Film deposition apparatus, film deposition method, and method for manufacturing electronic devices

Abstract

In a film deposition apparatus that deposits a film deposition material onto a substrate via a mask, the adhesion between the substrate and the mask is improved. [Solution] A film deposition apparatus capable of depositing a film deposition material onto a substrate of a predetermined thickness or greater, comprising: a substrate holding means for holding the substrate; a mask disposed opposite to the holding surface of the substrate holding means for holding the substrate; and a magnetic force applying means disposed opposite to the surface of the substrate holding means opposite to the holding surface, wherein the mask comprises a frame and a mask foil fixed to the frame, which is a mask foil made of a magnetic material having an opening corresponding to a film deposition pattern to be deposited on the substrate, the substrate holding means has a protruding portion that protrudes from the holding surface toward the mask outside the holding region for holding the substrate, the fixing portion to which the mask foil is fixed to the frame is located outside the end of the protruding portion that is closer to the holding region in a direction parallel to the holding surface, and the height of the protruding portion is less than or equal to the predetermined thickness.

Description

Technical Field

[0004] ,

[0001] The present invention relates to a film forming apparatus for depositing a film forming material on a substrate through a mask, a film forming method, and a method for manufacturing an electronic device.

Background Art

[0002] In a film forming apparatus, a film forming material released from an evaporation source is deposited on a substrate through a mask having openings formed in a predetermined pattern. Thereby, for example, an organic layer or a metal layer of an organic EL light emitting element can be formed on the substrate. In order to perform film formation with high accuracy, it is necessary to bring the substrate and the mask close to each other and adhere them in a state with high flatness. Patent Document 1 describes that the flatness of the mask is improved by welding and fixing the mask to the frame while applying tension to the mask. Patent Document 2 describes that the mask is made of a magnetic material and the adhesion between the mask and the substrate is improved by attracting the mask in the direction of the substrate with magnetic force.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

[0005] This invention has been made in view of these problems, and aims to improve the adhesion between a substrate and a mask in a film deposition apparatus for depositing a film deposition material onto a substrate via a mask. [Means for solving the problem]

[0006] The present invention relates to a film deposition apparatus capable of depositing a film deposition material onto a substrate of a predetermined thickness or greater, A substrate holding means for holding the substrate, A mask positioned opposite the holding surface of the substrate holding means that holds the substrate, A magnetic force applying means is arranged opposite to the surface of the substrate holding means that is opposite to the holding surface, Equipped with, The aforementioned mask is Frame and, A mask foil fixed to the frame, comprising a magnetic mask foil having an opening corresponding to a film deposition pattern to be formed on the substrate, It has, The substrate holding means has a projection that protrudes from the holding surface toward the mask outside the holding area for holding the substrate, The fixing portion to which the mask foil is fixed to the frame is in a direction parallel to the holding surface. , located outside the end of the protruding portion that is closer to the holding area, The film deposition apparatus is characterized in that the height of the protruding portion is less than or equal to the predetermined thickness. [Effects of the Invention]

[0007] According to the present invention, in a film deposition apparatus for depositing a film deposition material onto a substrate via a mask, the adhesion between the substrate and the mask can be improved. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic diagram of the film deposition apparatus for Example 1. [Figure 2] This is an enlarged view of the magnetic levitation stage of Example 1. [Figure 3] This is a top view of the magnetic levitation stage of Example 1. [Figure 4] This figure shows the mask and mask frame of Example 1. [Figure 5] This figure shows the state in which the magnetic force of the magnet in Example 1 is not acting on the mask. [Figure 6] This figure shows the state in which the magnetic force of the magnet in Example 1 is acting on the mask. [Figure 7] This figure shows the state in which the magnetic force of the magnet is not acting on the mask in the configuration having a gap block as in Example 1. [Figure 8] This figure shows the state in which the magnetic force of the magnet is acting on the mask in the configuration having a gap block as in Example 1. [Figure 9] This is a diagram showing electronic devices. [Modes for carrying out the invention]

[0009] The embodiments for carrying out this invention will be described in detail below with reference to the drawings, based on examples. However, unless otherwise specified, the dimensions, materials, shapes, relative arrangements, etc., of the components described in these embodiments are not intended to limit the scope of this invention to those specific examples.

