PCB transport device

Abstract

To provide a substrate transport device that can reduce vibrations of the end effector. [Solution] The substrate transport device loads and unloads substrates W into and out of a substrate container. The substrate transport device comprises an end effector 30, a transport drive unit 40, and an optical displacement meter 60. The end effector 30 has an inclined reflective surface 31a and supports the substrate W. The transport drive unit 40 moves the end effector 30 along the forward / backward direction Dx relative to the substrate container. The optical displacement meter 60 includes a light-emitting unit 61 and a light-receiving unit 62. The light-emitting unit 61 emits measurement light L1 from a position behind the inclined reflective surface 31a in the forward / backward direction Dx toward the inclined reflective surface 31a in an oblique direction toward the inclined reflective surface 31a. The light-receiving unit 62 receives the measurement light L1 from the inclined reflective surface 31a. The optical displacement meter 60 detects the position of the inclined reflective surface 31.

Description

Technical Field

[0001] The present disclosure relates to a substrate transfer device.

Background Art

[0002] Conventionally, transfer robots for transferring workpieces have been proposed (for example, Patent Documents 1 to 3). The transfer robot includes an end effector for supporting or holding a workpiece and a drive unit for moving the end effector. In Patent Documents 1 to 3, various sensors are provided in the end effector.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] A substrate processing apparatus for processing a substrate is also provided with a transfer robot for transferring the substrate. The transfer robot unloads a target substrate to be unloaded from a plurality of substrates in a substrate container placed on the substrate processing apparatus. The transfer robot transfers the substrate toward a processing unit. The processing unit performs wet processing or dry processing on the substrate. The transfer robot loads the substrate processed by the processing unit into the substrate container.

[0005] This transport robot includes an end effector that supports the substrate and a transport drive unit that moves the end effector. The transport drive unit moves the end effector into the substrate container with its tip first. The drive of this transport drive unit causes the tip of the end effector to vibrate. This vibration may cause the tip of the end effector to collide with the substrate inside the substrate container.

[0006] To avoid such collisions, one could consider installing a vibration sensor at the tip of the end effector. However, the addition of the vibration sensor would increase the weight of the end effector's tip, which would actually increase the amplitude of the end effector's vibration.

[0007] Therefore, the object of this disclosure is to provide a substrate transport device that can reduce vibration of the end effector. [Means for solving the problem]

[0008] The substrate transport device is a substrate transport device for transporting substrates into and out of a substrate container, and comprises an end effector having an inclined reflective surface and supporting the substrate, a transport drive unit for moving the end effector along the forward and backward direction relative to the substrate container, a light-emitting unit that emits measuring light obliquely toward the inclined reflective surface from a position behind the inclined reflective surface in the forward and backward direction, and a light-receiving unit that receives the measuring light from the inclined reflective surface, and an optical displacement meter for detecting the position of the inclined reflective surface. [Effects of the Invention]

[0009] This can reduce vibrations in the end effector. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a schematic plan view showing an example of the configuration of a substrate processing apparatus, including a first transport unit, which is an example of a substrate transport apparatus. [Figure 2] Figure 2 is a block diagram schematically showing an example of the internal configuration of the control unit. [Figure 3] Figure 3 is a schematic front view showing an example of the configuration of a substrate housing. [Figure 4] Figure 4 is a schematic diagram showing an example of the configuration of the first transport unit according to the first embodiment. [Figure 5] Figure 5 is a schematic perspective view showing an example of an end-effector configuration. [Figure 6] Figure 6 shows an example of how the tip of the end effector vibrates perpendicularly to the base. [Figure 7] Figure 7 is a schematic diagram illustrating an example of how measurement light passes through the substrate. [Figure 8] Figure 8 is a flowchart showing an example of the unloading operation in which the first transport unit unloads a substrate from the substrate container. [Figure 9] Figure 9 is a schematic diagram showing an example of the configuration of an end effector according to the second embodiment. [Figure 10] Figure 10 is a schematic diagram showing a first example of the configuration of an end effector according to the third embodiment. [Figure 11] Figure 11 is a schematic diagram showing a second example of the configuration of an end effector according to the third embodiment. [Figure 12] Figure 12 is a schematic diagram showing a third example of the configuration of an end effector according to the third embodiment. [Figure 13] Figure 13 is a schematic diagram showing a first example of the configuration of an end effector according to the fourth embodiment. [Figure 14] Figure 14 is a schematic perspective view showing a first example of the configuration of an end effector according to the fourth embodiment. [Figure 15] Figure 15 is a schematic diagram showing a second example of the configuration of an end effector according to the fourth embodiment. [Figure 16] Figure 16 is a schematic perspective view showing a third example of the configuration of an end effector according to the fourth embodiment. [Figure 17] Figure 17 is a schematic perspective view showing an example of the configuration of an end effector according to the sixth embodiment. [Figure 18] FIG. 18 is a diagram schematically showing a first example of the configuration of the first transport unit according to the seventh embodiment. [Figure 19] FIG. 19 is a perspective view schematically showing a first example of the configuration of the first transport unit according to the seventh embodiment. [Figure 20] FIG. 20 is a diagram schematically showing a second example of the configuration of the first transport unit according to the seventh embodiment. [Figure 21] FIG. 21 is a diagram schematically showing a third example of the configuration of the first transport unit according to the seventh embodiment.

Embodiments for Carrying out the Invention

[0011] Hereinafter, embodiments will be described in detail with reference to the drawings. In the drawings, for the purpose of easy understanding, the dimensions and numbers of each part are exaggerated or simplified as necessary. Also, parts having the same configuration and function are denoted by the same reference numerals, and redundant descriptions are omitted in the following description.

[0012] Also, in the following description, the same reference numerals are used to illustrate the same components, and their names and functions are also assumed to be the same. Therefore, detailed descriptions thereof may be omitted to avoid duplication.

[0013] Also, in the following description, even when ordinal numbers such as "first" or "second" are used, these terms are used for convenience in order to facilitate understanding of the content of the embodiment, and are not limited to the order that may be generated by these ordinal numbers.

[0014] When expressions indicating relative or absolute positional relationships are used (e.g., "in one direction," "along one direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.), unless otherwise specified, such expressions shall not only strictly represent the positional relationship but also represent a state in which there is a relative displacement in terms of angle or distance within a tolerance or a range in which equivalent functionality is obtained. When expressions indicating equality are used (e.g., "identical," "equal," "homogeneous," etc.), unless otherwise specified, such expressions shall not only strictly represent a state in which there is a quantitatively exact equality but also represent a state in which there is a difference within a tolerance or a range in which equivalent functionality is obtained. When expressions indicating shape are used (e.g., "quadrilateral" or "cylindrical"), unless otherwise specified, such expressions shall not only strictly represent the geometrically exact shape but also represent a shape with features such as concavities or chamfers within a range in which equivalent effects are obtained. When expressions such as "possess," "equip," "include," or "have" a single component are used, such expressions are not exclusive expressions that exclude the existence of other components. When the expression "at least one of A, B, and C" is used, it includes A only, B only, C only, any two of A, B, and C, and all of A, B, and C.

[0015] <First Embodiment> <Overall configuration of the substrate processing equipment> Figure 1 is a schematic plan view showing an example of the configuration of a substrate processing apparatus 100, including a first transport unit 20, which is an example of a substrate transport device. The substrate processing apparatus 100 is a single-wafer processing apparatus that processes substrates W one at a time.

[0016] The substrate W is, for example, a semiconductor wafer, a substrate for liquid crystal displays, an organic electroluminescence (EL) substrate, a flat panel display (FPD) substrate, an optical display substrate, a magnetic disk substrate, an optical disk substrate, a magneto-optical disk substrate, a photomask substrate, or a solar cell substrate. The substrate W has a thin, flat shape. In the following, it is assumed that the substrate W is a semiconductor wafer. The substrate W has, for example, a disc shape. The diameter of the substrate W is, for example, about 300 mm, and the film thickness of the substrate W is, for example, about 0.5 mm or more and about 5 mm or less.

[0017] In the example shown in Figure 1, the substrate processing apparatus 100 includes an indexer block 110, a processing block 120, and a control unit 90. The processing block 120 is primarily responsible for processing the substrate W. In the example shown in Figure 1, the indexer block 110 is primarily responsible for transporting the substrate W between the outside of the substrate processing apparatus 100 and the processing block 120.

[0018] The indexer block 110 includes a first transport unit 20. As shown in Figure 1, the indexer block 110 may be provided with a load port 10. A substrate container C, brought in from the outside, is placed on the load port 10. In other words, the load port 10 includes a mounting platform on which the substrate container C is placed. The mounting platform may be provided with a holding mechanism (not shown) for holding the substrate container C. In the example in Figure 1, a plurality of load ports 10 are arranged along a horizontal arrangement direction Dy. A plurality of substrates W are housed in the substrate container C. As an example, the plurality of substrates W are housed in the substrate container C with spacing between them in the vertical direction. A specific example of the configuration of the substrate container C will be described in detail later.

[0019] The first transport unit 20 is a transport robot, and may also be called an indexer robot. The first transport unit 20 transports the substrates W between each substrate container C and the processing block 120. As shown in Figure 1, the first transport unit 20 includes an end effector 30. The first transport unit 20 inserts the end effector 30 into the substrate container C from its tip to take out the substrates W from the substrate container C or to pass the substrates W to the substrate container C.

[0020] In the example shown in Figure 1, the first transport unit 20 is provided to be movable along the arrangement direction Dy and can be stopped at a position facing each substrate container C. With the first transport unit 20 facing the substrate container C, it moves the end effector 30 toward the inside of the substrate container C from its tip and stops the end effector 30 directly beneath the substrate W. Then, the first transport unit 20 raises the end effector 30 to lift the unprocessed substrate W and retracts the end effector 30, which is supporting the substrate W, from the substrate container C. This allows the first transport unit 20 to remove the substrate W from the substrate container C.

[0021] Next, the first transport unit 20 moves along the array direction Dy toward a position where it can transfer the substrate W to the processing block 120, and at that position, it transfers the substrate W to the processing block 120. The processing block 120 processes the substrate W. Then, the first transport unit 20 receives the processed substrate W from the processing block 120. Having received the processed substrate W, the first transport unit 20 moves to a position facing the substrate container C. The first transport unit 20 moves the end effector 30 supporting the substrate W into the substrate container C, and then lowers the end effector 30. As a result, the processed substrate W is transferred from the end effector 30 to the substrate container C. Then, the first transport unit 20 retracts the end effector 30. In this manner, the first transport unit 20 transports the substrate W between each substrate container C and the processing block 120.

[0022] In the example shown in Figure 1, the processing block 120 includes a plurality of processing units 121 and a second transport unit 122. The second transport unit 122 is a transport robot that transports the substrate W between the first transport unit 20 and the plurality of processing units 121. In the example shown in Figure 1, the second transport unit 122 transfers the substrate W from the first transport unit 20 via a relay unit 123. The relay unit 123 may be a shelf on which the substrate W is placed, or it may be a shuttle-type transport unit.

