Composite electronic components and their mounting substrates

Abstract

To provide a composite electronic component with reduced mounting volume. [Solution] The composite electronic component includes a main body 110(210) which includes a capacitance forming section containing a dielectric layer 111(211) and internal electrodes 121(221), 122(222), and cover sections 112(212), 113(213) arranged on both sides of the capacitance forming section in a first direction Z, and a pair of stacked electronic components 100(200) which have external electrodes 131(231), 132(232) arranged in a second direction X perpendicular to the first direction of the main body and are arranged to be in contact with each other in the first direction, wherein the cover sections of the pair of stacked electronic components are designated as the first cover section if they are adjacent to each other in the first direction, and the cover sections that are not adjacent to each other in the first direction are designated as the second cover section, and when the average dimension of one dielectric layer in the first direction is td, the average dimension of one first cover section in the first direction is tc1, and the average dimension of one second cover section in the first direction is tc2, then 0.5 × td ≤ tc1

Description

[Technical Field]

[0001] This invention relates to a composite electronic component and its mounting substrate. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] Such multilayer ceramic capacitors can be used as components in various electronic devices due to their advantages of being small, yet guaranteeing high capacitance, and being easy to implement. As various electronic devices such as computers and mobile devices become smaller and more powerful, the demand for smaller and higher-capacitance multilayer ceramic capacitors is increasing.

[0004] These multilayer ceramic capacitors have recently been applied to power drive systems in automobiles, and automotive multilayer ceramic capacitors are required to have excellent high-temperature reliability, humidity resistance, and shock resistance. In particular, cracks can occur in the ceramic body due to external shocks, acoustic noise, and bending stress, leading to component failure. To compensate for this, the shock resistance of the component is improved by methods such as attaching a metal frame to the external electrodes to mitigate external shocks.

[0005] However, in configurations where a frame is attached to multiple multilayer ceramic capacitors, some configurations of the multilayer ceramic capacitors have the problem of excessively protecting the region that forms the capacitance, resulting in an unnecessary mounting volume. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 11-373021 [Overview of the project] [Problems that the invention aims to solve]

[0007] One of the problems that this invention aims to solve is to provide a composite electronic component with reduced mounting volume.

[0008] One of the problems that this invention aims to solve is to provide a composite electronic component with improved dielectric capacitance characteristics.

[0009] One of the problems that this invention aims to solve is to provide a composite electronic component with improved voltage withstand characteristics.

[0010] However, some of the problems that the present invention aims to solve are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0011] The composite electronic component according to an embodiment of the present invention includes a capacitance forming portion including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, a main body including cover portions arranged on both surfaces of the capacitance forming portion in the first direction, and a plurality of multilayer electronic components including external electrodes arranged in a second direction perpendicular to the first direction of the main body. The plurality of multilayer electronic components include a pair of multilayer electronic components arranged to be in contact with each other in the first direction. Among the cover portions of the pair of multilayer electronic components, the cover portions arranged at positions adjacent to each other in the first direction are defined as first cover portions, and the cover portions arranged at positions not adjacent to each other in the first direction are defined as second cover portions. When the average dimension of one dielectric layer in the first direction is td, the average dimension of one first cover portion in the first direction is tc1, and the average dimension of one second cover portion in the first direction is tc2, 0.5×td≦tc1<tc2 can be satisfied.

[0012] The composite electronic component according to an embodiment of the present invention includes a capacitance forming portion including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, a main body including cover portions arranged on both surfaces of the capacitance forming portion in the first direction, and a plurality of multilayer electronic components including external electrodes arranged in a second direction perpendicular to the first direction of the main body. The plurality of multilayer electronic components are arranged to be in contact with each other in the first direction. Among the cover portions of the plurality of multilayer electronic components, the cover portions arranged at positions adjacent to each other in the first direction are defined as first cover portions, and the cover portions arranged at positions not adjacent to each other in the first direction are defined as second cover portions. When the average dimension of one dielectric layer in the first direction is td, the average dimension of one first cover portion in the first direction is tc1, and the average dimension of one second cover portion in the first direction is tc2, 0.5×td≦tc1<tc2 can be satisfied.

[0013] The mounting substrate of the composite electronic component according to another embodiment of the present invention includes a substrate, electrode pads arranged on the substrate, and the composite electronic component, and the composite electronic component can be mounted on the substrate so as to be joined to the electrode pads.

Effect of the Invention

[0014] One of the effects of the present invention is to reduce the mounting volume of the composite electronic component.

[0015] One of the effects of the present invention is to improve the capacitance characteristics of the composite electronic component.

[0016] One of the effects of the present invention is to improve the withstand voltage characteristics of the composite electronic component.

[0017] However, the various beneficial advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0018] [Figure 1] A perspective view of a composite electronic component according to an embodiment of the present invention is schematically shown. [Figure 2] A cross-sectional view taken along line I-I' of FIG. 1 is schematically shown. [Figure 3] A cross-sectional view taken along line II-II' of FIG. 1 is schematically shown. [Figure 4] A perspective view of a composite electronic component according to another embodiment of the present invention is schematically shown. [Figure 5] A cross-sectional view taken along line III-III' of FIG. 4 is schematically shown. [Figure 6] A mounting substrate of a composite electronic component in which the composite electronic component of FIG. 1 is mounted on a substrate is schematically shown.

Modes for Carrying Out the Invention

[0019] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of the ordinary skill. Accordingly, the shapes and sizes of elements in the drawings may be exaggerated for the sake of clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0020] Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the explanation have been omitted, and the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation; therefore, the present invention is not necessarily limited to what is shown. Components with the same function within the scope of the same concept will be described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a component, this does not exclude other components unless otherwise stated, but rather means that other components may be further included.

[0021] In drawings, the Z direction can be defined as the first direction, the lamination direction, or the thickness T direction; the X direction as the second direction or the length L direction; and the Y direction as the third direction or the width W direction.

[0022] Multilayer electronic components Figure 1 schematically shows a perspective view of a composite electronic component according to one embodiment of the present invention, Figure 2 schematically shows a cross-sectional view along the line I-I' in Figure 1, Figure 3 schematically shows a cross-sectional view along the line II-II' in Figure 1, Figure 4 schematically shows a perspective view of a composite electronic component according to another embodiment of the present invention, Figure 5 schematically shows a cross-sectional view along the line III-III' in Figure 4, and Figure 6 schematically shows a mounting substrate of a composite electronic component on which the composite electronic component of Figure 1 is mounted.

[0023] Hereinafter, with reference to FIGS. 1 to 6, a multilayer electronic component according to an embodiment of the present invention will be described in detail. However, as an example of the multilayer electronic component, a multilayer ceramic capacitor will be described, but the present invention can also be applied to various electronic products using a dielectric composition, such as an inductor, a piezoelectric element, a varistor, or a thermistor.