[0010] (Example 1) Referring to FIGS. 1 to 6, a film forming apparatus, a film forming method, and a method for manufacturing an electronic device according to Example 1 will be described. In each figure, the Z-axis is an axis parallel to the vertical direction, and the XY-axes are axes parallel to the horizontal direction and perpendicular to each other. FIG. 1 is a schematic configuration diagram of the film forming apparatus 1, schematically showing the configuration of the film forming apparatus 1 as viewed from the front. FIG. 2 is an enlarged view of the stage 2 in FIG. 1. FIG. 3 is a view of the stage 2 as viewed from above. In FIG. 3, in order to show the positional relationship between the mover and stator of the stage 2 and the stator and magnet 18 provided on the support 6, the stator and magnet 18 provided on the support 6 are also shown. FIG. 4 is a view showing the mask 16. FIG. 4(a) is a side view of the mask 16, FIG. 4(b) is a top view of the mask 16, and FIG. 4(c) is a bottom view of the mask 16. FIG. 5 is a view showing a state where the magnetic force of the magnet 18 does not act on the mask 16. FIG. 6 is a view showing a state where the magnetic force of the magnet 18 acts on the mask 16.

[0011] (Film Forming Apparatus) In FIG. 1, a stage 2 configured to float by magnetic force is provided in the portion surrounded by the dotted line. The stage 2 is fixed to a corner of the upper surface or an upper portion of the side surface inside the vacuum chamber 4 by the support 6. The vacuum chamber 4 has a side surface 3, a bottom surface 32, and a top plate 11, and has a hexahedral shape as a whole. A thin film is formed on the substrate 27 through the mask 16 by the film forming material emitted from the evaporation source 5 installed on the bottom surface 32 of the vacuum chamber 4.

[0012] An electrostatic chuck 25, which is a substrate holding means, is fixed to the lower surface of the stage 2. The electrostatic chuck 25 has a holding surface 42 that adsorbs and holds the substrate 27 by electrostatic force. The substrate 27 is adsorbed and held in the holding region S on the holding surface 42 of the electrostatic chuck 25. The substrate 27 is held by the electrostatic chuck 25 in a face-down state with the lower surface 39, which is the film forming target surface, facing downward.

[0013] The mask 16 is disposed below the electrostatic chuck 25 facing the holding surface 42 of the electrostatic chuck 25. The mask 16 has a highly rigid frame 15 provided on the outer periphery and a low-rigidity mask foil 26 fixed to the frame 15 and provided inside the frame 15. The mask foil 26 is made of a magnetic material and is attracted upward toward the magnet 18 by the action of the magnetic force of the magnet 18. The mask foil 26 is a metal foil resistant to thermal expansion, such as invar. As a method for fixing the mask foil 26 to the frame 15, various known techniques can be adopted, such as a method of fixing by spot welding in a state where the mask foil 26 is stretched over the frame 15, a mechanical clamp, or fixing by adhesion. When fixing, it is desirable to prevent the mask foil 26 from being distorted. In the first embodiment, as shown in FIGS. 5 and 6, the stretched mask foil 26 is fixed to the frame 15 by the fixing portion 17.

[0014] The mask foil 26 is provided with a plurality of through holes (openings) corresponding to the film-forming pattern (pixel pattern) formed on the substrate 27, and is configured to cover positions on the substrate 27 where no thin film is formed. Thereby, the film-forming material passing through the through holes of the mask foil 26 is deposited on the surface of the substrate 27, and film formation on the substrate 27 through the mask 16 is performed, and a thin film of the film-forming pattern (pattern corresponding to the position where the opening is provided) is formed on the substrate 27. The mask 16 is carried into the vacuum chamber 4 and placed on the mask stage 33 by the frame 15 being carried by the robot hand.

[0015] The magnet 18 is a magnetic force applying means disposed facing the upper surface 44, which is the surface opposite to the holding surface 42 of the electrostatic chuck 25. The magnet 18 is relatively movable up and down with respect to the stage 2 by the lifting mechanism 18X. The magnet 18 can approach within a non-contact range with respect to the upper surface 44 of the electrostatic chuck 25. The magnet 18 is configured to generate a magnetic flux necessary for attracting the mask foil 26. For the lifting mechanism 18X, various known techniques such as a ball screw mechanism or a rack and pinion mechanism can be adopted.

[0016] The electrostatic chuck 25 and substrate 27 are made of non-magnetic material. The mask foil 26 is made of magnetic material. The magnetic flux of the magnet 18 can generate a magnetic force that attracts the mask foil 26 vertically upward. This magnetic force allows the mask foil 26 to adhere tightly to the substrate 27. This adhesion makes it possible to suppress the leakage (shadowing) of the film deposition material during film formation.

