Sensor module

Abstract

This provides a sensor module that can reduce the possibility of the sensor board becoming distorted. [Solution] A sensor module comprising a base and a lid constituting a housing, a sensor substrate disposed inside the housing and on which a first sensor is mounted, two or more fixing members for fixing the sensor substrate to the base, and a filling member that covers the sensor substrate and the two or more fixing members and fills the space between the sensor substrate and the housing.

Description

Technical Field

[0001] The present invention relates to a sensor module.

Background Art

[0002] There is known a sensor module equipped with an inertial sensor that detects inertia based on a predetermined detection axis.

[0003] For example, Patent Document 1 describes a sensor unit including a sensor module configured to include a substrate on which an inertial sensor is mounted and an inner case on which the substrate is mounted, and an outer case that houses the sensor module. A recess is formed in the inner case, the inertial sensor is disposed in a region overlapping the recess in a plan view as viewed from the thickness direction of the substrate, a filling member is filled in a space formed by the substrate and the recess, and the sensor module is joined to the bottom wall of the outer case via a joining member.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] When a substrate on which an inertial sensor as described above is mounted is fixed to an inner case via a filling member, the substrate may be deformed according to an external environment such as heat or moisture.

Means for Solving the Problems

[0006] One aspect of the sensor module according to the present invention is a base and a lid that constitute a housing, a sensor substrate disposed in the housing and on which a first sensor is mounted, Two or more fixing members for fixing the sensor substrate to the base, A filling member that covers the sensor substrate and the two or more fixing members, and is filled between the sensor substrate and the housing, It is equipped with. [Brief explanation of the drawing]

[0007] [Figure 1] A schematic perspective view showing the sensor module according to this embodiment. [Figure 2] A schematic perspective view showing the sensor module according to this embodiment. [Figure 3] A schematic perspective view showing the sensor module according to this embodiment. [Figure 4] A schematic perspective view showing the sensor module according to this embodiment. [Figure 5] A schematic plan view showing the sensor module according to this embodiment. [Figure 6] A schematic bottom view showing the sensor module according to this embodiment. [Figure 7] A schematic cross-sectional view showing the sensor module according to this embodiment. [Figure 8] A schematic cross-sectional view showing the sensor module according to this embodiment. [Figure 9] A schematic perspective view showing a sensor module according to a modified example of this embodiment. [Modes for carrying out the invention]

[0008] Preferred embodiments of the present invention will be described in detail below with reference to the drawings. The embodiments described below are not intended to unduly limit the scope of the present invention as described in the claims. Furthermore, not all of the configurations described below are essential components of the present invention. .

[0009] 1. Sensor module 1.1. Structure First, the sensor module according to this embodiment will be described with reference to the drawings. Figures 1 to 4 are schematic perspective views showing the sensor module 100 according to this embodiment. Figure 5 is a schematic plan view showing the sensor module 100 according to this embodiment. Figure 6 is a schematic bottom view showing the sensor module 100 according to this embodiment. Figures 7 and 8 are schematic cross-sectional views showing the sensor module 100 according to this embodiment. In Figures 1 to 8, the X-axis, Y-axis, and Z-axis are shown as three mutually orthogonal axes.

[0010] The sensor module 100 is an inertial measurement unit (IMU) that detects the attitude and behavior of an object to which it is attached, such as an automobile or a robot. The object to which it is attached is not limited to moving objects such as automobiles or robots, but may also be a structure such as a bridge, elevated structure, or railway track. When the sensor module 100 is attached to a structure, the sensor module 100 is used as a structural health monitoring system to check the structural integrity of the structure.

[0011] As shown in Figures 1 to 8, the sensor module 100 includes, for example, a housing 10, a sensor substrate 20, a fixing member 30, a connector 40, a first X-axis angular velocity sensor 50x, a second X-axis angular velocity sensor 51x, a first Y-axis angular velocity sensor 52y, a second Y-axis angular velocity sensor 53y, a first Z-axis angular velocity sensor 54z, a second Z-axis angular velocity sensor 55z, a circuit element 60, an acceleration sensor 70, and a filling member 80.

[0012] For convenience, the lid 18 of the housing 10 is omitted from Figure 2. The lid 18 and the filling member 80 are omitted from Figure 3. The components of the housing 10 other than the base 11 are omitted from Figure 4. The lid 18 and the filling member 80 are omitted from Figure 5. The components of the housing 10 other than the sensor substrate 20 and the components mounted on the sensor substrate 20 are omitted from Figure 6.

