electronic machinery

Abstract

Reduces magnetic field noise radiated from flexible circuit boards. [Solution] The electronic device of the present disclosure comprises a first module that supplies first power and second power; a flexible wiring unit including first power wiring and second power wiring for transmitting first power, third power wiring and fourth power wiring for transmitting second power; and a second module to which first power and second power are supplied via the flexible wiring unit, wherein, during the transmission of first power and second power, the potential difference between the first power wiring and the fourth power wiring and the potential difference between the second power wiring and the third power wiring is greater than the potential difference between the second power wiring and the fourth power wiring, the first power wiring is arranged alongside the second power wiring in a first direction and alongside the fourth power wiring in a second direction perpendicular to the first direction, and the third power wiring is arranged alongside the fourth power wiring in a first direction and alongside the second power wiring in a second direction.

Description

Technical Field

[0001] The present disclosure relates to an electronic device.

Background Art

[0002] In recent years, due to the high functionality of electronic devices, the power consumption of semiconductor components has increased, and unnecessary magnetic noise caused by the current flowing through the power supply system has become a problem of affecting the quality of peripheral components. For example, in an imaging device such as a digital camera, it is necessary to continuously process a large amount of data over a long period of time by a high-definition imaging sensor. Therefore, the power consumption in the imaging sensor has increased significantly.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The electronic device described in Patent Document 1 supplies power using a flexible printed circuit board. However, there is a risk of degrading the quality of the captured image due to the magnetic field noise radiated from the flexible printed circuit board.

Means for Solving the Problems

[0005] The electronic device of this disclosure comprises a first module that supplies first power and second power; a flexible wiring unit including first power wiring and second power wiring for transmitting the first power, and third power wiring and fourth power wiring for transmitting the second power; and a second module to which the first power and second power are supplied via the flexible wiring unit, wherein, during the transmission of the first power and the second power, the potential difference between the first power wiring and the fourth power wiring and the potential difference between the second power wiring and the third power wiring are greater than the potential difference between the second power wiring and the fourth power wiring; the first power wiring is arranged alongside the second power wiring in a first direction and alongside the fourth power wiring in a second direction perpendicular to the first direction; and the third power wiring is arranged alongside the fourth power wiring in a first direction and alongside the second power wiring in a second direction. [Effects of the Invention]

[0006] According to this disclosure, it is possible to provide electronic equipment capable of reducing magnetic field noise. [Brief explanation of the drawing]

[0007] [Figure 1] This is a schematic diagram illustrating one configuration of an electronic device according to the first embodiment. [Figure 2A] This is a side view illustrating one configuration of a power receiving module, a flexible wiring unit, and a power supply module according to the first embodiment. [Figure 2B] This is a block diagram illustrating one configuration of a digital camera according to the first embodiment. [Figure 3] This is a plan view illustrating one configuration of a power receiving module and a flexible wiring unit according to the first embodiment. [Figure 4] This is a cross-sectional view of the flexible wiring board shown in Figure 3, along the line A-A'. [Figure 5] This is a side view illustrating one configuration of a power receiving module, a flexible wiring unit, and a power supply module according to a second embodiment. [Figure 6A] This is a plan view illustrating one configuration of a power receiving module and a flexible wiring unit according to a second embodiment. [Figure 6B] This is a plan view showing an example of a connection structure for a first flexible wiring board and a second flexible wiring board according to the second embodiment. [Figure 6C] This is a plan view illustrating one configuration of a power receiving module according to the second embodiment. [Figure 7A] Figure 6A shows a cross-sectional view along the line A-A' for the first and second flexible wiring boards. [Figure 7B] Figure 6A is a cross-sectional view along the line B-B' of the power receiving module, flexible wiring unit, and wiring board shown. [Figure 8] This is a plan view illustrating one configuration of a power receiving module and a flexible wiring unit according to the third embodiment. [Figure 9] Figure 8 shows cross-sectional views along the line A-A' for the first and second flexible wiring boards. [Figure 10] This is a plan view illustrating one configuration of a power receiving module and a flexible wiring unit according to the fourth embodiment. [Figure 11] Figure 10 shows cross-sectional views along the line A-A' for the first and second flexible wiring boards. [Figure 12] This is a plan view illustrating one configuration of a power receiving module and a flexible wiring unit according to the fifth embodiment. [Figure 13] Figure 12 shows cross-sectional views along the line A-A' for the first and second flexible wiring boards. [Figure 14] This graph illustrates the phase difference of currents flowing through power wiring. [Figure 15A] This is a side view illustrating one configuration of a power supply module, a power receiving module, and a flexible wiring unit according to the sixth embodiment. [Figure 15B]It is a plan view for explaining a configuration of a power supply module, a power receiving module, and a flexible wiring unit according to the sixth embodiment. [Figure 16] It is a graph showing simulation results of magnetic flux density in an example and a comparative example.

Embodiments for Carrying out the Invention

[0008] Hereinafter, embodiments for carrying out the present disclosure will be described in detail with reference to the drawings. Note that the present disclosure is not limited to the following embodiments, and can be appropriately changed without departing from the gist thereof. In the drawings described below, those having the same function are denoted by the same reference numerals, and the description thereof may be omitted or simplified.

[0009] [First Embodiment] The electronic device according to the first embodiment will be described with reference to FIGS. 1 to 4. FIG. 1 is a schematic diagram for explaining a configuration of the electronic device according to the first embodiment. Here, a digital camera 1 is shown as an example of the electronic device. The digital camera 1 includes a camera body 2 and a lens unit 3 (lens barrel). The camera body 2 includes a housing 9 that houses a power receiving module 5 (second module), a flexible wiring unit 6, a shake correction mechanism 7, and a power supply module 8 (first module). The lens unit 3 is an interchangeable lens unit with respect to the camera body 2 or a lens unit integrated with the camera body 2 for guiding light from a subject to the semiconductor element 51.

[0010] Power is supplied from the power supply module 8 to the power receiving module 5 via the flexible wiring unit 6. The flexible wiring unit 6 includes one or more flexible wiring members. Each flexible wiring member is, for example, a flexible printed circuit board (FPC) or a flexible flat cable (FFC). The flexible wiring unit 6 may be composed of a single flexible wiring member or an aggregate of a plurality of flexible wiring members. In this example, the power receiving module 5 includes a single wiring board 52, but the power receiving module 5 may include a plurality of wiring boards, and the flexible wiring unit 6 may be connected to the plurality of wiring boards of the power receiving module 5. In this example, the power supply module 8 includes a single wiring board 82, but the power supply module 8 may have a plurality of wiring boards, and the flexible wiring unit 6 may be connected to the plurality of wiring boards of the power supply module 8. The wiring board 52 can be referred to as a power receiving board, and the wiring board 82 can be referred to as a power supply board.

[0011] The power receiving module 5 includes a semiconductor element 51 and a wiring board 52. The semiconductor element 51 is an imaging element having a light receiving portion 50 that receives light from a subject. Therefore, the power receiving module 5 can also be referred to as an imaging module. The wiring board 52 conducts electricity to the semiconductor element 51 mounted on the main surface. Further, the power supply module 8 has a semiconductor component 81 and a wiring board 82. The semiconductor component 81 is an electronic component for image processing that processes an image acquired by imaging at high speed. Therefore, the power supply module 8 can also be referred to as an image processing module. The wiring board 82 is provided with a wiring pattern (not shown) for inputting and outputting signals to and from the semiconductor component 81. The wiring board 52 can be referred to as an imaging board, and the wiring board 82 can be referred to as an image processing board. Furthermore, the flexible wiring unit 6 has a plurality of wirings that electrically connect the wiring board 52 and the wiring board 82.

[0012] Furthermore, the image stabilization mechanism 7 has a function to correct image blur in the captured image. The image stabilization mechanism 7 moves the power receiving module 5 relative to the power supply module 8 within the housing 9. The image stabilization mechanism 7 has an actuator (not shown) that controls the position of the semiconductor element 51. When the power receiving module 5 moves relative to the power supply module 8, the flexible wiring unit 6 deforms to follow the displacement of the power receiving module 5 and the power supply module 8.

[0013] Figure 2A is a side view illustrating one configuration of a power receiving module 5, a flexible wiring unit 6, and a power supply module 8 according to the first embodiment. Here, the arrangement of the semiconductor element 51 included in the power receiving module 5, the wiring board 52, the flexible wiring unit 6, and the power supply module 8 is shown. In the first embodiment, the flexible wiring unit 6 consists of two flexible wiring boards: a flexible wiring board 60 for power supply and a flexible wiring board 65 for signal transmission. The wiring board 52 has connectors 53 and 54 on the side opposite to the side on which the semiconductor element 51 is provided. The wiring board 82 has connectors 83 and 84 on the side opposite to the side on which the semiconductor component 81 is provided. One end of the flexible wiring board 60 for power supply is connected to the connector 53 of the wiring board 52, and the other end is connected to the connector 83 of the power supply module 8. One end of the flexible wiring board 65 for signal transmission is connected to the connector 54 of the power receiving module 5, and the other end is connected to the connector 84 of the power supply module 8. However, the method of connecting the flexible wiring unit 6 to the power receiving module 5 and the power supply module 8 is not limited to this. At least some of the terminals of the flexible wiring unit 6 may be soldered to the circuit boards (wiring boards 52 and 82) of each module. For example, one end of the flexible wiring board 65 for signal transmission may be soldered to the power receiving module 5, and the other end of the flexible wiring board 65 for signal transmission may be soldered to the connector 84 of the power supply module 8. Alternatively, one end of the flexible wiring board 65 for signal transmission may be soldered to the power receiving module 5, and one end of the flexible wiring board 60 for power supply may be connected to the connector of the power receiving module 5.

