Component mounting device and component mounting method using multiple suction nozzles

Abstract

This invention provides a component mounting device and component mounting method with a simpler structure than conventional devices, suitable for handling large components and other parts. [Solution] The component mounting device comprises a mounting head having a first suction nozzle for adsorbing a component, one or more second suction nozzles for adsorbing a component, a rotating means for rotating the first suction nozzle around its axis, a first lifting means for raising and lowering the first suction nozzle in the axial direction, and a second lifting means for raising and lowering the second suction nozzle in the axial direction, and a control unit. The control unit causes the first and second suction nozzles to adsorb a component, and when the first and second suction nozzles are holding the component up, it stops the suction on the second suction nozzle, and uses the first lifting means and / or the second lifting means to change the height of the second suction nozzle relative to the component, thereby separating the second suction nozzle from the component, and uses the rotating means to rotate the first suction nozzle that is adsorbing the component.

Description

Technical Field

[0001] The present disclosure relates to a component mounting apparatus and a component mounting method using a plurality of suction nozzles.

Background Art

[0002] Conventionally, as disclosed in Patent Document 1, a component mounting apparatus and a component mounting method using a plurality of suction nozzles are known.

[0003] The component mounting apparatus sucks an electronic component using a suction nozzle provided in a mounting head and mounts it on a substrate. The electronic components to be mounted on the substrate generally include a number of small components such as chip resistors and a small number of large components such as integrated circuit components and connectors. In order to mount a small number of large components on the substrate, the mounting head may be replaced with a mounting head corresponding to the large component. When the frequency of replacement increases, the production efficiency of the substrate decreases. Therefore, a component mounting apparatus and a component mounting method that suck large components using a plurality of suction nozzles without replacing the mounting head, as disclosed in Patent Document 1, have been studied.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, the component mounting apparatus and the component mounting method disclosed in Patent Document 1 need to include a rotating means for rotating the entire mounting head when rotating a large component, and there is room for improvement in that the apparatus becomes large and complicated.

[0006] The present disclosure provides a component mounting apparatus and a component mounting method having a simpler structure than conventional ones and suitable for handling components such as large components.

Means for Solving the Problems

[0007] A component mounting device according to one aspect of the present disclosure comprises a mounting head and a control unit, the control unit having a first suction nozzle for adsorbing a component, one or more second suction nozzles for adsorbing the component, a rotating means for rotating the first suction nozzle about the axis of the first suction nozzle, a first lifting means for raising and lowering the first suction nozzle in the axial direction of the first suction nozzle, and a second lifting means for raising and lowering the second suction nozzle in the axial direction of the second suction nozzle, wherein the control unit causes the first suction nozzle and the second suction nozzle to adsorb the component, and when the first suction nozzle and the second suction nozzle are holding the component up, the control unit stops the suction of the second suction nozzle, and separates the second suction nozzle from the component by changing the height of the second suction nozzle relative to the component using the first lifting means and / or the second lifting means, and causes the rotating means to rotate the first suction nozzle that is adsorbing the component.

[0008] Furthermore, the component mounting method of the present disclosure is a component mounting method for attaching a component to a substrate by suction, wherein the control unit controls the first suction nozzle and at least one second suction nozzle to suction the component, the control unit controls the first suction nozzle and the second suction nozzle to lift the component, the control unit controls the second suction nozzle to stop suction, the control unit controls the first suction nozzle and / or the second suction nozzle to change the height of the second suction nozzle relative to the component, thereby separating the second suction nozzle from the component, and the control unit controls the first suction nozzle that has lifted the component to rotate using a rotating means. [Effects of the Invention]

[0009] According to this disclosure, it is possible to provide a component mounting device and a component mounting method that have a simpler structure than conventional devices and are suitable for handling large components and other parts. [Brief explanation of the drawing]

[0010] [Figure 1]Schematic diagram of a component mounting device and a component mounting device according to the embodiments of this disclosure. [Figure 2] Schematic plan view of component mounting device and component assembly device [Figure 3A] Schematic elevation view of the mounting head [Figure 3B] Schematic elevation view of a mounting head for picking up small parts. [Figure 3C] Schematic elevation view of a mounting head for picking up large parts. [Figure 4A] Block diagram showing the control system of a component mounting device. [Figure 4B] Block diagram showing the control system of the mounting head. [Figure 5] A flowchart illustrating the steps of attaching small components to a substrate by suction and rotation. [Figure 6A] A schematic elevation view showing the suction nozzle positioned above a small component. [Figure 6B] A schematic elevation view showing the suction nozzle lowered and holding a small component in place. [Figure 6C] A schematic elevation view showing the suction nozzle, which is holding a small component, in an elevated position. [Figure 6D] A schematic elevation view showing a rotating suction nozzle holding a small component. [Figure 6E] A schematic elevation view showing small components mounted on a circuit board. [Figure 7] A flowchart illustrating the steps of attaching large components to a substrate by suction and rotation. [Figure 8A] A schematic elevation view showing the first and second suction nozzles positioned above a large component. [Figure 8B] A schematic elevation view showing the state in which the first and second suction nozzles are lowered and a large component is being held in place. [Figure 8C] A schematic elevation view showing the first and second suction nozzles, which are holding large components, in an elevated position. [Figure 8D] A schematic elevation view showing the state in which the second suction nozzle has released its suction and detached from the large component. [Figure 8E]Schematic elevation view showing the state where the first suction nozzle adsorbing a large part is rotated [Figure 8F] Schematic elevation view showing the state where the second suction nozzle is brought into contact with the large part to resume suction [Figure 8G] Schematic elevation view showing the state where the large part is mounted on the substrate [Figure 9] Schematic elevation view showing the state where the second suction nozzle is brought into contact with the large part while the large part is placed at a predetermined location

