Light-emitting device

Abstract

Reduce the size of the package. [Solution] The package comprises a support portion and a surrounding portion joined to the support portion. The surrounding portion has a translucent portion comprising an inner surface in contact with the sealed space of the package and an outer surface in contact with the outside of the package. The support portion has a joining surface that joins to the surrounding portion, and a side surface that intersects the joining surface and is located between the inner surface and the outer surface in a top view taken from a direction perpendicular to the joining surface. The surrounding portion has a bottom surface that joins to the joining surface, and the side surface intersects the bottom surface.

Description

Technical Field

[0001] The present disclosure relates to a light-emitting device.

Background Art

[0002] Packages for encapsulating light-emitting elements have been developed. Patent Document 1 discloses a light-emitting device including a first substrate, a light-emitting element mounted on the first substrate, and a second substrate forming a space for encapsulating the light-emitting element. The second substrate is provided with a light guide hole through which light emitted from the light-emitting element passes. A light extraction window covers the light guide hole from the outside of the second substrate to seal the space.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] There are cases where it is desired to arrange other components while suppressing the optical path length of light from the light-emitting element. If a light-emitting device having a structure that allows other components to be mounted with a shorter distance from the light-emitting element can be provided, the degree of freedom when mounting other components is improved.

Means for Solving the Problems

[0005] The light-emitting device of the present disclosure, in an exemplary and non-limiting embodiment, includes a light-emitting element, a substrate that supports the light-emitting element, and one or more side wall portions joined to the substrate and surrounding the light-emitting element. The one or more side wall portions include a first side wall portion having a light incident surface on which light emitted from the light-emitting element and traveling in a first direction is incident and a light exit surface from which the light exits. The substrate has a joining surface that joins to the first side wall portion and a side surface that intersects the joining surface and is located between the light incident surface and the light exit surface in a top view seen from a direction perpendicular to the joining surface. [Effects of the Invention]

[0006] According to embodiments of this disclosure, it is possible to provide a light-emitting device that allows other components to be mounted at a shorter distance from the light-emitting element. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a top view of a light-emitting device according to the first embodiment of this disclosure. [Figure 2] Figure 2 is a cross-sectional view of the light-emitting device along the line II-II in Figure 1. [Figure 3] Figure 3 is a top view of the light-emitting device according to the first embodiment of this disclosure, with the first cap removed. [Figure 4] Figure 4 is a cross-sectional view corresponding to the cross-sectional view in Figure 2, which provides a more detailed explanation of the position of the side surface of the substrate. [Figure 5] Figure 5 is an enlarged cross-sectional view of portion X of the cross-sectional view in Figure 2. [Figure 6] Figure 6 is a top view of a light-emitting device according to the second embodiment of this disclosure. [Figure 7] Figure 7 is a cross-sectional view of the light-emitting device along the VII-VII section in Figure 6. [Figure 8] Figure 8 is a top view of the light-emitting device according to the second embodiment of this disclosure, with the first cap removed. [Figure 9] Figure 9 is a cross-sectional view of a light-emitting device according to the third embodiment of this disclosure. [Figure 10A] Figure 10A is a cross-sectional view of a light-emitting device according to the fourth embodiment of this disclosure. [Figure 10B] Figure 10B is a diagram illustrating the positional relationship between the first bonding member and the second bonding member and the FFP of the laser beam at the lens incident surface of the lens member in a light-emitting device according to the fourth embodiment of this disclosure. [Modes for carrying out the invention]

[0008] In this specification and in the claims, polygons such as triangles and quadrilaterals are not limited to polygons in a mathematically strict sense, but also include shapes in which the corners of a polygon have been rounded, chamfered, or otherwise processed. Furthermore, shapes in which processing has been applied not only to the corners (ends of the sides) of a polygon, but also to the middle part of the sides, are also referred to as polygons. In other words, shapes that retain the shape of a polygon as a base but have been partially processed are included in the "polygons" described in this specification and in the claims.

[0009] This applies not only to polygons, but also to words describing specific shapes such as trapezoids, circles, and concave shapes. The same applies when dealing with each side that forms such a shape. In other words, even if a corner or middle part of a side is processed, the processed part is still included in the definition of "side." When distinguishing a polygon or side without partial processing from a processed shape, the term "strictly" should be added, for example, "strictly quadrilateral."

[0010] In this specification or in the claims, if there are multiple elements identified by a certain name, and to distinguish each element, an ordinal number such as "first" or "second" may be added to the beginning of each element's name. For example, if the claim states that "a light-emitting element is arranged on a substrate," the specification may state that "a first light-emitting element and a second light-emitting element are arranged on a substrate." The ordinal numbers "first" and "second" are used to distinguish the two light-emitting elements. Element names with the same ordinal number may not refer to the same element in the specification and in the claims. For example, if elements identified by the terms "first light-emitting element," "second light-emitting element," and "third light-emitting element" are described in the specification, the "first light-emitting element" and "second light-emitting element" in the claims may correspond to the "first light-emitting element" and "third light-emitting element" in the specification. Furthermore, if the term "first light-emitting element" is used in claim 1 as described in the claims, and the term "second light-emitting element" is not used, the invention according to claim 1 only needs to have one light-emitting element, and that light-emitting element is not limited to the "first light-emitting element" in the specification, but may be a "second light-emitting element" or a "third light-emitting element".

[0011] In this specification or in the claims, terms indicating specific directions or positions (e.g., "up," "down," "right," "left," "front," "back") may be used. These terms are used solely for the purpose of clarifying the relative directions or positions in the referenced drawings. As long as the relative directional or positional relationships expressed by terms such as "up" and "down" in the referenced drawings are the same, the arrangement in drawings other than those disclosed, actual products, manufacturing equipment, etc., does not have to be identical to that in the referenced drawings.

[0012] The dimensions, dimensional ratios, shapes, and spacing of elements or components shown in the drawings may be exaggerated for clarity. Furthermore, some elements may be omitted from the drawings to avoid excessive complexity.

[0013] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The embodiments embody the technical idea of the present invention but do not limit the present invention. The numerical values, shapes, materials, etc. shown in the description of the embodiments are merely examples, and various modifications are possible as long as there is no technical contradiction. In the following description, elements specified by the same name and reference numeral are the same or similar elements, and redundant descriptions thereof may be omitted.

[0014] The light-emitting device according to an embodiment of the present disclosure may include one or more light-emitting elements, a substrate that supports the one or more light-emitting elements, one or more side wall portions joined to the substrate and surrounding the one or more light-emitting elements, an upper portion connected to the one or more side wall portions, one or more submounts, an optical member, a light-receiving element, a lens member, a beam combiner, a protection element represented by a Zener diode, and a temperature measurement element for measuring an internal temperature such as a thermistor.

[0015] In the light-emitting device according to an embodiment of the present disclosure, light emitted sideward from the one or more light-emitting elements disposed on the substrate enters the light incident surface of the first side wall portion and is emitted to the outside from the light emission surface of the first side wall portion. The first side wall portion is included in the one or more side wall portions.

[0016] <First Embodiment> Referring to FIGS. 1 to 5, the light-emitting device 100 according to the first embodiment of the present disclosure will be described. FIG. 1 is a top view of the light-emitting device 100. FIG. 2 is a cross-sectional view of the light-emitting device 100 taken along the II-II cross-sectional line of FIG. 1. In FIG. 2, for convenience of explanation, the protective element 61, the temperature measurement element 62, and the wiring 63 shown in FIG. 3 are omitted. FIG. 3 is a top view of the light-emitting device 100 with the first cap 14 removed. In FIG. 3, for ease of explanation, the outer edge of the first cap 14 is shown by a dotted line. FIG. 4 is a cross-sectional view corresponding to the cross-sectional view of FIG. 2 for explaining the position of the side surface of the substrate 11 in more detail. Similar to FIG. 2, in FIG. 4, the protective element 61, the temperature measurement element 62, and the wiring 63 shown in FIG. 3 are omitted. Also, in FIG. 4, the optical axis L of the light emitted from the light-emitting element 20 is shown by a dotted arrow. FIG. 5 is an enlarged cross-sectional view of the portion X of the cross-sectional view of FIG. 2.