[0014] Figure 2B is a block diagram illustrating one configuration of a digital camera 1 according to the first embodiment. The power receiving module 5 may include a first relay circuit 55 and a second relay circuit 56 in addition to the light receiving unit 50. The power receiving module 5 may also include an analog circuit 57 and a digital circuit 58 as circuit sections. Examples of the analog circuit 57 include a pixel circuit, a readout circuit, a clock generation circuit, a bias generation circuit, etc. Examples of the digital circuit 58 include an A / D conversion circuit, a digital control circuit, an ISP (Image Signal Processor), a data buffering circuit, a communication circuit, etc. The first relay circuit 55 supplies power to the analog circuit 57. The second relay circuit 56 supplies power to the digital circuit 58. The first relay circuit 55 and the second relay circuit 56 may include wiring on the wiring board 52. The first relay circuit 55 and the second relay circuit 56 may include connecting members such as bonding wires that connect the semiconductor element 51 and the wiring board 52. The first relay circuit 55 and the second relay circuit 56 may include connecting members such as connectors that connect the wiring board 52 and the flexible wiring unit 6. The first relay circuit 55 and the second relay circuit 56 may also include capacitors and inductors for noise suppression. The first relay circuit 55 and the second relay circuit 56 may also include voltage conversion circuits such as level shift circuits that perform voltage boosting or bucking.

[0015] In the example shown in Figure 2B, a semiconductor element 51 having a light-receiving section 50 is shown to have an analog circuit 57 and a digital circuit 58. At least a portion of at least one of the analog circuit 57 and the digital circuit 58 may be provided on a semiconductor element separate from the semiconductor element 51 having the light-receiving section 50, and this separate semiconductor element may be stacked on the semiconductor element 51. Also, in the example shown in Figure 2B, a first relay circuit 55 and a second relay circuit 56 are provided as semiconductor elements separate from the semiconductor element 51 having the light-receiving section 50. However, at least a portion of at least one of the first relay circuit 55 and the second relay circuit 56 may be provided on the semiconductor element 51 having the light-receiving section 50, or on a semiconductor element stacked on the semiconductor element 51 having the light-receiving section 50.

[0016] The power supply module 8 includes a first power supply 85 and a second power supply 86 in addition to the semiconductor component 81. The first power supply 85 and the second power supply 86 are, for example, DC-DC converters. The first power supply 85 and the second power supply 86 may be composed of one semiconductor element or multiple semiconductor elements. Also, in Figure 2B, the first relay circuit 55 is connected to the first power supply 85 via a flexible wiring board 60 for power supply. The second relay circuit 56 is connected to the second power supply 86 via a flexible wiring board 60 for power supply. Power only needs to be supplied from the first power supply 85 to the analog circuit 57 via the flexible wiring unit 6, and the configuration of the first relay circuit 55 can be designed as appropriate. Power only needs to be supplied from the second power supply 86 to the digital circuit 58 via the flexible wiring unit 6, and the configuration of the second relay circuit 56 can be designed as appropriate.

[0017] The flexible wiring unit 6 has four or more power wires for transmitting power from the power supply module 8 to the power receiving module 5. One power system corresponds to the product of the voltage of two power wires and the current flowing through them. Of the pair of power wires to which the voltage (potential difference) in this power is applied, the power wire with the higher potential is the high-potential wire, and the power wire with the lower potential is the low-potential wire. The four or more power wires in the flexible wiring unit 6 consist of one pair (first pair) of two power wires and another pair (second pair) of two power wires. The power transmitted by the first pair of two power wires is called the first power, and the power transmitted by the second pair of two power wires is called the second power. The magnitudes of the first power and the second power may be equal or different, but this embodiment is preferable when the magnitudes of the first power and the second power are different. Typically, the power corresponding to the first power is supplied to the analog circuit 57, and the power corresponding to the second power is supplied to the digital circuit 58. The magnitude of the first power transmitted by the flexible wiring unit 6 and the magnitude of the power supplied to the analog circuit 57 do not need to be exactly the same and may be modified by the first relay circuit 55. The magnitude of the second power transmitted by the flexible wiring unit 6 and the magnitude of the power supplied to the digital circuit 58 do not need to be exactly the same and may be modified by the second relay circuit 56.

[0018] Of the two power lines in the first pair for transmitting the first power, one power line is taken as the first power line, and the other power line is taken as the second power line. Of the two power lines in the second pair for transmitting the second power, one power line is taken as the third power line, and the other power line is taken as the fourth power line. When transmitting the first power and the second power, the potential difference between the first power line and the fourth power line and the potential difference between the second power line and the third power line are greater than the potential difference between the second power line and the fourth power line. When transmitting the first power and the second power, regarding the relationship of the potential V1 applied to the first power line, the potential V2 applied to the second power line, the potential V3 applied to the third power line, and the potential V4 applied to the fourth power line, |V1 - V4| > |V2 - V4| and |V2 - V3| > |V2 - V4|. Note that the potential difference between the second power line and the fourth power line may be zero or non-zero (|V2 - V4| ≥ 0). V1 may be greater than V4, or V1 may be less than V4. V2 may be greater than V3, or V2 may be less than V3. V2 may be greater than or equal to V3, or V2 may be less than or equal to V3. In the following embodiments, when V1 > V2 is satisfied, that is, when the first power line is taken as the high-potential line and the second power line is taken as the low-potential line, it will be described. Also, when V3 > V4 is satisfied, that is, when the third power line is taken as the high-potential line and the fourth power line is taken as the low-potential line, it will be described. However, even when either V1 < V2 or V3 < V4 is satisfied, it is only necessary to satisfy |V1 - V4| > |V2 - V4| and |V2 - V3| > |V2 - V4|. Furthermore, in the following embodiments, V1 and V3 are described as positive power supply potentials, and V2 and V4 are described as ground potentials. However, V1 and V3 can also be positive power supply potentials, and V2 and V4 can be negative power supply potentials. The value of the power supply potential is, for example, 0.5 [V] or more and 13 [V] or less, and may be 1.0 [V] or more and 6.0 [V] or less, or may be 4.0 [V] or less. The potential V1 and the potential V3 exemplified as positive power supply potentials may be the same potential or different potentials. For example, the potential V1 corresponding to the power supplied to the analog circuit 57 may be higher than the potential V3 corresponding to the power supplied to the digital circuit 58. The potential V2 and the potential V4 exemplified as ground potentials may be the same potential or different potentials.In other words, at least one of the potentials V2 and V4 does not have to match the frame ground potential of the electronic equipment. For example, the potential V2 corresponding to the power supplied to the analog circuit 57 may be lower than the potential V4 corresponding to the power supplied to the digital circuit 58. Each power supply potential may be approximately the same, and each ground potential may be approximately the same.

[0019] In this embodiment, the first power wiring is arranged alongside the second power wiring in the first direction, and alongside the fourth power wiring in the second direction perpendicular to the first direction. The third power wiring is arranged alongside the fourth power wiring in the first direction, and alongside the second power wiring in the second direction. By arranging the power wiring in this manner, it is possible to reduce magnetic field noise.

[0020] Figure 3 is a plan view illustrating one configuration of the power receiving module 5 and flexible wiring unit 6 according to the first embodiment. Figure 3 shows an XYZ Cartesian coordinate system, where the X, Y, and Z directions are orthogonal to each other. That is, the X and Y directions are orthogonal, and the Z direction is orthogonal to the X and Y directions. Figure 3 is a plan view of the wiring board 52 as seen from the wiring board 82 side, showing the arrangement of the flexible wiring board 60 for power supply, the flexible wiring board 65 for signal transmission, the semiconductor element 51, and the wiring board 52. The flexible wiring board 60 for power supply is a flexible wiring board including a first conductor layer and a second conductor layer stacked on top of each other in the Z direction. Power wiring 601 and power wiring 602 are arranged on the first conductor layer. Power wiring 601 corresponds to the first power wiring to which the power supply potential (potential V1) described above is applied. Power wiring 602 corresponds to the second power wiring to which the ground potential (potential V2) described above is applied. Power wiring 601 is arranged alongside power wiring 602 in the X direction in a plan view of the flexible wiring unit 6. Power wiring 601 and power wiring 602 transmit the first power. Power wiring 601 and power wiring 602 extend in the Y direction in a plan view, and current flows through power wiring 601 and power wiring 602 along the Y direction. The second conductor layer, which constitutes the layer below the first conductor layer, will be described later. The flexible wiring unit 6 overlaps with the semiconductor element 51 in the Z direction.