Embodiments for Carrying Out the Invention

[0011] According to the first aspect of the present disclosure, there is provided a mounting head including a first suction nozzle for sucking a part, one or more second suction nozzles for sucking the part, a rotating means for rotating the first suction nozzle about the axis of the first suction nozzle, a first elevating means for elevating the first suction nozzle in the axial direction of the first suction nozzle, and a second elevating means for elevating the second suction nozzle in the axial direction of the second suction nozzle, and a control unit. The control unit causes the first suction nozzle and the second suction nozzle to suck the part, stops suction of the second suction nozzle in a state where the first suction nozzle and the second suction nozzle lift the part, and separates the second suction nozzle from the part by changing the height of the second suction nozzle with respect to the part by the first elevating means and / or the second elevating means, and causes the rotating means to rotate the first suction nozzle sucking the part, thereby providing a component mounting device.

[0012] According to the second aspect of the present disclosure, there is provided the component mounting device according to the first aspect, wherein the control unit rotates the first suction nozzle lifting the part, and further changes the height of the second suction nozzle with respect to the part by the first elevating means and / or the second elevating means to bring the second suction nozzle into contact with the part and cause the second suction nozzle to suck the part.

[0013] According to a third aspect of this disclosure, the control unit provides a component mounting device according to the second aspect, wherein the control unit changes the height of the second suction nozzle relative to the component by the first lifting means and / or the second lifting means, thereby bringing the second suction nozzle into contact with the component, and then restarting the suction of the component by the second suction nozzle.

[0014] According to a fourth aspect of this disclosure, the control unit provides a component mounting device according to the second aspect, wherein the control unit restarts the suction of the component to the second suction nozzle while bringing the second suction nozzle closer to the component by the first lifting means and / or the second lifting means.

[0015] According to a fifth aspect of this disclosure, the control unit provides a component mounting device according to the second to fourth aspects, wherein the control unit rotates the first suction nozzle and then, with the component lifted by the first suction nozzle, suctions the component onto the second suction nozzle.

[0016] According to a sixth aspect of the present disclosure, the control unit rotates the first suction nozzle that is holding the component, places the component in a predetermined location, and changes the height of the second suction nozzle relative to the component using the first lifting means and / or the second lifting means, thereby bringing the second suction nozzle into contact with the component placed in the predetermined location and causing the component to be held by the second suction nozzle, thereby providing a component mounting device according to any one of the second to fourth aspects.

[0017] According to a seventh aspect of this disclosure, the control unit provides a component mounting device according to the second to sixth aspects, wherein the control unit lowers the second suction nozzle with the second lifting means to bring the second suction nozzle into contact with the component.

[0018] According to the eighth aspect of this disclosure, the control unit provides a component mounting device according to the first to seventh aspects, wherein the control unit raises the second suction nozzle by the second lifting means without driving the first lifting means, thereby separating the second suction nozzle from the component.

[0019] According to the ninth aspect of this disclosure, a component mounting device according to the first to eighth aspects is provided, further comprising a head moving means for moving the mounting head horizontally and a component receiving portion, wherein the control unit raises the component, then moves the mounting head above the component receiving portion using the head moving means, and stops the suction of the second suction nozzle.

[0020] According to a tenth aspect of this disclosure, a component mounting apparatus according to the first to ninth aspects is provided, which mounts the component onto a substrate using the first suction nozzle and the second suction nozzle.

[0021] According to an eleventh aspect of the present disclosure, a component mounting device according to the first to tenth aspects is provided, further comprising an imaging unit for photographing the component adsorbed by the first suction nozzle, and the control unit for rotating the first suction nozzle based on the imaging results from the imaging unit.

[0022] According to a twelfth aspect of this disclosure, a component mounting device according to the first to eleventh aspects is provided, which does not include a mounting head rotating means for rotating the mounting head.

[0023] A component mounting apparatus is provided, comprising a first component supply unit that supplies the component as a first component, and a component mounting apparatus described in any one of the first to twelfth embodiments.

[0024] According to a fourteenth aspect of this disclosure, the component mounting apparatus described in the thirteenth aspect further comprises a second component supply unit that supplies a second component different from the first component, and the control unit causes the second component to be adsorbed onto either the first suction nozzle or the second suction nozzle.

[0025] According to a 15th aspect of this disclosure, a component mounting method is provided for attaching a component to a substrate by suction, wherein a control unit controls the first suction nozzle and at least one second suction nozzle to suction the component, the control unit controls the first suction nozzle and the second suction nozzle to lift the component, the control unit controls the second suction nozzle to stop suction, the control unit controls the first suction nozzle and / or the second suction nozzle to change the height of the second nozzle relative to the component, thereby separating the second suction nozzle from the component, and the control unit controls the first suction nozzle that has lifted the component to rotate using a rotating means.

[0026] The embodiments of this disclosure will be described below with reference to the attached drawings. In addition, each element is shown schematically in each drawing for the sake of clarity.

[0027] (Embodiment) A component mounting apparatus according to an embodiment of this disclosure will be described.

[0028] [Overall structure] Figures 1 and 2 are schematic diagrams showing an example of a component mounting apparatus 1 according to an embodiment of the present disclosure. In Figure 1, the direction perpendicular to the plane of the paper is the X direction, the left-right direction is the Y direction, and the up-down direction is the Z direction.