[0017] In FIGS. 1 to 5, for reference, the X-axis, Y-axis, and Z-axis orthogonal to each other are shown. In addition, in other drawings other than FIGS. 1 to 5, for reference, the X-axis, Y-axis, and Z-axis orthogonal to each other are shown. Hereinafter, the directions of the X-axis, Y-axis, and Z-axis will be described as the X direction, Y direction, and Z direction, respectively. In each drawing, the X direction, Y direction, and Z direction are common.

[0018] The light-emitting device 100 includes a substrate 11, one or more light-emitting elements 20, and one or more side wall portions 12. In the illustrated example, the light-emitting device 100 further includes an upper portion 13, a submount 30, an optical member 40, a light-receiving element 50, a protective element 61, a temperature measurement element 62, and a wiring 63. Also, in the illustrated example, the light-emitting device 100 includes a first cap 14 having one or more side wall portions 12 and an upper portion 13.

[0019] First, each component will be described.

[0020] (Substrate 11) The substrate 11 is, for example, a flat plate. The substrate 11 may have an upper surface 11M, a lower surface located opposite the upper surface 11M, and a plurality of side surfaces. In the illustrated example, the substrate 11 has the upper surface 11M, the lower surface, and four side surfaces that are in contact with the four outer edges of the upper surface 11M, respectively. The upper surface 11M may be a plane. The upper surface 11M includes an arrangement surface 11Ma on which one or more components are arranged. The substrate 11 can be formed using ceramic as the main material. Examples of ceramics include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide. In the illustrated example, the size of the substrate 11 in the X direction may be, for example, 0.5 mm to 20 mm, and the size in the Z direction may be, for example, 0.5 mm to 20 mm. The size (thickness) in the Y direction may be, for example, 0.1 mm to 5 mm.

[0021] The upper surface 11M further includes a joint surface 11Mb. In the illustrated example, the joint surface 11Mb is located on the same plane as the placement surface 11Ma, and on the upper surface 11M, around the periphery of the placement surface 11Ma. It is located within the enclosure. However, the placement surface 11Ma and the bonding surface 11Mb may be located on different planes. One or more sidewall portions 12, described later, are bonded to the bonding surface 11Mb. A metal film for bonding may be formed on the bonding surface 11Mb. Examples of materials for forming this metal film include nickel, gold, titanium, platinum, copper, aluminum, iron, copper molybdenum, copper tungsten, and tungsten. The surface of the metal film formed from these materials may be further plated with Ni / Au (a metal film laminated in the order of Ni and Au) or Ti / Pt / Au (a metal film laminated in the order of Ti, Pt, and Au). In addition, the side surface of the substrate 11 that intersects with the bonding surface 11Mb is defined as side surface 11s. In the illustrated example, side surface 11s is parallel to the XY plane.

[0022] The substrate 11 may have one or more metal layers on its upper surface 11M. Specifically, one or more metal layers are provided on the placement surface 11Ma of the upper surface 11M. The one or more metal layers are formed from a conductor such as metal, patterned, and provided on the upper surface 11M. The one or more metal layers are electrically connected to electronic components, for example, placed on the placement surface 11Ma of the substrate 11, via metal wires. In the illustrated example, one or more metal layers are provided in each of the wiring region 16 and metal region 17 provided on the placement surface 11Ma. The wiring region 16 is provided along two sides of the outer edge of the placement surface 11Ma that extend in the Z direction. In other words, the wiring region 16 is provided along two sides of the inner edge of the bonding surface 11Mb that extend in the Z direction. The wiring region 16 is not provided along the entire length of the two sides that extend in the Z direction. In the illustrated example, the two wiring regions 16 are spaced apart in the X direction when viewed from above. Multiple metal layers are arranged in each wiring region 16. Alternatively, only one metal layer may be arranged in each wiring region 16.

[0023] The metal region 17 is provided across the entire area of ​​the placement surface 11Ma, excluding the wiring region 16. In the illustrated example, the metal region 17 has a T-shape. One metal layer is placed in the metal region 17. The metal layer on the placement surface 11Ma is electrically connected, for example, via via holes, to one or more metal layers provided on the lower surface of the substrate 11. The material of the metal layer provided on the placement surface 11Ma can be the same material as the metal film provided on the bonding surface 11Mb. However, the metal layer may be formed using a different material than the metal film provided on the bonding surface 11Mb.

[0024] (Side wall portion 12) The light-emitting device 100 has one or more sidewall portions 12 extending upward from the upper surface 11M of the substrate 11. The one or more sidewall portions 12 are joined to the bonding surface 11Mb of the substrate 11. More specifically, the one or more sidewall portions 12 are joined to the substrate 11 via a metal film provided on the bonding surface 11Mb. The one or more sidewall portions 12 are not joined to the placement surface 11Ma of the substrate 11. In other words, the region of the upper surface 11M to which the one or more sidewall portions 12 are joined is called the bonding surface 11Mb, and the region located inside the bonding surface 11Mb is called the placement surface 11Ma. The one or more sidewall portions 12 surround the placement surface 11Ma of the substrate 11 and extend upward from the upper surface 11M of the substrate 11. The one or more sidewall portions 12 surround, for example, one or more components placed on the placement surface 11Ma.

[0025] One or more sidewall portions 12 have one or more inner surfaces and one or more outer surfaces. One or more sidewall portions 12 include a first sidewall portion 12-1. The first sidewall portion 12-1 has an inner surface that includes at least a portion of a light incident surface 12a into which light is incident, and an outer surface that includes at least a portion of a light exit surface 12b into which light is emitted. In the illustrated example of the first sidewall portion 12-1, the entire inner surface is the light incident surface 12a, and the entire outer surface is the light exit surface 12b. An anti-reflective coating may be provided on the light incident surface 12a and / or the light exit surface 12b.

[0026] Here, "translucent" means the transmittance of light of any wavelength incident on that region. This means that the property of having 80% or more light absorption is satisfied. The first sidewall portion 12-1 includes a translucent region between the light incident surface 12a and the light emission surface 12b. The translucent region of the first sidewall portion 12-1 is formed from a translucent material such as glass, plastic, sapphire, or quartz. In other words, in the illustrated example, a translucent material exists between the light incident surface 12a and the light emission surface 12b. In the illustrated example, the entire first sidewall portion 12-1 is a translucent region. The light incident surface 12a and the light emission surface 12b may be parallel to each other and may be parallel to the XY plane. Parallelism here includes an error of ±5°. The light incident surface 12a and the light emission surface 12b may each be perpendicular to the upper surface 11M of the substrate 11. Perpendicularity here includes an error of ±5°. The light incident surface 12a and the light emission surface 12b may be inclined with respect to the upper surface 11M.

[0027] One or more sidewall portions 12 have a first sidewall portion 12-1 and a second sidewall portion 12-2 located on the opposite side of the upper surface 11M of the substrate 11 from the first sidewall portion 12-1. The second sidewall portion 12-2 has an inner surface and an outer surface. The inner surface of the second sidewall portion 12-2 faces the light incident surface 12a. The outer surface of the second sidewall portion 12-2 is located on the opposite side of the inner surface of the second sidewall portion 12-2. More specifically, this outer surface is located on the opposite side of the inner surface from the light incident surface 12a. In the illustrated example, the inner and outer surfaces of the second sidewall portion 12-2 are, for example, parallel to the XY plane. The second sidewall portion 12-2 is spaced apart from the first sidewall portion 12-1 in the Z direction.

