Rework system and optimization program used therein

Abstract

The objective is to create a rework system and an optimization program for use therein that improve the overall efficiency of rework operations while reducing the workload of workers engaged in rework. [Solution] A rework system comprising a rework device 20 for performing rework work, a rack 30 having multiple storage spaces for storing circuit boards, a stocker device 40 for supplying and returning circuit boards, and a control unit 100 for controlling and automatically performing the operations of the rework device 20 and the stocker device 40, wherein the control unit 100 has a rework order calculation function that, based on rack information which links inspection information regarding defective components obtained in advance from an inspection device 70 for inspecting the mounting state of electronic components on the circuit boards with position information of each circuit board stored in each storage space of the rack 30, performs at least the selection of tools to be used for rework work and the determination of the order in which the circuit boards to be reworked are performed.

Description

Technical Field

[0001] The present invention relates to a rework system for rearranging electronic components such as semiconductor elements on a substrate and an optimization program used therefor.

Background Art

[0002] An appearance inspection or the like is performed on an electronic component soldered to a substrate. When the inspection result is determined to be defective, a removal tool (for example, a heating nozzle or a suction bit) is used to heat the solder to remove the defective component from the substrate. After cleaning, a rework apparatus that attaches a new electronic component to the substrate is known (see, for example, Patent Document 1).

[0003] On the other hand, a substrate inspection system that performs an appearance inspection of a substrate according to an inspection program is known (see, for example, Patent Document 2). The inspection data for each substrate obtained in such a substrate inspection system is shared with a rework apparatus and used for removing defective components from the substrate and attaching new electronic components to the substrate (hereinafter referred to as "rework operation").

[0004] In addition, as means for supplying and returning (collecting) the substrate, a rack that accommodates a plurality of substrates stacked horizontally in the height direction, and a stocker apparatus (substrate transfer apparatus) that has a lifter and a transfer machine and supplies and returns the substrate between the rack and the rework apparatus is known (see, for example, Patent Document 3).

[0005] Then, the inventor of the present case combined the above-described rack, stocker apparatus, and rework apparatus to construct a rework system that automates the rework operation (removal of defective components and / or attachment of new electronic components to a plurality of substrates on which defective components are mounted), thereby reducing the labor during the rework operation for large substrates used particularly in data centers and the like.

Prior Art Documents

Patent Documents

[0006] [Patent Document 1] Japanese Patent Publication No. 2019-016774 [Patent Document 2] Japanese Patent Publication No. 2012-151250 [Patent Document 3] Japanese Patent Application Publication No. 5-186014 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] By the way, typically a single circuit board contains, for example, BGA (Ball Gauge). Multiple different electronic components are mounted, such as Grid Array (hereinafter the same) type semiconductor elements, QFP (Quad Flat Package (hereinafter the same)) type semiconductor elements, or chip components. Therefore, it is necessary to prepare multiple types of rework tools according to the type and size of the electronic components, and to select the appropriate tool for each electronic component to be reworked.

[0008] However, in the conventional rework system described above, rework work was performed in the order in which the boards were stored in the rack, for example, from the lower layer to the upper layer. This meant that the tools used had to be changed each time a board was replaced, and since changing tools took a certain amount of time, there was a need to improve the overall work efficiency of the rework system.

[0009] The present invention aims to solve the problems of the prior art described above by creating a rework system and an optimization program for use therein that improve the overall efficiency of rework operations by shortening the time required for tool changes and reduce the workload of workers engaged in rework operations. [Means for solving the problem]

[0010] Among the means for solving the above problems, the first means of the present invention is: A rework system comprising: a rework device having multiple tools to perform one or both of the rework operations of removing defective components mounted on a circuit board and reattaching new electronic components to the circuit board from which the defective components have been removed; a rack having multiple storage spaces for storing the circuit boards; a stocker device for supplying and returning the circuit boards between the rack and the rework device; and a control unit for controlling and automating the operations of the rework device and the stocker device, The control unit is characterized in that it has a rework order calculation function that performs at least the following based on rack information which links inspection information regarding defective components obtained in advance from an inspection device for inspecting the mounting state of electronic components on the substrate and position information of each substrate stored in each storage space of the rack: selecting the tool to be used for the rework work and determining the order in which the substrates to be reworked will be performed. The above method minimizes the number of tool changes by determining the order in which the circuit boards to be reworked are processed. This reduces the time required for tool changes and improves the overall efficiency of the rework process.

