Small devices

Abstract

In small devices, space is provided for measurement terminals, facilitating the measurement of transmission output. [Solution] The tab-lead substrate comprises a printed circuit board 20 having a front surface 20a and a back surface 20b facing the opposite side of the front surface 20a; a chip antenna 34 and a control unit 31 mounted on the front surface 20a of the printed circuit board 20; printed wiring 22 formed on the front surface 20a of the printed circuit board 20, having a first wiring section 26 connected to the chip antenna 34, a second wiring section 27 connected to the control unit 31, and a dividing section 28 separating the first wiring section 26 and the second wiring section 27 from each other; and a measuring terminal 44 formed on the back surface 20b of the printed circuit board 20, which is electrically connected to the second wiring section 27.

Description

Technical Field

[0001] The present invention relates to a small device.

Background Art

[0002] In a small device having a wireless communication function, it is necessary to measure the transmission output of an antenna circuit in a state where the antenna is disconnected, which is regulated by the Radio Law. For example, in Patent Document 1, a power supply unit provided on a main wiring board and a radiation unit that is housed and attached in a gap formed between the main wiring board and an exterior case that houses the main wiring board, is separate from the power supply unit and separable from each other, and a transmission output measurement terminal is connected to the power supply unit via a capacitor. According to this antenna device, even after the power supply unit is provided on the main wiring board, the radiation unit can be easily separated from the power supply unit by removing the exterior case from the main wiring board.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in a small device to be placed in a living body, there is a problem of securing a space for arranging the measurement terminal.

[0005] Therefore, the present invention secures a space for arranging a measurement terminal in a small device and facilitates the measurement of transmission output.

Means for Solving the Problems

[0006] <� A miniature device according to a first aspect of the present invention comprises a substrate having a first surface and a second surface facing the opposite side of the first surface; an antenna and a control unit mounted on the first surface of the substrate; a first wiring section formed on the first surface of the substrate and connected to the antenna; a second wiring section connected to the control unit; and a wiring section having a separation section that separates the first and second wiring sections from each other; and a measuring terminal formed on the second surface of the substrate and electrically connected to the second wiring section.

[0007] According to the first embodiment, the control unit, which is separated from the antenna by the dividing section, is electrically connected to the measurement terminal via the second wiring section. Since the measurement terminal is formed on the second surface of the substrate opposite to the first surface on which the control unit, antenna, and second wiring section are arranged, it is easy to secure space for bringing a probe close to the measurement terminal. Therefore, it is easier to lay out the measurement terminal. Thus, in a small device, it is possible to secure space for arranging the measurement terminal and to easily measure the transmission output. Furthermore, by electrically connecting the first wiring section and the second wiring section across the dividing section, the control unit and the antenna can be made to be interconnected.

[0008] A miniature device according to a second aspect of the present invention is a miniature device according to the first aspect, comprising a first element mounted on the first surface and connected to the first wiring section, and a second element mounted on the first surface and connected to the second wiring section, wherein the dividing section may be in a region sandwiched between the first element and the second element in a plan view.

[0009] According to the second embodiment, since the space where the divided portion is located is sandwiched between the first element and the second element, it is difficult to bring the probe close to the space where the divided portion is located. For this reason, it is difficult to provide a measurement terminal in the second wiring section adjacent to the divided portion, so the effect of easily measuring the transmission output can be effectively realized.

[0010] A miniature device according to a third aspect of the present invention is a miniature device according to the first or second aspect described above, further comprising an insulating film covering the second wiring portion, wherein the second wiring portion has an exposed portion where metal is exposed from the insulating film, the exposed portion is formed on the opposite side of the first wiring portion across the dividing portion, and the area of ​​the measuring terminal may be larger than the area of ​​the exposed portion.

[0011] According to the third embodiment, when forming a conductive portion that electrically connects the first wiring portion and the second wiring portion across the divided portion, the exposed portion can be used as the joint between the conductive portion and the second wiring portion. Since the area of ​​the measurement terminal is larger than the area of ​​the exposed portion, it is easier to apply the probe to the measurement terminal than to apply the probe to the exposed portion. Therefore, the effect of facilitating the measurement of the transmission output described above can be effectively demonstrated in a configuration in which it is difficult to apply the probe to the exposed portion.

[0012] A miniature device according to a fourth aspect of the present invention is a miniature device according to any of the first to third aspects described above, wherein the measuring terminal does not have to overlap with at least one of the antenna and the first wiring section in a plan view.