[0017] The configuration of the vibration isolation table support section on the atmospheric side will now be explained. Vibration isolation tables 9a and 9b are installed on the top plate 11 of the vacuum chamber 4 via vibration isolation table bases 10a and 10b. The support frame 8 is supported by vibration isolation tables 9a and 9b, thereby suppressing vibrations transmitted from the vacuum chamber 4. In addition, the mask stand 33 is supported within the vacuum chamber 4 by mask support columns 13a and 13b, which move up and down by mask guide mechanisms 12a and 12b provided on the support frame 8.

[0018] When the robot hand moves in and out of the vacuum chamber 4 to load the frame 15 and substrate 27 into the vacuum chamber 4, the mask guide mechanisms 12a and 12b lower the mask stand 33 to a position that does not obstruct the movement of the robot hand. When the mask guide mechanisms 12a and 12b move up and down, the bellows 14a and 14b extend and retract. These bellows 14a and 14b maintain the vacuum state inside the vacuum chamber 4.

[0019] Furthermore, in addition to the mechanism for raising and lowering the mask stand 33 in the vertical direction, it may also have a rotational translation mechanism. This would improve the positioning accuracy of the robot hand and the placement of the mask 16, etc. Even in cases of large temporal positional discrepancies, the mask 16 can be placed within the field of view of the alignment camera. Since this mechanism is publicly known, its explanation will be omitted.

[0020] (Magnetic levitation stage) Stage 2 will now be described. Stage 2 comprises a stage frame 31 and movable elements 22a, 22b, 22c, and 22d (hereinafter also simply referred to as movable elements 22) and linear motor movable elements 20a, 20b, 20c, and 20d (hereinafter also simply referred to as linear motor movable elements 20), which are self-weight compensating magnets fixed to the stage frame 31. The movable elements 22 support Stage 2 in a non-contact manner with respect to the support 6 in order to cancel out the self-weight of Stage 2. The linear motor movable elements 20 exert thrust to move Stage 2 in a non-contact manner with respect to the support 6.

[0021] On the lower surface of the support 6, stators 23a, 23b, 23c, and 23d (hereinafter also simply referred to as stators 23) are fixed, which are magnets that cancel out the weight of the stage 2, so as to face the movable elements 22a, 22b, 22c, and 22d of the stage 2, respectively. The setup is such that a magnetic force equivalent to the weight of the stage 2 is generated between the movable element 22 of the stage 2 and the stators 23 of the support 6. As a result, the stage 2 is supported by the support 6 in a non-contact state.

[0022] On the lower surface of the support 6, linear motor stators 21a, 21b, 21c, and 21d (hereinafter also simply referred to as linear motor stators 21) are fixed so as to face the linear motor movable elements 20a, 20b, 20c, and 20d of the stage 2, respectively. The thrust that moves the stage 2 is generated by the change in the current value flowing through the coils built into the linear motor stators 21.

[0023] Furthermore, in the vertical direction, the weight of Stage 2 is canceled out by the movable element 22 of Stage 2 and the stator 23 of the support 6, so the thrust generated by the linear motor movable element 20 and the linear motor stator 21 is minimal. Consequently, the amount of current supplied to the linear motor stator 21 is small, resulting in minimal heat generation, which suppresses deformation and damage to the components due to heat. If necessary, the coils of the linear motor stator 21 may be covered with a water-cooling jacket and actively cooled by circulating a coolant.

[0024] The linear motor movable elements 20 are positioned at four corners on the upper surface of the stage frame 31. This enables translational drive of the stage 2 in the XY direction and rotational drive around the Z axis. Furthermore, by positioning at least three linear motors (not shown) that generate thrust in the Z axis direction, it is possible to move the stage 2 with six degrees of freedom. In Embodiment 1, the stage 2 is configured to move with six degrees of freedom using a total of seven linear motors. In addition, the movable elements 22 are positioned symmetrically at four locations around the center of gravity of the stage 2. This allows a moment force to be applied, enabling stable levitation of the stage 2.

