In-line air pulverization and mixing apparatus and method for processing electrode film mixtures

Abstract

The present invention provides a method and system for processing electrode film mixtures. [Solution] In one embodiment, a method for processing an electrode film mixture is provided. The method comprises air milling a binder material by applying a temperature-controlled gas in an air milling device to form an air-milled binder material, wherein the air milling device includes an air milling chamber and a pressurized insert disposed within the air milling chamber, and the air milling device is attached to a mixing device including a mixing chamber, the pressurized insert including an outlet configured to provide fluid communication between the air milling chamber and the mixing chamber, dispersing the air-milled binder material in a mixing chamber containing an active material, and mixing in the mixing chamber to form an electrode film material mixture.

Description

[Technical Field]

[0001] [Cross-reference of related applications] This application claims priority to U.S. Patent Application No. 19 / 016,706, filed on January 10, 2025, entitled “INLINE AIR MILLING AND MIXING APPARATUSES FOR PROCESSING ELECTRODE FILM MIXTURES, AND METHODS THEREOF,” which is incorporated herein by reference in its entirety for all purposes. [Background technology]

[0002] This disclosure relates to systems and methods for processing electrode film mixtures and their products. In particular, the systems and methods relate to processing electrode film mixtures using an air pulverizer. An electrode film mixture for a typical energy storage device includes a binder material combined with an active electrode material. Generally, electrode film mixtures require effective distribution of the binder material before energy storage device assembly. In a dry electrode film manufacturing process, an effectively distributed dry binder is combined with the active electrode material and calendered without the use of solvents to form a dry electrode film. However, energy storage devices containing processed dry electrodes may have challenges in terms of high utilization rate, uniformity, and optimal particle size distribution of the binder material, which are important parameters for the electrochemical and mechanical properties of the electrodes. Conventional systems and methods to address the challenges of binder distribution may result in undesirable material aggregation and yield loss. [Overview of the Initiative]

[0003] For the purpose of summarizing the present invention and the advantages achieved beyond the prior art, specific purposes and advantages of the present invention are described herein. Not all such purposes or advantages can be achieved in any particular embodiment of the present invention. Accordingly, for example, those skilled in the art will understand that the present invention may be embodied or implemented to achieve or optimize one or more advantages as taught herein, without necessarily achieving other purposes or advantages as taught or suggested herein.

[0004] One embodiment describes a method for processing an electrode film mixture. The method comprises air milling a binder material by applying a temperature-controlled gas in an air milling apparatus to form an air-milled binder material, the air milling apparatus comprising an air milling chamber and a pressurized insert disposed within the air milling chamber, the air milling apparatus being attached to a mixing apparatus comprising a mixing chamber, the pressurized insert comprising an outlet configured to provide fluid communication between the air milling chamber and the mixing chamber, dispersing the air-milled binder material in a mixing chamber comprising an active material, and mixing the air-milled binder material and the active material in the mixing chamber to form an electrode film material mixture.

[0005] In another embodiment, a system for processing an electrode film mixture is described. The system includes a mixing device including a mixing chamber and an air grinding device including an air grinding chamber and a pressurizing insert disposed within the air grinding chamber, the air grinding device being attached to the mixing device, and the pressurizing insert including an outlet configured to provide fluid communication between the air grinding chamber and the mixing chamber.

[0006] In some embodiments, the outlet includes a dispersion nozzle. In some embodiments, the mixing apparatus is a fluidized bed mixing apparatus. In some embodiments, the mixing chamber includes mixing blades. In some embodiments, the system further includes a pressurized tank in fluid communication with an air grinding apparatus.

[0007] In another embodiment, a method for preparing an electrode film mixture is described. This method includes: pneumatically grinding a material to form a pneumatically ground material; dispersing the pneumatically ground material in a mixing chamber containing an active material; and mixing the pneumatically ground material and the active material in the mixing chamber to form an electrode film material mixture.

[0008] In some embodiments, the method further includes gravity feeding of the air-pulverized material into a mixing chamber. In some embodiments, the method further includes pre-mixing the material with a conductive additive. In some embodiments, mixing the air-pulverized material and the active material in the mixing chamber is carried out by a high-shear process. In some embodiments, the air-pulverized material is less than approximately 30 μm. 50 It has an average particle size distribution.

[0009] In some embodiments, pneumatic pulverization involves applying a temperature-controlled gas to the material. In some embodiments, the temperature-controlled gas includes gases selected from the group consisting of hydrogen gas, nitrogen gas, argon gas, oxygen gas, and combinations thereof. In some embodiments, pneumatic pulverization of the material is performed at a gauge pressure of 0.1 atm to 4 atm.

[0010] In some embodiments, the mixing is carried out at a temperature of at least about 20°C. In some embodiments, the method further includes coating the active material with a carbon material before dispersion or mixing. In some embodiments, the carbon material includes activated carbon. In some embodiments, the active material is selected from the group consisting of graphite, lithium nickel manganese cobalt oxide (NMC), lithium nickel cobalt aluminum oxide (NCA), and combinations thereof.

[0011] In some embodiments, the method further includes pre-treating the material before air grinding. In some embodiments, the pre-treatment includes temperature-controlled heating of the material to a temperature of about -200 to 300°C.

[0012] In some embodiments, the material is a binder material. In some embodiments, the binder material includes a fibrillizable binder. In some embodiments, the binder material is selected from the group consisting of polytetrafluoroethylene (PTFE), polyethylene (PE), polypropylene (PP), polyvinylidene fluoride (PVDF), polyvinyl chloride, poly(phenylene oxide) (PPO), polyethylene-block-poly(ethylene glycol), poly(ethylene oxide) (PEO), poly(phenylene oxide) (PPO), polyethylene-block-poly(ethylene glycol), polydimethylsiloxane (PDMS), polydimethylsiloxane-coalkylmethylsiloxane, polyalkylene, polyether, styrene-butadiene, styrene-butadiene rubber (SBR), carboxymethylcellulose (CMC), copolymers of polysiloxane and polysiloxane, branched polyether, polyvinyl ether, copolymers thereof, and combinations thereof. In some embodiments, the electrode film material mixture is substantially free of solvent residue. [Brief explanation of the drawing]

[0013] [Figure 1] This is a schematic diagram of a processing system including an air pulverizer and a mixing device according to several embodiments.

[0014] [Figure 2] Schematic diagram of an air pulverization device according to some embodiments.

[0015] [Figure 3] Schematic diagram of a part of an air pulverization device according to some embodiments.

[0016] [Figure 4] Schematic flow diagram of an air pulverization device and a mixing device according to some embodiments.

[0017] [Figure 5] Flow chart showing a method for treating an electrode film mixture including air pulverization according to some embodiments.

[0018] [Figure 6] Data plot showing the deflocculation of a binder material based on volume % and size according to some embodiments.

[0019] [Figure 7] Data plot showing the particle size distribution using an air-pulverized binder material and an un-pulverized binder material based on cumulative volume % and particle size according to some embodiments.

[0020] [Figure 8A] Flow vector diagram showing the flow rate of a binder material moving through a vertical cross-section of an air pulverization device according to some embodiments.

[0021] [Figure 8B] Schematic diagram comparing an air flow path and a powder flow path according to some embodiments.

[0022] [Figure 9] Data plot showing the pressure profile of air flowing from an air pulverization chamber to a mixing chamber according to some embodiments.

[0023] [Figure 10A] This is an energy-dispersive spectroscopy (EDS) image of an unground binder material that has undergone homogenization.

[0024] [Figure 10B] These are EDS images of air-pulverized binder material undergoing homogenization, according to several embodiments.

[0025] [Figure 10C] This is a data plot showing the predicted standard deviation against linear velocity for various air-pulverized and unpulverized binder materials according to several embodiments.

[0026] [Figure 11A] This is a data plot showing the amounts of bound and unbound fibrillated binders in weight percent based on sieve opening, according to several embodiments.

[0027] [Figure 11B] These are scanning electron microscope (SEM) images of un-pulverized binder material on a rigid cathode according to several embodiments.

[0028] [Figure 11C] These are SEM images of air-pulverized binder material on a rigid cathode, according to several embodiments.