[0013] The housing 10 houses the sensor substrate 20. The material of the housing 10 is, for example, aluminum. Thereby, the housing 10 has high rigidity. The surface of the housing 10 may be anodized. Thereby, the housing 10 has insulating properties. Note that the material of the housing 10 is not particularly limited, and may be, for example, a metal such as titanium, magnesium, or stainless steel, a ceramic such as alumina or titania, or a resin.

[0014] As shown in FIG. 1, the housing 10 has, for example, a box-like shape. The housing 10 has, for example, a substantially rectangular parallelepiped shape. The housing 10 has a base 11 and a lid 18. The base 11 and the lid 18 constitute the housing 10.

[0015] As shown in FIG. 3, the base 11 has an opening 11a where the sensor substrate 20 is located. In the illustrated example, the opening 11a opens in the +Z-axis direction. The base 11 has a concave shape.

[0016] As shown in FIG. 4, the base 11 has a bottom 12 and side walls 15. Thread holes 13 for fixing the sensor substrate 20 to the base 11 are formed in the bottom 12. A plurality of thread holes 13 are formed. Further, a through hole 14 for arranging a connector 40 mounted on the sensor substrate 20 is formed in the bottom 12. The side walls 15 stand upright from the edge of the bottom 12. On the upper surface of the side walls 15, there are thread holes for fixing the lid 18 to the base 11 A screw hole 16 is formed. In the illustrated example, the screw holes 16 are formed one by one diagonally on the base 11 when viewed from the Z-axis direction. Further, screw holes 17 for fixing the sensor module 100 to the mounted body are formed on the upper surface of the side wall 15. In the illustrated example, the screw holes 17 are formed one by one diagonally on the base 11 when viewed from the Z-axis direction. The diagonal on which the screw holes 17 are formed is different from the diagonal on which the screw holes 16 are formed. The diameter of the screw hole 17 is larger than the diameters of the screw holes 13 and 16, for example. The bottom 12 includes a first surface 12a on which the screw hole 13 is formed and the sensor substrate 20 is disposed, and a second surface 12b that is recessed in the -Z-axis direction from the first surface 12a. That is, the bottom 12 has the first surface 12a and the second surface 12b with different depths. As shown in FIG. 7, members such as a second Z-axis angular velocity sensor 55z are disposed between the second surface 12b of the bottom 12 and the second surface 22 of the sensor substrate 20.

[0017] The lid 18 is provided on the side wall 15 of the base 11. As shown in FIG. 1, the lid 18 has, for example, a plate-like shape. The lid 18 closes the opening 11a of the base 11. The lid 18 faces the sensor substrate 20 via the filling member 80. In the illustrated example, the lid 18 is fixed to the base 11 by screws 19. The screws 19 are inserted into the screw holes 16 shown in FIG. 4. The screws 19 are provided diagonally on the lid 18 when viewed from the Z-axis direction. Thereby, the lid 18 can be firmly fixed to the base 11. The connection method between the lid 18 and the base 11 is not particularly limited and may be welding or adhesion by the filling member 80.

[0018] As shown in FIG. 3, the sensor substrate 20 is disposed in the housing 10. The sensor substrate 20 has a substantially rectangular shape when viewed from the Z-axis direction. The sensor substrate 20 is, for example, a circuit board. The sensor substrate 20 is, for example, a multi-layer glass epoxy substrate or a multi-layer ceramic substrate.

[0019] As shown in Figures 5 and 6, the sensor substrate 20 has a first surface 21, a second surface 22, a first side surface 23, and a second side surface 24. The first surface 21 and the second surface 22 are in a front-back relationship with each other. In the illustrated example, the first surface 21 is oriented in the +Z axis direction. The second surface 22 is oriented in the -Z axis direction. The first side surface 23 and the second side surface 24 connect the first surface 21 and the second surface 22. The second side surface 24 is oriented in a direction perpendicular to the first side surface 23. In the illustrated example, the first side surface 23 is oriented in the -X axis direction. The second side surface 24 is oriented in the +Y axis direction.

[0020] The sensor substrate 20 has a projection 25 connecting the first side surface 23 and the second side surface 24. The projection 25 protrudes from the first side surface 23 in the -X-axis direction. Furthermore, the projection 25 protrudes from the second side surface 24 in the +Y-axis direction. As shown in Figure 5, the projection 25 is provided on one of the diagonal sides of the sensor substrate 20 in direction D1 when viewed from the Z-axis direction. In the illustrated example, direction D1 is inclined at 45° with respect to the X-axis and Y-axis directions. The projection 25 is also in contact with the first surface 12a of the bottom 12 of the base 11. A screw hole 27 is provided in the projection 25. A screw hole 13 is provided in the first surface 12a of the bottom 12 of the base 11, which is in contact with the projection 25.