[0025] (Alignment mechanism) The alignment mechanism (positioning mechanism) between the substrate 27 and the mask 16 will now be described. The alignment cameras 7a and 7b are supported by the support frame 8. This suppresses vibrations transmitted from the vacuum chamber 4 to the alignment cameras 7a and 7b, enabling high-precision measurements. A viewport for alignment measurement is installed on the top plate 11 of the vacuum chamber 4, allowing alignment measurements to be taken from the atmospheric side. Furthermore, by utilizing the transmitted light from the lights 24a and 24b installed on the underside of the mask stand 33, the alignment marks 102a and 102b on the mask 16 are captured by the alignment cameras 7a and 7b. Alignment cameras and lighting (not shown) are also provided for alignment marks 102c and 102d. Specifically, four alignment cameras and four lighting units are installed, configured to detect the positions of the alignment marks formed on the substrate 27 and the mask 16.

[0026] The relative position of Stage 2 with respect to the mask base 33 is measured by laser displacement sensors 19. These laser displacement sensors 19 are located at six locations in total: two in the X direction, one in the Y direction, and three in the Z direction. Based on the information from the six laser displacement sensors 19, a geometric coordinate transformation is performed to convert the Stage 2's position into six degrees of freedom around its center of gravity. Based on the six degrees of freedom position information, control calculations are performed to determine six-degree-of-freedom thrust commands. Based on these six-degree-of-freedom thrust commands, current is supplied to the coils of the seven linear motors located at each location, moving Stage 2 and enabling high-precision positioning of Stage 2 relative to the mask base 33.

[0027] Furthermore, the laser displacement meter 19 is fixed near the mask 16 on the mask stand 33. This allows for direct positioning of the mask 16 and the substrate 27 in a vacuum environment without being affected by Abbe errors or other factors. In addition, the laser displacement meter 19 is protected from vibrations from the vacuum chamber 4 by vibration isolation tables 9a and 9b on which the support frame 8 is mounted via the mask stand 33, enabling stable measurement. The stage 2 is also supported by a non-contact, low-magnetic spring-type self-weight compensating magnet, and is similarly protected from vibrations from the vacuum chamber 4. With this configuration, the relative position of the stage 2 and the mask stand 33 can be positioned with high precision, resulting in high-precision alignment of the substrate 27 and the mask 16.

[0028] The film deposition apparatus 1 has a control unit 35. The control unit 35 has functions for controlling various mechanisms and the evaporation source 5, and controlling film deposition. The control unit 35 can be configured by a computer having, for example, a processor, memory, storage, I / O, etc. In this case, the functions of the control unit 35 are realized by the processor executing a program stored in memory or storage. A general-purpose personal computer may be used as the computer, or an embedded computer or PLC (Programmable Logic Controller) may be used. Furthermore, some or all of the functions of the control unit 35 may be configured by circuits such as ASICs or FPGAs. In addition, a control unit 35 may be provided for each film deposition apparatus 1, or one control unit 35 may control multiple film deposition apparatuses 1.

[0029] Hereinafter, a characteristic configuration of the film forming apparatus 1 in Example 1 will be described with reference to FIGS. 5 and 6. The film forming apparatus 1 can form a film material on a substrate 27 having a thickness equal to or greater than a predetermined thickness. When the magnetic force of the magnet 18 does not act on the mask 16, as shown in FIG. 5, the mask foil 26 is bent downward at the center due to its own weight. The substrate 27 is adsorbed by the electrostatic chuck 25. The electrostatic chuck 25 is provided with a dummy workpiece 36 which is provided outside the holding region S of the holding surface 42 for holding the substrate 27 in the horizontal direction and protrudes downward from the holding surface 42 toward the mask 16. The tip of the dummy workpiece 36 facing the mask 16 has a lower surface 38 parallel to the holding surface 42. The height T1 at which the dummy workpiece 36 protrudes downward from the holding surface 42 is equal to or less than a predetermined thickness. FIG. 5 shows an example in which the protruding height T1 of the dummy workpiece 36 is the same as the thickness T2 of the substrate 27. Here, it is assumed that the film forming apparatus 1 can form a film material on a substrate having a thickness equal to or greater than a predetermined thickness T0, and the thickness T2 of the substrate 27 is T2≧T0. As shown in FIG. 5, when T1=T2≦T0, the vertical position of the lower surface 38 of the dummy workpiece 36 is the same as the vertical position of the lower surface 39 of the substrate 27. When T1<T2≦T0, the vertical position of the lower surface 38 of the dummy workpiece 36 will be above the vertical position of the lower surface 39 of the substrate 27. Further, the fixing portion 17 to which the mask foil 26 is fixed to the frame 15 is located outside the end portion 41 closer to the holding region S of the dummy workpiece 36 in the direction parallel to the holding surface 42 (horizontal direction). The end portion 41 closer to the holding region S of the dummy workpiece 36 is located outside the holding region S (and thus the outer peripheral end portion 40 of the substrate 27) in the horizontal direction, and the distance therebetween is D.

