Multilayer electronic components

Abstract

We provide multilayer electronic components with excellent moisture resistance and reliability. [Solution] A stacked electronic component according to one embodiment of the present invention includes a ceramic body 110 including a dielectric layer 111 and internal electrodes arranged alternately with the dielectric layer, a capacitor including external electrodes 131 and 132 arranged on the ceramic body and connected to the internal electrodes 121 and 122, and an organic layer 140 arranged to cover at least a part of the outer surface of the capacitor and containing a crosslinked polymer containing one or more of a polydiacetylene polymer and a polystyrene polymer. The crosslinked polymer has a functional group containing one or more of a silane group, a phosphate group, a thiol group, a carboxyl group, and an isocyanate group.

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors mounted on printed circuit boards of various electronic products such as liquid crystal displays (LCDs), plasma display panels (PDPs), computers, smartphones, and mobile phones, where they play the role of charging or discharging electricity. Due to their small size, guaranteed high capacitance, and ease of mounting, these multilayer ceramic capacitors can be used as components in a wide variety of electronic devices.

[0003] Recently, one method being considered to improve the moisture resistance reliability of multilayer ceramic capacitors is to coat the surface of the capacitor with a water-repellent agent. Silane coupling agents are mainly used as water-repellent agents for coating multilayer ceramic capacitors, but in order to improve the lifespan of the water-repellent coating, research is needed on water-repellent agents with improved thermal and chemical stability. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2017-135239 [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] One of the several objectives of the present invention is to provide a multilayer electronic component with excellent moisture resistance reliability.

[0006] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0007] A stacked electronic component according to one embodiment of the present invention includes a ceramic body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, a capacitor including external electrodes disposed on the ceramic body and connected to the internal electrodes, and an organic layer disposed to cover at least a portion of the outer surface of the capacitor and containing a crosslinked polymer containing one or more polydiacetylene polymers and polystyrene polymers, wherein the crosslinked polymer may have functional groups containing one or more silane groups, phosphate groups, thiol groups, carboxyl groups and isocyanate groups.

[0008] A stacked electronic component according to one embodiment of the present invention includes a ceramic body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, a capacitor including external electrodes disposed on the ceramic body and connected to the internal electrodes, and an organic layer disposed to cover at least a portion of the outer surface of the capacitor and including a crosslinked polymer, wherein the crosslinked polymer includes repeating units derived from a self-assembled monomolecule, the self-assembled monomolecule includes a head portion and a link portion connected to the head portion, the head portion includes one or more of a silane group, a phosphate group, a thiol group, a carboxyl group, and an isocyanate group, and the link portion may have at least one carbon-carbon double bond. [Effects of the Invention]

[0009] One of the various effects of the present invention is that it can provide a multilayer electronic component with excellent moisture resistance reliability. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 2] It is a perspective view schematically showing a capacitor of a multilayer electronic component according to an embodiment of the present invention. [Figure 3] It is a cross-sectional view schematically showing a cut cross-section along the line I-I' in FIG. 1. [Figure 4] It is a cross-sectional view schematically showing a cut cross-section along the line II-II' in FIG. 1. [Figure 5] It is a schematic diagram schematically showing the formation process of an organic layer. [Figure 6a] It is a schematic diagram schematically showing an example of the formation process of an organic layer. [Figure 6b] It is a schematic diagram schematically showing an example of the formation process of an organic layer. [Figure 6c] It is a schematic diagram schematically showing an example of the formation process of an organic layer. [Figure 6d] It is a schematic diagram schematically showing an example of the formation process of an organic layer.

Embodiments for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be deformed into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to ordinary technicians. Therefore, the shape, size, etc. of the elements in the drawings can be exaggerated for a clearer explanation, and the elements indicated by the same reference numerals in the drawings are the same elements.

[0012] Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the explanation have been omitted, and the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation; therefore, the present invention is not necessarily limited to what is shown. Components with the same function within the scope of the same concept are described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a certain component, this does not exclude other components unless otherwise stated, but rather means that it may further include other components.

[0013] In the drawing, the first direction X can be defined as the thickness T direction, the second direction Y as the length L direction, and the third direction Z as the width W direction.

