Thermal management assembly for sliding applications

Abstract

We provide thermal management assemblies or thermal solutions for sliding applications (e.g., those with improved durability). [Solution] In exemplary embodiments, the thermal management assembly or thermal solution is robust and improves heat transfer between a sliding heat source and a fixed heat sink via a durable layer (e.g., a metal wear-resistant layer formed from stainless steel, copper, beryllium copper, aluminum, brass, other metal substrates or covers, or other materials having high thermal conductivity and puncture resistance in addition to wear resistance) disposed on or along a thermal interface material (broadly defined as an interface material) (e.g., a thermal phase change material (PCM)), thereby providing a durable, slide-resistant thermal interface material (TIM) with improved performance compared to conventional thermal solutions.

Description

Technical Field

[0001] The present disclosure generally relates to thermal management assemblies and thermal solutions (e.g., those with improved durability, etc.) for sliding applications.

Background Art

[0002] This section provides background information related to the present disclosure, which is not necessarily prior art. Electrical components such as semiconductors, integrated circuit packages, and transistors typically have a pre-designed temperature at which the electrical components operate optimally. Ideally, the pre-designed temperature is close to the temperature of the surrounding air. However, the operation of electrical components generates heat. If the heat is not removed, the electrical components may operate at a temperature significantly higher than the normal or desired operating temperature. Such excessive temperatures can potentially have an adverse effect on the operating characteristics of the electrical components and the operation of the associated devices.

[0003] To avoid or at least mitigate the adverse operating characteristics due to heat generation, it is necessary to remove heat, for example, by conducting heat from the operating electrical component to a heat sink. The heat sink can then be cooled by conventional convection and / or radiation techniques. During conduction, heat can be transferred from the operating electrical component to the heat sink by direct surface contact between the electrical component and the heat sink and / or by contact between the electrical component and the heat sink surface through an intermediate medium or a thermal interface material (TIM). To enhance the heat transfer efficiency compared to filling the gap with air having a relatively low thermal conductivity., a thermal interface material can be used to fill the gap between the heat transfer surfaces.

Brief Description of the Drawings

[0004] The drawings described herein are for the purpose of illustrating only selected embodiments and are not intended to show all possible embodiments, nor are they intended to limit the scope of the present disclosure. [Figure 1] This figure shows an exemplary embodiment of a thermal management assembly or thermal solution that includes a metal wear-resistant layer (broadly speaking, a durability layer) (e.g., a stainless steel substrate, another metal substrate, etc.) and a thermal interface material (TIM) (broadly speaking, an interface material) (e.g., a thermal phase change material (PCM), etc.) below the metal wear-resistant layer, thereby improving the durability of the TIM. [Figure 2] Figure 1 is a partial cross-sectional view showing a thermal interface material (TIM) (or more broadly, an interface material) (e.g., a thermal phase change material (PCM)) positioned beneath the metal wear-resistant layer according to an exemplary embodiment. The metal wear-resistant layer improves the durability of the TIM between the sliding heat source and the fixed heat sink when the heat source slides along the metal wear-resistant layer against the heat sink and in physical sliding contact with the metal wear-resistant layer (e.g., during insertion, removal, and reinsertion). [Figure 3] Figure 1 shows a removable protective liner (e.g., protective foil) placed on top of the thermal interface material according to an exemplary embodiment. Figure 3 also shows first and second adhesive material strips or lines (e.g., pressure-sensitive adhesive) placed adjacent to the first and second (or front and rear) ends on both sides of the protective liner placed on top of the TIM. [Figure 4] Figure 1 shows an exemplary tab configured to facilitate the removal of a removable protective liner (e.g., protective foil) placed on top of a thermal interface material according to an exemplary embodiment. [Figure 5] This chart shows the relationship between the time-zero normalized thermal resistance (Rth / initial Rth) from the initial insertion and the number of reinsertions for a thermal management assembly or thermal solution, according to exemplary embodiments of the present disclosure, which includes a metal wear-resistant layer (broadly defined as a durability layer) (e.g., a stainless steel substrate, another metal substrate, etc.) and a thermal interface material (TIM) (broadly defined as an interface material) (e.g., a thermal phase change material (PCM), etc.) beneath the metal wear-resistant layer. [Figure 6] The results of three test samples of a thermal management assembly or thermal solution, each comprising a metallic wear-resistant layer (broadly defined as a durable layer) (e.g., a stainless steel substrate, another metal substrate, etc.) and a thermal interface material (TIM) (broadly defined as an interface material) (e.g., a thermal phase change material (PCM), etc.) beneath the metallic wear-resistant layer, are shown. Each sample was visually inspected every 100 insertions up to 500 insertions. As shown in Figure 6, no tearing was observed after the harsh insertion cycle. [Modes for carrying out the invention]

[0005] Through several figures in the drawings, corresponding reference numbers may indicate corresponding (but not necessarily identical) components. The exemplary embodiments will be described in more detail below with reference to the attached drawings.

[0006] Exemplary embodiments of thermal management assemblies or thermal solutions for sliding applications are disclosed. In the exemplary embodiments, the thermal management assembly or thermal solution is robust and improves heat transfer between a sliding heat source and a fixed heat sink via a durable layer (e.g., a metal wear-resistant layer formed from stainless steel, copper, beryllium copper, aluminum, brass, other metal substrates or covers, or other materials having high thermal conductivity and puncture resistance in addition to wear resistance) disposed on or along a thermal interface material (broadly speaking, interface material) (e.g., a thermal phase change material (PCM)), thereby providing a durable, sliding-resistant thermal interface material (TIM) with improved performance compared to conventional thermal solutions.

[0007] In exemplary embodiments, a thermal interface material (TIM) assembly (broadly speaking, a thermal management assembly or thermal solution) is mounted on a heat sink (broadly speaking, a heat removal / heat dissipation structure). The TIM assembly includes a wear-resistant metal layer (broadly speaking, a durable layer) (e.g., stainless steel, another metal) on and / or along the thermal interface material (broadly speaking, an interface material) (e.g., a thermal phase change material (PCM)). The wear-resistant metal layer protects the TIM as a heat source slides in and out of a predetermined position relative to the TIM assembly and heat sink. The wear-resistant metal layer may have a thickness in the range of about 17.5 microns to about 300 microns. The thermal interface material applied inside the wear-resistant metal layer may have a thermal conductivity in the range of about 1 watt per meter per kelvin (W / m·K) to about 50 W / m·K.

[0008] Once the heat source is slidably inserted relative to the TIM assembly, heat can be conducted along a defined heat transfer path through the wear-resistant metal layer, the TIM layer, to the heat sink. The TIM assembly can be held in place relative to the heat sink by a series of notches, dimples (or other similar self-locking mechanisms, retaining mechanisms, latching mechanisms, snap-latch mechanisms, etc., used to hold the shield cover to the frame / fence of the board-level shield (BLS)), and adhesive portions. The notch-dimple design (or other suitable mounting means / mechanism) allows for quick and easy alignment during installation, while also taking into account the bending required to conform to or shape the surface topology of the heat source.