[0028] One or more sidewall portions 12 further include a third sidewall portion 12-3 and a fourth sidewall portion 12-4 located opposite the third sidewall portion 12-3 across the upper surface 11M of the substrate 11. Each of the third sidewall portion 12-3 and the fourth sidewall portion 12-4 has an inner surface and an outer surface. The inner surface of the third sidewall portion 12-3 and the inner surface of the fourth sidewall portion 12-4 face each other. The fourth sidewall portion 12-4 is spaced apart from the third sidewall portion 12-3 in the X direction. The first sidewall portion 12-1 connects to the third sidewall portion 12-3 and the fourth sidewall portion 12-4. Similarly, the second sidewall portion 12-2 connects to the third sidewall portion 12-3 and the fourth sidewall portion 12-4. In the illustrated example, each of the first to fourth sidewall portions 12-1 to 12-4 is translucent. However, it is sufficient if at least the first side wall portion 12-1 of the four side wall portions is translucent.

[0029] Each of the one or more sidewall portions 12 has a lower surface. The first sidewall portion 12-1 has a lower surface 12c that intersects with an inner surface including the light incident surface 12a. The lower surface 12c further intersects with an outer surface including the light emission surface 12b. The first sidewall portion 12-1 is joined to the bonding surface 11Mb of the substrate 11 at its lower surface 12c. The one or more sidewall portions 12 other than the first sidewall portion 12-1 are also joined to the bonding surface 11Mb of the substrate 11 at their lower surfaces.

[0030] As shown in Figure 2 or Figure 3, in a top view, a portion of the first side wall portion 12-1 overlaps with the substrate 11 at the bonding surface 11Mb, and the remaining portion protrudes from the bonding surface 11Mb to the outside of the substrate 11. More specifically, a portion of the first side wall portion 12-1 protrudes from the bonding surface 11Mb to the side opposite to the placement surface 11Ma. Of the lower surface 12c of the first side wall portion 12-1, the area of ​​the lower surface 12c that is in contact with the bonding surface 11Mb is larger than the area of ​​the lower surface 12c that protrudes from the bonding surface 11Mb.

[0031] The first sidewall portion 12-1 protrudes from the substrate 11 in a direction perpendicular to the outer surface. In other words, the outer surface of the first sidewall portion 12-1 is located further outward than the side surface 11s when viewed from above. More specifically, in a direction perpendicular to the light incident surface 12a (or light emission surface 12b) of the first sidewall portion 12-1, the light emission surface 12b is located further away from the mounting surface 11Ma than the side surface 11s when viewed from above.

[0032] The lower surface 12c can be joined to the bonding surface 11Mb via a metal adhesive, metal bumps, or a bonding member containing metal. The metal adhesive and metal bumps may contain metals such as Au particles or AuSn. A solder containing [the specified element] is used. A metal film for joining, for example, is formed on the lower surface 12c.

[0033] The side surface 11s is located between the light incident surface 12a and the light emission surface 12b when viewed from above. The side surface 11s is located between the inner surface of the first side wall portion 12-1 including the light incident surface 12a and the outer surface of the first side wall portion 12-1 including the light emission surface 12b.

[0034] As illustrated in Figure 4, in the direction perpendicular to the light incident surface 12a (or light emission surface 12b), the distance d1 from the side surface 11s to the light incident surface 12a is greater than the distance d2 from the side surface 11s to the light emission surface 12b. The distance d2 is, for example, several tens of micrometers. The distance d1 is, for example, more than twice but less than five times the distance d2. Also, the distance d1 is, for example, more than 100 micrometers but less than 500 micrometers.

[0035] One or more sidewall portions 12 may be formed from a translucent material. Examples of translucent materials include glass, plastic, quartz, and sapphire. In the illustrated example, all sidewall portions 12 are formed from a translucent material. Alternatively, only the first sidewall portion 12-1 may be formed from a translucent material, while the other sidewall portions 12 are formed from non-translucent materials such as ceramic or silicon. Furthermore, only a portion of the first sidewall portion 12-1 may be formed from a translucent material to create a translucent region.

[0036] (Top 13) The upper part 13 has an upper surface and a lower surface 13b. In the illustrated example, the upper part 13 is located above the upper surface 11M of the substrate 11 and is connected to one or more side wall portions 12. The upper part 13 has a lower surface 13b that faces the upper surface 11M of the substrate 11.

[0037] A closed space V is formed by the substrate 11, one or more sidewalls 12, and the upper part. In the illustrated example, the closed space V is a sealed space and can be airtight.

[0038] The upper part 13 can be formed from the same material as, for example, one or more sidewall portions 12. For example, one or more sidewall portions 12 and the upper part 13 may be formed integrally. The light-emitting device 100 in the illustrated example includes a first cap 14 in which one or more sidewall portions 12 and the upper part 13 are integrally formed. Alternatively, one or more sidewall portions 12 and the upper part 13 may be formed separately and joined together with an adhesive or the like. In that case, the upper part 13 can be formed from a non-transparent material. Examples of non-transparent materials include silicon or ceramics.

[0039] In the illustrated example, the first cap 14 is formed from a translucent material such as glass, plastic, quartz, or sapphire, and can be manufactured using processing techniques such as etching. The first cap 14 is bonded to the bonding surface 11Mb of the substrate 11. For example, a closed space V is defined by the substrate 11, one or more side walls 12, and the upper part 13, and these together are sometimes referred to as a "package". In the illustrated example, the "package" is defined by the substrate 11 and the first cap 14 bonded to the substrate 11.

[0040] The first cap 14 in the illustrated example has a generally box-like shape. The outer shape of the first cap 14 is rectangular when viewed from above. However, the outer shape of the first cap 14 does not have to be rectangular; for example, when viewed from above, it may be a polygon other than a quadrilateral or a circle. The size of the first cap 14 in the X direction is, for example, 0.5 mm or more and 20 mm or less, and the size in the Z direction may be, for example, 0.5 mm or more and 20 mm or less. The size in the Y direction may be, for example, 0.2 mm or more and 5 mm or less.

[0041] (Light-emitting element 20) An example of the light-emitting element 20 is a semiconductor laser element (or laser diode). 0 may have a rectangular shape when viewed from above. If the light-emitting element 20 is an end-face emitting semiconductor laser element, the side that intersects one of the two shorter sides of this rectangle is the output end face 20E. The top and bottom surfaces of the light-emitting element 20 have a larger area than the output end face 20E. The light-emitting element 20 is not limited to an end-face emitting semiconductor laser element, but may be a surface-emitting semiconductor laser element such as a vertical-cavity surface-emitting laser (VCSEL), or a light-emitting diode (LED).

[0042] The light-emitting element 20 in the embodiments of this disclosure may have one or more light-emitting points on its exit end face 20E. The light-emitting element 20 may be a single emitter having one light-emitting point on its exit end face 20E, or it may be a multi-emitter having two or more light-emitting points on its exit end face 20E. The illustrated example of the light-emitting element 20 is a single emitter.

[0043] Here, let's add some explanation regarding the case where the light-emitting element 20 is an end-face emitting semiconductor laser element. The light (laser light) emitted from the exit end face of a semiconductor laser element is divergent light with a broad distribution. The laser light forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the exit end face. FFP is the shape and light intensity distribution of the emitted light at a position away from the exit end face.