[0023] In the example shown in Figure 1, multiple (e.g., four) processing units 121 are arranged to surround the second transport unit 122 in a plan view. This second transport unit 122 may also be called a center robot. At each position in the plan view, the multiple processing units 121 may be stacked vertically. That is, multiple (four in the figure) towers TW, each composed of multiple processing units 121 stacked vertically, may be arranged to surround the second transport unit 122. The processing units 121 perform various wet or dry processing on the substrate W, for example.

[0024] The control unit 90 comprehensively controls the substrate processing apparatus 100. More specifically, the control unit 90 controls the first transport unit 20, the second transport unit 122, and the processing unit 121. Figure 2 is a schematic block diagram showing an example of the internal configuration of the control unit 90. The control unit 90 is an electronic circuit and includes, for example, a data processing unit 91 and a storage unit 92. The data processing unit 91 and the storage unit 92 may be interconnected via a bus 93. The data processing unit 91 may be an arithmetic processing unit such as a CPU (Central Processor Unit). The storage unit 92 may include a non-temporary storage unit (e.g., ROM (Read Only Memory)) 921 and a temporary storage unit (e.g., RAM (Random Access Memory)) 922. The non-temporary storage unit 921 may store, for example, a program that defines the processing to be executed by the control unit 90. By executing this program, the data processing unit 91 enables the control unit 90 to execute the processing defined in the program. Of course, some or all of the processing performed by the control unit 90 may be performed by hardware such as dedicated logic circuits. In the example shown in Figure 2, the control unit 90 is also connected to a non-temporary storage unit 94 (for example, a memory such as flash memory or a hard disk). Furthermore, the data processing unit 91 may process the information acquired by the optical displacement sensor based on a program in the storage unit 92 to detect the position of the inclined reflective surface 31a. Additionally, the control unit 90 may control the operation of the forward / backward drive unit 41, the lifting / lowering drive unit 42, the rotation drive unit 43, and the movement drive unit 44 based on a program in the storage unit 92.

[0025] <Circuit board housing C> The substrate housing C may be a FOUP (Front Opening Unified Pod) or SMIF (Standard Mechanical Interface) pod that houses the substrate W in a sealed state, or it may be an OC (Open Cassette) that houses the substrate W in an open state. The substrate housing C may also be called a carrier.

[0026] Figure 3 is a schematic front view showing an example of the configuration of a substrate housing C. The substrate housing C has a box-shaped form that opens in one direction, approximately horizontally (towards the front of the paper in Figure 3). Specifically, the substrate housing C has a bottom 51, a top 52, and side walls 53. The bottom 51 and top 52 have a rectangular plate shape and face each other with a gap between them in the vertical direction. The side walls 53 connect the periphery of the bottom 51 and the periphery of the top 52 on three sides. As a result, an opening 55 is formed in the part where the side walls 53 are not provided. The substrate W is removed from or loaded into the substrate housing C through the opening 55. The substrate housing C may be provided with a lid that can be opened and closed to close the opening 55.

[0027] The substrate housing C is positioned in the load port 10 such that its opening 55 faces the first transport unit 20 (see also Figure 1). Multiple projection support parts 54 are provided on the inner surface of the side wall 53 to support the lower surface of the substrate W. Each projection support part 54 protrudes inward from the inner surface of the side wall 53. The upper surface of the projection support part 54 is approximately horizontal. Each projection support part 54 supports the end of the substrate W. Multiple projection support parts 54 are provided at intervals in the vertical direction, and multiple substrates W are supported by the projection support parts 54 on the left and right sides of the paper. Multiple substrates W are housed in the substrate housing C in a stacked state with gaps in the vertical direction. The number of substrates W housed in the substrate housing C is arbitrary, for example, 25.

[0028] Since both ends of the substrate W are supported inside the substrate housing C, the substrate W may bend, as shown in Figure 3, especially if the substrate W is thin. Specifically, the substrate W may bend in a convex shape downwards. In this case, the distance between adjacent substrates W becomes narrower in the central part of the substrate W. Since the end effector 30 of the first transport unit 20 enters between adjacent substrates W, a narrower distance increases the risk of the end effector 30 colliding with the substrate W.

[0029] <First transport unit> Figure 4 is a schematic diagram showing an example of the configuration of the first transport unit 20 according to the first embodiment. The first transport unit 20 includes an end effector 30, a transport drive unit 40, and an optical displacement meter 60.

[0030] <End effector> The end effector 30 supports the substrate W. The end effector 30 also has an inclined reflective surface 31a. As described later, measurement light L1 from the optical displacement meter 60 is incident on the inclined reflective surface 31a.

[0031] Figure 5 is a schematic perspective view showing an example of the configuration of the end effector 30. In the examples of Figures 4 and 5, the end effector 30 has a plate-like shape and is installed with its thickness direction aligned with the vertical direction. In the examples of Figures 4 and 5, the end effector 30 includes a hand 300. The hand 300 includes a first long portion 31A, a second long portion 31B, and a connecting portion 32. The first long portion 31A has a long plate-like shape and is installed with its longitudinal direction aligned with the horizontal direction. The second long portion 31B has a long plate-like shape and is installed with its longitudinal direction aligned with the horizontal direction. The height positions of the first long portion 31A and the second long portion 31B are approximately the same. The first long portion 31A and the second long portion 31B are spaced apart in their short-side directions. The connecting portion 32 connects the base end of the first elongated portion 31A and the base end of the second elongated portion 31B to each other. The connecting portion 32 has a plate-like shape and is provided in a position where its thickness direction is aligned with the vertical direction. The first elongated portion 31A, the second elongated portion 31B, and the connecting portion 32 may be integrally formed from the same material (for example, aluminum, carbon, or ceramics).

[0032] In the following, the tip side of the first elongated portion 31A in the longitudinal direction will be simply referred to as the tip side, and the side with the connecting portion 32 in the longitudinal direction will be referred to as the base end side. The tip of the end effector 30 is a predetermined area on the tip side of the end effector 30.

[0033] In the examples shown in Figures 4 and 5, the end effector 30 includes a protrusion 33. In the examples shown in Figures 4 and 5, the protrusion 33 is provided on the upper surface of the hand 300. As a more specific example, a protrusion 33 is provided on the tip of the first long section 31A and on the tip of the second long section 31B. Hereinafter, the protrusion 33 provided on the first long section 31A will also be referred to as protrusion 33A, and the protrusion 33 provided on the second long section 31B will also be referred to as protrusion 33B. As an example, the upper surface of the first long section 31A is a horizontal flat surface, and the protrusion 33A is provided on this upper surface. That is, the protrusion 33A protrudes upward from the upper surface of the first long section 31A. The upper surface of the second long section 31B is a horizontal flat surface, and the protrusion 33B is provided on this upper surface. That is, the protrusion 33B protrudes upward from the upper surface of the second long section 31B.

[0034] Each protrusion 33 has an inclined reflective surface 31a. The inclined reflective surface 31a is part of the side surface of the protrusion 33. Therefore, the inclined reflective surface 31a is located on the upper side of the end effector 30. Specifically, the inclined reflective surface 31a corresponds to a part of the side surface of the protrusion 33 on the base end side. The inclined reflective surface 31a is inclined with respect to the horizontal plane. More specifically, the inclined reflective surface 31a is inclined so as it approaches the tip side in the longitudinal direction, it is inclined vertically upward. As described later, the measurement light L1 from the optical displacement meter 60 is incident on the inclined reflective surface 31a. The measurement light L1 reflected by the inclined reflective surface 31a travels toward the optical displacement meter 60 and is received by the optical displacement meter 60. Hereafter, the inclined reflective surface 31a of the protrusion 33A will also be referred to as the inclined reflective surface 31aA (corresponding to the first inclined reflective surface), and the inclined reflective surface 31a of the protrusion 33B will also be referred to as the inclined reflective surface 31aB (corresponding to the second inclined reflective surface).

[0035] As shown in Figure 4, the protrusion 33 may be a protrusion 34 for positioning the substrate W. In the example in Figure 4, the end effector 30 includes protrusions 34 at positions that sandwich the substrate W in the longitudinal direction. For example, in a plan view, the end effector 30 includes four protrusions 34. The four protrusions 34 abut against the periphery of the substrate W to position the substrate W. In the example in Figure 4, the substrate W is shown by dashed lines. Here, the first protrusion 34 is provided at the tip of the first elongated portion 31A, on the tip side of the substrate W supported by the end effector 30. This first protrusion 34 corresponds to protrusion 33A. The second protrusion 34 is provided on the second elongated portion 31B, on the tip side of the substrate W supported by the end effector 30. This second protrusion 34 corresponds to protrusion 33B. Furthermore, a third protrusion 34 and a fourth protrusion 34 are provided on the base end side of the substrate W supported by the end effector 30. The third protrusion 34 and the fourth protrusion 34 may be provided on the first elongated portion 31A and the second elongated portion 31B, respectively, or on the connecting portion 32. The substrate W is positioned on the end effector 30 by the first to fourth protrusions 34 contacting the periphery of the substrate W.

[0036] <Transport drive unit> The transport drive unit 40 is controlled by the control unit 90 to move the end effector 30 in three dimensions. For example, the transport drive unit 40 includes a forward / backward drive unit 41, a lifting / lowering drive unit 42, a rotation drive unit 43, and a movement drive unit 44. The forward / backward drive unit 41 moves the end effector 30 along the longitudinal direction of the first long section 31A and the second long section 31B. The forward / backward drive unit 41 includes, for example, a plurality of arms 411. The plurality of arms 411 are rotatably coupled to each other. The tip of the coupled arms 411 is rotatably coupled to the coupling section 32 of the end effector 30, and the base of the coupled arms is rotatably coupled to, for example, the lifting / lowering drive unit 42. A motor is provided at each coupling section to change the coupling angle between the two members. The motors work in conjunction to move the end effector 30 along its longitudinal direction.

[0037] The lifting drive unit 42 raises and lowers the end effector 30. The lifting drive unit 42 may raise and lower the end effector 30 and the forward / backward drive unit 41 together. The lifting drive unit 42 includes, for example, a drive source such as a motor and a power transmission unit that transmits the driving force of the drive source to the end effector 30. The power transmission unit includes, for example, a ball screw mechanism or a cam mechanism. The vertical movement range (i.e., lifting range) of the end effector 30 by the lifting drive unit 42 can be set to, for example, a range from the inner bottom surface to the ceiling surface of the substrate housing C. This allows the lifting drive unit 42 to raise and lower the end effector 30 to a height position corresponding to any substrate W in the substrate housing C. As a specific example, the lifting range may be set to 100 mm or more, 200 mm or more, or 300 mm or more.

[0038] The rotary drive unit 43 rotates the end effector 30 around a predetermined axis of rotation. The predetermined axis of rotation is an axis extending in the vertical direction. The rotary drive unit 43 rotates the end effector 30 between a first rotation position in which the tip of the end effector 30 faces the substrate housing C side and a second rotation position in which the tip of the end effector 30 faces the processing block 120 side. The rotary drive unit 43 may rotate the end effector 30, the forward / backward drive unit 41, and the lifting / lowering drive unit 42 as a single unit. The rotary drive unit 43 includes, for example, a motor. With the end effector 30 in the first rotation position, the forward / backward drive unit 41 moves the end effector 30 along the forward / backward direction Dx relative to the substrate housing C. The forward / backward direction Dx is the horizontal direction in which the end effector 30 can enter the substrate housing C.