[0011] Furthermore, a second means of the present invention adds to the first means described above, the rework order calculation function, upon acquiring rack information for the next rack, includes confirming that the same electronic component that is the subject of rework work on the last board of the previous rack is present on any board in the next rack, and performing optimization as necessary. With the above method, when moving from rework work on one rack to rework work on the next rack, the tools used for the previous rack can be used without changing them, thus increasing the overall efficiency of the rework work.

[0012] Furthermore, a third means of the present invention adds to the first or second means described above, a means comprising: a substrate supply step of supplying substrates from the storage space of a rack to a rework device using a stocker device; a tool exchange step of exchanging a tool from a plurality of tools to one that is appropriate for the substrate; a rework work step of performing rework work using the exchanged tool; and a substrate retrieval step of returning the substrates for which the rework work has been completed to their original storage space in the rack using the stocker device. The above method can increase the automation rate of rework operations, thereby reducing the labor required for rework operations, particularly on large circuit boards used in data centers and the like.

[0013] Furthermore, a third means of the present invention is an optimization program used in the rework system described in the first or second means above, A first function involves supplying a circuit board with only specific defective components mounted from a rack to a rework device, performing rework on the specific defective components using a tool corresponding to the specific defective components, and then returning the circuit board to the rack, and performing this process for all circuit boards with only specific defective components mounted. A second function that supplies a circuit board on which multiple defective components, including the specific defective component, are mounted from the rack to a rework device, performs rework on the specific defective component using a tool corresponding to the specific defective component, and then returns the circuit board to the rack, and performs this process for all circuit boards on which multiple defective components, including the specific defective component, are mounted. A third function is performed on all boards that have the other defective components mounted on them, after the completion of the second function on the last board of a group of boards on which multiple defective components, including the specific defective component, are mounted, by replacing the tool used with a tool corresponding to the other defective components remaining on the last board, performing rework on the other defective components remaining on the last board, and then returning the last board to the rack. Supply a substrate on which only the other defective parts are mounted from the rack to the rework device, and after performing a rework operation on the other defective parts using the tool after replacement, return the substrate to the rack. A fourth function is to perform this process for all substrates on which only the other defective parts are mounted. In the above means, since it is possible to determine the order of substrates that minimizes the number of tool replacements, the time required for tool replacement can be shortened, and the efficiency of the entire rework operation can be improved.

Effect of the Invention

[0014] In the present invention, by shortening the time required for tool replacement, the efficiency of the entire rework operation can be improved, and the labor of workers engaged in the rework operation can be reduced.

Brief Description of the Drawings

[0015] [Figure 1] It is a schematic configuration diagram showing an embodiment of the rework system of the present invention. [Figure 2] It is a flowchart for determining the work procedure of the rework operation. [Figure 3] It is an explanatory diagram showing a first embodiment of the rework operation. [Figure 4] It is an explanatory diagram showing a second embodiment of the rework operation. [Figure 5] It is a diagram showing an example of a monitor screen during the rework operation.

Mode for Carrying Out the Invention

[0016] Hereinafter, embodiments of the present invention will be described with reference to the drawings. [Rework System] As shown in FIG. 1, the rework system 10 of the present invention includes a rework device 20 that selects an appropriate tool according to an electronic component and performs a rework operation on a substrate, a rack 30 that stores each substrate in a horizontally stacked state in the height direction, a stocker device 40 that takes out a substrate from the rack 30 and supplies it to the rework device 20 and / or returns the substrate from the rework device 20 to a predetermined position in the rack 30 after the rework operation is completed, a monitor 50 that displays the work procedure, progress status, etc. of the rework operation, and a control unit 100 that controls the operations of the rework device 20, the stocker device 40, etc. according to the rack information and a predetermined optimization program 60 described later and causes them to be automatically performed. In addition, the optimization program 60 and the control unit 100 may be configured by a dedicated arithmetic system as shown in FIG. 1, or may be configured to use an arithmetic unit provided inside the rework device 20.