[0029] The component mounting apparatus 1 shown in Figures 1 and 2 is a component mounting apparatus that mounts components onto a substrate C1, and mounts multiple types of components, including small components B1 and large components B2, onto the substrate C1. Figures 1 and 2 show the state in which the small components B1 and large components B2 are mounted on the substrate C1.

[0030] The component mounting device 1 comprises a component supply unit 10 and a component mounting device 20.

[0031] [Parts Supply Department] The parts supply unit 10 supplies small parts B1 and large parts B2 to the parts mounting device 20. The parts supply unit 10 comprises a small parts supply unit 12 and a large parts supply unit 18.

[0032] The small component supply unit 12 supplies small components B1. Small components B1 are components smaller than large components B2, such as chip resistors. The small component supply unit 12 in this embodiment is a tape feeder that sequentially supplies multiple small components B1 arranged in a line on a tape. As shown in Figure 1, the small component supply unit 12 comprises a tape feeder 14 and a trolley 16. Multiple tape feeders 14 can be placed on the trolley 16.

[0033] The small parts supply unit 12 is not limited to a tape feeder; it may include any component that supplies small parts B1 which are smaller than the large parts B2. For example, the small parts supply unit 12 may include a bulk feeder that aligns and supplies small parts B1 which are loosely stored in a cassette.

[0034] The large component supply unit 18 supplies large components B2. Large components B2 are components that are larger than small components B1, such as integrated circuit components and connectors. In this embodiment, the large component supply unit 18 is a tray capable of storing multiple large components B2.

[0035] [Component mounting device] The component mounting device 20 is a device that mounts small components B1 and large components B2 supplied from the component supply unit 10 onto the substrate C1, respectively. As shown in Figures 1 and 2, the component mounting device 20 includes a mounting head 30, a head moving means 50, a substrate transport unit 52, an imaging unit 54, an operation unit 56, and a control unit 60.

[0036] The component mounting device 20 uses a substrate transport unit 52 to move the substrate C1 that has been brought in from an upstream device (not shown). The component mounting device 20 further uses a head moving means 50 to position the mounting head 30 above a small component B1 or a large component B2. The component mounting device 20 further uses the mounting head 30 to pick up the small component B1 or the large component B2. The component mounting device 20 further uses the head moving means 50 to position the mounting head 30, which has picked up the small component B1 or the large component B2, above the brought-in substrate C1. The component mounting device 20 further uses the mounting head 30 to mount the small component B1 or the large component B2 onto the substrate C1.

[0037] Figure 3A shows a schematic diagram of the mounting head 30. The mounting head 30 comprises a body 32 and a plurality of nozzle units 33.

[0038] Of the multiple nozzle units 33, the central one is designated as the first nozzle unit 33A, and the units on either side of the first nozzle unit 33A are designated as the second nozzle units 33B. Each nozzle unit 33 has a similar structure and is equipped with a suction nozzle 34, a lifting mechanism 36, a rotating mechanism 38, and a switching valve 40. The mounting head 30 is also equipped with a negative pressure source 42, although this is not shown in the figure.

[0039] The body 32 is a component for holding multiple nozzle units 33. The body 32 is also attached to the head moving mechanism 50, which will be described later.

[0040] The suction nozzle 34 is a component for adsorbing and holding a small part B1 or a large part B2. The suction nozzle 34 is attached to the body 32 and is positioned to protrude downward. The suction nozzle 34 can generate a negative pressure state at its tip using a negative pressure source 42, which will be described later. This allows the suction nozzle 34 to adsorb and hold a small part B1 or a large part B2.

[0041] The lifting mechanism 36 raises and lowers the suction nozzle 34 in the vertical direction D1. The lifting mechanism 36 is a mechanism that can adjust the lifting distance, such as a voice coil motor or a screw jack.

[0042] The rotating means 38 rotates the suction nozzle 34 in direction R1 around its axis. The rotating means 38 can rotate the large part B2 or the small part B1 by rotating the suction nozzle 34 that is holding the large part B2 or the small part B1. The rotating means 38 is a mechanism that includes, for example, a combination of gears and a motor. One motor may rotate multiple suction nozzles 34, or multiple motors may rotate each suction nozzle 34 individually.

[0043] The switching valve 40 is provided in the flow path extending between the suction nozzle 34 and the negative pressure source 42. A switching valve 40 is provided for each suction nozzle 34. This allows the switching valve 40 to individually switch the generation and release of negative pressure for each suction nozzle 34.

[0044] The negative pressure source 42 generates negative pressure in the suction nozzle 34. The negative pressure source 42 is, for example, a vacuum pump.

[0045] The mounting head 30 shown in Figure 3A is equipped with three nozzle units 33, but is not limited to this and may be equipped with multiple units. Also, the suction nozzles 34 are arranged in a single row, but are not limited to this and may be arranged in multiple rows or in a circular pattern, for example.

[0046] Figure 3B shows the case where the mounting head 30 picks up a small component B1. As shown in Figure 3B, the mounting head 30 can pick up one small component B1 using one suction nozzle 34. In Figure 3B, the small component B1 is shown being held by the central suction nozzle 34A as an example, but it is also possible to pick up the small component B1 with each of the adjacent suction nozzles 34B.

[0047] Figure 3C shows the case where the mounting head 30 picks up a large component B2. The mounting head 30 can also pick up a large component B2 using multiple suction nozzles 34, as shown in Figure 3C. In the example shown in Figure 3C, one large component B2 is picked up using three suction nozzles 34.

[0048] Furthermore, the component mounting device 20 does not have a means for rotating the entire mounting head 30.