[0014] Multilayer electronic components Figure 1 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention, Figure 2 is a schematic perspective view of a capacitor of a multilayer electronic component according to one embodiment of the present invention, Figure 3 is a schematic cross-sectional view showing a cross section along the line I-I' in Figure 1, Figure 4 is a schematic cross-sectional view showing a cross section along the line II-II' in Figure 1, Figure 5 is a schematic diagram showing the organic layer formation process, and Figures 6a to 6d are schematic diagrams showing an example of the organic layer formation process.

[0015] Hereinafter, with reference to Figures 1 to 6d, a multilayer electronic component 1000 according to one embodiment of the present invention will be described in detail. Furthermore, a multilayer ceramic capacitor will be described as an example of a multilayer electronic component, but the present invention is not limited thereto and can be applied to various multilayer electronic components, such as inductors, piezoelectric elements, varistors, or thermistors.

[0016] The size of the stacked electronic component 1000 is not particularly limited, but the maximum length of the stacked electronic component 1000 in the second direction may be 0.1 mm to 6.0 mm, the maximum width of the stacked electronic component 1000 in the third direction may be 0.1 mm to 5.0 mm, and the maximum thickness of the stacked electronic component 1000 in the first direction may be 0.05 mm to 3.5 mm.

[0017] A stacked electronic component 1000 according to one embodiment of the present invention may include a capacitor 100 comprising a ceramic body 110 and external electrodes 131 and 132, and an organic layer 140.

[0018] The capacitor 100 may include a ceramic body 110 and external electrodes 131 and 132. The capacitor 100 may also be configured to perform the function of a multilayer electronic component 1000, for example, the function of forming capacitance.

[0019] There are no particular limitations on the specific shape of the ceramic body 110, but as shown in the figure, the ceramic body 110 can be hexahedral or a similar shape. Due to the shrinkage of the ceramic powder contained in the ceramic body 110 during the firing process, or due to the polishing process on the corners of the ceramic body 110, the ceramic body 110 may not be a perfectly straight hexahedral shape, but may have a substantially hexahedral shape.

[0020] The ceramic body 110 may include a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and facing each other in a third direction.

[0021] The ceramic body 110 may include dielectric layers 111 and internal electrodes 121 and 122 that are alternately arranged in a first direction with respect to the dielectric layers 111. The multiple dielectric layers 111 forming the ceramic body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0022] The dielectric layer 111 may mainly consist of a perovskite-type compound represented by ABO3, for example. The perovskite-type compound represented by ABO3 is, for example, BaTiO3, (Ba 1-x Cax )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3 and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5) can include one or more of them.

[0023] The average thickness td of the dielectric layer 111 is not particularly limited. The average thickness td of the dielectric layer 111 may be, for example, 0.1 μm to 20 μm, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.

[0024] The internal electrodes 121, 122 can include, for example, a first internal electrode 121 and a second internal electrode 122 that are alternately arranged in the first direction with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122, which are a pair of electrodes having different polarities, can be arranged to face each other with the dielectric layer 111 interposed therebetween.

[0025] The first internal electrode 121 is separated from the fourth surface 4 and can be connected to the first external electrode 131 on the third surface 3. The second internal electrode 122 is separated from the third surface 3 and can be connected to the second external electrode 132 on the fourth surface 4.

[0026] The conductive metal contained in the internal electrodes 121, 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys, and more preferably can include Ni, but the present invention is not limited thereto.

[0027] The average thickness te of the internal electrodes 121 and 122 is not particularly limited. The average thickness te of the internal electrodes 121 and 122 may be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0028] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 represent the average thickness of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction, respectively. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning the cross-sections of the ceramic body 110 in the first and second directions with a scanning electron microscope (SEM) at 10,000x magnification.

[0029] More specifically, the average thickness td of a dielectric layer 111 can be measured by taking the average value after measuring the thickness at multiple points on the dielectric layer 111, for example, at five points equally spaced in the second direction. Similarly, the average thickness te of internal electrodes 121 and 122 can be measured by taking the average value after measuring the thickness at multiple points on the internal electrodes 121 and 122, for example, at five points equally spaced in the second direction. The five equally spaced points can be specified in the capacitance forming section Ac.

[0030] On the other hand, if such average values ​​are measured for 10 dielectric layers 111 and 10 internal electrodes 121 and 122, and then the average values ​​are measured, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be further generalized.

[0031] The ceramic body 110 may include a capacitance forming portion Ac which is disposed inside the ceramic body 110 and includes first internal electrodes 121 and second internal electrodes 122 which are alternately arranged with respect to a dielectric layer 111 in between, and cover portions 112 and 113 which are disposed on both sides of the capacitance forming portion Ac facing each other in the first direction. The cover portions 112 and 113 may have a configuration similar to that of the dielectric layer 111, except that they do not include internal electrodes.

