FOUP or cassette storage for hybrid substrate bonding systems

Abstract

This invention provides an improved multi-chamber processing tool with an improved substrate storage system. [Solution] The equipment front-end module (EFEM) 102 has an overhead storage unit 410 having two or more load ports 114 for receiving two or more types of substrates, and a plurality of storage racks 412 positioned above the two or more load ports, each holding two or more types of front-opening unified pods (FOUPs) 416 of different sizes for storing two or more types of substrates, wherein a horizontal array 420 is positioned between the plurality of storage racks and the two or more load ports to provide a horizontal passage for FOUPs during transport to the two or more load ports, and an overhead transport system 502 positioned on the opposite side of the overhead storage unit has a pair of vertical actuators 504 for transporting FOUPs from the overhead storage unit to the two or more load ports.

Description

Technical Field

[0001]

[0001] Embodiments of the present disclosure generally relate to a substrate processing apparatus.

Background Art

[0002]

[0002] Substrates undergo various processes during the manufacture of semiconductor integrated circuit devices. Some of these processes include wafer dicing, where the processed wafer is placed on a dicing tape and cut or separated into a plurality of dies or chiplets. Once the wafer is diced, the chiplets generally remain on the dicing tape until they are extracted and bonded to a substrate. Conventional processing tools for cleaning, dicing, and bonding chiplets to substrates generally include a single linear robot housed in multiple tools or a mainframe tool. However, such conventional processing tools have limitations in the storage and automatic processing of various substrates.

[0003]

[0003] Therefore, the inventors have provided an improved multi-chamber processing tool having an improved substrate storage system.

Summary of the Invention

[0004]

[0004] Embodiments of equipment front-end modules (EFEMs) are provided herein. In some embodiments, an EFEM includes an overhead storage unit having two or more load ports for receiving two or more types of substrates, and a plurality of storage shelves positioned above the two or more load ports and configured to each hold two or more types of front-opening unified pods (FOUPs) of different sizes for storing two or more types of substrates, wherein a horizontal array is positioned between the plurality of storage shelves and the two or more load ports to provide a horizontal passage for FOUPs during transport to the two or more load ports, and an overhead transport system positioned on the opposite side of the overhead storage unit and having a pair of vertical actuators configured to transport FOUPs from the overhead storage unit to the two or more load ports.

[0005]

[0005] In some embodiments, the EFEM includes two or more load ports for receiving two or more types of substrates, an overhead storage unit having a plurality of storage shelves positioned above the two or more load ports and configured to each hold a forward-opening unified pod (FOUP) for storing two or more types of substrates, and an overhead transport system configured to transport FOUPs from the overhead storage unit to the two or more load ports, the transport system comprising a pair of vertical actuators configured to transport FOUPs vertically, one or more horizontal actuators configured to transport FOUPs horizontally, and grippers coupled to one or more horizontal actuators for transporting FOUPs.

[0006]

[0006] In some embodiments, a multi-chamber processing tool for substrate processing includes an equipment front-end module (EFEM) comprising an overhead storage unit having two or more load ports for receiving two or more types of substrates, and a plurality of storage shelves positioned above the two or more load ports and configured to each hold a forward-opening unified pod (FOUP) for storing two or more types of substrates, and an overhead transport system configured to transport FOUPs from the overhead storage unit to the two or more load ports; and a plurality of automation modules having a first automation module coupled to the EFEM, each of the plurality of automation modules comprising a transport chamber and one or more process chambers coupled to the transport chamber, the transport chamber comprising a buffer configured to hold a plurality of two or more types of substrates.

[0007]

[0007] Further embodiments of the present disclosure are described below.

