Electronic devices

Abstract

The present invention provides an electronic device that effectively cools the heat generated by heat-generating electronic components located in the case using a heat sink, while also minimizing the impact of moisture entering the case on electronic circuits and other components. [Solution] The heat sink 20, located inside the case 10, is provided with multiple protrusions that extend perpendicularly toward the opposing wall of the case. Air A1 entering the case through the first intake hole 31 formed in the opposing wall is dispersed by the protrusions and diffused periodically before being discharged to the outside through the exhaust hole 36 by the power fan 37. In addition, any moisture that enters the case is discharged downward through the drainage passage 43 along the upper surfaces of the first and second dam sections.

Claims

1. In an electronic device in which heat-generating electronic components and a heat sink are housed inside a case, The case has an opposing wall portion having an intake hole, and an exhaust hole opening at a position away from the intake hole, A power fan is provided that forms an airflow between the heat sink and the opposing wall portion, from the intake hole to the exhaust hole. The heat sink is provided with multiple protrusions whose height is greater than the maximum width at the base end, and the tip of each of these protrusions is directed toward the opposing wall. An electronic device characterized in that the intake holes are located opposite each other within a region of the protrusions arranged therein, and the area of ​​the protrusions arranged therein is larger than the opening area of ​​the intake holes.

2. The electronic device according to claim 1, wherein the heat sink has a heat dissipation plane facing the opposing wall portion, and the protrusion extends perpendicularly from the heat dissipation plane.

3. The electronic device according to claim 2, wherein the projection has a circular, oval, or elliptical cross-section, and the size of the cross-section is uniform from the base to the tip.

4. In an electronic device in which heat-generating electronic components and a heat sink are housed inside a case, The case has an opposing wall portion that extends vertically, a first side wall portion that intersects the opposing wall portion and extends vertically, a second side wall portion that faces the first side wall portion and extends vertically, an intake hole opening in the first side wall portion and an exhaust hole opening in the second side wall portion, The electronic device is characterized in that the heat sink is provided with a plurality of protrusions directed toward the opposing wall, a first dam located below the protrusions and extending from the inside of the first side wall in a direction intersecting the first side wall, and a drainage passage extending downward in a continuous manner with the first dam.

5. The electronic device according to claim 4, wherein the heat sink has a second dam portion that extends from the inside of the second side wall portion to the drainage passage.

6. The electronic device according to claim 5, wherein at least one of the first dam portion and the second dam portion is inclined in a direction that descends toward the drainage passage.

7. The electronic device according to claim 4, wherein the height dimension of the projection is greater than the maximum width dimension at the base end, and a plurality of such projections are arranged parallel to each other.

8. The electronic device according to claim 7, wherein the projection has a circular, oval, or elliptical cross-section, and the size of the cross-section is uniform from the base to the tip.

9. The electronic device according to any one of claims 4 to 8, which is provided with a power fan that forms an airflow between the heat sink and the opposing wall portion, from the intake hole to the exhaust hole.

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