[0013] According to the fourth embodiment, radio wave interference caused by the measurement terminal can be suppressed.

[0014] A miniature device according to a fifth aspect of the present invention may further include a connection portion that connects the second wiring portion and the measuring terminal to each other along the thickness direction of the substrate at the shortest distance, in addition to the miniature device according to the fourth aspect.

[0015] According to the fifth aspect, radio wave interference caused by the connection can be suppressed. [Effects of the Invention]

[0016] According to the present invention, in a small device, it is possible to secure space for arranging measurement terminals and facilitate the measurement of transmission output. [Brief explanation of the drawing]

[0017] [Figure 1] It is a plan view of a substrate with a tab lead according to an embodiment. [Figure 2] It is a bottom view of a substrate with a tab lead according to an embodiment. [Figure 3] It is a circuit block diagram of a substrate unit of an embodiment. [Figure 4] It is a plan view showing an enlarged periphery of a dividing portion of a substrate with a tab lead according to an embodiment. [Figure 5] It is a cross-sectional view of a substrate with a tab lead according to an embodiment, showing a cross-section of a substrate unit along the thickness direction.

Mode for Carrying Out the Invention

[0018] Hereinafter, an embodiment of a substrate with a tab lead according to the present invention will be described based on the drawings. In the following description, the same reference numerals are given to configurations having the same or similar functions. And redundant descriptions of those configurations may be omitted.

[0019] FIG. 1 is a plan view of a substrate with a tab lead according to an embodiment. The substrate with a tab lead 1 of the present embodiment is an example of a small device. As shown in FIG. 1, the substrate with a tab lead 1 includes a substrate unit 10, a battery holder 50 connected to the substrate unit 10, and a battery 60 held by the battery holder 50.

[0020] (Substrate Unit) The substrate unit 10 has a printed wiring board 20, various electronic components 30 mounted on the printed wiring board 20, and a conduction portion 40 attached to the printed wiring board 20. The substrate unit 10 is a so-called printed circuit board that functions as an electronic circuit by mounting a plurality of electronic components 30 on the printed wiring board 20 and providing the conduction portion 40.

[0021] The printed circuit board 20 includes a raw substrate 21 having insulation and printed wirings 22 formed on the raw substrate 21. The printed circuit board 20 also includes a front surface 20a and a back surface 20b facing the thickness direction T. Hereinafter, for two directions parallel to the thickness direction T and facing opposite to each other, the direction in which the front surface 20a of the printed circuit board 20 faces is defined as the front side, and the direction opposite to the front side is defined as the back side. Also, the direction orthogonal to the thickness direction T of the printed circuit board 20 is referred to as the in-plane direction.

[0022] FIG. 2 is a bottom view of the substrate with a tab lead according to the embodiment. As shown in FIGS. 1 and 2, the raw substrate 21 is a flat rigid substrate having a uniform thickness throughout. The raw substrate 21 is formed in a rectangular shape in a plan view as seen from the thickness direction T. However, the plan view shape of the raw substrate 21 is not limited to a rectangular shape and may be changed as appropriate.

[0023] The printed wiring 22 includes a first printed wiring 23 formed on the front surface 20a of the printed circuit board 20 and a second printed wiring 24 formed on the back surface 20b of the printed circuit board 20. The printed wiring 22 is formed of a metal material (or a conductive material) such as copper or gold into a predetermined circuit pattern. The first printed wiring 23 and the second printed wiring 24 may be appropriately electrically connected via a through electrode (not shown) penetrating the raw substrate 21 in the thickness direction T. Further, the printed circuit board 20 may be configured as a multilayer substrate such as a through multilayer substrate or a build-up substrate. Details of the first printed wiring 23 and the second printed wiring 24 will be described later.

[0024] FIG. 3 is a circuit block diagram of the substrate unit of the embodiment. As shown in Figure 3, the electronic component 30 includes a control unit 31, a filter 32, a matching element 33, and a chip antenna 34. The control unit 31 is, for example, a SoC (System on a Chip) that includes communication functions and control functions. The filter 32 is connected to the control unit 31 and the matching element 33. The matching element 33 is connected to the chip antenna 34 and the filter 32.