[0024] A composite electronic component 10 according to an embodiment of the present invention includes a capacitance forming portion Ac including a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111 in a first direction, a main body 110 including cover portions 112 and 113 arranged on both surfaces of the capacitance forming portion Ac in the first direction, and external electrodes 131 and 132 arranged in a second direction perpendicular to the first direction of the main body 110. The multilayer electronic component 100 includes a plurality of (100, 200) multilayer electronic components 100. The plurality of multilayer electronic components 100 and 200 include a pair of multilayer electronic components 100 and 200 arranged to be in contact with each other in the first direction. Among the cover portions 112, 113, 212, and 213 of the pair or plurality of multilayer electronic components, the cover portions arranged adjacent to each other in the first direction are defined as first cover portions 112 and 212, and the cover portions arranged not adjacent to each other in the first direction are defined as second cover portions 113 and 213. When the average dimension of one dielectric layer 111 in the first direction is td, the average dimension of one first cover portion 112 and 212 in the first direction is tc1, and the average dimension of one second cover portion 113 and 213 in the first direction is tc2, 0.5×td≦tc1<tc2 can be satisfied.

[0025] Hereinafter, the multilayer electronic component 100 will be described in more detail. Unless otherwise inconsistent, the description of the multilayer electronic component 100 can be similarly applied to other plurality of multilayer electronic components 200, 300, and 400. <000012><0>

[0026] " The main body 110 may have the dielectric layer 111 and the internal electrodes 121 and 122 alternately laminated.

[0027] More specifically, the main body 110 may include a capacitance forming section Ac which is located inside the main body 110 and includes first internal electrodes 121 and second internal electrodes 122 that are alternately arranged facing each other with a dielectric layer 111 in between, thereby forming a capacitance.

[0028] There are no particular restrictions on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be a hexahedron or a similar shape. Due to the shrinkage of the ceramic particles contained in the main body 110 during the firing process, the main body 110 may not be a perfectly straight hexahedron, but may have a substantially hexahedron shape.

[0029] The main body 110 may have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and facing each other in a third direction.

[0030] The multiple dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0031] The raw materials for forming the dielectric layer 111 are not limited as long as sufficient capacitance can be obtained. Generally, perovskite (ABO3) materials can be used, such as barium titanate materials, lead-composite perovskite materials, or strontium titanate materials. Barium titanate materials can include BaTiO3 ceramic particles, and examples of ceramic particles include BaTiO3, and BaTiO3 in which Ca (calcium), Zr (zirconium), etc., are partially dissolved (BaTiO3). 1-x Ca x )TiO3(0 <x<1)、Ba(Ti 1-y Ca y )O3(0 <y<1)、(Ba 1-x Ca x )(Ti 1-y Zry )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0032] Also, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to particles such as barium titanate (BaTiO3) according to the purpose of the present invention as raw materials for forming the dielectric layer 111.

[0033] On the other hand, in order to distinguish from the dielectric layers included in the cover portions 112 and 113 and the side margin region described later, the dielectric layer included in the capacitance forming portion Ac can be defined as the first dielectric layer, the dielectric layer included in the cover portions 112 and 113 can be defined as the second dielectric layer, and the dielectric layer formed by one method for forming the side margin region can be defined as the third dielectric layer. And the first to third dielectric layers may be the same, or at least a part thereof may be different. However, unless there are special circumstances, in the present invention, the description of the dielectric layer can correspond to the description of the first dielectric layer.

[0034] And since the first dielectric layer and the second dielectric layer can be formed using a dielectric material such as barium titanate (BaTiO3), they can include a dielectric microstructure after firing. The dielectric microstructure includes a plurality of crystal grains, grain boundaries disposed between adjacent crystal grains, and triple points disposed at points where three or more grain boundaries meet, and can include a plurality of crystal grains, grain boundaries, and triple points respectively.

[0035] The dimension td in the first direction of the dielectric layer 111 does not particularly need to be limited.

[0036] However, in order to improve the dielectric strength characteristics of the multilayer electronic component 100, the dimension td of the dielectric layer 111 in the first direction may be 10.0 μm or less, 9.0 μm or less, 8.0 μm or less, 6.0 μm or less, 5.0 μm or less, 4.0 μm or less, 3.0 μm or less, 2.0 μm or less, or 1.0 μm or less. To more easily achieve miniaturization and high capacitance, it may be 0.8 μm or less, 0.6 μm, or 0.4 μm or less.

[0037] Here, the dimension td of the dielectric layer 111 in the first direction can mean the dimension td of the dielectric layer 111 positioned between the first internal electrode 121 and the second internal electrode 122 in the first direction.

[0038] On the other hand, the dimension td of the dielectric layer 111 in the first direction can mean the dimension, distance, size, or length of the dielectric layer 111 in the first direction, or it can mean the thickness of the dielectric layer.

[0039] In this case, the dimension td of the dielectric layer 111 in the first direction may be a concept that includes the dimension td of at least one of the multiple dielectric layers 111 in the first direction, or it may be a concept that includes the dimension td of each of the dielectric layers 111 in the first direction.

[0040] Furthermore, the dimension td of the dielectric layer 111 in the first direction can mean the average dimension td of one dielectric layer 111 in the first direction, the average dimension td of each of multiple dielectric layers 111 in the first direction, or the average dimension td of multiple dielectric layers 111 in the first direction.

[0041] On the other hand, the average dimension td of a dielectric layer 111 in the first direction described in the present invention can be measured by scanning the cross-section of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average dimension td of a dielectric layer 111 in the first direction can mean the average value calculated by measuring the dimension of the dielectric layer 111 in the first direction at five equally spaced points in the second direction in the scanned image.

[0042] Furthermore, by extending this average value measurement to three dielectric layers 111 and measuring the average value, the average dimension td in the first direction of multiple dielectric layers 111 can be further generalized.

[0043] The internal electrodes 121 and 122 may be stacked alternately with the dielectric layer 111.

[0044] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122, which are arranged alternately facing each other across the dielectric layer 111 that constitutes the main body 110, and can be exposed on the third surface 3 and the fourth surface 4 of the main body 110, respectively.

[0045] More specifically, the first internal electrode 121 can be separated from the fourth surface 4 and exposed via the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed via the fourth surface 4. The first external electrode 131 is positioned on the third surface 3 of the main body 110 and connected to the first internal electrode 121, and the second external electrode 132 is positioned on the fourth surface 4 of the main body 110 and connected to the second internal electrode 122.

