Resin encapsulation apparatus and resin encapsulation method

Abstract

To provide a resin sealing device that can cool the bottom surface of resin-sealed products without increasing the number of transfers. [Solution] The resin encapsulation apparatus 1 includes a press module 3 having a mold 32 for resin encapsulating a workpiece w, an unloader 13 that enters the press module 3 and recovers the resin-encapsulated product W on which the unwanted resin portion R has been formed, a degator 42 that separates the unwanted resin portion R from the resin-encapsulated product W transported from the unloader 13, and cooling devices 41 and 14 provided in the transport path between the press module 3 and the degator 42, which spray a coolant A onto the lower surface W2 of the resin-encapsulated product W held by the unloader 13.

Description

Technical Field

[0001] The present invention relates to a resin sealing device and a resin sealing method using the device.

Background Art

[0002] The resin-sealed product taken out of the mold is connected to unnecessary resin such as a caul and a runner. The degator breaks the gate position to separate the unnecessary resin. In order to improve the production efficiency of the mold, the resin-sealed product is taken out as soon as it cools to a temperature at which it can be taken out of the mold. Since there are also resin-sealed products whose temperature is difficult to drop, if the unnecessary resin is separated while the gate position is soft, there is a risk that the remaining part may be removed or the part to be removed may remain, resulting in a defect such as breaking off from the gate position.

[0003] Therefore, in Patent Document 1, in order to prevent gate breakage defects due to insufficient cooling, a cooling means interposed between a sealing means (corresponding to a mold) for sealing a molded product such as a semiconductor chip with resin and a gate breakage means (corresponding to a degator) for removing unnecessary resin from the molded product is disclosed. The cooling means includes a jig portion having a surface shaped along the shape of the molded product, and air, which is a cooling medium, is ejected from air ejection holes provided at the positions of the runner portion and the caul portion of the molded product set on the jig portion.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in Patent Document 1, the molded product must be set in the uneven surface of the jig before cooling and then clamped with the clamping claws. Furthermore, after cooling, the molded product must be removed from the jig and transferred to a second transport means (corresponding to a degate pallet). This increases the number of times molded products are received and handed over, thus extending the cycle time, which is the time required to seal each molded product with resin. In addition, the surface of the jig is a dedicated part with the shape of the molded product reversed and cannot be used for other types of molded products, thus increasing the cost of introducing the cooling means in the case of multi-product production. The burden on the worker increases because the jig part of the cooling means must be replaced each time the type of molded product is changed.

[0006] This invention has been made in view of the above problems, and aims to provide a resin sealing device that can cool the bottom surface of a resin-sealed product without increasing the number of deliveries. [Means for solving the problem]

[0007] A resin encapsulation apparatus according to one aspect of the present invention comprises a press module having a mold for resin encapsulating a workpiece, an unloader that enters the press module and recovers the resin-encapsulated product on which the excess resin portion has been formed, a degator that separates the excess resin portion from the resin-encapsulated product transported from the unloader, and a cooling device provided in the transport path between the press module and the degator, which sprays a coolant onto the lower surface of the resin-encapsulated product while it is being held by the unloader.

[0008] Another aspect of the present invention relates to a resin encapsulation method which includes: encapsulating a workpiece with resin; an unloader entering a mold to recover the resin-encapsulated product from which unwanted resin portions have been formed; a cooling device spraying a coolant onto the lower surface of the resin-encapsulated product while it is being held by the unloader; and a digger separating the unwanted resin portions from the resin-encapsulated product. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a resin sealing device that can cool the lower surface of a resin-sealed product without increasing the number of transfers. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a plan view showing an example of a resin encapsulation apparatus according to one embodiment of the present invention. [Figure 2] Figure 2 is a rear view of the resin encapsulation device shown in Figure 1, as seen from the guide rail side. [Figure 3] Figure 3 is a plan view showing the first, second, and third positions included in the movement range of the digitated pallet. [Figure 4] Figure 4 is a front view showing the operation of a degator that separates unwanted resin parts from a resin-encapsulated product. [Figure 5] Figure 5 is a perspective view showing the frame of the out-module alongside the unloader in its first position. [Figure 6] Figure 6 is a perspective view showing the refrigerant being blown downwards from the unloader hand and degate hand, and the refrigerant being blown upwards from the cooling device, side by side. [Figure 7] Figure 7 is a perspective view showing a cooling device spraying refrigerant onto a resin-encapsulated product while it is being held by an unloader hand. [Figure 8] Figure 8 is a perspective view showing a cooling device in which the unloader hand shown in Figure 7 is omitted and the refrigerant is sprayed onto the underside of the resin-encapsulated product. [Figure 9] Figure 9 is a perspective view showing an example of the cooling device shown in Figure 8. [Figure 10] Figure 10 is a flowchart illustrating an example of a resin encapsulation method according to one embodiment of the present invention. [Modes for carrying out the invention]