[0009] As disclosed herein, a metal wear-resistant layer (e.g., stainless steel or other metal substrate or cover) may include dimples or bumps (broadly speaking, inwardly projecting portions, protrusions, or retaining members) arranged along spaced-apart fingers (e.g., elastic spring fingers). The dimples or bumps are configured to engage, be received, held, latched, or locked into notches or sockets (broadly speaking, openings or recesses) arranged along the corresponding fingers of a heat sink, for example, by pressing the TIM assembly against the heat sink. The engagement of the dimples or bumps of the metal wear-resistant layer into the notches or sockets of the heat sink assists in aligning and holding the TIM assembly relative to the heat sink. After the dimples or bumps of the metal wear-resistant layer engage within the notches or sockets of the heat sink, heat may be applied to the TIM assembly for purposes such as setting the TIM, curing the TIM (e.g., via chemical reactions during the heating process), melting the TIM, burning in the TIM, changing the phase of the TIM, softening the TIM, thinning the TIM, and / or wetting the surface.

[0010] Advantageously, the use of a stainless steel or other metal abrasion-resistant layer to protect the thermal interface material (broadly speaking, the interface material) improves durability compared to a polyimide film which is susceptible to tearing. Furthermore, the use of a stainless steel or other metal abrasion-resistant layer to protect the interface material also improves thermal performance compared to conventional thermal solutions in which a polyimide film is used to provide an abrasion-resistant layer to protect the thermal interface material. Additionally, the use of dimples or bumps (broadly speaking, inwardly projecting portions, protrusions, or retaining members) along spaced fingers (e.g., elastic spring fingers) configured to engage and be received, held, latched, or locked within notches or sockets (broadly speaking, openings or recesses) along the corresponding fingers of the heatsink facilitates alignment and positioning during assembly, improving manufacturability.

[0011] Referring here to the drawings, Figures 1 to 4 show exemplary embodiments of a thermal management assembly 100 or thermal solution, which includes a metal wear-resistant layer 104 (broadly speaking, a durable layer) (e.g., a stainless steel substrate, another metal substrate, etc.) and a thermal interface material (TIM) 108 (broadly speaking, an interface material) (e.g., a thermal phase change material (PCM), etc.) positioned beneath the metal wear-resistant layer 104. The metal wear-resistant layer 104 improves the durability of the thermal interface material 108 between the sliding heat source and the heat sink 112 when the heat source slides along the metal wear-resistant layer 104 against the heat sink 112 and in physical sliding contact with the metal wear-resistant layer (e.g., during insertion, removal, reinsertion, etc.).

[0012] In Figure 1, the thermal management assembly 100 is shown mounted on the pedestal of the heatsink 112. Alternatively, the thermal management assembly 100 may be mounted in a different manner, for example, on a different heatsink, on a different heat removal / heat dissipation component, or on a heat source or other component.

[0013] The metal wear-resistant layer 104 includes dimples or bumps 116 (broadly defined as inwardly projecting portions, protrusions, or retaining members) along spaced-apart fingers 120 (e.g., elastic spring fingers) (broadly defined as sidewall portions). The dimples or bumps 116 are configured to engage with, be received, held, latched, or locked into notches or sockets 124 (broadly defined as openings or recesses) along the corresponding fingers (broadly defined as sidewall portions) of the heatsink 112, for example, by pressing the thermal management assembly 100 onto the heatsink 112. The engagement of the dimples or bumps 116 of the metal wear-resistant layer 104 into the notches or sockets 124 of the heatsink 112 helps to align and hold the thermal management assembly 100 relative to the heatsink 112. After the dimples or bumps 116 of the metal wear-resistant layer 104 engage with the notches or sockets 124 of the heat sink 112, heat may be applied to the thermal management assembly 100 for purposes such as setting the thermal interface material 108, curing the thermal interface material 108 (e.g., via chemical reactions during the heating process), melting the TIM, burning in the TIM, changing the phase of the thermal interface material 108, softening the thermal interface material 108, thinning the thermal interface material 108, and / or wetting the surface.

[0014] Alternative embodiments may have configurations different from those shown in the drawings. For example, another exemplary embodiment may include a stainless steel substrate forming a wear-resistant layer, the stainless steel substrate not including spaced dimples or bumps along the fingers configured to engage with, be received, held, latched, or lock into notches or sockets along the corresponding fingers of the heatsink. Other exemplary embodiments may include a metal wear-resistant layer having other suitable means, mechanisms, or features for aligning and mounting the assembly to the heatsink (e.g., stoppers, full-dimples, half-dimples, non-circular dimples, latches, other means for mounting a board-level shielding (BLS) cover to a frame / fence), instead of, or in addition to, the dimples or bumps in the wear-resistant layer and the notches or sockets in the heatsink.

[0015] Figure 2 shows a thermal interface material (TIM) 108 (broadly speaking, interface material) (e.g., a thermal phase change material (PCM)) positioned beneath the metal wear-resistant layer 104 according to an exemplary embodiment of Figure 1. The metal wear-resistant layer 104 improves the durability of the thermal interface material 108 between the sliding heat source and the heat sink 112 when the heat source slides along the metal wear-resistant layer 104 against the heat sink 112 and in physical sliding contact with the metal wear-resistant layer (e.g., during insertion, removal, reinsertion, etc.).

[0016] Figure 3 shows a removable protective liner 128 (e.g., protective foil) positioned on top of the thermal interface material 108 of the thermal management assembly 100 according to an exemplary embodiment of Figure 1. Figure 3 also shows first and second adhesive material strips or lines 132 (e.g., pressure-sensitive adhesive) positioned adjacent to the first and second (or front and rear) portions on both sides of the protective liner 128 positioned on top of the thermal interface material 108 of the thermal management assembly 100. The thermal interface material 108 resides within a channel or region generally formed between the first and second adhesive material strips 132. Figure 4 shows an exemplary tab 136 configured to facilitate the removal of the removable protective liner 128 (e.g., protective foil) positioned on top of the thermal interface material 108 of the thermal management assembly 100 according to an exemplary embodiment of Figure 1.

[0017] The first and second adhesive material strips 132 may be configured to provide reinforcement along the leading and trailing edges of the thermal interface material 108, perpendicular to the sliding direction between the slidable heat source and the heat sink 112 (broadly defined as a heat removal / heat dissipation structure) to which the thermal management assembly 100 is bonded (e.g., bonded, or attached by engagement of dimples / bumps in notches / sockets). The fingers 120 (broadly defined as sidewall portions) of the metal wear-resistant layer 104 may be configured to provide reinforcement along the side edges of the thermal interface material 108, parallel to the sliding direction between the slidable heat source and the heat sink 112 (broadly defined as a heat removal / heat dissipation structure) to which the assembly 100 is bonded (e.g., bonded with adhesive, or attached by engagement of dimples / bumps in notches / sockets). The reinforcement along the edges of the thermal interface material 108 helps absorb compressive forces and confine the thermal interface material 108 within a channel or region generally formed between the first and second adhesive material strips 132, thereby helping to maintain the integrity of the thermal interface material 108 and prevent its movement.

[0018] The first and second adhesive material strips or lines 132 may include first and second pressure-sensitive adhesive layers or coatings arranged along the first and second opposite sides of a polymer film (e.g., polyethylene terephthalate film, thermoplastic polymer film, organic heat spreader film, flame-retardant meta-aramid film, other aramid films, etc.). For example, the first and second adhesive material strips or lines 132 may include first and second pressure-sensitive adhesive layers or coatings arranged along the first and second opposite sides of a polyethylene terephthalate film. In this latter example, the polyethylene terephthalate film may have a thickness of about 50 microns, and the pressure-sensitive adhesive may have a thickness of about 25 microns along each side of the polyethylene terephthalate film.