[0021] Furthermore, the flexible wiring board 65 for signal transmission has multiple differential signal lines 651. A differential signal line 651 transmits an electrical signal using two signal lines. When a signal flows through one signal line, a signal with the opposite phase flows through the other signal line. This minimizes the influence of external noise and enables high-speed and high-quality signal transmission. Figure 3 shows three differential signal lines 651, but the number of differential signal lines 651 provided on the flexible wiring board 65 for signal transmission may be four or more, eight or more, or sixteen or more. In this embodiment, when light incident on the semiconductor element 51 is converted into an electrical signal, the electrical signal is transmitted at high speed to the power supply module 8 by the differential signal lines 651 of the flexible wiring board 65.

[0022] Figure 4 is a cross-sectional view of the flexible wiring board 60 shown in Figure 3 along the line A-A'. As shown in Figure 4, it comprises a base material 605, a first conductor layer disposed on one surface (top surface) of the base material 605, a second conductor layer disposed on the other surface (bottom surface) of the base material 605, and a coverlay 606. Power wiring 601 and power wiring 602 are arranged on the first conductor layer. Power wiring 601 corresponds to the first power wiring to which the above-mentioned power supply potential (potential V1) is applied. Power wiring 602 corresponds to the second power wiring to which the above-mentioned ground potential (potential V2) is applied. Power wiring 603 and power wiring 604 are arranged on the second conductor layer. Power wiring 603 corresponds to the third power wiring to which the above-mentioned power supply potential (potential V3) is applied. Power wiring 604 corresponds to the fourth power wiring to which the above-mentioned ground potential (potential V4) is applied. The base material 605 is made of polyimide. The first and second conductor layers are made of copper foil. The thickness th1 in the Z direction of the first conductor layer and the thickness th2 in the Z direction of the second conductor layer are, for example, 1 μm or more, less than 100 μm, may be 5 μm or more, or less than 50 μm. The thickness in the Z direction of power wiring 601 and the thickness in the Z direction of power wiring 602 are approximately the same and are expressed as thickness th1. The thickness in the Z direction of power wiring 603 and the thickness in the Z direction of power wiring 604 are approximately the same and are expressed as thickness th2. The coverlay 606 is an insulating member that covers power wiring 601, power wiring 602, power wiring 603, and power wiring 604. Power wiring 603 and power wiring 604 are arranged in the second conductor layer. Power wiring 603 is arranged alongside power wiring 604 in the X direction. The spacing g1 between power wiring 601 and power wiring 602 and the spacing g2 between power wiring 603 and power wiring 604 in the X direction are, for example, 10 μm or more, 500 μm or less, and may be 50 μm or more or 100 μm or less. Power wiring 603 and power wiring 604 transmit second power. Power wiring 603 and power wiring 604 extend in the Y direction in a plan view, and current flows through power wiring 603 and power wiring 604 along the Y direction.The current values ​​flowing through power wiring 601 and power wiring 603 are, for example, between 0.5[A] and 3.0[A].

[0023] Furthermore, power wiring 603 is positioned opposite power wiring 602 in the Z direction. Therefore, as shown in Figure 3, power wiring 603 overlaps with power wiring 602 in a plan view of the flexible wiring unit 6. Similarly, power wiring 601 is positioned parallel to and opposite power wiring 604 in the Z direction. As shown in Figure 3, power wiring 601 overlaps with power wiring 604 in a plan view. In the first embodiment, power wiring 601 is connected to the analog circuit 57, and power wiring 603 is connected to the digital circuit 58. Conversely, power wiring 603 may be connected to the analog circuit 57, and power wiring 601 may be connected to the digital circuit 58. The distance g3 between power wiring 601 and power wiring 604 and the distance g4 between power wiring 603 and power wiring 602 in the Z direction are, for example, 10 μm or more, 500 μm or less, 50 μm or more, or 100 μm or less. The spacing g3 between power wiring 601 and power wiring 604 in the Z direction may be greater than the thickness th1 of power wiring 601 and / or the thickness th2 of power wiring 604 in the Z direction. The spacing g4 between power wiring 602 and power wiring 603 in the Z direction may be greater than the thickness th1 of power wiring 602 and / or the thickness th2 of power wiring 603 in the Z direction. The width w1 of power wiring 601 in the X direction is preferably greater than the thickness th1 of power wiring 601 in the Z direction, and the width w2 of power wiring 602 in the X direction is preferably greater than the thickness th1 of power wiring 602 in the Z direction. The width w3 of power wiring 603 in the X direction is preferably greater than the thickness th2 of power wiring 603 in the Z direction, and the width w4 of power wiring 604 in the X direction is preferably greater than the thickness th2 of power wiring 604 in the Z direction.

[0024] The spacing g1 between the power wiring (first power wiring) 601 and the power wiring (second power wiring) 602 in the X direction (first direction) is preferably smaller than the width w1 of the power wiring 601 and the width w2 of the power wiring 602 in the X direction. The spacing g2 between the power wiring (third power wiring) 603 and the power wiring (fourth power wiring) in the X direction is preferably smaller than the width w3 of the power wiring 603 and the width w4 of the power wiring 604 in the X direction. The spacing g3 between the power wiring 601 and the power wiring 604 in the Z direction (second direction) is preferably smaller than the width w1 of the power wiring 601 and the width w4 of the power wiring 604 in the X direction. The spacing g4 between the power wiring 602 and the power wiring 603 in the Z direction is preferably smaller than the width w2 of the power wiring 602 and the width w3 of the power wiring 603 in the X direction. The widths w1 of power wiring 601, w2 of power wiring 602, w3 of power wiring 603, and w4 of power wiring 604 in the X direction are, for example, 100 μm or more, 250 μm or more, 500 μm or more, 5 mm or less, 2.5 mm or less, 1000 μm or less, or 750 μm or less.

[0025] The width w1 of power wiring 601 may be approximately the same as the width w2 of the adjacent power wiring 602. Similarly, the width w3 of power wiring 603 may be approximately the same as the width w4 of the adjacent power wiring 604. The width w3 of power wiring 603 may be approximately the same as the width w2 of the opposing power wiring 602. The width w4 of power wiring 604 may be approximately the same as the width w1 of the opposing power wiring 601. The widths w1 to w4 are, for example, 630 μm. The spacing g1 between power wiring 601 and power wiring 602 is, for example, 70 μm. Note that "value A and value B are approximately the same" means that value A / value B is 100 ± 10%, and for example, if the value is width, it means that w1 / w2 and w3 / w4 are 100 ± 10%.

[0026] As described above, in the first conductor layer, power wiring 601 is arranged alongside power wiring 602, which carries current in the opposite direction to power wiring 601. Similarly, in the second conductor layer, power wiring 603 is arranged alongside power wiring 604, which carries current in the opposite direction to power wiring 603. This increases the effect of canceling out the magnetic field. In addition, power wiring 601 of the first conductor layer is arranged alongside power wiring 604 of the second conductor layer in the vertical direction (Z direction). Power wiring 603 of the second conductor layer, which is below the first conductor layer, is arranged alongside power wiring 602 of the first conductor layer in the vertical direction (Z direction). Thus, by arranging power wirings 601 and 603 alongside power wirings 602 and 604 in the horizontal direction (X direction), and power wirings 601 and 603 facing power wirings 604 and 602 in the vertical direction (Z direction), the effect of canceling out the magnetic field is further enhanced. Furthermore, if the widths of the power wirings are approximately the same, the effect of canceling out the magnetic field can be further enhanced. The larger the width of each power cable in the X direction, the greater the coupling with power cables aligned in the Z direction. Also, the smaller the spacing between each power cable and power cables aligned in the X or Z direction, the greater the coupling with power cables aligned in the X or Z direction. For this reason, typically, the relationships {w1,w2,w3,w4}>{g3,g4}≧{g1,g2}>{th1,th2} or {w1,w2,w3,w4}>{g1,g2}≧{g3,g4}>{th1,th2} are satisfied.

[0027] The example described shows one power circuit arranged on the same conductive layer, but it is not limited to this. For example, power wiring 601 and power wiring 604 may be arranged on the first conductive layer, and power wiring 602 and power wiring 603 may be arranged on the second conductive layer. In that case, power wiring 601 is arranged alongside (overlapping) power wiring 602 in the Z direction, and alongside power wiring 604 in the X direction which is perpendicular to the Z direction. Also, power wiring 603 is arranged alongside (overlapping) power wiring 604 in the Z direction, and alongside power wiring 602 in the X direction.

[0028] [Second Embodiment] The following describes the electronic device according to the second embodiment. In the first embodiment, the flexible wiring board 60 for power supply was a double-sided flexible wiring board with a two-layer structure. In the second embodiment, the flexible wiring board for power supply is composed of two single-sided flexible wiring boards. In the second embodiment, of the two flexible wiring boards for power supply, one is formed in a straight shape and the other is formed in a curved shape. The third embodiment differs from the first embodiment in the number of flexible wiring boards constituting the flexible wiring unit 6 and in the shape of the flexible wiring boards.

[0029] Figure 5 is a side view illustrating one configuration of a power receiving module 5, a flexible wiring unit 6, and a power supply module 8 according to the second embodiment. The flexible wiring unit 6 of this embodiment has a first flexible wiring board 61 and a second flexible wiring board 62 as flexible wiring boards for power supply. The first flexible wiring board 61 and the second flexible wiring board 62 each have a plurality of power wirings. One end of the first flexible wiring board 61 is connected to a connector 53A provided on a wiring board 52. The other end of the first flexible wiring board 61 is connected to a connector 83A provided on a wiring board 82. One end of the second flexible wiring board 62 is connected to a connector 53B provided on a wiring board 52. The other end of the second flexible wiring board 62 is connected to a connector 83B provided on a wiring board 82. The configuration of the flexible wiring board 65 for signal transmission is the same as in the first embodiment.