[0017] Although the details of the rework device 20 are omitted, as in the above-mentioned conventional (see Patent Document 1), at least a movable table that holds a substrate on which an electronic component is mounted and is movable in two axial directions orthogonal to each other in a horizontal plane, and a rework tool that is movable in a direction along a vertical axis and is rotatable around the vertical axis and includes a selected dedicated suction bit and a heating nozzle (IR heater), and moves to an arbitrary position on the substrate to perform a rework operation on the electronic component. It has a movable head unit, a camera unit that photographs the component-side electrodes provided on the electronic component and the land electrodes on the substrate, a soldering mechanism that electrically connects the component-side electrodes and the land electrodes, and a drive mechanism that drives the movable table, the movable head unit, the camera unit, the soldering mechanism, etc. In addition, a plurality of types of tools are prepared according to the types of electronic components.

[0018] The rack 30 includes a plurality of storage spaces for accommodating substrates in a housing. In this embodiment, it has seven storage spaces from the first space 31 at the bottommost stage to the seventh space 37 at the uppermost stage.

[0019] The stocker device 40 is comprised of an elevator 41 that has the function of taking out substrates 1 to 7 from any of the storage spaces from the first space 31 to the seventh space 37 provided in the rack 30, and the function of returning each substrate to its original storage space in the rack 30, and a transporter (loading device) 42 that has the function of transporting the substrates taken out of the rack 30 using the elevator 41 onto the movable table of the rework device 20. The stocker device 40 operates in response to commands from the control unit 100 which operates according to a predetermined optimization program 60.

[0020] Next, we will describe the rework process in the rework system 10 consisting of the above configuration. In the following, the rework process will be described using the removal of electronic components as an example. (Initial settings) All circuit boards are first inspected using an X-ray inspection device 70. The inspection information, which is the inspection result regarding the mounting status of the circuit boards acquired by the inspection device 70, is provided to the PC (personal computer) of the worker (operator), as described later, via, for example, an online cloud. The contents of the inspection information include, for example, the management number of the circuit board, the type of circuit board, the location of the electronic component determined to be defective on the circuit board, and the type of electronic component determined to be defective.

[0021] Circuit boards containing electronic components that have been determined to be defective are collected and placed by a worker into one of the storage spaces from the first space 31 to the seventh space 37 within the rack 30. Rack information for circuit boards 1 to 7 stored in the first space 31 to the seventh space 37 is sent from the worker's PC to the control unit 100 of the rework system 10. Here, rack information refers to information about which of the first space 31 to the seventh space 37 a circuit board with certain inspection information is stored in, and means information that links the inspection information of the circuit board with the position information of each circuit board stored in each storage space. Such rack information is sent to the control unit 100 each time the storage of circuit boards into the rack 30 is completed, but sometimes multiple rack information is sent at once, or rack information is sent at an intermediate stage where not all of circuit boards 1 to 7 have been stored.

[0022] (Determining the work procedure for rework) Figure 2 is a flowchart for determining the work procedure for rework. As shown in Figure 2, the control unit 100 (1) acquires rack information and, according to the program, calculates the order in which the boards to be reworked (determining the work procedure) (rework order calculation function). That is, (2) first selects the tool to be used for the rework for each type of electronic component that has been determined to be defective (converting component type to tool type). Next, (3) sets the board with the electronic component that can be removed using the tool currently attached to the movable head as the first step in the work procedure. From there, the boards are rearranged in order from the fewest to the most boards, while still being able to continue using the same tool. (4) Furthermore, if rack information for the next rack 30 is acquired, it checks whether the same defective component to be removed from the last board in the previous rack 30 is present on any board in the next rack 30 (that the tool can continue to be used). If the board is found to be present, the work order for the next rack 30 is set so that the board with the same defective component is the first to be reworked. If the board is not present, the work order is optimized from there, if possible based on the current progress. This eliminates the need for a tool change during the first rework operation of the next rack 30, thereby increasing the efficiency of the rework process. Furthermore, the reason for arranging the boards in order from the fewest to the most numerous components in (3) above is that the boards with the most components will be the last to be processed. This increases the likelihood that the electronic components mounted on the first board of the next rack 30 will be the same as those mounted on the last board of the previous rack 30, thus increasing the probability that the same tool can be used continuously without changing tools.