[0008]

[0008] By referring to exemplary embodiments of the present disclosure shown in the accompanying drawings, embodiments of the present disclosure summarized above and described in more detail below can be understood. However, the accompanying drawings only illustrate typical embodiments of the present disclosure and should not be considered limiting, and the present disclosure may also permit other equally valid embodiments. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic top view showing a multi-chamber processing tool for bonding chiplets to a substrate, according to at least some embodiments of the present disclosure. [Figure 2] This figure shows a second type of substrate according to at least some embodiments of the present disclosure. [Figure 3] This is an isometric view showing the transfer chambers of a plurality of automation modules according to at least some embodiments of the present disclosure. [Figure 4] This is a schematic left isometric view showing a multi-chamber processing tool having an equipment front-end module (EFEM) with an overhead storage unit, according to at least some embodiments of the present disclosure. [Figure 5] This is an isometric schematic diagram showing a portion of the EFEM according to at least some embodiments of the present disclosure. [Modes for carrying out the invention]

[0010]

[0014] For ease of understanding, the same reference numerals are used to indicate common and identical elements in the drawings whenever possible. The drawings are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be usefully incorporated into other embodiments without further detail.

[0011]

[0015] Embodiments of methods and apparatus for processing substrates are provided herein. The apparatus generally comprises a multi-chamber processing tool, which is modular and includes one or more instrument front-end modules (EFEMs) for loading substrates into and out of a multi-chamber processing tool coupled with a plurality of automation modules configured to perform one or more processing steps on the substrates. One or more EFEMs generally include an overhead storage unit having a plurality of storage racks for supporting a forward-opening unified pod (FOUP) having a plurality of different types of substrates. The FOUP may support substrates directly on a plurality of holders or support a cassette configured to hold one or more substrates internally. The plurality of automation modules may generally interface with the EFEMs to transfer substrates from a plurality of different types of substrates to one or more process chambers associated with each automation module. The overhead storage unit improves the throughput of substrates in the multi-chamber processing tool.

[0012]

[0016] One or more processing steps may be any suitable steps in the manufacturing or packaging of an integrated circuit. For example, one or more processing steps may be configured to perform one or more of the following: a bonding process for bonding multiple chiplets onto a substrate, a plasma dicing or singulation process, a substrate cleaning process, a substrate plating or coating process, etc. Multiple storage racks can advantageously facilitate the storage of different types of substrates in-situ within a multi-chamber processing tool, thereby improving substrate processing throughput.

[0013]

[0017] Each of the multiple automation modules includes a transfer robot, which enables the transfer robots to operate in parallel, thereby advantageously improving processing throughput by facilitating the simultaneous processing of multiple substrates. In an exemplary process of bonding multiple chiplets onto a substrate, a multi-chamber processing tool accommodates multiple different types of substrates (e.g., wafers, tape frames, etc., with chiplets of different sizes), and the all-in-one multi-chamber processing tool advantageously enables the bonding of multiple chiplets of different sizes onto a wafer. Multiple chiplets can be bonded in multiple layers onto the wafer within the multi-chamber processing tool.

[0014]

[0018] Figure 1 is a schematic top view showing a multi-chamber processing tool 100 for bonding chiplets to a substrate, according to at least some embodiments of the present disclosure. The multi-chamber processing tool 100 generally includes an equipment front-end module (EFEM) 102 and a plurality of automation modules 110 coupled in series to the EFEM 102. The plurality of automation modules 110 are configured to transport one or more types of substrates 112 back and forth from the EFEM 102 through the multi-chamber processing tool 100 and to perform one or more processing steps on one or more types of substrates 112. Each of the plurality of automation modules 110 generally includes a transport chamber 116 and one or more process chambers 106 coupled to the transport chamber 116 and performing one or more processing steps. The plurality of automation modules 110 are coupled to one another via their respective transport chambers 116 to advantageously provide modular expandability and customization of the multi-chamber processing tool 100. As shown in Figure 1, the multiple automation modules 110 include three automation modules, where the first automation module 110a is coupled to the EFEM 102, the second automation module 110b is coupled to the first automation module 110a, and the third automation module 110c is coupled to the second automation module 110b.