[0044] The ray passing through the center of the FFP shape of the laser beam is called the optical axis of the laser beam. Light traveling along the optical axis exhibits a peak intensity in the optical intensity distribution of the FFP. In the embodiments of this disclosure, in the optical intensity distribution of the FFP, the peak intensity value is 1 / e 2 Light with the above intensity is called "main portion" light, and is defined as 1 / e of the peak intensity value. 2 Light with an intensity of less than 1 is called "peripheral" light, and thus distinguishes it from "primary" light. However, the distinction between "primary" and "peripheral" light may also be made by the beam diameter at which the intensity in the FFP light intensity distribution is half of the peak intensity value, known as the "full width at half maximum."

[0045] In the elliptical shape of the FFP of light emitted from the light-emitting element 20, which is a semiconductor laser element, the direction of the minor axis of the ellipse is called the slow axis direction, and the direction of the major axis is called the fast axis direction. Multiple layers, including the active layer, that constitute the semiconductor laser element can be stacked in the direction of the fast axis direction.

[0046] Based on the light intensity distribution of FFP, 1 / e of the light intensity distribution 2 The angle corresponding to this is defined as the angle of light divergence of the semiconductor laser element. The angle of light divergence in the fast axis direction is called the angle of light divergence in the fast axis direction, and the angle of light divergence in the slow axis direction is called the angle of light divergence in the slow axis direction. The angle of light divergence in the slow axis direction is smaller than the angle of light divergence in the fast axis direction.

[0047] As the light-emitting element 20, for example, a semiconductor laser element that emits blue light, a semiconductor laser element that emits green light, or a semiconductor laser element that emits red light can be used. Alternatively, a semiconductor laser element that emits other types of light may be used.

[0048] Here, blue light is defined as light whose emission peak wavelength is in the range of 420 nm to 494 nm. Green light is defined as light whose emission peak wavelength is in the range of 495 nm to 570 nm. Red light is defined as light whose emission peak wavelength is in the range of 605 nm to 750 nm.

[0049] Examples of semiconductor laser elements that emit blue light or green light include semiconductor laser elements containing nitride semiconductors. Examples of nitride semiconductors that can be used include GaN, InGaN, and AlGaN. Examples of semiconductor laser elements that emit red light include those containing InAlGaP, GaInP, GaAs, and AlGaAs semiconductors.

[0050] (Submount 30) The submount 30 in the illustrated example has a top surface and a bottom surface located opposite the top surface, and has a rectangular parallelepiped shape. However, the shape of the submount 30 is not limited to a rectangular parallelepiped. The top and bottom surfaces of the submount 30 can each function as two bonding surfaces. The submount 30 can be formed from, for example, silicon nitride, aluminum nitride, or silicon carbide. A metal film for bonding may be provided on each of the top and bottom surfaces of the submount 30. The top surface may further be provided with a plurality of wiring regions for electrical connection to other components.

[0051] (Optical component 40) The optical element 40 has a partial reflective surface. The partial reflective surface reflects some of the incident light and transmits the remaining light. The partial reflective surface functions as a beam splitter. Light incident on the partial reflective surface is split into two beams of light, each traveling in a different direction. The two separated beams of light each contain light of the same wavelength. The optical element 40 splits the same wavelength component of the incident light into two in a predetermined ratio. For example, one of the two beams of light split by the optical element 40 may be used as the main beam (hereinafter referred to as the "main beam"), and the other may be used as a monitoring beam (hereinafter referred to as the "monitor beam") to control the main beam. The optical element 40 in the embodiments of this disclosure may be a rectangular parallelepiped, as illustrated in Figure 2 or Figure 3.

[0052] When incident light is split into main light and monitor light, the intensity of the monitor light is less than the intensity of the main light. A partially reflective surface, for example, transmits 80% to 99.5% of the incident light and reflects 0.5% to 20.0% of the incident light.

[0053] (Photodetector 50) The light-receiving element 50 has a bonding surface, a light-receiving surface 51, and multiple side surfaces. The light-receiving surface 51 is located on the opposite side of the bonding surface. The external shape of the light-receiving element 50 is a rectangular parallelepiped. However, it may have an external shape other than a rectangular parallelepiped.

[0054] The light-receiving surface 51 has a rectangular shape, and the length of the light-receiving surface in the X direction is greater than the length of the light-receiving surface in the Z direction. The light-receiving surface 51 may be provided with a plurality of light-receiving regions 52, each of which receives light. An example of the light-receiving element 50 is a photoelectric conversion element (photodiode) that outputs an electrical signal corresponding to the intensity or amount of incident light.

[0055] The light-receiving element 50 has multiple wiring regions 53. The same hatching is applied to the multiple wiring regions 53 shown in Figure 3. The multiple wiring regions 53 may be provided on the light-receiving surface 51. Note that the multiple wiring regions 53 may also be provided on surfaces other than the light-receiving surface 51, such as the side surfaces. The wiring regions 53 are electrically connected to the light-receiving region 52. Wiring may be provided on the light-receiving surface 51 to electrically connect the wiring regions 53 and the light-receiving region 52.

[0056] (Protection element 61) The protection element 61 is a circuit element that prevents excessive current from flowing through a specific element (for example, the light-emitting element 20) and causing it to be destroyed. A typical example of the protection element 61 is a constant voltage diode such as a Zener diode. A Si diode can be used as the Zener diode.

[0057] (Temperature measuring element 62) The temperature measuring element 62 is an element used as a temperature sensor to measure the ambient temperature. For example, a thermistor can be used as the temperature measuring element 62.

[0058] (Wiring 63) The wiring 63 is composed of a conductor having a linear shape with joints at both ends. In other words, the wiring 63 has joints at both ends of the linear portion for joining to other components. The wiring 63 is, for example, a metal wire. Examples of metals include gold, aluminum, silver, and copper.

[0059] (Light-emitting device 100) Next, an example configuration of the light-emitting device 100 will be described.

[0060] The light-emitting device 100 according to the first embodiment comprises a substrate 11, a first cap 14 including one or more side wall portions 12 and an upper portion 13, and one or more light-emitting elements 20. In the illustrated example, the light-emitting device 100 comprises three light-emitting elements 20. However, the number of light-emitting elements 20 is not limited to three, and may be one, two, or four or more. One or more light-emitting elements 20 are arranged on the placement surface 11Ma of the substrate 11. More specifically, one or more light-emitting elements 20 are arranged on the metal region 17 of the placement surface 11Ma. In the illustrated example, each light-emitting element 20 is an end-face emitting semiconductor laser element. One or more light-emitting elements 20 emit light in, for example, a first direction. Here, the first direction is a direction parallel to the optical axis of the light emitted by one or more light-emitting elements 20. The first direction is a direction perpendicular to the light incident surface 12a. In the illustrated example, the first direction coincides with the Z direction. The three light-emitting elements 20 each emit light of a different color, selected from, for example, red light, green light, and blue light. The light-emitting elements 20 may also emit light other than visible light, such as infrared light.

[0061] The light-emitting device 100 may further include a submount 30. The submount 30 is bonded to the placement surface 11Ma of the substrate 11 on its lower surface. More specifically, the submount 30 is positioned in a metal region 17 of the placement surface 11Ma. The submount 30 may be bonded to the placement surface 11Ma via a bonding member formed from metal, such as a metal adhesive containing, for example, Au particles, metal bumps containing metal such as gold-tin or solder, or a solder alloy.