[0019] As another example, the first and second adhesive material strips or lines may comprise an organic heat spreader containing a polymer film coated with a thermally conductive pressure-sensitive adhesive. The organic heat spreader may be configured to have a high in-plane thermal conductivity of the film (e.g., an in-plane thermal conductivity of about 50 W / m·K) and a high resistivity (e.g., greater than 10¹⁵ watts / cm (W / cm)), which is higher than the through-plane thermal conductivity (e.g., about 0.2 W / m·K). The first and second adhesive material strips or lines may contain a pressure-sensitive adhesive having a thickness in the range of about 25 microns to about 200 microns (e.g., 25 microns, 80 microns, 100 microns, 125 microns, 140 microns, 150 microns, 160 microns, etc.).

[0020] In exemplary embodiments, the thermal interface material, the metal wear-resistant layer, and the first and second adhesive material strips or lines are not slidable relative to each other. Instead, the positions of the thermal interface material, the metal wear-resistant layer, and the first and second adhesive material strips or lines can be fixed relative to each other.

[0021] A wide range of materials may be used as the durable layer in exemplary embodiments, including stainless steel (e.g., 301 / 302 stainless steel), phosphor bronze, copper-clad steel, brass, Monel, nickel silver alloy, aluminum, aluminum alloy, steel, carbon steel, cold-rolled steel, sheet metal, brass, copper, copper-nickel alloy, beryllium copper alloy, other copper alloys, magnesium alloys, other metals, other alloys, other materials having high thermal conductivity and puncture resistance in addition to abrasion resistance, and materials having higher thermal conductivity and durability (e.g., puncture resistance and abrasion resistance) than polyimide film. The embodiments of this disclosure should not be limited to use with any one specific durable layer or metal abrasion-resistant layer, and exemplary embodiments may include a wide range of metals, metal alloys, and other materials used to provide a durable layer (e.g., a puncture-resistant and abrasion-resistant layer).

[0022] As the interface material, a wide range of materials such as thermal gap fillers, thermally phase - changing materials, thermally conductive EMI absorbers or thermal / EMI hybrid absorbers, thermal pats, thermal pads, thermal greases, and other thermal interface materials disclosed herein can be used. In an exemplary embodiment, the interface material includes a thermally phase - changing material having a thermal conductivity within the range of about 1 W / m·K to about 50 W / m·K. For example, the interface material may include a thermally phase - changing material having a thermal conductivity of about 7.5 W / m·K. The interface material may have natural adhesiveness and / or self - adhesiveness with respect to the surface of another component. The interface material may be softer, more flexible, less durable, and / or more susceptible to wear than a metal wear - resistant layer. As disclosed herein, the thermal management assembly or thermal solution can provide an interface material with sufficiently good durability and wear resistance, thereby enabling the interface material to withstand and / or endure a sliding operation. Aspects of the present disclosure should not be limited to the use of any one particular interface material, and exemplary embodiments may include a wide range of thermal interface materials and other interface materials.

[0023] In an exemplary embodiment, the thermal management assembly 100 shown in Figure 1 may be assembled on a heatsink 112, a heat source, or other component via the following exemplary process. The assembly process may include removing or peeling off a protective liner 128 (e.g., protective foil) to expose the thermal interface material 108 (broadly speaking, the interface material). After the protective liner 128 is removed, the thermal management assembly 100 may be placed on the heatsink 112, a heat source, or other component such that the thermal interface material 108 is in thermal contact with the heatsink 112, a heat source, or other component (e.g., in direct physical contact, compressed against it, etc.). Placing the thermal management assembly 100 on a heat sink 112, heat source, or other component may also include, for example, pressing the thermal management assembly 100 against the heat sink 112, heat source, or other component, so that dimples or bumps 116 formed along the fingers 120 of the metal substrate 104 of the thermal management assembly 100 engage with, receive, hold, latch, or lock into notches or sockets 124 along the corresponding fingers of the heat sink 112, heat source, or other component. The engagement of the dimples or bumps 116 of the metal substrate 104 into notches or sockets 124 of the heat sink 112, heat source, or other component helps to align and hold the thermal management assembly 100 relative to the heat sink 112, heat source, or other component. After the dimples or bumps 116 of the metal substrate 104 engage with the heat sink 112, heat source, or notches or sockets 124 of other components, heat may be applied to the thermal management assembly 100 for purposes such as setting the thermal interface material 108, curing the thermal interface material 108 (e.g., via chemical reactions during the heating process), melting the TIM, burning in the TIM, changing the phase of the thermal interface material 108, softening the thermal interface material 108, thinning the thermal interface material 108, and / or wetting the surface.

[0024] By using a metal substrate (such as stainless steel, copper, beryllium copper, aluminum, brass, nickel, nickel plating, chrome plating, and / or a non-metallic film bonded or metallized to a metal) to form a durable layer (e.g., a puncture-resistant layer and a wear-resistant layer disposed on or along a thermal interface material (TIM)), compared to conventional solutions that form a wear-resistant layer on or along a thermal interface material (TIM) using a polyimide film, heat transfer between a slidable heat source and a heat sink is improved. The improved thermal performance is due to using components (metals versus polyimide) with higher thermal conductivity compared to conventional TIM assemblies that use a polyimide film to form a wear-resistant layer.

[0025] The thermal management assemblies and thermal solutions disclosed herein can be used in a wide range of devices and components. Accordingly, aspects of the present disclosure are not limited to use only with a heat sink as a thermal management assembly, and the thermal solutions disclosed herein can be used with other heat removal structures / radiation structures and / or components, such as a heat removal structure / radiation structure that is part of the housing or cage itself, a heat pipe, a vapor chamber, a heat spreader, a cold plate, etc. The thermal management assemblies and thermal solutions disclosed herein can be used with a connector plug, a slidable part of a tablet or other modular portable device, a cage of a transceiver (e.g., a small form factor pluggable (SFP) transceiver, an SFP+ transceiver, a quad small form factor pluggable (QSFP) transceiver, a QSFP+ transceiver, an XFP transceiver, an octal small form factor pluggable (OSFP) transceiver, etc.), any hot-swappable component, an E1.2 memory application, an E3.s memory application, etc.

[0026] In an exemplary embodiment, the thermal management assembly is configured to improve heat transfer between a sliding heat source and a heat sink via a durable layer disposed on and / or along the thermal interface material, thereby providing a high-performance, durable, and sliding-resistant thermal interface material.

[0027] In an exemplary embodiment, the thermal management assembly comprises a thermal interface material and a durable layer disposed on and / or along the thermal interface material. The durable layer is configured to protect the thermal interface material as a heat source or other component slides in and out of a predetermined position relative to the thermal management assembly.

[0028] In an exemplary embodiment, the thermal management assembly comprises a substrate having an inner and outer surface opposite to each other. A thermal interface material is disposed along the inner surface of the substrate. The substrate forms a durable layer disposed on and / or along the thermal interface material. The durable layer is configured to slide along and in contact with the first surface of the first component, during which the thermal management assembly is positioned along the second surface of the second component, and the first and second surfaces move slidably relative to each other.

[0029] In exemplary embodiments, the substrate includes a metal substrate. For example, the substrate may include, but is not limited to, metals such as stainless steel, copper, or beryllium copper. In an exemplary embodiment, the durable layer has a higher thermal conductivity than the polyimide film and is superior in abrasion resistance and puncture resistance compared to the polyimide film.