[0046] In other words, the first internal electrode 121 is not connected to the second external electrode 132, but can be connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131, but can be connected to the second external electrode 132. In this case, the first internal electrode 121 and the second internal electrode 122 can be electrically isolated from each other by the dielectric layer 111 placed in between them.

[0047] On the other hand, the main body 110 can be formed by alternately stacking a first ceramic green sheet printed with a paste for the first internal electrode, which will become the first internal electrode 121, and a second ceramic green sheet printed with a paste for the second internal electrode, which will become the second internal electrode 122, and then firing them.

[0048] The materials forming the internal electrodes 121 and 122 are not particularly limited, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0049] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of the following onto a ceramic green sheet: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. While screen printing or gravure printing can be used as the printing method for the conductive paste for internal electrodes, the present invention is not limited thereto.

[0050] On the other hand, the dimension te of the internal electrodes 121 and 122 in the first direction does not need to be particularly limited, and in the following, the explanation of the dimension te of the internal electrodes 121 and 122 in the first direction can mean the dimension te of the first internal electrode 121 and the second internal electrode 122, respectively.

[0051] To achieve miniaturization and high capacitance of the stacked electronic component 100, the dimension te of the internal electrodes 121 and 122 in the first direction may be 3.0 μm or less, 2.0 μm or less, or 1.0 μm or less. To more easily achieve ultra-miniaturization and high capacitance, the dimension te of the internal electrodes 121 and 122 in the first direction may be 0.8 μm or less, or 0.6 μm or less, and more preferably 0.4 μm or less.

[0052] In this case, the dimension te of the internal electrodes 121 and 122 in the first direction may be a concept that includes the dimension te of at least one of the multiple internal electrodes 121 and 122 in the first direction, or it may be a concept that includes the dimension te of all internal electrodes 121 and 122 in the first direction.

[0053] Here, the dimension te of the internal electrodes 121 and 122 in the first direction can mean the dimension, distance, size, or length of the internal electrodes 121 and 122 in the first direction, or it can mean the thickness of the internal electrodes 121 and 122.

[0054] In this case, the dimension te of the internal electrodes 121 and 122 in the first direction may be a concept that includes the dimension te of at least one of the multiple internal electrodes 121 and 122 in the first direction, or it may be a concept that includes the dimension te of each of the internal electrodes 121 and 122 in the first direction.

[0055] Furthermore, the dimension te of the internal electrodes 121 and 122 in the first direction can mean the average dimension te of one internal electrode 121 or 122 in the first direction, or the average dimension te of each of multiple internal electrodes 121 or 122 in the first direction, or the average dimension te of multiple internal electrodes 121 or 122 in the first direction.

[0056] The average dimension te of the internal electrodes 121 and 122 in the first direction can be measured by scanning the cross-section of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average dimension te of one internal electrode 121 or 122 can be calculated as the average value obtained by measuring the dimension in the first direction at five equally spaced points in the second direction of the single internal electrode in the scanned image. These five equally spaced points can be specified in the capacitance forming section Ac. Furthermore, by extending this measurement of average values ​​to three internal electrodes 121 and 122, the average dimension te of multiple internal electrodes 121 and 122 in the first direction can be further generalized.

[0057] On the other hand, the main body 110 may include cover portions 112 and 113 arranged on both end surfaces (or both sides) of the capacity forming portion Ac in the first direction.

[0058] The cover portions 112 and 113 can be formed by arranging a single second dielectric layer or two or more second dielectric layers on both sides of the capacitance forming portion Ac in the first direction, respectively, or by stacking them in the first direction, and can essentially serve to prevent damage to the internal electrodes 121 and 122 due to physical or chemical stress.

[0059] The cover portions 112 and 113 do not include internal electrodes 121 and 122 and may contain a dielectric material. That is, the cover portion may contain a dielectric material, for example, a barium titanate (BaTiO3) based dielectric material.

[0060] Furthermore, the cover portions 112 and 113 may contain at least one of magnesium (Mg), tin (Sn), zirconium (Zr), aluminum (Al), calcium (Ca), silicon (Si), and gallium (Ga) in order to improve mechanical or electrical properties.

[0061] On the other hand, the dimensions of the cover portions 112 and 113 in the first direction do not need to be particularly limited.

[0062] However, in order to improve the reliability of the stacked electronic component 100 in a high-voltage environment, the dimensions tc1 and tc2 of the cover portions 112 and 113 in the first direction may be 300 μm or less, 250 μm or less, 200 μm or less, 150 μm or less, or 100 μm or less. In order to more easily achieve miniaturization and high capacitance, the dimensions tc1 and tc2 of the cover portions 112 and 113 in the first direction may be 100 μm or less or 50 μm or less, preferably 30 μm or less, and more preferably 20 μm or less for ultra-small products.

[0063] Here, the dimensions tc1 and tc2 of the cover portions 112 and 113 in the first direction can mean the dimensions, distance, size, or length of the cover portions 112 and 113 in the first direction, or they can mean the thickness of the cover portions 112 and 113.

[0064] Furthermore, the dimensions tc1 and tc2 of the cover portions 112 and 113 in the first direction can refer to the average dimensions tc1 and tc2 of the respective cover portions 112 and 113 arranged on both sides of the volume forming portion Ac in the first direction.

[0065] The average dimensions tc1 and tc2 of the cover portions 112 and 113 in the first direction can be measured by scanning the cross-section of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, in an image scanned from one cover portion, the average value can be calculated by measuring the dimensions in the first direction at five equally spaced points in the second direction, and the average dimensions in the first direction of other cover portions can be determined in this manner.

[0066] On the other hand, in the stacked electronic component 100, the region between the capacitance forming portion Ac and both sides of the main body 110 in the third direction can be designated as side margin regions 114 and 115.

[0067] More specifically, the side margin regions 114 and 115 can mean the region 114 between the internal electrodes 121 and 122 and the fifth surface 5, and the region 115 between the internal electrodes 121 and 122 and the sixth surface 6, and unless otherwise contradictory, the description of the side margin regions 114 and 115 can be the description of the region 114 between the internal electrodes 121 and 122 and the fifth surface 5, and the region 115 between the internal electrodes 121 and 122 and the sixth surface 6, respectively.

[0068] As shown in the figure, the side margin regions 114 and 115 can refer to the regions between the ends of the first internal electrode 121 and the second internal electrode 122 in the third direction and the surface of the main body 110, with reference to the cross-sections of the main body 110 in the first and third directions.

[0069] The side margin regions 114 and 115 can be interpreted as the ceramic green sheet region excluding the internal electrodes 121 and 122 when the paste for the internal electrodes is applied to the ceramic green sheet applied to the volume-forming portion Ac, excluding the areas that will become the side margin regions 114 and 115.