[0062] One or more light-emitting elements 20 are directly or indirectly supported by the substrate 11. In the illustrated example of the light-emitting device 100, one or more light-emitting elements 20 are arranged on the mounting surface 11Ma of the substrate 11 via a submount 30. One or more light-emitting elements 20 are arranged in a second direction on the upper surface of the submount 30. Here, the second direction is perpendicular to the first direction and parallel to the upper surface 11M of the substrate 11. In the illustrated example, the second direction coincides with the X direction. The light-emitting elements 20 may be bonded to the upper surface of the submount 30 via bonding members formed from metal, such as a metal adhesive containing, for example, Au particles, metal bumps containing metal such as gold-tin or solder, or solder alloy.

[0063] The light-emitting device 100 may further include one or more protective elements 61 and a temperature measuring element 62. One or more protective elements 61 may be arranged on the mounting surface 11Ma of the substrate 11. More specifically, the protective elements 61 are arranged in a wiring region 16 located to the side of the submount 30. In the illustrated example, protective elements 61 are arranged in two wiring regions 16, respectively. Multiple metal layers provided in the two wiring regions 16 shown in Figure 3 are given the same hatching. The light-emitting device 100 illustrated in Figure 3 includes three protective elements 61. Each of the three protective elements 61 is arranged across two metal layers. Two wires connecting to one light-emitting element 20 are joined to the two metal layers on which one protective element is arranged.

[0064] The temperature measuring element 62, like the protective element 61, may be positioned in the lateral region on the mounting surface 11Ma. The temperature measuring element 62 is positioned in a metal layer provided in one of the wiring regions 16. Wiring 63 connecting to the temperature measuring element 62 is joined to a metal layer adjacent to the metal layer where the protective element 61 is positioned.

[0065] The light-emitting device 100 in the illustrated example further comprises an optical member 40 and a light-receiving element 50. The light-receiving element 50 is placed in a metal region 17 on the placement surface 11Ma of the substrate 11. The length in the second direction of the metal region 17 where the light-receiving element 50 is placed is longer than the length in the second direction of the metal region 17 where the submount 30 is placed. The optical member 40 is placed on the light-receiving surface 51 of the light-receiving element 50. The optical member 40 and the light-receiving element 50 are placed between one or more light-emitting elements 20 and the first cap 14, in a position that crosses the light emitted from the light-emitting elements 20. In other words, the optical member 40 and the light-receiving element 50 are placed between one or more light-emitting elements 20 and the first side wall portion 12-1.

[0066] The light-receiving element 50 is joined to the placement surface 11Ma at the bonding surface. The light-receiving element 50 can be joined to the placement surface 11Ma via a bonding member formed from metal, such as a metal adhesive containing Au particles, metal bumps containing metal such as gold-tin or solder, or a solder alloy. In addition, the multiple wiring regions 53 of the light-receiving element 50 and the metal layer placed in the wiring region 16 are connected via wiring 63.

[0067] As shown in Figure 3, three light-receiving regions 52 corresponding to the three light-emitting elements 20 are provided on the light-receiving surface 51. The three light-receiving regions 52 are arranged on the light-receiving surface 51 along the X direction, similar to the three light-emitting elements 20. This makes it possible to control the main light using the monitor light for each light-emitting element 20.

[0068] As shown in Figure 4, light emitted from the light-emitting element 20 is incident on the optical element 40. A portion of the light incident on the optical element 40 is reflected by the partial reflective surface and directed towards the light-receiving region 52 on the light-receiving surface 51 of the light-receiving element 50. The light incident on the light-receiving region 52 is used as monitor light. A portion of the light incident on the optical element 40 passes through the partial reflective surface and is emitted toward the first side wall portion 12-1 of the first cap 14.

[0069] One or more light-emitting elements 20, a submount 30, an optical member 40, and a light-receiving element 50 are arranged on the placement surface 11Ma of the substrate 11. The first cap 14 is mounted on the upper surface 11M of the substrate 11 so as to surround these elements. The first cap 14 is bonded to a bonding surface 11Mb provided around the periphery of the placement surface 11Ma of the substrate 11. As a result, one or more sidewall portions 12 surround the one or more light-emitting elements 20 arranged on the placement surface 11Ma. The one or more light-emitting elements 20 are arranged in a sealed space formed by the substrate 11, the one or more sidewall portions 12, and the upper part 13. The optical member 40 and the light-receiving element 50 are also arranged in the sealed space. The first cap 14 hermetically seals the one or more elements, including the light-emitting elements 20, arranged on the placement surface 11Ma. By hermetically sealing the space in which the light-emitting elements 20 are arranged, quality degradation due to dust collection can be suppressed.

[0070] One or more sidewall portions 12 include a first sidewall portion 12-1 having a light incident surface 12a into which light emitted from each light-emitting element 20 and traveling in a first direction is incident, and a light exit surface 12b from which the said light is emitted. Light emitted from the optical member 40 is incident on the light incident surface 12a of the first sidewall portion 12-1, passes through the interior of the first sidewall portion 12-1, and is emitted to the outside of the first cap 14 from the light exit surface 12b.

[0071] Here, referring to Figure 4, we define the virtual plane P, points Q1 and Q2. In Figure 4, the optical axis L of the light emitted from the light-emitting element 20 is shown by a dotted arrow, and the virtual plane P is shown by a dashed line. The plane that includes the side surface 11s of the substrate 11 and is parallel to the side surface 11s is called the "virtual plane P". The intersection of the optical axis L of the light and the virtual plane P is called point Q1, and the intersection of the optical axis L of the light and the light incident surface 12a is called point Q2. In the light-emitting device 100 illustrated in Figure 4, the light incident surface 12a of the first side wall portion 12-1, the light emission surface 12b, and the side surface 11s of the substrate 11 are parallel. In other words, the light incident surface 12a, the light emission surface 12b, and the virtual plane P are parallel. Here, parallelism includes an error of ±5° or less.

[0072] The optical axis L of the light emitted from the light-emitting element 20 intersects with the virtual plane P. In a top view, point Q1 is located between the light incident surface 12a and the light emission surface 12b of the first side wall portion 12-1. In the light-emitting device 100 illustrated in Figure 4, in a direction perpendicular to the bonding surface 11Mb, the height h1 of point Q2 from the bonding surface 11Mb is greater than half the height h2 of the lower surface 13b of the upper part 13 included in the first cap 14 from the bonding surface 11Mb. Also, in a direction perpendicular to the bonding surface 11Mb, the light-receiving surface 51 of the light-receiving element 50 is located below point Q2. This allows the light emitted from the light-emitting element 20 and reflected downward by the partial reflective surface of the optical member 40 to be directed towards the light-receiving surface 51.

[0073] Referring to Figure 5, the bonding between the substrate 11 and the first cap 14 will be explained. A metal film 98 is provided on the side surface 11s of the substrate 11. As mentioned above, the lower surface 12c of the side wall portion 12 and the bonding surface 11Mb of the substrate 11 are bonded via, for example, solder 99. In this case, some of the solder 99 may not remain between the lower surface 12c and the bonding surface 11Mb, but may overflow to the outside of the package (the positive Z-direction side in the illustrated example), potentially forming, for example, spherical solder balls. The solder 99 does not wet and spread on the ceramic surface, which may be the material of the substrate 11, and as a result, solder balls may form on the side surface 11s or the lower surface 12c. The detachment of the formed solder balls may cause malfunction of the light-emitting device. In contrast, by providing a metal film 98 on the side surface 11s, solder that flows outward beyond the outer edge of the substrate 11 wets and spreads on the metal film 98. This suppresses the formation of spherical solder balls. Furthermore, even if solder balls are formed, the contact area between the solder balls and the substrate 11 is increased, which helps to suppress the detachment of the solder balls. In this way, by providing a metal film 98 on the side surface 11s, the occurrence of defects during the manufacturing of the light-emitting device can be reduced.