[0025] As shown in Figure 1, the electronic component 30 is mounted on the printed circuit board 20 using solder or the like, and is fixed to the printed circuit board 20 in a state of electrical conductivity with the printed circuit board 22. The control unit 31, filter 32, matching element 33, and chip antenna 34 are arranged on the surface 20a of the printed circuit board 20 and connected to the first printed circuit board 23. The control unit 31, filter 32, matching element 33, and chip antenna 34 protrude from the surface 20a of the printed circuit board 20 to the front side. Here, two directions that are mutually orthogonal in the in-plane direction are defined as the first direction L1 and the second direction L2. The filter 32 and the matching element 33 are arranged such that their respective placement areas in the first direction L1 overlap in the second direction L2. The control unit 31 and the chip antenna 34 are on opposite sides of each other in the first direction L1, with the filter 32 and the matching element 33 in between. In each figure, only the control unit 31, filter 32, matching element 33, and chip antenna 34 are shown as electronic components 30, but the electronic components 30 mounted on the printed circuit board 20 may include other components such as sensors, oscillators, and memory.

[0026] Figure 4 is a plan view showing an enlarged view of the area around the divided portion of the tab-lead substrate according to the embodiment. Note that Figure 4 shows the state in which the conductive portion 40, which will be described later, is not arranged. As shown in Figures 1 and 4, the first printed circuit board 23 includes a first wiring section 26 connected to the chip antenna 34, a second wiring section 27 connected to the control unit 31, and a separation section 28 that separates the first wiring section 26 and the second wiring section 27 from each other.

[0027] The first wiring section 26 is a conductor extending from the division section 28 to the chip antenna 34. A matching element 33 is connected to the middle of the first wiring section 26. That is, a part of the first wiring section 26 is indirectly connected to the chip antenna 34 via a part of the electronic component 30 (the matching element 33 in this embodiment). The second wiring section 27 is a conductor extending from the division section 28 to the control unit 31. A filter 32 is connected to the middle of the second wiring section 27. That is, a part of the second wiring section 27 is indirectly connected to the control unit 31 via a part of the electronic component 30 (the filter 32 in this embodiment). The second wiring section 27 is formed separately from the first wiring section 26 and is not continuous with the first wiring section 26. As a result, the first wiring section 26 and the second wiring section 27 are electrically insulated from each other without a conductive section 40 being formed between them.

[0028] The dividing portion 28 is the gap between the first wiring portion 26 and the second wiring portion 27. In this embodiment, the dividing portion 28 is located at the point where the distance between the first wiring portion 26 and the second wiring portion 27 is minimized. The dividing portion 28 is between the tip of the first wiring portion 26 and the tip of the second wiring portion 27. In a plan view, the dividing portion 28 is in the region sandwiched between the filter 32 and the matching element 33. Furthermore, in a plan view, the dividing portion 28 is in the region that overlaps with the control unit 31 in the first direction L1. Thus, in a plan view, the dividing portion 28 is formed in a region defined by at least one of the electronic components 30.

[0029] As shown in Figure 4, the printed circuit board 20 is provided with an insulating film that covers the printed wiring 22. For example, the insulating film is solder resist. The insulating film covers the second wiring portion 27. The second wiring portion 27 has an exposed portion 27a where the metal forming the second wiring portion 27 is exposed from the insulating film. The exposed portion 27a is formed on the opposite side of the first wiring portion 26, separated by a dividing portion 28. The insulating film may also cover the first wiring portion 26. If the insulating film covers the first wiring portion 26, the first wiring portion 26 has another exposed portion 26a where the metal forming the first wiring portion 26 is exposed from the insulating film. The other exposed portion 26a is formed on the opposite side of the second wiring portion 27, separated by a dividing portion 28. That is, the dividing portion 28 is the gap between the exposed portion 27a of the second wiring portion 27 and the other exposed portion 26a of the first wiring portion 26.

[0030] Figure 5 is a cross-sectional view of a substrate with tab leads according to an embodiment, showing a cross-section of the substrate unit along the thickness direction. As shown in Figures 1 and 5, the printed circuit board 20 further includes a through-hole 42, a measuring terminal 44, and a grounding terminal 46.