[0030] In exemplary embodiments, the substrate includes a metal substrate forming a metallic wear-resistant layer disposed on and / or along the thermal interface material. The metallic wear-resistant layer is configured to slide along and in contact with the first surface of the first component, while the thermal management assembly is positioned along the second surface of the second component, so that the first and second surfaces move slidably relative to each other.

[0031] In an exemplary embodiment, the thermal management assembly is bonded to the inner surface of the substrate. In exemplary embodiments, the thermal management assembly is naturally tacky and / or self-adhesive, so that the thermal interface material adheres to the inner surface of the substrate without the need for additional adhesives.

[0032] In an exemplary embodiment, the first component includes a heat source. The second component includes a heat sink. The thermal management assembly is applied to the heat sink such that a thermal interface material is located between the heat sink and a durable layer, and the durable layer is located between the thermal interface material and the heat source. The durable layer is configured to contact and slide relative to the heat source when the heat source is slidably moved relative to the heat sink and the thermal management assembly applied to the heat sink.

[0033] In an exemplary embodiment, the first component includes a heat sink. The second component includes a heat source. The thermal management assembly is applied to the heat source such that a thermal interface material is located between the heat source and a durable layer, and the durable layer is located between the thermal interface material and the heat sink. The durable layer is configured to contact and slide relative to the heat sink when the heat source (and the thermal management assembly applied to the heat source) is slidably moved relative to the heat sink.

[0034] In exemplary embodiments, the durable layer includes stainless steel. For example, the durable layer may include metals such as stainless steel, copper, beryllium copper, etc. (but not limited to these). In exemplary embodiments, the durable layer has abrasion resistance and puncture resistance.

[0035] In an exemplary embodiment, the durable layer has a higher thermal conductivity than the polyimide film and is superior in abrasion resistance and puncture resistance compared to the polyimide film. In exemplary embodiments, the durable layer is a metallic wear-resistant layer disposed on and / or along the thermal interface material. The metallic wear-resistant layer is configured to slide along and in contact with the first surface of the first part, while the thermal management assembly is positioned along the second surface of the second part, so that the first and second surfaces move slidably relative to each other.

[0036] In exemplary embodiments, the thermal interface material includes a thermal phase change material. In other exemplary embodiments, the thermal interface material is not a thermal phase change material.

[0037] In an exemplary embodiment, the durable layer is configured to protect the thermal interface material as the heat source slides in and out of a predetermined position relative to the thermal management assembly and heat sink.

[0038] In exemplary embodiments, the durable layer has a thickness ranging from approximately 17.5 microns to approximately 300 microns. In exemplary embodiments, the thermal interface material has a thermal conductivity in the range of approximately 1 watt per meter per kelvin (W / m·K) to approximately 50 W / m·K.

[0039] In exemplary embodiments, the durable layer is formed by a substrate or cover including portions, projections, or retaining members that project inward along spaced fingers of the substrate or cover, and the inwardly projecting portions, projections, or retaining members are configured to engage with, receive, hold, latch, or lock into openings, holes, or recesses located along a heat sink, heat source, or other component. The substrate or cover may include, but is not limited to, metals such as stainless steel, copper, or beryllium copper.

[0040] In an exemplary embodiment, a removable protective liner is placed on top of the thermal interface material. In an exemplary embodiment, the first and second adhesive portions are adjacent to the opposite leading and trailing edges of the thermal interface material, respectively. The first and second adhesive portions provide reinforcement along the leading and trailing edges of the thermal interface material, and the reinforcement helps to confine the thermal interface material within the area formed by the reinforcement, thereby suppressing the movement of the thermal interface material.

[0041] In exemplary embodiments, the thermal interface material includes at least one of a thermally conductive pad, a thermally conductive gap filler, a phase-change thermal interface material, a dispensable thermal interface material, a thermal putty, and a thermal grease.

[0042] In exemplary embodiments, the device includes a thermal management assembly substantially as disclosed herein, a heat sink, and a heat source slidable relative to the heat sink. The thermal management assembly is applied to the heat sink such that a thermal interface material is located between the heat sink and a durable layer, and the durable layer is located between the thermal interface material and the heat source. The durable layer is configured to contact and slide relative to the heat source when the heat source is slidably moved relative to the heat sink and the thermal management assembly applied to the heat sink.

[0043] In exemplary embodiments, the device includes a thermal management assembly substantially as disclosed herein, a heat sink, and a heat source slidable relative to the heat sink. The thermal management assembly is applied to the heat source such that a thermal interface material is located between the heat source and a durable layer, and the durable layer is located between the thermal interface material and the heat sink. The durable layer is configured to contact and slide relative to the heat sink when the heat source (including the thermal management assembly applied to the heat source) is moved slidably relative to the heat sink.

[0044] Also disclosed herein are exemplary methods for assembling a thermal management assembly to a heat sink or heat source, as substantially disclosed herein. In exemplary embodiments, the thermal management assembly includes a durable layer disposed on and / or along the thermal interface material.

[0045] An exemplary method for installing a sliding thermal management assembly includes applying a thermal interface material (TIM) (e.g., a thermal phase change material) directly to the inner surface of a metal cover, the metal cover including an outer sliding surface and spring fingers having inward-facing dimples. The exemplary method further includes applying first and second adhesive reinforcing strips along the opposite edges of the thermal interface material perpendicular to the intended sliding direction. The exemplary method may also include removing a protective liner from the top surface of the thermal interface material. The exemplary method may also include pressing the metal cover onto a heat dissipation component (e.g., a heat sink) such that the inward-facing dimples are received in a socket of the heat dissipation component and the thermal interface material contacts the heat dissipation component.

[0046] In some exemplary methods, the method may further include heating the assembly to a burn-in temperature of 45°C to 75°C to soften the thermal interface material, reducing its thickness by 10% to 40%, thereby improving wettability and reducing contact resistance.

[0047] In some exemplary configurations, the metal cover may include stainless steel and have a thickness of approximately 50 to 100 microns. Each adhesive reinforcement strip may include a PET film with a thickness of 50 microns and an adhesive thickness of 25 microns on each side. The socket may be formed as a notch in the base of the heatsink. The assembly may be housed in a pluggable transceiver package such as SFP, SFP+, QSFP, QSFP+, and OSFP.

[0048] In an exemplary embodiment, the sliding thermal management assembly comprises a metal cover (e.g., stainless steel, copper, beryllium copper, etc.) having an outer sliding surface and an inner surface. The thermal interface material is positioned on the inner surface of the metal cover (e.g., directly on the inner surface without intervening components). Multiple inwardly projecting dimples are formed along spaced spring fingers of the metal cover. The dimples are configured to be received in corresponding sockets of a heat dissipation component (e.g., the base of a heat sink). First and second adhesive reinforcement strips are positioned on the opposite edges of the thermal interface material and extend along the edges perpendicular to the sliding direction, thereby trapping the thermal interface material between the first and second adhesive reinforcement strips while a heat source is slidably inserted along the outer sliding surface of the metal cover. The first and second adhesive reinforcement strips absorb edge compression and restrict movement of the thermal interface material. The heat transfer path extends through the metal cover and thermal interface material to the heat dissipation component.

[0049] In exemplary embodiments, the device comprises a heatsink having a socket positioned along the sidewall of a base. The device also includes a sliding thermal management assembly as disclosed herein. The sliding thermal management assembly engages with the heatsink by receiving dimples positioned along spaced spring fingers of a metal cover into the socket along the sidewall of the base. The heat source is configured to slide in and out in thermal contact with the outer sliding surface of the metal cover. The metal cover protects the thermal interface material during repeated sliding insertion and removal cycles and maintains a thermal path from the heat source through the metal cover and thermal interface material to the heatsink.