[0029] However, it should be clearly understood that the examples and drawings are for illustrative purposes only and do not necessarily limit the scope of the present invention. [Modes for carrying out the invention]

[0030] While certain preferred embodiments and examples are disclosed below, the subject matter of the present invention extends beyond the specifically disclosed embodiments to other alternative embodiments and / or uses, as well as their modifications and equivalents. Therefore, the appended claims are not limited by any of the specific embodiments described below. For example, in any method or process disclosed herein, the implementation or operation of the method or process may be performed in any suitable order, and is not necessarily limited to any specific disclosed order. Various operations can be described as a number of separate operations in a manner that may be helpful in understanding a particular embodiment. However, the order of description should not be construed to mean that these operations are order-dependent. Furthermore, the structures, systems, and / or apparatus described herein may be embodied as integrated components or as separate components. For the purpose of comparing various embodiments, specific aspects and advantages of these embodiments are described. Not all such aspects or advantages are necessarily achieved by any particular embodiment. Therefore, for example, various embodiments may be implemented to achieve or optimize one or more advantages taught herein without necessarily achieving other aspects or advantages that may be taught or suggested herein.

[0031] A system and method for processing electrode film mixtures using an air pulverizer is described. Generally, electrode film mixtures may include a mixture of active material and binder material. However, conventional systems and methods for processing electrode film mixtures can result in heterogeneity of the mixed material, metal contamination, material damage, undesirable material aggregation, and prolonged mixing cycles. Furthermore, if the binder particles are highly aggregated or not bound to the bonding network, membrane defects (e.g., differences in microstructure, density, local differences in membrane load, and reduced electrochemical performance) may occur in the electrode film.

[0032] Therefore, the material (e.g., electrode material) can be air-ground in an air-grinding device using a gas (e.g., temperature-controlled gas, pressurized cooling air) when the material is supplied into the mixing device (e.g., by gravity supply, by air pressure supply). By breaking down aggregated particles and achieving an optimal particle size distribution (e.g., small, well-distributed fibrous binder material), the material can be uniformly distributed within the mixing device.

[0033] In some embodiments, the material includes an electrode material. In some embodiments, the electrode material includes an active material (e.g., an active electrode material, a cathode active material, an anode active material), a carbon material, a conductive additive, a binder material, and combinations thereof. In some embodiments, the material may be in particulate form (e.g., a powder).

[0034] In some embodiments, the binder material is fibrousized or fibrillated in an air pulverizer and / or mixing apparatus. In some embodiments, fibrousization in an air pulverizer and / or mixing apparatus may help control the particle size of the binder material. Furthermore, formulations of high-density, homogeneous electrode film mixtures containing air-pulverized material (e.g., air-pulverized electrode material) may help form a sufficient bonding network to improve mechanical strength and packing density during electrode fabrication. In some embodiments, the air-pulverized material includes air-pulverized electrode material. In some embodiments, the air-pulverized electrode material includes air-pulverized active material (e.g., air-pulverized active electrode material, air-pulverized cathode active material, air-pulverized anode active material), air-pulverized carbon material, air-pulverized conductive additive, air-pulverized binder material, and combinations thereof.

[0035] In some embodiments, as a result of achieving an optimal particle size distribution of the electrode material, electrode film mixtures used to form electrode films, electrodes, and energy storage devices may have improved electrochemical and / or mechanical properties. Effective distribution and utilization of materials can enable the maximum use of inert additives in electrode fabrication, and therefore, the mechanical properties of the electrode can be improved using more active components. Effective distribution of materials can also help improve the energy density and cost basis ($ / kWh) of the electrode assembly. Furthermore, the fabrication of electrodes with uniformly distributed additives may improve electrochemical performance by reducing, for example, the pathways for lithium ion transport, contributing to reduced hot spots, lithium plating, and cycle life. Moreover, high localized additive concentrations in the electrode film fabrication process can adversely affect the mechanical and thermal properties of the electrode film and may lead to further defects such as roll build-up and pull-out.

[0036] Air grinding also allows for temperature control of the material, thereby controlling the aggregation of the material into the material itself and other additive particles within the mixing apparatus.

[0037] In some embodiments, the particle size and morphology of the material can be adjusted by changing the power pressure (e.g., fluid velocity) corresponding to the grinding force of the pneumatic grinder. In some embodiments, the pneumatic grinder may be modified based on specific fluid and particle trajectories. By changing the material particle size and other elements of the pneumatic grinder, the uniformity of the mixture can be improved and undesirable particle aggregation can be prevented.

[0038] • Air pulverizer and mixing device Figure 1 is a schematic diagram of a processing system including an air pulverizer and a mixing device. As shown in Figure 1, the processing system 100 includes an air pulverizer 110 including a pressure insert 120 and a mixing device 150 including a mixer or mixing chamber 160 and mixing blades 170. The air pulverizer 110 is mounted directly on top of the mixing device 150, the pressure insert 120 is located inside the mixing device 150, and the pulverizer 110 is in fluid communication with the mixing device 150. The pressure insert 120 has a lower insert length 130 and injection angles 135a, 135b. The upper part of the pressure insert 120 (not shown) is located inside the air pulverizer 110, and the lower part of the pressure insert 120 is located inside the mixing chamber 160. The lower part of the pressure insert 120 has a lower insert length 130 which may reach the floor of the mixing chamber 160 or where the mixing blades 170 are located. The injection angles 135a and 135b are associated with the lower insert length 130 such that a change in the lower insert length 130 affects the injection angles 135a and 135b.

[0039] In some embodiments, the pneumatic grinder is attached to, connected to, and / or fluid-communicated with, a mixing device. In some embodiments, the pneumatic grinder may be detached from or separated from, a mixing device. In some embodiments, a pressure insert is configured to be installed between the pneumatic grinder and the mixing device. In some embodiments, the shape of the pressure insert may be configured to pneumatically grind the material when the pneumatic grinder is in use to form pneumatically ground material. In some embodiments, the shape of the pressure insert is configured to increase the particle size distribution of the material ground by the grinder. In some embodiments, the shape of the pressure insert may be used to increase the gas flow rate, material flow rate, and / or pressure range within the pneumatic grinder. In some embodiments, the pressure insert may be detachably coupled so that it can be attached to, connected to, and / or fluid-communicated with, a mixing device based on pneumatic grinding requirements, and can be detached and / or replaced with pressure inserts of different shapes.

[0040] In some embodiments, the processing system includes a series connection between a grinding device and a mixing device so that the grinding device is in fluid communication with the mixing device.

[0041] In some embodiments, the mixing apparatus may be a fluidized bed mixer. In some embodiments, the fluidized bed mixer includes a fluidizing medium inlet containing a fluidizing medium (e.g., a fluidizing material). In some embodiments, the fluidizing medium is sprayed or mixed into the mixing chamber. In some embodiments, the fluidizing medium is fluidized within the mixing chamber. In some embodiments, the fluidized bed mixer is configured to suspend active material precursor particles in the fluidizing medium by gravity and / or by recirculation of the fluidizing medium. In some embodiments, the fluidizing medium is fluidized by a gas such as air or nitrogen and / or a liquid such as water or a solvent.

[0042] In some embodiments, the mixing device may include one or more mixing chambers. In some embodiments, the mixing device may include a material guide valve to allow the air-pulverized material to flow between one or more mixing chambers. In some embodiments, the mixing device may include an air separator to divert gas between one or more mixing chambers. In some embodiments, the mixing device may include an air filter to prevent gas buildup in one or more mixing chambers.

[0043] In some embodiments, the mixing chamber may include a plurality of mixing blades. In some embodiments, the mixing chamber may further include a deflector. In some embodiments, the mixing blades are configured to rotate clockwise or counterclockwise. In some embodiments, the mixer and / or mixing chamber is a high-shear mixer and / or mixing chamber. In some embodiments, the mixer and / or mixing chamber is a low-shear mixer and / or mixing chamber. In some embodiments, the mixing chamber includes an exhaust port for removing gas from within the mixing chamber. In some embodiments, the exhaust port is attached to and connected to the mixing device and / or has fluid communication with it. In some embodiments, the exhaust port may be removed from or isolated from the mixing device. In some embodiments, the exhaust port prevents short circuits to the exhaust port and prevents exceeding the maximum allowable pressure within the mixing chamber, allowing material to remain in the mixing chamber. In some embodiments, the mixing chamber includes a tangential gas inlet to aid in mixing the air-pulverized material into the mixing chamber.

[0044] In some embodiments, the injection angle may be positive (e.g., greater than about 0°). In some embodiments, the injection angle may be less than about 90°. In some embodiments, the injection angle is 1°, 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55°, 60°, 65°, 70°, 75°, 80°, 85°, or 90°, approximately those values, maximum those values, maximum approximately those values, or any range of values ​​between them. In some embodiments, the injection angle may be negative (e.g., less than about 0°). In some embodiments, the injection angle may be about -90°. In some embodiments, the injection angle is -1°, -5°, -10°, -15°, -20°, -25°, -30°, -35°, -40°, -45°, -50°, -55°, -60°, -65°, -70°, -75°, -80°, -85°, or -90°, approximately those values, at least those values, or at least approximately those values, or any range of values ​​between them.

