2-C5 alkenyl group, and at least one of R 11 ~R 13 may be a C2-C5 alkenyl group.

[0068] Since the siloxane-based compound containing the substituent represented by the above Chemical Formula 1 contains an alkenyl group, it can participate in a crosslinking reaction, thereby forming or strengthening the polymer network in the base resin, and increasing durability and stability not only in the natural environment but also in harsh environments such as high temperature and chemical environments.

[0069] The base resin may contain one or more selected from the siloxane-based compounds represented by the following Chemical Formula 1-1, the siloxane-based compounds represented by the following Chemical Formula 1-2, and the siloxane-based compounds represented by the following Chemical Formula 1-3.

[0070]

Chemical Formula

[0071] In the above Chemical Formula 1-1, R 11-1 ~R 13-1 are each independently hydrogen, a C1-C 20 alkyl group or a C2-C 20It is an alkenyl group, R 11-1 ~R 13-1 At least one of them is C2~C 20 It is an alkenyl group, R 14-1 and R 15-1 Each of these is independently of hydrogen or C1~C 20 It is an alkyl group, R 16-1 is hydrogen, C1~C 20 alkyl groups or C2-C 20 It is an alkenyl group, n 1-1 The range is 100 to 500.

[0072] [ka]

[0073] In the above chemical formulas 1 and 2, R 11-2 ~R 13-2 These are, independently, hydrogen, C1~C 20 alkyl groups or C2-C 20 It is an alkenyl group, R 11-2 ~R 13-2 At least one of them is C2~C 20 It is an alkenyl group, R 14-2 ~R 17-2 These are, independently, hydrogen, C1~C 20 alkyl groups or C2-C 20 It is an alkenyl group, R 14-2 ~R 17-2 At least one of them is C2~C 20 It is an alkenyl group, R 18-2 ~R 20-2 These are, independently, hydrogen, C1~C 20 alkyl groups or C2-C 20 It is an alkenyl group, n 1-21 and n 1-22 The range is 100 to 500.

[0074] [ka]

[0075] In the above chemical formulas 1 and 3, R 11-3 ~R 13-3 These are, independently, hydrogen, C1~C 20 alkyl groups or C2-C 20 It is an alkenyl group, R 11-3 ~R 13-3 At least one of them is C2~C 20 It is an alkenyl group, R 14-3 ~R 24-3 These are, independently, hydrogen, C1~C 20 alkyl groups or C2-C 20 It is the alkenyl group.

[0076] In the above chemical formula 1-1, R 11-1 ~R 13-1 These are, independently, hydrogen, C1~C 15 alkyl groups or C2-C 15 It is an alkenyl group, R 11-1 ~R 13-1 At least one of them is C2~C 15 Alkenyl group; preferably hydrogen, C1-C 10 alkyl groups or C2-C 10 It is an alkenyl group, R 11-1 ~R 13-1 At least one of them is C2~C 10 an alkenyl group; more preferably hydrogen, a C1-C5 alkyl group or a C2-C5 alkenyl group, R 11-1 ~R 13-1 At least one of these may be a C2-C5 alkenyl group.

[0077] In the above chemical formula 1-1, R 14-1 and R 15-1 Each of these is independently preferably hydrogen or C1-C 15 alkyl groups; more preferably hydrogen or C1-C 10an alkyl group; most preferably, a hydrogen atom or a C1-C5 alkyl group.

[0078] In the above chemical formula 1-1, R 16-1 Preferably, hydrogen, C1-C 15 alkyl groups or C2-C 15 Alkenyl group; more preferably, hydrogen, C1-C 10 alkyl groups or C2-C 10 an alkenyl group; most preferably, hydrogen, a C1-C5 alkyl group, or a C2-C5 alkenyl group.

[0079] In the above chemical formula 1-1, n 1-1 This value may preferably be 100 to 400, more preferably 150 to 500, and most preferably 300 to 500. When the above conditions are met, light is diffused uniformly, and excellent light transmittance can be achieved.

[0080] In the above chemical formulas 1 and 2, R 11-2 ~R 13-2 Each of these is independently preferably hydrogen, C1-C 15 alkyl groups or C2-C 15 It is an alkenyl group, R 11-2 ~R 13-2 At least one of them is C2~C 15 Alkenyl group; more preferably, hydrogen, C1-C 10 alkyl groups or C2-C 10 It is an alkenyl group, R 11-2 ~R 13-2 At least one of them is C2~C 10 an alkenyl group; most preferably hydrogen, a C1-C5 alkyl group or a C2-C5 alkenyl group, R 11-2 ~R 13-2 At least one of these may be a C2-C5 alkenyl group.