[0050] In exemplary embodiments, the metal cover may include stainless steel and have a thickness of 50 to 100 microns. The thermal interface material may include a thermal phase change material having a thickness-direction thermal conductivity of 5 watts per meter per kelvin (W / m·K) to 15 W / m·K. Each of the first and second adhesive reinforcement strips includes a polymer film (PET film) with a pressure-sensitive adhesive on opposite sides and has a total thickness of 75 to 150 micrometers. The spring fingers may be integrated with the sidewalls of the metal cover. The socket may also be formed as a notch in the base of the heatsink.

[0051] In exemplary embodiments, the heat source may include a pluggable transceiver module. The heat sink may include a machined aluminum base with a socket formed as a notch. The sliding insertion direction may be parallel to the edge reinforced by spring fingers and perpendicular to the edge reinforced by adhesive strips. The device may further include a cage or housing that provides sliding alignment.

[0052] In an exemplary embodiment, the cycle durability test involves ensuring that the assembly has sufficient contact resistance (e.g., ≤0.2K·cm) after repeated (e.g., at least 500) sliding insertion / removal cycles. 2 Demonstrates the maintenance of (e.g., W). An exemplary embodiment may include an adhesive-reinforced strip comprising a polyethylene terephthalate (PET) film having a thickness of about 50 microns, having pressure-sensitive adhesive layers of about 25 microns on both sides, and having a total thickness of about 100 microns. An exemplary embodiment may include a burn-in process to reduce the thickness of the TIM to about 10% to about 40% of the thickness before burn-in, thereby improving wettability and reducing contact resistance.

[0053] In exemplary embodiments, the thermal interface material may include a thermal phase change material having a thickness-direction thermal conductivity of about 5 W / m·K to about 15 W / m·K and a melting temperature of about 45°C to about 75°C.

[0054] In exemplary embodiments, the metal wear-resistant layer may be substantially composed of stainless steel grade 301 or 302 having a thickness of about 50 to about 100 microns, and provides a thermal conductivity at least 10 times greater than that of a polyimide film of the same thickness.

[0055] In exemplary embodiments, the metal cover may include copper-clad steel or a beryllium copper alloy. In exemplary embodiments, the dimples may include semi-dimples having a non-circular planar shape. In exemplary embodiments, the heat removal component may include a heat sink, a steam chamber, or a cold plate.

[0056] Figure 5 is a chart showing the relationship between the time-zero normalized thermal resistance (Rth / initial Rth) from the initial insertion and the number of reinsertions for a test sample of a thermal management assembly or thermal solution comprising a metal wear-resistant layer (broadly speaking, a durable layer or wear-resistant layer) (e.g., a stainless steel substrate, another metal substrate, etc.) and a thermal interface material (TIM) (e.g., a thermal phase change material (PCM), etc.) beneath the metal wear-resistant layer, according to an exemplary embodiment of the present disclosure.

[0057] In this particular test, the sample contained a stainless steel layer on top of a thermal interface material (TIM). The objective of the test was to characterize the durability and performance of the sample product after 500 reinsertions.

[0058] Test Conditions: The tests were conducted in a laboratory environment where the ambient temperature was maintained at 20°C to 25°C. The interfacial load applied to the OSFP-IHS module (Octall Small Form Factor Plug-In (OSFP) Integrated Heat Sink (IHS) module) during the tests was 36 Newtons, which is consistent with the guidelines specified in Section 5.5 of OSFP MSA Rev 5.1. The cold plate inlet temperature was set to 20°C.

[0059] Test preparation: To burn in the samples, the samples were pressed against a glass plate known to have a surface flatness of less than 50 microns and subjected to the following conditions. • Pressure: 13.8 kPa (kilopascals) • Temperature and time: Maintain the cold plate at 70°C for 30 minutes; and • Ensure the cold plate is below 35°C before removing pressure from the interface.

[0060] Test procedure: 1. Set up the liquid loop so that the inlet temperature to the cold plate is 20°C. 2. Insert the TTV (thermal test medium) and characterize its thermal resistance before reinserting it.

[0061] 3. Manually remove and reinsert the TTV 100 times. 4. Visually inspect the surface of the sample product for tears and record the surface condition with photographs (see, for example, Figure 6).

[0062] 5. Characterize the thermal resistance. 6. Manually remove and reinsert the TTV 100 times. 7. Repeat steps 4-6 until 500 insertions have been completed.

[0063] Thermal Performance Results: Thermal performance was measured at intervals of 100 insertions to track whether thermal resistance increased with increasing insertions. Compared to the initial thermal resistance, the thermal resistance after each round of 100 insertions remained consistent and even slightly improved by the end of 500 insertions, as shown in Figure 5.

[0064] Figure 6 shows the results of 500 insertions for three test samples of a thermal management assembly or thermal solution, each comprising a metallic wear-resistant layer (broadly speaking, a durable layer) (e.g., a stainless steel substrate, another metal substrate, etc.) and a thermal interface material (TIM) (e.g., a thermal phase change material (PCM), etc.) beneath the metallic wear-resistant layer, according to an exemplary embodiment of the present disclosure. Each sample was visually inspected after every 100 insertions. As shown in Figure 6, no tearing was observed after the harsh insertion cycle.

[0065] Various aspects of the present invention as described herein include, but are not limited to, those listed in the following numbered clauses. Section 1 A thermal management assembly for sliding applications, comprising a substrate having an inner and outer surface opposite to each other, and an interface material along the inner surface of the substrate, wherein the substrate forms a durable layer disposed on and / or along the interface material and configured to contact a first surface of a first component, wherein the thermal management assembly is disposed along a second surface of a second component, and the first surface moves slidably with respect to the second surface.

[0066] Section 2 The assembly described in paragraph 1 comprises a substrate comprising a metal cover having an outer sliding surface and an inner surface, an interface material disposed on the inner surface of the metal cover, a plurality of inwardly protruding dimples arranged along spaced spring fingers of the metal cover, the dimples configured to be received into corresponding sockets of a heat dissipation component, and a heat transfer path extending through the metal cover and interface material into the heat dissipation component.

[0067] Section 3 The assembly according to paragraph 2, wherein the first and second adhesive reinforcing strips are positioned on opposite edges of the interface material and extend along edges perpendicular to the sliding direction, thereby trapping the interface material between the first and second adhesive reinforcing strips so that the first and second adhesive reinforcing strips absorb edge compression and restrict movement of the interface material while a heat source is slidably inserted along the outer sliding surface of the metal cover.

[0068] Section 4 The assembly according to Section 3, wherein the metal cover comprises stainless steel, the interface material comprises a thermal phase change material, and each of the first and second adhesive reinforcement strips comprises a polymer film having a pressure-sensitive adhesive on opposite sides to each other.

[0069] Section 5 The assembly according to paragraph 3, wherein the metal cover comprises stainless steel having a thickness of 50 to 100 microns, the interface material comprises a thermal phase change material having a thickness-direction thermal conductivity of 5 watts per meter per kelvin (W / m·K) to 15 W / m·K, and each of the first and second adhesive reinforcing strips comprises a polymer film having a pressure-sensitive adhesive on opposite sides to each other and having a total thickness of 75 to 150 microns.