[0045] The lower insert length may be referred to as the travel distance between the air grinding chamber and the mixing chamber. In some embodiments, the injection angle and / or travel distance may affect the particle size distribution. In some embodiments, the lower insert length may be configured such that the injection angle corresponds to the travel distance. In some embodiments, a longer lower insert length may decrease the injection angle. In some embodiments, a shorter lower insert length may increase the injection angle. In some embodiments, the lower insert length is 10 cm, 11 cm, 12 cm, 13 cm, 14 cm, 15 cm, 16 cm, 17 cm, 18 cm, 19 cm, 20 cm, 21 cm, 22 cm, 23 cm, 24 cm, 25 cm, 26 cm, 27 cm, 28 cm, 29 cm, 30 cm, 31 cm, 32 cm, 33 cm, 34 cm, 35 cm, 36 cm, 37 cm, 38 cm, 39 cm, or 40 cm, approximately those values, at least those values, or at least approximately those values, or any range of values ​​between them.

[0046] Figure 2 is a schematic diagram of an air pulverizer. As shown in Figure 2, the air pulverizer 200 includes a hopper 210 (i.e., a funnel), an inlet valve 220, a material dispenser 230, and a pressurizing insert 240. The hopper 210 is in fluid communication with the inlet valve 220, which provides an open or closed inlet to the material dispenser 230. The material dispenser 230 is positioned between the inlet valve 220 and the pressurizing insert 240. The hopper 210, inlet valve 220, material dispenser 230, and pressurizing insert 240 are in fluid communication with each other.

[0047] In some embodiments, the hopper may include a suction air supply, which provides low friction roughness to the hopper surface. In some embodiments, the suction air supply may include a permeable metal for fluidization, allowing the gas flow to guide the material through the hopper. In some embodiments, the pressurizing insert is removable from the material dispenser, inlet valve, and / or funnel. In some embodiments, the material valve and / or material dispenser may be removable from the air grinding device. In some embodiments, the center of the material dispenser is configured to be eccentric from the center of the air grinding chamber to prevent short circuits. In some embodiments, the material dispenser includes a dispenser valve to prevent positive pressure and / or backflow.

[0048] Figure 3 is a schematic diagram of a part of the air grinding apparatus. As shown in Figure 3, part 300 of the air grinding apparatus includes part 310 of the material dispenser, gas inlets 320A and 320B, a pressurized insert 325, the upper part of the pressurized insert or the air grinding chamber 330, gas outlets 335A and 335B, and the lower part of the pressurized insert or the outlet 340. The outlet 340 further includes a dispersion nozzle 350. The outlet 340 is attached to or connected to the air grinding chamber 330 such that the outlet 340 extends into the mixing apparatus. Part 310 of the material dispenser, the air grinding chamber 330, and the outlet 340 are in fluid communication with each other. The gas inlets 320A and 320B are in fluid communication with the air grinding chamber 330 such that the gas inlets 320A and 320B supply gas into the air grinding chamber 330 via the gas outlets 335A and 335B, respectively. The gas outlets 335A and 335B function as channels for gas to flow from the gas inlets 320A and 320B into the air pulverization chamber 330.

[0049] In some embodiments, the pneumatic pulverizer may include one or more gas inlets. In some embodiments, the pneumatic pulverizer may include one or more gas outlets. In some embodiments, the gas outlets may include an air plenum to help control the gas flow. In some embodiments, the air plenum includes a high-section chamber that generates a gas flow at a low velocity. In some embodiments, the air plenum generates a pressure drop within the high-section chamber. In some embodiments, the gas outlets may further include a gas nozzle. In some embodiments, the gas nozzle is a sonic or supersonic gas nozzle having a convergent flow of gas at a velocity greater than the speed of sound. In some embodiments, the nozzle can provide a helical flow profile of the gas, increasing collisions between particles and generating a uniform velocity profile. In some embodiments, the nozzle can provide a non-helical (e.g., linear) flow profile of the gas and generating a non-uniform velocity profile. In some embodiments, the gas inlet may include a gas valve to allow and prevent gas from flowing into the pneumatic pulverizer chamber. In some embodiments, the pneumatic pulverizer may include a gas flow controller. In some embodiments, the dispersion nozzle can be removed from the pneumatic pulverizer. In some embodiments, the air grinding chamber includes a chamber outlet that controls the gas entering the pressurized insert.

[0050] Figure 4 is a schematic flow diagram of an air pulverizer and a mixing apparatus for processing an electrode film mixture. As shown in Figure 4, the flow process 400 includes a material dispenser 410 that supplies material to be fed into the air pulverizer 420. The air pulverizer 420 includes a hopper 425, an inlet valve 430, and a pressurizing insert 435. The material flows through the air pulverizer 420 into the mixing apparatus 440. The flow process 400 further includes a pressurizing tank 450 which is in fluid communication with a pressure regulating valve 460. The pressurizing tank 450 supplies a gas flow 455 to the pressure regulating valve 460. The pressure regulating valve 460 is in fluid communication with an air processing element 470. The air processing element 470 is configured to control the flow rate, temperature, and pressure of the gas flowing from the pressurizing tank 450. The air processing element 470 is further in fluid communication with the air pulverizer 420, the pressurizing insert 435, and the mixing apparatus 440, respectively.

[0051] In some embodiments, the flow process may include one or more pressurized tanks. In some embodiments, the pressurized tanks contain a gas selected from the group consisting of hydrogen gas, nitrogen gas, argon gas, oxygen gas, and combinations thereof. In some embodiments, the flow process may include one or more air treatment elements. In some embodiments, the air treatment elements may include a gas flow controller, a temperature controller, and / or a pressure controller. In some embodiments, the air treatment elements may be in fluid communication with one or more elements of the grinding apparatus. In some embodiments, the air treatment elements may be in fluid communication with one or more elements of the mixing apparatus. In some embodiments, the gas flow may include pressurized cooling air and / or a temperature-controlled gas. In some embodiments, the gas flow can act as a suction gas flow (e.g., the gas is led from the air grinding apparatus to the mixing apparatus) and / or a powered gas flow (e.g., the gas is led into the air grinding apparatus). In some embodiments, the gas is supplied to the air grinding apparatus for the purpose of air grinding the material and / or to the mixing apparatus for fluidizing the material in the mixing apparatus. In some embodiments, the gas supplied to the mixing apparatus fluidizes the material in the mixing apparatus together with the mixing blades.

[0052] • Method of aerial pulverization and mixing The method described can be used in the related systems and apparatus described throughout. Figure 5 is a flowchart of a method 500 for processing an electrode film mixture, including air pulverization. As shown in Figure 5, in step 510, the material is air pulverized to form an air-pulverized material. In step 520, the air-pulverized material is dispersed in a mixer (e.g., a mixing chamber), and in step 530, the air-pulverized material is mixed with an active material in the mixer (e.g., a mixing chamber) to form an electrode film mixture in step 540.

[0053] In some embodiments, processing the electrode film mixture may include gravity feeding of the air-pulverized material into a mixing chamber. In some embodiments, processing the electrode film mixture may include pneumatic feeding of the air-pulverized material into a mixing chamber. In some embodiments, the air-pulverized material may be pneumatically fed into one or more mixing chambers.

[0054] In some embodiments, the material may be pre-treated before air grinding. In some embodiments, the pre-treatment may include a cooling process to increase the brittleness of the material and / or a heating process to melt or soften the material. In some embodiments, the pre-treatment may include pre-mixing the material with other solid or liquid additives that can facilitate the grinding and dispersion of the material. In some embodiments, the pre-treatment may further include coating the active material with a carbon material before dispersion or mixing.

[0055] In some embodiments, the pretreatment may be performed at pretreatment temperatures ranging from -200°C, -150°C, -100°C, -50°C, -25°C, -10°C, -5°C, 0°C, 10°C, 15°C, 20°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, 65°C, 70°C, 75°C, 80°C, 85°C, 90°C, 95°C, 100°C, 120°C, 140°C, 160°C, 180°C, 200°C, 220°C, 240°C, 260°C, 280°C, 300°C, 320°C, 340°C, 360°C, 380°C, or 400°C, approximately those values, maximum those values, or maximum approximately those values, or any value in between. In some embodiments, the pretreatment may include temperature control of the material to a temperature of approximately -200 to 300°C. In some embodiments, the material is melted without the use of a solvent to achieve a small particle size. In some embodiments, a lower pretreatment temperature (e.g., below about 5°C) may form a more brittle material compared to a higher pretreatment temperature. In some embodiments, a lower pretreatment temperature may form a binder material that is less prone to fibrillation, thereby reducing the particle size of the material.

