Substrate processing apparatus and substrate processing method
The substrate processing apparatus addresses the challenge of recognizing substrate states during film forming by using a rotary table with an imaging device and information processing unit for precise imaging and speed control, ensuring accurate film deposition.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Filing Date
- 2025-01-08
- Publication Date
- 2026-07-21
Smart Images
Figure 2026119926000001_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method.
Background Art
[0002] Patent Document 1 discloses a substrate processing apparatus (film forming apparatus) that performs film forming processing, which is substrate processing, while revolving and rotating a plurality of substrates placed on a rotary table. In order to improve the film forming accuracy, this substrate processing apparatus controls the revolving speed and revolving direction when the rotary table revolves, and controls the rotation speed and rotation direction when the plurality of substrates rotate to perform substrate processing.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] The present disclosure provides a technique that can recognize the state of a substrate well even in a configuration where the substrate revolves and rotates in a processing container.
Means for Solving the Problems
[0005] According to one aspect of the present disclosure, a substrate processing apparatus is provided, comprising: a processing container capable of performing substrate processing; a rotary table rotatably provided inside the processing container; a mounting platform on which a substrate is placed at a position away from the rotation center of the rotary table, which moves in accordance with the rotation of the rotary table and rotates relative to the rotary table; an imaging device provided outside the processing container and capable of imaging the mounting platform and the substrate placed on the mounting platform; and an information processing unit for processing imaging information from the imaging device, wherein the imaging device, when performing the substrate processing, images an area on the circumferential direction of the rotary table that is narrower in width than the radius of the mounting platform. [Effects of the Invention]
[0006] According to one embodiment, even in a configuration in which the substrate revolves and rotates within the processing container, the state of the substrate can be clearly recognized. [Brief explanation of the drawing]
[0007] [Figure 1] This is a longitudinal cross-sectional view showing an example of the configuration of a substrate processing apparatus according to the embodiment. [Figure 2] Figure 1 is a plan view showing the configuration inside the processing container of the substrate processing apparatus. [Figure 3] Figure 1 is a perspective view showing the configuration of the rotary table and mounting platform of the substrate processing apparatus. [Figure 4] This is a schematic side cross-sectional view showing the imaging unit installed in the processing container. [Figure 5] This block diagram shows the functional blocks in the control unit that process imaging information from the imaging unit. [Figure 6] Figures 6(A) to 6(E) show the operation of imaging the substrate by the imaging device. [Figure 7] This is a diagram illustrating the calculation of the actual rotation speed of the substrate. [Figure 8] This diagram illustrates the relationship between the overall structure of the generated substrate and its film thickness. [Figure 9]Figures 9(A) and 9(B) show the displacement of the substrate in the overall view of the generated substrate and mounting platform. [Figure 10] This is a flowchart showing the processing flow of the substrate processing method. [Figure 11] Figure 10(A) shows an imaging unit according to a modified example. Figure 10(B) shows an example of a substrate imaged by the imaging unit according to a modified example. [Modes for carrying out the invention]
[0008] The following describes embodiments for implementing this disclosure with reference to the drawings. In each drawing, the same reference numerals are used for identical components, and redundant explanations may be omitted.
[0009] <Configuration of substrate processing device 1> The substrate processing apparatus 1 according to the embodiment will be described with reference to Figures 1 to 3. Figure 1 is a longitudinal cross-sectional view showing an example of the configuration of the substrate processing apparatus 1 according to the embodiment. Figure 2 is a plan view showing the configuration inside the processing container 11 of the substrate processing apparatus 1 of Figure 1. Note that in Figure 2, the top plate is omitted for the sake of explanation. Figure 3 is a perspective view showing the configuration of the rotary table 21 and the mounting table 211 of the substrate processing apparatus 1 of Figure 1.
[0010] The substrate processing apparatus 1 is configured to perform film deposition on the surface of a substrate W using atomic layer deposition (ALD) or molecular layer deposition (MLD). This substrate processing apparatus 1 comprises a processing unit 10, a rotary drive unit 20, an imaging unit 60, and a control unit 90.
[0011] The processing unit 10 performs a film deposition process to form a film on the substrate W. The processing unit 10 includes a processing container 11, a gas introduction unit 12, a gas exhaust unit 13, a transport port 14, a heating unit 15, and a cooling unit 16.
[0012] The processing container 11 is a vacuum container that can be switched to a vacuum atmosphere by reducing the pressure of the internal space. The processing container 11 is formed as a flat housing having a substantially circular planar shape and can accommodate a plurality of substrates W in its internal space. The substrates W may be, for example, semiconductor wafers. The processing container 11 includes a main body 111, a top plate 112, side walls 113 and a bottom plate 114 (Figure 1). The main body 111 has a cylindrical shape. The top plate 112 is detachably attached to the upper surface of the main body 111. The main body 111 and the top plate 112 are airtightly sealed together by a seal portion 115. The side walls 113 have a cylindrical shape and are airtightly connected to the lower surface of the main body 111. The bottom plate 114 is airtightly connected to the bottom surface of the side walls 113.
[0013] The gas introduction section 12 includes a raw material gas nozzle 121, a reaction gas nozzle 122, and separation gas nozzles 123 and 124 (Figure 2). The raw material gas nozzle 121, the reaction gas nozzle 122, and the separation gas nozzles 123 and 124 are arranged above the rotary table 21, which will be described later, with spacing between them along the circumferential direction of the processing container 11 (the direction indicated by arrow A in Figure 2). In the illustrated example, the separation gas nozzle 123, raw material gas nozzle 121, separation gas nozzle 124, and reaction gas nozzle 122 are arranged in this order clockwise from the transport port 14 (the direction of rotation of the rotary table 21). Each of the raw material gas nozzle 121, the reaction gas nozzle 122, and the separation gas nozzles 123 and 124 has gas introduction ports 121p, 122p, 123p, and 124p (Figure 2) at its base end for introducing various gases. The gas introduction ports 121p, 122p, 123p, and 124p are fixed to the side wall of the main body 111 and protrude to the outside of the main body 111. The raw material gas nozzle 121, reaction gas nozzle 122, and separation gas nozzles 123 and 124 are inserted into the processing container 11 from the side wall of the main body 111 and extend radially inward from the main body 111. The raw material gas nozzle 121, reaction gas nozzle 122, and separation gas nozzles 123 and 124 are made of, for example, quartz and are arranged parallel to the rotary table 21.
[0014] The raw material gas nozzle 121 is connected to a raw material gas supply source (not shown) via a pipe, a flow controller, etc. (not shown). Examples of the raw material gas include a silicon-containing gas, a metal-containing gas, etc. The raw material gas nozzle 121 has a plurality of discharge holes (not shown) that open toward the rotary table 21, which are arranged at intervals along the axial direction of the raw material gas nozzle 121. The lower region of the raw material gas nozzle 121 becomes a raw material gas adsorption region P1 for adsorbing the raw material gas to the substrate W.