[0023] (First embodiment) In the following, in the first embodiment, the case where there are two types of electronic components that are determined to be defective and need to be removed will be described as the first defective component a and the second defective component b. For example, the first defective component a is a chip component such as a resistor, and the second defective component b is a BGA type semiconductor element. Furthermore, among the multiple tools, the dedicated tool used to remove the first defective component a will be described as the first tool A, and similarly, the dedicated removal tool used to remove the second defective component b will be described as the second tool B. Furthermore, information on the first defective part a and the second defective part b is provided to the control unit 100 via the worker's PC as inspection information. The control unit 100 also determines from this inspection information whether the tool to be used in the first embodiment is the first tool A or the second tool B.

[0024] (Removal of electronic components) Based on the work procedure and optimization program 60 determined in the previous "determination of rework procedure," the control unit 100 drives the rework system 10 to automatically remove the electronic components determined to be defective from each circuit board. Figure 3 is an explanatory diagram showing a first embodiment of the rework process. As shown in Figure 3, the bottommost first space 31 houses the circuit board 1 with the first defective component a mounted on it, the second space 32 of the second stage houses the circuit board 2 with the second defective component b mounted on it, the third space 33 of the third stage houses the circuit board 3 with the first defective component a mounted on it, the fourth space 34 of the fourth stage houses the circuit board 4 with the second defective component b mounted on it, the fifth space 35 of the fifth stage houses the circuit board 5 with both the first defective component a and the second defective component b mounted on it, the sixth space 36 of the sixth stage houses the circuit board 6 with the second defective component b mounted on it, and the topmost seventh space 37 houses the circuit board 7 with the first defective component a mounted on it.

[0025] (Procedure 1) First, the process begins with the circuit board 7 located in the topmost 7th space 37. The control unit 100 drives the elevator 41 of the stocker device 40 to remove the circuit board 7 from the 7th space 37 of the rack 30 and transfer it to the transporter 42, and then drives the transporter 42 to supply the circuit board 7 onto the movable table of the rework device 20 (circuit board supply process). Next, the control unit 100 has the movable head unit replace the first tool A corresponding to the circuit board 7 from among several removal tools (tool replacement process). Note that if the removal tool attached to the movable head unit before the start of the work is the first tool A, the tool replacement process is omitted. Then, the movable head unit uses the replaced first tool A to remove the first defective part a (rework process). More specifically, the control unit 100 uses a suction bit, which constitutes the first tool A, to pick up the first defective component a, and also uses a heating nozzle, which also constitutes the first tool A, to heat the first defective component a and melt the solder, thereby removing the first defective component a from the substrate 7. Finally, the control unit 100 drives the conveyor 42 and the lifter 41, which constitute the stocker device 40, to return the substrate 7 from which the first defective component a has been removed back to its original seventh space 37 in the rack 30 (substrate retrieval process) (first function).

[0026] (Procedure 1, Step 2) Next, the control unit 100 performs the same removal operation as in the first operation procedure 1 on the first defective component a of the circuit board 3 housed in the third space 33 of the third stage (first function). However, since the removal tool used here is the same as the first tool A used in the first operation procedure 1, a tool replacement step is unnecessary.

[0027] (Step 1, Procedure 3) Next, the control unit 100 causes the circuit board 1 housed in the first space 31 of the first stage (lowest stage) to perform the same removal operation as in the first work procedure 2 described above (first function).