[0021] The sensor substrate 20 has notches 26 diagonally in direction D2, which intersects direction D1, when viewed from the Z-axis direction. In the illustrated example, direction D2 is perpendicular to direction D1. One notch 26 is provided on each diagonal of direction D2 of the sensor substrate 20. The notches 26 are provided, for example, along direction D1. The notches 26 are provided in the vicinity of the screw holes 17. The side surfaces of the sensor substrate 20 that constitute the notches 26 face the screw holes 17.

[0022] As shown in Figure 6, the sensor board 20 is fixed to the base 11. A screw hole 27 is formed for this purpose. The screw hole 27 communicates with a screw hole 13 formed in the base 11 shown in Figure 4. Multiple screw holes 27 are formed. One of the multiple screw holes 27 is formed in the protruding portion 25. In the example shown in Figure 6, the screw holes 27 are provided diagonally in direction D1 and diagonally in direction D2 of the sensor substrate 20 when viewed from the Z-axis direction.

[0023] The fixing member 30 secures the sensor substrate 20 to the base 11. The fixing member 30 penetrates the sensor substrate 20. The fixing member 30 is inserted into a screw hole 27 formed in the sensor substrate 20 and a screw hole 13 formed in the base 11. The fixing member 30 is, for example, a screw. The fixing member 30 screws the sensor substrate 20 to the base 11.

[0024] Multiple fixing members 30 are provided, corresponding to the multiple screw holes 13, 27. In the example shown in Figure 5, four fixing members 30 are provided as a first fixing member 30a, a second fixing member 30b, a third fixing member 30c, and a fourth fixing member 30d. The first fixing member 30a and the second fixing member 30b are arranged diagonally in the direction D1 of the sensor substrate 20 when viewed from the Z-axis direction. The first fixing member 30a is inserted into a screw hole 27 formed in the protrusion 25. The third fixing member 30c and the fourth fixing member 30d are arranged diagonally in the direction D2 of the sensor substrate 20 when viewed from the Z-axis direction. The number of fixing members 30 is not particularly limited, as long as there are two or more.

[0025] As shown in Figure 7, the connector 40 is provided on the second surface 22 of the sensor substrate 20. The connector 40 is, for example, a plug-type connector. The connector 40 is exposed to the outside of the sensor module 100 through a through-hole 14 formed in the base 11. This facilitates electrical connection between the sensor module 100 and an external device (not shown).

[0026] The first X-axis angular velocity sensor 50x, the second X-axis angular velocity sensor 51x, the first Y-axis angular velocity sensor 52y, the second Y-axis angular velocity sensor 53y, the first Z-axis angular velocity sensor 54z, and the second Z-axis angular velocity sensor 55z are mounted on the sensor board 20, as shown in Figures 5 and 6. The angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z are mounted on the sensor board 20. The angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z are packaged surface mount components. This allows them to have higher mechanical strength compared to mounted components with exposed elements. Furthermore, mounting the angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z onto the sensor board 20 is easy.

[0027] The first X-axis angular velocity sensor 50x, the second X-axis angular velocity sensor 51x, the first Y-axis angular velocity sensor 52y, the second Y-axis angular velocity sensor 53y, the first Z-axis angular velocity sensor 54z, and the second Z-axis angular velocity sensor 55z each have sensor elements made of, for example, quartz crystal oscillators. The angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z are basically the same in configuration, except that the vibration frequencies of the sensor elements are different to suppress interference between them, and they are arranged with their orientations orthogonal to each other so that their detection axes face the X-axis, Y-axis, and Z-axis. Note that the sensor elements may be silicon MEMS (Micro Electro Mechanical Systems) oscillators instead of quartz crystal oscillators. Note that the vibration frequencies of the sensor elements of the angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z may all be different, but some may be the same. For example, the vibration frequency of the sensor element of the first X-axis angular velocity sensor 50x is different from that of the second X-axis angular velocity sensor 51x, the vibration frequency of the sensor element of the first Y-axis angular velocity sensor 52y is different from that of the second Y-axis angular velocity sensor 53y, the vibration frequency of the sensor element of the first Z-axis angular velocity sensor 54z is different from that of the second Z-axis angular velocity sensor It may be different from the 55z sensor. For example, the vibration frequencies of the sensor elements of the angular velocity sensors 50x and 54z may be the same.