[0074] <Second Embodiment> Next, a light-emitting device according to the second embodiment will be described with reference to Figures 6 to 8.

[0075] The light-emitting device 200 according to the second embodiment differs from the light-emitting device 100 according to the first embodiment in that it comprises one or more lens members, and further differs from the light-emitting device 100 according to the first embodiment in that the substrate 11 has a mounting surface 11Mc. Figure 6 is a top view of the light-emitting device 200 according to the second embodiment. Figure 7 is a cross-sectional view of the light-emitting device 200 along the VII-VII section in Figure 6. In Figure 7, the optical axis L of the light emitted from the light-emitting element 20 is indicated by a dotted arrow, and the aforementioned virtual plane P is indicated by a dashed line. Figure 8 is a plan view of the light-emitting device 200 with the first cap 14 removed. In Figure 8, for clarity, the outer edge of the first cap 14 is indicated by a dotted line.

[0076] In the light-emitting device 200 according to the second embodiment, the substrate 11 has a mounting surface 11Mc, and one or more lens members are arranged on the mounting surface 11Mc. In the illustrated example, the light-emitting device 200 further includes a beam combiner 80 on the mounting surface 11Mc. Hereafter, the description will focus on the configurations that differ from the first embodiment, and the description of common configurations will be omitted as appropriate.

[0077] (Lens component 70) The lens member 70 has an upper surface 70a, a lower surface 70b, a lens incident surface 71 into which light is incident, and a lens exit surface 72 into which light is emitted. The lens exit surface 72 may have a spherical or aspherical lens shape. The lens member 70 collimates light incident on the lens incident surface 71, for example. Note that the lens member 70 may be a focusing lens instead of a collimating lens. The lens member 70 may be formed from a light-transmitting material, such as glass, plastic, or resin.

[0078] (Beam combiner 80) The beam combiner 80 emits combined light by coaxially aligning the light emitted from multiple incident light-emitting elements. The beam combiner 80 may have a structure in which multiple optical elements 81 are joined together. The optical elements 81 may be formed from transparent materials such as glass or plastic that transmit visible light. The optical elements 81 are realized, for example, by dichroic mirrors. The dichroic mirrors may have dielectric multilayer films having predetermined wavelength selectivity. The dielectric multilayer films may be formed from Ta2O5 / SiO2, TiO2 / SiO2, Nb2O5 / SiO2, etc.

[0079] (Circuit board 11) The upper surface 11M of the substrate 11 of the light-emitting device 200 has a placement surface 11Ma, a bonding surface 11Mb, and a mounting surface 11Mc. Hereafter, the placement surface 11Ma and the bonding surface 11Mb may be collectively referred to as the "first surface," and the mounting surface 11Mc may be referred to as the "second surface."

[0080] The substrate 11 further has a mounting surface 11Mc that intersects the side surface 11s and extends away from the light-emitting element 20 relative to the side surface 11s. The mounting surface 11Mc extends from the side surface 11s along the XZ plane. In a direction perpendicular to the bonding surface 11Mb, the mounting surface 11Mc is located below the bonding surface 11Mb. In other words, the second surface is located below the first surface. A step exists between the first surface and the second surface. The step is defined by the side surface 11s and the mounting surface 11Mc. In a direction perpendicular to the bonding surface 11Mb, the height h3 between the first surface and the second surface, i.e., the height h3 between the bonding surface 11Mb and the mounting surface 11Mc, is, for example, 100 μm or more and 500 μm or less.

[0081] In a top view, the protruding portion of the first side wall portion 12-1 that extends beyond the bonding surface 11Mb overlaps with the mounting surface 11Mc. The height h3 from the mounting surface 11Mc to the bonding surface 11Mb is smaller than the height h4 from the bottom surface 11b of the substrate 11 to the mounting surface 11Mc. The height h4 is, for example, 200 μm or more and 1 mm or less, and preferably, for example, 400 μm or more and 500 μm or less.

[0082] (Light-emitting device 200) In the light-emitting device 200, one or more lens members 70 are arranged on the mounting surface 11Mc of the substrate 11 and are located outside the first cap 14. Similarly, the beam combiner 80 is arranged on the mounting surface 11Mc and is located outside the first cap 14. In the optical path of the light emitted from the light-emitting element 20, the light-emitting element 20, the optical member 40, the first sidewall portion 12-1, the lens member 70, and the beam combiner 80 are arranged in this order in the direction of the arrow on the Z axis (+Z direction). The lens member 70 receives light emitted from the light-emitting element 20 and transmitted through the first sidewall portion 12-1. The beam combiner 80 is arranged on the mounting surface 11Mc and receives light emitted from the lens member 70.

[0083] Light emitted from the light-emitting surface 12b of the first side wall portion 12-1 is incident on the lens-incident surface 71 of the lens member 70. Furthermore, multiple beams of light collimated by the lens member 70 are incident on the beam combiner 80. The multiple beams of light are coupled coaxially, and the combined light is emitted from the beam combiner 80.

[0084] The lens member 70 has a lens incident surface 71 facing the side surface 11s of the substrate 11. In the first direction (i.e., the Z direction), the distance d3 between the lens incident surface 71 and the side surface 11s (or virtual surface P) is smaller than the distance d1 between the side surface 11s (or virtual surface P) and the light incident surface 12a. In the first direction, the distance d3 is, for example, 100 μm or more and 500 μm or less. Making the distance d3 smaller than the distance d1 is advantageous in that the optical path length of the laser light can be shortened. Also, by making the distance d1 relatively larger, the bonding area between the bonding surface 11Mb and the lower surface 12c can be confirmed. This can improve joint strength.

[0085] A gap G exists between the lens incident surface 71 of the lens member 70 and the light-emitting surface 12b of the first side wall portion 12-1. In the first direction, the distance d4 between the lens incident surface 71 and the light-emitting surface 12b may be, for example, 1000 μm or less. The gap G ensures a degree of freedom for centering the lens member 70.

[0086] The lower surface 70b of the lens member 70 is joined to the mounting surface 11Mc via a bonding member 90. The bonding member 90 may be formed from an adhesive such as an ultraviolet-curable resin or a thermosetting resin. As the ultraviolet-curable resin, an epoxy resin or an acrylate resin adhesive can be used. As the thermosetting resin, an epoxy resin or a silicone resin adhesive can be used. In the first direction, a portion of the bonding member 90 extends beyond the light-emitting surface 12b to the side surface 11s. In the example shown in Figure 7, the overall width of the bonding member 90 in the Z direction is, for example, about 200 μm to 2000 μm. Also, in the Z direction, the width of the portion of the bonding member 90 located on the side surface 11s side beyond the light-emitting surface 12b may be, for example, about 50 to 100 μm. The thickness of the bonding member 90 in the Y direction is, for example, 30 μm to 300 μm.

[0087] According to the light-emitting device of the second embodiment, in a top view, a portion of the bonding member 90 that protrudes beyond the side surface 11s of the lens member 70 beyond the lens incident surface 71 can be directed into the space between the side surface 11s of the substrate 11 and the light-emitting surface 12b of the first side wall portion 12-1. This makes it less likely for the bonding member 90 to interfere with the first side wall portion 12-1 of the first cap 14. This makes it possible to arrange the lens incident surface 71 of the lens member 70 and the light-emitting surface 12b of the first side wall portion 12-1 closer together, thereby shortening the distance d4. Consequently, the optical path length from the light-emitting element 20 to the lens incident surface 71 of the lens member 70 can be shortened. In other words, reducing the distance from the light-emitting element 20 to the lens incident surface 71 allows for a reduction in the area of ​​the lens incident surface 71, which is advantageous for miniaturizing the light-emitting device.