[0039] When the end effector 30 is stopped at the first rotation position, the forward / backward direction Dx is along the longitudinal direction of the first long section 31A and the second long section 31B. In this state, the leading end in the longitudinal direction corresponds to the front of the forward / backward direction Dx, and the base end in the longitudinal direction corresponds to the rear of the forward / backward direction Dx.

[0040] The moving drive unit 44 moves the end effector 30 along the arrangement direction Dy of the load port 10. The moving drive unit 44 may move the end effector 30, the forward / backward drive unit 41, the lifting / lowering drive unit 42, and the rotational drive unit 43 as a single unit. If the part including the end effector 30, the forward / backward drive unit 41, the lifting / lowering drive unit 42, and the rotational drive unit 43 is considered to be the first transport unit 20, then it can be said that the moving drive unit 44 moves the first transport unit 20 in the arrangement direction Dy. The moving drive unit 44 is fixed, for example, to the floor surface (bottom of the chamber) of the indexer block 110. For example, the moving drive unit 44 includes a drive source such as a motor and a power transmission unit that transmits the driving force of the drive source to the end effector 30. The power transmission unit includes, for example, a ball screw mechanism.

[0041] When the transport drive unit 40 moves the end effector 30, vibration occurs in the end effector 30. In other words, vibration occurs in the end effector 30 due to the drive of the transport drive unit 40. For example, the end effector 30 vibrates so that the tip of the end effector 30 reciprocates vertically relative to the base end of the end effector 30 (for example, the connecting portion 32). If the amplitude of the swing of the tip of the end effector 30 due to this vibration becomes large, the end effector 30 may collide with the board W inside the board housing C when it enters the board housing C (when it is moved in the forward / backward direction Dx).

[0042] <Optical Displacement Meter> The optical displacement sensor 60 is a sensor for detecting vibrations occurring in the end effector 30 and is a displacement sensor that detects the position of the inclined reflective surface 31a of the end effector 30. The optical displacement sensor 60 measures, for example, the distance between itself and the inclined reflective surface 31a. The optical displacement sensor 60 may also be called a distance sensor.

[0043] In the examples shown in Figures 4 and 5, the optical displacement meter 60 is provided in a one-to-one correspondence with the inclined reflective surface 31a. Here, since the end effector 30 has an inclined reflective surface 31aA and an inclined reflective surface 31aB, two optical displacement meters 60 are provided: an optical displacement meter 60A (corresponding to the first optical displacement meter) and an optical displacement meter 60B (corresponding to the second optical displacement meter). The optical displacement meter 60A is provided corresponding to the inclined reflective surface 31aA, and the optical displacement meter 60B is provided corresponding to the inclined reflective surface 31aB.

[0044] The optical displacement meter 60 includes a light-emitting unit 61 and a light-receiving unit 62. The light-emitting unit 61 and the light-receiving unit 62 may be provided in the same housing. The light-emitting unit 61 emits measurement light L1 obliquely toward the inclined reflective surface 31a of the end effector 30 from a position behind the inclined reflective surface 31a in the forward / backward direction Dx. The light-emitting unit 61 of the optical displacement meter 60A emits measurement light L1 toward the inclined reflective surface 31aA, and the light-emitting unit 61 of the optical displacement meter 60B emits measurement light L1 toward the inclined reflective surface 31aB. The measurement light L1 may be visible light or invisible light. The measurement light L1 may be, for example, infrared light. The light-emitting unit 61 may be a semiconductor light-emitting device such as a laser. The light-emitting unit 61 can also be said to be a light source. The light-emitting unit 61 is controlled by, for example, a control unit 90.

[0045] The light-receiving unit 62 receives the measurement light L1 reflected by the inclined reflective surface 31a. In the example in Figure 5, the light-receiving unit 62 of the optical displacement meter 60A receives the measurement light L1 reflected by the inclined reflective surface 31aA, and the light-receiving unit 62 of the optical displacement meter 60B receives the measurement light L1 reflected by the inclined reflective surface 31aB. The reflectance of the inclined reflective surface 31a with respect to the measurement light L1 may be, for example, 5% or more, 10% or more, or 20% or more. The light-receiving unit 62 outputs a detection signal based on the received measurement light L1. The light-receiving unit 62 includes one or more light-receiving elements (not shown). The light-receiving elements include photoelectric conversion elements such as photodiodes. The light-receiving unit 62 may include a plurality of light-receiving elements. The plurality of light-receiving elements may be arranged in an oblique direction including a vertical component. The light-receiving unit 62 may be a line sensor in which multiple light-receiving elements are arranged in a line, or it may be a sensor in which multiple light-receiving elements are arranged in two dimensions.

[0046] In the examples of Figures 4 and 5, the inclined reflective surface 31a is located on the upper side of the end effector 30, so the optical displacement meter 60 is provided above the end effector 30. The optical displacement meter 60 is provided on the base side of the substrate W supported by the end effector 30. As an example, the optical displacement meter 60 is provided on the connecting portion 32 of the end effector 30. The optical displacement meter 60 is provided above the substrate W placed on the end effector 30. In the example of Figure 5, the optical displacement meter 60A and the optical displacement meter 60B are arranged in the horizontal width direction perpendicular to the longitudinal direction.

[0047] In the example described above, the optical displacement meter 60 is installed on the end effector 30, so the transport drive unit 40 moves the end effector 30 and the optical displacement meter 60 together.

[0048] As shown in Figure 4, the light-emitting unit 61 and the light-receiving unit 62 may be arranged in an oblique direction including a vertical component. In the example in Figure 4, the light-emitting unit 61 is located below the light-receiving unit 62, but the light-emitting unit 61 may be located above the light-receiving unit 62. The lower ends of the light-emitting unit 61 and the light-receiving unit 62 may be located above the substrate W supported by the end effector 30.

[0049] The optical displacement meter 60 detects the position of the inclined reflective surface 31a of the end effector 30 based on the measurement light L1 received by the light receiving unit 62. Figure 6 shows an example of how the tip of the end effector 30 vibrates vertically relative to the base end. In Figure 6, the state where the tip of the end effector 30 is located further down is indicated by the dashed line. When the tip of the end effector 30 vibrates vertically, the distance between the optical displacement meter 60 and the inclined reflective surface 31a also changes periodically.

[0050] The shape and size of the inclined reflective surface 31a can be determined as follows: The shape and size of the inclined reflective surface 31a can be determined so that the measurement light L1 can continue to be incident on the inclined reflective surface 31a even when the tip of the end effector 30 vibrates at the assumed maximum amplitude. As a specific example, the elevation angle of the inclined reflective surface 31a (i.e., the angle between the inclined reflective surface 31a and the horizontal plane) can be determined to be, for example, 55 degrees or more and 65 degrees or less. On the other hand, the optical displacement meter 60 is installed so that the depression angle in the direction of propagation of the measurement light L1 emitted by the light-emitting unit 61 is, for example, 15 degrees or more and 25 degrees or less.

[0051] The optical displacement meter 60 detects the position of the inclined reflective surface 31a using, for example, a triangulation method or a TOF (Time of Flight) method. When the triangulation method is used, the optical displacement meter 60 calculates the position of the inclined reflective surface 31a based on the receiving position of the measurement light L1. When the TOF method is used, the optical displacement meter 60 calculates the position of the inclined reflective surface 31a based on the time difference between the emission time and the reception time of the measurement light L1.

[0052] The correspondence between such light-receiving position or time difference and the position of the inclined reflective surface 31a may be set in advance, for example, by experiments or simulations. The optical displacement meter 60 may determine the position of the inclined reflective surface 31a based on the measurement light L1 (i.e., detection signal) received by the light-receiving unit 62 and the pre-set correspondence. The position of the inclined reflective surface 31a referred to here corresponds, strictly speaking, to the position of the incident region (e.g., spot) of the measurement light L1 on the inclined reflective surface 31a.

[0053] The position calculation of the inclined reflective surface 31a based on the detection signal from the light-receiving unit 62 may be realized by a circuit built into the optical displacement meter 60. Alternatively, the light-receiving unit 62 may output a detection signal to the control unit 90, and the control unit 90 may detect the position of the inclined reflective surface 31a based on the detection signal. In this case, the position detection function of the control unit 90 can be said to be included in the optical displacement meter 60.

[0054] The time-series data of the position of the inclined reflective surface 31a represents the vibration of the end effector 30. However, as can be understood from the geometry in Figure 6, the vertical amplitude A1 of the tip of the end effector 30 is greater than the amplitude A2 of the positional variation of the inclined reflective surface 31a. The amplitude correspondence between amplitude A1 and amplitude A2 can also be set in advance by experiment or simulation. The control unit 90 may calculate the amplitude A1 of the vibration of the end effector 30 based on the time-series data of the position of the inclined reflective surface 31a and the amplitude correspondence.

[0055] The control unit 90 may determine whether the amplitude A1 is greater than a reference value. If the amplitude A1 is greater than a reference value, the control unit 90 may perform vibration reduction processing. Vibration reduction processing is a process that reduces the amplitude A1 of the vibration of the end effector 30. For example, as vibration reduction processing, the control unit 90 temporarily stops the transport drive unit 40. As a result, the vibration of the end effector 30 caused by the transport drive unit 40 subsides over time.

[0056] As described above, according to the first transport unit 20 of this embodiment, the optical displacement meter 60 emits measurement light L1 from a position behind the inclined reflective surface 31a of the end effector 30. The optical displacement meter 60 then receives the measurement light L1 from the inclined reflective surface 31a. The optical displacement meter 60 detects the position of the inclined reflective surface 31a based on the measurement light L1, and the control unit 90 calculates the amplitude A1 of the vibration of the end effector 30 based on the time-series data of the position of the inclined reflective surface 31a. Therefore, there is no need to provide a vibration sensor at the tip of the end effector 30, and the weight increase at the tip of the end effector 30 can be suppressed. Consequently, the increase in the amplitude A1 of the vibration of the end effector 30 caused by the weight increase can be suppressed.

[0057] Moreover, in the example described above, the inclined reflective surface 31a is located on the tip side of the substrate W supported by the end effector 30. In other words, the inclined reflective surface 31a is located near the tip of the end effector 30. Therefore, the control unit 90 can calculate the amplitude A1 of the vibration at the tip of the end effector 30 with higher accuracy.

[0058] Furthermore, in the above example, inclined reflective surfaces 31a are provided on each of the first long section 31A and the second long section 31B, and optical displacement meters 60 are provided to detect the position of each inclined reflective surface 31a. Therefore, the control unit 90 can individually calculate the amplitude A1 of each of the first long section 31A and the second long section 31B.

[0059] Furthermore, if the first long section 31A and the second long section 31B vibrate to the same extent, the inclined reflective surface 31a may be provided on only one of the first long section 31A and the second long section 31B.

[0060] Furthermore, in the example described above, the inclined reflective surface 31a is included in the protrusion 33. Therefore, it is not necessary to reduce the thickness of the end effector 30 in order to form the inclined reflective surface 31a. Thus, a reduction in the rigidity of the end effector 30 can be avoided.

[0061] Furthermore, in the example described above, the protrusion 33 functions as a positioning protrusion 34 for the substrate W. Therefore, compared to the case where the protrusion 33 is provided separately from the protrusion 34, the manufacturing cost of the end effector 30 can be reduced.