[0056] In some embodiments, the mixing of the air-pulverized material and the active material in the mixing chamber may be carried out at a mixing temperature in the range of 15°C, 16°C, 17°C, 18°C, 19°C, 20°C, 21°C, 22°C, 23°C, 24°C, 25°C, 26°C, 27°C, 28°C, 29°C, or 30°C, approximately those values, maximum those values, or maximum approximately those values, or any value in between.

[0057] In some embodiments, pneumatic pulverization may be performed at gauge pressures of 0 atm, 0.1 atm, 0.2 atm, 0.3 atm, 0.4 atm, 0.5 atm, 0.6 atm, 0.7 atm, 0.8 atm, 0.9 atm, 1 atm, 2 atm, 3 atm, 4 atm, or 5 atm, approximately those values, maximum those values, maximum approximately those values, or any range of values ​​between them.

[0058] In some embodiments, air pulverization may involve applying a temperature-controlled gas to a material at temperatures of -200°C, -150°C, -100°C, -50°C, -25°C, -10°C, -5°C, 0°C, 1°C, 2°C, 3°C, 4°C, 5°C, 6°C, 7°C, 8°C, 9°C, 10°C, 11°C, 12°C, 13°C, 14°C, 15°C, 16°C, 17°C, 18°C, 19°C, 20°C, 21°C, 22°C, 23°C, 24°C, 25°C, 26°C, 27°C, 28°C, 29°C, or 30°C, approximately those values, maximum those values, or maximum approximately those values, or any range in between. In some embodiments, air pulverization is performed at 0 m / s, 5 m / s, 10 m / s, 15 m / s, 20 m / s, 25 m / s, 30 m / s, 35 m / s, 40 m / s, 45 m / s, 50 m / s, 55 m / s, 60 m / s, 65 m / s, 70 m / s, 75 m / s, 80 m / s, 85 m / s, 90 m / s, 95 m / s, 100 m / s, 110 m / s, 120 m / s, 130 m / s, 140 m / s, 150 m / s, 160 m / s, 170 m / s, 180 m / s, 190 m / s, 200 m / s, 210 m / s, 220 m / s, 230 m / s, 240 m / s, 250 m / s, 260 m / s This may include applying a temperature-controlled gas to the material at a rate of approximately s, 270 m / s, 280 m / s, 290 m / s, 300 m / s, 310 m / s, 320 m / s, 330 m / s, 340 m / s, 350 m / s, 360 m / s, 370 m / s, 380 m / s, 390 m / s, 400 m / s, 410 m / s, 420 m / s, 430 m / s, 440 m / s, 450 m / s, 460 m / s, 470 m / s, 480 m / s, 490 m / s, or 500 m / s, at least those values, or at least approximately those values, or any range of values ​​in between. In some embodiments, the temperature-controlled gas may include a gas selected from the group consisting of hydrogen gas, nitrogen gas, argon gas, oxygen gas, and combinations thereof.

[0059] In the first embodiment, the material is 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, 100μm, 110μm, 120μm, 130μm, 140μm, 150μm, 160μm, 170μm, 180μm, 190μm, 200μm, 210μm, 220μm, 230μm, 240μm, 250μm, 260μm, 270μm, 280μm, 29 D is a range of 0 μm, 300 μm, 310 μm, 320 μm, 330 μm, 340 μm, 350 μm, 360 μm, 370 μm, 380 μm, 390 μm, 400 μm, 410 μm, 420 μm, 430 μm, 440 μm, 450 μm, 460 μm, 470 μm, 480 μm, 490 μm, or 500 μm, or approximately those values, or any value in between. 50 The average particle size distribution may be present. In some embodiments, the air-pulverized material has a range of D values ​​of 1 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, or 60 μm, or approximately those values, or any value in between. 50 It may have an average particle size distribution. In some embodiments, the air-pulverized material has a diameter of less than about 30 μm. 50 It has an average particle size distribution.

[0060] In some embodiments, the material is a binder material. In some embodiments, the air-pulverized material is an air-pulverized binder material. In some embodiments, the binder material (e.g., binder, fibrillable binder, fibrillated binder) is a D material with a particle size of 40 μm to 500 μm. 50It has an average particle size distribution. In some embodiments, the binder material has particle sizes of 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm, 180 μm, 190 μm, 200 μm, 210 μm, 220 μm, 230 μm, 240 μm, 250 μm, 260 μm, 270 μm, 280 μm, D in the range of 290μm, 300μm, 310μm, 320μm, 330μm, 340μm, 350μm, 360μm, 370μm, 380μm, 390μm, 400μm, 410μm, 420μm, 430μm, 440μm, 450μm, 460μm, 470μm, 480μm, 490μm, or 500μm, or approximately those values, or any value in between. 50 The average particle size distribution may be included. In some embodiments, the air-milled binder material (e.g., air-milled binder, air-milled fibrillable binder, air-milled fibrillated binder) material has a particle size range of 1 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm or 60 μm, or approximately those values ​​or any value in between. 50 The average particle size distribution may be included. In some embodiments, the air-pulverized binder material has a particle size of less than approximately 30 μm. 50 It has an average particle size distribution.

[0061] In some embodiments, the composition and / or particle size of the electrode film mixture can be reduced by air pulverization and / or by using high-shear equipment and processes. In some embodiments, the composition and / or particle size of the electrode film mixture can be reduced by air pulverization and / or by using non-destructive (e.g., low-shear) equipment and processes. High or low shear forces may be applied to separate agglomerating material into finely divided particles and / or to fibrillate the material so that the material can coat other electrode film components. In some embodiments, the resulting treated electrode film mixture (e.g., powder) may be compressed with heat and pressure using a roll mill to form a film, for example, by agglomerating and adhering the material to other components of the film in a fibrillated matrix.

[0062] In some embodiments, the electrode film mixture may be formed by mixing the components of the composite material (e.g., carbon additives and active materials; carbon additives, active materials and binders; or carbon additives, carbon active materials and binders) with or without a liquid. In some embodiments, the binder or binder material may include air-pulverized binders, air-pulverized fibrillable binders, or air-pulverized fibrillated binders. In some embodiments, the liquid may include aqueous solvents and / or organic solvents. In some embodiments, the liquid may include water. In some embodiments, the components of the electrode film mixture (e.g., carbon additives, active materials, binders, and liquids) may be substantially uniformly mixed and / or distributed in the mixture. In some embodiments, the electrode film material mixture may be substantially free of solvent residues.

[0063] In some embodiments, the carbon additive may be deaggregated and uniformly coated on the surface of the active particles. In some embodiments, uniformly coating the surface of the active particles with the carbon additive can improve the conductivity of the electrode, increase the surface energy attraction between the carbon additive and the binder, and improve the packing density of the carbon additive particles.

[0064] In some embodiments, the electrode film mixture may be formed by mixing a mixture containing a carbon additive and a binder with a carbon-activated material. In some embodiments, the binder material or binder may consist of essentially a single binder. In some embodiments, the binder material may be selected from the group consisting of polyvinylidene fluoride (PVDF), polytetrafluoroethylene (PTFE), copolymers thereof, and combinations thereof. In some embodiments, the conductive additive is activated carbon. In some embodiments, the mixture may contain additional silicon-activated material. In some embodiments, the mixture may contain carbon additives in amounts of 0.1% by weight, 0.2% by weight, 0.3% by weight, 0.4% by weight, 0.5% by weight, 0.6% by weight, 0.7% by weight, 0.8% by weight, 0.9% by weight, 1.0% by weight, 1.1% by weight, 1.2% by weight, 1.5% by weight, 2% by weight, 2.5% by weight, 3% by weight, 3.5% by weight, or 4% by weight, or approximately those values, or any range of values ​​between them, for example, about 0.1% by weight to about 4% by weight, where weight percent is based on the weight of the mixture.

[0065] In some embodiments, the mixture may contain a binder in amounts of 0.5% by weight, 1% by weight, 1.5% by weight, 2% by weight, 2.5% by weight, 3% by weight, 3.5% by weight, 4% by weight, 4.5% by weight, 4.9% by weight, 5% by weight, 5.5% by weight, 6% by weight, 6.5% by weight, 7% by weight, 7.5% by weight, 8% by weight, 8.5% by weight, 9% by weight, 9.5% by weight, or 10% by weight, or approximately those values, or any range of values ​​between them, for example, about 0.5% by weight to about 10% by weight, where weight percent is based on the weight of the mixture.