[0030] Figure 6 is a schematic cross-sectional view showing the mask 16 and substrate 27 when the magnetic force from the magnet 18 is acting on the mask foil 26. The mask foil 26, attracted upward by the magnetic force, comes into close contact with the lower surface 39 of the substrate 27 and the lower surface 38 of the dummy workpiece 36. Because the lower surface 38 of the dummy workpiece 36 is positioned horizontally outside the substrate 27, the shape of the mask foil 26 near the outer edge 40 of the substrate 27 becomes a highly flat shape that extends horizontally, following the lower surface 38 of the dummy workpiece 36. As a result, the lower surface 39 of the substrate 27 and the mask foil 26 come into contact with each other in a highly flat and parallel manner. Therefore, even near the outer edge 40 of the substrate 27, it is possible to bring the substrate 27 and the mask foil 26 into close contact without creating a gap between them.

[0031] Here, the fixing portion 17 that secures the mask foil 26 to the frame 15 is positioned horizontally outward from the inner peripheral edge 41 of the lower surface 38 of the dummy workpiece 36. This positional relationship allows the mask foil 26 to come into contact with the lower surface 38 of the dummy workpiece 36 when the mask foil 26 is attracted upward, resulting in the shape of the mask foil 26 near the outer peripheral edge 40 of the substrate 27 becoming a highly flat shape that conforms to the lower surface 39 of the substrate 27.

[0032] The dummy workpiece 36 may be a separate component fixed to the electrostatic chuck 25, or it may be an integral part of the electrostatic chuck 25 (part of the electrostatic chuck 25). If the dummy workpiece 36 is a separate component from the electrostatic chuck 25, it is desirable that it be adjusted with high precision so that it is at the same height as the lower surface 39 of the substrate 27. If the dummy workpiece 36 is an integral part of the electrostatic chuck 25, it is desirable that it be machined with high precision relative to the holding surface 42 of the electrostatic chuck 25. In particular, it is desirable that a protrusion corresponding to the dummy workpiece 36 be machined into the ceramic electrostatic chuck 25.

[0033] It is desirable that the horizontal distance D between the dummy work 36 and the holding area S (the end portion 40 on the outer peripheral side of the substrate 27) be as small as possible. However, considering variations in position when supplying the substrate 27 to the electrostatic chuck 25, etc., a distance D that does not hinder the adsorption of the substrate 27 is configured to be provided as a clearance between the dummy work 36 and the substrate 27. For example, the horizontal distance D between the end portion 41 on the side close to the holding area S of the dummy work 36 and the holding area S (the end portion 40 on the outer peripheral side of the substrate 27) is set to 1 mm or less.

[0034] Note that it is preferable that the horizontal clearance between the dummy work 36 and the end portion 40 on the outer peripheral side of the substrate 27 be configured to be adjustable. Since the mask foil 26 is stretched over the frame 15 and the inclination of the vertical deformation is very gentle, even if there is a clearance between the dummy work 36 and the substrate 27, the function of this embodiment in which the mask foil 26 conforms to the dummy work 36 and adheres closely to the lower surface of the substrate 27 in a highly flat state is not inhibited.

[0035] It is desirable that the vertical position of the lower surface 38 of the dummy work 36 be the same as the vertical position of the lower surface 39 of the substrate 27, but it may be slightly above the vertical position of the lower surface 39 of the substrate 27. In other words, the protruding height T1 of the dummy work 36 may be smaller than the predetermined thickness T0 which is the maximum value of the thickness T2 of the substrate 27 that can be film-formed by the film-forming apparatus 1 (T1 < T0). On the other hand, when the vertical position of the lower surface 38 of the dummy work 36 is below the vertical position of the lower surface 39 of the substrate 27 (when the dummy work 36 protrudes below the substrate 27, when T1 > T0), a gap equivalent to the downward protruding amount of the lower surface 38 of the dummy work 36 with respect to the lower surface 39 of the substrate 27 occurs between the substrate 27 and the mask foil 26 and this will happen.