[0062] Furthermore, in the example described above, the optical displacement meter 60 is provided on the end effector 30, and the transport drive unit 40 moves the end effector 30 and the optical displacement meter 60 together. With this structure, the distance between the optical displacement meter 60 and the inclined reflective surface 31a hardly changes with the movement of the end effector 30. In other words, the time-series data of the position of the inclined reflective surface 31a depends almost entirely on the vibration component at the tip of the end effector 30. For this reason, the control unit 90 can calculate the amplitude A1 of the vibration of the end effector 30 with high accuracy based on the time-series data of the position of the inclined reflective surface 31a.

[0063] Furthermore, in the example shown in Figure 4, the transport drive unit 40 is located below the end effector 30, the inclined reflective surface 31a is located on the upper side of the end effector 30, and the optical displacement meter 60 is located above the end effector 30. With this configuration, the optical displacement meter 60 and the transport drive unit 40 do not physically interfere with each other, making it easier to install the optical displacement meter 60.

[0064] <Wavelength of the light being measured> The measurement light L1 may be light that can penetrate the substrate W. For example, the transmittance of the substrate W with respect to the measurement light L1 is higher than the transmittance of the inclined reflective surface 31a with respect to the measurement light L1. If the substrate W is a silicon substrate, infrared light can be applied as the measurement light L1. As a more specific example, short-wave infrared light can be applied as the measurement light L1. The wavelength of the short-wave infrared light is, for example, 1000 nm or more and 3000 nm or less. Here, the measurement light L1 may be light that includes a wavelength range in which the transmittance of the substrate W is 20% or more. The transmittance of the substrate W may be 30% or more, 40% or more, or 50% or more.

[0065] When the measurement light L1 passes through the substrate W, the control unit 90 can obtain the amplitude A1 of the vibration of the end effector 30 even when the end effector 30 is located inside the substrate housing C. Figure 7 is a schematic diagram illustrating an example of how the measurement light L1 passes through the substrate W. Figure 7 shows two substrates W housed inside the substrate housing C. Figure 7 also shows how the end effector 30 enters between the two substrates W. When the end effector 30 is located directly below the substrates W inside the substrate housing C, the measurement light L1 can pass through the substrate W directly above the end effector 30. For example, the measurement light L1 from the optical displacement meter 60 passes through the substrate W and is incident on the inclined reflective surface 31a of the end effector 30. The measurement light L1 reflected by the inclined reflective surface 31a then passes through the substrate W and is received by the optical displacement meter 60.

[0066] As can be seen from Figure 7, when the end effector 30 is located outside the substrate housing C, the measurement light L1 does not pass through the substrate W inside the substrate housing C. Then, as the end effector 30 moves forward along the forward / backward direction Dx, the measurement light L1 will eventually pass through the substrate W inside the substrate housing C. Even in this case, as described above, the optical displacement meter 60 can receive the measurement light L1 reflected by the inclined reflective surface 31a. Hereafter, the position range in the forward / backward direction Dx of the end effector 30 in which the measurement light L1 does not pass through the substrate W inside the substrate housing C will be called the first position range, and the position range in which the measurement light L1 passes through the substrate W inside the substrate housing C will also be called the second position range.

[0067] The optical displacement meter 60 may detect the position of the inclined reflective surface 31a whether the end effector 30 is located within a first position range or within a second position range. Similarly, the control unit 90 may calculate the amplitude A1 of the vibration based on the time-series data of the position of the inclined reflective surface 31a whether the end effector 30 is located within a first position range or within a second position range.

[0068] Figure 8 is a flowchart illustrating an example of an unloading operation in which the first transport unit 20 unloads a substrate W from the substrate container C. First, the control unit 90 controls the transport drive unit 40 to move the end effector 30 to the facing position described below (step S1). The facing position is a position that faces the substrate container C in the forward / backward direction Dx, and is located between the height of the substrate W to be unloaded and the height of the substrate W directly below it.

[0069] Next, the control unit 90 controls the forward / backward drive unit 41 to move the end effector 30 forward in the forward / backward direction Dx to the stopping position within the substrate housing C (step S2). The stopping position is directly below the object to be unloaded. Next, the control unit 90 controls the lifting / lowering drive unit 42 to raise the end effector 30 (step S3). This causes the end effector 30 to lift the substrate W within the substrate housing C. The substrate W is positioned on the end effector 30 by the multiple protrusions 34. Next, the control unit 90 controls the forward / backward drive unit 41 to move the end effector 30 backward in the forward / backward direction Dx, retracting the end effector 30 and the substrate W from the substrate housing C (step S4). In this way, the substrate W is unloaded from the substrate housing C.

[0070] During this unloading operation, the control unit 90 performs vibration monitoring of the end effector 30 (step S10). In the example shown in Figure 8, the control unit 90 performs vibration monitoring in parallel with the movement of the end effector 30 to the position directly below (step S2). The vibration monitoring process includes the measurement process, determination process, and vibration reduction process described below.

[0071] The measurement process involves calculating the amplitude A1 of the vibration of the end effector 30. Specifically, the control unit 90 first initiates detection by the optical displacement meter 60. That is, the control unit 90 initiates detection by the optical displacement meter 60 while the end effector 30 is still positioned behind the substrate housing C. As an example, the control unit 90 initiates detection by the optical displacement meter 60 as soon as the end effector 30 starts moving from its opposing position. Based on the detection signal from the light-receiving unit 62 of the optical displacement meter 60, the control unit 90 calculates the position of the inclined reflective surface 31a. Then, the control unit 90 calculates the amplitude A1 of the vibration of the end effector 30 based on the time-series data of this position. The control unit 90 calculates the amplitude A1 at predetermined time intervals. This allows the control unit 90 to continuously monitor the amplitude A1 of the vibration associated with the movement of the end effector 30 in the forward / backward direction Dx.

[0072] The control unit 90 performs a determination process each time it calculates the amplitude A1. The determination process determines whether the amplitude A1 is greater than a reference value. The reference value is set in advance to a value such that the tip of the end effector 30 does not collide with the substrate W.

[0073] When the amplitude A1 is greater than the reference value, the control unit 90 performs vibration reduction processing. As part of the vibration reduction processing, the control unit 90 may temporarily stop the transport drive unit 40. This allows the vibration of the end effector 30 caused by the transport drive unit 40 to subside over time. Then, when the amplitude A1 of the vibration of the end effector 30 has decreased sufficiently, the control unit 90 controls the transport drive unit 40 to move the end effector 30 again.

[0074] As described above, the first transport unit 20 suppresses vibrations of the end effector 30, avoiding collisions between the tip of the end effector 30 and the substrate W, while enabling the substrate W to be transported out of the substrate housing C.

[0075] The control unit 90 may perform vibration monitoring until the end effector 30 stops at the position directly below. In other words, the control unit 90 may perform vibration monitoring whether the end effector 30 is located within the first position range or within the second position range. This makes it possible to more reliably avoid collisions between the tip of the end effector 30 and the substrate W until the end effector 30 reaches the position directly below.

[0076] Furthermore, the control unit 90 may also perform vibration monitoring processing (step S10) when the end effector 30 is raised (step S3) and when the end effector 30 is retracted (step S4). In this case, the control unit 90 can monitor the vibration of the end effector 30 even when the end effector 30 is raised and retracted.

[0077] Furthermore, even if the measurement light L1 cannot penetrate the substrate W, the control unit 90 can monitor the vibration of the end effector 30 when the end effector 30 is located within the first position range during the unloading operation.

[0078] <Optical path of measurement light> Incidentally, the measurement light L1 is refracted when it passes through the substrate W. Therefore, the state (position or phase) of the measurement light L1 as detected by the light receiving unit 62 may change depending on whether or not the measurement light L1 passes through the substrate W. Accordingly, the following describes the state in which the measurement light L1 passes through the substrate W and the state in which the measurement light L1 does not pass through the substrate W.

[0079] As can be seen from Figure 7, when the tip of the end effector 30 is still located outside the substrate housing C, the measurement light L1 does not pass through the substrate W. Then, as the end effector 30 moves toward the directly downward position, eventually either the forward or return path of the measurement light L1 will pass through the substrate W. As a result, the measurement light L1 is refracted by the substrate W in either the forward or return path. Furthermore, as the end effector 30 moves toward the directly downward position, both the forward and return paths of the measurement light L1 pass through the substrate W. As a result, the measurement light L1 is refracted by the substrate W in both the forward and return paths. Hereafter, the state in which only one of the forward or return paths passes through the substrate W will be referred to as the single-passage state, and the state in which both the forward and return paths pass through the substrate W will be referred to as the double-passage state.

[0080] As described above, the optical path changes due to refraction at the substrate W, so the position of the measurement light L1 received by the light receiving unit 62 can change between the non-passing state and the passing state. Also, the time difference between the emission time and the reception time of the measurement light L1 can change. Therefore, the correspondence between the measurement light L1 received by the light receiving unit 62 and the position of the inclined reflective surface 31a may be set in advance according to each state. For example, a first correspondence corresponding to the non-passing state and a second correspondence corresponding to the passing state may be set in advance by experiment or simulation. Alternatively, a second A correspondence corresponding to the one-passing state and a second B correspondence corresponding to the two-passing state may be set in advance.

[0081] Whether the optical path passes through the substrate W is determined by the position Dx in the forward / backward direction of the end effector 30. For example, in the position range from the facing position to the first position where one of the forward or return paths reaches the substrate W (i.e., the first position range described above), the measurement light L1 does not pass through the substrate W. Also, in the second A position range from the first position to the second position where the other of the forward or return path reaches the substrate W, only one of the forward or return paths of the measurement light L1 passes through the substrate W. In the second B position range from the second position to the stopping position, both the forward and return paths of the measurement light L1 pass through the substrate W. The second position range described above corresponds to the entire range of the second A position range and the second B position range.

[0082] On the other hand, the position of the end effector 30 in the forward / backward direction Dx is controlled by the control unit 90, and is therefore recognized by the control unit 90. Alternatively, the position of the end effector 30 in the forward / backward direction Dx may be detected by a position sensor 413 (see also Figure 4). The position sensor 413 may be provided in the forward / backward drive unit 41. The position sensor 413 may be, for example, an encoder that detects the rotational position of a motor provided at the coupling part of the arm 411 of the forward / backward drive unit 41. The encoder may output a detection signal indicating the rotational position of the motor to the control unit 90. The control unit 90 calculates the position of the end effector 30 in the forward / backward direction Dx based on the detection signal. In this case, it can be said that the position detection function of the control unit 90 is included in the position sensor 413.

[0083] The control unit 90 may select a correspondence relationship based on the position of the end effector 30 in the forward / backward direction Dx. For example, when the end effector 30 is within a first position range, the control unit 90 selects a first correspondence relationship. Similarly, when the end effector 30 is within a second position range, the control unit 90 selects a second correspondence relationship. Alternatively, when the end effector 30 is within a second A position range, the control unit 90 selects a second A correspondence relationship, and when the end effector 30 is within a second B position range, it selects a second B correspondence relationship. Then, the control unit 90 calculates the position of the inclined reflective surface 31a based on the selected correspondence relationship and the detection signal from the light receiving unit 62. This allows the control unit 90 to calculate the position of the inclined reflective surface 31a with higher accuracy. Consequently, the control unit 90 can calculate the amplitude A1 of the vibration of the end effector 30 with higher accuracy.