[0081] In the above chemical formulas 1 and 2, R 14-2 ~R 17-2 Each of these is independently preferably hydrogen, C1-C 15alkyl groups or C2-C 15 It is an alkenyl group, R 14-2 ~R 17-2 At least one of them is C2~C 15 Alkenyl group; more preferably, hydrogen, C1-C 10 alkyl groups or C2-C 10 It is an alkenyl group, R 14-2 ~R 17-2 At least one of them is C2~C 10 an alkenyl group; most preferably hydrogen, a C1-C5 alkyl group or a C2-C5 alkenyl group, R 14-2 ~R 17-2 At least one of these may be a C2-C5 alkenyl group.

[0082] In the above chemical formulas 1 and 2, R 18-2 ~R 20-2 Each of these is independently preferably hydrogen, C1-C 15 alkyl groups or C2-C 15 Alkenyl group; more preferably, hydrogen, C1-C 10 alkyl groups or C2-C 25 an alkenyl group; most preferably, hydrogen, a C1-C5 alkyl group, or a C2-C5 alkenyl group; may also be present.

[0083] In the above chemical formulas 1 and 2, n 1-21 and n 1-22 This value may preferably be 100 to 400, more preferably 150 to 500, and most preferably 300 to 500. When the above conditions are met, light is diffused uniformly, and excellent light transmittance can be achieved.

[0084] In the above chemical formulas 1-3, R 11-3 ~R 13-3 Each of these is independently preferably hydrogen, C1-C 15 alkyl groups or C2-C 15 It is an alkenyl group, R 11-3 ~R 13-3 At least one of them is C2~C 15an alkenyl group; more preferably hydrogen, a C1-C10 alkyl group or a C2-C 10 It is an alkenyl group, R 11-3 ~R 13-3 At least one of them is C2~C 10 an alkenyl group; most preferably hydrogen, a C1-C5 alkyl group or a C2-C5 alkenyl group, R 11-3 ~R 13-3 At least one of these may be a C2-C5 alkenyl group.

[0085] In the above chemical formulas 1-3, R 14-3 ~R 24-3 Each of these is independently preferably hydrogen, C1-C 15 alkyl groups or C2-C 15 Alkenyl group; more preferably, hydrogen, C1-C 10 alkyl groups or C2-C 10 an alkenyl group; most preferably, hydrogen, a C1-C5 alkyl group, or a C2-C5 alkenyl group; may also be present.

[0086] The siloxane compound represented by the above chemical formula 1-1 may also be a siloxane compound represented by the following chemical formula 1-1-1.

[0087] [ka]

[0088] In the aforementioned chemical formula 1-1-1, n 1-1-1 The range is 100 to 500.

[0089] In the above chemical formula 1-1-1, n 1-1-1 This value may preferably be 100 to 400, more preferably 150 to 300, and most preferably 300 to 500. When the above conditions are met, light is diffused uniformly, and excellent light transmittance can be achieved.

[0090] The siloxane compound represented by the above chemical formula 1-2 may also be a siloxane compound represented by the following chemical formula 1-2-1.

[0091] [ka]

[0092] In the aforementioned chemical formula 1-2-1, n 1-21-1 and n 1-22-1 Each of these ranges independently from 100 to 500.

[0093] In the aforementioned chemical formula 1-2-1, n 1-21-1 and n 1-22-1 Each of these values ​​may be independently preferably 100 to 400, more preferably 150 to 300, and most preferably 300 to 500. When the above conditions are met, light is diffused uniformly, and excellent light transmittance can be achieved.

[0094] The siloxane compound represented by the above chemical formula 1-3 may also be a siloxane compound represented by the following chemical formula 1-3-1.

[0095] [ka]

[0096] On the other hand, the base resin may be a mixture containing two or more siloxane compounds that include the substituent represented by chemical formula 1. Specifically, the base resin may be a mixture containing two or more compounds selected from the siloxane compound represented by chemical formula 1-1, the siloxane compound represented by chemical formula 1-2, and the siloxane compound represented by chemical formula 1-3.