[0032] The average thickness tc of the cover portions 112 and 113 is not particularly limited. The average thickness tc of the cover portions 112 and 113 may be, for example, 150 μm or less, 100 μm or less, 30 μm or less, or 20 μm or less. The average thickness tc of the cover portions 112 and 113 may be, for example, 5 μm or more, 10 μm or more, or 30 μm or more. Here, the average thickness tc of the cover portions 112 and 113 refers to the average thickness of the first cover portion 112 and the second cover portion 113, respectively.

[0033] The average thickness tc of the cover portions 112 and 113 can mean the average thickness of the cover portions 112 and 113 in the first direction, and can be the average value of the thickness in the first direction measured at five equally spaced points in the cross-section of the ceramic body 110 in the first and second directions.

[0034] The ceramic body 110 may include margin portions 114 and 115 arranged on both sides of the capacitance forming portion Ac facing the third direction. The margin portions 114 and 115 may represent the regions between the ends of the internal electrodes 121 and 122 and the interface of the ceramic body 110 in cross-sections obtained by cutting the ceramic body 110 in the first and third directions. The margin portions 114 and 115 may have a configuration similar to the dielectric layer 111, except that they do not include the internal electrodes 121 and 122.

[0035] The average thickness tm of the margin portions 114 and 115 is not particularly limited. The average thickness tm of the margin portions 114 and 115 may be, for example, 100 μm or less, 20 μm or less, or 15 μm or less. The average thickness tm of the margin portions 114 and 115 may be, for example, 5 μm or more, or 10 μm or more. Here, the average thickness tm of the margin portions 114 and 115 refers to the average thickness of the first margin portion 114 and the second margin portion 115, respectively.

[0036] The average thickness tm of the margin portions 114 and 115 can mean the average thickness of the margin portions 114 and 115 in the third direction, and can be the average value of the thickness in the third direction measured at five equally spaced points in the cross-section of the ceramic body 110 in the first and third directions.

[0037] External electrodes 131 and 132 are arranged on the ceramic body 110 and can be connected to internal electrodes 121 and 122. For example, external electrodes 131 and 132 can be arranged on the third surface 3 and the fourth surface 4 of the ceramic body 110 and can extend onto parts of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. External electrodes 131 and 132 may include a first external electrode 131 arranged on the third surface 3 and connected to the first internal electrode 121, and a second external electrode 132 arranged on the fourth surface 4 and connected to the second internal electrode 122.

[0038] The external electrodes 131 and 132 may include connecting portions CP1 and CP2 located on the third or fourth surfaces 3 and 4, and band portions BP1 and BP2 extending from the connecting portions CP1 and CP2 onto the first surface 1 and the second surface 2, respectively. The first external electrode 131 may include a first connecting portion CP1 located on the third surface 3, and a first band portion BP1 extending from the first connecting portion CP1 onto the first surface 1 and the second surface 2, respectively. The second external electrode 132 may include a second connecting portion CP2 located on the fourth surface 4, and a second band portion BP2 extending from the second connecting portion CP2 onto the first surface 1 and the second surface 2, respectively. The band portions BP1 and BP2 may extend from the connecting portions CP1 and CP2 onto the fifth surface 5 and the sixth surface 6, respectively.

[0039] The type and form of the external electrodes 131 and 132 are not particularly limited and may have a multilayer structure. For example, the external electrodes 131 and 132 may include base electrode layers 131a and 132a that come into contact with the internal electrodes 121 and 122, and plating layers 131b and 132b that are placed on the base electrode layers 131a and 132a.

[0040] The base electrode layers 131a and 132a may be fired electrode layers containing metal and glass. The metal contained in the base electrode layers 131a and 132a may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or alloys containing these. The glass contained in the base electrode layers 131a and 132a may include, for example, one or more oxides of Ba, Ca, Zn, Al, B, and Si.

[0041] On the other hand, the base electrode layers 131a and 132a may consist only of a fired electrode layer, but the present invention is not limited thereto, and the base electrode layers 131a and 132a may also include a fired electrode layer containing metal and glass, and a resin electrode layer disposed on the fired electrode layer containing metal particles and resin.