[0011] A preferred embodiment of the present invention will be described with reference to the attached drawings. In each drawing, components with the same reference numerals have the same or similar configuration. Each drawing is conveniently accompanied by a Cartesian coordinate system consisting of the X, Y, and Z axes to clarify the relationships between the drawings and to help understand the positional relationships of each component. The XY plane, which includes the X and Y axes, is defined as the horizontal plane, the direction of the Z-axis arrow is defined as vertically upward, and the direction opposite to the Z-axis arrow is defined as vertically downward. The direction parallel to the X-axis is referred to as the X-axis direction, the direction parallel to the Y-axis is referred to as the Y-axis direction, and the direction parallel to the Z-axis is referred to as the Z-axis direction. When viewed from the front side of the resin encapsulation device 1, the X-axis direction is, for example, the left-right direction, and the Y-axis direction is, for example, the front-back direction. The present invention will be described in detail below with reference to the drawings.

[0012] Figure 1 is a plan view showing an example of a resin encapsulation apparatus 1 according to one embodiment of the present invention. In the illustrated example, the resin encapsulation apparatus 1, configured as a transfer molding machine, includes an in-module 2, a plurality of press modules 3, an out-module 4, a loader device 10, and the like.

[0013] The loader device 10 includes a guide rail 11, a loader 12, an unloader 13, etc. The guide rail 11 extends across an in-module 2, multiple press modules 3, and an out-module 4. The loader 12 and unloader 13 move along the guide rail 11. The in-module 2 includes a workpiece supply device 21, a resin supply device 22, etc. The workpiece supply device 21 supplies workpieces w in an un-resin-sealed state to the loader 12. The resin supply device 22 supplies resin material r, such as resin tablets, to the loader 12.

[0014] The press module 3 includes a press device 31, a die 32, etc. The press device 31 opens and closes the die 32. The die 32 seals the workpiece w with resin material r. The output module 4 includes a decator 42, a storage magazine 43, etc. The decator 42 separates the unwanted resin part R from the resin-sealed product W. The storage magazine 43 stores the decated resin-sealed product W.

[0015] The unloader 13 includes an unloader body 131 configured to be movable left and right along the guide rail 11, an unloader hand 132 configured to move back and forth with respect to the unloader body 131 and to be retractable into and out of the mold 32, and the like. Similar to the unloader 13, the loader 12 includes a loader body 121 movable left and right, a loader hand 122 retractable back and forth, and the like. The loader 12 may be omitted and the unloader 13 may be configured to also perform the functions of the loader 12.

[0016] The work supply device 21 includes a supply magazine 211 that houses a plurality of works w, a turntable 212 that aligns the works w supplied from the supply magazine 211, a preheater 213 that preheats the works w, and the like. The work w before resin sealing is, for example, a lead frame with a semiconductor element mounted thereon, an interposer substrate with a semiconductor element mounted thereon, a carrier plate with an adhesive sheet to which a semiconductor element is temporarily attached, and the like, and is composed of a substrate and minute electronic components such as a semiconductor element, a MEMS chip, and an electronic device attached to the substrate.

[0017] FIG. 2 is a rear view of the resin sealing device 1 shown in FIG. 1 as viewed from the guide rail 11 side. In the illustrated example, the resin supply device 22 is configured to supply a resin tablet as the resin material r, and includes a hopper 221 that vibrates the resin tablet and drops it in predetermined amounts, an aligning device 222 that aligns the resin tablets dropped from the hopper 221 in a predetermined direction, a lifting device 223 that receives the resin tablets from the aligning device 222 and delivers the resin tablets to the loader 12 waiting in the upper space of the in-module 2, and the like.