[0015] The reaction gas nozzle 122 is connected to a reaction gas supply source (not shown) via a pipe, a flow controller, etc. (not shown). Examples of the reaction gas include an oxidation gas, a nitridation gas, etc. The reaction gas nozzle 122 has a plurality of discharge holes (not shown) that open toward the rotary table 21, which are arranged at intervals along the axial direction of the reaction gas nozzle 122. The lower region of the reaction gas nozzle 122 becomes a reaction gas supply region P2 for oxidizing or nitriding the raw material gas adsorbed to the substrate W in the raw material gas adsorption region P1. In the embodiment, the processing gas for processing the substrate W corresponds to the above raw material gas and reaction gas.
[0016] Both the separation gas nozzles 123 and 124 are connected to a separation gas supply source (not shown) via a pipe, a flow control valve, etc. (not shown). As the separation gas, for example, an inert gas such as argon (Ar) gas or nitrogen (N2) gas can be used. The separation gas nozzles 123 and 124 have a plurality of discharge holes (not shown) that open toward the rotary table 21, which are arranged at intervals along the axial direction of the separation gas nozzles 123 and 124.
[0017] Also, as shown in FIG. 2, two convex portions 1 are provided in the processing container 11. The convex portions 17 are attached to the back surface of the top plate 112 so as to project toward the rotary table 21 in order to constitute a separation region D together with the separation gas nozzles 123 and 124. Each convex portion 17 has a fan-shaped planar shape with the top cut in an arc shape, and is arranged such that the inner arc is connected to the protruding portion 18 and the outer arc is along the side wall of the processing container 11.
[0018] The gas exhaust section 13 includes a first exhaust port 131 and a second exhaust port 132 (Figure 2). The first exhaust port 131 is formed at the bottom of the first exhaust region E1, which communicates with the raw material gas adsorption region P1. The second exhaust port 132 is formed at the bottom of the second exhaust region E2, which communicates with the reaction gas supply region P2. The first exhaust port 131 and the second exhaust port 132 are connected to an exhaust device (not shown) via exhaust piping (not shown).
[0019] The transport port 14 is provided on the side wall of the main body 111 (Figure 2). At the transport port 14, substrates W are transferred between the rotary table 21 inside the processing container 11 and the transport device 14a outside the processing container 11. The transport port 14 is opened and closed by a gate valve (not shown).
[0020] The heating section 15 includes a fixed shaft 151, a heater support section 152, and a heater 153 (Figure 1).
[0021] The fixed shaft 151 has a cylindrical shape with the center of the processing container 11 as its central axis. The fixed shaft 151 is inside the rotating shaft 23 of the rotary drive device 20, which will be described later, and penetrates the bottom plate 114 of the processing container 11.
[0022] The heater support portion 152 is fixed to the upper part of the fixed shaft 151 and has a disc shape. The heater support portion 152 supports the heater 153.
[0023] The heater 153 is provided on the upper surface of the heater support portion 152. In addition to the upper surface of the heater support portion 152, the heater 153 may also be provided on the main body 111. The heater 153 generates heat when power is supplied from a power source (not shown) and heats the substrate W. The heater 153 may also be provided with a shielding plate on its upper surface (the surface facing the rotary table 21) to prevent the heater 153 from being exposed to the processing gas.
[0024] The cooling section 16 includes fluid passages 161a to 164a, chiller units 161b to 164b, inlet pipes 161c to 164c, and outlet pipes 161d to 164d (Figure 1). Fluid passages 161a to 164a are formed inside the main body 111, top plate 112, bottom plate 114, and heater support section 152, respectively. Chiller units 161b to 164b output temperature-controlled fluid. The temperature-controlled fluid output from chiller units 161b to 164b circulates through the inlet pipes 161c to 164c, fluid passages 161a to 164a, and outlet pipes 161d to 164d in that order. This adjusts the temperature of the main body 111, top plate 112, bottom plate 114, and heater support section 152. Examples of temperature-controlled fluids that can be used include water, antifreeze (brine), fluorinated fluids, and hydrocarbon fluids.
[0025] The rotary drive device 20 includes a rotary table 21, a housing box 22, a rotating shaft 23, a motor for revolution 24, and an outer cylinder 25.
[0026] The rotary table 21 is installed inside the processing container 11 and has a rotation center at the center of the processing container 11. The rotary table 21 is, for example, disc-shaped and made of quartz. Multiple (for example, five) mounting platforms 211 are provided on the upper surface of the rotary table 21 along the rotation direction (circumferential direction). The rotary table 21 is connected to the housing box 22 via a connecting portion 214 (Figure 3).
[0027] Each mounting base 211 has a disc shape that is slightly larger than the substrate W and is made of, for example, quartz. A mounting surface 211s on which the substrate W is placed is formed on the upper surface of each mounting base 211. Each mounting base 211 is connected to a rotation motor 213 via a rotation axis 212 and is configured to be rotatable relative to the rotary table 21 (Figure 1).
[0028] The rotation shaft 212 connects the lower surface of the mounting base 211 to the rotation motor 213 housed in the housing box 22, and transmits the power of the rotation motor 213 to the mounting base 211. The rotation shaft 212 is configured to rotate around the center of the mounting base 211 as its center of rotation. The rotation shaft 212 is provided through the ceiling portion 222 of the housing box 22 and the rotary table 21. A sealing portion 263 is provided near the penetration point in the ceiling portion 222 of the housing box 22 to maintain an airtight state inside the housing box 22. The sealing portion 263 includes, for example, a magnetic fluid seal.
[0029] The rotation motor 213 rotates the mounting base 211 relative to the rotary table 21 via the rotation axis 212, thereby rotating the substrate W around its center. Preferably, the rotation motor 213 is a servo motor. The rotation motor 213 also includes an encoder 213a for detecting the rotation speed of the rotation axis 212.
[0030] The connecting portion 214 connects the lower surface of the rotary table 21 to the upper surface of the storage box 22 (Figure 3). Multiple connecting portions 214 are provided along the circumferential direction of the rotary table 21.
[0031] The storage box 22 is located below the rotary table 21 within the processing container 11. The storage box 22 is connected to the rotary table 21 via a connecting part 214 and rotates together with the rotary table 21. The storage box 22 may be configured to move up and down within the processing container 11 by a lifting mechanism (not shown). The storage box 22 has a main body 221 and a ceiling 222.
[0032] The main body 221 is formed in a concave shape in a vertical cross-sectional view and in a ring shape in a plan view that is aligned with the rotation direction of the rotary table 21 (Figure 1).
[0033] The ceiling portion 222 is provided on the upper surface of the main body portion 221 so as to cover the opening of the main body portion 221. As a result, the main body portion 221 and the ceiling portion 222 form a rotating housing portion 223 that is isolated from the inside of the processing container 11.