[0042] The metal particles contained in the resin electrode layer may include one or more spherical particles and flake-shaped particles. The metal particles contained in the resin electrode layer may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn and / or alloys containing these. The resin contained in the resin electrode layer may include, for example, one or more epoxy resin, acrylic resin, and ethylcellulose.

[0043] The plating layers 131b and 132b may include, for example, Ni, Sn, Pd, and / or alloys containing these, and may be formed in multiple layers. The plating layers 131b and 132b may be, for example, a Ni plating layer or a Sn plating layer, and may be in a form in which the Ni plating layer and the Sn plating layer are formed sequentially. The plating layers 131b and 132b may also include multiple Ni plating layers and / or multiple Sn plating layers.

[0044] The drawing illustrates a structure in which the stacked electronic component 1000 has two external electrodes 131 and 132, but it is not limited to this, and the number and shape of the external electrodes 131 and 132 can be changed according to the form of the internal electrodes 121 and 122 or other purposes.

[0045] The multilayer electronic component 1000 may include an organic layer 140 that is arranged to cover at least a portion of the outer surface of the capacitor 100. For example, the organic layer 140 may be arranged to cover at least a portion of the outer surface of the ceramic body 110. The organic layer 140 may be arranged on at least one of the first surface 1, second surface 2, fifth surface 5, and sixth surface 6, for example. The organic layer 140 may be arranged continuously on the first surface 1, second surface 2, fifth surface 5, and sixth surface 6, for example.

[0046] In one embodiment, the organic layer 140 can be arranged so as to be in direct contact with the outer surface of the ceramic body 110. The organic layer 140 may be arranged so as to be in direct contact with at least one of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, for example. The first organic layer 140 may be arranged so as to be in direct contact with the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, respectively.

[0047] The organic layer 140 may be positioned to cover only a portion of the outer surface of the ceramic body 110. However, to more effectively improve the moisture resistance reliability of the multilayer electronic component 1000, the organic layer 140 may also be positioned to completely cover the area of ​​the outer surface of the ceramic body 110 that is not completely covered by the external electrodes 131 and 132. Here, the area of ​​the outer surface of the ceramic body 110 that is not covered by the external electrodes 131 and 132 can mean, for example, the area of ​​the ceramic body 110 that is exposed to the outside from between the first band portion BP1 and the second band portion BP2.

[0048] On the other hand, while the present invention only shows a structure in which the organic layer 140 is arranged to cover the outer surface of the ceramic body 110, the present invention is not limited thereto. For example, the organic layer 140 may be arranged to cover at least a portion of the outer surfaces of the external electrodes 131 and 132. The organic layer 140 may also be arranged to cover at least a portion of the outer surface of the ceramic body 110 and at least a portion of the outer surfaces of the external electrodes 131 and 132, respectively. The organic layer 140 may also be arranged to completely cover the outer surface of the capacitor 100. The organic layer 140 may also be arranged in an island-like manner on the outer surface of the capacitor 100. Furthermore, the organic layer 140 may include a first organic layer arranged to cover at least a portion of the outer surface of the ceramic body 110, and a second organic layer arranged to cover at least a portion of the external electrodes 131 and 132. The organic layer 140 may also have a multilayer structure composed of multiple layers.

[0049] The organic layer 140 may contain a crosslinked polymer. In the present invention, "crosslinked polymer" can mean a polymer containing a structure in which specific repeating units are crosslinked. The above crosslinked polymer may include, for example, one or more of polydiacetylene polymers and polystyrene polymers. However, the present invention is not limited thereto, and the above crosslinked polymer may also include one or more of polydiacetylene polymers, polystyrene polymers, silane-based crosslinked polymers, and boronic acid-based crosslinked polymers.

[0050] The above crosslinked polymer may have a functional group containing one or more of the following: a silane group, a phosphate group, a thiol group, a carboxyl group, and an isocyanate group. The organic layer 140 can be stably formed on the outer surface of the capacitor 100 via the above functional group, thereby improving the thermal and chemical stability of the organic layer 140.

[0051] Specifically, the functional groups can be located at the terminal ends of the crosslinked polymer that are close to the capacitor 100. This allows the functional groups to chemically bond with the outer surface of the capacitor 100. The chemical bond between the functional groups and the outer surface of the capacitor 100 may be, for example, a covalent bond. That is, the organic layer 140 may be chemically adsorbed onto the outer surface of the capacitor 100.