[0070] Alternatively, the side margin regions 114 and 115 can be formed by applying conductive paste to the ceramic green sheet applied to the capacitance forming portion Ac, except for the areas where the side margin regions 114 and 115 are formed, to form the internal electrodes 121 and 122. To suppress the step caused by the internal electrodes 121 and 122, the laminated internal electrodes 121 and 122 can be cut so that they are exposed in the third direction, and then a single third dielectric layer or two or more third dielectric layers can be formed by arranging or laminating them in the third direction on both end surfaces (end-surfaces) of the capacitance forming portion Ac in the third direction.

[0071] The side margin regions 114 and 115 can essentially serve to prevent damage to the internal electrodes 121 and 122 due to physical or chemical stress.

[0072] The side margin regions 114 and 115 do not include the internal electrodes 121 and 122 and may be made of the same material as the first dielectric layer 111, for example, they may correspond to a part of the first dielectric layer 111. That is, the side margin regions 114 and 115 may contain dielectric material, for example, barium titanate (BaTiO3) based dielectric material.

[0073] On the other hand, the third-direction dimension wm' of the side margin regions 114 and 115 does not need to be particularly limited, and in the following, the explanation of the third-direction dimension wm' of the side margin regions 114 and 115 can mean the third-direction dimension wm' of the region 114 between the internal electrodes 121 and 122 and the fifth surface 5, and the region 115 between the internal electrodes 121 and 122 and the sixth surface 6.

[0074] To more easily achieve miniaturization and increased capacitance of the stacked electronic component 100, the third-direction dimension wm' of the side margin regions 114 and 115 may be 50 μm or less, preferably 30 μm or less, and more preferably 20 μm or less for ultra-small products.

[0075] Here, the third-direction dimension wm' of the side margin regions 114 and 115 can mean the dimension, distance, size, or length of the side margin regions 114 and 115 in the third direction, or it can mean the width of the side margin regions 114 and 115.

[0076] Furthermore, the third-direction dimension wm' of the side margin regions 114 and 115 can represent the average third-direction dimension wm' of each side margin region 114 and 115.

[0077] The average dimension wm' in the third direction of the side margin regions 114 and 115 can be measured by scanning the cross-section of the main body 110 in the first and third directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, it can mean the average value calculated by measuring the dimension in the third direction at five equally spaced points in the first direction in an image scanned from one side margin region, and the average dimension in the third direction of other side margin regions can be determined in this way.

[0078] One embodiment of the present invention describes a structure in which a stacked electronic component 100 has two external electrodes 131 and 132. However, the number and shape of the external electrodes 131 and 132 can be changed according to the form of the internal electrodes 121 and 122 or other purposes.

[0079] The external electrodes 131 and 132 are positioned on the main body 110 and can be connected to the internal electrodes 121 and 122.

[0080] More specifically, the external electrodes 131 and 132 may include a first external electrode 131 and a second external electrode 132, which are arranged on the third surface 3 and the fourth surface 4 of the main body 110, respectively, and connected to a first internal electrode 121 and a second internal electrode 122, respectively. That is, the first external electrode 131 can be arranged on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 can be arranged on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0081] Furthermore, the external electrodes 131 and 132 may be arranged extending to a portion of the first surface 1 and the second surface 2 of the main body 110, or extending to a portion of the fifth surface 5 and the sixth surface 6 of the main body 110. That is, the first external electrode 131 can be arranged on the third surface 3 of the main body 110 and a portion of the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6 of the main body 110, and the second external electrode 132 can be arranged on the fourth surface 4 of the main body 110 and a portion of the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6 of the main body 110.

[0082] The external electrodes 131 and 132 may be formed from any material that has electrical conductivity, such as metal, and the specific material may be determined by considering electrical properties, structural stability, etc. Furthermore, they may have a multilayer structure.

[0083] For example, the external electrodes 131 and 132 may include first electrode layers 131a and 132a placed on the main body 110, and second electrode layers 131b and 132b placed on the first electrode layers 131a and 132a.

[0084] Here, it is preferable that the first electrode layers 131a, 132a and the second electrode layers 131b, 132b are distinct from each other. However, it is not limited to this, and they may be separated according to the order of the manufacturing process, and the first electrode layers 131a, 132a and the second electrode layers 131b, 132b may be observed as a single layer without being distinguished from each other.

[0085] In this invention, "distinguished" can mean, but is not limited to, two layers being distinguishable by physical differences, chemical differences, and / or simple optical differences, however, the distinction between layers can be made by the presence or absence of an "interface." An interface can mean a surface in which two layers in contact with each other are distinguishable from one another, for example, by differences in components determined by EDS analysis in equipment such as a scanning electron microscope (SEM).

[0086] The first electrode layers 131a and 132a may be formed by transferring a sheet containing a conductive metal onto the main body 110, or by applying a conductive paste for external electrodes containing a conductive metal to the main body 110 and then firing it, or by dipping the main body 110 in a conductive paste for external electrodes containing a conductive metal, but are not limited to these methods.

[0087] As a more specific example for the first electrode layers 131a and 132a, the first electrode layers 131a and 132a may be fired electrodes containing a conductive metal and glass.

[0088] The conductive metal contained in the first electrode layers 131a and 132a can be a material with excellent electrical conductivity. For example, the conductive metal may include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, but is not particularly limited thereto.

[0089] Furthermore, the glass contained in the first electrode layers 131a and 132a can play a role in improving the bonding with the main body 110.

[0090] The second electrode layers 131b and 132b can play a role in improving mounting characteristics, and may be plated layers formed on the first electrode layers 131a and 132a by a plating method, but are not particularly limited thereto.

[0091] The types of the second electrode layers 131b and 132b are not particularly limited and may include, for example, at least one of nickel (Ni), tin (Sn), silver (Ag), palladium (Pd), and alloys thereof.

[0092] The second electrode layers 131b and 132b may be a single layer or multiple layers.

[0093] More specifically, for example, the second electrode layers 131b and 132b may be nickel (Ni) electrode layers or tin (Sn) electrode layers, and may be configured such that nickel (Ni) electrode layers and tin (Sn) electrode layers are formed sequentially on the first electrode layers 131a and 132a, or may be configured such that tin (Sn) electrode layers, nickel (Ni) electrode layers, and tin (Sn) electrode layers are formed sequentially. Furthermore, the second electrode layers 131b and 132b may include multiple nickel (Ni) electrode layers and / or multiple tin (Sn) electrode layers.

[0094] There is no particular need to limit the sizes of the 100, 200, 300, and 400 multilayer electronic components.