[0030] In the second embodiment, power is transmitted from the power supply module 8 to the power receiving module 5 using the first flexible wiring board 61 and the second flexible wiring board 62, respectively. Generally, high-spec digital cameras require a large current of about 0.5 to 3.0 [A]. For this reason, multiple flexible wiring boards for power supply are provided to accommodate wiring migration. In the second embodiment, the first power is different from the second power, but it is also possible for the first and second powers to be the same.

[0031] Figure 6A is a plan view illustrating one configuration of the power receiving module 5 and flexible wiring unit 6 according to the second embodiment. Figure 6A is a plan view of the wiring board 52 as seen from the side of the wiring board 82, and shows the arrangement of the first flexible wiring board 61, the second flexible wiring board 62, the flexible wiring board 65, the semiconductor element 51, and the wiring board 52. The first flexible wiring board 61 and the second flexible wiring board 62 are single-sided flexible wiring boards in which the conductor layer is provided on only one side. In the first flexible wiring board 61, power wiring 611 is arranged alongside power wiring 612 in the X direction. Power wiring 611 and power wiring 612 transmit first power. Power wiring 611 corresponds to the first power wiring to which the above-mentioned power supply potential (potential V1) is applied. Power wiring 612 corresponds to the second power wiring to which the above-mentioned ground potential (potential V2) is applied. In addition, in the second flexible wiring board 62, power wiring 621 is arranged alongside power wiring 622. Power lines 621 and 622 transmit the second power. Power line 621 corresponds to the third power line to which the above-mentioned power supply potential (potential V3) is applied. Power line 622 corresponds to the fourth power line to which the above-mentioned ground potential (potential V4) is applied.

[0032] At least a portion of the first flexible wiring board 61 for power supply is arranged to overlap with the semiconductor element 51 in a plan view. Similarly, at least a portion of the second flexible wiring board 62 is arranged to overlap with the semiconductor element 51 in a plan view. Furthermore, the first flexible wiring board 61 and the second flexible wiring board 62 are arranged to overlap in at least a portion of their paths to the wiring board 82.

[0033] Furthermore, as shown in Figure 6A, the second flexible wiring board 62 is formed in a straight line. In contrast, the first flexible wiring board 61 includes a first substrate portion P1 that overlaps with the second flexible wiring board 62 in a plan view and is connected to the power receiving module (second module) 5, a second substrate portion P2 that does not overlap with the second flexible wiring board 62 and is connected to the power supply module (first module) 8, and a third substrate portion P3 between the first substrate portion P1 and the second substrate portion P2. The flexible wiring board for signal transmission (third flexible wiring board) 65 is arranged to intersect with the third substrate portion P3 in a plan view.

[0034] By providing two flexible wiring boards for power supply (first flexible wiring board 61 and second flexible wiring board 62) and separating the power supply, wiring migration can be avoided. In addition, by arranging the first flexible wiring board 61 so that at least a portion of it overlaps with the second flexible wiring board 62, the area and volume required for the flexible wiring boards are reduced, enabling miniaturization of electronic devices.

[0035] Figure 6B is a plan view showing an example of a connection structure for a first flexible wiring board 61 and a second flexible wiring board 62 according to a second embodiment. Here, two fixing members 10 are provided at the lower part of the first flexible wiring board 61 and the second flexible wiring board 62. The fixing members 10 have openings at both ends for inserting screws. Inside the housing 9 of the camera body 2, there are metal plates (not shown) or the like that which will be the parts to which the first flexible wiring board 61 and the second flexible wiring board 62 are fixed. The fixing members 10 define the position of the second flexible wiring board 62 relative to the first flexible wiring board 61 and fix the first flexible wiring board 61 and the second flexible wiring board 62 to the housing 9 of the camera body 2. The first flexible wiring board 61 and the second flexible wiring board 62 may be bonded to the metal plates or the like that constituting the housing 9 of the camera body 2 with an adhesive.

[0036] Figure 6C is a plan view illustrating one configuration of the power receiving module 5 according to the second embodiment. Here, a connector 54 to which the terminals (not shown) of a flexible wiring board 65 for signal transmission are connected is located approximately in the center of the semiconductor element 51 in a plan view. In addition, a connector 53B to which the terminals (not shown) of the first flexible wiring board 61 are connected and a connector 53A to which the terminals (not shown) of the second flexible wiring board 62 are connected are spaced apart near the outer periphery of the semiconductor element 51 in a plan view.

[0037] Figure 7A is a cross-sectional view along line A-A' of the first flexible wiring board 61 and the second flexible wiring board 62 for power supply shown in Figure 6. As shown in Figure 7A, the first flexible wiring board 61 comprises power wiring 611, power wiring 612, base material 615, and coverlay 616. The second flexible wiring board 62 comprises power wiring 621, power wiring 622, base material 625, and coverlay 626. The base materials 615 and 625 are made of polyimide. Copper wiring is provided on the base materials 615 and 625. The coverlays 616 and 626 are insulating members that cover the wiring. Power wiring 611 and power wiring 612 of the first flexible wiring board 61 transmit the first power. Power wiring 621 and power wiring 622 of the second flexible wiring board 62 transmit the second power. In the first flexible wiring board 61, the power wiring 611 is arranged alongside the power wiring 612 in the X direction in a plan view. In the second flexible wiring board 62, the power wiring 621 that supplies the second power is arranged alongside the power wiring 622 in the X direction in a plan view. Furthermore, the power wiring 611 of the first flexible wiring board 61 is arranged opposite the power wiring 622 of the second flexible wiring board 62 in the Z direction. Similarly, the power wiring 621 of the second flexible wiring board 62 is arranged opposite the power wiring 612 of the first flexible wiring board 61 in the Z direction.

[0038] Figure 7B is a cross-sectional view along the line B-B' of the power receiving module 5, flexible wiring unit 6, and wiring board 82 shown in Figure 6A. The thickness th10 of wiring board 82 and the thickness th11 of wiring board 52 are, for example, 0.8 mm. The thickness th12 of semiconductor element 51 is, for example, 0.7 mm. The distance d11 between wiring board 82 and the first flexible wiring board 61 is, for example, 10.9 mm. The distance d12 between wiring board 52 and the second flexible wiring board 62 is, for example, 10.9 mm. As shown in Figure 7B, the distance between the first flexible wiring board 61 and the semiconductor element 51 is longer than the distance between the second flexible wiring board 62 and the semiconductor element 51. In such an arrangement, it is preferable that the DC voltage value supplied by the first flexible wiring board 61 is higher than the DC voltage value supplied by the second flexible wiring board 62. In other words, it is preferable to position the flexible wiring board that transmits a larger power than the first flexible wiring board 61 and the second flexible wiring board 62, so that it is further away from the semiconductor element 51. This makes it possible to reduce magnetic field noise that affects the semiconductor element 51.

[0039] As described above, in the first flexible wiring board 61, power wiring 611 is arranged alongside power wiring 612 in the X direction. Current flows in power wiring 612 in the opposite direction to power wiring 601. Similarly, in the second flexible wiring board 62, power wiring 621 is arranged alongside power wiring 622 in the X direction. Current flows in power wiring 622 in the opposite direction to power wiring 621. This increases the effect of canceling out the magnetic field. In addition, power wiring 611 of the first flexible wiring board 61 is arranged opposite to power wiring 622 of the second flexible wiring board 62 in the Z direction. Power wiring 621 of the second flexible wiring board 62 is arranged opposite to power wiring 612 of the first flexible wiring board 61 in the Z direction. In this way, the arrangement of two power wirings with currents flowing in opposite directions, arranged side by side in the left-right direction (X direction) and up-down direction (Z direction), enhances the effect of canceling out the magnetic field. Furthermore, if the widths of the power wiring are approximately the same, the magnetic field cancellation effect can be enhanced. In addition, since the two flexible wiring boards are fixed, the relative positions of multiple power wirings can be maintained. This allows for a stable reduction in magnetic field noise.

[0040] [Third Embodiment] The electronic device according to the third embodiment will now be described. In the second embodiment described above, each of the first flexible wiring board 61 and the second flexible wiring board 62 for power supply had two power wires. In contrast, the third embodiment differs from the second embodiment in terms of the number of wires included in each flexible wiring board and the arrangement of the wires.