[0052] The functional groups of the crosslinked polymer can be determined by appropriately considering the main components of the outer surface of the capacitor 100 on which the organic layer 140 is placed, in order to ensure the thermal and chemical stability of the organic layer 140. For example, the main component constituting the outer surface of the ceramic body 110 may be ceramic, and the main component constituting the outer surfaces of the external electrodes 131 and 132 may be metal. When the organic layer 140 is arranged to cover the outer surface of the ceramic body 110, the functional groups can include one or more of silane groups and phosphate groups. The silane groups and phosphate groups may have better bonding strength with ceramics than with metals. Furthermore, when the organic layer 140 is arranged to cover the outer surfaces of the external electrodes 131 and 132, the functional groups can include thiol groups. The thiol groups may have better bonding strength with metals than with ceramics.

[0053] The above-mentioned crosslinked polymer may, for example, include repeating units derived from the self-assembled monomolecule 14. The repeating units derived from the self-assembled monomolecule 14 can mean repeating units having a structure obtained by polymerizing the self-assembled monomolecule 14. More specifically, the above-mentioned crosslinked polymer contained in the organic layer 140 may be formed by crosslinking (CS) between self-assembled monomolecule 14.

[0054] The self-assembled monolayer 14 can refer to the molecular structure of a self-assembled monolayer that spontaneously aligns and forms on the surface of the capacitor 100. The self-assembled monolayer 14 may include a head portion 14a and a link portion 14b connected to the head portion 14a. The link portion 14b may include a tail portion 14c located at the end of the link portion 14b.

[0055] The head portion 14a may contain one or more of the following: a silane group, a phosphate group, a thiol group, a carboxyl group, and an isocyanate group. This allows the head portion 14a to be chemically bonded to the surface of the capacitor 100. The head portion 14a can correspond to the functional group (FG) of the crosslinked polymer.

[0056] The link portion 14b plays a role in aligning each self-assembled monomolecule 14 and can exhibit hydrophobicity and water-repellent properties. The link portion 14b may have at least one carbon-carbon double bond to form a cross-linking bond (CS) between the self-assembled monomolecule 14. The type of link portion 14b is not particularly limited, but for example, it may include one or more aliphatic compounds having 5 or more carbon atoms and having at least one carbon-carbon double bond, and aromatic compounds having at least one carbon-carbon double bond.

[0057] The tail portion 14c may have hydrophobic functional groups to improve the moisture resistance reliability of the multilayer electronic component 1000, for example. The tail portion 14c may contain one or more of the following: substituted or unsubstituted C2-C10 alkene groups, substituted or unsubstituted phenyl groups, halogen groups (F, Cl, Br, I), and nitro groups.

[0058] In other words, the organic layer 140 may be a crosslinked self-assembled monolayer. This further effectively improves the thermal and chemical stability of the organic layer 140.

[0059] For example, as shown in Figure 6a, the self-assembled monomolecule may be a diacetylene-based compound. The crosslinked polymer formed by crosslinking between the diacetylene-based self-assembled monomolecules may include a polydiacetylene-based polymer. The organic layer 140 may include a polydiacetylene-based polymer having one or more functional groups (FG) from among a silane group, a phosphate group, a thiol group, a carboxyl group, and an isocyanate group.

[0060] For example, as shown in Figure 6b, the self-assembled monomolecule may be a styrene-based compound. The crosslinked polymer formed by crosslinking between the styrene-based self-assembled monomolecules may include a polystyrene-based polymer. The organic layer 140 may include a polystyrene-based polymer having one or more functional groups (FG) from among a silane group, a phosphate group, a thiol group, a carboxyl group, and an isocyanate group.

[0061] For example, as shown in Figure 6c, the self-assembled monomolecule may be a silane compound. The crosslinked polymer formed by crosslinking between the silane self-assembled monomolecules may include a silane-based crosslinked polymer. The organic layer 140 may include a silane-based crosslinked polymer having a thiol group as a functional group (FG). The organic layer 140 may include, for example, a silane-based alkanethiols.

[0062] For example, as shown in FIG. 6d, the self-assembled monomolecular substance may be a boronic acid-based compound. The cross-linked polymer formed by the cross-linking bond between the boronic acid-based self-assembled monomolecular substances may include a boronic acid-based cross-linked polymer. The organic layer 140 may include a boronic acid-based cross-linked polymer having a thiol group as a functional group (FG). The organic layer 140 may include, for example, boronic acid-based alkanethiols.