[0018] The loader 12 carries the work w and the resin material r into the mold 32. The mold 32 is provided with a preheating chamber that heats the resin material r, a flow path through which the molten resin material r flows, a cavity that transfers the outer shape of the molded product, and the like. The press module 3 fills the cavity with the resin material r heated in the preheating chamber through the flow path and resin-seals the work w in the mold 32.

[0019] In this specification, a workpiece w sealed with resin material r is referred to as a resin-sealed product W (shown in Figure 8). Furthermore, the resin material r cured in the pre-chamber is referred to as 'cal', and the resin material r cured in the flow channel is referred to as 'runner', and these together are referred to as the 'unnecessary resin part R' (shown in Figure 8).

[0020] Figure 3 is a plan view showing the first position Y1, the second position Y2, and the third position Y3, which are included in the movement range of the conveying device. As shown in Figure 3, the resin-sealed product W immediately after being sealed in the mold 32 remains connected to the unwanted resin part R. Because the temperature has not yet dropped, the gate position at the boundary between the resin-sealed product W and the unwanted resin part R is soft.

[0021] The unloader 13 removes the resin-encapsulated product W, along with the unnecessary resin parts R, from the mold 32. The unloader hand 132 can lift and hold the resin-encapsulated product W by gripping it. The conveying device retrieves the resin-encapsulated product W from the unloader 13 at the first position Y1, and conveys the resin-encapsulated product W to the third position Y3 where the storage magazine 43 is located, via the second position Y2 where part or all of the degator 42 is located.

[0022] The decator 42 includes a decate pallet 421, a decate hand 422, etc. In the illustrated example, the decate pallet 421 is an example of a conveying device that can move back and forth to convey the resin-encapsulated product W. The decate hand 422 is an example of a first decate unit located at the second position Y2, and together with the decate pallet 421 separates the unwanted resin part R from the resin-encapsulated product W.

[0023] Since the conveying device constitutes part of the decator 42, when separating the unwanted resin part R from the resin-encapsulated product W, there is no transfer of the resin-encapsulated product W from the conveying device to the decator 42. Because the unwanted resin part R can be separated from the resin-encapsulated product W while it is held by the conveying device, the cycle time can be shortened. Note that the conveying device is not limited to the decate pallet 421, but may be a device independent of the decator 42.

[0024] Figure 4 is a front view showing the operation of a degator 42 that separates unwanted resin parts R from a resin-sealed product W. As shown in Figure 4, the degator 42 sandwiches the resin-sealed product W between a degate pallet 421 and a degate hand 422, bends the unwanted resin parts R such as the casing and runner, and separates the unwanted resin parts R. The separated unwanted resin parts R are collected in a casing box 423.

[0025] In the illustrated example, two resin-encapsulated products W are connected via an unnecessary resin portion R. The degate pallet 421 has a first portion (left flap) 42A that supports one resin-encapsulated product W, a second portion (connecting portion) 42B that supports the unnecessary resin portion R, and a third portion (right flap) 42C that supports the other resin-encapsulated product W, etc. Similarly, the degate hand 422 has a fourth portion 42D that presses one resin-encapsulated product W toward the first portion 42A, a fifth portion 42E that presses the unnecessary resin portion R toward the second portion 42B, and a sixth portion 42F that presses the other resin-encapsulated product W toward the third portion 42C, etc.

[0026] When both ends of the first part 42A and the third part 42C of the degate pallet 421 are lifted relative to the second part 42B, the unwanted resin part R is bent at the gate position at the boundary between the resin-sealed product W and the unwanted resin part R, and the unwanted resin part R is broken at the gate position. Alternatively, both ends of the fourth part 42D and the sixth part 42F of the degate hand 422 may be pressed down relative to the fifth part 42E to bend the unwanted resin part R. Note that the configuration of the degator 42 is not limited to the illustrated example, and known configurations can be appropriately selected.