[0041] In the third embodiment, the meanings of the terms "first to fourth power wirings", "first power", and "second power" are the same as those in the above-described first and second embodiments. Also, out of the two power wirings in the third pair that transmit the third power, one power wiring is defined as the fifth power wiring, and the other power wiring is defined as the sixth power wiring. Out of the two power wirings in the fourth pair that transmit the fourth power, one power wiring is defined as the seventh power wiring, and the other power wiring is defined as the eighth power wiring. When transmitting the third power and the fourth power, the potential difference between the fifth power wiring and the eighth power wiring and the potential difference between the sixth power wiring and the seventh power wiring are greater than the potential difference between the sixth power wiring and the eighth power wiring. When transmitting the third power and the fourth power, regarding the relationship of the potentials V5 applied to the fifth power wiring, V6 applied to the sixth power wiring, V7 applied to the seventh power wiring, and V8 applied to the eighth power wiring, |V5 - V8| > |V6 - V8| and |V6 - V7| > |V6 - V8|. Note that the potential difference between the sixth power wiring and the eighth power wiring may be zero or non-zero (|V6 - V8| ≥ 0). V5 > V8 may be true, or V5 < V8 may be true, V6 > V7 may be true, or V6 < V7 may be true, V6 ≥ V7 may be true, or V6 ≤ V7 may be true. In the following embodiments, when V5 > V6 is satisfied, that is, when the fifth power wiring is described as the high-potential wiring and the sixth power wiring is described as the low-potential wiring. Also, when V7 > V8 is satisfied, that is, when the seventh power wiring is described as the high-potential wiring and the eighth power wiring is described as the low-potential wiring. However, even when either V5 < V6 or V7 < V8 is satisfied, it is only necessary to satisfy |V5 - V8| > |V6 - V8| and |V6 - V7| > |V6 - V8|. Furthermore, in the following embodiments, V5 and V7 are described as positive power supply potentials, and V6 and V8 are described as ground potentials. Each power supply potential may be substantially the same, and each ground potential may be substantially the same.

[0042] Figure 8 is a plan view illustrating one configuration of the power receiving module 5 and flexible wiring unit 6 according to the third embodiment. Figure 8 is a plan view of the wiring board 52 as seen from the wiring board 82 side, and shows the arrangement of the first flexible wiring board 61, the second flexible wiring board 62, the flexible wiring board 65, the semiconductor element 51, and the wiring board 52. The first flexible wiring board 61 and the second flexible wiring board 62 are single-sided flexible wiring boards in which the conductor layer is provided on only one side.

[0043] The first flexible wiring board 61 of this embodiment has power wiring 611A, power wiring 612A, power wiring 611B, and power wiring 612B. Power wiring 611A is arranged alongside power wiring 612A in the X direction. Power wiring 611A and power wiring 612A transmit the first power. Power wiring 611A corresponds to the first power wiring to which the above-mentioned power supply potential (potential V1) is applied. Power wiring 612A corresponds to the second power wiring to which the above-mentioned ground potential (potential V2) is applied. Power wiring 611B is arranged alongside power wiring 612B in the X direction. Power wiring 611B and power wiring 612B transmit the third power from the power supply module 8 to the power receiving module 5. Power wiring 611B corresponds to the fifth power wiring to which the above-mentioned power supply potential (potential V5) is applied. Power wiring 612B corresponds to the sixth power wiring to which the above-mentioned ground potential (potential V6) is applied.

[0044] Similarly, the second flexible wiring board 62 has power wiring 622A, power wiring 621A, power wiring 622B, and power wiring 621B. Power wiring 621A is arranged in the X direction alongside power wiring 622A and power wiring 622B. Power wiring 621A and power wiring 622A transmit the second power. Power wiring 621A corresponds to the third power wiring to which the above-mentioned power supply potential (potential V3) is applied. Power wiring 622A corresponds to the fourth power wiring to which the above-mentioned ground potential (potential V4) is applied. Power wiring 621B is arranged in the X direction alongside power wiring 622B. Power wiring 621B and power wiring 622B transmit the fourth power from the power supply module 8 to the power receiving module 5. Power wiring 621B corresponds to the seventh power wiring to which the above-mentioned power supply potential (potential V7) is applied. Power wiring 622B corresponds to the eighth power wiring to which the above-mentioned ground potential (potential V8) is applied. In the third embodiment, the difference between the first power and the third power is smaller than the difference between the first power and the second power, and the difference between the second power and the fourth power is smaller than the difference between the third power and the fourth power. The current values ​​flowing through power wiring 611A, power wiring 621A, power wiring 611B, and power wiring 621B are between 0.5[A] and 3.0[A], respectively.

[0045] By arranging the wiring as described above, magnetic field noise generated in the high-potential wiring of the first flexible wiring board 61 and the second flexible wiring board 62 can be confined by the power wiring 622A and power wiring 622B, which have ground potential on both sides, thereby reducing the magnetic field noise reaching the semiconductor element 51.

[0046] Furthermore, the first flexible wiring board 61 and the second flexible wiring board 62 are arranged so that at least a portion of them overlap in a plan view. That is, the first flexible wiring board 61 and the second flexible wiring board 62 partially or completely overlap along the path to the wiring board 82. This creates an effect where the magnetic fields between the first flexible wiring board 61 and the second flexible wiring board 62 cancel each other out. In addition, the power supply is isolated by providing the first flexible wiring board 61 and the second flexible wiring board 62 for power supply. This has the effect of avoiding wiring migration.

[0047] Figure 9 is a cross-sectional view along line A-A' of the first flexible wiring board 61 and the second flexible wiring board 62 shown in Figure 8. As shown in Figure 9, the first flexible wiring board 61 has power wiring 611A, power wiring 612A, power wiring 611B, power wiring 612B, base material 615, and coverlay 616.

[0048] Power wiring 611A is arranged in the Z direction alongside power wiring 622A of the second flexible wiring board 62. Power wiring 611B is arranged in the Z direction alongside power wiring 622B of the second flexible wiring board 62.

[0049] Similarly, the second flexible wiring board 62 has power wiring 622A, power wiring 621A, power wiring 622B, power wiring 621B, base material 625, and coverlay 626.

[0050] Power wiring 621A is arranged in the Z direction alongside power wiring 612A of the first flexible wiring board 61. Power wiring 621B is arranged in the Z direction alongside power wiring 612B of the first flexible wiring board 61. In a plan view, power wiring 611A, power wiring 612A, power wiring 611B, and power wiring 612B in the first flexible wiring board 61 overlap with power wiring 622A, power wiring 621A, power wiring 622B, and power wiring 621B in the second flexible wiring board 62, respectively.

[0051] The width W3 of the power wiring 611A and the width W4 of the power wiring 612A on the first flexible wiring board 61 are, for example, 630 μm. The width is preferably 250 μm or more and 700 μm or less. The thickness TH2 of the power wiring 611A, power wiring 612A, power wiring 611B, and power wiring 612B is, for example, 18 μm. The thickness TH3 of the base material 615 is, for example, 25 μm. The distance d2 from the top surface of the wiring to the top surface of the first flexible wiring board 61 is, for example, 30 μm. The spacing G2 between the power wiring 611A and the power wiring 612A is, for example, 70 μm. The spacing G2 is preferably 60 μm or more and 80 μm or less. The width of the wiring on the second flexible wiring board 62 may be approximately the same as the width of the wiring on the first flexible wiring board 61, and the spacing between the wiring on the second flexible wiring board 62 may be approximately the same as the spacing between the wiring on the first flexible wiring board 61.

[0052] In the electronic device according to this embodiment, low-potential wiring is arranged side by side with respect to each of the two high-potential wirings within the same flexible wiring board. This enables the distribution and supply of current, and further enhances the effect of canceling out magnetic field noise generated by the current flowing through the high-potential wiring with the current flowing in the opposite direction in the low-potential wiring. As a result, magnetic field noise reaching the semiconductor element 51 from the flexible wiring unit 6 can be further reduced.

[0053] [Fourth Embodiment] The electronic device according to the fourth embodiment will now be described. The fourth embodiment differs from the third embodiment in the arrangement of power wiring that transmits the first to fourth powers inside the first flexible wiring board 61 and the second flexible wiring board 62, respectively. In the fourth embodiment, the meanings of the terms first to eighth power wiring and first to fourth powers are the same as in the third embodiment described above.

[0054] Figure 10 is a plan view illustrating one configuration of the power receiving module 5 and flexible wiring unit 6 according to the fourth embodiment. Figure 11 is a cross-sectional view along line A-A' of the first flexible wiring board 61 and the second flexible wiring board 62 shown in Figure 10.

[0055] The first flexible wiring board 61 of this embodiment has power wiring 611A, power wiring 612A, power wiring 621B, power wiring 622B, base material 615, and coverlay 616. Power wiring 611A is arranged alongside power wiring 612A in the X direction. Power wiring 611A and power wiring 612A transmit the first power. Power wiring 611A corresponds to the first power wiring to which the above-mentioned power supply potential (potential V1) is applied. Power wiring 612A corresponds to the second power wiring to which the above-mentioned ground potential (potential V2) is applied. Power wiring 621B is arranged alongside power wiring 622B and power wiring 612A in the X direction. Power wiring 621B and power wiring 622B transmit the third power from the power supply module 8 to the power receiving module 5. Power wiring 621B corresponds to the fifth power wiring to which the above-mentioned power supply potential (potential V5) is applied. Power wiring 622B corresponds to the sixth power wiring to which the aforementioned ground potential (potential V6) is applied.