[0036] The vertical position (protruding height T1) of the lower surface 38 of the dummy workpiece 36 varies depending on the mechanical properties of the mask foil 26, the tensioning conditions, and the allowable gap between the substrate 27 and the mask foil 26. For example, if the allowable gap is approximately 0.8 μm at most, it is desirable that the lower surface 38 of the dummy workpiece 36 be positioned vertically upward within a range of 0 to 7 μm relative to the lower surface 39 of the substrate 27. That is, the difference (T0-T1) between the protruding height T1 of the dummy workpiece 36 and the predetermined thickness T0 is 7 μm or less.

[0037] The dummy workpiece 36 may be continuously provided around the entire circumference of the holding area S of the substrate 27, along the outer periphery of the holding area S, or it may be provided discretely. When the dummy workpiece 36 is discretely arranged along the outer periphery of the substrate 27, it may be limited to the vicinity of areas where particularly good adhesion between the outer periphery of the substrate 27 and the mask foil 26 is required. This reduces the man-hours required for adjusting the height of the dummy workpiece 36 and for processing.

[0038] Figures 7 and 8 are cross-sectional views showing the substrate 27 and mask 16 when a gap block 37 is provided on the stage 2 that holds the electrostatic chuck 25. Figure 7 shows the state where the magnetic force from the magnet 18 is not acting on the mask foil 26, and Figure 8 shows the state where the magnetic force from the magnet 18 is acting on the mask foil 26. The gap block 37 is a component for controlling the amount of gap between the substrate 27 and the mask foil 26. The stage 2 is seated on a counterbore surface 43 provided on the frame 15 via the gap block 37. The gap block 37 is provided horizontally outward from the fixing portion 17 of the mask foil 26 on the frame 15. Therefore, as shown in Figure 8, when the stage 2 is seated on the counterbore surface 43, the gap block 37 is positioned so as not to hinder the deformation of the mask foil 26. Note that the arrangement of the gap block 37 is not limited to the form of Embodiment 1, but a configuration that does not hinder the deformation of the mask foil 26 when the mask foil 26 is attracted by magnetic force is desirable.

[0039] (Film forming method) A film deposition method for depositing a film-forming material onto a substrate using the film deposition apparatus 1 of Example 1 will be described. First, the substrate 27 is loaded into the vacuum chamber 4 by a robot hand and held by an electrostatic chuck 25. Next, the mask 16 is loaded into the vacuum chamber 4 by a robot hand and placed on the mask stand 33. Next, the mask stand 33 is raised and lowered to bring the mask 16 and the substrate 27 held by the electrostatic chuck 25 closer together. Next, alignment marks 102a to 102d are photographed by alignment cameras 7a and 7b, and based on the photographic results, the stage 2 is moved by the linear motor movable element 20 and the linear motor stator 21 to align the substrate 27 and the mask 16. Next, the magnet 18 is lowered to apply magnetic force to the mask 16, causing the mask foil 26 of the mask 16 to come into close contact with the substrate 27. Next, the film-forming material is released from the evaporation source 5 by evaporation to deposit a film on the substrate 27 via the mask 16. By releasing a metal as a film-forming material, a metal film can be formed on a substrate. By releasing an organic material as a film-forming material, an organic film can be formed on a substrate.

[0040] (Method of manufacturing electronic devices) A method for manufacturing an electronic device by forming an organic film on a substrate 27 using the film deposition apparatus 1 of Example 1 will be described. Here, the method for manufacturing an organic EL element used in an organic EL display will be used as an example of the electronic device. However, the electronic device is not limited to this. For example, the present invention can also be applied to the manufacture of thin-film solar cells and organic CMOS image sensors. The manufacturing method of the electronic device in the example includes a step of forming an organic film on the substrate 27 using the film deposition apparatus 1 of the above example. Furthermore, after forming the organic film on the substrate 27, there is a step of forming a metal film or a metal oxide film. The structure of the organic EL display device 700 using the organic EL element manufactured by such a process will be described below.

