Light-emitting device

Abstract

To provide a light-emitting device that can illuminate the entire surrounding area. [Solution] The light-emitting device according to the embodiment comprises a plurality of LED chips and a plurality of substrates on which one or more of the LED chips are mounted, wherein the plurality of substrates are arranged on different planes in three-dimensional space, and are arranged such that the outer edge of the light emitted from an LED chip on one substrate and the outer edge of the light emitted from an LED chip on another substrate are parallel or intersecting, and have a pair of side substrates arranged so that their bottom surfaces face each other, and a top substrate arranged substantially perpendicular to the pair of side substrates, wherein the central part of the bottom surface of the top substrate is in contact with the ends of the pair of side substrates, giving it a T-shaped outline.

Description

Technical Field

[0001] Embodiments of the present invention relate to a light-emitting device.

Background Art

[0002] Lighting fixtures using LED chips have been developed. Document 1 discloses a light-emitting device in which a plurality of LED chips are arranged in concentric circles so that the irradiation light from the light-emitting surface can be made uniform.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the above conventional technology, although it is possible to irradiate the region facing the light-emitting surface, it is not possible to illuminate the entire periphery of the light-emitting device. The problem to be solved by the present invention is to provide a light-emitting device that can illuminate the entire periphery.

Means for Solving the Problems

[0005] The light-emitting device according to the embodiment includes a plurality of LED chips and a plurality of substrates on which one or more of the LED chips are placed. The plurality of substrates are arranged on different planes in a three-dimensional space, and the outer edges of the irradiation light irradiated from the LED chips on one substrate and the outer edges of the irradiation light irradiated from the LED chips on another substrate are arranged so as to be parallel or intersect. It has a pair of side substrates arranged so that the bottom surfaces face each other, and one top substrate arranged so as to be substantially orthogonal to the pair of side substrates. The central portion of the bottom surface of the top substrate contacts the ends of the pair of side substrates, thereby presenting a T-shaped outer shape.

Brief Description of the Drawings

[0006] [Figure 1] This is a perspective view of the light-emitting unit 1 according to the embodiment. [Figure 2] Figure 2A is a plan view of the light-emitting unit 1. Figure 2B is a front view of the light-emitting unit 1. [Figure 3] This diagram shows the mode of light emission from the light-emitting unit 1. [Figure 4] This is a perspective view of the light-emitting device 100. [Figure 5] This is a perspective view of cover 50. [Figure 6] This figure shows the mode of light emission from the light-emitting device 100. [Figure 7] This is a front view of the light-emitting unit 2 according to another embodiment. [Figure 8] This diagram shows the mode of light emission from the light-emitting unit 2. [Modes for carrying out the invention]

[0007] The embodiments of the present invention will be described below with reference to the drawings.

[0008] In this specification and the drawings, elements similar to those already described are denoted by the same reference numerals, and detailed explanations are omitted where appropriate. The drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the ratio of the sizes of the parts, etc., are not necessarily the same as those in reality. Even when representing the same part, the dimensions and ratios may be represented differently in different drawings.

[0009] <Embodiment> (1. Light-emitting unit 1) Figure 1 is a perspective view of the light-emitting unit 1 according to an embodiment. Figure 2A is a plan view of the light-emitting unit 1. Figure 2B is a front view of the light-emitting unit 1. The light-emitting unit 1 in this disclosure will be described with reference to Figures 1 and 2. The light-emitting unit 1 is a light-emitting component that includes a plurality of LED chips 20. As an example, the light-emitting unit 1 is used in a light-emitting device 100 that includes a cover 50, which will be described later.

[0010] As shown in Figures 1 and 2, the light-emitting unit 1 comprises a plurality of substrates 10 and one or more LED chips 20 mounted on the substrates 10. The plurality of substrates 10 are arranged on different planes in three-dimensional space. For example, the plurality of substrates 10 have a pair of side substrates 11 and a top substrate 12 positioned substantially perpendicular to the pair of side substrates.

[0011] A pair of side substrates 11 are formed in a flat shape and arranged so that their bottom surfaces face each other. Multiple (two in this embodiment) LED chips 20 and a control unit 30 are arranged on the upper surface 11a of the side substrates 11.

[0012] The top substrate 12 is formed in a disc shape, and is positioned so that the center of its bottom surface contacts the ends of a pair of side substrates 11. As a result, the multiple substrates 10 have a T-shaped outer form. Multiple (four in this embodiment) LED chips 20 are arranged on the upper surface 12a of the top substrate 12.

[0013] The LED chip 20 is a light-emitting element made of a semiconductor material (light-emitting diode), and emits light when a predetermined voltage is applied and a current flows. The light emitted from the LED chip 20 is concentrated in a specific direction. Examples of the LED chip 20 include a red LED chip that emits red light using AlGaInP, a blue LED chip that emits blue light using GaN material, and a white LED chip that emits white light by combining a blue LED with a phosphor, but the LED chip is not limited to these examples.