[0049] Returning to Figure 2, the head moving means 50 is a component that moves the mounting head 30. The head moving means 50 comprises an X-beam 50A, a Y-beam 50B, and a head support section 50C. The X-beam 50A is traversable along the Y-beam 50B. The head support section 50C is traversable along the X-beam 50A. The head support section 50C is capable of raising and lowering the mounting head 30 in the Z-axis direction. As a result, the mounting head 30 is movable in the X, Y, and Z directions.

[0050] The substrate transport unit 52 moves the substrate C1, which has been brought in from an upstream device (not shown), inside the component mounting device 1. The substrate transport unit 52 further transports the substrate C1, on which small components B1 and large components B2, etc., have been mounted, to a downstream device (not shown). The substrate transport unit 52 is, for example, a belt conveyor.

[0051] The imaging unit 54 captures images of the small component B1 or large component B2 that has been picked up by the mounting head 30. The imaging unit 54 is connected to the control unit 60, which will be described later, and can transmit the imaging results to the control unit 60. Based on the imaging results, the rotational orientation of the small component B1 or large component B2 is determined, and based on the determined rotational orientation, the amount of rotation of the suction nozzle 34 during component mounting is determined and adjusted.

[0052] The control unit 56 receives operator input. The control unit 56 is connected to the control unit 60, which will be described later, and can transmit the operator's input to the control unit 60. The control unit 56 may also have a display screen such as a touch panel.

[0053] Next, the control system of the component mounting device 1 will be described with reference to Figures 4A and 4B. Figure 4A is a block diagram showing the control system of the component mounting device 1, and Figure 4B is a block diagram showing the control system of the mounting head 30.

[0054] As shown in Figure 4A, the control unit 60 is communicated with the small component supply unit 12, the mounting head 30, the head moving means 50, the substrate transport unit 52, the imaging unit 54, and the operation unit 56.

[0055] The control unit 60 is connected to the small component supply unit 12 in a communication manner, allowing the component mounting device 20 to operate in conjunction with the small component supply unit 12. As a result, for example, the control unit 60 can pick up the supplied small component B1 from the small component supply unit 12 and attach it to the component mounting device 20.

[0056] Furthermore, the control unit 60 is connected to the mounting head 30 in a communication manner, thereby enabling the operation of the mounting head 30.

[0057] Specifically, as shown in Figure 4B, the control unit 60 is connected to the first nozzle unit 33A and the multiple second nozzle units 33B. This allows the control unit 60 to operate the first nozzle unit 33A and the multiple second nozzle units 33B individually.

[0058] The control unit 60 is connected to the lifting / lowering mechanism 36 of the suction nozzle 34, thereby enabling the lifting / lowering mechanism 36 to be operated. This allows the control unit 60 to raise and lower the suction nozzle 34.

[0059] Furthermore, the control unit 60 is connected to the rotating mechanism 38 of the suction nozzle 34, thereby enabling the rotating mechanism 38 to operate. This allows the control unit 60 to rotate the suction nozzle 34.

[0060] Furthermore, the control unit 60 is connected to the switching valve 40, thereby enabling the switching valve 40 to operate. This allows the control unit 60 to switch between generating and releasing negative pressure in the suction nozzle 34.

[0061] Returning to Figure 4A, the control unit 60 is further connected to the head moving means 50, thereby enabling the head moving means 50 to operate. This allows the control unit 60 to move the mounting head 30 in the X and Y directions.

[0062] The control unit 60 is further connected to the substrate transport unit 52, thereby enabling the substrate transport unit 52 to operate. This allows the control unit 60 to transport the substrate C1.

[0063] The control unit 60 is further connected to the imaging unit 54, enabling it to receive imaging results from the imaging unit 54. This allows the control unit 60 to operate the component mounting device 1 based on the received imaging results. For example, the control unit 60 may rotate the rotating means 38 based on the received imaging results to rotate the small component B1 or large component B2 that has been picked up.

[0064] The control unit 60 is further connected to the operation unit 56, enabling it to receive signals from the operation unit 56. This allows the control unit 60 to receive instructions entered by the operator using the operation unit 56.

[0065] The control unit 60 is composed of, for example, a microcontroller, CPU, MPU, GPU, DSP, FPGA, ASIC, or a combination thereof. The functions of the control unit 60 may be composed solely of hardware, or they may be realized by a combination of hardware and software. The control unit 60 may realize predetermined functions by reading data and programs stored in a storage unit such as memory and performing various arithmetic processing.

[0066] In this embodiment, the component mounting device 20 has a control unit 60, but is not limited to this. For example, the component mounting device 20 may have a control unit 60, and the small component supply unit 12 may additionally have another control unit. Alternatively, the control unit 60 may be provided separately from the component mounting device 1.

[0067] Next, the operation of the component mounting apparatus 1 in the embodiment of this disclosure will be described. Figure 5 is a flowchart showing how a small component B1 is attached to the substrate C1 by suction and rotation using the mounting head 30. Figure 7 is a flowchart showing how a large component B2 is attached to the substrate C1 by suction and rotation using the mounting head 30.

[0068] [Operation 1] First, we will explain the operation of the mounting head 30 in which it picks up and rotates the small component B1, referring to the flowchart shown in Figure 5 and the schematic diagrams shown in Figures 6A to 6E.

[0069] As shown in Figure 6A, the control unit 60 positions the suction nozzle 34 above the small component B1 supplied by the tape feeder 14.

[0070] The suction nozzle 34 descends (S10). Specifically, as shown in Figure 6B, the control unit 60 lowers the suction nozzle 34 in the downward direction D2.