[0097] The base resin containing the aforementioned mixture can maximize the performance of modules containing light-emitting elements, specifically automotive modules containing light-emitting elements, in various aspects such as improved heat resistance, chemical resistance, water resistance, optical properties, mechanical strength, thermal conductivity, and environmental friendliness. As a result, it can guarantee a long module lifespan, excellent performance, and stability, enabling the module to operate reliably even in extreme environments. In particular, when the base resin contains the siloxane compound represented by chemical formulas 1-3, it can improve light diffusion and optical uniformity, allowing for efficient light transmission.

[0098] Furthermore, the base resin may contain 70.0 to 90.0% by weight, preferably 73.0 to 86.0% by weight, and more preferably 76.0 to 83.0% by weight, of the siloxane compound represented by chemical formula 1-1, relative to the total weight of the base resin. When the above conditions are met, the physical stability and durability of the diffusion layer produced by the diffusion layer manufacturing composition can be improved, and the reduction in processability and transmittance can be minimized. As a result, even with long-term use, the module containing this diffusion layer will experience less performance degradation and increased resistance to environmental changes. Consequently, the module containing this diffusion layer can be applied to automotive signal lamps requiring high reliability.

[0099] The base resin may contain 1.0 to 20.0% by weight, preferably 2.0 to 15.0% by weight, and more preferably 4.0 to 11.0% by weight, of the siloxane compound represented by chemical formulas 1-2, relative to the total weight of the base resin. When the above conditions are met, chemical stability is enhanced, and the chemical resistance and environmental resistance of the diffusion layer produced by the diffusion layer production composition can be improved. In addition, the mechanical strength of the diffusion layer can be appropriately maintained, and the decrease in flexibility and permeability can be minimized.

[0100] The base resin may contain 5.0 to 25.0% by weight, preferably 7.0 to 21.0% by weight, and more preferably 10.0 to 17.0% by weight, of the siloxane compound represented by chemical formulas 1-3, relative to the total weight of the base resin. When the above conditions are met, the transparency, surface hardness, chemical resistance, and durability of the diffusion layer produced by the diffusion layer production composition can be improved. Furthermore, the surface of this diffusion layer can be produced more uniformly. In addition, the reduction in processability and transmittance of this diffusion layer can be minimized.

[0101] On the other hand, the base resin may further contain a siloxane compound represented by the following chemical formula 2.

[0102] [ka]

[0103] In the aforementioned chemical formula 2, R 21 ~R 29 Each of these is independently of hydrogen or C1~C 20 It is an alkyl group, n 2-1 and n 2-2 Each of these values ​​is independent and ranges from 1 to 100.

[0104] In the above chemical formula 2, R 21 ~R 29 Each of these is independently preferably hydrogen or C1-C 15 alkyl groups; more preferably hydrogen or C1-C 10 an alkyl group; most preferably, hydrogen or a C1-C5 alkyl group; may also be used.

[0105] In the aforementioned chemical formula 2, n 2-1 and n 2-2 Each of these can be independently preferably 1 to 80, more preferably 1 to 60, and most preferably 1 to 40. When the above conditions are met, the reactivity is not high and it can be chemically stable.

[0106] The siloxane compound represented by chemical formula 2 may also be a siloxane compound represented by the following chemical formula 2-1.

[0107] [ka]

[0108] In the aforementioned chemical formula 2-1, n 2-1-1 and n 2-2-1 Each of these values ​​is independent and ranges from 1 to 100.

[0109] In the aforementioned chemical formula 2, n 2-1-1 and n 2-2-1 Each of these can be independently preferably 1 to 80, more preferably 1 to 60, and most preferably 1 to 40. When the above conditions are met, the reactivity is not high and it can be chemically stabilized.

[0110] The base resin may contain 1.0 to 26.0% by weight of the siloxane compound represented by chemical formula 2, preferably 1.5 to 23.0% by weight, and more preferably 2.0 to 20.0% by weight, relative to the total weight of the base resin. When the above conditions are met, the diffusion layer produced by the diffusion layer production composition can maintain stability even in high-temperature environments, and its chemical resistance and durability can be further improved. Furthermore, the flexibility of this diffusion layer is excellent, and its shock absorption capacity can be improved.

[0111] The base resin may contain 74.0 to 99.0% by weight; preferably 77.0 to 98.5% by weight; more preferably 80.0 to 98.0% by weight; of the total weight of the base resin, a siloxane compound containing the substituent represented by chemical formula 1. When the above conditions are met, the diffusion layer produced by the diffusion layer production composition can maintain stability even in high-temperature environments, and its chemical resistance and durability can be further improved. Furthermore, the flexibility of this diffusion layer is excellent, and its shock absorption capacity can be improved.