[0095] However, in order to improve reliability under high-voltage environments, the effects of the present invention may become more pronounced in multilayer electronic components 100, 200, 300, and 400 of size 3216 (length × width: 3.2 mm × 1.6 mm, length and width satisfying an error of ±10%) or larger (e.g., 3216, 3225, 4520, 4532, 5750, 5763 sizes).

[0096] In addition, in order to simultaneously achieve miniaturization and high capacity, the thicknesses of the dielectric layer and the internal electrodes must be reduced and the number of laminations increased. Therefore, in multilayer electronic components 100, 200, 300, 400 with dimensions of 2012 (length × width: 2.0 mm × 1.2 mm, with length and width satisfying an error of within ±10%) or less (such as 2012, 1005, 0603, 0402 sizes), the effects of the present invention can be more显著.

[0097] Hereinafter, the composite electronic component 10 according to an embodiment of the present invention will be described in more detail.

[0098] First, in an embodiment of the present invention, the composite electronic component 10 can include a plurality of multilayer electronic components 100, 200, and the plurality of multilayer electronic components 100, 200 can be arranged to be adjacent in a first direction. That is, a pair of multilayer electronic components 100, 200 may be arranged to be adjacent in the first direction.

[0099] In the drawings, a pair of multilayer electronic components 100, 200 are shown arranged to be adjacent in the first direction, but it is not particularly limited thereto, and three or more multilayer electronic components, that is, a plurality of multilayer electronic components, may be arranged to be adjacent in the first direction.

[0100] In the present invention, for convenience of explanation, each multilayer electronic component can be defined as a first multilayer electronic component 100, a second multilayer electronic component 200, and the like.

[0101] Among the cover portions 112, 113, 212, 213 of the plurality of multilayer electronic components 100, 200, the cover portions arranged adjacent to each other in the first direction are defined as first cover portions 112, 212, and the cover portions arranged not adjacent to each other in the first direction are defined as second cover portions 113, 213. When the average dimension in the first direction of one dielectric layer 111 is td, the average dimension in the first direction of one first cover portion 112, 212 is tc1, and the average dimension in the first direction of one second cover portion 213, 313 is tc2, 0.5 × td ≤ tc1 < tc2 can be satisfied.

[0102] By satisfying 0.5×td≦tc1<tc2 for the plurality of multilayer electronic components 100 and 200 included in the composite electronic component 10, the capacitance can be improved and the withstand voltage characteristics can be made more excellent. This can be achieved by reducing the unnecessary thickness of the cover part and adjusting the thickness of the dielectric layer and the internal electrodes accordingly, or by increasing the number of layers, but is not particularly limited thereto.

[0103] More specifically, referring to FIG. 2, the average dimension in the first direction of any one of the plurality of dielectric layers 111 of the first multilayer electronic component 100 or the average dimension in the first direction of any one of the plurality of dielectric layers 211 of the second multilayer electronic component 200 can be defined as td.

[0104] Among the cover parts 112 and 113 of the first multilayer electronic component 100, the cover part arranged at a position adjacent to the second multilayer electronic component 200 in the first direction can be defined as the first cover part 112, and the cover part arranged at a position not adjacent to the second multilayer electronic component 200 in the first direction can be defined as the second cover part 113. Similarly, among the cover parts 212 and 213 of the second multilayer electronic component 200, the cover part arranged at a position adjacent to the first multilayer electronic component 100 in the first direction can be defined as the first cover part 212, and the cover part arranged at a position not adjacent to the first multilayer electronic component 100 in the first direction can be defined as the second cover part 213. Then, the average dimension in the first direction of the first cover part 112 of the first multilayer electronic component 100 and the first cover part 212 of the second multilayer electronic component 200 can be defined as tc1, and the average dimension in the first direction of the second cover part 113 of the first multilayer electronic component 100 and the second cover part 213 of the second multilayer electronic component 200 can be defined as tc2.

[0105] In the present invention, the first cover portions 112 and 212 can refer to the first cover portion 112 of the first stacked electronic component 100 and the first cover portion 212 of the second stacked electronic component 200, respectively, and similarly, the second cover portions 113 and 213 can refer to the second cover portion 113 of the first stacked electronic component 100 and the second cover portion 213 of the second stacked electronic component 200, respectively.

[0106] On the other hand, when the three stacked electronic components are arranged so as to be in contact with the first direction, the two cover portions of the intermediate stacked electronic component that are positioned in the first direction of the capacitance forming portion may both be first cover portions whose average dimension in the first direction is tc1.

[0107] Arranging multiple stacked electronic components 100, 200 so that they are in contact in a first direction can mean that the same external electrodes are in contact with each other, or that a conductive adhesive is placed between the external electrodes, and the components are arranged so that the conductive adhesive is included in the contact.

[0108] For example, the first external electrode 131 of the first stacked electronic component and the first external electrode 231 of the second stacked electronic component may be arranged to be in contact with each other, or the second external electrode 132 of the first stacked electronic component and the second external electrode 232 of the second stacked electronic component may be arranged to be in contact with each other.

[0109] When a conductive adhesive is applied, it can mean that the conductive adhesive is placed between the first external electrode 131 of the first stacked electronic component and the first external electrode 231 of the second stacked electronic component, and is applied and positioned to connect the first external electrode 131 of the first stacked electronic component and the first external electrode 231 of the second stacked electronic component. Similarly, it can mean that the conductive adhesive is placed between the second external electrode 132 of the first stacked electronic component and the second external electrode 232 of the second stacked electronic component, and is applied and positioned to connect the second external electrode 132 of the first stacked electronic component and the second external electrode 232 of the second stacked electronic component.

[0110] Conductive adhesives can be formed using any material that has electrical conductivity, such as metals, and the specific material may be determined by considering electrical properties, structural stability, etc.

[0111] To distinguish it from the conductive adhesive placed between the external electrodes and the metal frame, which will be described later, the conductive adhesive placed between the external electrodes can be defined as the first conductive adhesive, and the conductive adhesive placed between the external electrodes and the metal frame can be defined as the second conductive adhesive.

[0112] When multiple stacked electronic components 100 and 200 are arranged so as to be in contact only in a first direction, the average dimension wm' in the third direction of each of the side margin regions 114, 115, 214, and 215 of the multiple stacked electronic components 100 and 200 can be substantially constant. Here, the statement that the average dimension wm' in the third direction of each of the side margin regions 114, 115, 214, and 215 is substantially constant means that the average of the maximum and minimum values ​​of the average dimensions in the third direction of each of the side margin regions 114, 115, 214, and 215 satisfies an error range of ±10%.

[0113] On the other hand, in one embodiment of the present invention, the first cover portion 112 and the second cover portion 113 may have different compositions.