[0014] The control unit 30 includes electronic circuits for controlling the operation of the light-emitting unit 1. The control unit 30 is mounted on the substrate 10 and has the function of controlling the current and voltage supplied to the LED chip 20. Generally, the control unit may include a power supply circuit, a driver circuit, a temperature control circuit, etc. As an example, the control unit 30 may be used to adjust the light emission timing and brightness of the LED chip 20.

[0015] The wiring 40 is a conductive wire for supplying current to the control unit 30 and the LED chip 20. The wiring 40 is designed to reliably transmit signals and power, and includes conductive patterns, wires, etc. formed on the substrate 10.

[0016] (2. Light emission by the light emitting unit 1) FIG. 3 is a diagram showing the light emission mode of the light emitting unit 1. As shown in FIG. 3, the plurality of substrates 10 are arranged such that the outer edge of the irradiation light irradiated from the LED chip 20 on the side substrate 11 and the outer edge of the irradiation light irradiated from the LED chip on the top substrate 12 are parallel or intersect.

[0017] In the example shown in FIG. 3, the outer edge of the irradiation light L1 irradiated from the LED chip 20a arranged on one upper surface 11a of the side substrate 11 intersects with the outer edge of the irradiation light L2 irradiated from the LED chip 20b arranged on the upper surface 12a of the top substrate 12. Also, the outer edge of the irradiation light L3 irradiated from the LED chip 20c arranged on one upper surface 11a of the side substrate 11 intersects with the outer edge of the irradiation light L4 irradiated from the LED chip 20d arranged on the upper surface 12a of the top substrate 12. With such a configuration, the irradiation light irradiated from the LED chip 20 arranged on the upper surface 11a of the side substrate 11 and the irradiation light irradiated from the LED chip 20 arranged on the upper surface 12a of the top substrate 12 intersect in the vicinity of the light emitting unit 1, and no gap occurs in the irradiation light, so that it is possible to irradiate the irradiation light in all directions around the light emitting unit 1.

[0018] In order to realize the above configuration, the position of the LED chip 20 placed on the side substrate 11 or the top substrate 12 may be adjusted according to the irradiation angle of the LED chip 20. As the irradiation angle of the LED chip 20, physical quantities such as the half-value angle (the inner angle in the direction where the intensity of the light is 50% relative to the intensity of the light on the central axis of the irradiation light) may be used to adjust the position of the LED chip 20.

[0019] (3. Light emitting device 100) Figure 4 is a perspective view of the light-emitting device 100. Figure 5 is a perspective view of cover 50. The configuration of the light-emitting device 100 will be described with reference to Figures 4 and 5. As shown in Figure 4, the light-emitting device 100 is arranged around a plurality of substrates 10 and includes a cover 50 made of plastic or other resin that covers the plurality of substrates 10.

[0020] As shown in Figure 5, the cover 50 includes a spherical dome portion 51 positioned around the top substrate 12 and a cylindrical socket portion 52 positioned around the side substrate 11. The dome portion 51 is equipped with a hinge portion 51a and an engaging portion 51b, and is configured to be openable and detachable from the socket portion 52. The dome portion 51 and the socket portion 52 are frosted, making them semi-transparent or cloudy. This diffuses the light emitted from the light-emitting unit 1 located inside the cover 50.

[0021] Furthermore, the cover 50 may contain a phosphorescent material that stores the energy of the irradiated light and emits light in the dark. Examples of phosphorescent materials include zinc sulfide (ZnS) and strontium aluminate (SrAl2O4). With this configuration, the light-emitting device 100 can be used as an emergency light to illuminate the surroundings when the light-emitting device 100 is turned off or in the event of a power outage.

[0022] (4. Light emission by the light-emitting device 100) Figure 6 is a diagram showing the light emission patterns of the light-emitting device 100. In the example shown in Figure 6, the outer edge of the light beam L1 emitted from the LED chip 20a located on one upper surface of the side substrate 11 is parallel to the outer edge of the light beam L2 emitted from the LED chip 20b located on the upper surface of the top substrate 12. Also, the outer edge of the light beam L4 emitted from the LED chip 20c located on one upper surface of the side substrate 11 is parallel to the outer edge of the light beam L3 emitted from the LED chip 20d located on the upper surface of the top substrate 12. As shown in Figure 6, the light-emitting device 100 has a cover 50 arranged around the multiple substrates 10, so that the light emitted from the LED chips 20 is diffused. Specifically, the light emitted L1 from the LED chip 20a located on one upper surface 11a of the side substrate 11 is diffused by the cover 50 to become diffused light L5. Also, the light emitted L3 from the LED chip 20c located on one upper surface 11a of the side substrate 11 is diffused by the cover 50 to become diffused light L6. In this way, the light-emitting device 100 can emit light in all directions around the light-emitting unit 1 even if there is unevenness in brightness due to reinforcement and cancellation of light caused by interference between the light emitted from the LED chip 20 on one substrate 10 and the light emitted from the LED chips on other substrates.