[0056] Furthermore, the second flexible wiring board 62 has power wiring 622A, power wiring 621A, power wiring 612B, power wiring 611B, base material 625, and coverlay 626. Power wiring 621A of the second flexible wiring board 62 is arranged in the X direction alongside power wiring 622A and power wiring 612B. Power wiring 621A and power wiring 622A transmit the second power. Power wiring 621A corresponds to the third power wiring to which the above-mentioned power supply potential (potential V3) is applied. Power wiring 622A corresponds to the fourth power wiring to which the above-mentioned ground potential (potential V4) is applied. Power wiring 611B is arranged in the X direction alongside power wiring 612B. Power wiring 611B and power wiring 612B transmit the fourth power from the power supply module 8 to the power receiving module 5. Power wiring 611B corresponds to the seventh power wiring to which the above-mentioned power supply potential (potential V7) is applied. Power wiring 612B corresponds to the eighth power wiring to which the above-mentioned ground potential (potential V8) is applied. In the fourth embodiment, the difference between the first power and the fourth power is smaller than the difference between the first power and the second power, and the difference between the second power and the third power is smaller than the difference between the third power and the fourth power.

[0057] As shown in Figure 11, the power wiring 611A of the first flexible wiring board 61 is arranged in the Z direction alongside the power wiring 622A of the second flexible wiring board 62. The power wiring 621B of the first flexible wiring board 61 is arranged in the Z direction alongside the power wiring 612B of the second flexible wiring board 62.

[0058] The power wiring 621A of the second flexible wiring board 62 is arranged in the Z direction alongside the power wiring 612A of the first flexible wiring board 61. The power wiring 611B of the second flexible wiring board 62 is arranged in the Z direction alongside the power wiring 622B of the first flexible wiring board 61. In a plan view, the power wirings 611A, 612A, 621B, and 622B in the first flexible wiring board 61 overlap with the power wirings 622A, 621A, 612B, and 611B in the second flexible wiring board 62, respectively.

[0059] In this embodiment, the first flexible wiring board 61 and the second flexible wiring board 62 each have two power systems that supply different power. Therefore, each of the first flexible wiring board 61 and the second flexible wiring board 62 can evenly supply power supplies with different voltage values ​​to the semiconductor elements 51 and other circuit blocks of the wiring board 52, enabling a stable power supply. In addition, power wiring 621B is arranged side by side between power wiring 612A and power wiring 622B within the first flexible wiring board 61. Similarly, power wiring 621A is arranged side by side between power wiring 622A and power wiring 612B within the second flexible wiring board 62. Because the high-potential wiring is surrounded by two low-potential wirings through which current flows in the opposite direction, the effect of confining the magnetic field can be more effectively achieved. The arrangement of power wiring in this embodiment is effective, for example, when the noise current flowing through power wiring 621B and power wiring 621A is greater than the noise current flowing through power wiring 611A and power wiring 611B.

[0060] [Fifth Embodiment] The electronic device according to the fifth embodiment will now be described. The fifth embodiment differs from the third and fourth embodiments in the arrangement of power wiring that transmits the first to fourth powers inside the first flexible wiring board 61 and the second flexible wiring board 62, respectively. In the fifth embodiment, the meanings of the terms first to eighth power wiring and first to fourth powers are the same as in the third embodiment described above.

[0061] Figure 12 is a plan view illustrating one configuration of the power receiving module 5 and flexible wiring unit 6 according to the fifth embodiment. Figure 13 is a cross-sectional view along line A-A' of the first flexible wiring board 61 and the second flexible wiring board 62 shown in Figure 12.

[0062] The first flexible wiring board 61 of this embodiment has power wiring 611A, power wiring 612A, power wiring 621B, power wiring 622B, base material 615, and coverlay 616. Power wiring 611A is arranged alongside power wiring 612A in the X direction. Power wiring 611A and power wiring 612A transmit the first power. Power wiring 611A corresponds to the first power wiring to which the above-mentioned power supply potential (potential V1) is applied. Power wiring 612A corresponds to the second power wiring to which the above-mentioned ground potential (potential V2) is applied. Power wiring 621B is arranged alongside power wiring 612A and power wiring 622B in the X direction. Power wiring 621B and power wiring 622B transmit the third power from the power supply module 8 to the power receiving module 5. Power wiring 621B corresponds to the fifth power wiring to which the above-mentioned power supply potential (potential V5) is applied. Power wiring 622B corresponds to the sixth power wiring to which the aforementioned ground potential (potential V6) is applied.

[0063] Furthermore, the second flexible wiring board 62 has power wiring 612B, power wiring 611B, power wiring 622A, power wiring 621A, base material 625, and coverlay 626. Power wiring 611B of the second flexible wiring board 62 is arranged in the X direction alongside power wiring 622A and power wiring 612B. Power wiring 611B and power wiring 612B transmit the second power. Power wiring 611B corresponds to the third power wiring to which the above-mentioned power supply potential (potential V3) is applied. Power wiring 612B corresponds to the fourth power wiring to which the above-mentioned ground potential (potential V4) is applied. Power wiring 621A is arranged in the X direction alongside power wiring 622A. Power wiring 621A and power wiring 622A transmit the fourth power from the power supply module 8 to the power receiving module 5. Power wiring 621A corresponds to the seventh power wiring to which the above-mentioned power supply potential (potential V7) is applied. Power wiring 622A corresponds to the eighth power wiring to which the above-mentioned ground potential (potential V8) is applied. In this embodiment, the difference between the first power and the second power is smaller than the difference between the second power and the fourth power, and the difference between the third power and the fourth power is smaller than the difference between the first power and the third power.

[0064] As shown in Figure 13, the power wiring 611A of the first flexible wiring board 61 is arranged in the Z direction alongside the power wiring 612B of the second flexible wiring board 62. The power wiring 621B of the first flexible wiring board 61 is arranged in the Z direction alongside the power wiring 622A of the second flexible wiring board 62.

[0065] The power wiring 621A of the second flexible wiring board 62 is arranged in the Z direction alongside the power wiring 622B of the first flexible wiring board 61. The power wiring 611B of the second flexible wiring board 62 is arranged in the Z direction alongside the power wiring 612A of the first flexible wiring board 61. In a plan view, the power wirings 611A, 612A, 621B, and 622B in the first flexible wiring board 61 overlap with the power wirings 612B, 611B, 622A, and 621A in the second flexible wiring board 62, respectively.

[0066] In this embodiment, the first flexible wiring board 61 and the second flexible wiring board 62 each have two power systems that supply different power. Therefore, each of the first flexible wiring board 61 and the second flexible wiring board 62 can evenly supply power sources with different voltage values ​​to the semiconductor elements 51 and other circuit blocks of the wiring board 52, enabling a stable power supply. In addition, power wiring 611A and 612A for supplying the first power and power wiring 611B and 612B for supplying the second power are arranged in the left region relative to the center of the stacked flexible wiring boards. In addition, power wiring 621B and 622B for supplying the third power and power wiring 621A and 622A for supplying the fourth power are arranged in the right region. Furthermore, the difference between the first power and the second power is smaller than the difference between the second power and the fourth power, and the difference between the third power and the fourth power is smaller than the difference between the first power and the third power. By grouping and arranging power lines with small differences in supplied power in this way, the magnetic field cancellation effect is enhanced in both the X and Z directions, further reducing magnetic field noise.

[0067] For example, power wiring 611A and power wiring 611B may be power wiring that supplies power to digital circuits such as image processing circuits. Also, power wiring 621B and power wiring 621A may be power wiring that supplies power to analog circuits such as pixel power supply circuits. It is also possible to configure power wiring 611A and power wiring 611B to correspond to analog circuits and power wiring 621B and power wiring 621A to correspond to digital circuits. By arranging power wiring of the same system in close proximity in the X and Z directions, the cancellation effect can be enhanced even if a current phase difference occurs.

[0068] Figure 14 is a graph illustrating the phase difference of current flowing through power wiring. The horizontal axis represents time, and the vertical axis represents the current value. As shown in Figure 14, waveforms A and B show the phase changes of the current flowing through the two types of power wiring, respectively. The phase of the current flowing through each power wiring differs depending on the voltage value, but by aligning each power wiring within a flexible wiring board, the magnetic field can be effectively canceled out.

[0069] [Sixth Embodiment] The following describes the electronic device according to the sixth embodiment. Figure 15A is a side view of the main part of the electronic device, and Figure 15B is a plan view of the main part of the electronic device. In the sixth embodiment, the power receiving module 5 includes a plurality of wiring boards 521 and 522, and the power supply module 8 includes a plurality of wiring boards 821 and 822. The configuration of each of the wiring boards 521 and 522 may be the same as that of the wiring board 52 in the other embodiments. A connector 53A and a semiconductor element (not shown) are arranged on the wiring board 521, and a connector 53B and a power supply (not shown) are arranged on the wiring board 522. The wiring boards 521 and 522 overlap in the Z direction. The configuration of each of the wiring boards 521 and 522 may be the same as that of the wiring board 82 in the other embodiments. A connector 83A and a power supply (not shown) are arranged on the wiring board 821, and a connector 83B and a power supply (not shown) are arranged on the wiring board 822. The wiring boards 821 and 822 overlap in the Z direction. The flexible wiring unit 6 includes flexible wiring boards 61 and 62. Flexible wiring board 61 connects the wiring board 821 and the wiring board 521, and flexible wiring board 62 connects the wiring board 822 and the wiring board 522. Flexible wiring board 61 is provided with power wiring 611 and power wiring 612 as described in other embodiments, and flexible wiring board 62 is provided with power wiring 621 and power wiring 622 as described in other embodiments.