[0112] If the base resin contains a siloxane compound represented by chemical formula 2, the base resin may contain one or more compounds from among the siloxane compound represented by chemical formula 1-1, the siloxane compound represented by chemical formula 1-2, and the compound represented by chemical formula 1-3.

[0113] On the other hand, the viscosity of the base resin may be 4,000 to 10,000 cP, preferably 4,000 to 8,000 cP, and more preferably 4,000 to 6,000 cP. When the above conditions are met, it is possible to ensure fluidity with an appropriate amount of viscosity, which facilitates manufacturing and processing, prevents particle sedimentation, and maintains a uniform distribution of particles.

[0114] Here, the viscosity of the base resin can be measured at 25°C in accordance with ASTM D445 or ASTM D2196. Viscosity can be measured using a rotational viscometer, where the resistance force generated when the sample is rotated after being placed in a specific standard fixture or carrier can be measured to analyze the viscosity.

[0115] The base resin can be a commercially available substance, and specifically, one or more selected from SL3512A and SL3512B manufactured by KCC Corporation can be used.

[0116] (2) (meth)acrylic diffusing agent The (meth)acrylic diffusing agent not only has excellent compatibility with the base resin described above, but also improves diffusivity, enabling the production of a diffusion layer composition that can realize a high-brightness surface light source.

[0117] The (meth)acrylic diffusing agent may include one or more selected from polyalkyl (meth)acrylate; polyalkyl (meth)acrylate-co-polystyrene; a mixture of polyalkyl (meth)acrylate and polycarbonate; a mixture of polyalkyl (meth)acrylate and silica; and a mixture of polyalkyl (meth)acrylate and polyoxymethylene.

[0118] Here, the polyalkyl (meth)acrylate may have a crosslinked or uncrosslinked structure, and the polyalkyl (meth)acrylate may be polymethyl methacrylate.

[0119] The (meth)acrylic diffusing agent may have an average particle size of 0.5 to 5.0 μm, preferably 1.0 to 4.5 μm, and more preferably 1.5 to 4.0 μm. Even if the luminosity decreases as the average particle size increases, if the above conditions are met, the module manufactured with the diffusion layer manufacturing composition can achieve excellent transmittance.

[0120] The (meth)acrylic diffusing agent is preferably a spherical particle with excellent permeability, as uniform gaps exist between the particles due to their arrangement.

[0121] The (meth)acrylic diffusing agent may have a refractive index of 1.450 to 1.540, preferably 1.465 to 1.525, and more preferably 1.480 to 1.510. A higher refractive index causes excessive refraction of light, which can lead to light being trapped. However, satisfying the above conditions can achieve excellent optical efficiency.

[0122] The aforementioned diffusion layer manufacturing composition may contain 1.0 to 10.0% by weight, preferably 3.0 to 8.0% by weight, and more preferably 4.0 to 6.0% by weight, of the (meth)acrylic diffusion agent. If a smaller amount than the above conditions is included, the diffusion effect may be insufficient, and a hot spot phenomenon may occur where the light source is locally concentrated. If an excessive amount is included, the optical performance may deteriorate due to excessive scattering, and a problem of reduced brightness may occur.

[0123] The diffusion layer manufacturing composition may contain the base resin in a remainder amount such that the total weight of the diffusion layer manufacturing composition is 100% by weight.

[0124] Hereinafter, preferred embodiments are presented to facilitate understanding of the present invention. However, these embodiments are illustrative of the present description, and it will be obvious to a person of the skill that various changes and modifications are possible within the scope of the present description and the technical concept, and it goes without saying that such variations and modifications fall within the scope of the appended claims.

[0125] Examples and Comparative Examples The following is a description of the components used in the examples and comparative examples below.

[0126] 1) Base resin (1) Mixture of siloxane compounds: Mix SL3512A (trade name, manufacturer: KCC Co., Ltd., a mixture of the siloxane compound represented by chemical formula 1-1-1, the siloxane compound represented by chemical formula 1-2-1, and the siloxane compound represented by chemical formula 1-3-1) and SL3512B (trade name, manufacturer: KCC Co., Ltd., a mixture of the siloxane compound represented by chemical formula 1-1-1 and the siloxane compound represented by chemical formula 2-1) in a weight ratio of 3:1.