[0041] Figure 9(A) shows an overall view of the organic EL display device 700, and Figure 9(B) shows the cross-sectional structure of a single pixel of the organic EL display device 700. As shown in Figure 9(A), multiple pixels 702, each having multiple light-emitting elements, are arranged in a matrix in the display area 701 of the organic EL display device 700. Each light-emitting element has a structure comprising an organic layer sandwiched between a pair of electrodes. Here, a pixel refers to the smallest unit capable of displaying a desired color in the display area 701. The pixels 702 of the organic EL display device 700 are composed of a combination of a first light-emitting element 702R, a second light-emitting element 702G, and a third light-emitting element 702B, each emitting light in a different color. The first light-emitting element 702R, the second light-emitting element 702G, and the third light-emitting element 702B are a red light-emitting element, a green light-emitting element, and a blue light-emitting element, respectively. Note that the number of light-emitting elements per pixel and the combination of emitted colors are not limited to this example. For example, a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, or at least one color, is acceptable. Furthermore, each light-emitting element may be constructed by stacking multiple light-emitting layers.

[0042] A pixel 702 may be composed of multiple light-emitting elements that emit light of the same color, and a color filter may be used in which different color conversion elements are arranged to correspond to each light-emitting element, thereby enabling a single pixel 702 to display a desired color. For example, a pixel 702 may be composed of three white light-emitting elements, and a color filter may be used in which red, green, and blue color conversion elements are arranged to correspond to each light-emitting element. Alternatively, a pixel 702 may be composed of three blue light-emitting elements, and a color filter may be used in which red, green, and colorless color conversion elements are arranged to correspond to each light-emitting element. Note that the number of light-emitting elements per pixel and the combination of emitted colors are not limited to these examples. In the latter case, by using a quantum dot color filter (QD-CF) made of quantum dot (QD) material as the material constituting the color filter, the display color gamut can be made wider than that of an organic EL display device that does not use a quantum dot color filter.

[0043] Figure 9(B) is a schematic partial cross-sectional view of the line BB in Figure 9(A). Pixel 702 has an organic EL element formed on a substrate 27, comprising a first electrode (anode) 704, a hole transport layer 705, light-emitting layers 706R, 706G, 706B, an electron transport layer 707, and a second electrode (cathode) 708. The hole transport layer 705, light-emitting layers 706R, 706G, 706B, and electron transport layer 707 are organic layers. Light-emitting layer 706R is a red-emitting organic EL layer, light-emitting layer 706G is a green-emitting organic EL layer, and light-emitting layer 706B is a blue-emitting organic EL layer. When a color filter or quantum dot color filter is used, the color filter or quantum dot color filter is placed on the light-emitting side of each light-emitting layer, i.e., at the top or bottom of Figure 9(B).

[0044] The light-emitting layers 706R, 706G, and 706B are organic EL elements, each emitting red, green, and blue light, respectively. The light-emitting layers 706R, 706G, and 706B are formed according to the arrangement pattern of the light-emitting elements 702R, 702G, and 702B. A first electrode 704 is formed for each light-emitting element and is separated from each other. The hole transport layer 705, electron transport layer 707, and second electrode 708 may be formed to be shared by multiple light-emitting elements 702R, 702G, and 702B, or they may be formed separately for each light-emitting element. An insulating layer 709 is provided between the first electrodes 704 to prevent the first electrode 704 and the second electrode 708 from short-circuiting due to foreign matter. Since organic EL layers degrade due to moisture and oxygen, a protective layer 710 is provided to protect the organic EL elements from moisture and oxygen.

[0045] A method for manufacturing an organic EL display device as an electronic device will be described. First, a circuit (not shown) for driving the organic EL display device and a substrate 27 on which the first electrode 704 is formed are prepared.

[0046] Next, a resin layer such as acrylic resin or polyimide is formed on the substrate 27 on which the first electrode 704 is formed by spin coating. The resin layer is then patterned by lithography so that an opening is formed in the area where the first electrode 704 is formed, thereby forming an insulating layer 709. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0047] Next, the substrate 27 patterned with the insulating layer 709 is loaded into the first deposition apparatus, held by a substrate holding unit, and the hole transport layer 705 is deposited as a common layer on the first electrode 704 of the display area. The hole transport layer 705 is deposited by vacuum deposition. In practice, the hole transport layer 705 is formed to a size larger than the display area 701, so a high-resolution mask is not required. Here, the deposition apparatus used in this step and in the deposition of each of the following layers is the deposition apparatus described in any of the embodiments above.

[0048] Next, the substrate 27, on which the hole transport layer 705 has been formed, is brought into the second film deposition apparatus and held in the substrate holding unit. The substrate 27 and the mask 16 are aligned, the substrate 27 is placed on the mask 16, and a red light-emitting layer 706R is formed on the portion of the substrate 27 where the red light-emitting elements are to be placed.