[0031] As shown in Figure 2, the measurement terminal 44 and the grounding terminal 46 are terminals for making mechanical and electrical connections with the probe of the measuring instrument when measuring the transmission output of the antenna circuit with the chip antenna 34 electrically disconnected. The measurement terminal 44 and the grounding terminal 46 are formed on the back surface 20b of the printed circuit board 20. The measurement terminal 44 and the grounding terminal 46 are made of a metallic material. The measurement terminal 44 and the grounding terminal 46 are provided electrically independently of each other. The measurement terminal 44 and the grounding terminal 46 each have a rectangular planar shape. The measurement terminal 44 is connected to the second wiring section 27 of the first printed circuit board 23 via a through-hole 42 (see Figure 5). The grounding terminal 46 is grounded via the second printed circuit board 24.

[0032] As shown in Figures 1 and 4, the measurement terminal 44 does not overlap with at least one of the chip antenna 34 and the first wiring section 26 in a plan view. In this embodiment, the measurement terminal 44 does not overlap with both the chip antenna 34 and the first wiring section 26 in a plan view. Furthermore, the measurement terminal 44 does not overlap with the matching element 33 in a plan view. The area of ​​the measurement terminal 44 is larger than the area of ​​the exposed portion 27a of the second wiring section 27.

[0033] As shown in Figure 5, the through-hole 42 is formed of a metal material. The through-hole 42 penetrates the raw substrate 21 and connects to the second wiring section 27 and the measurement terminal 44 of the first printed circuit board 23. The through-hole 42 makes the second wiring section 27 and the measurement terminal 44 electrically connected to each other. As a result, the measurement terminal 44 is electrically connected to the control unit 31 through the through-hole 42 and the second wiring section 27. The through-hole 42 extends along the thickness direction T and is formed so that its front end and back end overlap in a plan view. As a result, the through-hole 42 connects the second wiring section 27 and the measurement terminal 44 to each other along the thickness direction T at the shortest distance.

[0034] As shown in Figures 1 and 4, the conductive portion 40 is formed separately from the printed wiring 22 and is connected to the first wiring portion 26 and the second wiring portion 27 of the printed circuit board 20. The conductive portion 40 is formed from a conductive material such as solder or conductive adhesive and provides electrical conductivity between the first wiring portion 26 and the second wiring portion 27. The conductive portion 40 is connected to the exposed portion 27a of the second wiring portion 27 and to other exposed portions 26a of the first wiring portion 26. The conductive portion 40 straddles the dividing portion 28. The conductive portion 40 protrudes outward from the surface 20a of the printed circuit board 20. In a plan view, the conductive portion 40 is located between the filter 32 and the matching element 33.

[0035] As described above, the tab-lead substrate 1 of this embodiment includes a chip antenna 34 and a control unit 31 mounted on the surface 20a of the printed circuit board 20, a first printed wiring 23 formed on the surface 20a of the substrate 1 and having a first wiring section 26 connected to the chip antenna 34, a second wiring section 27 connected to the control unit 31, and a separation section 28 that separates the first wiring section 26 and the second wiring section 27 from each other, and a measurement terminal 44 formed on the back surface 20b of the substrate 1 and electrically connected to the second wiring section 27. With this configuration, the measurement terminal 44 is electrically connected to the control unit 31, which is separated from the chip antenna 34 by the separation section 28, via the second wiring section 27. Since the measurement terminal 44 is formed on the back surface 20b of the substrate 1 opposite to the surface 20a where the control unit 31, chip antenna 34, and second wiring section 27 are arranged, it is easy to secure space to bring a probe close to the measurement terminal 44. Therefore, it is easier to lay out the measurement terminal 44. Therefore, on the tab-lead substrate 1, space can be secured for the measurement terminal 44, making it easy to measure the transmission output. Furthermore, by making the first wiring section 26 and the second wiring section 27 electrically connected across the division section 28, the control unit 31 and the chip antenna 34 can be made interconnected.

[0036] The tab-lead substrate 1 includes a matching element 33 mounted on the surface 20a and connected to the first wiring section 26, and a filter 32 mounted on the surface 20a and connected to the second wiring section 27. The division section 28 is located in the region sandwiched between the matching element 33 and the filter 32 in a plan view. With this configuration, since the space where the division section 28 is located is sandwiched between the matching element 33 and the filter 32, it is difficult to bring a probe close to the space where the division section 28 is located. For this reason, it is difficult to provide a measurement terminal in the second wiring section 27 adjacent to the division section 28, thus effectively demonstrating the effect of facilitating the measurement of the transmission output.