[0034] The rotating housing section 223 is formed in a rectangular shape in a vertical cross-sectional view and exhibits a ring shape along the rotation direction of the rotary table 21. The rotating housing section 223 houses the rotation motor 213 (rotation source). A communication passage 224 is formed in the main body section 221 that connects the rotating housing section 223 to the outside of the substrate processing apparatus 1. As a result, air is introduced into the rotating housing section 223 from the outside of the substrate processing apparatus 1, cooling the inside of the rotating housing section 223 and maintaining atmospheric pressure. In order to position the rotating housing section 223 so that it can rotate, the processing container 11 has a rotation source housing space 19 surrounded by side walls 113, a bottom plate 114, and a heating section 15.
[0035] The rotating shaft 23 is fixed to the lower part of the housing box 22. The rotating shaft 23 is installed by penetrating the bottom plate 114 of the processing container 11. The rotating shaft 23 transmits power from the orbital motor 24 to the rotary table 21 and the housing box 22, causing the rotary table 21 and the housing box 22 to rotate together. A seal portion 154 is provided between the outer wall of the fixed shaft 151 and the inner wall of the rotating shaft 23 of the rotary drive device 20. This allows the rotating shaft 23 to rotate relative to the fixed shaft 151 while maintaining an airtight state inside the processing container 11. For example, a magnetic fluid seal can be applied to the seal portion 154.
[0036] The outer cylinder 25 of the rotary drive device 20 is connected to the central lower surface of the bottom plate 114 of the processing container 11. The outer cylinder 25, together with the fixed shaft 151 of the processing container 11, supports the processing container 11. A seal portion 116 is provided between the rotary shaft 23 and the outer cylinder 25 to maintain an airtight state inside the processing container 11. For example, a magnetic fluid seal can be applied to the seal portion 116.
[0037] A passage 231 is formed inside the rotating shaft 23. The passage 231 is connected to a connecting passage 224 of the housing box 22 and functions as a fluid channel for introducing air into the housing box 22. The passage 231 also functions as a wiring duct for introducing power lines and signal lines for driving the rotation motors 213 into the housing box 22. For example, the same number of passages 231 as there are rotation motors 213 are provided.
[0038] Furthermore, the substrate processing apparatus 1 may be equipped with a plasma generation unit 50 in an appropriate region within the processing container 11, as shown by the dashed line in Figure 2. The plasma generation unit 50 generates plasma in the space within the processing container 11, thereby performing plasma processing on each substrate W that moves due to the rotation of the rotary table 21.
[0039] The imaging unit 60 according to this embodiment is installed, for example, upstream of the plasma generation unit 50 in the rotational direction, and images each substrate W and each mounting table 211 of the rotary table 21. However, the installation position of the imaging unit 60 is not limited to this and can be designed arbitrarily. For example, the imaging unit 60 may be installed adjacent to the transport port 14. This allows the imaging unit 60 to image the relative position between the substrate W being transported by the transport device 14a and the mounting table 211 during loading and unloading of the substrate W. The substrate processing device 1 can recognize the positioning of each mounting table 211 and the transport status of the substrate W based on the imaging information.
[0040] The imaging unit 60 is fixed to the installation position of the elongated window 112w provided in the top plate 112 of the processing container 11. The elongated window 112w is formed as a hole that penetrates the top plate 112. The elongated window 112w connects the space of the processing container 11 with the inside of the housing 63 of the imaging unit 60. A light-transmitting material (for example, quartz glass) may be fitted into the elongated window 112w.
[0041] In a plan view, the elongated window 112w has a rectangular shape (slit shape) that extends along the radial direction of the rotary table 21 (and processing container 11). That is, the longitudinal direction of the elongated window 112w is parallel to the radial direction of the rotary table 21, and the short direction (width direction) of the elongated window 112w is parallel to the tangent in the circumferential direction of the rotary table 21.
[0042] For example, the longitudinal dimension of the long window 112w is set to be longer than the diameter of each mounting platform 211 of the rotary table 21. Also, for example, the short-side dimension of the long window 112w is set to be shorter than the radius of each mounting platform 211. Preferably, the short-side dimension of the long window 112w is in the range of about 1 / 30 to 1 / 3 of the longitudinal dimension. This ensures that the width of the long window 112w is sufficiently narrow. This long window 112w functions as an aperture that defines the imaging range of the rotary table 21 by the imaging unit 60. By imaging the rotary table 21 (including the substrate W) through this long window 112w, the imaging unit 60 can image the substrate W and mounting platforms 211 that pass through the rotary table 21 as it rotates in a linear fashion.
[0043] If a large window were applied to the processing container 11, the sapphire glass 66 (or quartz glass installed in the window) described later might crack due to thermal stress during substrate processing. In contrast, the elongated window 112w according to this embodiment is formed to be sufficiently small, thereby reducing the effects of thermal stress as much as possible and avoiding damage.
[0044] Figure 4 is a schematic side cross-sectional view showing an imaging unit 60 installed in the processing container 11. The imaging unit 60 comprises a camera 61, an illumination device 62, and a housing 63 which is a support structure capable of integrally supporting these devices.
[0045] The camera 61 is fixed to the housing 63 so as to face downwards in the vertical direction. As described above, the imaging range inside the processing container 11 is narrowed by the long window 112w, so the camera 61 can be one that is highly sensitive (high resolution) and capable of imaging at a high frame rate (for example, 1,000 to 10,000 times per second). In other words, the camera 61 functions as a line camera capable of imaging each substrate W that passes through as the rotary table 21 rotates in a linear fashion. The camera 61 itself may also be a line scan camera.
[0046] The camera 61 may be a well-known camera having a CCD (Charge Coupled Device) sensor or a CMOS (Complementary Metal Oxide Semiconductor) sensor, etc. The camera 61 is communicatively connected to the control unit 90 and, based on the control of the control unit 90, takes an image of the inside of the processing container 11 and transmits this image information to the control unit 90. The imaging unit 60 may also be configured to include an image processing module (not shown) that processes the image information from the camera 61, and transmit the image information processed by the image processing module to the control unit 90.
[0047] The optical path 63a of the camera 61 inside the housing 63 is provided with a total reflection mirror 64, a half mirror 65, and sapphire glass 66, etc. The total reflection mirror 64, half mirror 65, and sapphire glass 66 are fixed at appropriate positions in the housing 63. The total reflection mirror 64 totally reflects the light directed toward the camera 61. The half mirror 65 transmits the light from the illumination device 62, while directing the light reflected from the rotary table 21 (mounting base 211, substrate W) toward the total reflection mirror 64.
[0048] The sapphire glass 66 is installed so as to block the space between the processing container 11, which communicates with it via the long window 112w, and the optical path 63a inside the housing 63. For example, the sapphire glass 66 is held by a holder 66h at an angle inclined with respect to the optical path 63a. An O-ring 66o1 is provided between the lower surface (and / or upper surface) of the sapphire glass 66 and the holder 66h. This allows the sapphire glass 66 to hermetically seal the space between the processing container 11 and the optical path 63a, thereby protecting the camera 61 (and illumination device 62). It is preferable that the inner surface of the sapphire glass 66 inside the housing 63 be coated with an anti-reflective coating such as an AR coating to prevent light reflection.