[0063] On the other hand, the presence, type, and characteristics of the organic substances contained in the organic layer 140 can be measured using infrared absorption spectra, ultraviolet-visible absorption spectra, MS spectra, 1H NMR spectra, etc., but are not limited thereto, and can be measured by general analysis means widely used in the industry.

[0064] Hereinafter, an example of a method for forming the laminated electronic component 1000 will be described. However, the manufacturing method of the laminated electronic component 1000 is not limited thereto.

[0065] First, prepare ceramic powder for forming the dielectric layer 111. The ceramic powder is, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, and (Ca 1-x Sr x )(Zr 1-y Ti y)One or more of O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5) can be included. The BaTiO3 powder can be synthesized, for example, by reacting a titanium raw material such as titanium dioxide with a barium raw material such as barium carbonate. Examples of the method for synthesizing the ceramic powder include a solid-phase method, a sol-gel method, a hydrothermal synthesis method, etc., but the present invention is not limited thereto. Next, after drying and pulverizing the prepared ceramic powder, an organic solvent such as ethanol and a binder such as polyvinyl butyral are mixed to produce a ceramic slurry, and the ceramic slurry is applied and dried on a carrier film to provide a ceramic green sheet.

[0066] Next, an internal electrode conductive paste containing a metal powder, a binder, an organic solvent, etc. with a predetermined thickness is printed on the ceramic green sheet using a screen printing method, a gravure printing method, etc. to form an internal electrode pattern.

[0067] Thereafter, after peeling the ceramic green sheet with the internal electrode pattern printed thereon from the carrier film, the ceramic green sheets with the internal electrode pattern printed thereon are laminated and pressure-bonded by a predetermined number of layers to form a ceramic laminate. On the upper and lower parts of the ceramic laminate, in order to form the cover parts 112 and 113 after firing, ceramic green sheets without an internal electrode pattern can be laminated by a predetermined number of layers. Thereafter, the ceramic laminate can be cut to have a predetermined chip size, and the cut chips can be fired at a temperature of 1000 °C or higher and 1400 °C or lower to form a ceramic body 110.

[0068] On the other hand, the margin portions 114 and 115 may be formed by applying a conductive paste for internal electrodes to the ceramic green sheet, except for the areas where the margin portions are formed, and then firing it. Alternatively, in order to suppress the step caused by the internal electrodes 121 and 122, the ceramic laminate can be cut so that the internal electrode pattern is exposed on both sides of the cut chip in the third direction, then a margin portion forming sheet can be attached to both sides of the cut chip in the third direction, and then fired to form the margin portions 114 and 115.

[0069] Next, external electrodes 131 and 132 are formed. For example, if the base electrode layers 131a and 132a include a fired electrode layer, the ceramic body 110 can be dipped in a conductive paste for external electrodes containing metal powder, glass frit, binder, and organic solvent, and then the conductive paste for external electrodes can be fired at a temperature of 500°C to 900°C to form a fired electrode layer.

[0070] For example, if the base electrode layers 131a and 132a include a resin electrode layer, the main body can be dipped in a conductive resin composition containing metal powder, resin, binder, and organic solvent, and then cured at a temperature of 250°C to 550°C to form the resin electrode layer.

[0071] Furthermore, electroplating and / or electroless plating can be used to form plating layers 131b and 132b on the underlying electrode layers 131a and 132a.

[0072] Next, the self-assembled monomolecule 14 can be coated onto the capacitor 100 using a liquid phase deposition method or a vapor phase deposition method. The head portion 14a of the self-assembled monomolecule 14 can be chemically bonded to the surface of the capacitor 100, thereby forming a self-assembled monomolecule film on the outer surface of the capacitor 100.

[0073] The self-assembled monomolecule 14 may, for example, be a diacetylene-based, styrene-based, silane-based, and / or boronic acid-based compound containing one or more of the following groups as the head portion 14a: a silane group, a phosphate group, a thiol group, a carboxyl group, and an isocyanate group.

[0074] Next, an organic layer 140 can be formed by crosslinking the self-assembled monomolecular material 14 that constitutes a self-assembled monolayer to form a crosslinked polymer. Polymerization by the above crosslinking bond can be initiated by UV photopolymerization and / or radical polymerization, but the present invention is not limited thereto. The above crosslinked polymer may be self-crosslinked, but the present invention is not limited thereto.