[0066] In some embodiments, the electrode film mixture can be formed by mixing a mixture (for example, the mixture may include a carbon additive, a binder, and a carbon active material) for a certain period of time using a mixing device. In some embodiments, the mixing time in the mixing chamber may be 200 seconds, 250 seconds, 300 seconds, 350 seconds, 365 seconds, 400 seconds, 450 seconds, 500 seconds, 550 seconds, or 600 seconds, or approximately those values, or any range of values ​​in between, for example, about 200 seconds to about 600 seconds. In some embodiments, mixing in the mixing chamber may be performed two or more times, such as two, three, four, five, six times, or any number of times as needed. In some embodiments, the mixing speed in the mixing chamber may be 500 rpm, 600 rpm, 700 rpm, 750 rpm, 800 rpm, 850 rpm, 900 rpm, 1000 rpm, 1100 rpm, 1200 rpm, 1300 rpm, 1400 rpm, or 1500 rpm, or approximately those values, or any range of values ​​in between, for example, about 500 rpm to about 1500 rpm. In some embodiments, the mixing blades in the mixing chamber may have a tip speed in the range of about 10 meters / min to about 40 meters / min.

[0067] In some embodiments, the electrode film mixture may be further diluted after it has been formed. In some embodiments, diluting the electrode film mixture may involve diluting the electrode film mixture to achieve a solid content of 20% by weight, 25% by weight, 30% by weight, 35% by weight, 40% by weight, 45% by weight, 50% by weight, 55% by weight, or 60% by weight, or approximately those values, or any range of values ​​between them, for example, about 20% by weight to about 60% by weight, where weight % is based on the weight of the electrode film mixture. In some embodiments, diluting the electrode film mixture may involve diluting the electrode film mixture to achieve a viscosity of 500 cp, 450 cp, 400 cp, 350 cp, 300 cp, 250 cp, 200 cp, 150 cp, or 100 cp, approximately those values, less than those values, or approximately less than those values, or any range of values ​​between them, for example, about 100 cp to about 500 cp. In some embodiments, dilution may be achieved by using a mixing device.

[0068] • Electrode film materials and electrode films Electrode film mixtures and electrode films formed using materials and / or air-pulverized materials are described herein. In some embodiments, the components of the active layer or electrode film may include particles such as composite materials. Particles for forming the active layer or electrode film may be combined with materials and / or air-pulverized materials to provide an electrode film mixture. In some embodiments, the active layer or electrode film may be formed from an electrode film mixture such that the weight percentage of the components of the active layer or electrode film is substantially the same as the weight percentage of the components of the electrode film mixture.

[0069] Active materials (e.g., cathode active materials, anode active materials) may be used in the preparation of electrode films and / or electrodes for energy storage devices.

[0070] In some embodiments, the active material is a cathode active material. In some embodiments, the cathode active material is selected from at least one of metal oxides, metal sulfides, sulfur-carbon composites, lithium metal oxides, and sulfur-containing materials. In some embodiments, the cathode active material is selected from lithium iron phosphate (i.e., LiFePO4 or "LFP"), lithium manganese iron phosphate (e.g., LiMn 0.6 Fe 0.4 PO4 or "LMFP"), lithium nickel manganese cobalt oxide (i.e., LiNi x Mn y Co 1-x-y O2 or "NMC"), lithium nickel cobalt aluminum oxide (i.e., LiNi x Co y Al z O2 or "NCA"), lithium manganese oxide ("LMO"), lithium nickel manganese oxide ("LNMO"), lithium cobalt oxide ("LCO"), lithium titanate ("LTO"), or a combination thereof. In some embodiments, the cathode active material includes at least two of LFP, LMFP, NMC, NCA, LMO, LNMO, LCO, LTO, and combinations thereof. In some embodiments, the cathode active material is an iron phosphate-based active material. In some embodiments, the iron phosphate-based active material includes LiFePO_{4} (i.e., "lithium iron phosphate" and "LFP") and LiMn 1-x Fe x PO4 (i.e., "lithium manganese iron phosphate" and "LMFP") (e.g., LiMn 0.6 Fe 0.4 PO4 or LiMn 0.8 Fe 0.2 PO4). In some embodiments, the iron phosphate-based active material includes LFP. In some embodiments, the iron phosphate-based active material includes LMFP. In some embodiments, the iron phosphate-based active material includes LFP and / or LMFP.

[0071] In some embodiments, the active material is an anode active material. In some embodiments, the anode active material may include, for example, an insert material (e.g., carbon, graphite and / or graphene), an alloying / dealloying material (e.g., silicon, silicon oxide, tin and / or tin oxide), a metal alloy or compound (e.g., Si-Al and / or Si-Sn), and / or a conversion material (e.g., manganese oxide, molybdenum oxide, nickel oxide and / or copper oxide). The anode active materials may be used alone or mixed together to form a multiphase material (e.g., Si-C, Sn-C, SiOx-C, SnOx-C, Si-Sn, Si-SiOx, Sn-SnOx, Si-SiOx-C, Sn-SnOx-C, Si-Sn-C, SiOx-SnOx-C, Si-SiOx-Sn, or Sn-SiOx-SnOx). Anode active materials include common natural graphite, synthetic or artificial graphite, surface-modified graphite, spherical graphite, flake graphite, and blends or combinations of these types of graphite, metallic elements and their compounds, as well as metal-C composites for anodes.

[0072] In some embodiments, the electrode film mixture and / or electrode film contains an amount of active material in the range of about 70% by weight, 75% by weight, 80% by weight, 85% by weight, 86% by weight, 87% by weight, 88% by weight, 89% by weight, 90% by weight, 91% by weight, 92% by weight, 93% by weight, 94% by weight, 95% by weight, 96% by weight, 97% by weight, 98% by weight, 98.5% by weight, 99% by weight, 99.5% by weight, 99.8% by weight, 99.9% by weight, approximately those values, at least those values, or at least approximately those values, or any value in between.

[0073] In some embodiments, the electrode film mixture and / or electrode film includes a carbon material configured to reversibly insert lithium ions. In some embodiments, the lithium-inserted carbon is selected from graphitic carbon, graphite, hard carbon, soft carbon, and combinations thereof. For example, the electrode film mixture and / or electrode film of an electrode may include a binder material, one or more of graphitic carbon, graphite, graphene-containing carbon, hard carbon, and soft carbon, and a conductivity-enhancing material. In some embodiments, the electrode is mixed with lithium metal and / or lithium ions. In some embodiments, the electrode includes an amount of carbon material in the range of 20% by weight, 15% by weight, 10% by weight, 9% by weight, 8% by weight, 7% by weight, 6% by weight, 5% by weight, 4% by weight, 3% by weight, 2% by weight, 1% by weight, approximately those values, up to those values, or up to approximately those values, or any value in between.

[0074] In some embodiments, the electrode film mixture and / or electrode film includes a conductive additive. In some embodiments, the conductive additive may include a conductive carbon additive such as carbon black. In some embodiments, the conductive carbon additive includes carbon black, carbon nanotubes, such as single-walled carbon nanotubes (SWCNTs) and multi-walled carbon nanotubes (MWCNTs). In some embodiments, the electrode film mixture and / or electrode film includes an amount of conductive additive in the range of 10% by weight, 9% by weight, 8% by weight, 7% by weight, 6% by weight, 5% by weight, 4% by weight, 3% by weight, 2% by weight, 1% by weight, 0.5% by weight, 0.25% by weight, 0.1% by weight, approximately those values, up to those values, or up to approximately those values, or any value in between. In some embodiments, each of the conductive additives is in an amount ranging from 10% by weight, 9% by weight, 8% by weight, 7% by weight, 6% by weight, 5% by weight, 4% by weight, 3% by weight, 2% by weight, 1% by weight, 0.5% by weight, 0.25% by weight, 0.1% by weight, approximately those values, up to those values, or up to approximately those values, or any value in between. In some embodiments, the conductive additive is carbon black.