[0049] The lighting device 62 is positioned vertically above the long window 112w and emits light toward the long window 112w to ensure sufficient brightness on the rotating table 21. The lighting device 62 is not particularly limited as long as it can emit light of appropriate brightness; for example, a lamp having one or more LEDs (Light Emitting Diodes) can be used.
[0050] The housing 63 supports the camera 61 and the lighting device 62, and also houses the optical path 63a of the camera 61. The lower end of the housing 63 is fixed to the top plate 112 of the processing container 11, enclosing the long window 112w. This allows the imaging unit 60 to reliably block external light between the camera 61 and the top surface of the rotary table 21, enabling imaging of the substrates W on each mounting table 211. In addition, an O-ring 66o2 is provided at the contact point between the holder 66h and the top plate 112, hermetically sealing the space inside the processing container 11 from the outside.
[0051] Returning to Figure 1, the control unit 90 controls each part of the substrate processing apparatus 1. The control unit 90 includes a control body 91 and a user interface 95. The control body 91 is a computer having one or more processors 92, memory 93, input / output interfaces (not shown), and communication interfaces. The one or more processors 92 are a combination of one or more of the following: CPU (Central Processing Unit), GPU (Graphics Processing Unit), ASIC (Application Specific Integrated Circuit), FPGA (Field-Programmable Gate Array), circuits made of multiple discrete semiconductors, etc., and execute programs stored in the memory 93. The memory 93 includes a main memory made of semiconductor memory, etc., and an auxiliary memory made of disks, semiconductor memory (flash memory), etc.
[0052] Furthermore, the user interface 95 is connected to the input / output interface of the control unit 91. This user interface 95 is not particularly limited, but examples include a touch panel, monitor, keyboard, mouse, etc.
[0053] The control unit 90 controls the various components of the substrate processing apparatus 1, including receiving substrates W from the transport device 14a (Figure 2) to each mounting table 211, processing each substrate W, and transferring substrates W from each mounting table 211 to the transport device 14a. For example, when receiving substrates W, the control unit 90 positions the mounting table 211 on which the substrates W are to be placed adjacent to the transport port 14 of the processing container 11. Then, after the transport device 14a is advanced from the transport port 14, the control unit 90 raises several lift pins (not shown) from the mounting table 211 to receive the substrates W from the transport device 14a. After the transport device 14a is retracted, the control unit 90 lowers each lift pin to place the substrates W on the mounting tables 211. The control unit 90 also rotates the rotary table 21 to sequentially change the mounting tables 211 adjacent to the transport port 14, repeating the above operation to place substrates W on each mounting table 211.
[0054] Then, in performing substrate processing such as film deposition, the control unit 90 reduces the pressure of the processing container 11 to a predetermined internal pressure and heats each substrate W with the heating unit 15. Furthermore, the control unit 90 rotates (revolves) the rotary table 21 around the rotation axis 23 while rotating (rotates) each mounting table 211 around the rotation axis 212. In this state, raw material gas is supplied by the raw material gas nozzle 121 of the gas introduction unit 12, reaction gas is supplied by the reaction gas nozzle 122, and separation gas is supplied by the separation gas nozzles 123 and 124, thereby depositing a desired film on the surface of each substrate W.
[0055] During substrate processing, the control unit 90 (control body 91) uses the camera 61 of the imaging unit 60 to image the substrates W on each mounting platform 211 of the revolving and rotating rotary table 21, and acquires imaging information. As described above, the camera 61 takes images through the long window 112w, thereby acquiring imaging information that partially includes the revolving and rotating mounting platform 211 and the substrates W. The control unit 90 repeats the imaging by the camera 61 at regular intervals to acquire multiple pieces of imaging information. As a result, the control unit 90 can calculate the rotation speed and revolving speed of each substrate W based on the multiple pieces of imaging information, and can also generate an overall image of the substrate W using the calculated rotation speed and the multiple pieces of imaging information.
[0056] <Processing by the control unit 90> The processing details of the control unit 90 (control body 91) will be explained in detail below with reference to Figure 5. Figure 5 is a block diagram showing the functional blocks in the control body 91 that process imaging information from the imaging unit 60.
[0057] As a functional unit for processing imaging information, the control body 91 contains, for example, an imaging information acquisition unit 911, an image processing unit 912, a feature point extraction unit 913, a speed calculation unit 914, a drive control unit 915, an overall image generation unit 916, a state recognition unit 917, and the like.
[0058] The imaging information acquisition unit 911 controls the operation of the imaging unit 60 connected to the control unit 91 to acquire imaging information from the camera 61. The control unit 91 may delete the imaging information after calculating the rotation speed of the substrate W based on the imaging information, or after generating an overall image of the substrate W. Alternatively, when a certain amount of imaging information has been accumulated, the control unit 91 may delete the oldest imaging information first.
[0059] Figures 6(A) to 6(E) illustrate the imaging information acquired by the imaging information acquisition unit 911. Figures 6(A) to 6(E) show several typical positions of the substrate W when it is continuously imaged while it is revolving and rotating. In practice, multiple imaging data are acquired with overlapping imaging ranges IA on the substrate W, depending on the frame rate of the camera 61.
[0060] The imaging information captured by the imaging unit 60 (camera 61) according to this embodiment may include cases where only the rotary table 21 is imaged without the mounting table 211 and the substrate W, or cases where the mounting table 211 and the substrate W are partially included in the image. Each image of the substrate W in which a part of the substrate W is imaged will have the outer edge of the arc shape of a part of the substrate W (see the substrate W within the imaging range IA in Figures 6(A) to 6(E)). The substrate W being imaged has a notch n in advance. The imaging information acquired while the camera 61 is imaging includes this notch n of the substrate W.
[0061] As shown in Figure 6(A), for example, the camera 61 first images the outer edge of the leading edge in the rotational direction of the substrate W, depending on the rotational speed and frame rate of the rotary table 21. Although Figure 6(A) shows an example where the notch n of the substrate W is also imaged at the same time, the position of the notch n depends on the rotational speed of the substrate W, so it does not have to be imaged at this timing.
[0062] Camera 61 repeats imaging multiple times based on the frame rate until imaging of the outer edge of the rear end in the rotational direction of the substrate W shown in Figures 6(B) to 6(E) is completed. The frame rate of camera 61 is set to a range of 1,000 to 10,000 times per second, as described above. For example, if the rotational speed of the rotary table 21 is 20 rpm, camera 61 can take 4,000 images of one substrate W that has passed through the camera 61 once.
[0063] Returning to Figure 5, the image processing unit 912 performs appropriate image processing on the imaging information acquired by the imaging information acquisition unit 911, thereby enabling the extraction of feature points included in the imaging information. Well-known methods can be used for this image processing, and therefore, a detailed explanation is omitted. Note that if the image processing is performed in the image processing module of the imaging unit 60, the control unit 91 does not need to perform image processing.