[0114] In this invention, the concept of "different compositions" includes cases where the elements are different from each other, and cases where the elements are the same but in different amounts.

[0115] As described above, the cover portions 112 and 113 may contain at least one of magnesium (Mg), tin (Sn), zirconium (Zr), aluminum (Al), calcium (Ca), silicon (Si), and gallium (Ga) in order to improve mechanical or electrical properties, and the first cover portion 112 and the second cover portion 113 may contain different minor elemental components.

[0116] Here, even if the same element is present, different content means that the content of the second element relative to 100 at% of the first element differs by 3 at% or more. Here, the first and second elements may both be present in the first cover portion 112 and the second cover portion 113. For example, if the first cover portion 112 and the second cover portion 113 contain titanium (Ti) and magnesium (Mg), and the atomic percentage of magnesium (Mg) relative to 100 at% of titanium (Ti) in the first cover portion 112 is α at%, and the atomic percentage of magnesium (Mg) relative to 100 at% of titanium (Ti) in the second cover portion 113 is β at%, then if 3 at% ≤ |α - β| is satisfied, then the compositions of the first cover portion 112 and the second cover portion 113 can be said to be different. Here, atomic percentage can refer to the average atomic percentage, and atomic percentage can be determined using equipment such as scanning electron microscopes (SEM), transmission electron microscopes (TEM), and scanning transmission electron microscopes (STEM) by methods such as EDS analysis.

[0117] On the other hand, in one embodiment of the present invention, the first cover portion 112 and the second cover portion 113 may have different porosity levels.

[0118] Here, the statement that the porosity of the first cover portion 112 and the second cover portion 113 are different can mean that the difference between the porosity of the first cover portion 112 and the porosity of the second cover portion 113, measured using the same measuring equipment or method, is 5% or more, and can mean that the porosity of the first cover portion 112 is smaller.

[0119] By reducing the porosity of the first cover portion 112, which has a relatively small average dimension in the first direction, the sintering density of the first cover portion 112 can be improved, thereby improving its mechanical properties.

[0120] On the other hand, in another embodiment of the present invention, a plurality of stacked electronic components can be further arranged to contact in the third direction. More specifically, referring to FIGS. 4 and 5 for explanation, the first stacked electronic component 100 and the second stacked electronic component 200 are arranged to contact in the first direction, the third stacked electronic component 300 and the fourth stacked electronic component 400 are arranged to contact in the first direction, and the first stacked electronic component 100 and the second stacked electronic component 200 and the third stacked electronic component 300 and the fourth stacked electronic component 400 can be arranged to contact in the third direction.

[0121] In the drawings, it shows that a pair of stacked electronic components 100, 200 and another pair of stacked electronic components 300, 400 are arranged to contact in the third direction, but it is not particularly limited thereto, and three or more stacked electronic components, that is, a plurality of stacked electronic components may be arranged to contact in the third direction.

[0122] Among the side margin regions 114', 115', 214', 215', 314', 315', 414', 415' of the plurality of stacked electronic components 100, 200, 300, 400, the side margin regions arranged at positions adjacent to each other in the third direction are defined as the first side margin regions 114', 214', 314', 414', and the side margin regions arranged at positions not adjacent to each other are defined as the second side margin regions 115', 215', 315', 415'. When the average dimension in the third direction of one first side margin region 114', 214', 314', 414' is wm1' and the average dimension in the third direction of one second side margin region 115', 215', 315', 41 five' is wm2', wm1' < wm2' can be satisfied.

[0123] When the plurality of stacked electronic components 100, 200, 300, 400 included in the composite electronic component 10 satisfy wm1' < wm2', the effective area of the internal electrodes can be improved to increase the capacitance, and the impact resistance can be improved.

[0124] In this case, wm2'-wm1' is preferably 10 μm or more, 20 μm or more, 30 μm or more, 40 μm or more, 50 μm or more, or 100 μm or more, 110 μm or more, 120 μm or more, or 125 μm or more, but is not particularly limited to these.

[0125] More specifically, of the side margin regions 114' and 115' of the first stacked electronic component 100, the side margin region located adjacent to the third stacked electronic component 300 in the third direction can be designated as the first side margin region 114', and the side margin region located not adjacent to the third stacked electronic component 300 in the third direction can be designated as the second side margin region 115'. Of the side margin regions 214' and 215' of the second stacked electronic component 200, the side margin region located adjacent to the fourth stacked electronic component 400 in the third direction can be designated as the first side margin region 214', and the side margin region located not adjacent to the fourth stacked electronic component 400 in the third direction can be designated as the second side margin region 215'. Of the side margin regions 314' and 315' of the third stacked electronic component 300, the side margin region located adjacent to the first stacked electronic component 100 in the third direction can be designated as the first side margin region 314', and the side margin region located not adjacent to the first stacked electronic component 100 in the third direction can be designated as the second side margin region 315'. Of the side margin regions 414' and 415' of the fourth stacked electronic component 400, the side margin region located adjacent to the second stacked electronic component 200 in the third direction can be designated as the first side margin region 414', and the side margin region located not adjacent to the second stacked electronic component 200 in the third direction can be designated as the second side margin region 415'.

[0126] Furthermore, the average dimension in the third direction of the first side margin region 114' of the first stacked electronic component 100, the first side margin region 214' of the second stacked electronic component 200, the first side margin region 314' of the third stacked electronic component 300, and the first side margin region 414' of the fourth stacked electronic component 400 can be set to wm1', and the average dimension in the third direction of the second side margin region 115' of the first stacked electronic component 100, the second side margin region 215' of the second stacked electronic component 200, the second side margin region 315' of the third stacked electronic component 300, and the second side margin region 415' of the fourth stacked electronic component 400 can be set to wm2'.

[0127] In the present invention, the first side margin regions 114', 214', 314', and 414' can mean the first side margin region 114' of the first stacked electronic component 100, the first side margin region 214' of the second stacked electronic component 200, the first side margin region 314' of the third stacked electronic component 300, and the first side margin region 414' of the fourth stacked electronic component 400, respectively. Similarly, the second side margin regions 115', 215', 315', and 415' can mean the second side margin region 115' of the first stacked electronic component 100, the second side margin region 215' of the second stacked electronic component 200, the second side margin region 315' of the third stacked electronic component 300, and the second side margin region 415' of the fourth stacked electronic component 400, respectively.

[0128] On the other hand, if the three stacked electronic components are arranged so as to be in contact with the third direction, the two side margin regions of the intermediate stacked electronic component may both be first side margin regions where the average dimension in the third direction is wm1'.