[0028] The first X-axis angular velocity sensor 50x and the second X-axis angular velocity sensor 51x are located on the first side surface 23 of the sensor substrate 20. The X-axis angular velocity sensors 50x and 51x are aligned in the Y-axis direction on the first side surface 23. The X-axis angular velocity sensors 50x and 51x are located between the sensor substrate 20 and the side wall 15 of the base 11. The X-axis angular velocity sensors 50x and 51x are spaced apart from the side wall 15. As shown in Figure 7, the X-axis angular velocity sensors 50x and 51x are longer in the Z-axis direction than the sensor substrate 20 and protrude from both the top and bottom sides of the sensor substrate 20. The X-axis angular velocity sensors 50x and 51x detect angular velocity around the X-axis.

[0029] The first Y-axis angular velocity sensor 52y and the second Y-axis angular velocity sensor 53y are located on the second side surface 24 of the sensor substrate 20, as shown in Figures 5 and 6. The Y-axis angular velocity sensors 52y and 53y are aligned in the X-axis direction on the second side surface 24. The Y-axis angular velocity sensors 52y and 53y are located between the sensor substrate 20 and the side wall 15 of the base 11. The Y-axis angular velocity sensors 52y and 53y are spaced apart from the side wall 15. The Y-axis angular velocity sensors 52y and 53y are longer in the Z-axis direction than the sensor substrate 20 and protrude from both the top and bottom sides of the sensor substrate 20. The Y-axis angular velocity sensors 52y and 53y detect angular velocity around the Y-axis.

[0030] The first Z-axis angular velocity sensor 54z is located on the first surface 21 of the sensor substrate 20, as shown in Figure 5. The first Z-axis angular velocity sensor 54z is located between the sensor substrate 20 and the lid 18. The first Z-axis angular velocity sensor 54z is spaced away from the lid 18. The second Z-axis angular velocity sensor 55z is located on the second surface 22 of the sensor substrate 20, as shown in Figure 6. The second Z-axis angular velocity sensor 55z is located between the sensor substrate 20 and the bottom 12 of the base 11. The second Z-axis angular velocity sensor 55z is spaced away from the bottom 12. The Z-axis angular velocity sensors 54z and 55z overlap each other, for example, when viewed from the Z-axis direction. The Z-axis angular velocity sensors 54z and 55z detect angular velocity around the Z-axis.

[0031] As shown in Figure 5, the circuit element 60 is mounted on the sensor substrate 20. The circuit element 60 is located on the first surface 21 of the sensor substrate 20. The circuit element 60 is electrically connected to the angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z via the sensor substrate 20. The circuit element 60 is, for example, an MCU (Micro Controller Unit). The circuit element 60 provides overall control for each part of the sensor module 100. Specifically, the circuit element 60 has a control circuit that controls the driving of the angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z, and an interface circuit that communicates with the outside.

[0032] The control circuit of circuit element 60 independently controls the drive of the angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z, and independently detects the angular velocity around the X, Y, and Z axes based on the detection signals output from the angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z. The control circuit detects the angular velocity around the X axis by averaging the detection signal output from the first X-axis angular velocity sensor 50x and the detection signal output from the second X-axis angular velocity sensor 51x. Furthermore, the control circuit detects the angular velocity around the Y axis by averaging the detection signal output from the first Y-axis angular velocity sensor 52y and the detection signal output from the second Y-axis angular velocity sensor 53y. Furthermore, the control circuit detects the angular velocity around the Z axis by averaging the detection signal output from the first Z-axis angular velocity sensor 54z and the detection signal output from the second Z-axis angular velocity sensor 55z.

[0033] The interface circuit of circuit element 60 transmits and receives signals and commands from external devices. The sensor accepts and outputs the detected angular velocity and acceleration to an external device. While there are no particular limitations on the communication method of the interface circuit, SPI (Serial Peripheral Interface) communication is one example. SPI communication is a suitable method for connecting multiple sensors. Because SPI communication allows all signals related to angular velocity and acceleration to be output from a single pin, the sensor module 100 can be made more pin-efficient.

[0034] The acceleration sensors 70 are mounted on the sensor board 20. For example, multiple acceleration sensors 70 are provided. In the illustrated example, four acceleration sensors 70 are provided. Two of the four acceleration sensors 70 are located on the first surface 21 of the sensor board 20. The other two acceleration sensors 70 are located on the second surface 22 of the sensor board 20.