[0064] The feature point extraction unit 913 extracts feature points of the substrate W or mounting stage 211 from the imaging information processed by the image processing unit 912. In this embodiment, the feature point extraction unit 913 extracts the notch n, which is a pre-cut out of the outer edge of the substrate W, and the outer edge of the substrate W itself, as feature points of the substrate W. However, the feature points of the substrate W are not limited to these, and may also be orientation flats, irregularities formed on the substrate W, devices formed on the substrate W, films deposited on the substrate W, etc. The feature point extraction unit 913 may also extract feature points of the mounting stage 211 from the imaging information (for example, the outer edge of the outer frame of the mounting stage 211, and / or the inner edge of the outer frame of the mounting stage 211). Furthermore, when the feature point extraction unit 913 extracts the shape and position of the notch n of the substrate W (for example, two-dimensional coordinates based on the imaging range IA) from the imaging information, it stores the information of the notch n in association with the imaging timing of that imaging information.
[0065] The speed calculation unit 914 calculates the rotation speed of the substrate W using the feature points (notches n in this embodiment) of the substrate W extracted by the feature point extraction unit 913. Figure 7 is a diagram illustrating the principle of calculating the rotation speed of the substrate W.
[0066] The rotation speed of the substrate W can be calculated based on the position of notch n during the first revolution of the substrate W and the position of notch n during the second revolution of the same substrate W. The method for recognizing whether multiple substrates W on the rotating table 21 are the same substrate W is not particularly limited and may be used to count the number of substrates W that have been imaged, to recognize them based on the revolution speed and elapsed time (including the time from the start of imaging), or to recognize them based on the width of the substrate W, etc.
[0067] For example, if the rotation of the rotary table 21 causes the same substrate W to complete one rotation in one second, the speed calculation unit 914 can calculate the rotation speed based on the initial position of notch n on the substrate W and the position of notch n on the substrate W after one second (one rotation). As an example, if the rotation speed is 15 rpm (0.25 revolutions / second), as shown in the left diagram of Figure 7, the position of notch n after one rotation will be shifted by 90° from the initial position of notch n. Conversely, if the position of notch n after one rotation is shifted by 90° from the initial position of notch n, the rotation speed of the substrate W can be calculated to be 15 rpm.
[0068] Specifically, the speed calculation unit 914 acquires information on the time from when the substrate W appears in the imaging information until the notch n appears, and the position of the notch n on the substrate W, both when the substrate W is first imaged and when the substrate W is imaged after one rotation. The position of the notch n on the substrate W can be calculated, for example, based on the width of the outer edge of the substrate W included in the imaging information. Therefore, the speed calculation unit 914 can recognize the amount and direction of change in the position of the notch n on the same substrate W during the time it takes for the substrate W to complete one rotation by the rotary table 21, and can accurately calculate the rotation speed of the substrate W. The current position of the substrate W may be determined by acquiring the detected value of the encoder of the orbital motor 24 and referring to this detected value. The position of the notch n on the substrate W may also be determined by acquiring the detected value of the encoder 213a of the rotational motor 213 and referring to this detected value.
[0069] Here, the substrate W and the mounting table 211 may slip due to the influence of the rotation (revolution) of the rotary table 21. Therefore, even if a drive command is issued to rotate the mounting table 211 at a target rotation speed (for example, 15 rpm), the actual rotation speed may deviate from the target rotation speed. Even if the rotation speed is detected by the encoder 213a of the rotation motor 213, it is not possible to accurately detect the rotation speed of the substrate W and the mounting table 211, which are affected by this slip.
[0070] Therefore, the substrate processing apparatus 1 according to the embodiment calculates the rotation speed of the substrate W (or mounting table 211) using imaging information from the imaging unit 60, thereby enabling accurate calculation of the rotation speed of the substrate W even when slippage occurs during rotation. If slippage occurs during rotation of the mounting table 211, for example, as shown in the right figure of Figure 7, the position of notch n after one rotation will be at an angle closer to the position of the initial notch n. The control unit 91 can calculate the accurate actual rotation speed of the slipping substrate W (for example, 12 rpm in the example of Figure 7) based on the amount of movement from the initial notch n position to the notch n position after one rotation. Note that the speed calculation unit 914 is not limited to calculating the actual rotation speed using only the initial notch n position and the notch n position after one rotation, but may also include, for example, the notch n position after two rotations in its calculation of the actual rotation speed. Alternatively, the speed calculation unit 914 may also include the notch n position after three or more rotations in its calculation of the actual rotation speed.
[0071] Furthermore, if the rotation speed of the substrate W is extremely fast, it may be difficult to accurately determine the difference between the initial position of notch n and the position of notch n after one rotation. For example, if the orbital speed is 60 rpm and the rotation speed is 75 rpm, notch n may be in the same position as it was at a rotation speed of 15 rpm. In this case, the control unit 91 may calculate the rotation speed based on the rate of change of the position or tilt of notch n in each image, using multiple image data captured by the camera 61 at a constant frame rate.
[0072] In other words, the notch n included in the imaging information captured at a constant frame rate gradually changes in position and tilt according to the rotation speed of the substrate W. Therefore, the control unit 91 can calculate the actual rotation speed of the substrate W using the duration of the frame rate and the distance over which the position of the notch n has changed or the angle over which its tilt has changed. In particular, when the rotation speed of the substrate W is fast, the changes in the position and tilt of the notch n captured at a constant frame rate become larger, making it easier to calculate the actual rotation speed.
[0073] Returning to Figure 4, the drive control unit 915 of the control body 91 controls the rotational drive of the rotary table 21 and each mounting platform 211. For example, the drive control unit 915 controls the rotation (revolution) of the rotary table 21 and the rotation (rotation) of each mounting platform 211 so that they reach the target revolution speed and target rotation speed set in the substrate processing recipe. Alternatively, in controlling the rotation speed of each mounting platform 211, the drive control unit 915 may control the rotational drive of each mounting platform 211 so that the actual rotation speed of each substrate W (or each mounting platform 211) calculated by the speed calculation unit 914 becomes the target rotation speed.
[0074] The overall image generation unit 916 generates an overall image of each substrate W or each mounting table 211 based on multiple imaging information captured during substrate processing. In this process, the overall image generation unit 916 can accurately generate an overall image of each circular substrate W by combining multiple imaging information using the actual rotation speed calculated by the speed calculation unit 914. For example, since the angle of each of the multiple imaging information points with the center of the substrate W as the base point can be determined based on the actual rotation speed, the overall image generation unit 916 can accurately form a circular substrate W by changing the inclination of the imaging information according to the angle and performing image overlapping or cropping. The overall image of each substrate W generated from each imaging information shows the film deposited on the in-plane surface of the substrate W. Therefore, the control unit 91 can recognize the in-plane distribution of the film deposited on each substrate W.
[0075] The state recognition unit 917 recognizes the state of the substrate W or the mounting table 211 during substrate processing based on the overall image of the substrate W or the mounting table 211 generated by the overall image generation unit 916.