[0070] In the AA region shown in Figures 15A and 15B, the flexible wiring board 61 and the flexible wiring board 62 are in close proximity. In the AA region, the flexible wiring board 61 may be bonded to the flexible wiring board 62 with adhesive, or it may be held in close contact with the flexible wiring board 62 using fixing members such as clips. Furthermore, the structure shown in Figures 15A and 15B may be deformed. For example, the flexible wiring unit 6 may be curved so that the wiring boards 521, 522, 821, and 822 overlap in the Z direction.

[0071] In the AA region shown in Figures 15A and 15B, the wiring configuration is the same as that shown in Figure 7A. Power wiring 611 is arranged alongside power wiring 612 in the X direction and alongside power wiring 622 in the Z direction. Power wiring 621 is arranged alongside power wiring 622 in the X direction and alongside power wiring 612 in the Z direction. By arranging the power wiring in this way, it is possible to reduce magnetic field noise.

[0072] [Examples] Examples 1-5 and Comparative Example 1, based on the first to fifth embodiments described above, will now be explained. In Examples 1-5 and Comparative Example 1, the imaging surface was assumed to be the circuit damaged by magnetic field noise, and a magnetic field simulation was performed to determine the magnetic flux density reaching the imaging surface.

[0073] The simulations were performed using CST Studio Suite (Dassault Systèmes) under the following conditions: In Example 1, the width of each power wiring was 630 [μm] and the wiring spacing was 70 [μm]. In Examples 2-5, the width of each power wiring was 280 [μm] and the wiring spacing was 70 [μm]. The distance from the power wiring in the first conductor layer or the first flexible circuit board to the power wiring in the second conductor layer or the second flexible circuit board, i.e., the distance between conductors, was set to 100 [μm]. The length in the longitudinal direction of the flexible circuit boards was set to 40 [mm] in all cases.

[0074] In the flexible wiring unit 6, the voltage for the analog circuit 57 was set to 3.5[V] and the voltage for the digital circuit 58 was set to 1.25[V]. The DC (pulsating) current flowing through each power wiring was set to 0.1[A] for the power wiring corresponding to Example 1 and Example 2, and to 0.05[A] for the power wiring corresponding to Example 2 and later, with a frequency of 73[kHz].

[0075] The phase difference between the current corresponding to a power wiring supplied with a potential of 3.5[V] and the current corresponding to a power wiring supplied with a potential of 1.25[V] was set to 30[°]. The distance to the imaging surface of the damaged circuit was set to 10.9[mm], and the imaging surface size was set to 39.2[mm] × 26.8[mm]. The reaching magnetic field was compared using the maximum magnetic flux density [nT] within the plane.

[0076] Figure 16 is a graph showing the magnetic field simulation results. Example 1 shows the magnetic field simulation results corresponding to the first and second embodiments. The comparative example shows the magnetic field simulation results when the first flexible wiring board 61 and the second flexible wiring board 62 are arranged so that high-potential wiring and low-potential wiring face each other in the stacking direction. Furthermore, Example 2 shows the magnetic field simulation results corresponding to the third embodiment, Example 3 shows the results corresponding to the fourth embodiment, and Example 4 shows the results corresponding to the fifth embodiment.

[0077] [Table 1]

[0078] In Example 1, the maximum magnetic flux density that reached the imaging plane was 93.1 [nT]. Compared to Comparative Example 1, where power lines with current flowing in the same direction were arranged facing each other in the vertical direction (Z direction), a reduction effect of 73.2 [%] was observed in Example 1. The results of Example 1 and Comparative Example 1 show that the reverse current flowing through other power lines arranged in the Z direction (vertical direction) to a given power line significantly affects the cancellation of magnetic field noise.

[0079] Furthermore, the maximum magnetic flux density in Example 2 was 46.5 [nT]. Unlike Example 1, in Example 2, two power lines carrying current in the same direction are provided on each flexible wiring board. In Example 2, the magnetic field was reduced by 50.1 [%] compared to Example 1. The radiated magnetic field is reduced because each flexible wiring board has multiple power lines carrying current in the same direction.

[0080] The maximum magnetic flux density in Example 3 was 2.8 [nT]. In Example 3, it was found that by placing power sources with different current phase differences within each flexible wiring board and increasing diagonal coupling with low-potential wiring positioned above, below, left, and right of high-potential wiring, the magnetic field cancellation effect was improved compared to Example 2. According to Example 3, even when a current phase difference occurred, the maximum magnetic flux density was reduced to 94.0% of that in Example 2.

[0081] The maximum magnetic flux density in Example 4 was 1.6 [nT]. In Example 4, it was confirmed that the increased coupling in the up, down, left, and right directions resulted in a further reduction effect of 42.9% compared to Example 3.

[0082] [Modified Embodiment] The present invention is not limited to the embodiments described above, and many modifications are possible within the technical concept of the present invention. Furthermore, the effects described in the embodiments are merely a list of the most preferred effects resulting from the present invention, and the effects of the present invention are not limited to those described in the embodiments.

[0083] Furthermore, although the above-described embodiment described the case where the electronic device is an imaging device (digital camera), the present invention is not limited to this. The present invention is applicable as long as it is equipped with a flexible wiring unit and mounted on a power supply module and a power receiving module. For example, the electronic device may be a mobile communication device. For example, the electronic device may be an information device such as a smartphone, or a communication device such as a modem or router. Alternatively, the electronic device may be office equipment such as a printer or copier, medical equipment such as a radiographer, magnetograph, ultrasound machine, or endoscope, industrial equipment such as a robot or semiconductor manufacturing equipment, or transportation equipment such as a vehicle, airplane, or ship. By using the configuration of the present disclosure in the limited space within the housing of an electronic device, it is possible to miniaturize and increase the density of the electronic device while suppressing noise. Furthermore, by using the configuration of the present disclosure in an electronic device equipped with multiple electronic modules, it is possible to miniaturize and increase the density of the electronic device while suppressing noise. For example, it is suitable for mobile terminals such as mobile phones, smartphones, tablet terminals, and notebook computers.

[0084] This disclosure includes the following components: (Composition 1) A first module that supplies the first and second power, A flexible wiring unit including a first power wiring and a second power wiring for transmitting the first power, and a third power wiring and a fourth power wiring for transmitting the second power, A second module to which the first power and the second power are supplied via the flexible wiring unit, Equipped with, During the transmission of the first and second powers, the potential difference between the first power wiring and the fourth power wiring, and the potential difference between the second power wiring and the third power wiring are greater than the potential difference between the second power wiring and the fourth power wiring. The first power wiring is arranged alongside the second power wiring in a first direction, and alongside the fourth power wiring in a second direction perpendicular to the first direction. The third power cable is arranged alongside the fourth power cable in the first direction and alongside the second power cable in the second direction. An electronic device characterized by the following features. (Configuration 2) The distance between the first power wiring and the second power wiring in the first direction is smaller than the width of the first power wiring and the second power wiring in the first direction. The distance between the third power wiring and the fourth power wiring in the first direction is smaller than the width of the third power wiring and the fourth power wiring in the first direction. The distance between the first power wiring and the fourth power wiring in the second direction is smaller than the width between the first power wiring and the fourth power wiring in the first direction. The distance between the second power wiring and the third power wiring in the second direction is smaller than the width between the second power wiring and the third power wiring in the first direction. The electronic device according to configuration 1, characterized by the features described above. (Composition 3) During the transmission of the first power and the second power, the potential of the first power wiring is higher than the potential of the third power wiring. The electronic device according to configuration 1, characterized by the features described above. (Composition 4) The flexible wiring unit includes a first conductor layer and a second conductor layer, The first conductor layer is arranged with the first power wiring and the second power wiring. The second conductor layer is arranged with the third power wiring and the fourth power wiring. The electronic device according to configuration 1, characterized by the features described above. (Composition 5) The flexible wiring unit has a first flexible wiring board and a second flexible wiring board arranged to overlap in the second direction, The first flexible wiring board is arranged with the first power wiring and the second power wiring. The second flexible wiring board is on which the third power wiring and the fourth power wiring are arranged. The electronic device according to configuration 1, characterized by the features described above. (Composition 6) A housing housing that houses the first module, the flexible wiring unit, and the second module, Fixing members for fixing the first flexible wiring board and the second flexible wiring board to the housing, The electronic device according to configuration 5, further comprising: (Composition 7) The flexible wiring unit further includes a fifth power wiring and a sixth power wiring for transmitting a third power, The flexible wiring unit further includes a seventh power wiring and an eighth power wiring for transmitting a fourth power, The fifth power cable is arranged in the first direction alongside the second power cable and the sixth power cable, and in the second direction alongside the eighth power cable. The seventh power cable is arranged alongside the eighth power cable in the first direction and alongside the sixth power cable in the second direction. The difference between the first power and the third power is smaller than the difference between the first power and the second power, and the difference between the second power and the fourth power is smaller than the difference between the third power and the fourth power. The difference between the first power and the fourth power is smaller than the difference between the first power and the second power, and the difference between the second power and the third power is smaller than the difference between the third power and the fourth power. The electronic device according to configuration 1, characterized in that the difference between the first power and the second power is smaller than the difference between the second power and the fourth power, and the difference between the third power and the fourth power is smaller than the difference between the first power and the third power. (Composition 8) In the first direction, the difference between the width of the first power wiring and the width of the second power wiring is smaller than the distance between the first power wiring and the second power wiring, and in the first direction, the difference between the width of the third power wiring and the width of the fourth power wiring is smaller than the distance between the third power wiring and the fourth power wiring. An electronic device according to any one of configurations 1 to 7, characterized by the above. (Composition 9) The second module includes semiconductor elements to which the first and second powers are supplied, and the flexible wiring unit overlaps with the semiconductor elements in the second direction. The electronic device according to configuration 1, characterized by the features described above. (Composition 10) The first power is greater than the second power, and the distance between the first power wiring and the semiconductor element is longer than the distance between the third power wiring and the semiconductor element. The electronic device according to configuration 9, characterized by the features described therein. (Composition 11) The flexible wiring unit has a third flexible wiring board that transmits signals, The first flexible wiring board is formed in a straight line, The second flexible wiring board includes, in a plan view, a first substrate portion that overlaps with the first flexible wiring board and is connected to the second module, a second substrate portion that does not overlap with the first flexible wiring board and is connected to the first module, and a third substrate portion between the first substrate portion and the second substrate portion. The third flexible wiring board is arranged so as to intersect with the third substrate portion in the plan view. The electronic device according to configuration 5, characterized by the features described herein. (Composition 12) The spacing between the first power wiring and the fourth power wiring in the second direction, and the spacing between the second power wiring and the fourth power wiring, is 500 μm or less. The electronic device according to configuration 5, characterized by the features described herein. (Composition 13) The second module includes analog and digital circuits. The first power wiring is connected to the analog circuit, and the third power wiring is connected to the digital circuit. The electronic device according to any one of configurations 1 to 12, characterized by the features described herein. (Composition 14) The second module includes analog and digital circuits. The first power wiring and the third power wiring are connected to the analog circuit, and the fifth power wiring and the seventh power wiring are connected to the digital circuit. The electronic device according to configuration 7, characterized by the features described above. (Composition 15) At least some of the terminals of the flexible wiring unit are connected to a connector provided on the second module. An electronic device according to any one of configurations 1 to 14, characterized by the features described herein. (Composition 16) At least some of the terminals of the flexible wiring unit are soldered to the circuit board of the second module. The electronic device according to any one of configurations 1 to 15, characterized by the features described herein. (Composition 17) The currents flowing through the first power wiring and the third power wiring, respectively, are between 0.5[A] and 3.0[A]. The electronic device according to any one of configurations 1 to 16, characterized by the features described herein. (Composition 18) During the transmission of the first and second powers, the potential of the first power wiring is higher than the potential of the second power wiring, and the potential of the third power wiring is higher than the potential of the fourth power wiring. An electronic device according to any one of configurations 1 to 17, characterized by the features described herein. (Composition 19) The right 2 module is an imaging module. The electronic device according to any one of configurations 1 to 18, characterized by the features described herein. (Composition 20) The electronic device according to any one of configurations 1 to 19, comprising: a housing for housing the first module, the flexible wiring unit, and the second module; and a mechanism for moving the second module relative to the first module within the housing. [Explanation of Symbols]