[0084] <Circuit board> The upper surface of the substrate W does not necessarily have a pattern formed on it. In other words, the substrate W may be a bare wafer. In this case, no reflection or refraction of the measurement light L1 due to the pattern on the substrate W occurs. Therefore, the measurement light L1 received by the light receiving unit 62 does not contain noise caused by the pattern. Consequently, the control unit 90 can detect the position of the inclined reflective surface 31a with even higher accuracy, and can calculate the amplitude A1 of the vibration of the end effector 30 with even higher accuracy.

[0085] <Circuit board on the end effector> As can be seen from Figure 4, when the end effector 30 is supporting the substrate W, the measurement light L1 is incident on the substrate W on the end effector 30. If the measurement light L1 passes through the substrate W, the optical displacement meter 60 can still receive the measurement light L1 from the inclined reflective surface 31a in this state. Therefore, the control unit 90 may also perform vibration monitoring processing during the loading operation in which the substrate W is loaded into the substrate housing C. An example of the loading operation is shown in Figure 8. However, in step S1, the end effector 30 is supporting the substrate W to be loaded. The control unit 90 controls the transport drive unit 40 to move the end effector 30 to a position opposite to the storage position in the substrate housing C, slightly above the storage position. Then, in step S2, the control unit 90 controls the forward / backward drive unit 41 to move the end effector 30 along the forward / backward direction Dx to the stopping position. The stopping position here is the position directly above the storage position in the substrate housing C. Next, in step S3, the lifting drive unit 42 is controlled to lower the end effector 30. This places the substrate W into its storage position within the substrate housing C. Next, in step S4, the control unit 90 controls the forward / backward drive unit 41 to retract the end effector 30 from the substrate housing C.

[0086] During this loading operation, the control unit 90 performs vibration monitoring in parallel with step S2 (step S10). This makes it possible to avoid collisions between the tip of the end effector 30 and the substrate W inside the substrate housing C.

[0087] In this loading operation, as described above, the substrate W is placed on the end effector 30 in step S2. Therefore, the measurement light L1 passes through the substrate W on the end effector 30. Thus, the correspondence for the loading operation and the unloading operation may be set in advance by experiment or simulation. The control unit 90 selects the correspondence for the unloading operation when loading, and selects the correspondence for the loading operation when loading. The control unit 90 may detect the position of the inclined reflective surface 31a based on the selected correspondence and the measurement light L1 received by the light receiving unit 62. With this, the control unit 90 can calculate the amplitude A1 of the vibration of the end effector 30 with higher accuracy in each of the unloading and loading operations.

[0088] Furthermore, during the loading operation, when the end effector 30 enters the board housing C, the measurement light L1 passes through the board W inside the board housing C. For this reason, the correspondence between the non-transmission state, the one-transmission state, and the two-transmission state during the loading operation may be set in advance through experiments or simulations.

[0089] <Second Embodiment> Figure 9 is a schematic diagram showing an example of the configuration of the end effector 30 according to the second embodiment. In the second embodiment, the inclined reflective surface 31a is provided on the base side of the substrate W supported by the end effector 30. In the example of Figure 9, the inclined reflective surface 31a forms a part of the base side of the side surface of the protrusion 33. Also, in the example of Figure 9, the protrusion 33 functions as a positioning protrusion 34 for the substrate W. Since the protrusion 33 is provided on the base side of the substrate W, the tip portion of the side surface of the protrusion 33 abuts against the periphery of the substrate W. In other words, the inclined reflective surface 31a of the protrusion 33 does not abut against the substrate W.

[0090] Similar to the first embodiment, protrusions 33A and 33B may be provided. Protrusions 33A and 33B may be provided, for example, on the connecting portion 32, or they may be arranged in the width direction. Furthermore, an optical displacement meter 60A corresponding to protrusion 33A may be provided, and an optical displacement meter 60B corresponding to protrusion 33B may be provided.

[0091] In the second embodiment as well, the optical displacement meter 60 is positioned on the base side of the inclined reflective surface 31a and emits measuring light L1 in an oblique direction. In the second embodiment, the distance between the inclined reflective surface 31a and the optical displacement meter 60 is shorter than the distance in the first embodiment. Therefore, the elevation angle of the inclined reflective surface 31a is set to be smaller. The elevation angle of the inclined reflective surface 31a is, for example, about 50 degrees or more and 60 degrees or less. On the other hand, the depression angle of the measuring light L1 is set to be larger. The optical displacement meter 60 is installed so that the depression angle of the measuring light L1 is, for example, about 45 degrees or more and 60 degrees or less.

[0092] In the second embodiment, as in the first embodiment, the weight increase of the tip of the end effector 30 can be suppressed. Therefore, the increase in vibration of the end effector 30 caused by the weight increase can be suppressed.

[0093] Furthermore, in the second embodiment, the inclined reflective surface 31a is located on the base end side (i.e., on the optical displacement meter 60 side) of the substrate W supported by the end effector 30. Therefore, the measurement light L1 from the optical displacement meter 60 does not pass through the substrate W supported by the end effector 30, nor does it pass through the substrate W in the substrate housing C. Consequently, the control unit 90 can detect the position of the inclined reflective surface 31a with higher accuracy or with simpler processing.

[0094] <Third Embodiment> Figure 10 is a schematic diagram showing a first example of the configuration of the end effector 30 according to the third embodiment. In the third embodiment as well, the end effector 30 includes a protrusion 33. However, in the third embodiment, unlike the first and second embodiments, the protrusion 33 does not function as a protrusion 34 for positioning the substrate W.

[0095] The protrusion 33 may be provided on the tip side of the substrate W supported by the end effector 30. More specifically, the protrusion 33 may be provided at the tip of the end effector 30. Also, the protrusion 33 may be provided on each of the first long portion 31A and the second long portion 31B. That is, the protrusion 33A may be provided on the first long portion 31A, and the protrusion 33B may be provided on the second long portion 31B. The protrusion 33 may have a triangular shape that tapers upward when viewed with the line of sight along the width direction. The side surface of the protrusion 33 on the base end side corresponds to the inclined reflective surface 31a. The inclined reflective surface 31a may be a flat surface and may be parallel to the width direction.

[0096] In the third embodiment as well, the optical displacement meter 60 is provided on the proximal side of the substrate W supported by the end effector 30. Therefore, as in the first embodiment, the weight increase of the tip of the end effector 30 can be suppressed, and the increase in vibration of the end effector 30 caused by the weight increase can be suppressed. If the protrusion 33 is provided at the tip of the end effector 30, the control unit 90 can calculate the amplitude A1 of the vibration of the end effector 30 with higher accuracy.

[0097] Figure 11 is a schematic diagram showing a second example of the configuration of the end effector 30 according to the third embodiment. In the second example of the third embodiment, the end effector 30 also has a protrusion 33. The protrusion 33 is provided on the base side of the substrate W supported by the end effector 30. There may be two protrusions 33, or the two protrusions 33 may be side by side in the width direction. The protrusion 33 may be provided on the connecting portion 32 of the end effector 30. The shape of the protrusion 33 may be the same as the shape of the protrusion 33 in the first example of the third embodiment.

[0098] According to the first and second examples of the third embodiment, the protrusion 33 does not function as a positioning protrusion 34, thus improving the degree of freedom in the placement of the protrusion 33.

[0099] Figure 12 is a schematic diagram showing a third example of the configuration of the end effector 30 according to the third embodiment. In the third example of the third embodiment, the tip of the first elongated portion 31A is curved upward. Such a first elongated portion 31A can be manufactured by bending. The curved surface on the inner circumference of the tip of the first elongated portion 31A corresponds to the inclined reflective surface 31a. The inclined reflective surface 31a extends in a curved shape so as it approaches the tip in the longitudinal direction, it curves vertically upward. The center of curvature of the inclined reflective surface 31a is located above the end effector 30. The tip of the first elongated portion 31A can also be said to be a convex portion that protrudes upward. The inclined reflective surface 31a may be parallel to the width direction. The tip of the second elongated portion 31B may also be curved in the same way as the tip of the first elongated portion 31A.

[0100] Since the inclined reflective surface 31a can be formed by bending, the end effector 30 can be manufactured at a low cost.

[0101] <Fourth Embodiment> Figure 13 is a schematic diagram showing a first example of the configuration of the end effector 30 according to the fourth embodiment. Figure 14 is a schematic perspective view showing a first example of the configuration of the end effector 30 according to the fourth embodiment. In the fourth embodiment, the end effector 30 has a recess 35. Specifically, the end effector 30 includes a hand 300 and a recess 35 provided in the hand 300. In the examples of Figures 13 and 14, the recess 35 is formed on the upper surface of the hand 300. The inclined reflective surface 31a corresponds to a part of the inner circumferential surface of the recess 35. That is, the inclined reflective surface 31a is provided on the upper surface side of the end effector 30. The inclined reflective surface 31a is inclined with respect to the horizontal plane, and specifically, it is inclined so as it approaches the tip side in the longitudinal direction, it is inclined vertically upward. The inclined reflective surface 31a may be a flat surface or may be parallel to the width direction. In the examples of Figures 13 and 14, the recess 35 also has an inclined surface 31b. The inclined surface 31b is inclined vertically upward from the lower end of the inclined reflective surface 31a, towards the base end in the longitudinal direction. The inclined reflective surface 31a may be a flat surface or parallel to the width direction. In the example in Figure 13, the elevation angle of the inclined surface 31b is smaller than the elevation angle of the inclined reflective surface 31a. The shape of the recess 35 can be appropriately changed as long as the measurement light L1 from the optical displacement meter 50 is incident on the inclined reflective surface 31a and the measurement light L1 reflected by the inclined reflective surface 31a can be received by the optical displacement meter 50.

[0102] In the example shown in Figure 14, recesses 35 are formed in both the first elongated portion 31A and the second elongated portion 31B. Hereafter, the recess 35 of the first elongated portion 31A will also be referred to as recess 35A, and the recess 35 of the second elongated portion 31B will also be referred to as recess 35B. In the example shown in Figure 14, recess 35A is formed over the entire width of the first elongated portion 31A. That is, the width of the inclined reflective surface 31a of recess 35A is the same as the width of the first elongated portion 31A. In the example shown in Figure 14, recess 35B is formed over the entire width of the second elongated portion 31B. That is, the width of the inclined reflective surface 31a of recess 35B is the same as the width of the second elongated portion 31B.

[0103] The recess 35 may be formed on the tip side of the center of the substrate W supported by the end effector 30. Since the recess 35 does not collide with the substrate W supported by the end effector 30, it may be located directly beneath the substrate W. In this way, the degree of freedom in the placement of the recess 35 (i.e., the degree of freedom in the placement of the inclined reflective surface 31a) can be improved in the fourth embodiment.

[0104] In the fourth embodiment as well, the optical displacement meter 60 is positioned on the proximal end side of the substrate W supported by the end effector 30. Therefore, as in the first embodiment, it is possible to suppress the weight increase at the tip of the end effector 30.