[0075] In some embodiments, the electrode film mixture and / or electrode film comprises a binder or binder material. In some embodiments, the binder may include polytetrafluoroethylene (PTFE), polyolefins, polyalkylenes, polyethers, styrene-butadiene, polysiloxanes and polysiloxane copolymers, branched polyethers, polyvinyl ethers, carboxymethylcellulose (CMC), copolymers thereof, and / or combinations thereof. In some embodiments, the polyolefin may include polyethylene (PE), polypropylene (PP), polyvinylidene fluoride (PVDF), copolymers thereof, and / or combinations thereof. For example, the binder may include polyvinyl chloride, poly(phenylene oxide) (PPO), polyethylene-block-poly(ethylene glycol), poly(ethylene oxide) (PEO), poly(phenylene oxide) (PPO), polyethylene-block-poly(ethylene glycol), polydimethylsiloxane (PDMS), polydimethylsiloxane-coalkylmethylsiloxane, copolymers thereof, and / or combinations thereof. In some embodiments, the binder may include thermoplastic materials. In some embodiments, the binder includes fibrillable polymers and / or fibrillated polymers. In certain embodiments, the binder includes, is essentially made from, or consists of a single fibrillable binder and / or fibrillated binder, such as PTFE. In some embodiments, the electrode film mixture and / or electrode film contains a binder in an amount ranging from 1% by weight, 2% by weight, 3% by weight, 4% by weight, 5% by weight, 6% by weight, 7% by weight, 8% by weight, 9% by weight, 10% by weight, approximately those values, up to those values, or up to approximately those values, or any value in between.

[0076] In some embodiments, the electrode film may be a wet-processed electrode film. In some embodiments, the electrode film is prepared by a wet or slurry-based electrode fabrication process. In some embodiments, the electrode film of the Disclosure may be a dry-processed electrode film. In some embodiments, the electrode film is prepared by a dry electrode fabrication process. As used herein, a dry electrode fabrication process may refer to a process that forms a dry electrode film without the use of a solvent, or substantially without the use of a solvent. For example, the components of the active layer or electrode film, comprising a carbon material and a binder, may include, consist of, or be essentially composed of dry particles. Dry particles for forming an active layer or electrode film may be combined to provide a dry particle active layer mixture. In some embodiments, the active layer or electrode film may be formed from a dry particle active layer mixture such that the weight percentage of the components of the active layer or electrode film is substantially the same as the weight percentage of the components of the dry particle active layer mixture. In some embodiments, the active layer or electrode film formed from a dry particle active layer mixture using a dry fabrication process may not contain, or substantially contain, any processing additives such as solvents and the resulting solvent residues. In some embodiments, the resulting active layer or electrode film is a self-supporting film formed using a drying process from a dry particle mixture. In some embodiments, the resulting active layer or electrode film is a free-standing film formed using a drying process from a dry particle mixture. The process for forming the active layer or electrode film may include fibrillating a fibrillable binder component so that the film contains a fibrillated binder. In further embodiments, the free-standing active layer or electrode film may be formed in the absence of a current collector. In even further embodiments, the active layer or electrode film may include a fibrillated polymer matrix so that the film is self-supporting. It is conceivable that a matrix, lattice, or web of fibrils can be formed to provide a mechanical structure to the electrode film.

[0077] In some embodiments, the electrode film is placed on a current collector to form an electrode. In some embodiments, the current collector may include a metallic material such as aluminum, nickel, copper, or a combination thereof. In some embodiments, the current collector may include a pure metal. In some embodiments, the current collector may include a metallized polymer film or a metal-coated polymer film. In some embodiments, the polymer may include polyethylene terephthalate (PET), biaxially oriented polypropylene (BOPP), or a combination thereof. In some embodiments, the metal coating may include aluminum. In some embodiments, coating the final electrode film mixture may involve forming a uniform electrode film mixture coating. In some embodiments, the current collector may have a thickness of 200 μm, 100 μm, 50 μm, 40 μm, 30 μm, 20 μm, 15 μm, 10 μm, 5 μm, approximately those values, maximum those values, maximum approximately those values, or any range of values ​​in between.

[0078] • Electrodes and energy storage devices An energy storage system or device includes a positive electrode (i.e., a cathode), a negative electrode (i.e., an anode), a separator placed between them, and an electrolyte placed within a housing. Each electrode includes an electrode film placed on a current collector. In some embodiments, the current collector is foil. In some embodiments, the current collector is aluminum foil, copper foil, or a combination thereof. In some embodiments, the current collector may include a metallic material such as aluminum, nickel, copper, or a combination thereof. In some embodiments, the current collector includes a pure metal. In some embodiments, the current collector includes a metallized polymer film or a metal-coated polymer film. In some embodiments, the polymer includes polyethylene terephthalate (PET), biaxially oriented polypropylene (BOPP), or a combination thereof. In some embodiments, the metal coating includes aluminum. In some embodiments, coating the final electrode film mixture includes forming a uniform electrode film mixture coating. In some embodiments, the current collector has a thickness of 200 μm, 100 μm, 50 μm, 40 μm, 30 μm, 20 μm, 15 μm, 10 μm, 5 μm, approximately those values, maximum those values, maximum approximately those values, or any range of values ​​in between. In some embodiments, an active layer is disposed on both sides of the current collector.

[0079] In some embodiments, the electrode is a double-sided electrode. In some embodiments, the double-sided electrode includes two electrode films. In some embodiments, the double-sided electrode may include a current collector, an upper electrode film, and a lower electrode film. In some embodiments, each of the two electrode films may have any suitable shape, size, and thickness.

[0080] In some embodiments, the energy storage device includes a separator, an anode electrode, a cathode electrode, an electrolyte, and a housing, wherein the electrolyte, separator, anode electrode, and cathode electrode are arranged within the housing, and the separator is positioned between the anode electrode and the cathode electrode. In some embodiments, the energy storage device is formed by arranging the electrolyte, separator, anode electrode, and cathode electrode described herein within a housing, with the separator positioned between the anode electrode and the cathode electrode.

[0081] The electrode assembly includes a cathode, an anode, and a separator positioned between the anode and the cathode. In some embodiments, the electrode assembly is a wound electrode (i.e., a spiral electrode) assembly (e.g., a jelly roll). In some embodiments, the energy storage device is selected from the group consisting of cylindrical energy storage devices, laminated prism-type energy storage devices, and helically wound prism-type energy storage devices.

[0082] Normalized circularity may be used to identify and / or correlate relatively weak core spots (e.g., spots that may cause electrode buckling) in a wound electrode assembly. The normalized circularity of a non-ideal helix is ​​defined as the minimum ratio between the non-ideal (actual) geometric shape and the ideal geometric shape at each point, according to the following formula:

number

[0083] The non-ideal (actual) spiral shape is given by measured Cartesian and polar coordinates (x, y, θ, r), while the ideal spiral shape is derived from the Archimedean spiral according to r = αθ + β. The geometric shape of the spiral (ideal or non-ideal) can be characterized by curvature (K), such as the following polar curvature parameterization.

number

[0084] In some embodiments, the electrode assembly is 0.7, 0.705, 0.71, 0.715, 0.72, 0.725, 0.73, 0.735, 0.74, 0.745, 0.75, 0.76, 0.77, 0.78, 0.79, 0.8, 0.805, 0.81, 0.815, 0.82, 0.825, 0.83, 0.835, 0.84, 0.845, 0.85 , 0.86, 0.87, 0.88, 0.89, 0.90, 0.91, 0.92, 0.93, 0.94, 0.95, 0.96, 0.97, 0.98, 0.99, 1, 1.05, 1.1, 1.15, 1.2, including normalized circularity values ​​of approximately those values, at least those values, or at least approximately those values, or any range of values ​​between them.

[0085] The electrodes disclosed herein can be used in energy storage devices. In some embodiments, the energy storage device includes a separator, an anode electrode, a cathode electrode, an electrolyte, and a housing, wherein the electrolyte, separator, anode electrode, and cathode electrode are arranged within the housing, and the separator is positioned between the anode electrode and the cathode electrode. In some embodiments, the energy storage device is formed by arranging the electrolyte, separator, anode electrode, and cathode electrode described herein within the housing, with the separator positioned between the anode electrode and the cathode electrode. In some embodiments, the energy storage device includes an anode electrode positioned between two cathode electrodes. In some embodiments, the anode electrode and / or cathode electrode includes a molded electrode film. In some embodiments, the energy storage device is a lithium-ion battery. In some embodiments, the energy storage device may be a battery, a capacitor, a capacitor-battery hybrid, a fuel cell, or a combination thereof. In some embodiments, the energy storage system or energy storage device may be used in electromobility. In some embodiments, the energy storage device can be used in vehicles including hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), and / or electric vehicles (EVs). In some embodiments, the energy storage device used in vehicles including hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), and / or electric vehicles (EVs) reduces greenhouse gas emissions.