[0035] The acceleration sensor 70 is a three-axis acceleration sensor capable of independently detecting acceleration in the X-axis direction, the Y-axis direction, and the Z-axis direction. Each of the multiple acceleration sensors 70 has a package and three sensor elements housed in the package. The three sensor elements are, respectively, a sensor element for detecting acceleration in the X-axis direction, a sensor element for detecting acceleration in the Y-axis direction, and a sensor element for detecting acceleration in the Z-axis direction. The three sensor elements are, for example, MEMS vibration elements. The acceleration sensor 70 is electrically connected to the sensor substrate 20 via connection terminals located on the package.

[0036] In addition to the angular velocity sensors 50x, 51x, 52y, 53y, 54z, 55z, circuit element 60, and acceleration sensor 70 mentioned above, the sensor board 20 may also have several other electronic components mounted on it.

[0037] The filling member 80 is housed in the housing 10, as shown in Figures 2 and 7. The filling member 80 fills the opening 11a of the base 11. The filling member 80 is filled between the sensor substrate 20 and the housing 10. The filling member 80 is located between the first surface 21 of the sensor substrate 20 and the lid 18, between the second surface 22 of the sensor substrate 20 and the bottom 12 of the base 11, and between the side surface of the sensor substrate 20 and the side wall 15 of the base 11. In the filling member 80, the thickness of the portion between the first surface 21 and the lid 18, and the thickness of the portion between the second surface 22 and the bottom 12 may be the same as each other.

[0038] The filling member 80 is located between the first X-axis angular velocity sensor 50x and the side wall 15, between the second X-axis angular velocity sensor 51x and the side wall 15, between the first Y-axis angular velocity sensor 52y and the side wall 15, between the second Y-axis angular velocity sensor 53y and the side wall 15, between the first Z-axis angular velocity sensor 54z and the lid 18, and between the second Z-axis angular velocity sensor 55z and the bottom 12.

[0039] The filling material 80 covers the sensor substrate 20. The filling material 80 further covers the angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z. Specifically, the filling material 80 covers the entirety of the first X-axis angular velocity sensor 50x, the entirety of the second X-axis angular velocity sensor 51x, the entirety of the first Y-axis angular velocity sensor 52y, the entirety of the second Y-axis angular velocity sensor 53y, the entirety of the first Z-axis angular velocity sensor 54z, and the entirety of the second Z-axis angular velocity sensor 55z. In other words, the filling material 80 completely covers the angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z without any gaps. The filling material 80 covers all areas of the first X-axis angular velocity sensor 50x except for the area mounted on the sensor substrate 20. Similarly, the filling material 80 covers all areas except for the mounting areas of the angular velocity sensors 51x, 52y, 53y, 54z, and 55z. The filling material 80 further covers the circuit element 60 and the acceleration sensor 70.

[0040] The filling member 80 covers the fixing member 30, as shown in Figures 2 and 8. Specifically In this case, the filling member 80 covers the entire fixing member 30. In other words, the filling member 80 completely covers the fixing member 30 without any gaps. In the example shown in Figure 8, the filling member 80 covers all areas of the fixing member 30 except for the area in contact with the sensor substrate 20 and the area in contact with the base 11.

[0041] The filler member 80 is, for example, a potting material. The filler member 80 is made of, for example, a hard material with low hygroscopicity and a small coefficient of thermal expansion. Specifically, the filler member 80 is made of a thermosetting epoxy adhesive. The hardness of the filler member 80 is, for example, 80D or higher, preferably 90D or higher, on a Type D durometer in the JIS 7215-1986 durometer hardness test. The filler member 80 may also be an epoxy adhesive containing various fillers. This allows the hardness and coefficient of thermal expansion of the filler member 80 to be easily adjusted by the fillers.

[0042] 1.2. Manufacturing method As for the manufacturing method of the sensor module 100, first, a base 11 is prepared as shown in Figure 4. Next, as shown in Figure 3, a sensor substrate 20 on which angular velocity sensors 50x, 51x, 52y, 53y, 54z, 55z, etc. are mounted is fixed to the base 11 by fixing members 30. Next, as shown in Figure 2, a filling member 80 is filled into the opening 11a of the base 11 so that the sensor substrate 20 and the fixing members 30 are embedded. Next, the filling member 80 is hardened by heat treatment. Since the sensor substrate 20 is fixed to the base 11 by multiple fixing members 30, the distortion generated in the sensor substrate 20 due to the stress when the filling member 80 hardens can be reduced. Next, as shown in Figure 1, a lid 18 is fixed to the base 11 by screws 19.