[0071] Next, the suction nozzle 34 starts suction (S11). Specifically, the control unit 60 uses the negative pressure generated by the suction nozzle 34 to pick up the small component B1.

[0072] Next, the suction nozzle 34 rises (S12). Specifically, as shown in Figure 6C, the control unit 60 raises the suction nozzle 34, which is holding the small component B1, upward in direction D3.

[0073] Next, the mounting head 30 moves (S13). Specifically, the control unit 60 moves the mounting head 30, which has the small component B1 attached, to a location where the imaging unit 54 can capture the attached small component B1.

[0074] Next, the imaging unit 54 performs imaging (S14). Specifically, the control unit 60 instructs the imaging unit 54 to image the small object B1 that has been picked up, and the imaging unit 54 transmits the imaging result to the control unit 60.

[0075] Next, the mounting head 30 moves (S15). Specifically, the control unit 60 moves the mounting head 30, which has picked up the small component B1, upwards on the substrate C1.

[0076] Next, the suction nozzle 34 rotates (S16). Specifically, as shown in Figure 6D, the control unit 60 rotates the suction nozzle 34, which is holding the small component B1, in direction R2 around the axis of the suction nozzle 34, based on the imaging results received from the imaging unit 54. This allows the component mounting device 20 to mount the substrate C1 in the desired direction.

[0077] Next, the small component B1 is attached to the substrate C1 (S17). Specifically, as shown in Figure 6E, the control unit 60 lowers the suction nozzle 34 downward D4 to attach the small component B1 to the substrate C1.

[0078] The above is an example of how the component mounting device 1 picks up a small component B1, rotates it, and mounts it onto the substrate C1.

[0079] This specification describes a case where one suction nozzle 34 adsorbs one small component B1, but it is not limited to this case. Multiple suction nozzles 34 may adsorb the small component B1 at different timings.

[0080] [Operation 2] Referring to the flowchart shown in Figure 7 and the schematic diagrams shown in Figures 8A to 8G, the operation of attaching the large component B2 to the substrate C1 by suction and rotation will be explained.

[0081] As shown in Figure 8A, the control unit 60 positions a plurality of suction nozzles 34 above the large component B2 which is housed by the large component supply unit 18 (not shown).

[0082] The first suction nozzle 34A and the second suction nozzle 34B descend (S20). Specifically, as shown in Figure 8B, the control unit 60 lowers the first suction nozzle 34A and the second suction nozzle 34B downward in direction D5. As a result, the first suction nozzle 34A and the second suction nozzle 34B come into contact with the large component B2.

[0083] Next, the first suction nozzle 34A and the second suction nozzle 34B begin suction (S21). Specifically, the control unit 60 uses the negative pressure generated by the first suction nozzle 34A and the second suction nozzle 34B to pick up the large component B2.

[0084] Next, the first suction nozzle 34A and the second suction nozzle 34B rise (S22). Specifically, as shown in Figure 8C, the control unit 60 raises the first suction nozzle 34A and the second suction nozzle 34B, which are holding the large component B2, upward in direction D6.

[0085] Next, the mounting head 30 moves (S23). Specifically, the control unit 60 drives the head moving means 50 to move the large object B2 that has been picked up to a location where the imaging unit 54 can capture an image.

[0086] Next, the imaging unit 54 performs imaging (S24). Specifically, the control unit 60 instructs the imaging unit 54 to image the large object B2 that has been picked up, and the imaging unit 54 transmits the imaging result to the control unit 60.

[0087] Next, the mounting head 30 moves (S25). Specifically, the control unit 60 drives the head moving means 50 to move the mounting head 30, which has the large component B2 attached, upwards on the substrate C1.

[0088] Next, the second suction nozzle 34B releases its suction (S26). Specifically, the control unit 60 releases the negative pressure generated in the second suction nozzle 34B.

[0089] Next, the second suction nozzle 34B rises (S27). Specifically, as shown in Figure 8D, the control unit 60 raises the second suction nozzle 34B upward in direction D7. As a result, the second suction nozzle 34B separates from the large component B2, and the first suction nozzle 34A picks up the large component B2 by itself.

[0090] In step S27, the control unit 60 separates the large component B2 from the second suction nozzle 34B by driving the second suction nozzle 34B upward without driving the first suction nozzle 34A which is holding the large component B2. As a result, the component mounting device 20 can separate the second suction nozzle 34B from the large component B2 more stably than when the first suction nozzle 34A is driven downward.

[0091] Next, the first suction nozzle 34A rotates (S28). Specifically, as shown in Figure 8E, the control unit 60 rotates the first suction nozzle 34A, which is adsorbing the large component B2, in the direction R3 around the axis of the first suction nozzle 34A, based on the imaging results received from the imaging unit 54.

[0092] Next, the second suction nozzle 34B descends (S29). Specifically, as shown in Figure 8F, the control unit 60 lowers the second suction nozzle 34B downward D8 and brings it into contact with the large component B2.

[0093] In step S29, the control unit 60 drives the second suction nozzle 34B downward without driving the first suction nozzle 34A which is holding the large component B2, thereby bringing the large component B2 into contact with the second suction nozzle 34B. As a result, the component mounting device 20 can bring the second suction nozzle 34B into contact with the large component B2 more stably than when the first suction nozzle 34A is driven upward.

[0094] Next, the second suction nozzle 34B starts suction (S30). Specifically, the control unit 60 generates negative pressure in the second suction nozzle 34B. As a result, the second suction nozzle 34B resumes suction.