[0070] Section 6 The assembly according to paragraph 3, wherein the metal cover comprises stainless steel having a thickness of 6 microns to 200 microns, the interface material comprises a thermal phase change material having a thickness-direction thermal conductivity of 0.15 watts per meter per kelvin (W / m·K) to 50 W / m·K, and each of the first and second adhesive reinforcing strips comprises a polymer film having a pressure-sensitive adhesive on opposite sides to each other and having a total thickness of 200 microns or less.

[0071] Section 7 The assembly described in paragraph 2 or 3, wherein the metal cover comprises stainless steel having a thickness of 50 to 100 microns, and the interface material comprises a thermal phase change material having a thickness-direction thermal conductivity of 5 watts per meter per kelvin (W / m·K) to 15 W / m·K.

[0072] Section 8 The assembly described in paragraph 2 or 3, wherein the metal cover comprises stainless steel having a thickness of 6 microns to 200 microns, and the interface material comprises a thermal phase change material having a thickness-direction thermal conductivity of 0.15 watts per meter per kelvin (W / m·K) to 50 W / m·K.

[0073] Section 9 The assembly according to any one of paragraphs 2 to 8, wherein the metal cover has a thermal conductivity at least 10 times greater than that of a polyimide film of the same thickness.

[0074] Section 10 The spring fingers are integrated with the sidewall of the metal cover, and the socket is a notch in the base of the heatsink, as described in any one of paragraphs 2 through 9.

[0075] Section 11 The assembly according to paragraph 1, wherein the substrate comprises a self-locking mechanism configured to interface with and engage with a corresponding self-locking mechanism of the heat dissipation component in order to hold the substrate to the heat dissipation component.

[0076] Section 12 The assembly described in paragraph 1 includes a substrate which includes a protruding dimple configured to be received into a corresponding socket of the heat dissipation component in order to hold the substrate in the heat dissipation component.

[0077] Section 13 The assembly described in paragraph 1 includes a plurality of sockets configured to accept the protruding dimples of the heat dissipation component in order to hold the substrate to the heat dissipation component.

[0078] Section 14 The assembly described in paragraph 1 comprises a substrate comprising a plurality of sockets configured to engage with and receive a metal cover having an outer sliding surface and an inner surface, an interface material positioned on the inner surface of the metal cover, a plurality of inwardly projecting dimples arranged along spaced spring fingers of the metal cover, the dimples configured to be received into corresponding sockets of a heat dissipation component, and a heat transfer path extending through the metal cover and interface material into the heat dissipation component.

[0079] Section 15 An assembly as described in any one of paragraphs 1 through 14, wherein the thickness of the interface material after burn-in is reduced by 10% to 40% compared to the thickness of the interface material before burn-in.

[0080] Section 16 The assembly described in any one of paragraphs 1 to 15 includes a metal substrate, which is made of stainless steel, copper, or beryllium copper.

[0081] Section 17 The assembly according to any one of paragraphs 1 to 16, wherein the durable layer has abrasion resistance and puncture resistance, and the durable layer has a higher thermal conductivity than the polyimide film and is superior in abrasion resistance and puncture resistance to the polyimide film.

[0082] Section 18 The assembly according to any one of paragraphs 1 to 17, wherein the durable layer has abrasion resistance and puncture resistance, and the durable layer has thermal conductivity, abrasion resistance, and / or puncture resistance that is substantially the same as or better than that of the polyimide film.

[0083] Section 19 The assembly according to any one of paragraphs 1 to 18, wherein the substrate includes a metal substrate that is positioned on and / or along the interface material and forms a metal wear-resistant layer configured to slide along and in contact with the first surface of the first component, wherein the thermal management assembly is positioned along the second surface of the second component and the first surface moves slidably relative to the second surface.

[0084] Section 20 The interface material is an assembly according to any one of paragraphs 1 to 19, which is naturally tacky to the inner surface of the substrate and self-adhesive without requiring additional adhesive.

[0085] Section 21 The assembly according to any one of paragraphs 1 to 20, wherein the first component includes a heat source, the second component includes a heat sink, and the thermal management assembly is applied to the heat sink such that the interface material is located between the heat sink and a durable layer, and the durable layer is located between the interface material and the heat source, and the durable layer is configured to contact and slide relative to the heat source when the heat source is moved slidably against the heat sink and the thermal management assembly applied to the heat sink.

[0086] Section 22 The assembly according to any one of paragraphs 1 to 20, wherein the first component includes a heat sink, the second component includes a heat source, and the thermal management assembly is applied to the heat source such that the interface material is located between the heat source and a durable layer, and the durable layer is located between the interface material and the heat sink, and the durable layer is configured to contact and slide relative to the heat sink when the heat source (and the thermal management assembly applied to the heat source) is moved slidably relative to the heat sink.

[0087] Section 23 The assembly according to any one of paragraphs 1 to 22, wherein the durable layer has a thickness in the range of approximately 17.5 microns to approximately 300 microns, and / or the interface material has a thermal conductivity in the range of approximately 1 W / mK to approximately 50 W / mK.

[0088] Section 24 The assembly according to any one of paragraphs 1 to 23, wherein the substrate includes inwardly projecting portions arranged along spaced fingers of the substrate, configured to engage with and be received within an opening positioned along a heat sink, heat source, or other component.

[0089] Section 25 The assembly according to any one of paragraphs 1 to 24, further comprising a removable protective liner positioned on the interface material and having tear tabs aligned in the sliding direction.

[0090] Section 26 The assembly according to any one of paragraphs 1 to 25, further comprising first and second adhesive portions positioned adjacent to the opposite front and rear edges of the interface material, the first and second adhesive portions providing reinforcement along the front and rear edges of the interface material, the reinforcement assisting in confining the interface material within the area formed by the reinforcement, thereby restricting movement of the interface material.

[0091] Section 27 The assemblies according to any one of paragraphs 1 to 26, wherein the interface material comprises at least one of a thermally conductive pad, a thermally conductive gap filler, a dispenseable thermal interface material, a phase-change thermal interface material, a thermal putty, and a thermal grease, the substrate is configured to protect the interface material as a heat source or other component slides in and out of a position relative to the thermal management assembly, and the thermal management assembly is configured to improve heat transfer between a sliding heat source and a heat sink via a substrate that forms a durable layer on and / or along the interface material, thereby providing an improved-performance, durable, and sliding-resistant interface material.

[0092] Section 28 The assembly according to any one of paragraphs 1 to 27, wherein the substrate protects the interface material and maintains a thermal path through the substrate and interface material during repeated sliding insertion and removal cycles.

[0093] Section 29 The assembly described in any one of paragraphs 1 to 28 includes a substrate which is part of an EMI cage for optical transceiver applications, forming a durable layer disposed on and / or along the interface material.

[0094] Section 30 A thermal management assembly for sliding applications, comprising: a metal cover having an outer sliding surface and an inner surface; an interface material disposed on the inner surface of the metal cover; a plurality of inwardly projecting dimples arranged along spaced spring fingers of the metal cover, the dimples configured to be received by a plurality of corresponding sockets of a heat removal component; and first and second adhesive reinforcing strips disposed on opposite edges of the interface material and extending along edges perpendicular to the sliding direction, wherein the interface material is trapped between the first and second adhesive reinforcing strips so as the heat source is slidably inserted along the outer sliding surface of the metal cover, the metal cover protects the interface material so as to be durable during repeated sliding insertion and removal cycles, and maintains a heat transfer path from the metal cover and interface material to a heat removal component.