[0127] 2) Diffusing agent (1) Cross-linked polymethyl methacrylate (cross-linked PMMA, average particle size: 2 μm, refractive index: 1.495, specific gravity: 1.2 g / mm³) 3 (Form: spherical, heat distortion temperature: 280℃)

[0128] <Manufacturing of compositions for producing diffusion layers> A composition for producing a diffusion layer was prepared using the base resin and diffusion agent in the amounts listed in Tables 1 to 3 below.

[0129] <Module Manufacturing> After placing circuit boards with light-emitting elements arranged in the molding spaces of the lower molds into which the diffusion layer manufacturing compositions of the examples and comparative examples were injected, thermal curing was performed. Specifically, after placing the circuit boards so that the light-emitting elements were immersed in the molding spaces of the lower molds into which the diffusion layer manufacturing compositions of the examples and comparative examples were injected, the molds were placed in a vacuum oven. Subsequently, primary curing was performed at 50°C for 60 minutes, followed by secondary curing at 150°C for 90 minutes to manufacture the modules.

[0130] Experimental Example 1 The physical properties of the modules in the examples and comparative examples were evaluated using the method described below, and the results are shown in Tables 1 to 3 below.

[0131] 1) Average luminance (unit: nit): Measured using a luminance meter (manufacturer: Konica Minolta, model name: CS-2000). Specifically, the sample light source was set perpendicular to the surface of the light source at a reference measurement distance of 1 m. Then, nine grid points at predetermined intervals were selected and the luminance was measured individually, and the arithmetic mean of the luminance values ​​of all measured points was calculated.

[0132] 2) Luminance Standard Deviation (unit: nit): This is an index used to evaluate the luminance uniformity of a light source, indicating how far the luminance at each measurement point deviates from the average luminance. The luminance deviation was calculated by calculating the standard deviation using the average and each luminance measurement value.

[0133] 3) Central Luminous Intensity (unit: cd): This refers to the light intensity (unit: cd) at the center (horizontal 0°, vertical 0°). Central luminous intensity is used to evaluate the light distribution characteristics of automotive lighting systems and was measured using a vehicle light distribution unit (manufacturer: Impress Sensor & Systems, model name: LMK 598). The vehicle light distribution unit's optical sensor senses and measures the intensity of light output from the module.

[0134] [Table 1]

[0135] [Table 2]

[0136] [Table 3]

[0137] Referring to Tables 1 to 3 above, it can be seen that Examples 1 to 10, which have a cross-linked PMMA content of 1.0 to 10.0% by weight, have a lower central luminosity of below 80 cd compared to Comparative Examples 1 to 5, which have a cross-linked PMMA content exceeding 10.0% by weight.

[0138] Furthermore, while the standard deviation decreased and the brightness uniformity improved as the cross-linked PMMA content increased, the standard deviation increased again when comparing Example 10 with Comparative Example 1. In other words, it was found that even if the concentration of cross-linked PMMA increases, the brightness standard deviation does not improve, and no significant change occurs once it reaches a predetermined level. In addition, it was found that the central luminosity of Comparative Examples 1 to 5 was too low. [Explanation of symbols]

[0139] 100 modules 110 Circuit board 120 light-emitting elements 130 Diffusion layer t: Thickness of the diffusion layer

Claims

1. The circuit board includes a light-emitting element located on the circuit board and a diffusion layer located on the light-emitting element. The module is manufactured using a diffusion layer manufacturing composition comprising a base resin containing a siloxane compound and a (meth)acrylic diffusion agent, wherein the content of the (meth)acrylic diffusion agent is 1.0 to 10.0% by weight.

2. The module according to claim 1, wherein the diffusion layer is a single layer covering the light-emitting element.

3. The module according to claim 1, wherein the light-emitting element emits light from its upper surface and has a beam angle of 120° or more.

4. The module according to claim 1, wherein the light-emitting element emits light from the side and has a beam angle of 140° or more.

5. The module according to claim 1, wherein the siloxane compound comprises a substituent represented by the following chemical formula 1. 【Chemistry 1】 In the aforementioned chemical formula 1, R １１ to R １３ are each independently hydrogen, C １ to C ２０ alkyl group or C ２ to C ２０ alkenyl group, and at least one of R １１ to R １３ is a C ２ to C ２０ alkenyl group.