[0095] The component mounting device 20 resumes suction when the second suction nozzle 34B is in contact with the large component B2. This suppresses the vibration of the large component B2 caused by the resumption of suction compared to when suction is resumed before contact, allowing the component mounting device 20 to resume suction of the second suction nozzle 34B more stably.

[0096] According to the steps described above, the component mounting device 20 can rotate the large component B2 that has been picked up. Therefore, the component mounting device 20 can rotate the large component B2 that has been picked up without the need for a mounting head rotation means to rotate the entire mounting head 30. As a result, the large component B2 is mounted on the substrate C1 in the desired orientation.

[0097] Next, the large component B2 is mounted onto the substrate C1 (S31). Specifically, as shown in Figure 8G, the control unit 60 lowers the multiple suction nozzles 34 downward D9 to mount the large component B2 onto the substrate C1. By using multiple suction nozzles 34, the component mounting device 20 can distribute the pressure when mounting the large component B2 onto the substrate C1.

[0098] The above is an example of how the component mounting device 1 picks up a large component B2, rotates it, and mounts it onto the substrate C1.

[0099] This specification describes a case where three suction nozzles 34 adsorb one large component B2, but it is not limited to this case. Multiple suction nozzles 34 can adsorb the large component B2.

[0100] Note that the step of rotating the large component B2 that has been attracted is not limited to the flowchart shown in Figure 7.

[0101] Furthermore, in the flowchart shown in Figure 7, in steps S27 and S29, the control unit 60 raised and lowered only the second suction nozzle 34B. However, the control unit 60 may also drive the first suction nozzle 34A. This allows the control unit 60 to operate the mounting head 30 more flexibly compared to the case where only the second suction nozzle 34B is raised and lowered.

[0102] [summary] To summarize the above explanation, the features of this disclosure are described below.

[0103] Conventionally, component mounting devices have been used that use multiple suction nozzles to pick up large components. However, in order to rotate the large components picked up by the multiple suction nozzles, a mechanism was needed to rotate the entire mounting head equipped with the multiple suction nozzles. The inventors investigated a novel component mounting device and component mounting method that can rotate large components without using a mechanism to rotate the entire mounting head.

[0104] Specifically, the first suction nozzle 34A and the second suction nozzle 34B are used to attract and lift the large part B2. Then, the suction of the second suction nozzle 34B is released, and the second suction nozzle 34B is separated from the large part B2. In this state, the first suction nozzle 34A, which is holding the large part B2, is rotated. This makes it possible to rotate the large part B2 without a mechanism to rotate the entire mounting head 30, and provides a component mounting device 20 and component mounting method that are simpler in structure than conventional devices and suitable for handling large parts B2.

[0105] [Effects / Effects] The component mounting device and component mounting method of this embodiment can achieve the following effects.

[0106] The component mounting device 20 of this embodiment comprises a mounting head 30 and a control unit 60, which includes a first suction nozzle 34A for adsorbing large component B2, one or more second suction nozzles 34B for adsorbing large component B2, a first rotating means 38A for rotating the first suction nozzle 34A about the axis of the first suction nozzle 34A, a first lifting means 36A for raising and lowering the first suction nozzle 34A in the axial direction of the first suction nozzle 34A, and a second lifting means 36B for raising and lowering the second suction nozzle 34B in the axial direction of the second suction nozzle 34B. The unit 60 uses the first suction nozzle 34A and the second suction nozzle 34B to hold the large part B2 in place. With the first suction nozzle 34A and the second suction nozzle 34B lifting the large part B2, the unit 60 stops the suction of the second suction nozzle 34B. The unit 60 then uses the first lifting means 36A and / or the second lifting means 36B to change the height of the second suction nozzle 34B relative to the large part B2, thereby separating the second suction nozzle 34B from the large part B2. Finally, the unit 60 uses the first rotating means 38A to rotate the first suction nozzle 34A, which is holding the large part B2 in place.

[0107] Furthermore, the component mounting method of this embodiment is a component mounting method for attaching a large component B2 to a substrate C1 by suction, wherein the control unit 60 controls the first suction nozzle 34A and at least one second suction nozzle 34B to suction the large component B2, the control unit 60 controls the first suction nozzle 34A and the second suction nozzle 34B to lift the large component B2, the control unit 60 controls the second suction nozzle 34B to stop suction, the control unit 60 controls the first suction nozzle 34A and / or the second suction nozzle 34B to change the height of the second suction nozzle 34B relative to the large component B2, thereby separating the second suction nozzle 34B from the large component B2, and the control unit 60 controls the first suction nozzle 34A that has lifted the large component B2 to rotate using the first rotating means 38A.

[0108] This configuration / method provides a component mounting device 20 and a component mounting method that are simpler in structure than conventional methods and suitable for handling large components such as component B2.

[0109] Furthermore, in the component mounting device 20 of this embodiment, the control unit 60 rotates the first suction nozzle 34A that is lifting the large component B2, and then, using the first lifting means 36A and / or the second lifting means 36B, changes the height of the second suction nozzle 34B relative to the large component B2, thereby bringing the second suction nozzle 34B into contact with the large component B2 and causing the large component B2 to be adsorbed by the second suction nozzle 34B.

[0110] With this configuration, it becomes possible to again adsorb the large component B2 using the first adsorption nozzle 34A and the second adsorption nozzle 34B.

[0111] Furthermore, the control unit 60 of the component mounting device 20 in this embodiment changes the height of the second suction nozzle 34B relative to the large component B2 using the first lifting means 36A and / or the second lifting means 36B, thereby bringing the second suction nozzle 34B into contact with the large component B2, and then restarts the suction of the large component B2 by the second suction nozzle 34B.