[0105] In the fourth embodiment, as in the first embodiment, the measurement light L1 may be transmitted through the substrate W. This allows the control unit 90 to perform vibration monitoring even when the end effector 30 is located within the second position range. Moreover, even when the recess 35 is located directly below the substrate W supported by the end effector 30, the optical displacement meter 60 can detect the position of the inclined reflective surface 31a. In other words, the control unit 90 can perform vibration monitoring even during the loading operation.

[0106] Figure 15 is a schematic diagram showing a second example of the configuration of the end effector 30 according to the fourth embodiment. The recess 35 is formed on the proximal side of the center of the substrate W supported by the end effector 30. The recess 35A may be formed in the first elongated portion 31A, and the recess 35B may be formed in the second elongated portion 31B. The recesses 35A and 35B may be located directly beneath the substrate W supported by the end effector 30. Alternatively, the recesses 35A and 35B may be formed in the connecting portion 32.

[0107] According to the second example of the fourth embodiment, since the recess 35 is provided on the base end side, the first position range corresponding to the non-passage state is wider. In the non-passage state, the measurement light L1 does not pass through the substrate W, so the control unit 90 can detect the position of the inclined reflective surface 31a with higher accuracy or more ease over a wider first position range.

[0108] Figure 16 is a schematic perspective view showing a third example of the configuration of the end effector 30 according to the fourth embodiment. In the example of Figure 16, the width of the recess 35A is narrower than the width of the first elongated portion 31A. That is, in plan view, the contour of the recess 35A has a closed shape. The contour of the recess 35A referred to here is the boundary between the recess 35A and the upper surface of the first elongated portion 31A. In the example of Figure 16, the contour of the recess 35A in plan view has a rectangular shape. The width of the recess 35A may be one-fifth or less of the width of the first elongated portion 31A, or one-tenth or less. As a specific numerical example, the width of the recess 35A may be 5 mm or less, or 3 mm or less. The same applies to the recess 35B. The second elongated portion 31B is the same as the first elongated portion 31A.

[0109] According to the third example of the fourth embodiment, the thickness of the portion of the first elongated portion 31A adjacent to the recess 35A in the width direction is greater than the thickness of the portion of the first elongated portion 31A in which the recess 35A is formed. Therefore, the rigidity of the first elongated portion 31A can be improved, and vibration of the first elongated portion 31A can be reduced. Vibration of the second elongated portion 31B can also be reduced in the same way as that of the first elongated portion 31A.

[0110] In the example shown in Figure 16, the recess 35A is located on the base end side of the first elongated portion 31A, but the position of the recess 35A can be changed as appropriate. The same applies to the recess 35B.

[0111] <Fifth Embodiment> The longitudinal position of the inclined reflective surface 31aA may be the same as the longitudinal position of the inclined reflective surface 31aB, but they may also be different. For example, as shown in Figure 4, the inclined reflective surface 31aA may be located towards the front of the substrate W supported by the end effector 30. In the example in Figure 4, the inclined reflective surface 31aA corresponds to a part of the side surface of the protrusion 33A at the front end of the first elongated portion 31A.

[0112] Since the inclined reflective surface 31aA is located on the tip side, during loading and unloading operations, the measurement light L1 from the optical displacement meter 60A can pass through the substrate W inside the substrate housing C (see also Figure 7).

[0113] On the other hand, the inclined reflective surface 31aB may be located on the proximal end side of the substrate W supported by the end effector 30, as shown in Figure 9, for example. In other words, the inclined reflective surface 31aB is located on the proximal end side of the inclined reflective surface 31aA. Conversely, the inclined reflective surface 31aA is located on the tip side of the inclined reflective surface 31aB. In the example of Figure 9, the inclined reflective surface 31aB corresponds to a part of the side surface of the protrusion 33B on the proximal end side of the substrate W supported by the end effector 30.

[0114] If the inclined reflective surface 31aB is located on the proximal end side of the substrate W supported by the end effector 30, the measurement light L1 from the optical displacement meter 60B does not pass through the substrate W inside the substrate housing C during loading and unloading operations.

[0115] Let's consider the loading and unloading operation of the first transport unit 20. In step S2, when the end effector 30 moves from the opposite position outside the substrate container C toward the stopping position inside the substrate container C, initially the measurement light L1 from the optical displacement meters 60A and 60B does not pass through the substrate W inside the substrate container C. Then, eventually, the measurement light L1 from the optical displacement meter 60A passes through the substrate W inside the substrate container C. On the other hand, the measurement light L1 from the optical displacement meter 60B does not pass through the substrate W inside the substrate container C during the loading and unloading operation.

[0116] The positional range of the end effector 30 in which the measurement light L1 from the optical displacement meter 60A does not pass through the substrate W inside the substrate housing C is determined in advance through experiments or simulations.

[0117] The control unit 90 may switch between optical displacement meter 60A and optical displacement meter 60B, based on the position of the end effector 30, for the optical displacement meter 60 used to calculate the amplitude A1 of the vibration of the end effector 30. For example, the control unit 90 uses optical displacement meter 60A when the measurement light L1 of both optical displacement meter 60A and optical displacement meter 60B does not pass through the substrate W in the substrate housing C. In other words, the control unit 90 calculates the amplitude A1 of the vibration of the end effector 30 based on the measurement light L1 received by the light receiving unit 62 of optical displacement meter 60A. Since the position of the inclined reflective surface 31aA is close to the tip of the end effector 30, the control unit 90 can calculate the amplitude A1 of the vibration of the end effector 30 with higher accuracy.

[0118] On the other hand, the control unit 90 uses the optical displacement meter 60B when only the measurement light L1 of the optical displacement meter 60A passes through the substrate W in the substrate housing C. In other words, the control unit 90 calculates the amplitude A1 of the vibration of the end effector 30 based on the measurement light L1 received by the light receiving unit 62 of the optical displacement meter 60B. This allows the control unit 90 to calculate the amplitude A1 of the vibration of the end effector 30 while avoiding the influence of the substrate W in the substrate housing C.

[0119] In the above example, although the end effector 30 is provided with a protrusion 33, a recess 35 may also be provided. For example, as shown in Figure 13, a recess 35A may be formed in the first elongated portion 31A, and a part of the inner circumferential surface of the recess 35A may correspond to the inclined reflective surface 31aA. The recess 35A may be formed on the tip side of the center of the substrate W placed on the end effector 30. On the other hand, a recess 35B may be formed in the second elongated portion 31B, and a part of the inner circumferential surface of the recess 35B may correspond to the inclined reflective surface 31aB. The recess 35B may be formed on the base end side of the recess 35A, and may be located on the base end side of the center of the substrate W supported by the end effector 30 (see also Figure 15).

[0120] The recess 35B may be formed directly beneath the substrate W supported by the end effector 30. In this case, during the unloading operation, the measurement light L1 from the optical displacement meter 60B can also pass through the substrate W in the substrate housing C.

[0121] During the loading and unloading operation, when the end effector 30 is moved to the substrate housing C (step S2), initially, neither the measurement light L1 from the optical displacement meter 60A nor the optical displacement meter 60B passes through the substrate W inside the substrate housing C. Then, first, the measurement light L1 from the optical displacement meter 60A passes through the substrate W inside the substrate housing C, and subsequently, the measurement light L1 from the optical displacement meter 60B passes through the substrate W inside the substrate housing C.

[0122] Therefore, the control unit 90 may use optical displacement meter 60A when both the measurement light L1 from optical displacement meter 60A and optical displacement meter 60B do not pass through the substrate W in the substrate housing C, and may use optical displacement meter 60B when only the measurement light L1 from optical displacement meter 60A passes through the substrate W in the substrate housing C. Furthermore, the control unit 90 may use optical displacement meter 60A again when both the measurement light L1 from optical displacement meter 60A and optical displacement meter 60B pass through the substrate W in the substrate housing C. According to this, the control unit 90 can calculate the amplitude A1 of the vibration of the end effector 30 with higher accuracy based on the position of the inclined reflective surface 31a on the tip side when the state of the measurement light L1 is the same. On the other hand, when only the measurement light L1 from optical displacement meter 60A passes through the substrate W in the substrate housing C, the control unit 90 calculates the amplitude A1 of the vibration of the end effector 30 based on the measurement light L1 received by the light receiving unit 62 of optical displacement meter 60B. As a result, the control unit 90 can calculate the amplitude A1 of the vibration of the end effector 30 while avoiding the influence of the substrate W inside the substrate housing C.

[0123] <Sixth Embodiment> Figure 17 is a schematic perspective view showing an example of the configuration of the end effector 30 according to the sixth embodiment. In the sixth embodiment, the inclined reflective surface 31a is provided on the lower side of the end effector 30. In the example of Figure 17, the end effector 30 includes a protrusion 33. The protrusion 33 projects downward from the lower surface of the hand 300. The base end portion of the side surface of this protrusion 33 corresponds to the inclined reflective surface 31a. The inclined reflective surface 31a is inclined with respect to the horizontal plane, and specifically, it is inclined so as it approaches the base end in the longitudinal direction. In the example of Figure 17, the protrusion 33 has a shape obtained by inverting the top and bottom of the protrusion 33 in Figure 10. In the example of Figure 17, the protrusion 33A is provided on the first elongated portion 31A, and the protrusion 33B is provided on the second elongated portion 31B.

[0124] According to the sixth embodiment, the protrusion 33 does not collide with the substrate W supported by the end effector 30, so the degree of freedom in positioning the protrusion 33 is high.

[0125] In the sixth embodiment, the optical displacement meter 60 is provided on the lower surface of the end effector 30. The optical displacement meter 60 is provided on the base end side of the end effector 30 relative to the inclined reflective surface 31a. The optical displacement meter 60 may also be provided on the connecting portion 32 of the end effector 30.

[0126] In the sixth embodiment, the measurement light L1 travels between the optical displacement meter 60 and the inclined reflective surface 31a below the end effector 30. Therefore, the position of the inclined reflective surface 31a can be detected without being affected by the substrate W supported by the end effector 30.

[0127] In the sixth embodiment, a recess 35 may be provided on the lower surface of the hand 300, and a part of the side surface of the recess 35 may correspond to the inclined reflective surface 31a.

[0128] <Seventh Embodiment> Figure 18 is a schematic diagram showing a first example of the configuration of the first transport unit 20 according to the seventh embodiment. Figure 19 is a schematic perspective view showing a first example of the configuration of the first transport unit 20 according to the seventh embodiment. In the seventh embodiment, the first transport unit 20 further includes a sensor displacement drive unit 70. The sensor displacement drive unit 70 is controlled by a control unit 90 to displace the optical displacement meter 60. In the example of Figure 18, the inclined reflective surface 31a is provided on the upper side of the end effector 30. Therefore, the optical displacement meter 60 is provided above the end effector 30. In the example of Figure 18, although the inclined reflective surface 31a corresponds to a part of the side surface of the convex portion 33, a concave portion 35 may be formed instead of the convex portion 33.

[0129] In the example shown in Figure 18, the optical displacement meter 60 is mounted on the fixed member 75 via the sensor displacement drive unit 70. The fixed member 75 may be the ceiling portion of the indexer block 110. The control unit 90 controls the sensor displacement drive unit 70 according to the position of the end effector 30 to cause the measurement light L1 from the optical displacement meter 60 to be incident on the inclined reflective surface 31a of the end effector 30. In other words, the control unit 90 displaces the optical displacement meter 60 according to the position of the end effector 30 so that the measurement light L1 from the optical displacement meter 60 continues to be incident on the inclined reflective surface 31a of the end effector 30.