[0043] Through the above process, the sensor module 100 can be manufactured.

[0044] 1.3. Effects The sensor module 100 comprises a base 11 and a lid 18 that constitute the housing 10, a sensor substrate 20 placed inside the housing 10 and equipped with a first Z-axis angular velocity sensor 54z as a first sensor, two or more fixing members 30 that fix the sensor substrate 20 to the base 11, and a filling member 80 that covers the sensor substrate 20 and the two or more fixing members 30 and fills the space between the sensor substrate 20 and the housing 10. Therefore, the sensor module 100 can reduce the possibility of the sensor substrate 20 being distorted in response to the external environment compared to a case where the fixing members are not covered by the filling member. Furthermore, it can reduce the possibility of the fixing members 30 becoming loose due to impact or the like.

[0045] In the sensor module 100, the base 11 has an opening 11a in the direction of the first direction, the +Z axis, where the sensor substrate 20 is located, and the lid 18 closes the opening 11a and faces the sensor substrate 20 via a filling member 80. Therefore, the sensor module 100 allows for a simplification of the housing 10 structure, and for example, the area of ​​the sensor substrate 20 can be increased. This makes it possible to increase the number of sensors mounted on the sensor substrate 20.

[0046] In the sensor module 100, when viewed from the +Z axis direction, two or more fixing members 30 are arranged diagonally in direction D1, which is the second direction of the sensor substrate 20. Therefore, in the sensor module 100, the sensor substrate 20 can be firmly fixed to the base 11 by the fixing members 30.

[0047] In the sensor module 100, the sensor substrate 20 has a notch 26 diagonally opposite to direction D2, which is a third direction intersecting direction D1. Therefore, the sensor module 100 Therefore, a screw hole 17 for attaching the sensor module 100 to the object to be mounted can be provided near the notch 26.

[0048] In the sensor module 100, the sensor substrate 20 has a first side surface 23 facing the -X axis direction as the fourth direction, a second side surface 24 facing the +Y axis direction as the fifth direction, and a protrusion 25 connecting the first side surface 23 and the second side surface 24, which protrudes more in the -X axis direction than the first side surface 23 and more in the +Y direction than the second side surface 24. A first X-axis angular velocity sensor 50x, which is the second sensor, is placed on the first side surface 23, and a first Y-axis angular velocity sensor 52y, which is the third sensor, is placed on the second side surface 24. Therefore, in the sensor module 100, the protrusion 25 allows space to be secured between the first side surface 23 and the base 11, and between the second side surface 24 and the base 11. The first X-axis angular velocity sensor 50x can be placed in the space between the first side surface 23 and the base 11, and the first Y-axis angular velocity sensor 52y can be placed in the space between the second side surface 24 and the base 11.

[0049] In the sensor module 100, the entirety of the first X-axis angular velocity sensor 50x, the entirety of the first Y-axis angular velocity sensor 52y, and the entirety of the first Z-axis angular velocity sensor 54z are covered with the filling material 80. Therefore, in the sensor module 100, stress caused by the filling material 80 in the angular velocity sensors 50x, 52y, and 54z can be equalized. This makes it possible to equalize the characteristics of the angular velocity sensors 50x, 52y, and 54z. For example, if one angular velocity sensor is completely covered with the filling material, while another angular velocity sensor is only half covered with the filling material, the stress caused by the filling material in the two angle sensors will differ, resulting in a difference in characteristics.

[0050] In the sensor module 100, the sensor substrate 20 has a first surface 21 and a second surface 22 that are in a front-back relationship with each other. A first Z-axis angular velocity sensor 54z is placed on the first surface 21, and a second Z-axis angular velocity sensor 55z, which acts as a fourth sensor, is placed on the second surface 22. Therefore, the sensor module 100 can improve detection accuracy compared to a case where only one Z-axis angular velocity sensor is provided.

[0051] In the sensor module 100, a second X-axis angular velocity sensor 51x, which functions as a fifth sensor, is positioned on the first side surface 23, and a second Y-axis angular velocity sensor 53y, which functions as a sixth sensor, is positioned on the second side surface 24. Therefore, the sensor module 100 can improve detection accuracy compared to a case where only one X-axis angular velocity sensor and one Y-axis angular velocity sensor are provided. For example, if two X-axis angular velocity sensors, two Y-axis angular velocity sensors, and two Z-axis angular velocity sensors are provided, the noise characteristics can be improved by 1 / (√2) times compared to a case where only one X-axis angular velocity sensor, two Y-axis angular velocity sensor, and one Z-axis angular velocity sensor are provided.