[0027] Figure 5 is a perspective view showing the frame of the out-module 4 alongside the unloader 13 in its first position Y1. The first position Y1 is an example of a transport path located between the press module 3 and the dicator 42. The lower part of the out-module 4 has space for a dust collector, a pressure source such as an air compressor, the aforementioned calbox 423, storage magazine 43, etc. The upper part of the out-module 4 has space for the aforementioned dicate pallet 421, dicate hand 422, etc., and also space for the addition of a cooling device 41, which will be described later.

[0028] Figure 6 is a perspective view showing the refrigerant A blown downward from the unloader hand 132 and the decate hand 422, and the refrigerant A blown upward from the cooling device 41, side by side. As shown in Figure 6, the unloader 13 can blow refrigerant A, such as air, toward the upper surface W1 (shown in Figure 8) of the resin-encapsulated product W while it is being held by the unloader hand 132. The decate hand 422 can blow refrigerant A toward the upper surface W1 of the resin-encapsulated product W when the decate pallet 421 is in the second position Y2.

[0029] The cooling device 41 can spray refrigerant A onto the lower surface W2 (shown in Figure 8) of the resin-sealed product W, which is opposite to the upper surface W1. The upper surface W1 of the resin-sealed product W may be referred to as the first surface W1, and the lower surface W2 may be referred to as the second surface W2. One of the features of the resin-sealing device 1 of the present invention is that it is equipped with a cooling device 41 and / or a cooling device 14 that sprays refrigerant A, such as air, onto the lower surface W2 of the resin-sealed product W while it is being held by the unloader 13, which enters the mold 32 and recovers the resin-sealed product W together with the unnecessary resin part R.

[0030] Refrigerant A is not limited to air; it may be nitrogen gas or other types of gas. The type of refrigerant A sprayed by the unloader 13, degate hand 422, cooling device 41, and cooling device 14 does not have to be the same. Since refrigerant A is sprayed onto the bottom surface W2 of the resin-encapsulated product W while it is held by the unloader 13, the resin-encapsulated product W does not need to be attached to the cooling devices 41 and 14. The bottom surface W2 of the resin-encapsulated product W can be cooled without increasing the number of times the resin-encapsulated product W is received or handed over. Since both the top surface W1 and bottom surface W2 of the resin-encapsulated product W can be cooled, deformation that would occur if only one side was cooled and the resin-encapsulated product W warped can be suppressed.

[0031] As shown in Figure 2, the press module 3 is equipped with a cooling device 14 positioned along a guide rail 11 that guides the unloader 13 to a first position Y1. The guide rail 11 is an example of a transport path located between the press module 3 and the degator 42. The cooling device 14 can spray a coolant A onto the underside W2 of the resin-encapsulated product W held by the unloader 13 as the unloader 13 moves from the mold 32 to the first position Y1.

[0032] Figure 7 is a perspective view showing a cooling device 41 spraying refrigerant A onto a resin-encapsulated product W while it is being held by an unloader hand 132. Figure 8 is a perspective view showing the cooling device 41 spraying refrigerant A onto the lower surface W2 of the resin-encapsulated product W, with the unloader hand 132 shown in Figure 7 omitted. As shown in Figures 7 and 8, the out-module 4 includes a cooling device 41 located at a first position Y1. When the unloader 13 moves to the first position Y1, the cooling device 41 sprays refrigerant A onto the lower surface W2 of the resin-encapsulated product W while it is being held by the unloader 13.

[0033] The cooling device 41 may also cool a conveying device such as a dedate pallet 421 that is waiting while the resin-encapsulated product W has not been collected. Even if the temperature of the conveying device rises due to contact with the resin-encapsulated product W, the temperature of the conveying device can be lowered before the next resin-encapsulated product W is collected.

[0034] The cooling device 41 may cool the lower surface W2 of the resin-encapsulated product W while it is being held by a conveying device such as a degate pallet 421, rather than while it is being held by the unloader 13. In that case, an opening for the refrigerant A may be formed in the mounting part of the conveying device on which the resin-encapsulated product W is placed, and the refrigerant A may be blown onto the lower surface W2 of the resin-encapsulated product W to cool it.

[0035] The resin-encapsulated product W being collected in the conveying device may be indirectly cooled by spraying refrigerant A onto the conveying device. When indirect cooling is performed, the opening through which refrigerant A passes may be omitted. Even when the lower surface W2 of the resin-encapsulated product W is being cooled while it is being held by the conveying device, the lower surface W2 of the resin-encapsulated product W can be cooled without attaching the resin-encapsulated product W to the cooling devices 41,14.