[0112] With this configuration, the second suction nozzle 34B can more stably resume the suction of the large component B2.

[0113] Furthermore, in the component mounting device 20 of this embodiment, the control unit 60 rotates the first suction nozzle 34A, and then, with the large component B2 lifted by the first suction nozzle 34A, it causes the large component B2 to be picked up by the second suction nozzle 34B.

[0114] With this configuration, the suction of the large component B2 by the second suction nozzle 34B can be resumed in a shorter time.

[0115] Furthermore, in the component mounting device 20 of this embodiment, the control unit 60 lowers the second suction nozzle 34B using the second lifting means 36B, thereby bringing the second suction nozzle 34B into contact with the large component B2.

[0116] With this configuration, the second suction nozzle 34B can be brought into contact with the large component B2 more stably.

[0117] Furthermore, in the component mounting device 20 of this embodiment, the control unit 60 raises the second suction nozzle 34B using the second lifting means 36B without driving the first lifting means 36A, thereby separating the second suction nozzle 34B from the large component B2.

[0118] With this configuration, the second suction nozzle 34B can be separated from the large component B2 more stably.

[0119] Furthermore, the control unit 60 of the component mounting device 20 in this embodiment uses the first suction nozzle 34A and the second suction nozzle 34B to mount the large component B2 onto the substrate C1.

[0120] With this configuration, the pressure can be distributed, allowing the large component B2 to be mounted on the substrate C1.

[0121] Furthermore, the component mounting device 20 of this embodiment further includes an imaging unit 54 that photographs the large component B2 that has been adsorbed onto the first suction nozzle 34A, and the control unit 60 rotates the first suction nozzle 34A based on the results of the imaging unit 54.

[0122] This configuration allows for more precise rotation of the large component B2.

[0123] Furthermore, the component mounting device 20 of this embodiment does not include a mounting head rotating means for rotating the mounting head 30.

[0124] This configuration allows for the provision of a component mounting device 20 with a simpler structure than conventional devices, which is suitable for handling large components such as component B2.

[0125] Furthermore, the component mounting apparatus 1 of this embodiment includes a large component supply unit 18 for supplying large components B2 and a component mounting apparatus 20.

[0126] With this configuration, it is possible to provide a component mounting device 1 that has a simpler structure than conventional devices and is suitable for handling large components such as component B2.

[0127] Furthermore, the component mounting apparatus 1 of this embodiment further includes a small component supply unit 12 that supplies a small component B1 separate from the large component B2, and the control unit 60 causes the small component B1 to be picked up by either the first suction nozzle 34A or the second suction nozzle 34B.

[0128] With this configuration, it is possible to provide a component mounting device 1 that has a simpler structure than conventional devices and is suitable for handling large components such as component B2.

[0129] [Timing when the second adsorption nozzle resumes adsorption] Furthermore, the operation of rotating the large, adsorbed component B2 is not limited to the operation shown in the flowchart in Figure 7.

[0130] In the flowchart shown in Figure 7, the control unit 60 lowers the second suction nozzle 34B in step S29, and then resumes suction to the second suction nozzle 34B in step S30. However, the control unit 60 may also resume suction while the second suction nozzle 34B is being lowered towards the large component B2.

[0131] As described above, the control unit 60 of the component mounting device 20 of this embodiment restarts the suction of the large component B2 by the second suction nozzle 34B while bringing the second suction nozzle 34B closer to the component using the first lifting means 36A and / or the second lifting means 36B.

[0132] With this configuration, the suction of the large component B2 by the second suction nozzle 34B can be restarted with simple control.

[0133] [Position where the second adsorption nozzle resumes adsorption] Furthermore, in the flowchart shown in Figure 7, the control unit 60 performed the rotation of the large component B2 in step S28 and the lowering and contact in step S29 while the large component B2 was floating. However, the control unit 60 may, after rotating the first suction nozzle 34A, lower the first suction nozzle 34A as shown in Figure 9 to place the large component B2 on a predetermined location P1 (for example, the large component supply unit 18). In this state, the control unit 60 may lower the second suction nozzle 34B to make contact with the large component B2 placed on the predetermined location. This allows the second suction nozzle 34B to make contact with the large component B2 more stably than when the large component B2 is floating.

[0134] As described above, in the component mounting device 20 of this embodiment, the control unit 60 rotates the first suction nozzle 34A that is holding the large component B2, places the large component B2 in a predetermined location, and changes the height of the second suction nozzle 34B relative to the large component B2 using the first lifting means 36A and / or the second lifting means 36B, thereby bringing the second suction nozzle 34B into contact with the large component B2 placed in the predetermined location, and causing the large component B2 to be held in place by the second suction nozzle 34B.

[0135] With this configuration, the second suction nozzle 34B can more stably resume the suction of the large component B2.

[0136] [Position where the second adsorption nozzle stops adsorption] Furthermore, in the flowchart shown in Figure 7, the control unit 60 moves the mounting head 30 above the substrate C1 in step S25 and rotates the large component B2 above the substrate C1 in step S28, but it may also move to a different location and rotate the large component B2. For example, the control unit 60 may move the mounting head 30, which has picked up the large component B2, above a component receiving section 58 that is not directly above the substrate C1. The component receiving section 58 is provided inside the component mounting device 20, for example, as shown in Figure 2. The component receiving section 58 may be made of a material that mitigates the impact if the large component B1 falls (for example, a sponge material). This allows the component receiving section 58 to catch the large component B2 even if it falls when it is rotated, thus suppressing damage to the large component B2.

[0137] Furthermore, the parts receiving section 58 may be a container that can receive and recover the large parts B2 that have fallen. This also allows for the efficient recovery of the large parts B2.