[0088] The lower part of the first surface of the substrate 11, located inside the first cap 14, has via wiring, while the lower part of the second surface, located outside the first cap 14, does not necessarily have via wiring.

[0089] <Third Embodiment> A light-emitting device according to the third embodiment will be described with reference to Figure 9.

[0090] The light-emitting device according to the third embodiment differs from the light-emitting device 200 according to the second embodiment in that it further comprises a surrounding body 15, and further differs from the light-emitting device 200 according to the second embodiment in that the upper surface 70a of the lens member 70 and the lower surface 15b of the surrounding body 15 are joined via a joining member. The differences from the light-emitting device 200 according to the second embodiment will be mainly described below.

[0091] Figure 9 is a cross-sectional view of the light-emitting device 300. The cross-section of the light-emitting device 300 shown in Figure 9 corresponds to the cross-section of the light-emitting device 200 shown in Figure 7.

[0092] The light-emitting device 300 further comprises a surrounding body 15. In the illustrated example, the surrounding body 15 is a second cap 15. Hereafter, a light-emitting device 400 comprising the second cap 15 will be described. The second cap 15 may be formed from the same material as the first cap 14, such as glass, plastic, quartz, or sapphire. The surrounding body 15 only needs to have a structure that surrounds its interior, and may be, for example, a package-shaped member that covers the entire component.

[0093] In the illustrated example, the second cap 15, like the first cap 14, has a generally box-like shape. The second cap 15 is bonded to the upper surface 11M of the substrate 11. The second cap 15 is provided to cover the above and sides of the plurality of light-emitting elements 20, one or more side wall portions 12, and the lens member 70. In the illustrated example, it is further provided to cover the above and sides of the beam combiner 80 and the first cap 14.

[0094] In the light-emitting device 300, similar to the light-emitting device 200 of the second embodiment, the lower surface 70b of the lens member 70 is joined to the mounting surface 11Mc of the substrate 11 via the first joining member 91. In the light-emitting device 300, the upper surface 70a of the lens member 70 is further joined to the lower surface 15b of the second cap 15 via the second joining member 92. In the first direction, the second joining member 92 extends beyond the light-emitting surface 12b to the light-incident surface 12a side. A portion of the second joining member 92 is located in the gap between the first cap 14 and the second cap 15.

[0095] The first joining member 91 and the second joining member 92 may be formed from the same material or from different materials. Each of the first joining member 91 and the second joining member 92 may be formed from an adhesive such as an ultraviolet-curable resin or a thermosetting resin. Each of the first joining member 91 and the second joining member 92 may be formed from an ultraviolet-curable resin or from a thermosetting resin. Alternatively, the first joining member 91 may be formed from an ultraviolet-curable resin and the second joining member 92 may be formed from a thermosetting resin. Or the reverse may also be true.

[0096] According to the light-emitting device 300 of the third embodiment, the lens member 70 is fixed on both the upper surface 70a and the lower surface 70b of the lens member 70. This reduces the movement of the lens member 70 in the direction perpendicular to the lower surface 70b (Y direction) due to the expansion or contraction of the first joining member 91 and the second joining member 92.

[0097] <Fourth Embodiment> The light-emitting device according to the fourth embodiment will be described with reference to Figures 10A and 10B.

[0098] The light-emitting device according to the fourth embodiment differs from the light-emitting device 200 according to the second embodiment in that the first joining member 91 and the second joining member 92 are provided on the light-emitting surface 12b of the first side wall portion 12-1. The differences from the light-emitting device 200 according to the second embodiment will be mainly described below.

[0099] Figure 10A is a cross-sectional view of the light-emitting device 400. The cross-sectional position of the light-emitting device 400 shown in Figure 10A corresponds to the cross-sectional position of the light-emitting device 200 shown in Figure 7 or the light-emitting device 300 shown in Figure 9. Figure 10B is a diagram illustrating the positional relationship between the first joining member 91 or the second joining member 92 and the FFP of the laser beam at the lens incident surface 71 of the lens member 70. In Figure 10B, the lens incident surface 71 is shown with a dashed line, and the FFP of the laser beam irradiated onto the lens incident surface 71 is shown with a dotted line.

[0100] The dotted outline of the FFP indicates the shape of the beam diameter of the main portion of the light emitted from the light-emitting element 20. The lens optical axis L2 of the lens member 70 shown in Figure 10B roughly coincides with the optical axis L1 of the light emitted from the light-emitting element 20 and passes through the center of the FFP of the laser beam.

[0101] In the illustrated example of the light-emitting device 400, the lens incident surface 71 of the lens member 70 and the light-emitting surface 12b of the first side wall portion 12-1 are joined at a first joining point 12s via a first joining member 91, and further joined at a second joining point 12t via a second joining member 92. In the illustrated example, the second joining member 92 does not come into contact with the mounting surface 11Mc.

[0102] The first bonding point 12s on the light-emitting surface 12b is located relative to the lens optical axis L2 of the lens member 70. The first joint location 12s is located above the upper end light incidence position 71a at the lens incidence surface 71, where light La passing through the upper end of the FFP of the laser beam is incident. The second joint location 12t at the light emission surface 12b is located below the lens optical axis L2 of the lens member 70. More specifically, the second joint location 12t is located below the lower end light incidence position 71b at the lens incidence surface 71, where light Lb passing through the lower end of the FFP of the laser beam is incident. This arrangement of joint members prevents interference between the first joint member 91, the second joint member 92 and the main portion of the laser beam. No joint members are provided on the lower surface 70b of the lens member 70, and the lower surface 70b of the lens member 70 is separated from the mounting surface 11Mc. In addition to the first joining member 91 and the second joining member 92, a joining member may also be provided between the lower surface 70b of the lens member 70 (see Figure 7) and the mounting surface 11Mc of the substrate 11.

[0103] The materials used for the first joining member 91 and the second joining member 92 are the same materials as the first joining material and the second joining material used in the light-emitting device 300 according to the third embodiment. Furthermore, whether the first joining member 91 and the second joining member 92 are formed from the same material or from different materials can be appropriately selected, as in the third embodiment.

[0104] According to the light-emitting device 400, the lens incident surface 71 is joined to the light-emitting surface 12b via a first joining member 91 and a second joining member 92. By joining in this manner, the misalignment of the optical axis of the lens member 70 due to the expansion or contraction of the joining members can be reduced. The expansion or contraction of the first joining member 91 and the second joining member 92 mainly affects the movement of the lens member 70 in the direction perpendicular to the lens incident surface (Z direction), and has little effect on the movement in the direction perpendicular to the lower surface 70b of the lens member 70 (Y direction). This reduces the influence on the misalignment of the lens optical axis L2 of the lens member 70.

[0105] While embodiments of the present invention have been described above, the light-emitting device according to the present invention is not strictly limited to the light-emitting devices of the embodiments. In other words, the present invention is not limited to the external form and structure of the light-emitting device disclosed in the embodiments. For example, it may be a light-emitting device without protective elements. Furthermore, it can be applied without requiring all components to be provided in sufficient quantities. For example, if some of the components of the light-emitting device disclosed in the embodiments are not described in the claims, a degree of design freedom for those skilled in the art is permitted for those components, such as substitution, omission, modification of shape, or change of material, and the invention described in the claims is then specified to be applicable.

[0106] In addition to the embodiments described above, this specification discloses light-emitting devices as described in the following appendix.