[0130] In the example shown in Figure 19, an inclined reflective surface 31aA is provided on the first long portion 31A, and an inclined reflective surface 31aB is provided on the second long portion 31B. An optical displacement meter 60A is provided corresponding to the inclined reflective surface 31aA, and an optical displacement meter 60B is provided corresponding to the inclined reflective surface 31aB. The sensor displacement drive unit 70 may displace the optical displacement meter 60A and the optical displacement meter 60B as a single unit.

[0131] In the example shown in Figure 18, the sensor displacement drive unit 70 includes a forward / backward drive unit 71. The forward / backward drive unit 71 is controlled by the control unit 90 to move the optical displacement meter 60 along the forward / backward direction Dx. The forward / backward drive unit 71 may move the optical displacement meter 60A and the optical displacement meter 60B together along the forward / backward direction Dx. The forward / backward drive unit 71 includes, for example, a drive source such as a motor and a power transmission unit that transmits the driving force of the drive source to the optical displacement meter 60. The power transmission unit includes, for example, a ball screw mechanism.

[0132] The control unit 90 controls the forward / backward drive unit 71 to move the optical displacement meter 60 in synchronization with the movement of the end effector 30 as the end effector 30 moves along the forward / backward direction Dx. In other words, the forward / backward drive unit 71 moves the optical displacement meter 60 while maintaining a constant distance between the end effector 30 and the optical displacement meter 60. This ensures that the measurement light L1 is continuously incident on the inclined reflective surface 31a of the end effector 30 when the end effector 30 moves in the forward / backward direction Dx during loading and unloading operations.

[0133] Incidentally, the end effector 30 moves to a height position within the substrate housing C corresponding to the substrate to be unloaded or loaded. Even in this case, the forward / backward drive unit 71 moves the optical displacement meter 60 along the forward / backward direction Dx according to the height position of the end effector 30, thereby allowing the measurement light L1 to be incident on the inclined reflective surface 31a.

[0134] The height position of the end effector 30 is controlled by the control unit 90 and is therefore recognized by the control unit 90. Alternatively, referring to Figure 4, the height position of the end effector 30 may be measured by the position sensor 423. The position sensor 423 may be an encoder that detects the rotation angle of a motor included in the lifting drive unit 42. The encoder may output a detection signal indicating the rotation position of the motor to the control unit 90. The control unit 90 calculates the vertical position (i.e., height position) of the end effector 30 based on the detection signal. In this case, the position detection function of the control unit 90 can also be said to be included in the position sensor 423.

[0135] The control unit 90 controls the forward / backward drive unit 71 according to the height position of the end effector 30 when the end effector 30 is positioned opposite the control unit 90. In other words, the control unit 90 moves the optical displacement meter 60 in the forward / backward direction Dx so that the measurement light L1 is incident on the inclined reflective surface 31a. The positional correspondence between the height position of the end effector 30 at the opposite position and the position of the optical displacement meter 60 in the forward / backward direction Dx can be set in advance by experiment or simulation. The control unit 90 may determine the position of the optical displacement meter 60 in the forward / backward direction Dx based on the height position of the end effector 30 and the positional correspondence.

[0136] Alternatively, as shown in Figure 18, the sensor displacement drive unit 70 may include a lifting drive unit 72. The lifting drive unit 72 is controlled by the control unit 90 to raise and lower the optical displacement meter 60. The lifting drive unit 72 may raise and lower the optical displacement meter 60A and the optical displacement meter 60B together. The lifting drive unit 72 includes, for example, a drive source such as a motor and a power transmission unit that transmits the driving force of the drive source to the optical displacement meter 60. The power transmission unit includes, for example, a ball screw mechanism or a cam mechanism. The control unit 90 may control the lifting drive unit 72 according to the height position. In other words, the control unit 90 may control the lifting drive unit 42 and the lifting drive unit 72 so that the difference between the height position of the optical displacement meter 60 and the height position of the end effector 30 is constant. This makes it possible to narrow the range of movement of the optical displacement meter 60 in the forward / backward direction Dx.

[0137] As described above, in the seventh embodiment, the optical displacement meter 60 is provided separately from the end effector 30, and the transport drive unit 40 does not move the optical displacement meter 60. Therefore, the weight of the end effector 30 can be reduced. Consequently, vibration of the end effector 30 can be further reduced.

[0138] Figure 20 is a schematic diagram showing a second example of the configuration of the first transport unit 20 according to the seventh embodiment. In the example of Figure 20, the sensor displacement drive unit 70 includes a rotation drive unit 73. The rotation drive unit 73 is controlled by the control unit 90 and rotates the optical displacement meter 60 in forward and reverse directions within a predetermined angular range around the rotation axis Q1. The rotation axis Q1 is an axis along a horizontal direction perpendicular to the forward / backward direction Dx. By rotating the optical displacement meter 60 with the rotation drive unit 73, the depression angle of the measurement light L1 can be changed. The control unit 90 controls the rotation drive unit 73 according to the position of the end effector 30 in the forward / backward direction Dx to keep the measurement light L1 incident on the inclined reflective surface 31a of the end effector 30. In other words, when the end effector 30 moves along the forward / backward direction Dx, the control unit 90 controls the rotation drive unit 73 to rotate the optical displacement meter 60 in accordance with the movement of the end effector 30.

[0139] The movement of the end effector 30 in the forward / backward direction Dx changes the distance between the end effector 30 and the optical displacement meter 60. In other words, the time-series data of the position of the inclined reflective surface 31a includes not only the vibration component of the end effector 30 but also the movement component of the end effector 30 in the forward / backward direction Dx. Since the frequency of the movement component is smaller than the frequency of the vibration component, the control unit 90 can determine the vibration component by removing the low-frequency component from the time-series data of the position of the inclined reflective surface 31a, for example, using a high-pass filter.

[0140] Incidentally, the end effector 30 moves to a height position within the substrate housing C corresponding to the substrate to be unloaded or loaded. Even in this case, the rotation drive unit 73 rotates the optical displacement meter 60 according to the height position of the end effector 30, thereby causing the measurement light L1 to be incident on the inclined reflective surface 31a. When the end effector 30 is positioned opposite, the control unit 90 may control the rotation drive unit 73 according to the height position of the end effector 30 to rotate the optical displacement meter 60 around the rotation axis Q1.

[0141] On the other hand, as shown in Figure 20, the sensor displacement drive unit 70 may include a lifting drive unit 72. The lifting drive unit 72 may move the rotation drive unit 73 and the optical displacement meter 60 together. The control unit 90 may control the lifting drive unit 42 and the lifting drive unit 72 so that the difference between the height position of the optical displacement meter 60 and the height position of the end effector 30 remains constant.

[0142] According to the second example of the seventh embodiment, since it is not necessary to move the optical displacement meter 60 along the forward / backward direction Dx, the size of the first transport unit 20 in the forward / backward direction Dx can be reduced.

[0143] Figure 21 is a schematic diagram showing a third example of the configuration of the first transport unit 20 according to the seventh embodiment. In the example of Figure 21, the sensor displacement drive unit 70 includes only the lifting drive unit 72. The control unit 90 controls the lifting drive unit 72 according to the position Dx of the end effector 30 to keep the measurement light L1 incident on the inclined reflective surface 31a of the end effector 30.

[0144] In this structure as well, the distance between the end effector 30 and the optical displacement meter 60 changes according to the position of the end effector 30. In other words, the time-series data of the position of the inclined reflective surface 31a includes not only the vibration component of the end effector 30, but also the component of the relative movement between the end effector 30 and the optical displacement meter 60. Since the frequency of the relative movement component is smaller than the frequency of the vibration component, the control unit 90 can determine the vibration component by removing the low-frequency component from the time-series data.

[0145] As described above, the substrate transport device (first transport unit 20) has been described in detail, but the above description is illustrative in all respects, and this disclosure is not limited thereto. Furthermore, the various modifications described above can be applied in combination as long as they do not contradict each other. And it is understood that a number of modifications not illustrated can be conceivable without falling outside the scope of this disclosure.

[0146] This disclosure includes the following aspects:

[0147] The first embodiment is a substrate transport device for transporting substrates into and out of a substrate container, comprising: an end effector having an inclined reflective surface and supporting the substrate; a transport drive unit for moving the end effector along the forward and backward direction relative to the substrate container; a light-emitting unit that emits measuring light obliquely toward the inclined reflective surface from a position behind the inclined reflective surface in the forward and backward direction; and a light-receiving unit that receives the measuring light from the inclined reflective surface, and an optical displacement meter for detecting the position of the inclined reflective surface.

[0148] A second embodiment is a substrate transport device according to the first embodiment, wherein the end effector includes a hand and a protrusion provided on the hand, and the inclined reflective surface is a part of the side surface of the protrusion.

[0149] A third embodiment is a substrate transport device according to the second embodiment, wherein the protrusion is a protrusion for positioning the substrate.

[0150] A fourth embodiment is a substrate transport apparatus according to the first embodiment, wherein the end effector includes a hand and a recess provided in the hand, and the inclined reflective surface is a part of the inner circumferential surface of the recess.

[0151] The fifth embodiment is a substrate transport device according to any one of the first to fourth embodiments, wherein the inclined reflective surface is provided on the end effector in front of the substrate supported by the end effector in the direction of advancement.

[0152] The sixth embodiment is a substrate transport device according to any one of the first to fourth embodiments, wherein the inclined reflective surface is provided on the end effector at a position behind the substrate supported by the end effector in the forward and backward direction.

[0153] The seventh embodiment is a substrate transport device according to any one of the first to sixth embodiments, wherein the optical displacement meter is provided on the end effector.

[0154] The eighth embodiment is a substrate transport device according to any one of the first to seventh embodiments, wherein the transport drive unit is provided below the end effector, the inclined reflective surface is provided on the upper side of the end effector, and the optical displacement meter is provided above the end effector.

[0155] The ninth embodiment is a substrate transport device according to any one of the first to seventh embodiments, wherein the inclined reflective surface is provided on the lower side of the end effector, and the optical displacement meter is provided below the end effector.

[0156] The tenth embodiment is a substrate transport device according to any one of the first to sixth embodiments, comprising a sensor displacement drive unit for displacing the optical displacement meter, and a control unit for controlling the sensor displacement drive unit according to the position of the end effector to cause the measurement light from the optical displacement meter to be incident on the inclined reflective surface.

[0157] The eleventh embodiment is a substrate transport device according to the tenth embodiment, wherein the sensor displacement drive unit includes a forward / backward drive unit that moves the optical displacement meter along the forward / backward direction.

[0158] A twelfth aspect is a substrate transport device according to the tenth or eleventh aspect, wherein the sensor displacement drive unit includes a rotation drive unit that rotates the optical displacement meter in forward and reverse directions around a horizontal rotation axis perpendicular to the forward and backward directions.

[0159] The 13th embodiment is a substrate transport device according to any one of the 10th to 12th embodiments, wherein the sensor displacement drive unit includes a lifting drive unit for raising and lowering the optical displacement meter.

[0160] The fourteenth embodiment is a substrate transport device according to any one of the first to thirteenth embodiments, wherein the measuring light is transmitted through the substrate.