[0095] Section 31 A device comprising: a heatsink having a socket positioned along the side wall of a base; a thermal management assembly as described in paragraph 30, which engages with the heatsink by receiving dimples positioned along spaced spring fingers of a metal cover into the socket positioned along the side wall of the base; and a heat source configured to slide in and out in thermal contact with the outer sliding surface of the metal cover, wherein the metal cover protects the interface material and maintains a thermal path from the heat source through the metal cover and interface material to the heatsink during repeated sliding insertion and removal cycles.

[0096] The exemplary embodiments are provided to ensure that the disclosure is sufficient and fully conveys its scope to those skilled in the art. Numerous specific details are given, including examples of specific components, devices, and methods, to provide a complete understanding of the embodiments of the disclosure. It will be apparent to those skilled in the art that the use of these specific details is not necessary, that the exemplary embodiments can be embodied in many different forms, and that neither should be construed as limiting the scope of the disclosure. In some exemplary embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail. Furthermore, any advantages and improvements that can be achieved in one or more exemplary embodiments of the disclosure are provided for illustrative purposes only, and the exemplary embodiments of the disclosure do not limit the scope of the disclosure, as they may provide all or none of the above advantages and improvements and are still within the scope of the disclosure.

[0097] The specific numerical dimensions and values, specific materials, and / or specific shapes disclosed herein are illustrative in nature and do not limit the scope of this disclosure. The disclosure herein regarding specific values ​​and ranges of values ​​for a given parameter does not preclude other values ​​and ranges of values ​​that may be useful in one or more examples disclosed herein. Furthermore, it is assumed that any two specific values ​​of a particular parameter described herein may define an endpoint of a range of values ​​that may be suitable for the given parameter (the disclosure of a first and second value of a given parameter may be interpreted as disclosing that any value between the first and second values ​​may be used for the particular parameter). For example, if parameter X is illustrated herein as having value A and also illustrated as having value Z, it is assumed that parameter X may have a range of values ​​from about A to about Z. Similarly, the disclosure of two or more ranges of values ​​for a parameter (whether such ranges are nested, overlapping, or distinct) is assumed to encompass all possible combinations of ranges of values ​​that may be claimed using the disclosed range endpoints. For example, if parameter X is exemplified herein as having values ​​in the range of 1 to 10, or 2 to 9, or 3 to 8, it is also conceivable that parameter X may have values ​​in other ranges, including 1 to 9, 1 to 8, 1 to 3, 1 to 2, 2 to 10, 2 to 8, 2 to 3, 3 to 10, and 3 to 9.

[0098] The terms used herein are for the sole purpose of describing specific exemplary embodiments and are not intended to be limiting. As used herein, the singular forms “one” and “it” are intended to include the plural form as well, unless the context clearly indicates otherwise. The terms “equip,” “include,” “contain,” “have,” and “possess” are inclusive and thus identify the presence of the described features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. The steps, processes, and operations described herein should not be construed as necessarily requiring their performance in a specific order described or illustrated unless specifically identified as an order of performance. It should also be understood that additional or alternative steps may be employed.

[0099] Where an element or layer is described as "on top of," "engaged with," "connected to," or "bonded to" another element or layer, it may be directly on top of, engaged with, connected to, or bonded to that other element or layer, or any intervening element or layer that may exist. In contrast, where an element is described as "directly on top of," "directly engaged with," "directly connected to," or "directly bonded to" another element or layer, there may be no intervening element or layer. Other words used to describe relationships between elements should be interpreted in a similar manner (e.g., "between" and "directly between," "adjacent" and "directly adjacent"). As used herein, the term "and / or" includes any and all combinations of one or more of the listed items relating to it.

[0100] When applied to a value, the term “approximately” indicates that the calculation or measurement allows for a slight inaccuracy in the value (approximately or reasonably close to the value, depending on the approach to accuracy of the value). If for any reason the inaccuracy provided by “approximately” is not understood in this ordinary sense in the art, “approximately” as used herein indicates at least the variation that may arise from the ordinary methods of measuring or using such a parameter. For example, the terms “generally,” “approximately,” and “substantially” may be used herein to mean within manufacturing tolerances.

[0101] Terms such as "first," "second," and "third" may be used herein to describe various elements, components, regions, layers, and / or sections, but these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms can only be used to distinguish one element, component, region, layer, or section from another region, layer, or section. As used herein, terms such as "first," "second," and other numerical terms do not imply order or sequence unless explicitly indicated by the context. Thus, a first element, component, region, layer, or section may be referred to as a second element, component, region, layer, or section without departing from the teaching of the exemplary embodiments.

[0102] Spatially relative terms such as “inside,” “outside,” “down,” “below,” “underside,” “up,” and “above” may be used herein to facilitate the description of the relationship between one element or function and another, as shown in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation, in addition to the orientation shown in the figures. For example, if the device in the figure is turned upside down, an element described as “below” or “below” another element or function becomes “above” the other element or function. Thus, an example of the term “down” may encompass both up and down directions. The device may be oriented differently (rotated 90 degrees or in other directions), and the spatially relative descriptors used herein may be interpreted accordingly.

[0103] The foregoing description of embodiments is provided for illustrative and explanatory purposes only. It is not intended to be exhaustive or to limit the disclosure. Individual elements, intended or described uses, or features of a particular embodiment are, in most cases, not limited to that particular embodiment, but are interchangeable where applicable and may be used in selected embodiments even if not specifically shown or described. The same may also be modified in many ways. Such modifications should not be considered deviations from the disclosure, and all such modifications are intended to be within the scope of the disclosure.

Claims

1. A thermal management assembly for sliding applications, A substrate having an inner surface and an outer surface opposite to each other, The substrate comprises an interface material along the inner surface, The substrate is disposed on and / or along the interface material and forms a durable layer configured to contact a first surface of a first component, wherein the thermal management assembly is disposed along a second surface of a second component and the first surface moves slidably relative to the second surface.

2. The substrate includes a metal cover having an outer sliding surface and an inner surface. The interface material is disposed on the inner surface of the metal cover, Multiple inwardly projecting dimples are arranged along multiple spaced spring fingers of the metal cover, and the multiple dimples are configured to be received in multiple corresponding sockets of the heat dissipation component. The assembly according to claim 1, wherein the heat transfer path extends through the metal cover and the interface material to the heat removal component.

3. The assembly according to claim 2, wherein the first and second adhesive reinforcing strips are positioned on opposite edges of the interface material and extend along edges perpendicular to the sliding direction, thereby trapping the interface material between the first and second adhesive reinforcing strips so that the first and second adhesive reinforcing strips absorb edge compression and suppress movement of the interface material while a heat source is slidably inserted along the outer sliding surface of the metal cover.

4. The aforementioned metal cover contains stainless steel, The aforementioned interface material includes a thermal phase change material, The assembly according to claim 3, wherein each of the first and second adhesive reinforcement strips comprises a polymer film having a pressure-sensitive adhesive on opposite sides to each other.

5. The aforementioned metal cover contains stainless steel having a thickness of 50 to 100 microns. The interface material includes a thermal phase change material having a thermal conductivity in the thickness direction of 5 watts per meter per kelvin (W / m·K) to 15 W / m·K. The assembly according to claim 3, wherein each of the first and second adhesive reinforcement strips comprises a polymer film having a pressure-sensitive adhesive on opposite sides to each other and having a total thickness of 75 micrometers to 150 micrometers.

