Lead pins for compression-sealed glass hermetic seals and their manufacturing method, as well as airtight terminals and electric compressors
The [Cr or Mo]-Cu composite lead pins address thermal expansion and conductivity issues by providing a unique cross-sectional structure, enhancing bonding reliability and reducing heat generation, suitable for high-current applications in electric compressors.
JP2026119977AActive Publication Date: 2026-07-21SHINKO YOGYO +2
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- SHINKO YOGYO
- Filing Date
- 2025-01-08
- Publication Date
- 2026-07-21
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Figure 2026119977000001_ABST
Abstract
The present invention provides a lead pin for a compression-sealed glass hermetic seal that has a relatively small axial thermal expansion coefficient and high axial electrical conductivity, offers high reliability in bonding with the sealing glass, allows for the conduction of large currents even with a small diameter, and generates little heat during energization. [Solution] The [Cr and / or Mo]-Cu composite has a metallic structure in which a Cr phase and / or Mo phase are dispersed in a Cu matrix. This [Cr and / or Mo]-Cu composite is a diameter-reduced stretched material for powder metallurgy molded bodies. When the cross-sectional structure is observed with an optical microscope, it has an axial cross-sectional structure in which layered or linear Cr phases and / or Mo phases are dispersed in the Cu matrix, and a radial cross-sectional structure in which flaky, small-piece, or granular Cr phases and / or Mo phases are dispersed in the Cu matrix.
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