[0049] Similar to the deposition of the light-emitting layer 706R, a light-emitting layer 706G that emits green light is deposited using a third deposition apparatus, and then a light-emitting layer 706B that emits blue light is deposited using a fourth deposition apparatus. After the deposition of the light-emitting layers 706R, 706G, and 706B is completed, an electron transport layer 707 is deposited over the entire display area 701 using a fifth deposition apparatus. Each of the light-emitting layers 706R, 706G, and 706B may be a single layer or a layer made up of multiple different layers stacked together. The electron transport layer 707 is formed as a common layer for the three colored light-emitting layers 706R, 706G, and 706B. In this embodiment, the electron transport layer 707 and the light-emitting layers 706R, 706G, and 706B are deposited by vacuum deposition.

[0050] Next, a second electrode 708 is formed on the electron transport layer 707. The second electrode may be formed by vacuum deposition or by sputtering. After that, the substrate 27 on which the second electrode 708 is formed is moved to a sealing apparatus and a sealing process is performed in which a protective layer 710 is formed by plasma CVD, completing the organic EL display device 700. In this example, the protective layer 710 is formed by the CVD method, but it is not limited to this and may also be formed by the ALD method or the inkjet method.

[0051] Between the time the substrate 27, which has the insulating layer 709 patterned on it, is loaded into the film deposition apparatus and the time the protective layer 710 is deposited, the substrate 27 is exposed to an atmosphere containing moisture and oxygen, which may cause the light-emitting layer to deteriorate due to moisture and oxygen. In the embodiment, the loading and unloading of the substrate 27 between film deposition apparatuses is performed under a vacuum atmosphere or an inert gas atmosphere. [Explanation of symbols]

[0052] 1: Film deposition apparatus, 15: Frame, 16: Mask, 17: Fixing part, 18: Magnet, 25: Electrostatic chuck, 26: Mask foil, 27: Substrate, 36: Dummy workpiece, 41: Edge, 42: Holding surface, S: Holding area

Claims

1. A film deposition apparatus capable of depositing a film deposition material onto a substrate of a predetermined thickness or greater, A substrate holding means for holding the substrate, A mask positioned opposite the holding surface of the substrate holding means that holds the substrate, A magnetic force applying means is arranged opposite to the surface of the substrate holding means that is opposite to the holding surface, Equipped with, The aforementioned mask is Frame and, A mask foil fixed to the frame, comprising a magnetic mask foil having an opening corresponding to a film deposition pattern to be formed on the substrate, It has, The substrate holding means has a projection that protrudes from the holding surface toward the mask outside the holding area for holding the substrate, The fixing portion to which the mask foil is fixed to the frame is located outward from the end of the protrusion closest to the holding area in a direction parallel to the holding surface. A film-forming apparatus characterized in that the height of the protruding portion is less than or equal to the predetermined thickness.

2. The film-forming apparatus according to claim 1, wherein the difference between the height of the protruding portion and the predetermined thickness is 7 μm or less.

3. The film-forming apparatus according to claim 1 or 2, wherein the distance between the end of the protruding portion closest to the holding region and the holding region is 1 mm or less.

4. The film-forming apparatus according to claim 1 or 2, wherein the tip of the protruding portion facing the mask has a surface parallel to the holding surface.

5. The film-forming apparatus according to claim 1 or 2, wherein the protruding portion is continuously provided around the holding area.

6. The film-forming apparatus according to claim 1 or 2, wherein the protrusions are discretely provided around the holding area.

7. The film deposition apparatus according to claim 1 or 2, wherein the substrate holding means is an electrostatic chuck that attracts the substrate by electrostatic force.

8. A method for forming a film on a substrate using the film forming apparatus described in claim 1, wherein A step of holding the substrate in the substrate holding means, A step of bringing the substrate held by the substrate holding means and the mask closer together, A step of applying a magnetic force from the magnetic force applying means to the mask to make the mask foil adhere to the substrate, A process of releasing the film-forming material from the evaporation source, A method for forming a film, characterized by having the following features.

9. A method for manufacturing an electronic device having a metal film formed on a substrate, A method for manufacturing an electronic device, characterized in that the metal film is formed by the film formation method described in claim 8.

10. A method for manufacturing an electronic device having an organic film formed on a substrate, The organic film is formed by the film formation method described in claim 8, and this is an electronic device A method for manufacturing sushi.

11. The method for manufacturing an electronic device according to claim 9, characterized in that the electronic device is an organic EL element.

Images