[0028] (Procedure 4 of the first operation) Next, the control unit 100 removes the first defective component a by performing the same substrate supply process and rework process as described above on the substrate 5 housed in the fifth space 35 of the fifth stage (second function). Next, the control unit 100 drives the movable head to replace the removal tool from the first tool A to the second tool B (tool replacement process). Then, the control unit 100 has the movable head use the newly selected second tool B to remove the second defective part b (rework process). More specifically, the control unit 100 uses the suction bit of the second tool B to pick up the second defective part b, and also uses the heating nozzle of the second tool B to heat the second defective part b, melting the solder and removing the second defective part b from the substrate 5. Finally, the control unit 100 drives the transporter 42 and the lifter 41 to return the substrate 5, from which the first defective part a and the second defective part b have been removed, to its original fifth space 35 in the rack 30 (substrate retrieval process) (third function).

[0029] (Procedure 5 of the first operation) Next, the control unit 100 performs the same removal operation as in the first work procedure 1 on the second defective component b of the circuit board 6 housed in the sixth space 36 of the sixth stage. However, since the removal tool used here can be the same second tool B that was replaced in the first work procedure 4, a tool replacement step is unnecessary (fourth function). (Procedure 6 of the first operation) Next, the control unit 100 removes the second defective component b from the circuit board 4 by performing the same removal procedure as in the first work procedure 5 on the circuit board 4 housed in the fourth space 34 of the fourth stage (fourth function). (Procedure 7 of the first operation) Finally, the second defective component b is removed from the circuit board 2 by performing the same removal procedure as in the first work procedure 6 described above on the circuit board 2 housed in the second space 32 of the second stage (fourth function).

[0030] As a result, the removal of all electronic components determined to be defective, mounted on all circuit boards 1 through 7 stored in rack 30, can be completed. In the removal of the electronic components described above, by following the first work procedure, the removal tool only needs to be replaced once, eliminating the need to replace the removal tool each time the circuit board is replaced as in the past. This significantly reduces the time required for replacing the removal tool, and as a result, improves the overall efficiency of the rework process.

[0031] (Second example) Figure 4 is an explanatory diagram showing a second embodiment of the rework process. In the second embodiment, we will explain the case where there are three types of electronic components on a single substrate that are determined to be defective and need to be removed, using the first defective component a, the second defective component b, and the third defective component c. For example, the first defective component a is a chip component such as a resistor, the second defective component b is a BGA type semiconductor element, and the third defective component c is a QFP type semiconductor element. Furthermore, the special tool used to remove the first defective component a will be called the first tool A, the special tool used to remove the second defective component b will be called the second tool B, and the special tool used to remove the third defective component c will be called the third tool C. In addition, "Second work sequence" refers to the work procedure in the second embodiment that was determined in the "Determination of rework procedure" above.

[0032] (Second work procedure 1, 2, and 3) The second work procedures 1, 2, and 3 are operations targeting the first defective part a, similar to the first work procedure 1 described above, and are the same as the first work procedures 1, 2, and 3 described above (first function).

[0033] (Second work procedure 4) In the second work procedure 4, the same work as in the first work procedure 4 is performed first. That is, the first defective component a is removed from the circuit board 5 housed in the fifth space 35 of the fifth stage by performing the same circuit board supply process and rework process as described above (second function). Next, the movable head is driven to replace the removal tool from the first tool A to the second tool B (tool replacement process). Then, the control unit 100 performs the removal of the second defective part b using the new second tool B (rework process). Finally, the control unit 100 drives the transporter 42 and the lifter 41 to return the circuit board 5, from which the first defective part a and the second defective part b have been removed, back to its original fifth space 35 in the rack 30 (circuit board retrieval process) (third function). Note that the circuit board 5 is in a state with the third defective part c mounted on it.

[0034] (Second work procedure 5) Next, the circuit board 6 housed in the sixth space 36 of the sixth stage is subjected to the circuit board supply process, the removal process of the second defective component b (rework process), and the recovery process of the circuit board (fourth function). Since the second tool B, which was replaced in the second work procedure 4, can be used again, a tool replacement process is unnecessary.