[0023] <Other Embodiments> Although the light-emitting unit 1 and light-emitting device 100 according to this embodiment have been described above, the application of the technical idea of ​​this disclosure is not limited to the above embodiments. For example, the multiple substrates 10 may be arranged in a manner other than T-shape (for example, L-shape or U-shape).

[0024] Figure 7 is a plan view of the light-emitting unit 2 according to another embodiment. Figure 8 shows the mode of light emission from the light-emitting unit 2. Another embodiment of the light-emitting unit 2 comprises one side substrate 11 and one top substrate 12. The side substrate 11 and the top substrate 12 are arranged with their ends in contact with each other to form an L-shaped outer form. Multiple LED chips 20 and a control unit 30 are arranged on the upper surface 11a of the side substrate 11. Multiple LED chips 20 are arranged on the upper surface 12a of the top substrate 12.

[0025] As shown in Figure 8, in the light-emitting unit 2, the outer edge of the illumination light L7 emitted from the LED chip 20e located on the upper surface 11a of the side substrate 11 and the outer edge of the illumination light L8 emitted from the LED chip 20f located on the upper surface 12a of the top substrate 12 are parallel. Even in this configuration, illumination light can be emitted in all directions around the light-emitting unit 1.

[0026] Furthermore, in the above embodiment, both the dome portion 51 and the socket portion 52 of the cover 50 are frosted, but the embodiment is not limited to this, and either the dome portion 51 or the socket portion 52 may be frosted. Alternatively, a part of the dome portion 51 or a part of the socket portion 52 may be frosted.

[0027] While several embodiments have been described in this disclosure, these are merely illustrative and do not limit the scope of the invention. The embodiments described in this disclosure can be modified, altered, or substituted in various ways, as long as they do not impair the spirit of the invention. All such variations, modifications, and alterations, as well as all embodiments into which those skilled in the art have made design changes, are included within the scope of the invention described in this disclosure and its equivalents. Furthermore, each embodiment in this disclosure can be combined with others to realize new forms. [Explanation of symbols]

[0028] 1, 2...light-emitting unit, 10...substrate, 11...side substrate, 11a...top surface, 12...Top substrate, 12a...Top surface, 20...LED chip, 30...Control unit, 40...Wiring, 50...Cover, 51...Dome section, 51a...Hinge section, 51b...Engaging section, 52...Socket section, 100... Light-emitting device

Claims

1. Multiple LED chips, The device comprises a plurality of substrates on which one or more of the aforementioned LED chips are mounted, The aforementioned multiple substrates are Arranged on different planes in three-dimensional space, The outer edge of the light emitted from an LED chip on one substrate and the outer edge of the light emitted from an LED chip on another substrate are arranged to be parallel or intersect. A pair of side substrates are arranged so that their bottom surfaces face each other, It has a pair of side substrates and a top substrate arranged substantially perpendicular to them, A light-emitting device having a T-shaped outer shape, wherein the central part of the bottom surface of the top substrate contacts the ends of the pair of side substrates.

2. Multiple LED chips, The device comprises a plurality of substrates on which one or more of the aforementioned LED chips are mounted, The aforementioned plurality of substrates are Arranged on different planes in three-dimensional space, A light-emitting device in which the outer edge of the light emitted from an LED chip on one substrate and the outer edge of the light emitted from an LED chip on another substrate are arranged to be parallel or intersect.

3. Multiple LED chips, The device comprises a plurality of substrates on which one or more of the aforementioned LED chips are mounted, The aforementioned plurality of substrates are A pair of side substrates are arranged so that their bottom surfaces face each other, It has a pair of side substrates and a top substrate arranged substantially perpendicular to them, A light-emitting device having a T-shaped outer shape, wherein the central part of the bottom surface of the top substrate contacts the ends of the pair of side substrates.

4. The system further comprises a cover that is positioned around the plurality of substrates and covers the plurality of substrates, The light-emitting device according to claim 3, wherein at least a portion of the cover is frosted.

5. The aforementioned cover is A spherical dome portion is arranged around the aforementioned top substrate, The side substrate includes a cylindrical socket portion arranged around it, The light-emitting device according to claim 4, wherein the dome portion and the socket portion are frosted.

6. The light-emitting device according to claim 4, wherein the cover includes a phosphorescent material.

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