[0015]

[0019] The EFEM102 includes a plurality of load ports 114 for receiving one or more types of substrates 112. In some embodiments, the one or more types of substrates 112 include 200 mm wafers, 300 mm wafers, 450 mm wafers, tape frame substrates, carrier substrates, silicon substrates, glass substrates, etc. In some embodiments, the plurality of load ports 114 include at least one of one or more first load ports 114a for receiving a first type of substrate 112a, or one or more second load ports 114b for receiving a second type of substrate 112b. In some embodiments, the first type of substrate 112a has a different size from the second type of substrate 112b. In some embodiments, the second type of substrate 112b includes a tape frame substrate or a carrier substrate. In some embodiments, the second type of substrate 112b includes a plurality of chiplets arranged on the tape frame or carrier plate. In some embodiments, the second type of substrate 112b can hold chiplets of different types and sizes. Therefore, one or more second load ports 114b may have different sizes or receiving surfaces configured to load second types of substrates 112b having different sizes.

[0016]

[0020] In some embodiments, multiple load ports 114 are arranged along a common side of the EFEM 102. While Figure 1 shows a pair of first load ports 114a and a pair of second load ports 114b, the EFEM 102 may include other combinations of load ports, such as one first load port 114a and three second load ports 114b.

[0017]

[0021] In some embodiments, the EFEM 102 includes a scan station 108 having a board ID reader for scanning one or more types of boards 112 to identify information. In some embodiments, the board ID reader includes a barcode reader or an optical character recognition (OCR) reader. The multi-chamber processing tool 100 is configured to use any identification information from the scanned one or more types of boards 112 to determine processing steps based on that identification information, for example, different processing steps for a first type of board 112a and a second type of board 112b. In some embodiments, the scan station 108 may also be configured to rotate to align the first type of board 112a or the second type of board 112b. In some embodiments, one or more of a plurality of automation modules 110 include the scan station 108.

[0018]

[0022] An EFEM robot 104 is positioned in the EFEM 102 and configured to transport a first type of substrate 112a and a second type of substrate 112b to a scan station 108 between a plurality of load ports 114. The EFEM robot 104 may include a substrate end effector for handling the first type of substrate 112a and a second end effector for handling the second type of substrate 112b. The EFEM robot 104 can rotate, or rotate and move linearly.

[0019]

[0023] Figure 2 shows a second type of substrate 112b according to at least some embodiments of the present disclosure. In some embodiments, the second type of substrate 112b is generally a tape frame substrate including a layer of backing tape 202 surrounded by a tape frame 204. When in use, a plurality of chiplets 206 can be attached to the backing tape 202. The plurality of chiplets 206 are generally formed by a singulation process that dices a semiconductor wafer 210 into a plurality of chiplets 206 or dies. In some embodiments, the tape frame 204 is made of a metal such as stainless steel. The tape frame 204 may have one or more notches 208 to facilitate alignment and handling. For a semiconductor wafer 210 having a diameter of 300 mm, the tape frame 204 may have a width of about 340 mm to about 420 mm and a length of about 340 mm to about 420 mm. The second type of substrate 112b may alternatively be a carrier plate configured such that a plurality of chiplets 206 are coupled to the carrier plate.

[0020]

[0024] Referring back to Figure 1, one or more process chambers 106 may be sealed and engaged with the transfer chamber 116. The transfer chamber 116 generally operates at atmospheric pressure, but can also be configured to operate at vacuum pressure. For example, the transfer chamber 116 may be a non-vacuum chamber configured to operate at atmospheric pressure of about 700 Torr or higher. In addition, although one or more process chambers 106 have generally been shown orthogonal to the transfer chamber 116, one or more process chambers 106 may be arranged diagonally to the transfer chamber 116, or in a combination of orthogonal and diagonal arrangements. For example, the second automation module 110b shows a pair of one or more process chambers 106 arranged diagonally to the transfer chamber 116.

[0021]

[0025] The transfer chamber 116 includes a buffer 120 configured to hold one or more first type substrates 112a. In some embodiments, the buffer 120 is configured to hold one or more first type substrates 112a and one or more second type substrates 112b. The transfer chamber 116 includes a transfer robot 126 configured to transfer the first type substrates 112a and second type substrates 112b between the buffer 120, one or more process chambers 106, and buffers located in adjacent automation modules of a plurality of automation modules 110. For example, the transfer robot 126 of the first automation module 110a is configured to transfer the first type substrates 112a and second type substrates 112b between the buffer 120 of the first automation module 110a and the second automation module 110b. In some embodiments, the buffer 120 is located within the internal area of ​​the transfer chamber 116, advantageously reducing the overall tool footprint. Furthermore, the buffer 120 may be open to the internal region of the transfer chamber 116 in order to facilitate access by the transfer robot 126.