6. The aforementioned metal cover contains stainless steel having a thickness of 6 microns to 200 microns. The interface material includes a thermal phase change material having a thermal conductivity in the thickness direction of 0.15 watts per meter per kelvin (W / m·K) to 50 W / m·K. The assembly according to claim 3, wherein each of the first and second adhesive reinforcement strips comprises a polymer film having a pressure-sensitive adhesive on opposite sides to each other and having a total thickness of 200 micrometers or less.

7. The aforementioned metal cover contains stainless steel having a thickness of 50 to 100 microns. The assembly according to claim 2, wherein the interface material includes a thermal phase change material having a thickness-direction thermal conductivity of 5 watts per meter per kelvin (W / m·K) to 15 W / m·K.

8. The aforementioned metal cover contains stainless steel having a thickness of 6 microns to 200 microns. The assembly according to claim 2, wherein the interface material includes a thermal phase change material having a thickness-direction thermal conductivity of 0.15 watts per meter per kelvin (W / m·K) to 50 W / m·K.

9. The assembly according to claim 2, wherein the metal cover has a thermal conductivity at least 10 times greater than that of a polyimide film of the same thickness.

10. The spring finger is integrated with the side wall of the metal cover. The assembly according to claim 2, wherein the socket is a notch in the base of the heatsink.

11. The assembly according to claim 1, wherein the substrate comprises a self-locking mechanism configured to interface with and engage with a corresponding self-locking mechanism of the heat removal component in order to hold the substrate to the heat removal component.

12. The assembly according to claim 1, wherein the substrate includes protruding dimples configured to be received in corresponding sockets of the heat dissipation component in order to hold the substrate in the heat dissipation component.

13. The assembly according to claim 1, wherein the substrate includes a plurality of sockets configured to receive protruding dimples of the heat removal component in order to hold the substrate to the heat removal component.

14. The substrate includes a plurality of sockets configured to engage with and receive a metal cover having an outer sliding surface and an inner surface, The interface material is disposed on the inner surface of the metal cover, Multiple inwardly projecting dimples are arranged along multiple spaced spring fingers of the metal cover, and the multiple dimples are configured to be received in multiple corresponding sockets of the heat dissipation component. The assembly according to claim 1, wherein the heat transfer path extends through the metal cover and the interface material to the heat removal component.

15. The assembly according to claim 1, wherein the thickness of the interface material after burn-in is reduced by 10% to 40% compared to the thickness of the interface material before burn-in.

16. The assembly according to claim 1, wherein the substrate includes a metal substrate containing stainless steel, copper, or beryllium copper.

17. The aforementioned durable layer has abrasion resistance and puncture resistance. The assembly according to claim 1, wherein the durable layer has a higher thermal conductivity than the polyimide film and is superior in abrasion resistance and puncture resistance than the polyimide film.

18. The aforementioned durable layer has abrasion resistance and puncture resistance. The assembly according to claim 1, wherein the durable layer has thermal conductivity, abrasion resistance, and / or puncture resistance that is substantially the same as or better than that of the polyimide film.

19. The assembly according to claim 1, wherein the substrate includes a metal substrate that is disposed on and / or along the interface material and forms a metal wear-resistant layer configured to slide along and in contact with the first surface of the first component, wherein the thermal management assembly is disposed along the second surface of the second component and the first surface moves slidably relative to the second surface.

20. The durable layer has a thickness in the range of 17.5 microns to 300 microns, and / or The assembly according to claim 1, wherein the interface material has a thermal conductivity in the range of 1 W / m·K to 50 W / m·K.

21. The assembly according to claim 1, wherein the substrate includes inwardly projecting portions arranged along spaced fingers of the substrate, configured to engage with and be received within an opening arranged along a heat sink or heat source.

22. The interface material further comprises a removable protective liner disposed on top of the interface material, having tear tabs aligned in the sliding direction, and / or The assembly according to claim 1, wherein the interface material is naturally tacky to the inner surface of the substrate and self-adhesive without requiring additional adhesive.

23. The assembly according to claim 1, further comprising first and second adhesive portions disposed adjacent to the opposite front and rear edges of the interface material, the first and second adhesive portions providing reinforcement along the front and rear edges of the interface material, the reinforcement assisting in confining the interface material within the region formed by the reinforcement, thereby restricting movement of the interface material.

24. The assembly according to claim 1, wherein the substrate protects the interface material during repeated sliding insertion and removal cycles and maintains a thermal path through the substrate and the interface material.

25. The assembly according to claim 1, wherein the substrate includes a portion of an EMI cage for optical transceiver applications that forms the durable layer disposed on and / or along the interface material.

26. The interface material includes at least one of a thermally conductive pad, a thermally conductive gap filler, a phase-change thermal interface material, a dispensable thermal interface material, a thermal putty, and a thermal grease. The substrate is configured to protect the interface material when the heat source slides in and out of a predetermined position relative to the thermal management assembly. The thermal management assembly is configured to improve heat transfer between a heat source and a heat sink that can slide through the substrate forming the durable layer on and / or along the interface material, thereby providing an improved, durable, and slide-resistant interface material, according to claim 1.

27. The first component includes a heat source. The second component includes a heatsink. The thermal management assembly is applied to the heat sink such that the interface material is located between the heat sink and the durable layer, and the durable layer is located between the interface material and the heat source. The assembly according to any one of claims 1 to 26, wherein the durable layer is configured to contact and slide relative to the heat source when the heat source is slidably moved relative to the heat sink and the thermal management assembly applied to the heat sink.

28. The first component includes a heatsink, The second component includes a heat source, The thermal management assembly is applied to the heat source such that the interface material is located between the heat source and the durable layer, and the durable layer is located between the interface material and the heat sink. The assembly according to any one of claims 1 to 26, wherein the durable layer is configured to contact and slide relative to the heat sink when the heat source (and the thermal management assembly applied to the heat source) is slidably moved relative to the heat sink.

29. A thermal management assembly for sliding applications, A metal cover having an outer sliding surface and an inner surface, An interface material disposed on the inner surface of the metal cover, A plurality of inwardly projecting dimples arranged along spaced-apart spring fingers of the metal cover, wherein the plurality of dimples are configured to be received in a plurality of corresponding sockets of a heat dissipation component, The interface material comprises first and second adhesive reinforcing strips positioned on opposite edges of the interface material and extending along edges perpendicular to the sliding direction, wherein the interface material is trapped between the first and second adhesive reinforcing strips so as the heat source is slidably inserted along the outer sliding surface of the metal cover, the first and second adhesive reinforcing strips absorb edge compression and suppress movement of the interface material, A thermal management assembly comprising a metal cover that protects the interface material so that the interface material is durable during repeated sliding insertion and removal cycles, and maintains a heat transfer path through the metal cover and the interface material to the heat removal component.

30. It is an electronic device, A heatsink having sockets arranged along the side wall of the base, The thermal management assembly according to claim 29, wherein the dimples, which are arranged along spaced spring fingers of the metal cover, are engaged with the heat sink by receiving them into the sockets, which are arranged along the side wall of the base, The metal cover comprises a heat source configured to slide in and out of the outer sliding surface of the metal cover while in thermal contact with it. The metal cover protects the interface material during repeated sliding insertion and removal cycles and maintains a thermal path from the heat source through the metal cover and the interface material to the heat sink in this electronic device.

Images