[0107] [Note 1] Light-emitting element and A substrate supporting the light-emitting element, Bonded to the substrate, one or more side wall portions surrounding the light-emitting element, Equipped with, The one or more side wall portions include a first side wall portion having a light incident surface into which light emitted from the light-emitting element and traveling in a first direction is incident, and a light exit surface from which the light is emitted. The substrate has a bonding surface that is bonded to the first side wall, and a side surface that intersects the bonding surface and is located between the light incident surface and the light emission surface when viewed from above in a direction perpendicular to the bonding surface.

[0108] [Note 2] The first side wall portion has a lower surface that is joined to the joining surface, The light incident surface intersects the lower surface and is the light-emitting device described in Appendix 1.

[0109] [Note 3] The optical axis of the light intersects with a virtual plane that includes the side surface and is parallel to the side surface. The light-emitting device according to Appendix 1 or 2, wherein, in the above view, the intersection point of the optical axis of the light and the virtual surface is located between the light incident surface and the light emission surface.

[0110] [Note 4] The light-emitting device according to any one of the appendices 1 to 3, wherein, in the first direction, the distance from the side surface to the light incident surface is greater than the distance from the side surface to the light emission surface.

[0111] [Note 5] The upper part further comprises one or more side wall portions connected to the aforementioned side wall portions, The light-emitting element is placed within a sealing space formed by the substrate, the one or more side walls, and the upper part. The light-emitting device according to any one of the appendices 1 to 4, wherein, in a direction perpendicular to the joining surface, the height from the joining surface of the intersection point of the optical axis of the light and the light incident surface is greater than half the height from the joining surface of the lower surface of the upper part.

[0112] [Note 6] The sealing space further comprises a light-receiving element, The light-receiving element has a light-receiving surface that receives a portion of the light, The light-emitting device according to Appendix 5, wherein the light-receiving surface is located below the intersection point in a direction perpendicular to the bonding surface.

[0113] [Note 7] The substrate further has a mounting surface that intersects with the side surface and extends with respect to the side surface on the side opposite to the light-emitting element, The light-emitting device according to any one of the appendices 1 to 6, wherein, in a direction perpendicular to the bonding surface, the mounting surface is located below the bonding surface.

[0114] [Note 8] The light-emitting device according to Appendix 7, wherein the distance between the bonding surface and the mounting surface in a direction perpendicular to the bonding surface is 100 μm or more and 500 μm or less.

[0115] [Note 9] The lens member is arranged on the mounting surface and has a lens incident surface that is into which the light is incident and faces the side surface, The light-emitting device according to Appendix 7 or 8, wherein, in the first direction, the distance between the lens incident surface and the side surface is smaller than the distance between the side surface and the light incident surface.

[0116] [Note 10] The light-emitting device according to Appendix 9, wherein a gap exists between the lens incident surface and the light-emitting surface.

[0117] [Note 11] The light-emitting device according to Appendix 9 or 10, wherein in the first direction, the distance between the lens incident surface and the light-emitting surface is 1000 μm or less.

[0118] [Note 12] The lens member is bonded to the mounting surface via the first bonding member. In the first direction, a portion of the first joining member is on the side side of the light emitting surface. A light-emitting device described in any of appendices 9 to 11, which reaches up to [a certain point].

[0119] [Note 13] The substrate is bonded to the surrounding body which is provided to cover the light-emitting element, the one or more side wall portions, and the lens member above and to the sides, The lens member has an upper surface and a lower surface. The upper surface of the lens member is joined to the lower surface of the surrounding body via the second joining member. In the first direction, the second joining member extends beyond the light emission surface to the light incidence surface side, as described in Appendix 12.

[0120] [Note 14] The light-emitting device according to any one of the appendices 9 to 13, wherein the lens incident surface and the light-emitting surface are joined via a first joining member at a first joining location located above the optical axis of the lens member, and are joined via a second joining member at a second joining location located below the optical axis of the lens member.

[0121] [Note 15] The second joining member is not in contact with the mounting surface, as described in Appendix 14 of the light-emitting device. [Industrial applicability]

[0122] The light-emitting device according to this embodiment can be used in head-mounted displays, projectors, lighting, displays, and the like. [Explanation of Symbols]

[0123] 11: Board, 11M: Top surface, 11Ma: Placement surface, 11Mb: Bonding surface, 11Mc: Mounting surface, 11b: Bottom surface, 11s: Side surface, 12: Side wall section, 12-1: First side wall section, 12-2: Second side wall section, 12-3: Third side wall section, 12-4: Fourth side wall section, 12a: Light incident surface, 12b: Light exit surface, 12c: Bottom surface, 12s: First joint, 12t: Second joint, 13: Top, 13b: Bottom surface, 14: First cap, 15: Second cap, 15b: Bottom surface, 16: Wiring region, 17: Metal region, 20: Light emitting element, 20E : Exit end face, 30: Submount, 40: Optical component, 50: Photodetector, 51: Photodetector surface, 52: Photodetector area, 53: Wiring area, 61: Protective element, 62: Temperature measuring element, 63: Wiring, 70: Lens component, 70a: Top surface, 70b: Bottom surface, 71: Lens incident surface, 71a: Upper end light incident position, 71b: Lower end light incident position, 72: Lens exit surface, 80: Beam combiner, 81: Optical component, 90: Joining member, 91: First joining member, 92: Second joining member, 98: Metal film, 99: Solder, 100~400: Light-emitting device

Claims

1. A package having a sealing space, It comprises a support portion and a surrounding portion joined to the support portion, The surrounding portion has a light-transmitting portion comprising an inner surface in contact with the sealed space and an outer surface in contact with the outside of the package. The support portion has a joining surface that joins to the surrounding portion, and a side surface that intersects with the joining surface and is located between the inner surface and the outer surface when viewed from above in a direction perpendicular to the joining surface. The surrounding portion has a lower surface that is joined to the joining surface, The aforementioned side intersects with the aforementioned bottom surface, forming a package.

2. The package according to claim 1, A light-emitting element provided inside the package, Equipped with, The light-emitting element is supported by the support portion, A light-emitting device in which the inner surface is a light incident surface to which light emitted from the light-emitting element and traveling in a first direction is incident, and the outer surface is a light emission surface from which the light is emitted.

3. The optical axis of the light intersects with a virtual plane that includes the side surface and is parallel to the side surface. The light-emitting device according to claim 2, wherein, in the top view, the intersection point of the optical axis of the light and the virtual surface is located between the light incident surface and the light emission surface.

4. The light-emitting device according to claim 2, wherein in the first direction, the distance from the side surface to the light incident surface is greater than the distance from the side surface to the light emission surface.

5. It further comprises an upper part connected to the aforementioned encircling portion, The sealing space is formed by the support portion, the surrounding portion, and the upper portion. The light-emitting device according to claim 2, wherein, in a direction perpendicular to the joining surface, the height from the joining surface of the intersection point of the optical axis of the light and the light incident surface is greater than half the height from the joining surface of the lower surface of the upper part.

6. In a direction perpendicular to the aforementioned bonding surface, the mounting surface located below the aforementioned bonding surface, The lens member is further arranged on the mounting surface and has a lens incident surface that is into which the light is incident and faces the side surface, The light-emitting device according to claim 2, wherein in the first direction, the distance between the lens incident surface and the side surface is smaller than the distance between the side surface and the light incident surface.

7. The light-emitting device according to claim 6, wherein a gap exists between the lens incident surface and the light-emitting surface.

8. The light-emitting device according to claim 6, wherein in the first direction, the distance between the lens incident surface and the light-emitting surface is 1000 μm or less.

9. The light-emitting device according to claim 7, wherein the distance between the lens incident surface and the light-emitting surface is smaller than the distance between the lens incident surface and the side surface.

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