[0052] 2. Variations of the sensor module Next, a modified sensor module according to this embodiment will be described with reference to the drawings. Figure 9 is a schematic perspective view showing a modified sensor module 200 according to this embodiment. For convenience, the housing 10, fixing member 30, and filling member 80 are omitted from the illustration in Figure 9.

[0053] In the following description of the sensor module 200 according to a modified example of this embodiment, components having the same function as the components of the sensor module 100 according to this embodiment described above are denoted by the same reference numerals, and their detailed descriptions are omitted.

[0054] In the sensor module 100 described above, as shown in Figure 5, the second Y-axis angular velocity sensor 53y was located on the second side surface 24 of the sensor substrate 20.

[0055] In contrast, in the sensor module 200, as shown in Figure 9, the second Y-axis angular velocity sensor 53y is located on the third side surface 28 of the sensor substrate 20. The third side surface 28 of the sensor substrate 20 faces in the opposite direction to the second side surface 24. In the illustrated example, the third side surface 28 faces in the -Y axis direction.

[0056] The sensor substrate 20 has a protrusion 29 between the first X-axis angular velocity sensor 50x and the second X-axis angular velocity sensor 51x. The protrusion 29 protrudes in the -X-axis direction more than the X-axis angular velocity sensors 50x and 51x. The protrusion 29 is in contact with the side wall 15 of the base 11. The protrusion 29 secures a space between the first side surface 23 and the side wall 15, and the X-axis angular velocity sensors 50x and 51x can be placed in this space.

[0057] The sensor module 200 has a first side surface 23 facing the -X axis direction as the fourth direction, a second side surface 24 facing the +Y axis direction as the fifth direction, and a third side surface 28 facing the -Y axis direction as the sixth direction. The first X-axis angular velocity sensor 50x as the second sensor and the second X-axis angular velocity sensor 51x as the third sensor are arranged on the first side surface 23, the first Y-axis angular velocity sensor 52y as the fourth sensor is arranged on the second side surface 24, and the second Y-axis angular velocity sensor 53y as the fifth sensor is arranged on the third side surface 28. Therefore, the sensor module 200 can improve detection accuracy compared to a case where only one X-axis angular velocity sensor and one Y-axis angular velocity sensor are provided.

[0058] The embodiments and variations described above are examples only and are not limiting. For example, each embodiment and each variation can be combined as appropriate.

[0059] The present invention includes configurations substantially identical to those described in the embodiments, for example, configurations with the same function, method, and results, or configurations with the same purpose and effect. Furthermore, the present invention includes configurations in which non-essential parts of the configurations described in the embodiments are replaced. Furthermore, the present invention includes configurations that produce the same effects or achieve the same purpose as those described in the embodiments. Finally, the present invention includes configurations that add known technology to the configurations described in the embodiments.

[0060] The following can be derived from the embodiments and modifications described above.

[0061] One embodiment of a sensor module is: The enclosure consists of a base and a lid, A sensor board, which is placed inside the aforementioned housing and on which the first sensor is mounted, Two or more fixing members for fixing the sensor substrate to the base, A filling member that covers the sensor substrate and the two or more fixing members, and is filled between the sensor substrate and the housing, It is equipped with.

[0062] This sensor module reduces the possibility of the sensor board becoming distorted.

[0063] In one embodiment of a sensor module, The base has an opening that opens in a first direction in which the sensor substrate is located. The lid may close the opening and face the sensor substrate via the filling member.

[0064] This sensor module allows for a simplification of the enclosure's structure.

[0065] In one embodiment of a sensor module, Viewed from the first direction, the two or more fixing members may be arranged diagonally in the second direction of the sensor substrate.

[0066] This sensor module allows the sensor board to be firmly fixed to the base using a fixing member.

[0067] In one embodiment of a sensor module, The sensor substrate may have notches at the diagonals in a third direction intersecting the second direction.

[0068] This sensor module allows for the provision of screw holes near the notch for attaching the sensor module to the object to be mounted.

[0069] In one embodiment of a sensor module, The aforementioned sensor substrate is A first side surface facing a fourth direction perpendicular to the first direction, A second side facing a fifth direction perpendicular to the first and fourth directions, A protruding portion that connects the first side surface and the second side surface, protruding from the first side surface in the fourth direction and from the second side surface in the fifth direction, It has, A second sensor is positioned on the first side surface. A third sensor may be located on the second side surface.