[0022]

[0026] FIG. 3 is an isometric view showing a transfer chamber 116 of a plurality of automation modules 110 according to at least some embodiments of the present disclosure. The transfer chamber 116 is illustrated in a simplified form for purposes of explaining the main components. The transfer chamber 116 generally includes a frame 310 covered with plates (top plate 312 shown in FIG. 3, side plates not shown) so as to surround the transfer chamber 116. In some embodiments, the transfer chamber 116 has a width shorter than its length. The top plate 312 (or side plates) may include an access opening 316 that is selectively opened and closed for servicing the transfer chamber 116. The side plates include openings at the joint surfaces with at least one of the one or more process chambers 106, EFEM 102, or an adjacent transfer chamber. Although a rectangular or box-shaped transfer chamber 116 is illustrated in FIG. 3, the transfer chamber 116 may have other suitable shapes such as cylindrical, hexagonal, etc. The one or more process chambers 106 may be coupled orthogonally or obliquely to the transfer chamber 116.

[0023]

[0027] The transfer chamber 116 may have one or more environmental controls. For example, the airflow openings (e.g., access opening 316) of the transfer chamber 116 may include filters for filtering the airflow entering the transfer chamber 116. Other environmental controls may include one or more of humidity control, electrostatic control, temperature control, or pressure control.

[0024]

[0028] The transfer robot 126 is generally housed within the frame 310. The transfer robot 126 is configured to perform rotational movement or rotational and linear movement within the transfer chamber 116. In some embodiments, the transfer robot 126 moves linearly via rails on the floor of the transfer chamber 116 or via wheels under the transfer robot 126. The transfer robot 126 includes a telescoping arm 320 having one or more end effectors 330 that can extend into one or more process chambers 106 and adjacent automation modules. In some embodiments, the one or more end effectors 330 include a substrate end effector for handling a first type of substrate 112a and a second end effector for handling a second type of substrate 112b. In some embodiments, with respect to the transfer chamber 116 having a length of from about 2.0 to about 2.5 meters, the telescoping arm 320 may have a stroke length of up to about 1.0 meter. In some embodiments, the EFEM robot 104 is of the same type and configuration as the transfer robot 126 to enhance part commonality.

[0025]

[0029] The buffer 120 is housed within the frame 310, for example, in an internal region of the frame 310. In some embodiments, the buffer 120 is configured to rotate to align a first type of substrate 112a and a second type of substrate 112b in a desired manner. In some embodiments, the buffer 120 is configured to hold one or more types of substrates 112 in a vertical stack, advantageously reducing the footprint of the transfer chamber 116. For example, in some embodiments, the buffer 120 includes a plurality of shelves 322 for storing or holding one or more first type of substrates 112a and one or more second type of substrates 112b. In some embodiments, the plurality of shelves 322 are spaced apart vertically. In some embodiments, the buffer 120 includes six shelves. In some embodiments, the plurality of shelves includes two shelves for accommodating a second type of substrate 112b.

[0026]

[0030] Referring back to Figure 1, one or more process chambers 106 may include an atmospheric chamber configured to operate under atmospheric pressure and a vacuum chamber configured to operate under vacuum pressure. Examples of atmospheric chambers generally include wet cleaning chambers, radiation chambers, heating chambers, measurement chambers, bonding chambers, etc. An example of a vacuum chamber is a plasma chamber. The atmospheric chambers of the above types may also be configured to operate under vacuum as needed. One or more process chambers 106 may be any process chamber or module necessary to perform bonding processes, dicing processes, cleaning processes, plating processes, etc.