[0076] Figure 8 is a diagram illustrating the relationship between the overall image of the generated substrate W and the film thickness. For example, as shown in Figure 8, the state of the substrate W during substrate processing includes the film thickness of the film deposited on the substrate W. The state recognition unit 917 can calculate the film thickness and / or the in-plane distribution of the film thickness based on the density of the film shown in the overall image of the substrate W generated by the overall image generation unit 916.
[0077] As an example, the overall image generation unit 916 generates the overall image of the substrate W described above at regular intervals during substrate processing. The generated substrate W gradually becomes denser in terms of the density of the film on its surface over time. The state recognition unit 917 has table information or a function that shows the relationship between the film density and the film thickness, obtained by conducting experiments or simulations in advance, and calculates the film thickness during substrate processing. Furthermore, the state recognition unit 917 can determine the end of substrate processing at the timing tx when the film thickness reaches the threshold thickness Th by comparing the calculated film thickness with a preset film thickness threshold Th.
[0078] Figures 9(A) and 9(B) show the positional misalignment of the substrate in the overall view of the generated substrate and mounting table. As shown in Figures 9(A) and 9(B), the state recognition unit 917 can recognize the state of positional misalignment of the substrate W relative to the mounting table 211 based on the overall view of the substrate W and mounting table 211 generated by the overall view generation unit 916.
[0079] Specifically, as shown in Figure 9(A), during substrate processing, the substrate W placed on the mounting table 211 is subjected to centrifugal force due to the rotation of the rotary table 21, and is often shifted towards the outer frame of the mounting table 211. The control unit 91 can calculate the positional displacement of the substrate W on the mounting table 211 by generating an overall image of the substrate W and the mounting table 211 based on multiple imaging information. For example, the state recognition unit 917 calculates the distances C1 and C2 between the substrate W and the outer frame of the mounting table 211 in the direction perpendicular to the direction of the shift, and also calculates the distance C3 between the substrate W and the outer frame of the mounting table 211 in the direction opposite to the direction of the shift.
[0080] Furthermore, since the size of the substrate W during substrate processing and the size of each mounting table 211 are known, the state recognition unit 917 may maintain a threshold for the amount of misalignment of the substrate W relative to the mounting table 211 according to these sizes, and compare it with the calculated intervals C1 to C3. This makes it possible to determine an abnormal condition, such as the substrate W being overhanging the mounting table 211, if the intervals C1 to C3 are greater than or equal to the threshold. When the state recognition unit 917 recognizes such an abnormal condition, it can take early action, such as stopping the rotation of the rotary table 21 and stopping substrate processing, or notifying the user of an alert.
[0081] Alternatively, the state recognition unit 917 may determine the timing for cleaning the processing container 11 by recognizing the film thickness of the film being deposited on the indicator unit 211a provided on the outer frame of the mounting table 211. Examples of this indicator unit 211a include screws that fix the outer frame of the mounting table 211. In this case, it is preferable that the exposed heads of the screws be treated to facilitate film thickness measurement (for example, by applying a color opposite to the color of the film being deposited).
[0082] <Substrate Processing Method> The substrate processing apparatus 1 according to this embodiment is basically configured as described above, and its operation (substrate processing method) will be explained below with reference to Figure 10. Figure 10 is a flowchart showing the processing flow of the substrate processing method according to this embodiment.
[0083] In the substrate processing method, the control unit 90 (control body 91) controls each component of the substrate processing apparatus 1 and sequentially executes steps S101 to S110 shown in Figure 10.
[0084] Specifically, the drive control unit 915 of the control unit 90 controls the orbital motor 24 and the rotational motor 213 to rotate (orbit) the rotary table 21 on which each substrate W is placed on each mounting base 211, and also rotate (rotate) each mounting base 211 (step S101). At this time, the drive control unit 915 acquires detection information from the encoder of the orbital motor 24 and controls the rotary table 21 to rotate at a constant speed at the target orbital speed set in the recipe. Furthermore, the drive control unit 915 acquires detection information from the encoder 213a of the rotational motor 213 and controls the mounting base 211 to rotate at a constant speed at the target rotational speed set in the recipe. Before or after step S101, the substrate processing apparatus 1 may perform processes such as exhausting the gas in the processing container 11 with the gas exhaust unit 13 to reduce the pressure to a target pressure, and heating each substrate W to a target temperature with the heater 153, for the purpose of substrate processing.
[0085] Next, while the rotary table 21 continues to revolve and each mounting platform 211 continues to rotate, the control unit 90 controls the gas introduction unit 12 to supply gases such as raw material gas, reaction gas, and separation gas into the processing container 11 (step S102). This causes the desired film to be formed on the surface of each substrate W. In other words, as the gas is supplied, the substrate processing apparatus 1 performs substrate processing on each substrate W on the rotary table 21.
[0086] Then, during substrate processing, the imaging unit 60 images the rotating table 21 inside the processing container 11 at a constant frame rate based on a command from the imaging information acquisition unit 911, and transmits the imaging information to the control unit 90 (step S103). The image processing unit 912 performs appropriate image processing on the imaging information acquired by the imaging information acquisition unit 911 and then stores it in the memory 93.
[0087] Furthermore, the feature point extraction unit 913 of the control unit 90 extracts feature points from the image-processed imaging information (for example, the outer edge of the substrate W, the outer edge of the mounting table 211, etc.) to recognize the presence or absence of the substrate W in the imaging information (step S104). In this feature point extraction, the feature point extraction unit 913 may calculate the width of the substrate W, the distance from the outer frame of the mounting table 211, etc., based on the outer edge of the substrate W included in the imaging information. If the imaging information includes a part of the substrate W (or mounting table 211), the control unit 90 retains that imaging information. On the other hand, if the imaging information does not include the substrate W (or mounting table 211), the imaging information may be deleted.
[0088] Furthermore, the feature point extraction unit 913 determines whether the notch n can be sufficiently identified in the substrate W of the extracted imaging information (step S105). If the notch n can be sufficiently identified, it is determined that the imaging information will be used to calculate the rotation speed (step S105: YES). On the other hand, if the notch n cannot be sufficiently identified, it is determined that the imaging information will not be used (step S105: NO), and the imaging information will not be used to calculate the rotation speed.
[0089] Subsequently, the speed calculation unit 914 calculates the actual rotation speed of the substrate W using the extracted notch n (step S106). As described above, the speed calculation unit 914 retains the initial (previous, one rotation ago) position of notch n as information, and can accurately calculate the actual rotation speed of the substrate W based on this information and the position of notch n after one rotation (this time). In calculating the actual rotation speed, the speed calculation unit 914 may correct the calculated value using the value of the encoder 213a of the rotation motor 213, the time of the imaging information, the width of the substrate W, etc. After calculation, the drive control unit 915 may also use the value of the encoder 213a of the rotation motor 213 and the difference in actual rotation speeds to provide feedback control for the rotation of each substrate W.