[0035] (Second work procedure 6) Next, the same removal procedure as in the second work procedure 5 described above is performed on the second defective component b of the circuit board 4 housed in the fourth space 34 of the fourth stage (fourth function). Since the tool used here is also the second tool B, a tool change procedure is unnecessary.

[0036] (Second work procedure 7) Next, the same substrate supply process as described above is performed on the substrate 5 housed in the fifth space 35 of the fifth stage, and then the third defective component c is removed by sequentially performing the tool replacement process, rework process, and substrate retrieval process (third function). In the tool replacement process, the removal tool is replaced from the second tool B to the third tool C.

[0037] (Second work procedure 8) Finally, the third defective component c is removed from the circuit board 2 housed in the second space 32 of the second stage by sequentially performing the same circuit board supply process and rework process as described above (fourth function). Note that the removal tool used here is the third tool C, so a tool change process is unnecessary.

[0038] As a result, the removal of defective electronic components from all circuit boards housed in rack 30 can be completed. In the removal of the three types of electronic components in the second embodiment described above, by performing the work according to the second work procedure, the tool replacement work is reduced to two times, eliminating the need to replace the tool every time the circuit board is replaced as in the conventional method. As a result, the time required for tool replacement can be significantly reduced, and the overall efficiency of the rework work can be increased.

[0039] In cases where multiple defective components are mounted on the same circuit board, attempting to complete all rework operations on that same board inevitably requires changing tools at some point. Furthermore, if the priority is to reduce the number of circuit board replacements during rework, the number of tool replacements will increase. On the other hand, if the priority is to reduce the number of tool replacements during rework, the number of circuit board replacements will increase. Thus, there is a trade-off between tool replacement and circuit board replacement. For this reason, it is desirable to be able to choose whether to prioritize tool replacement or circuit board replacement.

[0040] However, in actual rework processes, since the heating nozzles that make up the tool heat the defective parts, the time required for replacing the circuit board tends to be longer when considering the heating time and cool-down time. For this reason, it is preferable to prioritize tool replacement and minimize the number of tool changes.

[0041] Figure 5 shows an example of a monitor screen during rework. As shown in Figure 5, the monitor 50 screen displays a list 51 showing an example of the progress of rework work in rack 30. The vertical rows of list 51 represent the storage spaces from the first space 31 to the seventh space 37 in rack 30, and the horizontal rows show the number and type of electronic components determined to be defective. The leftmost row of list 51 displays the board numbers of the boards stored in the first space 31 to the seventh space 37, and the leftmost row of list 51 displays the work number indicating the work procedure. The cells between the board number and the work number display the type of electronic component (defective component) determined to be defective in each board.

[0042] Furthermore, by using line markers or inverted text (reversing the text and its background) to indicate defective parts that have completed rework (worked), it is possible to clearly understand the progress of the rework. Additionally, defective parts currently undergoing rework may be marked with a different color line marker or inverted text than those marked as "worked."

[0043] The configuration and effects of the present invention have been described above in accordance with the examples, but the embodiments of the present invention are not limited to the above examples. For example, in the above embodiment, the case in which the rack 30 has seven storage spaces was described, but the number of storage spaces is not limited to this.

[0044] Furthermore, although the above embodiment describes a case where one circuit board 3 is stored in one storage space, it is also possible to prepare pallets capable of mounting one or more circuit boards 3, and to supply and return (collect) the circuit boards 3 on a pallet-by-pallet basis. In this method, it is possible to perform rework work with multiple small circuit boards 3 of the same type mounted on a single pallet, thereby further increasing the efficiency of the rework work. In this case, it is preferable that the pallet be configured to have an external shape that can be accommodated in any of the storage spaces from the first space 31 to the seventh space 37 within the rack 30. It is also preferable to prepare multiple types of pallets; for example, a pallet that can fix multiple small circuit boards 3 of the same type side by side may be used, or a pallet that can fix only one large circuit board 3 may be used. Furthermore, it is preferable to affix a QR code (registered trademark) indicating the ID of the pallet to the pallet, so that when the operator reads the QR code, they can access a database linked to the ID and obtain inspection information for each circuit board mounted on the pallet.