[0027]

[0031] In some embodiments, each of the multiple automation modules 110 has one or more process chambers 106, including at least one of the wet cleaning chamber 122, plasma chamber 130, degassing chamber 132, radiation chamber 134, or bonder chamber 140, such that the multi-chamber processing tool 100 includes at least one wet cleaning chamber 122, at least one plasma chamber 130, at least one degassing chamber 132, at least one radiation chamber 134, and at least one bonder chamber 140. One or more process chambers 106 can be positioned at any suitable location on the multi-chamber processing tool 100.

[0028]

[0032] The wet cleaning chamber 122 is configured to perform a wet cleaning process for cleaning one or more types of substrates 112 through a fluid such as water. The wet cleaning chamber 122 may include a first wet cleaning chamber 122a for cleaning a first type of substrate 112a, or a second wet cleaning chamber 122b for cleaning a second type of substrate 112b. The degassing chamber 132 is configured to perform a degassing process for removing moisture from the substrates 112, for example, through a high-temperature firing process. In some embodiments, the degassing chamber 132 includes a first degassing chamber 132a for the first type of substrate 112a and a second degassing chamber 132b for the second type of substrate 112b.

[0029]

[0033] The plasma chamber 130 may be configured to perform an etching process to remove unwanted materials, such as organic materials and oxides, from a first type substrate 112a or a second type substrate 112b. In some embodiments, the plasma chamber 130 includes a first plasma chamber 130a for the first type substrate 112a and a second plasma chamber 130b for the second type substrate 112b. The plasma chamber 130 may also be configured to perform an etching process to dice the substrate 112 into chiplets. In some embodiments, the plasma chamber 130 may be configured to perform a deposition process, such as a physical vapor deposition process or a chemical vapor deposition process, to coat the first type substrate 112a or the second type substrate 112b with a layer of the desired material.

[0030]

[0034] The radiation chamber 134 is configured to perform an irradiation process on a second type of substrate 112b in order to reduce adhesion between the multiple chiplets 206 and the backing tape 202. For example, the radiation chamber 134 may be an ultraviolet radiation chamber configured to expose the backing tape 202 to ultraviolet light, or a heating chamber configured to heat the backing tape 202. By reducing adhesion between the multiple chiplets 206 and the backing tape 202, the multiple chiplets 206 can be easily removed from the second type of substrate 112b.

[0031]

[0035] The bonder chamber 140 is configured to transfer and bond at least a portion of a plurality of chiplets 206 to one of the first type of substrates 112a. The bonder chamber 140 generally includes a first support 142 that supports one of the first type of substrates 112a and a second support 144 that supports one of the second type of substrates 112b.

[0032]

[0036] In some embodiments, one or more process chambers 106 of the first automation module 110a include at least one of a plasma chamber 130 or a degassing chamber 132, and include a wet cleaning chamber 122. In the exemplary embodiment of Figure 1, the first automation module 110a includes a first plasma chamber 130a and a second plasma chamber 130b on a first side of the first automation module 110a. In some embodiments, the first automation module 110a includes a first wet cleaning chamber 122a and a second wet cleaning chamber 122b on a second side opposite to the first side of the first automation module 110a. In some embodiments, the second automation module includes a radiation chamber 134 and at least one of a plasma chamber 130 or a degassing chamber 132.

[0033]

[0037] In some embodiments, the terminal automation module of a plurality of automation modules 110, for example, the third automation module 110c in Figure 1, includes one or more bonder chambers 140 (two shown in Figure 1). In some embodiments, the first of the two bonder chambers is configured to remove and bond chiplets having a first size, and the second of the two bonder chambers is configured to remove and bond chiplets having a second size. In some embodiments, any of the plurality of automation modules 110 includes a measurement chamber 118 configured to perform measurements of one or more types of substrates 112. In Figure 1, the measurement chamber 118 is shown as part of the second automation module 110b coupled to the transfer chamber 116 of the second automation module 110b. However, the measurement chamber 118 may be coupled to or located within any transfer chamber 116.