[0070] According to this sensor module, the protrusions allow for space to be secured between the first side and the base, and between the second side and the base.

[0071] In one embodiment of a sensor module, The entirety of the first sensor, the entirety of the second sensor, and the entirety of the third sensor may be covered with the filling material.

[0072] This sensor module makes it possible to equalize the stress caused by the filling material in the first sensor, second sensor, and third sensor.

[0073] In one embodiment of a sensor module, The sensor substrate has a first surface and a second surface that are in a front-back relationship with respect to each other. The first sensor is placed on the first surface, A fourth sensor may be located on the second surface.

[0074] This sensor module can improve detection accuracy.

[0075] In one embodiment of a sensor module, A fifth sensor is positioned on the first side, A sixth sensor may be located on the second side surface.

[0076] This sensor module can improve detection accuracy.

[0077] In one embodiment of a sensor module, The aforementioned sensor substrate is A first side surface facing a fourth direction perpendicular to the first direction, A second side facing a fifth direction perpendicular to the first and fourth directions, A third side facing the sixth direction, which is opposite to the fifth direction, It has, The second sensor and the third sensor are arranged on the first side surface. A fourth sensor is positioned on the second side, A fifth sensor may be located on the third side.

[0078] This sensor module can improve detection accuracy. [Explanation of Symbols]

[0079] 10…Housing, 11…Base, 11a…Opening, 12…Bottom, 12a…First surface, 12b…Second surface, 13…Screw hole, 14…Through-hole, 15…Side wall, 16,17…Screw hole, 18…Lid, 19…Screw, 20…Sensor substrate, 21…First surface, 22…Second surface, 23…First side, 24…Second side, 25…Protrusion, 26…Notch, 27…Screw hole, 28…Third side, 29…Protrusion, 30…Fixing member, 30a…First fixing member 30b…Second fixing member, 30c…Third fixing member, 30d…Fourth fixing member, 40…Connector, 50x…First X-axis angular velocity sensor, 51x…Second X-axis angular velocity sensor, 52y…First Y-axis angular velocity sensor, 53y…Second Y-axis angular velocity sensor, 54z…First Z-axis angular velocity sensor, 55z…Second Z-axis angular velocity sensor, 60…Circuit element, 70…Accelerometer, 80…Filling member, 100, 200…Sensor module

Claims

1. The enclosure consists of a base and a lid, A sensor board, which is placed inside the aforementioned housing and on which the first sensor is mounted, Two or more fixing members for fixing the sensor substrate to the base, A filling member that covers the sensor substrate and the two or more fixing members, and is filled between the sensor substrate and the housing, A sensor module equipped with the following features.

2. In claim 1, The base has an opening that opens in a first direction in which the sensor substrate is located. The lid closes the opening and faces the sensor substrate via the filling member, forming a sensor module.

3. In claim 2, A sensor module in which, when viewed from the first direction, the two or more fixing members are arranged diagonally in the second direction of the sensor substrate.

4. In claim 3, The sensor module has notches on the diagonal of a third direction intersecting the second direction.

5. In claim 2, The aforementioned sensor substrate is A first side surface facing a fourth direction perpendicular to the first direction, A second side surface facing a fifth direction perpendicular to the first and fourth directions, A protruding portion that connects the first side surface and the second side surface, protruding from the first side surface in the fourth direction and from the second side surface in the fifth direction, It has, A second sensor is positioned on the first side surface. A sensor module in which a third sensor is located on the second side.

6. In claim 5, A sensor module in which the entirety of the first sensor, the entirety of the second sensor, and the entirety of the third sensor are covered with the filling material.

7. In claim 5, The sensor substrate has a first surface and a second surface that are in a front-back relationship with respect to each other. The first sensor is placed on the first surface, A sensor module in which a fourth sensor is arranged on the second surface.

8. In claim 7, A fifth sensor is positioned on the first side surface. A sensor module in which a sixth sensor is located on the second side.

9. In claim 2, The aforementioned sensor substrate is A first side surface facing a fourth direction perpendicular to the first direction, A second side surface facing a fifth direction perpendicular to the first and fourth directions, A third side facing the sixth direction, which is opposite to the fifth direction, It has, The second sensor and the third sensor are arranged on the first side surface. A fourth sensor is positioned on the second side, A sensor module in which a fifth sensor is located on the third side.

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