6. The module according to claim 1, wherein the base resin comprises one or more compounds selected from the following chemical formulas: 1-1, 1-2, and 1-3. 【Chemistry 2】 In the aforementioned chemical formula 1-1, R １１－１ ~R １３－１ These are, independently, hydrogen and C １ ~C ２０ alkyl group or C ２ ~C ２０ It is an alkenyl group, R １１－１ ~R １３－１ At least one of them is C ２ ~C ２０ It is an alkenyl group, R １４－１ and R １５－１ Each of them is independently of hydrogen or C １ ~C ２０ It is an alkyl group, R １６－１ is hydrogen, C １ ~C ２０ alkyl group or C ２ ~C ２０ It is an alkenyl group, n １－１ The range is 100 to 500. 【Transformation 3】 In the above chemical formula 1-2, R １１－２ ~R １３－２ These are, independently, hydrogen and C １ ~C ２０ alkyl group or C ２ ~C ２０ It is an alkenyl group, R １１－２ ~R １３－２ At least one of them is C ２ ~C ２０ It is an alkenyl group, R １４－２ ~R １７－２ These are, independently, hydrogen and C １ ~C ２０ alkyl group or C ２ ~C ２０ It is an alkenyl group, R １４－２ ~R １７－２ At least one of them is C ２ ~C ２０ It is an alkenyl group, R １８－２ ~R ２０－２ These are, independently, hydrogen and C １ ~C ２０ alkyl group or C ２ ~C ２０ It is an alkenyl group, n １－２１ and n １－２２ The range is 100 to 500. 【Chemistry 4】 In the above chemical formulas 1 and 3, R １１－３ ~R １３－３ These are, independently, hydrogen and C １ ~C ２０ alkyl group or C ２ ~C ２０ It is an alkenyl group, R １１－３ ~R １３－３ At least one of them is C ２ ~C ２０ It is an alkenyl group, R １４－３ ~R ２４－３ These are, independently, hydrogen and C １ ~C ２０ alkyl group or C ２ ~C ２０ It is the alkenyl group.

7. The module according to claim 6, wherein the siloxane compound represented by chemical formula 1-1 is a siloxane compound represented by the following chemical formula 1-1-1. 【Transformation 5】 In the aforementioned chemical formula 1-1-1, n １－１－１ The range is 100 to 500.

8. The module according to claim 6, wherein the siloxane compound represented by chemical formula 1-2 is a siloxane compound represented by the following chemical formula 1-2-1. 【Transformation 6】 In the aforementioned chemical formula 1-2-1, n １－２１－１ and n １－２２－１ Each of these ranges independently from 100 to 500.

9. The module according to claim 6, wherein the siloxane compound represented by chemical formula 1-3 is a siloxane compound represented by the following chemical formula 1-3-1. 【Transformation 7】

10. The base resin is 70.0 to 90.0% by weight of the siloxane compound represented by the chemical formula 1-1, 1.0 to 20.0% by weight of the siloxane compound represented by the above chemical formulas 1-2, The module according to claim 6, comprising 5.0 to 25.0% by weight of a siloxane compound represented by the chemical formulas 1-3.

11. The module according to claim 1, wherein the base resin comprises a siloxane compound represented by the following chemical formula 2. 【Transformation 8】 In the aforementioned chemical formula 2, R ２１ ~R ２９ Each of them is independently of hydrogen or C １ ~C ２０ It is an alkyl group, n ２－１ and n ２－２ Each of these ranges independently from 1 to 100.

12. The module according to claim 11, wherein the siloxane compound represented by chemical formula 2 is a siloxane compound represented by the following chemical formula 2-1. 【Chemistry 9】 In the aforementioned chemical formula 2-1, n ２－１－１ and n ２－２－１ Each of these ranges independently from 1 to 100.

13. The module according to claim 11, wherein the base resin contains 1.0 to 26.0% by weight of a siloxane compound represented by the chemical formula 2.

14. The module according to claim 1, wherein the (meth)acrylic diffusing agent comprises one or more selected from polyalkyl (meth)acrylate; polyalkyl (meth)acrylate-co-polystyrene; a mixture of polyalkyl (meth)acrylate and polycarbonate; a mixture of polyalkyl (meth)acrylate and silica; and a mixture of polyalkyl (meth)acrylate and polyoxymethylene.

15. The module according to claim 1, wherein the (meth)acrylic diffusing agent has an average particle size of 0.5 to 5.0 μm.

Images