[0086] In some embodiments, the energy storage device is charged with a suitable lithium-containing electrolyte. For example, the energy storage device may contain a lithium salt and a solvent such as a non-aqueous solvent or an organic solvent. Generally, the lithium salt contains a redox-stable anion. In some embodiments, the anion may be monovalent. In some embodiments, the lithium salt can be selected from lithium hexafluorophosphate (LiPF6), lithium bis(trifluoromethanesulfonyl)imide (LiFSI), lithium tetrafluoroborate (LiBF4), lithium perchlorate (LiClO4), lithium bis(trifluoromethanesulfonyl)imide (LiN(SO2CF3)2), lithium trifluoromethanesulfonate (LiSO3CF3), lithium bis(oxalato)borate (LiB(C2O4)2), lithium bis(fluorosulfonyl)imide (LiN(SO2F)2), lithium difluoro(oxalato)borate (LiC2BF2O4), and combinations thereof. In some embodiments, the electrolyte may include a quaternary ammonium cation and an anion selected from the group consisting of hexafluorophosphate, tetrafluoroborate, and iodide. In some embodiments, the salt concentration may be about 0.1 mol / L(M) to about 5 M, about 0.2 M to about 3 M, or about 0.3 M to about 2 M. In further embodiments, the salt concentration of the electrolyte may be about 0.7 M to about 2 M. In certain embodiments, the salt concentration of the electrolyte may be about 0.2 M, about 0.3 M, about 0.4 M, about 0.5 M, about 0.6 M, about 0.7 M, about 0.8 M, about 0.9 M, about 1 M, about 1.1 M, about 1.2 M, 1.3 M, 1.4 M, 1.5 M, or values ​​in between.

[0087] In some embodiments, the energy storage device may include a liquid solvent. The solvent does not need to dissolve all components of the electrolyte, nor does it need to completely dissolve any of the components. In further embodiments, the solvent may be an organic solvent. In some embodiments, the solvent may include one or more functional groups selected from dioxathiolanes (e.g., 1,3,2-dioxathiolane-2,2-dioxide (i.e., "DTD")), carbonates, ethers, and / or esters. In some embodiments, the solvent may include a carbonate. In further embodiments, the carbonate can be selected from cyclic carbonates, such as ethylene carbonate (EC), propylene carbonate (PC), vinylethylene carbonate (VEC), vinylene carbonate (VC), fluoroethylene carbonate (FEC), and combinations thereof, or from acyclic carbonates, such as dimethyl carbonate (DMC), diethyl carbonate (DEC), ethyl methyl carbonate (EMC), 1,3-propensultone (PRS), and combinations thereof. In some embodiments, the solvent can include an ester. In some embodiments, the ester can be selected from methyl acetate (MA), methyl propionate (MP), ethyl acetate (EA), methyl butyrate (MB), and combinations thereof. In some embodiments, the solvent may include EC, PC, VEC, VC, FEC, DMC, DEC, EMC, MA, MP, EA, MB, and combinations thereof. In some embodiments, the solvent may include EC, DMC, DEC, EMC, MA, and combinations thereof. In some embodiments, the solvent may include EC, DMC, EMC, and combinations thereof. In some embodiments, the solvent may contain EC:DMC:EMC in a ratio of 10-30:0-90:0-70.

[0088] In some embodiments, one or more solvents can be used in concentrations of 30% by weight, 35% by weight, 40% by weight, 45% by weight, 50% by weight, 55% by weight, 60% by weight, 65% by weight, 70% by weight, 75% by weight, 80% by weight, 85% by weight, or 90% by weight, approximately those values, at least those values, or at least approximately those values, or any range of values ​​in between. In some embodiments, the solvent is used as an additive in the electrolyte system and can be used in concentrations ranging from 0.1% by weight, 0.2% by weight, 0.3% by weight, 0.4% by weight, 0.5% by weight, 0.6% by weight, 0.7% by weight, 0.8% by weight, 0.9% by weight, 1% by weight, 1.1% by weight, 1.2% by weight, 1.3% by weight, 1.4% by weight, 1.5% by weight, 1.6% by weight, 1.7% by weight, 1.8% by weight, 1.9% by weight, 2% by weight, 2.1% by weight, 2.2% by weight, 2.3% by weight, 2.4% by weight, 2.5% by weight, 2.6% by weight, 2.7% by weight, 2.8% by weight, 2.9% by weight, 3% by weight, 4% by weight, 5% by weight, 6% by weight, 7% by weight, 8% by weight, 9% by weight, or 10% by weight, approximately those values, up to those values, or up to approximately those values, or any range of values ​​in between. For example, in some embodiments, the amount of additive in the electrolyte is one of the following ranges, or approximately one of the following ranges: 0.1 to 10% by weight, 1 to 6% by weight, 2 to 5% by weight, 0.1 to 6% by weight, 2 to 8% by weight, 2 to 3% by weight, or 1 to 4% by weight.

[0089] In some embodiments, the energy storage device is constructed such that one electrode (e.g., the anode) is larger and overhangs the other electrode (e.g., the cathode). One electrode may overhang more than the other in the winding direction and / or non-winding direction of the electrode assembly. Such electrode overhangs can avoid yield losses. In some embodiments, if there is no or substantially no overlap and / or mixing of the separator and the molded electrode film (e.g., the cathode electrode film), the boundary of the molded electrode film is easier to identify, and therefore the ability to form a counter electrode (e.g., the anode electrode) with an overhang is improved. [Examples]

[0090] Exemplary embodiments of the present disclosure, including processes, materials, and / or products obtained, are described in the following examples.

[0091] • Example 1 - Particle size analysis Figure 6 is a data plot showing the deaggregation of the binder material based on volume % and size, which measures particle fragmentation. As shown in Figure 6, the PTFE binder material can be air-ground at various pressures to adjust its particle size distribution. Particle fragmentation was measured using a particle size analyzer, and high fragmentation indicated a change in particle size distribution.

[0092] Figure 7 is a data plot showing the particle size distribution of air-pulverized and unpulverized binder materials based on cumulative volume % and particle size. As shown in Figure 7, air-pulverized binder materials exhibit improved uniformity of particle size distribution, which can result in improved cohesiveness of the electrode film structure.

[0093] • Example 2 - Flow rate profile and pressure profile Figure 8A is a flow vector diagram showing the flow rate of the binder material moving through the air pulverizer. Figure 8B is a schematic diagram comparing the air channel and the powder channel.

[0094] Figure 9 is a data plot showing the pressure profile of air flowing from the air grinding chamber to the mixing chamber. This data plot is based on CFD (Computational Fluid Dynamics). As shown in Figure 9, the data exhibits the Venturi effect, indicating that the fluid velocity increases and the pressure decreases as the material or gas passes through the constriction of the air grinding chamber. The pressure was measured along the center of the air grinding chamber. Pressurized cooling air supplied into the annulus accelerates the internal gas within the air grinding chamber, creating a localized vacuum (e.g., negative static pressure) that helps guide the material into the air grinding chamber. Air grinding was achieved by a combination of particle / gas friction shear, particle acceleration, and particle collisions with other material particles and the walls of the air grinding chamber.

[0095] • Example 3 - Mixing Profile The particle size of the PTFE binder was altered by adjusting and regulating the pressure of the air pulverizer. Increasing the pressure resulted in finer PTFE particles (i.e., powder). Figure 10A is an energy-dispersive spectroscopy (EDS) image of the unpulverized binder material (i.e., using initial state PTFE) after standard homogenization. Figure 10B is an EDS image of the air-pulverized binder material (i.e., 140 kPa pulverized PTFE) after 3 minutes of homogenization. As shown in Figures 10A and 10B, the fibril size was larger in the case of the unpulverized PTFE binder, as indicated by the strong fluorescence signal. Compared to the unpulverized PTFE binder, the air-pulverized PTFE binder showed shorter homogenization and fibrillation mixing times. Figure 10C is a data plot showing the predicted standard deviation against linear velocity for various air-pulverized and unpulverized binder materials.

[0096] Figure 11A is a data plot showing the amount of bound and unbound fibrillated binder in weight %, based on sieve opening. The amount of unbound binder particles was shown using a sieve tray. Unbound binder particles smaller than 63 μm passed through the sieve tray. As shown in Figure 11A, the majority (weight %) of unground fibrillated binder particles passed through the sieve tray, indicating a low number of bound binders. In comparison, the majority (weight %) of air-ground fibrillated binder particles were captured in the sieve tray, indicating a high number of bound binders.

[0097] Figure 11B is a scanning electron microscope (SEM) image of the unpulverized binder material on a rigid cathode. Figure 11C is a scanning electron microscope (SEM) image of the air-pulverized binder material on a rigid cathode. As shown in Figures 11B and 11C, when the electrode film mixture was treated with the unpulverized binder material, large fibrils with a small surface area were formed, while when the electrode film mixture was treated with the air-pulverized binder material, the fibrils were smaller with a larger surface area and greater binding ability.