[0034]

[0038] The controller 180 controls the operation of any of the multi-chamber processing tools described herein, including the multi-chamber processing tool 100. The controller 180 may use direct control of the multi-chamber processing tool 100, or alternatively, by controlling a computer (or controller) associated with the multi-chamber processing tool 100. In the process, the controller 180 enables the collection and feedback of data from the multi-chamber processing tool 100 to optimize its performance. The controller 180 generally includes a central processing unit (CPU) 182, memory 184, and support circuits 186. The CPU 182 may be any form of general-purpose computer processor available for use in an industrial environment. The support circuits 186 are conventionally coupled to the CPU 182 and may include a cache, clock circuit, input / output subsystem, power supply, etc. When software routines, such as those described below, are stored in memory 184 and executed by the CPU 182, the CPU 182 can be transformed into a computer for a specific purpose (controller 180). The software routine may also be stored and / or executed by a second controller (not shown) located remotely from the multi-chamber processing tool 100.

[0035]

[0039] Memory 184 is a form of computer-readable storage medium that, when executed by CPU 182, contains instructions that facilitate the operation of semiconductor processes and equipment. The instructions in memory 184 are in the form of a program product, such as a program, that performs the method of the present principle. The program code may conform to one of a number of different programming languages. For example, the present disclosure may be executed as a program product stored in a computer-readable storage medium for use with a computer system. The program(s) in the program product define the function of the embodiment (including the method described herein). Exemplary computer-readable storage mediums include, but are not limited to, non-write storage mediums on which information is permanently stored (e.g., read-only memory devices in a computer, such as CD-ROM disks, flash memory, ROM chips, or any type of solid non-volatile semiconductor memory, readable by a CD-ROM drive) and writable storage mediums on which modifiable information is stored (e.g., floppy disks in a diskette drive or hard disk drive, or any type of solid random-access semiconductor memory). Such a computer-readable storage medium is an embodiment of the present principle if it carries computer-readable instructions that direct the function of the method described herein.

[0036]

[0040] Figure 4 is a schematic left isometric view showing a multi-chamber processing tool 100 having an equipment front-end module (EFEM) 102 with an overhead storage unit 410, according to at least some embodiments of the present disclosure. The overhead storage unit 410 generally includes a frame 402 and a plurality of storage shelves 412 coupled to the frame 402. In some embodiments, the plurality of storage shelves 412 are located above one or more load ports 114. In some embodiments, the one or more load ports include exactly four load ports.

[0037]

[0041] Multiple storage shelves 412 are configured to hold a front-opening unified pod (FOUP) 416 for storing one or more types of substrates 112. Multiple storage shelves 412 may be configured to hold FOUPs 416 of different sizes. A FOUP 416 may include one or more first FOUPs 416a configured to store one or more first types of substrates 112a, and one or more second FOUPs 416b configured to store one or more second types of substrates 112b. In some embodiments, one or more second FOUPs 416b are larger in size than one or more first FOUPs 416a. For example, in some embodiments, one or more second FOUPs 416b are taller than one or more first FOUPs 216a. In some embodiments, all of the multiple storage shelves 412 may be the same size. In some embodiments, the storage racks 412 may have a first size for accommodating one or more first FOUPs 416a and a second size for accommodating one or more second FOUPs 416b.

[0038]

[0042] In some embodiments, the multiple storage racks 412 are arranged along a plane common to multiple vertices and multiple horizontal rows. In some embodiments, the multiple vertices include more than two vertices. In some embodiments, a horizontal array 420 is positioned between the multiple storage racks 412 and one or more load ports 114, serving as a horizontal passage for FOUPs 416 during transport to one or more load ports 114. In some embodiments, the multiple storage racks 412 are arranged between the multiple vertices such that one or more vertical arrays 430 are positioned to serve as a vertical passage for FOUPs 416 during transport to one or more load ports 114.

[0039]

[0043] Figure 5 is an isometric schematic view showing a portion of the EFEM 102 according to at least some embodiments of the present disclosure. The EFEM 102 includes an overhead transport system 502 configured to transport FOUP 416 from an overhead storage unit 410 to one or more load ports 114. In some embodiments, the frame 402 includes a rear wall 508 and side walls 510 extending from the rear wall 508 and at least partially enclosing a plurality of storage racks 412.