[0129] A composite electronic component 10 according to one embodiment of the present invention may further include an insulating portion 600 disposed between the main bodies 110 and 210 of a plurality of stacked electronic components 100 and 200.

[0130] More specifically, the insulating portion 600 can be positioned between the body 110 of the first stacked electronic component and the body 210 of the second stacked electronic component in a first direction, and preferably, it can be positioned in contact with them.

[0131] The insulating portion 600 can prevent a short circuit from occurring between the two components as the thickness of the first cover portion 112 of the first stacked electronic component and the first cover portion 212 of the second stacked electronic component decreases. The insulating portion 600 can be made of any insulating material, such as epoxy resin, and a material with high thermal conductivity, such as alumina (Al2O3), can also be used to provide heat dissipation properties.

[0132] On the other hand, the composite electronic component 10 according to one embodiment of the present invention may include metal frames 501 and 502, and the metal frames 501 and 502 may include a first metal frame 501 positioned on the second direction of the first external electrode 131 and a second metal frame 502 positioned on the second direction of the second external electrode 132.

[0133] The metal frames 501 and 502 may include connecting portions positioned on the second direction of the external electrodes 131 and 132, and support portions connected to the connecting portions and positioned away from the first surface 1.

[0134] Here, the connection between the connecting part and the support part is not limited to a structure in which they are directly connected, but may also include a concept in which other configurations, such as connecting parts of various shapes, are located between the connecting part and the support part, and the connecting part and the support part are indirectly connected via these connecting parts.

[0135] The explanation has mainly focused on the arrangement of the first metal frame 501 and the second metal frame 502 on the second direction of the first external electrode 131 and the second external electrode 132 of the first stacked electronic component 100. However, unless there is a particular contradiction, the metal frames 501 and 502 can also be arranged on the second direction of the first external electrode 231 and the second external electrode 232 of the second stacked electronic component 200, and furthermore, on the second direction of the first external electrode 331, 431 and the second external electrode 332, 432 of the third stacked electronic component 300 and the fourth stacked electronic component 400.

[0136] Although not shown in the drawings, the composite electronic component 10 according to one embodiment of the present invention may further include a conductive adhesive disposed between the external electrodes 131, 132 and the metal frames 501, 502, connecting the external electrodes 131, 132 and the metal frames 501, 502. More specifically, the conductive adhesive is disposed between the external electrodes 131, 132 and the connection portion of the metal frames 501, 502, and can connect the external electrodes 131, 132 and the connection portion.

[0137] More specifically, the conductive adhesive can be placed between the first external electrode 131 and the first metal frame 501 to connect the first external electrode 131 and the first metal frame 501, and can be placed between the second external electrode 132 and the second metal frame 502 to connect the second external electrode 132 and the second metal frame 502.

[0138] The explanation has mainly focused on the placement of conductive adhesive between the first external electrode 131 and the second external electrode 132 of the first stacked electronic component 100 and the first metal frame 501 and the second metal frame 502. However, unless otherwise contradictory, conductive adhesive can also be placed between the first external electrode 231, 331, 431 and the second external electrode 232, 332, 432 of the second stacked electronic component 200, the third stacked electronic component 300, and the fourth stacked electronic component 400 and the metal frames 501 and 502.

[0139] Conductive adhesives can be formed using any material that has electrical conductivity, such as metals, and the specific material may be determined by considering electrical properties, structural stability, etc.

[0140] More specifically, for example, conductive adhesives may include, but are not limited to, one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0141] As described above, the conductive adhesive placed between the external electrode and the metal frame can be defined as the second conductive adhesive.

[0142] Mounting board for complex electronic components A mounting substrate 1000 for a composite electronic component according to another embodiment of the present invention includes a substrate 20, electrode pads 31 and 32 disposed on the substrate 20, and the composite electronic component 10 described above, and the composite electronic component 10 can be mounted on the substrate 20 such that it is in contact with the electrode pads 31 and 32.

[0143] In this embodiment, the description of the composite electronic component 10 is omitted because it overlaps with the description of the composite electronic component 10 described above.

[0144] The composite electronic component 10 can be connected to electrode pads 31 and 32 by solder (SOL) placed on the underside of metal frames 501 and 502. More specifically, the first metal frame 501 and the second metal frame 502 can be connected to the first electrode pad 31 and the second electrode pad 32, respectively. The solder (SOL) is applied in such a way that it does not rise to the first and second connection points of the metal frames 501 and 502, thereby reducing acoustic noise or vibration generated from the composite electronic component 10 and transmitted to the substrate 20.

[0145] The present invention will be described in more detail below through test examples, but this is intended to aid in a concrete understanding of the invention, and the scope of the present invention is not limited by the test examples.

[0146] (Example test) Test Example 1 corresponds to a 2-stack MLCC in which two 5750 (length × width: 5.7 mm × 5.0 mm) chips are arranged in contact in the first direction. The dielectric layer thickness was 5.2 μm, the number of layers was 450, and the thickness of each chip was 2.513 mm. In this case, the thickness of the first cover portion, which is located adjacent to the other chips, was fabricated to 250 μm, and the thickness of the second cover portion, which is located not adjacent to the other chips, was fabricated to 250 μm.

[0147] Test Example 2 corresponds to a 2-stack MLCC in which two 5750 (length × width: 5.7 mm × 5.0 mm) chips are arranged in contact in the first direction. The dielectric layer thickness was 5.1 μm, the number of layers was 467, and the thickness of each chip was 2.504 mm. In this case, the thickness of the first cover portion, which is located adjacent to the other chips, was fabricated to 125 μm, and the thickness of the second cover portion, which is located not adjacent to the other chips, was fabricated to 250 μm.

[0148] Table 1 below shows the basic specifications of Test Example 1 and Test Example 2 described above, as well as the dielectric strength and dielectric capacitance characteristics of each test example, which were evaluated and / or measured.

[0149] [Table 1]

[0150] Although the dielectric strength of Test Example 1 and Test Example 2 was the same at 10.1 V / μm, the dielectric capacitance of Test Example 1 was 92.75 μF, resulting in a capacitance efficiency of 99% relative to the target product, while the dielectric capacitance of Test Example 2 was 96.26 μF, resulting in a capacitance efficiency of 102% relative to the target product.

[0151] This confirms that, when two MLCCs are arranged in contact with each other, the capacitance characteristics improve without a decrease in voltage withstand characteristics, even if the thickness of the first cover portion located adjacent to each other is reduced.

[0152] Test Example 3 corresponds to a 2-stack MLCC in which two 5750 (length × width: 5.7 mm × 5.0 mm) chips are arranged in contact in the first direction. The dielectric layer thickness was 7.6 μm, the number of layers was 325, and the thickness of each chip was 2.506 mm. In this case, the thickness of the first cover portion, which is located adjacent to the other chips, was fabricated to 250 μm, and the thickness of the second cover portion, which is located not adjacent to the other chips, was fabricated to 250 μm.