[0098] While specific embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of this disclosure. In fact, the novel methods and systems described herein can be embodied in various other forms. Furthermore, various omissions, substitutions, and modifications of systems and methods can be made without departing from the spirit of this disclosure. The appended claims and their equivalents are intended to encompass forms or modifications that fall within the scope and spirit of this disclosure. Accordingly, the scope of the present invention is defined solely by reference to the appended claims.

[0099] Any feature, material, property, or group described in relation to a particular aspect, embodiment, or example should be understood to be applicable to any other aspect, embodiment, or example described in this section or elsewhere in this specification, unless otherwise compatible. All features disclosed herein (including the appended claims, abstract, and drawings) and / or all steps of any method or process so as to be disclosed may be combined in any combination, except for any combination in which at least some of such features and / or steps are mutually exclusive. The protection is not limited to the details of any of the aforementioned embodiments. The protection extends to any novel features or any novel combination of features disclosed herein (including the appended claims, abstract, and drawings), or any novel steps or any novel combination of any method or process so as to be disclosed.

[0100] Furthermore, certain features described in this disclosure in the context of separate embodiments may also be implemented in combination in a single embodiment. Conversely, various features described in the context of a single embodiment may also be implemented separately or in any suitable partial combination in multiple embodiments. Furthermore, while features may be described above as acting in a particular combination, one or more features from a claimed combination may, in some cases, be removed from the combination, and the combination may be claimed as a partial combination or a variation of a partial combination.

[0101] Furthermore, while operations may be shown in the drawings or described herein in a specific order, such operations do not need to be performed in the specific order shown or in a sequential order to achieve the desired result, nor do all operations need to be performed. Other operations not shown or described may be incorporated into exemplary methods and processes. For example, one or more additional operations may be performed before, after, simultaneously with, or in between any of the described operations. Furthermore, operations may be rearranged or changed in other embodiments. Those skilled in the art will understand that in some embodiments, the actual steps performed in the illustrated and / or disclosed processes may differ from those shown in the drawings. Depending on the embodiment, certain steps among the steps described above may be omitted, or other steps may be added. Furthermore, the features and attributes of the particular embodiments disclosed above may be combined in different ways to form additional embodiments, all of which fall within the scope of this disclosure. Also, the separation of various system components in the embodiments described above should not be understood as requiring such separation in all embodiments, and the described components and systems may generally be integrated together in a single product or packaged in multiple products. For example, any of the components of the energy storage system described herein may be provided separately or integrated (e.g., packaged together or mounted together) to form the energy storage system.

[0102] For the purposes of this disclosure, certain aspects, advantages, and novel features are described herein. Not all such advantages can necessarily be achieved according to any particular embodiment. Accordingly, for example, a person skilled in the art will understand that this disclosure can be embodied or implemented to achieve one or more advantages taught herein without necessarily achieving other advantages that can be taught or suggested herein.

[0103] Conditional language such as “can,” “could,” “might,” or “may,” unless otherwise specified or understood to mean otherwise in the context in which they are used, is generally intended to convey that a particular embodiment includes certain features, elements, and / or steps, but other embodiments do not. Therefore, such conditional language does not generally imply that features, elements, and / or steps are required in any way in one or more embodiments, or that one or more embodiments necessarily include logic for determining whether these features, elements, and / or steps should be included in or performed in any particular embodiment, with or without user input or prompting.

[0104] Conjunctions such as the phrase "at least one of X, Y, and Z," are generally understood in contexts where they are used to convey that an item, term, etc., could be any of X, Y, or Z, unless otherwise specified. Therefore, such conjunctions are not generally intended to imply that a particular embodiment requires the presence of at least one X, at least one Y, and at least one Z.

[0105] As used herein, the terms “approximately,” “about,” “generally,” and “substantially” refer to values, quantities, or characteristics close to the stated values, quantities, or characteristics that still perform the desired function or achieve the desired result. For example, the terms “approximately,” “about,” “generally,” and “substantially” may refer to quantities less than 10%, less than 5%, less than 1%, less than 0.1%, and less than 0.01% of the stated quantity, depending on the desired function or desired result.

[0106] The scope of this disclosure is not intended to be limited by any specific disclosure of preferred embodiments in this section or elsewhere in this specification, but may be defined by the claims, as presented in this section or elsewhere in this specification, or as presented in the future. The language of the claims should be interpreted broadly on the basis of the language used in the claims, and not limited to the examples described herein or during the examination of an application, and the examples should be interpreted as non-exclusive.

Claims

1. A method for processing an electrode film mixture, A step of pneumatically grinding a binder material by applying a temperature-controlled gas in an air grinding apparatus to form an air-ground binder material, wherein the air grinding apparatus comprises an air grinding chamber and a pressurized insert disposed within the air grinding chamber, the air grinding apparatus is attached to a mixing apparatus comprising a mixing chamber, and the pressurized insert comprises an outlet configured to provide fluid communication between the air grinding chamber and the mixing chamber, The steps include dispersing the air-pulverized binder material in a mixing chamber containing an active material, The steps include mixing the air-pulverized binder material and the active material in the mixing chamber to form an electrode film material mixture, Methods that include...

2. A system for processing electrode film mixtures, A mixing apparatus including a mixing chamber, An air grinding apparatus comprising an air grinding chamber and a pressurized insert disposed within the air grinding chamber, wherein the air grinding apparatus is attached to a mixing apparatus, and the pressurized insert includes an outlet configured to provide fluid communication between the air grinding chamber and the mixing chamber, A system equipped with these features.

3. The system according to claim 2, wherein the outlet includes a dispersion nozzle.

4. The system according to claim 2, wherein the mixing device is a fluidized bed mixing device.

5. The system according to claim 2, wherein the mixing chamber includes a mixing blade.

6. The system according to claim 2, further comprising a pressurized tank in fluid communication with the aforementioned air pulverizer.

7. A method for preparing an electrode film mixture, The process involves the steps of: air-pulverizing the material to form an air-pulverized material, The steps include dispersing the air-pulverized material in a mixing chamber containing an active material, The steps include mixing the air-pulverized material and the active material in the mixing chamber to form an electrode film material mixture, Methods that include...

8. The method according to claim 7, further comprising the step of supplying the air-pulverized material to the mixing chamber by gravity.

9. The method according to claim 7, further comprising the step of pre-mixing the material with a conductive additive.

10. The method according to claim 7, wherein the step of mixing the air-pulverized material and the active material in the mixing chamber is carried out by a high-shear process.

11. The aforementioned air-pulverized material has a particle size of less than approximately 30 μm. ５０ The method according to claim 7, having an average particle size distribution.

12. The method according to claim 7, wherein air pulverization includes applying a temperature-controlled gas to the material.

13. The method according to claim 12, wherein the temperature-controlled gas includes a gas selected from the group consisting of hydrogen gas, nitrogen gas, argon gas, oxygen gas, and combinations thereof.

14. The method according to claim 7, wherein the aerial pulverization of the material is performed at a gauge pressure of 0.1 atm to 4 atm.

15. The method according to claim 7, wherein the mixing is carried out at a temperature of at least about 20°C.

16. The method according to claim 7, further comprising the step of coating the active material with a carbon material before dispersion or mixing.

17. The method according to claim 16, wherein the carbon material includes activated carbon.

18. The method according to claim 7, wherein the active material is selected from the group consisting of graphite, lithium nickel manganese cobalt oxide (NMC), lithium nickel cobalt aluminum oxide (NCA), and combinations thereof.

19. The method according to claim 7, further comprising the step of pre-treating the material before air pulverization.

20. The method according to claim 19, wherein the pretreatment includes temperature control of the material to a temperature of approximately -200 to 300°C.

21. The method according to claim 7, wherein the material is a binder material.

22. The method according to claim 21, wherein the binder material includes a dry fibrillable binder.

23. The method according to claim 21, wherein the binder material is selected from the group consisting of polytetrafluoroethylene (PTFE), polyethylene (PE), polypropylene (PP), polyvinylidene fluoride (PVDF), polyvinyl chloride, poly(phenylene oxide) (PPO), polyethylene-block-poly(ethylene glycol), poly(ethylene oxide) (PEO), poly(phenylene oxide) (PPO), polyethylene-block-poly(ethylene glycol), polydimethylsiloxane (PDMS), polydimethylsiloxane-coalkylmethylsiloxane, polyalkylene, polyether, styrene-butadiene, styrene-butadiene rubber (SBR), carboxymethylcellulose (CMC), copolymers of polysiloxane and polysiloxane, branched polyether, polyvinyl ether, copolymers thereof, and combinations thereof.

24. The method according to claim 7, wherein the electrode film material mixture substantially contains no solvent residue.

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