[0040]

[0044] In some embodiments, the overhead transport system 502 includes a pair of vertical actuators 504. The pair of vertical actuators 504 are generally configured to transport the FOUP 416 vertically. In some embodiments, the pair of vertical actuators 504 are located on the opposite side of the overhead storage unit 410. In some embodiments, the pair of vertical actuators 504 are fixed horizontally to each other. In some embodiments, a plurality of storage racks 412 are arranged horizontally between the pair of vertical actuators 504. In some embodiments, the pair of vertical actuators 504 are coupled to the side walls 510 of the frame 402. In some embodiments, the frame 402 may include a cutout section 528 that accommodates one or more load ports 114.

[0041]

[0045] In some embodiments, the overhead transport system 502 includes one or more horizontal actuators 506 (one shown in Figure 5) coupled to a pair of vertical actuators 504 and configured to transport the FOUP horizontally. In some embodiments, at least one of the one or more horizontal actuators 506 includes a gripper 512 configured to transport the FOUP 416. In some embodiments, the pair of vertical actuators 504 are configured to move the gripper 512 vertically, and at least one of the one or more horizontal actuators 506 is configured to move the gripper 512 horizontally. The gripper 512 includes a clamp 516 configured to carry the FOUP 416 for transport. In some embodiments, the FOUP includes an upper handle 518 configured to engage with the clamp 516 to facilitate the transport of the FOUP. The upper handle 518 may have any suitable shape for selective engagement with the clamp 516. In some embodiments, the FOUP 416 includes one or more side handles 552 for transporting together with the clamp 516 or for manual transport by an operator.

[0042]

[0046] In some embodiments, the overhead storage unit 410 includes one or more manual loading stations 540. In some embodiments, the one or more manual loading stations 540 are located below a horizontal array 420. The overhead transport system 502 is configured to transport FOUP 416 from one or more manual loading stations 540 to one or more load ports 114. In some embodiments, the one or more manual loading stations 540 include two manual loading stations.

[0043]

[0047] In some embodiments, the frame 402 may form an enclosure (not shown) around the overhead storage unit 410. For example, the enclosure may include a front wall (not shown) having one or more doors for accessing one or more load ports 114, FOUP 416, and one or more manual load stations 540. In some embodiments, the frame 402 may be in the form of a cabinet.

[0044]

[0048] In some embodiments, one of the multiple storage racks 412 is a loading station 530 for FOUPs 416. In some embodiments, all FOUPs 416 are loaded from the loading station 530 onto the overhead storage unit 410. In some embodiments, the multi-chamber processing tool 100 includes a transfer robot 550 for transferring the FOUPs 416 to the loading station 530. In some embodiments, another of the multiple storage racks 412 is an unloading station 534 for FOUPs 416. In some embodiments, the loading station 530 and the unloading station 534 are arranged along the top row 526 of the multiple storage racks 412. The transfer robot 550 may be configured to unload the FOUPs 416 from the unloading station 534 when, for example, one or more types of substrates 112 are depleted. Alternatively, a separate transfer robot may be used for loading and unloading the FOUPs 416.

[0045]

[0049] To facilitate transportation, in some embodiments, each of the multiple storage racks 412 is positioned adjacent to one of one or more vertical arrays 430. In some embodiments, the multiple storage racks 412 are arranged along four or more cascaded rows. In some embodiments, at least some of the multiple storage racks 412 are aligned with one or more of the one or more load ports 114 and positioned vertically upward.

[0046]

[0050] While the above describes embodiments of the present disclosure, other and further embodiments of the present disclosure can be devised without departing from its basic scope.