[0138] As described above, the component mounting device 20 of this embodiment further includes a head moving means 50 for moving the mounting head 30 in the horizontal direction. After the large component B2 is raised, the control unit 60 moves the mounting head 30 above the component receiving section 58 using the head moving means 50, and stops the suction of the second suction nozzle 34B.

[0139] With this configuration, damage can be minimized even if the large component B2 falls.

[0140] [others] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various modifications and alterations will be obvious to those skilled in the art. Such modifications and alterations should be understood to be included within the scope of the invention as defined by the appended claims. [Industrial applicability]

[0141] This disclosure is useful for a component mounting device and a component mounting method that uses an adsorption nozzle for adsorbing components. [Explanation of Symbols]

[0142] 1. Component mounting equipment 10. Parts Supply Department 12. Small Parts Supply Unit 14 Tape feeders 16 bogies 18. Large Parts Supply Department 20. Parts mounting device 30 Mounting Head 32 Body 33A First Nozzle Unit 34A First suction nozzle 36A First lifting means 38A First Rotating Means 40A First switching valve 33B Second Nozzle Unit 34B Second suction nozzle 36B Second lifting means 38B Second Rotating Means 40B Second switching valve 42. Negative pressure source 50 Head moving means 50A X-beam 50B Y-beam 50C Head support section 52. Substrate transport section 54 Children's Department 56 Operation section 58 Parts receiving section 60 Control Unit B1 Small parts B2 Large parts C1 substrate D1, D2, D3, D4, D5, D6, D7, D8, D9, D10 direction P1 Designated location R1, R2, R3 Rotation direction

Claims

1. A first suction nozzle for picking up parts, One or more second suction nozzles for adsorbing the aforementioned component, The first suction nozzle is provided with a rotating means for rotating it around the axis of the first suction nozzle, The first suction nozzle is raised and lowered in the axial direction of the first suction nozzle, The second suction nozzle is raised and lowered in the axial direction of the second suction nozzle, A mounting head equipped with, Control unit and Equipped with, The control unit, The component is attached to the first suction nozzle and the second suction nozzle, With the first suction nozzle and the second suction nozzle lifting the component, the second suction nozzle is instructed to stop suction. By changing the height of the second suction nozzle relative to the part using the first lifting means and / or the second lifting means, the second suction nozzle and the part are separated. The rotating means rotates the first suction nozzle that is adsorbing the component. Component mounting device.

2. The control unit rotates the first suction nozzle that is lifting the component, and then, By changing the height of the second suction nozzle relative to the part using the first lifting means and / or the second lifting means, the second suction nozzle is brought into contact with the part. The second suction nozzle is used to attract the component. The component mounting device according to claim 1.

3. The control unit, by changing the height of the second suction nozzle relative to the component using the first lifting means and / or the second lifting means, brings the second suction nozzle into contact with the component, and then resumes the suction of the component by the second suction nozzle. The component mounting device according to claim 2.

4. The control unit, using the first lifting means and / or the second lifting means, moves the second suction nozzle closer to the component and restarts the suction of the component by the second suction nozzle. The component mounting device according to claim 2.

5. The control unit rotates the first suction nozzle, and then, with the part lifted by the first suction nozzle, causes the part to be picked up by the second suction nozzle. The component mounting device according to claim 2.

6. The control unit rotates the first suction nozzle that is holding the component, Place the aforementioned parts in the designated location. By changing the height of the second suction nozzle relative to the part using the first lifting means and / or the second lifting means, the second suction nozzle is brought into contact with the part placed in the predetermined location. The second suction nozzle is used to attract the component. The component mounting device according to claim 2.

7. The control unit lowers the second suction nozzle using the second lifting means, thereby bringing the second suction nozzle into contact with the component. The component mounting device according to claim 2.

8. The control unit raises the second suction nozzle using the second lifting means without driving the first lifting means, thereby separating the second suction nozzle from the component. The component mounting device according to claim 1.

9. A head moving means for moving the mounting head in the horizontal direction, It further includes a parts receiving section, The control unit, After raising the aforementioned component, the mounting head is moved above the component receiving portion by the head moving means, and the suction of the second suction nozzle is stopped. The component mounting device according to claim 1.

10. The control unit uses the first suction nozzle and the second suction nozzle to mount the component onto the substrate. The component mounting device according to claim 1.

11. The system further comprises an imaging unit for photographing the component that has been adsorbed onto the first adsorption nozzle, The control unit rotates the first suction nozzle based on the imaging results obtained by the imaging unit. The component mounting device according to claim 1.

12. The mounting head does not include a means for rotating the mounting head. The component mounting device according to claim 1.

13. A first component supply unit that supplies the aforementioned component as a first component, A component mounting device according to any one of claims 1 to 12, Equipped with Component mounting equipment.

14. The system further includes a second component supply unit that supplies a second component, which is different from the first component. The control unit causes the second component to be adsorbed onto either the first suction nozzle or the second suction nozzle. The component mounting apparatus according to claim 13.

15. A component mounting method that uses suction to attach components to a substrate, The control unit controls the first suction nozzle and at least one second suction nozzle to pick up the component. The control unit controls the first suction nozzle and the second suction nozzle to lift the component. The control unit controls the second adsorption nozzle to stop adsorption, The control unit controls the first suction nozzle and / or the second suction nozzle to change the height of the second suction nozzle relative to the component, thereby separating the second suction nozzle from the component. The control unit controls the first suction nozzle, which has lifted the component, to be rotated using a rotating means. Parts installation method.

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