[0036] Figure 9 is a perspective view showing an example of the cooling device 41 shown in Figure 8. In the illustrated example, the cooling device 41 includes a plurality of tubes 413 connected to a pressure source such as an air compressor, hollow pipes 414 connected to each of the tubes 413, a box-shaped housing 411, and brackets 412 for fixing the plurality of pipes 414 to the housing 411.

[0037] Each pipe 414 is provided with multiple nozzles 415 for injecting refrigerant A. The spacing between adjacent pipes 414 can be adjusted by sliding the bracket 412. The orientation of the nozzles 415 can be adjusted by loosening the bracket 412 and rotating each pipe 414. The configuration of the cooling device 41 is not limited to the illustrated example and may be modified as appropriate.

[0038] Figure 10 is a flowchart illustrating an example of a resin encapsulation method according to one embodiment of the present invention. Using the resin encapsulation apparatus 1 described above, the resin encapsulation method involves the unloader 13 entering the mold 32 and recovering the resin-encapsulated product W together with the unwanted resin portion R (step S1).

[0039] The unloader 13 blows a coolant A, such as air, onto the upper surface W1 of the resin-encapsulated product W (step S2). While blowing the coolant A, the unloader 13 moves toward the first position Y1 (step S3). Step S2 may be omitted as the decate hand 422 may cool the upper surface W1 of the resin-encapsulated product W instead of the unloader 13.

[0040] A cooling device 14, positioned along the guide rail 11, sprays refrigerant A onto the lower surface W2 of the resin-encapsulated product W, which is being held by the moving unloader 13 (step S4). Step S4 may be omitted, as a cooling device 41 may cool the lower surface W2 of the resin-encapsulated product W instead of cooling device 14. Alternatively, step S4 may be configured so that the cooling device 41 sprays refrigerant A onto the lower surface W2 of the resin-encapsulated product W, which is being held on a dedate pallet 421, instead of the unloader 13.

[0041] Step S5 involves a cooling device 41 located at the first position Y1 spraying refrigerant A onto the lower surface W2 of the resin-encapsulated product W, which is being held by the unloader 13 that has moved to the first position Y1. If the cooling device 14 is already cooling the lower surface W2 of the resin-encapsulated product W, step S5 may be omitted.

[0042] A conveying device such as a decate pallet 421 transports the resin-encapsulated product W recovered from the unloader 13 at the first position Y1 to the second position Y2 (step S6). A first decate unit such as a decate hand 422 located at the second position sprays refrigerant A onto the upper surface W1 of the resin-encapsulated product W (step S7). Step S7 may be omitted if the unloader 13 has cooled the upper surface W1 of the resin-encapsulated product W. Alternatively, if the resin-encapsulated product W has been sufficiently cooled by the cooling device 41 or the like, step S7 may be omitted. The decate pallet 421, which has moved to the second position Y2, separates the unwanted resin part R from the resin-encapsulated product W together with the decate hand 422, which is also located at the second position Y2 (step S8).

[0043] With the resin sealing apparatus 1 and resin sealing method using the resin sealing apparatus 1 configured as described above, the refrigerant A is sprayed onto the lower surface W2 of the resin-sealed product W while it is held in the unloader 13, so the lower surface W2 of the resin-sealed product W can be cooled without attaching the resin-sealed product W to the cooling devices 41 and 14. Because the cooling is forced by spraying the refrigerant A, there is no need to wait for the temperature of the resin-sealed product W to drop naturally. The cycle time, which is the time required to produce each resin-sealed product W, can be shortened.

[0044] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The elements, arrangement, materials, conditions, shapes, and sizes of the embodiments are not limited to those exemplified and can be modified as appropriate. Furthermore, it is possible to partially substitute or combine the configurations shown in different embodiments.

[0045] [Note 1] The resin encapsulation apparatus (1) includes a press module (3) having a mold (32) for resin encapsulating a workpiece (w), an unloader (13) for collecting the resin-encapsulated product (W) that has entered the press module (3) and formed an unwanted resin portion (R), a degator (42) for separating the unwanted resin portion (R) from the resin-encapsulated product (W) transported from the unloader (13), and a cooling device (41, 14) provided in the transport path between the press module (3) and the degator (42) for blowing a coolant (A) onto the lower surface (W2) of the resin-encapsulated product (W) held by the unloader (13).