Claims

1. A front-end module (EFEM), Two or more load ports for accepting two or more types of circuit boards, An overhead storage unit having a plurality of storage shelves positioned above the two or more load ports and configured to each hold two or more forward-opening unified pods (FOUPs) of different sizes that store two or more types of substrates, wherein a horizontal array is positioned between the plurality of storage shelves and the two or more load ports to provide a horizontal passage for the two or more types of FOUPs during transport to the two or more load ports, An overhead transport system having a pair of vertical actuators positioned on the opposite side of the overhead storage unit and configured to transport FOUPs from the overhead storage unit to two or more load ports, wherein the plurality of storage racks are positioned between the pair of vertical actuators, and EFEM equipped with

2. The EFEM according to claim 1, wherein the overhead transport system includes one or more horizontal actuators coupled to the pair of vertical actuators and configured to transport the FOUP horizontally.

3. The EFEM according to claim 2, wherein at least one of the one or more horizontal actuators includes a gripper configured to transport the FOUP, the pair of vertical actuators are configured to move the gripper vertically, and at least one of the one or more horizontal actuators is configured to move the gripper horizontally.

4. The EFEM according to claim 1, wherein the plurality of storage shelves are arranged in a plurality of vertical and a plurality of horizontal rows along a common plane.

5. The EFEM according to claim 4, further comprising one or more vertical arrays positioned between the plurality of tandem rows and configured to provide a vertical passage for FOUP during transport to the two or more load ports.

6. The EFEM according to claim 5, wherein each of the plurality of storage shelves is arranged adjacent to one of the one or more vertical arrays.

7. One or more FOUPs of a first type are placed in each of the aforementioned multiple storage shelves, One or more second types of FOUPs are placed in each of the aforementioned multiple storage shelves. The EFEM according to any one of claims 1 to 6, further comprising:

8. The EFEM according to any one of claims 1 to 6, wherein the two or more load ports include at least one load port configured to receive a semiconductor wafer and at least one load port configured to receive a tape frame substrate.

9. The EFEM according to any one of claims 1 to 6, wherein one of the plurality of storage shelves is a loading station for the FOUP, another of the plurality of storage shelves is an unloading station for the FOUP, and the loading station and the unloading station are arranged along the uppermost horizontal row of the plurality of storage shelves.

10. The EFEM according to any one of claims 1 to 6, wherein the overhead transport system includes one or more horizontal actuators coupled to the pair of vertical actuators, at least one of the one or more horizontal actuators includes a gripper configured to transport the FOUP, the gripper includes a clamp configured to carry the FOUP for transport.

11. The EFEM according to any one of claims 1 to 6, wherein the plurality of storage shelves are arranged along four or more vertical columns.

12. The EFEM according to any one of claims 1 to 6, wherein the plurality of storage shelves are arranged horizontally between the pair of vertical actuators.

13. The EFEM according to any one of claims 1 to 6, wherein the two or more load ports include exactly four load ports.

14. The EFEM according to any one of claims 1 to 6, wherein the overhead storage unit includes a frame and a plurality of storage shelves coupled to the frame, and the frame includes a rear wall and side walls extending from the rear wall and at least partially enclosing the plurality of storage shelves.

15. A multi-chamber processing tool for substrate processing, A device front-end module (EFEM) according to any one of claims 1 to 6, A plurality of automation modules, each having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules includes a transfer chamber and one or more process chambers coupled to the transfer chamber, and the transfer chamber includes a buffer configured to hold a plurality of two or more types of substrates. A multi-chamber processing tool equipped with the following features.

16. The multi-chamber processing tool according to claim 15, wherein the transfer chamber includes a transfer robot configured to transfer two or more types of substrates between the buffer, the one or more process chambers, and buffers located in adjacent automation modules of the plurality of automation modules.

17. The multi-chamber processing tool according to claim 15, wherein the one or more process chambers include one or more bonding chambers having a first support for supporting a first type of substrate of the two or more types of substrates and a second support for supporting a second type of substrate of the two or more types of substrates.

18. The multi-chamber processing tool according to claim 15, wherein the EFEM includes one or more manual loading stations, and the overhead transport system is configured to transport FOUPs from the one or more manual loading stations to two or more load ports.

19. The multi-chamber processing tool according to claim 15, wherein the one or more process chambers include a wet cleaning chamber and a degassing chamber.

20. The multi-chamber processing tool according to claim 15, wherein the transfer chamber is a non-vacuum chamber.

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