[0085] 1: Digital camera 2: Camera body 3: Lens Unit 5: Power receiving module 6: Flexible Wiring Unit 7: Image stabilization mechanism 8: Power supply module 9: Cabinet 10: Fixing member 51: Semiconductor devices 52: Wiring board 55: First relay circuit 56: Second relay circuit 57: Analog Circuits 58: Digital Circuits 60: Flexible wiring board 61: First Flexible Wiring Board 62: Second Flexible Wiring Board 65: Flexible wiring board 81: Semiconductor components 82: Wiring board 601, 602, 603, 604, 611, 611A, 611B, 612, 612A, 612B, 621, 621A, 621B, 622, 622A, 622B: Power wiring

Claims

1. A first module for supplying first and second power, A flexible wiring unit including a first power wiring and a second power wiring for transmitting the first power, and a third power wiring and a fourth power wiring for transmitting the second power, A second module to which the first power and the second power are supplied via the flexible wiring unit, Equipped with, During the transmission of the first power and the second power, the potential difference between the first power wiring and the fourth power wiring and the potential difference between the second power wiring and the third power wiring are greater than the potential difference between the second power wiring and the fourth power wiring. The first power wiring is arranged alongside the second power wiring in a first direction, and alongside the fourth power wiring in a second direction perpendicular to the first direction. The third power wiring is arranged in parallel with the fourth power wiring in the first direction and in parallel with the second power wiring in the second direction. An electronic device characterized by the following features.

2. The distance between the first power wiring and the second power wiring in the first direction is smaller than the width of the first power wiring and the second power wiring in the first direction. The distance between the third power wiring and the fourth power wiring in the first direction is smaller than the width of the third power wiring and the fourth power wiring in the first direction. The distance between the first power wiring and the fourth power wiring in the second direction is smaller than the width of the first power wiring and the fourth power wiring in the first direction. The distance between the second power wiring and the third power wiring in the second direction is smaller than the width between the second power wiring and the third power wiring in the first direction. The electronic device according to feature 1.

3. During the transmission of the first power and the second power, the potential of the first power wiring is higher than the potential of the third power wiring. The electronic device according to feature 1.

4. The flexible wiring unit includes a first conductor layer and a second conductor layer, The first conductor layer is arranged with the first power wiring and the second power wiring. The third power wiring and the fourth power wiring are arranged in the second conductor layer. The electronic device according to feature 1.

5. The flexible wiring unit has a first flexible wiring board and a second flexible wiring board arranged to overlap in the second direction, The first flexible wiring board is arranged with the first power wiring and the second power wiring. The second flexible wiring board is on which the third power wiring and the fourth power wiring are arranged. The electronic device according to feature 1.

6. A housing housing that houses the first module, the flexible wiring unit, and the second module, Fixing members for fixing the first flexible wiring board and the second flexible wiring board to the housing, The electronic device according to claim 5, further comprising:

7. The flexible wiring unit further includes a fifth power wiring and a sixth power wiring for transmitting a third power, The flexible wiring unit further includes a seventh power wiring and an eighth power wiring for transmitting a fourth power, The fifth power cable is arranged in the first direction alongside the second power cable and the sixth power cable, and in the second direction alongside the eighth power cable. The seventh power cable is arranged alongside the eighth power cable in the first direction and alongside the sixth power cable in the second direction. The difference between the first power and the third power is smaller than the difference between the first power and the second power, and the difference between the second power and the fourth power is smaller than the difference between the third power and the fourth power. The difference between the first power and the fourth power is smaller than the difference between the first power and the second power, and the difference between the second power and the third power is smaller than the difference between the third power and the fourth power. The electronic device according to claim 1, characterized in that the difference between the first power and the second power is smaller than the difference between the second power and the fourth power, and the difference between the third power and the fourth power is smaller than the difference between the first power and the third power.

8. In the first direction, the difference between the width of the first power wiring and the width of the second power wiring is smaller than the distance between the first power wiring and the second power wiring, and in the first direction, the difference between the width of the third power wiring and the width of the fourth power wiring is smaller than the distance between the third power wiring and the fourth power wiring. The electronic device according to feature 1.

9. The second module includes semiconductor elements to which the first power and the second power are supplied, and the flexible wiring unit overlaps with the semiconductor elements in the second direction. The electronic device according to feature 1.

10. The first power is greater than the second power, and the distance between the first power wiring and the semiconductor element is longer than the distance between the third power wiring and the semiconductor element. The electronic device according to feature 9.

11. The flexible wiring unit has a third flexible wiring board that transmits signals, The first flexible wiring board is formed in a straight line, The second flexible wiring board includes, in a plan view, a first substrate portion that overlaps with the first flexible wiring board and is connected to the second module, a second substrate portion that does not overlap with the first flexible wiring board and is connected to the first module, and a third substrate portion between the first substrate portion and the second substrate portion. The third flexible wiring board is arranged so as to intersect with the third substrate portion in the plan view. The electronic device according to feature 5.

12. The distance between the first power wiring and the fourth power wiring in the second direction, and the distance between the second power wiring and the fourth power wiring, are 500 μm or less. The electronic device according to feature 5.

13. The second module includes analog and digital circuits. The first power wiring is connected to the analog circuit, and the third power wiring is connected to the digital circuit. The electronic device according to feature 1.

14. The second module includes analog and digital circuits. The first power wiring and the third power wiring are connected to the analog circuit, and the fifth power wiring and the seventh power wiring are connected to the digital circuit. The electronic device according to feature 7.

15. At least some of the terminals of the flexible wiring unit are connected to a connector provided on the second module. The electronic device according to feature 1.

16. At least some of the terminals of the flexible wiring unit are soldered to the circuit board of the second module. The electronic device according to feature 1.

17. The currents flowing through the first power wiring and the third power wiring, respectively, are between 0.5 [A] and 3.0 [A]. The electronic device according to feature 1.

18. During the transmission of the first and second powers, the potential of the first power wiring is higher than the potential of the second power wiring, and the potential of the third power wiring is higher than the potential of the fourth power wiring. The electronic device according to feature 1.

19. The first module is an imaging module. The electronic device according to any one of claims 1 to 18.

20. The electronic device according to any one of claims 1 to 18, comprising: a housing for housing the first module, the flexible wiring unit, and the second module; and a mechanism for moving the second module relative to the first module within the housing.

Images