[0046] [Note 8] The resin sealing method includes: sealing a workpiece (w) with resin; an unloader (13) entering a mold (32) to recover the resin-sealed product (W) from which an unwanted resin portion (R) has been formed (S1); a cooling device (41, 14) spraying a coolant (A) onto the lower surface (W2) of the resin-sealed product (W) held by the unloader (13) (S5, S2); and a digger separating the unwanted resin portion (R) from the resin-sealed product (W).

[0047] According to appendices 1 and 8, since the refrigerant (A) is sprayed onto the bottom surface (W2) of the resin-encapsulated product (W) while it is held in the unloader (13), the bottom surface (W2) of the resin-encapsulated product (W) can be cooled without attaching it to the cooling device (41, 14). Because it is forcibly cooled by spraying the refrigerant (A), there is no need to wait for the temperature of the resin-encapsulated product (W) to drop naturally. The cycle time, which is the time required to produce each resin-encapsulated product (W), can be shortened.

[0048] [Note 7] The resin encapsulation device (1) includes an unloader (13) that enters the mold (32) and recovers the resin-encapsulated product (W) together with the unwanted resin part (R), a first decate section (422) that constitutes at least a part of a decator (42) that separates the unwanted resin part (R) from the resin-encapsulated product (W), a transport device (421) that recovers the resin-encapsulated product (W) from the unloader (13) at a first position (Y1) and transports it via a second position (Y2) where the first decate section (422) is located, and a cooling device (41) that is located at the first position (Y1) and blows a coolant (A) onto the lower surface (W2) of the resin-encapsulated product (W) that is being held by the transport device (421).

[0049] According to Appendix 7, since the refrigerant (A) is sprayed onto the underside of the resin-encapsulated product (W) while it is held in the conveying device (421), the underside (W2) of the resin-encapsulated product (W) can be cooled without attaching it to the jig of the cooling device (41,14). Because it is forcibly cooled by spraying the refrigerant (A), there is no need to wait for the temperature of the resin-encapsulated product (W) to drop naturally. The cycle time, which is the time required to produce each resin-encapsulated product (W), can be shortened.

[0050] [Note 2] In Appendix 1, the decator (42) further comprises a first decate section (422) which constitutes at least a part of the decator (42), and a transport device (421) which recovers the resin-encapsulated product (W) from the unloader (13) at a first position (Y1) and transports it via a second position (Y2) where the first decate section (422) is located, wherein the cooling device (41) is located at the first position (Y1), and when the unloader (13) moves to the first position (Y1), a coolant (A) may be sprayed onto the lower surface (W2) of the resin-encapsulated product (W) held by the unloader (13).

[0051] [Note 3] In Appendix 1 or 2, the cooling device (14) is positioned along a guide rail (11) that guides the unloader (13) to a first position (Y1), and when the unloader (13) is moving from the mold (32) to the first position (Y1), the cooling device (A) may be sprayed onto the lower surface (W2) of the resin-encapsulated product (W) held by the unloader (13).

[0052] In both appendices 2 and 3, the refrigerant (A) can be sprayed onto the resin-encapsulated product (W) while it is held in the unloader (13). The bottom surface (W2) of the resin-encapsulated product (W) can be cooled without increasing the number of times the resin-encapsulated product (W) is handled.

[0053] [Note 4] In appendices 1 to 3, the unloader (13) may spray the refrigerant (A) toward the upper surface (W1) of the resin-sealed product (W) that is being held by the unloader (13).

[0054] [Note 5] In Appendix 2, the first dergate unit (422) may spray refrigerant (A) onto the upper surface (W1) of the resin-encapsulated product (W) when the conveying device (421) is moving to the second position (Y2).

[0055] In both appendices 4 and 5, both the top (W1) and bottom (W2) surfaces of the resin-encapsulated product (W) can be cooled, thus suppressing deformation that would occur if only one side were cooled, causing the resin-encapsulated product (W) to warp. [Note 6] In Appendix 2 or 5, the conveying device (421) may constitute a part of the decator (42) and, together with the first decate section (422), separate the unwanted resin portion (R) from the resin-encapsulated product (W) at the second position (Y2).