[0090] Furthermore, the speed calculation unit 914 may calculate the actual orbital speed of the rotary table 21 based on the spacing between each mounting platform 211 in multiple imaging data and the frame rate (step S107). After calculation, the drive control unit 915 may use the encoder value of the orbital motor 24 and the actual orbital speed value to provide feedback control for the orbit of the rotary table 21.
[0091] The overall image generation unit 916 generates an overall image of the substrate W (and each mounting stage 211) using the calculated actual rotation speed and each imaging information with acquisition timing (step S108). The generation of the overall image of the substrate W is performed for each of the multiple substrates W placed on the rotary table 21. The generation of the overall image of each substrate W may be performed each time the rotary table 21 completes one rotation, or it may be performed at intervals set to reduce the processing load on the control unit 90. This interval may be set automatically (or based on user input) according to the substrate processing recipe.
[0092] Furthermore, the state recognition unit 917 recognizes the state of each substrate W and each mounting stage 211 based on the overall image of each generated substrate W and each mounting stage 211 (step S109). For example, the state recognition unit 917 estimates the film deposition state by recognizing the in-plane distribution of the film on each generated substrate W as described above, and determines the timing to stop film deposition. Alternatively, the state recognition unit 917 may transmit an instruction to the drive control unit 915 to adjust the rotation speed of the corresponding substrate W based on the in-plane distribution of the film on the substrate W. For example, if the film thickness is thicker in the center of the substrate W and thinner in the outer periphery, an instruction to increase the rotation speed may be given, while if the film thickness is thinner in the center of the substrate W and thicker in the outer periphery, an instruction to decrease the rotation speed may be given.
[0093] The control unit 90 then determines the timing for ending the substrate processing (step S110). The timing for ending the substrate processing can be determined by whether the actual measured period has reached the target period for substrate processing set in the recipe. Alternatively, the timing for ending the substrate processing can be determined when the state recognition unit 917 recognizes that the film thickness of each substrate W has reached the desired thickness. If the control unit 90 decides to continue the substrate processing (step S110: NO), it returns to step S103 and repeats the same processing flow. On the other hand, if the control unit 90 decides to end the substrate processing (step S110: NO), it performs appropriate termination control to stop the substrate processing. Examples of this termination control include stopping the supply of various gases by the gas introduction unit 12, stopping the heating of each substrate W, stopping the rotation of the rotary table 21, stopping the rotation of each mounting table 211, and stopping imaging by the imaging unit 60.
[0094] As described above, the substrate processing apparatus 1 and substrate processing method according to the embodiment can accurately calculate the actual rotation speed of the substrate W using imaging information of a narrow range captured through the long window 112w. Furthermore, the substrate processing apparatus 1 and substrate processing method can accurately generate an overall image of the substrate W and each mounting stage 211 based on the calculated actual rotation speed and each imaging information, thereby enabling the recognition of various states of each substrate W and each mounting stage 211 during substrate processing.
[0095] <Variation> It should be noted that the substrate processing apparatus 1 and substrate processing method according to this disclosure are not limited to the embodiments described above and can be modified in various ways. For example, the state recognition unit 917 is not limited to recognizing the state using an overall image of the substrate W and / or the mounting table 211, but may also directly recognize the state from imaging information acquired from the camera 61. As an example, when monitoring the density of the film deposited on the substrate W (calculation and determination of film thickness, etc.), monitoring may be performed using a partial image of the substrate W included in the imaging information. Similarly, when determining whether or not to perform cleaning based on the film thickness accumulated on the outer frame of the mounting table 211, a partial image of the mounting table 211 included in the imaging information may also be used.
[0096] Furthermore, the substrate processing apparatus 1 may rotate the rotary table 21 not only in one direction (clockwise in Figure 2), but also in the opposite direction (counterclockwise), and may switch the rotation direction during substrate processing. In addition, the substrate processing apparatus 1 may rotate each mounting table 211 not only in one direction (clockwise in Figure 2), but also in the opposite direction (counterclockwise), and may switch the rotation direction during substrate processing. Of course, the substrate processing apparatus 1 may independently control the rotation direction of each mounting table 211.
[0097] Figure 11(A) is a side cross-sectional view showing an imaging unit 60A according to a modified example. Figure 11(B) is a diagram showing a substrate W imaged by the imaging unit according to the modified example. The imaging unit 60A according to the modified example is configured to project multiple point-like illuminations onto the surface of the substrate W using an illumination device 62A. For example, the imaging unit 60A includes a filter unit 67 that can be switched to point-like illumination, and a drive unit 68 that moves the filter unit 67 forward and backward. The drive unit 68 makes it possible to illuminate the point-like illuminations sk by positioning the filter unit 67 in front of the illumination of the illumination device 62 based on the control of the control unit 90.
[0098] Each point sk irradiated onto the substrate W is arranged, for example, in a matrix. The camera 61 acquires imaging information of each point sk on the substrate W during imaging. If the substrate W is warped, the spacing between the points sk at the warped locations changes (closer or further apart). Therefore, the control unit 90 can recognize the state of warping on each substrate W (degree of warping, location of warping, direction of warping, etc.) by monitoring each point sk included in the acquired imaging information. In monitoring each point sk, as described above, it is possible to accurately calculate the spacing between each point sk by generating an overall image of the substrate W based on the actual rotation speed.
[0099] Furthermore, the control unit 90 can determine whether or not the substrate W has warped beyond a predetermined level, and take measures such as stopping the substrate processing or adjusting the orbital speed or rotational speed. This makes it possible to prevent problems such as the warped substrate W flying off the mounting table 211.
[0100] <Note> The technical ideas and effects of this disclosure, as described in the embodiments above, are described below.
[0101] A first aspect of the present disclosure is a substrate processing apparatus 1 comprising: a processing container 11 capable of performing substrate processing; a rotary table 21 rotatably provided inside the processing container 11; a mounting table 211 on which a substrate W is placed at a position away from the rotation center of the rotary table 21, which moves with the rotation of the rotary table 21 and rotates relative to the rotary table 21; an imaging device (camera 61) provided outside the processing container 11 and capable of imaging the mounting table 211 and the substrate W placed on the mounting table 211; and an information processing unit (control unit 90) for processing imaging information from the imaging device, wherein the imaging device images a range on the circumferential direction of the rotary table 21 that is narrower than the radius of the mounting table 211 when performing substrate processing.
[0102] As described above, the substrate processing apparatus 1 can process the image information of the rotating (revolving and rotating on its own axis) substrate W at an efficient speed by imaging an area on the circumferential direction of the rotary table 21 that is narrower than the radius of the mounting table 211 using the imaging device (camera 61). Furthermore, by using this image information of the substrate W and the mounting table 211, the substrate processing apparatus 1 can accurately recognize the state of the substrate W even when the substrate W is revolving and rotating on its own axis within the processing container 11. Therefore, for example, the substrate processing apparatus 1 can take early action, such as stopping the substrate processing, when there is an abnormality in the state of the substrate W.