[0161] The 15th embodiment is a substrate transport device according to the 14th embodiment, wherein the optical displacement meter detects the position of the inclined reflective surface when the position of the end effector in the forward and backward direction is within a first position range in which the measuring light does not pass through the substrate in the substrate container, and when the measuring light is within a second position range in which it passes through the substrate in the substrate container.

[0162] The sixteenth embodiment is a substrate transport apparatus according to the fifteenth embodiment, wherein a first correspondence between the measuring light and the position of the inclined reflective surface when the measuring light passes through the substrate, and a second correspondence between the measuring light and the position of the inclined reflective surface when the measuring light does not pass through the substrate are set in advance, and the optical displacement meter determines the position of the inclined reflective surface based on the measuring light received by the light receiving unit and the first correspondence when the position of the end effector in the forward and backward direction is within the first position range, and determines the position of the inclined reflective surface based on the measuring light received by the light receiving unit and the second correspondence when the position of the end effector in the forward and backward direction is within the second position range.

[0163] The 17th embodiment is a substrate transport device according to any one of the first to 16 embodiments, wherein the end effector includes a first long portion and a second long portion, the first inclined reflective surface is provided corresponding to the first long portion, the second inclined reflective surface is provided corresponding to the second long portion, the first optical displacement meter is provided corresponding to the first inclined reflective surface, and the second optical displacement meter is provided corresponding to the second inclined reflective surface.

[0164] The 18th embodiment is a substrate transport device according to the 17th embodiment, comprising a control unit, wherein the first inclined reflective surface is provided in front of the second inclined reflective surface in the forward / backward direction, the measuring light transmits through the substrate, and the control unit calculates the amplitude of vibration at the tip of the end effector based on the position of the first inclined reflective surface detected by the first optical displacement meter when the position of the end effector in the forward / backward direction is within a position range in which both the measuring light from the first and second optical displacement meters do not pass through the substrate in the substrate container, and calculates the amplitude of vibration at the tip of the end effector based on the position of the second inclined reflective surface detected by the second optical displacement meter when the position of the end effector in the forward / backward direction is within a position range in which the measuring light from the first optical displacement meter passes through the substrate in the substrate container and the measuring light from the second optical displacement meter does not pass through the substrate in the substrate container.

[0165] According to the first embodiment, the optical displacement sensor is positioned behind the inclined reflective surface. Therefore, vibrations at the tip of the end effector can be reduced compared to the case where the optical displacement sensor is positioned in front of the inclined reflective surface of the end effector.

[0166] According to the second embodiment, unlike the recess, it does not lead to a reduction in the thickness of the end effector, thus avoiding a decrease in the strength of the end effector.

[0167] According to the third embodiment, manufacturing costs can be reduced compared to the case in which the protrusion having an inclined reflective surface is provided separately from the positioning protrusion.

[0168] According to the fourth embodiment, the recess does not interfere with the substrate supported by the end effector, thus improving the degree of freedom in setting the recess.

[0169] According to the fifth embodiment, vibrations of the end effector can be detected with higher accuracy.

[0170] According to the sixth embodiment, the measurement light does not pass through the substrate inside the substrate housing. Therefore, even when the end effector enters the substrate housing, the optical displacement meter can detect the position of the inclined reflective surface while avoiding the influence of the substrate.

[0171] According to the seventh embodiment, the optical displacement sensor moves together with the end effector, so that vibrations of the end effector can be detected with higher accuracy.

[0172] According to the eighth aspect, interference with the transport drive unit can be avoided, making it easier to install an optical displacement sensor.

[0173] According to the ninth aspect, the optical displacement sensor can detect the position of the inclined reflective surface without being affected by the substrate supported by the end effector.

[0174] According to the tenth embodiment, since the optical displacement meter is not provided on the end effector, the end effector can be made lighter. As a result, vibration of the end effector can be further reduced.

[0175] According to the eleventh embodiment, the end effector can be moved along the forward and backward direction while maintaining a constant distance between the end effector and the optical displacement meter.

[0176] According to the twelfth embodiment, since it is not necessary to move the optical displacement sensor along the forward and backward direction, the size of the substrate transport device can be reduced.

[0177] According to the 13th embodiment, the optical displacement sensor can be raised and lowered according to the position of the end effector.

[0178] According to the 14th and 15th embodiments, when the end effector enters the substrate housing, measurement light from the optical displacement meter is incident on the substrate inside the substrate housing. The measurement light can pass through the substrate and enter the inclined reflective surface of the end effector. Therefore, even when the end effector is located inside the substrate housing (i.e., when the end effector is located within the second position range), the optical displacement meter can detect the position of the inclined reflective surface.

[0179] According to the 16th aspect, the position of the inclined reflective surface can be detected with higher accuracy.

[0180] According to the 17th embodiment, the optical displacement meter can detect the position of the inclined reflective surface of the first long portion and the position of the inclined reflective surface of the second long portion.

[0181] According to the 18th embodiment, the amplitude of vibration of the end effector can be calculated while avoiding the influence of the substrate inside the substrate housing. Moreover, when neither the measurement light from the first and second optical displacement meters penetrates the substrate, the control unit calculates the amplitude of vibration at the tip of the end effector based on the position of the first inclined reflecting surface closer to the tip of the end effector. Therefore, the control unit can calculate the amplitude with higher accuracy. [Explanation of Symbols]

[0182] 20. Substrate transport device (first processing unit) 30 End Effectors 300 hands 31a Slanted reflective surface 31aA First inclined reflective surface (inclined reflective surface) 31aB Second inclined reflective surface (inclined reflective surface) 31A 1st long part 31B 2nd long part 33 Convex part 34 Positioning protrusion 35 recess 40 Conveyor drive unit 60 Optical displacement meter 60A First Optical Displacement Meter (Optical Displacement Meter) 60B Second Optical Displacement Meter (Optical Displacement Meter) 61 Light-emitting part 62 Light receiving part 70 Sensor displacement drive unit 71 Reverse drive unit 72 Lifting drive unit 73 Reverse drive unit 90 Control Unit C board housing Dx forward / backward direction L1 Measurement light Q1 Rotation axis W board

Claims

1. A substrate transport device for loading and unloading substrates into and from a substrate container, An end effector having an inclined reflective surface and supporting the substrate, A transport drive unit that moves the end effector along the forward and backward direction relative to the substrate housing, An optical displacement meter includes a light-emitting unit that emits measurement light obliquely toward the inclined reflective surface from a position behind the inclined reflective surface in the direction of advancement and retreat, and a light-receiving unit that receives the measurement light from the inclined reflective surface, and detects the position of the inclined reflective surface. A substrate transport device equipped with the following features.

2. A substrate transport apparatus according to claim 1, The aforementioned end effector is, Hand and, The protrusion provided on the hand and Includes, A substrate transport device in which the inclined reflective surface is part of the side surface of the convex portion.

3. A substrate transport apparatus according to claim 2, The aforementioned protrusion is a protrusion for positioning the substrate, in a substrate transport device.

4. A substrate transport apparatus according to claim 1, The aforementioned end effector is, Hand and, The recess provided in the hand and Includes, The inclined reflective surface is part of the inner circumferential surface of the recess in the substrate transport device.

5. A substrate transport device according to any one of claims 1 to 4, A substrate transport device wherein the inclined reflective surface is provided on the end effector in the forward direction of the substrate supported by the end effector.

6. A substrate transport device according to any one of claims 1 to 4, A substrate transport device wherein the inclined reflective surface is provided on the end effector at a position behind the substrate supported by the end effector in the forward / backward direction.

7. A substrate transport device according to any one of claims 1 to 4, The optical displacement sensor is provided on the end effector of the substrate transport device.

8. A substrate transport device according to any one of claims 1 to 4, The transport drive unit is located below the end effector. The inclined reflective surface is provided on the upper side of the end effector. The optical displacement sensor is located above the end effector in the substrate transport device.

9. A substrate transport device according to any one of claims 1 to 4, The inclined reflective surface is provided on the lower side of the end effector. The optical displacement sensor is located below the end effector in the substrate transport device.

10. A substrate transport device according to any one of claims 1 to 4, A sensor displacement drive unit that displaces the optical displacement meter, A control unit controls the sensor displacement drive unit according to the position of the end effector to cause the measurement light from the optical displacement meter to be incident on the inclined reflective surface. A substrate transport device equipped with the following features.

11. A substrate transport apparatus according to claim 10, The substrate transport device includes a sensor displacement drive unit that moves the optical displacement meter along the forward and backward direction.

12. A substrate transport apparatus according to claim 10, A substrate transport device in which the sensor displacement drive unit includes a rotation drive unit that rotates the optical displacement meter in forward and reverse directions around a horizontal rotation axis perpendicular to the forward and backward directions.

13. A substrate transport apparatus according to claim 10, The aforementioned sensor displacement drive unit includes a lifting drive unit for raising and lowering the optical displacement meter, in a substrate transport device.

14. A substrate transport device according to any one of claims 1 to 4, The aforementioned measuring light is transmitted through the substrate, and the substrate transport device.

15. A substrate transport apparatus according to claim 14, A substrate transport device wherein the optical displacement meter detects the position of the inclined reflective surface when the position of the end effector in the forward and backward direction is within a first position range in which the measuring light does not pass through the substrate in the substrate holder, and when the measuring light is within a second position range in which it passes through the substrate in the substrate holder.

16. A substrate transport apparatus according to claim 15, A first correspondence between the measurement light and the position of the inclined reflective surface when the measurement light passes through the substrate, and a second correspondence between the measurement light and the position of the inclined reflective surface when the measurement light does not pass through the substrate are set in advance. The optical displacement meter is When the position of the end effector in the forward and backward direction is within the first position range, the position of the inclined reflective surface is determined based on the measurement light received by the light receiving unit and the first correspondence relationship. A substrate transport device that determines the position of the inclined reflective surface based on the measurement light received by the light receiving unit and the second correspondence relationship when the position of the end effector in the forward and backward direction is within the second position range.

17. A substrate transport device according to any one of claims 1 to 4, The end effector includes a first long portion and a second long portion, The first inclined reflective surface is provided in correspondence with the first elongated portion, The second inclined reflective surface is provided in correspondence with the second elongated portion, The first optical displacement meter is provided in correspondence with the first inclined reflective surface, A substrate transport device in which the second optical displacement meter is provided corresponding to the second inclined reflective surface.

18. A substrate transport apparatus according to claim 17, Equipped with a control unit, The first inclined reflective surface is provided in front of the second inclined reflective surface in the direction of advancement and retraction. The measurement light is transmitted through the substrate, The control unit, When the position of the end effector in the forward and backward direction is within a range where the measurement light from both the first and second optical displacement meters does not pass through the substrate in the substrate housing, the amplitude of vibration at the tip of the end effector is calculated based on the position of the first inclined reflective surface detected by the first optical displacement meter. A substrate transport device that calculates the amplitude of vibration at the tip of the end effector based on the position of the second inclined reflective surface detected by the second optical displacement meter when the position of the end effector in the forward and backward direction is within a range in which the measuring light from the first optical displacement meter passes through the substrate in the substrate container, and the measuring light from the second optical displacement meter does not pass through the substrate in the substrate container.

Images