[0075] Directly coating a polymer onto a capacitor 100 may require precise control and complex equipment / facilities. According to the present invention, a self-assembled monomolecule 14 can be coated onto the capacitor 100 in a relatively simple manner. While a simple monomolecule film may have only a slight effect on improving the moisture resistance reliability of a multilayer electronic component 1000, the moisture resistance reliability of the multilayer electronic component 1000 can be effectively improved by forming a crosslinked polymer with excellent water-repellent properties through the crosslinking of the monomolecule forming the monomolecule film.

[0076] The present invention is not limited by the embodiments described above or the accompanying drawings, but is limited by the claims provided herein. Accordingly, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, without departing from the technical idea of ​​the present invention as described in the claims, and these also fall within the scope of the present invention.

[0077] Furthermore, the expression "one embodiment" does not mean that each embodiment is the same as another, but is provided to highlight and explain the unique and distinct characteristics of each embodiment. However, the above-presented embodiments do not preclude their realization in combination with the features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description in the other embodiment that contradicts or is contrary to that matter.

[0078] In this invention, "connected" is a concept that includes not only direct connection but also indirect connection via an adhesive layer or the like. Furthermore, "electrically connected" is a concept that includes both cases where physically connected and cases where not connected. In addition, expressions such as "first," "second," etc., are used to distinguish one component from another and do not limit the order and / or importance of the components. In some cases, within the scope of the rights, the first component may be named the second component, and similarly, the second component may be named the first component. [Explanation of Symbols]

[0079] 1000: Stacked Electronic Components 100: Capacitor 110: Ceramic body 111: Dielectric layer 112, 113: Cover section 114, 115: Margin section 121, 122: Internal electrode 131, 132: External electrode 131a, 132a: Base electrode layer 131b, 132b: Plating layer 140:Organic layer

Claims

1. A ceramic body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, and a capacitor including external electrodes disposed on the ceramic body and connected to the internal electrodes, The capacitor comprises an organic layer disposed to cover at least a portion of its outer surface, and containing a crosslinked polymer comprising one or more polydiacetylene polymers and polystyrene polymers, The crosslinked polymer has a functional group comprising one or more of the following: a silane group, a phosphate group, a thiol group, a carboxyl group, and an isocyanate group, and is a multilayer electronic component.

2. The multilayer electronic component according to claim 1, wherein the crosslinked polymer includes repeating units derived from a self-assembled monomolecule.

3. The self-assembled monomolecule includes a head portion and a link portion connected to the head portion. The head portion has the functional group, The multilayer electronic component according to claim 2, wherein the link portion has at least one carbon-carbon double bond.

4. The stacked electronic component according to claim 1, wherein the organic layer is a cross-linked self-assembled monolayer.

5. The multilayer electronic component according to claim 1, wherein the functional group is chemically bonded to the outer surface of the capacitor.

6. The stacked electronic component according to claim 1, wherein the organic layer is arranged so as to be in direct contact with the outer surface of the capacitor.

7. The stacked electronic component according to claim 1, wherein the organic layer is arranged to cover at least a portion of the outer surface of the ceramic body.

8. The stacked electronic component according to any one of claims 1 to 7, wherein the organic layer is arranged to completely cover the area of ​​the outer surface of the ceramic body that is not covered by the external electrode.

9. The multilayer electronic component according to claim 7, wherein the functional group comprises one or more of a silane group and a phosphate group.

10. A ceramic body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, and a capacitor including external electrodes disposed on the ceramic body and connected to the internal electrodes, The capacitor comprises an organic layer containing a crosslinked polymer, which is arranged to cover at least a portion of the outer surface of the capacitor, The crosslinked polymer includes repeating units derived from a self-assembled monomolecule, The self-assembled monomolecule includes a head portion and a link portion connected to the head portion. The head portion contains one or more of a silane group, a phosphate group, a thiol group, a carboxyl group, and an isocyanate group, and the link portion has at least one carbon-carbon double bond, wherein the multilayer electronic component.

11. The stacked electronic component according to claim 10, wherein the organic layer is arranged to cover at least a portion of the outer surface of the ceramic body.

12. The stacked electronic component according to claim 10 or 11, wherein the organic layer is arranged to completely cover the area of ​​the outer surface of the ceramic body that is not covered by the external electrode.

13. The stacked electronic component according to claim 11, wherein the head portion includes one or more of a silane group and a phosphate group.

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