[0103] Furthermore, the information processing unit (control unit 90) calculates the rotation speed of the substrate W based on the feature points (notches n) of the substrate W included in the multiple imaging data. This allows the substrate processing device 1 to calculate the rotation speed of the substrate W easily and accurately.
[0104] Furthermore, the information processing unit (control unit 90) generates an overall image of the substrate W based on the calculated rotation speed of the substrate W and the substrate W included in multiple imaging information. By using the rotation speed and multiple imaging information in this way, the substrate processing device 1 can generate an overall image that reflects the state of the substrate W, even when the imaging device (camera 61) images a narrow area.
[0105] Furthermore, multiple mounting tables 211 are provided in the circumferential direction of the rotary table 21 and can rotate independently of each other. The information processing unit (control unit 90) generates an overall image of each substrate W placed on one of the multiple mounting tables 211. As a result, the substrate processing device 1 can reliably recognize the state of all substrates W being processed.
[0106] Furthermore, the information processing unit (control unit 90) calculates the displacement of the substrate W relative to the mounting table 211 based on the imaging information. This allows the substrate processing device 1 to accurately recognize the displacement of the substrate W during substrate processing and to detect abnormalities early.
[0107] Furthermore, the information processing unit (control unit 90) estimates the film thickness of the film deposited on the substrate W based on the imaging information. This allows the substrate processing device 1 to accurately recognize the film thickness of the substrate W during substrate processing, and for example, to appropriately determine the timing of the end of substrate processing.
[0108] Furthermore, the information processing unit (control unit 90) calculates the warping state of the substrate W based on the imaging information. This allows the substrate processing device 1 to recognize the warping state of the substrate W during substrate processing and to detect abnormalities early.
[0109] Furthermore, the processing container 11 extends along the radial direction of the rotary table 21 and is equipped with a light-transmitting elongated window 112w at the installation position of the imaging device (camera 61). This elongated window 112w allows the substrate processing device 1 to easily define the imaging range IA of the imaging device.
[0110] Furthermore, the processing container 11 is equipped with a support structure (housing 63) fixed to the top plate 112, and the support structure integrally supports the imaging device (camera 61) and the illumination device 62 that irradiates light onto the rotary table 21. As a result, the substrate processing device 1 can fix the positions of the imaging device and the illumination device 62, and can capture good images of the substrate W and the mounting table 211 in the imaging range IA.
[0111] Furthermore, a second aspect of this disclosure includes a processing container 11 capable of performing substrate processing, a rotary table 21 rotatably provided inside the processing container 11, a mounting table 211 on which a substrate W is placed at a position away from the rotation center of the rotary table 21, which moves with the rotation of the rotary table 21 and rotates relative to the rotary table 21, an imaging device (camera 61) provided outside the processing container 11 capable of imaging the mounting table 211 and the substrate W placed on the mounting table 211, and an information processing unit (control unit 90) that processes imaging information from the imaging device. A substrate processing method for a substrate processing apparatus 1 comprising the steps of: rotating a rotary table 21 and rotating a mounting table 211 while performing substrate processing on a substrate W placed on the mounting table 211; imaging a range on the circumferential direction of the rotary table 21 that is narrower than the radius of the mounting table 211 using an imaging device during the execution of the substrate processing step; and calculating the rotation speed of the substrate W based on the feature points of the substrate W included in a plurality of imaging information captured by the imaging device using an information processing unit (control unit 90). Even in this case, the substrate processing method can accurately recognize the state of the substrate in a configuration in which the substrate revolves and rotates within the processing container.
[0112] The substrate processing apparatus 1 and substrate processing method according to the embodiments disclosed herein are illustrative in all respects and are not restrictive. The embodiments can be modified and improved in various ways without departing from the scope and spirit of the appended claims. The matters described in the above embodiments can be otherwise configured and combined in a non-consistent manner. [Explanation of Symbols]
[0113] 1. Substrate processing apparatus 11 Processing container 21 Rotating Table 61 Camera 90 Control Unit 211 Mounting platform W board
Claims
1. A processing container capable of performing substrate processing, A rotating table is provided inside the processing container so as to be rotatable, A mounting platform is provided, on which a substrate is placed at a position away from the rotation center of the aforementioned rotating table, and which moves in conjunction with the rotation of the rotating table and rotates relative to the rotating table. An imaging device provided outside the processing container, capable of imaging the aforementioned mounting stand and the substrate placed on the mounting stand, A substrate processing apparatus comprising an information processing unit for processing imaging information from the imaging device, The imaging device, when performing the substrate processing, captures an area on the circumferential direction of the rotary table that is narrower in width than the radius of the mounting stand described above. Circuit board processing equipment.
2. The information processing unit calculates the rotation speed of the substrate based on the feature points of the substrate included in the plurality of imaging information. The substrate processing apparatus according to claim 1.
3. The information processing unit generates an overall image of the substrate based on the calculated rotation speed of the substrate and the substrate included in the plurality of imaging information. The substrate processing apparatus according to claim 2.
4. Multiple mounting platforms are provided in the circumferential direction of the rotating table and are capable of rotating independently of each other. The information processing unit generates an overall image of each of the substrates placed on the plurality of the aforementioned mounting stands. The substrate processing apparatus according to claim 3.
5. The information processing unit calculates the displacement state of the substrate relative to the mounting stand described above based on the imaging information. A substrate processing apparatus according to any one of claims 1 to 4.
6. The information processing unit estimates the thickness of the film to be deposited on the substrate based on the imaging information. A substrate processing apparatus according to any one of claims 1 to 4.
7. The information processing unit calculates the warping state of the substrate based on the imaging information. A substrate processing apparatus according to any one of claims 1 to 4.
8. The processing container extends along the radial direction of the rotating table and is provided with a long, light-transmitting window at the installation position of the imaging device. A substrate processing apparatus according to any one of claims 1 to 4.
9. The processing container is equipped with a support structure that is fixed to the top plate, The support structure integrally supports the imaging device and the illumination device that irradiates light onto the rotating table. A substrate processing apparatus according to any one of claims 1 to 4.
10. A processing container capable of performing substrate processing, A rotating table is provided inside the processing container so as to be rotatable, A mounting platform is provided, on which a substrate is placed at a position away from the rotation center of the aforementioned rotating table, and which moves in conjunction with the rotation of the rotating table and rotates relative to the rotating table. An imaging device provided outside the processing container, capable of imaging the aforementioned mounting stand and the substrate placed on the mounting stand, A substrate processing method for a substrate processing apparatus comprising an information processing unit for processing imaging information of the imaging device, The process involves rotating the aforementioned rotating table and the aforementioned mounting stand, while performing substrate processing on the aforementioned mounting stand, During the process of performing the substrate processing, the imaging device is used to image an area on the circumferential direction of the rotary table that is narrower in width than the radius of the base described above. The process includes a step of calculating the rotation speed of the substrate based on the characteristic points of the substrate included in a plurality of imaging data captured by the imaging device by the information processing unit. Substrate processing method.