Polyamide resin composition

A polyamide resin composition with a high-melting-point resin, halogen-based flame retardant, and polyhydric alcohol addresses the lack of fluidity, flame retardancy, and tracking resistance in existing compositions, enhancing performance in high-voltage connectors and solder reflow processes.

JP2026121185APending Publication Date: 2026-07-23MITSUI CHEMICALS INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
MITSUI CHEMICALS INC
Filing Date
2025-01-10
Publication Date
2026-07-23

AI Technical Summary

Technical Problem

Existing polyamide resin compositions lack a combination of fluidity, flame retardancy, reflow heat resistance, and tracking resistance, particularly at high temperatures and voltages, which are required for components like high-voltage connectors and solder reflow processes.

Method used

A polyamide resin composition comprising a polyamide resin with a melting point of 280°C or higher, a halogen-based flame retardant, and a polyhydric alcohol, with specific content ratios and combinations to enhance fluidity, tracking resistance, and maintain flame retardancy and reflow heat resistance.

Benefits of technology

The composition achieves improved fluidity, tracking resistance, and maintains flame retardancy and reflow heat resistance, suitable for high-voltage connectors and solder reflow processes.

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Abstract

This disclosure aims to provide halogen-containing polyamide resin compositions that have improved fluidity and tracking resistance while maintaining flame retardancy and reflow heat resistance, as well as molded articles and high-voltage connectors containing the same. [Solution] A polyamide resin composition comprising a polyamide resin (A) having a melting point of 280°C or higher as measured by a differential scanning calorimeter (DSC), a halogenated flame retardant (B), and a polyhydric alcohol (C), wherein the content of the polyhydric alcohol (C) is 0.1 parts by mass or more and 4.3 parts by mass or less per 100 parts by mass of the polyamide resin (A), and the polyamide resin composition is for molding high-voltage connectors.
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