[0056] According to Appendix 6, when separating the unwanted resin part (R) from the resin-encapsulated product (W), there is no transfer of the resin-encapsulated product (W) from the conveying device (421) to another component. Since the unwanted resin part (R) can be separated from the resin-encapsulated product (W) while it is held by the conveying device (421), the cycle time can be shortened. [Explanation of symbols]

[0057] 1... Resin encapsulation device, 2... In-module, 3... Press module, 4... Out-module, 10... Loader device, 11... Guide rail, 12... Loader, 13... Unloader, 14... Cooling device, 21... Work supply device, 22... Resin supply device, 31... Press device, 32... Mold, 41... Cooling device, 42... Degator, 43... Storage magazine, 121... Loader body, 122... Loader hand, 131... Unloader body, 132... Unloader hand, 211... Supply magazine, 212... Turntable, 213... Preheater, 221... Hopper, 222... Alignment device, 223... Lifting device, 41 1...Housing, 412...Bracket, 413...Tube, 414...Pipe, 415...Nozzle, 421...Degate pallet (example of conveying device), 422...Degate hand (example of first degate section), 423...Calbox, 42A...First part, 42B...Second part, 42C...Third part, 42D...Fourth part, 42E...Fifth part, 42F...Sixth part, A...Refrigerant, r...Resin material, R...Unnecessary resin part, w...Workpiece, W...Resin-sealed product, W1...Top surface, W2...Bottom surface, X...Left-right direction, Y...Front-back direction, Y1...First position, Y2...Second position, Y3...Third position, Z...Vertical direction (up and down direction).

Claims

1. A press module having a mold and resin-encapsulating a workpiece, An unloader enters the press module and recovers the resin-sealed product on which the unwanted resin portion has been formed, A degator for separating unwanted resin parts from the resin-sealed product transported from the unloader, The system includes a cooling device provided in the transport path between the press module and the degator, which sprays a refrigerant onto the lower surface of the resin-sealed product while it is being held by the unloader, Resin encapsulation device.

2. The first decate section, which constitutes at least a part of the decater, The system further comprises a conveying device that recovers the resin-encapsulated product from the unloader at a first position and conveys it via a second position where the first dedate unit is located, The cooling device is positioned in the first position, and when the unloader moves to the first position, it sprays a coolant onto the lower surface of the resin-encapsulated product held by the unloader. The resin encapsulation apparatus according to claim 1.

3. The cooling device is arranged along a guide rail that guides the unloader to a first position, and when the unloader is moving from the mold to the first position, it sprays a coolant onto the lower surface of the resin-encapsulated product held by the unloader. The resin encapsulation apparatus according to claim 1.

4. The unloader sprays refrigerant toward the upper surface of the resin-sealed product that it is holding. The resin encapsulation apparatus according to claim 1.

5. The first decate unit sprays a refrigerant onto the upper surface of the resin-sealed product when the transport device is moved to the second position. The resin encapsulation apparatus according to claim 2.

6. The transport device constitutes a part of the decator and, together with the first decate section, separates the unnecessary resin portion from the resin-encapsulated product at the second position. The resin encapsulation apparatus according to claim 2.

7. A press module having a mold and resin-encapsulating a workpiece, An unloader enters the press module and recovers the resin-sealed product on which the unwanted resin portion has been formed, A first degate section, which constitutes at least a part of a degator that separates the unwanted resin portion from the resin-encapsulated product transported from the unloader, A conveying device that recovers the resin-encapsulated product from the unloader at a first position and transports it via a second position where the first dedate unit is located, A cooling device is positioned in the first position and sprays a refrigerant onto the lower surface of the resin-sealed product while it is being held by the conveying device, Equipped with, Resin encapsulation device.

8. To encase the workpiece in resin, The unloader enters the mold and recovers the resin-sealed product from which unwanted resin parts have formed. The cooling device sprays refrigerant onto the lower surface of the resin-sealed product while it is being held by the unloader, and The decator separates the unnecessary resin portion from the resin-sealed product, Resin encapsulation method.

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