[0037] The second wiring section 27 has an exposed portion 27a where metal is exposed from the insulating film. The exposed portion 27a is formed on the opposite side of the first wiring section 26, across the dividing portion 28. The area of ​​the measuring terminal 44 is larger than the area of ​​the exposed portion 27a. With this configuration, when forming a conductive portion 40 that connects the first wiring section 26 and the second wiring section 27 electrically across the dividing portion 28, the exposed portion 27a can be used as the connection point between the conductive portion 40 and the second wiring section 27. Since the area of ​​the measuring terminal 44 is larger than the area of ​​the exposed portion 27a, it is easier to apply the probe to the measuring terminal 44 than to the exposed portion 27a. Therefore, in a configuration where it is difficult to apply the probe to the exposed portion 27a, the effect of facilitating the measurement of the transmission output can be effectively demonstrated.

[0038] The measurement terminal 44 does not overlap with at least one of the chip antenna 34 and the first wiring section 26 in a plan view. This configuration suppresses radio wave interference caused by the measurement terminal 44. Furthermore, since the through-hole 42 connects the second wiring section 27 and the measurement terminal 44 along the shortest distance in the thickness direction T, radio wave interference caused by the through-hole 42 can also be suppressed.

[0039] It should be noted that the present invention is not limited to the embodiments described above with reference to the drawings, and various modifications are conceivable within its technical scope. For example, in the above embodiment, the dividing portion 28 is located in a region sandwiched between the filter 32 and the matching element 33 in a plan view. However, the electronic components arranged to sandwich the dividing portion are not limited to the filter and the matching element, but may be other components such as a control unit or a chip antenna. Furthermore, the dividing portion does not have to be located in a region sandwiched between a pair of electronic components in a plan view. For example, the dividing portion may be located in close proximity to only one of the first element connected to the first wiring portion and the second element connected to the second wiring portion.

[0040] In the above embodiment, the first tab lead 51 of the battery holder 50 is connected to the negative electrode can 61 of the battery 60, and the second tab lead 52 is connected to the positive electrode can 62. However, the configuration is not limited to this. For example, the first tab lead 51 may be connected to the positive electrode can 62, and the second tab lead 52 may be connected to the negative electrode can 61.

[0041] In the above embodiment, the measurement terminal 44 is positioned so as not to overlap with either the chip antenna 34 or the first wiring section 26 in a plan view, but the configuration is not limited to this. The measurement terminal may overlap with at least one of the chip antenna or the first wiring section in a plan view.

[0042] Furthermore, it is possible to replace the components in the above-described embodiments with well-known components as appropriate, without departing from the spirit of the present invention. [Explanation of Symbols]

[0043] 1...Substrate with tab leads (small device) 20...Printed circuit board (substrate) 20a...First side (front) 20b...Second side (back) 22...Printed wiring (wiring) 26...First wiring section 27...Second wiring section 27a...Exposed section 28...Separated section 31...Control section 32...Filter (second element) 33...Matching element (first element) 34...Chip antenna (antenna) 42...Through section (connection section) 44...Measuring terminal T...Thickness direction

Claims

1. A substrate having a first surface and a second surface facing the opposite side of the first surface, An antenna and a control unit mounted on the first surface of the substrate, A wiring section formed on the first surface of the substrate, having a first wiring section connected to the antenna, a second wiring section connected to the control unit, and a dividing section that separates the first wiring section and the second wiring section from each other, A measuring terminal formed on the second surface of the substrate and electrically connected to the second wiring portion, Equipped with Small device.

2. A first element mounted on the first surface and connected to the first wiring section, A second element mounted on the first surface and connected to the second wiring section, Equipped with, The aforementioned dividing portion is located in the region sandwiched between the first element and the second element in a plan view. The miniature device according to claim 1.

3. The device further comprises an insulating film covering the second wiring portion, The second wiring portion has an exposed portion in which metal is exposed from the insulating film, The exposed portion is formed on the opposite side of the first wiring portion, with the dividing portion in between. The area of ​​the measuring terminal is larger than the area of ​​the exposed portion. A miniature device according to claim 1 or claim 2.

4. The measurement terminal is positioned such that, in a plan view, it does not overlap with at least one of the antenna and the first wiring section. A miniature device according to claim 1 or claim 2.

5. The substrate further comprises a connection section that connects the second wiring section and the measuring terminals to each other along the shortest distance in the thickness direction of the substrate. The miniature device according to claim 4.

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