[0153] Test Example 4 corresponds to a 2-stack MLCC in which two 5750 (length × width: 5.7 mm × 5.0 mm) chips are arranged in contact in the first direction. The dielectric layer thickness was 7.8 μm, the number of layers was 332, and the thickness of each chip was 2.512 mm. In this case, the thickness of the first cover portion, which is located adjacent to the other chips, was fabricated to 125 μm, and the thickness of the second cover portion, which is located not adjacent to the other chips, was fabricated to 250 μm.

[0154] Table 2 below shows the basic specifications for Test Example 3 and Test Example 4 described above, as well as the dielectric strength and dielectric capacitance characteristics of each test example, which were evaluated and / or measured.

[0155] [Table 2]

[0156] Although the capacitance efficiency for the target product was the same at 99% for both Test Example 3 and Test Example 4, the withstand voltage for Test Example 3 was evaluated as 9.9V / μm, while the withstand voltage for Test Example 4 was evaluated as 9.6V / μm.

[0157] This confirms that, when two MLCCs are arranged in contact with each other, the voltage withstand characteristics improve without a decrease in capacitance characteristics, even if the thickness of the first cover portion located adjacent to each other is reduced.

[0158] Although embodiments and test examples of the present invention have been described in detail above, the present invention is not limited by the embodiments and accompanying drawings described above, but is limited by the claims provided. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0159] Furthermore, the term "embodiment" as used in this invention does not mean that each "embodiment" is the same as another, but is provided to highlight and describe the unique and distinct features of each. However, the above-presented embodiments do not preclude their realization in combination with features of another embodiment. For example, even if a matter described in one particular embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description in the other embodiment that contradicts or is contrary to that matter.

[0160] The terms used in this invention are used solely to describe one embodiment and are not intended to limit the invention. In this context, singular expressions may include plural expressions unless the context clearly indicates otherwise. [Explanation of symbols]

[0161] 10: Composite electronic components 100, 200, 300, 400: Multilayer electronic components 110: Main unit 111: Dielectric layer 112, 113: Cover section 114', 115': Side margin area 121, 122: Internal electrode 131, 132: External electrode 1000: Mounting board for composite electronic components

Claims

1. The multilayer electronic component includes a capacitance forming section containing a dielectric layer and internal electrodes arranged alternately with the dielectric layer in a first direction, a main body containing cover sections arranged on both sides of the capacitance forming section in the first direction, and an external electrode arranged on a second direction perpendicular to the first direction of the main body. The plurality of stacked electronic components include a pair of stacked electronic components arranged to be in contact with each other in the first direction, A composite electronic component in which, among the cover portions of the pair of stacked electronic components, the cover portion arranged adjacent to each other in the first direction is called the first cover portion, and the cover portion arranged not adjacent to each other in the first direction is called the second cover portion, and the average dimension of one dielectric layer in the first direction is td, the average dimension of one first cover portion in the first direction is tc1, and the average dimension of one second cover portion in the first direction is tc2, such that 0.5 × td ≤ tc1 < tc2.

2. The composite electronic component according to claim 1, wherein the first cover portion and the second cover portion have different compositions.

3. The composite electronic component according to claim 1, further comprising an insulating portion disposed between the bodies of the plurality of stacked electronic components.

4. The composite electronic component according to claim 1, further comprising a metal frame disposed on the second direction of the external electrode.

5. The composite electronic component according to claim 4, further comprising a conductive adhesive disposed between the external electrode and the metal frame, and connecting the external electrode and the metal frame.

6. The composite electronic component further includes at least one of the plurality of stacked electronic components and an additional stacked electronic component arranged to be in contact with a third direction perpendicular to the first and second directions. In the aforementioned stacked electronic component, when the region between the capacitance forming portion and both sides of the main body in the third direction is defined as the side margin region, The composite electronic component according to claim 1, wherein, among the side margin regions of the plurality of stacked electronic components, side margin regions arranged adjacent to each other in the third direction are designated as a first side margin region, and side margin regions arranged not adjacent to each other are designated as a second side margin region, and when the average dimension of one first side margin region in the third direction is wm1', and the average dimension of one second side margin region in the third direction is wm2', the composite electronic component satisfies wm1' < wm2'.

7. The multilayer electronic component includes a capacitance forming section containing a dielectric layer and internal electrodes arranged alternately with the dielectric layer in a first direction, a main body containing cover sections arranged on both sides of the capacitance forming section in the first direction, and an external electrode arranged on a second direction perpendicular to the first direction of the main body. The plurality of stacked electronic components are arranged so as to be in contact with each other in the first direction. A composite electronic component in which, among the cover portions of the plurality of stacked electronic components, the cover portions arranged adjacent to each other in the first direction are designated as the first cover portion, and the cover portions arranged not adjacent to each other in the first direction are designated as the second cover portion, and the average dimension of one dielectric layer in the first direction is td, the average dimension of one first cover portion in the first direction is tc1, and the average dimension of one second cover portion in the first direction is tc2, such that 0.5 × td ≤ tc1 < tc2.

8. The composite electronic component according to claim 7, wherein the first cover portion and the second cover portion have different compositions.

9. The composite electronic component according to claim 7, further comprising an insulating portion disposed between the bodies of the plurality of stacked electronic components.

10. The composite electronic component according to claim 7, further comprising a metal frame positioned on the second direction of the external electrode.

11. The composite electronic component according to claim 10, further comprising a conductive adhesive disposed between the external electrode and the metal frame, and connecting the external electrode and the metal frame.

12. The composite electronic component further includes at least one of the plurality of stacked electronic components and an additional stacked electronic component arranged to be in contact with a third direction perpendicular to the first and second directions. In the aforementioned stacked electronic component, when the region between the capacitance forming portion and both sides of the main body in the third direction is defined as the side margin region, The composite electronic component according to claim 1, wherein, among the side margin regions of the plurality of stacked electronic components, side margin regions arranged adjacent to each other in the third direction are designated as a first side margin region, and side margin regions arranged not adjacent to each other are designated as a second side margin region, and when the average dimension of one first side margin region in the third direction is wm1', and the average dimension of one second side margin region in the third direction is wm2', the composite electronic component satisfies wm1' < wm2'.

13. circuit board and An electrode pad placed on the substrate, A composite electronic component according to any one of claims 1 to 12, A mounting substrate for a composite electronic component, wherein the composite electronic component is mounted on the substrate such that it is in contact with the electrode pads.

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