[0045] Furthermore, although the first embodiment described a case where there are two types of defective parts and tools, and the second embodiment described a case where there are three types of defective parts and tools, the types of defective parts and tools are not limited to these.

[0046] Furthermore, although the above embodiment described the rework process as the removal of defective parts, the rework process may also be a process of soldering new electronic components, or it may be a process that includes both a removal process and a soldering process (an electronic component replacement process). [Industrial applicability]

[0047] This invention can be applied to a wider range of fields in the field of rework systems for rearranging electronic components such as semiconductor elements on a substrate. [Explanation of Symbols]

[0048] 1-7: Circuit board 10: Rework System 20: Rework equipment 30: Rack 31: First Space 32: Second Space 33: Third Space 34: 4th Space 35: Space 5 36: 6th Space 37: Space 7 40: Storage device 41: Elevator 42: Conveyor 50: Monitor 51: List 60: Optimization Program 70: Inspection equipment 100: Control Unit A: First tool B: Second tool C: Third tool a: First defective part b: 2nd defective part c: 3rd defective part

Claims

1. A rework system comprising: a rework device (20) having multiple tools to perform rework operations of removing defective components mounted on a circuit board and / or reattaching new electronic components to the circuit board from which the defective components have been removed; a rack (30) having multiple storage spaces for storing the circuit boards; a stocker device (40) for supplying and returning the circuit boards between the rack (30) and the rework device (20); and a control unit (100) for controlling and automating the operations of the rework device (20) and the stocker device (40), wherein A rework system characterized in that the control unit (100) has a rework order calculation function that performs at least the following based on rack information obtained in advance from an inspection device (70) for inspecting the mounting state of electronic components on the substrate and the position information of each substrate stored in each storage space of the rack (30): selecting the tool to be used for the rework work and determining the order in which the substrates to be reworked.

2. The rework order calculation function, when rack information relating to the next rack (30) is obtained, includes confirming that the same electronic component that is the subject of rework work on the last board of the previous rack (30) is present on any board in the next rack (30), and performing optimization as necessary, according to claim 1.

3. A rework system according to claim 1 or 2, comprising: a substrate supply step of supplying substrates from the storage space of a rack (30) to a rework device (20) using a stocker device (40); a tool exchange step of exchanging a tool from a plurality of tools to one appropriate for the substrate; a rework step of performing rework work using the exchanged tool; and a substrate retrieval step of returning the substrates for which the rework work has been completed to their original storage space in the rack (30) using the stocker device (40).

4. An optimization program for use in the rework system according to claim 1 or claim 2, A first function involves supplying a circuit board with only specific defective components mounted from a rack (30) to a rework device, performing rework on the specific defective components using a tool corresponding to the specific defective components, and then returning the circuit board to the rack (30), and performing this process for all circuit boards with only specific defective components mounted. A second function is to supply a circuit board on which multiple defective components, including the specific defective component, are mounted from the rack (30) to a rework device, perform rework on the specific defective component using a tool corresponding to the specific defective component, and then return the circuit board to the rack (30), and to perform this process for all circuit boards on which multiple defective components, including the specific defective component, are mounted. A third function is performed on all boards on which the other defective components are mounted, by replacing the tool used with a tool corresponding to the other defective components remaining on the last board after the completion of the second function on the last board on which the multiple defective components, including the specific defective component, are mounted, and then returning the last board to the rack (30) after performing rework on the other defective components remaining on the last board. An optimization program characterized by having a fourth function, which involves supplying a circuit board on which only the other defective components are mounted from the rack (30) to the rework device, performing rework on the other defective components using the replaced tool, and then returning the circuit board to the rack (30), and performing this process for all circuit boards on which only the other defective components are mounted.

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